JP7522386B2 - Glass composition and sealing material - Google Patents
Glass composition and sealing material Download PDFInfo
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- JP7522386B2 JP7522386B2 JP2020085891A JP2020085891A JP7522386B2 JP 7522386 B2 JP7522386 B2 JP 7522386B2 JP 2020085891 A JP2020085891 A JP 2020085891A JP 2020085891 A JP2020085891 A JP 2020085891A JP 7522386 B2 JP7522386 B2 JP 7522386B2
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- 239000011521 glass Substances 0.000 title claims description 177
- 239000003566 sealing material Substances 0.000 title claims description 35
- 239000002131 composite material Substances 0.000 title description 2
- 239000000843 powder Substances 0.000 claims description 51
- 239000000203 mixture Substances 0.000 claims description 36
- 239000000945 filler Substances 0.000 claims description 27
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 6
- 229910003069 TeO2 Inorganic materials 0.000 claims description 6
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 claims description 6
- 239000010453 quartz Substances 0.000 claims description 6
- LAJZODKXOMJMPK-UHFFFAOYSA-N tellurium dioxide Chemical compound O=[Te]=O LAJZODKXOMJMPK-UHFFFAOYSA-N 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 5
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 4
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 claims 2
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 claims 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 29
- 238000004031 devitrification Methods 0.000 description 22
- 238000010304 firing Methods 0.000 description 21
- 238000004017 vitrification Methods 0.000 description 14
- 238000002844 melting Methods 0.000 description 13
- 230000008018 melting Effects 0.000 description 13
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 238000005259 measurement Methods 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- 239000005385 borate glass Substances 0.000 description 5
- 229910052593 corundum Inorganic materials 0.000 description 5
- ZPPSOOVFTBGHBI-UHFFFAOYSA-N lead(2+);oxido(oxo)borane Chemical compound [Pb+2].[O-]B=O.[O-]B=O ZPPSOOVFTBGHBI-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229910001845 yogo sapphire Inorganic materials 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000011812 mixed powder Substances 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000009970 fire resistant effect Effects 0.000 description 2
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000006060 molten glass Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- -1 polyethylene carbonate Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- BUUSNVSJZVGMFY-UHFFFAOYSA-N 4-ethylheptane-3,3-diol Chemical compound CCCC(CC)C(O)(O)CC BUUSNVSJZVGMFY-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000505 Al2TiO5 Inorganic materials 0.000 description 1
- 229910011255 B2O3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000002202 Polyethylene glycol Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 1
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Inorganic materials O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N nickel(II) oxide Inorganic materials [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001223 polyethylene glycol Chemical class 0.000 description 1
- AABBHSMFGKYLKE-SNAWJCMRSA-N propan-2-yl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(C)C AABBHSMFGKYLKE-SNAWJCMRSA-N 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- YEAUATLBSVJFOY-UHFFFAOYSA-N tetraantimony hexaoxide Chemical compound O1[Sb](O2)O[Sb]3O[Sb]1O[Sb]2O3 YEAUATLBSVJFOY-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 229910052844 willemite Inorganic materials 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- 229910000500 β-quartz Inorganic materials 0.000 description 1
- 229910052644 β-spodumene Inorganic materials 0.000 description 1
Landscapes
- Glass Compositions (AREA)
Description
本発明は、有害な鉛を含有することなく、耐候性を有しつつ、低温焼成で気密封着することが可能なガラス組成物と、それを用いた封着材料に関するものである。 The present invention relates to a glass composition that does not contain harmful lead, has weather resistance, and can be hermetically sealed by low-temperature firing, and a sealing material that uses the glass composition.
半導体集積回路、水晶振動子、金属部材、平面表示装置やLED用ガラス端子等には、封着材料が使用される。 Sealing materials are used in semiconductor integrated circuits, quartz crystal oscillators, metal components, flat panel displays, glass terminals for LEDs, etc.
上記の封着材料には、化学的耐久性および耐熱性が要求されるため、樹脂系の接着剤ではなくガラス系封着材料が用いられている。封着材料には、さらに機械的強度、流動性、耐候性等の特性が要求されるが、熱に弱い素子を搭載する電子部品の封着には、封着温度をできる限り低くすることが要求される。具体的には、400℃以下での封着が好ましい。それゆえ、上記特性を満足するガラスとして、軟化点を下げる効果が極めて大きいPbOを多量に含有する鉛硼酸系ガラスが広く用いられてきた(例えば、特許文献1参照)。 The above sealing materials require chemical durability and heat resistance, so glass-based sealing materials are used instead of resin-based adhesives. Sealing materials are also required to have properties such as mechanical strength, fluidity, and weather resistance, but sealing electronic components that are equipped with elements that are sensitive to heat requires that the sealing temperature be as low as possible. Specifically, sealing at 400°C or lower is preferable. Therefore, lead borate glass, which contains a large amount of PbO, which has an extremely large effect of lowering the softening point, has been widely used as a glass that satisfies the above properties (see, for example, Patent Document 1).
鉛硼酸系ガラスに含まれるPbOに対して環境上の問題が指摘されており、鉛硼酸系ガラスからPbOを含まないガラスに置き換えることが望まれている。そのため、鉛硼酸系ガラスの代替品として、様々な低軟化点ガラスが開発されている。しかし、一般的に、ガラスの軟化点が低くなるにともない、ガラスの耐候性は悪化する傾向があるため、この両立が技術課題である。特許文献2に記載されているCuO-TeO2-MoO3系ガラスは、鉛硼酸系ガラスの代替候補として期待されていたが、耐候性を有するものの、前述の素子の耐熱性を考慮すると、更なる封着温度の低温化が求められていた。 Environmental problems have been pointed out regarding the PbO contained in lead borate glass, and it is desirable to replace lead borate glass with glass that does not contain PbO. For this reason, various low-softening point glasses have been developed as substitutes for lead borate glass. However, in general, as the softening point of glass decreases, the weather resistance of the glass tends to deteriorate, so achieving both is a technical challenge. The CuO-TeO 2 -MoO 3 glass described in Patent Document 2 was expected to be a candidate for replacing lead borate glass, but although it has weather resistance, further lowering of the sealing temperature is required in consideration of the heat resistance of the above-mentioned element.
以上に鑑み、本発明は、耐候性を有しつつ、低温焼成で封着可能なガラス組成物と、それを用いた封着材料を提供することを目的とする。 In view of the above, the present invention aims to provide a glass composition that is weather resistant and can be sealed by low-temperature firing, and a sealing material using the same.
本発明のガラス組成物は、モル%で、MgO+CaO+SrO+BaO+ZnO 1~30%、TeO2 30~80%、MoO3 5~30%を含有することを特徴とする。ここで、「MgO+CaO+SrO+BaO+ZnO」とは、MgO、CaO、SrO、BaO及びZnOの合量を意味する。 The glass composition of the present invention is characterized by containing, in mol %, 1-30% MgO+CaO+SrO+BaO+ZnO, 30-80% TeO 2 , and 5-30 % MoO 3. Here, "MgO+CaO+SrO+BaO+ZnO" means the total amount of MgO, CaO, SrO, BaO, and ZnO.
