JP7848919B2 - Components for manufacturing a vapor chamber, a vapor chamber, and a method for manufacturing a vapor chamber. - Google Patents

Description

This invention relates to components for manufacturing vapor chambers, vapor chambers, and methods for manufacturing vapor chambers.

For example, heat-generating components such as central processing units (CPUs), light-emitting diodes (LEDs), and power semiconductors used in mobile devices such as handheld terminals and tablet terminals are cooled by heat pipes (see, for example, Patent Document 1).

In recent years, in order to make mobile devices and other electronic devices thinner, development of vapor chambers, which can be made thinner than heat pipes, has been progressing.

The vapor chamber contains a working fluid, which absorbs heat from the heat-generating component and transfers that heat, thereby cooling the component.

More specifically, the working fluid in the vapor chamber absorbs heat from the heat-generating element in the area close to it (the evaporation section), evaporates into vapor, and then the vapor moves to a position away from the evaporation section, cools, and condenses back into a liquid.

The vapor chamber contains a liquid flow channel that functions as a capillary structure (wick). The liquid working fluid is transported through this channel towards the evaporation section, where it is heated again and evaporates.

In this way, the working fluid undergoes phase changes, i.e., repeated evaporation and condensation, as it refluxes within the vapor chamber, thereby transferring heat from the device and improving heat dissipation efficiency.

However, conventional vapor chambers lack flexibility, and depending on the shape of the heat-generating component, it was sometimes impossible to achieve sufficiently good adhesion with the heat-generating component. Furthermore, there is a need for further improvement in the heat transport capacity of vapor chambers.

Japanese Patent Publication No. 2016-205693

The object of the present invention is to provide a vapor chamber manufacturing component that is suitable for use in manufacturing a vapor chamber that is excellent in flexibility and has particularly excellent heat transport capacity, and also to provide a vapor chamber and a method for manufacturing the same that are excellent in flexibility and have particularly excellent heat transport capacity.

These objectives are achieved by the present invention as described in (1) to (11) below.
(1) A vapor chamber manufacturing component used in the manufacture of the wick structure of a vapor chamber having a wick structure and a working fluid,
The wick structure has multiple portions that extend in its longitudinal direction and are made of a material including a cured resin and fibers, which function as flow path walls for the working fluid, and the space between the flow path walls is configured to form the flow path portion for the working fluid.
A component for manufacturing a vapor chamber, characterized by comprising the aforementioned fibers, an uncured resin material containing at least a photopolymerizable resin and an alkali-soluble resin corresponding to the cured resin product, and a photosensitive agent.

(2) A vapor chamber manufacturing component used in the manufacture of the wick structure of a vapor chamber having a wick structure and a working fluid,
The wick structure has multiple portions that extend in its longitudinal direction and are made of a material including a cured resin and fibers, which function as flow path walls for the working fluid, and the space between the flow path walls is configured to form the flow path portion for the working fluid.
A component for manufacturing a vapor chamber, characterized by comprising a fibrous substrate composed of the aforementioned fibers, and an uncured resin material and a photosensitive agent impregnated into the fibrous substrate, the resin material containing at least a photopolymerizable resin and an alkali-soluble resin corresponding to the cured resin.

(3) The vapor chamber manufacturing component according to (2) above, wherein the thickness of the fibrous substrate is 10 μm or more and 1000 μm or less.

(4) The vapor chamber manufacturing component according to (2) or (3) above, wherein the thickness of the vapor chamber manufacturing component is 10 μm or more and 2000 μm or less.

(5) The vapor chamber manufacturing component according to any one of (1) to (4) above, wherein the fiber is composed of an aromatic resin containing a heterocycle in its molecule.

(6) A vapor chamber manufacturing component according to any one of (1) to (5) above, wherein the fiber content in the vapor chamber manufacturing component is Xf [mass%] and the resin material content is Xr [mass%], and the relationship 0.01 ≤ Xf/Xr ≤ 8.0 is satisfied.

( 7 ) The component for manufacturing a vapor chamber according to any one of (1) to (6) above, wherein the alkali-soluble resin contains a (meth)acrylic group and a phenolic hydroxyl group.

( 8 ) The vapor chamber manufacturing component according to any one of (1) to (7) above , wherein the resin material further comprises a thermosetting resin different from the alkali-soluble resin.

(9) A container having a hollow part inside,
A wick structure placed in the aforementioned cavity,
A vapor chamber having a working fluid disposed in the cavity,
The wick structure has multiple portions that extend in its longitudinal direction and are composed of a material including a resin cured product made from a photopolymerizable resin, an alkali-soluble resin, and a photosensitive agent, and fibers, and functions as flow channel walls for the working fluid, the space between the flow channel walls is configured to form a flow channel portion for the working fluid, and the fibers are arranged in a portion of the flow channel portion for the working fluid where the resin cured product is not present.

( 10 ) The vapor chamber according to ( 9 ) above, wherein the wick structure is formed using the vapor chamber manufacturing component described in any of (1) to ( 8 ) above.

( 11 ) A vapor chamber manufacturing component preparation step, which includes preparing a component for manufacturing a vapor chamber comprising fibers, an uncured resin material containing at least a photopolymerizable resin and an alkali-soluble resin, and a photosensitive agent .
A first joining step involves joining the vapor chamber manufacturing member to a first sheet material on one of its surfaces, which is a first surface.
An exposure step in which light is irradiated in a predetermined pattern onto the vapor chamber manufacturing member bonded to the first sheet material,
A developing step to remove the uncured resin material in the areas that were not irradiated with light in the exposure step,
A second joining step is performed in which the vapor chamber manufacturing member that has undergone the development step is joined to a second sheet material on a second surface which is the surface opposite to the first surface,
A method for manufacturing a vapor chamber, characterized by comprising a working fluid supply and sealing step of injecting working fluid into the space between the first sheet material and the second sheet material and sealing the space.

According to the present invention, it is possible to provide a vapor chamber manufacturing component that is suitable for use in manufacturing a vapor chamber that is excellent in flexibility and has particularly excellent heat transport capacity, and also to provide a vapor chamber and a method for manufacturing the same that are excellent in flexibility and have particularly excellent heat transport capacity.

This is a schematic perspective view showing an example of a component for manufacturing a vapor chamber according to the present invention. This is a schematic longitudinal cross-sectional view showing an example of a component for manufacturing a vapor chamber according to the present invention. This is a schematic longitudinal cross-sectional view showing another example of a component for manufacturing a vapor chamber according to the present invention. This is a schematic longitudinal cross-sectional view showing another example of a component for manufacturing a vapor chamber according to the present invention. This is a schematic longitudinal cross-sectional view showing an example of the vapor chamber of the present invention. This is a schematic longitudinal cross-sectional view showing another example of the vapor chamber of the present invention. This is a schematic longitudinal cross-sectional view showing another example of the vapor chamber of the present invention. This is a schematic longitudinal cross-sectional view showing another example of the vapor chamber of the present invention. This is a schematic plan view showing the wick structure of the vapor chamber of the present invention. This is a schematic longitudinal cross-sectional view showing an example of a method for manufacturing a vapor chamber according to the present invention. This is a schematic longitudinal cross-sectional view showing an example of a method for manufacturing a vapor chamber according to the present invention.

The present invention will be described in detail below with reference to the attached figures.
[1] Components for manufacturing vapor chambers First, the components for manufacturing vapor chambers of the present invention will be described.
Figure 1 is a schematic perspective view showing an example of a vapor chamber manufacturing component of the present invention. Figure 2 is a schematic longitudinal cross-sectional view showing an example of a vapor chamber manufacturing component of the present invention. Figures 3 and 4 are schematic longitudinal cross-sectional views showing other examples of vapor chamber manufacturing components of the present invention, respectively.

The vapor chamber manufacturing component 10' is used in the manufacture of the vapor chamber 100, which will be described later. More specifically, the vapor chamber manufacturing component 10' is a wick structure manufacturing component used in the manufacture of the wick structure 10, which is a molded body that makes up the vapor chamber 100.

Furthermore, the vapor chamber manufacturing component 10' includes fibers 131 and an uncured resin material 14'.

This makes it possible to provide a vapor chamber manufacturing component 10' that is suitable for use in manufacturing a vapor chamber 100 that is highly flexible and has particularly excellent heat transport capacity. Furthermore, because the flexibility of the vapor chamber 100 can be improved, regardless of the components or arrangement to which the vapor chamber 100 is applied, a good degree of contact between the vapor chamber 100 and the components can be maintained, thereby more reliably demonstrating its excellent heat transport capacity.

The excellent effects obtained are thought to be due to the following reasons. Specifically, because the vapor chamber manufacturing member 10' contains fibers 131 and an uncured resin material 14', the wick structure 10 formed using the vapor chamber manufacturing member 10' can be made of a material containing fibers 131 and cured resin 14, and the vapor chamber 100 as a whole can exhibit excellent flexibility. Furthermore, because the vapor chamber manufacturing member 10' contains an uncured resin material 14', for example, by irradiating it with light (exposure light) in a predetermined pattern in a method described later, the flow path portion 15 of the working fluid 30 in the vapor chamber 100, in particular the flow path portion of the gaseous working fluid 30 (the portion of the flow path portion 15 in which fibers 131 do not exist, or the portion in which the density of fibers 131 is low) and the flow path portion of the liquid working fluid 30 (the portion of the flow path portion 15 in which fibers 131 exist, or the portion in which the density of fibers 131 is high) can be suitably formed. More specifically, a structure for moving the gaseous working fluid 30 and a structure for moving the liquid working fluid 30 by capillary action can be formed in a suitable arrangement. This allows for an acceleration of the evaporation and condensation cycle of the working fluid 30, resulting in particularly excellent heat transport capacity for the vapor chamber 100 as a whole. However, some of the liquid working fluid 30 may flow through the flow path portion of the gaseous working fluid 30 (the portion of the flow path portion 15 where fibers 131 are absent or where the density of fibers 131 is low), or some of the gaseous working fluid 30 may flow through the flow path portion of the liquid working fluid 30 (the portion of the flow path portion 15 where fibers 131 are present or where the density of fibers 131 is high).

