JP7536715B2 - Tape for processing electronic devices and method for producing tape for processing electronic devices - Google Patents

Description

The present invention relates to a tape for processing electronic devices, and in particular to a tape for processing electronic devices used in dicing and picking up semiconductor wafers, and a method for manufacturing the tape for processing electronic devices.

As a tape for processing semiconductor wafers, a dicing tape in which label sections having a plurality of predetermined shapes in plan view are formed at predetermined intervals on a long length of base tape, or an electronic device processing tape equipped with a die bonding film is used. An adhesive layer is provided on the base tape in a portion corresponding to the label section. The semiconductor wafer is positioned at the label section by attaching it to the label section on which the adhesive layer is provided. The positioned semiconductor wafer is diced while attached to the label section to manufacture semiconductor chips. The manufactured semiconductor chips are picked up from the label section by reducing the adhesive strength of the adhesive layer through a curing process using ultraviolet light, etc.

For example, Patent Document 1 discloses a semiconductor wafer processing tape in which a semiconductor wafer processing tape has multiple label parts formed at predetermined intervals on a base tape, and in which a predetermined precut process is applied to the semiconductor wafer processing tape, and unnecessary parts between the label parts arranged at predetermined intervals are peeled off and removed along the cut lines of the precut process.

In this way, the base tape is partitioned by the precut process into a label portion to which the semiconductor wafer is attached, a waste portion that is an unnecessary portion that surrounds the outer side of the label portion in a plan view, and a peripheral portion that contacts the outer edge of the waste portion in a plan view. The precut process is performed on the base film and the adhesive layer provided on the surface of the base film using a rotary punching blade that is arranged opposite the base tape (Patent Document 2).

In addition, before the semiconductor wafer is diced, the waste portion of the base tape is peeled off from the electronic device processing tape by winding it up in the longitudinal direction of the base tape (the transport direction of the base tape) using a winding means. Therefore, with the waste portion of the base tape removed from the electronic device processing tape, the electronic device processing tape is set in the semiconductor wafer lamination machine.

The material and thickness of the base tape are optimized from the viewpoint of the electronic device processing process, such as expandability and pick-up properties. Therefore, when removing the residue of the base tape from the tape for electronic device processing, the following problems can occur.

For example, when the base tape is thin, the tear strength of the base tape decreases. When the tear strength of the base tape decreases, the tension applied to the waste portion of the base tape when it is peeled off from the electronic device processing tape causes large tears to occur in the waste portion, especially in the waste portion between the label portions formed at a predetermined interval, and in some cases, the waste portion may be separated between the label portions, making it difficult to peel off the waste portion smoothly from the electronic device processing tape. In addition, when the tear strength of the base tape decreases, when the waste portion of the base tape is peeled off from the electronic device processing tape, the waste portion may deviate from the precut cut line, causing a tear to occur in the waste portion, and the waste portion may remain between the label portions. In addition, depending on the conditions of use of the electronic device processing tape, a material that does not have a tear strength sufficient to withstand the tension applied to the waste portion when it is peeled off may be used as the material of the base tape. Even if the material of the base tape does not have sufficient tear strength, the tension applied to the waste portion when it is peeled off from the electronic device processing tape can cause large tears in the waste portion, especially in the waste portion between the label portions formed at a predetermined interval, and in some cases the waste portion can break off between the label portions, making it impossible to peel off the waste portion smoothly from the electronic device processing tape. Also, if the material of the base tape does not have sufficient tear strength, when the waste portion of the base tape is peeled off from the electronic device processing tape, it can deviate from the precut cut line, causing tears in the waste portion and leaving the waste portion between the label portions.

JP 2011-111530 A JP 2014-017357 A

In view of the above circumstances, the present invention aims to provide a tape for processing electronic devices and a method for manufacturing such a tape, which prevents large tears from occurring in the waste portion even if the base tape is made thinner or the tear strength is reduced due to the material of the base tape, and which prevents tears from occurring in the waste portion that deviate from the precut cutting line and allows the waste portion to be peeled off smoothly, thereby preventing waste portions from being left in the waste peeling portion.

The gist and configuration of the present invention are as follows.
[1] a release film;
A tape for processing electronic devices comprising a base tape having a pressure-sensitive adhesive layer formed on a main surface of a base film, the base tape being laminated with the release film,
the base tape comprises: label portions having a predetermined shape in plan view, which are formed at predetermined intervals in a feed direction of the tape for processing electronic devices; a waste removal portion which surrounds the outer side of the label portion in plan view and has a space portion which forms the predetermined space; and a peripheral portion which contacts an outer edge of the waste removal portion in plan view;
a cut line forming an outer edge of the waste portion extending from the front in the conveying direction and a cut line forming an outer edge of the waste portion extending from the rear in the conveying direction do not intersect with each other;
A tape for processing electronic devices, in which, in the gap portion of the waste portion, an end of the cut line extending from one direction is located at the same position or in the direction of the peripheral portion as an end of the cut line extending from the other direction in a direction perpendicular to the conveying direction.
[2] The tape for processing electronic devices described in [1], wherein in the gap portion of the waste portion, at least one of the cut lines extending from one direction and the cut lines extending from the other direction has a turn portion extending from the end toward the center line of the base tape parallel to the conveying direction.
[3] The tape for processing electronic devices according to [2], wherein the turn portion has a curved portion in a plan view.
[4] The tape for processing electronic devices according to [3], wherein the curved portion of the turn portion in plan view has a portion that is an arc-shaped curved portion with a curvature radius of R1.0 mm or more.
[5] The tape for processing electronic devices according to [2], wherein the turn portion has a straight portion in a plan view.
[6] A tape for processing electronic devices described in any one of [1] to [5], wherein the distance between an end of the cut line extending from one direction and an end of the cut line extending from the other direction in a direction parallel to the conveying direction is 0.1 mm or more and 10 mm or less.
[7] The tape for processing electronic devices according to any one of [1] to [6], wherein the angle θ between a virtual line parallel to the conveying direction passing through an end of the cut line extending from one direction and the tip of the cut line extending from one direction is 10° or more and 150° or less.
[8] A tape for processing electronic devices described in any one of [1] to [7], wherein an end of the cut line extending from one direction is located further toward the peripheral portion than an end of the cut line extending from the other direction, and the distance between the end of the cut line extending from one direction and the end of the cut line extending from the other direction in a direction perpendicular to the conveying direction is 0.1 mm or more and 10 mm or less.
[9] Further comprising an adhesive layer provided on a part of the main surface of the release film,
The tape for processing electronic devices according to any one of [1] to [8], wherein the base tape covers the adhesive layer and is in contact with the release film around the periphery of the adhesive layer.
[10] A step of applying a pressure-sensitive adhesive layer onto a substrate film to prepare a substrate tape;
laminating the base tape with a release film;
a step of performing a precut using a rotary punch blade, in which a label portion having a predetermined shape in plan view is formed at a predetermined interval in the transport direction of the base tape, a waste portion surrounding the outer side of the label portion in plan view and having a spaced portion forming the predetermined space, and a peripheral portion in contact with the outer edge of the waste portion in plan view are partitioned, and a cut line forming the outer edge of the waste portion extending from the front in the transport direction does not intersect with a cut line forming the outer edge of the waste portion extending from the rear in the transport direction, and in the spaced portion of the waste portion, an end of the cut line extending from one direction is located closer to the peripheral portion than an end of the cut line extending from the other direction, or an end of the cut line extending from one direction and an end of the cut line extending from the other direction are located parallel to the transport direction;
a step of removing the waste portion to form a waste-removed portion on the base tape;
A method for producing a tape for processing electronic devices comprising the steps of:

According to the aspect of the electronic device processing tape of the present invention, in the gap between the waste portions, the end of the cut line extending from one direction is located in the same position as the end of the cut line extending from the other direction in a direction perpendicular to the transport direction of the electronic device processing tape, or in the direction of the peripheral portion in contact with the outer edge of the waste portion that becomes the waste peeling portion. This facilitates tearing between the end of the cut line extending from one direction and the end of the cut line extending from the other direction when the waste portion of the base tape is peeled off. Therefore, during the waste removal process, the outer edges of the label portions are reliably connected, preventing the occurrence of a tear from the outer edge of the waste portion toward the center line of the base tape, and preventing the occurrence of a tear in the waste portion away from the cut line. Tearing from the outer edge of the waste portion toward the center line is prevented, and tears in the waste portion away from the cut line are also prevented. This makes it possible to peel off the waste portion smoothly, even if the base tape is made thinner or a material with lower tensile strength is used for the base tape, and prevents waste from being left behind in the waste peeling portion of the tape for electronic device processing.

According to an embodiment of the electronic device processing tape of the present invention, at least one of the cut lines extending from one direction and the cut lines extending from the other direction in the gaps between the waste portions has a turn portion extending from the end of the cut line toward the center line of the base tape parallel to the transport direction of the electronic device processing tape, which makes it possible to more reliably tear between the cut line extending from one direction and the cut line extending from the other direction, and more reliably and smoothly peel off the waste portions.

According to the aspect of the electronic device processing tape of the present invention, the distance between the end of the cut line extending from one direction and the end of the cut line extending from the other direction in a direction parallel to the transport direction of the electronic device processing tape is 0.1 mm or more and 10 mm or less, which more reliably prevents the occurrence of a tear from the outer edge of the waste portion toward the center line of the base tape, and more reliably tears between the cut line extending from one direction and the cut line extending from the other direction, making it possible to more reliably and smoothly peel off the waste portion.

According to the aspect of the tape for processing electronic devices of the present invention, the angle θ between the virtual line parallel to the conveying direction passing through the end of the cut line extended from one direction and the tip of the cut line extended from one direction is 10° or more and 150° or less. This allows the tear of the waste portion from the tip of the cut line extended from the other direction to reach the cut line extended from one direction reliably, while preventing a large tension acting on the base film when the tear of the waste portion passes from the tip of the cut line extended from the other direction near the tip of the cut line extended from one direction, causing the tear to occur in a position shifted from the expected tear position, and leaving the tip of the waste portion behind, thereby making it possible to more reliably and smoothly peel off the waste portion.

According to an embodiment of the electronic device processing tape of the present invention, the distance between the end of the cut line extending from one direction and the end of the cut line extending from the other direction in a direction perpendicular to the transport direction of the electronic device processing tape is 0.1 mm or more and 10 mm or less, so that the tearing between the cut line extending from one direction and the cut line extending from the other direction becomes more reliable, and the peeling off of the waste portion can be more reliably and smoothly performed.

1 is a cross-sectional view showing an outline of a laminated structure of a tape for processing electronic devices according to a first embodiment of the present invention before a waste removing process. 1 is an explanatory diagram showing an outline of a plan view of a tape for processing electronic devices according to a first embodiment of the present invention before a waste removing process; 1 is an enlarged schematic plan view of a tape for processing electronic devices according to a first embodiment of the present invention before a waste removing process; 1 is an explanatory diagram showing an overview of a rotary punching blade that performs precut processing on an electronic device processing tape according to a first embodiment of the present invention; FIG. 1 is an enlarged schematic plan view of a tape for processing electronic devices according to a first embodiment of the present invention before a waste removing process; 1A to 1C are explanatory diagrams illustrating an example of a method of using the tape for processing electronic devices according to the first embodiment of the present invention. FIG. 11 is a cross-sectional view showing an outline of a laminated structure of a tape for processing electronic devices according to another embodiment of the present invention before a waste removing process.

First, the electronic device processing tape according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing an outline of the laminated structure of the electronic device processing tape according to the first embodiment of the present invention before the waste removal process. FIG. 2 is an explanatory diagram showing an outline of the plan view of the electronic device processing tape according to the first embodiment of the present invention before the waste removal process. FIG. 3 is an enlarged view showing an outline of the plan view of the electronic device processing tape according to the first embodiment of the present invention before the waste removal process.

As shown in FIG. 1, the electronic device processing tape 1 according to the first embodiment of the present invention is a laminate including a release film 11, an adhesive layer 12 provided on a portion of the main surface 61 of the release film 11, and a base tape 13 that covers the adhesive layer 12 and contacts the release film 11 around the adhesive layer 12. As described below, the base tape 13 is a laminated structure in which an adhesive layer 15 is formed on the main surface 71 of a base film 14.

The release film 11 has a rectangular, long shape, and is formed so that its length in the longitudinal direction is sufficiently longer than its length in the direction perpendicular to the longitudinal direction (width direction). The release film 11 functions as a support during the manufacture and use of the electronic device processing tape 1. When bonding a semiconductor wafer to the electronic device processing tape 1, the release film 11 is peeled off from the electronic device processing tape 1. The release film 11 is peeled off and the semiconductor wafer is bonded to the adhesive layer 12 exposed.