本発明のガラス組成物は、MgO、CaO、SrO、BaO及びZnOの合量を1%以上にすることにより、ガラスの耐候性を有しつつ、低軟化点を達成している。なお、一般に、ガラスの軟化点が低くなると、ガラス化が困難であったり、分相が生じて均質なガラスが得られにくい傾向にあるが、本発明では、TeO2の含有量を30%以上、MoO3の含有量を5%以上に規定しているため、ガラスが安定化し、均質なガラスを得ることが出来る。 The glass composition of the present invention achieves a low softening point while retaining the weather resistance of glass by making the total content of MgO, CaO, SrO, BaO and ZnO 1% or more. Generally, when the softening point of glass is low, vitrification becomes difficult or phase separation occurs, making it difficult to obtain homogeneous glass. However, in the present invention, the content of TeO2 is set to 30% or more and the content of MoO3 is set to 5% or more, so that the glass is stabilized and homogeneous glass can be obtained.
更に、本発明のガラス組成物は、モル%で、Li2O+Na2O+K2O 1~30%を含有することが好ましい。ここで、「Li2O+Na2O+K2O」とは、Li2O、Na2O及びK2Oの合量を意味する。 Furthermore, the glass composition of the present invention preferably contains, in mol %, 1 to 30% of Li 2 O + Na 2 O + K 2 O. Here, "Li 2 O + Na 2 O + K 2 O" means the total amount of Li 2 O, Na 2 O and K 2 O.
更に、本発明のガラス組成物は、モル%で、BaOが1~30%であることが好ましい。 Furthermore, the glass composition of the present invention preferably contains, in mole percent, 1 to 30% BaO.
更に、本発明のガラス組成物は、モル%で、TiO2+Al2O3 0~10%を含有することが好ましい。ここで、「TiO2+Al2O3」とは、TiO2及びAl2O3の合量を意味する。 Furthermore, the glass composition of the present invention preferably contains, in mol %, 0 to 10% of TiO 2 +Al 2 O 3 , where "TiO 2 +Al 2 O 3 " means the total amount of TiO 2 and Al 2 O 3 .
更に、本発明のガラス組成物は、モル%で、Al2O3 1~10%を含有することが好ましい。 Furthermore, the glass composition of the present invention preferably contains, in mol %, 1 to 10% Al 2 O 3 .
更に、本発明のガラス組成物は、モル%で、CuO 0~30%、WO3 0~20%、P2O5 0~10%を含有することが好ましい。 Furthermore, the glass composition of the present invention preferably contains, in mol %, CuO 0-30%, WO 3 0-20%, and P 2 O 5 0-10%.
更に、本発明のガラス組成物は、モル%で、CuO 1~30%を含有することが好ましい。 Furthermore, the glass composition of the present invention preferably contains, in mole percent, 1 to 30% CuO.
本発明の封着材料は、上記のガラス組成物からなるガラス粉末 40~100体積%と、耐火性フィラー粉末 0~60体積%とを含有することを特徴とする。 The sealing material of the present invention is characterized by containing 40 to 100 volume % of glass powder made of the above glass composition and 0 to 60 volume % of refractory filler powder.
本発明の封着材料は、耐火性フィラー粉末がZr2WO4(PO4)2を含有することが好ましい。 In the sealing material of the present invention, the refractory filler powder preferably contains Zr 2 WO 4 (PO 4 ) 2 .
本発明の封着材料は、耐火性フィラー粉末が略球状であることが好ましい。 In the sealing material of the present invention, the fire-resistant filler powder is preferably approximately spherical.
本発明の封着材料は、水晶振動子のパッケージに使用されることが好ましい。 The sealing material of the present invention is preferably used to package quartz crystal oscillators.
本発明の封着材料ペーストは、上記の封着材料とビークルとを含有することを特徴とする。 The sealing material paste of the present invention is characterized by containing the above-mentioned sealing material and a vehicle.
本発明は、環境に有害な鉛を含有させることなく、低温焼成で封着可能なガラス組成物と、それを用いた封着材料を提供することができる。 The present invention provides a glass composition that can be sealed by low-temperature firing without containing lead, which is harmful to the environment, and a sealing material that uses the glass composition.
本発明のガラス組成物は、モル%で、MgO+CaO+SrO+BaO+ZnO 1~30%、TeO2 30~80%、MoO3 5~30%を含有する。ガラス組成を上記のように限定した理由を以下に示す。なお、以下の各成分の含有量に関する説明において、特に断りのない限り、「%」は「モル%」を意味する。 The glass composition of the present invention contains, in mole percent, 1-30% MgO+CaO+SrO+BaO+ZnO, 30-80% TeO 2 , and 5-30% MoO 3 . The reasons for limiting the glass composition as above are as follows. In the following description of the content of each component, "%" means "mol percent" unless otherwise specified.
MgO、CaO、SrO、BaO及びZnOは、ガラス化範囲を広げ、ガラスの耐候性を改善する成分である。MgO+CaO+SrO+BaO+ZnOは、1~30%、好ましくは3~25%、より好ましくは5~20%、更に好ましくは8~18%、特に好ましくは10~15%である。MgO+CaO+SrO+BaO+ZnOが少な過ぎると、ガラス化が困難になる。またガラスの耐候性が悪化すると共に、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。一方、MgO+CaO+SrO+BaO+ZnOが多過ぎても、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。 MgO, CaO, SrO, BaO and ZnO are components that expand the vitrification range and improve the weather resistance of glass. MgO + CaO + SrO + BaO + ZnO is 1 to 30%, preferably 3 to 25%, more preferably 5 to 20%, even more preferably 8 to 18%, and particularly preferably 10 to 15%. If there is too little MgO + CaO + SrO + BaO + ZnO, vitrification becomes difficult. In addition, the weather resistance of the glass deteriorates, and the glass becomes thermally unstable, making it more likely to devitrify when melted or fired. On the other hand, if there is too much MgO + CaO + SrO + BaO + ZnO, the glass becomes thermally unstable and more likely to devitrify when melted or fired.
なお、MgO、CaO、SrO、BaO及びZnOの含有量の好ましい範囲は以下の通りである。 The preferred ranges for the contents of MgO, CaO, SrO, BaO and ZnO are as follows:
MgOは、ガラス化範囲を広げ、ガラスの軟化点の過度な上昇を抑えつつ、ガラスの耐候性を改善する成分である。MgOの含有量は、1~30%、好ましくは3~25%、より好ましくは5~20%、更に好ましくは8~18%、特に好ましくは10~15%である。MgOの含有量が少なすぎると、ガラス化が困難になり、ガラスの耐候性が悪化すると共に、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。一方、MgOの含有量が多すぎても、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。 MgO is a component that expands the vitrification range and improves the weather resistance of glass while suppressing an excessive increase in the softening point of glass. The MgO content is 1 to 30%, preferably 3 to 25%, more preferably 5 to 20%, even more preferably 8 to 18%, and particularly preferably 10 to 15%. If the MgO content is too low, vitrification becomes difficult, the weather resistance of the glass deteriorates, and the glass becomes thermally unstable, making it prone to devitrification when melted or fired. On the other hand, if the MgO content is too high, the glass becomes thermally unstable and prone to devitrification when melted or fired.
