JP7546232B2 - Component imaging device and component mounting device - Google Patents

Description

The present disclosure relates to a component imaging device that images components and a component mounting device that mounts components on a substrate.

The component mounting device has a component supply unit, a mounting head that horizontally moves the components supplied by the component supply unit, and a board transport conveyor that holds the board. The mounting head has a nozzle that picks up the components and mounts them on the board. To improve the accuracy of component mounting, for example, the component mounting device described in Patent Document 1 has a component recognition camera (component imaging device) and a board recognition camera (board imaging device). The component recognition camera images the position of the component held by the nozzle. The board recognition camera moves together with the mounting head to image the marks formed on the board.

The mounting head is detachable from the main body of the component mounting device. In order to ensure component mounting accuracy by correcting the positional relationship between the nozzle of such a mounting head and the board recognition camera, the following is set in Patent Document 1. That is, a glass plate on which a reference mark is formed is placed on the upper surface of the component recognition camera. The glass plate is positioned so that the reference mark is within the field of view of the component recognition camera. The mounting head further moves so that the nozzle is within this field of view. In this state, the component recognition camera detects the positions of the nozzle and the reference mark. The board recognition camera calculates the positional relationship between the nozzle and the board recognition camera from the imaged reference mark and the position of the optical axis of the board recognition camera.

JP 2004-179636 A

The component imaging device disclosed herein comprises a component imaging section provided on an imaging element for imaging a component , a transparent member provided on a first optical path along which the component imaging section images the component, a mark provided on the transparent member outside the field of view of the component imaging section, a mark imaging section provided on the imaging element for imaging the mark, and a positional deviation calculation section for calculating a positional deviation amount of the field of view of the component imaging section based on the imaging result of the mark by the mark imaging section, and the transparent member is provided on a second optical path along which the mark imaging section images the mark .

The component mounting apparatus of the present disclosure includes a nozzle that holds a component and mounts it on a board, a component imaging device that images the component held by the nozzle, a board imaging device that moves integrally with the nozzle to image the board, and an offset amount calculation unit that calculates an offset amount between the nozzle and the board imaging device, the component imaging device having a component imaging unit provided on an imaging element and imaging the component, a transparent member provided on a first optical path along which the component imaging unit images the component, a mark provided on the transparent member outside a field of view of the component imaging unit, and a mark imaging unit provided on the imaging element and imaging the mark, the transparent member being provided on a second optical path along which the mark imaging unit images the mark, and the offset amount calculation unit calculates the offset amount based on the imaging result of the mark by the mark imaging unit of the component imaging device and the imaging result of the mark by the board imaging device.

According to the present disclosure, it is possible to calculate the shift over time of the optical axis of a camera that captures images of components, and correct the shift in the mounting position of the components caused by this shift. It is also possible to accurately calculate the offset between the nozzle and the board imaging device during the production of the mounting board.

FIG. 1 is a plan view of a component mounting apparatus according to an embodiment of the present disclosure; FIG. 2 is a perspective side view showing the configuration of the component mounting apparatus shown in FIG. FIG. 3 is a plan view of a transparent member of a component recognition camera provided in the component mounting apparatus shown in FIGS. FIG. 3 is a configuration explanatory diagram of a component recognition camera provided in the component mounting device shown in FIG. FIG. 3 is a plan view of a sensor board of a component recognition camera provided in the component mounting device shown in FIGS. 1 and 2 ; FIG. 3C is a diagram illustrating how the component held by the nozzle is imaged by the component recognition camera shown in FIG. FIG. 3 is a configuration explanatory diagram of a board recognition camera provided in the component mounting device shown in FIG. 1 and FIG. 2 . FIG. 3 is a functional block diagram showing the configuration of a control system of the component mounting apparatus shown in FIGS. 1 and 2 . FIG. 3C is a diagram for explaining deviation of the optical axis caused by heat generated by the component recognition camera shown in FIG. 3B. FIG. 3C is a diagram showing an example of a captured image of a mark captured by a mark capturing unit of the component recognition camera shown in FIG. 3B ; FIG. 3C is a diagram showing an example of a captured image of a part held by a nozzle captured by a part imaging unit of a part recognition camera shown in FIG. FIG. 6 is a diagram for explaining how a mark provided on the component recognition camera shown in FIG. 3B is imaged by the board recognition camera shown in FIG. 5 . FIG. 11 is a diagram showing an example of a captured image of a mark provided on a component recognition camera captured by the board recognition camera shown in FIG. 10 .