Furthermore, the shape of the flow path portion 15 and flow path wall 16 of the vapor chamber 100 (wick structure 10) manufactured using the vapor chamber manufacturing component 10' can be suitably adjusted according to the application and application area of the vapor chamber 100. In other words, it offers excellent on-demand capabilities. Moreover, the vapor chamber 100 (wick structure 10) can be suitably manufactured by general processes such as light irradiation and heat treatment, allowing for the production of a vapor chamber 100 with the excellent characteristics described above without the need for complex metalworking. Additionally, the flow path portion for the gaseous working fluid 30 and the flow path portion for the liquid working fluid 30 can be formed in a common process, eliminating the need for alignment of these portions. Therefore, high productivity and high yield can be achieved in the manufacturing of the vapor chamber 100.

The uncured resin material 14' can be any curable resin material in which the curing reaction has not yet been completed; it may also be a resin material in which the curing reaction has partially progressed, for example, a resin material in stage B.

In particular, in the illustrated configuration, the vapor chamber manufacturing component 10' includes a fibrous substrate 13 composed of fibers 131 and an uncured resin material 14' impregnated into the fibrous substrate 13.

This allows the above-mentioned effects to be exhibited more clearly. For example, by including a fiber base material 13 in which multiple fibers 131 are intertwined, rather than only containing fibers 131 in an independent state, it becomes easier to adjust the gaps between the fibers 131 in the vapor chamber manufacturing member 10' to a state where the liquid working fluid 30 is more likely to exhibit capillary action, and it also becomes easier to adjust the arrangement of the fibers 131 in the vapor chamber manufacturing member 10'. Therefore, in the wick structure 10 formed using the vapor chamber manufacturing member 10', the flow path portion for the gaseous working fluid 30 and the flow path portion for the liquid working fluid 30 can be formed more favorably, and the above-mentioned effects can be exhibited more reliably. Furthermore, the manufacturing of the vapor chamber manufacturing component 10' becomes easier, and the arrangement and distribution of the fibers 131 within the vapor chamber manufacturing component 10' can be easily adjusted. For example, undesirable uneven distribution of fibers 131 in various parts of the vapor chamber manufacturing component 10' (for example, insufficient fibers 131 in areas that should become flow path portions 15) can be effectively prevented.

In the illustrated configuration, the fibrous substrate 13 is in the form of a sheet, but the shape of the fibrous substrate 13 is not particularly limited.

Furthermore, in the illustrated configuration, the vapor chamber manufacturing component 10' is sheet-shaped, and in particular, has a shape corresponding to the sheet-shaped fibrous base material 13. However, the shape of the vapor chamber manufacturing component 10' is not particularly limited.

[1-1] Fibers The vapor chamber manufacturing component 10' contains fibers 131.

The fiber 131 may be composed of any material. Examples of constituent materials for the fiber 131 include cotton, hemp, wool, polyester resin, polyamide resin, acrylic resin, aromatic resins containing heterocyclic rings in their molecules, glass, carbon, iron, silver, copper, etc. One or more of these can be selected and used in combination.

In particular, if the fiber 131 is composed of an aromatic resin containing heterocyclic rings in its molecule, the long-term durability of the vapor chamber 100 is improved.

Aromatic resins containing heterocyclic rings in their molecules include polyimides, polyamideimides, polyesterimides, and polybenzoxazoles, among which polyphenylenebenzobisoxazole is preferred. A commercially available fiber composed of poly(p-phenylenebenzobisoxazole) is, for example, Zylon manufactured by Toyobo Co., Ltd.

The thickness of the fiber 131 is not particularly limited, but is preferably 1 μm to 100 μm, more preferably 4 μm to 30 μm, and even more preferably 5 μm to 15 μm.

This prevents the vapor chamber manufacturing component 10' from becoming excessively thick, while ensuring a more favorable gap between the fibers 131, thereby improving the capillary action transport capacity of the liquid working fluid 30 in the vapor chamber 100. As a result, the heat transport capacity of the vapor chamber 100 can be improved.

In the vapor chamber manufacturing component 10' and the vapor chamber 100, the fibers 131 may be included, for example, in a state where multiple fibers 131 are bundled together, i.e., as fiber bundles. Examples of fiber bundles include multi-twisted yarns, single-twisted yarns, Lang-twisted yarns, and braided cords.

This prevents the vapor chamber manufacturing component 10' from becoming excessively thick, while ensuring a more favorable gap between the fibers 131, thereby improving the capillary action transport capacity of the liquid working fluid 30 in the vapor chamber 100. As a result, the heat transport capacity of the vapor chamber 100 can be improved.

In the illustrated configuration, the fibers 131 constitute a sheet-like fibrous substrate (fiber sheet) 13.

This allows the effects of including the fibrous base material 13, as described above, to be realized. Furthermore, because the fibrous base material 13 is in sheet form, it is possible to effectively prevent the vapor chamber manufacturing member 10' from becoming excessively thick, and to more effectively prevent unintended deformation of the fibrous base material 13 during the manufacturing of the vapor chamber 100 (wick structure 10), and unintended movement of the fibers 131 within the vapor chamber manufacturing member 10' (wick structure 10).

The fibrous base material 13 may be, for example, a nonwoven fabric or a woven fabric.
If the fiber base material 13 is a woven fabric, examples of such woven fabrics include plain weave, twill weave, satin weave, gauze weave, ribbed weave, double weave, and the like.

The thickness of the fibrous base material 13 is preferably 10 μm or more and 1000 μm or less, more preferably 20 μm or more and 500 μm or less, and even more preferably 30 μm or more and 200 μm or less.

This prevents the vapor chamber manufacturing component 10' from becoming excessively thick, while ensuring a more favorable gap between the fibers 131, thereby further improving the capillary action transport capacity of the liquid working fluid 30 in the vapor chamber 100. As a result, the heat transport capacity of the vapor chamber 100 can be further improved.

The fibrous base material 13 may have areas with different fiber densities. For example, the fibrous base material 13 may have areas with different fiber densities in the thickness direction.

The vapor chamber manufacturing component 10' may include multiple fibrous substrates 13. In this case, these fibrous substrates 13 may be under the same conditions or under different conditions. When the vapor chamber manufacturing component 10' includes multiple fibrous substrates 13, for example, the multiple fibrous substrates 13 may be laminated in the thickness direction of the vapor chamber manufacturing component 10'.

Even if the vapor chamber manufacturing component 10' includes a fibrous base material 13, it may further include fibers 131 independent of the fibrous base material 13.

The fiber content 131 in the vapor chamber manufacturing component 10' is preferably 1% by mass or more and 80% by mass or less, more preferably 3% by mass or more and 75% by mass or less, and even more preferably 5% by mass or more and 70% by mass or less.

In particular, when the fibers 131 are composed of inorganic materials, the fiber content in the vapor chamber manufacturing component 10' is preferably 40% by mass or more and 80% by mass or less, more preferably 45% by mass or more and 75% by mass or less, and even more preferably 50% by mass or more and 70% by mass or less.

Furthermore, when the fiber 131 is composed of an organic material, the fiber 131 content in the vapor chamber manufacturing component 10' is preferably 1% by mass or more and 40% by mass or less, more preferably 3% by mass or more and 35% by mass or less, and even more preferably 5% by mass or more and 30% by mass or less.

By satisfying the above-mentioned content ratio conditions, the ratio of the gaseous working fluid 30 flow path portion to the liquid working fluid 30 flow path portion in the vapor chamber 100 (wick structure 10) manufactured using the vapor chamber manufacturing component 10' can be made more favorable.

[1-2] Resin material The vapor chamber manufacturing component 10' contains an uncured resin material 14'.

The resin material 14' may contain an uncured curable resin, or it may contain a partially cured resin (for example, a resin in stage B), or it may contain a thermoplastic resin in addition to the uncured curable resin.

In particular, the resin material 14' preferably contains an alkali-soluble resin and a photopolymerizable resin.

This allows for the formation of a predetermined pattern through the exposure and development steps in the method described later, and in the development step, an alkaline aqueous solution with a lower environmental impact can be suitably used instead of an organic solvent, which is widely used as a developer.

The following describes alkali-soluble resins.
Examples of alkali-soluble resins include novolac resins such as cresol type, phenol type, bisphenol A type, bisphenol F type, catechol type, resorcinol type, and pyrogallol type; acrylic resins such as phenol aralkyl resins, hydroxystyrene resins, methacrylic acid resins, and methacrylic acid ester resins; cyclic olefin resins containing hydroxyl groups, carboxyl groups, etc.; and polyamide resins (specifically, resins having at least one of a polybenzoxazole structure and a polyimide structure, and having hydroxyl groups, carboxyl groups, ether groups, or ester groups in the main chain or side chain; resins having a polybenzoxazole precursor structure; resins having a polyimide precursor structure; resins having a polyamic acid ester structure, etc.).

As the alkali-soluble resin, for example, a resin having alkali-soluble groups and double bonds can be suitably used.

Examples of resins having alkali-soluble groups and double bonds include curable resins that can be cured by both light and heat.

Examples of alkali-soluble groups include hydroxyl groups and carboxyl groups. These alkali-soluble groups can also contribute to thermosetting reactions.

Examples of such resins include thermosetting resins having photoreactive groups such as acryloyl groups, methacryloyl groups, and vinyl groups, and photocurable resins having thermally reactive groups such as phenolic hydroxyl groups, alcoholic hydroxyl groups, carboxyl groups, and acid anhydride groups. Furthermore, photocurable resins may also have thermally reactive groups such as epoxy groups, amino groups, and cyanate groups. Specifically, examples include (meth)acrylic-modified phenolic resins, (meth)acryloyl group-containing acrylic acid polymers, and carboxyl group-containing (epoxy) acrylates.
Among these, the alkali-soluble resin is preferably one that contains (meth)acrylic groups and phenolic hydroxyl groups, and more preferably a (meth)acrylic-modified phenolic resin.

