JP7549006B2 - Circuit forming method and circuit forming device - Google Patents

Description

The present invention relates to a circuit formation method and a circuit formation device that form a circuit using wiring formed on a substrate and electronic components mounted on the substrate.

As described in the following patent document, a technology has been developed to form a circuit using wiring formed on a substrate and electronic components mounted on the substrate.

JP 2013-115070 A

The objective is to properly form a circuit using wiring formed on a substrate and electronic components mounted on the substrate.

In order to solve the above problems, the present specification provides a substrate forming step of forming a substrate which is a resin laminate having resin layers laminated thereon by repeating the discharge of an ultraviolet curing resin and the irradiation of ultraviolet light to the discharged ultraviolet curing resin, a wiring forming step of forming wiring on the substrate, and a cavity-shaped resin laminate having a depth dimension larger than the height dimension of an electronic component to be mounted, which is formed on the substrate by repeating the discharge of the ultraviolet curing resin on the substrate and the irradiation of ultraviolet light to the discharged ultraviolet curing resin, such that a part of the wiring is exposed inside the cavity. the mounting step of mounting the electronic component on the substrate with the electrodes of the electronic component facing downward so that the electrodes are electrically connected to wiring exposed inside the cavity; the encapsulation step of injecting and curing a thermosetting resin between the substrate and the electronic component mounted on the substrate; and the sealing step of forming a resin laminate by repeatedly discharging the ultraviolet curing resin into the cavity and irradiating the discharged ultraviolet curing resin with ultraviolet rays , thereby sealing the electronic component mounted inside the cavity with the resin laminate.

In order to solve the above-mentioned problems, the present specification provides a method for manufacturing a resin laminate comprising: a first modeling unit that forms wiring; a second modeling unit that forms a resin layer; and a mounting unit that mounts an electronic component on a substrate; the second modeling unit repeatedly discharges an ultraviolet curing resin and irradiates the discharged ultraviolet curing resin with ultraviolet light to form a base material that is a resin laminate formed by stacking resin layers; the first modeling unit forms wiring on the base material; and the second modeling unit repeatedly discharges the ultraviolet curing resin on the base material and irradiates the discharged ultraviolet curing resin with ultraviolet light to form a resin laminate having a cavity with a depth dimension larger than the height dimension of an electronic component to be mounted, the resin laminate being formed by stacking resin layers on the base material, the the mounting unit mounts the electronic component on the substrate with the electrodes of the electronic component facing downward so that the electrodes are electrically connected to the wiring exposed inside the cavity; the second modeling unit injects and hardens a thermosetting resin between the substrate and the electronic component mounted on the substrate; and the second modeling unit repeatedly ejects the ultraviolet-curing resin into the cavity and irradiates the ejected ultraviolet-curing resin with ultraviolet light to form a resin laminate, thereby sealing the electronic component mounted inside the cavity with the resin laminate.

In the present disclosure, electronic components are mounted on a substrate with the electrodes facing downwards so that the electrodes are electrically connected to the wiring. Then, a thermosetting resin is filled between the substrate and the electronic components mounted on the substrate, and the electronic components mounted on the substrate are sealed with an ultraviolet-curing resin. This allows the circuit to be properly formed.

FIG. 1 is a diagram showing a circuit forming device. FIG. 2 is a block diagram showing a control device. FIG. 2 is a cross-sectional view showing a circuit in a state in which a resin laminate has been formed. FIG. 2 is a cross-sectional view showing a circuit in a state in which a resin laminate is further formed on the resin laminate. 4 is a cross-sectional view showing a circuit in a state where an electronic component is mounted inside a cavity of a resin laminate. FIG. 4 is a cross-sectional view showing a circuit in a state where a resin laminate is sealed inside a cavity. FIG. FIG. 2 is a cross-sectional view showing a circuit in a state in which wiring electrically connected to an electronic component is formed. 1 is a cross-sectional view showing a circuit in a state in which wiring that cannot be properly electrically connected to an electronic component is formed. 1 is a cross-sectional view showing a circuit in a state in which wiring that cannot be properly electrically connected to an electronic component is formed. FIG. 2 is a cross-sectional view showing a circuit in a state in which wiring is formed on a resin laminate. FIG. 2 is a cross-sectional view showing a circuit in a state in which a resin laminate is further formed on the resin laminate. 4 is a cross-sectional view showing a circuit in a state where an electronic component is mounted inside a cavity of a resin laminate. FIG. 4 is a cross-sectional view showing a circuit in a state in which an electronic component mounted in a cavity is sealed with a resin laminate. FIG. 11 is a plan view showing a circuit in a state in which a thermosetting resin has been discharged along a side surface of an electronic component. FIG. 4 is a cross-sectional view showing a circuit in a state in which a thermosetting resin is sealed between the upper surface of the resin laminate and the lower surface of the electronic component. FIG. 4 is a cross-sectional view showing a circuit in a state in which an electronic component mounted in a cavity is sealed with a resin laminate. FIG.

