JP7591024B2 - SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - Google Patents

Description

The present invention relates to a substrate processing apparatus and a substrate processing method for cleaning substrates.

Substrate processing equipment is used to carry out various processes on various substrates, such as FPD (Flat Panel Display) substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, or solar cell substrates. Substrate cleaning equipment is used to clean substrates.

For example, the substrate cleaning device described in Patent Document 1 includes two suction pads that hold the peripheral edge of the back surface of the wafer, a spin chuck that holds the central part of the back surface of the wafer, and a brush that cleans the back surface of the wafer. The two suction pads hold the wafer and move laterally. In this state, the central part of the back surface of the wafer is cleaned with the brushes. The spin chuck then receives the wafer from the suction pads, and rotates while holding the central part of the back surface of the wafer. In this state, the peripheral edge of the back surface of the wafer is cleaned with the brushes.

Patent No. 5904169

In a substrate cleaning device, the cleanliness of the brush gradually deteriorates as substrate cleaning is repeated. When the cleanliness of the brush deteriorates, the substrate cannot be properly cleaned.

In the above-mentioned substrate cleaning apparatus, the brush is provided with its upper surface exposed for cleaning the wafer. In order to prevent the cleanliness of the brush from decreasing, it is conceivable to discharge a cleaning liquid onto the brush and clean the brush. However, if the cleaning liquid used to clean the brush is splashed inside the substrate cleaning apparatus, the splashed cleaning liquid may cause a decrease in the cleanliness of the substrate and its cleaning environment.

The object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can prevent a substrate from being cleaned with a brush whose cleanliness has been degraded, and that can reduce the degradation of the substrate's cleanliness and the degradation of the substrate's cleaning environment that are caused by brush cleaning.

According to one aspect of the present invention, there is provided a substrate processing apparatus comprising: a processing chamber; a transport device configured to perform a load operation for loading a substrate into the processing chamber and an unload operation for unloading a substrate from the processing chamber; a first substrate holding unit provided within the processing chamber and configured to hold the substrate loaded by the transport device; a brush cleaning unit provided within the processing chamber and configured to bring a brush into contact with the substrate held by the first substrate holding unit to clean an underside of the substrate; a cleaning nozzle provided within the processing chamber and configured to eject a brush cleaning liquid onto the brush for cleaning the brush; a cleaning liquid supply unit which supplies the brush cleaning liquid to the cleaning nozzle; and a control unit which controls the cleaning liquid supply unit to control a period during which the loading operation by the transport device is performed and a period during which the transport device is not loaded. and a control unit that stops the supply of the brush cleaning liquid to the cleaning nozzle during at least a portion of the period during which the ejection operation is performed, the brush cleaning unit including the brush and a brush moving unit configured to move the brush between a cleaning position in contact with the underside of the substrate held by the first substrate holding unit and a standby position spaced apart from the substrate held by the first substrate holding unit, the cleaning nozzle being configured to eject brush cleaning liquid to the brush in the standby position, and the control unit controls the cleaning liquid supply unit to stop the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position .

A substrate processing apparatus according to another aspect of the present invention includes a first substrate holding part configured to hold a substrate, a brush cleaning part configured to contact a substrate held by the first substrate holding part to clean an underside of the substrate, a second substrate holding part configured to hold a substrate, a processing part for performing a predetermined processing on the substrate held by the second substrate holding part, a relative movement part that performs a relative movement operation to change a relative position between the first substrate holding part and the substrate by moving at least one of the first substrate holding part, the second substrate holding part, and the substrate in order to switch a state in which the substrate is held by the first substrate holding part to a state in which the substrate is held by the second substrate holding part, a cleaning nozzle configured to be able to eject a brush cleaning liquid onto the brush for cleaning the brush, a cleaning liquid supply part that supplies the brush cleaning liquid to the cleaning nozzle, and a control part for controlling the cleaning liquid supply part. and a processing chamber accommodating the first substrate holding unit, the brush cleaning unit, the second substrate holding unit, the processing unit, the cleaning nozzle, and the cleaning liquid supply unit , wherein the brush cleaning unit includes the brush and a brush moving unit configured to be able to move the brush between a cleaning position in contact with the underside of the substrate held by the first substrate holding unit and a standby position spaced apart from the substrate held by the first substrate holding unit, and the cleaning nozzle is configured to be able to eject brush cleaning liquid to the brush in the standby position, and the control unit controls the cleaning liquid supply unit to stop the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position .

According to yet another aspect of the present invention, a substrate processing apparatus includes a first substrate holding unit configured to hold a substrate, a brush cleaning unit configured to bring a brush into contact with the substrate held by the first substrate holding unit to clean an underside of the substrate, a cleaning nozzle configured to eject a brush cleaning liquid onto the brush for cleaning the brush, a cleaning liquid supply unit that supplies the brush cleaning liquid to the cleaning nozzle, a control unit that controls the cleaning liquid supply unit to stop the supply of the brush cleaning liquid to the cleaning nozzle for at least a portion of a period during which the substrate is held by the first substrate holding unit , and a control unit that controls the first substrate holding unit, the brush cleaning unit, the cleaning liquid supply unit, and the cleaning nozzle. The brush cleaning unit includes a processing chamber that accommodates a nozzle and the cleaning liquid supply unit , and the brush cleaning unit includes the brush and a brush moving unit configured to move the brush between a cleaning position in which it contacts the underside of the substrate held by the first substrate holding unit and a standby position spaced apart from the substrate held by the first substrate holding unit, and the cleaning nozzle is configured to be able to eject brush cleaning liquid to the brush in the standby position, and the control unit controls the cleaning liquid supply unit to stop the supply of brush cleaning liquid from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in a position other than the standby position .

According to yet another aspect of the present invention, a substrate processing apparatus includes a first substrate holding part configured to hold a substrate, a brush that contacts an underside of a substrate to clean the underside, a brush moving part configured to be able to move the brush between a cleaning position where the brush contacts the underside of a substrate held by the first substrate holding part and a standby position that is below the first substrate holding part and spaced apart from the substrate held by the first substrate holding part, a second substrate holding part provided at a position above the first substrate holding part and configured to hold a substrate, a processing part that performs a predetermined processing on the substrate held by the second substrate holding part, a cleaning nozzle configured to be able to eject a brush cleaning liquid onto the brush for cleaning the brush, and a brush moving part configured to move the brush between the cleaning position and a standby position that is below the first substrate holding part and spaced apart from the substrate held by the first substrate holding part. the control unit controls the cleaning liquid supply unit to stop the supply of the brush cleaning liquid to the cleaning nozzle when a substrate is held by the second substrate holding unit and the brush is in a position other than the standby position ; and a processing chamber accommodating the first substrate holding unit, the brush, the brush moving unit, the second substrate holding unit, the processing unit, the cleaning nozzle and the cleaning liquid supply unit , wherein the cleaning nozzle is configured to be able to eject brush cleaning liquid onto the brush which is in the standby position, and the control unit controls the cleaning liquid supply unit to stop the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position .

According to yet another aspect of the present invention, a substrate processing apparatus includes a first substrate holding unit configured to hold a substrate, a brush cleaning unit configured to contact a substrate held by the first substrate holding unit to clean an underside of the substrate, a second substrate holding unit provided at a position higher than the first substrate holding unit and configured to hold a substrate, a processing unit that performs a predetermined processing on the substrate held by the second substrate holding unit, a cleaning nozzle configured to eject a brush cleaning liquid onto the brush for cleaning the brush, a cleaning liquid supply unit that supplies the brush cleaning liquid to the cleaning nozzle, an operation unit for inputting supply conditions of the brush cleaning liquid by the cleaning liquid supply unit during a period in which the processing unit performs the predetermined processing on the substrate, a reception unit that receives the supply conditions of the brush cleaning liquid input by the operation unit, and a control unit that controls the cleaning liquid supply unit in accordance with the supply conditions received by the reception unit. and a processing chamber accommodating the first substrate holding unit, the brush cleaning unit, the second substrate holding unit, the processing unit, the cleaning nozzle, and the cleaning liquid supply unit, wherein the brush cleaning unit includes the brush and a brush moving unit configured to be able to move the brush between a cleaning position in contact with the underside of the substrate held by the first substrate holding unit and a standby position spaced apart from the substrate held by the first substrate holding unit, and the cleaning nozzle is configured to be able to eject brush cleaning liquid to the brush in the standby position, and the control unit controls the cleaning liquid supply unit to stop the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position .
According to yet another aspect of the present invention, a substrate processing apparatus includes a processing chamber, a substrate holding section provided within the processing chamber for holding a substrate, a brush provided within the processing chamber and capable of cleaning an underside of a substrate held by the substrate holding section, a cleaning nozzle provided within the processing chamber and configured to be capable of ejecting brush cleaning liquid into the brush for cleaning the brush, a cleaning liquid supply section for supplying the brush cleaning liquid to the cleaning nozzle, a brush moving section configured to be capable of moving the brush between a cleaning position in contact with the underside of the substrate held by the substrate holding section and a standby position spaced apart from the substrate held by the substrate holding section, and a control section for controlling the cleaning liquid supply section to stop the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position.

A substrate processing method according to yet another aspect of the present invention includes the steps of: loading a substrate into a processing chamber using a transport device configured to be capable of a load operation for loading a substrate into a processing chamber and an unload operation for unloading a substrate from the processing chamber; holding the substrate loaded by the transport device with a first substrate holding part within the processing chamber; cleaning an underside of the substrate by contacting a brush with the substrate held by the first substrate holding part within the processing chamber; supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle within the processing chamber, thereby ejecting the brush cleaning liquid from the cleaning nozzle onto the brush; and ejecting the substrate from the processing chamber using the transport device, wherein the step of ejecting the brush cleaning liquid onto the brush comprises the steps of: The method includes stopping the supply of the brush cleaning liquid to the cleaning nozzle during at least a portion of the period during which the loading operation and the unloading operation are performed by the transport device, and the step of cleaning the underside of the substrate includes moving the brush between a cleaning position in contact with the underside of the substrate held by the first substrate holding part and a standby position spaced apart from the substrate held by the first substrate holding part, and the cleaning nozzle is configured to be able to eject brush cleaning liquid onto the brush in the standby position, and the step of ejecting the brush cleaning liquid onto the brush further includes stopping the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position .

