JP7584085B2 - Partitioning materials and heating/cooling systems - Google Patents

Description

This disclosure relates to partition members and heating/cooling systems, and in particular to partition members and heating/cooling systems suitable for heating/cooling by radiation.

In recent years, radiant heating and cooling systems that use radiant heat to heat and cool rooms have been gaining attention as a heating and cooling method that combines energy conservation and comfort. A radiant heating and cooling system cools the ceiling, floor, etc. when cooling and heats them when heating, and cools and heats the room using radiant heat from the cooled or heated ceiling or floor. Heating and cooling using radiant heat is comfortable because there are no extreme temperature variations in the room, and the amount of heat required to cool or heat the ceiling, floor, etc. is less than that required for so-called convection heating and cooling systems. For this reason, radiant heating and cooling systems can be said to be more energy-efficient.

In the above-mentioned radiant heating and cooling system, temperature-adjusted air is supplied to the ceiling and floor surfaces from the space behind the cooling and heating room to cool or heat them. Even if there is no space in the space behind the cooling and heating room to install a duct to circulate the temperature-adjusted air, the following is an example of a radiant heating and cooling system that can efficiently transfer the cold or warmth contained in the temperature-adjusted air to the ceiling and floor surfaces. The radiant heating and cooling system comprises a partition member that divides the cooling and heating room. The partition member comprises a partition plate that forms the boundary of the cooling and heating room, a heat dissipation section formed on the surface facing the cooling and heating room, and a heat collection plate that contacts the heat dissipation section and protrudes into the space behind the cooling and heating room. In this radiant heating and cooling system, when temperature-adjusted air is circulated into the space behind the cooling and heating room, the heat of the air is received by the heat collection plate and transferred to the heat dissipation section, from which the heat is radiated into the cooling and heating room via finishing materials such as tile carpet or plastic tiles (see, for example, Patent Document 1).

JP 2015-040667 A

In the radiant heating and cooling system described in Patent Document 1, when the supply of temperature-conditioned air is stopped and heat transfer from the temperature-conditioned air to the partition members ceases, the temperature change in the finishing material becomes large, and the radiant effect during that time may become insufficient.

In consideration of the above-mentioned problems, the present disclosure provides a partition member and a heating and cooling system that can continue to radiate even if the air flow in the back space stops.

In order to achieve the above-mentioned object, a partition member according to a first aspect of the present disclosure comprises a partition plate that is disposed away from a building structural surface and partitions a space to be cooled or heated, and a heat collection plate that is attached to the partition plate in a rear space, which is the space between the building structural surface and the partition plate, and transfers cold or hot heat contained in the air present in the rear space to the partition plate, and the partition plate includes a front plate formed of a material with a specific heat of 650 to 25,000 kJ/ ^m3 ·K.

When configured in this way, the partition plate includes a top plate made of a material with the above-mentioned specific heat, so even if the air flow in the back space stops, the cold or warm heat stored in the top plate can be radiated to the space to be cooled or heated, allowing radiant heating and cooling to continue.

The partition member according to the second aspect of the present disclosure is the partition member according to the first aspect of the present disclosure, in which the partition plate includes a back plate that is positioned closer to the building structural surface than the front plate, and the back plate has a heat collection plate mounting claw that clamps a portion of the heat collection plate.

This configuration makes it easy to attach the heat collection plate to the partition plate.

The partition member according to the third aspect of the present disclosure is the partition member according to the first or second aspect of the present disclosure, in which the heat collection plate has a parallel heat collection section that extends along the surface of the partition plate at a predetermined distance from the partition plate, and a connecting heat collection section that connects the parallel heat collection section to the partition plate, and the parallel heat collection section has a plurality of tunnel-shaped fins.

By configuring it in this way, multiple fins are formed, so the surface area of the parallel heat collection section can be increased, and the amount of cold or hot heat collected from the air in the back space can be increased.

The partition member according to the fourth aspect of the present disclosure is a partition member according to any one of the first to third aspects of the present disclosure, in which the heat collection plate has a parallel heat collection section that spreads along the surface of the partition plate at a predetermined distance from the partition plate, a connecting heat collection section that connects the parallel heat collection section to the partition plate, and a flap that narrows the opening area downstream in the flow direction of air passing between the partition plate and the parallel heat collection section.

