JP7575864B2

JP7575864B2 - Manufacturing method of electrode-embedded member

Info

Publication number: JP7575864B2
Application number: JP2019077302A
Authority: JP
Inventors: 優棋薮花
Original assignee: NGK Spark Plug Co Ltd
Current assignee: Niterra Co Ltd
Priority date: 2019-04-15
Filing date: 2019-04-15
Publication date: 2024-10-30
Anticipated expiration: 2039-04-15
Also published as: JP2020177735A

Description

本発明は、セラミックス製の基体の内部に電極が埋設された電極埋設部材の製造方法に関する。電極埋設部材は、例えば、半導体製造装置に組み込まれるセラミックス製ヒーターまたは静電チャックとして用いられる。 The present invention relates to a method for manufacturing an electrode-embedded member in which an electrode is embedded inside a ceramic base. The electrode-embedded member is used, for example, as a ceramic heater or electrostatic chuck incorporated into semiconductor manufacturing equipment.

従来、窒化アルミニウム（ＡｌＮ）等のセラミックスからなる板状の基体の内部に金属電極（内部電極）を埋設して構成された電極埋設部材が知られている。この電極埋設部材においては、セラミックス製の基体に機械加工によって穴（端子穴）を形成し、この穴に基体内部の金属電極を露出させ、当該穴に円柱状の金属端子を挿入して、金属端子の先端面を基体内部の金属電極にロウ付けしている。 Conventionally, there is known an electrode-embedded member that is configured by embedding a metal electrode (internal electrode) inside a plate-shaped base made of ceramics such as aluminum nitride (AlN). In this electrode-embedded member, a hole (terminal hole) is formed in the ceramic base by machining, the metal electrode inside the base is exposed in this hole, a cylindrical metal terminal is inserted into the hole, and the tip surface of the metal terminal is brazed to the metal electrode inside the base.

電極埋設部材は、例えば半導体製造装置（エッチング装置、ＣＶＤ装置等）に組み込まれて、半導体ウェハの静電チャックや加熱のために使用されるものであり、使用環境下で高温に繰り返しさらされることがある。 Electrode-embedded members are incorporated, for example, into semiconductor manufacturing equipment (etching equipment, CVD equipment, etc.) and used for electrostatic chucking and heating of semiconductor wafers, and may be repeatedly exposed to high temperatures in the operating environment.

特許文献１によれば、従来の電極埋設部材に対して、室温と６００℃との間での熱サイクル試験、及び６００℃での長期間の保持試験を行ったところ、金属端子用の穴を画定する基体の内側面にクラックが発生することがあった。そのようなクラック発生への対策として、特許文献１では、電極埋設部材の製造時に基体に残留する応力を減少させ、基体に発生するクラックを抑える技術が提案されている。 According to Patent Document 1, when a conventional electrode-embedded member was subjected to a thermal cycle test between room temperature and 600°C, and a long-term holding test at 600°C, cracks were sometimes generated on the inner surface of the base that defines the hole for the metal terminal. As a measure against such cracks, Patent Document 1 proposes a technology that reduces the stress remaining in the base during the manufacture of the electrode-embedded member, thereby suppressing the generation of cracks in the base.

また、特許文献２には、従来のセラミックス部材（電極埋設部材）の製造方法が開示されている。図９及び図１０は、この従来の製造方法を模式的に示しており、この従来方法は、窒化アルミニウム（ＡｌＮ）焼結体１００の上に、導体１０１と、タングステンと窒化アルミニウム粉末との混合物を加圧したペレットからなる接続導体１０２を載せ、その上に、焼成処理後に基体１０３を形成する窒化アルミニウムの原料粉を充填後、ホットプレスで焼結する工程と、接続導体１０２を露出させる穴（端子穴）１０４を形成する機械加工を行った後、接続導体１０２の露出部に外部金属端子１０５を、ロウ付け部１０６によって接続する工程とを含んでいる。 Patent Document 2 also discloses a conventional method for manufacturing a ceramic member (electrode-embedded member). Figures 9 and 10 show a schematic diagram of this conventional manufacturing method, which includes the steps of placing a conductor 101 and a connecting conductor 102 made of a pellet of a mixture of tungsten and aluminum nitride powder on an aluminum nitride (AlN) sintered body 100, filling the aluminum nitride raw material powder that will form a base body 103 after firing, and sintering the resulting body by hot pressing, and performing machining to form a hole (terminal hole) 104 that exposes the connecting conductor 102, and then connecting an external metal terminal 105 to the exposed part of the connecting conductor 102 by a brazing part 106.

特許３７７６４９９号公報Patent No. 3776499 特許４３７４０９６号公報Patent No. 4374096

ところが、特許文献２の製造方法によってセラミックス部材（電極埋設部材）を製造する場合、ホットプレス時に、窒化アルミニウム（ＡｌＮ）焼結体１００と、窒化アルミニウムの原料粉（焼成処理後に基体１０３となる）の収縮率が異なり、その結果、接続導体１０２と、窒化アルミニウムの原料粉の焼成によって形成された基体１０３との界面(特に接続導体１０２の縁部)に、予期しない残留応力が働き、クラックが発生することがあった。このクラックは、窒化アルミニウムの原料粉の焼結処理により形成された基体１０３、焼成による一体化処理に先立って準備されていた窒化アルミニウム焼結体１００、及び／または接続導体１０２において発生することがあった。 However, when manufacturing a ceramic member (electrode-embedded member) using the manufacturing method of Patent Document 2, the shrinkage rates of the aluminum nitride (AlN) sintered body 100 and the aluminum nitride raw material powder (which becomes the base 103 after sintering) differ during hot pressing, and as a result, unexpected residual stress may act on the interface (particularly the edge of the connecting conductor 102) between the connecting conductor 102 and the base 103 formed by sintering the aluminum nitride raw material powder, causing cracks to occur. These cracks may occur in the base 103 formed by sintering the aluminum nitride raw material powder, the aluminum nitride sintered body 100 that was prepared prior to the integration process by sintering, and/or the connecting conductor 102.

そのため、ホットプレス等を用いた焼成処理時において、接続部材（接続導体）と、その周囲の窒化アルミニウム（ＡｌＮ）等のセラミックス材料との収縮率の差を緩和しつつ、線膨張係数差（熱膨張係数差）の変化を緩和することによって、接続部材の縁部に集中する応力を小さくし、クラックの抑制を図る必要があった。 Therefore, during firing using a hot press or the like, it was necessary to reduce the stress concentrated at the edge of the connection member and suppress cracks by mitigating the difference in the shrinkage rate between the connection member (connection conductor) and the surrounding ceramic material such as aluminum nitride (AlN) while mitigating the change in the difference in linear expansion coefficient (difference in thermal expansion coefficient).

特に、接続部材（接続導体）を、タングステン等の金属材料と窒化アルミニウム（ＡｌＮ）等のセラミックス材料との混合物で形成する場合には、金属材料のみで形成する場合に比べて、加圧焼成時に接続部材においてクラックが発生し易いという傾向がある。この傾向（接続部材におけるクラックの発生し易さ）は、加圧焼成前の接続部材の成形体にバインダーを含ませていない場合において特に顕著である。なお、製造工程上の便宜を考慮すれば、バインダー無しの接続部材の成形体を使用したいという要請がある。すなわち、接続部材の成形体に含まれるバインダーの量によっては、Ｎ_２雰囲気での追加の脱脂工程が必要となり、製造工程が複雑化するという問題がある。 In particular, when the connection member (connection conductor) is formed of a mixture of a metal material such as tungsten and a ceramic material such as aluminum nitride (AlN), cracks tend to occur more easily in the connection member during pressure firing than when the connection member is formed of only a metal material. This tendency (ease of cracks occurring in the connection member) is particularly noticeable when the connection member molded body before pressure firing does not contain a binder. In addition, in consideration of the convenience of the manufacturing process, there is a demand to use a connection member molded body without a binder. In other words, depending on the amount of binder contained in the connection member molded body, an additional degreasing process in a _N2 atmosphere is required, which causes a problem of complicating the manufacturing process.

また、特許文献２の製造方法の場合、接続部材（接続導体）の上に窒化アルミニウム（ＡｌＮ）粉末を充填してホットプレス処理を行うものであるため、ホットプレス処理の際に、接続部材に対して比較的大きな圧力が加えられる。そして、接続部材に加えられた圧力が、接続部材の変形によって電極に伝達され、これにより電極が変形し、その平坦度が劣化するという問題があった。 In addition, in the case of the manufacturing method of Patent Document 2, aluminum nitride (AlN) powder is filled on the connection member (connection conductor) and then hot pressing is performed, so a relatively large pressure is applied to the connection member during the hot pressing process. The pressure applied to the connection member is then transmitted to the electrode through deformation of the connection member, which causes the electrode to deform and deteriorates its flatness.

本発明は、以上の点に鑑み、窒化アルミニウム（ＡｌＮ）等のセラミックス製の基体の中に電極及びこの電極と電気的に接続した接続部材を埋設してなる電極埋設部材を製造する際に、電極埋設部材を構成する材料の内部にクラックや残留応力が発生することを抑制または防止し、或いは電極が変形することを抑制または防止することができる電極埋設部材の製造方法を提供することを目的とする。 In view of the above, the present invention aims to provide a method for manufacturing an electrode-embedded member that can suppress or prevent the occurrence of cracks or residual stress inside the material that constitutes the electrode-embedded member, or suppress or prevent the electrode from deforming, when manufacturing the electrode-embedded member that is formed by embedding an electrode and a connection member electrically connected to the electrode in a ceramic base such as aluminum nitride (AlN).

［１］上記目的を達成するため、本発明は、窒化アルミニウム製の基体の中に電極及び前記電極と電気的に接続したタングステンと窒化アルミニウムとを含む接続部材を埋設してなる電極埋設部材の製造方法において、
窒化アルミニウム成形体を脱脂して作製した窒化アルミニウム製の第１脱脂体と、
前記電極と、
窒化アルミニウム粉末とタングステンの粉末から作製した前記接続部材の未焼成体と、
前記接続部材の未焼成体が収容される穴部を有し、窒化アルミニウム成形体を脱脂して作製した窒化アルミニウム製の第２脱脂体と、
を順に積層して積層体を構成し、
前記積層体を加圧焼成することによって、一体化してなる電極埋設部材を製造することを特徴とする。 [1] In order to achieve the above object, the present invention provides a method for manufacturing an electrode-embedded member, comprising embedding an electrode and a connection member containing tungsten and aluminum nitride electrically connected to the electrode in an aluminum nitride substrate, the method comprising the steps of:
a first degreased body made of aluminum nitride produced by degreasing an aluminum nitride molded body;
The electrode;
an unsintered body of the connection member made of aluminum nitride powder and tungsten powder;
a second degreased body made of aluminum nitride and having a hole in which the unsintered body of the connection member is accommodated, the second degreased body being produced by degreasing an aluminum nitride molded body;
are laminated in order to form a laminate,
The laminate is pressurized and sintered to produce an integrated electrode-embedded member.

上記特徴を備えた本発明の電極埋設部材の製造方法によれば、加圧焼成時に、第１脱脂体の部分と第２脱脂体の部分は同時に収縮する。そのため、加圧焼成時において、第１脱脂体と第２脱脂体の接合界面近傍での収縮率差や線膨張係数差（熱膨張係数差）に起因するクラックや残留応力の発生を抑制または防止することができる。 According to the manufacturing method of the electrode-embedded member of the present invention having the above-mentioned characteristics, the first degreased body and the second degreased body shrink simultaneously during pressure firing. Therefore, during pressure firing, it is possible to suppress or prevent the occurrence of cracks and residual stress caused by the difference in shrinkage rate and the difference in linear expansion coefficient (difference in thermal expansion coefficient) near the bonding interface between the first degreased body and the second degreased body.

また、未焼成体からなる接続部材は、電極埋設部材の基体を構成する少なくとも１種のセラミックス成分からなるセラミックス粉末と金属の粉末から作製されているため、未焼成体の接続部材の線膨張係数（熱膨張係数）は、電極の線膨張係数（熱膨張係数）とセラミックス材料の線膨張係数（熱膨張係数）の中間の値をとり、接続部材とセラミックス材料の界面の線膨張係数（熱膨張係数）の変化が緩和される。これにより、クラックや残留応力の発生を抑制または防止することができる。 In addition, since the connecting member made of the unsintered body is made of ceramic powder consisting of at least one ceramic component that constitutes the base of the electrode-embedded member and metal powder, the linear expansion coefficient (thermal expansion coefficient) of the connecting member made of the unsintered body is an intermediate value between the linear expansion coefficient (thermal expansion coefficient) of the electrode and the linear expansion coefficient (thermal expansion coefficient) of the ceramic material, and the change in the linear expansion coefficient (thermal expansion coefficient) of the interface between the connecting member and the ceramic material is mitigated. This makes it possible to suppress or prevent the occurrence of cracks and residual stress.

さらに、接続部材の未焼成体は、予め第２脱脂体に形成された穴部に挿入されている。これにより、加圧焼成時にセラミックス材料と同時に接続部材の未焼成体が収縮する。接続部材として従来用いられていた焼結金属からなるバルク体を埋め込む場合は加圧焼成時にバルク体の剛性がその周囲に比べて高いために圧縮応力が選択的にバルク体に作用する。その結果、接続部材にクラック（破損）が発生する原因となっていた。そこで、接続部材の未焼成体を用いることで焼成時に接続部材の焼結がその周囲のセラミックス材料と同時期に進行するようにしつつ、接続部材の未焼成体を予め第２脱脂体に形成された穴部に挿入することで接続部材が選択的に強い圧縮力を受けることを回避でき、接続部材自体の破損を抑制しつつセラミックス材料と一体化させることができる。その結果、接続部材および接続部材からセラミックス素材に進展するクラックを抑制または防止することができる。 Furthermore, the unsintered body of the connection member is inserted into a hole formed in the second degreased body in advance. This causes the unsintered body of the connection member to shrink at the same time as the ceramic material during pressure firing. When a bulk body made of sintered metal, which has been used conventionally as a connection member, is embedded, the stiffness of the bulk body is higher than that of its surroundings during pressure firing, so that compressive stress acts selectively on the bulk body. As a result, this causes cracks (damage) to occur in the connection member. Therefore, by using the unsintered body of the connection member, the sintering of the connection member progresses at the same time as the surrounding ceramic material during firing, while the unsintered body of the connection member is inserted into a hole formed in the second degreased body in advance, it is possible to avoid the connection member being selectively subjected to strong compressive force, and the connection member can be integrated with the ceramic material while suppressing damage to the connection member itself. As a result, it is possible to suppress or prevent cracks from developing in the connection member and from the connection member to the ceramic material.

［２］上記目的を達成するため、本発明は、窒化アルミニウム製の基体の中に電極及び前記電極と電気的に接続したタングステンと窒化アルミニウムとを含む接続部材を埋設してなる電極埋設部材の製造方法において、
開口を有する有底筒状型に窒化アルミニウム粉末を充填して加圧し第１圧粉体を形成する第１圧粉体形成工程と、
前記有底筒状型の中で、前記第１圧粉体の前記有底筒状型の開口側に、窒化アルミニウム粉末とタングステンの粉末から作製した前記接続部材の未焼成体と、前記電極とを配置する電極載置工程と、
前記有底筒状型の中の、前記第１圧粉体、前記電極、及び前記接続部材の未焼成体の前記開口側に前記窒化アルミニウム粉末を充填して加圧し前記第１圧粉体を含んだ第２圧粉体を形成する第２圧粉体形成工程と、
前記電極及び前記接続部材の未焼成体を埋設した前記第２圧粉体を加圧焼成することによって、電極埋設部材を製造する焼結工程と、を備えることを特徴とする。 [2] In order to achieve the above object, the present invention provides a method for manufacturing an electrode-embedded member, comprising embedding an electrode and a connection member containing tungsten and aluminum nitride electrically connected to the electrode in an aluminum nitride substrate, the method comprising the steps of:
a first powder compact forming step of filling an aluminum nitride powder into a bottomed cylindrical mold having an opening and pressing the aluminum nitride powder to form a first powder compact;
an electrode placement step of placing the green body of the connection member made of aluminum nitride powder and tungsten powder and the electrode on an opening side of the bottomed cylindrical mold of the first powder compact in the bottomed cylindrical mold;
a second green compact forming step of filling the aluminum nitride powder into the opening side of the unsintered body of the first green compact, the electrode, and the connection member in the bottomed cylindrical mold, and applying pressure to form a second green compact including the first green compact;
and a sintering step of producing an electrode-embedded member by pressurizing and firing the second powder compact in which the unsintered bodies of the electrodes and the connecting members are embedded.

上記特徴を備えた本発明の電極埋設部材の製造方法によっても、上述した特有の作用効果を奏することができる。 The manufacturing method of the electrode-embedded member of the present invention, which has the above-mentioned characteristics, can also achieve the above-mentioned unique effects.

［３］また、本発明の電極埋設部材の製造方法において、前記接続部材の未焼成体は、成形体、脱脂体、又は仮焼体である。
［４］また、本発明の電極埋設部材の製造方法において、加圧焼成後の前記電極埋設部材の一方の面に、直径が前記接続部材より小さく、かつ、前記接続部材の一部のみを露出させるような端子穴が形成されることを特徴とする。
これにより、上述した特有の作用効果を確実に奏することができる。 [3] In the method for producing an electrode-embedded member of the present invention, the green body of the connection member is a molded body, a degreased body, or a calcined body.
[4] Furthermore, in the manufacturing method of the electrode-embedded member of the present invention, a terminal hole having a diameter smaller than that of the connection member and exposing only a portion of the connection member is formed on one surface of the electrode-embedded member after pressure sintering.
This ensures that the above-mentioned unique effects can be achieved.

本発明による電極埋設部材の製造方法の一実施形態を説明するための模式図である。1A to 1C are schematic diagrams for explaining one embodiment of a method for producing an electrode-embedded member according to the present invention. 本発明による電極埋設部材の製造方法の一実施形態を説明するための模式図である。1A to 1C are schematic diagrams for explaining one embodiment of a method for producing an electrode-embedded member according to the present invention. 本発明による電極埋設部材の製造方法の一実施形態を説明するための他の模式図である。4 is another schematic diagram for explaining an embodiment of the manufacturing method of the electrode-embedded member according to the present invention. FIG. 本発明による電極埋設部材の製造方法の一実施形態を説明するための他の模式図である。4 is another schematic diagram for explaining an embodiment of the manufacturing method of the electrode-embedded member according to the present invention. FIG. 本発明による電極埋設部材の製造方法の一実施形態を説明するためのさらに他の模式図である。10 is yet another schematic diagram for explaining an embodiment of the manufacturing method of an electrode-embedded member according to the present invention. FIG. 本発明による電極埋設部材の製造方法の一実施形態を説明するためのさらに他の模式図である。10 is yet another schematic diagram for explaining an embodiment of the manufacturing method of an electrode-embedded member according to the present invention. FIG. 本発明による電極埋設部材の製造方法の一実施例を説明するための模式図である。1A to 1C are schematic diagrams for explaining an embodiment of a method for manufacturing an electrode-embedded member according to the present invention. 本発明による電極埋設部材の製造方法の一実施例を説明するための模式図である。1A to 1C are schematic diagrams for explaining an embodiment of a method for manufacturing an electrode-embedded member according to the present invention. 本発明による電極埋設部材の製造方法の一実施例を説明するための模式図である。1A to 1C are schematic diagrams for explaining an embodiment of a method for manufacturing an electrode-embedded member according to the present invention. 本発明による電極埋設部材の製造方法の一実施例を説明するための他の模式図である。4A to 4C are other schematic diagrams for explaining an embodiment of the manufacturing method of an electrode-embedded member according to the present invention. 本発明による電極埋設部材の製造方法の一実施例を説明するための他の模式図である。4A to 4C are other schematic diagrams for explaining an embodiment of the manufacturing method of an electrode-embedded member according to the present invention. 本発明による電極埋設部材の製造方法の一実施例を説明するための他の模式図である。4A to 4C are other schematic diagrams for explaining an embodiment of the manufacturing method of an electrode-embedded member according to the present invention. 本発明による電極埋設部材の製造方法の一実施例を説明するためのさらに他の模式図である。10 is still another schematic diagram for explaining an embodiment of a manufacturing method for an electrode-embedded member according to the present invention. FIG. 本発明による電極埋設部材の製造方法の一実施例を説明するためのさらに他の模式図である。10 is still another schematic diagram for explaining an embodiment of a manufacturing method for an electrode-embedded member according to the present invention. FIG. 本発明による電極埋設部材の製造方法の一実施例を説明するためのさらに他の模式図である。10 is still another schematic diagram for explaining an embodiment of a manufacturing method for an electrode-embedded member according to the present invention. FIG. 本発明による電極埋設部材の製造方法の一実施例を説明するためのさらに他の模式図である。10 is still another schematic diagram for explaining an embodiment of a manufacturing method for an electrode-embedded member according to the present invention. FIG. 本発明による電極埋設部材の製造方法の一実施例を説明するためのさらに他の模式図である。10 is still another schematic diagram for explaining an embodiment of a manufacturing method for an electrode-embedded member according to the present invention. FIG. 従来の電極埋設部材の製造方法の一例を説明するための模式図である。1A to 1C are schematic diagrams for explaining an example of a conventional method for manufacturing an electrode-embedded member. 従来の電極埋設部材の製造方法の一例を説明するための模式図である。1A to 1C are schematic diagrams for explaining an example of a conventional method for manufacturing an electrode-embedded member. 従来の電極埋設部材の製造方法の一例を説明するための他の模式図である。11A and 11B are other schematic diagrams for explaining an example of a conventional method for manufacturing an electrode-embedded member. 従来の電極埋設部材の製造方法の一例を説明するための他の模式図である。11A and 11B are other schematic diagrams for explaining an example of a conventional method for manufacturing an electrode-embedded member.

以下、本発明の一実施形態としての電極埋設部材の製造方法について、図面を参照して説明する。なお、図面は、電極埋設部材の主要部、特に内部電極と外部金属端子との接続箇所を模式的（概念的）に示すものである。 The manufacturing method of an electrode-embedded member according to one embodiment of the present invention will be described below with reference to the drawings. Note that the drawings are schematic (conceptual) views of the main parts of the electrode-embedded member, in particular the connection points between the internal electrodes and the external metal terminals.

本実施形態による電極埋設部材の製造方法においては、まず初めに、図１Ａおよび図１Ｂに示したように、セラミックス成形体を脱脂して作製したセラミックス製の第１脱脂体からなる第１部材１と、モリブデン（Ｍｏ）等の金属からなり、高周波電極、接地電極、又は静電吸着用電極として機能する電極２と、未焼成体からなる接続部材３と、セラミックス成形体を脱脂して作製したセラミックス製の第２脱脂体からなる第２部材４と、を準備する。 In the manufacturing method of the electrode-embedded member according to this embodiment, first, as shown in FIG. 1A and FIG. 1B, a first member 1 made of a first degreased ceramic body made by degreasing a ceramic molded body, an electrode 2 made of a metal such as molybdenum (Mo) and functioning as a high-frequency electrode, a ground electrode, or an electrostatic attraction electrode, a connecting member 3 made of an unsintered body, and a second member 4 made of a second degreased ceramic body made by degreasing a ceramic molded body are prepared.

より具体的には、窒化アルミニウム（ＡｌＮ）等のセラミックス材料からなるＣＩＰ体等から切り出して、所定の形状の第１成形体（焼成後に絶縁層となるプレート）を作製し、この第１成形体を脱脂して、第１脱脂体からなる第１部材１を作製する。 More specifically, a first molded body (a plate that will become an insulating layer after firing) of a predetermined shape is produced by cutting out a CIP body or the like made of a ceramic material such as aluminum nitride (AlN), and this first molded body is degreased to produce the first member 1 made of the first degreased body.

同様に、窒化アルミニウム（ＡｌＮ）等のセラミックス材料からなるＣＩＰ体等から切り出して、所定の形状の第２成形体（焼成後に基台となるプレート）を作製し、この第２成形体を脱脂して、第２脱脂体からなる第２部材４を作製する。 Similarly, a second molded body (a plate that will become the base after firing) of a predetermined shape is produced by cutting out a CIP body made of a ceramic material such as aluminum nitride (AlN), and this second molded body is degreased to produce the second member 4 made of the second degreased body.

次に、第１部材（第１脱脂体）１及び第２部材（第２脱脂体）４を加工して、それらの外形を整えると共に、電極２および接続部材（未焼成体）３を収納するための空間を形成する。図１Ａに示したように、第２部材（第２脱脂体）４には、接続部材（未焼成体）３を収納するための穴部５が形成されている。 Next, the first member (first degreased body) 1 and the second member (second degreased body) 4 are processed to adjust their external shapes and to form a space for housing the electrode 2 and the connection member (unsintered body) 3. As shown in FIG. 1A, the second member (second degreased body) 4 has a hole 5 formed therein for housing the connection member (unsintered body) 3.

また、接続部材（未焼成体）３は、電極埋設部材の基体（第１部材１および第２部材４）を構成する少なくとも１種のセラミックス成分からなるセラミックス粉末と金属の粉末から作製した、成形体または脱脂体または仮焼体からなる。例えば、窒化アルミニウム（ＡｌＮ）等のセラミックス原料粉末と、タングステン（Ｗ）等の金属粉末を所定の体積比で混合した後、接続部材３の未焼成体（成形体等）を作製する。なお、セラミックス原料粉末に窒化アルミニウム（ＡｌＮ）が含まれる場合は、必要に応じてイットリア（Ｙ_２Ｏ_３）等の焼結助剤を添加してもよい。 The connection member (unfired body) 3 is made of a compact, degreased body, or calcined body made of a ceramic powder consisting of at least one ceramic component constituting the base (first member 1 and second member 4) of the electrode-embedded member and a metal powder. For example, a ceramic raw material powder such as aluminum nitride (AlN) and a metal powder such as tungsten (W) are mixed in a predetermined volume ratio, and then an unfired body (such as a compact) of the connection member 3 is made. When the ceramic raw material powder contains aluminum nitride (AlN), a sintering aid such as yttria (Y ₂ O ₃ ) may be added as necessary.

次に、第１部材（第１脱脂体）１に電極２を載置し、その上に接続部材（未焼成体）３を載置する。さらに、第２部材（第２脱脂体）４をその上に載置して、図１Ｂに示したように積層体６を構成する。なお、積層体６の積層の順番は、図１Ｂで示す順番と逆にしてもよい。 Next, an electrode 2 is placed on the first member (first degreased body) 1, and a connecting member (unfired body) 3 is placed on top of that. Furthermore, a second member (second degreased body) 4 is placed on top of that to form a laminate 6 as shown in FIG. 1B. Note that the order of stacking the laminate 6 may be reversed from that shown in FIG. 1B.

図１Ｂから分かるように、穴部５の中に収納された接続部材（未焼成体）３と、穴部５を画成する壁面との間には、間隙が形成されている。すなわち、接続部材（未焼成体）３と第２部材（第２脱脂体）４の壁面を形成するセラミックス材料とは接触しておらず、離間している。なお、図１Ｂでは両者の全体が離間した状態（接触部分がない状態）が示されているが、両者の一部が接触する形態でも良い。 As can be seen from FIG. 1B, a gap is formed between the connection member (unsintered body) 3 housed in the hole 5 and the wall surface that defines the hole 5. In other words, the connection member (unsintered body) 3 and the ceramic material that forms the wall surface of the second member (second degreased body) 4 are not in contact with each other but are separated from each other. Note that FIG. 1B shows a state in which the two are entirely separated from each other (a state in which there is no contact), but a form in which only a portion of the two is in contact with each other is also acceptable.

接続部材（未焼成体）３の周囲に形成される間隙の寸法は、典型的には、接続部材３の上下方向においては１００μｍ、横方向においては３００μｍである。 The dimensions of the gap formed around the connecting member (unsintered body) 3 are typically 100 μm in the vertical direction and 300 μm in the horizontal direction of the connecting member 3.

次に、図１Ｂに示した積層体６に対して、一軸加圧焼成（ホットプレス）処理を行う。このように積層体６を加圧焼成することによって、第１部材（第１脱脂体）１、第２部材（第２脱脂体）４、及び接続部材（未焼成体）３が焼結し、図２Ａに示したように、これらの部材が電極２と共に一体化される。焼結後の第１部材１及び第２部材４は、両者が一体となって電極埋設部材の基体７を構成する。加圧焼成前に接続部材３の周囲に存在していた間隙は、焼結後には消失しており、接続部材３は第２部材４と一体化している。 Next, the laminate 6 shown in FIG. 1B is subjected to uniaxial pressure sintering (hot pressing). By pressure sintering the laminate 6 in this manner, the first member (first degreased body) 1, the second member (second degreased body) 4, and the connection member (unsintered body) 3 are sintered, and these members are integrated with the electrode 2 as shown in FIG. 2A. After sintering, the first member 1 and the second member 4 are integrated together to form the base 7 of the electrode-embedded member. The gaps that existed around the connection member 3 before pressure sintering have disappeared after sintering, and the connection member 3 is integrated with the second member 4.

次に、図２Ａに示した焼結後の積層体６に対して、図２Ｂに示したように、一方の面（図中上側の面）より機械加工を施して、端子穴８を形成する。これにより、接続部材３の一部が端子穴８の内部に露出する。ここで、端子穴８の直径は、接続部材３の代表寸法（例えば直径）より小さいことがより望ましい。 Next, as shown in FIG. 2B, one surface (the upper surface in the figure) of the sintered laminate 6 shown in FIG. 2A is machined to form a terminal hole 8. This exposes a part of the connection member 3 inside the terminal hole 8. Here, it is more desirable that the diameter of the terminal hole 8 is smaller than the representative dimension (e.g., diameter) of the connection member 3.

次に、図３Ａに示したように、ロウ材（ロウ付け部９）と端子（外部接続端子）１０を端子穴８の中に挿入し、図３Ｂに示したように、端子１０と接続部材３をロウ付け部９でロウ接合する。ロウ付け部９には、ロウ材の中に埋設されたタングステン（Ｗ）の中間部材９ａとコバールの中間部材９ｂとが含まれている。ロウ材としては、Ａｕ－Ｎｉ系に代表される金ロウやＡｇ－Ｃｕ系に代表される銀ロウが好適である。端子穴８の径は、例えば５ｍｍである。端子１０は、例えば、直径が４．８ｍｍであり、長さが２０ｍｍである。端子１０と、端子穴８を画定する基体７の内側面との間には、隙間が形成されている。隙間の幅は、例えば０．１ｍｍである。端子１０を構成する金属材料としては、典型的にはニッケルがあげられ、その他、コバール等の低熱膨張金属合金、及び／またはチタン、銅またはこれらを主成分とする合金がある。 Next, as shown in FIG. 3A, the brazing material (brazing portion 9) and the terminal (external connection terminal) 10 are inserted into the terminal hole 8, and as shown in FIG. 3B, the terminal 10 and the connection member 3 are brazed at the brazing portion 9. The brazing portion 9 includes an intermediate member 9a of tungsten (W) and an intermediate member 9b of kovar embedded in the brazing material. As the brazing material, gold brazing material represented by Au-Ni system and silver brazing material represented by Ag-Cu system are suitable. The diameter of the terminal hole 8 is, for example, 5 mm. The terminal 10 has, for example, a diameter of 4.8 mm and a length of 20 mm. A gap is formed between the terminal 10 and the inner surface of the base 7 that defines the terminal hole 8. The width of the gap is, for example, 0.1 mm. The metal material constituting the terminal 10 is typically nickel, and other low thermal expansion metal alloys such as kovar, and/or titanium, copper, or alloys mainly composed of these.

なお、本実施形態においては、円柱状の端子１０と円板状の接続部材３とが互いに同心的に配置されて接続されているが、端子１０と接続部材３とは必ずしも同心的に配置する必要はなく、同心位置からずれていても良い。また、端子１０の形状は、円柱状以外の棒状の形状でも良い。また、ロウ付け部９は、その周囲に存在する基体７の材料と接触していても良い。 In this embodiment, the cylindrical terminal 10 and the disk-shaped connecting member 3 are concentrically arranged and connected to each other, but the terminal 10 and the connecting member 3 do not necessarily need to be arranged concentrically and may be shifted from the concentric position. The shape of the terminal 10 may be a rod shape other than a cylindrical shape. The brazing portion 9 may also be in contact with the material of the base body 7 that exists around it.

上述した構成によって、端子（外部金属端子）１０と、基体７の内部に埋設された電極２とが電気的に接続される。なお、接続部材３の形状は、必ずしも円板状に限定されるものではなく、電極２と端子１０とを電気的に接続する上で好適な形状を適宜選択することができる。また、電極２と接続部材３との間の電気的な接続状態を確保するための形態としては、両者を直接的に接触させる形態、または導電性ペーストを使って両者を接着する形態等を採用することができる。 The above-mentioned configuration electrically connects the terminal (external metal terminal) 10 and the electrode 2 embedded inside the substrate 7. The shape of the connection member 3 is not necessarily limited to a disk shape, and any shape suitable for electrically connecting the electrode 2 and the terminal 10 can be selected as appropriate. In addition, the electrical connection between the electrode 2 and the connection member 3 can be ensured by directly contacting the two or by bonding the two using a conductive paste.

なお、接続部材（未焼成体）３を構成する成形体は、バインダーを含まずともＣＩＰ成形が可能である。成形体の強度を高めるためにバインダーを含ませてもよいが、その場合は、バインダーの量によってはＮ_２雰囲気での脱脂が更に追加される。本実施形態の場合、加圧焼成前の第１部材１及び第２部材４がいずれも脱脂体なので、その間に配置される接続部材（未焼成体）３は、バインダー無しのものを使用することが好ましい。 The green body constituting the connection member (unfired body) 3 can be CIP molded even if it does not contain a binder. A binder may be added to increase the strength of the green body, but in that case, degreasing in a _N2 atmosphere is further added depending on the amount of binder. In the case of this embodiment, since the first member 1 and the second member 4 before pressure firing are both degreased bodies, it is preferable to use a connection member (unfired body) 3 without a binder.

また、本実施形態では、電極２が１層である場合の電極埋設部材の製造方法について説明したが、複数層の電極が埋設される場合は、それに応じて複数の脱脂体および複数の接続部材を用いて同様な工程で製作することができる。これについては、本発明の実施例として後述する。 In addition, in this embodiment, the manufacturing method of the electrode-embedded member when the electrode 2 is a single layer has been described, but when multiple layers of electrodes are embedded, the electrode-embedded member can be manufactured in a similar process using multiple degreased bodies and multiple connecting members accordingly. This will be described later as an example of the present invention.

上記構成よりなる本実施形態の電極埋設部材の製造方法によれば、加圧焼成（ホットプレス焼成）時に、第１脱脂体（第１部材１）の部分と第２脱脂体（第２部材４）の部分は同時に収縮する。そのため、加圧焼成時において、第１脱脂体と第２脱脂体の接合界面近傍での収縮率差や線膨張係数差（熱膨張係数差）に起因するクラックや残留応力の発生を抑制または防止することができる。 According to the manufacturing method of the electrode-embedded member of this embodiment having the above configuration, the first degreased body (first member 1) and the second degreased body (second member 4) shrink simultaneously during pressure firing (hot press firing). Therefore, during pressure firing, it is possible to suppress or prevent the occurrence of cracks and residual stress caused by the difference in shrinkage rate and the difference in linear expansion coefficient (difference in thermal expansion coefficient) near the bonding interface between the first degreased body and the second degreased body.

また、本実施形態においては、未焼成体からなる接続部材３が、電極埋設部材の基体７（第１部材１および第２部材４）を構成する少なくとも１種のセラミックス成分からなるセラミックス粉末と金属の粉末から作製されている。このため、未焼成体の接続部材３の線膨張係数（熱膨張係数）は、電極２の線膨張係数（熱膨張係数）とセラミックス材料（ＡｌＮ等）の線膨張係数（熱膨張係数）の中間の値をとり、接続部材３とセラミックス材料の界面の線膨張係数（熱膨張係数）の変化が緩和される。これにより、クラックや残留応力の発生を抑制または防止することができる。 In addition, in this embodiment, the connection member 3 made of an unsintered body is made of ceramic powder made of at least one type of ceramic component that constitutes the base 7 (first member 1 and second member 4) of the electrode-embedded member, and metal powder. Therefore, the linear expansion coefficient (thermal expansion coefficient) of the unsintered connection member 3 is an intermediate value between the linear expansion coefficient (thermal expansion coefficient) of the electrode 2 and the linear expansion coefficient (thermal expansion coefficient) of the ceramic material (AlN, etc.), and the change in the linear expansion coefficient (thermal expansion coefficient) of the interface between the connection member 3 and the ceramic material is mitigated. This makes it possible to suppress or prevent the occurrence of cracks and residual stress.

さらに、接続部材３の未焼成体（成形体等）は、予め第２部材（第２脱脂体）４に形成された穴部５に挿入されており、加圧焼成前において接続部材（未焼成体）３の周囲に間隙が存在する。また、接続部材３の未焼成体は、加圧焼成時にその周囲の脱脂体と同時期に焼結が進行し収縮する。これにより、加圧焼成時のセラミックス材料の収縮によって接続部材３が強い圧縮力を受けることを回避でき、接続部材３自体の破損を抑制しつつセラミックス材料と一体化させることができる。その結果、接続部材３の内部におけるクラック、および接続部材３から窒化アルミニウム（ＡｌＮ）等のセラミックス素材に進展するクラックを、抑制または防止することができる。 Furthermore, the unsintered body (molded body, etc.) of the connection member 3 is inserted into a hole 5 formed in advance in the second member (second degreased body) 4, and a gap exists around the connection member (unsintered body) 3 before pressure firing. In addition, the unsintered body of the connection member 3 undergoes sintering and shrinks at the same time as the surrounding degreased body during pressure firing. This makes it possible to avoid the connection member 3 being subjected to a strong compressive force due to the shrinkage of the ceramic material during pressure firing, and the connection member 3 can be integrated with the ceramic material while suppressing damage to the connection member 3 itself. As a result, cracks inside the connection member 3 and cracks that propagate from the connection member 3 to the ceramic material such as aluminum nitride (AlN) can be suppressed or prevented.

また、接続部材（未焼成体）３を、成形体を仮焼した仮焼体とすることにより、更に強度を高めることができ、加圧焼成工程中での接続部材３の破損をより確実に防ぐことができる。 In addition, by making the connecting member (unsintered body) 3 into a calcined body obtained by calcining the molded body, the strength can be further increased, and damage to the connecting member 3 during the pressure sintering process can be more reliably prevented.

次に、本発明による電極埋設部材の製造方法の他の実施形態について説明する。
上述した実施形態では成形体プレス法を用いたが、本実施形態においては粉末ホットプレス法を用いる。 Next, another embodiment of the method for producing an electrode-embedded member according to the present invention will be described.
In the above-described embodiment, the compact pressing method is used, but in this embodiment, a powder hot pressing method is used.

すなわち、本実施形態による電極埋設部材の製造方法は、開口を有する有底筒状型にセラミックス原料粉末を充填して加圧し第１圧粉体（図１Ａ、１Ｂの第１部材１に対応する）を形成する第１圧粉体形成工程を有する。また、有底筒状型の中で、第１圧粉体の有底筒状型の開口側に、基体（図２Ａ、２Ｂの基体７に対応する）を構成する少なくとも１種のセラミックス成分からなるセラミックス粉末と金属の粉末から作製した接続部材（図１Ａ、１Ｂの接続部材３に対応する）の未焼成体と、電極（図１Ａ、１Ｂの電極２に対応する）とを配置する電極載置工程を有する。また、有底筒状型の中の、第１圧粉体、電極、及び接続部材の未焼成体の開口側にセラミックス原料粉末を充填して加圧し、第１圧粉体を含んだ第２圧粉体を形成する第２圧粉体形成工程を有する。さらに、電極及び接続部材の未焼成体を埋設した第２圧粉体を加圧焼成する焼結工程を備える。 That is, the manufacturing method of the electrode-embedded member according to the present embodiment includes a first green compact forming step of filling a bottomed cylindrical mold having an opening with ceramic raw material powder and pressing it to form a first green compact (corresponding to the first member 1 in Figs. 1A and 1B). In addition, the method includes an electrode placing step of placing an unfired body of a connection member (corresponding to the connection member 3 in Figs. 1A and 1B) made of ceramic powder consisting of at least one ceramic component constituting a base (corresponding to the base 7 in Figs. 2A and 2B) and a metal powder, and an electrode (corresponding to the electrode 2 in Figs. 1A and 1B) on the open side of the bottomed cylindrical mold of the first green compact. In addition, the method includes a second green compact forming step of filling the open side of the first green compact, the electrode, and the unfired body of the connection member in the bottomed cylindrical mold with ceramic raw material powder and pressing it to form a second green compact including the first green compact. In addition, the method includes a sintering step of pressurizing and firing the second green compact in which the unfired bodies of the electrode and the connection member are embedded.

本実施形態においても、上述した実施形態（図１Ａ乃至図３Ｂ）と同様の作用効果を得ることができる。 In this embodiment, the same effects as those of the above-described embodiment (FIGS. 1A to 3B) can be obtained.

（実施例）
以下、上記実施形態の電極埋設部材の製造方法に関する各種の実施例について説明する。以下の実施例に記載の脱脂、焼成、ロウ付けの条件は従前のセラミックス焼結体の製造方法に準拠し、適切な条件の変更を含む。 (Example)
Various examples of the manufacturing method of the electrode-embedded member of the above embodiment will be described below. The conditions of degreasing, firing, and brazing described in the following examples are based on the conventional manufacturing method of a ceramic sintered body, and include appropriate changes to the conditions.

［実施例１］
まず、実施例１として、成形体プレス法を用いて電極埋設部材を製造した例について、図４Ａ乃至図８を参照して説明する。 [Example 1]
First, as Example 1, an example in which an electrode-embedded member was manufactured using a compact pressing method will be described with reference to FIGS. 4A to 8. FIG.

（１）まず、窒化アルミニウム粉末９５質量％、酸化イットリウム粉末５質量％からなる粉末混合物をＣＩＰ成形(圧力１ｔｏｎ／ｃｍ^２)し、成形体のインゴットを得て、これを機械加工した後に脱脂を行うことにより、以下の成形体を作製した。
（i）円板状成形体（第１の脱脂体）２１(焼成後絶縁層となるプレート)（図４Ａ）
直径３４０ｍｍ、厚み５ｍｍ
（ii）円板状成形体（第２の脱脂体）２２(焼成後に中間基台となるプレート) （図４Ｂ）
直径３４０ｍｍ、厚み１０ｍｍ
円板状成形体２２の一方の面に、成形体の中心を共有し、電極を収納するための直径３００ｍｍ、深さ０．１ｍｍの凹部２４を設ける。
更に、端子を形成する所定の位置に、接続部材を収納するための直径８．５ｍｍ、深さ１．１ｍｍの凹部２５を設ける。
（iii)円板状成形体（第３の脱脂体）２３（焼成後に基台となるプレート) （図４Ｃ）
直径３４０ｍｍ、厚み２０ｍｍ
円板状成形体２３の一方の面に、成形体の中心を共有し、電極を収納するための直径３００ｍｍ、深さ０．１ｍｍの凹部２６を設ける。
更に、端子を形成する所定の位置に、接続部材成形体を収納するための直径８．５ｍｍ、深さ１．１ｍｍの凹部２７を設ける。 (1) First, a powder mixture consisting of 95% by mass of aluminum nitride powder and 5% by mass of yttrium oxide powder was subjected to CIP molding (pressure 1 ton/ ^cm2 ) to obtain an ingot of a molded body. This ingot was then machined and degreased to produce the following molded body.
(i) Disc-shaped body (first degreased body) 21 (plate that will become an insulating layer after firing) (FIG. 4A)
Diameter 340mm, thickness 5mm
(ii) Disc-shaped body (second degreased body) 22 (plate that becomes the intermediate base after firing) (FIG. 4B)
Diameter 340mm, thickness 10mm
A recess 24 having a diameter of 300 mm and a depth of 0.1 mm is provided on one surface of the disk-shaped molded body 22, sharing the center of the molded body, for accommodating an electrode.
Furthermore, a recess 25 having a diameter of 8.5 mm and a depth of 1.1 mm is provided at a predetermined position where a terminal is to be formed, for accommodating a connecting member.
(iii) Disc-shaped body (third degreased body) 23 (plate that becomes a base after firing) (FIG. 4C)
Diameter 340mm, thickness 20mm
A recess 26 having a diameter of 300 mm and a depth of 0.1 mm is provided on one surface of the disk-shaped molded body 23, sharing the center of the molded body, for accommodating an electrode.
Furthermore, a recess 27 having a diameter of 8.5 mm and a depth of 1.1 mm for accommodating the connecting member molded body is provided at a predetermined position where the terminal is to be formed.

（２）接続部材成形体の作製
タングステン（Ｗ）粉末及び窒化アルミニウム（ＡｌＮ）粉末９５質量％、酸化イットリウム粉末５質量％からなる粉末混合物をＷの体積比が９０％、８０％、７０％、６０％となるように配合し、これを一軸プレス成型の後、ＣＩＰ成形し、φ８ｍｍ×０．８ｍｍtの接続部材成形体３を作製した。 (2) Production of connecting member molded body A powder mixture consisting of 95 mass% tungsten (W) powder, aluminum nitride (AlN) powder, and 5 mass% yttrium oxide powder was mixed so that the volume ratio of W was 90%, 80%, 70%, and 60%, and this was uniaxially press molded and then CIP molded to produce a connecting member molded body 3 with a size of φ8 mm x 0.8 mmt.

（３）円板状脱脂体２３に電極、接続部材成形体を内装した（図５Ａ）。
（iv）ヒーター電極
モリブデンワイヤーによるメッシュ（線径０．１ｍｍ、平織り、メッシュサイズ＃５０）
これを所定の形状に裁断しヒーター電極２Ａとする。最外径２９４ｍｍ。
（v）電極等の配置
円板上脱脂体２３の直径８．５ｍｍの凹部２７に接続部材成形体３を配置する（図５Ａ）。
その上に、３００ｍｍ凹部にヒーター電極２Ａを収納する（図５Ｂ）。
（vi）円板状脱脂体２２の積層
円板上脱脂体２３のヒーター電極２Ａが埋設された側に、円板状脱脂体２２を積層する（図５Ｃ）。
（vii）円板状脱脂体２１の積層（図６、６Ｂ）
円板状脱脂体２２の直径８．５ｍｍの凹部２５に、上述の接続部材成形体３を配置する（図６Ａ）。
その上の３００ｍｍ凹部２４にヒーター電極と同様のモリブデンワイヤーによるメッシュからなり最外径が３００ｍｍとなるように裁断された高周波電極２Ｂを収納する（図６Ａ）。
その上に円板状脱脂体２１を積層し、積層体(脱脂体)２８を完成させる（図６Ｂ）。 (3) The electrodes and connecting member molded bodies were fitted inside the disk-shaped degreased body 23 (FIG. 5A).
(iv) Heater electrode: Molybdenum wire mesh (wire diameter 0.1 mm, plain weave, mesh size #50)
This is cut into a predetermined shape to form the heater electrode 2A. The maximum outer diameter is 294 mm.
(v) Arrangement of Electrodes, etc. The connection member molded body 3 is arranged in a recess 27 having a diameter of 8.5 mm in the disk-shaped degreased body 23 (FIG. 5A).
On top of that, a heater electrode 2A is placed in a 300 mm recess (FIG. 5B).
(vi) Stacking of Disc-Shaped Degreased Body 22 A disc-shaped degreased body 22 is stacked on the side of the disc-shaped degreased body 23 where the heater electrode 2A is embedded (FIG. 5C).
(vii) Stacking of disk-shaped degreased bodies 21 (FIGS. 6 and 6B)
The above-mentioned connection member molded body 3 is placed in a recess 25 having a diameter of 8.5 mm in the disk-shaped degreased body 22 (FIG. 6A).
In the 300 mm recess 24 above, a high-frequency electrode 2B made of a mesh of molybdenum wire similar to that of the heater electrode and cut to have a maximum outer diameter of 300 mm is placed (FIG. 6A).
A disk-shaped degreased body 21 is layered on top of it to complete a layered body (degreased body) 28 (FIG. 6B).

（４）積層体２６をホットプレス炉に載置してホットプレス焼成した（図７Ａ）。
１０ＭＰａの圧力で、焼成温度１８００℃、焼成時間２時間でホットプレス焼成を行った。 (4) The laminate 26 was placed in a hot press furnace and hot press sintered (FIG. 7A).
The hot press firing was carried out at a pressure of 10 MPa, a firing temperature of 1800° C., and a firing time of 2 hours.

（５）焼成後加工（図７Ｂ）
その後、全面に研削、研磨加工を行い、総厚２５ｍｍ、絶縁層厚さ１．０ｍｍ、表面粗さをＲａ０．４μｍのウェハ載置面を形成した。
セラミック基体裏面側より端子位置に接続部材３に到達するまで穴径φ５．５ｍｍの平底穴加工を行い、端子穴８を形成する。 (5) Post-firing processing (Fig. 7B)
Thereafter, the entire surface was ground and polished to form a wafer-mounting surface with a total thickness of 25 mm, an insulating layer thickness of 1.0 mm, and a surface roughness Ra of 0.4 μm.
A flat-bottom hole having a diameter of φ5.5 mm is drilled from the rear surface of the ceramic substrate to the terminal position, reaching the connecting member 3, to form a terminal hole 8.

（６）外部金属端子接続（図８）
露出した接続部材底面にロウ材（ロウ付け部９）を介して直径５ｍｍ、厚み２ｍｍのタングステンとコバール製の緩衝部材（中間部材９ａ、９ｂ）と直径５ｍｍ長さ３０ｍｍの円柱状Ｎｉ製給電端子１０を設置し、真空炉により１０５０℃でＡｕ－Ｎｉ系ロウ材によるロウ付けを行い、電極内蔵部材（図８）を完成させた。 (6) External metal terminal connection (Fig. 8)
A buffer member (intermediate members 9a, 9b) made of tungsten and Kovar with a diameter of 5 mm and a thickness of 2 mm and a cylindrical Ni power supply terminal 10 with a diameter of 5 mm and a length of 30 mm were placed on the exposed bottom surface of the connection member via a brazing material (brazing portion 9), and brazing was performed using an Au-Ni based brazing material at 1050° C. in a vacuum furnace to complete the electrode-embedded member (FIG. 8).

［実施例２］
次に、実施例２として、実施例１で積層した接続部材成形体の代わりに、以下の工程による接続部材脱脂体を用いて、同様に電極埋設部材を作製した例について説明する。 [Example 2]
Next, as Example 2, an example in which an electrode-embedded member was similarly produced using a degreased connecting member body prepared by the following process instead of the connecting member molded body laminated in Example 1 will be described.

Ｗ粉末及び窒化アルミニウム粉末９５質量％、酸化イットリウム粉末５質量％にＰＶＡを３質量％添加してこれを一軸プレス成型の後、ＣＩＰ成形し、φ８ｍｍ×１．１ｍｍtの接続部材成形体を作製した。
Ｗの体積比は６０％となるように配合した。
これをＮ_２雰囲気、５００℃で脱脂し、接続部材脱脂体を作製した。 W powder, aluminum nitride powder 95% by mass, yttrium oxide powder 5% by mass, and 3% by mass of PVA were added, and this was uniaxially press molded and then CIP molded to prepare a connection member molded body of φ8 mm×1.1 mmt.
The volume ratio of W was adjusted to 60%.
This was degreased in a _N2 atmosphere at 500°C to prepare a degreased connection member.

［実施例３］
次に、実施例３として、実施例１で積層した接続部材成形体の代わりに以下の工程による接続部材仮焼体を用いて同様に電極埋設部材を作製した例について説明する。 [Example 3]
Next, as Example 3, an example will be described in which an electrode-embedded member was produced in the same manner as in Example 1, except that a calcined connecting member body produced by the following process was used instead of the connecting member compacts laminated in Example 1.

Ｗ粉末及び窒化アルミニウム粉末９５質量％、酸化イットリウム粉末５質量％からなる粉末混合物を一軸プレス成型の後、ＣＩＰ成形し、φ８ｍｍ×０．８ｍｍtの接続部材成形体を作製した。
Ｗの体積比は６０％となるように配合した。
これを、Ａｒ雰囲気、１５００℃で仮焼し、接続部材仮焼体を作製した。 A powder mixture consisting of W powder, 95% by mass of aluminum nitride powder, and 5% by mass of yttrium oxide powder was uniaxially press molded and then CIP molded to prepare a connection member compact having a diameter of 8 mm and a thickness of 0.8 mm.
The volume ratio of W was adjusted to 60%.
This was calcined in an Ar atmosphere at 1500° C. to prepare a calcined body of the connection member.

［実施例４］
次に、実施例４として、粉末ホットプレス法を用いて電極埋設部材を製造した例について説明する。 [Example 4]
Next, as Example 4, an example in which an electrode-embedded member was manufactured by using a powder hot pressing method will be described.

（１）窒化アルミニウム粉末９５質量％、酸化イットリウム粉末５質量％からなる粉末混合原料粉を有底のカーボン型に充填して一軸加圧し、第１円板状圧粉体を作製する。
（i）第１円板状圧粉体(焼成後絶縁層となるプレート)
直径３４０ｍｍ、厚み５ｍｍ。
（ii)実施例１と同じ高周波電極を第１円形圧粉体上の所定位置に載置する。
(iii）接続部材
実施例１と同じ接続部材成形体を高周波電極上の所定の位置に配置する。 (1) A powder mixture of 95% by mass of aluminum nitride powder and 5% by mass of yttrium oxide powder is filled into a bottomed carbon mold and uniaxially pressed to produce a first disk-shaped green compact.
(i) First circular compact (the plate that will become the insulating layer after firing)
Diameter 340mm, thickness 5mm.
(ii) The same high-frequency electrode as in Example 1 is placed at a predetermined position on the first circular powder compact.
(iii) Connection Member The same connection member molded body as in Example 1 is placed at a predetermined position on the high-frequency electrode.

（２）同一の粉末混合原料粉を有底のカーボン型に更に充填して一軸加圧して第２円板状圧粉体を作製する。
直径３４０ｍｍ、厚み１０ｍｍ
（iv)ヒーター電極を第２円板状圧粉体上に載せる。
(v）接続部材
実施例１と同じ接続部材成形体をヒーター電極上の所定の位置に配置する。 (2) The same powder mixture is further filled into a bottomed carbon mold and uniaxially pressed to produce a second disk-shaped green compact.
Diameter 340mm, thickness 10mm
(iv) A heater electrode is placed on the second disk-shaped compact.
(v) Connection Member The same connection member molded body as in Example 1 was placed at a predetermined position on the heater electrode.

（３）同一の粉末混合原料粉を有底のカーボン型に更に充填して一軸加圧し、第３円板状圧粉体を作製する。
（vi）第３円板状圧粉体(焼成後基台となるプレート)
直径３４０ｍｍ、厚み２０ｍｍ (3) The same powder mixture is further filled into a bottomed carbon mold and uniaxially pressed to produce a third disk-shaped green compact.
(vi) Third circular compact (the plate that will become the base after firing)
Diameter 340mm, thickness 20mm

（４）ホットプレス焼成
１０ＭＰａの圧力で、焼成温度１８００℃、焼成時間２時間でホットプレス焼成を行った。 (4) Hot-press sintering Hot-press sintering was carried out at a pressure of 10 MPa, a sintering temperature of 1800° C., and a sintering time of 2 hours.

（５）焼成後加工
その後、全面に研削、研磨加工を行い、総厚２５ｍｍ、絶縁層厚さ１．０ｍｍ、表面粗さをＲａ０．４μｍのウェハ載置面を形成した。
セラミック基体裏面側より端子位置に接続部材に到達するまで穴径φ５．５ｍｍの平底穴加工を行う。 (5) Post-firing processing Thereafter, the entire surface was subjected to grinding and polishing processing to form a wafer-mounting surface with a total thickness of 25 mm, an insulating layer thickness of 1.0 mm, and a surface roughness Ra of 0.4 μm.
A flat-bottom hole having a diameter of φ5.5 mm is drilled from the rear surface of the ceramic substrate to the terminal position, reaching the connecting member.

（６）外部金属端子接続
露出した接続部材底面にロウ材を介して直径５ｍｍ、厚み２ｍｍのタングステンとコバール製の緩衝部材と直径５ｍｍ長さ３０ｍｍの円柱状Ｎｉ製給電端子を設置し、真空炉により１０５０℃でＡｕ－Ｎｉ系ロウ材によるろう付けを行い電極内蔵部材を完成させた。 (6) External Metal Terminal Connection A buffer member made of tungsten and Kovar with a diameter of 5 mm and a thickness of 2 mm and a cylindrical Ni power supply terminal with a diameter of 5 mm and a length of 30 mm were installed on the exposed bottom surface of the connection member via solder, and brazing was performed using a Au-Ni based solder at 1050°C in a vacuum furnace to complete the electrode-embedded member.

［比較例］
実施例１において接続部材をタングステン（Ｗ）のバルク体(焼結金属)とした従来の製造方法によって電極埋設部材を作製した。 [Comparative Example]
In Example 1, an electrode-embedded member was produced by a conventional manufacturing method in which the connecting member was a bulk body (sintered metal) of tungsten (W).

(評価)
実施例１～４及び比較例で作製した電極埋設部材を、プロセス温度が６００℃である半導体製造プロセスに使用した。
使用開始後３か月経過後に、端子部の断面をＳＥＭ観察した。
その結果、実施例１～４ともクラックは確認されなかったが、比較例は、接続部材の縁部から電極埋設部材表面に向かうクラックの進展が確認された。
また、接続部材にφ４ｍｍのＮｉ端子をロウ付けした後、引っ張り試験を行った。強度試験後は全て接続部材の内部で破断していた。
強度値はＷの体積比が大きくなるにつれ、わずかに強度の低下傾向がみられたものの使用上問題となる程度ではなかった。 (evaluation)
The electrode-embedded members produced in Examples 1 to 4 and the Comparative Example were used in a semiconductor manufacturing process in which the process temperature was 600°C.
Three months after the start of use, the cross section of the terminal portion was observed using a SEM.
As a result, no cracks were observed in any of Examples 1 to 4, but in the comparative example, a crack was observed to have developed from the edge of the connection member toward the surface of the electrode-embedded member.
In addition, a Ni terminal having a diameter of 4 mm was brazed to the connection member, and then a tensile test was performed. After the strength test, all of the connection members were found to have broken inside.
As the volume ratio of W increased, the strength tended to decrease slightly, but this was not to the extent that would cause problems in use.

１第１部材（第１脱脂体）
２、２Ａ、２Ｂ電極（内部電極）
３接続部材
４第２部材（第２脱脂体）
５、２５、２７穴部
６積層体
７基体
８端子穴
９ロウ付け部
１０端子
２１円板状成形体（第１の脱脂体）
２２円板状成形体（第２の脱脂体）
２３円板状成形体（第３の脱脂体） 1 First member (first degreased body)
2, 2A, 2B electrode (internal electrode)
3 Connection member 4 Second member (second degreased body)
Reference Signs 5, 25, 27: Hole 6: Laminate 7: Base 8: Terminal hole 9: Brazing portion 10: Terminal 21: Disc-shaped molded body (first degreased body)
22 Disc-shaped body (second degreased body)
23 Disc-shaped body (third degreased body)

Claims

A method for manufacturing an electrode-embedded member, comprising embedding an electrode and a connection member containing tungsten and aluminum nitride electrically connected to the electrode in an aluminum nitride substrate, comprising:
a first degreased body made of aluminum nitride produced by degreasing an aluminum nitride molded body;
The electrode;
an unsintered body of the connection member made of aluminum nitride powder and tungsten powder;
a second degreased body made of aluminum nitride and having a hole in which the unsintered body of the connection member is accommodated, the second degreased body being produced by degreasing an aluminum nitride molded body;
are laminated in order to form a laminate,
The method for producing an electrode-embedded member comprises pressurizing and sintering the laminate to produce an integrated electrode-embedded member.

A method for manufacturing an electrode-embedded member, comprising embedding an electrode and a connection member containing tungsten and aluminum nitride electrically connected to the electrode in an aluminum nitride substrate, comprising:
a first powder compact forming step of filling an aluminum nitride powder into a bottomed cylindrical mold having an opening and pressing the aluminum nitride powder to form a first powder compact;
an electrode placement step of placing the green body of the connection member made of aluminum nitride powder and tungsten powder and the electrode on an opening side of the bottomed cylindrical mold of the first powder compact in the bottomed cylindrical mold;
a second green compact forming step of filling the aluminum nitride powder into the opening side of the unsintered body of the first green compact, the electrode, and the connection member in the bottomed cylindrical mold, and applying pressure to form a second green compact including the first green compact;
a sintering step of pressurizing and firing the second powder compact in which the unsintered bodies of the electrodes and the connecting members are embedded;
A method for manufacturing an electrode-embedded member comprising the steps of:

The method for manufacturing an electrode-embedded member according to claim 1 or 2, wherein the unsintered body of the connection member is a compact, a degreased body, or a calcined body.

2. The method for manufacturing an electrode-embedded member according to claim 1, characterized in that a terminal hole having a diameter smaller than that of the connecting member and exposing only a portion of the connecting member is formed by machining on one surface of the laminate after pressure sintering.