JP7507811B2 - Gaming Machines - Google Patents

Description

The present invention relates to gaming machines such as pachinko machines and slot machines.

Various gaming machines such as pachinko machines are equipped with a large number of boards, including control boards such as the main control board, LED boards, relay boards, etc. (For example, see Patent Document 1).

JP 2017-80581 A

When manufacturing various types of circuit boards, discarded boards are provided around the periphery of the substrate to be manufactured, via perforations or the like, for the purposes of protecting the substrate during the manufacturing process, ensuring a gripping margin for manufacturing machines, and other purposes. Ultimately, the discarded boards are cut off from the substrate to be manufactured, but burrs remaining at this stage can cause problems, such as obstructing storage in a substrate storage section by protruding from the outer periphery, or damaging the surrounding area when mounting or removing the substrate, and therefore a burr removal process was conventionally required.
The present invention has been made in consideration of the above circumstances, and has an object to provide an amusement machine that can improve the efficiency of the manufacturing process by omitting the burr removal process.

The present invention relates to an amusement machine having a substrate formed into a predetermined shape by separating adjacent integrally formed portions at connecting portions, wherein one or more recesses are provided on the outer periphery of the substrate, burrs created by cutting the connecting portions remain in the recesses, the depth of the recesses is greater than the protruding length of the burrs, the substrate does not have copper foil within a first distance from the outer periphery of the recesses, and a ground wiring path is arranged at a position at least the first distance away from the outer periphery of the recesses, and for portions other than the recesses, the ground wiring path is arranged at a position less than the first distance from the outer periphery.

According to the present invention, it is possible to improve the efficiency of the manufacturing process by eliminating the burr removal process.

1 is an overall front view of a pachinko machine according to one embodiment of the present invention. 2 is a back view of the front door of the pachinko machine and a front view of the inner frame. FIG. 13 is a diagram showing the arrangement of LED boards, etc. on the front door of the pachinko machine. This is a wiring diagram for the third LED board of the pachinko machine. A diagram showing the wiring patterns of each wiring layer in the third LED board of the pachinko machine. 13 is a side cross-sectional view of the third LED board and its surroundings of the pachinko machine. FIG. 13 is a partially enlarged view of the wiring pattern on the third LED board of the pachinko machine. FIG. 13A and 13B are front and side cross-sectional views of the LED driver mounting portion on the third LED board of the pachinko machine. This figure shows various setting values related to the LED driver mounting portion on the third LED board of the pachinko machine and various calculation values based on them. 13A and 13B are diagrams showing the shape of a recess in the third LED board of the pachinko machine and the wiring pattern near the recess. 13 is a diagram showing the state of the third LED board of the pachinko machine before it is separated from the discarded board. FIG.

Embodiments of the present invention will be described in detail below with reference to the drawings. Figures 1 to 11 show an embodiment in which the present invention is applied to a pachinko machine. In Figures 1 and 2, the gaming machine main body 1 comprises a rectangular outer frame 2 and an inner frame 4 which is pivotally attached to the front of the outer frame 2 by a hinge 3 on one of the left and right sides, for example the left side, so that it can be opened and closed freely.

On the front side of the inner frame 4, a game board mounting frame 6 for mounting a game board 5 is arranged on the upper side, and a launching means 7, a lower speaker 10, etc. are arranged on the lower side, and a front door 8 that covers the front of these is pivoted so that it can be opened and closed freely by a hinge 9 on the same side as the hinge 3.

As shown in FIG. 2, the launching means 7 includes a support plate 11 made of sheet metal, a launching rail 12 attached to the front of the support plate 11, a ball holding section 13 attached to the front of the support plate 11 and holding the game balls to be launched on the launching rail 12, a striking hammer 15 supported on the front of the support plate 11 so as to be able to swing around a drive shaft 14 in the front-rear direction, and a launching drive means 16 such as a rotary solenoid attached to the back side of the support plate 11 and driving the striking hammer 15 in the striking direction via the drive shaft 14. When the launch handle 17 on the front door 8 side is operated, the launching drive means 16 continuously drives the striking hammer 15 in the striking direction (clockwise) according to the amount of operation. As a result, the game balls supplied one by one on the launching rail 12 are launched along the launching rail 12 toward the playing area 5a of the game board 5.

The game board 5 is attached to the game board mounting frame 6, for example from the front side, and is removably fixed by one or more fixing devices 18. A guide rail 21 that guides the game ball launched by the launching means 7 is attached in a ring shape to the front side, and various game components such as a central display unit 22, a normal symbol starting means 23, a special symbol starting means 24, a big prize means 25, and a normal prize means 26 are arranged in the game area 5a inside the guide rail 21.