In this configuration, the provision of the flap allows the air passing between the partition plate and the parallel heat collection section to be forced to circulate to the rear surface of the partition plate, thereby increasing the heat transfer from the air to the partition plate.

The cooling and heating system according to the fifth aspect of the present disclosure includes a partition member according to any one of the first to fourth aspects of the present disclosure, and a temperature control device that controls the temperature of the air supplied to the rear space.

When configured in this way, the cold or warmth contained in the air is transferred to the partition plate, and heat is radiated from the partition plate, thereby cooling or heating the space to be cooled or heated.

According to the configuration of the present disclosure, the partition plate includes a surface plate formed of a material with a specific heat of 650 to 25,000 kJ/ ^m3 ·K, so that even if the air flow in the back space stops, the cold or hot heat stored in the surface plate can be radiated to the space to be cooled or heated, allowing radiant heating and cooling to continue.

1A is an exploded perspective view of a flooring material according to a first embodiment of the present disclosure, and FIG. 1B is a side view of the flooring material. 1A is an oblique view of a back panel that constitutes a flooring material, and FIG. 1B is an oblique view of the back panel with one heat collection plate attached. FIG. 11 is a schematic configuration diagram of a heating and cooling system according to a second embodiment of the present disclosure. 1A is a perspective view of a partition plate provided in a heating and cooling system, and FIG. 1B is a perspective view of the partition plate attached to a support leg. 1A is a perspective view of a heat collection plate according to a modified example, and FIG. 1B is a perspective view of a floor material according to a modified example.

The following describes the embodiments with reference to the drawings. Note that in each drawing, identical or similar reference numerals are used for identical or corresponding components, and duplicate explanations are omitted.

First, referring to FIG. 1, a flooring material 10 according to a first embodiment of the present disclosure will be described. FIG. 1(A) is an exploded perspective view of the flooring material 10, and FIG. 1(B) is a side view of the flooring material 10 installed on a floor surface BF as a building structural surface. In this specification, a building structural surface refers to a surface that forms the structure of a building, such as a floor, a wall, or a ceiling. The flooring material 10 is one form of a partition member, and in this embodiment, it is a member that forms the room floor RF of the cooling and heating room R to be cooled or heated (hereinafter referred to as "cooling and heating"). Since the flooring material 10 is installed and used on the floor surface BF, the following description will be given on the premise that it is installed on the floor surface BF, unless otherwise specified, for the sake of convenience. The flooring material 10 is a member for obtaining cold or hot heat from the air A supplied to the space S under the floor and radiating the cold or hot heat. A plurality of flooring materials 10 are arranged to form the room floor RF of the cooling and heating room R. The flooring 10 includes a partition plate 11 and a heat collection plate 16.

The partition plate 11 is a member of the floor material 10 that constitutes the floor surface of the cooling and heating room R. In this embodiment, the partition plate 11 has a front plate 12 and a back plate 13, which are stacked so that their surfaces are in contact with each other. The partition plate 11 is formed in a flat plate shape when viewed as a whole with the front plate 12 and the back plate 13 stacked. The shape and size of the partition plate 11 can be appropriately determined depending on the situation in which the floor material 10 is laid, such as the load capacity of the cooling and heating room R. In this embodiment, the partition plate 11 is formed in a square shape with one side of 250 mm. However, the partition plate 11 may have one side of 200 mm to 300 mm or other dimensions (for example, 900 mm x 1800 mm), and the shape is not limited to a square, but may be a rectangle, a rhombus, or other polygonal or geometric shape. The partition plate 11 is typically installed at a position away from the floor surface BF so that the flat surface is horizontal. This creates a space between the floor surface BF and the partition plate 11 (hereinafter referred to as "underfloor space S"). The underfloor space S is one form of rear space. The height of the underfloor space S (the distance from the floor surface BF of the partition plate 11) only needs to be a distance that can create a space in which the desired volume of air A can flow, and may be smaller than the space in which a duct can be installed.