Examples of materials for the release film 11 include polyesters such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene naphthalate (PEN), and polyolefins such as polyethylene (PE) and polypropylene (PP). The thickness of the release film 11 is not particularly limited and can be appropriately selected depending on the conditions of use of the electronic device processing tape 1, and can be, for example, 25 μm to 50 μm. The width dimension of the release film 11 is also not particularly limited and can be appropriately selected depending on the conditions of use of the electronic device processing tape 1, such as the size of the semiconductor wafer, and can be, for example, 20 cm to 70 cm.

The adhesive layer 12 is provided in a partial region of the main surface 61 of the release film 11, and has a shape in plan view that corresponds to the shape in plan view of the semiconductor wafer that is to be bonded to the adhesive layer 12 and diced. In this specification, "plan view" refers to the state as viewed from a position facing the main surface 61 of the release film 11 and the main surface 71 of the base film 14.

The adhesive layer 12 is disposed between the release film 11 and the base tape 13. The adhesive layer 12 is in contact with the adhesive layer 15 of the base tape 13, and is peeled off from the adhesive layer 15 while still attached to the semiconductor chip when the semiconductor chip is picked up.

Examples of materials for the adhesive layer 12 include epoxy resins, (meth)acrylic resins, phenolic resins, polyurethane resins, polyester resins, polyimide resins, and silicone resins. The thickness of the adhesive layer 12 is not particularly limited and can be appropriately selected depending on the conditions of use of the electronic device processing tape 1, but may be, for example, 5 μm to 100 μm.

The base tape 13 is a laminated structure of the base film 14 and the adhesive layer 15, with the adhesive layer 15 formed over the entire main surface 71 of the base film 14, covering the entire adhesive layer 12 and being able to come into contact with the release film 11 over the entire periphery of the adhesive layer 12. The base tape 13, like the release film 11, is rectangular and long, and is formed so that its length in the longitudinal direction is sufficiently longer than its length in the direction perpendicular to the longitudinal direction (width direction). The base tape 13 functions as a fixing means when the semiconductor wafer is diced.

Materials for the base film 14 include, for example, α-olefin homopolymers or copolymers such as polyethylene, polypropylene, ethylene-propylene copolymers, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymers, ethylene-ethyl (meth)acrylate copolymers, ethylene-methyl (meth)acrylate copolymers, ethylene-(meth)acrylic acid copolymers, ionomers, or mixtures thereof, polyesters such as polyethylene terephthalate and polymethyl (meth)acrylate, polycarbonate, polyurethane, styrene-ethylene-butene or pentene copolymers, and thermoplastic elastomers such as polyamide-polyol copolymers.

The thickness of the base film 14 is not particularly limited and can be selected appropriately depending on the conditions of use of the tape 1 for processing electronic devices, and can be, for example, 50 μm to 200 μm. The width dimension of the base film 14 is not particularly limited and can be selected appropriately depending on the conditions of use of the tape 1 for processing electronic devices, such as the size of the semiconductor wafer, and can be, for example, the same dimension as the width dimension of the release film 11. Specific examples of the width dimension of the base film 14 are 20 cm to 70 cm.

Examples of materials for the adhesive layer 15 include polypropylene resin, (meth)acrylic resin, polyester resin, polyurethane resin, and epoxy resin. In addition, an ultraviolet-curable compound may be added to the adhesive layer 15, so that the adhesive layer 15 can be easily peeled off from the adhesive layer 12 by curing the adhesive layer 15 through ultraviolet irradiation. Adding an ultraviolet-curable compound improves the pick-up properties of the semiconductor chip.

As the UV-curable compound, for example, a compound having at least two photopolymerizable carbon-carbon double bonds in the molecule, which can be three-dimensionally reticulated by UV irradiation, is used. Specific examples of the UV-curable compound include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and difunctional or higher (meth)acrylate monomers such as oligoester (meth)acrylate.

Specific examples of ultraviolet-curable compounds include urethane (meth)acrylate oligomers in addition to the above (meth)acrylate monomers. Urethane (meth)acrylate oligomers can be obtained by reacting a urethane prepolymer having an isocyanate group at the end, which is obtained by reacting a polyol compound such as a polyester or polyether type with a polyfunctional isocyanate compound (e.g., 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc.), with a (meth)acrylate compound having a hydroxyl group (e.g., 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, polyethylene glycol (meth)acrylate, etc.).

When a UV-curable compound is added, a photopolymerization initiator may be added as necessary to facilitate the curing of the UV-curable compound. Specific examples of photopolymerization initiators include isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecyl thioxanthone, dimethyl thioxanthone, diethyl thioxanthone, benzyl dimethyl ketal, α-hydroxycyclohexyl phenyl ketone, and 2-hydroxymethyl phenyl propane.

As shown in FIG. 2, before the waste portion 31 is peeled off, the base tape 13 of the electronic device processing tape 1 is divided into a label portion 21 to which a semiconductor wafer is attached, a waste portion 31 which is an unnecessary portion surrounding the outer edge 22 of the label portion 21 in a plan view, and a peripheral portion 41 which is in contact with the outer edge 34 of the waste portion 31 in a plan view and is located at the edge of the base tape 13 in the width direction. The base tape 13 is subjected to a waste removal process in which the waste portion 31 is peeled off, and the area which was the waste portion 31 becomes a waste peeling portion, thereby forming the electronic device processing tape 1 according to the first embodiment of the present invention. In the electronic device processing tape 1, the peripheral portion 41 is in contact with the outer edge of the waste peeling portion in a plan view. In the drawings explaining the electronic device processing tape 1 according to the first embodiment of the present invention, for convenience of explanation, the waste portion 31 is left without being peeled off. The portion of the base tape 13 that overlaps with the adhesive layer 12 in a plan view and, if necessary, the vicinity of the overlapping portion corresponds to the label portion 21. Therefore, the label portion 21 has a structure in which the release film 11, the adhesive layer 12, the adhesive layer 15, and the base film 14 are laminated in the above order. On the other hand, the waste portion 31 and the peripheral portion 41 do not have the adhesive layer 12. Therefore, the waste portion 31 and the peripheral portion 41 have a structure in which the release film 11, the adhesive layer 15, and the base film 14 are laminated in the above order.

In FIG. 2, the electronic device processing tape 1 is wound into a roll before the waste portion 31 is peeled off.

The label portions 21 are formed at a predetermined interval in the transport direction D of the tape 1 for processing electronic devices. The shape and area of the label portions 21 in plan view are not particularly limited, and may be, for example, a shape and area that roughly corresponds to the shape in plan view of the semiconductor wafer to which it is bonded and diced. In the tape 1 for processing electronic devices, the shape of the label portions 21 in plan view is circular.

