JP7536716B2 - Tape for processing electronic devices and method for producing tape for processing electronic devices - Google Patents

Description

The present invention relates to a tape for processing electronic devices, and in particular to a tape for processing electronic devices used in dicing and picking up semiconductor wafers, and a method for manufacturing the tape for processing electronic devices.

As a tape for processing semiconductor wafers, a dicing tape in which a plurality of label sections having a predetermined shape in plan view are formed at predetermined intervals on a long length of base tape, or an electronic device processing tape equipped with a die bonding film is used. An adhesive layer is provided on the base tape in a portion corresponding to the label section. The semiconductor wafer is positioned on the label section of the base tape by attaching the semiconductor wafer to the label section on which the adhesive layer is provided. The positioned semiconductor wafer is diced while attached to the label section to manufacture semiconductor chips. The manufactured semiconductor chips are picked up from the label section by reducing the adhesive strength of the adhesive layer through a curing process using ultraviolet light, etc.

As an example of a semiconductor wafer processing tape in which multiple label parts are formed at predetermined intervals on a base tape, a semiconductor wafer processing tape has been disclosed in which a predetermined precut process is applied to the semiconductor wafer processing tape, and unnecessary parts between the label parts arranged at predetermined intervals are peeled off and removed along the cut lines of the precut process (Patent Document 1).

In this way, the base tape is divided by the cut lines formed by the precut process into a label section to which the semiconductor wafer is attached, a waste section that is an unnecessary section that surrounds the outer side of the label section in a plan view, and a peripheral section that contacts the outer edge of the waste section in a plan view. The precut process is performed on the base film and the adhesive layer provided on the surface of the base film using a rotary punch blade that is arranged opposite the base tape (Patent Document 2).

In addition, before the semiconductor wafer is diced, the waste portion of the base tape is peeled off from the electronic device processing tape by a waste removal process in which the base tape is wound up in the longitudinal direction (the transport direction of the base tape) by a winding means. Therefore, with the waste portion of the base tape removed, the electronic device processing tape is set in the semiconductor wafer lamination machine.

The material and thickness of the base tape are optimized from the viewpoint of the electronic device processing process, such as expandability and pick-up properties, and the conditions under which the tape for electronic device processing is used. Therefore, when removing residue from the base tape from the tape for electronic device processing, the following problems can occur.

As described above, a rotary punch blade is used in the precut process for forming cut lines in the base tape. When a continuous cut line is formed in a long base tape, an intersection is formed where a cut line extending from one direction and a cut line extending from the other direction cross each other in the longitudinal direction of the base tape at the gap between the label portions. However, depending on the thickness and material of the base tape and the cutting state of the cut line, when performing a waste removal process for removing waste from a cut line extending from one direction toward a cut line extending from the other direction, the waste removal may derail from the cut line starting from the intersection where the cut lines cross, making it impossible to smoothly remove the waste along the cut line. In particular, the cutting state of a continuous cut line is almost the same, but at an intersection where multiple cut lines cross, the cutting state of the cut line extending from one direction may not match the cutting state of the cut line extending from the other direction, and cut lines with different cutting states may cross at the intersection. If the cutting state of the cut line extending from one direction does not match the cutting state of the cut line extending from the other direction, the scrap removal may derail from the cut line starting from the intersection point where the cut lines intersect. If the cutting state of the cut line extending from one direction differs from the cutting state of the cut line extending from the other direction, causing the scrap removal to derail from the cut line, the tension applied to the scrap when the scrap of the base tape is peeled off may cause large tears to occur in the scrap, especially in the scrap between the label parts formed at a predetermined interval, and in some cases the scrap may break between the label parts, making it difficult to peel the scrap off smoothly from the tape for processing electronic devices.

JP 2011-111530 A JP 2014-017357 A

In view of the above circumstances, the present invention aims to provide a tape for processing electronic devices and a method for manufacturing such a tape, which prevents the scrap removal from derailing from the cut line starting from the intersection of the precut cut lines and smoothly peels off the scrap, thereby preventing the scrap from being left behind in the scrap removal area.

The gist and configuration of the present invention are as follows.
[1] a release film;
A tape for processing electronic devices comprising a base tape having a pressure-sensitive adhesive layer formed on a main surface of a base film, the base tape being laminated with a release film,
the base tape comprises: label portions having a predetermined shape in plan view, which are formed at predetermined intervals in a feed direction of the tape for processing electronic devices; a waste removal portion which surrounds the outer side of the label portion in plan view and has a space portion which forms the predetermined space; and a peripheral portion which contacts an outer edge of the waste removal portion in plan view;
a cut line that forms an outer edge of the waste portion and that extends from the front in the conveying direction and a cut line that forms an outer edge of the waste portion and that extends from the rear in the conveying direction have an intersection point at the interval portion of the waste portion,
A tape for processing electronic devices, in which a first cut line extension portion of the cut line extending from the intersection to the end thereof is positioned in the direction of the peripheral portion rather than a virtual line extending from the intersection in a direction parallel to the conveying direction.
[2] The tape for processing electronic devices described in [1], wherein in the gap portion of the waste portion, at least one of the cut lines extending from one direction and the cut lines extending from the other direction has a turn portion extending from the intersection point in the direction of the center line of the base tape parallel to the conveying direction and in a direction away from the end of the cut line.
[3] A tape for processing electronic devices as described in [1] or [2], wherein the angle θ1 between the first cut line extension portion and the virtual line at the intersection is greater than the angle θ2 between the cut line extending from another direction of a position opposite the first cut line extension portion via the virtual line and the virtual line.
[4] The tape for processing electronic devices described in any one of [1] to [3], wherein the first cut line extension portion has a length of 0.5 mm or more.
[5] The tape for processing electronic devices described in [2], wherein the angle θ3 between the turn portion of the cut line extending from one direction and the virtual line at the intersection is greater than the angle θ2 between the cut line extending from the other direction at a position opposite the first cut line extension portion via the virtual line and the virtual line.
[6] The tape for processing electronic devices according to claim [2] or [5], wherein the turn portion has a curved portion in a plan view.
[7] The tape for processing electronic devices according to [6], wherein the curved portion of the turn portion in plan view has a portion that is an arc-shaped curved portion with a curvature radius of R1.0 mm or more.
[8] The tape for processing electronic devices according to [2] or [5], wherein the turn portion has a straight portion in a plan view.
[9] The tape for processing electronic devices described in any one of [1] to [8], wherein the cut line extending from the other direction has a second cut line extension portion extending from the intersection to the terminal end.
[10] Further comprising an adhesive layer provided on a part of the main surface of the release film,
The tape for processing electronic devices according to any one of [1] to [9], wherein the base tape covers the adhesive layer and is in contact with the release film around the periphery of the adhesive layer.
[11] A step of applying a pressure-sensitive adhesive layer onto a substrate film to prepare a substrate tape;
laminating the base tape with a release film;
a step of performing a precut using a rotary punch blade, the precutting forming a partition on the base tape consisting of label portions having a predetermined shape in plan view, the label portions being formed at predetermined intervals in a transport direction of the base tape, waste portions surrounding the outer sides of the label portions in plan view and having a spaced portion forming the predetermined space, and a peripheral portion in contact with an outer edge of the waste portion in plan view, the precutting forming a partition on the base tape consisting of a label portion having a predetermined shape in plan view and formed at a predetermined space in a transport direction of the base tape, the label portion being formed at a predetermined space in a transport direction of the base tape, the waste portion having a spaced portion surrounding the outer sides of the label portions in plan view and having a spaced portion forming the predetermined space in a transport direction of the base tape, the precutting forming a partition on the base tape consisting of a label portion having a predetermined shape in plan view and a waste portion having a spaced portion forming the predetermined space in a transport direction of the base tape, the precutting forming a partition on the base tape consisting of a label portion having a predetermined shape in plan view and ...
a step of removing the waste portion to form a waste-removed portion on the base tape;
A method for producing a tape for processing electronic devices comprising the steps of:

According to the aspect of the electronic device processing tape of the present invention, the cut line forming the outer edge of the waste portion extending from the front of the transport direction of the electronic device processing tape and the cut line forming the outer edge of the waste portion extending from the rear of the transport direction have an intersection point where they intersect at the gap between the waste portions, and the first cut line extension portion of the cut line extending from one direction from the intersection point to the end is located in the direction of the peripheral portion that is in contact with the outer edge of the waste portion, rather than a virtual line extending from the intersection point in a direction parallel to the transport direction. Therefore, when the waste lifting process is performed in a direction in which the intersection point of the cut line extending from one direction is upstream of the end point, the waste lifting can be prevented from derailing from the cut line starting from the intersection point, and the waste portion can be smoothly peeled off, thereby preventing the waste portion from being left behind in the waste peeling portion.

According to an embodiment of the electronic device processing tape of the present invention, at least one of the cut lines extending from one direction and the cut lines extending from the other direction in the gaps between the waste portions has a turn portion extending from the intersection toward the center line of the base tape parallel to the transport direction and away from the end of the cut line, making it easier to form the cut line in a shape that follows the label portion while arranging the end of the cut line extending from one direction more peripherally than the intersection.

According to the aspect of the electronic device processing tape of the present invention, the angle θ1 between the first cut line extension and the virtual line at the intersection is greater than the angle θ2 between the cut line extending from the other direction opposite the first cut line extension via the virtual line and the virtual line. This more reliably prevents the scrap removal from derailing from the cut line starting from the intersection, and allows the scrap removal process to be performed smoothly from the cut line extending from one direction along the cut line extending from the other direction via the intersection. As a result, it is more reliably prevented that the scrap portion is left behind in the scrap removal area.

According to the aspect of the electronic device processing tape of the present invention, the first cut line extension portion has a length of 0.5 mm or more, and by reliably intersecting the cut line extending from one direction with the cut line extending from the other direction, the scrap removal process can be performed more smoothly along the cut line, and scraps are more reliably prevented from being left in the scrap removal area.

According to the aspect of the electronic device processing tape of the present invention, the angle θ3 between the turning portion of the cut line extending from one direction at the intersection and the imaginary line is greater than the angle θ2, which more reliably prevents the scrap removal from derailing from the cut line starting from the intersection, and as a result, more reliably prevents the scrap portion from being left behind in the scrap removal portion.

1 is a cross-sectional view showing an outline of a laminated structure of a tape for processing electronic devices according to a first embodiment of the present invention before a waste removing process. 1 is an explanatory diagram showing an outline of a plan view of a tape for processing electronic devices according to a first embodiment of the present invention before a waste removing process; 1 is an enlarged schematic plan view of a tape for processing electronic devices according to a first embodiment of the present invention before a waste removing process; 1 is an explanatory diagram showing an overview of a rotary punching blade that performs precut processing on an electronic device processing tape according to a first embodiment of the present invention; FIG. 1 is an enlarged schematic plan view of a tape for processing electronic devices according to a first embodiment of the present invention before a waste removing process; 1A to 1C are explanatory diagrams illustrating an example of a method of using the tape for processing electronic devices according to the first embodiment of the present invention. FIG. 11 is a cross-sectional view showing an outline of a laminated structure of a tape for processing electronic devices according to another embodiment of the present invention before a waste removing process.

First, the electronic device processing tape according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing an outline of the laminated structure of the electronic device processing tape according to the first embodiment of the present invention before the waste removal process. FIG. 2 is an explanatory diagram showing an outline of the plan view of the electronic device processing tape according to the first embodiment of the present invention before the waste removal process. FIG. 3 is an enlarged view showing an outline of the plan view of the electronic device processing tape according to the first embodiment of the present invention before the waste removal process.

As shown in FIG. 1, the electronic device processing tape 1 according to the first embodiment of the present invention is a laminate of a release film 11, an adhesive layer 12 provided on a portion of the main surface 61 of the release film 11, and a base tape 13 that covers the adhesive layer 12 and contacts the release film 11 around the adhesive layer 12. As described below, the base tape 13 is a laminated structure in which an adhesive layer 15 is formed on the main surface 71 of a base film 14.

The release film 11 has a rectangular, long shape, and is formed so that its length in the longitudinal direction is sufficiently longer than its length in the direction perpendicular to the longitudinal direction (width direction). The release film 11 functions as a support during the manufacture and use of the electronic device processing tape 1. When laminating a semiconductor wafer to the electronic device processing tape 1, the release film 11 is peeled off from the electronic device processing tape 1. The release film 11 is peeled off, and the semiconductor wafer is laminated to the adhesive layer 12 exposed, thereby positioning the semiconductor wafer.

Examples of materials for the release film 11 include polyester-based polymers such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene naphthalate (PEN), and polyolefin-based polymers such as polyethylene (PE) and polypropylene (PP). The thickness of the release film 11 is not particularly limited and can be appropriately selected depending on the conditions of use of the tape 1 for processing electronic devices, and can be, for example, 25 μm to 50 μm. The width dimension of the release film 11 is also not particularly limited and can be appropriately selected depending on the conditions of use of the tape 1 for processing electronic devices, such as the size of the semiconductor wafer, and can be, for example, 20 cm to 70 cm.