CaOは、ガラス化範囲を広げ、ガラスの軟化点の過度な上昇を抑えつつ、ガラスの耐候性を改善する成分である。CaOの含有量は、1~30%、好ましくは3~25%、より好ましくは5~20%、更に好ましくは8~18%、特に好ましくは10~15%である。CaOの含有量が少なすぎると、ガラス化が困難になり、ガラスの耐候性が悪化すると共に、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。一方、CaOの含有量が多すぎても、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。 CaO is a component that expands the vitrification range and improves the weather resistance of glass while suppressing an excessive increase in the softening point of glass. The CaO content is 1 to 30%, preferably 3 to 25%, more preferably 5 to 20%, even more preferably 8 to 18%, and particularly preferably 10 to 15%. If the CaO content is too low, vitrification becomes difficult, the weather resistance of the glass deteriorates, and the glass becomes thermally unstable, making it prone to devitrification when melted or fired. On the other hand, if the CaO content is too high, the glass becomes thermally unstable and prone to devitrification when melted or fired.
SrOは、ガラス化範囲を広げ、ガラスの軟化点の過度な上昇を抑えつつ、ガラスの耐候性を改善する成分である。SrOの含有量は、1~30%、好ましくは3~25%、より好ましくは5~20%、更に好ましくは8~18%、特に好ましくは10~15%である。SrOの含有量が少なすぎると、ガラス化が困難になり、ガラスの耐候性が悪化すると共に、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。一方、SrOの含有量が多すぎても、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。 SrO is a component that expands the vitrification range and improves the weather resistance of glass while suppressing an excessive increase in the softening point of glass. The SrO content is 1 to 30%, preferably 3 to 25%, more preferably 5 to 20%, even more preferably 8 to 18%, and particularly preferably 10 to 15%. If the SrO content is too low, vitrification becomes difficult, the weather resistance of the glass deteriorates, and the glass becomes thermally unstable, making it prone to devitrification when melted or fired. On the other hand, if the SrO content is too high, the glass becomes thermally unstable and prone to devitrification when melted or fired.
BaOは、MgO、CaO、SrO及びZnOに比べ、ガラス化範囲を顕著に広げ、ガラスの軟化点を顕著に下げ、また、ガラスの耐候性を顕著に向上させる成分である。BaOの含有量は、1~30%、好ましくは3~25%、より好ましくは5~20%、更に好ましくは8~18%、特に好ましくは10~15%である。BaOの含有量が少なすぎると、ガラス化が困難になり、軟化点が下がらないことにより低温封着が困難になると共に、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。また、ガラスの耐候性の維持が困難になる。一方、BaOの含有量が多すぎても、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。 BaO is a component that significantly expands the vitrification range, significantly lowers the softening point of glass, and significantly improves the weather resistance of glass, compared to MgO, CaO, SrO, and ZnO. The BaO content is 1 to 30%, preferably 3 to 25%, more preferably 5 to 20%, even more preferably 8 to 18%, and particularly preferably 10 to 15%. If the BaO content is too low, vitrification becomes difficult, the softening point does not decrease, making low-temperature sealing difficult, and the glass becomes thermally unstable, making it prone to devitrification when melted or fired. It also becomes difficult to maintain the weather resistance of the glass. On the other hand, if the BaO content is too high, the glass becomes thermally unstable, making it prone to devitrification when melted or fired.
ZnOは、ガラス化範囲を広げ、ガラスの軟化点の過度な上昇を抑えつつ、ガラスの耐候性を改善する成分である。ZnOの含有量は、1~30%、好ましくは3~25%、より好ましくは5~20%、更に好ましくは8~18%、特に好ましくは10~15%である。ZnOの含有量が少なすぎると、ガラス化が困難になり、ガラスの耐候性が悪化すると共に、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。一方、ZnOの含有量が多すぎても、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。 ZnO is a component that expands the vitrification range and improves the weather resistance of glass while suppressing an excessive increase in the softening point of glass. The ZnO content is 1 to 30%, preferably 3 to 25%, more preferably 5 to 20%, even more preferably 8 to 18%, and particularly preferably 10 to 15%. If the ZnO content is too low, vitrification becomes difficult, the weather resistance of the glass deteriorates, and the glass becomes thermally unstable, making it prone to devitrification when melted or fired. On the other hand, if the ZnO content is too high, the glass becomes thermally unstable and prone to devitrification when melted or fired.
TeO2は、ガラスネットワークを形成すると共に、耐候性を向上させる成分である。TeO2の含有量は30~80%であり、好ましくは35~75%、より好ましくは40~70%、更に好ましくは45~65%、特に好ましくは50~60%である。TeO2の含有量が少な過ぎると、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなると共に、耐候性が低下し易くなる。一方、TeO2の含有量が多過ぎると、ガラスの粘性(軟化点等)が高くなり、低温封着が困難になると共に、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。また、ガラスの熱膨張係数が高くなり過ぎる傾向にある。 TeO2 is a component that forms a glass network and improves weather resistance. The content of TeO2 is 30 to 80%, preferably 35 to 75%, more preferably 40 to 70%, even more preferably 45 to 65%, and particularly preferably 50 to 60%. If the content of TeO2 is too small, the glass becomes thermally unstable, the glass becomes easily devitrified when melted or fired, and the weather resistance is easily reduced. On the other hand, if the content of TeO2 is too large, the viscosity (softening point, etc.) of the glass becomes high, low-temperature sealing becomes difficult, the glass becomes thermally unstable, and the glass becomes easily devitrified when melted or fired. In addition, the thermal expansion coefficient of the glass tends to become too high.
MoO3は、ガラスネットワークを形成すると共に、耐候性を向上させる成分である。MoO3の含有量は5~30%であり、好ましくは7~27%、より好ましくは10~25%、更に好ましくは12~22%、特に好ましくは15~20%である。MoO3の含有量が少な過ぎると、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなると共に、ガラスの粘性(軟化点等)が高くなり、低温封着が困難になる。一方、MoO3の含有量が多過ぎると、ガラス化しにくくなる。またガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなると共に、ガラスの熱膨張係数が高くなり過ぎる傾向にある。 MoO 3 is a component that forms a glass network and improves weather resistance. The content of MoO 3 is 5 to 30%, preferably 7 to 27%, more preferably 10 to 25%, even more preferably 12 to 22%, and particularly preferably 15 to 20%. If the content of MoO 3 is too small, the glass becomes thermally unstable, the glass becomes easily devitrified when melted or fired, and the viscosity (softening point, etc.) of the glass becomes high, making low-temperature sealing difficult. On the other hand, if the content of MoO 3 is too high, vitrification becomes difficult. In addition, the glass becomes thermally unstable, the glass becomes easily devitrified when melted or fired, and the thermal expansion coefficient of the glass tends to become too high.
本発明のガラス組成物は、上記成分以外にも、ガラス組成中に下記の成分を含有してもよい。 In addition to the above components, the glass composition of the present invention may contain the following components in the glass composition.