The waste portion 31 has an outer periphery 33 that surrounds the outer edge 22 in plan view of each label portion 21, and a spacing portion 32 that forms a predetermined spacing between adjacent label portions 21. The outer edge 34 of the outer periphery 33 is a portion that extends along the outer edge 22 in plan view of the label portion 21. The outer periphery 33 and the spacing portion 32 are also formed continuously. From the above, the outer periphery 33 that surrounds the outer edge 22 in plan view of each label portion 21 is continuous with the outer periphery 33 that surrounds the outer edge 22 in plan view of another label portion 21-2 adjacent to the specified label portion 21-1 via the spacing portion 32.

As shown in Figure 3, the spacing portion 32 of the waste portion 31 is divided in the width direction by an outer edge 34 extending from an outer periphery 33 surrounding a specific label portion 21-1 toward the other label portion 21-2 adjacent to the specific label portion 21-1, and an outer edge 34 extending from an outer periphery 33 surrounding the other label portion 21-2 adjacent to the specific label portion 21-1 toward the specific label portion 21-1. The tip 63 of the outer edge 34 extending from the outer periphery 33 surrounding the other label portion 21-2 toward the specific label portion 21-1 does not reach the outer edge 34 of the outer periphery 33 surrounding the specific label portion 21-1. That is, the end of the outer edge 34 extending from the outer periphery 33 surrounding the other label part 21-2 toward the specified label part 21-1 does not extend to the outer edge 34 of the outer periphery 33 surrounding the specified label part 21-1. Also, the tip 53 of the outer edge 34 extending from the outer periphery 33 surrounding the specified label part 21-1 toward the other label part 21-2 does not reach the outer edge 34 of the outer periphery 33 surrounding the other label part 21-2. That is, the end of the outer edge 34 extending from the outer periphery 33 surrounding the specified label part 21-1 toward the other label part 21-2 does not extend to the outer edge 34 of the outer periphery 33 surrounding the other label part 21-2.

In addition, the outer edge 34 of the outer periphery 33 of the waste portion 31 surrounding a given label portion 21-1 does not intersect with the outer edge 34 of the outer periphery 33 of the waste portion 31 surrounding another label portion 21-2. In other words, the outer edge 34 of the outer periphery 33 of the waste portion 31 extending from the front in the transport direction D of the electronic device processing tape 1 does not intersect with the outer edge 34 of the outer periphery 33 of the waste portion 31 extending from the rear in the transport direction D.

As shown in FIG. 3, in the interval portion 32 of the waste portion 31, the tip 53 of the outer edge 34 extending from the outer periphery 33 surrounding the specified label portion 21-1 toward the other label portion 21-2 is located toward the peripheral portion 41 more than the tip 63 of the outer edge 34 extending from the outer periphery 33 surrounding the other label portion 21-2 toward the specified label portion 21-1. That is, the end of the outer edge 34 extending from the outer periphery 33 surrounding the specified label portion 21-1 toward the other label portion 21-2 (i.e., extending from one direction) is located toward the peripheral portion 41 in a direction perpendicular to the conveying direction D of the electronic device processing tape 1, relative to the end of the outer edge 34 extending from the outer periphery 33 surrounding the other label portion 21-2 toward the specified label portion 21-1 (i.e., extending from the other direction). From the above, the tip 53 is located outside the tip 63 in the width direction of the base tape 13.

In FIG. 3, the scrap removal process in which the scrap portion 31 is peeled off from the base tape 13 to form the electronic device processing tape 1 is performed in the direction from the tip 63 of the outer edge 34 of the outer periphery 33 surrounding the other label portion 21-2 to the tip 53 of the outer edge 34 of the outer periphery 33 surrounding the specified label portion 21-1.

In the space 32 of the waste portion 31, the outer edge 34 extending from the outer periphery 33 surrounding the specified label portion 21-1 toward the other label portion 21-2 has a turn portion 50 extending from the tip 53 which is the terminal end toward the center line C of the base tape 13 which is parallel to the conveying direction D. The turn portion 50 of the outer edge 34 is a portion which extends in a different direction from the outer edge 34 in the portion surrounding the specified label portion 21-1. The turn portion 50 is formed in the space 32 of the waste portion 31. The turn portion 50 of the outer edge 34 is shaped to extend from the tip 53 of the outer edge 34 toward the specified label portion 21-1 and toward the center line C of the base tape 13. As described below, the outer edge 34 that extends from the outer periphery 33 that surrounds a given label part 21-1, including the turn part 50, toward the other label part 21-2 is a precut cut line formed through the base tape 13, and the release film 11 and adhesive layer 12 do not necessarily have to have a precut cut line formed therein.

The outer edge 34 extending from the outer periphery 33 surrounding the specified label part 21-1 including the turn part 50 toward the other label part 21-2 is formed only in a portion outside the center line C of the base tape 13 parallel to the conveying direction D of the tape 1 for processing electronic devices. In other words, the outer edge 34 extending from the outer periphery 33 surrounding the specified label part 21-1 including the turn part 50 toward the other label part 21-2 does not extend to cross the center line C of the base tape 13 parallel to the conveying direction D. In addition, two turn parts 50 are formed per one space portion 32, and in this embodiment, they are arranged approximately symmetrically with respect to the center line C. The arrangement of the turn parts 50 does not have to be symmetrical with respect to the center line C.

The turn section 50 has a planar shape with a curved portion 51. The curved portion 51 of the turn section 50 has an outward portion 52 that extends from the base point (the portion closest to the center line C) 56 of the curved portion 51 toward the peripheral portion 41. The outward portion 52 of the curved portion 51 is a portion that extends in the gap portion 32 from the center line C toward the outside in the width direction of the base tape 13, that is, from the center line C of the base tape 13 toward the edge portion perpendicular to the conveying direction D.

In addition, in the space 32 of the waste portion 31, the outer edge 34 extending from the outer periphery 33 surrounding the other label portions 21-2 toward the specified label portion 21-1 has a turn portion 60 extending from the tip 63 which is the terminal end toward the center line C of the base tape 13 which is parallel to the conveying direction D. The turn portion 60 of the outer edge 34 is a portion which extends in a different direction from the outer edge 34 in the portion surrounding the other label portions 21-2. The turn portion 60 is formed in the space 32 of the waste portion 31. The turn portion 60 of the outer edge 34 is shaped to extend from the tip 63 of the outer edge 34 toward the other label portions 21-2 and toward the center line C of the base tape 13. As described below, the outer edge 34 extending from the outer periphery 33 surrounding the other label parts 21-2, including the turn part 60, toward the specified label part 21-1 is a pre-cut cut line formed through the base tape 13, and the release film 11 and adhesive layer 12 do not necessarily have to have a pre-cut cut line formed therein.