The central display unit 22 is provided with an image display means 27 such as a liquid crystal display, as well as a normal symbol display means 28, a special symbol display means 29, and a normal reserved number display means 30. The image display means 27 includes a performance symbol display means 31, a special reserved number display means 32, and the like.

The normal symbol display means 28 is composed of two light-emitting elements (e.g., LEDs) corresponding to two types of normal symbols, for example, "O" and "X". On the condition that the normal symbol starting means 23, which is composed of a passing gate or the like, detects a gaming ball, the two light-emitting elements flash alternately for a predetermined period of time. When the winning judgment random number value included in the normal random number information acquired when the normal symbol starting means 23 detects a gaming ball matches a predetermined winning judgment value, the light-emitting element on the "O" side corresponding to the winning state is illuminated, and otherwise the light-emitting element on the "X" side corresponding to the losing state is illuminated, and the flashing ends.

The normal random number information acquired when the normal symbol starting means 23 detects a game ball is reserved and stored up to a predetermined upper limit of reserved numbers, for example up to four, and each time a normal symbol can be changed, one is consumed and the normal symbol is changed. The number of stored normal random number information (hereinafter, normal reserved number) is notified to the player by, for example, the number of light-emitting elements emitted by the normal reserved number display means 30, which has the same number of light-emitting elements as the upper limit of reserved number.

The special symbol start means 24 is for starting the symbol variation by the special symbol display means 29, and is provided with, for example, two upper and lower start winning means 24a, 24b, and is arranged below the central display unit 22. The upper start winning means 24a is a non-opening/closing type winning means that does not have an opening/closing means. The lower start winning means 24b is an opening/closing type winning means that can be switched by the opening/closing means 33 between a closed state in which the game ball cannot enter (or is difficult to enter) and an open state in which the game ball can enter (or is easier to enter than in the closed state), and is opened from the closed state to the open state for a predetermined time when the stopped symbol after the variation of the normal symbol display means 28 becomes a winning state and a normal profit state occurs.

The special symbol display means 29 is composed of a display means such as a seven-segment type capable of variably displaying one or more special symbols, for example one special symbol, and variably displays the special symbol for a predetermined period of time on the condition that the special symbol start means 24 detects a game ball, i.e., the game ball enters either of the two upper and lower start winning means 24a, 24b. If the jackpot determination random number value included in the special random number information obtained when the ball enters the start winning means 24a, 24b matches a predetermined jackpot determination value, the display stops in a predetermined jackpot mode (specific mode), and in other cases, for example, in a miss mode.

The special random number information acquired when the special symbol starting means 24 detects a game ball is stored up to a predetermined upper limit of reserved numbers, for example, four, and each time the special symbol display means 29 becomes able to change the pattern, one is consumed to change the special pattern. The number of stored special random number information (hereinafter, special reserved number) is notified to the player by the special reserved number display means 32, for example, by the number of reserved display images X displayed.

The effect pattern display means 31 displays the effect patterns in a changing manner in parallel with the changing display of the special patterns by the special pattern display means 29, and is configured to be able to display one or more effect patterns, for example, three effect patterns in the left and right direction, along with various effect images, on the display screen 27a of the image display means 27, and when the special pattern start means 24 detects a game ball, that is, when the game ball wins in either of the two upper and lower start winning means 24a, 24b, it starts changing the effect patterns according to one of multiple types of change patterns at approximately the same time as the special pattern starts to change, and stops the effect patterns in a predetermined order such as left, right, center, etc., so that they finally stop at approximately the same time as the special pattern stops changing.

The big prize means 25 is an opening/closing type prize means equipped with an opening/closing plate 25a that can be switched between an open state where game balls can enter and a closed state where game balls cannot enter. When the special pattern displayed by the special pattern display means 29 changes to a big win state and a special profit state occurs, the opening/closing plate 25a opens forward according to a predetermined opening pattern, allowing game balls that fall onto it to enter the prize.

The front door 8 is provided with a door base 35, for example made of resin, in which a window hole 34 corresponding to the front side of the play area 5a is formed. In the door base 35, for example, a pair of upper first speakers 36a, 36b and an air blowing effect means 37 are arranged near the upper side of the window hole 34, and a pair of upper second speakers 38a, 38b are arranged near the lower side of the window hole 34. The air blowing effect means 37 is for blowing air toward a player sitting in front of the gaming machine main body 1, and is provided with an air blowing means 37a such as a sirocco fan operated by a motor (drive means), and is arranged adjacent to the upper first speaker 36b on the right side at the upper right end of the door base 35 so that the air blowing port 37b faces diagonally downward and forward.

