JP7543832B2 - Vapor chamber and method for manufacturing the vapor chamber - Google Patents

Description

The present invention relates to a vapor chamber and a method for manufacturing a vapor chamber.

For example, heat-generating components such as central processing units (CPUs), light-emitting diodes (LEDs), and power semiconductors used in mobile devices such as mobile terminals and tablet terminals are cooled by heat pipes.

In recent years, in order to make mobile devices thinner, vapor chambers have been developed that can be made thinner than heat pipes (see, for example, Patent Document 1).

A working fluid is sealed inside the vapor chamber, and this working fluid absorbs the heat from the heat-generating components and transfers the heat, thereby cooling the heat-generating components.

More specifically, the working fluid in the vapor chamber receives heat from the heat-generating component in the area close to the heat-generating component (evaporation section) and evaporates into steam. The steam then moves to a position away from the evaporation section, where it is cooled and condenses into liquid.

Inside the vapor chamber, a liquid flow path is provided as a capillary structure (wick), and the liquefied working fluid passes through this liquid flow path and is transported toward the evaporation section, where it is again exposed to heat and evaporated.

In this way, the working fluid circulates through the vapor chamber while repeatedly undergoing phase changes, i.e. evaporation and condensation, transferring heat from the device and improving heat dissipation efficiency.

However, conventional vapor chambers lack flexibility, and depending on the shape of the heat-generating component, they may not be able to achieve sufficient adhesion to the heat-generating component. Furthermore, there is a demand for further improvements in the heat transport capacity of vapor chambers.

WO2017/104819

The object of the present invention is to provide a vapor chamber that is highly flexible, and has particularly excellent durability and heat transport capabilities, as well as a method for manufacturing the same.

These objects can be achieved by the present invention described below in (1) to ( 12 ).
(1) A container made of a metal material and having a hollow space therein;
a deformation prevention member that is arranged in the hollow portion and has a function of preventing deformation of the container in a thickness direction and is made of a resin material;
a hydraulic fluid disposed in the cavity ,
A vapor chamber characterized in that the deformation prevention member is formed integrally with a fiber that functions as a wick .

(2) The vapor chamber described in (1) above, in which the deformation prevention member has a height of 10 μm or more and 2000 μm or less.

(3) The deformation prevention member has a portion that functions as a flow path wall of the hydraulic fluid,
The vapor chamber according to (1) or (2) above, wherein the width of the flow path wall is 5 μm or more and 1000 μm or less.

( 4 ) The deformation prevention member has a portion that functions as a flow path wall of the hydraulic fluid,
The vapor chamber according to any one of ( 1 ) to (3) above, wherein the fiber base material made of the fibers is disposed so as to penetrate a portion that functions as a flow path wall for the working fluid.

( 5 ) The vapor chamber according to the above ( 4 ), wherein the thickness of the fiber base material is 10 μm or more and 1000 μm or less.

( 6 ) The vapor chamber according to any one of ( 1 ) to ( 5 ) above, wherein the fiber is a glass fiber.

( 7 ) A vapor chamber according to any one of (1) to ( 6 ) above, wherein the container is mainly composed of Cu or a Cu alloy.

( 8 ) The container is formed by joining sheet materials,
The vapor chamber according to any one of (1) to ( 7 ) above, wherein the thickness of the sheet material is 12 μm or more and 500 μm or less.

( 9 ) A vapor chamber manufacturing component preparation process for preparing a vapor chamber manufacturing component made of a material including an uncured resin material;
A first joining step of joining the vapor chamber manufacturing member to a first sheet material made of a metal material at a first surface, which is one surface of the vapor chamber manufacturing member;
an exposure step of irradiating the vapor chamber manufacturing member joined to the first sheet material with light in a predetermined pattern;
a developing step for removing the uncured resin material from the portion not irradiated with the light in the exposure step;
A second joining process of joining the vapor chamber manufacturing member that has undergone the developing process to a second sheet material made of a metal material on a second surface that is the surface opposite to the first surface;
A method for manufacturing a vapor chamber, comprising a hydraulic fluid supply and sealing process for injecting a hydraulic fluid into the space between the first sheet material and the second sheet material and sealing the space.

( 10 ) The method for manufacturing a vapor chamber according to the above ( 9 ), wherein the resin material contains an alkali-soluble resin and a photopolymerizable resin.

( 11 ) The method for producing a vapor chamber according to the above ( 10 ), wherein the alkali-soluble resin contains a (meth)acrylic group and a phenolic hydroxyl group.

( 12 ) The resin material further contains a thermosetting resin different from the alkali-soluble resin,
The method for manufacturing a vapor chamber described in ( 10 ) or ( 11 ) above, in which the resin material is made adhesive by heat treatment in the second bonding step, and then the resin material is thermally cured.

The present invention provides a vapor chamber and a manufacturing method thereof that is highly flexible and has particularly excellent durability and heat transport capabilities.

FIG. 1 is a vertical cross-sectional view illustrating a schematic diagram of an example of a vapor chamber of the present invention. FIG. 2 is a vertical cross-sectional view illustrating another example of the vapor chamber of the present invention. FIG. 2 is a vertical cross-sectional view illustrating another example of the vapor chamber of the present invention. FIG. 2 is a vertical cross-sectional view illustrating another example of the vapor chamber of the present invention. 2 is a plan view showing a schematic diagram of a wick structure provided in the vapor chamber of the present invention. FIG. FIG. 2 is a perspective view showing a schematic diagram of an example of a member for manufacturing a vapor chamber. FIG. 2 is a longitudinal sectional view showing a schematic diagram of an example of a member for manufacturing a vapor chamber. FIG. 2 is a longitudinal cross-sectional view showing a schematic diagram of another example of a member for manufacturing a vapor chamber. FIG. 2 is a longitudinal cross-sectional view showing a schematic diagram of another example of a member for manufacturing a vapor chamber. 1 is a vertical cross-sectional view showing a schematic example of a method for manufacturing a vapor chamber of the present invention. FIG. 1 is a vertical cross-sectional view showing a schematic example of a method for manufacturing a vapor chamber of the present invention. FIG.

The present invention will now be described in detail with reference to the accompanying drawings.
[1] Vapor Chamber First, the vapor chamber of the present invention will be described.

Figure 1 is a vertical cross-sectional view showing an example of the vapor chamber of the present invention. Figures 2 to 4 are vertical cross-sectional views showing another example of the vapor chamber of the present invention. Figure 5 is a plan view showing a wick structure of the vapor chamber of the present invention. Note that the fibers 131 are not shown in Figure 5. In the following description, the vapor chamber 100 will be mainly described in the case where the lower surface (surface of the first sheet material 21) in Figures 1 to 4 contacts the member to which the vapor chamber 100 is applied (heat-generating member), but the vapor chamber 100 may be used so that the upper surface in Figures 1 to 4 contacts the member to which the vapor chamber 100 is applied (heat-generating member). In addition, Figures 1 to 4 show a state in which the first sheet material 21 faces downward, but the orientation of the vapor chamber 100 when the vapor chamber 100 is used is not particularly limited, and for example, the vapor chamber 100 may be used with the first sheet material 21 facing upward.

The vapor chamber 100 has a container 20 with a hollow space inside, a deformation prevention member 10 that is placed in the hollow space and has the function of preventing deformation of the container 20 in the thickness direction, and a working liquid (working fluid) 30 that is placed in the hollow space.

The container 20 is made of a metal material, and the deformation prevention member 10 is made of a resin material.

In other words, the vapor chamber 100 comprises a container 20 made of a metal material and having a hollow space inside, a deformation prevention member 10 made of a resin material that is placed in the hollow space and has the function of preventing deformation of the container 20 in the thickness direction, and a working liquid 30 that is placed in the hollow space.

This makes it possible to provide a vapor chamber 100 that has excellent flexibility (pliability), and particularly excellent durability and heat transport capacity. In addition, since the vapor chamber 100 can have excellent flexibility (pliability), regardless of the member to which the vapor chamber 100 is applied or the arrangement, the vapor chamber 100 can be in good contact with the member, and excellent heat transport capacity can be more reliably exhibited. In particular, when the thickness of the vapor chamber 100 is relatively thin (for example, when the thickness of the vapor chamber 100 is 50 μm or more and less than 500 μm), more excellent flexibility (pliability) is exhibited, and when the thickness of the vapor chamber 100 is relatively thick (for example, when the thickness of the vapor chamber 100 is 500 μm or more and 2100 μm or less), the three-dimensional moldability of the vapor chamber 100 can be more excellent.

