JP7849421B2 - Gaming machine - Google Patents

Description

This invention relates to amusement machines such as pachinko machines and slot machines.

Various gaming machines, such as pachinko machines, are equipped with various circuit boards, including control boards such as the main control board (for example, Patent Document 1).

Japanese Patent Publication No. 2017-80581

The present invention aims to provide a gaming machine that can improve various efficiencies by improving the shape of the circuit board and the wiring pattern .

The present invention relates to a gaming machine equipped with a substrate formed in a predetermined shape , wherein the substrate has a protruding burr in a recess provided on its outer periphery, the depth of the recess is greater than the protruding length of the burr, the substrate does not have copper foil within a first distance from the outer edge of the recess, a ground wiring path is arranged at a distance of the first distance or more from the outer edge of the recess, a signal wiring path is arranged at a distance of the second distance or more from the outer edge of the recess which is longer than the first distance, and for parts other than the recess, a ground wiring path is arranged at a distance less than the first distance from the outer edge .

According to the present invention, the shape of the substrate and the wiring pattern can be improved, and various efficiencies can be enhanced.

This is an overall front view of a pachinko machine according to one embodiment of the present invention. These are the rear view of the front door and the front view of the inner frame of the pachinko machine. This diagram shows the arrangement of LED circuit boards and other components in the front door of the pachinko machine. This is the wiring diagram for the third LED board of the same pachinko machine. This diagram shows the wiring patterns of each wiring layer on the third LED board of the pachinko machine. This is a side cross-sectional view of the third LED circuit board and its surrounding area in the same pachinko machine. This is a magnified view of a portion of the wiring pattern on the third LED circuit board of the same pachinko machine. These are a front view and a side cross-sectional view of the LED driver mounting portion on the third LED board of the pachinko machine. This figure shows various setting values and calculated values related to the LED driver mounting section on the third LED board of the pachinko machine. This figure shows the shape of the recess and the wiring pattern near the recess in the third LED circuit board of the pachinko machine. This diagram shows the third LED circuit board of the pachinko machine before it was separated from the main circuit board.

The embodiments of the present invention will be described in detail below with reference to the drawings. Figures 1 to 11 illustrate one embodiment in which the present invention is employed in a pachinko machine. In Figures 1 and 2, the game machine body 1 comprises a rectangular outer frame 2 and an inner frame 4 pivotally attached to the front side of the outer frame 2 by a hinge 3 on one side, for example, the left side, so as to be openable and closable.

On the front side of the inner frame 4, a game board mounting frame 6 for mounting the game board 5 is positioned on the upper side, while a launching mechanism 7, lower speaker 10, etc., are positioned on the lower side. A front door 8 covering the front of these components is pivotally attached to the hinge 3 by a hinge 9 on the same side, allowing it to open and close freely.

As shown in Figure 2, the launching mechanism 7 comprises a sheet metal support plate 11, a launching rail 12 mounted on the front of the support plate 11, a ball holder 13 mounted on the front of the support plate 11 and holding the game balls for launch on the launching rail 12, a striking hammer 15 supported on the front of the support plate 11 so as to be able to swing around a drive shaft 14 in the front-rear direction, and a launching drive mechanism 16 such as a rotary solenoid mounted on the back of the support plate 11 and driving the striking hammer 15 in the striking direction via the drive shaft 14. When the launching handle 17 on the front door 8 side is operated, the launching drive mechanism 16 continuously drives the striking hammer 15 in the striking direction (clockwise) according to the amount of operation. As a result, the game balls supplied one by one onto the launching rail 12 are launched along the launching rail 12 toward the game area 5a of the game board 5.

The game board 5 is mounted to the game board mounting frame 6, for example, from the front, and is detachably secured by one or more fasteners 18. A guide rail 21, which guides the game balls launched by the launching means 7, is mounted in an annular shape on its front side. Various game components, such as a central display unit 22, a normal symbol starting means 23, a special symbol starting means 24, a big prize means 25, and a normal prize means 26, are arranged in the game area 5a inside the guide rail 21.

The central display unit 22 is equipped with an image display means 27, such as a liquid crystal display, as well as a normal symbol display means 28, a special symbol display means 29, a normal hold count display means 30, and the like. The image display means 27 also constitutes a special effect symbol display means 31, a special hold count display means 32, and the like.

