JP7523737B2 - Light emitting device, manufacturing method thereof and transporting method thereof - Google Patents

Description

Embodiments of the present invention relate to a light-emitting device, a method for manufacturing a light-emitting device, and a method for transporting a light-emitting device.

There is a light-emitting device in which a light-emitting element is covered with a resin member. Patent Document 1 discloses the resin member that constitutes the outer surface of the light-emitting device.

JP 2001-223229 A

In the manufacturing process of such light-emitting devices, after the light-emitting device is completed with the light-emitting elements covered with resin, the light-emitting device may be transported by sliding it on a rail or stage and stored in a specified package. Furthermore, when incorporating such light-emitting devices into a light source device or the like, the light-emitting device may be removed from the package and transported by sliding it on a rail or stage. However, if the surface of the resin member located on the outer surface of the light-emitting device is too flat, there is a concern that the light-emitting device may stick to the rail or stage during the transport process due to the tackiness (tack) of the resin surface.

The embodiment of the present disclosure aims to provide a light-emitting device that can reduce the adhesion of the resin member, a method for manufacturing a light-emitting device, and a method for transporting a light-emitting device.

The light-emitting device according to the embodiment of the present disclosure is characterized by comprising a light-emitting element and a resin member that covers the light-emitting element and has a wrinkled uneven structure formed on its surface upon contact with a curing inhibitor.

The method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes the steps of: fixing a light-emitting element to an adhesive layer containing a curing inhibitor; forming a resin member that contacts the adhesive layer and covers the light-emitting element, forming a sealing body that includes the light-emitting element and the resin member; and removing the adhesive layer from the sealing body, and is characterized in that a wrinkled uneven structure is formed on the surface of the resin member that was in contact with the adhesive layer.

The method for transporting a light-emitting device according to an embodiment of the present disclosure is characterized in that the light-emitting device includes a light-emitting element and a resin member that has a wrinkled uneven structure formed on the surface by contact with a curing inhibitor and covers the light-emitting element, and the light-emitting device is transported while the surface on which the wrinkled uneven structure is formed is in contact with a transport support.

Embodiments of the present disclosure can provide a light-emitting device that can reduce the adhesion of the resin member, a method for manufacturing a light-emitting device, and a method for transporting a light-emitting device.

FIG. 2 is a schematic top view of the light emitting device according to the embodiment. FIG. 2 is a schematic bottom view of the light emitting device according to the embodiment. FIG. 2 is a schematic cross-sectional view taken along line III-III shown in FIG. 1 is a photograph showing a wrinkled uneven structure. 1 is a photograph showing a wrinkled uneven structure. 1 is a photograph of a surface of a resin member 2 of a comparative example. This is a three-dimensional composite image of wrinkled uneven structures. 13 is a three-dimensional composite image of the surface of a resin member of a comparative example. FIG. 11 is a schematic cross-sectional view of a modified example of the light emitting device according to the embodiment. FIG. 11 is a schematic cross-sectional view of a modified example of the light emitting device according to the embodiment. 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing a method for transporting the light emitting device according to the embodiment.

The light emitting device and its manufacturing method and transport method will be described below with reference to the drawings. The drawings referred to in the following description show the embodiments of the present disclosure in a schematic manner, so that the size and positional relationship of the components shown in the drawings may be exaggerated, and the shapes may be simplified. In the following description, the same names and symbols generally indicate the same or similar components and processes, and detailed descriptions will be omitted as appropriate.
In addition, terms indicating a specific direction or position (e.g., "upper", "lower", and other terms including these terms) may be used. However, these terms are merely used for the purpose of making the relative direction or position in the referenced drawings easier to understand. As long as the relationship of the relative direction or position by terms such as "upper", "lower" in the referenced drawings is the same, the arrangement in drawings other than this disclosure, in actual products, etc. may not be the same as in the referenced drawings. In addition, in this application, an end view showing only a cut surface may be used as a cross-sectional view.

The light emitting device 100 of this embodiment will be described with reference to Figs. 1 to 6B. The light emitting device 100 includes a light emitting element 4, a translucent member 1 provided on the main light emitting surface A of the light emitting element 4, and a resin member 2 that covers the side surface of the light emitting element 4 and the side surface of the translucent member 1. The resin member 2 forms part of the outer surface of the light emitting device 100.