Li2O、Na2O及びK2Oは、ガラスの粘性(軟化点等)を低下させる成分である。Li2O+Na2O+K2Oは、好ましくは1~30%、より好ましくは2~25%、更に好ましくは5~20%、特に好ましくは8~15%である。Li2O+Na2O+K2Oが少な過ぎると、ガラスの粘性(軟化点等)が高くなり、低温封着が困難になると共に、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。一方、Li2O+Na2O+K2Oが多過ぎると、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。 Li 2 O, Na 2 O and K 2 O are components that reduce the viscosity (softening point, etc.) of glass. Li 2 O + Na 2 O + K 2 O is preferably 1 to 30%, more preferably 2 to 25%, even more preferably 5 to 20%, and particularly preferably 8 to 15%. If Li 2 O + Na 2 O + K 2 O is too little, the viscosity (softening point, etc.) of the glass increases, making low-temperature sealing difficult, and the glass becomes thermally unstable, making the glass more likely to devitrify during melting or firing. On the other hand, if Li 2 O + Na 2 O + K 2 O is too much, the glass becomes thermally unstable, making the glass more likely to devitrify during melting or firing.
Li2Oは、Na2O及びK2Oに比べ、ガラスの粘性(軟化点等)を顕著に低下させる成分である。Li2Oの含有量は、好ましくは1~30%、より好ましくは2~25%、更に好ましくは3~20%、特に好ましくは5~18%である。Li2Oの含有量が少な過ぎると、ガラスの粘性(軟化点等)が高くなり、低温封着が困難になる。一方、Li2Oの含有量が多過ぎると、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。 Li 2 O is a component that significantly reduces the viscosity (softening point, etc.) of glass compared with Na 2 O and K 2 O. The content of Li 2 O is preferably 1 to 30%, more preferably 2 to 25%, further preferably 3 to 20%, and particularly preferably 5 to 18%. If the content of Li 2 O is too low, the viscosity (softening point, etc.) of the glass becomes high, making low-temperature sealing difficult. On the other hand, if the content of Li 2 O is too high, the glass becomes thermally unstable and is prone to devitrification during melting or firing.
Na2Oは、K2Oに比べ、ガラスの粘性(軟化点等)を低下させる成分である。Na2Oの含有量は、好ましくは1~20%、より好ましくは2~15%、更に好ましくは3~12%、特に好ましくは5~10%である。Na2Oの含有量が少な過ぎると、ガラスの粘性(軟化点等)が高くなり、低温封着が困難になる。一方、Na2Oの含有量が多過ぎると、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。 Na 2 O is a component that lowers the viscosity (softening point, etc.) of glass compared with K 2 O. The content of Na 2 O is preferably 1 to 20%, more preferably 2 to 15%, further preferably 3 to 12%, and particularly preferably 5 to 10%. If the content of Na 2 O is too low, the viscosity (softening point, etc.) of the glass increases, making low-temperature sealing difficult. On the other hand, if the content of Na 2 O is too high, the glass becomes thermally unstable and is prone to devitrification during melting or firing.
K2Oは、ガラスの粘性(軟化点等)を低下させる成分である。K2Oの含有量は、好ましくは1~30%、より好ましくは2~25%、更に好ましくは3~20%、特に好ましくは5~18%である。K2Oの含有量が少な過ぎると、ガラスの粘性(軟化点等)が高くなり、低温封着が困難になる。一方、K2Oの含有量が多過ぎると、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。 K 2 O is a component that reduces the viscosity (softening point, etc.) of glass. The content of K 2 O is preferably 1 to 30%, more preferably 2 to 25%, further preferably 3 to 20%, and particularly preferably 5 to 18%. If the content of K 2 O is too low, the viscosity (softening point, etc.) of the glass increases, making low-temperature sealing difficult. On the other hand, if the content of K 2 O is too high, the glass becomes thermally unstable and is prone to devitrification during melting or firing.
更に、アルカリ混合効果によりガラスの軟化点を低下すべく、Li2O/K2Oのモル比は、好ましくは0.3~5、より好ましくは0.4~4、0.5~3、更に好ましくは0.6~2、特に好ましくは0.7~1.5である。Li2O/K2Oが小さ過ぎると、ガラスの粘性(軟化点等)が高くなり、低温封着が困難になると共に、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。一方、Li2O/K2Oが大き過ぎると、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。 Furthermore, in order to lower the softening point of the glass by the alkali mixing effect, the molar ratio of Li 2 O/K 2 O is preferably 0.3 to 5, more preferably 0.4 to 4, 0.5 to 3, even more preferably 0.6 to 2, and particularly preferably 0.7 to 1.5. If Li 2 O/K 2 O is too small, the viscosity (softening point, etc.) of the glass increases, making low-temperature sealing difficult and the glass becomes thermally unstable, making it easy for the glass to devitrify during melting or firing. On the other hand, if Li 2 O/K 2 O is too large, the glass becomes thermally unstable, making it easy for the glass to devitrify during melting or firing.
TiO2及びAl2O3は、耐候性を向上させる成分である。TiO2+Al2O3は、好ましくは0~10%、より好ましくは0.1~8%、更に好ましくは1~6%、特に好ましくは2~5%である。TiO2+Al2O3が多過ぎると、ガラスの粘性(軟化点等)が高くなり、低温封着が困難になると共に、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。 TiO2 and Al2O3 are components that improve weather resistance. TiO2 + Al2O3 is preferably 0 to 10%, more preferably 0.1 to 8%, further preferably 1 to 6%, and particularly preferably 2 to 5%. If TiO2 + Al2O3 is too much, the viscosity (softening point , etc. ) of the glass increases, making low-temperature sealing difficult and making the glass thermally unstable, which makes the glass more susceptible to devitrification during melting or firing.
なお、TiO2及びAl2O3の含有量の好ましい範囲は以下の通りである。 The preferred ranges of the contents of TiO2 and Al2O3 are as follows.
TiO2の含有量は、好ましくは0~8%、より好ましくは0.1~6%、更に好ましくは1~5%、特に好ましくは2~4%である。Al2O3の含有量は、好ましくは0~8%、より好ましくは0.1~5%、更に好ましくは0.5~3%、特に好ましくは1~2%である。 The content of TiO2 is preferably 0-8%, more preferably 0.1-6%, even more preferably 1-5%, and particularly preferably 2-4%. The content of Al2O3 is preferably 0-8%, more preferably 0.1-5%, even more preferably 0.5-3%, and particularly preferably 1-2%.