The adhesive layer 12 is provided in a partial region of the main surface 61 of the release film 11. The shape of the adhesive layer 12 in a plan view corresponds to the shape of the semiconductor wafer to be bonded to the adhesive layer 12 and diced in a plan view. In this specification, "plan view" refers to a state viewed from a position facing the main surface 61 of the release film 11 and the main surface 71 of the base film 14.

The adhesive layer 12 is disposed between the release film 11 and the base tape 13. The adhesive layer 12 is in contact with the adhesive layer 15 of the base tape 13, and when the semiconductor chip is picked up from the tape 1 for processing electronic devices, the adhesive layer 12 is peeled off from the adhesive layer 15 while still attached to the semiconductor chip.

The material of the adhesive layer 12 may be, for example, an epoxy resin, a (meth)acrylic resin, a phenolic resin, a polyurethane resin, a polyester resin, a polyimide resin, or a silicone resin. The thickness of the adhesive layer 12 is not particularly limited and may be appropriately selected depending on the conditions of use of the tape 1 for processing electronic devices, and may be, for example, 5 μm to 100 μm.

The base tape 13 is a laminated structure of the base film 14 and the adhesive layer 15, with the adhesive layer 15 formed over the entire main surface 71 of the base film 14, covering the entire adhesive layer 12 and contacting the release film 11 over the entire periphery of the adhesive layer 12. The base tape 13, like the release film 11, is rectangular and long, and is formed so that its length in the longitudinal direction is sufficiently longer than its length in the direction perpendicular to the longitudinal direction (width direction). The base tape 13 functions as a fixing means for the semiconductor wafer when the semiconductor wafer is diced.

Materials for the base film 14 include, for example, homopolymers or copolymers of α-olefins such as polyethylene, polypropylene, ethylene-propylene copolymers, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymers, ethylene-ethyl (meth)acrylate copolymers, ethylene-methyl (meth)acrylate copolymers, and ethylene-(meth)acrylic acid copolymers, or ionomers or mixtures of these polymers, polyesters such as polyethylene terephthalate and polymethyl (meth)acrylate, polycarbonate, polyurethane, styrene-ethylene-butene or pentene copolymers, and thermoplastic elastomers such as polyamide-polyol copolymers.

The thickness of the base film 14 is not particularly limited and can be appropriately selected depending on the conditions of use of the tape 1 for processing electronic devices, and can be, for example, 50 μm to 200 μm. The width dimension of the base film 14 is not particularly limited and can be appropriately selected depending on the conditions of use of the tape 1 for processing electronic devices, such as the size of the semiconductor wafer, and can be, for example, the same dimension as the width dimension of the release film 11. Specific examples of the width dimension of the base film 14 are 20 cm to 70 cm.

Examples of materials for the adhesive layer 15 include polypropylene resin, (meth)acrylic resin, polyester resin, polyurethane resin, and epoxy resin. In addition, an ultraviolet-curable compound may be added to the adhesive layer 15, so that the adhesive layer 15 can be easily peeled off from the adhesive layer 12 by curing the adhesive layer 15 through ultraviolet irradiation. Adding an ultraviolet-curable compound to the adhesive layer 15 improves the pick-up properties of the semiconductor chip.

As the UV-curable compound, for example, a compound having at least two photopolymerizable carbon-carbon double bonds (e.g., ethylenic double bonds) in the molecule that can be three-dimensionally reticulated by UV irradiation is used. Specific examples of the UV-curable compound include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and difunctional or higher (meth)acrylate monomers such as oligoester (meth)acrylate.

Specific examples of ultraviolet-curable compounds include urethane (meth)acrylate oligomers in addition to the above (meth)acrylate monomers. Urethane (meth)acrylate oligomers can be obtained by reacting a urethane prepolymer having an isocyanate group at the end, which is obtained by reacting a polyol compound such as a polyester or polyether type with a polyfunctional isocyanate compound (e.g., 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc.), with a (meth)acrylate compound having a hydroxyl group (e.g., 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, polyethylene glycol (meth)acrylate, etc.).

When a UV-curable compound is added, a photopolymerization initiator may be added as necessary to facilitate the photocuring of the UV-curable compound. Specific examples of photopolymerization initiators include isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecyl thioxanthone, dimethyl thioxanthone, diethyl thioxanthone, benzyl dimethyl ketal, α-hydroxycyclohexyl phenyl ketone, and 2-hydroxymethyl phenyl propane.

As shown in FIG. 2, before the waste portion 31 is peeled off, the base tape 13 of the electronic device processing tape 1 is divided into a label portion 21 to which a semiconductor wafer is attached, a waste portion 31 which is an unnecessary portion surrounding the outer edge 22 of the label portion 21 in a plan view, and a peripheral portion 41 which is in contact with the outer edge 34 of the waste portion 31 in a plan view and is located at the edge of the base tape 13 in the width direction. The base tape 13 is subjected to a waste removal process in which the waste portion 31 is peeled off, and the area which was the waste portion 31 becomes a waste peeling portion, thereby forming the electronic device processing tape 1 according to the first embodiment of the present invention. In the electronic device processing tape 1, the peripheral portion 41 is in contact with the outer edge of the waste peeling portion in a plan view. In the drawings explaining the electronic device processing tape 1 according to the first embodiment of the present invention, for convenience of explanation, the waste portion 31 is left without being peeled off. The portion of the base tape 13 that overlaps with the adhesive layer 12 in a plan view and, if necessary, the vicinity of the peripheral portion of the overlapping portion corresponds to the label portion 21. Therefore, the label portion 21 has a structure in which the release film 11, the adhesive layer 12, the adhesive layer 15, and the base film 14 are laminated in the above order. On the other hand, the waste portion 31 and the peripheral portion 41 do not have the adhesive layer 12. Therefore, the waste portion 31 and the peripheral portion 41 have a structure in which the release film 11, the adhesive layer 15, and the base film 14 are laminated in the above order.

In FIG. 2, before the waste portion 31 is peeled off, i.e., before it becomes the waste peeling portion, the electronic device processing tape 1 is wound into a roll.

The label portions 21 are formed at a predetermined interval along the transport direction D of the tape 1 for processing electronic devices. The shape and area of the label portions 21 in a plan view are not particularly limited, and for example, the shape and area of the label portions 21 generally correspond to the shape and area of the semiconductor wafer in a plan view to which the label portions 21 are bonded and diced in a plan view. In the tape 1 for processing electronic devices, the shape of the label portions 21 in a plan view is circular.