By using a resin containing alkali-soluble groups, when removing unreacted resin with unreacted double bonds during the developing process, an alkaline aqueous solution with a lower environmental impact can be applied instead of the organic solvents typically used as developers. Furthermore, since the double bonds contribute to the curing reaction, the heat resistance of the cured resin product 14 (described later) can be maintained.

Here, when using a thermosetting resin having photoreactive groups, the modification rate (substitution rate) of the photoreactive groups is not particularly limited, but it is preferably 20 mol% to 80 mol% of the total reactive groups of the alkali-soluble groups and double-bonded resin, and more preferably 30 mol% to 70 mol%.

This allows for improved resolution of the resin material 14' in the manufacturing method of the vapor chamber 100 described later, i.e., improved pattern reproducibility in the exposure process. As a result, it can be more suitably applied to the manufacturing of a vapor chamber 100 equipped with a wick structure 10 having a fine pattern.

On the other hand, when using a photocurable resin having a thermally reactive group, the modification rate (substitution rate) of the thermally reactive group is not particularly limited, but it is preferably 20 mol% to 80 mol% of the total reactive groups of the alkali-soluble group and the resin having a double bond, and more preferably 30 mol% to 70 mol%.

This allows for improved resolution of the resin material 14' in the manufacturing method of the vapor chamber 100 described later, i.e., improved pattern reproducibility in the exposure process. As a result, it can be more suitably applied to the manufacturing of a vapor chamber 100 equipped with a wick structure 10 having a fine pattern.

The weight-average molecular weight of the resin having the alkali-soluble group and double bond is not particularly limited, but is preferably 300,000 or less, and more preferably 5,000 to 150,000.

This allows for excellent shape stability of the resin material 14' in the vapor chamber manufacturing component 10', while also enabling more favorable removal of the resin material 14' during the developing process.

The weight-average molecular weight can be evaluated, for example, using GPC (Glycerin Producing Coefficient of Concentration), and can be calculated using a calibration curve prepared in advance using styrene standard materials. In particular, it can be measured using tetrahydrofuran (THF) as the measurement solvent under a temperature of 40°C. In the examples described later, the values obtained under these conditions are also shown as the weight-average molecular weight.

The content of alkali-soluble resin in the resin material 14' is not particularly limited, but is preferably 10% by mass or more and 80% by mass or less, and more preferably 15% by mass or more and 70% by mass or less.

This allows for excellent shape stability of the resin material 14' in the vapor chamber manufacturing component 10', while also improving resolution during the exposure process and developability during the development process. Furthermore, the heat treatment during the manufacturing process of the vapor chamber 100 improves the bonding strength and adhesion between the wick structure 10 and the container 20 (first sheet material 21, second sheet material 22).

Next, we will explain photopolymerizable resins.
The resin material 14' can be improved in patternability by including a photopolymerizable resin along with the aforementioned alkali-soluble resin.

Examples of photopolymerizable resins include unsaturated polyesters, acrylic compounds such as acrylic monomers and oligomers having at least one acryloyl group or methacryloyl group per molecule, and vinyl compounds such as styrene. One or more of these can be selected and used in combination.

Among these, UV-curable resins primarily composed of acrylic compounds are preferred. Acrylic compounds exhibit a fast curing speed when irradiated with light (exposure light), allowing for suitable patterning of the resin material 14' with a relatively small amount of exposure.

Examples of acrylic compounds include monomers of acrylic acid esters and methacrylic acid esters. More specifically, examples include difunctional acrylates such as ethylene glycol diacrylate, ethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, glycerin diacrylate, glycerin dimethacrylate, 1,10-decanediol diacrylate, and 1,10-decanediol dimethacrylate; and polyfunctional acrylates such as trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexaacrylate, and dipentaerythritol hexamethacrylate.

Among these, (meth)acrylic acid esters are preferred, and acrylic acid esters and alkyl methacrylates with 1 to 15 carbon atoms in the ester moiety are more preferred.
This improves reactivity and enhances sensitivity in the exposure process.

Furthermore, while the photopolymerizable resin is not particularly limited, it is preferable that it is liquid at room temperature (23°C).

This improves curing reactivity with exposure light (especially ultraviolet light). It also facilitates mixing with other components (e.g., alkali-soluble resins). Examples of photopolymerizable resins that are liquid at room temperature include the aforementioned UV-curable resins primarily composed of acrylic compounds.

The weight-average molecular weight of the photopolymerizable resin is not particularly limited, but is preferably 5,000 or less, and more preferably 150 to 3,000.

This improves the reactivity of the resin material 14', thereby increasing sensitivity in the exposure process and improving the resolution of the resin material 14'.

The content of the photopolymerizable resin in the resin material 14' is not particularly limited, but is preferably 9% by mass or more and 40% by mass or less, and more preferably 13% by mass or more and 30% by mass or less.

This allows for a higher level of balance between the heat resistance and flexibility of the resin cured product 14, as described later. Furthermore, it improves the resolution of the resin material 14' in the manufacturing method of the vapor chamber 100, as described later, i.e., the reproducibility of the pattern in the exposure process. As a result, it can be more suitably applied to the manufacture of a vapor chamber 100 equipped with a wick structure 10 having a fine pattern.

When the content of alkali-soluble resin in the resin material 14' is XA [mass%] and the content of photopolymerizable resin in the resin material 14' is XP [mass%], it is preferable that the relationship 0.15 ≤ XP/XA ≤ 0.90 is satisfied, more preferably that 0.19 ≤ XP/XA ≤ 0.87 is satisfied, and even more preferably that 0.22 ≤ XP/XA ≤ 0.33 is satisfied.

This allows for an even better balance of stability in the shape of the resin material 14' in the vapor chamber manufacturing component 10', including resolution during the exposure process, developability during the development process, bonding strength and adhesion between the wick structure 10 and the container 20 (first sheet material 21, second sheet material 22), and the heat resistance and flexibility of the cured resin product 14.

If the resin material 14' contains an alkali-soluble resin and a photopolymerizable resin, it is preferable that the resin material 14' further contains a thermosetting resin different from the alkali-soluble resin.

This allows for improved heat resistance of the vapor chamber 100 (wick structure 10). Furthermore, it enables the development of suitable adhesive properties during the manufacturing process of the vapor chamber 100, as described later, resulting in improved bonding strength and adhesion between the wick structure 10 and the container 20 (first sheet material 21, second sheet material 22).

Examples of the thermosetting resin include novolac-type phenolic resins such as phenol novolac resin, cresol novolac resin, and bisphenol A novolac resin; phenolic resins such as resol phenolic resin; bisphenol-type epoxy resins such as bisphenol A epoxy resin and bisphenol F epoxy resin; novolac-type epoxy resins such as novolac epoxy resin and cresol novolac epoxy resin; biphenyl-type epoxy resin, stilbene-type epoxy resin, triphenolmethane-type epoxy resin, alkyl-modified triphenolmethane-type epoxy resin, triazine nucleus-containing epoxy resin, dicyclopentadiene-modified phenolic epoxy resin; resins having a triazine ring such as urea resin and melamine resin; unsaturated polyester resin, bismaleimide resin, polyurethane resin, diallyl phthalate resin, silicone resin, resin having a benzoxazine ring, cyanate ester resin, etc., and one or more selected from these can be used in combination. Among these, epoxy resins are particularly preferred as the thermosetting resin. This improves the heat resistance of the cured resin 14 (described later) and its adhesion to the fibers 131, the first sheet material 21, and the second sheet material 22.

In particular, it is preferable to use a silicone-modified epoxy resin as the epoxy resin, and it is even more preferable to use a combination of a solid epoxy resin at room temperature (especially a bisphenol-type epoxy resin) and a liquid epoxy resin at room temperature (especially a silicone-modified epoxy resin that is liquid at room temperature).

This allows for an even higher level of balance between the heat resistance and flexibility of the cured resin product 14, as described later. Furthermore, it improves the resolution of the resin material 14' in the manufacturing method of the vapor chamber 100, as described later, i.e., the reproducibility of the pattern in the exposure process. As a result, it can be more suitably applied to the manufacture of a vapor chamber 100 equipped with a wick structure 10 having a fine pattern.

The content of the thermosetting resin in the resin material 14' is not particularly limited, but is preferably 10% by mass or more and 60% by mass or less, and more preferably 15% by mass or more and 55% by mass or less.

This makes it possible to achieve a higher level of both heat resistance and toughness in the resin cured product 14, as described later.

When the content of alkali-soluble resin in the resin material 14' is XA [mass%] and the content of thermosetting resin in the resin material 14' is XT [mass%], it is preferable that the relationship 0.20 ≤ XT/XA ≤ 1.5 is satisfied, more preferably that 0.30 ≤ XT/XA ≤ 1.2 is satisfied, and even more preferably that 0.55 ≤ XT/XA ≤ 0.80 is satisfied.

This allows for an even better balance of factors such as the stability of the shape of the resin material 14' in the vapor chamber manufacturing component 10', resolution during the exposure process, developability during the development process, heat resistance and toughness of the cured resin 14, and bonding strength and adhesion between the wick structure 10 and the container 20 (first sheet material 21, second sheet material 22).

The content of the resin material 14' in the vapor chamber manufacturing component 10' is preferably 10% by mass or more and 95% by mass or less, more preferably 15% by mass or more and 90% by mass or less, and even more preferably 20% by mass or more and 85% by mass or less.

In particular, when the fiber 131 is composed of an inorganic material, the content of the resin material 14' in the vapor chamber manufacturing component 10' is preferably 10% by mass or more and 50% by mass or less, more preferably 15% by mass or more and 45% by mass or less, and even more preferably 20% by mass or more and 40% by mass or less.