A substrate processing method according to yet another aspect of the present invention includes the steps of holding a substrate with a first substrate holding part, contacting a brush with the substrate held by the first substrate holding part to clean an underside of the substrate, holding the substrate with a second substrate holding part, performing a predetermined process on the substrate held by the second substrate holding part, performing a relative movement operation to change a relative position between the first substrate holding part and the substrate by moving at least one of the first substrate holding part, the second substrate holding part, and the substrate in order to switch a state in which the substrate is held by the first substrate holding part to a state in which the substrate is held by the second substrate holding part, and supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle, thereby discharging the brush cleaning liquid from the cleaning nozzle onto the brush. the step of ejecting the brush cleaning liquid onto the brush includes stopping the supply of the brush cleaning liquid to the cleaning nozzle during the relative movement operation, the first substrate holding part, the brush, the second substrate holding part and the cleaning nozzle are housed within a processing chamber, the step of cleaning the underside of the substrate includes moving the brush between a cleaning position in which it contacts the underside of the substrate held by the first substrate holding part and a standby position spaced apart from the substrate held by the first substrate holding part, the cleaning nozzle is configured to be able to eject brush cleaning liquid onto the brush in the standby position, and the step of ejecting the brush cleaning liquid onto the brush further includes stopping the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position .

A substrate processing method according to yet another aspect of the present invention includes the steps of holding a substrate with a first substrate holding part, contacting a brush with the substrate held by the first substrate holding part to clean an underside of the substrate, and supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle, thereby discharging the brush cleaning liquid from the cleaning nozzle onto the brush, wherein the step of discharging the brush cleaning liquid onto the brush includes stopping the supply of the brush cleaning liquid to the cleaning nozzle for at least a portion of a period during which the substrate is held by the first substrate holding part, and The brush and the cleaning nozzle are housed in a processing chamber, and the step of cleaning the underside of the substrate includes moving the brush between a cleaning position in which it contacts the underside of the substrate held by the first substrate holding part and a standby position spaced apart from the substrate held by the first substrate holding part, and the cleaning nozzle is configured to be able to eject brush cleaning liquid onto the brush in the standby position, and the step of ejecting the brush cleaning liquid onto the brush further includes stopping the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position .

A substrate processing method according to still another aspect of the present invention includes the steps of holding a substrate by a first substrate holding part, moving a brush, which contacts an underside of a substrate to clean the underside, between a cleaning position where the brush contacts the underside of the substrate held by the first substrate holding part and a standby position below the first substrate holding part and spaced apart from the substrate held by the first substrate holding part, holding a substrate by a second substrate holding part provided at a position above the first substrate holding part, performing a predetermined processing on the substrate held by the second substrate holding part, and supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle to apply the brush cleaning liquid from the cleaning nozzle to the brush. the step of ejecting the brush cleaning liquid onto the brush includes stopping the supply of the brush cleaning liquid to the cleaning nozzle when a substrate is held by the second substrate holding part and the brush is in a position other than the standby position, the first substrate holding part, the brush, the second substrate holding part and the cleaning nozzle are housed in a processing chamber, and the cleaning nozzle is configured to be able to eject brush cleaning liquid onto the brush which is in the standby position, and the step of ejecting the brush cleaning liquid onto the brush further includes stopping the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position .

A substrate processing method according to yet another aspect of the present invention includes the steps of holding a substrate with a first substrate holding part, contacting a brush with the substrate held by the first substrate holding part to clean an underside of the substrate, holding the substrate with a second substrate holding part provided at a position higher than the first substrate holding part, performing a predetermined processing on the substrate held by the second substrate holding part, supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle, thereby ejecting the brush cleaning liquid from the cleaning nozzle onto the brush, and when a supply condition of the brush cleaning liquid to the cleaning nozzle during a period during which the predetermined processing is performed on the substrate held by the second substrate holding part is input to an operation part, accepting the supply condition of the brush cleaning liquid input by the operation part, and ejecting the brush cleaning liquid onto the brush. the step of adjusting a supply state of the brush cleaning liquid to the cleaning nozzle in accordance with the supply conditions received in the receiving step during a period during which the specified processing is performed on the substrate , the first substrate holding part, the brush, the second substrate holding part and the cleaning nozzle are housed in a processing chamber, the step of cleaning the underside of the substrate includes moving the brush between a cleaning position in contact with the underside of the substrate held by the first substrate holding part and a standby position spaced apart from the substrate held by the first substrate holding part, the cleaning nozzle is configured to be able to eject brush cleaning liquid onto the brush in the standby position, and the step of ejecting the brush cleaning liquid onto the brush further includes stopping the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position .
A substrate processing method according to yet another aspect of the present invention includes the steps of: holding a substrate by a substrate holding part in a processing chamber; bringing a brush into contact with the substrate held by the substrate holding part in the processing chamber to clean an underside of the substrate; and supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle in the processing chamber, thereby discharging the brush cleaning liquid from the cleaning nozzle onto the brush;
The step of cleaning the underside of the substrate includes moving the brush between a cleaning position in which it contacts the underside of the substrate held by the substrate holding part and a waiting position spaced apart from the substrate held by the substrate holding part, and the step of ejecting the brush cleaning liquid onto the brush includes stopping the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the waiting position.

The present invention makes it possible to prevent a substrate from being cleaned with a brush whose cleanliness has deteriorated, and to reduce the deterioration of the substrate's cleanliness and the deterioration of the substrate's cleaning environment caused by brush cleaning.

1 is a schematic plan view of a substrate processing apparatus according to an embodiment of the present invention; 2 is a schematic cross-sectional view of the substrate processing apparatus taken along line JJ in FIG. 1. FIG. 2 is a schematic plan view of the substrate cleaning apparatus of FIG. 1 . FIG. 4 is an external perspective view showing an internal configuration of the substrate cleaning apparatus of FIG. 3. FIG. 5 is a side view showing an example of a state in which a cleaning liquid for brush cleaning is discharged from one of the brush nozzles in FIG. 4 to a lower surface brush. 5 is another side view showing an example of a state in which the cleaning liquid for brush cleaning is discharged from the other brush nozzle in FIG. 4 to the lower surface brush. FIG. 2 is a block diagram showing a configuration of a control system of the substrate cleaning apparatus of FIG. 1 . 4 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 3. 4 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 3. 4 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 3. 4 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 3. 4 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 3. 4 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 3. 4 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 3. 4 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 3. 4 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 3. 4 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 3. 4 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 3. 4 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 3. 11A and 11B are diagrams showing a series of operations of the substrate cleaning apparatus when performing cleaning processing on one substrate, and a relationship between whether or not cleaning liquid is supplied from a brush cleaning liquid supplier to a brush nozzle. 13A and 13B are diagrams showing examples of settings of the supply state of the cleaning liquid for cleaning the brush while the substrate W is held by the upper holding device; 13A and 13B are diagrams showing examples of settings of the supply state of the cleaning liquid for cleaning the brush while the substrate W is held by the upper holding device;

The substrate processing apparatus and substrate processing method according to one embodiment of the present invention will be described below with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate (wafer), a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. In this embodiment, the upper surface of the substrate is the circuit formation surface (front surface), and the lower surface of the substrate is the surface opposite to the circuit formation surface (rear surface). In addition, the substrate used in this embodiment has at least a partially circular outer periphery. For example, the substrate used in this embodiment has a circular outer periphery except for the notch.

1. Configuration of the Substrate Processing Apparatus Fig. 1 is a schematic plan view of a substrate processing apparatus according to an embodiment of the present invention. Fig. 2 is a schematic cross-sectional view of the substrate processing apparatus 100 taken along line J-J in Fig. 1. As shown in Fig. 1, the substrate processing apparatus 100 according to this embodiment has an indexer block 110 and a processing block 120. The indexer block 110 and the processing block 120 are provided adjacent to each other.

The indexer block 110 includes multiple (four in this example) carrier mounting tables 140 and a transport section 150. The multiple carrier mounting tables 140 are connected to the transport section 150 and are arranged in a row with spaces between them. A carrier C that stores multiple substrates W is placed on each carrier mounting table 140.

The transport section 150 is provided with an indexer robot 200 and a control device 170. The indexer robot 200 includes multiple (four in this example) hands Ia, Ib, Ic, and Id, a hand support member 210, and a transport drive section 220.

The multiple hands Ia to Id are configured to be able to hold multiple substrates W, respectively, and are arranged on the hand support member 210 in a state of being arranged at regular intervals in the vertical direction, as shown in FIG. 2. The hand support member 210 is formed to extend in one direction, and supports the multiple hands Ia to Id so that they can move forward and backward in that one direction. The transport drive unit 220 is configured to be able to move in the horizontal direction (the direction in which the multiple carrier mounting tables 140 are arranged), and supports the hand support member 210 so that it can rotate around a vertical axis and rise and fall. Furthermore, the transport drive unit 220 includes multiple motors, air cylinders, etc., and moves the hand support member 210 in the horizontal direction, rotates the hand support member 210 around the vertical axis, and raises and lowers it in order to transport multiple substrates W by the multiple hands Ia to Id. The transport drive unit 220 also moves the multiple hands Ia to Id forward and backward in the horizontal direction. The control device 170 is composed of a computer including a CPU (central processing unit), RAM (random access memory), ROM (read only memory), and a storage device, and controls each component within the substrate processing device 100.

A part of the transport section 150 of the indexer block 110 (a part of the outer wall of the transport section 150) is provided with an operation panel 180 configured to be operable by a user from outside the substrate processing apparatus 100. The operation panel 180 is connected to the control device 170, and is used, for example, by the user to input operating conditions for each component in the substrate processing apparatus 100.

As shown in FIG. 1, the processing block 120 includes cleaning units 161 and 162 and a transport unit 163. Cleaning unit 161, transport unit 163, and cleaning unit 162 are arranged adjacent to transport unit 150 and aligned in this order. In cleaning unit 161, as shown in FIG. 2, multiple (four in this example) substrate cleaning devices 1 are stacked vertically. Cleaning unit 162 in FIG. 1 has the same configuration as cleaning unit 161. Therefore, in cleaning unit 162, similar to the configuration of cleaning unit 161, multiple (four in this example) substrate cleaning devices 1 are stacked vertically.

Each substrate cleaning apparatus 1 has an entrance/exit 2x (FIG. 2) for loading and unloading a substrate W into and from the substrate cleaning apparatus 1. The configuration and operation of the substrate cleaning apparatus 1 will be described in detail later.

The transport section 163 is provided with a main robot 300. The main robot 300 includes multiple (four in this example) hands Ma, Mb, Mc, Md, a hand support member 310, and a transport drive section 320. The multiple hands Ma to Md have a common configuration and are provided on the hand support member 310 in a vertically aligned state. Each hand Ma to Md is configured to be able to hold the substrate W in a horizontal position.