Figures 4A and 4B are photographs showing an example of the surface of the resin member 2 observed by a metal microscope. The resin member 2 has a wrinkled uneven structure 2a on its surface as shown in Figures 4A and 4B. This wrinkled uneven structure 2a can reduce the contact area between the resin member 2 and other members when the resin member 2 comes into contact with the other members. This can reduce the sticking of the light emitting device 100 to the transport rails, etc. In addition, the wrinkled uneven structure 2a on the surface of the resin member 2 can reduce the sticking of the light emitting devices 100 to each other. This can reduce transport failures of the light emitting device. In addition, the reduction in the contact area between the light emitting device 100 and the transport rails, etc. can suppress the charging of the light emitting device 100 due to static electricity.

The wrinkled uneven structure 2a can be formed on the surface of the resin member 2 that comes into contact with the curing inhibitor by curing the resin member 2 in a state where the resin member 2 is in contact with the curing inhibitor that inhibits the curing of the resin member 2. The curing inhibitor that inhibits the curing of the resin member 2 may be attached to the surface of the formed wrinkled uneven structure 2a. In this way, it becomes easier to inhibit the curing of the resin member 2 and to form the wrinkled uneven structure 2a. The curing inhibitor will be described in detail later.

Figure 5 is a photograph of the surface of a comparative resin member 2 that was cured without substantial contact with a curing inhibitor, observed with a metallurgical microscope. In the comparative example of Figure 5, the surface of the resin member 2 is substantially flat, and no wrinkled uneven structure 2a as shown in Figures 4A and 4B is observed.

FIG. 6A is a three-dimensional composite image of the wrinkled uneven structure 2a illustrated in FIG. 4B, and FIG. 6B is a three-dimensional composite image of the surface of the resin member 2 in the comparative example illustrated in FIG.
Here, the three-dimensional composite image was obtained by sequentially autofocusing the heights of the unevenness of the subject surface from the upper limit to the lower limit using a digital microscope, and synthesizing the parts in focus at each height. In addition, in Figures 6A and 6B, the coordinate values on any of the coordinate axes X, Y, and Z are appropriately inserted in micrometer (μm) units along with the coordinate axis names (X, Y, Z).
6A, it can be seen that the wrinkled uneven structure 2a has a structure in which convex portions 2a1 and concave portions 2a2 each extending in the Y direction are alternately arranged. The interval between adjacent convex portions 2a1 in the X direction is approximately several tens of micrometers. The height from the bottom of the concave portion 2a2 to the top of the convex portion 2a1 is approximately several micrometers.

On the other hand, in FIG. 6B, no wrinkled uneven structure 2a is observed, and it can be seen that the surface of the resin member 2 is almost flat. When the surface is almost flat, the contact area becomes large when the resin member comes into contact with another member, so the resin member is more likely to stick to the other member or become charged with static electricity.

In response to this, by providing a wrinkled uneven structure 2a as shown in FIG. 6A, the contact area with other components can be reduced, preventing the device from sticking to the conveyor rail or other light-emitting devices, and preventing static electricity buildup.

The wrinkled uneven structure 2a in this embodiment is not limited to those exemplified in Figures 4A, 4B, and 6A. In other words, the shape and size (width, height, etc.) of the wrinkled uneven structure 2a can be selected in various ways within a range that provides effects such as reducing adhesion and suppressing static electricity, and such selections are also included in this embodiment.

As shown in FIG. 3, the light-emitting element 4 has a main light-emitting surface A and an electrode arrangement surface B on which a first electrode 3A and a second electrode 3B are arranged on the opposite side of the main light-emitting surface A. In this specification, the main light-emitting surface A is sometimes referred to as the upper surface of the light-emitting element, the electrode arrangement surface B is sometimes referred to as the lower surface of the light-emitting element, and the surface of the light-emitting element located between the main light-emitting surface A and the electrode arrangement surface B is sometimes referred to as the side surface of the light-emitting element 4. There may be a space between the first electrode 3A and the second electrode 3B so that a resin member 2 can be formed, or it may be filled with an insulating member.