Furthermore, when the fiber 131 is composed of an organic material, the content of the resin material 14' in the vapor chamber manufacturing component 10' is preferably 50% by mass or more and 95% by mass or less, more preferably 55% by mass or more and 90% by mass or less, and even more preferably 60% by mass or more and 85% by mass or less.

By satisfying the above-described content requirements, the ratio of the gaseous working fluid 30 flow path portion to the liquid working fluid 30 flow path portion in the vapor chamber 100 (wick structure 10) manufactured using the vapor chamber manufacturing component 10' can be made more favorable.

When the content of fiber 131 in the vapor chamber manufacturing component 10' is Xf [mass%] and the content of resin material 14' is Xr [mass%], it is preferable that the relationship 0.01 ≤ Xf/Xr ≤ 8.0 is satisfied, more preferably that 0.1 ≤ Xf/Xr ≤ 5.0 is satisfied, and even more preferably that 0.3 ≤ Xf/Xr ≤ 3.0 is satisfied.

In particular, when the fiber 131 is composed of an inorganic material, it is preferable that the relationship 0.8 ≤ Xf/Xr ≤ 8.0 is satisfied, more preferably that 1.0 ≤ Xf/Xr ≤ 7.0 is satisfied, and even more preferably that 2.0 ≤ Xf/Xr ≤ 6.0 is satisfied.

Furthermore, if the fiber 131 is composed of an organic material, it is preferable that the relationship 0.01 ≤ Xf/Xr ≤ 0.8 is satisfied, more preferably that 0.05 ≤ Xf/Xr ≤ 0.6 is satisfied, and even more preferably that 0.10 ≤ Xf/Xr ≤ 0.4 is satisfied.

By satisfying the above-described relationship of content ratios, the ratio of the flow path portion for gaseous working fluid 30 to the flow path portion for liquid working fluid 30 in the vapor chamber 100 (wick structure 10) manufactured using the vapor chamber manufacturing component 10' can be made more favorable.

[1-3] Filler The vapor chamber manufacturing component 10' may further contain a filler in addition to the fiber 131 and resin material 14'.

This improves the shape retention of the cured resin product 14 (described later) and enhances the durability of the vapor chamber 100.

The shape of the filler can be anything, including spherical, spindle-shaped, needle-shaped, rod-shaped, fibrous, or flaky forms.

Examples of fillers include organic fillers such as fine particles of phenolic resin, acrylic resin, polyamide, polysulfone, polystyrene, and fluororesin; silicates such as talc, calcined clay, uncalcined clay, mica, and glass; oxides such as titanium dioxide, alumina, fused silica (fused spherical silica, fused crushed silica), and crystalline silica; carbonates such as calcium carbonate, magnesium carbonate, and hydrotalcite; hydroxides such as aluminum hydroxide, magnesium hydroxide, and calcium hydroxide; sulfates or sulfites such as barium sulfate, calcium sulfate, and calcium sulfite; borates such as zinc borate, barium metaborate, aluminum borate, calcium borate, and sodium borate; nitrides such as aluminum nitride, boron nitride, and silicon nitride; carbon-based materials such as graphite and diamond; and metallic materials such as copper and aluminum. One or more of these can be selected and used in combination.

When the filler is spherical, its average particle size is preferably 0.05 μm or more and 0.35 μm or less, more preferably 0.10 μm or more and 0.30 μm or less, and even more preferably 0.10 μm or more and 0.25 μm or less.

This makes it possible to more effectively suppress the generation of residue after the development process in the manufacturing method of the vapor chamber 100, as described later, and to improve the shape retention of the cured resin product 14, as described later.

In this specification, unless otherwise specified, "average particle size" refers to the average particle size based on the number of particles. For example, it can be determined by measurement using a laser diffraction particle size distribution analyzer (SALD-7000) with the filler dispersed in water. Alternatively, the measurement may be performed after ultrasonic treatment of the dispersion. In the examples described later, the average particle size was determined by adding and stirring the filler in water, performing ultrasonic treatment for one minute, and then measuring using a laser diffraction particle size distribution analyzer (SALD-7000).

The content of the filler material in the vapor chamber manufacturing component 10' is preferably 1% by mass or more and 50% by mass or less, more preferably 3% by mass or more and 45% by mass or less, and even more preferably 5% by mass or more and 40% by mass or less.

This makes it possible to more effectively suppress the generation of residue after the development process in the manufacturing method of the vapor chamber 100, as described later, and to further improve the shape retention of the cured resin product 14, as described later.

[1-4] Curing agent The vapor chamber manufacturing component 10' may further contain a curing agent in addition to the fibers 131 and resin material 14'.

The curing agent (photosensitive agent) is not particularly limited as long as it cures the resin material 14'. Examples include benzophenone, acetophenone, benzoin, benzoin isobutyl ether, benzoin methyl benzoate, benzoin benzoic acid, benzoin methyl ether, benzylphenyl sulfide, benzyl, dibenzyl, diacetyl, etc. One or more of these can be selected and used in combination.

The content of the curing agent (photosensitive agent) in the vapor chamber manufacturing component 10' is not particularly limited, but is preferably 0.1% by mass or more and 50% by mass or less, more preferably 0.5% by mass or more and 40% by mass or less, and even more preferably 1.0% by mass or more and 30% by mass or less.

This ensures excellent storage stability for the vapor chamber manufacturing component 10', while also allowing for more favorable initiation and progression of the photopolymerization reaction during the manufacturing of the vapor chamber 100, as described later.

[1-5] Other Components The vapor chamber manufacturing component 10' may contain components other than those described above (hereinafter also referred to as "other components"). Examples of such components include ultraviolet absorbers, leveling agents, coupling agents, flame retardants, antioxidants, etc., and one or more of these can be selected and used in combination.

However, the content of other components in the vapor chamber manufacturing component 10' is preferably 7.0% by mass or less, more preferably 5.0% by mass or less, and even more preferably 3.0% by mass or less.

[1-6] Overall configuration of the vapor chamber manufacturing component The shape of the vapor chamber manufacturing component 10' is not particularly limited, but in the illustrated configuration it is sheet-like.

This allows for the efficient manufacture of a sheet-like vapor chamber 100 (wick structure 10). Furthermore, it more effectively prevents unintended deformation of the vapor chamber manufacturing member 10' and unintended movement of the fibers 131 within the vapor chamber manufacturing member 10' (wick structure 10) during manufacturing.

When the vapor chamber manufacturing component 10' is in the form of a sheet, the sheet-like fibrous base material 13 (fibers 131) may be present throughout almost the entire thickness direction of the vapor chamber manufacturing component 10', as shown in Figure 2; or it may be unevenly distributed near the center of the thickness direction of the vapor chamber manufacturing component 10', as shown in Figure 3; or it may be unevenly distributed on one side of the vapor chamber manufacturing component 10', as shown in Figure 4. Furthermore, the sheet-like fibrous base material 13 (fibers 131) may be unevenly distributed on both sides of the vapor chamber manufacturing component 10', and the fiber content near the center of the thickness direction of the vapor chamber manufacturing component 10' may be lower compared to these areas.

The thickness of the vapor chamber manufacturing component 10' is preferably 10 μm or more and 2000 μm or less, more preferably 20 μm or more and 1000 μm or less, and even more preferably 30 μm or more and 500 μm or less.

This prevents the vapor chamber 100 manufactured using the vapor chamber manufacturing component 10' from becoming excessively thick, while allowing for a more favorable formation of the flow path portion for the gaseous working fluid 30 and the flow path portion for the liquid working fluid 30.

[2] Vapor Chamber Next, the vapor chamber of the present invention will be described.
Figure 5 is a schematic longitudinal cross-sectional view showing an example of the vapor chamber of the present invention. Figures 6 to 8 are schematic longitudinal cross-sectional views showing other examples of the vapor chamber of the present invention, respectively. Figure 9 is a schematic plan view showing the wick structure provided in the vapor chamber of the present invention. Note that the illustration of the fibers 131 is omitted in Figure 9. In the following description, the vapor chamber 100 will be mainly described in the case where the vapor chamber 100 is in contact with the member to which it is applied (heat-generating member) on the lower surface (surface of the first sheet material 21) in Figures 5 to 8, but it may also be used so that the vapor chamber 100 is in contact with the member to which it is applied (heat-generating member) on the upper surface in Figures 5 to 8. Also, although Figures 5 to 8 show the state in which the first sheet material 21 is facing downwards, the orientation of the vapor chamber 100 when using the vapor chamber 100 is not particularly limited, and for example, it may be used with the first sheet material 21 facing upwards.

The vapor chamber 100 comprises a container 20 having a cavity inside, a wick structure 10 disposed within the cavity, and a working fluid 30 disposed within the cavity.

The wick structure 10 is composed of a material containing a cured resin 14 and fibers 131, and the fibers 131 are arranged in a portion of the fluid channel 15 of the working fluid 30 where the cured resin 14 is not present.

This makes it possible to provide a vapor chamber that is highly flexible and, in particular, possesses excellent heat transport capabilities. Furthermore, because the vapor chamber 100 has excellent flexibility, regardless of the components to which it is applied or their arrangement, a good degree of contact between the vapor chamber 100 and the components can be maintained, thereby more reliably demonstrating its superior heat transport capabilities.

[2-1] Container The container 20 houses the wick structure 10 and the working fluid 30. In the evaporation section, it mainly functions to transfer heat to the working fluid 30 housed inside the container 20 by coming into contact with a component to be cooled, such as a heat-generating component, and in the condensation section, it functions to dissipate the heat received from the working fluid 30 as it undergoes a phase transition from a gaseous state to a liquid state.

The container 20 is formed using a first sheet material 21 and a second sheet material 22.