As shown in FIG. 1, the hand support member 310 is formed to extend in one direction, and supports the above-mentioned multiple hands Ma to Md so that they can each independently move forward and backward in that one direction. The transport drive unit 320 is controlled by the control device 170, and supports the hand support member 310 so that it can rotate around a vertical axis and move up and down. Furthermore, the transport drive unit 320 includes multiple motors and air cylinders, etc., and rotates the hand support member 310 around the vertical axis and moves it up and down in order to transport multiple substrates W by the multiple hands Ma to Md. The transport drive unit 320 also moves the multiple hands Ma to Md forward and backward in the horizontal direction.

Between the indexer block 110 and the processing block 120, multiple (four in this example) substrate placement parts PASS1 and multiple substrate placement parts PASS2 are stacked vertically to transfer substrates W between the indexer robot 200 and the main robot 300. The multiple substrate placement parts PASS1 are located above the multiple (four in this example) substrate placement parts PASS2.

The multiple substrate placement parts PASS2 are used to transfer substrates W from the indexer robot 200 to the main robot 300. The multiple substrate placement parts PASS1 are used to transfer substrates W from the main robot 300 to the indexer robot 200.

The indexer robot 200 removes an unprocessed substrate W from one of the multiple carriers C placed on the multiple carrier placement stages 140. The indexer robot 200 also places the removed unprocessed substrate W on one of the multiple substrate placement parts PASS2. The indexer robot 200 then receives a processed substrate W placed on one of the multiple substrate placement parts PASS1 and stores it in an empty carrier C.

The main robot 300 receives the multiple unprocessed substrates W placed on the multiple substrate placement parts PASS2 using the multiple hands Ma to Md. The main robot 300 also transports the multiple unprocessed substrates W received from the substrate placement part PASS2 using the multiple hands Ma to Md into the multiple substrate cleaning apparatuses 1 in the cleaning part 161 or 162. The main robot 300 also transports the multiple processed substrates W out of the multiple substrate cleaning apparatuses 1 using the multiple hands Ma to Md. The main robot 300 then places the processed substrate W transported out of each substrate cleaning apparatus 1 onto one of the multiple substrate placement parts PASS1.

2. Configuration of the substrate cleaning apparatus 1 Fig. 3 is a schematic plan view of the substrate cleaning apparatus 1 of Fig. 1. Fig. 4 is an external perspective view showing the internal configuration of the substrate cleaning apparatus 1 of Fig. 3. In the substrate cleaning apparatus 1 according to the present embodiment, mutually orthogonal X-direction, Y-direction, and Z-direction are defined to clarify the positional relationship. In Fig. 3 and certain figures following Fig. 4, the X-direction, Y-direction, and Z-direction are appropriately indicated by arrows. The X-direction and the Y-direction are mutually orthogonal in a horizontal plane, and the Z-direction corresponds to the vertical direction (up-down direction).

As shown in FIG. 3, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a pedestal device 30, a transfer device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an edge cleaning device 80, and an opening/closing device 90. These components are provided in a unit housing 2. In FIG. 4, the unit housing 2 is indicated by a dotted line.

The unit housing 2 has a rectangular bottom surface 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom surface 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall 2b. This opening is an entrance 2x for the substrate W, and is used when the substrate W is loaded into and unloaded from the unit housing 2. In FIG. 4, the entrance 2x is indicated by a thick dotted line. In the following description, the direction in the Y direction from inside the unit housing 2 through the entrance 2x to the outside of the unit housing 2 (the direction from the side wall 2c to the side wall 2b) is referred to as the front, and the opposite direction (the direction from the side wall 2b to the side wall 2c) is referred to as the rear.

An opening/closing device 90 is provided in the portion of the side wall 2b where the loading/unloading opening 2x is formed and in the area nearby. The opening/closing device 90 includes a shutter 91 configured to be able to open and close the loading/unloading opening 2x, and a shutter drive unit 92 that drives the shutter 91. In FIG. 4, the shutter 91 is indicated by a thick two-dot chain line. The shutter drive unit 92 drives the shutter 91 to open the loading/unloading opening 2x when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1. This brings the shutter 91 into an open state. The shutter drive unit 92 also drives the shutter 91 to close the loading/unloading opening 2x when the substrate W is cleaned in the substrate cleaning apparatus 1. This brings the shutter 91 into a closed state.

A pedestal device 30 is provided in the center of the bottom surface portion 2a. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal drive unit 33. The linear guide 31 includes two rails and is provided so as to extend in the Y direction from the vicinity of the side wall portion 2b to the vicinity of the side wall portion 2c in a plan view. The movable pedestal 32 is provided so as to be movable in the Y direction on the two rails of the linear guide 31. The pedestal drive unit 33 includes, for example, a pulse motor, and moves the movable pedestal 32 in the Y direction on the linear guide 31.

The lower holding device 20 and the lower surface cleaning device 50 are arranged on the movable base 32 so as to be aligned in the Y direction. The lower holding device 20 includes an adsorption holding unit 21 and an adsorption holding drive unit 22. The adsorption holding unit 21 is a so-called spin chuck, and has a circular adsorption surface capable of adsorbing and holding the lower surface of the substrate W, and is configured to be rotatable around an axis extending in the vertical direction (axis in the Z direction). In the following description, when the substrate W is adsorbed and held by the adsorption holding unit 21, the area of the lower surface of the substrate W to be adsorbed by the adsorption surface of the adsorption holding unit 21 is referred to as the lower surface central area. On the other hand, the area of the lower surface of the substrate W that surrounds the lower surface central area is referred to as the lower surface outer area.

The suction-holding drive unit 22 includes a motor. The motor of the suction-holding drive unit 22 is provided on the movable base 32 so that the rotation shaft protrudes upward. The suction-holding unit 21 is attached to the upper end of the rotation shaft of the suction-holding drive unit 22. A suction path is formed on the rotation shaft of the suction-holding drive unit 22 for suctioning and holding the substrate W in the suction-holding unit 21. The suction path is connected to an air suction device (not shown). The suction-holding drive unit 22 rotates the suction-holding unit 21 around the rotation shaft.

A transfer device 40 is further provided on the movable base 32 near the lower holding device 20. The transfer device 40 includes a plurality of support pins 41 (three in this example), a pin connecting member 42, and a pin lifting and lowering drive unit 43. The pin connecting member 42 is formed to surround the suction holding unit 21 in a plan view, and connects the plurality of support pins 41. The plurality of support pins 41 extend upward a certain length from the pin connecting member 42 while being connected to each other by the pin connecting member 42. The pin lifting and lowering drive unit 43 raises and lowers the pin connecting member 42 on the movable base 32. As a result, the plurality of support pins 41 rise and lower relative to the suction holding unit 21.

The underside cleaning device 50 includes a underside brush 51, two substrate nozzles 52, two brush nozzles 52a, 52b, a gas ejection unit 53, a lifting support unit 54, a underside brush rotation drive unit 55a, and a underside brush lifting drive unit 55b. As shown in FIG. 4, the lifting support unit 54 is provided on the movable base 32 so that it can be raised and lowered. The lifting support unit 54 has an upper surface 54u that slopes diagonally downward in the direction away from the suction holding unit 21 (rearward in this example).

As shown in FIG. 3, the lower brush 51 has a circular outer shape in a plan view, and in this embodiment, it is formed to be relatively large. Specifically, the diameter of the lower brush 51 is larger than the diameter of the suction surface of the suction holder 21, for example, 1.3 times the diameter of the suction surface of the suction holder 21. The diameter of the lower brush 51 is also larger than 1/3 and smaller than 1/2 the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

The lower brush 51 is a sponge brush, and is preferably made of a material with relatively low wettability, such as a fluororesin. In this case, adhesion of contaminants to the lower brush 51 is reduced. This makes the lower brush 51 less susceptible to contamination. In this example, the lower brush 51 is made of PTFE (polytetrafluoroethylene), but the embodiment is not limited to this. The lower brush 51 may also be made of a relatively soft resin material, such as PVA (polyvinyl alcohol).

The lower brush 51 has a cleaning surface that can contact the lower surface of the substrate W. The lower brush 51 is attached to the upper surface 54u of the lift support 54 so that the cleaning surface faces upward and can rotate around an axis that passes through the center of the cleaning surface and extends in the vertical direction.

Each of the two substrate nozzles 52 is attached to the upper surface 54u of the lift support 54 so that it is located near the lower surface brush 51 and has its liquid outlet facing upward. A lower surface cleaning liquid supply unit 56 (FIG. 7) is connected to the substrate nozzle 52. The lower surface cleaning liquid supply unit 56 supplies cleaning liquid for cleaning the substrate to the substrate nozzle 52. When the substrate W is cleaned by the lower surface brush 51, the substrate nozzle 52 discharges the cleaning liquid supplied from the lower surface cleaning liquid supply unit 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning liquid supplied to the substrate nozzle 52.

The two brush nozzles 52a and 52b are used to clean the lower brush 51. Each of the two brush nozzles 52a and 52b is attached to the upper surface 54u of the lift support 54 so as to be located near the lower brush 51. A brush cleaning liquid supply unit 57 (FIG. 7) is connected to the brush nozzles 52a and 52b. The brush cleaning liquid supply unit 57 supplies cleaning liquid for brush cleaning to the brush nozzles 52a and 52b. As a result, the cleaning liquid supplied from the brush cleaning liquid supply unit 57 is discharged from the brush nozzles 52a and 52b toward the lower brush 51. The cleaning liquid supplied to the two substrate nozzles 52 and the cleaning liquid supplied to the two brush nozzles 52a and 52b are the same. Therefore, in this embodiment, pure water is used as the cleaning liquid supplied to the brush nozzles 52a and 52b.

Figure 5 is a side view showing an example of a state in which cleaning liquid for brush cleaning is discharged from one of the brush nozzles 52a in Figure 4 to the lower brush 51. The brush nozzle 52a is provided on the upper surface 54u of the lift support part 54 so that the tip of the brush nozzle 52a (liquid discharge port) faces a position above the lower brush 51. Therefore, as shown by the dotted arrow in Figure 5, the cleaning liquid discharged from the brush nozzle 52a is guided from a position to the side of the lower brush 51 to the center of the cleaning surface of the lower brush 51 in a parabolic curve.

Figure 6 is another side view showing an example of a state in which cleaning liquid for brush cleaning is discharged from the other brush nozzle 52b in Figure 4 to the lower brush 51. The brush nozzle 52b is provided on the upper surface 54u of the lift support part 54 so that the tip end (liquid discharge port) of the brush nozzle 52b faces the side (outer peripheral end) of the lower brush 51. Therefore, as shown by the dotted arrow in Figure 6, the cleaning liquid discharged from the brush nozzle 52b is guided from a position to the side of the lower brush 51 to the side (outer peripheral end) of the lower brush 51.