Figure 1 shows the circuit forming device 10. The circuit forming device 10 includes a conveying device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, and a control device (see Figure 2) 28. The conveying device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 are arranged on a base 29 of the circuit forming device 10. The base 29 is generally rectangular in shape, and in the following description, the longitudinal direction of the base 29 is referred to as the X-axis direction, the lateral direction of the base 29 as the Y-axis direction, and the direction perpendicular to both the X-axis direction and the Y-axis direction as the Z-axis direction.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 29 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. The X-axis slide mechanism 30 also includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by the drive of the electromagnetic motor 38. The Y-axis slide mechanism 32 also includes a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. The stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to any position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to any position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The stage 52 has a base 60, a holding device 62, and a lifting device 64. The base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. The substrate is fixedly held by clamping both edges in the X-axis direction of the substrate placed on the base 60 between the holding devices 62. The lifting device 64 is disposed below the base 60, and raises and lowers the base 60.

The first modeling unit 22 is a unit that models the wiring of the circuit board, and has a first printing unit 72 and a heating unit 74. The first printing unit 72 has an inkjet head (see FIG. 2) 76 and a dispense head (see FIG. 2) 77. The inkjet head 76 ejects metal ink in a linear shape. The metal ink is a dispersion of nanometer-sized metal particles in a solvent. The surfaces of the metal particles are coated with a dispersant to prevent aggregation in the solvent. The inkjet head 76 ejects the metal ink from multiple nozzles, for example, by a piezo method using a piezoelectric element.

The dispense head 77 also ejects metal paste. The metal paste is a resin that hardens when heated and has micrometer-sized metal particles dispersed in it. The metal particles are in the form of flakes. The viscosity of the metal paste is relatively high compared to metal ink, so the dispense head 77 ejects the metal paste from a single nozzle with a diameter larger than that of the nozzle of the inkjet head 76.

The heating unit 74 has a heater 78 (see FIG. 2). The heater 78 is a device that heats the metal ink ejected by the inkjet head 76. The metal ink is baked by being heated by the heater 78, and wiring is formed. Note that baking of metal ink is a phenomenon in which, by applying energy, the solvent is evaporated and the protective film for the metal particles, i.e., the dispersant is decomposed, and the metal particles come into contact or fuse together, thereby increasing the electrical conductivity. Then, by baking the metal ink, metal wiring is formed.

The heater 78 is also a device that heats the metal paste dispensed by the dispense head 77. When the metal paste is heated by the heater 78, the resin hardens. At this time, the hardened resin in the metal paste shrinks, and the flake-shaped metal particles dispersed in the resin come into contact with each other. This causes the metal paste to exhibit electrical conductivity.

The second modeling unit 24 is a unit that models the resin layer of the circuit board, and has a second printing section 84 and a curing section 86. The second printing section 84 has an inkjet head (see FIG. 2) 88 and a dispense head (see FIG. 2) 89. The inkjet head 88 dispenses ultraviolet curing resin. The ultraviolet curing resin is a resin that is cured by irradiation with ultraviolet light. The dispense head 89 dispenses thermosetting resin. The thermosetting resin is a resin that is cured by heating. The inkjet head 88 may be, for example, a piezo type that uses a piezoelectric element, or a thermal type that heats the resin to generate bubbles and discharges the resin from multiple nozzles.