Prior to describing the embodiments of the present disclosure, the background to the concept of the present disclosure will be briefly described. The component recognition camera in a conventional component mounting device detects the position of the component held by the nozzle from the position of the optical axis of the camera. However, in the process of continuously producing mounted boards, the optical axis of the camera may shift (distort) due to changes over time caused by heat generation of the imaging element included in the component recognition camera. Therefore, in order to maintain the mounting accuracy of the components, it is necessary to periodically detect the shift in the optical axis of the component recognition camera and appropriately correct the mounting position of the components. In the conventional technology including Patent Document 1, a method for detecting the shift in the optical axis of the component recognition camera during the production of mounted boards is not disclosed, and there is room for further improvement in order to improve the mounting accuracy of the components.

The present disclosure provides a component imaging device that can detect deviation in the optical axis of a camera that images a component and correct the position at which the component is mounted based on that deviation. That is, the component imaging device calculates the amount of positional deviation of the field of view of a component imaging unit, which is a camera that images the component. The present disclosure also provides a component mounting device that can accurately calculate the amount of offset between a nozzle and a board imaging device during production of a mounting board.

The embodiments of the present disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanatory purposes and can be modified as appropriate depending on the specifications of the component mounting device, the board recognition camera, and the component recognition camera. In the following, the same reference numerals are used for corresponding elements in all drawings, and duplicated explanations will be omitted. In each drawing, the board is transported along the X-axis. The Y-axis is perpendicular to the X-axis in the horizontal plane. The Z-axis is perpendicular to the horizontal plane and extends from bottom to top.

First, the configuration of the component mounting device 1 will be described with reference to Figures 1 and 2. Note that Figure 2 shows a schematic view of a portion of the component mounting device 1 in Figure 1. The component mounting device 1 performs component mounting work by mounting components D supplied from a component supply unit 4 onto a board 3. As shown in Figure 1, a board transport mechanism (hereinafter, transport mechanism) 2 is arranged along the X-axis at the center of the base 1a. The transport mechanism 2 transports the board 3 transported from upstream to the mounting work position, positions it, and holds it. The transport mechanism 2 also transports the board 3 downstream after the component mounting work has been completed.

Component supply units 4 are arranged on both sides of the Y axis of the transport mechanism 2. Multiple tape feeders 5 are attached in parallel to each component supply unit 4. The tape feeders 5 pitch-feed a tape 11, on which pockets for storing components D are formed, in a direction (tape feed direction) from the outside of the component supply unit 4 toward the transport mechanism 2. In this way, the tape feeders 5 supply components D to component supply positions 5a (see FIG. 2) from which the mounting head 8 picks up the components D, as described below.

At both ends of the X-axis of the upper surface of the base 1a, Y-axis tables 6 are arranged so as to extend along the Y-axis. Each Y-axis table 6 has a linear drive mechanism. A beam 7 is connected to the pair of Y-axis tables 6 so as to connect the Y-axis tables 6. The beam 7 extends along the X-axis. The beam 7 can be moved along the Y-axis by the linear drive mechanism of the Y-axis table 6. The beam 7 also has a linear drive mechanism like the Y-axis table 6. A mounting head 8 is attached to the beam 7. The mounting head 8 can be moved along the X-axis by the linear drive mechanism of the beam 7. As shown in FIG. 2, the mounting head 8 has a suction unit 8a. The suction unit 8a can be raised and lowered, and holds the component D by suction. A nozzle 8b that suctions and holds the component D is attached to the lower end of the suction unit 8a.

In Fig. 1, the Y-axis table 6 and beam 7 constitute a head movement mechanism (hereinafter, movement mechanism) 9 that moves the mounting head 8 along the X-axis and Y-axis. The movement mechanism 9 and mounting head 8 perform a mounting turn in which the nozzle 8b picks up and removes a component D from the component supply position 5a of the tape feeder 5 arranged in the component supply section 4, and mounts it at the mounting position of the board 3 positioned by the transport mechanism 2. That is, the Y-axis table 6, beam 7 and mounting head 8 hold the component D supplied to the component supply position 5a of the tape feeder 5 with the nozzle 8b and mount it on the board 3.

A component recognition camera (hereinafter, the first camera) 20 is disposed between the component supply unit 4 and the transport mechanism 2. When the mounting head 8 which has picked up a component D from the component supply unit 4 moves above the first camera 20, the first camera 20 captures an image of the component D held by the mounting head 8 to recognize the posture of the component D. A board recognition camera 30 (hereinafter, the second camera) is attached to the plate 7a to which the mounting head 8 is attached. The second camera 30 moves integrally with the mounting head 8.

As the mounting head 8 moves, the second camera 30 moves above the board 3 positioned on the transport mechanism 2 and captures an image of the board mark 3a provided on the board 3 to recognize the position of the board 3. When the mounting head 8 mounts components on the board 3, the mounting position is corrected taking into account the recognition result of the component D by the first camera 20 and the recognition result of the position of the board 3 by the second camera 30.