Figure 7 is a schematic cross-sectional view illustrating a light emitting device 200 including multiple light emitting elements 4. The multiple light emitting elements 4 are covered with a resin member 2. The multiple light emitting elements 4 included in the light emitting device 200 may have the same size, shape, and/or emission wavelength, etc., or may be different from each other. For example, the light emitting device 200 may include a light emitting element whose emission peak wavelength is in the range of 430 nm or more and less than 490 nm (wavelength range of the blue region) and a light emitting element whose emission peak wavelength is in the range of 490 nm or more and 570 nm or less (wavelength range of the green region).

The light-emitting element 4 is, for example, a light-emitting diode (LED). For example, the semiconductor laminate is an LED in which a first semiconductor layer (e.g., an n-type semiconductor layer), a light-emitting layer, and a second semiconductor layer (e.g., a p-type semiconductor layer) are laminated in this order, and on the same side (e.g., the second semiconductor layer side) there is a first electrode 3A electrically connected to the first semiconductor layer and a second electrode 3B electrically connected to the second semiconductor layer. The semiconductor laminate is usually laminated on a growth substrate, but the light-emitting element 4 may or may not have a growth substrate. The material and shape of the semiconductor layer and the laminate structure are not particularly limited.

The first electrode 3A and the second electrode 3B can be formed, for example, from a single layer or a laminated film of a metal such as Au, Pt, Pd, Rh, Ni, W, Mo, Cr, Ti, or an alloy thereof. The film thickness may be any film thickness used in the relevant field. On the underside of the light emitting device, the first electrode 3A and the second electrode 3B of the light emitting element are preferably exposed from the resin member 2. In this way, electricity can be supplied to the first electrode 3A and the second electrode 3B of the light emitting element from a mounting board arranged on the underside of the light emitting device.

The light-emitting element 4 may have a light-reflecting member such as a DBR (distributed Bragg reflector) layer on the electrode placement surface B side of the semiconductor laminate to the extent that it does not impede electrical connection.

The light-transmitting member 1 is a light-transmitting member provided on the light-emitting element 4 to protect the light-emitting element 4. The light-transmitting member 1 is fixed to at least one surface of the light-emitting element 4. A known member having light-transmitting properties can be used as the material of the light-transmitting member. For example, resin, glass, phosphor crystals or sintered bodies can be used as the material of the light-transmitting member. Examples of resins that can be used for the light-transmitting member include silicone resin, silicone-modified resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, TPX resin, polynorbornene resin, and hybrid resins containing one or more of these resins. Among them, silicone resin or epoxy resin is preferable, and silicone resin, which is particularly excellent in light resistance and heat resistance, is more preferable. In this specification, "having light-transmitting properties" refers to a light transmittance of 55% or more at the emission peak wavelength of the light-emitting element. The transmittance of the light-transmitting member 1 at the emission peak wavelength of the light-emitting element is preferably 70% or more, and more preferably 80% or more.

The light-transmitting member may contain a wavelength conversion member. The wavelength conversion member is a member that absorbs at least a portion of the primary light emitted by the light-emitting element and emits secondary light of a wavelength different from that of the primary light. A known wavelength conversion member can be used as the wavelength conversion member. For example, one of the specific examples shown below can be used alone, or two or more types can be used in combination as the wavelength conversion member.

Examples of wavelength conversion members that emit green light include yttrium aluminum garnet phosphors (e.g., Y ₃ (Al,Ga) ₅ O ₁₂ :Ce), lutetium aluminum garnet phosphors (e.g., Lu ₃ (Al,Ga) ₅ O ₁₂ :Ce), terbium aluminum garnet phosphors (e.g., Tb ₃ (Al,Ga) ₅ O ₁₂ :Ce) phosphors, silicate phosphors (e.g., (Ba,Sr) ₂ SiO ₄ :Eu), chlorosilicate phosphors (e.g., Ca ₈ Mg (SiO ₄ ) ₄ Cl ₂ :Eu), β-sialon phosphors (e.g., Si _6-z Al _z O _z N _8-z :Eu (0<z<4.2)), SGS phosphors (e.g., SrGa ₂ S ₄ :Eu), alkaline earth aluminate phosphors (for example _, (Ba,Sr,Ca) _{MgxAl10O16 +x} :Eu,Mn (where 0≦x≦1)), and the like.