The curing section 86 has a flattening device (see FIG. 2) 90, an irradiation device (see FIG. 2) 92, and a heater (see FIG. 2) 93. The flattening device 90 flattens the upper surface of the ultraviolet curing resin discharged by the inkjet head 88, for example, by leveling the surface of the ultraviolet curing resin and scraping off excess resin with a roller or blade, thereby making the thickness of the ultraviolet curing resin uniform. The irradiation device 92 has a mercury lamp or LED as a light source and irradiates the discharged ultraviolet curing resin with ultraviolet rays. This hardens the discharged ultraviolet curing resin, forming a resin layer. The heater 93 heats the thermosetting resin discharged by the dispense head 89. This hardens the discharged thermosetting resin, forming a resin layer.

The mounting unit 26 is a unit that mounts electronic components on a circuit board, and has a supply section 110 and a mounting section 112. The supply section 110 has a plurality of tape feeders (see FIG. 2) 114 that feed taped electronic components one by one, and supplies the electronic components at a supply position. Note that the supply section 110 is not limited to the tape feeders 114, and may be a tray-type supply device that picks up and supplies electronic components from a tray. The supply section 110 may also be configured to include both tape-type and tray-type supply devices, or other types of supply devices.

The mounting section 112 has a mounting head 116 (see FIG. 2) and a moving device 118 (see FIG. 2). The mounting head 116 has a suction nozzle (not shown) for suctioning and holding an electronic component (see FIG. 11) 119. The suction nozzle suctions and holds the electronic component by sucking air when negative pressure is supplied from a positive/negative pressure supply device (not shown). Then, the electronic component is released when a slight positive pressure is supplied from the positive/negative pressure supply device. The moving device 118 moves the mounting head 116 between the supply position of the electronic component by the tape feeder 114 and the base 60. As a result, in the mounting section 112, the electronic component supplied from the tape feeder 114 is held by the suction nozzle, and the electronic component held by the suction nozzle is mounted on the circuit board.

2, the control device 28 includes a controller 120 and a plurality of drive circuits 122. The plurality of drive circuits 122 are connected to the electromagnetic motors 38, 56, the holding device 62, the lifting device 64, the inkjet head 76, the dispense head 77, the heater 78, the inkjet head 88, the dispense head 89, the flattening device 90, the irradiation device 92, the heater 93, the tape feeder 114, the mounting head 116, and the moving device 118. The controller 120 includes a CPU, ROM, RAM, etc., and is mainly a computer, and is connected to the plurality of drive circuits 122. As a result, the operation of the transport device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 is controlled by the controller 120.

In the circuit forming device 10, a resin laminate is formed on a substrate using the above-mentioned configuration, electronic components are mounted on the resin laminate, and wiring is formed to electrically connect to the electronic components, thereby forming a circuit.

Specifically, a substrate (see FIG. 3) 70 is set on the base 60 of the stage 52, and the stage 52 is moved below the second modeling unit 24. Then, in the second modeling unit 24, a resin laminate 130 is formed on the substrate 70, as shown in FIG. 3. The resin laminate 130 is formed by repeatedly ejecting ultraviolet curable resin from the inkjet head 88 and irradiating the ejected ultraviolet curable resin with ultraviolet light by the irradiation device 92.

More specifically, in the second printing section 84 of the second modeling unit 24, the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the upper surface of the substrate 70. Next, once the ultraviolet curable resin has been ejected in a thin film, the ultraviolet curable resin is flattened by the flattening device 90 in the curing section 86 so that the film thickness of the ultraviolet curable resin is uniform. Then, the irradiation device 92 irradiates the thin film of ultraviolet curable resin with ultraviolet light. This forms a thin film resin layer 132 on the substrate 70.

Then, the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the thin film resin layer 132. The thin film of ultraviolet curable resin is then flattened by the flattening device 90, and the irradiation device 92 irradiates the ejected thin film of ultraviolet curable resin with ultraviolet light, thereby laminating a thin film of resin layer 132 on top of the thin film of resin layer 132. In this manner, ejection of ultraviolet curable resin onto the thin film of resin layer 132 and irradiation with ultraviolet light are repeated, and a plurality of resin layers 132 are laminated to form the resin laminate 130.