The front plate 12 of the partition plate 11 is a member arranged on the side of the cooling and heating compartment R. The front plate 12 is formed in a flat plate shape from a material having the desired heat storage properties. A material having a volumetric specific heat of 650 to 25,000 kJ/m ³ ·K is used as the material for the front plate 12. In particular, from the viewpoint of improving the heat storage performance, the volumetric specific heat is preferably 1,000 kJ/m ³ ·K or more, more preferably 1,500 kJ/m ³ ·K or more, and even more preferably 2,000 kJ/m ³ ·K or more. On the other hand, from the viewpoint of accelerating the rise of the radiation effect, the volumetric specific heat is preferably 10,000 kJ/m ³ ·K or less, more preferably 8,000 kJ/m ³ ·K or less or 5,000 kJ/m ³ ·K or less, and even more preferably 3,000 kJ/m ³ ·K or less. Specific examples of the material of the top plate 12 include plywood, particle board, concrete board, calcium silicate board, etc. The thickness of the top plate 12 is preferably determined to be about 10 mm to 30 mm, typically about 20 mm, taking into consideration the specific heat of the material and the required heat storage amount, and the larger the specific heat, the thinner the top plate 12 can be, and the smaller the specific heat, the thicker the top plate 12 can be. Note that the thickness of the top plate 12 may be thicker than 30 mm or thinner than 10 mm, as long as it is suitable for the purpose of the cooling and heating room R in which the floor material 10 is installed. The top plate 12 may have a heat capacity that maintains the radiation effect for about 30 minutes to 1 hour after the supply of temperature-adjusted air A to the underfloor space S is stopped, and may have a heat capacity that maintains the radiation effect for about 2 hours to 3 hours or more.

The back plate 13 of the partition plate 11 is a member arranged on the side of the underfloor space S. The back plate 13 is preferably made of a material with high thermal conductivity, and is typically formed in a thin plate shape from metal such as iron or aluminum. The back plate 13 is formed with a heat collection plate mounting claw (hereinafter simply referred to as "mounting claw 13C") for mounting the heat collection plate 16. The mounting claw 13C is a small rectangular piece that is one step lower from the surface of the back plate 13 (protruding toward the underfloor space S), and it can be understood by also referring to Figure 2 (A). The mounting claw 13C can be formed by pressing. The number and arrangement of the mounting claws 13C will be described later. The back plate 13 may have fixing holes 13H formed in the four corners for passing fixing screws.

The heat collecting plate 16 is a member that transfers the cold or hot heat held by the air A present in the underfloor space S to the partition plate 11. The heat collecting plate 16 is attached to the back plate 13 so as to be present in the underfloor space S. The heat collecting plate 16 is preferably formed of a material with high thermal conductivity, typically a steel plate or an aluminum plate. The heat collecting plate 16 is formed by bending a thin plate-like member. In this embodiment, the heat collecting plate 16 is formed by bending the inner sides of both short sides of a rectangular thin plate-like member 90 degrees parallel to the short sides, and further bending the inner sides 90 degrees in the opposite direction parallel to the short sides. The heat collecting plate 16 is formed into a parallel portion 16E and a connection portion 16C by this bending process. The parallel portion 16E is a portion located in the longitudinal center of the rectangle before processing, and has a surface that extends parallel to the partition plate 11. The parallel portion 16E corresponds to a parallel heat collecting portion. The connection parts 16C are L-shaped sections at both longitudinal ends of the parallel part 16E. The connection parts 16C correspond to the connection heat collection parts. Both connection parts 16C extend vertically from one side of the parallel part 16E, and then extend parallel to the parallel part 16E on the side opposite to the side on which the parallel part 16E exists. This part of the connection part 16C that extends parallel to the parallel part 16E is the part that is connected to the back plate 13, and is also referred to as the connection part end 16CT.

A plurality of fins 16F are formed on the surface of the parallel portion 16E of the heat collecting plate 16. In this embodiment, each fin 16F is formed in a semi-cylindrical shape. Each fin 16F protrudes toward the inside of the heat collecting plate 16 (the side of the back plate 13). Each fin 16F is arranged in a direction in which the axis of the semicircle is parallel to the boundary line between the parallel portion 16E and the connecting portion 16C. Both sides of the semicircle (sides parallel to the axis) of each fin 16F are connected to the surface of the parallel portion 16E, and the inside of the semi-cylindrical shape is hollow and formed like a tunnel. The multiple fins 16F are arranged at a predetermined interval vertically and horizontally, and are offset by half a row every other row. Each fin 16F can be formed by cutting and raising by press processing.