CuOは、ガラスの粘性(軟化点等)を低下させると共に、ガラスの熱膨張係数を低下させる成分である。また、金属を封着する場合、ガラスと金属の接着強度を向上させる成分である。このメカニズムの詳細は現時点では不明であるが、Cu原子は拡散性が高いため、金属の表層から内部に向かってCu原子が拡散することで、ガラスと金属が一体化し易くなるためだと考える。なお、封着対象物である金属の種類に特に制限はないが、例として、鉄、鉄合金、ニッケル、ニッケル合金、銅、銅合金、アルミニウム、アルミニウム合金等が挙げられる。CuOの含有量は、0~30%、0~10%、0.1~5%、0.5~3%、特に1~2%であることが好ましい。また金属を封着する場合のCuOの含有量は、好ましくは1~30%、より好ましくは1~20%、更に好ましくは3~15%、特に好ましくは5~10%である。CuOの含有量が多過ぎると、ガラスが熱的に不安定になり、封着工程において、ガラス表面から金属Cuが析出し、封着性や電気特性に悪影響を与える虞がある。また、溶融時又は焼成時にガラスが失透し易くなる。 CuO is a component that reduces the viscosity (softening point, etc.) of glass and also reduces the thermal expansion coefficient of glass. It is also a component that improves the adhesive strength between glass and metal when sealing metal. The details of this mechanism are unclear at this time, but it is believed that because Cu atoms have high diffusivity, Cu atoms diffuse from the surface layer of the metal to the inside, making it easier for the glass and metal to be integrated. There is no particular restriction on the type of metal to be sealed, but examples include iron, iron alloys, nickel, nickel alloys, copper, copper alloys, aluminum, and aluminum alloys. The CuO content is preferably 0-30%, 0-10%, 0.1-5%, 0.5-3%, and especially 1-2%. The CuO content when sealing metal is preferably 1-30%, more preferably 1-20%, even more preferably 3-15%, and especially preferably 5-10%. If the CuO content is too high, the glass becomes thermally unstable, and metallic Cu may precipitate from the glass surface during the sealing process, adversely affecting the sealing properties and electrical properties. In addition, the glass is prone to devitrification during melting or firing.
WO3は、ガラスの熱膨張係数を低下させる成分である。WO3の含有量は0~20%、0.1~10%、特に1~5%である。WO3の含有量が多過ぎると、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなると共に、ガラスの粘性(軟化点等)が高くなり、低温封着が困難になる。 WO3 is a component that reduces the thermal expansion coefficient of glass. The content of WO3 is 0 to 20%, 0.1 to 10%, and particularly 1 to 5%. If the content of WO3 is too high, the glass becomes thermally unstable, the glass becomes easily devitrified during melting or firing, and the viscosity (softening point, etc.) of the glass increases, making low-temperature sealing difficult.
P2O5は、ガラスネットワークを形成すると共に、ガラスを熱的に安定化させる成分である。P2O5の含有量は、好ましくは0~10%、より好ましくは0.1~5%、更に好ましくは0.2~2%、特に好ましくは0.5~1%である。P2O5の含有量が多過ぎると、ガラスの粘性(軟化点等)が高くなり、低温封着が困難になると共に耐候性が低下し易くなる。 P 2 O 5 is a component that forms a glass network and thermally stabilizes the glass. The content of P 2 O 5 is preferably 0 to 10%, more preferably 0.1 to 5%, further preferably 0.2 to 2%, and particularly preferably 0.5 to 1%. If the content of P 2 O 5 is too high, the viscosity (softening point, etc.) of the glass increases, making low-temperature sealing difficult and facilitating a decrease in weather resistance.
Ag2Oは、ガラスの粘性(軟化点等)を低下させる成分である。Ag2Oの含有量は、好ましくは0~10%、より好ましくは0.1~5%、更に好ましくは0.2~3%、特に好ましくは0.5~2%である。Ag2Oの含有量が多過ぎると、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。また、焼成雰囲気により、ガラス中から金属Agが析出する虞がある。 Ag 2 O is a component that reduces the viscosity (softening point, etc.) of glass. The content of Ag 2 O is preferably 0 to 10%, more preferably 0.1 to 5%, further preferably 0.2 to 3%, and particularly preferably 0.5 to 2%. If the content of Ag 2 O is too high, the glass becomes thermally unstable and is prone to devitrification during melting or firing. In addition, there is a risk that metallic Ag will precipitate from the glass depending on the firing atmosphere.
AgIは、ガラスの粘性(軟化点等)を低下させる成分である。AgIの含有量は、好ましくは0~10%、より好ましくは0.1~5%、更に好ましくは0.2~2%、特に好ましくは0.5~1%である。AgIの含有量が多過ぎると、ガラスの熱膨張係数が高くなり過ぎる傾向にある。 AgI is a component that reduces the viscosity (softening point, etc.) of glass. The AgI content is preferably 0-10%, more preferably 0.1-5%, even more preferably 0.2-2%, and particularly preferably 0.5-1%. If the AgI content is too high, the thermal expansion coefficient of the glass tends to be too high.
Nb2O5は、ガラスを熱的に安定化させると共に、耐候性を向上させる成分である。Nb2O5の含有量は、好ましくは0~10%、より好ましくは0.1~5%、更に好ましくは0.2~2%、特に好ましくは0.5~1%である。Nb2O5の含有量が多過ぎると、ガラスの粘性(軟化点等)が高くなり、低温封着が困難になり易い。 Nb 2 O 5 is a component that thermally stabilizes glass and improves weather resistance. The content of Nb 2 O 5 is preferably 0 to 10%, more preferably 0.1 to 5%, further preferably 0.2 to 2%, and particularly preferably 0.5 to 1%. If the content of Nb 2 O 5 is too high, the viscosity (softening point, etc.) of the glass increases, making low-temperature sealing difficult.
V2O5は、ガラスネットワークを形成すると共に、ガラスの粘性(軟化点等)を低下させる成分である。V2O5の含有量は、好ましくは0~10%、より好ましくは0.1~5%、更に好ましくは0.2~3%、更に好ましくは1~2%である。V2O5の含有量が多過ぎると、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなると共に、耐候性が低下し易くなる。 V 2 O 5 is a component that forms a glass network and reduces the viscosity (softening point, etc.) of the glass. The content of V 2 O 5 is preferably 0 to 10%, more preferably 0.1 to 5%, even more preferably 0.2 to 3%, and still more preferably 1 to 2%. If the content of V 2 O 5 is too high, the glass becomes thermally unstable, and the glass is likely to devitrify during melting or firing, and the weather resistance is likely to decrease.
Ga2O3は、ガラスを熱的に安定化させると共に、耐候性を向上させる成分であるが、非常に高価であることから、その含有量は0.01%未満、特に含有しないことが好ましい。 Ga 2 O 3 is a component that thermally stabilizes the glass and improves the weather resistance. However, since it is very expensive, it is preferable that the content be less than 0.01%, and in particular that no Ga 2 O 3 is contained.
SiO2、GeO2、Fe2O3、NiO、CeO2、B2O3、Sb2O3、ZrO2はガラスを熱的に安定化させて、失透を抑制する成分であり、各々2%未満まで添加可能である。これらの含有量が多すぎると、ガラスが熱的に不安定になり、溶融時又は焼成時にガラスが失透し易くなる。 SiO2 , GeO2 , Fe2O3 , NiO , CeO2 , B2O3 , Sb2O3 , and ZrO2 are components that thermally stabilize the glass and suppress devitrification, and each can be added up to less than 2%. If the content of these is too high, the glass becomes thermally unstable and is prone to devitrification during melting or firing.
本発明のガラス組成物は、環境上の理由から、実質的にPbOを含有しないことが好ましい。ここで、「実質的にPbOを含有しない」とは、ガラス組成中のPbOの含有量が1%以下の場合を指す。 For environmental reasons, it is preferable that the glass composition of the present invention contains substantially no PbO. Here, "substantially no PbO" refers to a glass composition containing 1% or less PbO.