In FIG. 2, a cart 10 is set in the component supply section 4. The cart 10 has a feeder base 10a, on which a number of tape feeders 5 are pre-installed. The cart 10 holds a tape reel 12. The tape reel 12 stores a tape 11 holding a component D in a wound state. The tape 11 pulled out from the tape reel 12 is pitch-fed by the tape feeder 5 to the component supply position 5a.

In Fig. 1, a touch panel 13 operated by an operator is installed at the position where the operator works on the front side of the component mounting device 1. The touch panel 13 displays various information on its display. The operator also inputs data from the touch panel 13 and operates the component mounting device 1 using operation buttons and the like displayed on the display.

Next, the configuration of the first camera 20 will be described with reference to Figures 3A to 3C. As shown in Figure 3B, the first camera 20 has a housing 21, a sensor board 23, a lens 24, a component illumination section 25, and a transparent member 26. The sensor board 23 is installed on the bottom 21a inside the housing 21. An imaging element 22 such as a two-dimensional CMOS (complementary metal oxide semiconductor) sensor is mounted on the sensor board 23. The lens 24 is installed above the sensor board 23 within the housing 21, and the component illumination section 25 is installed above the lens 24. The transparent member 26 is installed at a location on the upper part 21b of the housing 21 where a part of the housing 21 is cut out.

The transparent member 26 is made of a plate-like glass that transmits light. A mark 27 for detecting the deviation of the optical axis of the imaging element 22 is provided on a part of the upper surface 26c of the transparent member 26. As shown in FIG. 3A, the mark 27 is outside the component imaging field 26a when the imaging element 22 images the component D held by the nozzle 8b, and is arranged in the mark imaging field 26b when the imaging element 22 images the mark 27. In this example, five disks formed of a metal thin film that does not transmit light are arranged at equal intervals along the Y axis as the marks 27 in the mark imaging field 26b. Note that the shape, number, and arrangement of the marks 27 shown in FIG. 3A are only an example, and are not limited to this example. As shown in FIG. 3B, the transparent member 26 is provided on the first optical path Pa where the component imaging unit 22a images the component D, and on the second optical path Pb where the mark imaging unit 22b images the mark 27.

As shown in FIG. 3C, the imaging element 22 has a part imaging section 22a and a mark imaging section 22b arranged side by side along the X-axis. The part imaging section 22a and the mark imaging section 22b extend along the Y-axis. That is, the length along the Y-axis is shorter than the length along the X-axis. The part imaging section 22a images the part D held by the nozzle 8b. The mark imaging section 22b images the mark 27 provided on the transparent member 26. As shown in FIG. 3B and FIG. 4, the part imaging section 22a images the part D whose lower surface Da is located at the part recognition height Ha set above the mark recognition height Hb of the upper surface 26c of the transparent member 26. In this way, the imaging element 22 is provided with the part imaging section 22a that images the part D and the mark imaging section 22b that images the mark 27. As shown in FIG. 3A, the mark 27 is provided in a mark imaging field of view 26b outside a component imaging field of view 26a which is the field of view of the component imaging section 22a.

The part imaging section 22a is provided in a part of the imaging element 22, and the mark imaging section 22b is provided in a part of the imaging element 22 different from the part imaging section 22a. In this way, by providing the part imaging section 22a and the mark imaging section 22b in the same imaging element 22, the detection accuracy of the positional deviation amount of the field of view of the part imaging section 22a is improved, as described below.

As shown in Figure 3B, the lens 24 arranged above the imaging element 22 forms an image of an imaged object (such as part D) located above the transparent member 26 at part recognition height Ha on the part imaging section 22a. The lens 24 also forms an image of a mark 27 formed on the transparent member 26 on the mark imaging section 22b. The mark 27 is located at mark recognition height Hb. The physical distance Lpa of the first optical path Pa from the part imaging section 22a to the imaged object located at part recognition height Ha is different from the physical distance Lpb of the second optical path Pb from the mark imaging section 22b to the mark 27.

3B and 3C, a correction member 28 made of a material such as glass that transmits light and has a refractive index different from that of air is placed on the component imaging unit 22a. The refractive index and thickness T of the correction member 28 are set to correct the optical path length Loa (optical distance) of the first optical path Pa to form an image in each of the component imaging unit 22a and the mark imaging unit 22b. This allows the lens 24 to simultaneously focus on the image of the object to be imaged in the component imaging unit 22a and the image of the mark 27 to be imaged in the mark imaging unit 22b.