Typically, four mounting claws 13C are formed for each heat collecting plate 16 for attaching the heat collecting plate 16 to the back plate 13. In other words, one heat collecting plate 16 is supported by four mounting claws 13C. In this embodiment, two heat collecting plates 16 are attached to one back plate 13, so eight mounting claws 13C are formed on one back plate 13. The heat collecting plate 16 is provided in each area obtained by bisecting the back plate 13 by a virtual straight line VL (see FIG. 2B). The virtual straight line VL is a virtual straight line connecting the midpoints of a pair of opposing sides of the four sides that form the outer edge of the back plate 13. Each heat collecting plate 16 is arranged so that the semi-cylindrical axis of the fin 16F is perpendicular to the virtual straight line VL. Each heat collecting plate 16 is supported by the mounting claws 13C in a manner in which the surface of the connection end 16CT is in contact with the surface of the back plate 13. Each heat collecting plate 16 has its connection end 16CT supported by a mounting claw 13C extending parallel to the virtual line VL at the end closest to the virtual line VL, and at the end farthest from the virtual line VL by a mounting claw 13C extending perpendicular to the virtual line VL. Each mounting claw 13C closest to the virtual line VL is connected to the surface of the back plate 13 at the edge closest to the virtual line VL. Each mounting claw 13C farthest from the virtual line VL is connected to the surface of the back plate 13 at the outer edge in a direction perpendicular to the axis of the fin 16F. Each heat collecting plate 16 can be sandwiched between each mounting claw 13C by contacting a part of the surface of the connection end 16CT with the surface of the back plate 13 near the edge of the back plate 13 parallel to the virtual line VL, and then moving the heat collecting plate 16 along the surface of the back plate 13 toward the virtual line VL.

The flooring material 10 constructed as described above is typically laid on the floor surface BF using the support legs 19, as shown in FIG. 1(B). The support legs 19 have a lower plate 19R, a support rod 19S, and an upper plate 19T, as shown in FIG. 1(A). The lower plate 19R is a plate-shaped member that contacts the floor surface BF and is configured to be fixed to the floor surface BF using adhesive, anchors, etc. If it is not necessary to fix the lower plate 19R to the floor surface BF, it may be simply placed on the floor surface BF without using adhesive or anchors. The support rod 19S is a member that connects the lower plate 19R and the upper plate 19T while maintaining the distance between them. The length of the support rod 19S affects the height of the underfloor space S. The support rod 19S is attached perpendicular to the surface of the lower plate 19R. The support rod 19S may be configured to be able to adjust the height using a nut or a long nut. The upper plate 19T is a member on which the partition plate 11 is placed. The upper plate 19T is attached to the support rod 19S so that its surface is perpendicular to the support rod 19S. The upper plate 19T is designed so that a corner of one partition plate 11 is placed on one of four imaginary equal areas in the front, back, left and right directions. Therefore, the corners of four partition plates 11 can be placed on one upper plate 19T. The upper plate 19T may be attached with a nut that receives a screw that has passed through the fixing hole 13H of the back plate 13. This nut is preferably attached so that it protrudes from the lower side of the upper plate 19T (the side of the lower plate 19R).

Next, referring to FIG. 3, a cooling and heating system 1 according to a second embodiment of the present disclosure will be described. FIG. 3 is a diagram showing a schematic configuration of the cooling and heating system 1. In the following description of the cooling and heating system 1, when referring to the configuration of the flooring 10, FIG. 1 and FIG. 2 will be referred to as appropriate. The cooling and heating system 1 includes a plurality of floorings 10 described above, a partition plate 30 that divides the underfloor space S (see FIG. 1B), an air conditioner 91, and a floor panel (described later) for a different purpose from the flooring 10. The air conditioner 91 is a device that adjusts the temperature of air to generate temperature-controlled air A (air with a regulated temperature), and corresponds to a temperature control device. In this embodiment, a general-purpose room air conditioner is used as the air conditioner 91, and it is installed on the ceiling of the cooling and heating room R. In FIG. 3, for the sake of convenience, the boundaries of the floorings 10 are indicated by dashed lines, and the part where the partition plate 30 is installed is indicated by a solid line (excluding the outer periphery).

