JP7582046B2 - Circuit board unit and power equipment - Google Patents

Description

The technology disclosed in this specification relates to circuit board units and power equipment.

One example of a conventional heat dissipation structure for an electronic device equipped with a heat sink is described in Patent Document 1 below.

JP 2013-131520 A

As the number of power elements mounted on boards in power equipment increases, multiple elements may be installed on a single board. The first problem that this invention aims to solve is to reduce the installation space while increasing the cooling surface of the heat sink, which serves as a heat dissipation member.

The second problem that this invention aims to solve is to improve the heat dissipation performance of multiple heat sinks installed on a substrate, even when sufficient installation space for the heat sinks that serve as heat dissipation members can be secured.

The first circuit board unit includes a circuit board, a power element mounted on the circuit board, a heat dissipation member including a main body portion in contact with the power element, and a flange portion connected to the main body portion and spaced apart from the circuit board, and the heat dissipation member is arranged such that the main body portions are spaced apart from each other and at least portions of the flange portions face each other and overlap when viewed from the normal direction of the plate surface of the circuit board.

The second circuit board unit includes a circuit board, a power element mounted on the circuit board, a main body in contact with the power element, and a heat dissipation member including a flange connected to the main body and spaced from the circuit board, the main body being spaced from each other and the flanges facing each other so as to protrude inward from the main body, the flanges being divided to have a first piece and a second piece that is at a different angle from the first piece relative to the main body.

The above technology can be applied to electric power equipment.

First, the installation space of the heat dissipation member can be reduced while ensuring the heat dissipation performance of the heat dissipation member. With the increase in power elements mounted on the boards of electric power equipment, multiple heat sinks with simple shapes such as L-shaped bent structures or comb-shaped structures may be installed on one board. For example, to save space, it is possible to shorten the dimensions of the heat sinks and place them side by side, but the fins provided to increase the cooling surface have a depth. The inventors came up with the idea of providing a division section in the flange section connected to the main body section in order to increase the cooling efficiency of the heat sink, which serves as the heat dissipation member. As a result, the division section becomes multiple fins, increasing the cooling surface and improving cooling efficiency. Furthermore, by configuring the flange portion to have a first piece and a second piece that is angled differently from the first piece relative to the main body, when the flange portions are arranged facing each other so that they protrude inward from the main body and at least portions of the flange portions overlap when viewed from the normal direction of the plate surface of the circuit board, the installation space can be made smaller than when multiple heat sinks of simple shapes are installed.

Secondly, the heat dissipation performance of the heat dissipation member can be improved. The power element mounted on the circuit board generates heat when electricity is applied. The heat generated from the power element is transferred to a heat sink that is a heat dissipation member including a main body portion in contact with the power element and a flange portion connected to the main body portion, and dissipates the heat. By making the flange portion have a first piece portion and a second piece portion that is different in angle from the first piece portion relative to the main body portion, when the flange portions are arranged facing each other so as to protrude inward from the main body portion and at least parts of the flange portions overlap each other when viewed from the normal direction of the plate surface of the circuit board, an enclosed space is created between the circuit board and the heat sink. If air is circulated in the enclosed space, the first piece portion and the second piece portion that are different in angle relative to the main body portion become protrusions, making it easier for turbulence to occur. The generation of turbulence promotes thermal diffusion, improving the heat dissipation performance of the heat sink.

The first and second effects of the present invention found by the inventors can be applied to electric power equipment. For example, electric power equipment for network servers and electric power equipment for mobile phone base stations are installed inside buildings. Since the power elements used in electric power equipment generate heat, it is common to use a heat sink as a heat dissipation member to cool the power elements. However, to improve the cooling efficiency using a heat sink, it is necessary to increase the cooling surface of the heat sink, which increases the size of the heat sink and therefore the size of the electric power equipment. However, with the present invention, it is possible to achieve a reduction in the size and weight of electric power equipment while ensuring the cooling efficiency of the heat dissipation member, and the installation space for the electric power equipment can be reduced.

FIG. 1 is a perspective view of an electric power device according to a first embodiment; Plan view showing inside the case of the power device Side view of the circuit board unit Side view of the heat dissipation member 4 is a cross-sectional view of the circuit board unit taken along line AA in FIG. 4 is a cross-sectional view of the circuit board unit taken along line B-B of FIG. FIG. 3 is a perspective view of a pair of heat dissipation members before being assembled; FIG. 1 is a plan view of the pair of heat dissipation members before they are attached 5 and 6 in a pair of heat dissipation members. 3 is a cross-sectional view taken along line AA of FIG. 2, showing a state before the pair of heat dissipation members are mounted on the circuit board; 3 is a cross-sectional view taken along line BB of FIG. 2, showing a state before the pair of heat dissipation members are mounted on the circuit board; FIG. 6 is a cross-sectional view of a circuit board unit according to a second embodiment, the same as FIG. FIG. 7 is a cross-sectional view of the circuit board unit shown in FIG. FIG. 6 is a cross-sectional view of a circuit board unit according to a third embodiment, the same as FIG. FIG. 7 is a cross-sectional view of the circuit board unit shown in FIG. 11 is a cross-sectional view of a circuit board unit according to a fourth embodiment of the present invention; FIG. 6 is a cross-sectional view of a circuit board unit according to a fifth embodiment, the same as FIG. FIG. 7 is a cross-sectional view of the circuit board unit shown in FIG. FIG. 11 is a cross-sectional view of a circuit board unit according to a sixth embodiment, the same as FIG. FIG. 7 is a cross-sectional view of the circuit board unit shown in FIG. FIG. 13 is a cross-sectional view of a circuit board unit according to a seventh embodiment, the same as FIG. FIG. 7 is a cross-sectional view of the circuit board unit shown in FIG. Plan view showing inside the case of the power device FIG. 13 is a cross-sectional view of a circuit board unit according to an eighth embodiment, the same as FIG.

An overview of the circuit board unit will now be described.
The first circuit board unit comprises a circuit board, a power element mounted on the circuit board, a heat dissipation member including a main body portion in contact with the power element, and a flange portion connected to the main body portion and spaced apart from the circuit board, wherein the heat dissipation member is arranged such that the main body portions are spaced apart and at least portions of the flange portions face each other and overlap when viewed from the normal direction of the plate surface of the circuit board.

The power element mounted on the circuit board generates heat when electricity is applied. The heat generated by the power element is transferred to and dissipated by a heat dissipation member that includes a main body portion that contacts the power element and a flange portion that is connected to the main body portion. The space of the main body portion that is spaced apart in the heat dissipation member is surrounded by the circuit board and the flange portion that is spaced apart from the plate surface of the circuit board. Therefore, by circulating air through this space, heat dissipation from the main body portion and the flange portion is efficiently promoted.

The flange portions of the heat dissipation member are arranged so that at least a portion of them overlap when viewed from the normal direction of the plate surface of the circuit board. Compared to a case in which the flange portions are arranged so that they do not overlap when viewed from the normal direction of the plate surface of the circuit board, the distance between the main body portions can be reduced while the protruding dimension of the flange portions from the main body portion is increased. Increasing the protruding dimension of each flange portion increases the surface area of the heat dissipation member, improving heat dissipation performance. Reducing the distance between the main body portions reduces the installation space for the heat dissipation member.

The flange portion may have multiple pieces. By having the flange portion have multiple pieces, the surface area of the flange portion increases, thereby improving the heat dissipation performance of the heat dissipation member.

The plurality of pieces may include a first piece and a second piece that is at a different angle to the main body than the first piece.

In the space surrounded by the circuit board, main body, and flange, a first piece and a second piece are arranged at different angles to the main body, so turbulence is likely to occur when air is circulated through the space. The generation of turbulence allows heat to be transferred from the heat dissipation member to the air, further improving the heat dissipation performance of the heat dissipation member.

The second circuit board unit includes a circuit board, a power element mounted on the circuit board, a main body in contact with the power element, and a heat dissipation member including a flange portion spaced apart from the circuit board and connected to the main body portion, the main body portions of the heat dissipation member being spaced apart from each other and the flange portions being arranged facing each other so as to protrude inward from the main body portion, the flange portion having a first piece and a second piece that is angled differently from the first piece with respect to the main body portion.

The power element mounted on the circuit board generates heat when electricity is applied. The heat generated by the power element is transferred to a heat dissipation member including a main body portion in contact with the power element and a flange portion connected to the main body portion, and dissipated. If the flange portion protrudes outward from the main body portion, the space between the heat dissipation members is open and not closed by the flange portion. In contrast, if the flange portion protrudes inward from the main body portion, the space between the heat dissipation members is surrounded by the circuit board and each flange portion. Therefore, if air is circulated through the enclosed space, the heat is dissipated from the main body portion and the flange portion.

The flange portions of the opposing heat dissipation members are divided into a first piece and a second piece that is at a different angle to the main body portion than the first piece. By making the flange portion into a divided structure, the surface area of the flange portion is increased, improving heat dissipation performance. Furthermore, since the first piece and the second piece that are at different angles to the main body portion are arranged in the space between the spaced apart main body portions, turbulence is likely to occur when air is circulated through the space. The generation of turbulence allows heat to be transferred from the heat dissipation members to the air, improving heat dissipation performance. As a result, sufficient heat dissipation performance can be obtained even if the heat dissipation members are made smaller.

The first piece provided on one of the opposing heat dissipation members and the second piece provided on the other heat dissipation member may be arranged so as to overlap when viewed from the normal direction of the plate surface of the circuit board. The first piece and the second piece arranged so as to overlap when viewed from the normal direction of the plate surface of the circuit board have different angles with respect to the main body, so that the position where they connect to the main body can be the same as the normal direction of the plate surface of the circuit board. This makes it possible to reduce the arrangement space of the heat dissipation member in the normal direction of the plate surface of the circuit board.

The first piece may have an angle of 90° or less relative to the main body, while the second piece may have an angle of less than 90° relative to the main body. The first piece and the second piece, which are arranged so as to overlap when viewed from the normal direction of the plate surface of the circuit board, have an angle of less than 90° relative to the main body. This reduces the space required for arranging the heat dissipation member in the normal direction of the plate surface of the circuit board.

The first piece of the one heat dissipation member may contact the second piece of the other heat dissipation member. The second piece of the one heat dissipation member may contact the first piece of the other heat dissipation member that overlaps with the first piece when viewed from the normal direction.

The overlapping first and second pieces are in contact with each other when viewed from the normal direction of the circuit board surface, so the opposing heat dissipation members are less likely to shift position in any direction relative to the normal direction of the circuit board surface. Contact between the first and second pieces allows heat to transfer between the heat dissipation members, so the opposing heat dissipation members can be considered as a single member. This increases the cooling surface of the heat dissipation member, improving cooling efficiency. To measure or manage the temperature of the heat dissipation member, a temperature sensor can be installed on one of the heat dissipation members.

The first piece of the one heat dissipation member may be arranged with its end face facing the first piece of the other heat dissipation member, and the second piece of the one heat dissipation member may be arranged with its end face facing the second piece of the other heat dissipation member. The end faces of the pieces that do not overlap when viewed from the normal direction of the plate surface of the circuit board face each other. The heat dissipation member is unlikely to shift in position in any direction in the arrangement direction of the pieces that do not overlap when viewed from the normal direction of the plate surface of the circuit board.

The flange portion may include at least one of the first piece or the second piece, and may be configured so that the first piece and the second piece are arranged alternately. In the space surrounded by the circuit board, the main body, and the flange portion, the first piece and the second piece, which are at different angles to the main body, are arranged alternately. When air is circulated through the space, turbulence is easily generated, further improving the heat dissipation performance of the heat dissipation member.

The heat dissipation member may be provided with an intermediate flange portion connected to the main body portion and disposed between the circuit board and the flange portion. The space between the main body portion and the circuit board is spaced apart, and the intermediate flange portion is disposed between the circuit board and the flange portion. By circulating air through this space, heat dissipation is promoted.

The flange portion of the heat dissipation member of the opposing heat dissipation member has a protruding end surface from the main body portion that contacts the flange portion of the other heat dissipation member, while the intermediate flange portion of one of the heat dissipation members of the opposing heat dissipation members may have a protruding end surface from the main body portion that contacts the intermediate flange portion of the other heat dissipation member.

The flange portions protruding from the spaced apart main body portions come into contact with each other, and the intermediate flange portions come into contact with each other, ensuring the spacing between the opposing heat dissipation members. As the flange portions come into contact with each other and the intermediate flange portions come into contact with each other, heat is transferred between the opposing heat dissipation members, and the opposing heat dissipation members can be considered as a single member. To measure or manage the temperature of the heat dissipation members, a temperature sensor can be installed on one of the heat dissipation members.

The opposing heat dissipation members may be arranged such that at least a portion of the intermediate flange portions overlap when viewed from the normal direction of the plate surface of the circuit board. Compared to an arrangement in which the intermediate flange portions do not overlap when viewed from the normal direction of the plate surface of the circuit board, the protruding dimension of the intermediate flange portions protruding from the main body portion is larger. This increases the surface area of the heat dissipation member, thereby improving the heat dissipation performance of the heat dissipation member.

The intermediate flange portion may have a first intermediate piece and a second intermediate piece that is angled differently from the first intermediate piece with respect to the main body portion. By making the intermediate flange portion a divided structure, the surface area is increased, and the heat dissipation performance of the heat dissipation member is improved. Since the space of the main body portion that is spaced apart has the first intermediate piece and the second intermediate piece arranged at different angles with respect to the main body portion, turbulence is likely to occur when air is circulated through the space. The generation of turbulence allows heat to be transferred from the heat dissipation member to the air, improving the heat dissipation performance of the heat dissipation member.

The opposing heat dissipation members may be the same part. This reduces the number of different parts, making assembly during manufacturing easier and facilitating inventory management of the parts.

The power element may be disposed on the side opposite to the side where the flange protrudes from the main body. Compared to a case where the power element is disposed on the side where the flange protrudes from the main body, the portion of the circuit board that is sandwiched between the main body portions that are disposed at intervals can be effectively utilized.

A drive circuit for driving the power element may be provided in the space between the spaced apart main body parts of the circuit board. The power element is driven by the drive circuit. The drive circuit can be installed in the space between the spaced apart main body parts of the circuit board, making effective use of the space on the circuit board.

The power element may be arranged so as to be sandwiched between the body parts arranged at a distance. By circulating air through the space surrounded by the circuit board, the body parts, and the flange parts, the heat generated by the power element can be directly transferred to the circulating air. This allows the power element to be cooled efficiently.

The power elements may be arranged on the side where the flange portion protrudes from the main body and on the opposite side to the protruding side. The power elements arranged on the side where the flange portion protrudes from the main body and the power elements arranged on the opposite side to the side where the flange portion protrudes from the main body are in contact with a common main body, thereby dissipating heat. When many power elements are mounted on a circuit board, the power elements can be cooled efficiently.

The electric power device includes the circuit board unit and a cooling fan that cools the circuit board unit. When air is blown from the cooling fan to the circuit board unit, the air is efficiently circulated in the space surrounded by the circuit board, the main body, and the flange. This further improves the heat dissipation performance of the heat dissipation member.

<Embodiment 1>
A first embodiment in which the technology disclosed in this specification is applied to an electric power device 10 will be described with reference to Figs. 1 to 11. X-axis, Y-axis, and Z-axis are shown in a part of each figure, and each axis direction is drawn to be the direction shown in each figure. The up-down direction is based on Figs. 3 to 6 and Figs. 9 to 11, and the upper side of each figure is the front side and the lower side of each figure is the back side.

Figure 1 is a perspective view of an electric power device according to the first embodiment. As shown in Figure 1, the electric power device 10 of this embodiment includes a case 11 that is box-shaped overall. The case 11 is provided with a power switch 12 and the like. A ventilation hole 13 that allows air to circulate between inside and outside is provided on the wall of the case 11. The electric power device 10 is, for example, a converter or an inverter. In this embodiment, a switching power supply (switching regulator) that converts AC power to DC power is exemplified as the electric power device 10.

Figure 2 is a plan view showing the inside of the case of the electric power device. As shown in Figures 1 and 2, at least a cooling fan 14 and a circuit board unit 20 are housed inside the case 11. The cooling fan 14 is disposed between the circuit board unit 20 and a ventilation hole 13 in the wall of the case 11. When the cooling fan 14 is driven, outside air is drawn into the case 11 through the ventilation hole 13. The drawn-in air is blown onto the circuit board unit 20.

2 and 3, the circuit board unit 20 includes a circuit board 21, a power element 22 mounted on the circuit board 21, and a heat dissipation member 23 attached to the circuit board 21. The circuit board 21 is a rectangular plate following the planar shape of the case 11. The short side direction of the plate surface 21A of the circuit board 21 coincides with the X-axis direction, the long side direction of the plate surface 21A coincides with the Y-axis direction, and the normal direction (plate thickness direction) of the plate surface 21A coincides with the Z-axis direction. A circuit board different from the circuit board 21 described above is housed inside the case 11.

In this embodiment, the power element 22 is a FET (field effect transistor). It has the function of converting the input AC current into a DC current by pulse width modulation or frequency modulation and outputting the DC current. The power element 22 generates heat when current is applied.

As shown in Figures 2 and 3, the power element 22 is mounted on the front plate surface 21A of the circuit board 21. The power element 22 has multiple terminal portions 22A (specifically, three). The multiple terminal portions 22A are inserted into terminal holes formed in the circuit board 21. The power element 22 is soldered to each terminal portion 22A inserted into each terminal hole of the circuit board 21. In this way, the power element 22 is electrically connected to the circuit pattern formed on the circuit board 21.

The power elements 22 are arranged in rows of three on the plate surface 21A of the circuit board 21, spaced apart in the Y-axis direction. Two rows of power elements 22 are arranged at positions spaced apart in the X-axis direction. In this embodiment, a total of six power elements 22 are arranged in order on the plate surface 21A of the circuit board 21. The circuit board 21 also has circuit elements (diodes, capacitors, transformers, etc.) other than the power elements 22. These circuit elements include the drive circuit element 26A described below.

The heat dissipation member 23 is formed into a predetermined shape by bending a metal plate. This metal plate is made of a metal material with excellent thermal conductivity, such as aluminum. The heat dissipation member 23 dissipates heat generated by the power element 22 when it is energized.

As shown in Figures 2 to 4, the heat dissipation member 23 has a main body 30 and a flange portion 31 connected to the main body 30. The main body 30 is attached to the circuit board 21. The main body 30 has a horizontally long rectangular shape when viewed from the side. The short side direction of the plate surface of the main body 30 coincides with the Z-axis direction, the long side direction of the plate surface coincides with the Y-axis direction, and the normal direction of the plate surface coincides with the X-axis direction.

The main body 30 has mounting legs 30A. The mounting legs 30A are inserted into mounting holes formed in the circuit board 21. The mounting legs 30A are provided at both ends of the lower end of the main body 30 in the Y-axis direction, and each protrudes downward. The main body 30 is fixed with an adhesive or the like with each mounting leg 30A inserted into each mounting hole of the circuit board 21. This causes the main body 30 to be attached to the circuit board 21. In this attached state, the main part (parts other than the mounting legs 30A) of the main body 30 is raised from the circuit board 21 to the front side along the Z-axis direction.

As shown in Figures 2, 4, and 5, the power elements 22 are attached to the main body 30 in contact with the plate surface. An insulating sheet 24 is provided between the main body 30 and the power elements 22 to keep them insulated from each other. Each power element 22 and insulating sheet 24 is attached to the main body 30 at positions spaced apart at approximately equal intervals in the Y-axis direction.

The insulating sheet 24 can efficiently transfer heat generated by the power element 22 to the main body 30. The power element 22 and the insulating sheet 24 are attached to the main body 30 by the mounting screws 25. The main body 30 is provided with screw mounting holes 30B into which the mounting screws 25 are attached. The insulating sheet 24 is provided with communication holes that communicate with the screw mounting holes 30B.

As shown in FIG. 5, the flange portion 31 is bent so as to protrude from the main body portion 30 to one side in the X-axis direction. The flange portion 31 protrudes from the main body portion 30 toward the side opposite the power element 22 in the X-axis direction. The flange portion 31 is connected to the end of the main body portion 30 on the front side (opposite the mounting leg portion 30A side) in the Z-axis direction. The flange portion 31 is disposed on the front side with a gap between it and the front plate surface 21A of the circuit board 21.

As shown in Figures 3 and 5, the heat dissipation member 23 configured as described above is attached to the circuit board 21. The heat dissipation member 23 is attached to the circuit board 21 so that the main body portions 30 are spaced apart in the X-axis direction. The heat dissipation member 23 has flange portions 31 that protrude inward from the opposing main body portions 30, and each power element 22 is disposed on the outside of the main body portions 30.

As shown in Figs. 5 and 6, a drive circuit 26 is provided in a portion of the circuit board 21 that is sandwiched between the opposing main body parts 30. The drive circuit 26 drives the power element 22. The drive circuit 26 may be a plurality of drive circuit elements 26A. The plurality of drive circuit elements 26A are mounted on the plate surface 21A on the back side of the circuit board 21 (the side opposite to the side on which the power element 22 and the heat dissipation member 23 are mounted).

The inventors wanted to miniaturize electric power equipment while increasing its efficiency. However, the circuit elements (such as power element 22) in the electric power equipment generate heat. In particular, it is common to use a heat sink as a method for cooling semiconductor elements, which are power elements, but in order to diffuse the heat and increase the cooling efficiency, it is necessary to increase the cooling surface of the heat sink. Generally, increasing the cooling surface increases the size of the heat sink, which in turn increases the size of the electric power equipment. Therefore, in order to achieve miniaturization, it is necessary to realize a heat sink structure that can reduce the heat sink size as much as possible and increase the surface area.

To solve this problem, it is conceivable to apply a heat sink with a simple L-shaped bent structure, but the inventor came up with a structure in which the L-shaped portion is cut to form multiple fins in order to increase the surface area of the heat sink and improve cooling efficiency. Furthermore, by forming a structure in which the multiple fins are bent alternately so that they do not overlap when viewed from the L-shaped side, the inventor discovered that by arranging these heat sinks opposite each other and allowing the multiple fins to overlap and interlock, it is possible to configure a U-shaped heat sink unit in which the heat sinks combine when placed opposite each other and require less space than simply combining L-shaped bent heat sinks. This makes it possible to increase the surface area of the heat sink while saving space compared to arranging L-shaped bent heat sinks opposite each other. The details are explained below.

As shown in Figures 5 and 6, the heat dissipation member 23 according to this embodiment is arranged so that a portion of each flange portion 31 protruding inward from each main body portion 30 overlaps when viewed from the Z-axis direction, which is the normal direction of the plate surface 21A of the circuit board 21.

Of the opposing heat dissipation members 23, the protruding tip side portion of the flange portion 31 of one heat dissipation member 23 and the protruding tip side portion of the flange portion 31 of the other heat dissipation member 23 overlap vertically in the Z-axis direction. The protruding base end side portions of each flange portion 31 do not overlap vertically in the Z-axis direction.

The opposing heat dissipation members 23 are arranged so that the distance between the opposing body portions 30 is smaller than the sum of the protrusions (protrusion dimensions) of each flange portion 31.

As shown in FIG. 7, the flange portion 31 has a divided structure. The flange portion 31 is divided into a number of pieces 32 by making slits 31S. In this embodiment, five slits 31S are made at approximately equal intervals in the Y-axis direction, so that the flange portion 31 is divided into six pieces 32. The width dimensions of each piece 32 are approximately the same.

As shown in Figures 5 to 7, the multiple pieces 32 include two types: a first piece 32A and a second piece 32B. The second piece 32B has a different bending angle (angle) relative to the main body 30 compared to the first piece 32A. The first piece 32A and the second piece 32B have in common that both bending angles relative to the main body 30 are 90° or less.

The first piece 32A has a bending angle of about 90° relative to the main body 30. In contrast, the second piece 32B has a bending angle of about 45° relative to the main body 30. In other words, the second piece 32B has a smaller bending angle relative to the main body 30 than the first piece 32A. The position of the first piece 32A in the Z-axis direction remains almost constant throughout its entire length. In contrast, the position of the second piece 32B in the Z-axis direction gradually decreases from the protruding base end to the protruding tip, and it approaches the circuit board 21.

In this embodiment, the flange portion 31 includes an equal number (three) of first pieces 32A and second pieces 32B. The flange portion 31 is configured such that the first pieces 32A and the second pieces 32B are arranged alternately in the Y-axis direction.

As shown in FIG. 2, the opposing heat dissipation members 23 are arranged such that the positions of each slit 31S and each piece 32 in the Y-axis direction are aligned.

As shown in Figures 5 and 6, the opposing heat dissipation members 23 are arranged such that the first piece 32A of one heat dissipation member 23 and the second piece 32B of the other heat dissipation member 23 overlap when viewed from the Z-axis direction. The first piece 32A overlaps the second piece 32B on the outside (upper side). The second piece 32B overlaps the first piece 32A on the inside (lower side). The second piece 32B is arranged to protrude obliquely toward the inside of the space S surrounded by the circuit board 21, the main body 30 arranged opposite to it, and the first piece 32A.

As shown in FIG. 7, of the opposing heat dissipation members 23, the left heat dissipation member 23 has the first arm 32A and the second arm 32B arranged alternately in the Y-axis direction. The opposing heat dissipation member 23 on the right side has the second arm 32B and the first arm 32A arranged alternately in the Y-axis direction. The opposing heat dissipation members 23 have the first arm 32A and the second arm 32B arranged in the reverse order.

Of the pieces 32 provided on the opposing heat dissipation members 23, those that overlap when viewed from the Z-axis direction are a combination of a first piece 32A and a second piece 32B. The heat dissipation members 23 are the same part.

As shown in Figures 5 and 6, the first and second pieces 32A and 32B that overlap each other when viewed from the Z-axis direction are in contact with each other. As shown in Figures 5 and 6, the protruding end surface 32A1 of each first piece 32A is in contact with the outer plate surface of each second piece 32B that overlaps each other when viewed from the Z-axis direction, so that the heat dissipation member 23 can be positioned in the X-axis direction.

As shown in FIG. 9, the heat dissipation members 23 facing each other do not overlap when viewed in the Z-axis direction, and the side end faces of each piece 32 adjacent to each other in the Y-axis direction are arranged facing each other.

Of the opposing heat dissipation members 23, the two first pieces 32A adjacent to each other in the Y-axis direction are arranged with a gap of slit 32S between their side end faces 32A2 along the protruding direction from the main body 30. The side end faces 32A2 of the two first pieces 32A adjacent to each other in the Y-axis direction can come into contact with each other. Of the opposing heat dissipation members 23, the two second pieces 32B adjacent to each other in the Y-axis direction are arranged with a gap of slit 32S between their side end faces 32B1 along the protruding direction from the main body 30. The side end faces 32B1 of the two second pieces 32B adjacent to each other in the Y-axis direction can come into contact with each other. This makes it difficult for the heat dissipation members 23 to become misaligned in the Y-axis direction.

As shown in Figures 5 and 6, in this embodiment, in addition to the flange portion 31 configured as described above, the heat dissipation member 23 is provided with an intermediate flange portion 33.

The intermediate flange portion 33 is disposed facing the plate surface 21A of the circuit board 21 and the flange portion 31 with a gap therebetween. The intermediate flange portion 33 is located midway between the circuit board 21 and the flange portion 31 in the Z-axis direction. The intermediate flange portion 33 is disposed in a manner protruding from a midpoint in the Z-axis direction within the space S surrounded by the circuit board 21, the main body portion 30 disposed opposite, and the first piece portion 32A. The intermediate flange portion 33 protrudes to the same side as the flange portion 31. The intermediate flange portion 33 is connected to the end of the main body portion 30 on the back side (opposite the flange portion 31 side) in the Z-axis direction.

As shown in FIG. 7, the intermediate flange portion 33 is located on the center side in the Y-axis direction at the lower end of the main body portion 30. The intermediate flange portion 33 is sandwiched on both sides by the opposing mounting legs 30A in the Y-axis direction. The length dimension (formation range) of the intermediate flange portion 33 in the Y-axis direction is smaller than that of the flange portion 31.

The intermediate flange portion 33 has a divided structure. The intermediate flange portion 33 is divided into a plurality of intermediate pieces 34 by inserting slits 33S. In this embodiment, three slits 33S are inserted at approximately equal intervals in the Y-axis direction, so that the intermediate flange portion 33 is divided into four intermediate pieces 34. The width dimension of each intermediate piece 34 is approximately the same, and is approximately the same as the width dimension of the piece 32. The four intermediate pieces 34 are arranged to match the four pieces 32 excluding the ones located at both ends in the Y-axis direction out of the six pieces 32, and overlap when viewed from the Z-axis direction.

As shown in Figures 5 to 7, the multiple intermediate pieces 34 include two types: a first intermediate piece 34A and a second intermediate piece 34B. The second intermediate piece 34B has a different bending angle (angle) relative to the main body 30 from the first intermediate piece 34A. The first intermediate piece 34A and the second intermediate piece 34B have in common that both bending angles relative to the main body 30 are 90° or less.

The first intermediate piece 34A has a bending angle of approximately 90° relative to the main body 30. In contrast, the second intermediate piece 34B has a bending angle of approximately 45° relative to the main body 30. In other words, the second intermediate piece 34B has a smaller bending angle relative to the main body 30 than the first intermediate piece 34A. The first intermediate piece 34A has the same bending angle relative to the main body 30 as the first piece 32A. Similarly, the second intermediate piece 34B has the same bending angle relative to the main body 30 as the second piece 32B.

The position of the first intermediate piece 34A in the Z-axis direction remains almost constant throughout its entire length. In contrast, the position of the second intermediate piece 34B in the Z-axis direction gradually increases from the protruding base end to the protruding tip end, and becomes farther away from the circuit board 21. The intermediate flange portion 33 includes the same number (two) of first intermediate pieces 34A and second intermediate pieces 34B. The intermediate flange portion 33 is configured such that the first intermediate pieces 34A and the second intermediate pieces 34B are alternately arranged in the Y-axis direction.

As shown in Figures 8 and 9, the opposing heat dissipation members 23 are arranged such that the positions of the slits 33S in each intermediate flange portion 33 and the positions of the intermediate pieces 34 in the Y-axis direction are aligned.

As shown in Figures 5 and 6, the opposing heat dissipation members 23 are arranged such that the first intermediate piece 34A of one heat dissipation member 23 and the second intermediate piece 34B of the other heat dissipation member 23 overlap when viewed from the Z-axis direction. The first intermediate piece 34A overlaps the second intermediate piece 34B on the outside (lower side). In contrast, the second intermediate piece 34B overlaps the first intermediate piece 34A on the inside (upper side). The second intermediate piece 34B is arranged to protrude obliquely toward the inside of the space S surrounded by the circuit board 21, the main body 30 arranged opposite to it, and the first piece 32A.

As shown in FIG. 8, of the opposing heat dissipation members 23, the left heat dissipation member 23 has the first intermediate piece 34A and the second intermediate piece 34B arranged alternately in the Y-axis direction. The opposing heat dissipation member 23 on the right side has the second intermediate piece 34B and the first intermediate piece 34A arranged alternately in the Y-axis direction. The opposing heat dissipation members 23 have the first intermediate piece 34A and the second intermediate piece 34B arranged in the opposite order.

Among the intermediate pieces 34 provided on the opposing heat dissipation members 23, those that overlap when viewed from the Z-axis direction are a combination of a first intermediate piece 34A and a second intermediate piece 34B. The heat dissipation members 23 are the same part.

As shown in FIG. 8, the first intermediate piece 34A is arranged so as to overlap the second piece 32B provided on the same heat dissipation member 23 when viewed from the Z-axis direction. Similarly, the second intermediate piece 34B is arranged so as to overlap the first piece 32A provided on the same heat dissipation member 23 when viewed from the Z-axis direction.

As shown in Figures 5 and 6, the second piece 32B and the second intermediate piece 34B are arranged opposite each other in the space S surrounded by the circuit board 21, the main body 30 arranged opposite each other, and the first intermediate piece 34A. The second piece 32B and the second intermediate piece 34B are adjacent to each other in the Y-axis direction, and the diagonal arrangement of the space S is alternated.

As shown in Figures 5 and 6, the first intermediate piece 34A and the second intermediate piece 34B, which overlap each other when viewed from the Z-axis direction, are in contact with each other.

The protruding end surface 34A1 of each first intermediate piece 34A is in contact with the outer plate surface of each overlapping second intermediate piece 34B when viewed from the Z-axis direction. The opposing heat dissipation members 23 can be positioned in the X-axis direction with each first piece 32A and each second piece 32B in contact with each other, and with each first intermediate piece 34A and each second intermediate piece 34B in contact with each other.

As shown in FIG. 9, the heat dissipation members 23 facing each other do not overlap when viewed in the Z-axis direction, and the side end faces of each intermediate piece 34 adjacent to each other in the Y-axis direction are arranged facing each other.

The procedure for assembling the circuit board unit 20 will now be described. As shown in FIG. 8, the power elements 22 and the insulating sheet 24 are attached to the heat dissipation members 23 with mounting screws 25. After the power elements 22 and the insulating sheet 24 are attached to each heat dissipation member 23, the opposing heat dissipation members 23 are assembled together. For assembly, the plate surfaces of the main body 30 are placed facing each other and the two are brought close together in the X-axis direction.

As shown in Figures 10 and 11, the protruding end surface 32A1 of each first piece 32A contacts the outer plate surface of the opposing second piece 32B, and the protruding end surface 34A1 of each first intermediate piece 34A contacts the outer plate surface of the opposing second intermediate piece 34B. This allows the opposing heat dissipation members 23 to be positioned in both the up and down directions in the Z-axis direction, and maintains a constant distance between the main body parts 30 in the X-axis direction.

As shown in FIG. 9, the side end faces 32A2 of adjacent first pieces 32A are arranged opposite each other in the Y-axis direction, and the side end faces 32B1 of adjacent second pieces 32B are arranged opposite each other in the Y-axis direction. Similarly, the side end faces 34A2 of adjacent first intermediate pieces 34A are arranged opposite each other in the Y-axis direction, and the side end faces 34B1 of adjacent second intermediate pieces 34B are arranged opposite each other in the Y-axis direction. The opposing heat dissipation members 23 can be positioned to be greater than the width of the slits 31S, 33S in either the forward or rearward direction in the Y-axis direction.

The opposing heat dissipation members 23 are positioned in all directions, X-axis, Y-axis, and Z-axis. As shown in Figures 5 and 6, the heat dissipation members 23 can be attached to the circuit board 21, so that each mounting leg 30A is smoothly inserted into each mounting hole, and each terminal portion 22A is smoothly inserted into each terminal hole. This results in excellent assembly workability of the circuit board unit 20.

The mounting legs 30A inserted into the mounting holes are fixed with adhesive, and the terminals 22A inserted into the terminal holes are soldered. This completes the manufacture of the circuit board unit 20.

As shown in Figures 5 and 6, in the circuit board unit 20 manufactured in this manner, at least a portion of the flange portions 31 of the opposing heat dissipation members 23 are arranged to overlap when viewed from the Z-axis direction.

With this configuration, compared to a case in which the flange portions are arranged so that they do not overlap when viewed from the Z-axis direction, the distance between the opposing main body portions 30 can be reduced while increasing the protrusion of each flange portion 31 from each main body portion 30. If the protrusion of each flange portion 31 is increased, the surface area of the heat dissipation member 23 increases and the heat dissipation performance is improved. If the distance between the opposing main body portions 30 is reduced, the installation space for the heat dissipation member 23 is reduced, and the electric power equipment 10 and the circuit board unit 20 can be made smaller. This allows the electric power equipment 10 and the circuit board unit 20 to be made smaller while maintaining the heat dissipation performance of the heat dissipation member 23.

As shown in Figures 5 and 6, at least a portion of the intermediate flange portions 33 of the heat dissipation member 23 is arranged to overlap when viewed from the Z-axis direction.

With this configuration, the protrusion margin of each intermediate flange portion 33 protruding from each main body portion 30 is larger than if the intermediate flange portions were arranged so that they do not overlap when viewed from the Z-axis direction. This increases the surface area of the heat dissipation member 23, improving the heat dissipation performance of the heat dissipation member 23.

As shown in Figures 5 and 6, the first piece 32A and the second piece 32B, which are arranged to overlap when viewed from the Z-axis direction, have different angles relative to each main body part 30, so that the positions at which they connect to each main body part 30 are approximately the same in the Z-axis direction. Similarly, the first intermediate piece 34A and the second intermediate piece 34B, which are arranged to overlap when viewed from the Z-axis direction, have different angles relative to each main body part 30, so that the positions at which they connect to each main body part 30 are approximately the same in the Z-axis direction. This allows the arrangement space for the heat dissipation member 23 to be reduced in the Z-axis direction.

As shown in Figures 5 and 6, the first piece 32A and the second piece 32B, which are arranged to overlap when viewed from the Z-axis direction, both have angles smaller than 90° relative to each main body 30. Similarly, the first intermediate piece 34A and the second intermediate piece 34B, which are arranged to overlap when viewed from the Z-axis direction, both have angles smaller than 90° relative to each main body 30. This reduces the arrangement space for the heat dissipation member 23 in the Z-axis direction.

As shown in Figures 7 and 8, the heat dissipation member 23 is the same part, so the number of different parts that make up the circuit board unit 20 can be reduced. This makes it easier to manage inventory of parts.

As shown in Figures 5 and 6, the power element 22 is arranged on the opposite side of the main body 30 from the side where the flange portion 31 protrudes.

In this way, the space between the spaced apart main body portions 30 of the circuit board 21 can be used more effectively than if the power element were placed on the side where the flange portion 31 protrudes from the main body portion 30. In this embodiment, in order to make effective use of the space, the drive circuit 26 is provided in the portion of the circuit board 21 that is sandwiched between the spaced apart opposing main body portions 30. This allows the space of the circuit board 21 to be used more effectively, thereby making it possible to reduce the size of the circuit board 21 and, ultimately, the circuit board unit 20.

As shown in FIG. 2, the circuit board unit 20 manufactured by the above-described assembly procedure is housed in the case 11 of the electric power device 10 for use. When in use, each power element 22 provided on the circuit board unit 20 generates heat when current is applied, so the cooling fan 14 provided on the case 11 is driven to cool them. Each power element 22 is driven by a drive circuit 26.

As shown in Figures 5 and 6, when the cooling fan 14 is driven, air circulation is promoted in the space S surrounded by the circuit boards 21 constituting the circuit board unit 20, the main body parts 30 arranged opposite each other, and the flange parts 31 protruding inward from each of the main body parts 30. The air flowing through the space S efficiently dissipates the heat transferred from the power element 22 to the heat dissipation member 23.

In the space S, the intermediate flange portion 33 is disposed at a position intermediate between the circuit board 21 and the flange portion 31, so that the air flowing through the space S promotes heat dissipation from the intermediate flange portion 33 in addition to the main body portion 30 and the flange portion 31. This improves the heat dissipation performance of the heat dissipation member 23.

As shown in Figures 5 and 6, the flange portion 31 and intermediate flange portion 33, both of which have a divided structure, are configured with a piece portion 32 and an intermediate piece portion 34 arranged in the space S. This ensures that the surface area of the flange portion 31 and intermediate flange portion 33 exposed to the air flowing through the space S is sufficient, improving the heat dissipation performance of the heat dissipation member 23.

The piece 32 and the intermediate piece 34 include a first piece 32A and a second piece 32B, and a first intermediate piece 34A and a second intermediate piece 34B, each of which has a different bending angle relative to the main body 30. By arranging the first piece 32A, the second piece 32B, the first intermediate piece 34A, and the second intermediate piece 34B in the space S, turbulence is easily generated in the air flowing through the space S.

In the space S, the first pieces 32A and the second pieces 32B are arranged alternately, and the first intermediate pieces 34A and the second intermediate pieces 34B are arranged alternately, so that turbulence is likely to occur in the air flowing through the space S. In particular, the second pieces 32B and the second intermediate pieces 34B are arranged so as to protrude into the space S from their positions in the space S, so that turbulence is likely to occur in the air flowing through the space S.

The second piece 32B and the second intermediate piece 34B are adjacent to each other in the Y-axis direction, and the arrangement of the space S is alternated, so that turbulence is more likely to occur in the air flowing through the space S. The generation of such turbulence efficiently transfers heat from the heat dissipation member 23 to the air flowing through the space S, improving the heat dissipation performance of the heat dissipation member 23.

As shown in Figures 5 and 6, when viewed from the Z-axis direction, the heat dissipation members 23 are in contact with the overlapping first and second pieces 32A and 32B, and also in contact with the first and second intermediate pieces 34A and 34B. This allows heat to be transferred between the heat dissipation members 23, so that the opposing heat dissipation members 23 can be considered as a single member. For example, if a temperature sensor TS is installed on one of the opposing heat dissipation members 23, it becomes possible to measure and manage the temperature of the heat dissipation members 23 with a single temperature sensor TS.

As described above, according to this embodiment, each flange portion 31 of the heat dissipation member 23 has a divided structure, and each piece portion 32 is alternately bent to interlock with each other. This provides the following effects: (1) miniaturization by reducing the arrangement space for the heat dissipation member 23; (2) improved heat dissipation efficiency by increasing the surface area of the heat dissipation member 23; (3) improved heat dissipation efficiency by generating turbulence in the space S; and (4) improved assembly workability by positioning the pair of heat dissipation members 23 relative to each other.

<Embodiment 2>
A second embodiment in which the technology disclosed in this specification is applied to an electric power device 110 will be described with reference to Fig. 12 or 13. Descriptions of structures, actions, and effects similar to those of the first embodiment will be omitted.

As shown in Figures 12 and 13, the power element 122 according to this embodiment is disposed on the side of the body 130 of the heat dissipation member 123 where the flange portion 131 protrudes from the body 130. In other words, the power element 122 is disposed so as to be sandwiched between the body portions 130 disposed at a distance. Therefore, the power element 122 is located in a space S surrounded by the circuit board 121 constituting the circuit board unit 120, the body portion 130 disposed opposite, and the flange portion 131. This allows heat from the power element 122 to be directly transferred to the air circulating in the space S, thereby allowing the power element 122 to be efficiently cooled.

The power element 122 in this embodiment is a diode. In this embodiment, the insulating sheet 24 described in the above-mentioned embodiment 1 is omitted. In this embodiment, the intermediate flange portion 33 described in the above-mentioned embodiment 1 is omitted.

<Embodiment 3>
A third embodiment in which the technology disclosed in this specification is applied to an electric power device 210 will be described with reference to Fig. 14 or 15. Descriptions of structures, actions, and effects similar to those of the first embodiment will be omitted.

As shown in Figures 14 and 15, the power element 222 according to this embodiment is attached to both the front and back sides of the main body 230 of the heat dissipation member 223. The power element 222 is disposed on the side where the flange portion 231 protrudes from the main body 230 and on the opposite side.

The power elements 222 according to this embodiment include FETs and diodes. The power elements 222 that are FETs are attached to the main body 230 in a back-to-back arrangement, similar to the first embodiment described above. An insulating sheet 224 is disposed between the power elements 222 that are FETs and the main body 230. The power elements 222 that are diodes are attached in a sandwiched arrangement between the main body 230, similar to the second embodiment described above. The insulating sheet 224 does not have to be disposed between the power elements 222 that are diodes and the main body 230.

Heat is dissipated by being transferred to the common main body 230 of the power element 222 that is an FET and the power element 222 that is a diode. In particular, even when many power elements 222 are mounted on the circuit board 221, the power elements 222 can be cooled efficiently.

The power element 222, which is an FET, and the power element 222, which is a diode, may be arranged offset in the Y-axis direction. This makes it difficult for heat to build up in the main body 230. In this embodiment, the intermediate flange portion 33 described in the first embodiment above is omitted.

<Embodiment 4>
A fourth embodiment in which the technology disclosed in this specification is applied to an electric power device 310 will be described with reference to Fig. 16. Descriptions of the same structure, action, and effect as those of the first embodiment will be omitted.

As shown in FIG. 16, in the heat dissipation member 323 according to this embodiment, the mounting legs 330A are separate parts from the main body 330. The mounting legs 330A are screwed to the main body 330. The mounting legs 330A are made of a metal material different from the main body 330 (aluminum) and are made of a metal material suitable for soldering. The mounting legs 330A are fixed by being soldered while inserted into mounting holes in the circuit board 321.

<Embodiment 5>
A fifth embodiment in which the technology disclosed in this specification is applied to an electric power device 410 will be described with reference to Fig. 17 or 18. Descriptions of structures, actions, and effects similar to those of the first embodiment will be omitted.

As shown in Figures 17 and 18, the heat dissipation member 423 according to this embodiment is fixed by a fixing member 35. The fixing member 35 is a flat plate parallel to the plate surface 421A of the circuit board 421. The fixing member 35 is disposed so as to straddle the flange portion 431 provided on the heat dissipation member 423, and is attached to the opposing flange portion 431 from the outside (upper side).

<Embodiment 6>
A sixth embodiment in which the technology disclosed in this specification is applied to an electric power device 510 will be described with reference to Fig. 19 or 20. Descriptions of the same structure, action, and effect as those of the first embodiment will be omitted.

As shown in FIG. 19 and FIG. 20, in the heat dissipation member 523 according to this embodiment, the bending angles of the second piece 532B and the second intermediate piece 534B with respect to the main body 530 are both greater than 90°. The bending angles of the second piece 532B and the second intermediate piece 534B with respect to the main body 530 are both about 135°, which are larger than the first piece 532A and the first intermediate piece 534A. The second piece 532B is disposed so as to protrude obliquely toward the outside of the space S surrounded by the circuit board 521, the main body 530, and the first piece 532A. On the other hand, the second intermediate piece 534B is disposed within the space S, but is disposed so as to protrude obliquely toward the circuit board 521 in the Z-axis direction.

The first piece 532A contacts the inner (lower) plate surface of the second piece 532B, which is disposed opposite the protruding end surface 532A1. The first intermediate piece 534A contacts the inner (upper) plate surface of the second intermediate piece 534B, which is disposed opposite the protruding end surface 534A1. As with the first embodiment described above, the opposing heat dissipation members 523 can be positioned in the Z-axis direction and the X-axis direction. The pair of heat dissipation members 523 can also be positioned in the Y-axis direction.

In this embodiment, when the opposing heat dissipation members 523 are attached to the circuit board 521, each heat dissipation member 523 is attached individually. One heat dissipation member 523 is attached to the circuit board 521 first, and then the other heat dissipation member 523 is attached to the circuit board 521.

The second piece 532B and the second intermediate piece 534B both protrude from the base end position connected to the main body 530 toward the outside of the space S. When attaching the other heat dissipation member 523 to the circuit board 521, the pieces 532 and the intermediate pieces 534 are less likely to get caught on each other (see the two-dot chain lines in Figures 19 and 20).

<Embodiment 7>
A seventh embodiment in which the technology disclosed in this specification is applied to an electric power device 610 will be described with reference to Fig. 21 to Fig. 23. Descriptions of the same structure, action, and effect as those of the first embodiment will be omitted.

As shown in Figures 21 to 23, the heat dissipation member 623 according to this embodiment is arranged so that the flange portions 631 do not overlap when viewed from the Z-axis direction. The flange portions 631 of the heat dissipation member 623 are offset left and right in the X-axis direction, with a predetermined gap between them. The heat dissipation member 623 is arranged so that the gap between the main body portions 630 arranged opposite each other is greater than the sum of the protrusion amounts of each flange portion 631 from each main body portion 630.

As shown in Figures 21 to 23, each flange portion 631 of the heat dissipation member 623 is divided into a first piece portion 632A and a second piece portion 632B with different bending angles relative to each main body portion 630. Similarly, each intermediate flange portion 633 of the heat dissipation member 623 is divided into a first intermediate piece portion 634A and a second intermediate piece portion 634B with different bending angles relative to each main body portion 630.

As shown in FIG. 23, when the cooling fan 614 is driven, the heat dissipation performance of each heat dissipation member 623 is ensured to be equivalent to that of the above-mentioned embodiment 1. The first piece 632A, the second piece 632B, the first intermediate piece 634A, and the second intermediate piece 634B make it easier for turbulence to occur in the air flowing through the space S. The generation of turbulence efficiently transfers heat from the heat dissipation member 623 to the air flowing through the space S, improving the heat dissipation performance of the heat dissipation member 623. In this embodiment, when attaching the heat dissipation member 623 to the circuit board 621, each heat dissipation member 623 is attached individually.

<Embodiment 8>
An eighth embodiment in which the technology disclosed in this specification is applied to an electric power device 710 will be described with reference to Fig. 24. Descriptions of the same structure, action, and effects as those of the first embodiment will be omitted.

As shown in FIG. 24, the heat dissipation member 723 according to this embodiment has a uniform bending angle of 90° for each flange portion 731 and each intermediate flange portion 733 relative to each main body portion 730.

The flanges 731 are connected to the main body 730 at different base end positions in the Z-axis direction, so that the protruding tip end portions overlap when viewed from the Z-axis direction. The intermediate flanges 733 are connected to the main body 730 at different base end positions in the Z-axis direction, so that the protruding tip end portions overlap when viewed from the Z-axis direction. The heat dissipation members 723 are not the same part, but different parts.

Each flange portion 731 and each intermediate flange portion 733 may have a divided structure as in the above-mentioned embodiment 1, etc. Alternatively, they may have a non-divided structure.

<Other embodiments>
The technology disclosed in this specification is not limited to the embodiments described above and illustrated in the drawings, and the following embodiments, for example, are also included in the technical scope.

(1) The bending angle of the flange portion 31 (each piece portion 32A, 32B) relative to the main body portion 30 can be changed appropriately to a value other than 45°, 90°, and 135° exemplified in each embodiment. For example, the bending angle of the first piece portion 32A relative to the main body portion 30 may be smaller than 90° or larger than 90°. The bending angles of the first piece portion 32A and the second piece portion 32B relative to the main body portion 30 may both be smaller than 90° or larger than 90°. Although the bending angle of the first piece portion 32A relative to the main body portion 30 may be smaller than 90°, the bending angle of the second piece portion 32B relative to the main body portion 30 may be larger than 90°. Although the bending angle of the first piece portion 32A relative to the main body portion 30 may be larger than 90°, the bending angle of the second piece portion 32B relative to the main body portion 30 may be smaller than 90°.

(2) The bending angle of the intermediate flange portion 33 (each intermediate piece portion 34A, 34B) can be appropriately changed to a value other than 45°, 90°, and 135° exemplified in each embodiment. For example, the bending angle of the first intermediate piece portion 34A relative to the main body portion 30 may be smaller than 90° or larger than 90°. The bending angles of the first intermediate piece portion 34A and the second intermediate piece portion 34B relative to the main body portion 30 may both be smaller than 90° or larger than 90°. Although the bending angle of the first intermediate piece portion 34A relative to the main body portion 30 may be smaller than 90°, the bending angle of the second intermediate piece portion 34B relative to the main body portion 30 may be larger than 90°. Although the bending angle of the first intermediate piece portion 34A relative to the main body portion 30 may be larger than 90°, the bending angle of the second intermediate piece portion 34B relative to the main body portion 30 may be smaller than 90°.

(3) Three or more types of pieces 32 having different bending angles relative to the main body 30 may be set. Similarly, three or more types of intermediate pieces 34 having different bending angles relative to the main body 30 may be set.

(4) The bending angle of the first piece 32A relative to the main body 30 may be different from the bending angle of the first intermediate piece 34A relative to the main body 30. Similarly, the bending angle of the second piece 32B relative to the main body 30 may be different from the bending angle of the second intermediate piece 34B relative to the main body 30.

(5) The flange portion 31 may have a plurality of first pieces 32A and a plurality of second pieces 32B arranged in succession in the Y-axis direction. Similarly, the intermediate flange portion 33 may have a plurality of first intermediate pieces 34A and a plurality of second intermediate pieces 34B arranged in succession in the Y-axis direction.

(6) The number of first pieces 32A and the number of second pieces 32B may be different. For example, there may be one of the first pieces 32A and the second pieces 32B and multiple of the other. Similarly, the number of first intermediate pieces 34A and the number of second intermediate pieces 34B may be different. For example, there may be one of the first intermediate pieces 34A and the second intermediate pieces 34B and multiple of the other.

(7) The specific number of installed pieces 32 (number of divisions) can be changed as appropriate. Similarly, the specific number of installed intermediate pieces 34 can be changed as appropriate. For example, the number of installed intermediate pieces 34 may be the same as the number of installed pieces 32, or the number of installed intermediate pieces 34 may be greater than the number of installed pieces 32. The number of installed first pieces 32A and second pieces 32B may be one each. The number of installed first intermediate pieces 34A and second intermediate pieces 34B may be one each.

(8) The flange portion 31 may be provided so as to be connected to a position on the circuit board 21 side (lower side) of the end portion (upper end portion) of the main body portion 30 opposite the circuit board 21 side. Similarly, the intermediate flange portion 33 may be provided so as to be connected to a position on the opposite side (upper side) of the circuit board 21 side of the end portion (lower end portion) of the main body portion 30 opposite the circuit board 21 side.

(9) The opposing heat dissipation members 23 may be in a relationship in which the flange portions 31 overlap over almost the entire area when viewed from the normal direction of the plate surface 21A of the circuit board 21. The degree of overlap of the flange portions 31 when viewed from the normal direction of the plate surface 21A of the circuit board 21 can be changed as appropriate.

(10) The opposing heat dissipation members 23 may be arranged such that at least a portion of each flange portion 31 overlaps when viewed from the normal direction of the plate surface 21A of the circuit board 21, but the flange portions 31 are not in contact with each other and are kept non-contacting. The heat dissipation members 23 may be arranged such that at least a portion of each intermediate flange portion 33 overlaps when viewed from the normal direction of the plate surface 21A of the circuit board 21, but the intermediate flange portions 33 are not in contact with each other and are kept non-contacting.

(11) The opposing heat dissipation members 23 may be arranged such that the side end faces 32A2, 32B1 of each piece 32A, 32B of each flange portion 31 do not face each other. The heat dissipation members 23 may be arranged such that the side end faces 34A2, 34B1 of each intermediate piece 34A, 34B of each intermediate flange portion 33 do not face each other.

(12) In the first to seventh embodiments, the opposing heat dissipation members 23 may be different parts rather than being the same part. In that case, for example, the protrusion amount from the main body 30 of the flange portion 31 and intermediate flange portion 33 of one heat dissipation member 23 may be different from the protrusion amount from the main body 30 of the flange portion 31 and intermediate flange portion 33 of the other heat dissipation member 23. The flange portion 31 and intermediate flange portion 33 of one heat dissipation member 23 may have a different base end position connected to the main body 30 from the flange portion 31 and intermediate flange portion 33 of the other heat dissipation member 23.

(13) In embodiments 1 to 4 and 8, when the opposing heat dissipation members 23 are attached to the circuit board 21, each heat dissipation member 23 may be attached individually.

(14) In embodiment 6, the opposing heat dissipation members 23 may be attached to the circuit board 21 together.

(15) It is also possible to combine the technical matters described in each embodiment as appropriate.

(16) The power element 22 may be attached to the heat dissipation member 23 by adhesive or the like, other than the mounting screw 25. In that case, it is also possible to omit the screw mounting hole 30B of the heat dissipation member 23.

(17) The case 11 may be configured with multiple sets of heat dissipation members 23 facing each other.

(18) The power element 22 may be a type other than a FET or a diode.

(19) The number and arrangement of the power elements 22 on the heat dissipation member 23 can be changed as appropriate. The number of power elements 22 installed on opposing heat dissipation members 23 may differ.

(20) The arrangement of the drive circuit 26 on the circuit board 21 can be changed as appropriate.

(21) The number and arrangement of the cooling fans 14 can be changed as appropriate. For example, the cooling fans 14 may be of a blowing type other than the blowing type described above.

(22) The cooling fan 14 can be omitted.

(23) The shape, size, accessories, and other configuration of the case 11 can be changed as appropriate.

(24) The power equipment 10 may be something other than a switching power supply. For example, it may be a DC power supply device or an AC power supply device. It may also be a rectifier, an uninterruptible power supply device (UPS), or a power conditioner (PCS) for solar power generation. The PCS may be a PCS that includes a power storage device or a PCS for electric vehicles. In addition, it may be used in lighting equipment such as facility/outdoor lighting equipment and UV equipment.

(25) An insulating sheet 24 can also be interposed between the power element 22, which is a diode, and the main body 30.

10, 110, 210, 310, 410, 510, 610, 710: Power equipment, 14, 614: Cooling fan, 20, 120, 420: Circuit board unit, 21, 121, 221, 321, 421, 521, 621: Circuit board, 21A, 421A: Board surface, 21A, 421A: Board surface, 22, 122, 222, 622: Power element, 23, 123, 223, 323, 423, 523, 623, 723: Heat dissipation member, 26: Drive circuit, 30, 130, 230, 330, 530, 630, 730: main body portion, 31, 131, 231, 431, 631, 731: flange portion, 32, 532: piece portion, 32A, 532A, 632A: first piece portion, 32A2: side end face (end face), 32B, 532B, 632B: second piece portion, 32B1: side end face (end face), 33, 633, 733: intermediate flange portion, 34A, 534A, 634A: first intermediate piece portion, 34B, 534B, 634B: second intermediate piece portion

Claims (6)

A circuit board;
A power element mounted on the circuit board;
a pair of heat dissipation members attached to the circuit board;
the heat dissipation member includes a main body portion attached to the circuit board and in contact with the power element, and a flange portion connected to the main body portion and spaced from a plate surface of the circuit board,
The pair of heat dissipation members are disposed such that the pair of main body portions are spaced apart from each other , and the pair of flange portions are disposed opposite each other so as to overlap at least partially with each other when viewed from a normal direction of a plate surface of the circuit board ,
The flange portion has a plurality of pieces,
The circuit board unit has a first piece and a second piece that is angled differently from the first piece with respect to the main body . The circuit board unit according to claim 1 , wherein the flange portion includes a plurality of at least one of the first arm portions and the second arm portions, and the first arm portions and the second arm portions are arranged alternately and repeatedly. The circuit board unit according to claim 2, wherein the first piece provided on one of the opposing heat dissipation members and the second piece provided on the other of the heat dissipation members are arranged so as to overlap when viewed from a normal direction to the plate surface of the circuit board. The circuit board unit according to claim 3 , wherein the first arm has an angle of 90° or less relative to the main body, whereas the second arm has an angle of smaller than that of the first arm. The circuit board unit according to claim 1 , wherein the pair of opposing heat dissipation members are a same component. A circuit board unit according to any one of claims 1 to 5 ,
a cooling fan that cools the circuit board unit.

Images