Both the first sheet material 21 and the second sheet material 22 are made of materials with high thermal conductivity. Examples of such materials include metallic materials such as copper, aluminum, magnesium, zinc, and alloys containing at least one of these.

The first sheet material 21 and the second sheet material 22 may be made of the same material or of different materials.

The thickness of the first sheet material 21 and the second sheet material 22 is not particularly limited, but is preferably 12 μm or more and 70 μm or less, and more preferably 18 μm or more and 35 μm or less.

The first sheet material 21 and the second sheet material 22 are sealed at their outer periphery by a sealing portion 23. This seals the wick structure 10 and the cavity containing the working fluid 30, maintaining a liquid-tight and airtight state.

The sealing portion 23 may be made of the same material as the first sheet material 21 or the second sheet material 22, or it may be made of a different material from the first sheet material 21 and the second sheet material 22.

The sealing portion 23 can be formed, for example, by plating, laser welding, seam welding, cold pressure welding, diffusion bonding, brazing, or adhesive bonding.

[2-2] Wick Structure The wick structure 10 is a component that facilitates the flow of the working fluid 30 associated with heat transport, particularly the flow of the working fluid 30 vaporized by heat absorption in the evaporation section of the container 20, and the flow of the working fluid 30 condensed by heat absorption in the condensation section of the container 20.

The wick structure 10 is composed of a material containing a cured resin 14 and fibers 131, and the fibers 131 are arranged in a portion of the flow path 15 of the working fluid 30 where the cured resin 14 is not present. In particular, the flow path 15 has a flow path portion for the gaseous working fluid 30 (a portion of the flow path 15 where fibers 131 are absent or where the density of fibers 131 is low) and a flow path portion for the liquid working fluid 30 (a portion of the flow path 15 where fibers 131 are present or where the density of fibers 131 is high).

Such a wick structure 10 may be formed by any method, but it is preferable that it be formed using the vapor chamber manufacturing component 10' of the present invention described above.

This allows the vapor chamber 100 to be manufactured with high productivity and high yield, for example, by the method described later, thereby improving the reliability of the vapor chamber 100.

When the wick structure 10 is formed using the vapor chamber manufacturing member 10' of the present invention as described above, the wick structure 10 may be manufactured using one vapor chamber manufacturing member 10' or using multiple vapor chamber manufacturing members 10'. When multiple vapor chamber manufacturing members 10' are used, these vapor chamber manufacturing members 10' may be arranged in the planar direction of the wick structure 10, or they may be arranged (stacked) in the thickness direction of the wick structure 10.

The following description will primarily focus on the case where the wick structure 10 is manufactured using the aforementioned vapor chamber manufacturing component 10', and more particularly, the case where it is manufactured using the vapor chamber manufacturing component 10' including the fiber base material 13.

The wick structure 10 is in contact with the inner surface of the container 20 on both sides. More specifically, the wick structure 10 is in contact with the first sheet material 21 on one side, the first surface 11, and with the second sheet material 22 on the other side, the second surface 12.

The fibers 131 and fiber base material 13 constituting the wick structure 10 preferably satisfy the same conditions as described in the section on vapor chamber manufacturing component 10'.

The sheet-like fibrous base material 13 (fibers 131) may be present throughout almost the entire thickness of the wick structure 10, as shown in Figure 5; it may be unevenly distributed near the center of the thickness of the wick structure 10, as shown in Figure 6; it may be unevenly distributed on the second surface 12 side of the wick structure 10, as shown in Figure 7; or it may be unevenly distributed on the first surface 11 side of the wick structure 10, as shown in Figure 8. Furthermore, the sheet-like fibrous base material 13 (fibers 131) may be unevenly distributed on both sides of the wick structure 10 (the first surface 11 side and the second surface 12 side), and the fiber content near the center of the thickness of the wick structure 10 may be lower compared to these areas.

The cured resin product 14 can be suitably obtained by curing the aforementioned resin material 14'.
The wick structure 10 extends in its longitudinal direction, is made of a material containing a cured resin 14, and has multiple portions that function as flow path walls 16 for the working fluid 30.

The spacing S between adjacent channel walls 16 (i.e., the width of the channel portion 15) is not particularly limited, but is preferably 100 μm or more and 1000 μm or less, more preferably 200 μm or more and 800 μm or less, and even more preferably 300 μm or more and 700 μm or less.

This allows for smoother movement of the working fluid 30 (gaseous and liquid working fluid 30) while suppressing an increase in the size of the wick structure 10 and the vapor chamber 100. Furthermore, when reducing the pressure in the portion of the flow path 15 where fibers 131 are absent to lower the boiling point of the working fluid 30, the presence of a flow path wall 16 between the first sheet material 21 and the second sheet material 22 prevents deformation of the first and second sheet materials 21 and 22. As a result, the heat transport capacity of the vapor chamber 100 can be made particularly excellent.

The ratio (L/S) of the width L [μm] of the channel wall 16 to the width S [μm] of the channel portion 15 is not particularly limited, but is preferably 0.05 to 0.50, more preferably 0.08 to 0.40, and even more preferably 0.10 to 0.35.

This allows for improved heat transport capacity and durability of the vapor chamber 100 while suppressing the enlargement of the wick structure 10 and the vapor chamber 100. Conversely, if the L/S value is below the lower limit, deformation of the first sheet material 21 or the second sheet material 22 is more likely to occur when the flow path section 15 is depressurized. Furthermore, if the L/S value exceeds the upper limit, the heat transport efficiency decreases.

In the illustrated configuration, the flow channel portion 15 and the flow channel wall 16 have a constant width, but they may have portions with different widths.

Furthermore, in the illustrated configuration, the flow path portion 15 and the flow path wall 16 are provided in a straight line in one direction, but they may also have curved or bent portions.

[2-3] Working fluid The working fluid 30 is placed in the cavity of the container 20 together with the wick structure 10.

The working fluid 30 primarily functions to transport heat within the cavities inside the container 20.

Examples of the working fluid 30 include water, hydrochlorofluorocarbons such as HCFC-22, hydrofluorocarbons such as HFCR134a, HFCR407C, HFCR410A, and HFC32, hydrofluoroolefins such as HFO1234yf, hydrofluoroethers, alcohols such as ethanol and methanol, acetone, carbon dioxide, ammonia, and propane.

[2-4] Overall configuration of the vapor chamber The thickness of the vapor chamber 100 is preferably 150 μm or more and 3000 μm or less, more preferably 200 μm or more and 2000 μm or less, and even more preferably 250 μm or more and 1000 μm or less.

This prevents the vapor chamber 100 from becoming thicker while allowing for smoother movement of the working fluid 30 (gaseous and liquid working fluid 30). As a result, the heat transport capacity of the vapor chamber 100 can be made particularly excellent. Furthermore, the durability of the vapor chamber 100 can be improved.

[2-5] Usage of the vapor chamber Next, we will describe examples of usage of the vapor chamber of the present invention.

The vapor chamber of the present invention may be used, for example, to transfer heat from a heat-generating element to a predetermined location, or to equalize the heat of a locally high-temperature area of a heat-generating element.

The following description will primarily focus on the case where the vapor chamber of the present invention is used for the purpose of transferring heat from a predetermined component (heat-generating component).

When used for the purpose of cooling heat-generating components (e.g., CPUs), the vapor chamber is used with a portion of its surface (the evaporation area) in contact with the heat-generating component itself or a component made of a highly thermally conductive material that comes into contact with it (e.g., a thermal conductive sheet) (hereinafter, these are collectively referred to as "heat-generating components, etc.").

In this case, the vapor chamber may be in contact with a heat dissipation component (e.g., a heat sink) or a component made of a highly thermally conductive material that comes into contact with it (e.g., a thermal conductive sheet) (hereinafter collectively referred to as "heat dissipation components, etc.") in the condensation section, which is a different section from the evaporation section, i.e., the section that dissipates heat received from the heat-generating component.

As mentioned above, the vapor chamber of the present invention exhibits excellent flexibility.

Therefore, when there is a step between the area where the heat-generating component is installed and the area where the heat-dissipating component should be installed, if conventional heat pipes or vapor chambers with poor flexibility are used, it is necessary to install spacers (e.g., metal spacers) to eliminate or mitigate the step, which leads to problems such as increased costs due to the increase in parts and increased weight of the entire device. In contrast, the vapor chamber of the present invention has excellent flexibility, and can be suitably processed, for example, by bending. Therefore, even if the aforementioned spacers are omitted, a good state of contact with other components (heat-generating components, heat-dissipating components, etc.) in the condensing and evaporation sections can be ensured. Thus, the above-mentioned problems can be suitably resolved while exhibiting good heat dissipation performance.

Furthermore, when using the vapor chamber of the present invention, interference with other components can be effectively avoided by curving or bending the vapor chamber, thereby increasing the degree of freedom in the layout of each component in a device equipped with a heating element.

Furthermore, in this invention, by using the method described above, the shape of the flow path portion and flow path wall of the vapor chamber (wick structure) can be suitably adjusted. Therefore, according to this invention, vapor chambers with complex shapes, such as those with notches, as well as simple shapes like rectangles, can be suitably manufactured, even if they have flow path portions and flow path walls corresponding to those shapes. Consequently, for example, it is possible to increase the contact area with heat-generating components and heat-dissipating components while suitably eliminating interference with other components. This allows for better heat dissipation performance.

Furthermore, in cases where a motor, which acts as a heat-generating component, is housed in a casing (for example, in the joints of a multi-joint robot), a combination of an aluminum molded body and a heat-conducting sheet was sometimes used within the casing to dissipate the heat from the motor to the outside. However, this resulted in the casing becoming larger. In contrast, using the vapor chamber of the present invention eliminates the need for an aluminum molded body, offering advantages in terms of miniaturization of the casing and reduction of the number of parts.

[3] Method for manufacturing a vapor chamber Next, the method for manufacturing a vapor chamber according to the present invention will be described.
Figures 10 and 11 are schematic longitudinal cross-sectional views showing an example of a method for manufacturing a vapor chamber according to the present invention.