The standard symbol display means 28 is composed of two light-emitting elements (e.g., LEDs) corresponding to two types of standard symbols, such as "○" and "×". When the standard symbol activation means 23, consisting of a passage gate or the like, detects a game ball, these two light-emitting elements blink alternately for a predetermined time. If the random number value for winning, included in the standard random number information acquired when the game ball is detected by the standard symbol activation means 23, matches a predetermined winning judgment value, the light-emitting element corresponding to the "○" symbol remains lit. Otherwise, the blinking stops when the light-emitting element corresponding to the "×" symbol remains lit.

Furthermore, the normal random number information acquired when the game ball is detected by the normal symbol activation means 23 is stored in a predetermined upper limit, for example, up to 4 units. Each time a normal symbol change becomes possible, one unit is consumed, and the normal symbol change occurs. The number of stored normal random number information units (hereinafter referred to as the normal reserve number) is notified to the player by, for example, the number of light-emitting elements in the normal reserve number display means 30, which has the same number of light-emitting elements as the upper limit.

The special symbol activation means 24 is for initiating the symbol change by the special symbol display means 29. For example, it comprises two activation prize-winning means 24a and 24b, positioned below the central display unit 22. The upper activation prize-winning means 24a is a non-opening/closing type prize-winning means without opening/closing mechanisms. The lower activation prize-winning means 24b is an opening/closing type prize-winning means that can be switched between a closed state where game balls cannot (or are difficult to) enter and an open state where game balls can (or are easier to enter than in the closed state) by an opening/closing mechanism 33. When the stopped symbol after the change on the normal symbol display means 28 becomes a winning pattern and a normal profit state occurs, it is opened from the closed state to the open state for a predetermined time.

The special symbol display means 29 is composed of a display means such as a 7-segment type capable of displaying one or more special symbols, for example, one special symbol in a variable manner. The special symbol activation means 24 detects a game ball, that is, a game ball enters either of the two upper and lower activation prize entry means 24a or 24b. The special symbol is then displayed in a variable manner for a predetermined time. If the jackpot judgment random number value included in the special random number information acquired when the ball enters the activation prize entry means 24a or 24b matches a predetermined jackpot judgment value, the display stops in a predetermined jackpot mode (specific mode); otherwise, it stops in a losing mode, for example.

Furthermore, the special random number information acquired when the game ball is detected by the special symbol activation means 24 is stored up to a predetermined upper limit of four reserved numbers. Each time the special symbol display means 29 enables symbol variation, one reserved number is consumed, and the special symbol variation occurs. The number of special random number information items stored (hereinafter referred to as the special reserved number) is notified to the player by the special reserved number display means 32, for example, by the number of reserved display images X displayed.

The performance symbol display means 31 displays performance symbols in parallel with the special symbol display means 29's display of special symbols. It is configured to display one or more performance symbols, for example, three in the left-right direction, along with various performance images, on the display screen 27a of the image display means 27. When the special symbol activation means 24 detects a game ball, that is, when a game ball enters either of the two activation prize-winning means 24a or 24b, the performance symbols begin to change according to one of several variation patterns approximately simultaneously with the start of the special symbol change, and stop in a predetermined order such as left, right, and center, approximately simultaneously with the stop of the special symbol change.

The jackpot mechanism 25 is an open/close type jackpot mechanism equipped with an open/close plate 25a that can be switched between an open state allowing game balls to enter and a closed state preventing game balls from entering. When the special symbol displayed by the special symbol display mechanism 29 changes to a jackpot pattern and a special profit state is generated, the open/close plate 25a opens forward according to a predetermined opening pattern, allowing game balls that have fallen onto it to enter the mechanism.

The front door 8 is equipped with a door base 35, for example, made of resin, which has a window opening 34 formed on the front side of the game area 5a. The door base 35 has, for example, a pair of left and right upper first speakers 36a, 36b and a fan-blowing mechanism 37 positioned near the upper side of the window opening 34, and a pair of left and right upper second speakers 38a, 38b positioned near the lower side of the window opening 34. The fan-blowing mechanism 37 is for blowing air towards the player seated in front of the game machine body 1. It includes a fan-blowing mechanism 37a, such as a sirocco fan, operated by a motor (drive mechanism), and is positioned adjacent to the right upper first speaker 36b on the upper right end of the door base 35, so that, for example, the air outlet 37b faces diagonally downwards and forward.

Furthermore, as shown in Figure 3, multiple (six in this case) LED boards 41-46 are arranged around the window opening 34 on the front side of the door base 35. Specifically, the first LED board 41 is located in the lower left of the window opening 34, the second LED board 42 in the upper left, and the third LED board 43 approximately in the center of the upper left side of the window opening 34. The fourth LED board 44 is located in the lower right of the window opening 34, the fifth LED board 45 is located above it, and the sixth LED board 46 is located near the air blower effect means 37 in the upper right of the window opening 34.