本発明の封着材料は、上記のガラス組成物からなるガラス粉末を含有する。本発明の封着材料は、機械的強度を向上、或いは熱膨張係数を調整するために、耐火性フィラー粉末を含有してもよい。その混合割合は、好ましくはガラス粉末40~100体積%、耐火性フィラー粉末0~60体積%であり、より好ましくはガラス粉末50~99体積%、耐火性フィラー粉末1~50体積%であり、更に好ましくはガラス粉末60~95体積%、耐火性フィラー粉末5~40体積%であり、特に好ましくはガラス粉末70~90体積%、耐火性フィラー粉末10~30体積%である。耐火性フィラー粉末の含有量が多過ぎると、相対的にガラス粉末の割合が少なくなるため、所望の流動性を確保し難くなる。 The sealing material of the present invention contains glass powder made of the above glass composition. The sealing material of the present invention may contain a refractory filler powder in order to improve the mechanical strength or adjust the thermal expansion coefficient. The mixing ratio is preferably 40 to 100 volume % of glass powder and 0 to 60 volume % of refractory filler powder, more preferably 50 to 99 volume % of glass powder and 1 to 50 volume % of refractory filler powder, even more preferably 60 to 95 volume % of glass powder and 5 to 40 volume % of refractory filler powder, and particularly preferably 70 to 90 volume % of glass powder and 10 to 30 volume % of refractory filler powder. If the content of the refractory filler powder is too high, the proportion of the glass powder will be relatively small, making it difficult to ensure the desired fluidity.
耐火性フィラー粉末は、Zr2WO4(PO4)2を含有することが好ましい。Zr2WO4(PO4)2は上記のガラス粉末と反応し難く、効率的に封着材料の熱膨張係数を低下することが可能である。 The refractory filler powder preferably contains Zr 2 WO 4 (PO 4 ) 2. Zr 2 WO 4 (PO 4 ) 2 does not easily react with the above-mentioned glass powder, and can efficiently reduce the thermal expansion coefficient of the sealing material.
また本発明の封着材料は、耐火性フィラー粉末として、Zr2WO4(PO4)2以外の耐火性フィラー粉末を使用することもできる。その他の耐火性フィラー粉末としては、NbZr(PO4)3、Zr2MoO4(PO4)2、Hf2WO4(PO4)2、Hf2MoO4(PO4)2、リン酸ジルコニウム、ジルコン、ジルコニア、酸化錫、チタン酸アルミニウム、石英、β-スポジュメン、ムライト、チタニア、石英ガラス、β-ユークリプタイト、β-石英、ウィレマイト、コーディエライト、Sr0.5Zr2(PO4)3等からなる粉末を、単独で又は2種以上を混合して使用することができる。 In addition, the sealing material of the present invention may use a refractory filler powder other than Zr 2 WO 4 (PO 4 ) 2 as the refractory filler powder. As the other refractory filler powder, powders consisting of NbZr (PO 4 ) 3 , Zr 2 MoO 4 (PO 4 ) 2 , Hf 2 WO 4 (PO 4 ) 2 , Hf 2 MoO 4 (PO 4 ) 2 , zirconium phosphate, zircon, zirconia, tin oxide, aluminum titanate, quartz, β-spodumene, mullite, titania, quartz glass, β-eucryptite, β-quartz, willemite, cordierite, Sr 0.5 Zr 2 (PO 4 ) 3 , etc. may be used alone or in combination of two or more.
耐火性フィラー粉末は、略球状であることが好ましい。このようにすれば、ガラス粉末が軟化する際に、ガラス粉末の流動性が耐火性フィラー粉末によって阻害され難くなり、結果として、封着材料の流動性が向上する。また、平滑なグレーズ層を得やすくなる。さらに、仮にグレーズ層の表面に耐火性フィラー粉末の一部が露出しても、耐火性フィラー粉末が略球状であるため、この部分の応力が分散され、更には封着に際し、被封着物をグレーズ層に当接しても、被封着物に不当な応力がかかり難く、結果として気密性を確保し易くなる。なお、本発明でいう「略球状」とは、真球のみに限定されるものではなく、耐火性フィラー粉末において、耐火性フィラー粉末の重心を通る最も短い径を最も長い径で割った値が0.5以上、好ましくは0.7以上のものを指す。 It is preferable that the refractory filler powder is substantially spherical. In this way, when the glass powder softens, the fluidity of the glass powder is less likely to be hindered by the refractory filler powder, and as a result, the fluidity of the sealing material is improved. In addition, it is easier to obtain a smooth glaze layer. Furthermore, even if a part of the refractory filler powder is exposed on the surface of the glaze layer, since the refractory filler powder is substantially spherical, the stress of this part is dispersed, and even if the sealed object is brought into contact with the glaze layer during sealing, undue stress is unlikely to be applied to the sealed object, and as a result, it is easier to ensure airtightness. In addition, the "substantially spherical" in the present invention is not limited to a perfect sphere, but refers to a refractory filler powder in which the value obtained by dividing the shortest diameter passing through the center of gravity of the refractory filler powder by the longest diameter is 0.5 or more, preferably 0.7 or more.
なお、耐火性フィラー粉末の粒径は、平均粒子径D50が0.2~20μm程度のものを使用することが好ましい。 The particle size of the refractory filler powder is preferably such that the average particle size D50 is about 0.2 to 20 μm.
本発明の封着材料の軟化点は、好ましくは350℃以下、特に好ましくは340℃以下である。軟化点が高過ぎると、ガラスの粘性が高くなるため、所定の流動性を満たすために封着温度が上昇し、封着時の熱により素子を劣化させる虞がある。なお、軟化点の下限は特に限定されないが、現実的には180℃以上である。ここで、「軟化点」とは、平均粒子径D50が0.5~20μmの封着材料を測定試料として、マクロ型示差熱分析装置で測定した値を指す。測定条件としては、室温から測定を開始し、昇温速度は10℃/分とする。なお、マクロ型示差熱分析装置で測定した軟化点は、図1に示す測定曲線における第四屈曲点の温度(Ts)を指す。 The softening point of the sealing material of the present invention is preferably 350°C or less, particularly preferably 340°C or less. If the softening point is too high, the viscosity of the glass increases, so that the sealing temperature rises to meet a predetermined fluidity, and there is a risk of the element being deteriorated by the heat during sealing. The lower limit of the softening point is not particularly limited, but is practically 180°C or more. Here, the "softening point" refers to a value measured by a macro-type differential thermal analyzer using a sealing material having an average particle size D50 of 0.5 to 20 μm as a measurement sample. The measurement conditions are that the measurement is started from room temperature and the heating rate is 10°C/min. The softening point measured by a macro-type differential thermal analyzer refers to the temperature (Ts) of the fourth bending point in the measurement curve shown in FIG. 1.
本発明の封着材料の熱膨張係数(30~150℃)は、好ましくは20×10-7/℃~200×10-7/℃、より好ましくは30×10-7/℃~160×10-7/℃、更に好ましくは40×10-7/℃~140×10-7/℃、特に好ましくは50×10-7/℃~120×10-7/℃である。熱膨張係数が低すぎても高すぎても、被封着材料との熱膨張差により、封着時や封着後に封着部が破損し易くなる。 The thermal expansion coefficient (30 to 150° C.) of the sealing material of the present invention is preferably 20×10 −7 /° C. to 200×10 −7 /° C., more preferably 30×10 −7 /° C. to 160×10 −7 /° C., even more preferably 40×10 −7 /° C. to 140×10 −7 /° C., and particularly preferably 50×10 −7 /° C. to 120×10 −7 /° C. If the thermal expansion coefficient is too low or too high, the difference in thermal expansion with the sealed material makes the sealed portion prone to damage during or after sealing.