The manufacturing method of the vapor chamber 100 of this embodiment comprises: a vapor chamber manufacturing member preparation step (1a) of preparing the vapor chamber manufacturing member 10' of the present invention; a first joining step (1b) of joining the vapor chamber manufacturing member 10' to the first sheet material 21 on one of its surfaces, the first surface 11; and an exposure step (1c) of irradiating the vapor chamber manufacturing member 10' joined to the first sheet material 21 with light (exposure light) E in a predetermined pattern. The method is characterized by comprising: a developing step (1d) to remove the uncured resin material 14' in areas not irradiated with light E during the exposure step; a second joining step (1e) to join the vapor chamber manufacturing member 10', which has undergone the developing step, to the second sheet material 22 on the second surface 12, which is the surface opposite to the first surface 11; and a working fluid supply and sealing step (1f) to inject working fluid 30 into the space between the first sheet material 21 and the second sheet material 22 and to seal the space.

This provides a method for manufacturing a vapor chamber that can suitably produce a vapor chamber with excellent flexibility and particularly superior heat transport capacity. Furthermore, because the manufactured vapor chamber 100 has excellent flexibility, regardless of the components to which the vapor chamber 100 is applied or its arrangement, a good degree of contact between the vapor chamber 100 and the components can be achieved, thereby more reliably demonstrating superior heat transport capacity.

[3-1] Preparation of components for vapor chamber manufacturing In the preparation of components for vapor chamber manufacturing, the vapor chamber manufacturing component 10' of the present invention described above is prepared (1a).

The vapor chamber manufacturing component 10' can be obtained, for example, by impregnating a fibrous substrate 13 with a composition containing an uncured resin material 14'.

The composition may, for example, contain other components mentioned above in addition to the resin material 14'. The composition may also contain a solvent. If the composition contains a solvent, the vapor chamber manufacturing component 10' can be obtained by impregnating the fiber substrate 13 with the composition and then volatilizing the solvent.

The composition may be applied, for example, from the side corresponding to the first surface 11 of the fiber substrate 13, from the side corresponding to the second surface 12 of the fiber substrate 13, or from both sides of the surface corresponding to the first surface 11 and the second surface 12 of the fiber substrate 13.

Methods for applying the composition to the fibrous substrate 13 include, for example, coating, spraying, and immersion methods.

[3-2] First joining process In the first joining process, the vapor chamber manufacturing member 10' is joined to the first sheet material 21 on one of its surfaces, the first surface 11 (1b).

The uncured resin material 14' constituting the vapor chamber manufacturing component 10' can be suitably bonded to the first sheet material 21 by bringing it into contact with the sheet material 21 and applying pressure. Further suitability of the bonding can be achieved by applying heat in addition to pressure.

[3-3] Exposure process In the exposure process, light E is irradiated onto the vapor chamber manufacturing member 10' bonded to the first sheet material 21 in a predetermined pattern (1c).

As a result, the portion of the resin material 14' irradiated with light E selectively hardens, becoming a cured resin product 14. In other words, a cured portion corresponding to the channel wall 16, which is composed of the cured resin product 14, can be formed in a pattern corresponding to the irradiation pattern of light E.

Furthermore, the curing reaction in this process only needs to proceed to the extent that the uncured resin material 14' can be removed in the subsequent developing process while leaving the cured resin product 14 intact; it does not need to proceed completely.

The type of light E irradiated in this process is determined according to the type of resin material 14', but ultraviolet light is preferred.

This allows the resin material 14' to be cured suitably with a relatively short exposure treatment, thereby improving the productivity of the vapor chamber 100.

The exposure process may be performed, for example, by scanning light such as laser light in a predetermined pattern, but it can be preferably carried out using a photomask.

[3-4] Development process In the development process, the uncured resin material 14' in the areas that were not irradiated with light E in the exposure process is removed (1d).

This allows for the removal of the resin material 14' while leaving the cured resin 14 and fibers 131 intact. This makes it possible to reveal the portion that will become the channel wall 16 in a predetermined pattern, i.e., a pattern corresponding to the irradiation pattern of light E.

The development process can be suitably carried out by using a developer that selectively dissolves the resin material 14' but does not dissolve the cured resin product 14.

The composition of the developing solution varies depending on the resin material 14', the cured resin 14, etc. For example, if the resin material 14' contains an alkali-soluble resin as described above, an alkaline aqueous solution such as sodium hydroxide or tetramethylammonium hydroxide can be suitably used.

[3-5] Second joining process In the second joining process, the vapor chamber manufacturing member 10' that has undergone the developing process is joined to the second sheet material 22 on the second surface 12, which is the surface opposite to the first surface 11 (1e).

The bonding of the second sheet material 22 to the vapor chamber manufacturing component 10' may be performed, for example, by applying an adhesive to the second sheet material 22 or the vapor chamber manufacturing component 10'. However, if a resin material 14' that satisfies the aforementioned conditions (particularly one containing an alkali-soluble resin and a photopolymerizable resin, along with a thermosetting resin different from the alkali-soluble resin) is used, heating after contacting the vapor chamber manufacturing component 10' with the second sheet material 22 allows the thermosetting resin to develop adhesive properties during the thermosetting process, resulting in particularly excellent bonding strength between the second sheet material 22 and the vapor chamber manufacturing component 10' (wick structure 10). Similarly, particularly excellent bonding strength can also be achieved between the first sheet material 21 and the vapor chamber manufacturing component 10' (wick structure 10).

In this case, the heating temperature in this process is preferably between 80°C and 250°C, more preferably between 90°C and 220°C, and even more preferably between 100°C and 200°C.

This allows for more effective prevention of unintended deterioration of the constituent materials of the vapor chamber 100, while also demonstrating the aforementioned effects more significantly. Furthermore, it enables improved productivity of the vapor chamber 100.

Furthermore, this process may involve combining heating under different conditions. Specifically, for example, it may combine heating under pressure (thermocompression bonding) with subsequent heating after releasing the pressure (post-curing).

Furthermore, the heating time in this process is preferably between 0.1 minutes and 600 minutes.
This allows for more effective prevention of unintended deterioration of the constituent materials of the vapor chamber 100, while also demonstrating the aforementioned effects more significantly. Furthermore, it enables improved productivity of the vapor chamber 100.

As described above, when combining heat treatment under pressure (thermocompression bonding) and subsequent heat treatment after releasing the pressure (post-curing), the processing time for heat treatment under pressure (thermocompression bonding) is preferably 0.1 minutes or more and 10 minutes or less, and the processing time for heat treatment after releasing the pressure (post-curing) is preferably 20 minutes or more and 480 minutes or less.

[3-6] Working fluid supply and sealing process In the working fluid supply and sealing process, working fluid 30 is injected into the space between the first sheet material 21 and the second sheet material 22, and the space is sealed (1f).

The injection of the working fluid 30 can be suitably performed, for example, by reducing the pressure in the space between the first sheet material 21 and the second sheet material 22 through vacuuming.

By reducing the pressure in the space between the first sheet material 21 and the second sheet material 22, the boiling point of the working fluid 30 can be lowered, allowing the evaporation and condensation cycle of the working fluid 30 to be performed more efficiently, thereby further enhancing the heat transport effect and heat soaking effect.

After the working fluid 30 is injected, the injection port of the working fluid 30 is sealed, and the space containing the wick structure 10 and the working fluid 30 is sealed in a liquid-tight and airtight manner.

The wick structure 10 and the space containing the working fluid 30 are sealed by forming a sealing portion 23.

Methods for forming the sealing portion 23 include, for example, plating, laser welding, seam welding, cold pressure welding, diffusion bonding, brazing, and adhesive bonding.

While preferred embodiments of the present invention have been described above, the present invention is not limited to those described above. Modifications, improvements, and other modifications that can achieve the objectives of the present invention are included within the scope of the present invention.

For example, the method for manufacturing a vapor chamber according to the present invention may further include other steps in addition to the steps described above.

Furthermore, the vapor chamber of the present invention is not limited to those manufactured by the method described above, but may be manufactured by any method.

Furthermore, while the embodiments described above primarily focused on cases where the vapor chamber manufacturing component and the wick structure constituting the vapor chamber of the present invention contain fibers in the form of a sheet-like fibrous substrate (fiber sheet), the vapor chamber manufacturing component and the wick structure constituting the vapor chamber of the present invention may contain fibers in any form, including forms other than a sheet-like fibrous substrate.

Furthermore, while the above-described embodiment primarily focused on the case where the vapor chamber is used to transfer heat from a heat-generating component to a predetermined location, the vapor chamber may also be used, for example, to equalize the heat from a locally high-temperature area of the heat-generating component.

The present invention will be described in detail below based on examples, but the present invention is not limited thereto.

[4] Components for manufacturing vapor chambers, manufacturing of vapor chambers (Example 1)
1. Alkali-soluble resins (synthesis of resins having alkali-soluble groups and double bonds (curable resins that can be cured by both light and heat: methacrylic-modified bisphenol A novolac resin: MPN))

A 500g solution of bisphenol A novolac resin (phenolite LF-4871, manufactured by Dainippon Ink and Chemicals, Inc.) with 60% solids content methyl ethyl ketone (MEK) was placed in a 2L flask. 1.5g of tributylamine as a catalyst and 0.15g of hydroquinone as a polymerization inhibitor were added, and the mixture was heated to 100°C.

Subsequently, 180.9 g of glycidyl methacrylate was added dropwise to the above mixture over 30 minutes, and the mixture was stirred at 100°C for 5 hours to obtain a methacrylic-modified bisphenol A novolac resin with a non-volatile content of 74%. The modification rate of the methacrylic-modified bisphenol A novolac resin (alkali-soluble resin) obtained in this way was 50%.