The gas ejection unit 53 in FIG. 4 is a slit-shaped gas injection nozzle having a gas ejection port extending in one direction. The gas ejection unit 53 is provided on the movable base 32 so that it can be raised and lowered independently of the other components of the underside cleaning device 50. A description of the drive unit for raising and lowering the gas ejection unit 53 is omitted. The gas ejection port of the gas ejection unit 53 is located between the underside brush 51 and the suction holding unit 21 in a plan view and faces upward. A gas ejection supply unit 58 (FIG. 7) is connected to the gas ejection unit 53.

The gas jet supply unit 58 supplies gas to the gas jet unit 53. In this embodiment, an inert gas such as nitrogen gas is used as the gas supplied to the gas jet unit 53. The gas jet unit 53 jets the gas supplied from the gas jet supply unit 58 onto the underside of the substrate W when the substrate W is cleaned by the underside brush 51 and when the underside of the substrate W is dried as described below. In this case, a band-shaped gas curtain extending in the X direction is formed between the underside brush 51 and the suction holding unit 21.

The lower surface brush rotation drive unit 55a in FIG. 3 includes a motor, and basically rotates the lower surface brush 51 while the power of the substrate processing apparatus 100 is on. The lower surface brush lift drive unit 55b includes a stepping motor or an air cylinder, and lifts and lowers the lift support unit 54 above the movable base 32.

A cup device 60 is further provided in the center of the bottom surface portion 2a. The cup device 60 includes a cup 61 and a cup drive unit 62. The cup 61 is provided so as to surround the lower holding device 20 and the base device 30 in a plan view and is movable up and down. In FIG. 4, the cup 61 is indicated by a dotted line. The cup drive unit 62 moves the cup 61 between a lower cup position and an upper cup position depending on which part of the lower surface of the substrate W is to be cleaned by the lower surface brush 51. The lower cup position is a height position where the upper end of the cup 61 is below the substrate W adsorbed and held by the adsorption holding unit 21. The upper cup position is a height position where the upper end of the cup 61 is above the adsorption holding unit 21. When the cup 61 is in the upper cup position, the cup 61 and the adsorption holding unit 21 overlap each other in a side view.

A pair of upper holding devices 10A, 10B are provided at a height position above the cup 61, facing each other across the base device 30 in a plan view. The upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck drive unit 13A, and an upper chuck drive unit 14A. The upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck drive unit 13B, and an upper chuck drive unit 14B.

The lower chucks 11A, 11B are disposed symmetrically with respect to a vertical plane that extends in the Y direction (front-to-back direction) through the center of the suction holding unit 21 in a plan view, and are provided so as to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A, 11B has two support pieces that can support the peripheral portion of the lower surface of the substrate W from below the substrate W. The lower chuck driving units 13A, 13B move the lower chucks 11A, 11B so that the lower chucks 11A, 11B approach each other, or so that the lower chucks 11A, 11B move away from each other.

The upper chucks 12A, 12B, like the lower chucks 11A, 11B, are arranged symmetrically with respect to a vertical plane that passes through the center of the suction holding unit 21 in the Y direction (front-rear direction) in a plan view, and are provided so as to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A, 12B has two holding pieces that are configured to abut against two parts of the outer periphery of the substrate W and to be able to hold the outer periphery of the substrate W. The upper chuck driving units 14A, 14B move the upper chucks 12A, 12B so that the upper chucks 12A, 12B approach each other, or so that the upper chucks 12A, 12B move away from each other.

As shown in FIG. 3, an upper surface cleaning device 70 is provided on one side of the cup 61 so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

The rotating support shaft 71 is supported by the upper surface cleaning drive unit 74 so as to extend vertically on the bottom surface portion 2a and to be movable up and down and rotatable. As shown in FIG. 4, the arm 72 is provided at a position above the upper holding device 10B and extends horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is attached to the tip of the arm 72.

An upper surface cleaning fluid supply unit 75 (Figure 7) is connected to the spray nozzle 73. The upper surface cleaning fluid supply unit 75 supplies cleaning liquid and gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid and gas supplied from the upper surface cleaning fluid supply unit 75 to generate a mixed fluid, and sprays the generated mixed fluid downward.

The upper surface cleaning drive unit 74 includes one or more pulse motors and air cylinders, etc., and raises and lowers the rotating support shaft 71 and rotates the rotating support shaft 71. With the above configuration, the spray nozzle 73 is moved in an arc over the upper surface of the substrate W that is attracted and held by the suction holding unit 21 and rotated, thereby cleaning the entire upper surface of the substrate W.

As shown in FIG. 3, an edge cleaning device 80 is provided on the other side of the cup 61 so as to be located near the upper holding device 10A in a plan view. The edge cleaning device 80 includes a rotating support shaft 81, an arm 82, a bevel brush 83, and a bevel brush drive unit 84.

The rotating support shaft 81 is supported by a bevel brush drive unit 84 on the bottom surface portion 2a so as to extend in the vertical direction and to be movable up and down and rotatable. As shown in FIG. 4, the arm 82 is provided at a position above the upper holding device 10A and extends horizontally from the upper end of the rotating support shaft 81. A bevel brush 83 is provided at the tip of the arm 82 so as to protrude downward and to be rotatable around a vertical axis.

The bevel brush 83 has an upper half shaped like an inverted truncated cone and a lower half shaped like a truncated cone. This bevel brush 83 can clean the outer edge of the substrate W at the central portion in the vertical direction of the outer circumferential surface.

The bevel brush driving unit 84 includes one or more pulse motors and air cylinders, and raises and lowers the rotating support shaft 81 and rotates the rotating support shaft 81. With the above configuration, the entire outer periphery of the substrate W can be cleaned by contacting the central portion of the outer periphery of the bevel brush 83 with the outer periphery of the substrate W that is rotated while being attracted and held by the attracting and holding unit 21.

Here, the bevel brush driving unit 84 further includes a motor built into the arm 82. The motor rotates the bevel brush 83 provided at the tip of the arm 82 around an axis extending in the vertical direction. Therefore, when cleaning the outer circumferential edge of the substrate W, the rotation of the bevel brush 83 improves the cleaning power of the bevel brush 83 at the outer circumferential edge of the substrate W.

3. Control System of Substrate Processing Apparatus Fig. 7 is a block diagram showing the configuration of the control system of the substrate processing apparatus 100 of Fig. 1. As described above, the control device 170 of Fig. 1 includes a CPU, a RAM, a ROM, and a storage device. The RAM is used as a working area for the CPU. The ROM stores a system program. The storage device stores a substrate processing program.

7 shows only the configuration of the parts of the control system of the substrate processing apparatus 100 in FIG. 1 that correspond to each of the multiple substrate cleaning apparatuses 1. As shown in FIG. 7, the control device 170 includes a chuck control unit 9A, a suction control unit 9B, a pedestal control unit 9C, a transfer control unit 9D, a lower surface cleaning control unit 9E, a cup control unit 9F, an upper surface cleaning control unit 9G, a bevel cleaning control unit 9H, a loading/unloading control unit 9I, and a condition receiving unit 9J as functional units for controlling the operation of each of the multiple substrate cleaning apparatuses 1. The functional units of the control device 170 are realized by the CPU executing the substrate cleaning program stored in the storage device on the RAM. Some or all of the functional units of the control device 170 may be realized by hardware such as electronic circuits.

The chuck control unit 9A receives the substrate W that is brought into the substrate cleaning apparatus 1 and controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B to hold the substrate W at a position above the suction holding unit 21. The suction control unit 9B controls the suction holding driving unit 22 to suction and hold the substrate W by the suction holding unit 21 and to rotate the substrate W that is suction-held.

The pedestal control unit 9C controls the pedestal drive unit 33 to move the movable pedestal 32 relative to the substrate W held by the upper holding devices 10A and 10B. The transfer control unit 9D controls the pin lift drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the suction holding unit 21.

The bottom surface cleaning control unit 9E controls the bottom surface brush rotation drive unit 55a, the bottom surface brush lift drive unit 55b, the bottom surface cleaning liquid supply unit 56, and the jet gas supply unit 58 to clean the bottom surface of the substrate W. The bottom surface cleaning control unit 9E also controls the brush cleaning liquid supply unit 57 to clean the bottom surface brush 51. The cup control unit 9F controls the cup drive unit 62 to use the cup 61 to catch the cleaning liquid that splashes from the substrate W when cleaning the substrate W adsorbed and held by the suction holding unit 21.

The top surface cleaning control unit 9G controls the top surface cleaning drive unit 74 and the top surface cleaning fluid supply unit 75 to clean the top surface of the substrate W adsorbed and held by the adsorption holding unit 21. The bevel cleaning control unit 9H controls the bevel brush drive unit 84 to clean the outer peripheral edge of the substrate W adsorbed and held by the adsorption holding unit 21. The loading/unloading control unit 9I controls the shutter drive unit 92 to open and close the loading/unloading opening 2x of the unit housing 2 when loading and unloading the substrate W in the substrate cleaning apparatus 1.

The condition receiving unit 9J receives the operating conditions of each component in the substrate processing apparatus 100 inputted via the operation panel 180, and stores the received operating conditions, for example, in a storage device of the control device 170. This sets the operating conditions of the various components in the substrate processing apparatus 100.

4. Schematic operation of the substrate cleaning apparatus 1 FIGS. 8 to 19 are schematic diagrams for explaining the schematic operation of the substrate cleaning apparatus 1 of FIG. 3. In each of FIGS. 8 to 19, a plan view of the substrate cleaning apparatus 1 is shown in the upper part. A side view of the lower holding device 20 and its periphery as viewed along the Y direction is shown in the middle part, and a side view of the lower holding device 20 and its periphery as viewed along the X direction is shown in the lower part. The side view in the middle part corresponds to the side view of line A-A in FIG. 3, and the side view in the lower part corresponds to the side view of line B-B in FIG. 3. In order to facilitate understanding of the shape and operating state of each component in the substrate cleaning apparatus 1, the enlargement and reduction ratios of some components are different between the plan view in the upper part and the side views in the middle and lower parts. In addition, in FIGS. 8 to 19, the cup 61 is shown by a two-dot chain line, and the outer shape of the substrate W is shown by a thick dashed line.

In the initial state (standby state) before the substrate W is loaded into the substrate cleaning apparatus 1, the shutter 91 of the opening/closing device 90 closes the loading/unloading opening 2x. As shown in FIG. 3, the lower chucks 11A, 11B are maintained in a state in which the distance between them is sufficiently larger than the diameter of the substrate W. The upper chucks 12A, 12B are also maintained in a state in which the distance between them is sufficiently larger than the diameter of the substrate W.