The first LED board 41 and the second LED board 42 are positioned along the window opening 34 between the left upper second speaker 38a and the upper first speaker 36a, and the third LED board 43 is positioned between the left and right upper first speakers 36a and 36b. The fourth LED board 44 and the fifth LED board 45 are positioned along the window opening 34 between the right upper second speaker 38b and the air blowing effect mechanism 37, and the sixth LED board 46 is positioned, for example, on the outer circumference of the air outlet 37b of the air blowing effect mechanism 37.

As shown in Figure 1, an upper tray 47 for storing game balls to be supplied to the launching mechanism 7 is located on the lower front side of the door base 35, for example, slightly to the left. Below the upper tray 47, a lower tray 48 for storing excess balls when the upper tray 47 is full is located on the left end, and the launching handle 17 is located on the right end.

Furthermore, the front of the door base 35 is fitted with an upper decorative cover 49 that substantially covers the area around the window opening 34 from the front, and a lower decorative cover 50 that substantially covers the upper tray 47, lower tray 48, etc., from the front. The upper decorative cover 49 has a light-emitting lens portion that is translucent, at least in the portion corresponding to the front of the first to sixth LED boards 41 to 46. On the lower decorative cover 50, a player-operable effect button 51 is positioned approximately in the left-right center of the front of the upper tray 47, and a ball dispensing operation unit 52 is positioned to its side.

As shown in Figure 2, a glass unit 53 that substantially covers the window opening 34 from the rear is detachably mounted on the back of the door base 35, and below it are the ball feeding means 54, the lower tray guide means 55, the front door relay board 56, etc. The ball feeding means 54 supplies game balls from the upper tray 47 one by one onto the launch rail 12, and is positioned in front of the launch means 7, and operates in synchronization with the launching operation of the launch means 7. The lower tray guide means 55 is for guiding excess balls when the upper tray 47 is full, and foul balls that have been launched by the launch means 7 but have returned without reaching the game area 5a, to the lower tray 48, and is positioned, for example, adjacent to the ball feeding means 54 on its hinge 9 side. Furthermore, the front door relay board 56 acts as a relay between the performance control board and other components located on the back of the game board 5, and the first to sixth LED boards 41-46, speakers 10, 36a, 36b, 38a, 38b, and various performance components such as the air blower 37 on the front door 8 side. It is positioned between the door base 35 and the lower tray guide component 55 behind it.

Next, we will explain the wiring of the various game components installed in the front door 8, particularly the first to sixth LED boards 41-46, the upper first speakers 36a and 36b, the upper second speakers 38a and 38b, and the air blowing effect means 37.

As shown in Figure 3, the wiring paths for the first to sixth LED boards 41-46 branch off to the left and right from the front door relay board 56, which is located on the lower side of the front door 8, along the window opening 34. The first to third LED boards 41-43 constitute the left wiring path 57 on the left side of the window opening 34, and the fourth to sixth LED boards 44-46 constitute the right wiring path 58 on the right side of the window opening 34. The drive wiring paths for the upper first speakers 36a and 36b are provided on the left wiring path 57, and the drive wiring path for the air blower effect means 37 is provided on the right wiring path 58. The upper second speakers 38a and 38b are independent of the left and right wiring paths 57 and 58, and are connected to the front door relay board 56 via harnesses 59a and 59b.

The first to third LED boards 41 to 43, which constitute the left wiring path 57, are connected in series via harnesses 61 and 62, with the first LED board 41, the upstreammost of these, connected to the front door relay board 56 via harness 60. In the left wiring path 57, through-pass wiring is provided for the first LED board 41 and the second LED board 42, and a circuit section including LEDs 71 to 74 and an LED driver 75 that drives them, located on the third LED board 43, is connected to the downstream side of the through-pass wiring. In addition, the first LED board 41 and the second LED board 42 are also provided with circuit sections including LEDs 76 to 79, 80 to 83 and LED drivers 84 to 85 and 86 to 87 that drive them, and each is connected to the through-pass wiring. Furthermore, a portion of the drive wiring for the upper first speakers 36a and 36b is provided on the first to third LED boards 41 to 43, and the downstream third LED board 43 is connected to the upper first speakers 36a and 36b via harnesses 63 and 64, respectively.