As shown in FIG. 3, on the front side of the door base 35, multiple (six in this example) LED boards 41-46 are arranged around the window hole 34. That is, the first LED board 41 is arranged at the lower left of the window hole 34, the second LED board 42 is arranged at the upper left of the window hole 34, the third LED board 43 is arranged at approximately the center in the left-right direction on the upper side of the window hole 34, the fourth LED board 44 is arranged at the lower right of the window hole 34, the fifth LED board 45 is arranged above that, and the sixth LED board 46 is arranged near the air blowing means 37 at the upper right of the window hole 34.

The first LED board 41 and the second LED board 42 are arranged along the window hole 34 between the left upper second speaker 38a and the upper first speaker 36a, and the third LED board 43 is arranged between the left and right upper first speakers 36a, 36b. The fourth LED board 44 and the fifth LED board 45 are arranged along the window hole 34 between the right upper second speaker 38b and the air blowing performance means 37, and the sixth LED board 46 is arranged, for example, on the outer periphery of the air blowing port 37b of the air blowing performance means 37.

As shown in FIG. 1, an upper tray 47 for storing game balls to be supplied to the launching means 7 is disposed at the lower front side of the door base 35, for example toward the left side. Further below the upper tray 47, a lower tray 48 for storing surplus balls when the upper tray 47 is full is disposed at the left end, and a launch handle 17 is disposed at the right end.

In addition, an upper decorative cover 49 that roughly covers the periphery of the window hole 34 from the front side, and a lower decorative cover 50 that roughly covers the upper tray 47, lower tray 48, etc. from the front side are attached to the front side of the door base 35. At least the portion of the upper decorative cover 49 that corresponds to the front sides of the first to sixth LED boards 41 to 46 is a light-emitting lens portion that has translucency. On the lower decorative cover 50, a performance button 51 that can be operated by the player is located approximately in the center in the left-right direction on the front side of the upper tray 47, and a ball lending operation unit 52 is located to the side of that.

2, a glass unit 53 that substantially covers the window hole 34 from the rear side is detachably attached to the rear side of the door base 35, and a ball feeding means 54, a lower tray guide means 55, a front door relay board 56, etc. are arranged below it. The ball feeding means 54 supplies the game balls in the upper tray 47 one by one onto the launch rail 12, and is arranged corresponding to the front side of the launch means 7 and operates in synchronization with the launching operation by the launch means 7. The lower tray guide means 55 guides surplus balls when the upper tray 47 is full and foul balls that have been launched by the launch means 7 but have returned without reaching the play area 5a to the lower tray 48, and is arranged, for example, adjacent to the ball feeding means 54 on the hinge 9 side. In addition, the front door relay board 56 relays between the performance control board, etc., located on the back side of the game board 5 and various performance means, etc., such as the first to sixth LED boards 41 to 46 on the front door 8 side, speakers 10, 36a, 36b, 38a, 38b, and air blowing performance means 37, and is located between the door base 35 and the lower tray guide means 55 behind it.

Next, we will explain the wiring for the various game components provided on the front door 8, particularly the first to sixth LED boards 41 to 46, the upper first speakers 36a, 36b, the upper second speakers 38a, 38b, and the air blowing device 37.

As shown in FIG. 3, the wiring paths of the first to sixth LED boards 41 to 46 branch out to the left and right along the window hole 34 from the front door relay board 56 arranged on the lower side of the front door 8, with the first to third LED boards 41 to 43 forming a left wiring path 57 on the left side of the window hole 34, and the fourth to sixth LED boards 44 to 46 forming a right wiring path 58 on the right side of the window hole 34. In addition, the drive wiring path of the upper first speakers 36a, 36b is provided on the left wiring path 57, and the drive wiring path of the air blowing performance means 37 is provided on the right wiring path 58. The upper second speakers 38a, 38b are independent of the left and right wiring paths 57, 58, and are connected from the front door relay board 56 via harnesses 59a, 59b.

The first to third LED boards 41 to 43 constituting the left wiring path 57 are connected in series via harnesses 61 and 62, and the first LED board 41 on the most upstream side is connected to the front door relay board 56 via a harness 60. In the left wiring path 57, a through-path wiring path is provided in the first LED board 41 and the second LED board 42, and a circuit unit including LEDs 71 to 74 arranged on the third LED board 43 and an LED driver 75 that drives them is connected to the downstream side of the through-path wiring path. In addition, the first LED board 41 and the second LED board 42 are also provided with respective circuit units including LEDs 76 to 79, 80 to 83 and LED drivers 84 to 85, 86 to 87 that drive them, and are each connected to a through-path wiring path. In addition, a portion of the drive wiring path for the upper first speakers 36a, 36b is provided on the first to third LED boards 41-43, and the third LED board 43 on the most downstream side is connected to the upper first speakers 36a, 36b via harnesses 63, 64, respectively.

