JP7550367B2 - Mounting system, head unit and imaging method - Google Patents

Description

The present disclosure relates generally to an implementation system, a head unit, and an imaging method, and more specifically to an implementation system, a head unit, and an imaging method for implementing a first object captured by a capture unit onto a second object.

Patent document 1 discloses an imaging device and imaging method for capturing images while a surface mount machine is picking up and mounting components.

The imaging device described in Patent Document 1 captures images of the component mounting operation by the suction nozzle when the capture unit (suction nozzle) picks up a component and mounts it at a specified component mounting position. The imaging device is connected to the mounting head (head body) via a bracket and moves together with the mounting head. During the mounting process, when the capture unit is positioned above a specific area (component mounting position) on the printed circuit board, the CCD camera of the imaging device captures an image of a certain range centered on the specific area. Therefore, the CCD camera of the imaging device is positioned diagonally above the specific area on the printed circuit board.

JP 2008-103426 A

This disclosure has been made in consideration of the above reasons, and aims to provide an implementation system, head unit, and imaging method that are more suitable for imaging specific areas.

A mounting system according to one aspect of the present disclosure includes a mounting head and an imaging device. The mounting head has a capture unit. The mounting head moves the capture unit to approach a second object while the capture unit captures a first object, and mounts the first object on a mounting surface of the second object. The imaging device is fixed to the mounting head , and includes in its imaging field of view a specific area of the mounting surface that faces the capture unit in a direction perpendicular to the mounting surface. When the imaging field of view is divided into a central portion and a peripheral portion, the imaging device has a higher resolution in the peripheral portion of the imaging field of view than in the central portion.

A head unit according to one aspect of the present disclosure includes a mounting head and an imaging device. The mounting head has a capture unit. The mounting head moves the capture unit to approach a second object while the capture unit captures a first object, and mounts the first object on a mounting surface of the second object. The imaging device is fixed to the mounting head , and includes in its imaging field of view a specific area of the mounting surface that faces the capture unit in a direction perpendicular to the mounting surface. When the imaging field of view is divided into a central portion and a peripheral portion, the imaging device has a higher resolution in the peripheral portion of the imaging field of view than in the central portion.

An imaging method according to one aspect of the present disclosure is an imaging method used in a mounting system including a mounting head. The mounting head has a capture unit. The mounting head moves the capture unit to approach a second object while the capture unit has captured a first object, and mounts the first object on the mounting surface of the second object. The imaging method includes a step of imaging a specific area with an imaging device. The imaging device is fixed to the mounting head , and includes in an imaging field of view a specific area of the mounting surface that faces the capture unit in a direction perpendicular to the mounting surface. In the step of imaging the specific area, when the imaging field of view is divided into a central portion and a peripheral portion, the imaging device images the peripheral portion with a higher resolution than the central portion of the imaging field of view.

FIG. 1 is a schematic perspective view of a mounting system according to a first embodiment. FIG. 2 is a schematic side view of a main part of the mounting system. FIG. 3 is a block diagram of the mounting system. 4A is a plan view of a head unit of the mounting system, FIG 4B is a front view of the head unit, and FIG 4C is a side view of the head unit. FIG. 5 is an explanatory diagram that illustrates a typical imaging field of view of an imaging device in the mounting system. 6A and 6B are schematic side views of a main part of the mounting system, respectively, and are schematic views of an image obtained by an imaging device in the mounting system. FIG. 7 is a flowchart showing an example of the operation of the mounting system. Fig. 8A is a schematic side view of a main part of a mounting system according to embodiment 2. Fig. 8B is a schematic enlarged cross-sectional view of an imaging device of the mounting system. FIG. 9 is an explanatory diagram that illustrates a typical imaging field of view of an imaging device in the mounting system. 10A and 10B are schematic side views of a main part of the mounting system, respectively, and are schematic views of an image obtained by an imaging device in the mounting system. Fig. 11A is a schematic plan view of a main part of a mounting system according to embodiment 3. Fig. 11B is a schematic side view of the main part of the mounting system.

(Embodiment 1)
Hereinafter, a mounting system 100, a head unit 10, and an imaging method according to the present embodiment will be described with reference to FIGS.

(1) Overview Conventionally, an imaging device is arranged with a CCD camera tilted with respect to the perpendicular line to the mounting surface (front surface) of a printed circuit board so as to face a specific area of the printed circuit board. Therefore, for example, the area occupied by the imaging device in a plane parallel to the mounting surface becomes relatively large, and there is a concern that the movement range of the mounting head may be restricted.

1, the mounting system 100 according to this embodiment is a mounting device (mounting machine) for mounting a first object T1 captured by a capture unit 11 onto a second object T2. The mounting system 100 is used in the manufacturing of various products such as electronic devices, automobiles, clothing, food, medicines, and crafts in facilities such as factories, laboratories, offices, and educational facilities.

In this embodiment, the mounting system 100 is used in the manufacture of electronic devices in a factory. A typical electronic device has various circuit blocks, such as a power supply circuit and a control circuit. In the manufacture of these circuit blocks, as an example, a solder application process, a mounting process, and a soldering process are performed in this order. In the solder application process, cream solder is applied (or printed) to a board (including a printed wiring board). In the mounting process, components (including electronic components) are mounted (mounted) on the board. In the soldering process, for example, the board with the components mounted thereon is heated in a reflow furnace to melt the cream solder and perform soldering. In the mounting process, the mounting system 100 performs the task of mounting the components, which are the first object T1, on the board, which is the second object T2.

Thus, the mounting system 100 used to mount a first object T1 (component) on a second object T2 (substrate) includes a mounting head 1 having a capture unit 11 for capturing the first object T1, as shown in Figure 1. The capture unit 11 is, for example, a suction nozzle, and captures (holds) the first object T1, which is a component, in a state in which it can be released (i.e., released from capture). With the first object T1 captured by the capture unit 11, the mounting system 100 lowers the capture unit 11 so as to approach the second object T2, and mounts the first object T1 on the mounting surface T21 of the second object T2.

In such a mounting system 100, when mounting the first object T1 on the mounting surface T21 of the second object T2, it is necessary to image the specific area R1 for the purpose of recognizing the specific area R1 that is the mounting position on the mounting surface T21. Therefore, the mounting system 100 according to this embodiment is equipped with an imaging device 2 as shown in FIG. 2 in addition to the mounting head 1. As a result, the mounting system 100 images the specific area R1 of the mounting surface T21 with the imaging device 2, and for example, it becomes possible to check the state of the first object T1 and/or the second object T2 by the image immediately before and/or immediately after the mounting of the first object T1 by the mounting head 1. Therefore, in this embodiment, the imaging device 2 is configured to be able to image at least the area directly below the capture section 11 of the mounting surface T21.

That is, the mounting system 100 according to this embodiment includes a mounting head 1 and an imaging device 2, as shown in FIG. 2. The mounting head 1 has a capture unit 11. With the capture unit 11 capturing the first object T1, the mounting head 1 moves the capture unit 11 closer to the second object T2, and mounts the first object T1 on the mounting surface T21 of the second object T2. The imaging device 2 is fixed to the mounting head 1. The imaging device 2 includes in its imaging field of view R10 a specific region R1 of the mounting surface T21 that faces the capture unit 11 in a direction perpendicular to the mounting surface T21. The imaging device 2 has an imaging optical axis Ax1 perpendicular to the mounting surface T21.

According to the above configuration, the imaging device 2 includes in the imaging field of view R10 the specific region R1 of the mounting surface T21 that faces the capture unit 11 in a direction perpendicular to the mounting surface T21, so that it is possible to image at least the region directly below the capture unit 11 of the mounting surface T21. Moreover, since the imaging optical axis Ax1 of the imaging device 2 is perpendicular to the mounting surface T21, it is possible to arrange the imaging device 2 in an orientation perpendicular to the mounting surface T21. That is, in this embodiment, the imaging optical axis Ax1 of the imaging device 2 is not directed toward the specific region R1, but is intentionally directed outside the specific region R1 so that the specific region R1 is reflected at the edge of the imaging field of view R10 of the imaging device 2. This makes it possible to make the imaging optical axis Ax1 of the imaging device 2 perpendicular to the mounting surface T21. Therefore, for example, there is an advantage that the area occupied by the imaging device 2 in a plane parallel to the mounting surface T21 can be kept relatively small, and the movement range of the mounting head 1 by the imaging device 2 is less likely to be restricted. Therefore, it is possible to provide a mounting system 100 that is more suitable for imaging the specific region R1.

(2) Details The mounting system 100, the head unit 10, and the imaging method according to this embodiment will be described in detail below.

(2.1) Premise In this embodiment, as an example, a case will be described in which the mounting system 100 is used to mount a component (first object T1) by surface mount technology (SMT). That is, the component as the first object T1 is a surface mount component (SMD: Surface Mount Device), and is mounted by being placed on the surface (mounting surface) of the substrate as the second object T2. However, this is not limited to this example, and the mounting system 100 may be used to mount a component (first object T1) by insertion mount technology (IMT). In this case, the component as the first object T1 is a component for insertion mounting having a lead terminal, and is mounted on the surface (mounting surface) of the substrate (second object T2) by inserting the lead terminal into a hole in the substrate as the second object T2.

Furthermore, the "imaging optical axis" in this disclosure is the optical axis of the image captured by the imaging device 2, and is the optical axis determined by both the imaging element 21 (see FIG. 2) and the optical system 22 (see FIG. 2) of the imaging device 2 described below. In other words, the optical path along which light passes from the center of the image captured by the imaging device 2 becomes the imaging optical axis Ax1 of the imaging device 2. Specifically, the straight line connecting the center of the light receiving surface of the imaging element 21 and the portion of the subject that is imaged at the center of the light receiving surface of the imaging element 21 through the optical system 22 becomes the imaging optical axis Ax1 of the imaging device 2.