The outer edge 34 extending from the outer periphery 33 surrounding the other label parts 21-2 including the turn part 60 toward the specified label part 21-1 is formed only in a portion outside the center line C of the base tape 13 parallel to the conveying direction D of the tape 1 for processing electronic devices. In other words, the outer edge 34 extending from the outer periphery 33 surrounding the other label parts 21-2 including the turn part 60 toward the specified label part 21-1 does not extend to cross the center line C of the base tape 13 parallel to the conveying direction D. In addition, two turn parts 60 are formed per one space 32, and are arranged approximately symmetrically with respect to the center line C. The arrangement of the turn parts 60 does not have to be symmetrical with respect to the center line C.

The turn section 60 has a planar shape that includes a curved portion 61. The curved portion 61 of the turn section 60 has an outward portion 62 that extends from the base point 66 of the curved portion 61 (the portion closest to the center line C) toward the peripheral portion 41. The outward portion 62 of the curved portion 61 is a portion that extends from the center line C toward the outside in the width direction of the base tape 13 in the spacing portion 32, that is, from the center line C of the base tape 13 toward the edge portion perpendicular to the conveying direction D.

The tip 63 of the outer edge 34 extending from the outer periphery 33 surrounding the other label part 21-2 toward the specified label part 21-1 does not reach the outer edge 34 of the outer periphery 33 surrounding the specified label part 21-1, and the tip 53 of the outer edge 34 extending from the outer periphery 33 surrounding the specified label part 21-1 toward the other label part 21-2 does not reach the outer edge 34 of the outer periphery 33 surrounding the other label part 21-2, thereby improving the tensile strength and breaking strength in the gap part 32 of the waste part 31. In the gap part 32 of the waste part 31, the tip 53 of the outer edge 34 extending from the outer periphery 33 surrounding the specified label part 21-1 toward the other label part 21-2 is located in the direction of the peripheral part 41 further than the tip 63 of the outer edge 34 extending from the outer periphery 33 surrounding the other label part 21-2 toward the specified label part 21-1. During the scrap removal process, a tensile force acts on the base tape 13 in the longitudinal direction, so that tension acts on the outer edge 34 of the base tape 13 in a direction parallel to the scrap removal direction and in a direction toward the center line C. Therefore, when the scrap removal position reaches the tip 63, the tearing of the base tape 13 progresses in a direction parallel to the scrap removal direction or slightly toward the center line C. The tip 53 is located in a direction farther away from the center line C than the tip 63, and the outward portion 52 is located closer to the center line C than the tip 63, so that the tearing that progresses from the tip 63 reliably reaches the outer edge 34 of the outer periphery 33 that surrounds the specified label part 21-1. This facilitates the tearing from the tip 63 to the tip 53. On the other hand, if the tip 53 is located in a direction closer to the center line C than the tip 63, there are cases in which the tearing that progresses from the tip 63 cannot reach the outer edge 34 of the outer periphery 33 that surrounds the specified label part 21-1, and this causes problems in the tearing from the tip 63 to the tip 53. Therefore, during the waste removal process, the outer edges 34 between the label portions 21 are reliably connected, preventing tearing from the outer edge 34 of the waste portion 31 in the direction of the center line C of the base tape 13, and preventing tearing from occurring in the waste portion 31 away from the outer edge 34. By preventing tearing from the outer edge 34 of the waste portion 31 in the direction of the center line C and preventing tearing from occurring in the waste portion 31 away from the outer edge 34, even if the base tape 13 is made thin or a material with a lower tensile strength is used for the base tape 13, the waste portion 31 can be peeled off smoothly, preventing the waste portion 31 from being left behind in the waste peeling portion of the tape 1 for processing electronic devices.

The outer edge 34, which extends from the outer periphery 33 surrounding a given label part 21-1 toward the other label part 21-2, has a turn section 50. By having the turn section 50, it is possible to form the outer edge 34 in a shape that conforms to the label part 21 while forming the outward portion 52. Therefore, it is possible to reliably connect the outer edges 34 between the label parts 34, regardless of the shape of the label part 21.

The curved portion 51 of the turn portion 50 is a curved portion that is arc-shaped in plan view. That is, the outward portion 52 extending from the base point 56 of the curved portion 51 toward the peripheral portion 41 is a curved portion that is arc-shaped in plan view. The radius of curvature of the curved portion that is arc-shaped in plan view is not particularly limited, but the lower limit is preferably R1.0 mm, and particularly preferably R2.0 mm, in order to more reliably prevent tearing from the outer edge 34 toward the center line C of the base tape 13 in the space portion 32 of the waste portion 31. On the other hand, the upper limit of the radius of curvature of the curved portion 51 can be appropriately selected depending on the dimensions of the tape 1 for processing electronic devices, but for example, R20 mm is preferable in terms of minimizing the distance between the label portions.

The curved portion 61 of the turn portion 60 is a curved portion that is arc-shaped in plan view. That is, the outward portion 62 extending from the base point 66 of the curved portion 61 toward the peripheral portion 41 is a curved portion that is arc-shaped in plan view. The radius of curvature of the curved portion that is arc-shaped in plan view is not particularly limited, but the lower limit is preferably R1.0 mm, and particularly preferably R2.0 mm, in order to more reliably prevent tearing from the outer edge 34 toward the center line C of the base tape 13 in the space portion 32 of the waste portion 31. On the other hand, the upper limit of the radius of curvature of the curved portion 61 can be appropriately selected depending on the dimensions of the tape 1 for processing electronic devices, but for example, R20 mm is preferable in terms of minimizing the distance between the label portions.

The distance L1, in a direction parallel to the conveying direction D, between the tip 53 of the outer edge 34 extending from the outer periphery 33 surrounding a specified label portion 21-1 toward the other label portion 21-2 and the tip 63 of the outer edge 34 extending from the outer periphery 33 surrounding the other label portion 21-2 toward the specified label portion 21-1, is not particularly limited, but the lower limit is preferably 0.1 mm, more preferably 0.2 mm, and particularly preferably 0.5 mm, in order to more reliably prevent the occurrence of a tear from the outer edge 34 of the waste portion 31 in the direction of the center line C of the base tape 13. On the other hand, the upper limit of the distance L1 between the tip 53 and the tip 63 is preferably 10 mm, more preferably 7.0 mm, and particularly preferably 5.0 mm, in order to ensure a more reliable tear between the outer edge 34 extending from the outer periphery 33 surrounding the specified label part 21-1 toward the other label part 21-2 and the outer edge 34 extending from the outer periphery 33 surrounding the other label part 21-2 toward the specified label part 21-1.