The movable base 32 of the base device 30 is arranged so that the center of the suction holder 21 is located at the center of the cup 61 in a plan view. The lower surface cleaning device 50 is located on the movable base 32 at a fixed distance in the Y direction from the suction holder 21. The cleaning surface (upper end) of the lower surface brush 51 of the lower surface cleaning device 50 is located below the suction holder 21. The vertical (Z direction) position of the lower surface brush 51 in the initial state is called the standby position. When the substrate W is held by the suction holder 21, the standby position is below the substrate W. Particularly in this embodiment, the standby position corresponds to the lowest position within the vertical range in which the lower surface brush 51 can be raised and lowered by the lift support 54.

In the initial state, the transfer device 40 has the multiple support pins 41 positioned below the suction holding unit 21. Furthermore, the cup 61 of the cup device 60 is in the lower cup position. In the following description, the center position of the cup 61 in a planar view is referred to as the planar reference position rp. Furthermore, the position of the movable base 32 on the bottom surface portion 2a when the center of the suction holding unit 21 is at the planar reference position rp in a planar view is referred to as the first horizontal position.

The substrate W is loaded into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading/unloading opening 2x immediately before the substrate W is loaded. Then, as indicated by the thick solid arrow a1 in FIG. 8, the hand (hand Ma in this example) of the main robot 300 in FIG. 1 enters the unit housing 2 through the loading/unloading opening 2x and moves the substrate W to a position approximately in the center of the unit housing 2. At this time, the substrate W held by the hand Ma is positioned between the lower chuck 11A and upper chuck 12A and the lower chuck 11B and upper chuck 12B.

Next, as shown by the thick solid arrow a2 in Figure 9, the lower chucks 11A, 11B approach each other so that the multiple support pieces of the lower chucks 11A, 11B are positioned below the peripheral edge of the lower surface of the substrate W. In this state, the hand Ma is lowered and the substrate W held by the hand Ma is placed on the pair of lower chucks 11A, 11B. Multiple portions of the peripheral edge of the lower surface of the substrate W are each supported by the multiple support pieces of the lower chucks 11A, 11B. The empty hand Ma then exits from the load/unload opening 2x. After the hand Ma exits, the shutter 91 closes the load/unload opening 2x.

In the following description, the operation of the main robot 300 in FIG. 1 to load the substrate W into one of the substrate cleaning apparatus 1 is referred to as the load operation. The load operation includes the forward and backward movement of the hand Ma with at least a portion of the hand Ma being within the unit housing 2. Therefore, in this embodiment, the period during which the load operation by the main robot 300 is performed includes, for example, the period during which the substrate W is loaded into one of the substrate cleaning apparatus 1 and any of the hands (Ma to Md) of the main robot 300 is within the unit housing 2.

Next, as shown by the thick solid arrow a3 in FIG. 10, the upper chucks 12A and 12B approach each other so that the multiple holding pieces of the upper chucks 12A and 12B abut against the outer peripheral edge of the substrate W. The multiple holding pieces of the upper chucks 12A and 12B abut against multiple parts of the outer peripheral edge of the substrate W, so that the substrate W supported by the lower chucks 11A and 11B is further held by the upper chucks 12A and 12B. Also, as shown by the thick solid arrow a4 in FIG. 10, the suction holding portion 21 is shifted a predetermined distance from the planar reference position rp and the movable base 32 moves forward from the first horizontal position so that the center of the lower brush 51 is located at the planar reference position rp. The position on the bottom surface portion 2a of the movable base 32 when the center of the lower brush 51 is located at the planar reference position rp in a planar view is called the second horizontal position.

11, the lifting support 54 rises so that the cleaning surface of the lower brush 51 in the standby position comes into contact with the central region of the underside of the substrate W. With the substrate W held by the upper holding devices 10A, 10B, the position of the lower brush 51 when it comes into contact with the underside of the substrate W is called the first processing position. Also, as shown by the thick solid arrow a6 in FIG. 11, the lower brush 51 rotates (spins) around a vertical axis. As a result, contaminants adhering to the central region of the underside of the substrate W are physically peeled off by the lower brush 51.

At the bottom of FIG. 11, an enlarged side view of the portion where the lower brush 51 contacts the lower surface of the substrate W is shown in a bubble. As shown in the bubble, with the lower brush 51 in contact with the substrate W, the substrate nozzle 52 and the gas ejection part 53 are held in a position close to the lower surface of the substrate W. At this time, the substrate nozzle 52 ejects the cleaning liquid toward the lower surface of the substrate W at a position close to the lower brush 51, as shown by the outlined arrow a51. As a result, the cleaning liquid supplied to the lower surface of the substrate W from the substrate nozzle 52 is guided to the contact part between the lower brush 51 and the substrate W, and the contaminants removed from the rear surface of the substrate W by the lower brush 51 are washed away by the cleaning liquid. In this way, in the lower surface cleaning device 50, the substrate nozzle 52 is attached to the lift support part 54 together with the lower brush 51. As a result, the cleaning liquid can be efficiently supplied to the portion of the lower surface of the substrate W cleaned by the lower brush 51. Therefore, the consumption of the cleaning liquid is reduced and excessive scattering of the cleaning liquid is suppressed.

Here, the upper surface 54u of the lifting support 54 is inclined obliquely downward in a direction away from the suction holder 21. In this case, when cleaning liquid containing contaminants falls from the underside of the substrate W onto the lifting support 54, the cleaning liquid received by the upper surface 54u is guided in a direction away from the suction holder 21.

When the lower surface of the substrate W is cleaned by the lower brush 51, the gas blowing unit 53 blows gas toward the lower surface of the substrate W at a position between the lower brush 51 and the suction holder 21, as shown by the white arrow a52 in the blowing of FIG. 11. In this embodiment, the gas blowing unit 53 is attached to the movable base 32 so that the gas blowing port extends in the X direction. In this case, when gas is blown from the gas blowing unit 53 to the lower surface of the substrate W, a band-shaped gas curtain extending in the X direction is formed between the lower brush 51 and the suction holder 21. This prevents the cleaning liquid containing contaminants from scattering toward the suction holder 21 when the lower surface of the substrate W is cleaned by the lower brush 51. Therefore, when the lower surface of the substrate W is cleaned by the lower brush 51, the cleaning liquid containing contaminants is prevented from adhering to the suction holder 21, and the suction surface of the suction holder 21 is kept clean.

In the example of FIG. 11, the gas ejection part 53 ejects gas obliquely upward from the gas ejection part 53 toward the lower surface brush 51, as shown by the outlined arrow a52, but the present invention is not limited to this. The gas ejection part 53 may eject gas from the gas ejection part 53 toward the lower surface of the substrate W along the Z direction.

Next, in the state shown in FIG. 11, when cleaning of the central region of the underside of the substrate W is completed, the lifting support part 54 descends so that the cleaning surface of the underside brush 51 is spaced a predetermined distance from the substrate W. In addition, the ejection of cleaning liquid from the substrate nozzle 52 onto the substrate W is stopped. At this time, the injection of gas from the gas ejection part 53 onto the substrate W continues.

Then, as shown by the thick solid arrow a7 in FIG. 12, the movable base 32 moves backward so that the center of the suction holder 21 is located at the planar reference position rp in a planar view. That is, the movable base 32 moves from the second horizontal position to the first horizontal position. At this time, gas continues to be sprayed from the gas outlet 53 onto the substrate W, so that the central region of the underside of the substrate W is sequentially dried by the gas curtain.

13, the lifting support 54 is lowered so that the cleaning surface of the lower brush 51 is positioned below the suction surface (upper end) of the suction holding unit 21. This causes the lower brush 51 to move to the standby position. Also, as shown by the thick solid arrow a9 in FIG. 13, the upper chucks 12A and 12B move away from each other so that the multiple holding pieces of the upper chucks 12A and 12B move away from the outer circumferential end of the substrate W. At this time, the substrate W is supported (placed) by the lower chucks 11A and 11B. The lower brush 51 may move from the first processing position to the standby position after cleaning the central region of the lower surface of the substrate W and before drying by the gas ejection unit 53.

Then, as shown by the thick solid arrow a10 in FIG. 13, the pin connecting member 42 rises so that the upper ends of the multiple support pins 41 are positioned slightly above the lower chucks 11A and 11B. As a result, the substrate W supported by the lower chucks 11A and 11B is received by the multiple support pins 41.

Next, as shown by the thick solid arrow a11 in FIG. 14, the lower chucks 11A and 11B move away from each other. At this time, the lower chucks 11A and 11B move to positions where they do not overlap the substrate W supported by the multiple support pins 41 in a plan view. As a result, both upper holding devices 10A and 10B return to their initial states.

15, the pin connecting member 42 is lowered so that the upper ends of the multiple support pins 41 are positioned below the suction holding unit 21. As a result, the substrate W supported on the multiple support pins 41 is received by the suction holding unit 21. In this state, the suction holding unit 21 suctions and holds the central region of the lower surface of the substrate W. Simultaneously with the descent of the pin connecting member 42 or after the descent of the pin connecting member 42 is completed, the cup 61 is raised from the lower cup position to the upper cup position, as shown by the thick solid arrow a13 in FIG. 15.

Next, as shown by the thick solid arrow a14 in FIG. 16, the suction holder 21 rotates around the vertical axis (the axis of the rotation axis of the suction holder drive unit 22). As a result, the substrate W suction-held by the suction holder 21 rotates in a horizontal position.

Next, the rotary support shaft 71 of the upper surface cleaning device 70 rotates and descends. As a result, the spray nozzle 73 moves to a position above the substrate W, as shown by the thick solid arrow a15 in FIG. 16. The spray nozzle 73 also descends so that the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixed fluid of cleaning liquid and gas onto the upper surface of the substrate W. The rotary support shaft 71 also rotates. As a result, the spray nozzle 73 moves to a position above the rotating substrate W, as shown by the thick solid arrow a16 in FIG. 16. The mixed fluid is sprayed onto the entire upper surface of the substrate W, thereby cleaning the entire upper surface of the substrate W.

When the upper surface of the substrate W is cleaned by the spray nozzle 73, the rotary support shaft 81 of the edge cleaning device 80 also rotates and descends. As a result, the bevel brush 83 moves to a position above the outer circumferential edge of the substrate W, as shown by the thick solid arrow a17 in FIG. 16. The central portion of the outer circumferential surface of the bevel brush 83 also descends so as to contact the outer circumferential edge of the substrate W. In this state, the bevel brush 83 rotates (spins) around an axis extending in the vertical direction. As a result, contaminants adhering to the outer circumferential edge of the substrate W are physically peeled off by the bevel brush 83. The contaminants peeled off from the outer circumferential edge of the substrate W are washed away by the cleaning liquid of the mixed fluid sprayed from the spray nozzle 73 onto the substrate W.