The fourth to sixth LED boards 44 to 46, which constitute the right wiring path 58, are connected in series via harnesses 66 and 67, with the upstream fourth LED board 44 connected to the front door relay board 56 via harness 65. In the right wiring path 58, through-pass wiring paths are provided for the fourth LED board 44 and the fifth LED board 45, and a circuit section including LEDs 91, 92, etc., arranged on the sixth LED board 46 and an LED driver (not shown) that drives them is connected to the downstream side of the through-pass wiring path. The fourth LED board 44 is also provided with a circuit section including LEDs 93 to 96 and an LED driver 97 that drives them, and this is connected to the through-pass wiring path. LEDs 101 to 104 are also provided on the fifth LED board 45, but these LEDs are driven by the LED driver 97 on the fourth LED board 44. Furthermore, a portion of the drive wiring path for the air blower effect mechanism 37 is provided on the fourth and fifth LED boards 44 and 45, and the fifth LED board 45 and the air blower mechanism 37a of the air blower effect mechanism 37 are connected via a harness 68.

Next, using the third LED board 43 as an example from the first to sixth LED boards 41 to 46, we will explain heat dissipation measures for the LED driver, which is an example of a heat-generating component, and measures to prevent burrs on the board.

First, the circuit configuration of the third LED board 43 will be explained. As shown in Figure 3, the third LED board 43 has a horizontally elongated, roughly rectangular board body 111 with wiring layers on both the front and rear sides. As shown in Figure 4, this board body 111 is equipped with an upstream connector 112, a pair of speaker connectors 113 and 114, an LED driver 75, LEDs 71 to 74, protective resistors 115 and 116, and the like.

The upstream connector 112 is connected to the downstream connector on the second LED board 42 side by the harness 62. It has the same terminal configuration as the downstream connector, and includes an LED power terminal 121, an LED driver power terminal 122, a signal terminal 123, a clock terminal 124, ground terminals 125a and 125b, and speaker terminals 126a to 126d. These 10 terminals are arranged in two rows of five, for example. The two terminals at each end of these two rows, totaling four terminals, are the speaker terminals 126a to 126d.

The speaker connectors 113 and 114 are connected to the upper first speakers 36a and 36b by harnesses 63 and 64. Speaker connector 113 is provided with speaker terminals 131a and 131b, and speaker connector 114 is provided with speaker terminals 131c and 131d. The speaker terminals 131a and 131b of speaker connector 113 are connected to the speaker terminals 126a and 126b of the upstream connector 112 via speaker drive wiring lines 132a and 132b. The speaker terminals 131c and 131d of speaker connector 114 are connected to the speaker terminals 126c and 126d of the upstream connector 112 via speaker drive wiring lines 132c and 132d.

Figure 5 shows the specific wiring pattern of the third LED board 43, layer by layer. On the third LED board 43, LEDs 71-74, etc., are located on the first wiring layer 141a on the front side (Figure 5(a)), while the upstream connector 112, speaker connectors 113 and 114, LED driver 75, protective resistors 115 and 116, etc., are located on the second wiring layer 141b on the back side (Figure 5(b)).

The upstream connector 112 is positioned on one end of the second wiring layer 141b with its terminals arranged in the left-right direction, while the speaker connectors 113 and 114 are positioned on both ends of the second wiring layer 141b with their terminals arranged in the up-down direction. Speaker drive wiring paths 132a and 132b are connected to the speaker terminals 126a and 126b at one end of the upstream connector 112 from the outside in the terminal arrangement direction (left-right direction), and speaker drive wiring paths 132c and 132d are connected to the speaker terminals 126c and 126d at the other end of the upstream connector 112 from the outside in the terminal arrangement direction (left-right direction).

Furthermore, speaker drive wiring paths 132a and 132b are connected to the speaker terminals 131a and 131b of speaker connector 113 from the outside in the terminal arrangement direction (here, the vertical direction), and speaker drive wiring paths 132c and 132d are connected to the speaker terminals 131c and 131d of speaker connector 114 from the outside in the terminal arrangement direction (here, the vertical direction). Note that the speaker drive wiring paths 132a to 132d are provided almost entirely on the same first wiring layer 141a side as the LEDs 71 to 74, except for predetermined areas near the connection points to each connector 112 to 114, for example, at both ends.

The LED driver 75 is positioned approximately in the center of the second wiring layer 141b, with protective resistors 115 and 116, connected to the RGB terminals of the LED driver 75, positioned on either side. The LED driver 75 is connected to the LED driver power terminal 122, signal terminal 123, and clock terminal 124 of the upstream connector 112 via wiring paths 133-135 for the LED driver power supply, signal, and clock. Except for a portion of the bypass route that bypasses to the first wiring layer 141a via vias 140, almost the entirety of these wiring paths 133-135 is located on the second wiring layer 141b. Via 140 is a through-hole type via with copper foil applied to the inner surface of the through-hole.