Examples of wavelength conversion materials that emit yellow light include α-sialon phosphors (for example, Mz(Si,Al) ₁₂ (O,N) ₁₆ (where 0<z≦2, and M is Li, Mg, Ca, Y, and lanthanide elements excluding La and Ce). In addition, some of the above-mentioned wavelength conversion materials that emit green light also emit yellow light. For example, the emission peak wavelength of an yttrium aluminum garnet phosphor can be shifted to the long wavelength side by substituting part of the Y with Gd, making it possible to emit yellow light. Some of these wavelength conversion materials also emit orange light.

Examples of wavelength conversion members that emit red light include nitrogen-containing calcium aluminosilicate (CASN or SCASN) phosphors (e.g., (Sr,Ca)AlSiN ₃ :Eu), SLAN phosphors (SrLiAl ₃ N ₄ :Eu), etc. In addition, there is manganese-activated fluoride phosphors (phosphors represented by the general formula (I) A ₂ [M _1-a Mn _a F ₆ ] (wherein, in the general formula (I), A is at least one element selected from the group consisting of K, Li, Na, Rb, Cs, and NH ₄ , M is at least one element selected from the group consisting of Group 4 elements and Group 14 elements, and a satisfies 0<a<0.2)). A representative example of this manganese-activated fluoride phosphor is manganese-activated potassium fluorosilicate phosphor (e.g., K ₂ SiF ₆ :Mn).

The light-transmitting member 1 may contain additives such as a diffusing material and a colorant. Examples of additives include silica, titanium oxide, zirconium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, aluminum oxide, iron oxide, chromium oxide, and manganese oxide.

The light-transmitting member 1 may be a single layer, or may have a structure in which multiple layers are laminated. When multiple layers are laminated, it is preferable that the layer containing the wavelength conversion particles is covered with a layer that does not substantially contain the wavelength conversion material. In this way, it becomes easier to prevent the layer containing the wavelength conversion particles from being exposed to the outside. As a result, the layer that does not substantially contain the wavelength conversion material functions as a protective layer, so that the wavelength conversion material can be prevented from deteriorating due to moisture, etc. An example of a wavelength conversion material that is sensitive to moisture is manganese-activated fluoride phosphor. "Substantially does not contain a wavelength conversion material" means that the wavelength conversion material that is inevitably mixed in is not excluded, and it is preferable that the content of the wavelength conversion material is 0.05% by weight or less.

The translucent member 1 arranged on the main light-emitting surface A of the light-emitting element 4 may be fixed in direct contact with the main light-emitting surface A of the light-emitting element 4 as shown in FIG. 3, or may be fixed to the light-emitting element 4 via a translucent joining member 5 as shown in FIG. 8. The joining member 5 may be located only between the main light-emitting surface A of the light-emitting element 4 and the translucent member 1 to fix the light-emitting element and the translucent member, or may cover from the main light-emitting surface A of the light-emitting element to the side of the light-emitting element to fix the light-emitting element and the translucent member. When the joining member 5 has a higher transmittance of light from the light-emitting element than the resin member 2, the joining member 5 covers the side of the light-emitting element, making it easier for the light from the light-emitting element to be guided to the translucent member 1. This improves the light extraction efficiency of the light-emitting device. It is preferable that the side of the joining member 5 is inclined so as to widen toward the translucent member 1. In this way, the light extraction efficiency of the light-emitting device is further improved. It is preferable that the material of the joining member 5 is hardened by light or heat. In particular, it is preferable to use a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenolic resin as the material of the joining member 5.

The resin member 2 is a member that covers the light-emitting element 4 and protects the light-emitting element 4. The resin member 2 may have light reflectivity, translucency, or light absorption. The resin member 2 is preferably light reflective. In this way, a light-emitting device with high contrast between the light-emitting region and the non-light-emitting region and good "parting" can be obtained. In this specification, "having light reflectivity" refers to a light reflectivity of 50% or more at the emission peak wavelength of the light-emitting element. The light reflectivity of the resin member 2 at the emission peak wavelength of the light-emitting element is preferably 70% or more, and more preferably 80% or more. The resin molded body is preferably white. The resin member 2 having light reflectivity can be formed, for example, by adding a light-reflecting substance to a resin material similar to the translucent member. Examples of light-reflecting substances include titanium oxide, silicon oxide, zirconium oxide, magnesium oxide, yttrium oxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, etc. In addition, when the resin member 2 has light transmittance, it may contain a wavelength conversion material such as a phosphor.