2. Preparation of Resin Varnish 31.74 parts by mass of methacrylic-modified bisphenol A novolac resin (MPN) synthesized as described above as an alkali-soluble resin (curable resin that can be cured by both light and heat), 9.83 parts by mass of acrylic resin monomer (NK Ester 3G, manufactured by Shin-Nakamura Chemical Co., Ltd.) that is liquid at room temperature as a photopolymerizable resin, 19.84 parts by mass of bisphenol A novolac type epoxy resin (Epiclon N-865, manufactured by Dainippon Ink and Chemicals, Inc.) as a thermosetting resin, 3.63 parts by mass of silicone epoxy resin (BY16-115, manufactured by Toray Dow Corning Silicone Co., Ltd.), and 33.71 parts by mass of silica (KE-P30, manufactured by Nippon Shokubai Co., Ltd., average particle size: 0.28 μm, maximum particle size: 0.9 μm) as a particulate filler were weighed, and methyl ethyl ketone (MEK) was added to prepare the mixture so that the resin component concentration was 71% by mass. The mixture was then stirred until the bisphenol A novolac type epoxy resin (N-865) dissolved.

Next, silica was dispersed using a bead mill (bead diameter 400 μm, processing speed 6 g/s, 5 passes).

Subsequently, 1.25 parts by mass of a hardening agent (photosensitive agent) (Irgacure 651, manufactured by Ciba Specialty Chemicals) was added, and the mixture was stirred with a stirring blade (450 rpm) for 1 hour to obtain a resin varnish.

3. Manufacturing of the adhesive film A portion of the resin varnish prepared in "2. Preparation of resin varnish" above was applied to a support base polyester film (manufactured by Mitsubishi Polyester Film Co., Ltd., T100G, 25 μm thick) using a comma coater, and dried at 80°C for 10 minutes to form a film, obtaining an adhesive film with a thickness of 65 μm.

4. Manufacturing of components for vapor chamber production A portion of the resin varnish prepared in "2. Preparation of resin varnish" above was impregnated into glass woven fabric (Unitika Corporation, #1078, 46 μm thick), and dried in a 100°C heating oven for 3 minutes to obtain a prepreg with a thickness of 50 μm.

Next, the two prepregs obtained in this manner were stacked together, and the 65 μm thick photosensitive adhesive film manufactured in "3. Manufacturing of Adhesive Film" above was layered on both sides. The layers were then bonded using a laminating roll at 80°C to obtain a vapor chamber manufacturing component with a thickness of 230 μm (first photosensitive adhesive film layer: 65 μm, prepreg: 100 μm, second photosensitive adhesive film layer: 65 μm) (see Figure 1). Furthermore, this vapor chamber manufacturing component was then cut to an external size of 15 mm x 100 mm.

The vapor chamber manufacturing component obtained in this manner was a sheet with a thickness of 230 μm, containing uncured resin material. As shown in Figure 3, a fibrous substrate was present near the center in the thickness direction, while no fibers were present on either side of the vapor chamber manufacturing component.

5. Manufacturing of the Vapor Chamber First, a vapor chamber manufacturing component (external dimensions: 15 mm x 100 mm) obtained as described above was prepared (vapor chamber manufacturing component preparation step), and on one side of this component, the first surface, it was bonded to a copper sheet material (external dimensions: 15 mm x 100 mm, thickness: 35 μm) as the first sheet material, utilizing the adhesive properties of the uncured resin material constituting the vapor chamber manufacturing component (first bonding step).

Next, the vapor chamber manufacturing component, which was bonded to the first sheet material, was irradiated with light (exposed) using a photomask that had openings (light-transmitting sections) in a pattern corresponding to the flow channel wall to be formed (exposure process). The exposure was performed using a mercury lamp with a main wavelength of 365 nm, under conditions of exposure dose: 500 mJ/ ^cm² .

Next, a 3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH), an alkaline aqueous solution, was used as the developer. The treatment was performed under conditions of developer pressure: 0.2 MPa and development time: 300 seconds, removing the uncured resin material from areas not exposed to light during the exposure process (development process).

Next, the vapor chamber manufacturing component, which had undergone the development process, was brought into contact with a copper sheet material (thickness: 35 μm), which served as the second sheet material, on the second surface opposite to the first surface, and pressed with a pressure of 0.3 MPa. In this state, heat compression bonding was performed at 185°C for 60 minutes, followed by heat treatment (post-cure) in an oven at 180°C for 1 hour. This firmly bonded the vapor chamber manufacturing component and the second sheet material. After the curing reaction was completed, a wick structure formed using the vapor chamber manufacturing component was obtained, with the first surface firmly bonded to the first sheet material and the second surface firmly bonded to the second sheet material (second bonding process).

The peripheral edges of the first and second sheet materials (excluding the working fluid inlet) were sealed by soldering. Then, 80 mg of pure water was injected into the space between the first and second sheet materials as the working fluid, and the working fluid inlet was further sealed with solder (working fluid supply and sealing process). This resulted in a vapor chamber as shown in Figure 6.

The wick structure of the vapor chamber obtained in this manner had a thickness of 230 μm and a structure as shown in Figure 9. It extended in its longitudinal direction, was composed of a resin-cured material, and had multiple sections that functioned as flow path walls for the working fluid. The spacing between adjacent flow path walls (i.e., the width of the flow path section) was 500 μm, and the width of each flow path wall was 100 μm.

(Example 2)
50 parts by mass of methacrylic-modified bisphenol A novolac resin (MPN) synthesized in the same manner as described in Example 1, 15.5 parts by mass of acrylic resin monomer (manufactured by Kyoeisha Chemical Co., Ltd., Light Ester TMP) which is liquid at room temperature as a photopolymerizable resin, 18 parts by mass of bisphenol A novolac type epoxy resin (manufactured by Mitsubishi Chemical Corporation, 1032H60) which is a thermosetting resin, 5 parts by mass of bisphenol F type epoxy resin (manufactured by DIC Corporation, EPICLON 830), 9 parts by mass of phenol novolac resin (manufactured by Sumitomo Bakelite Corporation, PR-53647), and 2.5 parts by mass of curing agent (photosensitive agent) (manufactured by Ciba Specialty Chemicals, Irgacure 651) were weighed out, and methyl ethyl ketone (MEK) was added to prepare a resin varnish so that the resin component concentration was 50% by mass.

Except for using the resin varnish obtained in this manner, the adhesive film, the component for manufacturing the vapor chamber, and the vapor chamber were manufactured in the same manner as in Example 1.

(Example 3)
The vapor chamber was manufactured in the same manner as in Example 2, except that the amount of pure water injected as the working fluid was changed from 80 mg to 160 mg.

(Example 4)
The vapor chamber was manufactured in the same manner as in Example 2, except that the amount of pure water injected as the working fluid was changed from 80 mg to 40 mg.

(Example 5)
First, an adhesive film was manufactured in the same manner as in Example 2, except that the thickness was set to 40 μm.

Furthermore, the vapor chamber manufacturing components and the vapor chamber were manufactured in the same manner as in Example 2, except that the number of prepregs used for lamination in the manufacturing of the vapor chamber manufacturing components was changed from two to three, and the adhesive film (first photosensitive adhesive film layer and second photosensitive adhesive film layer) was the aforementioned 40 μm thick adhesive film.

(Example 6)
First, an adhesive film was manufactured in the same manner as in Example 2, except that the thickness was set to 100 μm.

Furthermore, a portion of the resin varnish prepared in Example 2 was impregnated into a glass woven fabric (Unitika Corporation, #1037, 27 μm thick), and dried in a 100°C oven for 3 minutes to obtain a prepreg with a thickness of 30 μm.

Then, a 100 μm thick adhesive film was layered on both sides of a 30 μm thick prepreg sheet and bonded using an 80°C laminating roll to obtain a vapor chamber manufacturing component with a thickness of 230 μm (first photosensitive adhesive film layer: 100 μm, prepreg: 30 μm, second photosensitive adhesive film layer: 100 μm). Furthermore, this vapor chamber manufacturing component was then cut to an external size of 15 mm x 100 mm.

Subsequently, a vapor chamber was manufactured in the same manner as in Example 1, except that the vapor chamber manufacturing components were used.

(Example 7)
First, an adhesive film was manufactured in the same manner as in Example 2, except that the thickness was set to 90 μm.

Furthermore, a portion of the resin varnish prepared in Example 2 was impregnated into a glass woven fabric (Unitika Corporation, #1078, 46 μm thick), and dried in a 100°C oven for 3 minutes to obtain a prepreg with a thickness of 50 μm.

Then, a 90 μm thick adhesive film was layered on both sides of a 50 μm thick prepreg sheet and bonded using an 80°C laminating roll to obtain a vapor chamber manufacturing component with a thickness of 230 μm (first photosensitive adhesive film layer: 90 μm, prepreg: 50 μm, second photosensitive adhesive film layer: 90 μm). Furthermore, this vapor chamber manufacturing component was then cut to an external size of 15 mm x 100 mm.

Subsequently, a vapor chamber was manufactured in the same manner as in Example 1, except that the vapor chamber manufacturing components were used.

(Example 8)
A vapor chamber was manufactured in the same manner as in Example 2, except that a first photosensitive adhesive film layer with a thickness of 40 μm was used, and a second photosensitive adhesive film layer with a thickness of 90 μm was used.

(Example 9)
A vapor chamber was manufactured in the same manner as in Example 2, except that a first photosensitive adhesive film layer with a thickness of 40 μm was used, a second photosensitive adhesive film layer with a thickness of 40 μm was used, and the amount of pure water injected as the working fluid was changed from 80 mg to 40 mg.

(Example 10)
The vapor chamber was manufactured in the same manner as in Example 9, except that one sheet of the prepreg manufactured in Example 7 was used as the prepreg.