On the other hand, if the above conditions are not met, satisfactory results will not be obtained.
For example, if the vapor chamber does not have a deformation prevention member, it is not possible to sufficiently prevent deformation in the thickness direction of the hollow part of the container that stores the working fluid, for example, deformation when the hollow part is decompressed to lower the boiling point of the working fluid, and the smooth flow of the working fluid is hindered. As a result, the heat transport capacity of the vapor chamber cannot be sufficiently excellent.

In addition, if both the container and the deformation prevention member are made of metal materials,
The flexibility of the vapor chamber is significantly reduced. In addition, the reduced flexibility of the vapor chamber reduces the adhesion of the vapor chamber 100 to the member (e.g., heat-generating member) to which it is applied, and the substantial heat transport capacity of the vapor chamber is reduced. This tendency is particularly noticeable when the vapor chamber is applied to a member having a height difference (including when the vapor chamber is applied across multiple members).

Furthermore, if both the container and the deformation prevention member are made of a resin material, the container has low thermal conductivity, making it difficult to transfer heat from the heat-generating member to the working fluid, resulting in a reduced heat transport capacity. In addition, the container has low water vapor barrier properties and low gas barrier properties, making it difficult for heat to be transferred (heat dissipation, etc.) from the working fluid via the container, reducing the heat transport capacity of the vapor chamber as a whole.

[1-1] Container The container 20 stores the deformation prevention member 10 and the working fluid 30. The container 20 mainly has a function of transferring heat to the working fluid 30 stored inside the container 20 in the evaporator section by coming into contact with a member to be cooled, such as a heat-generating member, and a function of dissipating heat received from the working fluid 30 undergoing a phase transition from a gas state to a liquid state in the condenser section.

The container 20 is made of a metallic material.
Metal materials generally have high thermal conductivity and are also excellent in strength, ductility, etc. Therefore, for example, the vapor chamber 100 can be made excellent in shape conformity and adhesion to the member to which it is applied (for example, a member to be cooled such as a heat-generating member, etc.), and the vapor chamber 100 can be made particularly excellent in substantial heat transport capacity and excellent in durability. In particular, the container 20 can be suitably formed using a relatively thin metal sheet material, which is advantageous from the viewpoint of thinning the vapor chamber 100 and reducing the raw material cost of the vapor chamber 100.

Metal materials constituting the container 20 include, for example, Cu, Al, Mg, Zn, and alloys containing at least one of these.

Of these, it is preferable that the metal material constituting the container 20 is Cu or a Cu alloy.

This allows the effect of having a container 20 made of a metal material to be more pronounced. That is, among various metal materials, Cu or a Cu alloy is relatively inexpensive and has particularly excellent thermal conductivity and ductility, so that the vapor chamber 100 can have particularly excellent shape conformability and adhesion to the member to which it is applied (e.g., a member to be cooled such as a heat-generating member, etc.), and the vapor chamber 100 can have an even better actual heat transport capacity. Also, the durability of the vapor chamber 100 can be even better.

When the container 20 is constructed by joining metal sheet materials, the thickness of the sheet materials is preferably 12 μm or more and 500 μm or less, and more preferably 18 μm or more and 250 μm or less.

This is particularly advantageous in terms of making the vapor chamber 100 thinner, further improving its flexibility and heat transport capacity, and reducing the raw material costs of the vapor chamber 100, while also making the vapor chamber 100 more durable and reliable.

In the illustrated configuration, the container 20 is formed using a first sheet material 21 and a second sheet material 22.

The first sheet material 21 and the second sheet material 22 may be made of the same material or different materials.

Furthermore, the first sheet material 21 and the second sheet material 22 may be of the same thickness or of different thicknesses.

The first sheet material 21 and the second sheet material 22 are sealed at their outer peripheries by a sealing portion 23. This seals the cavity that contains the deformation prevention member 10 and the working fluid 30, and maintains a liquid-tight and airtight state.

The sealing portion 23 may be made of, for example, the same material as the first sheet material 21 or the second sheet material 22, or may be made of a material different from the first sheet material 21 and the second sheet material 22.

The sealing portion 23 can be formed, for example, by plating up, laser welding, seam welding, cold pressure welding, diffusion bonding, brazing, or adhesive bonding.

[1-2] Deformation Prevention Member The deformation prevention member 10 is a member that has the function of preventing deformation in the thickness direction of the container 20 (for example, deformation when the hollow portion is depressurized to lower the boiling point of the working fluid 30).

By arranging such a deformation prevention member 10 in the hollow portion of the container 20, a flow path for the working fluid can be preferably secured in the hollow portion of the container 20, and the flow of the working fluid 30 in the hollow portion can be effectively prevented from being impeded due to deformation of the container 20.

The deformation prevention member 10 has a portion that functions as a flow path wall 16 for the hydraulic fluid 30, and the portion of the deformation prevention member 10 where the flow path wall 16 is not provided becomes the flow path portion 15 for the hydraulic fluid 30.

The width of the flow channel wall 16 (the width at a cross section perpendicular to the longitudinal direction of the flow channel wall 16) is not particularly limited, but is preferably 5 μm or more and 1000 μm or less, and more preferably 10 μm or more and 500 μm or less.

This makes it possible to sufficiently prevent unintended deformation of the container 20 in the thickness direction while providing the vapor chamber 100 with particularly excellent flexibility.

In the illustrated configuration, the deformation prevention member 10 has multiple portions that function as flow path walls 16 extending in its longitudinal direction.

The distance S between adjacent flow path walls 16 (i.e., the width of the flow path portion 15) is not particularly limited, but is preferably 100 μm or more and 1000 μm or less, more preferably 200 μm or more and 800 μm or less, and even more preferably 300 μm or more and 700 μm or less.

This allows the working fluid 30 (gaseous working fluid 30 and liquid working fluid 30) to move more smoothly while preventing the deformation prevention member 10 and vapor chamber 100 from becoming too large. In addition, it is possible to provide the vapor chamber 100 with particularly excellent flexibility (pliability) while fully preventing unintended deformation in the thickness direction of the container 20.

The ratio (L/S) of the width L [μm] of the flow path wall 16 to the width S [μm] of the flow path portion 15 is not particularly limited, but is preferably 0.05 to 0.50, more preferably 0.08 to 0.40, and even more preferably 0.10 to 0.35.

This allows the vapor chamber 100 to have particularly excellent flexibility (pliability), while adequately preventing undesired deformation in the thickness direction of the container 20. Also, the heat transport capacity and durability of the vapor chamber 100 can be improved while preventing the deformation prevention member 10 and the vapor chamber 100 from becoming too large. On the other hand, if the value of L/S is less than the lower limit, deformation in the thickness direction of the container 20 is likely to occur depending on the thickness of the sheet material constituting the container 20, the constituent materials, etc. Also, if the value of L/S exceeds the upper limit, the heat transport efficiency decreases.

In the illustrated configuration, the flow path portion 15 and the flow path wall 16 have a constant width, but they may have portions with different widths.

In addition, in the illustrated configuration, the flow path portion 15 and the flow path wall 16 are arranged linearly in one direction, but they may also have curved or bent portions.

The height (thickness) of the deformation prevention member 10 is preferably 10 μm or more and 2000 μm or less, more preferably 20 μm or more and 1000 μm or less, and even more preferably 30 μm or more and 500 μm or less.

This prevents the vapor chamber 100 from becoming unnecessarily thick, while more suitably securing the flow path portion of the working fluid 30 (particularly the flow path portion of the gaseous working fluid 30 and the flow path portion of the liquid working fluid 30).

The resin material constituting the deformation prevention member 10 is not particularly limited, but in this embodiment, it contains a hardened product (resin hardened product 14) of a hardening resin (e.g., a photopolymerizable resin or a thermosetting resin, as described in detail later).

This makes the vapor chamber 100 more durable and reliable.

The deformation prevention member 10 may also contain an alkali-soluble resin, as described in detail below.