A plurality of floor materials 10 are placed on the floor surface BF (see FIG. 1B) and arranged in a checkerboard pattern. In place of the floor material 10, a duct-connected floor 81 is arranged in one corner of the heating and cooling room R. The duct-connected floor 81 is a floor on which a connection port 81H of a supply duct 92 that guides the temperature-controlled air A to the underfloor space S (see FIG. 1B) is formed. A return-ported floor 83 is arranged diagonally from the duct-connected floor 81 in the heating and cooling room R. The return-ported floor 83 is a floor on which a return port 83H is formed that moves the temperature-controlled air A in the underfloor space S into the heating and cooling room R. The duct-connected floor 81 and the return-ported floor 83 are not provided with a heat collection plate 16 (see FIG. 1). In addition, a floor panel 82 is arranged along the entirety of one of the two outer peripheries extending from the corner where the duct connection floor 81 is arranged, so as to continue to the duct connection floor 81. In addition, a floor panel 84 is arranged along the entirety of the side opposite the arranged floor panel 82, so as to continue to the return port-equipped floor 83. The floor panels 82 and 84 are typically the same, but for convenience of explanation, they are distinguished by different reference numerals depending on their arrangement. The floor panels 82 and 84 are typically the floor material 10 from which the heat collecting plate 16 has been removed, but panels of different materials may be used in place of the front plate 12 and/or back plate 13 as long as they are the same size as the partition plate 11. In the example shown in FIG. 3, floor materials 10 are arranged on the floor surface BF of the 2500 mm x 2500 mm cooling/heating room R, the number of which is 10 x 10 minus the number of duct-connected floors 81, floor panels 82, floors with reflux ports 83, and floor panels 84. In the example shown in FIG. 3, one duct-connected floor 81 and one floor with reflux ports 83 are arranged, and nine floor panels 82 and nine floor panels 84 are arranged, so 80 floor materials 10 are arranged.

As shown in FIG. 4A, the partition plate 30 is formed of a generally rectangular plate-like member. The partition plate 30 has two pairs of opposing rectangular sides, one pair of sides 31 of which has the same length as one side of the partition plate 11 (250 mm in this embodiment), and the other pair of sides 32 has the same length as the height of the underfloor space S. A bent portion 33 is provided at both ends of each pair of sides 31. The bent portion 33 is a small piece that extends at an angle of 90 degrees to the surface of the partition plate 30. The partition plate 30 is typically formed of metal, and is formed by punching out the bent portion 33 as a single piece and then bending the bent portion 33 by 90 degrees. However, the partition plate 30 may also be formed by molding the bent portion 33 as a single piece from a synthetic resin.

As shown in FIG. 4B, the partition plate 30 is arranged by attaching the bent portion 33 to the support leg 19. When one end of the side 31 of the partition plate 30 is taken into consideration, one bent portion 33 is sandwiched between the floor surface BF and the lower plate 19R, and the bent portion 33 of the opposing side 31 is sandwiched between the upper plate 19T and the partition plate 11, so that the partition plate 30 is installed. As shown in FIG. 3, the partition plates 30 are arranged in a direction perpendicular to the arrangement direction of the floor panels 82 from the row in which the floor panels 82 are arranged to the row in which the floor panels 84 are arranged in the portion where the floor material 10 is laid. In this embodiment, there are 10 rows of floor materials 10 arranged in a direction perpendicular to the arrangement direction of the floor panels 82, and the partition plate 30 is arranged between the rows of the floor materials 10. Therefore, in this embodiment, there are 9 rows of partition plates 30. Strictly speaking, the partition plate 30 is offset from the space between the rows of flooring 10 by half the width of the lower plate 19R (upper plate 19T), but for convenience, it is considered to be disposed between the rows of flooring 10. The partition plate 30 is not provided in the area where the duct connection floor 81, the return port floor 83, and the floor panels 82 and 84 are disposed. The flooring 10 is arranged so that the axis of the fin 16F of the heat collection plate 16 is parallel to the direction in which the partition plate 30 extends. The surfaces of the flooring 10 and the like arranged on the floor surface BF are typically provided with a finishing material (not shown) such as tile carpet or P tile.