The waste portion 31 has an outer periphery 33 that surrounds the outer edge 22 of each label portion 21 in plan view, and a spacing portion 32 that forms a predetermined spacing between adjacent label portions 21. The outer edge 34 of the outer periphery 33 is a portion that extends along the outer edge 22 of the label portion 21 in plan view. The outer periphery 33 and the spacing portion 32 are formed continuously. As described above, the waste portion 31 surrounds the outside of the label portion 21 in plan view, and the outer periphery 33 that surrounds the outer edge 22 of each label portion 21 in plan view is continuous with the outer periphery 33 that surrounds the outer edge 22 of the other adjacent label portion 21 in plan view via the spacing portion 32.

3, the spacing portion 32 of the waste portion 31 is divided in the width direction by an outer edge 34 that extends from the outer periphery 33 surrounding a specific label portion 21-2 among the multiple label portions 21, 21, 21... toward the other label portion 21-1 adjacent to the specific label portion 21-2, and an outer edge 34 that extends from the outer periphery 33 surrounding the other label portion 21-1 adjacent to the specific label portion 21-2 (hereinafter sometimes simply referred to as the "other label portion 21-1"). Hereinafter, the outer edge 34 that extends from the outer periphery 33 surrounding the other label portion 21-1 toward the specific label portion 21-2 may be referred to as the first outer edge 34-1, and the outer edge 34 that extends from the outer periphery 33 surrounding the specific label portion 21-2 toward the other label portion 21-1 may be referred to as the second outer edge 34-2. In FIG. 3, the specified label portion 21-2 is the label portion 21 on the upstream side of the feed direction D of the tape 1 for processing electronic devices, and the other label portion 21-1 is the label portion 21 on the downstream side of the feed direction D of the tape 1 for processing electronic devices.

The first outer edge 34-1 extending from the outer periphery 33 surrounding the other label part 21-1 toward the specified label part 21-2 intersects with the second outer edge 34-2 extending from the outer periphery 33 surrounding the specified label part 21-2 toward the other label part 21-1 at the space 32 to form an intersection 35. That is, the outer edge 34 of the outer periphery 33 of the waste part 31 extending from the front in the transport direction D of the electronic device processing tape 1 and the outer edge 34 of the outer periphery 33 of the waste part 31 extending from the rear in the transport direction D intersect at the space 32 of the waste part 31.

The first outer edge 34-1 extending from the outer periphery 33 surrounding the other label part 21-1 toward the specified label part 21-2 extends beyond the second outer edge 34-2 toward the specified label part 21-2. The second outer edge 34-2 extending from the outer periphery 33 surrounding the specified label part 21-2 toward the other label part 21-1 extends beyond the first outer edge 34-1 toward the other label part 21-1. Therefore, the end (tip) 63 of the first outer edge 34-1 extending from the outer periphery 33 surrounding the other label part 21-1 toward the specified label part 21-2 is located in the direction of the specified label part 21-2 from the intersection 35. The first outer edge 34-1 has a first outer edge extension 62 extending from the intersection 35 to the end 63. Additionally, the end (tip) 53 of the second outer edge 34-2, which extends from the outer periphery 33 surrounding the specified label part 21-2 toward the other label part 21-1, is located toward the other label part 21-1 from the intersection 35. The second outer edge 34-2 has a second outer edge extension 52 that extends from the intersection 35 to the end 53.

As shown in FIG. 3, the first outer edge extension 62 of the first outer edge 34-1 is located in the direction of the peripheral portion 41 from the imaginary line L that extends from the intersection 35 and is parallel to the transport direction D of the tape 1 for processing electronic devices. From the above, the first outer edge extension 62 of the first outer edge 34-1 extends from the position of the imaginary line L toward the outside in the width direction of the base tape 13.

The second outer edge extension 52 of the second outer edge 34-2 is located in the direction of the peripheral portion 41 from the imaginary line L that extends from the intersection 35 and is parallel to the transport direction D of the tape 1 for processing electronic devices. From the above, the second outer edge extension 52 of the second outer edge 34-2 extends from the position of the imaginary line L toward the outside in the width direction of the base tape 13.

In FIG. 3, in order to form the electronic device processing tape 1, the scrap removal process in which the scrap portion 31 is peeled off from the base tape 13 is performed in the direction from the first outer edge 34-1 surrounding the other label portion 21-1 to the second outer edge 34-2 surrounding the specified label portion 21-2.

As shown in FIG. 3, in the space 32 of the waste portion 31, the first outer edge 34-1 extending from the outer periphery 33 surrounding the other label portion 21-1 toward the specified label portion 21-2 has a turn portion 60 extending from the intersection 35 toward the center line C of the base tape 13, which is parallel to the conveying direction D. The turn portion 60 of the first outer edge 34-1 is a portion having a different extension direction from the first outer edge 34-1 in the portion surrounding the other label portion 21-1. The turn portion 60 is formed in the space 32 of the waste portion 31. The first outer edge 34-1 extending into the space 32 along the other label portion 21-1 terminates from the center line C direction toward the peripheral portion 41 via the turn portion 60. This allows the first outer edge 34-1 to be formed into a shape that follows the other label portion 21-1, while the end 63 can be positioned closer to the peripheral portion 41 than the intersection 35. As described below, the first outer edge 34-1 extending from the outer periphery 33 surrounding the other label parts 21-1 including the turn part 60 toward the specified label part 21-2 is a pre-cut cutting line formed through the base tape 13. Note that the pre-cut cutting line does not have to be formed on the release film 11 and the adhesive layer 12.

The first outer edge 34-1, which extends from the outer periphery 33 surrounding the other label parts 21-1 including the turn part 60 toward the specified label part 21-2, is formed only in a portion outside the center line C of the base tape 13 parallel to the transport direction D of the tape 1 for processing electronic devices. In other words, the first outer edge 34-1 including the turn part 60 does not extend so as to cross the center line C of the base tape 13 parallel to the transport direction D. In addition, two turn parts 60 are formed per one space portion 32, and are arranged approximately symmetrically with respect to the center line C. The arrangement of the two turn parts 60 can be appropriately selected depending on the conditions of the waste removal process, and they do not have to be arranged approximately symmetrically with respect to the center line C.

The turn section 60 has a curved portion 61 in plan view. The curved portion 61 of the turn section 60 is an outward portion extending from the base point (the portion closest to the center line C) 66 of the curved portion 61 toward the peripheral portion 41. The outward portion of the curved portion 61 is a portion that extends from the center line C toward the outside in the width direction of the base tape 13 in the spacing portion 32, that is, from the center line C of the base tape 13 toward the edge portion perpendicular to the conveying direction D. In correspondence with the curved portion 61 in plan view of the turn section 60, the first outer edge extension portion 62 that is continuous with the turn section 60 has a curved portion in plan view.