The fourth to sixth LED boards 44 to 46 constituting the right wiring path 58 are connected in series via harnesses 66 and 67, and the fourth LED board 44 on the most upstream side is connected to the front door relay board 56 via a harness 65. In the right wiring path 58, a through-path wiring path is provided in the fourth LED board 44 and the fifth LED board 45, and a circuit section including LEDs 91, 92, etc. arranged on the sixth LED board 46 and an LED driver (not shown) that drives them is connected to the downstream side of the through-path wiring path. The fourth LED board 44 is also provided with a circuit section including LEDs 93 to 96 and an LED driver 97 that drives them, and is connected to the through-path wiring path. The fifth LED board 45 is also provided with LEDs 101 to 104, but these LEDs are driven by the LED driver 97 on the fourth LED board 44. In addition, a portion of the drive wiring path of the air blowing effect means 37 is provided on the fourth and fifth LED boards 44 and 45, and the fifth LED board 45 and the air blowing means 37a of the air blowing effect means 37 are connected via a harness 68.

Next, we will use the third LED board 43 as an example of the first to sixth LED boards 41 to 46 to explain heat dissipation measures for the LED driver, which is an example of a heat-generating component, and measures against burrs on the board.

First, the circuit configuration of the third LED board 43 will be described. As shown in FIG. 3, the third LED board 43 has a horizontally elongated, generally rectangular board body 111 with wiring layers on both the front and rear sides. This board body 111 is provided with an upstream connector 112, a pair of speaker connectors 113, 114, an LED driver 75, LEDs 71 to 74, protective resistors 115, 116, etc., as shown in FIG. 4.

The upstream connector 112 is connected to the downstream connector on the second LED board 42 side by the harness 62, and has the same terminal configuration as the downstream connector, including an LED power terminal 121, an LED driver power terminal 122, a signal terminal 123, a clock terminal 124, ground terminals 125a, 125b, and speaker terminals 126a to 126d, with a total of 10 terminals arranged, for example, in two rows of five each. Two terminals on each end of the two rows in the terminal arrangement direction, for a total of four terminals, are speaker terminals 126a to 126d.

The speaker connectors 113 and 114 are connected to the upper first speakers 36a and 36b by harnesses 63 and 64. The speaker connector 113 has speaker terminals 131a and 131b, and the speaker connector 114 has speaker terminals 131c and 131d. The speaker terminals 131a and 131b of the speaker connector 113 are connected to the speaker terminals 126a and 126b of the upstream connector 112 via the speaker drive wiring paths 132a and 132b, and the speaker terminals 131c and 131d of the speaker connector 114 are connected to the speaker terminals 126c and 126d of the upstream connector 112 via the speaker drive wiring paths 132c and 132d.

Figure 5 shows the specific wiring pattern of the third LED board 43 for each wiring layer. In the third LED board 43, the LEDs 71 to 74, etc. are arranged on the first wiring layer 141a (Figure 5(a)) on the front side, and the upstream connector 112, speaker connectors 113, 114, LED driver 75, protective resistors 115, 116, etc. are arranged on the second wiring layer 141b (Figure 5(b)) on the rear side.

The upstream connector 112 is arranged on one of the left and right ends of the second wiring layer 141b so that the terminal arrangement is in the left-right direction, and the speaker connectors 113, 114 are arranged on both the left and right ends of the second wiring layer 141b so that the terminal arrangement is in the up-down direction. Speaker drive wiring paths 132a, 132b are connected to the speaker terminals 126a, 126b on one end of the upstream connector 112 from the outside in the terminal arrangement direction (left-right direction here), and speaker drive wiring paths 132c, 132d are connected to the speaker terminals 126c, 126d on the other end of the upstream connector 112 from the outside in the terminal arrangement direction (left-right direction here).

The speaker drive wiring paths 132a, 132b are connected to the speaker terminals 131a, 131b of the speaker connector 113 from the outside in the terminal arrangement direction (here, the vertical direction), and the speaker drive wiring paths 132c, 132d are connected to the speaker terminals 131c, 131d of the speaker connector 114 from the outside in the terminal arrangement direction (here, the vertical direction). Note that the speaker drive wiring paths 132a-132d are substantially entirely provided on the same first wiring layer 141a side as the LEDs 71-74, except for, for example, both ends, i.e., a predetermined range near the connection parts to the connectors 112-114.