The second wiring layer 141b is provided with one or more ground plane patterns 136. The ground plane patterns 136, together with the ground plane patterns 137 on the first wiring layer 141a side, constitute a ground wiring path 138. For example, they are connected to the ground terminals 125a and 125b of the upstream connector 112 and the ground terminal of the LED driver 75 via vias 140, the ground plane patterns 137, etc.

A portion of the ground plane pattern 136 is positioned between the LED driver 75 and the main board 111. Furthermore, a predetermined number of vias 140 (hereinafter referred to as through-holes 140a) connecting the ground plane pattern 136 and the ground plane pattern 137 on the first wiring layer 141a side are positioned within the LED driver 75's placement area.

LEDs 71-74 are arranged in a zigzag pattern along the longitudinal direction of the first wiring layer 141a. LEDs 71 and 72 on the left and LEDs 73 and 74 on the right are connected in series via an inter-LED wiring path 142. The anode electrodes of LEDs 72 and 73 are connected to the LED power terminal 121 of the upstream connector 112 via a via 140 and an LED power supply wiring path 143 that spans the second wiring layer 141b. The cathode electrodes of LEDs 71 and 74 are connected to protective resistors 115 and 116 via a cathode-side wiring path 144 that spans the second wiring layer 141b, separated by a via 140.

As shown in Figure 6, the third LED substrate 43 is mounted on the front side of the door base (first member) 35 with the first wiring layer 141a, on which LEDs 71-74 are arranged, facing forward. Its front side is covered by the upper decorative cover (second member) 49, which constitutes the light-emitting lens. Specifically, the front (second surface) side, where the first wiring layer 141a is formed, faces the upper decorative cover (second member) 49, while the rear (first surface) side, where the second wiring layer 141b is formed, faces the door base (first member) 35. The relationship between the distance L1 between the third LED substrate 43 and the rear of the door base (first member) 35, and the distance L2 between the third LED substrate 43 and the front of the upper decorative cover (second member) 49, is L1 < L2.

Next, the configuration for heat dissipation measures for the LED driver 75 will be described. As shown in Figure 8, the LED driver (heat-generating component) 75 has a rectangular conductor pad (conductor portion) 151 made of copper foil or other conductor on its back surface. This conductor pad 151 is fixed to the substrate body 111 by bonding (soldering) it to the ground plane pattern (copper foil portion) 136 on the second wiring layer (first surface) 141b side. In this embodiment, as shown in Figures 8 and 9(a), the thickness T of the substrate body 111 is 1 mm, the vertical dimension X of the conductor pad 151 is 5.3 mm, the horizontal dimension Y is 5.3 mm, and the area S is 28.09 mm². On the opposite side of the first wiring layer 141a, a ground plane pattern 137 is arranged in an area corresponding to at least the conductor pad (conductor portion) 151 of the LED driver 75 (in this case, an area including the area corresponding to the LED driver 75, which is a heat-generating component) (Figure 5(a)).

Furthermore, a predetermined number of through-holes 140a are arranged in a matrix within the area corresponding to the conductor pad 151 on the substrate body 111. Copper foil is applied to the inner surface of each through-hole 140a, and these through-holes 140a provide electrical connection between the ground plane pattern 136 on the second wiring layer 141b side and the ground plane pattern 137 on the first wiring layer 141a side. In this embodiment, as shown in Figures 8 and 9(a), nine through-holes 140a with a diameter of φ = 0.6 mm are arranged in a 3x3 arrangement at equal intervals vertically and horizontally within the square area of the conductor pad 151. The spacing Ls between these through-holes 140a is larger than the diameter φ of the through-hole 140a (1.2 mm in this case).

By providing such a through-hole 140a within the area corresponding to the conductor pad 151 of the heat-generating LED driver 75, heat can be dissipated from the inner surface of the through-hole 140a. Furthermore, heat from the LED driver 75, which is located on the rear side where the distance (L1) to the opposing surface (door base 35) is shorter, can be more efficiently dissipated by diverting it to the front side where there is more space (L2) to the opposing surface (upper decorative cover 49).