Furthermore, the term "image" in this disclosure refers to an image captured by the imaging device 2, and includes still images (still images) and videos (moving images). Furthermore, "video" includes an image composed of multiple still images obtained by stop motion photography or the like. The image does not have to be the data itself output from the imaging device 2. For example, the image may be appropriately compressed as necessary, converted to another data format, or processed by cutting out a portion of the image captured by the imaging device 2, adjusting the focus, adjusting the brightness, adjusting the contrast, or the like. In this embodiment, as an example, the image is a full-color still image.

In addition, in this disclosure, "orthogonal" does not only mean a state in which the angle between two objects is exactly 90 degrees, but also means a state in which two objects are approximately orthogonal within a certain margin of error. In other words, the angle between two objects that are orthogonal falls within a certain margin of error (10 degrees or less, as an example) from 90 degrees. Similarly, in this disclosure, "parallel" does not only mean a state in which the angle between two objects is strictly 0 degrees, but also means a state in which two objects are approximately parallel within a certain margin of error. In other words, the angle between two objects that are parallel falls within a certain margin of error (10 degrees or less, as an example) from 0 degrees.

In the following, as an example, three mutually orthogonal axes, the X-axis, the Y-axis, and the Z-axis, are set, and the axes parallel to the surface (mounting surface T21) of the substrate, which is the second object T2, are defined as the "X-axis" and "Y-axis", and the axis parallel to the thickness direction of the substrate is defined as the "Z" axis. In particular, the "X-axis" is an axis along the direction in which two or more capture units 11 constituting the first capture unit group G1, which will be described later, are arranged. Furthermore, the capture unit 11 side as seen from the substrate, which is the second object T2, is defined as the positive direction of the Z-axis (also referred to as "above"). In addition, the state as seen from the positive direction of the Z-axis (above) is also referred to as "planar view" below. The X-axis, Y-axis, and Z-axis are all virtual axes, and the arrows indicating "X", "Y", and "Z" in the drawings are merely indicated for the purpose of explanation, and none of them have any substance. In addition, these directions are not intended to limit the directions when the mounting system 100 is used.

In addition, pipes for circulating cooling water, cables for supplying power, and pipes for supplying air pressure (including positive pressure and vacuum) are connected to the mounting system 100, but in this embodiment, these are omitted from the illustration as appropriate.

(2.2) Overall Configuration Next, the overall configuration of the mounting system 100 according to this embodiment will be described with reference to FIG.

As shown in FIG. 1, the mounting system 100 according to this embodiment includes a mounting head 1 and one or more imaging devices 2. In addition, in this embodiment, as shown in FIG. 3, the mounting system 100 further includes a driving device 3, a component supplying device 4, a conveying device 5, a backup device 6, a control device 7, and a lighting device 8 in addition to the mounting head 1 and the imaging device 2. However, the driving device 3, the component supplying device 4, the conveying device 5, the backup device 6, the control device 7, and the lighting device 8 are not essential components of the mounting system 100. In other words, at least one of the driving device 3, the component supplying device 4, the conveying device 5, the backup device 6, the control device 7, and the lighting device 8 may not be included as a component of the mounting system 100. In addition, in FIG. 1, only the mounting head 1, the imaging device 2, and the driving device 3 are illustrated, and the illustration of the other components of the mounting system 100 is omitted as appropriate.

The mounting head 1 has one or more capture portions 11. In this embodiment, the mounting head 1 has multiple (for example, 16) capture portions 11. With the capture portion 11 capturing the first object T1 (component), the mounting head 1 moves the capture portion 11 closer to the second object T2 (board), and mounts the first object T1 on the mounting surface T21 of the second object T2.

The imaging device 2 is fixed to the mounting head 1. In this embodiment, the mounting system 100 has multiple (for example, nine) imaging devices 2. The imaging device 2 has an imaging element 21 and an optical system 22. The imaging device 2 is, for example, a still camera that captures a still image. As described above, the imaging device 2 includes in its imaging field of view R10 (see Figure 2) a specific area R1 that faces the capture section 11 on the mounting surface T21 of the second object T2 (substrate).

The one or more imaging devices 2, together with the mounting head 1, constitute the head unit 10. That is, the head unit 10 according to this embodiment includes the mounting head 1 and the imaging device 2. In other words, the mounting system 100 according to this embodiment includes the head unit 10 including the mounting head 1 and the imaging device 2, a drive device 3, a component supply device 4, a transport device 5, a backup device 6, a control device 7, and a lighting device 8. Each of the mounting head 1 and imaging device 2 that constitute the head unit 10 will be described in detail in the sections "(2.3) Mounting Head" and "(2.4) Imaging Device".

The driving device 3 is a device that moves the mounting head 1. In this embodiment, the driving device 3 moves the mounting head 1 within the X-Y plane. The "X-Y plane" here is a plane that includes the X-axis and Y-axis and is perpendicular to the Z-axis. In other words, the driving device 3 moves the mounting head 1 in the X-axis and Y-axis directions.

In this embodiment, the imaging device 2 is fixed to the mounting head 1, and therefore the driving device 3 also moves the imaging device 2 together with the mounting head 1. In other words, the mounting head 1 is driven within the XY plane by the driving device 3 together with the imaging device 2 which, together with the mounting head 1, constitutes the head unit 10. In other words, the driving device 3 moves the head unit 10, which includes the mounting head 1 and the imaging device 2, within the XY plane.

Specifically, as shown in FIG. 1, the drive device 3 has an X-axis drive unit 31 and a Y-axis drive unit 32. The X-axis drive unit 31 moves the mounting head 1 linearly in the X-axis direction. The Y-axis drive unit 32 moves the mounting head 1 linearly in the Y-axis direction. The Y-axis drive unit 32 moves the mounting head 1 linearly in the Y-axis direction by moving the mounting head 1 together with the X-axis drive unit 31 along the Y-axis. In this embodiment, as an example, each of the X-axis drive unit 31 and the Y-axis drive unit 32 includes a linear motor, and moves the mounting head 1 (head unit 10) by a driving force generated by the linear motor when power is supplied.

The component supply device 4 supplies a component as a first object T1 to be captured by the capture unit 11 of the mounting head 1. As an example, the component supply device 4 has a tape feeder that supplies components stored on a carrier tape. Alternatively, the component supply device 4 may have a tray on which a plurality of components are placed. The mounting head 1 captures the first object T1 (component) from such a component supply device 4 with the capture unit 11.

The transport device 5 is a device that transports a substrate as the second object T2. The transport device 5 is realized, for example, by a belt conveyor. The transport device 5 transports the second object T2 (substrate), for example, along the X-axis. The transport device 5 transports the second object T2 at least below the mounting head 1, that is, to a mounting space that faces the capture unit 11 in the Z-axis direction. The transport device 5 then stops the second object T2 in the mounting space until the mounting head 1 has completed mounting the first object T1 (component) on the second object T2 (substrate).

The backup device 6 backs up the board as the second object T2 transported to the mounting space by the transport device 5. In other words, the second object T2 (board) transported to the mounting space by the transport device 5 is held in the mounting space by the backup device 6. The backup device 6 backs up the second object T2 in the mounting space at least until mounting of the first object T1 (component) on the second object T2 (board) by the mounting head 1 is completed.

The control device 7 controls each part of the mounting system 100. The control device 7 is mainly composed of a microcontroller having one or more processors and one or more memories. In other words, the functions of the control device 7 are realized by the processor of the microcontroller executing a program recorded in the memory of the microcontroller. The program may be pre-recorded in the memory, may be provided via a telecommunications line such as the Internet, or may be provided recorded on a non-transitory recording medium such as a memory card.

The control device 7 is electrically connected to, for example, each of the mounting head 1, the imaging device 2, the drive device 3, the component supply device 4, the transport device 5, the backup device 6 and the lighting device 8. The control device 7 outputs a control signal to the mounting head 1 and the drive device 3, and controls the mounting head 1 and the drive device 3 so as to mount at least the first object T1 captured by the capture unit 11 on the mounting surface T21 of the second object T2. The control device 7 also outputs a control signal to the imaging device 2 and the lighting device 8, and controls the imaging device 2 and the lighting device 8, and acquires images captured by the imaging device 2 from the imaging device 2.

The lighting device 8 illuminates the imaging field of view R10 of the imaging device 2. The lighting device 8 only needs to illuminate the imaging field of view R10 at least at the timing when the imaging device 2 captures an image, and for example, emits light in accordance with the imaging timing of the imaging device 2. In this embodiment, since the image captured by the imaging device 2 is a full-color still image, the lighting device 8 outputs light in the wavelength range of the visible light region, such as white light. In this embodiment, as an example, the lighting device 8 has multiple light sources such as LEDs (Light Emitting Diodes). The lighting device 8 illuminates the imaging field of view R10 of the imaging device 2 by emitting light from these multiple light sources. The lighting device 8 is realized by an appropriate lighting method, such as ring lighting or coaxial epi-illumination.

The lighting device 8 is fixed to the mounting head 1 together with the imaging device 2, for example. The lighting device 8, together with one or more imaging devices 2 and the mounting head 1, constitutes the head unit 10. In other words, the head unit 10 according to this embodiment includes the lighting device 8 in addition to the mounting head 1 and the imaging device 2.

In addition to the above configuration, the mounting system 100 also includes, for example, a communication unit. The communication unit is configured to communicate with a higher-level system directly or indirectly via a network or a repeater. This allows the mounting system 100 to transmit and receive data between the higher-level system.

(2.3) Mounting Head Next, a more detailed configuration of the mounting head 1 will be described with reference to FIGS. 1 to 4C.

In this embodiment, in addition to the capture unit 11, the mounting head 1 further has an actuator 12 (see FIG. 3) for moving the capture unit 11, and a head body 13 that holds the capture unit 11 and the actuator 12. In the mounting system 100 according to this embodiment, one head body 13 holds multiple (16, for example) capture units 11 and actuators 12. This allows the mounting head 1 to capture multiple (16, for example) first objects T1 (components) simultaneously.

The capture unit 11 is, for example, a suction nozzle. The capture unit 11 is controlled by the control device 7 and can be switched between a capture state in which the first object T1 is captured (held) and a release state in which the first object T1 is released (released from capture). However, the capture unit 11 is not limited to a suction nozzle, and may be configured to capture (hold) the first object T1 by pinching (picking) it like a robot hand, for example.