In this embodiment, the correction member 28 is installed on the part imaging unit 22a, but the correction member 28 may be installed in the middle of either the first optical path Pa or the second optical path Pb. That is, the first camera 20 has a correction member 28 that corrects either the optical path length Loa or the optical path length Lob in either the first optical path Pa in which the part imaging unit 22a images the part D or the second optical path Pb in which the mark imaging unit 22b images the mark 27. Note that correction members 28 with different refractive indices and/or thicknesses T may be installed in both the first optical path Pa and the second optical path Pb. In addition, if the depth of field of the lens 24 is deep and the two images of the imaging object and the mark 27 can be focused on simultaneously without the correction member 28, the correction member 28 can be omitted.

3B, the component illumination unit 25 includes a side illumination unit 25a, a coaxial illumination unit 25b, and a half mirror 25c. The side illumination unit 25a has a plurality of light-emitting diode (LED) chips, etc., and emits light that illuminates the imaging target object (component D, etc.) and mark 27 located at the component recognition height Ha from diagonally below. The coaxial illumination unit 25b has a plurality of LED chips, etc., and is disposed below the side illumination unit 25a.

The half mirror 25c is disposed midway between the first optical path Pa and the second optical path Pb. The half mirror 25c reflects the light irradiated from the coaxial illumination unit 25b toward the imaging object (such as component D) and the mark 27 located at the component recognition height Ha above the half mirror 25c. In other words, the coaxial illumination unit 25b and the half mirror 25c illuminate the imaging object and the mark 27 coaxially with the first optical path Pa and the second optical path Pb.

The part illumination unit 25 switches between illumination by the lateral illumination unit 25a and illumination by the coaxial illumination unit 25b, or combines them, depending on the material of the object to be imaged. In this way, the first camera 20 has an illumination unit (part illumination unit 25) that illuminates the mark 27.

Next, referring to Figure 4, the imaging of component D by the first camera 20 will be described. The mounting head 8 holding component D by the nozzle 8b positions the underside Da of component D at the component recognition height Ha, and moves along the X-axis as shown by arrow a so that component D passes over the first optical path Pa of the first camera 20. During this time, the component illumination unit 25 illuminates component D. The first camera 20 transmits the imaging results captured by the imaging element 22 (component imaging unit 22a, mark imaging unit 22b) to the control unit 40 shown in Figure 6.

Next, the configuration of the second camera 30 will be described with reference to Figure 5. The second camera 30 has a housing 31, a window member 34, and a camera unit 32 and a board illumination unit 33 installed inside the housing 31. The window member 34 is made of light-transmitting glass or the like, and is installed in a cut-out portion of the lower part of the housing 31. The camera unit 32 is made of an imaging element such as a two-dimensional CMOS sensor with its optical axis facing downward, a lens, etc.

The board illumination unit 33 includes a side illumination unit 33a that illuminates the board 3 of the imaging target from above diagonally below, a coaxial illumination unit 33b, and a half mirror 33c. The half mirror 33c reflects the light irradiated from the coaxial illumination unit 33b toward the imaging target below. The board illumination unit 33 switches between illumination by the side illumination unit 33a and illumination by the coaxial illumination unit 33b, or combines them, depending on the material of the target imaged by the camera unit 32.

The second camera 30 captures an image of an object to be imaged, such as the board mark 3a formed on the board 3 and the mark 27 provided on the transparent member 26 of the first camera 20. In this case, the second camera 30 moves above the object to be imaged together with the mounting head 8, and the camera unit 32 images the object to be imaged while the board illumination unit 33 illuminates the object to be imaged. In this way, the second camera 30 is a board imaging device that has a board illumination unit 33 that illuminates the board mark 3a and the mark 27 formed on the board 3, and moves integrally with the nozzle 8b to capture the board 3 and the mark 27. The second camera 30 transmits the image captured by the camera unit 32 to the control unit 40.

Next, the configuration of the control system of the component mounting device 1 will be described with reference to FIG. 6. The component mounting device 1 has a control unit 40, a transport mechanism 2, a tape feeder 5, a mounting head 8, a moving mechanism 9, a first camera 20, a second camera 30, and a touch panel 13. The control unit 40 has an imaging processing unit (hereinafter, first processing unit) 41, a position deviation calculation unit (hereinafter, first calculation unit) 42, an offset amount calculation unit (hereinafter, second calculation unit) 43, a mounting operation processing unit (hereinafter, second processing unit) 44, and a mounting memory unit (hereinafter, memory unit) 45. The memory unit 45 stores mounting data 46, imaging data 47, a mark field position deviation amount (hereinafter, first position deviation amount) 48, a component field position deviation amount (hereinafter, second position deviation amount) 49, a board field position deviation amount (hereinafter, third position deviation amount) 50, an offset amount 51, and the like.