Furthermore, the third LED substrate 43 of this embodiment is provided with three types of through-holes: signal conduction vias (through-holes) for conducting signal wiring paths between different wiring layers, power conduction vias (through-holes) for conducting power wiring paths between different wiring layers, and heat dissipation through-holes primarily for heat dissipation. The aforementioned through-hole 140a is a heat dissipation through-hole that also serves as a power conduction via. In the third LED substrate 43 of this embodiment, as shown in Figure 7, the relationship between the diameter φ of heat dissipation through-holes such as through-hole 140a, the diameter φ1 of signal conduction vias such as via 140b, and the diameter φ2 of power conduction vias such as via 140c is φ1 < φ ≈ φ2.

Here, if a through-hole 140a is provided within the area of the conductor pad 151, the bonding area of the LED driver 75 to the substrate body 111 decreases by the area of the through-hole 140a, thus reducing the bonding strength. On the other hand, since copper foil is formed on the inner surface of the through-hole 140a, the heat dissipation surface increases by the surface integral of that inner surface, increasing the amount of heat dissipated. Therefore, the larger the diameter φ of the through-hole 140a, the greater the heat dissipation effect, but at the same time, the bonding strength of the LED driver 75 decreases.

Therefore, in this embodiment, the thickness T (mm) of the substrate body 111, the diameter φ, and the number n of through-holes 140a within the area of the conductor pad 151 are set such that the copper foil increase rate Ri (%), which is the ratio of the surface area S1 of the through-holes 140a to the area S of the conductor pad 151, is greater than the porosity Rs (%), which is the ratio of the hole area S2 of the through-holes 140a to the area S of the conductor pad 151.

Specifically, as shown in Figure 9(b), the surface area of the inner surface of the through-hole 140a is S1 (mm²) = φπTn = 16.956, the pore area of the through-hole 140a is S2 (mm²) = (φ/2)²πn = 2.543, the porosity Rs (%) = (S2/S) × 100 = 9.05, and the copper foil increase rate (%) = Ri (%) = (S1/S) × 100 = 60.36, thus Rs < Ri.

This can be rephrased as the increase in heat dissipation due to the formation of the through-hole 140a outweighs the decrease in adhesive strength caused by its formation. In other words, while the adhesive strength of the LED driver 75 is slightly compromised by the provision of the through-hole 140a, the heat dissipation effect is increased even more significantly. In this embodiment, as described above, the hole spacing Ls of the through-hole 140a is larger than the diameter φ of the through-hole 140a (Figure 8(b)), making it possible to maintain a certain level of adhesive strength while providing the through-hole 140a.

Here, Rs < Ri means that S1 > S2. Therefore, as shown in Figure 9(b), the net increase in copper foil area due to the formation of the through-hole 140a, Sni (mm²) = S1 - S2 = 14.413, i.e., Sni > 0.

Furthermore, in this embodiment, as shown in Figure 9(b), the total copper foil area Sa (mm²) = S + Sni = 42.503, and the copper foil net increase rate Rni (%) = (Sa/S) × 100 = 151.31.

Next, we will explain the burr countermeasures for the third LED substrate 43. As shown in Figure 5, one or more recesses 161, in this case four, are formed on the outer circumference of the third LED substrate 43. Within these recesses 161, as shown in Figure 10, burrs 162 remain, created by separating the substrate body 111 from the discard substrate 163 (Figure 11). The depth of the recess 161 (hereinafter referred to as recess depth D) is greater than the protruding length of the burr 162 (hereinafter referred to as burr length L). By ensuring that the burr 162 remains within the recess 161 and D > L, the burr 162 does not protrude beyond the outer edge of the substrate body 111 without the need for deburring, thus simplifying the manufacturing process by eliminating the deburring step.

Figure 11 shows the state of the third LED substrate 43 before separating the substrate body 111 from the discard substrate (adjacent portion) 163. A slit 164 of approximately constant width (hereinafter referred to as slit width W) is formed between the substrate body 111 and the discard substrate 163. The slit 164 consists of a bent slit portion 164a that forms a recess 161 and a general slit portion 164b that forms the outer shape of the substrate body 111 excluding the recess 161.

The bent slit portion 164a is formed by a pair of bent portions 165, 165 that bend from the general slit portion 164b toward the substrate body 111, and an intermediate portion 166 formed between these bent portions 165, 165. The intermediate portion 166 is formed in a substantially straight line and is missing in one or more places (two places in this case). These missing portions form a connecting portion 167 that connects the substrate body 111 and the discard substrate 163. Here, the length of the connecting portion 167 is equal to the slit width W. Furthermore, since the burr 162 is the portion remaining after the connecting portion 167 is cut approximately in the center, the burr length L is approximately half the slit width W (L ≈ W/2).