The LED driver 75 is disposed approximately in the center of the second wiring layer 141b, and protective resistors 115, 116 are disposed on both the left and right sides of the LED driver 75, which are connected to the RGB terminals of the LED driver 75, respectively. The LED driver power supply terminal 122, signal terminal 123, and clock terminal 124 of the upstream connector 112 are connected to the LED driver 75 by wiring paths 133-135 for the LED driver power supply, signal, and clock. The LED driver power supply, signal, and clock wiring paths 133-135 are disposed approximately entirely on the second wiring layer 141b side, except for a portion of the bypass portion that is bypassed to the first wiring layer 141a side via the via 140. The via 140 is a through-hole type via with copper foil applied to the inner surface of the through hole.

The second wiring layer 141b is provided with one or more solid ground patterns 136. The solid ground patterns 136, together with the solid ground patterns 137 on the first wiring layer 141a side, form a ground wiring path 138, and are connected to the ground terminals 125a and 125b of the upstream connector 112 and the ground terminal of the LED driver 75, for example, via vias 140 and the solid ground patterns 137.

A portion of the solid ground pattern 136 is disposed between the LED driver 75 and the substrate body 111. In addition, a predetermined number of the vias 140 (hereinafter referred to as through holes 140a) that connect the solid ground pattern 136 to the solid ground pattern 137 on the first wiring layer 141a side are disposed within the arrangement area of the LED driver 75.

The LEDs 71 to 74 are arranged in a zigzag pattern in the longitudinal direction of the first wiring layer 141a, with the left LEDs 71 and 72 and the right LEDs 73 and 74 connected in series by the inter-LED wiring path 142. The anode electrodes of the LEDs 72 and 73 are connected to the LED power supply terminal 121 of the upstream connector 112 through the LED power supply wiring path 143 that spans the second wiring layer 141b side through the via 140, and the cathode electrodes of the LEDs 71 and 74 are connected to the protective resistors 115 and 116 through the cathode side wiring path 144 that spans the second wiring layer 141b side across the via 140.

As shown in FIG. 6 and other figures, the third LED board 43 is attached to the front side of the door base (first member) 35 with the first wiring layer 141a on which the LEDs 71 to 74 are arranged facing the front side, and its front side is covered by the upper decorative cover (second member) 49 that constitutes a light-emitting lens. That is, the front side (second surface) on which the first wiring layer 141a is formed faces the upper decorative cover (second member) 49, and the back side (first surface) on which the second wiring layer 141b is formed faces the door base (first member) 35. The relationship between the distance L1 between the third LED board 43 and the door base (first member) 35 on its rear side and the distance L2 between the third LED board 43 and the upper decorative cover (second member) 49 on its front side is L1<L2.

Next, the configuration of the heat dissipation measures of the LED driver 75 will be described. As shown in FIG. 8, the LED driver (heat-generating component) 75 has a rectangular conductor pad (conductor portion) 151 made of copper foil or other conductor on its back surface, and this conductor pad 151 is fixed to the board body 111 by gluing (soldering) it to the solid ground pattern (copper foil portion) 136 on the second wiring layer (first surface) 141b side. In this embodiment, as shown in FIG. 8 and FIG. 9(a), the board body 111 has a thickness T of 1 mm, the vertical dimension X of the conductor pad 151 is 5.3 mm, the horizontal dimension Y is 5.3 mm, and the area S is 28.09 mm2. In addition, the solid ground pattern 137 is arranged on the opposite first wiring layer 141a at least in the area corresponding to the conductor pad (conductor portion) 151 of the LED driver 75 (here, the area including the area corresponding to the LED driver 75, which is a heat-generating component) (FIG. 5(a)).

In addition, a predetermined number of through holes 140a are arranged in a matrix in the area of the substrate body 111 corresponding to the conductor pad 151. The through holes 140a have copper foil on their inner surfaces, and the through holes 140a provide electrical continuity between the solid ground pattern 136 on the second wiring layer 141b side and the solid ground pattern 137 on the first wiring layer 141a side. In this embodiment, as shown in Figures 8 and 9(a), nine through holes 140a with a diameter φ = 0.6 mm are arranged in a 3 x 3 arrangement at equal intervals vertically and horizontally within the square area of the conductor pad 151, and the hole spacing Ls of the through holes 140a is larger than the diameter φ of the through holes 140a (here, 1.2 mm).