Continuing with reference to Figures 1 to 3, the operation of the flooring 10 and the heating and cooling system 1 will be described. The operation of the flooring 10 will be described as part of the operation of the heating and cooling system 1. In the heating and cooling system 1, temperature-controlled air A, whose temperature is controlled by the air conditioner 91, is generated. The temperature-controlled air A is supplied to the underfloor space S directly below the duct-connected floor 81 via the supply duct 92. The temperature-controlled air A that flows into the underfloor space S flows along the partition plate 30 from directly below the flooring 10 adjacent to the duct-connected floor 81 to directly below the floor panel 84. At the same time, the temperature-controlled air A flows along the arrangement of the floor panels 82 in the underfloor space S from directly below the floor panel 82 adjacent to the duct-connected floor 81 to directly below the floor panel 82 on the opposite side of the duct-connected floor 81. The temperature-controlled air A that flows in the underfloor space S along the arrangement of the floor panels 82 also enters directly below the flooring 10 adjacent to each floor panel 82. At this time, since the heat collecting plate 16 is not provided on the back surface of the floor panel 82, the temperature-controlled air A flows toward the opposite side of the duct-connected floor 81, and can relatively easily flow into the area directly below the floor material 10 at a right angle to the flow direction. After entering the underfloor space S directly below the floor material 10 from the underfloor space S directly below the floor panel 82, the temperature-controlled air A flows along the partition plate 30 in the underfloor space S toward the area directly below the floor panel 84. In this way, the temperature-controlled air A supplied to the underfloor space S directly below the duct-connected floor 81 flows row by row through the underfloor space S directly below the rows of multiple floor materials 10 (10 rows in this embodiment) toward the underfloor space S directly below the floor panel 84 or the floor 83 with a return port.

When the temperature-controlled air A flows through the underfloor space S directly below the rows of the floor materials 10, the floor materials 10 are arranged so that the axis of the fins 16F of the heat collecting plate 16 is parallel to the partition plate 30, so that the temperature-controlled air A also passes through the heat collecting plate 16 between the parallel portion 16E and the back plate 13. In other words, when the temperature-controlled air A flows through the underfloor space S directly below the rows of the floor materials 10, it flows along the floor surface BF, the surface of the back plate 13, the surface of the heat collecting plate 16, and the surface of the partition plate 30. When the temperature-controlled air A flows along the surface of the back plate 13 and the surface of the heat collecting plate 16, it transfers cold heat (when cooling) or hot heat (when heating) to the back plate 13 and the heat collecting plate 16. At this time, since the heat collecting plate 16 has multiple fins 16F, the heat transfer area is increased, and the amount of heat transferred from the temperature-controlled air A to the heat collecting plate 16 can be increased. The heat collection plate 16, which obtains cold or hot heat from the temperature-controlled air A, transfers the cold or hot heat to the back plate 13 to which the heat collection plate 16 is connected.

The back plate 13, which has received cold or hot heat from the temperature-controlled air A and the heat collecting plate 16, transfers the cold or hot heat to the front plate 12. As a result, the front plate 12 is cooled during cooling and heated during heating. The front plate 12 has a relatively large heat capacity, so it can store a relatively large amount of heat. From the cooled or heated front plate 12, cold or hot heat is radiated to the cooling/heating room R through the finishing material (not shown), and the cooling/heating room R is cooled or heated. The temperature-controlled air A flowing through the flow path divided by the partition plate 30 in the underfloor space S gives cold or hot heat to the heat collecting plates 16 it encounters one after another until it reaches the floor panel 84 at the end of the flow path or directly below the floor 83 with a return port. As a result, cold or hot heat is radiated from each floor material 10 to the cooling/heating room R, and the entire cooling/heating room R is cooled or heated. The temperature-controlled air A that reaches the underfloor space S directly below the floor panel 84 from each row of the multiple flooring materials 10 changes direction and flows toward the floor with reflux port 83. The temperature-controlled air A that reaches directly below the floor with reflux port 83 flows into the cooling and heating room R through the reflux port 83H. The temperature-controlled air A that reaches the cooling and heating room R is sucked into the air conditioner 91, where the temperature is adjusted again and supplied to the underfloor space S below the duct-connected floor 81 through the supply duct 92, and the above-mentioned action is repeated thereafter.