The deformation prevention member 10 may contain components other than the resin material. Examples of such components include fillers, UV absorbers, leveling agents, coupling agents, flame retardants, and antioxidants.

However, the content of components other than the resin material in the deformation prevention member 10 (if multiple types of components are included, the sum of their contents) is preferably 10.0% by mass or less, more preferably 7.0% by mass or less, and even more preferably 5.0% by mass or less.

In the illustrated configuration, the deformation prevention member 10 is in contact with the inner surface of the container 20 on both sides (more specifically, one side, the first side 11, is in contact with the first sheet material 21, and the other side, the second side 12, is in contact with the second sheet material 22), but other members may be interposed between the deformation prevention member 10 and the container 20. In other words, the deformation prevention member 10 may be fixed to the inner surface of the container 20 via, for example, other members.

[1-3] Fibers In this embodiment, the deformation prevention member 10 is integrally formed with the fibers 131 that function as a wick. In other words, the integral molding of the deformation prevention member 10 and the fibers 131 is a member that has the function of preventing deformation in the thickness direction of the container, and is also a wick structure that is a member through which the working fluid 30 flows due to heat transport, in particular, the working fluid 30 vaporized by receiving heat in the evaporating section of the container 20 and the working fluid 30 condensed by receiving heat in the condensing section of the container 20 flow.

In particular, the wick structure includes a deformation prevention member 10 made of a resin material and fibers 131, and the fibers 131 are arranged in a part of the flow path portion 15 of the working fluid 30 where the deformation prevention member 10 (resin material) is not arranged.

In this way, since the deformation prevention member 10 is integrally formed with the fibers 131 that function as a wick, for example, the flow path portion 15 can have a flow path portion for the gaseous working liquid 30 (a portion of the flow path portion 15 where the fibers 131 are not present, or a portion where the density of the fibers 131 is low) and a flow path portion for the liquid working liquid 30 (a portion of the flow path portion 15 where the fibers 131 are present, or a portion where the density of the fibers 131 is high), and the flow path for the liquid working liquid 30 and the flow path for the gaseous working liquid 30 can be functionally separated. As a result, the heat transport capacity of the vapor chamber 100 can be made particularly excellent. In addition, the durability of the vapor chamber 100 can also be made even more excellent.

The fibers 131 may be made of any material. Examples of materials that can be used to make the fibers 131 include cotton, linen, wool, polyester resin, polyamide resin, acrylic resin, aromatic resin containing a heterocycle in the molecule, glass, carbon, iron, silver, copper, etc., and one or more of these materials may be used in combination.

In particular, when the fibers 131 are glass fibers, the durability of the vapor chamber 100 can be improved. Furthermore, since glass fibers generally have excellent light transmittance, including ultraviolet light, in the manufacturing method of the vapor chamber 100 described in detail below, the curing reaction in the exposure process can be effectively prevented from being unintentionally inhibited, and the productivity and yield of the vapor chamber 100 can be improved.

The thickness of the fiber 131 is not particularly limited, but is preferably 1 μm or more and 100 μm or less, more preferably 4 μm or more and 30 μm or less, and even more preferably 5 μm or more and 15 μm or less.

This prevents the wick structure from becoming unnecessarily thick, while maintaining the gaps between the fibers 131 in a more optimal state, improving the transport capacity of the liquid working fluid 30 by capillary action in the vapor chamber 100. As a result, the heat transport capacity of the vapor chamber 100 can be improved.

In the wick structure and vapor chamber 100, the fibers 131 may be, for example, a bundle of multiple fibers 131, that is, included as a fiber bundle. Examples of fiber bundles include ply-twisted yarns, single-twisted yarns, lange-twisted yarns, braided cords, and the like.

This prevents the wick structure from becoming unnecessarily thick, while maintaining the gaps between the fibers 131 in a more optimal state, improving the transport capacity of the liquid working fluid 30 by capillary action in the vapor chamber 100. As a result, the heat transport capacity of the vapor chamber 100 can be improved.

In the illustrated configuration, the fibers 131 form a sheet-like fiber substrate (fiber sheet) 13.

As a result, for example, the wick structure does not only contain the fibers 131 in an independent state, but can contain a fiber substrate 13 in which a plurality of fibers 131 are entangled, and for example, the gaps between the fibers 131 in the wick structure can be easily adjusted to a state in which the liquid working liquid 30 is likely to cause capillary action, and the arrangement of the fibers 131 in the wick structure can be easily adjusted. Therefore, the flow path portion of the gaseous working liquid 30 and the flow path portion of the liquid working liquid 30 can be more suitably coexisted, and the above-mentioned effect can be more reliably achieved. In addition, the wick structure is also easily manufactured, and the arrangement and distribution of the fibers 131 in the wick structure can be easily adjusted, and for example, unintended uneven distribution of the fibers 131 in each part of the wick structure (for example, the fibers 131 are not sufficiently present in the part that should become the flow path portion 15) can be suitably prevented. Furthermore, because the fiber base material 13 is sheet-shaped, it is possible to effectively prevent the wick structure from becoming unnecessarily thick, and it is also possible to more effectively prevent unintended deformation of the fiber base material 13 during the manufacture of the vapor chamber 100 (wick structure) and unintended movement of the fibers 131 within the wick structure.

The fiber base material 13 may be, for example, a nonwoven fabric or a woven fabric.
When the fiber base material 13 is a woven fabric, examples of the woven fabric include plain weave, twill weave, satin weave, leno weave, mock weave, twill weave, double weave, and the like.

In addition, in this embodiment, the fiber base material 13 composed of fibers 131 is arranged to penetrate the flow path wall 16 of the deformation prevention member 10.

This more effectively prevents unintended movement of the fibers 131 in the vapor chamber 100, and the effects described above are more pronounced. In addition, the stability of the shapes of the deformation prevention member 10 and the wick structure is improved, making the durability and reliability of the vapor chamber 100 more excellent. In addition, the ease of handling of the vapor chamber manufacturing member 10' during the manufacture of the vapor chamber 100, as described in detail below, and the ease of handling of the deformation prevention member 10 and the wick structure are improved.

The thickness of the fiber base material 13 is preferably 10 μm or more and 1000 μm or less, more preferably 20 μm or more and 500 μm or less, and even more preferably 30 μm or more and 200 μm or less.

This prevents the wick structure from becoming unnecessarily thick, while ensuring more optimal gaps between the fibers 131, and further improves the transport capacity of the liquid working fluid 30 by capillary action in the vapor chamber 100. As a result, the heat transport capacity of the vapor chamber 100 can be further improved.

The fiber base material 13 may have regions with different fiber densities. For example, the fiber base material 13 may have regions with different fiber densities in the thickness direction.

The wick structure may include multiple fiber substrates 13. In this case, these fiber substrates 13 may be of the same condition or may be of different conditions. When the wick structure includes multiple fiber substrates 13, for example, multiple fiber substrates 13 may be stacked in the thickness direction of the wick structure.

The wick structure may include a fiber substrate 13, or may further include fibers 131 that are independent of the fiber substrate 13.

The content of fibers 131 in the wick structure is preferably 1% by mass or more and 80% by mass or less, more preferably 3% by mass or more and 75% by mass or less, and even more preferably 5% by mass or more and 70% by mass or less.

In particular, when the fibers 131 are made of an inorganic material such as glass or metal, the content of the fibers 131 in the wick structure is preferably 30% by mass or more and 80% by mass or less, more preferably 35% by mass or more and 75% by mass or less, and even more preferably 40% by mass or more and 70% by mass or less.

In addition, when the fibers 131 are made of an organic material, the content of the fibers 131 in the wick structure is preferably 1% by mass or more and 30% by mass or less, more preferably 3% by mass or more and 25% by mass or less, and even more preferably 5% by mass or more and 20% by mass or less.

By satisfying the above content conditions, the ratio between the flow path portion of the gaseous working liquid 30 and the flow path portion of the liquid working liquid 30 in the vapor chamber 100 (wick structure) can be made more suitable.

The wick structure as described above may be formed by any method, but is preferably formed using a vapor chamber manufacturing component 10' as described below.

As a result, for example, by using a method as described below, the vapor chamber 100 can be manufactured with high productivity and high yield, and the reliability of the vapor chamber 100 can be improved.