Next, as shown in FIG. 4, a resin laminate 140 is further formed on the resin laminate 130. The resin laminate 140 has a cavity 142 and is created by substantially the same method as the resin laminate 130. That is, in the second printing section 84 of the second modeling unit 24, the inkjet head 88 ejects the ultraviolet curing resin in a thin film on the upper surface of the resin laminate 130. At this time, the inkjet head 88 ejects the ultraviolet curing resin so that a predetermined portion of the upper surface of the resin laminate 130 is exposed in a generally rectangular shape. Next, when the ultraviolet curing resin is ejected in a thin film, the ultraviolet curing resin ejected in a thin film is flattened by the flattening device 90 in the curing section 86, and ultraviolet light is irradiated by the irradiation device 92. As a result, a thin-film resin layer 144 is formed on the resin laminate 130.

Then, the inkjet head 88 ejects a thin film of ultraviolet curable resin only onto the portion above the thin film resin layer 144. The ejected thin film of ultraviolet curable resin is then flattened by the flattening device 90, and the thin film resin layer 144 is laminated on the thin film resin layer 144 by irradiating it with ultraviolet light by the irradiation device 92. In this manner, ejection of ultraviolet curable resin onto the thin film resin layer 144 except for the generally rectangular portion of the upper surface of the resin laminate 130 and irradiation with ultraviolet light are repeated, and a plurality of resin layers 144 are laminated to form a resin laminate 140 having a cavity 142.

Then, when the resin laminate 140 having the cavity 142 is formed, the stage 52 is moved below the mounting unit 26. In the mounting unit 26, the electronic component is supplied by the tape feeder 114, and the electronic component is held by the suction nozzle of the mounting head 116. As shown in FIG. 5, the electronic component 150 is generally composed of a block-shaped component body 152 and a pair of electrodes 154 arranged on one surface of the component body 152. Then, the mounting head 116 is moved by the moving device 118, and the electronic component 150 held by the suction nozzle is mounted on the upper surface of the resin laminate 130 inside the cavity 142 of the resin laminate 140. At this time, the electronic component 150 is mounted on the upper surface of the resin laminate 130 inside the cavity 142 of the resin laminate 140 with the pair of electrodes 154 of the electronic component 150 facing upward. The depth dimension of the cavity 142 of the resin laminate 140 is approximately the same as the height dimension of the component body 152 of the electronic component 150. Therefore, the height of the top surface of the component body 152 of the electronic component 150 mounted inside the cavity 142 is approximately the same as the top surface of the resin laminate 140.

Next, the stage 52 is moved below the second modeling unit 24. Then, in the second modeling unit 24, as shown in FIG. 6, the resin laminate 160 is formed in the gap of the cavity 142 of the resin laminate 140, that is, between the side of the component body 152 of the electronic component 150 and the inner wall surface that defines the cavity 142 of the resin laminate 140. At this time, the resin laminate 160 is formed so that the upper surface of the resin laminate 160 and the upper surface of the resin laminate 140 are flat, that is, flush with each other. As a result, the upper surface of the resin laminate 140, the upper surface of the resin laminate 160, and the upper surface of the component body 152 of the electronic component 150 are flush with each other. Note that the resin laminate 160 is formed by repeating the ejection of ultraviolet curable resin by the inkjet head 88 and the irradiation of ultraviolet light by the irradiation device 92, similar to the resin laminate 130.

Then, the stage 52 is moved below the first modeling unit 22. Then, in the first printing section 72 of the first modeling unit 22, the inkjet head 76 ejects metal ink in a line shape onto the resin laminates 140, 160 according to the circuit pattern. At this time, as shown in FIG. 7, the metal ink 170 is ejected in a line shape so as to connect the electrode 154 of the electronic component 150 to the electrode of another electronic component (not shown). Then, in the heating section 74 of the first modeling unit 22, the metal ink 170 is heated by the heater 78. As a result, the metal ink 170 is baked, and the wiring 172 is formed. In other words, the wiring 172 that is conductive to the electrode 154 of the electronic component 150 is formed.

In this way, in the circuit forming device 10, the resin laminates 130, 140, 160 are formed from the UV-curable resin, the electronic components 150 are mounted, and the wiring 172 that conducts electricity to the electronic components is formed from the metal ink 170, making it possible to form a circuit. However, when a circuit is formed using the above-mentioned method, there is a risk that the circuit may not be formed properly due to dimensional tolerances of the components, etc.

Specifically, for example, when the dimensions of electronic component 150, particularly the height dimension of component body 152, are small, as shown in FIG. 8, when electronic component 150 is mounted inside cavity 142 and resin laminate 160 is formed inside cavity 142, electronic component 150 is embedded inside resin laminate 160. When electronic component 150 is embedded inside resin laminate 160 in this way, electrodes 154 of electronic component 150 are not exposed, so electrodes 154 cannot be electrically connected to wiring 172, and an appropriate circuit cannot be formed.