Furthermore, the intermediate section 166 is shifted toward the substrate body 111 side by a recess depth D relative to the general slit section 164b. In this embodiment, the relationship between the recess depth D and the slit width W is D = W. Therefore, in this embodiment, L ≈ W/2 = D/2, and the recess depth D is approximately twice the burr length L.

Furthermore, the recess depth D and burr length L are approximately the same (D ≈ L) when the recess depth D is half the slit width W (D = W/2). Therefore, to make the recess depth D greater than the burr length L (D > L), the recess depth D should be set to be greater than half the slit width W (D > W/2).

Furthermore, the bent portion 165 is bent at a predetermined angle from the general slit portion 164b toward the substrate body 111, and in this embodiment, the angle of refraction is less than 90 degrees (approximately 60 degrees in this case). That is, the recess 161 in this embodiment is formed to widen from the inside (towards the substrate body 111) toward the outside.

Furthermore, in the third LED substrate 43 of this embodiment, both the first wiring layer 141a and the second wiring layer 141b have areas along their outer edges where copper foil is not provided (hereinafter referred to as the outer margin portion 171). However, the width of this outer margin portion 171 (the distance between the outer and inner edges) differs between the recessed area 161 and the other areas. Specifically, as shown in Figure 10, the outer margin portion 171a corresponding to the recessed area 161 is formed within a range of approximately constant width WSa along the outer edge (excluding the burr 162), while the outer margin portion 171b corresponding to the area other than the recessed area 161 is formed within a range of approximately constant width WSb along the outer edge, with the relationship being WSa > WSb.

In the example shown in Figure 10, a ground wiring path 138 is arranged inside the outer peripheral margin 171, and further inside the ground wiring path 138, the signal wiring path 134 and clock wiring path 135 are arranged. Thus, in the third LED substrate 43 of this embodiment, an outer peripheral margin 171a is formed in the recess 161 portion, where copper foil is not provided within a range of WSa (first distance) from the outer peripheral edge. Inside this, the ground wiring path 138 is arranged at a position at a distance of WSa (first distance) or more from the outer peripheral edge, and further inside that (at a position at a distance of a second distance or more, which is longer than WSa (first distance) from the outer peripheral edge), the signal wiring path 134 and the like are arranged. Furthermore, in areas other than the recess 161, a peripheral margin 171b is formed where copper foil is not provided within a range of WSb (less than the first distance) from the outer edge. Inside this margin, i.e., at a position WSb shorter than WSa from the outer edge (less than the first distance), a ground wiring path 138 is arranged, and further inside that (i.e., at a position less than the second distance from the outer edge), signal wiring paths 134, etc., are arranged.

This configuration eliminates the possibility of ground wiring 138 and signal wiring 134 being scraped off even if manufacturing errors cause the recess 161 to be formed at a different position than intended, and also allows for efficient use of the wiring layer. Furthermore, it improves resistance to vibration and shock when the connecting portion 167 is folded during the manufacturing process. Note that the impact of vibration and shock when folding the connecting portion 167 is small at positions far from the recess 161, so the outer margin 171 is made smaller to ensure sufficient area for the copper foil pattern.

As described above, the pachinko machine of this embodiment has a third LED substrate (substrate) 43 on which an LED driver (heat-generating component) 75 is mounted. The LED driver 75, positioned on the first surface of the third LED substrate 43, has a conductor portion 151 on its back surface that is bonded to the copper foil portion on the first surface. Nine (a predetermined number) through-holes 140a, each with copper foil on its inner surface, are provided in the area corresponding to the conductor portion 151 of the LED driver 75. The thickness T of the third LED substrate 43, the diameter φ of the through-holes 140a, and the predetermined number n are set such that the ratio Ri of the surface area S1 of the inner surface of the through-holes 140a to the area S of the conductor portion 151 is greater than the ratio Rs of the hole area S2 of the through-holes 140a to the area S of the conductor portion 151. This makes it possible to improve heat dissipation while suppressing a decrease in the mounting strength of the LED driver (heat-generating component) 75.

Furthermore, nine (a predetermined number) through-holes 140a are arranged in a matrix at equal intervals both vertically and horizontally, and the spacing Ls between these through-holes 140a is larger than the diameter φ of each through-hole 140a. This makes it possible to ensure a certain level of adhesive strength while still providing through-holes 140a.

Furthermore, a solid ground pattern 137 is placed on the second surface of the third LED substrate 43, opposite to the first surface, in a region corresponding to at least the conductor portion 151. This allows heat conducted through the through-holes 140a to be efficiently dissipated on the second surface side via the solid ground pattern 137.