The resin member 2 preferably covers the side and bottom of the light-emitting element 4 as shown in FIG. 3. In this way, the light-emitting element can be protected from external forces acting laterally and below. The resin member 2 preferably covers the entire side of the light-emitting element 4. In this way, the light-emitting element can be further protected from external forces acting laterally. If the light-emitting device includes a joining member 5, the resin member 2 may cover the side of the light-emitting element 4 via the joining member 5. The resin member 2 may cover the side of the translucent member 1. If the resin member 2 is light-reflective, the resin member 2 covers the side of the translucent member 1, thereby providing a light-emitting device with high contrast between the light-emitting region and the non-light-emitting region.

As shown in FIG. 3, the wrinkled uneven structure 2a formed on the surface of the resin member 2 and the first electrode 3A and the second electrode 3B of the light-emitting element are located on the lower surface of the light-emitting device 100. The wrinkled uneven structure 2a is preferably formed on the lower surface of the light-emitting device 100. The light-emitting device 100 shown in FIG. 3 can extract light from the light-emitting element from the upper surface of the translucent member 1. If the upper surface of the translucent member 1 is scratched, the light distribution of the light-emitting device may change, so it is preferable that the upper surface of the translucent member 1 does not come into contact with other members. For this reason, when the light-emitting device is transported using a rail, it is generally transported so that the lower surface of the resin member 2 located opposite the upper surface of the translucent member 1 comes into contact with the rail. For this reason, the wrinkled uneven structure 2a is preferably formed on the lower surface of the light-emitting device 100 opposite the upper surface on which the translucent member 1 is located. The formation of the wrinkled uneven structure 2a on the lower surface of the light-emitting device 100 can also be rephrased as the formation of the wrinkled uneven structure 2a on the surface of the resin member 2 located on the electrode arrangement surface B side of the light-emitting element. The wrinkled uneven structure 2a may be formed on the top surface and/or side surface of the light emitting device 100.

The height in the Z direction from the bottom of the recess 2a2 of the wrinkled uneven structure 2a shown in FIG. 6A to the top of the adjacent protrusion 2a1 is preferably 1 μm or more and 20 μm or less. When the height from the bottom of the recess 2a2 to the top of the adjacent protrusion 2a1 is 1 μm or more, the adhesiveness is easily reduced. Also, when the height from the bottom of the recess 2a2 to the top of the adjacent protrusion 2a1 is 20 μm or less, chipping of the resin member 2 is easily suppressed. Also, it is preferable that the distance between adjacent protrusions 2a1 in the X direction is greater than the height from the bottom of the recess 2a2 to the top of the protrusion 2a1. In this way, the number of protrusions 2a1 can be reduced. As a result, the surface of the resin member 2 becomes smooth, making it easier to suppress chipping of the resin member 2. For example, the distance between adjacent protrusions 2a1 is preferably 10 μm or more and 100 μm or less. In this way, the resin member 2 is less likely to chip, and the adhesiveness of the surface of the resin member 2 can be easily reduced. Note that the distance between adjacent protrusions 2a1 means the distance between the tops of adjacent protrusions 2a1 in the X direction in FIG. 6A.

Figures 9A to 21 are process diagrams illustrating the manufacturing method of the light emitting device of this embodiment.

First, as shown in FIG. 9A, an adhesive layer 26 containing a curing inhibitor is attached to a support member 27 to prepare a support 20. The adhesive layer 26 may have an adhesive substance containing a curing inhibitor on its surface. For example, a tape or film coated with a material containing a curing inhibitor may be used as the adhesive layer 26. Examples of the curing inhibitor include compounds containing nitrogen, sulfur, tin, phosphorus, arsenic, antimony, selenium, and tellurium. As the support member 27, a frame may be used as shown in FIG. 9A. The planar shape of the frame may be a ring or a hollow polygon. By attaching the periphery of the adhesive layer 26 to such a frame-shaped support member 27, the adhesive layer 26 can be supported in a substantially flat state. Alternatively, as shown in FIG. 9B, the adhesive layer 26 may be supported by attaching substantially the entire adhesive layer 26 to a plate-shaped support member 27'. Alternatively, a support 20 in which a material containing a curing inhibitor is applied to the surface of a plate-shaped support member 27' may be used.