上記の特性を有する本発明の封着材料は、特に低温での封着が要求される水晶振動子のパッケージに好適である。 The sealing material of the present invention, which has the above-mentioned characteristics, is particularly suitable for packaging quartz crystal oscillators, which require sealing at low temperatures.
次に本発明のガラス組成物を用いたガラス粉末の製造方法、及び本発明のガラス組成物を封着材料として使用する方法の一例について説明する。 Next, we will explain an example of a method for producing glass powder using the glass composition of the present invention, and a method for using the glass composition of the present invention as a sealing material.
まず、上記組成となるように調合した原料粉末を800~1000℃で1~2時間、均質なガラスが得られるまで溶融する。次いで、溶融ガラスをフィルム状等に成形した後、粉砕し、分級することにより、本発明のガラス組成物からなるガラス粉末を作製する。なお、ガラス粉末の平均粒子径D50は1~20μm程度であることが好ましい。必要に応じて、ガラス粉末に各種耐火性フィラー粉末を添加した封着材料とする。 First, the raw material powder prepared to have the above composition is melted at 800 to 1000°C for 1 to 2 hours until a homogeneous glass is obtained. Next, the molten glass is formed into a film or the like, pulverized, and classified to produce glass powder made of the glass composition of the present invention. The average particle size D50 of the glass powder is preferably about 1 to 20 μm. If necessary, various fire-resistant filler powders are added to the glass powder to produce a sealing material.
次いでガラス粉末(あるいは封着材料)にビークルを添加して混練することによりガラスペースト(あるいは封着材料ペースト)を調製する。ビークルは、主に有機溶剤と樹脂とからなり、樹脂はペーストの粘性を調整する目的で添加される。また、必要に応じて、界面活性剤、増粘剤等を添加することもできる。 Next, a vehicle is added to the glass powder (or sealing material) and kneaded to prepare a glass paste (or sealing material paste). The vehicle mainly consists of an organic solvent and a resin, and the resin is added to adjust the viscosity of the paste. If necessary, surfactants, thickeners, etc. can also be added.
有機溶剤は、沸点が低く(例えば、沸点が300℃以下)、且つ焼成後の残渣が少ないことに加えて、ガラスを変質させないものが好ましく、その含有量は10~40質量%であることが好ましい。有機溶剤としては、プロピレンカーボネート、トルエン、N,N’-ジメチルホルムアミド(DMF)、1,3-ジメチル-2-イミダゾリジノン(DMI)、炭酸ジメチル、ブチルカルビトールアセテート(BCA)、酢酸イソアミル、ジメチルスルホキシド、アセトン、メチルエチルケトン等を使用することが好ましい。また、有機溶剤として、高級アルコールを使用することがさらに好ましい。高級アルコールは、それ自身が粘性を有しているために、ビークルに樹脂を添加しなくても、ペースト化することができる。また、ペンタンジオールとその誘導体、具体的にはジエチルペンタンジオール(C9H20O2)も粘性に優れるため、溶剤に使用することができる。 The organic solvent is preferably one that has a low boiling point (for example, a boiling point of 300° C. or less), leaves little residue after firing, and does not alter the glass, and the content is preferably 10 to 40% by mass. As the organic solvent, it is preferable to use propylene carbonate, toluene, N,N'-dimethylformamide (DMF), 1,3-dimethyl-2-imidazolidinone (DMI), dimethyl carbonate, butyl carbitol acetate (BCA), isoamyl acetate, dimethyl sulfoxide, acetone, methyl ethyl ketone, or the like. It is more preferable to use a higher alcohol as the organic solvent. Since higher alcohols themselves have viscosity, they can be made into a paste without adding a resin to the vehicle. In addition, pentanediol and its derivatives, specifically diethylpentanediol (C 9 H 20 O 2 ), also have excellent viscosity and can be used as a solvent.
樹脂は、分解温度が低く、焼成後の残渣が少ないことに加えて、ガラスを変質させ難いものが好ましく、その含有量は0.1~20質量%であることが好ましい。樹脂として、ニトロセルロース、ポリエチレングリコール誘導体、ポリエチレンカーボネート、アクリル酸エステル(アクリル樹脂)等を使用することが好ましい。 The resin preferably has a low decomposition temperature, leaves little residue after firing, and is not likely to alter the glass, and its content is preferably 0.1 to 20% by mass. The resin preferably used is nitrocellulose, polyethylene glycol derivatives, polyethylene carbonate, acrylic esters (acrylic resins), etc.
次いで、ガラスペースト(封着材料ペースト)を金属、セラミック、または、ガラスからなる被封着物の封着箇所にディスペンサーやスクリーン印刷機等の塗布機を用いて塗布し、乾燥させ、300~350℃でグレーズ処理する。その後、被封着物を接触させて、350~400℃で熱処理することにより、ガラス粉末が軟化流動して両者が封着される。 Next, the glass paste (sealing material paste) is applied to the sealing points of the objects to be sealed, which are made of metal, ceramic, or glass, using an applicator such as a dispenser or screen printer, dried, and glazed at 300 to 350°C. The objects to be sealed are then brought into contact with each other and heat-treated at 350 to 400°C, causing the glass powder to soften and flow, sealing the two objects.
本発明のガラス組成物は、封着用途以外にも被覆、充填等の目的で使用できる。また、ペースト以外の形態、具体的には粉末、グリーンシート、タブレット(粉末の焼結体であるプレスフリット)等の状態で使用することもできる。 The glass composition of the present invention can be used for purposes other than sealing, such as coating and filling. It can also be used in forms other than paste, such as powder, green sheet, tablet (press frit, which is a sintered body of powder), etc.
実施例に基づいて、本発明を詳細に説明する。表1及び2は、本発明の実施例(試料No.1~17)及び比較例(試料No.18~21)を示している。 The present invention will be described in detail based on examples. Tables 1 and 2 show examples of the present invention (samples No. 1 to 17) and comparative examples (samples No. 18 to 21).
まず、表中に示したガラス組成となるように各種酸化物、炭酸塩等のガラス原料を調合し、ガラスバッチを準備した後、このガラスバッチを白金坩堝に入れ、大気中にて800~1000℃で1~2時間溶融した。その後、溶融ガラスを水冷ローラーでフィルム状に成形し、フィルム状のガラスをボールミルで粉砕した後、目開き75μmの篩を通過させて、平均粒子径D50が約10μmのガラス粉末を得た。 First, glass raw materials such as various oxides and carbonates were mixed to obtain the glass compositions shown in the table to prepare glass batches, which were then placed in platinum crucibles and melted in air at 800 to 1000° C. for 1 to 2 hours. The molten glass was then formed into a film using water-cooled rollers, and the film-like glass was pulverized using a ball mill and passed through a sieve with 75 μm openings to obtain glass powder with an average particle size D 50 of about 10 μm.
その後、表中に示した通りに、得られたガラス粉末と耐火性フィラー粉末を混合し、混合粉末を得た。 Then, the obtained glass powder and the refractory filler powder were mixed as shown in the table to obtain a mixed powder.