The angle θ between the imaginary line D1 parallel to the conveying direction D passing through the tip 53 of the outer edge 34 extending from the outer periphery 33 surrounding the specified label part 21-1 toward the other label part 21-2 and the outward part 52 at the tip 53 is not particularly limited, but the lower limit is preferably 10°, more preferably 20°, and particularly preferably 30°, in order to ensure that the tear from the tip 63 of the outer edge 34 extending from the outer periphery 33 surrounding the other label part 21-2 toward the specified label part 21-1 reaches the outward part 52 more reliably. On the other hand, the upper limit of the angle θ is preferably 150°, and particularly preferably 130°, in order to ensure smooth scrap removal processing by preventing a large tension acting on the base film 14 when scrap removal approaches the vicinity of the tip 53 from the tip 63, causing a tear to occur at a position shifted from the expected tear position, and the tip of the scrap part 31 remaining.

The distance between the tip 53 of the outer edge 34 extending from the outer periphery 33 surrounding the specified label part 21-1 toward the other label part 21-2 and the tip 63 of the outer edge 34 extending from the outer periphery 33 surrounding the other label part 21-2 toward the specified label part 21-1 in the direction perpendicular to the conveying direction D is not particularly limited, but is preferably 0.1 mm or more and 10 mm or less, more preferably 0.2 mm or more and 7.0 mm or less, and particularly preferably 0.5 mm or more and 5.0 mm or less, in order to ensure more reliable tearing between the outer edge 34 extending from the outer periphery 33 surrounding the specified label part 21-1 toward the other label part 21-2 and the outer edge 34 extending from the outer periphery 33 surrounding the other label part 21-2 toward the specified label part 21-1, and to ensure more reliable smooth peeling of the waste part 31.

Next, a method for forming the partitions of the label portion 21, waste portion 31, and peripheral portion 41 on the base tape 13 will be described. A method for forming the partitions of the label portion 21 to which the semiconductor wafer is attached, the waste portion 31 surrounding the outer edge 22 of the label portion 21 in a plan view, and the peripheral portion 41 in contact with the outer edge 34 of the waste portion 31 and located on the edge of the base tape 13 on the base tape 13 includes, for example, a method of precutting the base tape 13 using a rotary punching blade. In this case, the partitions of the label portion 21, waste portion 31, and peripheral portion 41 are formed by cut lines provided on the base tape 13.

The electronic device processing tape having the waste portion 31 for forming the electronic device processing tape 1 can be partitioned into the label portion 21, waste portion 31, and peripheral portion 41 by precutting the base tape 13 using a rotary punching blade 100 having the blade pattern shown in FIG. 4, and turn portions 50, 60 can be formed in the spaced portion 32 of the waste portion 31. The rotary punching blade 100 is attached by wrapping it around the outer surface of a cylindrical roll (not shown), and the cylindrical roll is rotated while pressing the base tape 13 against the rotary punching blade 100, thereby precutting the base tape 13. One precut label portion 21 is formed by one rotation of the cylindrical roll.

As shown in FIG. 4, the rotary punching blade 100 includes a label forming blade 110 for forming the outer edge 22 of the label portion 21 in plan view, and a waste portion forming blade 120 for forming the outer edge 34 of the waste portion 31, which is provided on the outer periphery of the label portion forming blade 110. In the electronic device processing tape 1, the label portion forming blade 110 is circular in shape to correspond to the circular shape of the label portion 21 in plan view.

The waste portion forming blade 120 has a turn portion forming blade 121 for forming the turn portion 50, a turn portion forming blade 122 for forming the turn portion 60, and a peripheral portion outer edge forming blade 123 for forming the outer edge 34 of the peripheral portion 33 surrounding the label portion 21. The turn portion forming blade 121 is formed in a position facing the turn portion forming blade 122. The peripheral portion outer edge forming blade 123 is connected to the turn portion forming blade 121 and the turn portion forming blade 122. The turn portion forming blade 121 is connected to the turn portion forming blade 122 via the peripheral portion outer edge forming blade 123.

The tip 53 of the outer edge 34 extending from the outer periphery 33 surrounding the specified label part 21-1 toward the other label part 21-2 is located closer to the peripheral part 41 than the tip 63 of the outer edge 34 extending from the outer periphery 33 surrounding the other label part 21-2 toward the specified label part 21-1. In response to this, the spacing S1 of the turn part forming blades 121 is set wider than the spacing S2 of the turn part forming blades 122.

In response to the formation of the curved portion 51 in the turn portion 50, the turn portion forming blade 121 is provided with a curved portion 124 in the extension direction of the turn portion forming blade 121. The radius of curvature of the curved portion 124 corresponds to the radius of curvature of the curved portion 51 of the turn portion 50. Furthermore, in response to the formation of the outward portion 52 in the curved portion 51 of the turn portion 50, the curved portion 124 of the turn portion forming blade 121 is provided with an outward portion 125 that extends outward.

In response to the formation of the curved portion 61 in the turn portion 60, the turn portion forming blade 122 is provided with a curved portion 224 in the extension direction of the turn portion forming blade 122. The radius of curvature of the curved portion 224 corresponds to the radius of curvature of the curved portion 61 in the turn portion 60. Furthermore, in response to the formation of the outward portion 62 in the curved portion 61 of the turn portion 60, the curved portion 224 of the turn portion forming blade 122 is provided with an outward portion 225 that extends outward.

During the first rotation of the rotary punching blade 100, the label portion forming blade 110 forms the specified label portion 21-1, the outer edge 34 of the outer periphery 33 surrounding the specified label portion 21-1 is formed by the outer peripheral edge forming blade 123, and the turn portion 50 is formed by the turn portion forming blade 121. During the second rotation of the rotary punching blade 100, the turn portion 60 is formed by the turn portion forming blade 122 near the portion where the turn portion 50 is formed, and another label portion 21-2 adjacent to the specified label portion 21-1 is formed by the label portion forming blade 110, and the outer edge 34 of the outer periphery 33 surrounding the other label portion 21-2 is formed by the outer peripheral edge forming blade 123. By repeating the above precut processing operation, the label portion 21, the waste portion 31, and the peripheral portion 41 can be continuously divided into sections on the base tape 13.