By providing such a through hole 140a in the area corresponding to the conductor pad 151 of the LED driver 75, which is a heat-generating component, heat can be dissipated from the inner surface of the through hole 140a, and heat from the LED driver 75, which is located on the rear side and has a short distance (L1) to the opposing surface (door base 35), can be dissipated more efficiently by escaping to the front side, which has a larger distance (L2) to the opposing surface (upper decorative cover 49).

The third LED board 43 of this embodiment has three types of through holes: a signal conduction via (through hole) for conducting the signal wiring path between different wiring layers, a power supply conduction via (through hole) for conducting the power supply wiring path between different wiring layers, and a heat dissipation through hole mainly for the purpose of heat dissipation. The above-mentioned through hole 140a is a heat dissipation through hole that also serves as a power supply conduction via. As shown in FIG. 7, in the third LED board 43 of this embodiment, the relationship between the diameter φ of the heat dissipation through hole such as the through hole 140a, the diameter φ1 of the signal conduction via such as the via 140b, and the diameter φ2 of the power supply conduction via such as the via 140c is φ1<φ≒φ2.

If a through hole 140a is provided within the area of the conductor pad 151, the adhesive area of the LED driver 75 to the board body 111 is reduced by the hole area of the through hole 140a, and the adhesive strength is reduced accordingly. On the other hand, because copper foil is formed on the inner surface of the through hole 140a, the heat dissipation surface increases by the surface area of the inner surface, and the amount of heat dissipation increases. Therefore, the larger the diameter φ of the through hole 140a, the higher the heat dissipation effect, but on the other hand, the adhesive strength of the LED driver 75 is reduced.

Therefore, in this embodiment, the thickness T (mm) of the board body 111, the diameter φ and the number n of the through holes 140a within the area of the conductor pad 151 are set so that the copper foil increase rate Ri (%), which is the ratio of the surface area S1 of the through holes 140a to the area S of the conductor pad 151, is greater than the porosity Rs (%), which is the ratio of the hole area S2 of the through holes 140a to the area S of the conductor pad 151.

Specifically, as shown in FIG. 9(b), the surface area S1 (mm2) of the inner surface of the through hole 140a = φπTn = 16.956, the hole area S2 (mm2) of the through hole 140a = (φ/2)2πn = 2.543, the porosity Rs (%) = (S2/S) x 100 = 9.05, and the copper foil increase rate (%) = Ri (%) = (S1/S) x 100 = 60.36, so Rs < Ri.

This can be said to mean that the increase in heat dissipation effect due to the formation of the through holes 140a is greater than the decrease in adhesive strength due to the formation of the through holes 140a. In other words, by providing the through holes 140a, the adhesive strength of the LED driver 75 is somewhat sacrificed, but the heat dissipation effect can be increased by more than that. In this embodiment, as described above, the hole spacing Ls of the through holes 140a is larger than the diameter φ of the through holes 140a (Figure 8 (b)), so it is possible to ensure a certain adhesive strength even when the through holes 140a are provided.

Here, Rs<Ri means that S1>S2. Therefore, as shown in FIG. 9(b), the net increase in copper foil area due to the formation of through-hole 140a is Sni (mm2) = S1-S2 = 14.413, that is, Sni>0.

In this embodiment, as shown in FIG. 9(b), the total copper foil area Sa (mm2) = S + Sni = 42.503, and the copper foil net gain rate Rni (%) = (Sa/S) x 100 = 151.31.

Next, burr countermeasures for the third LED board 43 will be described. As shown in FIG. 5, one or more recesses 161, four in this example, are formed on the outer periphery of the third LED board 43. As shown in FIG. 10, burrs 162 remain in the recesses 161, which were created by separating the board body 111 from the discarded board 163 (FIG. 11). The depth of the recesses 161 (hereinafter referred to as recess depth D) is greater than the protruding length of the burrs 162 (hereinafter referred to as burr length L). In this way, by allowing the burrs 162 to remain in the recesses 161 and making D>L, the burrs 162 do not protrude outward from the outer edge of the board body 111 even without deburring, and it is possible to omit the deburring process and simplify the manufacturing process.

Figure 11 shows the state before the board body 111 of the third LED board 43 is separated from the waste board (adjacent portion) 163. A slit 164 of a substantially constant width (hereinafter referred to as slit width W) is formed between the board body 111 and the waste board 163. The slit 164 is composed of a bent slit portion 164a that forms the recess 161, and a general slit portion 164b that forms the outer shape of the board body 111 excluding the recess 161.