When the supply of temperature-controlled air A from the air conditioner 91 is stopped, the supply of temperature-controlled air A to the underfloor space S is also stopped. When the supply of new temperature-controlled air A to the underfloor space S is stopped, the temperature in the underfloor space S approaches the ambient temperature. At this time, if the thermal capacity of the floor of the cooling and heating room R where the cold or hot heat is radiated is small, the temperature of the floor approaches the ambient temperature in a relatively short time, and the radiation effect is insufficient. In this regard, since the thermal capacity of the surface plate 12 of the floor material 10 according to this embodiment is large, even if the supply of new temperature-controlled air A to the underfloor space S is stopped, the surface plate 12 is unlikely to approach the ambient temperature, and radiation from the surface plate 12 to the cooling and heating room R can be continued. If the radiation effect can be maintained even if the air conditioner 91 is stopped for a relatively long period of time in consideration of the energy balance due to the heat storage effect of the surface plate 12, it is also possible to save energy by planning to stop the air conditioner 91 periodically.

As described above, the flooring 10 according to the first embodiment and the heating and cooling system 1 according to the second embodiment including this flooring 10 have the following advantages. Because the flooring 10 includes the heat collection plate 16, the amount of cold or hot heat acquired by the partition plate 11 from the temperature-controlled air A can be increased. In addition, the back plate 13 is formed with mounting claws 13C, and the heat collection plate 16 can be attached to the back plate 13 by being clamped between the mounting claws 13C, so that a heat collection plate 16 with a simple configuration and high heat collection efficiency can be obtained. In addition, because the heat capacity of the front plate 12 is large, radiation from the front plate 12 to the cooling and heating room R can be continued even if the supply of new temperature-controlled air A to the underfloor space S is stopped.

Next, referring to FIG. 5(A), a heat collection plate 16A according to a modified example will be described. This heat collection plate 16A is provided in place of the heat collection plate 16 (see FIG. 1(A)) in the flooring material 10 (see FIG. 1(A)). The heat collection plate 16A differs from the heat collection plate 16 (see FIG. 1(A)) in the following points. The heat collection plate 16A has fins 16F protruding outward (downward) from the heat collection plate 16. The configuration of the fins 16F themselves other than the protruding direction is the same as that of the heat collection plate 16 (see FIG. 1(A)). The heat collection plate 16A is also provided with a flap 16S. The flap 16S is a plate-shaped member provided at an angle upward from the end edge of the parallel portion 16E downstream of the flow direction of the temperature-controlled air A. As shown in FIG. 5B, the flap 16S is sized so that when the heat collecting plate 16A is attached to the back plate 13, the upper end does not contact the back plate 13, and a slit-shaped gap 16H is formed between the flap 16S and the back plate 13. The flap 16S plays a role in narrowing the opening area on the downstream side of the flow direction of the temperature-controlled air A passing through the inside of the heat collecting plate 16A. The gap 16H has the same width as the width of the parallel portion 16E, and the height is formed to a size such that the flow velocity of the temperature-controlled air A passing through the gap 16H is a desired flow velocity. The desired flow velocity of the temperature-controlled air A passing through the gap 16H is a flow velocity that can increase the heat transfer from the temperature-controlled air A to the back plate 13 by forcing the temperature-controlled air A to circulate on the surface of the back plate 13. This flow velocity may be, for example, 3 m/s or more, more preferably 5 m/s or more, and preferably 8 m/s or less from the viewpoint of noise prevention, but may be 8 m/s depending on the situation. The heat collecting plate 16A has a connecting portion 16C that is perpendicular to the parallel portion 16E and expands to cover the side of the portion extended by the flap 16S. When the heat collecting plate 16A configured in this manner is used, the flow rate of the temperature-controlled air A flowing along the surface of the back plate 13 can be increased, and the heat transfer from the temperature-controlled air A to the back plate 13 can be increased.