In the electronic device processing tape 1 according to the first embodiment shown in Figures 2 and 3, the tip 53 of the outer edge 34 extending from the outer periphery 33 surrounding the specified label part 21-1 toward the other label part 21-2 in the space 32 of the waste part 31 is located toward the peripheral part 41 from the tip 63 of the outer edge 34 extending from the outer periphery 33 surrounding the other label part 21-2 toward the specified label part 21-1. However, as shown in Figure 5, the electronic device processing tape 2 may have the tip 53 of the outer edge 34 extending from the outer periphery 33 surrounding the specified label part 21-1 toward the other label part 21-2 and the tip 63 of the outer edge 34 extending from the outer periphery 33 surrounding the other label part 21-2 toward the specified label part 21-1 in the space 32 of the waste part 31 parallel to the conveying direction D.

Note that FIG. 5 is an enlarged plan view of the electronic device processing tape according to the first embodiment of the present invention before the waste removal process, which differs from FIGS. 2 and 3 in that the leading edge 53 and the leading edge 63 are positioned parallel to the transport direction D.

That is, in the electronic device processing tape 2 according to the first embodiment shown in FIG. 5, the end of the outer edge 34 extending from the outer periphery 33 surrounding the specified label portion 21-1 toward the other label portion 21-2 (i.e., extending from one direction) and the end of the outer edge 34 extending from the outer periphery 33 surrounding the other label portion 21-2 toward the specified label portion 21-1 (i.e., extending from the other direction) are positioned parallel to the conveying direction D. From the above, the tip 53 and the tip 63 are in the same position in the width direction of the base tape 13.

In the electronic device processing tape 2, the spacing S1 of the turn portion forming blade 121 of the rotary punching blade 100 and the spacing S2 of the turn portion forming blade 122 are set to the same spacing, so that the tip 53 and the tip 63 can be set at the same position in the width direction of the base tape 13.

In the gap 32 of the waste portion 31, the tip 53 of the outer edge 34 extending from the outer periphery 33 surrounding the specified label portion 21-1 toward the other label portion 21-2 and the tip 63 of the outer edge 34 extending from the outer periphery 33 surrounding the other label portion 21-2 toward the specified label portion 21-1 are positioned parallel to the conveying direction D, so that, as with the electronic device processing tape 1, tearing from the tip 63 to the tip 53 is smoothed during the waste removal process in which the waste portion 31 of the base tape 13 is peeled off by a winding means or the like. Therefore, even if tension is applied to the waste portion 31, a tear is prevented from occurring from the outer edge 34 of the waste portion 31 in the direction of the center line C of the base tape 13, and a tear is also prevented from occurring in the waste portion 31 away from the outer edge 34.

From the above, in the electronic device processing tape of the present invention, it is sufficient that the tip 63 of the outer edge 34 extending from the outer periphery 33 surrounding the other label part 21-2, located upstream of the scrap removal process, toward the specified label part 21-1, is not located further in the direction of the peripheral part 41 than the tip 53 of the outer edge 34 extending from the outer periphery 33 surrounding the specified label part 21-1, located downstream of the scrap removal process, toward the other label part 21-2.

Next, we will explain an example of a method for manufacturing tape 1 for electronic device processing.

First, a primary precut is performed on the laminate in which the adhesive layer 12 is applied to the main surface 61 of the release film 11, using a rotary punch blade to form a precut on the adhesive layer 12. After the primary precut, unnecessary portions of the adhesive layer 12 (portions other than the portion corresponding to the label portion 21) are removed. Separately, a base tape 13 is prepared as a laminate structure in which an adhesive layer 15 is applied to the main surface 71 of a base film 14. Next, the adhesive layer 15 is placed opposite the adhesive layer 12 from which the unnecessary portions have been removed, and the base tape 13 is laminated to the release film 11 and adhesive layer 12, so that the base tape 13 is superimposed on the release film 11.

Next, a rotary punching blade 100 arranged opposite the base tape 13 is used to perform a secondary precut on the base tape 13 to form a partition (cut line) between the label portion 21 to which the semiconductor wafer is attached, the waste portion 31 surrounding the outer edge 22 of the label portion 21 in a plan view, and the peripheral portion 41 that contacts the outer edge 34 of the waste portion 31 and is located at the edge of the base tape 13. In the secondary precut, turn portions 50 and 60, which are cut lines, are also formed in the spaced portion 32 of the waste portion 31. In the secondary precut, the tip 53 of the outer edge 34, which is a cut line extending from the outer periphery 33 surrounding a specified label portion 21-1 toward the other label portion 21-2, and the tip 63 of the outer edge 34, which is a cut line extending from the outer periphery 33 surrounding the other label portion 21-2 toward the specified label portion 21-1, are formed at predetermined positions in the spaced portion 32 of the waste portion 31. In addition, in the secondary precut, the outer edge 34, which is the cut line of the outer periphery 33 of the waste portion 31 surrounding the specified label portion 21-1, does not intersect with the outer edge 34, which is the cut line of the outer periphery 33 of the waste portion 31 surrounding the other label portion 21-2.

Next, a waste removal process is performed in which the waste portion 31 of the base tape 13 is peeled off using a winding means or the like to form a waste removal portion. This allows the tape 1 for processing electronic devices to be manufactured.

Next, an example of how to use the electronic device processing tape of the present invention will be described. Here, an example of how to use the electronic device processing tape of the present invention will be described using the electronic device processing tape 1 according to the first embodiment. Note that FIG. 6 is an explanatory diagram of an example of how to use the electronic device processing tape according to the first embodiment of the present invention.

As shown in FIG. 6, first, the rolled electronic device processing tape 1 is pulled out from the roll of electronic device processing tape 1 by a release film take-up roller 200. A peeling means 201 is provided on the pull-out path of the electronic device processing tape 1, and only the release film 11 is peeled off from the electronic device processing tape 1 with the tip of the peeling means 201 as the turning point. The peeled off release film 11 is taken up by the release film take-up roller 200, which has the function of pulling out the electronic device processing tape 1 from the roll.

A laminating section 202 is provided beyond the peeling means 201. A semiconductor wafer W and a ring frame 205 surrounding the semiconductor wafer W are placed on the upper surface of the laminating section 202. The laminate of the adhesive layer 12 and the base tape 13 from which the release film 11 has been peeled off is guided onto the semiconductor wafer W facing the adhesive layer 12, and the semiconductor wafer W is laminated to the adhesive layer 12 by a laminating roller 203.