Regarding the capture of the first target T1 by the capture unit 11, the mounting head 1 operates by receiving air pressure (vacuum) as a power source. In other words, the mounting head 1 switches between the capture state and the release state of the capture unit 11 by opening and closing a valve on the air pressure (vacuum) supply path connected to the capture unit 11.

The actuator 12 moves the capture unit 11 linearly in the Z-axis direction. Furthermore, the actuator 12 rotates the capture unit 11 in a rotational direction (hereinafter referred to as the "θ direction") around an axis along the Z-axis direction. In this embodiment, as an example, the actuator 12 drives the capture unit 11 by a driving force generated by a linear motor when moving the capture unit 11 in the Z-axis direction. The actuator 12 drives the capture unit 11 by a driving force generated by a rotary motor when moving the capture unit 11 in the θ direction. On the other hand, as described above, the mounting head 1 moves linearly in the X-axis direction and the Y-axis direction by the driving device 3. As a result, the capture unit 11 included in the mounting head 1 can move in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction by the driving device 3 and the actuator 12.

Here, with respect to movement in the X-axis direction and the Y-axis direction, the multiple capture units 11 included in the mounting head 1 move as a unit. On the other hand, with respect to movement in the Z-axis direction and the θ direction, the multiple capture units 11 included in the mounting head 1 move individually. Furthermore, the multiple capture units 11 included in the mounting head 1 can each be switched individually between a captured state and a released state.

As an example, the head body 13 is made of metal and formed into a rectangular parallelepiped shape. A plurality of capture portions 11 and actuators 12 are assembled to the head body 13, whereby the head body 13 holds the capture portions 11 and the actuators 12. In this embodiment, the capture portions 11 are indirectly held by the head body 13 via the actuators 12 in a state in which they can move in the Z-axis direction and the θ direction. The mounting head 1 moves within the X-Y plane as the head body 13 is moved within the X-Y plane by the drive device 3. In Figure 4A, the head body 13 is shown by an imaginary line (two-dot chain line).

According to the above-mentioned configuration, the mounting head 1, while capturing the first object T1 (component) with the capturing unit 11, moves the capturing unit 11 so as to approach the second object T2 (board), and is able to mount the first object T1 on the mounting surface T21 of the second object T2. That is, the mounting head 1 moves the capturing unit 11 at least between a first position facing the mounting surface T21 of the second object T2 and a second position that is farther away from the mounting surface T21 than the first position. Here, in FIG. 2, the capturing unit 11 and the first object T1 when the capturing unit 11 is in the first position are shown by solid lines, and the capturing unit 11 and the first object T1 when the capturing unit 11 is in the second position are shown by imaginary lines (two-dot chain lines). In short, the mounting head 1 mounts the first target object T1 on the mounting surface T21 of the second target object T2 by moving the capture portion 11, which has captured the first target object T1, from the second position to the first position.

In this embodiment, the mounting head 1 has a plurality of capture portions 11 (for example, 16). These plurality of capture portions 11 are classified into a first capture portion group G1 and a second capture portion group G2, as shown in Figures 4A to 4C. The first capture portion group G1 and the second capture portion group G2 each consist of two or more capture portions 11 aligned along the X-axis direction (first direction). The first capture portion group G1 and the second capture portion group G2 face each other in the Y-axis direction (second direction) that is perpendicular to the X-axis direction (first direction) in a plan view.

Specifically, as shown in Figures 4A to 4C, the mounting head 1 has eight capture portions 11 constituting the first capture portion group G1 and eight capture portions 11 constituting the second capture portion group G2. The eight capture portions 11 constituting the first capture portion group G1 are arranged in a row along the X-axis. The eight capture portions 11 constituting the second capture portion group G2 are arranged in a row along the X-axis. The capture portions 11 constituting the first capture portion group G1 and the capture portions 11 constituting the second capture portion group G2 face each other in the Y-axis direction.

Here, the eight capture units 11 constituting the first capture unit group G1 and the eight capture units 11 constituting the second capture unit group G2 are all arranged at equal intervals in the X-axis direction. Furthermore, the eight capture units 11 constituting the first capture unit group G1 and the eight capture units 11 constituting the second capture unit group G2 are arranged to face each other at a predetermined interval in the Y-axis direction (second direction). In this embodiment, as an example, the interval between two adjacent capture units 11 in the Y-axis direction is wider than the interval between two adjacent capture units 11 in the X-axis direction.

(2.4) Imaging Device Next, a more detailed configuration of the imaging device 2 will be described with reference to FIGS.

2 and 3, the imaging device 2 has an imaging element 21 and an optical system 22. The optical system 22 forms an image Im1 (see FIG. 6B) of an imaging field of view R10 including a specific region R1 on the imaging element 21.

The image sensor 21 is, for example, an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor). The image sensor 21 converts the image formed on the light receiving surface into an electrical signal and outputs it.

The optical system 22 includes one or more lenses, mirrors, etc. In this embodiment, as an example, the optical system 22 is realized by a combination of multiple lenses (lens group). The optical system 22 forms an image of light from an imaging field of view R10 as shown in FIG. 2 on the light receiving surface of the image sensor 21. In this embodiment, the optical system 22 of the imaging device 2 is a non-telecentric optical system. That is, unlike a telecentric optical system in which the chief ray is parallel to the optical axis (imaging optical axis Ax1) throughout the optical system, in the imaging device 2, the chief ray is inclined with respect to the optical axis (imaging optical axis Ax1).

2, the imaging device 2 includes in its imaging field of view R10 a specific region R1 of the mounting surface T21 that faces the capture unit 11 in a direction perpendicular to the mounting surface T21 (the Z-axis direction). In other words, when the capture unit 11 is located on the mounting surface T21 of the second object T2, the imaging device 2 includes in its imaging field of view R10 the region directly below the capture unit 11 on the mounting surface T21 as the specific region R1. Therefore, the imaging device 2 is able to capture an image of the region directly below the capture unit 11.

Specifically, the imaging device 2 is fixed to the mounting head 1 by being held by the head body 13 of the mounting head 1. Here, the imaging device 2 is held by the head body 13 by being fixed to the underside of the head body 13, that is, the surface of the head body 13 facing the second object T2. Since the capture unit 11 is disposed on the underside of the head body 13, the imaging device 2 is disposed to the side of the capture unit 11 in a plan view.

Here, as described above, the imaging device 2 has an imaging optical axis Ax1 perpendicular to the mounting surface T21. That is, the imaging device 2 is fixed to the mounting head 1 in a position in which the imaging optical axis Ax1 is perpendicular to the mounting surface T21. As described above, "perpendicular" here includes not only a state in which the angle between the two is strictly 90 degrees, but also a state in which the two are approximately perpendicular within a certain range of error. Therefore, the angle between the imaging optical axis Ax1 of the imaging device 2 and the mounting surface T21 may be strictly 90 degrees, or may be within a certain range of error (for example, 10 degrees or less) from 90 degrees. In other words, the imaging optical axis Ax1 of the imaging device 2 may be an axis along the perpendicular line to the mounting surface T21.

In other words, the imaging optical axis Ax1 of the imaging device 2 is approximately parallel to the Z axis and directed directly below the imaging device 2. In this way, the imaging device 2 is disposed to the side of the capture unit 11 and is capable of capturing an image of the specific region R1 directly below the capture unit 11, even though the imaging optical axis Ax1 is directed directly below along the Z axis.

In addition, in this embodiment, a specific region R1 directly below two or more capture sections 11 is covered by one imaging device 2. That is, in this embodiment, the mounting head 1 has multiple (two or more) capture sections 11 as described above. The specific region R1 included in the imaging field of view R10 of one imaging device 2 is a region of the mounting surface T21 that faces multiple (two or more) capture sections 11 in a direction perpendicular to the mounting surface T21. In other words, the imaging field of view R10 of one imaging device 2 includes specific regions R1 directly below two or more capture sections 11, that is, multiple specific regions R1. Therefore, the mounting system 100 according to this embodiment is capable of imaging the region directly below two or more capture sections 11 with one imaging device 2.

Here, the imaging device 2 is located between two of the multiple capture units 11 in a plan view. In this disclosure, "located between" two parts means located between the two parts in the direction in which the two parts are lined up. In other words, C, which is located between A and B lined up in the X-axis direction, only needs to be between A and B in the X-axis direction, and does not necessarily need to be on a straight line connecting A and B. In other words, if C is located between the Y-Z plane that includes A and the Y-Z plane that includes B, which is perpendicular to the straight line connecting A and B (a straight line extending in the X-axis direction), then C will be located between A and B.

And, one imaging device 2 located between two capture sections 11 includes in its imaging field of view R10 the specific area R1 directly below these two capture sections 11. In other words, the imaging field of view R10 of one imaging device 2 includes at least the specific area R1 directly below the two capture sections 11 located on both sides of this imaging device 2. In this embodiment, as an example, the mounting head 1 has 16 capture sections 11, and one imaging device 2 covers the specific area R1 directly below two or four of these capture sections 11. In other words, one imaging device 2 includes two or four specific areas R1 in its imaging field of view R10.

More specifically, as described above, the mounting system 100 according to this embodiment has a plurality of (for example, nine) imaging devices 2. These imaging devices 2 enable the specific region R1 to be included in the imaging field of view R10 for all of the plurality of (here, 16) capture sections 11.

That is, multiple (here, nine) imaging devices 2 are arranged in a row along the X-axis direction (first direction) as shown in Figures 4A to 4C. Meanwhile, the mounting head 1 has a first capture portion group G1 and a second capture portion group G2, each consisting of eight capture portions 11 arranged along the X-axis direction (first direction), as described above. The nine imaging devices 2 are arranged between the first capture portion group G1 and the second capture portion group G2, which are divided into two rows.

