JP7818239B2 - Mounting system and mounting method - Google Patents

Description

The present disclosure relates to an implementation system and an implementation method.

The electronic component mounting device of Patent Document 1 is equipped with a component holding device and a control device.

The component holding device has an imaging device that captures an image of a planned mounting area, including the planned mounting position of an electronic component, from above on a circuit board. The control device determines whether an adjacent electronic component has intruded into the planned mounting area based on the imaging results of the imaging device. If the control device determines that an adjacent electronic component has intruded into the planned mounting area, it corrects the planned mounting position and mounts the electronic component held by the component holding device in the corrected planned mounting position.

An electronic component mounting device (mounting system) such as that described in Patent Document 1 moves an imaging device (imaging unit) provided on a component holding device (capturing unit) above a planned mounting area and captures an image of the planned mounting area. The electronic component mounting device then moves the electronic component (first object) held by the component holding device above the planned mounting position and then lowers it, thereby performing a mounting operation to mount the electronic component at the planned mounting position.

However, the electronic component mounting device cannot move the electronic component held by the component holding device above the intended mounting position until it has completed imaging of the intended mounting area. This results in a loss of time required for mounting, resulting in reduced productivity.

Japanese Patent Application Laid-Open No. 2002-076693

The purpose of this disclosure is to provide an implementation system and implementation method that can reduce the time required for implementation and improve productivity.

A mounting system according to one aspect of the present disclosure includes a mounting head, an imaging unit, a drive unit, and a control unit. The mounting head has a capture unit capable of capturing a first object and movable toward a second object, and mounts the first object at a planned mounting position on a mounting surface of the second object. The imaging unit is provided on the mounting head and captures an imaging area including at least one of the tip of the capture unit and an area facing the capture unit in the movement direction of the capture unit. The drive unit drives the mounting head to move the mounting head. The control unit controls the drive unit and the mounting head so that the capture unit can mount the first object at the planned mounting position. The control unit determines, based on the imaging result of the imaging unit, an intrusion state of at least one mounted component already mounted on the second object with respect to a planned mounting area including the planned mounting position, and corrects the planned mounting position according to the intrusion state. The control unit controls a waiting time, which is the length of time the capture unit stops at a position facing the planned mounting position. If it is predicted that the dimension of the gap between the first object to be mounted at the corrected intended mounting position and the at least one mounted component will be less than a control threshold, the waiting time is made longer than when the dimension of the gap is equal to or greater than the control threshold.

A mounting method according to one aspect of the present disclosure is performed by a mounting system including a mounting head, an imaging unit, a drive unit, and a control unit. The mounting head has a capture unit capable of capturing a first object and movable toward a second object, and mounts the first object at a planned mounting position on a mounting surface of the second object. The imaging unit is provided on the mounting head. The drive unit drives the mounting head to move the mounting head. The control unit controls the drive unit and the mounting head so that the capture unit can mount the first object at the planned mounting position. The mounting method includes an imaging step, a correction step, and a wait time control step . In the imaging step, the imaging unit captures an imaging area including at least one of the tip of the capture unit and an area facing the capture unit in the movement direction of the capture unit. In the correction step, the control unit determines, based on the imaging result of the imaging unit, an intrusion state of at least one mounted component already mounted on the second object with respect to a planned mounting position including the planned mounting position, and corrects the planned mounting position according to the intrusion state. In the waiting time control process, if the control unit predicts that the dimension of the gap between the first object to be mounted at the corrected intended mounting position and the at least one mounted component will be less than a control threshold, the control unit lengthens the waiting time, which is the length of time that the capture unit stops at a position opposite the intended mounting position, compared to when the dimension of the gap is greater than or equal to the control threshold.

FIG. 1 is a configuration diagram showing a mounting system according to an embodiment. FIG. 2 is a perspective view showing a main part of the mounting system. FIG. 3 is a block diagram showing the mounting system of the above embodiment. FIG. 4 is a perspective view showing a component to be mounted in the mounting system. FIG. 5 is a side view for explaining the mounting of the components in the above embodiment. FIG. 6 is a side view for explaining the mounting of the components in the same. FIG. 7 is a perspective view showing the periphery of the imaging unit of the mounting system. 8A and 8B are schematic diagrams for explaining the mounting process of the mounting system. FIG. 9 is a flowchart showing a mounting method executed by the mounting system. FIG. 10 is a side view for explaining correction of the planned mounting position by the mounting system. FIG. 11 is a side view for explaining correction of the planned mounting position by the mounting system. FIG. 12 is a side view for explaining correction of the planned mounting position by the mounting system. FIG. 13 is a side view for explaining correction of the planned mounting position by the mounting system. FIG. 14 is a side view for explaining the abort process of the mounting system. FIG. 15 is a perspective view showing a modified example of the imaging unit of the mounting system. FIG. 16 is a side view showing another modified example of the imaging unit of the mounting system.

The following embodiments generally relate to mounting systems and mounting methods. More specifically, the present invention relates to a mounting system and mounting method that includes a capture unit capable of capturing a first object and that is movable toward a second object, and that mounts the first object on the second object.

The mounting system and mounting method according to the embodiment will be described in detail below with reference to Figures 1 to 14. However, the figures described in the following embodiments are schematic diagrams, and the ratios of the sizes and thicknesses of the components do not necessarily reflect the actual dimensional ratios. Note that the configurations described in the following embodiments are merely examples of the present disclosure. The present disclosure is not limited to the following embodiments, and various modifications are possible depending on the design, etc., as long as the effects of the present disclosure can be achieved.

(1) Overview of Mounting System Hereinafter, an overview of the mounting system 1 according to this embodiment will be described.

As shown in Figure 1, the mounting system 1 is a mounting device (mounting machine) for mounting a first object T1 to a second object T2. The mounting system 1 is used in the manufacturing of various products such as electronic devices, automobiles, clothing, food, pharmaceuticals, and crafts in facilities such as factories, laboratories, offices, and educational facilities.

In this embodiment, the mounting system 1 is used in the manufacture of electronic devices in a factory. Typical electronic devices include various circuit blocks, such as a power supply circuit and a control circuit. In the manufacture of these circuit blocks, for example, a solder application process, a mounting process, and a soldering process are performed in this order. In the solder application process, cream solder is applied (or printed) to a substrate (including a printed wiring board). In the mounting process, components (including electronic components) are mounted (mounted) on the substrate. In the soldering process, for example, the substrate with the mounted components is heated in a reflow furnace to melt the cream solder and perform soldering. In the mounting process, the mounting system 1 mounts a component T10, which is a first object T1, on a substrate T20, which is a second object T2. That is, in the mounting system 1 according to this embodiment, the first object T1 is the component T10, and the second object T2 is the substrate T20 on which the component T10 is mounted.

As shown in FIG. 1, the mounting system 1 used to mount a first object T1 (component T10) on a second object T2 (substrate T20) includes a mounting head 2, an imaging unit 3, a drive unit 4, a control unit 5, a base 61, a transport device 62, multiple component supply devices 63, and a fixed camera 7. The transport device 62 has a pair of conveyor mechanisms 62a extending in the X-axis direction on the base 61, and transports the second object T2, or substrate T20, in the X-axis direction to position it in a predetermined mounting space. The multiple component supply devices 63 have tape feeders attached to feeder bases 65 of carts 64 connected to the base 61, lined up in the X-axis direction. Each component supply device 63 pitch-feeds a carrier tape 67 supplied from a reel 66 and supplies the first object T1, or component T10, held on the carrier tape 67 to a component supply port 63a. The reels 66 are held by the carts 64. The fixed camera 7 is mounted on a base 61 and captures images above.

The mounting head 2 has a capture unit 21 for capturing the first object T1. The capture unit 21 is, for example, a suction nozzle, and captures (holds) the first object T1, which is a component T10, in a state in which it can be released (i.e., released from capture). With the component T10 captured by the capture unit 21, the mounting system 1 lowers the capture unit 21 so that it approaches the board T20, and mounts the component T10 on the mounting surface T21 of the board T20.

In the component mounting field, particularly the field of sandwich mounting of electronic components, where the above-described mounting system 1 is used, there has been a demand in recent years for shortening the time required for mounting and improving productivity as electronic components have become increasingly miniaturized and denser. A specific example of component T10 is an electronic component measuring 0.1 mm wide x 0.2 mm long in plan view.

In the mounting system 1, the mounting head 2 has a capture unit 21 capable of capturing a first object T1 that is movable toward a second object T2, and mounts the first object T1 at a planned mounting position P1 (see Figure 2) on the mounting surface T21 of the second object T2. The imaging unit 3 is provided on the mounting head 2 and captures an imaging region R1 (see Figure 7) that includes the lower end (tip) of the capture unit 21 and at least one of the regions facing the capture unit 21 in the movement direction of the capture unit 21 (downward in this embodiment). The drive unit 4 drives the mounting head 2 to move the mounting head 2. The control unit 5 controls the drive unit 4 and the mounting head 2 so that the capture unit 21 can mount the first object T1 at the planned mounting position P1. Based on the imaging results of the imaging unit 3, the control unit 5 determines the extent to which at least one mounted component T3 (see FIG. 4 ) already mounted on the second object T2 has intruded into the planned mounting area Q1 (see FIG. 2 ), which includes the planned mounting position P1, and corrects the planned mounting position P1 according to the extent of intrusion. The planned mounting area Q1 is an area obtained by adding the reference dimensions of the component T10 to the dimensional tolerance of the component T10 and the deviation of the mounting position (mounting accuracy) of the component T10, and is set around the planned mounting position P1. In other words, the planned mounting area Q1 is the entire area that the component T10 mounted at the planned mounting position P1 can occupy on the mounting surface T21. In other words, the component T10 mounted at the planned mounting position P1 will fit within the planned mounting area Q1 even when the dimensional tolerance and mounting accuracy of the component T10 are taken into account.

In this mounting system 1, the imaging unit 3 is provided on the mounting head 2 and captures an imaging area R1 (see Figure 7) that includes at least one of the lower end of the capture unit 21 and the area facing the capture unit 21 in the direction of movement of the capture unit 21. That is, in the mounting system 1, the imaging unit 3 moves together with the mounting head 2. In other words, the mounting system 1 can simultaneously move the mounting head 2 and the imaging unit 3 to capture an image of the mounting state around the intended mounting position P1. Therefore, the mounting system 1 can reduce the time required for mounting and improve productivity compared to a configuration in which the mounting head 2 and the imaging unit 3 are moved separately.

In recent years, there has also been a demand for even finer-pitch adjacent mounting. For example, as shown in Figure 4, a component T10 may be mounted on a mounting surface T21 on which at least one mounted component T3 (in Figure 4, four mounted components T3 aligned in the Y-axis direction) is already mounted. In this case, it is necessary to mount the component T10 on the mounting surface T21 without interfering with the already mounted components T3. Therefore, in the past, the intended mounting position of the component T10 was corrected based on the individual dimensional variations of the board T20 (such as the manufacturing accuracy of the board T20 and expansion and contraction due to heat and humidity) and the deviation in the capture position of the component T10 by the capture unit 21. However, conventional mounting accuracy and methods for correcting the intended mounting position will make it difficult to accommodate narrow-pitch mounting that meets the requirements of the future market.

In Figure 4, mounted components T31 and T32 are already mounted on mounting surface T21, aligned in the Y-axis direction, as mounted component T3, and component T10 is to be mounted between mounted components T31 and T32 in the Y-axis direction. Component T10 and mounted components T31 and T32 are each mounted using solder 8 applied to lands T22 formed at equal intervals along the Y-axis direction on mounting surface T21. Solder 8 corresponds to the joining member that joins component T10 and mounted component T3 to board T20.

Figures 5 and 6 are side views of mounted component T31 and component T10 as viewed from the X-axis direction. In this embodiment, the pre-set adjacent pitch Yp in the Y-axis direction for component T10 and mounted component T3 is 40 μm. Furthermore, the dimensional tolerances in the Y-axis direction for component T10 and mounted component T3 are a one-sided tolerance Yt of +5 μm and a two-sided tolerance of ±10 μm. Furthermore, the dimension (gap dimension) of the gap G1 in the Y-axis direction formed between component T10 and mounted component T31 is Yg1.

Ideally, each mounting component, such as component T10 and mounted component T3, is mounted at a reference position where the center of the land T22 in the Y-axis direction coincides with the center of the mounted component in the Y-axis direction. However, due to mechanical precision and software processing precision, the mounting position of the mounted component may deviate from the reference position, resulting in what is known as mounting misalignment. The maximum value (absolute value) of the mounting misalignment caused by such mechanical precision and software processing precision is referred to as the mounting misalignment value Ym (see Figure 6). Note that if the deviation between the actual mounting position of the mounted component and the reference position is equal to or less than a predetermined value, it may be considered that no mounting misalignment has occurred. In this embodiment, the mounting misalignment value Ym is set to 20 μm.

In Figure 5, the dimension of component T10 in the Y-axis direction includes a one-sided tolerance Yt, and the dimension of mounted component T31 in the Y-axis direction also includes a one-sided tolerance Yt. Furthermore, there is no mounting misalignment between component T10 and mounted component T31. In this case, the gap dimension Yg1 is "Yg1 = Yp - 2 · Yt = 30 μm," and component T10 does not interfere with mounted component T31.

In addition, in Figure 6, component T10 and mounted component T31 each experience a mounting misalignment of Ym (= 20 μm) in the direction that brings them closer to each other in the Y-axis direction. In this case, the gap dimension Yg1 corresponds to the overlap dimension between component T10 and mounted component T31, and "Yg1 = Yp - 2 * Yt - 2 * Ym = -10 μm," meaning that component T10 interferes with mounted component T31.

Therefore, when performing close-adjacent mounting, the mounting system 1 determines the position of the mounted component T3 adjacent to the first object T1 and corrects the intended mounting position P1 to suppress interference between the first object T1 and the mounted component T3.

Note that the state in which "component T10 interferes with already-mounted component T31" is not limited to a state in which component T10 and already-mounted component T31 overlap each other, as shown in Figure 6. The state in which "component T10 interferes with already-mounted component T31" also includes, for example, a state in which component T10 and already-mounted component T31 do not overlap each other, but the gap dimension Yg1 is less than a predetermined dimension. If the gap dimension Yg1 is less than the predetermined dimension, the mounting system 1 determines that there is a high possibility of interference, and corrects the intended mounting position P1 to suppress interference between the first object T1 and already-mounted component T3.

When correcting the intended mounting position P1, the mounting system 1 preferably takes into consideration the individual dimensional variations of the board T20 and the deviation in the capture position of the component T10, as well as the tolerances of the component T10 and the mounted component T3, as well as the deviation in the mounting position of the mounted component T3. Furthermore, when interference between the first object T1 and the mounted component T3 or between the capture unit 21 and the mounted component T3 cannot be avoided, the mounting system 1 preferably stops the mounting process of the first object T1. Furthermore, the mounting system 1 preferably corrects the intended mounting position P1 to suppress interference between the capture unit 21 and the mounted component T3.

(2) Details (2.1) Premise In this embodiment, as an example, a case will be described in which the mounting system 1 is used to mount a component (first object T1) using surface mount technology (SMT). That is, the component T10 serving as the first object T1 is a surface mount device (SMD) and is mounted by being placed on the surface (mounting surface T21) of the substrate T20 serving as the second object T2. However, this example is not limiting, and the mounting system 1 may also be used to mount a component (first object T1) using insertion mount technology (IMT). In this case, the component T10 serving as the first object T1 is an insertion mount component having lead terminals and is mounted on the surface (mounting surface T21) of the substrate (second object T2) by inserting the lead terminals into holes in the substrate T20 serving as the second object T2.

The "imaging optical axis" referred to in this disclosure is the optical axis of the image captured by the imaging unit 3 (image captured by the imaging unit 3), and is an optical axis determined by both the imaging element 31 (see FIG. 3) and the optical system 32 (see FIG. 3) of the imaging unit 3. In other words, the imaging optical axis of the imaging unit 3 is the straight line connecting the center of the light-receiving surface of the imaging element 31 and the part within the imaging region R1 (see FIG. 7) that is imaged at the center of the light-receiving surface of the imaging element 31 through the optical system 32.

In addition, the "imaging result" referred to in this disclosure refers to an image captured by the imaging unit 3, and includes still images (still images) and videos (moving images). Furthermore, "video" includes an image captured by the imaging unit 3 consisting of multiple still images obtained by stop-motion photography, etc. The image captured by the imaging unit 3 does not have to be the data output from the imaging unit 3 itself. For example, the image captured by the imaging unit 3 may be subjected to processing such as data compression, conversion to another data format, or cutting out a portion of the image captured by the imaging unit 3, or adjusting the focus, brightness, or contrast, as necessary. In this embodiment, as an example, the image captured by the imaging unit 3 is a full-color moving image.

As an example, the following describes three mutually orthogonal axes: the X-axis, the Y-axis, and the Z-axis. The axes parallel to the surface (mounting surface T21) of the substrate T20, which is the second object T2, are referred to as the "X-axis" and "Y-axis," and the axis parallel to the thickness direction of the substrate T20 is referred to as the "Z" axis. Furthermore, one of the two directions along the Z-axis is referred to as the upward direction, and the other as the downward direction. For example, when the capture unit 21 faces the mounting surface T21 of the substrate T20, the substrate T20 is located below the capture unit 21. Note that the X-axis, Y-axis, and Z-axis are all imaginary axes, and the arrows indicating "X," "Y," and "Z" in the drawings are merely used for explanatory purposes and do not represent any physical entities. Furthermore, these directions are not intended to limit the directions in which the mounting system 1 is used.

In addition, pipes for circulating cooling water, cables for supplying power, and pipes for supplying air pressure (including positive pressure and vacuum) are connected to the mounting system 1, but in this embodiment, these are omitted from the illustration as appropriate.

(2.2) Overall Configuration Next, the main parts of the mounting system 1 according to this embodiment will be described with reference to FIGS. 1 to 3 and 7. FIG.

The mounting system 1 according to this embodiment includes a mounting head 2, an imaging unit 3, a drive unit 4, and a control unit 5. Furthermore, in this embodiment, as shown in FIG. 3, in addition to the mounting head 2, imaging unit 3, drive unit 4, and control unit 5, the mounting system 1 further includes a conveying device 62, a component supplying device 63, and a fixed camera 7. However, the conveying device 62, component supplying device 63, and fixed camera 7 are not essential components of the mounting system 1. In other words, all or some of the conveying device 62, component supplying device 63, and fixed camera 7 do not need to be included as components of the mounting system 1. Furthermore, FIG. 2 illustrates only the mounting head 2, imaging unit 3, and drive unit 4, and the illustration of other components of the mounting system 1 is omitted as appropriate.

The mounting head 2 has at least one capture portion 21. In this embodiment, the mounting head 2 has one capture portion 21. With the component T10 captured by the capture portion 21, the mounting head 2 moves the capture portion 21 closer to the board T20 and mounts the component T10 on the mounting surface T21 of the board T20. In other words, the mounting head 2 holds the capture portion 21 so that it can be moved toward the board T20.

The imaging unit 3 is fixed to the mounting head 2. The imaging unit 3 has an imaging element 31 and an optical system 32. The imaging unit 3 is, for example, a video camera that captures moving images. In this embodiment, as shown in FIG. 7, the imaging unit 3 captures an imaging region R1 that includes the limit position at which the capture unit 21, which is located above the planned mounting position P1 and facing the planned mounting position P1, can get closest to the board T20. In FIG. 7, the limit position is the bottom dead center U1, which is the lowest position in the Z-axis direction of the capture unit 21. In other words, the imaging unit 3 captures an image below the capture unit 21, which is located above the planned mounting position P1 and facing the planned mounting position P1, so as to include the bottom dead center U1.

The imaging unit 3 may also capture an image of the area from the bottom end of the capture unit 21 to the planned mounting position P1 as the imaging area R1. The imaging unit 3 may also capture an image of the area from the bottom end of the capture unit 21 to the planned mounting area Q1 as the imaging area R1.

In other words, the imaging unit 3 only needs to be able to image the imaging area R1 that includes at least one of the lower end of the capture unit 21 and the area facing the capture unit 21 in the direction of movement of the capture unit 21.

The control unit 5 controls each part of the mounting system 1. The control unit 5 is primarily composed of a microcontroller having one or more processors and one or more memories. In other words, the functions of the control unit 5 are realized when the processor of the microcontroller executes a program recorded in the memory of the microcontroller. The program may be pre-recorded in the memory, provided via a telecommunications line such as the Internet, or provided recorded on a non-transitory recording medium such as a memory card.

The control unit 5 is electrically connected to, for example, each of the mounting head 2, imaging unit 3, drive unit 4, conveying device 62, component supply device 63, and fixed camera 7. The control unit 5 outputs control signals to the mounting head 2 and drive unit 4, and controls the mounting head 2 and drive unit 4 so that the component T10 captured by the capture unit 21 is mounted on the mounting surface T21 of the board T20. The control unit 5 also outputs control signals to the imaging unit 3 and fixed camera 7 to control the imaging unit 3 and fixed camera 7, and to acquire images captured by the imaging unit 3 and fixed camera 7 from the imaging unit 3 and fixed camera 7, respectively.

The drive unit 4 is a device that moves the mounting head 2. In this embodiment, the drive unit 4 moves the mounting head 2 within the X-Y plane. The "X-Y plane" here refers to a plane that includes the X-axis and Y-axis and is perpendicular to the Z-axis. In other words, the drive unit 4 moves the mounting head 2 in the X-axis and Y-axis directions. In this embodiment, because the imaging unit 3 is fixed to the mounting head 2, the drive unit 4 also moves the imaging unit 3 together with the mounting head 2. In other words, the drive unit 4 moves the mounting head 2 and the imaging unit 3 within the X-Y plane. In FIG. 1, the drive unit 4 moves the mounting head 2 and the imaging unit 3 between above the board T20, which is positioned in the mounting space of the transport device 62, and above the component supply port 63a of the component supply device 63.

Specifically, as shown in FIG. 2, the drive unit 4 has an X-axis drive unit 41 and a Y-axis drive unit 42. The X-axis drive unit 41 moves the mounting head 2 linearly in the X-axis direction. The Y-axis drive unit 42 moves the mounting head 2 linearly in the Y-axis direction. The Y-axis drive unit 42 moves the mounting head 2 linearly in the Y-axis direction by moving the mounting head 2 together with the X-axis drive unit 41 along the Y-axis. In this embodiment, as an example, each of the X-axis drive unit 41 and the Y-axis drive unit 42 includes a linear motor, and moves the mounting head 2 by the driving force generated by the linear motor when power is supplied.

The component supply device 63 supplies components T10 to be captured by the capture unit 21 of the mounting head 2. As an example, the component supply device 63 has a tape feeder that supplies components T10 housed on a carrier tape. Alternatively, the component supply device 63 may have a tray on which multiple components T10 are placed. The mounting head 2 captures components T10 from such a component supply device 63 using the capture unit 21.

The transport device 62 is a device that transports the substrate T20. The transport device 62 is realized, for example, by a belt conveyor. The transport device 62 transports the substrate T20, for example, along the X-axis. The transport device 62 transports the substrate T20 to a mounting space that is at least below the mounting head 2, that is, opposite the capture unit 21 in the Z-axis direction. The transport device 62 then stops the substrate T20 in the mounting space until the mounting head 2 has completed mounting the component T10 on the substrate T20.

In addition to the above configuration, the implementation system 1 may also be equipped with a backup device, a lighting device, a communication unit, etc.

The backup device backs up the substrate T20 transported to the mounting space by the transport device 62. In other words, the substrate T20 transported to the mounting space by the transport device 62 is held in the mounting space by the backup device.

The lighting device illuminates the imaging region R1 of the imaging unit 3. The lighting device only needs to be turned on at least when the imaging unit 3 captures an image, and for example, emits light in synchronization with the imaging timing of the imaging unit 3. In this embodiment, the images captured by the imaging unit 3 are full-color video, so the lighting device outputs light in the wavelength range of visible light, such as white light. In this embodiment, as an example, the lighting device has multiple light sources, such as LEDs (Light Emitting Diodes). The lighting device illuminates the imaging region R1 of the imaging unit 3 by emitting light from these multiple light sources. The lighting device is realized by an appropriate lighting method, such as ring lighting or coaxial epi-illumination. The lighting device is, for example, fixed to the mounting head 2 together with the imaging unit 3.

The communication unit is configured to communicate with a higher-level system directly or indirectly via a network or a repeater, etc. This allows the implementation system 1 to exchange data with the higher-level system.

(2.3) Mounting Head The configuration of the mounting head 2 will be described in more detail with reference to FIGS. 2, 3, 7, 8A, and 8B.

In this embodiment, in addition to the capture unit 21, the mounting head 2 further has an actuator 22 (see Figure 3) for moving the capture unit 21, and a head body 23 that holds the capture unit 21 and the actuator 22. In the mounting system 1 according to this embodiment, one head body 23 holds one capture unit 21 and one actuator 22. This allows the mounting head 2 to capture one component T10.

The capture unit 21 is, for example, a suction nozzle. The capture unit 21 is controlled by the control unit 5 and can switch between a capture state in which it captures (holds) the part T10 and a release state in which it releases (releases the capture) the part T10. However, the capture unit 21 is not limited to a suction nozzle, and may be configured to capture (hold) the part T10 by pinching (picking) it, for example, like a robot hand.

When the capturing unit 21 captures the component T10, the mounting head 2 operates by receiving air pressure (vacuum) as power. In other words, the mounting head 2 switches the capturing unit 21 between a captured state and a released state by opening and closing a valve on the air pressure (vacuum) supply path connected to the capturing unit 21.

The actuator 22 moves the capture unit 21 linearly in the Z-axis direction. Furthermore, the actuator 22 rotates the capture unit 21 in a rotational direction (hereinafter referred to as the "θ direction") around an axis along the Z-axis direction. In this embodiment, as an example, for movement of the capture unit 21 in the Z-axis direction, the actuator 22 is driven by a driving force generated by a linear motor. For movement of the capture unit 21 in the θ direction, the actuator 22 is driven by a driving force generated by a rotary motor. Meanwhile, as described above, the mounting head 2 moves linearly in the X-axis and Y-axis directions by the drive unit 4. As a result, the capture unit 21 included in the mounting head 2 can be moved in the X-axis, Y-axis, Z-axis, and θ directions by the drive unit 4 and the actuator 22.

The head body 23 is, for example, made of metal and formed in a rectangular parallelepiped shape. The capture unit 21 and actuator 22 are assembled to the head body 23, thereby allowing the head body 23 to hold the capture unit 21 and actuator 22. In this embodiment, the capture unit 21 is indirectly held by the head body 23 via the actuator 22, allowing it to move in the Z-axis direction and the θ direction. The mounting head 2 moves within the X-Y plane as the head body 23 is moved within the X-Y plane by the drive unit 4.

With the above-described configuration, as shown in Figures 8A and 8B, the mounting head 2 can move the capturing unit 21 closer to the substrate T20 while capturing the component T10, thereby mounting the component T10 on the mounting surface T21 of the substrate T20. That is, the mounting head 2 moves the capturing unit 21 up and down along the Z axis at least between bottom dead center U1 (see Figure 8B), which is the lowest position of the capturing unit 21 in the Z axis direction, and top dead center U2 (see Figure 8A), which is the highest position of the capturing unit 21 in the Z axis direction. In this case, the mounting head 2 lowers the capturing unit 21, which has captured the component T10, from top dead center U2 to bottom dead center U1, thereby mounting the component T10 on the mounting surface T21 of the substrate T20. However, the "bottom dead center" in this disclosure does not refer to the lowest position in the movable range of the capture part 21, but refers to the lowest position of the capture part 21 when mounting the component T10 on the mounting surface T21 of the board T20. Also, the "top dead center" in this disclosure does not refer to the highest position in the movable range of the capture part 21, but refers to the highest position of the capture part 21 when mounting the component T10 on the mounting surface T21 of the board T20.

(2.4) Imaging Unit The configuration of the imaging unit 3 will be described in more detail with reference to FIGS. 2, 7, 8A, and 8B.

In this embodiment, the imaging unit 3 is composed of a single mobile camera 3a that moves with the mounting head 2 as shown in Figure 7, and has an imaging element 31 and an optical system 32 as shown in Figure 3. The optical system 32 forms an image of the imaging region R1 on the imaging element 31.

The imaging element 31 is an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor). The imaging element 31 converts the image formed on the light-receiving surface into an electrical signal and outputs it.

The optical system 32 includes one or more lenses, mirrors, etc. In this embodiment, as an example, the optical system 32 is realized by a combination of multiple lenses (lens group). The optical system 32 forms an image of light from the imaging region R1 as shown in Figure 7 on the light receiving surface of the imaging element 31. In this embodiment, the optical system 32 of the imaging unit 3 is a telecentric optical system. In other words, the chief ray of the entire optical system is parallel to the optical axis (imaging optical axis Ax1). Note that the optical system 32 is not limited to the above configuration.

As shown in Figure 7, the imaging unit 3 includes in its imaging region R1 an area of the mounting surface T21 of the substrate T20 that faces the capture unit 21 in the direction perpendicular to the mounting surface T21 (the Z-axis direction). In other words, when the capture unit 21 is located on the mounting surface T21 of the substrate T20, the imaging unit 3 includes in its imaging region R1 an area directly below the capture unit 21 on the mounting surface T21. In yet other words, the imaging region R1 is an area that includes the bottom dead center U1 located directly below the capture unit 21 when the capture unit 21 is located on the mounting surface T21 of the substrate T20. Therefore, the imaging unit 3 is able to generate an image of the area directly below the capture unit 21.

Furthermore, when the capture unit 21 is positioned on the mounting surface T21 of the board T20, the imaging area R1 includes not only the planned mounting area Q1 of the component T10, but also at least a portion of the already mounted component T3 that is mounted adjacent to the planned mounting area Q1. Therefore, the image captured by the imaging unit 3 includes the planned mounting area Q1 of the component T10 and at least a portion of the already mounted component T3 that is mounted adjacent to the planned mounting area Q1.

Specifically, as shown in FIG. 7 , the imaging unit 3 is attached to the lower end of the bracket 24. The upper end of the bracket 24 is attached to the head body 23. That is, the imaging unit 3 is positioned below the head body 23 and to the side of the capture unit 21 in a plan view seen from the Z-axis direction. In this way, the imaging unit 3 is attached to the mounting head 2, and the mounting head 2 and imaging unit 3 move simultaneously. Therefore, the mounting system 1 can shorten the time required for mounting and improve productivity compared to a configuration in which the mounting head 2 and imaging unit 3 move separately.

7, 8A, and 8B, the imaging unit 3 has an imaging optical axis Ax1 that is inclined with respect to the perpendicular (a straight line along the Z axis) to the mounting surface T21 of the board T20. In other words, the imaging unit 3 is fixed to the bracket 24 in an orientation such that its imaging optical axis Ax1 is inclined with respect to the perpendicular to the mounting surface T21. In other words, the imaging optical axis Ax1 of the imaging unit 3 is inclined with respect to the Z axis. Because the imaging unit 3 is disposed to the side of the capture unit 21 and the imaging optical axis Ax1 is inclined with respect to the Z axis, it can capture an imaging region R1 directly below the capture unit 21. That is, when the capture unit 21 is positioned above the intended mounting position P1, the imaging unit 3 can capture an imaging region R1 that includes the bottom dead center U1 located directly below the capture unit 21. In this case, the captured image of the imaging region R1 can be used to determine the intrusion state of the mounted component T3 into the intended mounting region Q1, and the intended mounting position P1 can be corrected in accordance with this intrusion state. It is preferable that the image captured by the imaging unit 3 of the imaging area R1 includes both the component T10 captured by the capture unit 21 located opposite the intended mounting position P1 and the mounted component T3.

Furthermore, when the imaging unit 3 is positioned above the substrate T20, it is preferable to capture an image of the entire substrate T20 separately from the above-mentioned imaging area R1. In this case, the control unit 5 can use the overall image capturing the entire substrate T20 to correct the intended mounting position P1 based on dimensional variations of the substrate T20. Furthermore, the overall image of the substrate T20 may be captured by a camera other than the imaging unit 3.

(2.5) Fixed Camera The configuration of the fixed camera 7 will be described in more detail with reference to FIG.

The fixed camera 7 captures an image from below of the mounting head 2 as it moves between above the board T20 positioned in the mounting space and above the component supply port 63a of the component supply device 63. Therefore, the image captured by the fixed camera 7 shows the component T10 captured by the capture unit 21. In other words, the image captured by the fixed camera 7 contains information about the relative positions of the capture unit 21 and the component T10, in other words, information about the misalignment of the component T10 relative to the capture unit 21.

It is preferable that the fixed camera 7 captures an image from below of the mounting head 2 moving from the component supply port 63a to the board T20. In this case, the fixed camera 7 does not capture images all the time, but rather captures images when the capture unit 21 capturing the component T10 passes above the fixed camera 7.

The fixed camera 7 may also be installed below the component supply port 63a.

It is also preferable that the mounting system 1 further includes a lighting device that illuminates the imaging area of the fixed camera 7.

(2.6) Control Unit The configuration of the control unit 5 will be described in more detail with reference to FIGS. 1 to 3, 7, 8A, and 8B.

As described above, the control unit 5 controls the mounting head 2 by outputting a control signal to the mounting head 2. Specifically, the control unit 5 controls the mounting head 2 to move the capture unit 21 linearly in the Z-axis direction until it reaches bottom dead center U1 from top dead center U2. In other words, the control unit 5 lowers the capture unit 21 in the Z-axis direction until it reaches bottom dead center U1 from top dead center U2. The control unit 5 also controls the mounting head 2 to move the capture unit 21 to bottom dead center U1, and then release the capture of component T10 by the capture unit 21, or to have the capture unit 21 capture component T10. This embodiment illustrates a mounting process in which component T10 captured by the capture unit 21 is mounted on the mounting surface T21 of the board T20, and the control unit 5 controls the mounting head 2 to release the capture of component T10 by the capture unit 21.

Then, when mounting the component T10 captured by the capture unit 21 on the mounting surface T21 of the board T20, the control unit 5 places the component T10 at the intended mounting position P1 on the mounting surface T21. The intended mounting position P1 is expressed in XY coordinates, which include coordinates in the X-axis direction and coordinates in the Y-axis direction. The control unit 5 pre-stores data for the XY coordinates (initial values) of the intended mounting position P1 set for the component T10 captured by the capture unit 21, or acquires it from an external system. The control unit 5 controls the mounting head 2 so that the XY coordinates of the component T10 captured by the capture unit 21 match the XY coordinates of the intended mounting position P1.

However, depending on the individual dimensional variations of the board T20, the deviation in the capture position of the component T10, the tolerances of the component T10 and the mounted component T3, and the deviation in the mounting position of the mounted component T3, the component T10 mounted at the intended mounting position P1 may interfere with the mounted component T3.

The control unit 5 then acquires data of the captured images (imaging results) from the imaging unit 3 and the fixed camera 7. Based on the captured image from the imaging unit 3, the control unit 5 determines the intrusion state of at least one mounted component T3 already mounted on the board T20 into the intended mounting area Q1, which includes the intended mounting position P1, and corrects the intended mounting position P1 in accordance with this intrusion state. Details of the correction process for the intended mounting position P1 based on the captured image from the imaging unit 3 will be described later.

Furthermore, it is preferable that the control unit 5 also corrects the intended mounting position P1 based on the image captured by the fixed camera 7. In this case, the control unit 5 can measure the amount of deviation of the component T10 from the center of the capture unit 21 based on the image captured by the fixed camera 7. Then, the control unit 5 corrects the intended mounting position P1 so as to offset the amount of deviation of the component T10.

Furthermore, it is preferable that the control unit 5 corrects the intended mounting position P1 based on an overall image of the substrate T20. In this case, the control unit 5 can measure the dimensional variation of the substrate T20 based on the overall image of the substrate T20. Then, the control unit 5 corrects the intended mounting position P1 so as to offset the dimensional variation of the substrate T20.

The control unit 5 can also control the actuator 22 to control the movement speed of the capture unit 21 in the Z-axis direction. In other words, the control unit 5 can control the descending speed and ascending speed of the capture unit 21.

(3) Mounting Method Next, a mounting method according to this embodiment will be described.

The mounting method according to this embodiment is executed by a mounting system 1 including a mounting head 2, an imaging unit 3, a drive unit 4, and a control unit 5. The mounting head 2 has a capture unit 21 capable of capturing a first object T1 that is movable toward a second object T2, and mounts the first object T1 at a planned mounting position P1 on the mounting surface T21 of the second object T2. The imaging unit 3 is provided on the mounting head 2. The drive unit 4 drives the mounting head 2 to move it. The control unit 5 controls the drive unit 4 and the mounting head 2 so that the capture unit 21 can mount the first object T1 at the planned mounting position P1. The mounting method includes an imaging process and a correction process. In the imaging process, the imaging unit 3 captures an imaging region R1 that includes the lower end (tip) of the capture unit 21 and at least one of the regions facing the capture unit 21 in the direction of movement of the capture unit 21. In the correction process, the control unit 5 determines the intrusion state of at least one mounted component T3 already mounted on the second object T2 into the planned mounting area Q1 including the planned mounting position P1 based on the imaging results of the imaging unit 3, and corrects the planned mounting position P1 according to the intrusion state.

That is, the mounting method according to this embodiment is a mounting method executed by the mounting system 1 according to this embodiment. In this mounting method, the mounting head 2 and the imaging unit 3 are moved simultaneously to capture images of the mounting state around the intended mounting position P1. Therefore, the mounting system 1 can reduce the time required for mounting compared to a configuration in which the mounting head 2 and the imaging unit 3 are moved separately, thereby improving productivity.

Figure 9 is a flowchart showing the overall operation of the mounting system 1, including the mounting method according to this embodiment. The mounting method includes steps S1 to S9 shown in Figure 9.

First, the control unit 5 controls the mounting head 2 and the drive unit 4 to cause the capture unit 21 to capture the component T10 at the component supply port 63a (capture process S1).

Next, the control unit 5 controls the drive unit 4 to move the mounting head 2 in the X-axis and Y-axis directions, thereby moving the capture unit 21 above the intended mounting position P1 (movement process S2). Specifically, the control unit 5 causes the X-axis drive unit 41 to move the mounting head 2 linearly in the X-axis direction, and causes the Y-axis drive unit 42 to move the mounting head 2 linearly in the Y-axis direction. At this time, the control unit 5 moves the mounting head 2 in the X-axis and Y-axis directions so that the X- and Y-coordinates of the component T10 captured by the capture unit 21 match the X- and Y-coordinates of the intended mounting position P1. Note that the X- and Y-coordinates of the component T10 correspond to the X- and Y-coordinates of the center of the component T10 in a planar view seen from the Z-axis direction.

8A, when the mounting head 2 reaches a position where the XY coordinates of component T10 match the XY coordinates of the intended mounting position P1, the capture unit 21 descends from top dead center U2 toward bottom dead center U1. The control unit 5 then activates the imaging unit 3, which captures an image of the imaging area R1 as the capture unit 21 moves from top dead center U2 to bottom dead center U1 (imaging process S3). In this embodiment, the image captured by the imaging unit 3 includes the lower end of the capture unit 21 located opposite the intended mounting position P1, a portion of the component T10 captured by the capture unit 21, and a portion of the mounted component T3 adjacent to the intended mounting position P1.

The timing for capturing an image by the imaging unit 3 in the imaging process S3 may be when the capture unit 21 is positioned at top dead center U2. In this case, the image captured by the imaging unit 3 includes at least a portion of the mounted component T3 adjacent to the intended mounting position P1.

In addition, the timing of imaging by the imaging unit 3 in the imaging process S3 may be before the mounting head 2 reaches a position where the XY coordinates of the component T10 match the XY coordinates of the intended mounting position P1. In this case, the image captured by the imaging unit 3 includes at least a portion of the mounted component T3 adjacent to the intended mounting position P1.

Next, the control unit 5 performs a correction process for the XY coordinates of the intended mounting position P1 based on the image of the imaging area R1 captured by the imaging unit 3, the overall image of the board T20, and the image captured by the fixed camera 7 (correction process S4). The control unit 5 measures the dimensional variation of the board T20 from the overall image of the board T20 and corrects the XY coordinates of the intended mounting position P1 based on the dimensional variation of the board T20. The control unit 5 also measures the amount of deviation of the component T10 from the center of the capture unit 21 from the image captured by the fixed camera 7 and corrects the XY coordinates of the intended mounting position P1 based on the deviation. Furthermore, the control unit 5 determines the intrusion state of the mounted component T3 relative to the intended mounting area Q1 based on the image captured by the imaging unit 3 and corrects the XY coordinates of the intended mounting position P1 based on this intrusion state. The intrusion state of the mounted component T3 corresponds to a state in which the end of the mounted component T3 in the Y-axis direction is shifted toward the intended mounting position P1 relative to the end of the mounted component T3 in the Y-axis direction when placed at the reference position.

Upon completing the correction process S4, the control unit 5 predicts the gap dimension Yg between the component T10 and the adjacent mounted component T3 when the component T10 is mounted on the mounting surface T21 using the corrected intended mounting position P1. The control unit 5 determines whether the predicted value of the gap dimension Yg is equal to or greater than a predetermined control threshold (first determination process S5). The control threshold is, for example, the sum of the dimensional tolerance of the component T10 and the mounting deviation value (mounting accuracy). If the control unit 5 determines that the predicted value of the gap dimension Yg is equal to or greater than the control threshold, it sets the descent speed of the capture unit 21 to the normal speed. The control unit 5 then controls the movement of the capture unit 21 so that the capture unit 21 descends toward the corrected intended mounting position P1 at the normal speed, and mounts the component T10 captured by the capture unit 21 at the corrected intended mounting position P1 (normal mounting process S6). This normal speed is faster than the safe speed, described below, and can shorten the time required to mount the component T10. After mounting the component T10 at the corrected intended mounting position P1, the control unit 5 releases the capture unit 21, raises the capture unit 21, and performs the capture process S1 again on the next component T10.

In the first determination step S5, if the control unit 5 determines that the predicted value of the gap dimension Yg is less than the control threshold, it determines whether or not the component T10 can be mounted at the corrected intended mounting position P1 by changing the drive parameters of the capture unit 21 (second determination step S7). Here, the drive parameter to be changed is, for example, the descent speed of the capture unit 21, and the control unit 5 determines whether or not the component T10 can be mounted at the corrected intended mounting position P1 by slowing the descent speed of the capture unit 21 below the normal speed.

If the control unit 5 determines that component T10 can be mounted at the corrected intended mounting position P1 by slowing the descent speed of the capture unit 21 below the normal speed, it sets the descent speed of the capture unit 21 to a safe speed, slower than the normal speed. That is, if the control unit 5 predicts that the gap dimension Yg, which is the gap dimension between component T10 to be mounted at the corrected intended mounting position P1 and the already-mounted component T3, is less than the control threshold and greater than the abort threshold, it slows the descent speed of the capture unit 21 compared to when the gap dimension Yg is greater than the control threshold. The control unit 5 then controls the movement of the capture unit 21 so that the capture unit 21 descends toward the corrected intended mounting position P1 at a safe speed, and mounts the component T10 captured by the capture unit 21 at the corrected intended mounting position P1 (safe mounting process S8). This safe speed is slower than the aforementioned normal speed, and vibration of component T10 during descent can be suppressed. Therefore, even if the predicted value of gap dimension Yg is less than the control threshold value, control unit 5 can mount component T10 at corrected intended mounting position P1 while reducing the possibility of component T10 interfering with adjacent already-mounted component T3. After mounting component T10 at corrected intended mounting position P1, control unit 5 releases capture unit 21, raises capture unit 21, and performs capture step S1 again on the next component T10.

In the second determination step S7, if the control unit 5 determines that component T10 cannot be mounted at the corrected intended mounting position P1 even when the descent speed of the capture unit 21 is slower than the normal speed, it aborts the mounting of component T10 (abortion step S9). That is, if the control unit 5 predicts that the gap dimension Yg, which is the dimension of the gap between component T10 to be mounted at the corrected intended mounting position P1 and already-mounted component T3, will be less than the abort threshold, it aborts the mounting of component T10 on board T20. This prevents component T10 from interfering with adjacent already-mounted components T3. In the abort step S9, the control unit 5 skips the mounting of the current component T10 and repeats the capture step S1 process for the next component T10. Alternatively, the control unit 5 may issue an error notification using at least one of a sound and a display. Alternatively, the control unit 5 may control the transport device 62 to eject the board T20 from the mounting space and load the next board T20 into the mounting space.

In the second determination step S7, the control unit 5 may control the waiting time, which is the length of time that the capture unit 21 stops at a position opposite the intended mounting position P1. In this case, if the control unit 5 predicts that the gap dimension Yg between the component T10 to be mounted at the corrected intended mounting position P1 and the already-mounted component T3 will be less than the control threshold, the control unit 5 lengthens the waiting time compared to when the gap dimension Yg is equal to or greater than the control threshold.

Specifically, the drive parameters of the capture unit 21 that are subject to change in the second determination step S7 include the descent speed of the capture unit 21, as well as the time the capture unit 21 waits at top dead center U2 after reaching above the intended mounting position P1, i.e., the wait time at top dead center U2. By lengthening the wait time, the vibration of component T10 can be further damped. If the control unit 5 determines that the predicted value of gap dimension Yg is less than the control threshold, the control unit 5 lengthens the wait time to further dampen the vibration of component T10, and once the vibration of component T10 has sufficiently damped, it again compares the predicted value of gap dimension Yg with the control threshold. Therefore, the control unit 5 can prevent component T10 from contacting or interfering with the mounted component T3 due to the vibration of component T10.

(4) Correction In the correction step S4, the control unit 5 determines the intrusion state of the already-mounted component T3 into the intended mounting area Q1 based on the image captured by the imaging unit 3, and corrects the intended mounting position P1 in accordance with this intrusion state. The image captured by the imaging unit 3 used in this correction of the intended mounting position P1 includes both the component T10 captured by the capture unit 21 located opposite the intended mounting position P1 and the already-mounted component T3.

The correction of the intended mounting position P1 will be explained below with reference to Figures 10 to 13. Note that "correcting the intended mounting position P1" refers to correcting the X and Y coordinates of the intended mounting position P1. Furthermore, the intended mounting position P1 before correction (the initial value of the intended mounting position) may be represented as P1(1), and the intended mounting position P1 after correction may be represented as P1(2).

(4.1) First Correction Example When at least one mounted component T3 on the board T20 is mounted in one of two regions adjacent to the intended mounting position P1 and not mounted in the other region, the control unit 5 preferably corrects the intended mounting position P1 so that a gap is formed between the component T10 and the at least one mounted component T3.

In Figure 10, three lands T22 are formed in a line along the Y-axis direction on the mounting surface T21. A mounted component T34 is mounted on the land T22 located at one end in the Y-axis direction as a mounted component T3. A mounted component T3 is not mounted on the land T22 located in the middle in the Y-axis direction or the land T22 located at the other end in the Y-axis direction. Then, assume that the mounting system 1 mounts component T10 on the middle land T22.

In this case, the control unit 5 predicts, based on the image captured by the imaging unit 3, the gap dimension Yg3 of the gap G3 that will occur between the component T10 and the already-mounted component T34 when the component T10 is mounted at the current intended mounting position P1(1). The intended mounting position P1(1) is the initial value of the intended mounting position P1 and is the intended mounting position P1 before correction. The control unit 5 then compares the predicted value of the gap dimension Yg3 with the correction threshold Ya. The correction threshold Ya is the sum of the dimensional tolerance and mounting deviation value of the component T10. For example, if the one-sided tolerance Yt of the component T10 is +5 μm and the mounting deviation value Ym is 20 μm, the correction threshold Ya is 25 μm.

If the predicted value of the gap dimension Yg3 is greater than or equal to the correction threshold value Ya, the control unit 5 determines that the possibility of interference is low and does not correct the planned mounting position P1 (1), as shown in Figure 10.

If the predicted value of the gap dimension Yg3 is less than the correction threshold Ya, the control unit 5 determines that interference is highly likely, and corrects the intended mounting position P1 so that the gap dimension Yg3 is equal to or greater than the correction threshold Ya. For example, as shown in FIG. 11 , assume that the mounted component T34 is shifted in the Y-axis direction by a mounting deviation value Ym and is approaching the intended mounting position P1(1) of the component T10. In FIG. 11 , the gap dimension Yg3 when the component T10 is mounted at the intended mounting position P1(1) is set to Yg3(1). In this case, the control unit 5 corrects the intended mounting position P1 from P1(1) to P1(2) so that the gap dimension Yg3 matches the correction threshold Ya. The intended mounting position P1(2) is the corrected intended mounting position P1, and is farther from the mounted component T34 in the Y-axis direction than the intended mounting position P1(1). 11, the gap dimension Yg3 when the component T10 is mounted at the intended mounting position P1(2) is Yg3(2), and Yg3(2) = Ya. Note that the intended mounting position P1(2) is the corrected intended mounting position P1. By correcting the intended mounting position P1 from P1(1) to P1(2), the gap dimension Yg3 that occurs between the mounted component T10 and the already-mounted component T34 can be made equal to or greater than the correction threshold value Ya. Therefore, interference between the component T10 and the already-mounted component T34 can be suppressed.

(4.2) Second Correction Example If multiple mounted components T3 are mounted adjacent to the intended mounting position P1 on the board T20, it is preferable that the control unit 5 corrects the intended mounting position P1 so that a gap is formed between the component T10 and each of the multiple mounted components T3.

In particular, if multiple mounted components T3 are mounted adjacent to the intended mounting position P1 on the board T20, the control unit 5 preferably corrects the intended mounting position P1 so that the dimensions of each gap between the component T10 and each of the multiple mounted components T3 are the same. Note that if the dimensions of each gap are within the error due to the mounting accuracy of the mounting system 1, they can be considered to be "the same dimensions."

In Figure 12, three lands T22 are formed in a line along the Y-axis direction on the mounting surface T21. A mounted component T34 is mounted as a mounted component T3 on the land T22 located at one end in the Y-axis direction. A mounted component T35 is mounted as a mounted component T3 on the land T22 located at the other end in the Y-axis direction. A mounted component T3 is not mounted on the land T22 located in the middle in the Y-axis direction. Then, assume that the mounting system 1 mounts a component T10 on the middle land T22.

In this case, the control unit 5 corrects the intended mounting position P1 based on the image captured by the imaging unit 3 so that the gap dimension Yg4 of the gap G4 between the component T10 and the mounted component T34 and the gap dimension Yg5 of the gap G5 between the component T10 and the mounted component T35 are equal to each other.

For example, as shown in Figure 13, if mounted components T34 and T35 are each shifted to one end in the Y-axis direction by the mounting deviation value Ym, mounted component T34 will move away from the current intended mounting position P1(1), and mounted component T35 will move closer to the current intended mounting position P1(1). In this case, if component T10 is mounted at the current intended mounting position P1(1), component T10 will be closer to mounted component T35 than to mounted component T34.

Therefore, the control unit 5 corrects the intended mounting position P1 so that the gap dimension Yg4 of the gap G4 between the component T10 and the mounted component T34 and the gap dimension Yg5 of the gap G5 between the component T10 and the mounted component T35 are the same. In FIG. 13, the intended mounting position P1 is corrected from P1(1) to P1(2). The intended mounting position P1(1) is the initial value of the intended mounting position P1 and is the intended mounting position P1 before correction. The intended mounting position P1(2) is the corrected intended mounting position P1, which is farther from the mounted component T35 in the Y-axis direction than the intended mounting position P1(1). By correcting the intended mounting position P1 from P1(1) to P1(2), the gap dimensions Yg4 and Yg5 between the mounted component T10 and the mounted components T34 and T35 can be made the same. Therefore, interference between the component T10 and the mounted components T34 and T35 can be suppressed.

13, when component T10 is mounted at intended mounting position P1(1) before correction, gap dimension Yg50 occurring between component T10 and already-mounted component T35 is smaller than gap dimension Yg40 occurring between component T10 and already-mounted component T34. Specifically, if the adjacent pitch Yp is 40 μm, the one-sided tolerance Yt is +5 μm, and the mounting deviation value Ym is 20 μm, gap dimension Yg40 is 50 μm and gap dimension Yg50 is 10 μm.

On the other hand, when component T10 is mounted at the corrected intended mounting position P1(2), the gap dimension Yg5 that occurs between component T10 and already-mounted component T35 will be the same as the gap dimension Yg4 that occurs between component T10 and already-mounted component T34. Specifically, if the adjacent pitch Yp is 40 μm, the one-sided tolerance Yt is +5 μm, and the mounting deviation value Ym is 20 μm, then the gap dimension Yg4 will be 30 μm and the gap dimension Yg5 will be 30 μm.

(4.3) Third Correction Example In the above-described second correction example, if multiple mounted components T3 are mounted adjacent to the intended mounting position P1 on the board T20, the control unit 5 may correct the intended mounting position P1 so that the dimensions of the gaps between the component T10 and each of the multiple mounted components T3 are different from each other. That is, in FIG. 13 , the control unit 5 corrects the intended mounting position P1 so that the gap dimension Yg5 occurring between the component T10 and the mounted component T35 and the gap dimension Yg4 occurring between the component T10 and the mounted component T34 are different from each other.

(5) Mounting Abort The above-mentioned abort step S9 will be described with reference to FIG.

In Figure 14, three lands T22 are formed in a line along the Y-axis direction on the mounting surface T21. A mounted component T34 is mounted as a mounted component T3 on the land T22 located at one end in the Y-axis direction. A mounted component T35 is mounted as a mounted component T3 on the land T22 located at the other end in the Y-axis direction. A mounted component T3 is not mounted on the land T22 located in the middle in the Y-axis direction. Then, assume that the mounting system 1 mounts component T10 on the middle land T22.

In Figure 14, mounted component T34 and mounted component T35 are each shifted by a mounting deviation value Ym in the direction in which they approach each other in the Y-axis direction. Therefore, the distance between mounted component T34 and mounted component T35 in the Y-axis direction becomes narrower. In this case, too, the control unit 5 corrects the intended mounting position P1 based on the image captured by the imaging unit 3 so that the gap dimension Yg4 of the gap G4 between component T10 and mounted component T34 and the gap dimension Yg5 of the gap G5 between component T10 and mounted component T35 are equal to each other.

However, because the gap between mounted component T34 and mounted component T35 is narrow, even if the corrected intended mounting position P1 is applied, the gap dimensions Yg4 and Yg5 are below the predetermined abort threshold. Specifically, if the adjacent pitch Yp is 40 μm, the one-sided tolerance Yt is +5 μm, and the mounting deviation value Ym is 20 μm, the gap dimensions Yg4 and Yg5 are each 10 μm. Here, if the abort threshold is set to 11 μm, the gap dimensions Yg4 and Yg5 are each below the abort threshold. Therefore, the control unit 5 determines that component T10 cannot be mounted at the corrected intended mounting position P1 even if the descent speed of the capture unit 21 is slower than the normal speed, and aborts the mounting of this component T10.

(6) Modifications (6.1) First Example of Imaging Unit Fig. 15 shows a first modification of the imaging unit 3. The imaging unit 3 is attached to the lower end of the bracket 240. The upper end of the bracket 240 is attached to the head body 23. In this way, the imaging unit 3 is attached to the mounting head 2, and the mounting head 2 and imaging unit 3 move simultaneously.

The imaging unit 3 in Figure 15 has two mobile cameras 3a and 3b that move together with the mounting head 2. Mobile camera 3a is attached to mounting piece 240a of bracket 240, and mobile camera 3b is attached to mounting piece 240b of bracket 240. Mounting piece 240a extends in the X-axis direction, and mounting piece 240b extends in the Y-axis direction.

The mobile camera 3a has an imaging optical axis Ax1 that extends in the Y-axis direction when viewed in a plan view from the Z-axis direction. The imaging optical axis Ax1 is inclined with respect to the perpendicular line (a straight line along the Z-axis) to the mounting surface T21 of the substrate T20. In other words, the mobile camera 3a is fixed to the mounting piece 240a in an orientation such that its imaging optical axis Ax1 is inclined with respect to the perpendicular line to the mounting surface T21.

Moving camera 3b has an imaging optical axis Ax2 that extends in the X-axis direction when viewed in a plan view from the Z-axis direction. The imaging optical axis Ax2 is inclined with respect to the perpendicular line (a straight line along the Z-axis) to the mounting surface T21 of the substrate T20. In other words, moving camera 3b is fixed to mounting piece 240b in an orientation such that its imaging optical axis Ax2 is inclined with respect to the perpendicular line to the mounting surface T21.

The imaging optical axis Ax1 of the mobile camera 3a and the imaging optical axis Ax2 of the mobile camera 3b are perpendicular to each other in a planar view from the Z-axis direction and intersect at a point on the mounting surface T21. The imaging area R1 of the mobile camera 3a and the imaging area R2 of the mobile camera 3b are each an area that includes the bottom dead center U1 located directly below the capture unit 21 when the capture unit 21 is located on the mounting surface T21. Furthermore, when the capture unit 21 is located on the mounting surface T21, each imaging area R1, R2 includes not only the planned mounting area Q1 of the component T10, but also at least a portion of the already-mounted component T3 that is mounted adjacent to the planned mounting area Q1.

Then, the control unit 5 determines the intrusion state of the mounted component T3 into the intended mounting area Q1 based on the images captured by the mobile camera 3a and the images captured by the mobile camera 3b, and corrects the intended mounting position P1 according to the intrusion state.

16 shows a second modified example of the imaging unit 3. The imaging unit 3 is attached to the underside of the head body 23. That is, the imaging unit 3 is attached to the mounting head 2, and the mounting head 2 and the imaging unit 3 move simultaneously.

The imaging unit 3 in Figure 16 includes two mobile cameras 3c and 3d. The mobile cameras 3c and 3d are so-called stereo cameras arranged side by side along the Y-axis direction. The imaging area of mobile camera 3c and the imaging area of mobile camera 3d are each an area that includes the bottom dead center U1 located directly below the capture unit 21 when the capture unit 21 is located on the mounting surface T21. Furthermore, when the capture unit 21 is located on the mounting surface T21, each imaging area includes not only the planned mounting area Q1 of component T10, but also at least a portion of the already-mounted component T3 that is mounted adjacent to the planned mounting area Q1.

Then, the control unit 5 determines the intrusion state of the mounted component T3 into the intended mounting area Q1 based on the images captured by the mobile camera 3c and the images captured by the mobile camera 3d, and corrects the intended mounting position P1 according to the intrusion state.

(7) Other Modifications The image captured by the imaging unit 3 may include at least one of the tip (bottom end) of the capture unit 21 and the component T10 captured by the capture unit 21, as well as the mounted component T3.

For example, the image captured by the imaging unit 3 may capture the bottom end (tip) of the capture unit 21, but not the component T10 captured by the capture unit 21. In this case, the control unit 5 determines the offset of the component T10 relative to the capture unit 21 based on the image captured by the fixed camera 7. The control unit 5 can then determine the position of the component T10 by reflecting the offset of the component T10 in the position of the capture unit 21. As a result, the control unit 5 can predict the gap dimension Yg between the component T10 and the mounted component T3 adjacent to the component T10.

In addition, the configurations described in the above-mentioned embodiments and each variant example can be applied in appropriate combinations.

Furthermore, the relative positions of the capture unit 21 and the second object T2, such as the substrate T20, are not limited to a configuration in which they face each other in the vertical direction along the Z axis. In other words, the relative positions of the capture unit 21 and the second object T2, such as the substrate T20, may be other configurations, such as a configuration in which they face each other in the horizontal direction.

(8) Summary A mounting system (1) according to a first aspect of the embodiment includes a mounting head (2), an imaging unit (3), a drive unit (4), and a control unit (5). The mounting head (2) has a capture unit (21) capable of capturing a first object (T1) and movable toward a second object (T2), and mounts the first object (T1) at a planned mounting position (P1) on a mounting surface (T21) of the second object (T2). The imaging unit (3) is provided on the mounting head (2) and captures an image of an imaging region (R1, R2) including at least one of the tip (lower end) of the capture unit (21) and a region facing the capture unit (21) in the movement direction (downward) of the capture unit (21). The drive unit (4) drives the mounting head (2) to move the mounting head (2). The control unit (5) controls the drive unit (4) and the mounting head (2) so that the capture unit (21) can mount the first object (T1) at the planned mounting position (P1). The control unit (5) determines the intrusion state of at least one mounted component (T3) already mounted on the second object (T2) into the planned mounting region (Q1) including the planned mounting position (P1) based on the imaging result of the imaging unit (3), and corrects the planned mounting position (P1) in accordance with the intrusion state.

The above-mentioned mounting system (1) can reduce the time required for mounting and improve productivity.

In the mounting system (1) of the second aspect of the embodiment, in the first aspect, it is preferable that the control unit (5) corrects the intended mounting position (P1) so that a gap (G3 to G5) is formed between the first object (T1) and the at least one mounted component (T3) if at least one mounted component (T3) on the second object (T2) is mounted in one of two areas adjacent to the intended mounting position (P1) and not in the other area.

The above-mentioned mounting system (1) can reduce the possibility of the first object (T1) interfering with an adjacent mounted component (T3).

In a mounting system (1) of a third aspect of the embodiment, in the first aspect, there are multiple mounted components (T3). If multiple mounted components (T3) are mounted adjacent to the intended mounting position (P1) on the second object (T2), the control unit (5) preferably corrects the intended mounting position (P1) so that gaps (G4, G5) are formed between the first object (T1) and each of the multiple mounted components (T3).

The above-mentioned mounting system (1) can reduce the possibility of the first object (T1) interfering with an adjacent mounted component (T3).

In the mounting system (1) of the fourth aspect of the embodiment, in the third aspect, if multiple mounted components (T3) are mounted adjacent to the intended mounting position (P1) on the second object (T2), it is preferable that the control unit (5) corrects the intended mounting position (P1) so that the dimensions (Yg4, Yg5) of each gap (G4, G5) between the first object (T1) and each of the multiple mounted components (T3) are the same.

The above-mentioned mounting system (1) can reduce the possibility of the first object (T1) interfering with adjacent mounted components (T3) by making the dimensions (Yg4, Yg5) of each gap (G4, G5) between the first object (T1) and each of the multiple mounted components (T3) the same.

In the mounting system (1) of the fifth aspect of the embodiment, in the third aspect, if multiple mounted components (T3) are mounted adjacent to the intended mounting position (P1) on the second object (T2), it is preferable that the control unit (5) corrects the intended mounting position (P1) so that the dimensions (Yg4, Yg5) of each gap (G4, G5) between the first object (T1) and each of the multiple mounted components (T3) are different from each other.

The above-mentioned mounting system (1) can reduce the possibility of the first object (T1) interfering with adjacent mounted components (T3) even if the dimensions (Yg4, Yg5) of each gap (G4, G5) between the first object (T1) and each of the multiple mounted components (T3) are different from each other.

In a sixth aspect of the mounting system (1) according to any one of the first to fifth aspects, the imaging results of the imaging unit (3) preferably include at least one of the capture unit (21) and the first object (T1) captured by the capture unit (21), and at least one mounted component (T3). The control unit (5) determines the intrusion state based on the dimensions of the gaps (G3 to G5) between the first object (T1) and at least one mounted component (T3) determined from the imaging results. If the dimensions (Yg3 to Yg5) of the gaps (G3 to G5) are less than a correction threshold, the control unit (5) corrects the intended mounting position (P1) so that the dimensions (Yg3 to Yg5) of the gaps (G3 to G5) are equal to or greater than the correction threshold.

The above-mentioned mounting system (1) can reduce the possibility of the first object (T1) interfering with an adjacent mounted component (T3) by setting the dimensions (Yg3 to Yg5) of the gaps (G3 to G5) to be equal to or greater than the correction threshold.

In the mounting system (1) of the seventh aspect of the embodiment, in any one of the first to sixth aspects, the control unit (5) controls the movement speed of the capture unit (21), and if it is predicted that the dimension (Yg3 to Yg5) of the gap (G3 to G5) between the first object (T1) to be mounted at the corrected intended mounting position (P1) and at least one mounted component (T3) will be less than the control threshold, it is preferable to slow down the movement speed of the capture unit (21) compared to when the dimension (Yg3 to Yg5) of the gap (G3 to G5) is equal to or greater than the control threshold.

The above-mentioned mounting system (1) can reduce the possibility of the first object (T1) interfering with an adjacent mounted component (T3).

In the mounting system (1) of the eighth aspect of the embodiment, in any one of the first to seventh aspects, the control unit (5) controls the waiting time, which is the length of time that the capture unit (21) stops at a position opposite the intended mounting position (P1), and if it is predicted that the dimensions (Yg3 to Yg5) of the gap (G3 to G5) between the first object (T1) to be mounted at the corrected intended mounting position (P1) and at least one mounted component (T3) will be less than the control threshold, it is preferable to lengthen the waiting time compared to when the dimensions (Yg3 to Yg5) of (G3 to G5) are equal to or greater than the control threshold.

The above-mentioned mounting system (1) can reduce the possibility of the first object (T1) interfering with an adjacent mounted component (T3).

In the mounting system (1) of the ninth aspect of the embodiment, in any one of the first to eighth aspects, it is preferable that the control unit (5) cancels the mounting of the first object (T1) on the second object (T2) when it is predicted that interference will occur between the first object (T1) to be mounted at the corrected intended mounting position (P1(2)) and at least one mounted component (T3).

The above-mentioned mounting system (1) can prevent the first object (T1) from interfering with an adjacent mounted component (T3).

In the mounting system (1) of the tenth aspect of the embodiment, in any one of the first to ninth aspects, it is preferable that the imaging area includes the bottom dead center (U1), which is the lower limit position of the capture section (21).

The above-mentioned mounting system (1) can reduce the possibility of the descending first object (T1) interfering with the mounted component (T3).

The mounting method of an eleventh aspect of the present embodiment is a mounting method performed by a mounting system (1) including a mounting head (2), an imaging unit (3), a drive unit (4), and a control unit (5). The mounting head (2) has a capture unit (21) capable of capturing a first object (T1) and movable toward a second object (T2), and mounts the first object (T1) at a planned mounting position (P1) on a mounting surface (T21) of the second object (T2). The imaging unit (3) is provided on the mounting head (2). The drive unit (4) drives the mounting head (2) to move the mounting head (2). The control unit (5) controls the drive unit (4) and the mounting head (2) so that the capture unit (21) can mount the first object (T1) at the planned mounting position (P1). The mounting method includes an imaging process (S3) and a correction process (S4). In the imaging step (S3), the imaging unit (3) images imaging regions (R1, R2) including at least one of the tip (lower end) of the capture unit (21) and a region facing the capture unit (21) in the movement direction (downward) of the capture unit (21). In the correction step (S4), the control unit (5) determines, based on the imaging result of the imaging unit (3), an intrusion state of at least one mounted component (T3) already mounted on the second object (T2) into a planned mounting region (Q1) including a planned mounting position (P1), and corrects the planned mounting position (P1) in accordance with the intrusion state.

The above-mentioned implementation method can reduce the time required for implementation and improve productivity.

REFERENCE SIGNS LIST 1 Mounting system 2 Mounting head 21 Capturing unit 3 Imaging unit 4 Driving unit 5 Control unit G3 to G5 Gap P1 Planned mounting position Q1 Planned mounting area R1, R2 Imaging area T1 First object T2 Second object T21 Mounting surface T3 Mounted component U1 Bottom dead center (limit position)
Yg3 to Yg5: Gap dimensions S3: Imaging process S4: Correction process

Claims (10)

a mounting head having a capture unit capable of capturing a first object and movable toward a second object, the mounting head mounting the first object at a predetermined mounting position on a mounting surface of the second object;
an imaging unit provided in the mounting head, which captures an imaging area including at least one of the tip of the capture unit and an area facing the capture unit in the movement direction of the capture unit;
a drive unit that drives the mounting head to move the mounting head;
a control unit that controls the drive unit and the mounting head so that the capture unit can mount the first object at the intended mounting position,
the control unit determines an intrusion state of at least one mounted component already mounted on the second object with respect to a mounting planned area including the mounting planned position based on the imaging result of the imaging unit, and corrects the mounting planned position in accordance with the intrusion state ;
The control unit
controlling a waiting time that is a length of time during which the capture unit stops at a position facing the intended mounting position;
when it is predicted that the dimension of a gap between the first object to be mounted at the corrected intended mounting position and the at least one mounted component will be less than a control threshold, the waiting time is made longer than when the dimension of the gap is equal to or greater than the control threshold;
Implementation system. the control unit corrects the intended mounting position so that a gap is formed between the first object and the at least one mounted component, when the at least one mounted component is mounted in one of two areas adjacent to the intended mounting position on the second object and is not mounted in the other area;
The mounting system of claim 1 . the mounted components are plural,
the control unit corrects the intended mounting positions so that a gap is formed between the first object and each of the plurality of mounted components when the plurality of mounted components are mounted adjacent to the intended mounting positions on the second object.
The mounting system of claim 1 . the control unit, if the plurality of mounted components are mounted adjacent to the intended mounting positions on the second object, corrects the intended mounting positions so that dimensions of each gap between the first object and each of the plurality of mounted components become the same.
The mounting system of claim 3. the control unit, if the plurality of mounted components are mounted adjacent to the intended mounting positions on the second object, corrects the intended mounting positions so that dimensions of gaps between the first object and each of the plurality of mounted components are different from one another.
The mounting system of claim 3. an imaging result of the imaging unit includes at least one of the capture unit and the first object captured by the capture unit, and the at least one mounted component;
The control unit
determining the intrusion state based on a dimension of a gap between the first object and the at least one mounted component obtained from the imaging result;
If the dimension of the gap is less than a correction threshold, correct the intended mounting position so that the dimension of the gap is equal to or greater than the correction threshold.
6. The mounting system according to claim 1. The control unit
Controlling the moving speed of the capture unit;
when it is predicted that the dimension of a gap between the first object to be mounted at the corrected intended mounting position and the at least one mounted component will be less than a control threshold, the moving speed of the capture unit is slower than when the dimension of the gap is equal to or greater than the control threshold.
7. The mounting system according to claim 1. the control unit, when it is predicted that the first object to be mounted at the corrected intended mounting position will interfere with the at least one mounted component, suspends mounting of the first object on the second object.
8. The mounting system of claim 1. The imaging area includes a bottom dead center, which is a lower limit position of the capturing unit.
9. The mounting system of claim 1. a mounting head having a capture unit capable of capturing a first object and movable toward a second object, the mounting head mounting the first object at a predetermined mounting position on a mounting surface of the second object;
an imaging unit provided in the mounting head;
a drive unit that drives the mounting head to move the mounting head;
a control unit that controls the drive unit and the mounting head so that the capture unit can mount the first object at the intended mounting position,
an imaging step in which the imaging unit images an imaging area including at least one of the tip of the capture unit and an area facing the capture unit in the moving direction of the capture unit;
a correction step in which the control unit determines an intrusion state of at least one mounted component already mounted on the second object with respect to a mounting planned area including the mounting planned position based on an imaging result of the imaging unit, and corrects the mounting planned position in accordance with the intrusion state;
and a standby time control step of, when the control unit predicts that the dimension of a gap between the first object to be mounted at the corrected intended mounting position and the at least one mounted component will be less than a control threshold, lengthening a standby time that is a length of time that the capture unit stops at a position facing the intended mounting position, compared to when the dimension of the gap is equal to or greater than the control threshold.
How to implement it.