The first processing unit 41, the first calculation unit 42, the second calculation unit 43, and the second processing unit 44 constituting the control unit 40 are each composed of a CPU (Central Processing Unit) or an LSI (Large Scale Integrated Circuit). They may include memory as necessary. They may be composed of dedicated circuits, or may be realized by controlling general-purpose hardware with software read from a transient or non-transient storage device or recording medium. Two or more of these may also be integrated. The storage unit 58 is composed of a rewritable RAM, flash memory, hard disk, etc. The storage unit 58 may be composed of multiple memories and may store the implementation data 46 to the offset amount 51 individually, or may be integrated to store these data collectively.

The mounting data 46 includes information necessary for component mounting work, such as the size of the board 3 for each type of board 3, the type of component D to be mounted, and the mounting position (XY coordinates). When detecting (calculating) the positional deviation of the imaging field of view of the first camera 20, the first processing unit 41 controls the mark imaging unit 22b and the component illumination unit 25 of the first camera 20. Specifically, the first processing unit 41 causes the mark imaging unit 22b to image the mark 27 provided on the transparent member 26 while illuminating the mark 27 with the component illumination unit 25. The first processing unit 41 stores the imaging result in the memory unit 45 as imaging data 47.

Now, referring to Figures 7 and 8, the imaging result of the mark 27 captured by the first camera 20 will be described. The first camera 20 repeatedly captures the component D held by the nozzle 8b during the component mounting operation. During this process, the sensor board 23 and the housing 21 may be distorted over time due to heat generation from the imaging element 22 and the component illumination unit 25. Figure 7 shows a state in which the sensor board 23 is distorted due to such a change over time, causing the imaging element 22 to shift in position within the XY plane, and the first optical path Pa (optical axis) of the component imaging unit 22a and the second optical path Pb (optical axis) of the mark imaging unit 22b are shifted from their initial states. On the X axis, the first optical path Pa is shifted by a position shift amount ΔXd, and the second optical path Pb is shifted by a position shift amount ΔXm.

7, in an initial state where there is no distortion in the first camera 20, the position of the first optical path Pa at the part recognition height Ha is defined as the initial part field center position Cd0, and the position of the second optical path Pb at the mark recognition height Hb is defined as the initial mark field center position Cm0. Also, in a state where the image sensor 22 is misaligned in the XY plane, the position of the first optical path Pa at the part recognition height Ha is defined as the part field center position Cd, and the position of the second optical path Pb at the mark recognition height Hb is defined as the mark field center position Cm.

Figure 8 shows a mark image 60, which is an image of the mark 27 captured by the first camera 20 when the image sensor 22 is misaligned in the XY plane as shown in Figure 7. The mark image 60 shows a line of five marks 27 captured by the mark imaging unit 22b. The center of the third mark 27 (hereinafter, central mark 27A) of the five lined up marks 27 is the initial mark field of view central position Cm0. The center 60c of the mark image 60 is the mark field of view central position Cm.

In the initial state where there is no distortion in the first camera 20, in the image captured by the first camera 20, the initial mark field center position Cm0 is located at the center 60c of the mark image 60, and the five marks 27 are located at the positions indicated by the dotted lines. In Figure 8, the image sensor 22 is misaligned, causing the position of the second optical path Pb at the mark recognition height Hb to move away from the center of the central mark 27A.

The first calculation unit 42 shown in Fig. 6 calculates a first positional deviation amount 48, which is a positional deviation amount from the initial state of the field of view of the mark imaging unit 22b, based on the mark image 60, and stores the first positional deviation amount 48 in the storage unit 45. Specifically, the first calculation unit 42 calculates a deviation amount ΔXm on the X axis and a deviation amount ΔYm on the Y axis from the position of the central mark 27A relative to the center 60c of the mark image 60 shown in Fig. 8. In addition, the first calculation unit 42 calculates a deviation amount Δθm in the θ direction, which is the direction of rotation about the Z axis, from the inclination of the straight line connecting the centers of the five marks 27.

Figure 9 shows a part image (hereinafter, first image) 61, which is an image of part D captured by the first camera 20 when the image sensor 22 shown in Figure 7 is misaligned in the XY plane. The nozzle 8b holds the center of part D. The center of part D captured in the first image 61 is the initial part view center position Cd0. The center 61c of the first image 61 is the part view center position Cd. In the initial state where there is no distortion in the first camera 20, in the first image 61, the initial part view center position Cd0 is located at the center 61c of the first image 61, and the part D and the nozzle 8b holding the part D are located at the positions shown by the dotted lines.

The second positional deviation amount 49, which is the amount of positional deviation from the initial state of the field of view of the component imaging unit 22a based on the first image 61, is expressed as a deviation amount ΔXd on the X axis and a deviation amount ΔYd on the Y axis. That is, the deviation of the position of the center of the component D from the center 61c of the first image 61 is a deviation amount ΔXd and a deviation amount ΔYd. In addition, the degree of rotation of the component D (such as the inclination of each side of the component D) is a deviation amount Δθd in the θ direction, which is the direction of rotation about the Z axis.