In the above explanation, the partition plate 11 has a front plate 12 and a back plate 13, but if the heat collecting plates 16, 16A can be directly attached to the front plate 12 and the cold or hot heat contained in the temperature-controlled air A can be transferred to the front plate 12, the back plate 13 may be omitted. Alternatively, one or more intermediate plates may be provided between the front plate 12 and the back plate 13. Examples of intermediate plates include insole cushioning material made of conductive resin or rubber with high thermal conductivity.

In the above description, the back plate 13 is formed from a thin metal plate, but it may be formed from a material other than metal (e.g., synthetic resin, etc.). However, from the viewpoint of effectively transferring the heat contained in the temperature-controlled air A to the front plate 12, and from the viewpoint of being able to easily form the mounting claws 13C by press processing, it is preferable that it be formed from metal.

In the above description, the fins 16F on the heat collection plate 16 are semi-cylindrical, but they may be of a shape other than semi-cylindrical, such as a semi-triangular tube. The fins 16F may protrude inward or outward. In other words, the fins 16F of the heat collection plate 16 may protrude outward (downward) from the heat collection plate 16, and the fins 16F of the heat collection plate 16A may protrude inward (upward) from the heat collection plate 16A.

In the above description, the partition member is a floor material 10 installed on the floor surface BF, but it may also be a wall material installed on a wall surface or a ceiling material suspended from a ceiling surface.

In the above explanation, the air temperature regulator is an air conditioner 91, but it can be anything that can regulate the air temperature, such as a fan coil unit.

10 Flooring (compartment member)
11 Partition plate 12 Front plate 13 Back plate 13C Mounting claw (heat collecting plate mounting claw)
16, 16A heat collecting plate 16C connection part (connection heat collecting part)
16E Parallel section (parallel heat collection section)
16F Fin 16S Flap 91 Air conditioner (temperature control device)
BF Floor surface (architectural structure surface)
R Cooling and heating room (space to be cooled and heated)
S Underfloor space (rear space)

Claims (5)

A partition plate that is provided away from the building structural surface and partitions a space to be cooled or heated;
A heat collecting plate is attached to the partition plate in a back space between the building structural surface and the partition plate, and transfers cold or hot heat contained in the air present in the back space to the partition plate.
The partition plate includes a surface plate formed of a material having a specific heat of 650 to 25,000 kJ/ ^m3 ·K;
The heat collecting plate has a parallel heat collecting section that extends along the surface of the partition plate at a predetermined distance from the partition plate, and a connecting heat collecting section that connects the parallel heat collecting section to the partition plate,
The parallel heat collecting section has a plurality of tunnel-shaped fins.
Partitioning member. The heat collecting plate has a flap that narrows the opening area downstream in the flow direction of the air passing between the partition plate and the parallel heat collecting section.
The partition member according to claim 1 . A partition plate that is provided away from the building structural surface and partitions a space to be cooled or heated;
A heat collecting plate is attached to the partition plate in a back space between the building structural surface and the partition plate, and transfers cold or hot heat contained in the air present in the back space to the partition plate.
The partition plate includes a surface plate formed of a material having a specific heat of 650 to 25,000 kJ/ ^m3 ·K;
The heat collecting plate has a parallel heat collecting section that spreads along the surface of the partition plate at a predetermined distance from the partition plate, a connecting heat collecting section that connects the parallel heat collecting section to the partition plate, and a flap that narrows the opening area downstream in the flow direction of the air passing between the partition plate and the parallel heat collecting section.
Partitioning member. The partition plate includes a back plate disposed closer to the building structural surface than the front plate,
The back plate has a heat collection plate mounting claw that clamps a part of the heat collection plate.
The partition member according to any one of claims 1 to 3 . A partition member according to any one of claims 1 to 4,
A temperature adjusting device that adjusts the temperature of the air supplied to the back space.
Heating and cooling system.