The bent slit section 164a is formed by a pair of bent sections 165, 165 that bend from the general slit section 164b toward the substrate body 111, and an intermediate section 166 formed between the pair of bent sections 165, 165. The intermediate section 166 is formed in a substantially straight line and is missing at one or more locations (two locations in this case), and the missing portions serve as connecting sections 167 that connect the substrate body 111 and the discarded substrate 163. Here, the length of the connecting section 167 is equal to the slit width W. Also, since the burr 162 is the portion that remains after the connecting section 167 is cut approximately in the center, the burr length L is approximately half the slit width W (L ≒ W/2).

In addition, the intermediate portion 166 is shifted toward the substrate body 111 by recess depth D relative to the general slit portion 164b, but in this embodiment, the relationship between recess depth D and slit width W is D = W. Therefore, in this embodiment, L ≒ W/2 = D/2, and recess depth D is approximately twice the burr length L.

Note that recess depth D and burr length L are approximately the same (D ≒ L) when recess depth D is 1/2 of slit width W (D = W/2). Therefore, in order to make recess depth D greater than burr length L (D > L), recess depth D should be set to be greater than 1/2 of slit width W (D > W/2).

The bending portion 165 is bent at a predetermined angle from the general slit portion 164b toward the substrate body 111, and in this embodiment, the bending angle is smaller than 90 degrees (about 60 degrees in this embodiment). That is, the recess 161 in this embodiment is formed so that it becomes wider from the inside (the substrate body 111 side) toward the outside.

In addition, in the third LED board 43 of this embodiment, both the first wiring layer 141a and the second wiring layer 141b have an area along the outer periphery where no copper foil is provided (hereinafter referred to as the outer margin 171), but the width of this outer margin 171 (the distance between the outer edge and the inner edge) differs between the recess 161 and other parts. That is, as shown in FIG. 10, the outer margin 171a corresponding to the recess 161 is formed within a range of approximately constant width WSa along the outer periphery (excluding burrs 162), and the outer margin 171b corresponding to the part other than the recess 161 is formed within a range of approximately constant width WSb along the outer periphery, with the relationship between them being WSa>WSb.

10, the ground wiring path 138 is arranged inside the peripheral margin 171, and the signal and clock wiring paths 134, 135 are arranged further inside the ground wiring path 138. Thus, in the third LED board 43 of this embodiment, the recess 161 has a peripheral margin 171a where no copper foil is provided within a range of WSa (first distance) from the peripheral edge, and the ground wiring path 138 is arranged inside the peripheral margin 171a, i.e., at a position at least WSa (first distance) away from the peripheral edge, and the signal wiring path 134, etc. are arranged further inside (i.e., at a position at least a second distance longer than WSa (first distance) from the peripheral edge). In addition, for the portion other than the recess 161, a peripheral margin 171b is formed in which no copper foil is provided within a range of WSb (less than a first distance) from the peripheral edge, and the ground wiring path 138 is arranged inside of that, i.e., at a position WSb shorter than WSa from the peripheral edge (a position less than the first distance), and the signal wiring path 134, etc. are arranged further inside that (i.e., a position less than a second distance from the peripheral edge).

By configuring it in this way, even if a manufacturing error occurs and the recess 161 is formed displaced from its original position, it is possible to eliminate the possibility of the ground wiring path 138, the signal wiring path 134, etc. being scraped off, and the wiring layer can be used efficiently. In addition, it is possible to improve resistance to vibration and impact when the connecting portion 167 is folded and broken during the manufacturing process. Note that, since the impact of vibration and impact when folding and breaking the connecting portion 167 is small at positions away from the recess 161, the peripheral margin 171 is made small to ensure the area of the copper foil pattern.

As described above, the pachinko machine of this embodiment has a third LED board (board) 43 on which an LED driver (heat-generating component) 75 is mounted, and the LED driver 75 arranged on the first surface of the third LED board 43 has a conductor portion 151 provided on its back surface bonded to the copper foil portion on the first surface side, and nine (a predetermined number) through holes 140a with copper foil on the inner surface are provided in the area corresponding to the conductor portion 151 of the LED driver 75, and the plate thickness T of the third LED board 43, the diameter φ of the through holes 140a, and the predetermined number n are set so that the ratio Ri of the surface area S1 of the inner surface of the through hole 140a to the area S of the conductor portion 151 is greater than the ratio Rs of the hole area S2 of the through hole 140a to the area S of the conductor portion 151. This makes it possible to enhance heat dissipation while suppressing a decrease in the mounting strength of the LED driver (heat-generating component) 75.

In addition, nine (a predetermined number) through holes 140a are arranged in a matrix at equal intervals vertically and horizontally, and the interval Ls between the through holes 140a is set to be greater than the diameter φ of the through holes 140a. This makes it possible to ensure a certain level of adhesive strength even when the through holes 140a are provided.