In the first camera 20, the part imaging section 22a and the mark imaging section 22b are formed in a single imaging element 22. Therefore, due to changes over time in the first camera 20, the shift of the first optical path Pa of the part imaging section 22a and the shift of the second optical path Pb of the mark imaging section 22b occur in conjunction with each other. Therefore, the first positional deviation amount 48 and the second positional deviation amount 49 have a predetermined relationship (e.g., a proportional relationship) determined by the configuration of the first camera 20. In other words, the second positional deviation amount 49 can be calculated from the first positional deviation amount 48.

The first calculation unit 42 performs a predetermined calculation on the first positional deviation amount 48 calculated from the mark image 60 to calculate the second positional deviation amount 49, and stores the second positional deviation amount 49 in the memory unit 45. The predetermined calculation is, for example, a calculation in which the X-axis component and the Y-axis component are multiplied by a predetermined coefficient, and the θ direction is left unchanged. That is, the first calculation unit 42 calculates the positional deviation amount (second positional deviation amount 49) of the field of view of the part imaging unit 22a based on the mark image 60, which is the imaging result of the mark 27 by the mark imaging unit 22b. The part imaging unit 22a, the mark imaging unit 22b, the mark 27, and the first calculation unit 42 constitute a part imaging device that images the part D held by the nozzle 8b and calculates the second positional deviation amount 49.

The second processing unit 44 shown in FIG. 6 controls each part of the component mounting device 1 based on the mounting data 46. Specifically, it controls the nozzle 8b of the mounting head 8 to hold the component D supplied by the tape feeder 5. Then, it causes the first camera 20 to detect the positional deviation of the component D held by the nozzle 8b. Furthermore, it controls the nozzle 8b to mount the component D on the board 3 held at the mounting work position. The second processing unit 44 controls this series of component mounting operations. At that time, the second processing unit 44 corrects the position of the component D relative to the nozzle 8b detected by the first camera 20 based on the second positional deviation amount 49 stored in the memory unit 45.

The mark imaging unit 22b can image the mark 27 while the mounting head 8 is taking out the component D from the tape feeder 5 or mounting the component on the board 3. That is, the mark imaging unit 22b can image the mark 27 independently of the operation of the mounting head 8 during the idle time when the mounting head 8 is not above the first camera 20. Therefore, the mark imaging unit 22b can image the mark 27 during the idle time and update the second positional deviation amount 49 to the latest value. This allows the optical axis deviation (second positional deviation amount 49) of the component imaging camera 20 that images the component D to be detected without reducing the efficiency of the component mounting work, and the position at which the component D is mounted can be corrected, and the component D can be mounted in the normal mounting position with high accuracy.

6 detects (calculates) positional deviations of the mounting head 8, nozzle 8b, and second camera 30 caused by distortion of the moving mechanism 9 over time. Specifically, the first processing unit 41 controls the moving mechanism 9, the second camera 30, and the first camera 20 to cause the camera unit 32 to capture an image of the mark 27 formed on the transparent member 26. The first processing unit 41 stores the image capture result in the memory unit 45 as image capture data 47.

Next, the details of the imaging of the mark 27 by the second camera 30 and the imaging results will be described with reference to Figures 10 and 11. When imaging the mark 27 by the second camera 30, the first processing unit 41 shown in Figure 6 first controls the moving mechanism 9 to move the second camera 30 to a position where the mark 27 provided on the first camera 20 is imaged. Next, the first processing unit 41 controls the component illumination unit 25 of the first camera 20 to illuminate the mark 27 provided on the transparent member 26 from below, while controlling the camera unit 32 shown in Figure 10 to image the mark 27.

That is, when the second camera 30 serving as a board imaging device images the mark 27, the part illumination unit 25 illuminates the mark 27 with transmitted illumination. This allows the second camera 30 to clearly image the mark 27 even if, for example, the transparent member 26 is dirty. Note that the camera unit 32 may image the mark 27 while the board illumination unit 33 illuminates the mark 27. Also, although the part illumination unit 25 uses transmitted illumination, transmitted illumination is one example of a type of illumination and is not limited to this example.

The moving mechanism 9 repeatedly moves the mounting head 8 during component mounting operations. During this process, the moving mechanism 9 may become distorted over time due to heat generated by the linear drive mechanism of the moving mechanism 9. In the control unit 40, various control parameters are set so that the positions of the mounting head 8 and nozzle 8b are controlled assuming an initial state in which there is no distortion in the moving mechanism 9, with a base point (not shown) set in the component mounting device 1 as the origin. If there is distortion in the moving mechanism 9, the mounting head 8 and nozzle 8b will deviate from their initial positions, requiring correction.