As shown in FIG. 10, a laminate 30 having a light-emitting element 4 and a translucent member 1 is prepared. The light-emitting element 4 and the translucent member 1 are fixed.

As shown in FIG. 11, the electrode arrangement surface B of the light-emitting element is placed against the upper surface of the adhesive layer 26 containing the curing inhibitor component of the support 20, and multiple laminates 30 are placed so that the first electrode 3A and the second electrode 3B are in contact with the adhesive layer 26. At this time, it is preferable to arrange the laminates 30 in a regular pattern. This makes it possible to suppress variation in the shape of the light-emitting device when the light-emitting device is divided into individual pieces by cutting, as described below.

As shown in FIG. 12, the support 20 on which the laminate 30 is placed is placed between the upper mold 8 and the lower mold 9. Then, resin is injected into the space formed between the upper mold 8 and the lower mold 9 to harden the resin member 2. In this way, a sealed body 40 in which the laminate 30 is covered with the resin member 2 can be formed. The sealed body 40 includes the laminate 30 and the resin member 2. The resin member 2 formed in the space formed between the mold 8 and the lower mold 9 is in contact with an adhesive layer containing a hardening inhibitor. The resin member 2 can be formed by a known method such as compression molding, transfer molding, or injection molding.

As shown in Figures 13 and 14, the sealing body 40 is removed from the upper mold 8 and the lower mold 9.

As shown in FIG. 15, the support 20 is removed from the sealing body 40. At this time, a wrinkled uneven structure 2a (see FIGS. 4A and 4B) is formed on the surface of the resin member 2 that was in contact with the adhesive layer 26 of the support 20. By curing the resin member on the adhesive layer 26 containing the curing inhibitor, the ease of curing of the resin member can be changed between the part in contact with the adhesive layer 26 and the other parts. As a result, the surface of the resin member 2 that was in contact with the adhesive layer 26 is difficult to cure, so the wrinkled uneven structure 2a is formed. The wrinkled uneven structure 2a may be formed on the entire surface of the resin member 2 located on the electrode placement surface B side, or may be formed only on a part of the surface of the resin member 2 located on the electrode placement surface B side. If a part of the resin member 2 gels and the resin member 2 is not completely cured when the sealing body 40 is formed, heat curing may be performed again. In addition, a curing inhibitor may be attached to the surface of the resin member 2.

As shown in FIG. 16, a support 20 is prepared in which the retention tape 10 is attached to a support member 27. As described above, the retention tape 10 may be supported in a substantially flat state by attaching the periphery of the retention tape 10 to a frame-shaped support member 27. The support may also support the retention tape 10 by attaching substantially the entire retention tape to a plate-shaped support member. As shown in FIG. 16, a sealant 40 is placed on the retention tape 10.

As shown in FIG. 17, the resin member 2 on the main light-emitting surface A side is removed to expose the translucent member 1 from the resin member 2. When removing the resin member 2, a part of the upper surface of the translucent member 1 may be removed. In this way, it is easier to prevent the resin member 2 from being located on the upper surface of the translucent member 1. A known method such as grinding can be used to remove the resin member 2 on the main light-emitting surface A side. When removing the resin member 2 on the main light-emitting surface A side, it is preferable to fix the sealing body 40 to the holding tape 10 and process it. As a method of fixing the sealing body 40 to the holding tape 10, a method of directly adsorbing the sealing body 40 using a vacuum chuck or the like can be mentioned. Note that if the translucent member 1 is exposed from the resin member 2 when the sealing body 40 is formed, the process of removing the resin member 2 on the main light-emitting surface A side may be omitted.

As shown in FIG. 18, the resin member 2 of the sealing body 40 is cut at the position of the cutting line 2c. As a result, as shown in FIG. 19, it is possible to separate into a plurality of light emitting devices 100. As shown in FIG. 3, it is possible to cut so that one light emitting device has one light emitting element, or as shown in FIG. 7, it is possible to cut so that one light emitting device has multiple light emitting elements. As a cutting method, dicing, Thomson processing, ultrasonic processing, laser processing, etc. can be used. Then, as shown in FIG. 20, the separated light emitting devices 100 are peeled off from the holding tape 10. When the sealing body 40 is fixed with the holding tape 10, etc., it is preferable to cut it by a method that does not completely cut the tape. In this way, the holding tape 10 is not divided into a plurality of pieces, so that the holding tape 10 can be removed by peeling it off from the light emitting device at once.