耐火性フィラー粉末には、略球状のZr2WO4(PO4)2(表中ではZWPと表記)、NbZr(PO4)3(表中ではNZPと表記)を用いた。なお、耐火性フィラー粉末の平均粒子径D50は約10μmであった。 The refractory filler powder used was roughly spherical Zr2WO4 ( PO4 ) 2 (referred to as ZWP in the table) and NbZr( PO4 ) 3 (referred to as NZP in the table). The average particle size D50 of the refractory filler powder was about 10 μm.
No.1~21の試料について、ガラス転移点、熱膨張係数、軟化点、流動性、失透の有無、耐候性、金属との接着性を評価した。 Samples No. 1 to 21 were evaluated for glass transition point, thermal expansion coefficient, softening point, fluidity, presence or absence of devitrification, weather resistance, and adhesion to metals.
ガラス転移点及び熱膨張係数(30~150℃)は、次のようにして評価した。混合粉末試料を、棒状の金型に入れプレス成型した後に、離型剤を塗ったアルミナ基板上で380℃にて10分間焼成した。その後、焼成体を所定の形状に加工し、TMA装置により測定した。 The glass transition point and thermal expansion coefficient (30-150°C) were evaluated as follows. The mixed powder sample was placed in a rod-shaped mold and press-molded, then sintered at 380°C for 10 minutes on an alumina substrate coated with a release agent. The sintered body was then processed into a specified shape and measured using a TMA device.
軟化点は、マクロ型示差熱分析装置により測定し、第四変局点を以て軟化点とした。なお、測定雰囲気は大気中、昇温速度は10℃/分とし、室温から測定を開始した。 The softening point was measured using a macro differential thermal analyzer, and the fourth inflection point was taken as the softening point. The measurement was performed in air, the heating rate was 10°C/min, and the measurement was started from room temperature.
流動性は次のようにして評価した。混合粉末試料の合成密度分の重量を、直径20mmの金型に入れプレス成型した後に、ガラス基板上で380℃にて10分間焼成した。焼成体の流動径が19mm以上であるものを「○」、19mm未満のものを「×」とした。 The flowability was evaluated as follows. The weight of the mixed powder sample corresponding to the composite density was placed in a mold with a diameter of 20 mm, press molded, and then fired on a glass substrate at 380°C for 10 minutes. Fired bodies with a flow diameter of 19 mm or more were marked as "○", and those with a flow diameter of less than 19 mm were marked as "×".
失透の有無は次のようにして評価した。目視で、上記で作製した焼成体表面を観察し、ガラス光沢がないものを失透「あり」、それ以外を失透「なし」とした。 The presence or absence of devitrification was evaluated as follows: The surface of the fired body prepared above was visually observed, and those that did not have a glassy luster were rated as "present" devitrification, and all other cases were rated as "absent" devitrification.
耐候性は、PCT(Pressure Cooker Test)による加速劣化試験で評価した。具体的には、上記で作製した焼成体を、121℃、2気圧、相対湿度100%の環境下で24時間保持した後、目視観察で、焼成体表面から析出物がないものを「〇」、それ以外を「×」とした。 Weather resistance was evaluated by an accelerated deterioration test using the PCT (Pressure Cooker Test). Specifically, the fired bodies prepared above were kept in an environment of 121°C, 2 atm, and 100% relative humidity for 24 hours, and then visually observed to determine whether there was any precipitate on the surface of the fired bodies, and whether there was an "O" or "X" rating.
金属との接着性は次のようにして評価した。ガラス粉末試料の密度分の重量を、直径20mmの金型に入れプレス成型した後に、ステンレスSUS304基板上で380℃にて10分間、窒素雰囲気中で焼成を行った。焼成後、SUS304の焼成体が封着されている面とは反対側の面を、地平線に垂直な壁に密着するように貼り付け、その後、24時間経過しても、焼成体が自重により、SUS304基板から剥離しないものを「○」、剥離し落下したものを「×」とした。 The adhesion to metal was evaluated as follows. A weight equivalent to the density of the glass powder sample was placed in a mold with a diameter of 20 mm, press molded, and then fired on a stainless steel SUS304 substrate at 380°C for 10 minutes in a nitrogen atmosphere. After firing, the surface opposite to the surface to which the fired SUS304 body was sealed was attached so that it was in close contact with a wall perpendicular to the horizon. If the fired body did not peel off from the SUS304 substrate due to its own weight even after 24 hours, it was marked as "○", and if it peeled off and fell off, it was marked as "×".
表から明らかなように、本発明の実施例であるNo.1~17の試料は、軟化点が低いため流動性に優れていた。また、耐候性に優れていた。一方、比較例であるNo.18の試料は、MgO+CaO+SrO+BaO+ZnOが所定量を超過していたため、焼成の際にガラスが失透し、流動性が不良だった。比較例であるNo.19の試料は、MoO3の含有量が所定量を超過していたため、ガラス化しなかった。比較例であるNo.20、21の試料は、MgO、CaO、SrO、BaO、ZnOを含有していなかったため、耐候性が不良だった。 As is clear from the table, the samples No. 1 to No. 17, which are examples of the present invention, had excellent fluidity due to their low softening points. They also had excellent weather resistance. On the other hand, the sample No. 18, which is a comparative example, had a content of MgO+CaO+SrO+BaO+ZnO that exceeded the specified amount, so the glass was devitrified during firing and had poor fluidity. The sample No. 19, which is a comparative example, did not vitrify because the content of MoO3 exceeded the specified amount. The samples No. 20 and No. 21, which are comparative examples, did not contain MgO, CaO, SrO, BaO, or ZnO, so their weather resistance was poor.
本発明のガラス組成物は、半導体集積回路、水晶振動子、平面表示装置、LED用ガラス端子や窒化アルミニウム基板の封着に好適である。また金属の封着材料としても使用可能である。 The glass composition of the present invention is suitable for sealing semiconductor integrated circuits, quartz crystal oscillators, flat panel displays, glass terminals for LEDs, and aluminum nitride substrates. It can also be used as a sealing material for metals.
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| WO2012020694A1 (en) | 2010-08-11 | 2012-02-16 | 株式会社日立製作所 | Glass composition for electrode, paste for electrode using said glass composition, and electronic component using said paste |
| JP2019142725A (en) | 2018-02-16 | 2019-08-29 | 日本電気硝子株式会社 | Glass composition and sealing material |
| JP2019202921A (en) | 2018-05-25 | 2019-11-28 | 日本電気硝子株式会社 | Glass composition and sealing material |
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| WO2012020694A1 (en) | 2010-08-11 | 2012-02-16 | 株式会社日立製作所 | Glass composition for electrode, paste for electrode using said glass composition, and electronic component using said paste |
| JP2019142725A (en) | 2018-02-16 | 2019-08-29 | 日本電気硝子株式会社 | Glass composition and sealing material |
| JP2019202921A (en) | 2018-05-25 | 2019-11-28 | 日本電気硝子株式会社 | Glass composition and sealing material |
| JP2020011851A (en) | 2018-07-13 | 2020-01-23 | 日本電気硝子株式会社 | Sealing material |
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