Figure 10 shows a state in which the second camera 30 is misaligned and stopped due to distortion of the moving mechanism 9, even though the first processing unit 41 controls the moving mechanism 9 to align the third optical path Ph of the camera unit 32 with the center of the mark 27. As described above, the second camera 30 including the camera unit 32 moves integrally with the mounting head 8 by the moving mechanism 9. In an initial state in which there is no distortion in the moving mechanism 9, the position of the third optical path Ph on the mark 27 is defined as the initial board view center position Ch0. Furthermore, in a state in which there is distortion in the moving mechanism 9, the position of the third optical path Ph on the transparent member 26 is defined as the board view center position Ch.

Figure 11 shows a board recognition camera image (hereinafter, second image) 62 of the mark 27 captured by the camera unit 32 of the second camera 30 when there is distortion in the moving mechanism 9 as shown in Figure 10. The center 62c of the second image 62 is the board view center position Ch. Furthermore, the center of the third central mark 27A of the five marks 27 captured in the second image 62 is the initial board view center position Ch0. In the initial state when there is no distortion in the moving mechanism 9, the initial board view center position Ch0 is located at the center 62c in the second image 62, and the five marks 27 are at the positions shown by the dotted lines.

The second calculator 43 shown in Fig. 6 calculates a third positional deviation amount 50, which is a positional deviation amount from the initial state of the field of view of the camera unit 32, based on the second image 62 shown in Fig. 11, and stores the third positional deviation amount 50 in the memory unit 45. Specifically, the second calculator 43 calculates a deviation amount ΔXh on the X axis and a deviation amount ΔYh on the Y axis from the position of the central mark 27A relative to the center 62c of the second image 62. In addition, the second calculator 43 calculates a deviation amount Δθh in the θ direction, which is the direction of rotation about the Z axis, from the inclination of the straight line connecting the centers of the five marks 27.

The second processing unit 44 controls the second camera 30 to capture an image of the board mark 3a of the board 3 held at the mounting work position to recognize the position of the board 3. At that time, the second processing unit 44 corrects the stop position of the board 3 based on the third positional deviation amount 50 stored in the memory unit 45. In addition, in the component mounting work, it is necessary to correct the position of the nozzle 8b with respect to the base point set in the component mounting device 1 and mount the component D held by the nozzle 8b at a predetermined mounting position on the board 3. To correct the position of the nozzle 8b, in addition to the distortion of the moving mechanism 9, it is also necessary to take into account the distortion of the first camera 20 that captures the component D held by the nozzle 8b described above.

10, the second calculation unit 43 calculates an offset amount 51 between the nozzle 8b and the second camera 30 based on the positional relationship (Xn, Yn) between the second camera 30 and the nozzle 8b in the mounting head 8, as well as the third positional deviation amount 50 and the first positional deviation amount 48. The second calculation unit 43 then stores the offset amount 51 in the memory unit 45. As described above, the first positional deviation amount 48 is a positional deviation amount of the field of view of the first camera 20 that represents the distortion of the first camera 20. The second processing unit 44 corrects the position of the nozzle 8b based on the mounting data 46 and the offset amount 51 stored in the memory unit 45, controls the nozzle 8b, and mounts the component D held by the nozzle 8b at the mounting position on the board 3.

As described above, the positional deviation amount of the field of view of the first camera 20 is calculated by the first calculation unit 42 based on the image capturing result of the mark by the mark capturing unit 22b of the first camera 20. That is, the first calculation unit 42 calculates the first positional deviation amount 48 based on the mark image 60 shown in FIG. 8. When the first camera 20 captures the mark 27, the first processing unit 41 controls the board illumination unit 33 of the second camera 30 to illuminate the mark 27 provided on the transparent member 26 from above, and controls the mark imaging unit 22b to capture the mark 27. That is, when the first camera 20 captures the mark 27, the board illumination unit 33 illuminates the mark 27 with transmitted illumination. As a result, for example, even if the transparent member 26 is dirty, the mark 27 can be clearly captured.

In this way, the second calculation unit 43 calculates the offset amount 51 between the nozzle 8b and the second camera 30 based on the imaging result of the mark 27 by the mark imaging unit 22b of the first camera 20, which is a component imaging device, and the imaging result of the mark 27 by the second camera 30, which is a board imaging device. That is, the second calculation unit 43 calculates the offset amount 51 based on the mark image 60 and the board recognition camera image 62.

As described above, the component mounting device 1 has a component imaging device (first camera 20, first calculation unit 42) that images the component D held by the nozzle 8b, a board imaging device (second camera 30) that moves integrally with the nozzle 8b to image the board 3, and an offset amount calculation unit (second calculation unit) 43 that calculates the offset amount 51. This allows the offset amount 51 between the nozzle 8b and the board recognition device to be calculated with high accuracy.