Next, with the laminate of the adhesive layer 12 and the base tape 13 attached to the semiconductor wafer W and the ring frame 205, the semiconductor wafer W is diced to form semiconductor chips (not shown). After dicing to form the semiconductor chips, the base tape 13 is subjected to a curing process such as ultraviolet irradiation to cure the adhesive component constituting the adhesive layer 15 of the base tape 13, thereby reducing the adhesive strength of the adhesive component. When the adhesive strength of the adhesive layer 15 is reduced, the adhesive layer 12 is smoothly peeled off from the adhesive layer 15, and the semiconductor chip is picked up with the adhesive layer 12 attached to the back surface of the semiconductor chip. The adhesive layer 12 attached to the back surface of the semiconductor chip functions as a die bonding film when the semiconductor chip is bonded to a lead frame, a package substrate, or another semiconductor chip.

Next, other embodiments of the electronic device processing tape of the present invention will be described. In the above-mentioned first embodiment of the electronic device processing tape 1, 2, the planar shape of the turn portion 50, 60 has a curved portion 51, 61, but instead, the planar shape of the turn portion 50, 60 may have a straight portion.

In the electronic device processing tapes 1 and 2 according to the first embodiment, the outer edge 34 extending from the outer periphery 33 surrounding the specified label portion 21-1 toward the other label portion 21-2 has a turn portion 50 extending from the tip 53, which is the end, toward the center line C of the base tape 13 parallel to the conveying direction D. Alternatively, the turn portion 50 extending from the tip 53 toward the center line C of the base tape 13 may not be included. If the turn portion 50 is not included, the outer edge 34 extending from the outer periphery 33 surrounding the specified label portion 21-1 toward the other label portion 21-2 has a shape that extends from the tip 53 toward the specified label portion 21-1 in the gap portion 32 parallel to the conveying direction D.

In addition, in the electronic device processing tapes 1 and 2 according to the first embodiment, the adhesive layer 12 is provided between the release tape 11 and the base tape 13. Alternatively, as shown in FIG. 7, the electronic device processing tape 3 may have no adhesive layer 12 between the release tape 11 and the base tape 13. In the electronic device processing tape 3, the adhesive layer 15 of the base tape 13 is in direct contact with the release tape 11 even in the label portion 21.

The electronic device processing tape of the present invention can facilitate peeling off of waste even when the base tape is made thin or a material with reduced tensile strength is used for the base tape, making it highly useful, for example, in the field of dicing and bonding integrated films.

REFERENCE SIGNS LIST 1, 2, 3 Tape for processing electronic devices 11 Release film 12 Adhesive layer 13 Base tape 14 Base film 15 Pressure-sensitive adhesive layer 50, 60 Turn portion 53, 63 Tip

Claims (9)

A release film;
A tape for processing electronic devices comprising a base tape having a pressure-sensitive adhesive layer formed on a main surface of a base film, the base tape being laminated with the release film,
the base tape comprises: label portions having a predetermined shape in plan view, which are formed at predetermined intervals in a feed direction of the tape for processing electronic devices; a waste removal portion which surrounds the outer side of the label portion in plan view and has a space portion which forms the predetermined space; and a peripheral portion which contacts an outer edge of the waste removal portion in plan view;
a cut line forming an outer edge of the waste portion extending from the front in the conveying direction and a cut line forming an outer edge of the waste portion extending from the rear in the conveying direction do not intersect with each other;
In the gap portion of the waste portion, an end of the cut line extending from one direction is located at the same position or in the direction of the peripheral portion with respect to an end of the cut line extending from the other direction in a direction perpendicular to the conveying direction ,
In the gap portion of the waste portion, the cut line extending from one direction has a turn portion extending from the end toward the center line of the base tape parallel to the conveying direction, and the cut line extending from the other direction has a turn portion extending from the end toward the center line of the base tape parallel to the conveying direction . 2. The tape for processing electronic devices according to claim 1 , wherein the turn portion has a curved portion in a plan view. 3. The tape for processing electronic devices according to claim 2 , wherein the turn portion has a curved portion in a plan view that is an arcuate curved portion having a radius of curvature of R 1.0 mm or more. 2. The tape for processing electronic devices according to claim 1 , wherein the turn portion has a straight portion in a plan view. 5. The tape for processing electronic devices according to claim 1, wherein the distance between an end of the cut line extending from one direction and an end of the cut line extending from the other direction in a direction parallel to the conveying direction is 0.1 mm or more and 10 mm or less. 6. The tape for processing electronic devices according to claim 1, wherein an angle θ between a virtual line passing through an end of the cut line extending from one direction and a tip of the cut line extending from one direction, the virtual line being parallel to the conveying direction, is 10 ° or more and 150° or less. 7. The tape for processing electronic devices according to claim 1, wherein an end of the cut line extending from one direction is located closer to the peripheral portion than an end of the cut line extending from the other direction, and a distance between the end of the cut line extending from one direction and the end of the cut line extending from the other direction in a direction perpendicular to the conveying direction is 0.1 mm or more and 10 mm or less. Further comprising an adhesive layer provided on a portion of the main surface of the release film,
8. The tape for processing electronic devices according to claim 1, wherein the base tape covers the adhesive layer and is in contact with the release film around the periphery of the adhesive layer. A step of applying an adhesive layer onto a substrate film to prepare a substrate tape;
laminating the base tape with a release film;
The base tape is partitioned into a label portion having a predetermined shape in a plan view, the label portion being formed at a predetermined interval in the transport direction of the base tape, a waste portion surrounding the outer side of the label portion in a plan view and having a spaced portion forming the predetermined space, and a peripheral portion in contact with the outer edge of the waste portion in a plan view, and a cut line forming the outer edge of the waste portion extending from the front in the transport direction and a cut line forming the outer edge of the waste portion extending from the rear in the transport direction do not intersect, and at the spaced portion of the waste portion, an end of the cut line extending from one direction intersects with a cut line extending from the other direction. a step of performing a precut using a rotary punch blade, the precut being located in a direction toward the peripheral portion from an end of a cut line, or an end of the cut line extending from one direction and an end of the cut line extending from the other direction being parallel to the conveying direction, and the cut line extending from one direction has a turn portion extending from the end toward a center line of the base tape parallel to the conveying direction in the gap portion of the waste portion, and the cut line extending from the other direction has a turn portion extending from the end toward a center line of the base tape parallel to the conveying direction;
a step of removing the waste portion to form a waste-removed portion on the base tape;
A method for producing a tape for processing electronic devices comprising the steps of:

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