Furthermore, the LED driver (heat-generating component) 75 is positioned on the back (first surface) side facing the door base (first component) 35, and the LEDs 71-74 are positioned on the front (second surface) side facing the upper decorative cover (second component) 49. The distance L2 between the upper decorative cover 49 and the third LED board 43 is greater than the distance L1 between the door base 35 and the third LED board 43. This allows heat from the LED driver 75, which is located on the back (first surface) side where the distance (L1) to the opposing surface (door base 35) is shorter, to be dissipated more efficiently by diverting heat to the front (second surface) side where there is more headroom (L2) to the opposing surface (upper decorative cover 49).

Furthermore, by providing one or more recesses 161 on the outer circumference of the third LED substrate 43, and by leaving burrs 162 created by cutting the connecting portion 167 within the recesses 161, and by making the depth D of the recesses 161 greater than the protruding length L of the burrs 162, the manufacturing process can be made more efficient by omitting the burr removal step.

Furthermore, copper foil is not provided within a first distance WSaa from the outer edge of the recess 161. A ground wiring path 138 is positioned at a distance of at least the first distance WSaa from the outer edge of the recess 161, and a signal wiring path 134 is positioned at a distance of at least the second distance (longer than the first distance WSaa) from the outer edge of the recess 161. For the portion of the outer edge of the third LED substrate 43 other than the recess 161, a ground wiring path 138 is positioned at a distance less than the first distance WSaa from the outer edge, and a signal wiring path 134 is positioned at a distance less than the second distance from the outer edge. This eliminates the possibility of the ground wiring path 138 or signal wiring path 134 being scraped off even if manufacturing errors cause the recess 161 to be formed slightly off-center, and also allows for efficient use of the wiring layer.

The embodiments of the present invention have been described in detail above, but the present invention is not limited to these embodiments, and various modifications are possible without departing from the spirit of the invention. For example, in the embodiments, an example was shown where the relationship between the diameter φ of the heat dissipation through-hole, the diameter φ1 of the signal conduction via, and the diameter φ2 of the power conduction via was φ1 < φ ≈ φ2, but this is not limited to this, and for example, φ1 ≈ φ < φ2 or φ1 ≈ φ ≈ φ2 may be used. Also, when the diameter of the heat dissipation through-hole differs for each heat-generating component, if the diameter of the heat dissipation through-hole corresponding to heat-generating component A is φa and the diameter of the heat dissipation through-hole corresponding to heat-generating component B is φb, then φ1 ≈ φa < φb ≈ φ2 may be used.

In this embodiment, the heat-generating component 75 and its conductor portion 151 are square, and the heat-dissipating through-holes 140a are arranged in a matrix (3x3) with an equal number of vertical and horizontal holes within the area corresponding to the square conductor portion 151. However, if the heat-generating component and/or its conductor portion are rectangular rather than square, the heat-dissipating through-holes may be arranged in a matrix with a different number of vertical and horizontal holes (for example, 3x5).

In the example shown in Figure 10, the minimum width of the ground wiring path 138 inside the outer perimeter margin 171 in the recessed portion 161 is smaller than the minimum width of the ground wiring path 138 inside the outer perimeter margin 171 in the portion other than the recessed portion 161. However, the two may be approximately the same. Also, in the example shown in Figure 10, the ground wiring path 138 is placed between the outer perimeter margin 171 and the signal wiring path 134, etc., but the signal wiring path, etc., may be placed inside the outer perimeter margin 171 without a ground wiring path in between.

Furthermore, while the embodiment shows an example of applying the present invention to a pachinko machine, it can be similarly implemented in various other gaming machines such as arrangement ball machines and slot machines.

43. Third LED substrate (substrate)
75 LED driver (heat-generating component)
137 Ground pattern 140a Through hole 151 Conductor part

Claims (1)

In a gaming machine equipped with a circuit board formed in a predetermined shape ,
The substrate has a protruding burr in a recess provided on its outer circumference,
The depth of the recess is greater than the protruding length of the burr.
The aforementioned substrate is
Copper foil is not provided within a first distance range from the outer edge of the recess.
A ground wiring path is placed at a position at a distance of at least the first distance from the outer edge of the recess,
The signal wiring path is positioned at a distance greater than or equal to a second distance, which is longer than the first distance, from the outer edge of the recess.
For portions other than the aforementioned recess, the ground wiring path is positioned at a distance less than the first distance from the outer edge.
A gaming machine characterized by the following features.