On the other hand, when the dimensions of the electronic component 150, particularly the height dimension of the component body 152, are large, as shown in FIG. 9, when the electronic component 150 is mounted inside the cavity 142 and the resin laminate 160 is formed inside the cavity 142, the component body 152 protrudes from the upper surface of the resin laminate 160. When the component body 152 of the electronic component 150 protrudes from the upper surface of the resin laminate 160 in this way, the upper surface of the resin laminate 160 and the upper surface of the component body 152 form a step surface, and the wiring 172 is broken, so that the electrode 154 cannot be electrically connected to the wiring 172 and a suitable circuit cannot be formed.

For this reason, it is conceivable to form a circuit using a method of mounting the electronic components 150 with the electrodes 154 facing downward (hereinafter referred to as the "face-down mounting method"), rather than a method of mounting the electronic components 150 with the electrodes 154 facing upward (hereinafter referred to as the "face-up mounting method"). Specifically, first, in the second modeling unit 24, a resin laminate 130 is formed on the upper surface of the substrate 70 as shown in FIG. 3, similar to the face-up mounting method. Next, the stage 52 is moved below the first modeling unit 22, and wiring 172 is formed in the first modeling unit 22 as shown in FIG. 10.

Then, the stage 52 is moved below the second modeling unit 24, and in the second modeling unit 24, as shown in FIG. 11, a resin laminate 140 having a cavity 142 is formed on the resin laminate 130. At this time, the resin laminate 140 is formed so that the end of the wiring 172 formed on the resin laminate 130 is exposed inside the cavity 142. Then, the stage 52 is moved below the first modeling unit 22, and in the first printing section 72 of the first modeling unit 22, the dispense head 77 ejects metal paste 180 onto the end of the wiring 172 exposed inside the cavity 142.

Next, the stage 52 is moved below the mounting unit 26. In the mounting unit 26, the electronic component 150 is supplied by the tape feeder 114, and the electronic component 150 is held by the suction nozzle of the mounting head 116. Then, the mounting head 116 is moved by the moving device 118, and the electronic component 150 held by the suction nozzle is mounted inside the cavity 142 of the resin laminate 140. At this time, as shown in FIG. 12, with a pair of electrodes 154 of the electronic component 150 facing downward, the electronic component 150 is mounted inside the cavity 142 so as to come into contact with the metal paste 180 dispensed onto the wiring 172. Then, the stage 52 is moved below the first modeling unit 22, and the metal paste 180 is heated by the heater 78 in the heating section 74 of the first modeling unit 22. This causes the metal paste 180 to harden and become conductive, so that the electrodes of the electronic component 150 are electrically connected to the wiring 172 via the conductive metal paste 180.

Next, the stage 52 is moved below the second modeling unit 24. Then, in the second modeling unit 24, as shown in FIG. 13, a resin laminate 190 is formed inside the cavity 142 of the resin laminate 140, that is, between the inner wall surface that defines the cavity 142 of the resin laminate 140 and the electronic component 150. Note that, like the resin laminate 130, the resin laminate 190 is formed by repeatedly ejecting ultraviolet curable resin from the inkjet head 88 and irradiating ultraviolet light from the irradiation device 92.

In addition, since the depth dimension of the cavity 142 is larger than the height dimension of the electronic component 150, the electronic component 150 mounted in the cavity 142 is embedded inside the resin laminate 190 formed in the cavity 142. As a result, a circuit in which the electronic component 150 is sealed inside the resin laminate 190, that is, a circuit in which the electronic component 150 is sealed in the resin laminate 190, is formed. In this way, by sealing the electronic component 150 in the resin laminate 190, peeling, oxidation, ion migration, etc. of the electronic component 150 and the wiring 172 can be prevented. In addition, even if, for example, the height dimension of the component body 152 differs due to the dimensional tolerance of the electronic component 150, the electrode 154 of the electronic component 150 can be reliably electrically connected to the wiring 172. Furthermore, the upper surface of the resin laminate 190 in which the electronic component 150 is embedded and the upper surface of the resin laminate 140 are made to be a flat plane that is connected to each other. That is, when the resin laminate 190 is formed, the surface of the UV-curable resin discharged as the upper surface of the resin laminate 190 is flattened by a flattening device 90 so that it is flush with the upper surface of the resin laminate 140, and then the UV-curable resin is irradiated with UV rays. This makes it possible to form a circuit with a flat surface.