Figure 21 is a schematic cross-sectional view illustrating the transport process of the light-emitting device 100 of this embodiment. As shown in Figure 21, the light-emitting device 100 after singulation can be transported on a transport support 11 such as a rail, and can proceed to a process of further sorting and packaging, or mounting on a mounting board, etc. The transport support 11 may be, for example, a rail, or a stage with a flat upper surface. By providing an inclined surface on the transport support 11 and applying, for example, ultrasonic vibration, the light-emitting device 100 placed on it may be transported along the inclined surface toward the downward direction of gravity in the direction of arrow 11a. In addition, the transport support 11 itself may move in the transport direction to transport the light-emitting device 100.

When the light-emitting device 100 is transported, the wrinkled uneven structure 2a is in contact with the transport support 11, thereby preventing the light-emitting device 100 from sticking to the transport support 11. Furthermore, by providing the wrinkled uneven structure 2a, the light-emitting devices 100 can be prevented from sticking to each other. Furthermore, by providing the wrinkled uneven structure 2a, the contact area with the transport support 11 can be reduced, and charging of the light-emitting device 100 due to static electricity can be prevented.

The above describes the embodiments of the present invention. However, the present invention is not limited to these descriptions. Any design modifications made by a person skilled in the art to the above-described embodiments are also included within the scope of the present invention as long as they have the characteristics of the present invention. For example, the content, shape, dimensions, materials, arrangement, conditions, etc. of each element and step of the light-emitting device and its manufacturing method are not limited to those exemplified, and can be modified as appropriate.

Furthermore, the elements and steps of each of the above-mentioned embodiments can be combined to the extent technically possible, and such combinations are also included within the scope of the present invention as long as they include the features of the present invention.

REFERENCE SIGNS LIST 1 Light-transmitting member 2 Resin member 2a Wrinkled uneven structure 3A First electrode 3B Second electrode 4 Light-emitting element 5 Light-transmitting joining member 6 Adhesive layer containing a curing inhibitor 7 Support 8 Upper mold 9 Lower mold 10 Holding tape A Main light-emitting surface B Electrode arrangement surface

Claims (10)

A light-emitting element;
a resin member having a wrinkled uneven structure formed on a surface thereof by contact with a curing inhibitor and covering the light emitting element;
A light emitting device comprising: The light-emitting device according to claim 1, characterized in that at least one surface of the light-emitting element and the translucent member are fixed. The light-emitting element has an electrode,
3. The light-emitting device according to claim 1, wherein the electrode and the wrinkled uneven structure are located on a lower surface of the light-emitting device. A plurality of the light emitting elements are provided,
4. The light emitting device according to claim 1, wherein the plurality of light emitting elements are covered with the resin member. The light-emitting device according to any one of claims 1 to 4, characterized in that the resin member covers the side and bottom surfaces of the light-emitting element. The light-emitting device according to any one of claims 1 to 5, characterized in that the curing inhibitor adheres to the wrinkled uneven structure. A step of fixing a light emitting element to an adhesive layer containing a curing inhibitor;
forming a resin member that is in contact with the adhesive layer and covers the light emitting element, thereby forming a sealing body including the light emitting element and the resin member;
removing the adhesive layer from the sealing body;
Equipped with
A method for manufacturing a light emitting device, comprising the steps of: forming a wrinkled uneven structure on the surface of the resin member that has been in contact with the adhesive layer; The method for manufacturing a light-emitting device according to claim 7, characterized in that in the process of fixing the light-emitting element to the adhesive layer, the light-emitting element and the translucent member are fixed. The method for manufacturing a light-emitting device according to claim 8, further comprising the step of grinding the resin member to expose the translucent member from the resin member after the step of removing the adhesive layer from the sealing body. A method for transporting a light-emitting device comprising: a light-emitting element; and a resin member covering the light-emitting element, the resin member having a wrinkled uneven structure formed on the surface thereof by contact with a curing inhibitor, the method transporting the light-emitting device while bringing the surface on which the wrinkled uneven structure is formed into contact with a transport support.

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