When the upper surface of the substrate W is cleaned by the spray nozzle 73, the lifting support 54 is raised so that the cleaning surface of the lower brush 51 comes into contact with the outer region of the lower surface of the substrate W. The position of the lower brush 51 when the substrate W is held by the lower holding device 20 and comes into contact with the lower surface of the substrate W is called the second processing position. As shown by the thick solid arrow a18 in FIG. 16, the lower brush 51 rotates (spins) around an axis in the vertical direction. Furthermore, the substrate nozzle 52 ejects cleaning liquid toward the lower surface of the substrate W, and the gas ejection part 53 ejects gas toward the lower surface of the substrate W. This allows the lower brush 51 to clean the entire outer region of the lower surface of the substrate W that is adsorbed and held by the suction holding part 21 and rotated. The rotation direction of the lower brush 51 may be opposite to the rotation direction of the suction holding part 21. In this case, the outer region of the lower surface of the substrate W can be efficiently cleaned.

The lifting support part 54 may be configured to be movable in the Y direction relative to the lower holding device 20 on the movable base 32. In this case, the lifting support part 54 is moved in the Y direction on the movable base 32 as shown by the thick solid arrow a19 in FIG. 16. This allows the entire outer area of the lower surface of the substrate W to be cleaned by the lower surface brush 51 regardless of the size of the lower surface brush 51.

When cleaning of the upper surface, outer peripheral edge, and lower outer region of the substrate W is completed, the spray nozzle 73 stops spraying the mixed fluid onto the substrate W. Also, as shown by the thick solid arrow a20 in FIG. 17, the spray nozzle 73 moves to a position on one side of the cup 61 (initial state position). Also, as shown by the thick solid arrow a21 in FIG. 17, the bevel brush 83 moves to a position on the other side of the cup 61 (initial state position). Furthermore, the lift support part 54 descends so that the cleaning surface of the lower brush 51 is separated from the substrate W by a predetermined distance. As a result, the lower brush 51 moves from the second processing position to the standby position. Also, the discharge of the cleaning liquid from the substrate nozzle 52 onto the substrate W and the spray of gas from the gas blowing part 53 onto the substrate W are stopped. In this state, the suction holding part 21 rotates at high speed, so that the cleaning liquid adhering to the substrate W is shaken off, and the entire substrate W is dried.

18, the cup 61 descends from the upper cup position to the lower cup position. In addition, in preparation for a new substrate W being loaded into the unit housing 2, the lower chucks 11A and 11B approach each other to a position where they can support the new substrate W, as shown by the thick solid arrow a23 in FIG. 18.

Finally, the substrate W is unloaded from within the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading/unloading opening 2x immediately before the substrate W is unloaded. Thereafter, as indicated by the thick solid arrow a24 in FIG. 19, the hand Ma of the main robot 300 in FIG. 1 enters the unit housing 2 through the loading/unloading opening 2x. Next, the hand Ma receives the substrate W on the suction holder 21 and exits through the loading/unloading opening 2x. After the hand Ma exits, the shutter 91 closes the loading/unloading opening 2x.

In the following description, the operation of the main robot 300 in FIG. 1 to transport the substrate W out of one substrate cleaning apparatus 1 is referred to as the transport operation. The transport operation includes the forward and backward movement of the hand Ma with at least a portion of the hand Ma being within the unit housing 2. Therefore, in this embodiment, the period during which the transport operation by the main robot 300 is performed includes, for example, the period during which the substrate W is being transported out of one substrate cleaning apparatus 1 and one of the hands of the main robot 300 is within the unit housing 2.

5. Discharge of cleaning liquid from brush nozzles 52a, 52b to lower brush 51 (a) Cleaning of lower brush 51 In the above-described substrate cleaning apparatus 1, cleaning liquid is discharged from brush nozzles 52a, 52b to the rotating lower brush 51. In this case, the cleaning liquid is supplied to the entire lower brush 51, and contaminants adhering to the lower brush 51 are washed away. This prevents the lower brush 51 with a reduced cleanliness from cleaning the substrate W. In addition, the lower brush 51 is prevented from drying out, and the occurrence of defects (damage) caused by the dried lower brush 51 coming into contact with the substrate W is prevented.

The time required for cleaning the outer region of the lower surface of the substrate W by the relatively large lower brush 51 (FIG. 16) is shorter than the time required for cleaning the upper surface of the substrate W by the spray nozzle 73 (FIG. 16). Therefore, in this embodiment, while the upper surface of the substrate W is being cleaned by the spray nozzle 73, the lower brush 51 reciprocates between the cleaning position and the standby position multiple times. Also, when the lower brush 51 is in the standby position, a cleaning liquid is discharged from the brush nozzles 52a, 52b onto the lower brush 51. As a result, cleaning of the outer region of the lower surface of the substrate W and cleaning of the lower brush 51 are performed alternately. In this case, the cleanliness of the outer region of the lower surface of the substrate W after cleaning is improved compared to the case where the outer region of the lower surface of the substrate W is cleaned continuously while the upper surface of the substrate W is being cleaned by the spray nozzle 73.

(b) Periods that are not preferred for cleaning the lower surface brush 51 As described above, it is preferable that the lower surface brush 51 is not dry when it comes into contact with the substrate W. For this reason, it is preferable that the cleaning liquid be ejected from the brush nozzles 52 a, 52 b onto the lower surface brush 51 not only when the upper surface of the substrate W is cleaned using the spray nozzle 73.

However, when the cleaning liquid ejected from the brush nozzles 52a, 52b splashes from the lower brush 51, the splashes may adhere to the substrate W or peripheral components of the substrate W at an unintended timing. In this case, the cleaning of the lower brush 51 reduces the cleanliness of the substrate W after the cleaning process, or reduces the cleanliness of the cleaning environment of the substrate W. The cleanliness of the cleaning environment of the substrate W refers to the cleanliness of each component provided inside the unit housing 2 and the cleanliness of the device that transports the substrate W.

Therefore, in this embodiment, the lower surface cleaning control unit 9E in Figure 7 prohibits the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a, 52b during a portion of the period during which the above series of operations are performed to clean one substrate W (hereinafter referred to as the basic stop period), and does not clean the lower surface brush 51.

On the other hand, the lower surface cleaning control unit 9E allows the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a, 52b during at least a portion of the other period during which the above series of operations are performed to clean one substrate W (hereinafter referred to as the cleaning permissible period).

Figure 20 is a diagram showing a series of operations of the substrate cleaning apparatus 1 when performing a cleaning process on one substrate W, and the relationship between whether or not cleaning liquid is supplied from the brush cleaning liquid supply unit 57 to the brush nozzles 52a, 52b. In Figure 20, multiple operating states of the substrate cleaning apparatus 1 are shown in chronological order, and whether or not the supply of cleaning liquid for brush cleaning is permitted in each operating state is indicated with the corresponding drawing number.

(c) Period for Loading and Unloading the Substrate W In this embodiment, the basic stop period includes the period for loading and unloading the substrate W. As shown in Fig. 20, in this embodiment, the lower surface cleaning control unit 9E in Fig. 7 stops the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a and 52b during the period for loading and unloading the substrate W into and from the substrate cleaning apparatus 1. The period for loading the substrate W is the period for which the main robot 300 performs the operation for loading the substrate W. The period for unloading the substrate W is the period for which the main robot 300 performs the operation for unloading the substrate W. As a result, the cleaning liquid for brush cleaning is not scattered inside the unit housing 2 during the loading and unloading operations of the substrate W by the main robot 300. Therefore, the cleaning liquid for brush cleaning does not adhere to the substrate W transported by the main robot 300 during the loading and unloading operations of the substrate W. Furthermore, the cleaning liquid for brush cleaning does not adhere to the hand Ma of the main robot 300 entering the unit housing 2. This reduces the deterioration in cleanliness of the substrate W caused by cleaning of the lower surface brushes 51 and the deterioration in cleanliness of the hand Ma of the main robot 300.

(d) Period for transferring the substrate W between the upper and lower holding devices (10A, 10B, 20) In the present embodiment, the basic stop period includes a period for transferring the substrate W between the upper and lower holding devices (10A, 10B, 20).

The lower surface cleaning control unit 9E in FIG. 7 stops the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a and 52b when the substrate W is transferred between the upper holding devices 10A and 10B and the lower holding device 20.

Specifically, in this embodiment, the support pins 41 move up and down to switch from a state in which the substrate W is held by the upper holding device 10A, 10B to a state in which the substrate W is held by the lower holding device 20. Therefore, the lower surface cleaning control unit 9E stops the supply of cleaning liquid for brush cleaning when the support pins 41 move up and down. As a result, the cleaning liquid for brush cleaning does not scatter inside the unit housing 2 when the support pins 41 move up and down. Therefore, when the substrate W is transferred between the upper holding device 10A, 10B and the lower holding device 20, the cleaning liquid for brush cleaning does not adhere to the substrate W and the peripheral members of the substrate W (the support pins 41, the pin connecting member 42, etc.). Therefore, the decrease in the cleanliness of the substrate W caused by the cleaning of the lower surface brush 51 and the decrease in the cleanliness of the transfer device 40 are reduced.

(e) The period during and after drying of the substrate W held by the lower holding device 20 In addition, in this embodiment, the basic stop period includes the period during and after drying of the substrate W held by the lower holding device 20.

The lower surface cleaning control unit 9E in FIG. 7 stops the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a, 52b when the substrate W is being dried after cleaning while the substrate W is being held by the lower holding device 20. The lower surface cleaning control unit 9E also stops the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a, 52b while the substrate W after drying is being held by the lower holding device 20.

Specifically, in a series of processes for one substrate W, assume that cleaning of the upper surface, outer peripheral edge, and lower outer region of the substrate W adsorbed and held by the adsorption holding unit 21 is completed. In this case, after the cleaning is completed, the adsorption holding unit 21 rotates at high speed without supplying cleaning liquid or the like to the substrate W, and the substrate W is dried (spin drying). Therefore, the lower surface cleaning control unit 9E stops the supply of cleaning liquid for brush cleaning from the start of spin drying of the substrate W until the substrate W is received by the main robot 300. As a result, after the start of spin drying of the substrate W, the cleaning liquid for brush cleaning is not scattered inside the unit housing 2. Therefore, the cleaning liquid for brush cleaning does not adhere to the substrate W and its peripheral members after drying. Therefore, the decrease in cleanliness of the substrate W and the lower holding device 20 caused by cleaning of the lower surface brush 51 is reduced.