In this way, by adopting the face-down mounting method, the electronic component 150 is sealed in the resin laminate 190, which ensures reliable electrical continuity between the electronic component 150 and the wiring 172 and prevents peeling, oxidation, ion migration, and the like between the electronic component 150 and the wiring 172. However, since the resin laminate 190 is formed by discharging an ultraviolet-curable resin between the electronic component 150 and the cavity 142 after the electronic component 150 is mounted inside the cavity 142 and then irradiating the ultraviolet-curable resin with ultraviolet light, there is a risk that the ultraviolet-curable resin may partially fail to cure.

In more detail, like the resin laminate 130, the resin laminate 190 is formed by laminating multiple thin-film resin layers, but when the lower resin layer of the resin laminate 190 is formed, ultraviolet-curable resin gets into the gap between the lower surface of the electronic component 150 and the upper surface of the resin laminate 130 at the bottom surface of the cavity 142. In this way, the ultraviolet-curable resin that gets into the gap between the lower surface of the electronic component 150 and the upper surface of the resin laminate 130 cannot be irradiated with ultraviolet light, and therefore, poor curing occurs. In other words, in the resin laminate 190 that seals the electronic component 150, there is a risk that the ultraviolet-curable resin that gets into the gap between the lower surface of the electronic component 150 and the upper surface of the resin laminate 130 is in a poorly cured state.

In view of this, when a circuit is formed using the face-down mounting method, not only an ultraviolet curing resin but also a thermosetting resin is used as the resin for sealing the electronic component 150. Specifically, as in the above-mentioned method using the face-down mounting method, as shown in FIG. 12, the electronic component 150 is mounted in the cavity 142 of the resin laminate 140 with the electrode 154 facing downward. At this time, the electrode 154 of the electronic component 150 is brought into contact with the metal paste 180 dispensed onto the wiring 172. Then, the metal paste 180 is heated by the heater 78 to make the metal paste 180 conductive, and the electrode 154 of the electronic component 150 is made conductive to the wiring 172 via the metal paste 180.

Next, the stage 52 is moved below the second modeling unit 24. Then, the dispense head 89 dispenses the thermosetting resin 200 onto the upper surface of the resin laminate 130 inside the cavity 142 along the outer edge of the side of the electronic component 150 attached to the upper surface of the resin laminate 130, as shown in FIG. 14. At this time, the dispense head 89 dispenses the thermosetting resin 200 in a generally L-shape along the outer edge of one of the four side surfaces of the electronic component 150 and another side surface that is continuous with the one side surface. Note that FIG. 14 is a view showing the circuit as it is being formed, viewed from above.

When the thermosetting resin 200 is discharged onto the upper surface of the resin laminate 130 along the outer edge of the side of the electronic component 150, the thermosetting resin 200 penetrates between the upper surface of the resin laminate 130 and the lower surface of the component body 152 of the electronic component 150 by capillary action. As a result, as shown in FIG. 15, the thermosetting resin 200 is sealed between the upper surface of the resin laminate 130 and the lower surface of the component body 152 of the electronic component 150. In other words, the thermosetting resin 200 is sealed between the upper surface of the resin laminate 130 and the lower surface of the component body 152. Then, the thermosetting resin 200 is heated by the heater 93, and the thermosetting resin 200 hardens while being sealed between the upper surface of the resin laminate 130 and the lower surface of the component body 152.

Next, in the second modeling unit 24, the ejection of a thin-film ultraviolet-curing resin into the cavity 142, that is, between the inner wall surface that defines the cavity 142 of the resin laminate 140 and the electronic component 150, and the irradiation of ultraviolet light to the ultraviolet-curing resin are repeated. As a result, as shown in FIG. 16, the electronic component 150 is sealed by the resin laminate 210 of the cured ultraviolet-curing resin inside the cavity 142. In other words, the electronic component 150 is sealed by the resin laminate 210 of the ultraviolet-curing resin in a state in which the cured thermosetting resin 200 is sealed between the upper surface of the resin laminate 130 and the lower surface of the component body 152 inside the cavity 142. In this way, the thermosetting resin 200 is used as the resin sealed between the upper surface of the resin laminate 130 and the lower surface of the component body 152 inside the cavity 142. On the other hand, an ultraviolet curing resin is used as the resin that seals the electronic component 150 inside the cavity 142 above the thermosetting resin 200. This makes it possible to prevent poor curing of the resin inside the cavity 142 in which the electronic component 150 is mounted, and ensures the formation of an appropriate circuit.