When the wick structure is formed using a vapor chamber manufacturing component 10' as described below, the wick structure may be manufactured using one vapor chamber manufacturing component 10', or may be manufactured using multiple vapor chamber manufacturing components 10'. When multiple vapor chamber manufacturing components 10' are used, these vapor chamber manufacturing components 10' may be arranged in the surface direction of the wick structure, or may be arranged (stacked) in the thickness direction of the wick structure.

The sheet-like fiber substrate 13 (fibers 131) may be present throughout almost the entire thickness of the wick structure as shown in FIG. 1, or may be unevenly distributed near the center of the thickness of the wick structure as shown in FIG. 2, or may be unevenly distributed on the second surface 12 side of the wick structure as shown in FIG. 3, or may be unevenly distributed on the first surface 11 side of the wick structure as shown in FIG. 4. The sheet-like fiber substrate 13 (fibers 131) may be unevenly distributed on both sides of the wick structure (the first surface 11 side and the second surface 12 side), and the content of fibers 131 near the center of the thickness of the wick structure may be lower than those in these areas.

[1-4] Hydraulic Fluid Hydraulic fluid 30 is placed in the hollow portion of the container 20 together with the deformation prevention member 10 (wick structure).

The working fluid 30 mainly functions to transport heat in the hollow space inside the container 20.

Examples of the working fluid 30 include water, hydrochlorofluorocarbons such as HCFC-22, hydrofluorocarbons such as HFCR134a, HFCR407C, HFCR410A, and HFC32, hydrofluoroolefins such as HFO1234yf, hydrofluoroethers, alcohols such as ethanol and methanol, acetone, carbon dioxide gas, ammonia, and propane.

[1-5] Overall Configuration of Vapor Chamber The thickness of the vapor chamber 100 is preferably 50 μm or more and 2100 μm or less, more preferably 80 μm or more and 1070 μm or less, and even more preferably 100 μm or more and 570 μm or less.

This allows the working fluid 30 (gaseous working fluid 30 and liquid working fluid 30) to move more smoothly while preventing the vapor chamber 100 from becoming too thick. As a result, the heat transport capacity of the vapor chamber 100 can be made particularly excellent. In addition, the durability of the vapor chamber 100 can be made even more excellent.

[1-6] Usage of the Vapor Chamber Next, examples of usage of the vapor chamber of the present invention will be described.

The vapor chamber of the present invention may be used, for example, to transfer heat from a heat-generating component to a specified location, or to equalize the heat of a localized high-temperature portion of a heat-generating component.

The following will mainly explain how the vapor chamber of the present invention is used to transfer heat from a specific component (heat-generating component).

When used to cool a heat-generating component (such as a CPU), the vapor chamber is used with a portion of its surface (evaporation portion) in contact with the heat-generating component itself or a component made of a highly thermally conductive material that comes into contact with it (such as a thermally conductive sheet) (hereinafter, these are collectively referred to as "heat-generating component, etc.").

At this time, the vapor chamber may be in a state where the condensation section, which is a section different from the evaporation section, i.e., the section that dissipates heat received from the heat-generating component, is in contact with a heat dissipation component (e.g., a heat sink, etc.) or a component made of a highly thermally conductive material that is in contact with it (e.g., a thermally conductive sheet, etc.) (hereinafter, these are collectively referred to as "heat dissipation components, etc.").

As mentioned above, the vapor chamber of the present invention has excellent flexibility.

Therefore, when there is a step between the part where the heat generating component is installed and the part where the heat dissipation component should be installed, if a conventional heat pipe or vapor chamber with poor flexibility is used, it is necessary to install a spacer (e.g., a metal spacer, etc.) to eliminate or reduce the step, which causes problems such as increased costs due to an increase in parts and an increase in weight of the entire device. In contrast, the vapor chamber of the present invention has excellent flexibility and can be bent, for example, so that even if the spacer is omitted, it is possible to ensure good adhesion with other components (heat generating components, heat dissipation components, etc.) in the condensation section and evaporation section. Therefore, it is possible to exhibit good heat dissipation performance while effectively solving the above-mentioned problems.

In addition, when using the vapor chamber of the present invention, the vapor chamber can be curved or bent to effectively avoid interference with other components, which increases the freedom of layout of each component in a device equipped with a heat-generating component.

In addition, in the present invention, the shape of the flow path portion and flow path wall of the vapor chamber (wick structure) can be suitably adjusted, so that vapor chambers having not only simple shapes such as rectangles, but also complex shapes such as shapes with cutouts, and having flow path portions and flow path walls corresponding to those shapes can be suitably manufactured. Therefore, for example, it is possible to increase the contact area with heat-generating components and heat dissipating components while suitably eliminating interference with other components. This allows for better heat dissipation performance.

For example, in a housing (such as the joints of an articulated robot) that houses a motor as a heat-generating component, an aluminum molded body and a heat-conducting sheet have been used in combination inside the housing to allow the heat from the motor to escape to the outside through the housing, but this has the problem of increasing the size of the housing. In contrast, when using the vapor chamber of the present invention, there is no need to use an aluminum molded body, which is advantageous from the standpoint of miniaturizing the housing and reducing the number of parts.

[2] Components for manufacturing vapor chambers Next, we will explain components for manufacturing vapor chambers that can be suitably used for manufacturing the vapor chamber of the present invention, in particular, for manufacturing the deformation prevention member (wick structure) that the vapor chamber is equipped with.

Figure 6 is a perspective view showing a schematic example of a vapor chamber manufacturing component. Figure 7 is a vertical cross-sectional view showing a schematic example of a vapor chamber manufacturing component. Figures 8 and 9 are vertical cross-sectional views showing schematic examples of other vapor chamber manufacturing components.

The vapor chamber manufacturing component 10' includes fibers 131 and an uncured resin material 14'.

This makes it possible to provide a vapor chamber manufacturing component 10' that has excellent flexibility and can be suitably used to manufacture a vapor chamber 100 that has particularly excellent heat transport capacity. In addition, because the vapor chamber 100 can have excellent flexibility, the vapor chamber 100 can be in good contact with the component regardless of the component or arrangement to which the vapor chamber 100 is applied, and the excellent heat transport capacity can be more reliably exhibited.

Such excellent effects are believed to be obtained for the following reasons. That is, since the vapor chamber manufacturing member 10' contains the fiber 131 and the uncured resin material 14', the wick structure formed using the vapor chamber manufacturing member 10' can be made of a material containing the fiber 131 and the cured resin 14, and the vapor chamber 100 as a whole can exhibit excellent flexibility (pliability). In addition, since the vapor chamber manufacturing member 10' contains the uncured resin material 14', for example, by irradiating light (exposure light) in a predetermined pattern in a method described later, the flow path portion 15 of the working liquid 30 in the vapor chamber 100, particularly the flow path portion of the gaseous working liquid 30 (the portion of the flow path portion 15 where the fiber 131 does not exist or the portion where the density of the fiber 131 is low) and the flow path portion of the liquid working liquid 30 (the portion of the flow path portion 15 where the fiber 131 exists or the portion where the density of the fiber 131 is high) can be suitably formed. More specifically, a structure for moving the gaseous working liquid 30 and a structure for moving the liquid working liquid 30 by capillary action can be formed in a suitable arrangement. This can speed up the evaporation/condensation cycle of the working liquid 30, and the heat transport capacity of the vapor chamber 100 as a whole can be particularly excellent. However, a part of the liquid working liquid 30 may flow in the flow path part of the gaseous working liquid 30 (a part of the flow path part 15 where the fibers 131 are not present or where the density of the fibers 131 is low), or a part of the gaseous working liquid 30 may flow in the flow path part of the liquid working liquid 30 (a part of the flow path part 15 where the fibers 131 are present or where the density of the fibers 131 is high).

In addition, the shape of the flow path portion 15 and flow path wall 16 of the vapor chamber 100 (wick structure, deformation prevention member 10) manufactured using the vapor chamber manufacturing member 10' can be suitably adjusted according to the purpose of the vapor chamber 100, the application site, etc. In other words, it has excellent on-demand properties. In addition, the vapor chamber 100 (wick structure, deformation prevention member 10) can be suitably manufactured by general treatments such as light irradiation and heat treatment, and the vapor chamber 100 with the above-mentioned excellent characteristics can be manufactured without performing complicated metal processing, etc. In addition, the flow path portion of the gaseous working liquid 30 and the flow path portion of the liquid working liquid 30 can be formed in a common process, and alignment of these parts is not required, so high productivity and high yield can be achieved in the manufacture of the vapor chamber 100.