(Example 11)
A vapor chamber was manufactured in the same manner as in Example 2, except that a first photosensitive adhesive film layer with a thickness of 88 μm was used, a second photosensitive adhesive film layer with a thickness of 88 μm was used, and GTS-MP (12 μm thick) manufactured by Furukawa Electric Co., Ltd. was used as the first and second sheet materials.

(Example 12)
60 parts by mass of methacrylic-modified bisphenol A novolac resin (MPN) synthesized in the same manner as described in Example 1, 10.5 parts by mass of acrylic resin monomer (manufactured by Kyoeisha Chemical Co., Ltd., Light Ester TMP) which is liquid at room temperature as a photopolymerizable resin, 18 parts by mass of bisphenol A novolac type epoxy resin (manufactured by Mitsubishi Chemical Corporation, 1032H60) which is a thermosetting resin, 9 parts by mass of phenol novolac resin (manufactured by Sumitomo Bakelite Co., Ltd., PR-53647), and 2.5 parts by mass of curing agent (photosensitive agent) (manufactured by Ciba Specialty Chemicals, Irgacure 651) were weighed out, and methyl ethyl ketone (MEK) was added to prepare a resin varnish so that the resin component concentration was 50% by mass.

Except for using the resin varnish obtained in this manner, the adhesive film, the component for manufacturing the vapor chamber, and the vapor chamber were manufactured in the same manner as in Example 1.

(Example 13)
69 parts by mass of cyclomer P (manufactured by Daicel Ornex Co., Ltd.) as an alkali-soluble resin (curable resin that can be cured by both light and heat), 16 parts by mass of acrylic resin monomer that is liquid at room temperature (manufactured by Shin Nakamura Chemical Co., Ltd., NK Ester 3G) as a photopolymerizable resin, 5 parts by mass of bisphenol A novolac type epoxy resin (manufactured by Dainippon Ink and Chemicals, Ltd., Epiclon N-865) as a thermosetting resin, 3 parts by mass of bisphenol F type epoxy resin (manufactured by DIC Corporation, EPICLON 830), 5 parts by mass of phenol novolac resin (manufactured by Sumitomo Bakelite Co., Ltd., PR-53647), and 2.0 parts by mass of curing agent (photosensitive agent) (manufactured by Ciba Specialty Chemicals, Inc., Irgacure 651) were weighed out, and methyl ethyl ketone (MEK) was added to prepare a resin varnish so that the resin component concentration was 50% by mass.

Except for using the resin varnish obtained in this manner, the adhesive film, the component for manufacturing the vapor chamber, and the vapor chamber were manufactured in the same manner as in Example 1.

(Comparative Example 1)
A vapor chamber was manufactured in the same manner as in Example 2, except that a first photosensitive adhesive film layer with a thickness of 115 μm was used, and a second photosensitive adhesive film layer with a thickness of 115 μm was used, and the first photosensitive adhesive film layer and the second photosensitive adhesive film layer were directly bonded together without using a prepreg.

The configurations of the vapor chambers in each of the above examples and comparative examples are summarized in Tables 1 and 2. In the tables, the constituent material of the adhesive film for the vapor chamber manufacturing component in Example 1 is indicated as "C-1," the constituent material of the adhesive film for the vapor chamber manufacturing component in Example 2 as "C-2," the constituent material of the adhesive film for the vapor chamber manufacturing component in Example 12 as "C-12," and the constituent material of the adhesive film for the vapor chamber manufacturing component in Example 13 as "C-13." Tables 1 and 2 also show the Xf/Xr values, where Xf [mass%] is the fiber content and Xr [mass%] is the resin material content in the vapor chamber manufacturing component.

[5] Evaluation A ceramic heater (manufactured by Sakaguchi Electric Heating Co., Ltd., model number: Ultramic, heater section 12 mm square, 2.5 mm thick) with variable output and the ability to measure the temperature inside the heater was prepared.

When the ceramic heater was output at 4W and 7W, the internal heater temperatures were 225°C and 310°C, respectively.

Next, the ceramic heater was set to output 4W and 7W respectively, and the ends of the vapor chambers manufactured in each of the above embodiments and comparative examples were placed on the heater section. The temperature inside the heater was then measured when the temperature stabilized.
These results are summarized in Tables 3 and 4.

As is clear from Tables 3 and 4, in Comparative Example 1, which did not use a fibrous substrate in the vapor chamber manufacturing components, the ceramic heater temperature dropped by 30°C at both 4W and 7W outputs. However, in the vapor chambers of the above embodiments, the temperature drop was much greater, demonstrating excellent heat transport capacity.

Furthermore, it was confirmed that the vapor chambers according to each of the above embodiments exhibited excellent flexibility.

Furthermore, when a vapor chamber was manufactured in the same manner as described above, and evaluated in the same manner as described above, the same excellent effects were obtained as described above, except that the thickness of the fibrous base material constituting the vapor chamber manufacturing component was varied within the range of 10 μm to 1000 μm, the thickness of the vapor chamber manufacturing component was varied within the range of 10 μm to 2000 μm, and the value of Xf/Xr, where the fiber content in the vapor chamber manufacturing component is Xf [mass%] and the resin material content is Xr [mass%], was varied within the range of 0.01 to 8.0.

Furthermore, by changing the method of applying resin varnish to the fiber substrate, vapor chamber manufacturing components were produced as shown in Figures 2 and 4. Vapor chambers were then manufactured using these vapor chamber manufacturing components, except that the cross-sectional structure was as shown in Figures 5, 7, and 8. Except for this change, vapor chambers were manufactured in the same manner as described above, and evaluated in the same manner as described above. The same excellent effects were obtained.

Furthermore, a vapor chamber was manufactured in the same manner as described above, except that a woven fabric composed of fibers made of paraphenylenebenzobisoxazole, an aromatic resin containing heterocyclic rings in its molecule, was used instead of glass woven fabric. When evaluated in the same manner as described above, excellent effects were obtained, similar to those described above.

100: Vapor chamber 10: Wick structure 10': Component for manufacturing vapor chamber 11: First surface 12: Second surface 13: Fiber substrate (fiber sheet)
131: Fiber 14': Resin material 14: Cured resin 15: Flow channel section 16: Flow channel wall 20: Container 21: First sheet material 22: Second sheet material 23: Sealing section 30: Working fluid S: Spacing L: Width E: Light (exposure light)

Claims (11)

A vapor chamber manufacturing component used in the manufacture of the wick structure of a vapor chamber having a wick structure and a working fluid,
The wick structure has multiple portions that extend in its longitudinal direction and are made of a material including a cured resin and fibers, which function as flow path walls for the working fluid, and the space between the flow path walls is configured to form the flow path portion for the working fluid.
A component for manufacturing a vapor chamber, characterized by comprising the aforementioned fibers, an uncured resin material containing at least a photopolymerizable resin and an alkali-soluble resin corresponding to the cured resin product, and a photosensitive agent. A vapor chamber manufacturing component used in the manufacture of the wick structure of a vapor chamber having a wick structure and a working fluid,
The wick structure has multiple portions that extend in its longitudinal direction and are made of a material including a cured resin and fibers, which function as flow path walls for the working fluid, and the space between the flow path walls is configured to form the flow path portion for the working fluid.
A component for manufacturing a vapor chamber, characterized by comprising a fibrous substrate composed of the aforementioned fibers, and an uncured resin material and a photosensitive agent impregnated into the fibrous substrate, the resin material containing at least a photopolymerizable resin and an alkali-soluble resin corresponding to the cured resin. The vapor chamber manufacturing component according to claim 2, wherein the thickness of the fibrous substrate is 10 μm or more and 1000 μm or less. The vapor chamber manufacturing component according to claim 2 or 3, wherein the thickness of the component for manufacturing the vapor chamber is 10 μm or more and 2000 μm or less. The fiber is composed of an aromatic resin containing a heterocyclic ring in its molecule, as described in any one of claims 1 to 4, for use as a vapor chamber manufacturing component. A vapor chamber manufacturing component according to any one of claims 1 to 5, wherein the fiber content in the vapor chamber manufacturing component is Xf [mass%] and the resin material content is Xr [mass%], and the relationship 0.01 ≤ Xf/Xr ≤ 8.0 is satisfied. The component for manufacturing a vapor chamber according to any one of claims 1 to 6, wherein the alkali-soluble resin contains (meth)acrylic groups and phenolic hydroxyl groups. The vapor chamber manufacturing component according to any one of claims 1 to 7, wherein the resin material further comprises a thermosetting resin different from the alkali-soluble resin. A container having a hollow section inside,
A wick structure is placed in the aforementioned cavity,
A vapor chamber having a working fluid disposed in the cavity,
The wick structure has multiple portions that extend in its longitudinal direction and are composed of a material including a resin cured product made from a photopolymerizable resin, an alkali-soluble resin, and a photosensitive agent, and fibers, and functions as flow channel walls for the working fluid, the space between the flow channel walls is configured to form a flow channel portion for the working fluid, and the fibers are arranged in a portion of the flow channel portion for the working fluid where the resin cured product is not present. The vapor chamber according to claim 9, wherein the wick structure is formed using a vapor chamber manufacturing component described in any one of claims 1 to 8. A vapor chamber manufacturing component preparation step, which includes preparing a component for manufacturing a vapor chamber comprising fibers, an uncured resin material containing at least a photopolymerizable resin and an alkali-soluble resin, and a photosensitive agent,
A first joining step involves joining the vapor chamber manufacturing member to a first sheet material on one of its surfaces, which is a first surface.
An exposure step in which light is irradiated in a predetermined pattern onto the vapor chamber manufacturing member bonded to the first sheet material,
A developing step to remove the uncured resin material in the areas that were not irradiated with light in the exposure step,
A second joining step is performed in which the vapor chamber manufacturing member that has undergone the development step is joined to a second sheet material on a second surface which is the surface opposite to the first surface,
A method for manufacturing a vapor chamber, characterized by comprising a working fluid supply and sealing step of injecting working fluid into the space between the first sheet material and the second sheet material and sealing the space.