The component imaging device of the present disclosure can calculate the misalignment of the optical axis of the camera that images the component. In addition, the component mounting device of the present disclosure can accurately calculate the offset between the nozzle and the board imaging device during the production of the mounted board. Therefore, both are useful in the field of mounting components on boards.

1 Component mounting device 1a Base 2 Substrate transport mechanism (transport mechanism)
3: Board 3a: Board mark 4: Component supply unit 5: Tape feeder 5a: Component supply position 6: Y-axis table 7: Beam 7a: Plate 8: Mounting head 8a: Suction unit 8b: Nozzle 9: Head moving mechanism (moving mechanism)
10: Cart 10a: Feeder base 11: Tape 12: Tape reel 13: Touch panel 20: Component recognition camera (first camera)
21, 31 Housing 21a Bottom 21b Upper portion 22 Imaging element 22a Component imaging section 22b Mark imaging section 23 Sensor board 24 Lens 25 Component illumination section 25a, 33a Side illumination section 25b, 33b Coaxial illumination section 25c, 33c Half mirror 26 Transparent member 26a Component imaging field 26b Mark imaging field 26c Upper surface 27 Mark 27A Central mark 28 Correction member 30 Board recognition camera (second camera)
32 camera unit 33 board illumination unit 34 window member 40 control unit 41 imaging processing unit (first processing unit)
42 Position deviation amount calculation unit (first calculation unit)
43 offset amount calculation unit (second calculation unit)
44 Mounting operation processing unit (second processing unit)
45 Implementation memory unit (memory unit)
46 Mounting data 47 Imaging data 48 Mark field position shift amount (first position shift amount)
49 Component field position shift amount (second position shift amount)
50 Substrate field position deviation amount (third position deviation amount)
51 Offset amount 60 Mark image 60c, 61c, 62c Center 61 Part image (first image)
62 Board recognition camera image (second image)
D Part Pa First optical path Pb Second optical path Ph Third optical path

Claims (9)

a component imaging unit provided in the imaging element for imaging a component;
a transparent member provided on a first optical path along which the component imaging unit images the component;
a mark provided on the transparent member outside the field of view of the component imaging unit;
a mark imaging unit provided in the imaging element for imaging the mark;
a positional deviation amount calculation unit that calculates a positional deviation amount of the field of view of the component imaging unit based on an imaging result of the mark by the mark imaging unit ,
the transparent member is provided on a second optical path along which the mark imaging unit images the mark;
Parts imaging device. The component imaging unit and the mark imaging unit are provided in different portions of the imaging element.
The part imaging device according to claim 1 . a correction member that corrects an optical path length is provided in at least one of the first optical path in which the component imaging unit images the component and the second optical path in which the mark imaging unit images the mark;
The part imaging device according to claim 1 . Further comprising an illumination unit that illuminates the mark.
The part imaging device according to claim 1 . a nozzle for holding the component and placing it on the board;
a component imaging device that images the component held by the nozzle;
a substrate imaging device that moves integrally with the nozzle to image the substrate;
an offset amount calculation unit that calculates an offset amount between the nozzle and the substrate imaging device,
The component imaging device includes:
a component imaging unit provided in the imaging element for imaging the component;
a transparent member provided on a first optical path along which the component imaging unit images the component;
a mark provided on the transparent member outside the field of view of the component imaging unit;
a mark imaging unit provided in the imaging element and configured to image the mark;
the transparent member is provided on a second optical path along which the mark imaging unit images the mark,
the offset amount calculation unit calculates the offset amount based on an imaging result of the mark by the mark imaging unit of the component imaging device and an imaging result of the mark by the board imaging device.
Component mounting equipment. The component imaging unit and the mark imaging unit are provided in different portions of the imaging element.
The component mounting apparatus according to claim 5 . a correction member that corrects an optical path length is provided in at least one of the first optical path in which the component imaging unit images the component and the second optical path in which the mark imaging unit images the mark;
7. The component mounting apparatus according to claim 5 or 6 . the component imaging device includes a positional deviation amount calculation unit that calculates a positional deviation amount of a field of view of the component imaging unit based on an imaging result of the mark by the mark imaging unit,
the offset amount calculation unit calculates the offset amount based on an imaging result of the mark by the board imaging device and a positional deviation amount of the field of view of the component imaging device.
The component mounting device according to claim 5 . the component imaging device includes a component illumination unit that illuminates the mark when the component imaging device images the mark,
The substrate imaging device has a substrate illumination unit that illuminates the mark when the substrate imaging device images the mark.
9. The component mounting apparatus according to claim 5 ,

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