The uncured resin material 14' may be a curable resin material in which the curing reaction has not yet been completed, or may be a resin material in which the curing reaction has partially progressed, for example, a B-stage resin material.

In particular, in the illustrated configuration, the vapor chamber manufacturing component 10' includes a fiber base material 13 composed of fibers 131 and an uncured resin material 14' that is impregnated into the fiber base material 13.

This makes the above-mentioned effects more pronounced. For example, by including a fiber substrate 13 in which a plurality of fibers 131 are entangled, rather than only including the fibers 131 in an independent state, it is easier to adjust the gaps between the fibers 131 in the vapor chamber manufacturing member 10' so that the liquid working liquid 30 is more likely to cause capillary action, and it is also easier to adjust the placement of the fibers 131 in the vapor chamber manufacturing member 10'. Therefore, in the wick structure formed using the vapor chamber manufacturing member 10', the flow path portion of the gaseous working liquid 30 and the flow path portion of the liquid working liquid 30 can be more suitably formed, and the above-mentioned effects can be more reliably achieved. Furthermore, the vapor chamber manufacturing component 10' is also easier to manufacture, and the arrangement and distribution of the fibers 131 in the vapor chamber manufacturing component 10' can be easily adjusted. For example, it is possible to effectively prevent unintended uneven distribution of the fibers 131 in each part of the vapor chamber manufacturing component 10' (for example, insufficient fiber 131 being present in the part that should become the flow path portion 15).

In the illustrated configuration, the fiber base material 13 is in the form of a sheet, but the shape of the fiber base material 13 is not particularly limited.

In addition, in the illustrated configuration, the vapor chamber manufacturing component 10' is sheet-shaped, and in particular has a shape corresponding to the sheet-shaped fiber base material 13, but the shape of the vapor chamber manufacturing component 10' is not particularly limited.

[2-1] Resin Material The vapor chamber manufacturing member 10' contains an uncured resin material 14'.

The resin material 14' may contain a curable resin in an uncured state, may be a resin in which the curing reaction has progressed to a certain degree (e.g., a resin in the B stage), or may contain a thermoplastic resin in addition to a curable resin in an uncured state.

Among these, it is preferable that the resin material 14' contains an alkali-soluble resin and a photopolymerizable resin.

As a result, in the method described below, a predetermined pattern can be suitably formed through the exposure process and development process, and in the development process, an alkaline aqueous solution, which has a smaller environmental impact, can be suitably used as a developer, rather than the organic solvents that are widely used.

The alkali-soluble resin will now be described.
Examples of the alkali-soluble resin include novolak resins such as cresol type, phenol type, bisphenol A type, bisphenol F type, catechol type, resorcinol type, and pyrogallol type; acrylic resins such as phenol aralkyl resins, hydroxystyrene resins, methacrylic acid resins, and methacrylic acid ester resins; cyclic olefin resins containing a hydroxyl group, a carboxyl group, or the like; and polyamide resins (specifically, resins having at least one of a polybenzoxazole structure and a polyimide structure and having a hydroxyl group, a carboxyl group, an ether group, or an ester group in the main chain or side chain, resins having a polybenzoxazole precursor structure, resins having a polyimide precursor structure, and resins having a polyamic acid ester structure).

As the alkali-soluble resin, for example, a resin having an alkali-soluble group and a double bond can be suitably used.

As a result, when removing resin whose double bonds have not reacted during development, an alkaline aqueous solution, which has a lower environmental impact, can be used instead of the organic solvents that are typically used as developers, and because the double bonds contribute to the curing reaction, the heat resistance of the cured resin 14 formed by curing the resin material 14' can be maintained.

An example of a resin having an alkali-soluble group and a double bond is a curable resin that can be cured by both light and heat.

Examples of alkali-soluble groups include hydroxyl groups and carboxyl groups. These alkali-soluble groups can also contribute to the thermosetting reaction.

Examples of such resins include thermosetting resins having photoreactive groups such as acryloyl groups, methacryloyl groups, and vinyl groups, and photocurable resins having thermally reactive groups such as phenolic hydroxyl groups, alcoholic hydroxyl groups, carboxyl groups, and acid anhydride groups. The photocurable resins may further have thermally reactive groups such as epoxy groups, amino groups, and cyanate groups. Specific examples include (meth)acrylic modified phenolic resins, (meth)acryloyl group-containing acrylic acid polymers, and carboxyl group-containing (epoxy)acrylates.

Among these, the alkali-soluble resin is preferably one that contains a (meth)acrylic group and a phenolic hydroxyl group, and more preferably a (meth)acrylic-modified phenolic resin.

This allows for more efficient removal of unreacted resin during development using an alkaline aqueous solution.

When a thermosetting resin having a photoreactive group is used as the alkali-soluble resin, the modification rate (substitution rate) of the photoreactive group is not particularly limited, but is preferably 20 mol% or more and 80 mol% or less of the total reactive groups of the resin having the alkali-soluble group and the double bond, and more preferably 30 mol% or more and 70 mol% or less.

This allows the resolution of the resin material 14' in the manufacturing method of the vapor chamber 100 described below, i.e., the reproducibility of the pattern in the exposure process, to be improved. As a result, it can be more suitably applied to the manufacture of a vapor chamber 100 equipped with a deformation prevention member 10 (wick structure) having a fine pattern.

On the other hand, when a photocurable resin having a thermally reactive group is used, the modification rate (substitution rate) of the thermally reactive group is not particularly limited, but is preferably 20 mol% or more and 80 mol% or less of the total reactive groups of the resin having the alkali-soluble group and the double bond, and more preferably 30 mol% or more and 70 mol% or less.

This allows the resolution of the resin material 14' in the manufacturing method of the vapor chamber 100 described below, i.e., the reproducibility of the pattern in the exposure process, to be improved. As a result, it can be more suitably applied to the manufacture of a vapor chamber 100 equipped with a deformation prevention member 10 (wick structure) having a fine pattern.

The weight average molecular weight of the resin having an alkali-soluble group and a double bond is not particularly limited, but is preferably 300,000 or less, and more preferably 5,000 or more and 150,000 or less.

This allows the resin material 14' in the vapor chamber manufacturing component 10' to have sufficiently excellent shape stability while also allowing the resin material 14' to be more effectively removed during the development process.

The weight average molecular weight can be evaluated, for example, using a G.P.C., and the weight average molecular weight can be calculated from a calibration curve prepared in advance using a styrene standard substance. In particular, the weight average molecular weight can be measured using tetrahydrofuran (THF) as the measurement solvent at a temperature of 40°C.

The content of the alkali-soluble resin in the resin material 14' is not particularly limited, but is preferably 10% by mass or more and 80% by mass or less, and more preferably 15% by mass or more and 70% by mass or less.

This allows the resin material 14' in the vapor chamber manufacturing component 10' to have sufficiently excellent shape stability, while also providing better resolution in the exposure process and better developability in the development process. In addition, the heat treatment in the manufacturing process of the vapor chamber 100 allows the bonding strength and adhesion between the deformation prevention member 10 (wick structure) and the container 20 (first sheet material 21, second sheet material 22) to be improved.

Next, the photopolymerizable resin will be described.
The resin material 14' contains a photopolymerizable resin in addition to the above-mentioned alkali-soluble resin, thereby improving the patterning properties.

Examples of photopolymerizable resins include unsaturated polyesters, acrylic compounds such as acrylic monomers and oligomers having at least one acryloyl group or methacryloyl group in each molecule, and vinyl compounds such as styrene. One or more of these may be used in combination.

Among these, ultraviolet-curable resins containing an acrylic compound as a main component are preferred. Acrylic compounds cure quickly when irradiated with light (exposure light), and the resin material 14' can be suitably patterned with a relatively small amount of exposure light.

Examples of acrylic compounds include monomers of acrylic acid esters and methacrylic acid esters, and more specifically, bifunctional acrylates such as ethylene glycol diacrylate, ethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, glycerin diacrylate, glycerin dimethacrylate, 1,10-decanediol diacrylate, and 1,10-decanediol dimethacrylate, and polyfunctional acrylates such as trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexaacrylate, and dipentaerythritol hexamethacrylate.

Among these, (meth)acrylic acid esters are preferred, and acrylic acid esters and methacrylic acid alkyl esters having an ester moiety with 1 to 15 carbon atoms are more preferred.
This makes it possible to improve the reactivity and the sensitivity in the exposure step.

The photopolymerizable resin is not particularly limited, but is preferably liquid at room temperature (23°C).

This improves the curing reactivity with exposure light (especially ultraviolet light). It also makes it easier to mix with other ingredients (e.g., alkali-soluble resins). Examples of photopolymerizable resins that are liquid at room temperature include the aforementioned ultraviolet-curable resins that contain an acrylic compound as a main component.

The weight average molecular weight of the photopolymerizable resin is not particularly limited, but is preferably 5,000 or less, and more preferably 150 or more and 3,000 or less.

This improves the reactivity of the resin material 14', improves the sensitivity in the exposure process, and improves the resolution of the resin material 14'.

The content of the photopolymerizable resin in the resin material 14' is not particularly limited, but is preferably 9% by mass or more and 40% by mass or less, and more preferably 13% by mass or more and 30% by mass or less.

This allows the resin material 14' to have a higher level of both heat resistance and flexibility as the cured resin 14 formed by curing the resin material 14'. In addition, the resolution of the resin material 14' in the method for manufacturing the vapor chamber 100 described below, i.e., the reproducibility of the pattern in the exposure process, can be improved. As a result, this method can be more suitably applied to the manufacture of a vapor chamber 100 equipped with a deformation prevention member 10 (wick structure) having a fine pattern.

When the content of the alkali-soluble resin in the resin material 14' is XA [mass %] and the content of the photopolymerizable resin in the resin material 14' is XP [mass %], it is preferable to satisfy the relationship 0.15≦XP/XA≦0.90, it is more preferable to satisfy the relationship 0.19≦XP/XA≦0.87, and it is even more preferable to satisfy the relationship 0.22≦XP/XA≦0.33.

This makes it possible to further improve the balance of the shape stability of the resin material 14' in the vapor chamber manufacturing component 10', the resolution in the exposure process, the developability in the development process, the bonding strength and adhesion between the deformation prevention component 10 (wick structure) and the container 20 (first sheet material 21, second sheet material 22), the heat resistance and flexibility of the cured resin 14 formed by curing the resin material 14', etc.

When the resin material 14' contains an alkali-soluble resin and a photopolymerizable resin, it is preferable that the resin material 14' further contains a thermosetting resin different from the alkali-soluble resin.

This allows the deformation prevention member 10 (wick structure) to have better heat resistance. It also allows suitable adhesion to be exhibited during the manufacturing process of the vapor chamber 100 described below, allowing for better bonding strength and adhesion between the deformation prevention member 10 (wick structure) and the container 20 (first sheet material 21, second sheet material 22).

Examples of the thermosetting resin include novolac-type phenolic resins such as phenol novolac resin, cresol novolac resin, and bisphenol A novolac resin, phenolic resins such as resol phenolic resin, bisphenol A epoxy resin, and bisphenol F epoxy resin, novolac-type epoxy resins such as novolac epoxy resin and cresol novolac epoxy resin, biphenyl-type epoxy resin, stilbene-type epoxy resin, triphenol methane-type epoxy resin, alkyl-modified triphenol methane-type epoxy resin, triazine nucleus-containing epoxy resin, dicyclopentadiene-modified phenolic epoxy resin, urea resin, resins having a triazine ring such as melamine resin, unsaturated polyester resin, bismaleimide resin, polyurethane resin, diallyl phthalate resin, silicone resin, resins having a benzoxazine ring, cyanate ester resin, etc., and one or more of these may be used in combination. Among these, epoxy resin is particularly preferable as the thermosetting resin. This makes it possible to improve the heat resistance of the cured resin 14 formed by curing the resin material 14' and the adhesion of the cured resin 14 formed by curing the resin material 14' to the fibers 131, the first sheet material 21, and the second sheet material 22.

In particular, it is preferable to use a silicone-modified epoxy resin as the epoxy resin, and it is even more preferable to use a combination of an epoxy resin that is solid at room temperature (particularly a bisphenol-type epoxy resin) and an epoxy resin that is liquid at room temperature (particularly a silicone-modified epoxy resin that is liquid at room temperature).

This allows the resin material 14' to have both high heat resistance and flexibility. In addition, the resolution of the resin material 14' in the method for manufacturing the vapor chamber 100 described below, i.e., the reproducibility of the pattern in the exposure process, can be further improved. As a result, it can be more suitably applied to the manufacture of a vapor chamber 100 equipped with a deformation prevention member 10 (wick structure) having a fine pattern.

The content of the thermosetting resin in the resin material 14' is not particularly limited, but is preferably 10% by mass or more and 60% by mass or less, and more preferably 15% by mass or more and 55% by mass or less.

This allows the resin material 14' to harden and produce a cured resin 14 that has both high heat resistance and high toughness.

When the content of the alkali-soluble resin in the resin material 14' is XA [mass %] and the content of the thermosetting resin in the resin material 14' is XT [mass %], it is preferable to satisfy the relationship 0.20≦XT/XA≦1.5, it is more preferable to satisfy the relationship 0.30≦XT/XA≦1.2, and it is even more preferable to satisfy the relationship 0.55≦XT/XA≦0.80.

This makes it possible to achieve an even better balance between the shape stability of the resin material 14' in the vapor chamber manufacturing component 10', the resolution in the exposure process, the developability in the development process, the heat resistance and toughness of the cured resin 14 formed by curing the resin material 14', and the bonding strength and adhesion between the deformation prevention component 10 (wick structure) and the container 20 (first sheet material 21, second sheet material 22).

The content of the resin material 14' in the vapor chamber manufacturing component 10' is preferably 10% by mass or more and 95% by mass or less, more preferably 15% by mass or more and 90% by mass or less, and even more preferably 20% by mass or more and 85% by mass or less.

In particular, when the fibers 131 are made of an inorganic material, the content of the resin material 14' in the vapor chamber manufacturing component 10' is preferably 10% by mass or more and 50% by mass or less, more preferably 15% by mass or more and 45% by mass or less, and even more preferably 20% by mass or more and 40% by mass or less.

In addition, when the fibers 131 are made of an organic material, the content of the resin material 14' in the vapor chamber manufacturing component 10' is preferably 50% by mass or more and 95% by mass or less, more preferably 55% by mass or more and 90% by mass or less, and even more preferably 60% by mass or more and 85% by mass or less.

By satisfying the above content conditions, the ratio between the flow path portion of the gaseous working liquid 30 and the flow path portion of the liquid working liquid 30 in the vapor chamber 100 (wick structure) manufactured using the vapor chamber manufacturing component 10' can be made more suitable.

When the content of fiber 131 in vapor chamber manufacturing component 10' is Xf [mass %] and the content of resin material 14' is Xr [mass %], it is preferable to satisfy the relationship 0.01≦Xf/Xr≦8.0, it is more preferable to satisfy the relationship 0.1≦Xf/Xr≦5.0, and it is even more preferable to satisfy the relationship 0.3≦Xf/Xr≦3.0.

In particular, when the fibers 131 are made of an inorganic material, it is preferable that the relationship 0.8≦Xf/Xr≦8.0 is satisfied, it is more preferable that the relationship 1.0≦Xf/Xr≦7.0 is satisfied, and it is even more preferable that the relationship 2.0≦Xf/Xr≦6.0 is satisfied.

In addition, when the fiber 131 is made of an organic material, it is preferable that the relationship 0.01≦Xf/Xr≦0.8 is satisfied, it is more preferable that the relationship 0.05≦Xf/Xr≦0.6 is satisfied, and it is even more preferable that the relationship 0.10≦Xf/Xr≦0.4 is satisfied.

By satisfying the above content relationship, the ratio between the flow path portion of the gaseous working liquid 30 and the flow path portion of the liquid working liquid 30 in the vapor chamber 100 (wick structure) manufactured using the vapor chamber manufacturing component 10' can be made more suitable.

[2-2] Fibers The vapor chamber manufacturing member 10 ′ of this embodiment includes fibers 131 .

The fibers 131 contained in the vapor chamber manufacturing member 10' preferably satisfy the same conditions as the fibers 131 described above as a constituent material of the wick structure (vapor chamber 100).
This provides the same effect as described above.

[2-3] Hardener The vapor chamber manufacturing member 10' may further contain a hardener.

The curing agent (photosensitive agent) is not particularly limited as long as it cures the resin material 14', and examples thereof include benzophenone, acetophenone, benzoin, benzoin isobutyl ether, benzoin methyl benzoate, benzoin benzoic acid, benzoin methyl ether, benzyl phenyl sulfide, benzyl, dibenzyl, diacetyl, etc., and one or more selected from these may be used in combination.

The content of the curing agent (photosensitive agent) in the vapor chamber manufacturing component 10' is not particularly limited, but is preferably 0.1% by mass or more and 50% by mass or less, more preferably 0.5% by mass or more and 40% by mass or less, and even more preferably 1.0% by mass or more and 30% by mass or less.

This ensures that the storage stability of the vapor chamber manufacturing component 10' is sufficiently excellent, while allowing the photopolymerization reaction to be initiated and progressed more efficiently when manufacturing the vapor chamber 100 described below.

[2-4] Other Components The vapor chamber manufacturing member 10' may contain components other than the above-mentioned components (hereinafter, also referred to as "other components"). Examples of such components include fillers, ultraviolet absorbers, leveling agents, coupling agents, flame retardants, antioxidants, etc., and one or more selected from these may be used in combination.

However, the content of other components in the vapor chamber manufacturing component 10' is preferably 7.0% by mass or less, more preferably 5.0% by mass or less, and even more preferably 3.0% by mass or less.

[2-5] Overall Configuration of Vapor Chamber Manufacturing Member The shape of the vapor chamber manufacturing member 10' is not particularly limited, but in the illustrated configuration, it is in the form of a sheet.

This allows the sheet-shaped vapor chamber 100 (wick structure) to be manufactured in an optimal manner. It also allows for more optimal prevention of unintended deformation of the vapor chamber manufacturing component 10' during the manufacture of the vapor chamber 100 (wick structure) and unintended movement of the fibers 131 within the vapor chamber manufacturing component 10' (wick structure).

When the vapor chamber manufacturing member 10' is in the form of a sheet, the sheet-like fiber base material 13 (fibers 131) may be present over almost the entire thickness of the vapor chamber manufacturing member 10' as shown in FIG. 7, or may be unevenly distributed near the center of the thickness of the vapor chamber manufacturing member 10' as shown in FIG. 8, or may be unevenly distributed on one side of the vapor chamber manufacturing member 10' as shown in FIG. 9. The sheet-like fiber base material 13 (fibers 131) may be unevenly distributed on both sides of the vapor chamber manufacturing member 10', and the content of fibers 131 near the center of the thickness of the vapor chamber manufacturing member 10' may be lower than those portions.

The thickness of the vapor chamber manufacturing component 10' is preferably 10 μm or more and 2000 μm or less, more preferably 20 μm or more and 1000 μm or less, and even more preferably 30 μm or more and 500 μm or less.

This makes it possible to prevent the vapor chamber 100 manufactured using the vapor chamber manufacturing component 10' from becoming unnecessarily thick, while more suitably forming the flow path portion for the gaseous working fluid 30 and the flow path portion for the liquid working fluid 30.

[3] Manufacturing Method of Vapor Chamber Next, a manufacturing method of the vapor chamber of the present invention will be described.

Figures 10 and 11 are vertical cross-sectional views that show a schematic example of a method for manufacturing a vapor chamber of the present invention.

The method for manufacturing the vapor chamber 100 of this embodiment includes a vapor chamber manufacturing component preparation process (1a) for preparing a vapor chamber manufacturing component 10' made of a material containing an uncured resin material 14', a first joining process (1b) for joining the vapor chamber manufacturing component 10' to a first sheet material 21 made of a metal material at a first surface 11, which is one surface of the vapor chamber manufacturing component 10', and a second joining process (1c) for applying light (exposure light) E in a predetermined pattern to the vapor chamber manufacturing component 10' joined to the first sheet material 21. The method includes an exposure process (1c) in which the resin material 14' is irradiated with light E; a development process (1d) in which the uncured resin material 14' is removed from the portion not irradiated with light E in the exposure process; a second joining process (1e) in which the vapor chamber manufacturing component 10' that has been subjected to the development process is joined to a second sheet material 22 made of a metal material on a second surface 12, which is the surface opposite to the first surface 11; and a working liquid supply and sealing process (1f) in which a working liquid 30 is injected into the space between the first sheet material 21 and the second sheet material 22 and the space is sealed.

This provides a method for manufacturing a vapor chamber that is excellent in flexibility and can be used to manufacture a vapor chamber with particularly excellent heat transport capacity. Furthermore, because the manufactured vapor chamber 100 can be made to have excellent flexibility, the vapor chamber 100 can be made to have a good adhesion state with the member to which the vapor chamber 100 is applied, regardless of the member or arrangement, etc., and the vapor chamber 100 can more reliably exhibit excellent heat transport capacity.

[3-1] Process for preparing components for manufacturing vapor chambers In the process for preparing components for manufacturing vapor chambers, a component 10' for manufacturing vapor chambers is prepared that is made of a material containing an uncured resin material 14', in particular a component 10' for manufacturing vapor chambers that contains fibers 131 together with the uncured resin material 14' as described above (1a).

The vapor chamber manufacturing component 10' can be obtained, for example, by impregnating a fiber base material 13 with a composition containing an uncured resin material 14'.

The composition may contain, for example, the resin material 14' as well as the other components described above. The composition may also contain a solvent. When the composition contains a solvent, the fiber substrate 13 is impregnated with the composition and then the solvent is evaporated to obtain a vapor chamber manufacturing component 10'.

The composition may be applied, for example, from the side of the fiber substrate 13 that corresponds to the first side 11, from the side of the fiber substrate 13 that corresponds to the second side 12, or from both the side of the fiber substrate 13 that corresponds to the first side 11 and the side of the fiber substrate 13 that corresponds to the second side 12.

Methods for applying the composition to the fiber substrate 13 include, for example, a coating method, a spraying method, a dipping method, etc.

[3-2] First Bonding Step In the first bonding step, the vapor chamber manufacturing member 10' is bonded to a first sheet material 21 at the first surface 11, which is one surface of the vapor chamber manufacturing member 10' (1b).

The uncured resin material 14' constituting the vapor chamber manufacturing component 10' can be brought into contact with the first sheet material 21 and then pressure applied to achieve a favorable bond. The bonding can be further improved by applying heat in addition to pressure.

[3-3] Exposure Step In the exposure step, the vapor chamber manufacturing member 10' joined to the first sheet material 21 is irradiated with light E in a predetermined pattern (1c).

As a result, the portions of the resin material 14' irradiated with the light E are selectively cured to become the cured resin 14. In other words, it is possible to form the cured portions corresponding to the portions that are to become the flow path walls 16 made of the cured resin 14 in a pattern that corresponds to the irradiation pattern of the light E.

The curing reaction in this step does not have to proceed completely, but only needs to proceed to the extent that the uncured resin material 14' can be removed in the subsequent development step while leaving the cured resin 14 behind.

The type of light E irradiated in this process is determined according to the type of resin material 14', but ultraviolet light is preferred.

This allows the resin material 14' to be cured effectively with a relatively short exposure process, improving the productivity of the vapor chamber 100.

The exposure step may be carried out, for example, by scanning light such as laser light in a predetermined pattern, but is preferably carried out using a photomask.

[3-4] Development Step In the development step, the uncured resin material 14' in the area not irradiated with the light E in the exposure step is removed (1d).

This allows the resin material 14' to be removed while leaving the cured resin 14 and the fibers 131. This allows the appearance of areas that will become the flow path walls 16 in a predetermined pattern, i.e., a pattern that corresponds to the irradiation pattern of the light E.

The development process can be suitably carried out by using a developer that selectively dissolves the resin material 14' and does not dissolve the cured resin 14.

The composition of the developer varies depending on the resin material 14', the cured resin 14, etc., but for example, if the resin material 14' contains an alkali-soluble resin as described above, an alkaline aqueous solution such as sodium hydroxide or tetramethylammonium hydroxide can be suitably used.

[3-5] Second bonding process In the second bonding process, the vapor chamber manufacturing member 10' that has undergone the development process is bonded to a second sheet material 22 on the second surface 12, which is the surface opposite to the first surface 11 (1e).

The second sheet material 22 and the vapor chamber manufacturing member 10' may be joined by applying an adhesive to the second sheet material 22 or the vapor chamber manufacturing member 10', but if a resin material 14' that satisfies the above-mentioned conditions (particularly, one that contains a thermosetting resin other than the alkali-soluble resin, in addition to an alkali-soluble resin and a photopolymerizable resin) is used, the vapor chamber manufacturing member 10' and the second sheet material 22 are brought into contact with each other and then heated, so that the thermosetting resin exhibits adhesiveness during the thermal curing process, and the bonding strength between the second sheet material 22 and the vapor chamber manufacturing member 10' (wick structure) can be made particularly excellent. Similarly, the bonding strength between the first sheet material 21 and the vapor chamber manufacturing member 10' (wick structure) can also be made particularly excellent.

In particular, when the resin material 14' contains a thermosetting resin other than an alkali-soluble resin, it is preferable to perform a heat treatment in this process to cause the resin material 14' to develop adhesiveness and then thermally harden the resin material 14'.

This allows for better adhesion between the deformation prevention member 10 (wick structure) and the container 20, and also allows for better strength of the deformation prevention member 10 (wick structure), resulting in better durability and reliability of the vapor chamber 100.

The heating temperature in this process is preferably 80°C or higher and 250°C or lower, more preferably 90°C or higher and 220°C or lower, and even more preferably 100°C or higher and 200°C or lower.

This makes it possible to more effectively prevent undesired deterioration of the constituent materials of the vapor chamber 100, while more significantly achieving the effects described above. It also makes it possible to improve the productivity of the vapor chamber 100.

In addition, in this process, heating under different conditions may be performed in combination. Specifically, for example, a heating treatment under pressure (thermocompression bonding) may be performed in combination with a subsequent heating treatment after the pressure is released (post-cure).

The heating time in this step is preferably from 0.1 minutes to 600 minutes.
This makes it possible to more effectively prevent undesired deterioration of the materials constituting the vapor chamber 100, and to more significantly exhibit the effects described above. In addition, the productivity of the vapor chamber 100 can be improved.

As described above, when a combination of heat treatment under pressure (thermocompression bonding) and subsequent heat treatment after the pressure is released (post-cure) is performed, the processing time for the heat treatment under pressure (thermocompression bonding) is preferably 0.1 minutes or more and 10 minutes or less, and the processing time for the heat treatment after the pressure is released (post-cure) is preferably 20 minutes or more and 480 minutes or less.

[3-6] Hydraulic Fluid Supplying and Sealing Step In the hydraulic fluid supplying and sealing step, hydraulic fluid 30 is injected into the space between the first sheet material 21 and the second sheet material 22, and the space is sealed (1f).

The hydraulic fluid 30 can be injected, for example, in a state where the space between the first sheet material 21 and the second sheet material 22 is reduced in pressure by vacuum drawing.

By reducing the pressure in the space between the first sheet material 21 and the second sheet material 22, the boiling point of the working fluid 30 can be lowered, and the evaporation and condensation cycle of the working fluid 30 can be carried out more efficiently, thereby further enhancing the heat transport effect and the heat uniformity effect.

After the hydraulic fluid 30 is injected, the injection section for the hydraulic fluid 30 is sealed, and the deformation prevention member 10 (wick structure) and the space containing the hydraulic fluid 30 are sealed liquid-tight and airtight.

The deformation prevention member 10 (wick structure) and the space containing the working fluid 30 are sealed by forming a sealing portion 23.

Methods for forming the sealing portion 23 include, for example, plating up, laser welding, seam welding, cold pressure welding, diffusion bonding, brazing, and adhesive bonding.

The above describes a preferred embodiment of the present invention, but the present invention is not limited to the above, and any modifications or improvements that can achieve the object of the present invention are included in the present invention.

For example, the method for manufacturing a vapor chamber of the present invention may include other steps in addition to the steps described above.

Furthermore, the vapor chamber of the present invention is not limited to being manufactured by the method described above, but may be manufactured by any method.

For example, in the above embodiment, a container is formed using two metal sheet materials (a first sheet material and a second sheet material), but the container may be formed using one metal sheet material, or may be formed using three or more metal sheet materials.

In addition, in the above-described embodiment, a case has been described in which the wick structure constituting the vapor chamber contains fibers together with a resin material, but the wick structure may not contain fibers. In other words, the deformation prevention member does not have to be formed integrally with the fibers.

In addition, in the above-mentioned embodiment, the vapor chamber has been mainly described as being used for the purpose of transferring heat from a heat-generating component to a specified location, but the vapor chamber may also be used for the purpose of, for example, equalizing the heat of a localized high-temperature portion of a heat-generating component.

100: Vapor chamber 10: Deformation prevention member 10': Vapor chamber manufacturing member 11: First surface 12: Second surface 13: Fiber base material (fiber sheet)
131: Fiber 14': Resin material 14: Resin hardened material 15: Flow path portion 16: Flow path wall 20: Container 21: First sheet material 22: Second sheet material 23: Sealing portion 30: Working liquid (working fluid)
S: Spacing L: Width E: Light (exposure light)

Claims (12)

A container made of a metal material and having a hollow space therein;
a deformation prevention member that is arranged in the hollow portion and has a function of preventing deformation of the container in a thickness direction and is made of a resin material;
a hydraulic fluid disposed in the cavity ,
A vapor chamber characterized in that the deformation prevention member is formed integrally with a fiber that functions as a wick . The vapor chamber of claim 1, wherein the deformation prevention member has a height of 10 μm or more and 2000 μm or less. the deformation prevention member has a portion that functions as a flow path wall of the hydraulic fluid,
The vapor chamber according to claim 1 or 2, wherein the width of the flow path wall is 5 μm or more and 1000 μm or less. the deformation prevention member has a portion that functions as a flow path wall of the hydraulic fluid,
The vapor chamber according to claim 4 , wherein the fiber substrate made of the fibers is arranged to penetrate a portion that functions as a flow path wall for the working fluid. The vapor chamber according to claim 5, wherein the thickness of the fiber substrate is 10 μm or more and 1000 μm or less. The vapor chamber according to any one of claims 4 to 6, wherein the fibers are glass fibers. The vapor chamber according to any one of claims 1 to 7, wherein the container is mainly composed of Cu or a Cu alloy. The container is formed by joining sheet materials,
9. The vapor chamber according to claim 1, wherein the sheet material has a thickness of 12 μm or more and 500 μm or less. A vapor chamber manufacturing component preparation process for preparing a vapor chamber manufacturing component made of a material including an uncured resin material;
A first joining step of joining the vapor chamber manufacturing member to a first sheet material made of a metal material at a first surface, which is one surface of the vapor chamber manufacturing member;
an exposure step of irradiating the vapor chamber manufacturing member joined to the first sheet material with light in a predetermined pattern;
a developing step for removing the uncured resin material from the portion not irradiated with the light in the exposure step;
A second joining process of joining the vapor chamber manufacturing member that has undergone the developing process to a second sheet material made of a metal material on a second surface that is the surface opposite to the first surface;
A method for manufacturing a vapor chamber, comprising a hydraulic fluid supply and sealing process for injecting a hydraulic fluid into the space between the first sheet material and the second sheet material and sealing the space. The method for manufacturing a vapor chamber according to claim 9 , wherein the resin material contains an alkali-soluble resin and a photopolymerizable resin. The method for manufacturing a vapor chamber according to claim 10 , wherein the alkali-soluble resin contains a (meth)acrylic group and a phenolic hydroxyl group. the resin material further includes a thermosetting resin different from the alkali-soluble resin,
The method for manufacturing a vapor chamber according to claim 10 or 11 , wherein the resin material is made adhesive by heat treatment in the second bonding step, and then the resin material is thermally cured.

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