As shown in FIG. 3, in the space 32 of the scum portion 31, the second outer edge 34-2 extending from the outer periphery 33 surrounding the specified label portion 21-2 toward the other label portion 21-1 has a turn portion 50 extending from the intersection 35 toward the center line C of the base tape 13 parallel to the conveying direction D. The turn portion 50 of the second outer edge 34-2 is a portion having a different extension direction from the second outer edge 34-2 in the portion surrounding the specified label portion 21-2. The turn portion 50 is formed in the space 32 of the scum portion 31. The second outer edge 34-2 extending to the space 32 along the specified label portion 21-2 terminates toward the peripheral portion 41 from the center line C direction via the turn portion 50. This allows the second outer edge 34-2 to be formed into a shape that follows the specified label portion 21-2, while the end 53 can be positioned closer to the peripheral portion 41 than the intersection 35. As described below, the second outer edge 34-2 extending from the outer periphery 33 surrounding the specified label part 21-2 including the turn part 50 toward the other label part 21-1 is a precut cutting line formed by penetrating the base tape 13. Note that the precut cutting line does not have to be formed on the release film 11 and the adhesive layer 12.

The second outer edge 34-2, which extends from the outer periphery 33 surrounding a given label part 21-2 including the turn part 50 toward the other label part 21-1, is formed only in a portion outside the center line C of the base tape 13 parallel to the transport direction D of the tape 1 for processing electronic devices. In other words, the second outer edge 34-2 including the turn part 50 does not extend so as to cross the center line C of the base tape 13 parallel to the transport direction D. In addition, two turn parts 50 are formed per one space portion 32, and are arranged approximately symmetrically with respect to the center line C. The arrangement of the two turn parts 50 can be appropriately selected depending on the conditions of the waste removal process, and they do not have to be arranged approximately symmetrically with respect to the center line C.

The turn section 50 has a planar shape that has a curved portion 51. The curved portion 51 of the turn section 50 is an outward portion that extends from the base point (the portion closest to the center line C) 56 of the curved portion 51 toward the peripheral portion 41. The outward portion of the curved portion 51 is a portion that extends in the spacing portion 32 from the center line C toward the outside in the width direction of the base tape 13, that is, from the center line C of the base tape 13 toward the edge portion perpendicular to the conveying direction D. In correspondence with the fact that the turn section 50 has a planar shape that has a curved portion 51, the second outer edge extension portion 52 that is continuous with the turn section 50 has a planar shape that has a curved portion.

In the electronic device processing tape 1, a cut line forming the outer edge 34 of the scum portion 31 extending from the front in the transport direction D of the electronic device processing tape 1 and a cut line forming the outer edge 34 of the scum portion 31 extending from the rear in the transport direction D have an intersection 35 where they intersect at the space portion 32 of the scum portion 31, and the first outer edge extension portion 62 of the cut line, which is the first outer edge 34-1 extending from one direction, from the intersection 35 to the end 63 is positioned in the direction of the peripheral portion 41 that is in contact with the outer edge 34 of the scum portion 31, rather than a virtual line L extending from the intersection 35 in a direction parallel to the transport direction D. As a result, when the scrap removal process is performed from the first outer edge 34-1 of the outer periphery 33 surrounding the other label part 21-1 in the direction toward the second outer edge 34-2 of the outer periphery 33 surrounding the specified label part 21-2, that is, when the scrap removal process is performed in a direction in which the intersection 35 of the cut line that is the first outer edge 34-1 extending from one direction is upstream of the end 63 of the first outer edge 34-1, it is possible to prevent the scrap removal from derailing from the outer edge 34 starting from the intersection 35. The intersection 35 is formed by the intersection of the cut line that is the first outer edge 34-1 extending from one direction and the cut line that is the second outer edge 34-2 extending from the other direction. The cut state of the cut lines is substantially the same for a single continuous cut line, but at the intersection 35, cut lines with different cut states intersect. Therefore, for example, if the cutting state of the cut line which is the first outer edge 34-1 extending from one direction is good and the cutting state of the cut line which is the second outer edge 34-2 extending from the other direction is somewhat poor, the scrap removal from the intersection 35 onwards may proceed along the first outer edge 34-1 and may not move to the second outer edge 34-2. During the scrap removal process, a pulling force acts on the base tape 13 in the longitudinal direction (i.e., the conveying direction D), so that tension acts on the outer edge 34 of the scrap part 31 of the base tape 13 in a direction parallel to the scrap removal direction and in a direction toward the center line C. Therefore, particularly when the first outer edge extension part 62 extending from the intersection 35 to the end 63 extends in the direction of the center line C more than the virtual line L parallel to the conveying direction D, the scrap removal is more likely to proceed along the first outer edge 34-1. In the electronic device processing tape 1, the first outer edge extension 62 of the first outer edge 34-1 is located outside the width direction of the base tape 13 from the virtual line L parallel to the transport direction D extending from the intersection 35. Therefore, the force to peel the base tape 13 is unlikely to act in the direction of the first outer edge extension 62, preventing the scrap removal from the intersection 35 onward from proceeding along the first outer edge 34-1, and allowing for a smooth transition from the cut line that is the first outer edge 34-1 to the cut line that is the second outer edge 34-2.

In addition, in the tape 1 for processing electronic devices, in the gap portion 32 of the waste portion 31, the cut line, which is the first outer edge 34-1 extending from one direction, has a turn portion 60 extending from the intersection 35 toward the center line C of the base tape parallel to the conveying direction D, and the cut line, which is the second outer edge 34-2 extending from the other direction, has a turn portion 50 extending from the intersection 35 toward the center line C of the base tape parallel to the conveying direction D. This allows the outer edge 34 to be formed in a shape that follows the label portion 21, while the ends 53 and 63 can be positioned closer to the peripheral portion 41 than the intersection 35.

The relationship between the angle θ1 between the first outer edge extension 62 of the first outer edge 34-1 at the intersection 35 and the virtual line L, and the angle θ2 between the second outer edge 34-2 (i.e., the turn portion 50 of the second outer edge 34-2) at the position opposite the first outer edge extension 62 at the intersection 35 via the virtual line L, and the virtual line L is not particularly limited, but it is preferable that the angle θ1 is larger than the angle θ2 in order to more reliably prevent the scrap lift from derailing from the outer edge 34 starting from the intersection 35. By more reliably preventing the scrap lift from derailing from the outer edge 34 starting from the intersection 35, the scrap lifting process can be performed smoothly along the cut line that is the second outer edge 34-2 that extends from the intersection 35 in the other direction from the cut line that is the first outer edge 34-1 extending from one direction, and as a result, the scrap portion 31 is more reliably prevented from being left in the scrap peeling portion.

The length of the first outer edge extension 62 is not particularly limited, but is preferably 0.5 mm or more, and particularly preferably 1.0 mm or more, in order to ensure that the cut line of the first outer edge 34-1 extending from one direction and the cut line of the second outer edge 34-2 extending from the other direction intersect. The upper limit of the length of the first outer edge extension 62 can be appropriately selected depending on the width dimension of the base tape 13, and is, for example, 2.0 mm. By ensuring that the cut line of the first outer edge 34-1 extending from one direction and the cut line of the second outer edge 34-2 extending from the other direction intersect, the scrap removal process can be performed more smoothly and as designed along the outer edge 34, and the scrap portion 31 is more reliably prevented from being left in the scrap peeling portion. Note that the "length of the first outer edge extension" means the length extended in a straight line when the first outer edge extension 62 has a bent portion.

The relationship between the angle θ3 and the angle θ2 between the turn portion 60 of the cut line, which is the first outer edge 34-1 extending from one direction at the intersection 35, and the imaginary line L is not particularly limited, but it is preferable that the angle θ3 is greater than the angle θ2 in order to more reliably prevent the scrap lift from derailing from the outer edge 34 starting from the intersection 35. By more reliably preventing the scrap lift from derailing from the outer edge 34 starting from the intersection 35, it is more reliably prevented that the scrap portion 31 is left behind in the scrap peeling portion.

In the tape 1 for electronic device processing, the curved portion 61 of the turn portion 60 is a curved portion that is an arc in plan view. That is, the outward portion extending from the base point 66 of the curved portion 61 toward the peripheral portion 41 is a curved portion that is an arc in plan view. The radius of curvature of the curved portion that is an arc in plan view is not particularly limited, but the lower limit is preferably R1.0 mm, and particularly preferably R2.0 mm, from the viewpoint of reliably preventing tearing from the first outer edge 34-1 in the spacing portion 32 of the waste portion 31 toward the center line C of the base tape 13. On the other hand, the upper limit of the radius of curvature of the curved portion 61 can be appropriately selected according to the dimensions of the tape 1 for electronic device processing, but for example, R20 mm is preferable from the viewpoint of minimizing the distance between the label portions 21.

In the tape 1 for electronic device processing, the curved portion 51 of the turn portion 50 is a curved portion that is arc-shaped in plan view. That is, the outward portion extending from the base point 56 of the curved portion 51 toward the peripheral portion 41 is a curved portion that is arc-shaped in plan view. The radius of curvature of the curved portion that is arc-shaped in plan view is not particularly limited, but the lower limit is preferably R1.0 mm, and particularly preferably R2.0 mm, from the viewpoint of reliably preventing tearing from the second outer edge 34-2 in the spacing portion 32 of the waste portion 31 toward the center line C of the base tape 13. On the other hand, the upper limit of the radius of curvature of the curved portion 51 can be appropriately selected according to the dimensions of the tape 1 for electronic device processing, but for example, R20 mm is preferable from the viewpoint of minimizing the distance between the label portions 21.

Next, a method for forming the partitions of the label portion 21, waste portion 31, and peripheral portion 41 on the base tape 13 will be described. A method for forming the partitions of the label portion 21 to which the semiconductor wafer is attached, the waste portion 31 surrounding the outer edge 22 of the label portion 21 in a plan view, and the peripheral portion 41 in contact with the outer edge 34 of the waste portion 31 and located on the edge of the base tape 13 in the width direction, on the base tape 13, includes, for example, a method of precutting the base tape 13 using a rotary punching blade. In this case, the partitions of the label portion 21, waste portion 31, and peripheral portion 41 are all formed by cut lines provided on the base tape 13.

The tape for electronic device processing having the waste portion 31 for forming the tape for electronic device processing 1 can be partitioned into the label portion 21, waste portion 31, and peripheral portion 41 by precutting the base tape 13 using a rotary punching blade 100 having the blade pattern shown in FIG. 4, and the first outer edge extension portion 62, the second outer edge extension portion 52, and the turn portions 50 and 60 can be formed in the space portion 32 of the waste portion 31. The rotary punching blade 100 is wrapped around the outer surface of a cylindrical roll (not shown) and attached, and the cylindrical roll is rotated while pressing the base tape 13 against the rotary punching blade 100, so that the base tape 13 can be precut. One precut label portion 21 is formed by one rotation of the cylindrical roll.

As shown in FIG. 4, the rotary punching blade 100 includes a label forming blade 110 for forming the outer edge 22 of the label portion 21 in plan view, and a waste portion forming blade 120 for forming the outer edge 34 of the waste portion 31, which is provided along the outer periphery of the label portion forming blade 110. In the electronic device processing tape 1, the label portion forming blade 110 is circular in shape to correspond to the circular shape of the label portion 21 in plan view.

The waste portion forming blade 120 has a first outer edge extending portion forming blade 122 for forming the first outer edge extending portion 62 and the turn portion 60, a second outer edge extending portion forming blade 121 for forming the second outer edge extending portion 52 and the turn portion 50, and an outer peripheral portion outer edge forming blade 123 for forming the outer edge 34 of the outer peripheral portion 33 surrounding the label portion 21. The first outer edge extending portion forming blade 122 is formed at a position facing the second outer edge extending portion forming blade 121. The outer peripheral portion outer edge forming blade 123 is connected to the first outer edge extending portion forming blade 122 and the second outer edge extending portion forming blade 121. The first outer edge extending portion forming blade 122 is connected to the second outer edge extending portion forming blade 121 via the outer peripheral portion outer edge forming blade 123.

The first outer edge 34-1 extending from the outer periphery 33 surrounding the other label part 21-1 toward the specified label part 21-2 intersects with the second outer edge 34-2 extending from the outer periphery 33 surrounding the specified label part 21-2 toward the other label part 21-1 at the spacing part 32 to form an intersection 35. In response to this, the spacing S1 of the second outer edge extension forming blade 121 is set to be approximately equal to the spacing S2 of the first outer edge extension forming blade 122.

In addition, the first outer edge 34-1 intersects with the second outer edge 34-2 at the gap 32 to form an intersection 35. Accordingly, the positions of the first outer edge extension forming blade 122 and the second outer edge extension forming blade 121 are set so that when the portion of the first outer edge extension forming blade 122 and the portion of the second outer edge extension forming blade 121 are overlapped, the intermediate portion between the starting point 126 and the end 127 of the first outer edge extension forming blade 122 intersects with the intermediate portion between the starting point 124 and the end 125 of the second outer edge extension forming blade 121.

During the first rotation of the rotary punching blade 100, the label portion forming blade 110 forms the specified label portion 21-2, the outer edge 34 (second outer edge 34-2) of the outer periphery 33 surrounding the specified label portion 21-2 is formed by the outer peripheral edge forming blade 123, and the second outer edge extension portion forming blade 121 forms the second outer edge extension portion 52 and the turn portion 50. Then, during the second rotation of the rotary punching blade 100, the first outer edge extension portion forming blade 122 forms the first outer edge extension portion 62 and the turn portion 60 intersecting with the portion where the second outer edge extension portion 52 and the turn portion 50 are formed, and the label portion forming blade 110 forms another label portion 21-1 adjacent to the specified label portion 21-2, and the outer edge 34 (first outer edge 34-1) of the outer periphery 33 surrounding the other label portion 21-1 is formed by the outer peripheral edge forming blade 123. By repeating the above precutting process, the label section 21, waste section 31, and peripheral section 41 can be continuously formed on the base tape 13.

In the electronic device processing tape 1 according to the first embodiment shown in Figures 2 and 3, the turn portion 50 of the second outer edge 34-2 extending from the outer periphery 33 surrounding a specific label portion 21-2 toward the other label portion 21-1 has a shape that has a curved portion 51 in a plan view. However, as shown in Figure 5, the electronic device processing tape 2 may have a shape in which the turn portion 50 of the second outer edge 34-2 has a straight portion in a plan view. More specifically, the turn portion 50 may have a straight shape in a plan view.

Note that FIG. 5 is an enlarged plan view of the electronic device processing tape according to the first embodiment of the present invention before the waste removal process, which differs from FIGS. 2 and 3 in that the turn portion 50 of the second outer edge 34-2 has a shape that has a straight portion in plan view.

In the electronic device processing tape 2 according to the first embodiment shown in FIG. 5, the turn portion 50 of the second outer edge 34-2 is located along an imaginary line L extending from the intersection 35 and parallel to the transport direction D of the electronic device processing tape 1. Therefore, the angle θ2 between the turn portion 50 and the imaginary line L is 0°. In the electronic device processing tape 2, the second outer edge extension portion 52 continuing to the turn portion 50 via the intersection 35 also has a linear shape in plan view along the imaginary line L, corresponding to the fact that the turn portion 50 has a linear shape in plan view.

In the electronic device processing tape 2, the shape of the second outer edge extension forming blade 121 of the rotary punching blade 100 is linear along the direction of rotation, so that the turn portion 50 of the second outer edge 34-2 can be shaped to have a linear portion in a plan view.

In the electronic device processing tape 2, the first outer edge extension 62 of the first outer edge 34-1 extending from one direction is located in the direction of the peripheral portion 41 in contact with the outer edge 34 of the waste portion 31, rather than the imaginary line L parallel to the conveying direction D extending from the intersection 35. This prevents the waste portion 31 from derailing from the outer edge 34 starting from the intersection 35 when the waste portion 31 is removed from the first outer edge 34-1 of the outer periphery 33 surrounding the other label portion 21-1 in the direction of the second outer edge 34-2 of the outer periphery 33 surrounding the specified label portion 21-2. In addition, in the electronic device processing tape 2, the turn portion 50 of the second outer edge 34-2 is a straight line portion along the imaginary line L, so that the waste portion 31 can be more reliably peeled from the first outer edge 34-1 to the second outer edge 34-2 as designed.

From the above, in the electronic device processing tape of the present invention, the first outer edge extension portion 62 of the first outer edge 34-1 extending from one direction located upstream of the scrap removal process is required to be located in the direction of the peripheral portion 41 from the imaginary line L parallel to the conveying direction D extending from the intersection point 35, and the second outer edge 34-2 extending from the other direction located downstream of the scrap removal process has a second outer edge extension portion 52 and a turn portion 50 with a planar shape that is not particularly limited.

Next, an example of a method for manufacturing tape 1 for electronic device processing will be described.

First, a primary precut is performed on the laminate in which the adhesive layer 12 is applied to the main surface 61 of the release film 11, using a rotary punch blade to form a precut on the adhesive layer 12. After the primary precut, unnecessary portions of the adhesive layer 12 (portions other than the portion corresponding to the label portion 21) are removed. Separately, a base tape 13 is prepared, which is a laminated structure in which an adhesive layer 15 is applied to the main surface 71 of a base film 14. Next, the adhesive layer 15 is placed opposite the adhesive layer 12 from which the unnecessary portions have been removed, and the base tape 13 is laminated to the release film 11 and the adhesive layer 12, and the base tape 13 is superimposed on the release film 11.

Next, a rotary punching blade 100 arranged opposite the base tape 13 is used to perform a secondary precut on the base tape 13 to form a partition (cut line) between the label portion 21 to which the semiconductor wafer is attached, the waste portion 31 surrounding the outer edge 22 of the label portion 21 in a plan view, and the peripheral portion 41 that contacts the outer edge 34 of the waste portion 31 and is located on the width direction edge of the base tape 13. In the secondary precut, the first outer edge extension 62, the second outer edge extension 52, and the turn portions 50 and 60, which are cut lines, are also formed in the space portion 32 of the waste portion 31. In the secondary precut, a first outer edge 34-1, which is a cut line extending from the outer periphery 33 surrounding the other label part 21-1 toward the specified label part 21-2, and a second outer edge 34-2, which is a cut line extending from the outer periphery 33 surrounding the specified label part 21-2 toward the other label part 21-1, are formed to intersect in the space 32 of the waste part 31. Therefore, in the secondary precut, a first outer edge extension 62 is formed on the cut line extending from one direction, with the first outer edge extension 62 located from the intersection 35 to the end 63 in the direction of the peripheral part 41 from the virtual line L parallel to the conveying direction D extending from the intersection 35.

Next, a waste removal process is performed in which the waste portion 31 of the base tape 13 on which the cut lines have been formed is peeled off using a winding means or the like to form a waste-removed portion. This allows the tape 1 for processing electronic devices to be manufactured.

Next, an example of how to use the electronic device processing tape of the present invention will be described. Here, an example of how to use the electronic device processing tape of the present invention will be described using the electronic device processing tape 1 according to the first embodiment. Note that FIG. 6 is an explanatory diagram of an example of how to use the electronic device processing tape according to the first embodiment of the present invention.

As shown in FIG. 6, first, the electronic device processing tape 1, from which the waste portion 31 has been peeled off and wound into a roll, is pulled out from the roll of electronic device processing tape 1 by a release film take-up roller 200. A peeling means 201 is provided on the pull-out path of the electronic device processing tape 1, and only the release film 11 is peeled off from the electronic device processing tape 1 with the tip of the peeling means 201 as the turning point. The peeled-off release film 11 is taken up by the release film take-up roller 200, which has the function of pulling out the electronic device processing tape 1 from the roll.

A laminating section 202 is provided beyond the peeling means 201. A semiconductor wafer W and a ring frame 205 surrounding the semiconductor wafer W are placed on the upper surface of the laminating section 202. The laminate of the adhesive layer 12 and the base tape 13 from which the release film 11 has been peeled off is guided onto the semiconductor wafer W facing the adhesive layer 12, and the semiconductor wafer W is laminated to the adhesive layer 12 by a laminating roller 203.

Next, with the laminate of the adhesive layer 12 and the base tape 13 attached to the semiconductor wafer W and the ring frame 205, the semiconductor wafer W is diced to form semiconductor chips (not shown). After dicing to form the semiconductor chips, the base tape 13 is subjected to a curing process such as ultraviolet irradiation to cure the adhesive component constituting the adhesive layer 15 of the base tape 13, thereby reducing the adhesive strength of the adhesive component. When the adhesive strength of the adhesive layer 15 is reduced, the adhesive layer 12 is peeled off from the adhesive layer 15, and the semiconductor chip is picked up with the adhesive layer 12 attached to the back surface of the semiconductor chip. The adhesive layer 12 attached to the back surface of the semiconductor chip functions as a die bonding film when the semiconductor chip is bonded to a lead frame, a package substrate, or another semiconductor chip.

Next, other embodiments of the electronic device processing tape of the present invention will be described. In the electronic device processing tapes 1 and 2 according to the first embodiment, the planar shape of the turn portion 60 of the first outer edge 34-1 has a curved portion 61, but instead, the planar shape of the turn portion 60 may have a straight portion. Also, in the electronic device processing tapes 1 and 2 according to the first embodiment, the turn portion 60 of the first outer edge 34-1 extends from the intersection 35 in the direction of the center line C of the base tape 13, but instead, it may extend from the intersection 35 along a virtual line L parallel to the transport direction D.

In addition, in the electronic device processing tapes 1 and 2 according to the first embodiment, the second outer edge 34-2 has a second outer edge extension 52 extending from the intersection 35 to the end 53. Alternatively, the second outer edge 34-2 may not have a second outer edge extension 52, and the intersection 35 may be the end 53 of the second outer edge 34-2.

In addition, in the electronic device processing tapes 1 and 2 according to the first embodiment, the adhesive layer 12 is provided between the release tape 11 and the base tape 13. Alternatively, as shown in FIG. 7, the electronic device processing tape 3 may have no adhesive layer 12 between the release tape 11 and the base tape 13. In the electronic device processing tape 3, the adhesive layer 15 of the base tape 13 is in direct contact with the release tape 11 even in the label portion 21.

The electronic device processing tape of the present invention can prevent the scrap removal from deviating from the cut line starting from the intersection of the precut cut lines, and can smoothly peel off the scrap, making it highly useful, for example, in the field of dicing and bonding integrated films.

REFERENCE SIGNS LIST 1, 2, 3 Tape for processing electronic devices 11 Release film 12 Adhesive layer 13 Base tape 14 Base film 15 Pressure-sensitive adhesive layer 21 Label portion 31 Waste portion 34 Outer edge 35 Intersection 62 First outer edge extension

Claims (10)

A release film;
A tape for processing electronic devices comprising a base tape having a pressure-sensitive adhesive layer formed on a main surface of a base film, the base tape being laminated with the release film,
the base tape comprises: label portions having a predetermined shape in plan view, which are formed at predetermined intervals in a feed direction of the tape for processing electronic devices; a waste removal portion which surrounds the outer side of the label portion in plan view and has a space portion which forms the predetermined space; and a peripheral portion which contacts an outer edge of the waste removal portion in plan view;
a cut line forming an outer edge of the waste portion extending from the front in the conveying direction and a cut line forming an outer edge of the waste portion extending from the rear in the conveying direction have an intersection point at the interval portion of the waste portion,
A tape for processing electronic devices, in which a first cut line extension portion of the cut line extending from the intersection to the end is located in the direction of the peripheral portion rather than a virtual line extending from the intersection in a direction parallel to the transport direction, and a second cut line extension portion of the cut line extending from the intersection to the end is a straight line in a planar view along a virtual line extending from the intersection in a direction parallel to the transport direction . The tape for processing electronic devices according to claim 1, wherein at least one of the cut lines extending from one direction and the cut lines extending from the other direction in the gap of the waste portion has a turn portion extending from the intersection in the direction of the center line of the base tape parallel to the transport direction and in a direction away from the end of the cut line. The tape for processing electronic devices according to claim 1 or 2, wherein the angle θ1 between the first cut line extension and the virtual line at the intersection is greater than the angle θ2 between the cut line extending from another direction of the position facing the first cut line extension via the virtual line and the virtual line. The tape for processing electronic devices according to any one of claims 1 to 3, wherein the first cut line extension has a length of 0.5 mm or more. The tape for processing electronic devices according to claim 2, wherein the angle θ3 between the turn portion of the cut line extending from one direction and the virtual line at the intersection is greater than the angle θ2 between the cut line extending from the other direction at a position facing the first cut line extension portion via the virtual line and the virtual line. 6. The tape for processing electronic devices according to claim 2 or 5, wherein the turn portion of the cut line extending in one direction has a curved portion in a plan view. 7. The tape for processing electronic devices according to claim 6, wherein the turn portion of the cut line extending in one direction has a curved portion in a plan view that is an arc-shaped curved portion having a curvature radius of R1.0 mm or more. The tape for processing electronic devices according to claim 2 or 5, wherein the turn portion has a straight portion in a plan view. Further comprising an adhesive layer provided on a portion of the main surface of the release film,
9. The tape for processing electronic devices according to claim 1, wherein the base tape covers the adhesive layer and is in contact with the release film around the periphery of the adhesive layer. A step of applying an adhesive layer onto a substrate film to prepare a substrate tape;
laminating the base tape with a release film;
a step of performing a precut using a rotary punch blade, in which a label portion having a predetermined shape in plan view is formed at a predetermined interval in the transport direction of the base tape, a waste portion surrounding the outer side of the label portion in plan view and having a spaced portion forming the predetermined space, and a peripheral portion in contact with the outer edge of the waste portion in plan view are partitioned, wherein a cut line forming the outer edge of the waste portion extending from the front in the transport direction and a cut line forming the outer edge of the waste portion extending from the rear in the transport direction have an intersection point at the spaced portion of the waste portion, a first cut line extension portion from the intersection point to an end of the cut line extending from one direction is located in the direction of the peripheral portion with respect to a virtual line extending from the intersection point in a direction parallel to the transport direction, and a second cut line extension portion from the intersection point to an end of the cut line extending from the other direction has a linear shape in plan view along a virtual line extending from the intersection point in a direction parallel to the transport direction;
a step of removing the waste portion to form a waste-removed portion on the base tape;
A method for producing a tape for processing electronic devices comprising the steps of:

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