In addition, a solid ground pattern 137 is arranged on at least the area corresponding to the conductor portion 151 on the second surface opposite the first surface of the third LED substrate 43. This makes it possible to efficiently dissipate heat conducted via the through hole 140a on the second surface side via the solid ground pattern 137.

The LED driver (heat-generating member) 75 is arranged on the back surface (first surface) facing the door base (first member) 35, and the LEDs 71-74 are arranged on the front surface (second surface) facing the upper decorative cover (second member) 49, and the distance L2 between the upper decorative cover 49 and the third LED board 43 is set to be greater than the distance L1 between the door base 35 and the third LED board 43. This allows the heat from the LED driver 75 arranged on the back surface (first surface) side, which is closer in distance (L1) to the opposing surface (door base 35), to escape to the front surface (second surface) side, which has a larger distance (L2) to the opposing surface (upper decorative cover 49), making it possible to dissipate heat more efficiently.

In addition, one or more recesses 161 are provided on the outer periphery of the third LED substrate 43, and burrs 162 created by cutting the connecting portion 167 remain in the recesses 161, and the depth D of the recesses 161 is set to be greater than the protruding length L of the burrs 162, so the burr removal process can be omitted, making the manufacturing process more efficient.

In addition, no copper foil is provided within the range of the first distance WSa from the outer periphery of the recess 161, the ground wiring path 138 is disposed at a position at least the first distance WSa away from the outer periphery of the recess 161, and the signal wiring path 134 is disposed at a position at least a second distance away from the outer periphery of the recess 161 that is longer than the first distance WSa. For the portion of the periphery of the third LED board 43 other than the recess 161, the ground wiring path 138 is disposed at a position less than the first distance WSa from the outer periphery, and the signal wiring path 134 is disposed at a position less than the second distance from the outer periphery. This eliminates the possibility that the ground wiring path 138, the signal wiring path 134, etc. will be scraped off, and allows efficient use of the wiring layer, even if a manufacturing error occurs and the recess 161 is formed out of position.

Although the embodiment of the present invention has been described above in detail, the present invention is not limited to this embodiment, and various modifications are possible within the scope of the present invention. For example, in the embodiment, the relationship between the diameter φ of the heat dissipation through hole, the diameter φ1 of the signal conduction via, and the diameter φ2 of the power conduction via is φ1 < φ ≒ φ2, but this is not limited to this example, and may be, for example, φ1 ≒ φ < φ2, or φ1 ≒ φ ≒ φ2. In addition, when the diameter of the heat dissipation through hole is different for each heat-generating component, if the diameter of the heat dissipation through hole corresponding to heat-generating component A is φa and the diameter of the heat dissipation through hole corresponding to heat-generating component B is φb, then φ1 ≒ φa < φb ≒ φ2 may be satisfied.

In the embodiment, the heat-generating component 75 and its conductor portion 151 are square, and the heat dissipation through holes 140a are arranged in a matrix (3 x 3) with the same number of holes in each direction within the area corresponding to the square conductor portion 151. However, if the heat-generating component and/or its conductor portion is a rectangle other than a square, the heat dissipation through holes may be arranged in a matrix (e.g. 3 x 5) with different numbers of holes in each direction.

In the example of FIG. 10, the minimum width of the ground wiring path 138 inside the peripheral margin 171 in the portion other than the recess 161 is smaller than the minimum width of the ground wiring path 138 inside the peripheral margin 171 in the portion of the recess 161, but the two may be approximately the same. Also, in the example of FIG. 10, the ground wiring path 138 is disposed between the peripheral margin 171 and the signal wiring path 134, etc., but the signal wiring path, etc. may be disposed inside the peripheral margin 171 without sandwiching the ground wiring path.

In addition, although the embodiment shows an example of applying the present invention to a pachinko machine, it can be similarly implemented in various gaming machines such as arrange ball machines and slot machines.

43 Third LED board (board)
134 Signal wiring path 138 Ground wiring path 161 Recess 162 Burr 163 Disposable board (adjacent portion)
167 Connection

Claims (1)

In a gaming machine having a base plate formed into a predetermined shape by separating adjacent integrally formed portions at connecting portions,
providing one or more recesses on the outer periphery of the substrate;
Burrs formed by cutting the connecting portion remain in the recessed portion,
The depth of the recess is greater than the protruding length of the burr,
The substrate is
No copper foil is provided within a first distance from an outer periphery of the recess,
a ground wiring path is disposed at a position that is at least the first distance away from an outer circumferential edge of the recess;
In the portion other than the recess, the ground wiring path is disposed at a position less than the first distance from the outer circumferential edge.
A gaming machine characterized by: