JP3577338B2 - Heat sink for electronic equipment - Google Patents

Description

[0001]
[Industrial applications]
The present invention relates to a pair of radiators provided in an upright state with respect to a substrate, or to a radiator plate of an electronic device which is hung between a radiator and a chassis and screwed to these.
[0002]
[Prior art]
FIG. 6 is a perspective view of an electronic device according to a conventional example.
[0003]
In this electronic device, a pair of radiators 2 and 3 are opposed to each other on a substrate 1 in an upright state. Then, the upper ends of the radiators 2 and 3 are horizontally bent inward over a predetermined width to form the mounting portions 2a and 3a. Both ends are mounted on both mounting portions 2a and 3a, and the heat sink 8 and the mounting portions 2a and 3a are screwed together with screws 6.
[0004]
The heat radiating plate 8 is made of a material having excellent heat conductivity such as aluminum or copper.
[0005]
FIG. 7 is a perspective view of an electronic apparatus according to another conventional example.
[0006]
In this electronic apparatus, the mounting portion 9a is formed by bending the upper end of the upright side plate of the chassis 9 to which the substrate 1 is attached horizontally inward, and the mounting portion of one radiator 2 provided substantially at the center of the substrate 1. The radiator plate 8 is placed between the radiator plate 2a and the radiator plate 2a.
[0007]
[Problems to be solved by the invention]
However, in a conventional electronic device, as shown in FIG. 8, when there is a step between the mounting portions 2a and 3a of the radiators 2 and 3 (or between the mounting portions 2a and 9a shown in FIG. When the two are connected by the plate 8, the distortion becomes a stress of deformation of the substrate 1, and the stress is applied to the soldering portions 10 a and 11 a of the semiconductor leads 10 and 11 attached to the radiators 2 and 3. .
[0008]
Stress is applied in the directions indicated by arrows F1 and F2 in the figure, and there is a disadvantage that the reliability of the soldered portions 10a and 11a is impaired due to the application of such stress.
[0009]
The present invention has been made based on such a background, and even if there is a step or an inclination between radiators to be connected or between a radiator and a chassis, a soldering portion of a semiconductor lead attached to a substrate and a radiator. It is an object of the present invention to provide a heat sink of an electronic device that can prevent stress from being applied to the heat sink.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention , a pair of radiators are arranged on a substrate so as to face each other in an upright state, and the upper ends of the radiators are horizontally bent to form mounting portions, respectively. Place both ends of the radiator plate on both mounting parts so as to be bridged, screw the radiator plate and both mounting parts with screws, and connect both radiators with the radiator plate. In the plate, a slit for stress release is formed near both sides of the screw of the radiator plate, and a radiator plate portion to which a screw partitioned by the slit is screwed is an elastic tongue. It is assumed that.
[0011]
[Action]
In the present invention, there is a step or inclination between the connected radiators, and when stress is applied to the radiator plate, the tongue piece portion sandwiched between the slits of the screwed portion is easily bent, and stress is applied to the substrate and the like. Nothing.
[0012]
【Example】
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0013]
The same parts as those in the conventional example are denoted by the same reference numerals, and redundant description will be omitted.
[0014]
FIG. 1 is a perspective view of an electronic apparatus according to an embodiment, and FIG. 2 is a side view of the same.
[0015]
In this embodiment, as shown in FIG. 1, a pair of stress relief slits is provided at opposite positions across the screw 6 of the radiator plate 5 connected to the mounting portions 2a and 3a of the radiators 2 and 3 by the screw 6. The heat radiation plate 5 is formed with the elastic tongues 12 and is divided by the slits 7 and into which the screw 6 is screwed. The slits 7, 7 and the tongue piece 12 are formed near the four corners of the heat sink 5 in correspondence with the screws 6.
[0016]
3 is a side view of the electronic device showing a state before screw tightening when there is a step between the mounting portions of the radiator, FIG. 4 is a partial cross-sectional view enlarging a portion A in FIG. 3, and FIG. FIG. As shown in FIG. 3, when the mounting portion 2 a is lower than the mounting portion 3 a, if the tongue piece 12 at that portion is to be fixed to the mounting portion 2 a by the screw 6, as shown in FIGS. 4 and 5. As described above, since the tongue piece 12 is bent downward from its base and abuts against the mounting portion 2a horizontally, the heat radiation plate 5 and the radiators 2 and 3 are firmly fixed by the screw 6 without causing the heat radiation plate 5 to be distorted. Can be connected.
[0017]
The direction in which the slit 7 is formed may be a direction perpendicular to this embodiment, or the slit 7 may not be formed up to the edge of the heat sink 5. In short, it is only necessary that the place where the screw 6 is screwed has flexibility downward.
[0018]
【The invention's effect】
As described above, according to the present invention, there is a step or inclination between the connected radiators , and when stress is applied to the radiator, the portion sandwiched between the slits of the screwed portion is easily bent and the substrate is Since no stress is applied to the semiconductor device and the like, the soldered portion of the semiconductor lead attached to the radiator is not damaged, and the reliability of the soldered portion and eventually the entire electronic device can be improved.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic apparatus according to an embodiment of the invention.
FIG. 2 is a side view of the electronic device according to the embodiment of the present invention.
FIG. 3 is a side view of the electronic device according to the embodiment of the present invention, showing a state before screw tightening when there is a step between the mounting portions of the radiator.
FIG. 4 is an enlarged partial sectional view of a portion A in FIG. 3;
FIG. 5 is an enlarged perspective view of a portion A in FIG. 3;
FIG. 6 is a perspective view of an electronic device according to a conventional example.
FIG. 7 is a perspective view of an electronic apparatus according to another conventional example.
FIG. 8 is a side view showing a state in which a heat sink is mounted in the conventional example when there is a step in the radiator and a problem in the conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate 2, 3 Heat sink 5 Heat sink 6 Screw 7 Slit 9 Chassis

Claims (2)

A pair of radiators are opposed to each other in a standing state on the substrate, and the upper ends of the radiators are horizontally bent to form mounting portions, and both ends of the radiator plate so as to be bridged between the two radiators. The heat sink and both mounting parts are screwed with screws, and both heat sinks are connected by the heat sink. A heat radiating plate for an electronic device, wherein a slit for stress relief is formed in the vicinity, and a radiating plate portion to which a screw partitioned by the slit is screwed is an elastic tongue . 2. The heat sink for an electronic device according to claim 1, wherein a semiconductor lead attached to said radiator is attached to said substrate by a soldering portion.

Images