Here, the nine imaging devices 2 are arranged at equal intervals in the X-axis direction. Furthermore, in the Y-axis direction (second direction), each imaging device 2 is located in the middle (intermediate) between the eight capture units 11 that make up the first capture unit group G1 and the eight capture units 11 that make up the second capture unit group G2. Furthermore, of the nine imaging devices 2, seven imaging devices 2, excluding the two imaging devices 2 at both ends in the X-axis direction, are all arranged at equal distances from the four capture units 11.

According to this arrangement, of the nine imaging devices 2, seven imaging devices 2, excluding the two imaging devices 2 at both ends in the X-axis direction, each have four capture sections 11 located around them. Therefore, for these seven imaging devices 2, the imaging field of view R10 includes a specific region R1 directly below the four surrounding capture sections 11. In other words, the imaging field of view R10 of each of these seven imaging devices 2 includes at least the specific region R1 directly below the four capture sections 11 located around each imaging device 2. In other words, each of these seven imaging devices 2 includes four specific regions R1 in its imaging field of view R10.

Furthermore, of the nine imaging devices 2, the two imaging devices 2 at both ends in the X-axis direction each have two capture sections 11 located around them. Therefore, for these two imaging devices 2, the imaging field of view R10 includes a specific region R1 directly below the two surrounding capture sections 11. In other words, the imaging field of view R10 of each of these two imaging devices 2 includes at least the specific region R1 directly below the two capture sections 11 located around each of these imaging devices 2. In other words, these two imaging devices 2 (at both ends in the X-axis direction) each include two specific regions R1 in their imaging field of view R10.

In the mounting system 100 according to the present embodiment, when the imaging field of view R10 is divided into a central portion R101 and a peripheral portion R102 as shown in FIG. 5, the imaging device 2 has a higher resolution in the peripheral portion R102 than in the central portion R101 of the imaging field of view R10. FIG. 5 is an explanatory diagram that shows the imaging field of view R10 of the imaging device 2 in a plan view. In the example of FIG. 5, the central portion R101 is a circular area located in the center of the imaging field of view R10 of each imaging device 2, and the peripheral portion R102 is an annular area surrounding the central portion R101. In other words, the area along the outer periphery of the imaging field of view R10 in a plan view is the peripheral portion R102, and the area surrounded by the peripheral portion R102 is the central portion R101. In FIG. 5, the shaded (dot hatched) area represents the peripheral portion R102.

In this disclosure, "resolution" refers to the overall performance of the image sensor 21 and the optical system 22. One example of an index representing the performance of the optical system 22 is the modulation transfer function (MTF) characteristic, which simultaneously represents both the resolution and contrast information of the optical system 22 (lens). In this embodiment, the peripheral portion R102 of the imaging field R10 has a higher resolution than the central portion R101, so the peripheral portion R102 has higher (better) MTF characteristics than the central portion R101. Therefore, the imaging device 2 can capture the subject included in the peripheral portion R102 with higher resolution than the subject included in the central portion R101 of the imaging field R10.

Here, in this embodiment, as described above, the imaging device 2 is disposed to the side of the capture section 11, and even though the imaging optical axis Ax1 is directed directly downward along the Z axis, it is capable of imaging the specific region R1 directly below the capture section 11. That is, the imaging device 2 captures the specific region R1 not in the central portion R101 of the imaging field of view R10 but in the peripheral portion R102 of the imaging field of view R10, thereby enabling imaging of the specific region R1 directly below the capture section 11. In other words, when the imaging field of view R10 of the imaging device 2 is divided into the central portion R101 and the peripheral portion R102, the specific region R1 is included in the peripheral portion R102 of the imaging field of view R10 of the imaging device 2.

The peripheral portion R102 including the specific region R1 has a higher resolution than the central portion R101 of the imaging field of view R10. Therefore, the imaging device 2 can obtain an image of the specific region R1 with a relatively high resolution (compared to the central portion R101) while capturing the specific region R1 in the peripheral portion R102 of the imaging field of view R10.

Furthermore, the configuration in which the imaging device 2 has a higher resolution in the peripheral portion R102 than in the central portion R101 of the imaging field of view R10 can be adopted separately from the configuration in which the imaging optical axis Ax1 of the imaging device 2 is perpendicular to the mounting surface T21. That is, the mounting system 100 includes a mounting head 1 and an imaging device 2. The mounting head 1 has a capture unit 11. The mounting head 1 moves the capture unit 11 so as to approach the second object T2 while capturing the first object T1 with the capture unit 11, and mounts the first object T1 on the mounting surface T21 of the second object T2. The imaging device 2 is fixed to the mounting head 1. The imaging device 2 includes in the imaging field of view R10 a specific region R1 of the mounting surface T21 that faces the capture unit 11 in a direction perpendicular to the mounting surface T21. Here, when the imaging field of view R10 is divided into a central portion R101 and a peripheral portion R102, the imaging device 2 has a higher resolution in the peripheral portion R102 than in the central portion R101 of the imaging field of view R10. In this case, it is not essential that the imaging optical axis Ax1 of the imaging device 2 is perpendicular to the mounting surface T21, and the imaging optical axis Ax1 of the imaging device 2 may be inclined with respect to the perpendicular to the mounting surface T21.

5, the mounting system 100 according to this embodiment realizes a stereo camera by using two of the multiple (here, nine) imaging devices 2 as the first imaging device 201 and the second imaging device 202. That is, in this embodiment, of the nine imaging devices 2, two imaging devices 2 (the first imaging device 201 and the second imaging device 202) adjacent in the X-axis direction can be used to obtain distance information to a subject using a stereo camera method.

In short, the mounting system 100 according to this embodiment further includes, in addition to the first imaging device 201 as the imaging device 2, a second imaging device 202 that is fixed to the mounting head 1 and includes a specific region R1 in its imaging field of view R10. The second imaging field of view R200, which is the imaging field of view R10 of the second imaging device 202, includes a different region from the first imaging field of view R100, which is the imaging field of view R10 of the first imaging device 201. The specific region R1 is included in the region where the first imaging field of view R100 and the second imaging field of view R200 overlap.

As a result, the specific region R1 directly below the capture unit 11 is included in both the imaging field of view R10 (first imaging field of view R100) of the first imaging device 201 and the imaging field of view R10 (second imaging field of view R200) of the second imaging device 202. Therefore, stereo images of the specific region R1 can be obtained from the outputs of both the first imaging device 201 and the second imaging device 202. Therefore, the mounting system 100 can obtain distance information representing the distance from the mounting head 1 for the subject in the specific region R1 by using a stereo camera method. As a result, the mounting system 100 is able to capture the subject in the specific region R1 in three dimensions.

Here, in this embodiment, all nine imaging devices 2 have a common configuration. Therefore, the first imaging device 201 may be any imaging device 2 among the nine imaging devices 2, and the second imaging device 202 may be an imaging device 2 adjacent to the first imaging device 201. For example, both the first imaging device 201 and the second imaging device 202 have an imaging optical axis Ax1 perpendicular to the mounting surface T21. Also, both the first imaging device 201 and the second imaging device 202 have a higher resolution in the peripheral portion R102 than in the central portion R101 of the imaging field of view R10 when the imaging field of view is divided into a central portion R101 and a peripheral portion R102.

In particular, in this embodiment, the capture unit 11 is located between the first imaging device 201 and the second imaging device 202 in a planar view. More specifically, the capture unit 11 located between the first imaging device 201 and the second imaging device 202 is located in the middle (middle) between the first imaging device 201 and the second imaging device 202 in the X-axis direction. As a result, as shown in FIG. 5, the overlapping portion between the peripheral portion R102 of the imaging field R10 (first imaging field R100) of the first imaging device 201 and the peripheral portion R102 of the imaging field R10 (second imaging field R200) of the second imaging device 202 can be aligned with the specific region R1. Therefore, according to the first imaging device 201 and the second imaging device 202, it is possible to capture the subject in the specific region R1 three-dimensionally and with a relatively high resolution (compared to the central portion R101).

In addition, in this embodiment, as described above, the mounting head 1 has eight capture units 11 constituting the first capture unit group G1 and eight capture units 11 constituting the second capture unit group G2. Here, the first imaging device 201 and the second imaging device 202 are located between the first capture unit group G1 and the second capture unit group G2 in a planar view, as shown in FIG. 4A. In short, in this embodiment, nine imaging devices 2 including two imaging devices 2 that can be the first imaging device 201 and the second imaging device 202 are arranged between the first capture unit group G1 and the second capture unit group G2. Therefore, the first imaging device 201 and the second imaging device 202 are located between the first capture unit group G1 and the second capture unit group G2 in a planar view.

(3) Imaging Method Next, an imaging method according to this embodiment will be described with reference to FIGS. 6A, 6B, and 7. FIG.

The imaging method according to this embodiment is an imaging method used in a mounting system 100 including a mounting head 1. The mounting head 1 has a capture unit 11. With the capture unit 11 capturing a first object T1, the mounting head 1 moves the capture unit 11 closer to the second object T2, and mounts the first object T1 on the mounting surface T21 of the second object T2. The imaging method includes a step of imaging a specific region R1 with an imaging device 2. The imaging device 2 is fixed to the mounting head 1. The imaging device 2 includes in its imaging field of view R10 a specific region R1 of the mounting surface T21 that faces the capture unit 11 in a direction perpendicular to the mounting surface T21, and has an imaging optical axis Ax1 perpendicular to the mounting surface T21.

That is, the imaging method according to this embodiment is a method of imaging a specific region R1 using the mounting system 100 according to this embodiment. In this imaging method, the specific region R1 is imaged by an imaging device 2 whose imaging field of view R10 includes the specific region R1 of the mounting surface T21 that faces the capture section 11 in a direction perpendicular to the mounting surface T21. Therefore, it is possible to image at least the region of the mounting surface T21 directly below the capture section 11. Moreover, since the imaging optical axis Ax1 of the imaging device 2 is perpendicular to the mounting surface T21, it is possible to position the imaging device 2 in an orientation perpendicular to the mounting surface T21.