(f) Cleaning Permitted Period In this embodiment, the cleaning permissible period includes a period during which the substrate W is not present inside the unit housing 2. In the above example, it includes a period before the substrate W before cleaning processing is carried into the substrate cleaning apparatus 1 and a period after the substrate W after cleaning processing is carried out from the substrate cleaning apparatus 1. During a period during which the substrate W is not present inside the unit housing 2, even if the cleaning liquid for brush cleaning is discharged onto the lower brush 51, the cleaning liquid scattered due to the discharge does not come into contact with the substrate W. Here, when the substrate W is not present inside the unit housing 2, the substrate cleaning apparatus 1 is basically in the initial state. During the initial state period, the lower brush 51 is held at the standby position. The standby position is located below the suction holding portion 21. As a result, during the initial state period, even if the cleaning liquid is discharged onto the lower brush 51, the cleaning liquid is unlikely to adhere to the suction holding portion 21 of the upper holding devices 10A, 10B and the lower holding device 20.

In addition to the above examples, the cleaning permissible period includes the period from when the substrate W is held by the upper holding device 10A, 10B until the holding state is released. Furthermore, the cleaning permissible period includes the period during which the substrate W is being cleaned from when the substrate W is held by the lower holding device 20 until spin drying of the substrate W is started.

During the above-mentioned cleaning permissible period, even if cleaning liquid for brush cleaning is discharged, it is considered that the cleanliness of the substrate W and its cleaning environment is not likely to decrease. Therefore, in the substrate cleaning apparatus 1, cleaning of the lower surface brush 51 can be performed at any time during the cleaning permissible period, not only while the upper surface of the substrate W is being cleaned.

However, even during the cleaning permissible period, depending on the relative positions of the components within the unit housing 2, the ejection of cleaning liquid for brush cleaning may cause a decrease in the cleanliness of the substrate W and its cleaning environment.

It is considered that the user has some understanding of the relative positions of the various components within the unit housing 2 during processing of the substrate W in the substrate cleaning apparatus 1. It is also considered that the user can predict to some extent the effect that the ejection of the cleaning liquid for brush cleaning during processing of the substrate W will have on the cleanliness of the substrate W and its surrounding components. Taking these points into consideration, it is preferable for the user to appropriately set the ejection timing of the cleaning liquid for brush cleaning with regard to the permissible cleaning period.

In this embodiment, the user can set the supply and stop of the cleaning liquid for brush cleaning during the cleaning permitted period as an operating condition of the brush cleaning liquid supply unit 57 by operating the operation panel 180 in FIG. 7. For example, the user can set the supply and stop of the cleaning liquid for brush cleaning during the period in which the substrate W is held by the upper holding devices 10A, 10B as an operating condition of the brush cleaning liquid supply unit 57.

Figures 21 and 22 are diagrams showing examples of settings for the supply state of cleaning liquid for brush cleaning while the substrate W is held by the upper holding devices 10A and 10B. In each of Figures 21 and 22, the upper, middle and lower rows show a number of setting examples. In each setting example diagram, the horizontal axis represents time. It is also assumed that cleaning of the central region of the underside of the substrate W held by the upper holding devices 10A and 10B begins at time t1, and drying of the central region of the underside of the substrate W ends at time t2.

In the setting example in the upper part of FIG. 21, cleaning liquid for brush cleaning is continuously discharged to the lower brush 51 during the period from time t1 to time t2. In the setting example in the middle part of FIG. 21, cleaning liquid for brush cleaning is not continuously discharged to the lower brush 51 during the period from time t1 to time t2.

In the setting example in the lower part of FIG. 21, cleaning liquid for brush cleaning is discharged to the lower brush 51 only during a portion of the initial period between time t1 and time t2. In the setting example in the upper part of FIG. 22, cleaning liquid for brush cleaning is discharged to the lower brush 51 only during a portion of the approximate middle period between time t1 and time t2. In the setting example in the middle part of FIG. 22, cleaning liquid for brush cleaning is discharged to the lower brush 51 only during a portion of the final period between time t1 and time t2. Furthermore, in the setting example in the lower part of FIG. 22, cleaning liquid for brush cleaning is discharged to the lower brush 51 only during a portion of the initial period and a portion of the final period between time t1 and time t2.

As described above, the user can set the supply and stop of cleaning liquid for brush cleaning during the cleaning permitted period as the operating conditions of the brush cleaning liquid supply unit 57 by operating the operation panel 180. The set operating conditions are received by the condition receiving unit 9J in FIG. 7 as described above and stored in the control device 170. The underside cleaning control unit 9E in FIG. 7 controls the brush cleaning liquid supply unit 57 based on the set operating conditions.

6. Effects (a) In the above-described substrate cleaning apparatus 1, the substrate W carried into the unit housing 2 by the main robot 300 is held by the upper holding devices 10A, 10B or the lower holding device 20. The lower surface of the substrate W is cleaned by the lower surface brush 51 coming into contact with the substrate W held by the upper holding devices 10A, 10B or the lower holding device 20. The lower surface brush 51 is cleaned with the cleaning liquid discharged from the brush nozzles 52a, 52b. This prevents the substrate W from being cleaned by the lower surface brush 51 with a reduced cleanliness level, and reduces the decrease in cleanliness of the substrate W after cleaning.

In addition, according to the above-described substrate cleaning apparatus 1, during the loading and unloading periods of the substrate W, the cleaning liquid is not discharged onto the lower brush 51, and the cleaning liquid does not splash around in the vicinity of the substrate W. Therefore, during the loading and unloading periods of the substrate W, the cleaning liquid for brush cleaning does not adhere to the substrate W and the hands (Ma to Md) of the main robot 300.

As a result, the substrate W is prevented from being cleaned by the lower surface brush 51 with reduced cleanliness, and the deterioration in the cleanliness of the substrate W and the cleaning environment of the substrate W caused by cleaning the lower surface brush 51 is reduced.

(b) According to the above-described substrate cleaning apparatus 1, during the transfer period of the substrate W between the upper holding device 10A, 10B and the lower holding device 20, i.e., during the period during which the transfer device 40 raises and lowers the substrate W, the cleaning liquid for brush cleaning is not discharged onto the lower brush 51, and the cleaning liquid is not splashed in the vicinity of the substrate W. During the transfer period of the substrate W between the upper holding device 10A, 10B and the lower holding device 20, the cleaning liquid for brush cleaning does not adhere to the substrate W, the multiple support pins 41, and the pin connecting member 42. As a result, the substrate W is prevented from being cleaned by the lower brush 51 with a reduced cleanliness, and the reduction in the cleanliness of the substrate W and the cleaning environment of the substrate W caused by the cleaning of the lower brush 51 is reduced.

(c) According to the above-described substrate cleaning apparatus 1, during and after drying of the substrate W held by the lower holding device 20, cleaning liquid for brush cleaning is not discharged onto the lower brush 51, and cleaning liquid is not splashed in the vicinity of the substrate W. As a result, after the start of drying of the substrate W held by the lower holding device 20, cleaning liquid for brush cleaning does not adhere to the substrate W and the lower holding device 20. As a result, the substrate W is prevented from being cleaned by the lower brush 51 with a reduced cleanliness, and the reduction in the cleanliness of the substrate W and the cleaning environment of the substrate W caused by cleaning of the lower brush 51 is reduced.

(d) As described above, during the cleaning permissible period, depending on the processing state of the substrate W in the substrate cleaning apparatus 1, even if the cleaning liquid discharged onto the lower brush 51 adheres to the substrate W, such adhesion may not affect the cleanliness of the substrate W after cleaning. Also, depending on the relative position of the lower brush 51 with respect to the substrate W, the cleaning liquid discharged onto the lower brush 51 may not splash to the position of the substrate W and its surrounding components. Also, the effect that the cleaning liquid discharged onto the lower brush 51 during the cleaning permissible period has on the substrate W and its surrounding components is predictable to a certain extent.

According to the above-mentioned substrate cleaning apparatus 1, the user can input and set the operating conditions of the brush cleaning liquid supply unit 57 during the cleaning permitted period by operating the operation panel 180. As a result, the supply state of the cleaning liquid to the lower brush 51 is adjusted according to the set operating conditions of the brush cleaning liquid supply unit 57. For example, by setting the desired operating conditions, the user can stop the discharge of the cleaning liquid at a timing when the discharge of the cleaning liquid is considered to have a negative effect on the cleanliness of the substrate W during the period from when the substrate W is held by the upper holding device 10A, 10B to when the substrate W is being cleaned. As a result, the substrate W is prevented from being cleaned by the lower brush 51 with a reduced cleanliness, and the decrease in the cleanliness of the substrate W and the cleanliness of the cleaning environment of the substrate W caused by the cleaning of the lower brush 51 is reduced.

7. Other Embodiments (a) In the substrate cleaning apparatus 1 according to the above embodiment, the cleaning permissible period includes the period from when the substrate W is held by the upper holding device 10A, 10B to when the held state is released, but the present invention is not limited to this.

When the lower brush 51 is in the standby position, even if cleaning liquid for brush cleaning is discharged onto the lower brush 51, the splashes are unlikely to reach the upper holding devices 10A, 10B and their surrounding areas. In contrast, when the lower brush 51 is in a position other than the standby position, for example, when the lower brush 51 is positioned higher than the standby position, the distance between the lower brush 51 and the upper holding devices 10A, 10B is shorter. When cleaning liquid for brush cleaning is discharged onto the lower brush 51 in this state, splashes of the cleaning liquid are more likely to reach the upper holding devices 10A, 10B and their surrounding areas than when the lower brush 51 is in the standby position.

Therefore, during the period from when the substrate W is held by the upper holding devices 10A, 10B until the held state is released, the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a, 52b may be permitted only when the lower brush 51 is in the standby position during that period. In other words, during the period when the substrate W is held by the upper holding devices 10A, 10B, the ejection of cleaning liquid for brush cleaning may be permitted when the lower brush 51 is in the standby position, and the ejection of cleaning liquid for brush cleaning may be prohibited when the lower brush 51 is in a position other than the standby position.

In this case, the lower surface cleaning control unit 9E in FIG. 7 controls the brush cleaning liquid supply unit 57 to stop the supply of cleaning liquid to the brush nozzles 52a, 52b when the substrate W is held by the upper holding devices 10A, 10B and the lower surface brush 51 is in a position other than the standby position. This further reduces the adhesion of cleaning liquid for brush cleaning to the substrate W and its surrounding members while the substrate W is held by the upper holding devices 10A, 10B. As a result, the substrate W is prevented from being cleaned by the lower surface brush 51 with a reduced cleanliness level, and the reduction in the cleanliness of the substrate W and the cleaning environment of the substrate W caused by cleaning of the lower surface brush 51 is reduced.