When forming the resin laminate 210, similarly to when forming the resin laminate 190, the surface of the ultraviolet curable resin discharged as the upper surface of the resin laminate 210 is flattened by a flattening device 90 so that it is flush with the upper surface of the resin laminate 140, and then the ultraviolet curable resin is irradiated with ultraviolet light. This makes the upper surface of the resin laminate 210 that seals the electronic component 150 and the upper surface of the resin laminate 140 a flat, connected plane.

As shown in FIG. 2, the controller 120 of the control device 28 has a forming section 220, an application section 222, an attachment section 224, an encapsulation section 226, a sealing section 228, and a flattening section 230. The forming section 220 is a functional section for forming the wiring 172 on the resin laminate 130. The application section 222 is a functional section for applying the metal paste 180 on the wiring 172. The attachment section 224 is a functional section for mounting the electronic component 150 inside the cavity 142 so that the electrode 154 contacts the metal paste 180. The encapsulation section 226 is a functional section for encapsulating the thermosetting resin 200 between the lower surface of the electronic component 150 attached to the cavity 142 and the upper surface of the resin laminate 130. The sealing section 228 is a functional section for sealing the electronic component 150 attached to the cavity 142 with the resin laminate 210. The planarizing section 230 is a functional section for planarizing the upper surface of the resin laminate 210 that encapsulates the electronic component 150 so that it is flush with the upper surface of the resin laminate 140.

In the above embodiment, the circuit forming device 10 is an example of a circuit forming device. The inkjet head 76 is an example of a forming device. The heater 78 is an example of a forming device. The inkjet head 88 is an example of a sealing device. The dispense head 89 is an example of an encapsulating device. The irradiation device 92 is an example of a sealing device. The heater 93 is an example of an encapsulating device. The mounting head 116 is an example of a mounting device. The moving device 118 is an example of a mounting device. The resin laminate 130 is an example of a substrate. The resin laminate 140 is an example of a substrate. The cavity 142 is an example of a cavity. The electronic component 150 is an example of an electronic component. The electrode 154 is an example of an electrode. The wiring 172 is an example of a wiring. The metal paste 180 is an example of a conductive fluid. The thermosetting resin 200 is an example of a thermosetting resin. The process performed by the forming unit 220 is an example of a forming process. The process performed by the coating unit 222 is an example of a coating process. The process performed by the mounting unit 224 is an example of a mounting process. The process performed by the encapsulation unit 226 is an example of an encapsulation process. The process performed by the sealing unit 228 is an example of a sealing process. The process performed by the flattening unit 230 is an example of a flattening process.

The present invention is not limited to the above embodiment, and can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above embodiment, the electronic component 150 is mounted inside the cavity 142 with the electrode 154 facing downward, but the electronic component 150 may be mounted in a part other than the cavity with the electrode 154 facing downward.

When the thermosetting resin 200 is filled between the upper surface of the resin laminate 130 and the lower surface of the electronic component 150, the thermosetting resin 200 is applied along two of the side surfaces of the component body 152, but the thermosetting resin 200 may be applied along any number of the side surfaces of the component body 152. However, if the thermosetting resin 200 is applied along all of the side surfaces of the component body 152, there is a risk that air will be filled between the upper surface of the resin laminate 130 and the lower surface of the electronic component 150, so it is preferable that the thermosetting resin 200 is applied along fewer than all of the side surfaces of the component body 152.

In the above embodiment, a thermosetting resin is used as the resin filled between the upper surface of the resin laminate 130 and the lower surface of the electronic component 150, but any resin other than ultraviolet curable resin can be used. Specifically, for example, a two-liquid mixed curable resin can be used.

In the above embodiment, the circuit is composed of the resin laminates 130, 140, 210, wiring 172, electronic components 150, thermosetting resin 200, etc., but wiring may be formed on top of the circuit, electronic components may be attached, and resin laminates may be laminated.