In this imaging method, rather than directing the imaging optical axis Ax1 of the imaging device 2 toward the specific region R1, the imaging optical axis Ax1 of the imaging device 2 is deliberately directed outside the specific region R1 so that the specific region R1 is reflected at the edge of the imaging field of view R10 of the imaging device 2. This makes it possible to make the imaging optical axis Ax1 of the imaging device 2 perpendicular to the mounting surface T21. This has the advantage that, for example, the area occupied by the imaging device 2 in a plane parallel to the mounting surface T21 can be kept relatively small, and the movement range of the mounting head 1 by the imaging device 2 is less likely to be restricted. Therefore, it is possible to provide an imaging method that is more suitable for imaging the specific region R1.

According to the imaging method described above, for example, as shown in FIG. 6A, when the first object T1 (component) is mounted in a specific region R1 directly below the capture section 11 on the mounting surface T21 of the second object T2 (substrate), the first object T1 can be imaged by the imaging device 2. That is, in the state shown in FIG. 6A, an image Im1 is obtained in which the first object T1 is reflected in the specific region R1, as shown in FIG. 6B, by any one of the imaging devices 2. The image Im1 shown in FIG. 6B is an image obtained by an imaging device 2 that includes the four specific regions R1 in its imaging field of view R10, that is, one of the seven imaging devices 2 excluding the two imaging devices 2 at both ends in the X-axis direction.

In this way, according to the imaging method of this embodiment, the first object T1 in the specific region R1 directly below the capture unit 11 can be imaged by the imaging device 2. Here, the imaging device 2 captures the specific region R1 not in the central portion R101 of the imaging field of view R10 but in the peripheral portion R102 of the imaging field of view R10, so that the first object T1 is reflected in the peripheral region (here, the four corners) of the image Im1 as shown in FIG. 6B. In this embodiment, the peripheral portion R102 has a higher resolution than the central portion R101 of the imaging field of view R10, so that the first object T1 in the specific region R1 can be imaged with a relatively high resolution (compared to the central portion R101). In addition, in this imaging method, the first object T1 in the specific region R1 can be captured three-dimensionally by the stereo camera method using the first imaging device 201 and the second imaging device 202.

Figure 7 is a flowchart showing the overall operation of the mounting system 100, including the imaging method of this embodiment.

First, the mounting system 100 executes the capture process S1. In the capture process S1, the mounting system 100 moves (lowers) the capture unit 11 located above the first object T1 (component) supplied from the component supply device 4 in a direction approaching the component supply device 4 (first object T1), and captures the first object T1 with the capture unit 11. Then, the mounting system 100 moves (raises) the capture unit 11 in a state in which the first object T1 has been captured in a direction away from the component supply device 4 (first object T1). In this embodiment, since the mounting head 1 includes multiple capture units 11, in the capture process S1, the mounting system 100 drives each of the multiple capture units 11 to capture the first object T1 with each of the multiple capture units 11. After capturing the first target object T1, the mounting system 100 drives the mounting head 1 with the drive device 3, and moves the capturing unit 11, which has captured the first target object T1, onto the second target object T2.

Next, the mounting system 100 performs the imaging method according to the present embodiment (S2). That is, the mounting system 100 images the specific region R1 directly below the capture unit 11 with the imaging device 2 while the capture unit 11 is positioned on the second object T2 (S2).

When the specific region R1 is captured by the imaging device 2, the imaging device 2 outputs the obtained image Im1 to the control device 7 (S3). The control device 7 may simply record the image Im1 obtained from the imaging device 2, or may analyze the image Im1 in real time.

In the mounting process S4, the mounting system 100 moves (lowers) the capture unit 11 located above the second object T2 in a direction approaching the second object T2, and mounts the first object T1 on the mounting surface T21 of the second object T2. In other words, when the first object T1 reaches the mounting surface T21 of the second object T2, the mounting system 100 releases the first object T1 by releasing the capture by the capture unit 11. Then, the mounting system 100 moves (raises) the capture unit 11 that has released the first object T1 in a direction away from the second object T2. In this embodiment, since the mounting head 1 includes multiple capture units 11, in the mounting process S4, the mounting system 100 drives each of the multiple capture units 11 to mount the first object T1 with each of the multiple capture units 11.

From the image Im1 obtained by the above-mentioned imaging method (S2), it is possible to confirm, for example, the state of the mounting surface T21 before mounting of the first object T1, such as the state of application of the cream solder, the presence or absence of foreign matter or deformation, etc. In particular, in this embodiment, since it is possible to image the specific region R1 directly below the capture portion 11, it is easy to confirm the mounting surface T21 immediately before mounting of the first object T1.

The flowchart in FIG. 7 is merely an example of the overall operation of the mounting system 100, and processes may be omitted or added as appropriate, and the order of processes may be changed as appropriate. For example, after the mounting process S4, by imaging a specific area R1 directly below the capture unit 11 with the imaging device 2, it is possible to check the state of the mounting surface T21 after the mounting of the first object T1, for example, whether the mounting of the first object T1 is normal/abnormal, the orientation of the first object T1, or whether there is a missing part. In particular, in this embodiment, since it is possible to image the specific area R1 directly below the capture unit 11, it is easier to check the mounting surface T21 immediately after the mounting of the first object T1.

Furthermore, during the mounting process S4, if the imaging device 2 captures an image of the specific area R1 directly below the capture unit 11, it is possible to check the state of the mounting surface T21 during mounting of the first object T1, for example, the capture state of the first object T1 by the capture unit 11. In particular, in this embodiment, since the imaging device 2 can capture an image of the specific area R1 directly below the capture unit 11, it is easy to check the mounting surface T21 even during mounting of the first object T1.

(4) Modifications The first embodiment is merely one of various embodiments of the present disclosure. Various modifications of the first embodiment are possible depending on the design and the like, as long as the object of the present disclosure can be achieved. In addition, all drawings referred to in this disclosure are schematic diagrams, and the ratios of the sizes and thicknesses of the components in the drawings do not necessarily reflect the actual dimensional ratios. In addition, a function similar to the imaging method according to the first embodiment may be embodied in a mounting system 100, a (computer) program, or a non-transitory recording medium on which a program is recorded. The program according to one aspect is a program for causing one or more processors to execute the imaging method according to the first embodiment.

Below, we list some variations of the first embodiment. The variations described below can be combined as appropriate.

The mounting system 100 in the present disclosure includes a computer system in, for example, the control device 7. The computer system is mainly composed of a processor and a memory as hardware. The processor executes a program recorded in the memory of the computer system to realize the function of the mounting system 100 in the present disclosure. The program may be pre-recorded in the memory of the computer system, provided through an electric communication line, or recorded and provided in a non-transitory recording medium such as a memory card, an optical disk, or a hard disk drive that can be read by the computer system. The processor of the computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large-scale integrated circuit (LSI). The integrated circuits such as IC or LSI referred to here are called differently depending on the degree of integration, and include integrated circuits called system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration). Furthermore, a field-programmable gate array (FPGA) that is programmed after the manufacture of the LSI, or a logic device that can reconfigure the connection relationship inside the LSI or reconfigure the circuit partition inside the LSI, can also be adopted as a processor. The electronic circuits may be integrated in one chip or distributed among multiple chips. The chips may be integrated in one device or distributed among multiple devices. The computer system referred to here includes a microcontroller having one or more processors and one or more memories. Thus, the microcontroller is also composed of one or more electronic circuits including a semiconductor integrated circuit or a large-scale integrated circuit.

In addition, it is not essential for mounting system 100 that multiple functions are concentrated in one housing. The components of mounting system 100 may be distributed across multiple housings. Furthermore, at least some of the functions of mounting system 100 may be realized by the cloud (cloud computing) or the like.

Conversely, in embodiment 1, at least some of the functions of the mounting system 100 that are distributed among multiple devices may be consolidated within a single housing. For example, some of the functions that are distributed among the mounting head 1 and the control device 7 may all be consolidated into the mounting head 1.

In addition, the use of the mounting system 100 is not limited to the manufacture of electronic devices in a factory. For example, when the mounting system 100 is used to mount a mechanical component on a glass plate, the mounting system 100 performs the task of mounting the mechanical component, which is the first object T1, on the glass plate, which is the second object T2.

Furthermore, the number of capture units 11 and the number of imaging devices 2 provided in the head unit 10 are not limited to the numbers described in embodiment 1. For example, the number of capture units 11 may be 15 or less or 17 or more, and the number of imaging devices 2 may be 8 or less or 10 or more. Of course, the head unit 10 may be provided with only one capture unit 11 or only one imaging device 2. Furthermore, the arrangement of the capture units 11 and imaging devices 2 is not limited to the arrangement described in embodiment 1 and can be changed as appropriate.

Furthermore, the imaging device 2 is not limited to a still camera capable of capturing full-color still images, but may be, for example, a camera capable of capturing monochrome images, a camera capable of capturing moving images, a line sensor, etc.

Furthermore, the peripheral portion R102 of the imaging field of view R10 is not limited to a perfect circular ring shape, but may be a ring shape including an ellipse, triangle, polygon, or free curve.

(Embodiment 2)
8A and 8B, the mounting system 100A according to this embodiment differs from the mounting system 100 according to the first embodiment in that, in addition to the first specific region R1, which is the specific region R1, a second specific region R2 is included in the imaging field of view R10 of the imaging device 2. Hereinafter, the same components as those in the first embodiment will be denoted by the same reference numerals and descriptions thereof will be omitted as appropriate.

The mounting system 100A includes a mounting head 1 and an imaging device 2. The mounting head 1 has a capture unit 11 that captures a first object T1. The mounting head 1 moves the capture unit 11 between a first position and a second position to mount the first object T1 on the mounting surface T21. The first position is a position facing the mounting surface T21 of the second object T2. The second position is a position farther away from the mounting surface T21 than the first position. The imaging device 2 includes a first specific region R1 and a second specific region R2 in the imaging field of view R10. The first specific region R1 is a region of the mounting surface T21 that faces the capture unit 11 at the first position in a direction (Z-axis direction) perpendicular to the mounting surface T21. The second specific region R2 is a region that includes the side of the capture unit 11 at the second position.

8A, the capture unit 11 and the first object T1 when the capture unit 11 is in the first position are shown by solid lines, and the capture unit 11 and the first object T1 when the capture unit 11 is in the second position are shown by imaginary lines (two-dot chain lines). In short, the mounting head 1 moves the capture unit 11, which has captured the first object T1, from the second position to the first position, thereby mounting the first object T1 on the mounting surface T21 of the second object T2. The first specific region R1 is a region that is directly below the capture unit 11 on the mounting surface T21 when the capture unit 11 is in the first position. The second specific region R2 is a region that includes the side of the capture unit 11 when the capture unit 11 is in the second position, that is, a region when the capture unit 11 is viewed from the side. In this embodiment, the first position is the bottom dead center of the capture unit 11, and the second position is the top dead center of the capture unit 11. However, in this disclosure, "bottom dead center" does not refer to the lowest position in the range of motion of the capture portion 11, but to the lowest position of the capture portion 11 when the first object T1 is mounted on the mounting surface T21 of the second object T2.

According to the above configuration, the imaging device 2 includes in the imaging field of view R10 the first specific region R1 of the mounting surface T21 that faces the capture unit 11 in a direction perpendicular to the mounting surface T21, so that at least the region directly below the capture unit 11 of the mounting surface T21 can be imaged. Moreover, in addition to the first specific region R1, the imaging field of view R10 of the imaging device 2 also includes the second specific region R2 including the side of the capture unit 11 at the second position, so that, for example, the capture state of the first object T1 by the capture unit 11 can be confirmed. Therefore, while being able to confirm the state of the mounting surface T21 and the state of the capture unit 11 before or after mounting, there is an advantage that the area occupied by the imaging device 2 in a plane parallel to the mounting surface T21 is kept relatively small, and the movement range of the mounting head 1 by the imaging device 2 is not easily restricted. Therefore, a mounting system 100A that is more suitable for imaging the mounting state can be provided.

In this embodiment, one or more imaging devices 2 together with the mounting head 1 constitute a head unit 10A. That is, the head unit 10A according to this embodiment includes the mounting head 1 and the imaging device 2. In other words, the mounting system 100A according to this embodiment includes the head unit 10A including the mounting head 1 and the imaging device 2, a drive device 3, a component supply device 4, a conveying device 5, a backup device 6, a control device 7, and a lighting device 8.

Here, in this embodiment, the imaging field of view R10 of the imaging device 2 simultaneously includes the first specific region R1 and the second specific region R2. That is, in the imaging device 2, when the imaging field of view R10 includes the first specific region R1, the second specific region R2 is also included in the imaging field of view R10. Therefore, the imaging device 2 is able to simultaneously image the first specific region R1 and the second specific region R2, rather than imaging them separately.

8A, the imaging device 2 has an imaging element 21 and an optical system 22. The optical system 22 forms an image of an imaging field R10 including a first specific region R1 and a second specific region R2 on the imaging element 21. In short, the optical system 22 forms a first optical path that forms an image of light from the first specific region R1 on the light receiving surface of the imaging element 21, and a second optical path that forms an image of light from the second specific region R2 on the light receiving surface of the imaging element 21. Moreover, in this embodiment, the imaging field R10 of the imaging device 2 simultaneously includes the first specific region R1 and the second specific region R2, so that the first optical path and the second optical path are formed simultaneously.

In particular, as shown in Fig. 8B, the optical system 22 includes a lens group 221 and a prism 222. The lens group 221 and the prism 222 are arranged below the image sensor 21 along the Z-axis direction such that the lens group 221 faces the image sensor 21 (upper side).

The prism 222 has a reflecting surface, and reflects the light L1 incident on the imaging device 2 from the side (i.e., the direction intersecting the Z axis) toward the lens group 221 at the reflecting surface. On the other hand, the light L2 incident on the imaging device 2 from diagonally below (i.e., from below and inclined with respect to the Z axis) enters the lens group 221 through the side of the prism 222. The lens group 221 forms an image of the light L1 that has passed through the prism 222 and the light L2 that has passed through the side of the prism 222 on the light receiving surface of the imaging element 21. Here, the light L1 reflected by the prism 222 is the light that enters from the second specific region R2, and the light L2 that passes through the side of the prism 222 is the light that enters from the first specific region R1. With such an optical system 22, light from both the first specific region R1 and the second specific region R2 enters the imaging element 21. As a result, the optical system 22 forms an image of an imaging field of view R10 including the first specific region R1 and the second specific region R2 on the imaging element 21.

8A, the first specific region R1 and the second specific region R2 are separate regions that can be separated. In other words, there is no overlapping area between the first specific region R1 and the second specific region R2, and the first specific region R1 and the second specific region R2 can be completely separated. More precisely, the lower end position of the second specific region R2 is located above the upper end position of the first specific region R1.

The first specific region R1 in this embodiment corresponds to the specific region R1 in embodiment 1, so the configuration of the specific region R1 described in embodiment 1 also applies to the first specific region R1. Points similar to the specific region R1 described in embodiment 1 will be described below with reference to FIG. 9. FIG. 9 is an explanatory diagram that shows a schematic representation of the imaging field of view R10 of the imaging device 2 in a planar view. FIG. 9 shows only the imaging field of view R10 of some (three in this case) of the nine imaging devices 2, but the imaging field of view R10 of the other imaging devices 2 is similar. In FIG. 9, the head body 13 is shown by an imaginary line (two-dot chain line).

9, the mounting system 100A according to this embodiment realizes a stereo camera by using two of the multiple (here, nine) imaging devices 2 as the first imaging device 201 and the second imaging device 202. That is, in this embodiment, of the nine imaging devices 2, two imaging devices 2 (the first imaging device 201 and the second imaging device 202) adjacent in the X-axis direction can be used to obtain distance information to a subject using a stereo camera method.

In short, the mounting system 100A according to this embodiment further includes, in addition to the first imaging device 201 as the imaging device 2, a second imaging device 202 that is fixed to the mounting head 1 and includes a first specific region R1 in an imaging field of view R10. The second imaging field of view R200, which is the imaging field of view R10 of the second imaging device 202, includes a different region from the first imaging field of view R100, which is the imaging field of view R10 of the first imaging device 201. The first specific region R1 is included in the region where the first imaging field of view R100 and the second imaging field of view R200 overlap.

As a result, the first specific region R1 directly below the capture unit 11 is included in both the imaging field of view R10 (first imaging field of view R100) of the first imaging device 201 and the imaging field of view R10 (second imaging field of view R200) of the second imaging device 202. Therefore, a stereo image of the first specific region R1 can be obtained from the output of both the first imaging device 201 and the second imaging device 202. Therefore, the mounting system 100A can obtain distance information representing the distance from the mounting head 1 for the subject in the first specific region R1 by the stereo camera method. As a result, the mounting system 100A is able to capture the subject in the first specific region R1 in three dimensions.

Here, in this embodiment, all nine imaging devices 2 have a common configuration. Therefore, the first imaging device 201 may be any imaging device 2 among the nine imaging devices 2, and the second imaging device 202 may be an imaging device 2 adjacent to the first imaging device 201. For example, in both the first imaging device 201 and the second imaging device 202, in addition to the first specific region R1, the imaging field of view R10 of the imaging device 2 includes the second specific region R2.

In addition, in this embodiment, the first specific region R1 directly below two or more capture sections 11 is covered by one imaging device 2. That is, in this embodiment, the mounting head 1 has multiple (two or more) capture sections 11. The first specific region R1 included in the imaging field of view R10 of one imaging device 2 is a region facing multiple (two or more) capture sections 11 that are at a first position on the mounting surface T21 in a direction perpendicular to the mounting surface T21. In other words, the imaging field of view R10 of one imaging device 2 includes the first specific region R1 directly below two or more capture sections 11, that is, multiple first specific regions R1. Therefore, the mounting system 100 according to this embodiment is capable of imaging the region directly below two or more capture sections 11 with one imaging device 2.

However, the number of capture parts 11 covered by one imaging device 2 differs between the first specific region R1 directly below the capture part 11 and the second specific region R2 in which the capture part 11 is captured from the side (seen from the side). In other words, among the multiple capture parts 11, the number of capture parts 11 corresponding to the first specific region R1 in the imaging field of view R10 of one imaging device 2 is greater than the number of capture parts 11 corresponding to the second specific region R2. Here, the number of capture parts 11 corresponding to the first specific region R1 means the number of capture parts 11 that have the first specific region R1 directly below, that is, the number of capture parts 11 directly above the first specific region R1. The number of capture parts 11 corresponding to the second specific region R2 means the number of capture parts 11 whose side is included in the second specific region R2.

Specifically, as shown in Figure 9, the imaging field of view R10 of the imaging device 2 includes a central portion R101, a peripheral portion R102, and a lateral portion R103. The lateral portion R103 is an area extending in both directions (directions perpendicular to the Z axis) from the imaging device 2, and faces the second specific region R2. In other words, the second specific region R2 is included in the lateral portion R103 of the imaging field of view R10. In Figure 9, the shaded (dot-hatched) area represents the peripheral portion R102 and the lateral portion R103.

9, in the imaging field of view R10 of one imaging device 2, the first specific region R1 included in the peripheral portion R102 corresponds to four capture units 11, whereas the second specific region R2 included in the lateral portion R103 corresponds to two capture units 11. Specifically, the first specific region R1 corresponds to four capture units 11 located in the annular peripheral portion R102 centered on the imaging device 2. On the other hand, the second specific region R2 corresponds to two capture units 11 located diagonally in the XY plane as viewed from the imaging device 2. By adopting such a configuration, the shape of the prism 222 can be made relatively simple. Moreover, with multiple (here, nine) imaging devices 2, it is possible to include the second specific region R2 in the imaging field of view R10 for all of the multiple (here, 16) capture units 11.

However, in this configuration, a stereo image is obtained only for the first specific region R1 of the first specific region R1 and the second specific region R2. In other words, for the second specific region R2, a stereo image cannot be obtained because it is not included in the overlapping region of the imaging field R10 (first imaging field R100) of the first imaging device 201 and the imaging field R10 (second imaging field R200) of the second imaging device 202. As a result, the mounting system 100A is capable of capturing the subject three-dimensionally only for the first specific region R1 of the first specific region R1 and the second specific region R2.

Next, the imaging method related to this embodiment will be described with reference to Figures 10A and 10B.

The imaging method according to this embodiment is an imaging method used in a mounting system 100 including a mounting head 1. The mounting head 1 has a capture unit 11 that captures a first object T1. The mounting head 1 moves the capture unit 11 between a first position facing the mounting surface T21 of the second object T2 and a second position that is farther away from the mounting surface T21 than the first position, and mounts the first object T1 on the mounting surface T21. The imaging method includes a step of imaging a first specific region R1 and a second specific region R2 with an imaging device 2. The imaging device 2 is fixed to the mounting head 1. The imaging device 2 includes in its imaging field of view R10 a first specific region R1 facing the capture unit 11 at the first position in a direction perpendicular to the mounting surface T21 of the mounting surface T21, and a second specific region R2 including a side surface of the capture unit 11 at the second position.

That is, the imaging method according to this embodiment is a method of imaging a first specific region R1 and a second specific region R2 using the mounting system 100A according to this embodiment. In this imaging method, the first specific region R1 is imaged by an imaging device 2 that includes in its imaging field of view R10 the first specific region R1 that faces the capture portion 11 at a first position on the mounting surface T21 in a direction perpendicular to the mounting surface T21. Therefore, it is possible to image at least the region directly below the capture portion 11 on the mounting surface T21.

Moreover, in addition to the first specific region R1, the second specific region R2 including the side of the capture unit 11 at the second position is also included in the imaging field of view R10 of the imaging device 2, so that, for example, it is possible to confirm the capture state of the first object T1 by the capture unit 11. Therefore, while it is possible to confirm the state of the mounting surface T21 and the state of the capture unit 11 before and after mounting, there are advantages such as keeping the area occupied by the imaging device 2 in a plane parallel to the mounting surface T21 relatively small, and being less likely to be restricted by the movement range of the mounting head 1 by the imaging device 2. Therefore, it is possible to provide an imaging method that is more suitable for imaging the mounting state.

According to the imaging method described above, for example, as shown in FIG. 10A, when the first object T1 (component) is mounted in the first specific region R1 directly below the capture section 11 on the mounting surface T21 of the second object T2 (substrate), the first object T1 can be imaged by the imaging device 2. That is, in the state of FIG. 10A, in any one of the imaging devices 2, an image Im1 in which the first object T1 is reflected in the first specific region R1 is obtained as shown in FIG. 10B. Furthermore, in the state of FIG. 10A, in any one of the imaging devices 2, an image Im1 in which the capture section 11 is reflected in the second specific region R2 is obtained as shown in FIG. 10B. The image Im1 shown in FIG. 10B is an image obtained by an imaging device 2 that includes the four first specific regions R1 in the imaging field of view R10, that is, one of the seven imaging devices 2 excluding the two imaging devices 2 at both ends in the X-axis direction.

In this way, according to the imaging method of this embodiment, the first object T1 in the first specific region R1 directly below the capture unit 11 in the first position can be imaged by the imaging device 2. Furthermore, the second object region R2 including the side of the capture unit 11 in the second position can be imaged by the imaging device 2. Here, the imaging device 2 captures the first specific region R1 in the peripheral region R102 of the imaging field of view R10, not in the central portion R101 of the imaging field of view R10, so that the first object T1 is reflected in the peripheral region R12 (here, the four corners) of the image Im1 as shown in FIG. 10B. On the other hand, the imaging device 2 captures the second specific region R2 in the central portion R101 of the imaging field of view R10, so that the capture unit 11 in the second specific region R2 (in the second position) is reflected in the central region R11 of the image Im1 as shown in FIG. 10B. In the example of Fig. 10B, the central region R11 is a rectangular region located in the center of the image Im1, and the peripheral region R12 is a rectangular frame-shaped region surrounding the central region R11. In other words, in the image Im1, the region along the outer periphery is the peripheral region R12, and the region surrounded by the peripheral region R12 is the central region R11. In Fig. 10B, the hatched region represents the central region R11.

That is, when the image Im1 formed on the image sensor 21 is divided into a central region R11 and a peripheral region R12, the first specific region R1 is included in the peripheral region R12 of the image Im1, and the second specific region R2 is included in the central region R11 of the image Im1. Such a configuration is realized by designing the optical system 22. That is, as shown in FIG. 8B, the optical system 22 is designed so that the light L1 from the second specific region R2 is imaged at the center of the light receiving surface of the image sensor 21, and the second specific region R2 is included in the central region R11 of the image Im1.

In this embodiment, the peripheral area R102 of the imaging field of view R10 has a higher resolution than the central area R101, so the first object T1 in the first specific area R1 can be imaged at a relatively higher resolution (compared to the central area R101). In other words, the imaging device 2 has a higher resolution in the peripheral area R12 of the image Im1 than in the central area R11. In addition, in this imaging method, the first imaging device 201 and the second imaging device 202 can capture the first object T1 in the first specific area R1 three-dimensionally using a stereo camera system.

The configuration described in embodiment 2 (including modified examples) can be applied in appropriate combination with the configuration described in embodiment 1 (including modified examples).

(Embodiment 3)
11A and 11B, the mounting system 100B according to this embodiment differs from the mounting system 100 according to the first embodiment in that the mounting head 1 of the head unit 10B is a rotary head. Hereinafter, the same components as those in the first embodiment will be denoted by the same reference numerals and the description thereof will be omitted as appropriate.

In this embodiment, the mounting head 1 has multiple (eight, for example) capture units 11. The multiple capture units 11 are arranged at equal intervals on a circle centered on the rotation axis C1. One point on the circle centered on the rotation axis C1 is the "mounting position", and the mounting head 1 mounts the first object T1 on the second object T2 by lowering one capture unit 11 located at the mounting position as shown in FIG. 11B. The mounting head 1 has the function of switching the capture unit 11 located at the mounting position by rotating the multiple capture units 11 around the rotation axis C1 (see the arrows in FIG. 11A).

The mounting system 100B according to this embodiment includes two imaging devices 2. The mounting system 100B realizes a stereo camera by using these two imaging devices 2 as the first imaging device 201 and the second imaging device 202. As shown in FIG. 11A and FIG. 11B, the two imaging devices 2 are arranged adjacent to one of the multiple capture units 11 located at the mounting position. In this state, the two imaging devices 2 include in their imaging field of view R10 a (first) specific area R1 directly below the one capture unit 11 located at the mounting position. Here, when the mounting head 1 rotates the multiple capture units 11 around the rotation axis C1, the capture unit 11 located at the mounting position is switched, so that the two imaging devices 2 are shared by the multiple capture units 11.

In this embodiment, as in embodiment 2, it is preferable to include a second specific region R2 in the imaging field of view R10 of the imaging device 2 in addition to the first specific region R1, which is the specific region R1.

Furthermore, as a variant of embodiment 3, there may be only one imaging device 2, or there may be two or more imaging devices 2.

In another variation of embodiment 3, the mounting head 1 may have only one capture portion 11.

The configuration described in embodiment 3 (including modified examples) can be applied in appropriate combination with the configuration described in embodiment 1 or 2 (including modified examples).

(summary)
As described above, the mounting system (100, 100A, 100B) according to the first aspect includes a mounting head (1) and an imaging device (2). The mounting head (1) has a capture unit (11). The mounting head (1) moves the capture unit (11) so as to approach the second object (T2) while the first object (T1) is captured by the capture unit (11), and mounts the first object (T1) on the mounting surface (T21) of the second object (T2). The imaging device (2) is fixed to the mounting head (1). The imaging device (2) includes a specific region (R1) of the mounting surface (T21) in an imaging field of view (R10). The specific region (R1) faces the capture unit (11) in a direction perpendicular to the mounting surface (T21). The imaging device (2) has an imaging optical axis (Ax1) perpendicular to the mounting surface (T21).

According to this aspect, the imaging device (2) includes in the imaging field of view (R10) a specific region (R1) of the mounting surface (T21) that faces the capture unit (11) in a direction perpendicular to the mounting surface (T21), so that the imaging device (2) can capture an image of the region directly below the capture unit (11) of the mounting surface (T21). Moreover, since the imaging optical axis (Ax1) of the imaging device (2) is perpendicular to the mounting surface (T21), it is possible to arrange the imaging device (2) in an orientation perpendicular to the mounting surface (T21). That is, instead of directing the imaging optical axis (Ax1) of the imaging device (2) to the specific region (R1), the imaging optical axis (Ax1) of the imaging device (2) is deliberately directed outside the specific region (R1), so that the specific region (R1) is reflected at the edge of the imaging field of view (R10) of the imaging device (2). This makes it possible to make the imaging optical axis (Ax1) of the imaging device (2) perpendicular to the mounting surface (T21). Therefore, for example, there is an advantage that the area occupied by the imaging device (2) in a plane parallel to the mounting surface (T21) can be kept relatively small, and the movement range of the mounting head (1) is less likely to be restricted by the imaging device (2), etc. Therefore, it is possible to provide a mounting system (100, 100A, 100B) that is more suitable for imaging the specific region (R1).

In the mounting system (100, 100A, 100B) of the second aspect, in the first aspect, when the imaging field of view (R10) of the imaging device (2) is divided into a central portion (R101) and a peripheral portion (R102), the specific region (R1) is included in the peripheral portion (R102) of the imaging field of view (R10) of the imaging device (2).

According to this aspect, a specific area (R1) can be captured in the peripheral area (R102) located at the edge of the imaging field of view (R10).

In the mounting system (100, 100A, 100B) according to the third aspect, in the first or second aspect, the mounting head (1) has a plurality of capture portions (11). A specific area (R1) included in the imaging field of view (R10) of one imaging device (2) is an area of the mounting surface (T21) that faces the plurality of capture portions (11) in a direction perpendicular to the mounting surface (T21).

According to this aspect, a specific region (R1) corresponding to multiple capture sections (11) can be imaged using a single imaging device (2).

In the mounting system (100, 100A, 100B) relating to the fourth aspect, in the third aspect, the imaging device (2) is positioned between two of the multiple capture sections (11) in a planar view.

According to this aspect, a specific region (R1) corresponding to two capture sections (11) can be efficiently imaged using a single imaging device (2).

The mounting system (100, 100A, 100B) according to the fifth aspect further includes a second imaging device (202) in any one of the first to fourth aspects. The second imaging device (202) is fixed to the mounting head (1) separately from the first imaging device (201) as the imaging device (2), and includes a specific region (R1) in its imaging field of view (R10). The second imaging field of view (R200), which is the imaging field of view (R10) of the second imaging device (202), includes a different region from the first imaging field of view (R100), which is the imaging field of view (R10) of the first imaging device (201). The specific region (R1) is included in the region where the first imaging field of view (R100) and the second imaging field of view (R200) overlap.

According to this aspect, the stereo camera method makes it possible to capture a subject within a specific area (R1) in three dimensions.

In the mounting system (100, 100A, 100B) relating to the sixth aspect, in the fifth aspect, the capture section (11) is located between the first imaging device (201) and the second imaging device (202) in a planar view.

According to this aspect, the stereo camera system makes it possible to three-dimensionally capture a subject within a specific region (R1) corresponding to a capture section (11) located between a first imaging device (201) and a second imaging device (202).

In the mounting system (100, 100A, 100B) according to the seventh aspect, in the fifth aspect, the mounting head (1) has a plurality of capture sections (11). The plurality of capture sections (11) are classified into a first capture section group (G1) consisting of two or more capture sections (11) arranged along a first direction, and a second capture section group (G2) consisting of two or more capture sections (11). The first capture section group (G1) and the second capture section group (G2) face each other in a second direction perpendicular to the first direction in a planar view. The first imaging device (201) and the second imaging device (202) are located between the first capture section group (G1) and the second capture section group (G2) in a planar view.

According to this aspect, the first imaging device (201) and the second imaging device (202) are arranged inside the first capture unit group (G1) and the second capture unit group (G2), so that the first imaging device (201) and the second imaging device (202) are less likely to get in the way.

In the mounting system (100, 100A, 100B) relating to the eighth aspect, in any of the first to seventh aspects, when the imaging field of view (R10) is divided into a central portion (R101) and a peripheral portion (R102), the imaging device (2) has a higher resolution in the peripheral portion (R102) than in the central portion (R101) of the imaging field of view (R10).

According to this aspect, a specific region (R1) can be imaged at a relatively high resolution in the peripheral area (R102) located at the edge of the imaging field of view (R10).

In the mounting system (100, 100A, 100B) relating to the ninth aspect, in any of the first to eighth aspects, the imaging device (2) is arranged to the side of the capture section (11).

According to this embodiment, the imaging device (2) is less likely to get in the way when the capture section (11) moves.

The head unit (10, 10A, 10B) according to the tenth aspect includes a mounting head (1) and an imaging device (2). The mounting head (1) has a capture section (11). The mounting head (1) moves the capture section (11) so as to approach the second object (T2) while the first object (T1) is captured by the capture section (11), and mounts the first object (T1) on the mounting surface (T21) of the second object (T2). The imaging device (2) is fixed to the mounting head (1). The imaging device (2) includes in its imaging field of view (R10) a specific region (R1) of the mounting surface (T21) that faces the capture section (11) in a direction perpendicular to the mounting surface (T21). The imaging device (2) has an imaging optical axis (Ax1) perpendicular to the mounting surface (T21).

According to this aspect, a head unit (10, 10A, 10B) that is more suitable for imaging a specific area (R1) can be provided.

The mounting system (100, 100A, 100B) according to the eleventh aspect includes a mounting head (1) and an imaging device (2). The mounting head (1) has a capture section (11). The mounting head (1) captures a first object (T1) with the capture section (11), moves the capture section (11) to approach a second object (T2), and mounts the first object (T1) on a mounting surface (T21) of the second object (T2). The imaging device (2) is fixed to the mounting head (1). The imaging device (2) includes a specific region (R1) of the mounting surface (T21) in an imaging field of view (R10). The specific region (R1) faces the capture section (11) in a direction perpendicular to the mounting surface (T21). When the imaging field of view (R10) is divided into a central portion (R101) and a peripheral portion (R102), the imaging device (2) has a higher resolution in the peripheral portion (R102) than in the central portion (R101) of the imaging field of view (R10).

According to this aspect, a mounting system (100, 100A, 100B) that is more suitable for imaging a specific region (R1) can be provided.

The imaging method according to the twelfth aspect is an imaging method used in a mounting system (100, 100A, 100B) including a mounting head (1). The mounting head (1) has a capture unit (11). The mounting head (1) moves the capture unit (11) so as to approach the second object (T2) while capturing a first object (T1) with the capture unit (11), and mounts the first object (T1) on the mounting surface (T21) of the second object (T2). The imaging method includes a step of imaging a specific region (R1) with an imaging device (2). The imaging device (2) is fixed to the mounting head (1). The imaging device (2) includes a specific region (R1) of the mounting surface (T21) in an imaging field of view (R10). The specific region (R1) faces the capture unit (11) in a direction perpendicular to the mounting surface (T21). The imaging device (2) has an imaging optical axis (Ax1) perpendicular to the mounting surface (T21).

According to this aspect, an imaging method that is more suitable for imaging a specific region (R1) can be provided.

Without being limited to the above aspects, various configurations (including modified examples) of the mounting systems (100, 100A, 100B) relating to embodiments 1 to 3 can be embodied using an imaging method.

The configurations relating to the second to ninth aspects are not essential to the mounting system (100, 100A, 100B) and may be omitted as appropriate.

REFERENCE SIGNS LIST 1 Mounting head 2 Imaging device 11 Capture unit 10, 10A, 10B Head unit 100, 100A, 100B Mounting system 201 First imaging device 202 Second imaging device Ax1 Imaging optical axis G1 First capture unit group G2 Second capture unit group R1 Specific area R10 Imaging field of view R100 First imaging field of view R200 Second imaging field of view R101 Central area R102 Periphery T1 First object T2 Second object T21 Mounting surface

Claims (12)

a mounting head having a capture unit, the capture unit being moved toward a second object while the capture unit has captured a first object, and the first object being mounted on a mounting surface of the second object;
an imaging device that is fixed to the mounting head and has an imaging field of view that includes a specific area of the mounting surface that faces the capture unit in a direction perpendicular to the mounting surface,
When the imaging field of view is divided into a central portion and a peripheral portion,
the imaging device has a higher resolution in the peripheral portion of the imaging field of view than in the central portion;
Implementation system. the specific area includes a mounting position of the first object on the mounting surface,
The mounting system according to claim 1 . The mounting head has a plurality of the capture portions,
The specific area included in the imaging field of view of one of the imaging devices is an area of the mounting surface that faces the plurality of capture units in a direction perpendicular to the mounting surface.
The mounting system according to claim 1 . The imaging device is located between two of the plurality of capture units in a plan view.
The mounting system according to claim 3 . The mounting head further includes a second imaging device fixed to the mounting head in addition to the first imaging device as the imaging device,
a second imaging field of view that is an imaging field of view of the second imaging device includes an area different from a first imaging field of view that is the imaging field of view of the first imaging device,
The peripheral portion of the first imaging field of view includes the specific area located in an area where the first imaging field of view and the second imaging field of view overlap.
The mounting system according to any one of claims 1 to 4. The capture unit is located between the first imaging device and the second imaging device in a plan view.
The mounting system according to claim 5 . The mounting head has a plurality of the capture portions,
The plurality of capture parts are classified into a first capture part group consisting of two or more capture parts and a second capture part group consisting of two or more capture parts, each of which is arranged along a first direction;
The first capture portion group and the second capture portion group face each other in a second direction perpendicular to the first direction in a plan view,
The first imaging device and the second imaging device are located between the first capturing unit group and the second capturing unit group in a plan view.
The mounting system according to claim 5 . the mounting head has a plurality of the capture portions arranged on a circumference centered on a rotation axis,
The mounting head rotates the plurality of capture units around the rotation axis,
The peripheral portion of the imaging field of view of the imaging device includes the specific area corresponding to the capture portion located at the mounting position among the plurality of capture portions,
The mounting system according to claim 1 . The mounting head further includes a second imaging device fixed to the mounting head in addition to the first imaging device as the imaging device,
the mounting head has a plurality of capture units including a first capture unit serving as the capture unit imaged by the first imaging device and a second capture unit serving as the capture unit imaged by the second imaging device,
The first imaging device and the second imaging device are arranged side by side along a first direction in which the plurality of capture units are arranged.
The mounting system according to claim 1 . The imaging device is disposed to the side of the capture unit.
The mounting system according to any one of claims 1 to 9. a mounting head having a capture unit, the capture unit being moved toward a second object while the capture unit has captured a first object, and the first object being mounted on a mounting surface of the second object;
an imaging device that is fixed to the mounting head and has an imaging field of view that includes a specific area of the mounting surface that faces the capture unit in a direction perpendicular to the mounting surface,
When the imaging field of view is divided into a central portion and a peripheral portion,
the imaging device has a higher resolution in the peripheral portion of the imaging field of view than in the central portion;
Head unit. 1. An imaging method for use in a mounting system, comprising: a mounting head having a capture unit, the capture unit being moved toward a second object in a state where the capture unit has captured a first object, and the first object being mounted on a mounting surface of the second object, the imaging method comprising:
an imaging device that is fixed to the mounting head and has an imaging field of view that includes a specific area of the mounting surface that faces the capture unit in a direction perpendicular to the mounting surface, and an imaging device that captures the specific area;
In the step of imaging the specific region, when the imaging field of view is divided into a central portion and a peripheral portion, the imaging device images the peripheral portion of the imaging field of view with a higher resolution than the central portion.
Imaging method.

Images