In addition, in the above embodiment, the metal ink and metal paste are heated by the heater 78, but the metal ink and metal paste may also be heated by irradiation with laser light or the like.

In the above embodiment, the metal paste 180 is ejected by the dispense head 77, but the metal paste 180 may be transferred by a stamp or the like. Also, the metal ink or metal paste may be printed by screen printing.

10: Circuit forming device 76: Inkjet head (forming device) 78: Heater (forming device) 88: Inkjet head (sealing device) 89: Dispense head (encapsulation device) 92: Irradiation device (sealing device) 93: Heater (encapsulation device) 116: Mounting head (mounting device) 118: Moving device (mounting device) 130: Resin laminate (substrate) 140: Resin laminate (substrate) 142: Cavity 150: Electronic component 154: Electrode 172: Wiring 180: Metal paste (conductive fluid) 200: Thermosetting resin 220: Forming section (forming process) 222: Coating section (coating process) 224: Mounting section (mounting process) 226: Encapsulation section (encapsulation process) 228: Sealing section (sealing process) 230: Flattening section (flattening process)

Claims (5)

a substrate forming step of forming a substrate which is a resin laminate having resin layers stacked thereon by repeating the ejection of an ultraviolet curable resin and the irradiation of ultraviolet rays to the ejected ultraviolet curable resin ;
a wiring forming step of forming wiring on the base material;
a cavity forming step of forming a resin laminate having a cavity with a depth dimension larger than a height dimension of an electronic component to be mounted on the base material by repeating the discharge of the ultraviolet curing resin onto the base material and the irradiation of ultraviolet rays to the discharged ultraviolet curing resin, so that a part of the wiring is exposed inside the cavity;
a mounting step of mounting the electronic component on the substrate with the electrodes of the electronic component facing downward so that the electrodes are electrically connected to wiring exposed inside the cavity;
an encapsulation step of encapsulating and curing a thermosetting resin between the substrate and the electronic components mounted on the substrate;
a sealing process in which the electronic component mounted inside the cavity is sealed with the resin laminate by repeatedly discharging the ultraviolet curing resin inside the cavity and irradiating the discharged ultraviolet curing resin with ultraviolet light to form a resin laminate;
A circuit forming method comprising the steps of: A coating step of coating the wiring with a conductive fluid that exhibits conductivity when heated,
The mounting step includes:
The method for forming a circuit according to claim 1 , further comprising the step of mounting the electronic component so that the electrode is in contact with the conductive fluid applied onto the wiring. The circuit forming method according to claim 1 or 2, further comprising a planarizing step of planarizing the upper surface of the ultraviolet curing resin that seals the electronic components mounted inside the cavity so that it is flush with the upper surface of the substrate. The encapsulation step includes:
4. The circuit forming method according to claim 1, further comprising discharging a thermosetting resin along an outer edge of an electronic component mounted on the substrate, thereby sealing the thermosetting resin between the substrate and the electronic component. a first modeling unit that forms wiring;
a second modeling unit that forms a resin layer;
a mounting unit for mounting electronic components on a board;
Equipped with
The second modeling unit repeats the discharge of the ultraviolet curing resin and the irradiation of the ultraviolet ray to the discharged ultraviolet curing resin, thereby forming a base material which is a resin laminate in which resin layers are laminated;
forming wiring on the base material by the first modeling unit;
By repeating the discharging of the ultraviolet curing resin onto the base material and the irradiation of ultraviolet rays to the discharged ultraviolet curing resin by the second modeling unit, a resin laminate having a cavity with a depth dimension larger than a height dimension of an electronic component to be mounted is formed on the base material such that a part of the wiring is exposed inside the cavity;
The mounting unit mounts the electronic component on the substrate with the electrodes of the electronic component facing downward so that the electrodes are electrically connected to wiring exposed inside the cavity;
by the second modeling unit, filling a space between the base material and the electronic component mounted on the base material with a thermosetting resin and curing the resin;
A circuit forming device in which the second molding unit forms a resin laminate by repeatedly ejecting the ultraviolet-curing resin inside the cavity and irradiating the ejected ultraviolet-curing resin with ultraviolet light , thereby sealing an electronic component mounted inside the cavity with the resin laminate.

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