(b) In the substrate cleaning apparatus 1 according to the above embodiment, the cleaning permissible period includes a period during which the substrate W is not present inside the unit housing 2, but the present invention is not limited to this.

As described above, when the substrate W is not present in the unit housing 2, the substrate cleaning device 1 is basically in the initial state (standby state), and the lower brush 51 is held in the standby position. However, even when the substrate W is not present in the unit housing 2, the lower brush 51 may move to a position other than the standby position due to repair or failure of the substrate cleaning device 1. Therefore, during the period when the substrate W is not present inside the unit housing 2, the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a, 52b may be permitted only when the lower brush 51 is in the standby position during that period. In other words, during the period when the substrate W is not present inside the unit housing 2, the discharge of cleaning liquid for brush cleaning may be permitted when the lower brush 51 is in the standby position, and the discharge of cleaning liquid for brush cleaning may be prohibited when the lower brush 51 is in a position other than the standby position.

In this case, the underside cleaning control unit 9E in FIG. 7 controls the brush cleaning liquid supply unit 57 to stop the supply of cleaning liquid to the brush nozzles 52a, 52b when the substrate W is not present in the unit housing 2 and the underside brush 51 is in a position other than the standby position. This prevents a decrease in work efficiency and a decrease in cleanliness inside the unit housing 2 caused by the cleaning liquid for brush cleaning being discharged at an unintended position when a user works inside the unit housing 2 due to repairs or a malfunction of the substrate cleaning apparatus 1.

(c) In the substrate cleaning apparatus 1 according to the above embodiment, a transfer device 40 is provided to switch between a state in which the substrate W is held by the upper holding devices 10A, 10B and a state in which the substrate W is held by the lower holding device 20. The transfer device 40 moves the substrate W up and down relative to the upper holding devices 10A, 10B and the lower holding device 20 by raising and lowering a plurality of support pins 41, thereby transferring the substrate W. The present invention is not limited to the above example.

The substrate cleaning apparatus 1 may be provided with a lifting drive unit that raises and lowers the lower holding device 20 relative to the upper holding devices 10A, 10B. Alternatively, a lifting drive unit that raises and lowers the upper holding devices 10A, 10B relative to the lower holding device 20 may be provided. In this case, the lifting drive unit functions as a relative movement unit. As a result, at least one of the lower holding device 20 and the upper holding devices 10A, 10B raises and lowers relative to the other, making it possible to transfer the substrate W between the two holding devices without using multiple support pins 41. In this case, the transfer device 40 is not required.

(d) In the above embodiment, cleaning of the outer region of the lower surface of the substrate W and cleaning of the lower brush 51 are repeated primarily while cleaning the upper surface of the substrate W, but the present invention is not limited to this. The lower surface cleaning control unit 9E may prohibit the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a, 52b during the period in which the substrate W is held by the lower holding device 20. In this case, the lower surface cleaning control unit 9E allows the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a, 52b during the cleaning permissible period and during the period in which the substrate W is not held by the lower holding device 20.

(e) In the above embodiment, the basic stop period includes the period during which the substrate W is loaded, the period during which the substrate W is unloaded, the period during which the substrate W is transferred between the two holding devices, and the period after drying of the substrate W held by the lower holding device 20 begins, but the present invention is not limited to this. The basic stop period set in the substrate cleaning apparatus 1 may include at least one of the period during which the substrate W is loaded, the period during which the substrate W is unloaded, the period during which the substrate W is transferred between the two holding devices, and the period after drying of the substrate W held by the lower holding device 20 begins.

(f) In the above embodiment, the cleaning liquid supplied to the two substrate nozzles 52 and the cleaning liquid supplied to the two brush nozzles 52a, 52b are the same, but these cleaning liquids may be different from each other. That is, the cleaning liquid for substrate cleaning and the cleaning liquid for brush cleaning may be the same or different from each other.

(g) As shown in the above embodiment, when the cleaning liquid for substrate cleaning and the cleaning liquid for brush cleaning are the same, two substrate nozzles 52 do not need to be provided. In this case, when cleaning the central region of the underside of the substrate W and when cleaning the outer region of the underside of the substrate W, the cleaning liquid ejected from the brush nozzles 52a, 52b to the underside brush 51 can be used as the cleaning liquid for substrate cleaning.

(h) In the substrate cleaning apparatus 1 according to the above embodiment, cleaning liquid is supplied to the substrate W from two substrate nozzles 52 while the lower surface brush 51 is cleaning the central region of the lower surface of the substrate W, but the present invention is not limited to this.

In the substrate cleaning apparatus 1, before cleaning the central region of the underside of the substrate W with the lower brush 51, the lower brush 51 may be preliminarily cleaned to soak the lower brush 51 in cleaning liquid. In this case, by bringing the lower brush 51 soaked in cleaning liquid into contact with the central region of the underside of the substrate W, the central region of the underside of the substrate W can be cleaned without the need to supply new cleaning liquid.

(i) The substrate cleaning apparatus 1 according to the above embodiment may have a back rinse nozzle that supplies a rinse liquid to the outer region of the lower surface of the substrate W that is held by suction by the lower holding device 20.

(j) In the above embodiment, cleaning of the central region of the underside of the substrate W held by the upper holding device 10A, 10B is performed after cleaning of the outer region of the underside of the substrate W held by the lower holding device 20 is performed, but the embodiment is not limited to this. Cleaning of the central region of the underside of the substrate W may be performed by the upper holding device 10A, 10B after cleaning of the outer region of the underside of the substrate W is performed by the lower holding device 20.

(k) In the above embodiment, cleaning of the central region of the underside of the substrate W is performed in the upper holding devices 10A, 10B, and cleaning of the outer region of the underside of the substrate W is performed in the lower holding device 20, but the embodiment is not limited to this. In the substrate cleaning apparatus 1, it is sufficient that a cleaning process is performed on the substrate W held by either one of the upper holding devices 10A, 10B and the lower holding device 20. Therefore, a process other than a cleaning process (such as a polishing process or a developing process) may be performed on the substrate W held by the other of the upper holding devices 10A, 10B and the lower holding device 20.

(l) In the above embodiment, the upper surface of the substrate W is cleaned using the spray nozzle 73, but the embodiment is not limited to this. The upper surface of the substrate W may be cleaned using a brush, or may be cleaned using a rinse nozzle that ejects a rinse liquid. Also, the upper surface of the substrate W does not have to be cleaned. In this case, the substrate cleaning apparatus 1 does not include the upper surface cleaning device 70. Similarly, the outer peripheral edge of the substrate W does not have to be cleaned. In this case, the substrate cleaning apparatus 1 does not include the edge cleaning device 80.

(m) In the above embodiment, cleaning of the outer underside region of the substrate W at the processing position and cleaning of the lower brush 51 at the standby position are repeated multiple times, but the embodiment is not limited to this. Cleaning of the outer underside region of the substrate W at the processing position and cleaning of the lower brush 51 at the standby position do not have to be repeated.

8. Correspondence between each component of the claims and each part of the embodiment Below, examples of correspondence between each component of the claims and each element of the embodiment will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

In the above embodiment, the substrate processing apparatus 100 and the substrate cleaning apparatus 1 are examples of a substrate processing apparatus, the unit housing 2 is an example of a processing chamber, the main robot 300 is an example of a transport device, the upper holding devices 10A and 10B are examples of a first substrate holding unit or a second substrate holding unit, the lower surface brush 51 is an example of a brush, and the lower surface cleaning device 50 is an example of a brush cleaning unit.

Furthermore, the brush nozzles 52a and 52b that eject cleaning liquid for brush cleaning are an example of a cleaning nozzle, the brush cleaning liquid supply unit 57 is an example of a cleaning liquid supply unit, the control device 170 and the underside cleaning control unit 9E are an example of a control unit, each of the hands Ma to Md of the main robot 300 is an example of a transport holding unit, the transport drive unit 320 is an example of a transport drive unit, and the lift support unit 54 is an example of a brush moving unit.

In addition, the lower holding device 20 is an example of a second substrate holding unit or a first substrate holding unit, the lower surface cleaning device 50, the upper surface cleaning device 70 and the edge cleaning device 80 are examples of a processing unit, the transfer device 40 is an example of a relative moving unit, the central region of the lower surface of the substrate W is an example of a first region of the lower surface of the substrate, and the outer region of the lower surface of the substrate W is an example of a second region of the lower surface of the substrate.

In addition, the first processing position and the second processing position of the lower surface brush 51 are examples of cleaning positions, the standby position of the lower surface brush 51 is an example of a standby position, the operation panel 180 is an example of an operation unit, and the condition reception unit 9J is an example of a reception unit.

9. Summary of the embodiment (1) The substrate processing apparatus according to the first embodiment includes:
A processing chamber;
a transport device configured to be capable of performing a carry-in operation for carrying a substrate into the processing chamber and an unloading operation for carrying a substrate out of the processing chamber;
a first substrate holder provided in the processing chamber and configured to hold a substrate carried in by the transfer device;
a brush cleaning unit provided in the processing chamber and configured to be able to clean an underside of the substrate by bringing a brush into contact with the substrate held by the first substrate holding unit;
a cleaning nozzle provided in the processing chamber and configured to be able to discharge a brush cleaning liquid to the brush for cleaning the brush;
a cleaning liquid supply unit for supplying the brush cleaning liquid to the cleaning nozzle;
The control unit controls the cleaning liquid supply unit to stop the supply of the brush cleaning liquid to the cleaning nozzle during at least a portion of the period during which the transport device performs the loading operation and the unloading operation.

In this substrate processing apparatus, a substrate is carried into a processing chamber by a transport device and held by a first substrate holding unit. A brush comes into contact with the substrate held by the first substrate holding unit, thereby cleaning the underside of the substrate. The brush is cleaned with a brush cleaning solution discharged from a cleaning nozzle. This prevents the substrate from being cleaned by a brush with a reduced level of cleanliness.

Furthermore, according to the above-mentioned substrate processing apparatus, brush cleaning liquid is not supplied to the cleaning nozzle during at least a portion of the period during which the transport device carries the substrate in and out. Therefore, when the supply of brush cleaning liquid is stopped, the brush cleaning liquid does not splash around the substrate in the processing chamber. Therefore, during at least one of the substrate carrying in and out operations by the transport device, adhesion of brush cleaning liquid to a part of the transport device that enters the processing chamber in association with the substrate carrying in or out operation is reduced. Also, adhesion of brush cleaning liquid to a part of the substrate transported by the transport device in association with the substrate carrying in or out operation is reduced.

As a result, the substrate is prevented from being cleaned with a brush of reduced cleanliness, and the deterioration of the substrate's cleanliness and the deterioration of the substrate's cleaning environment caused by brush cleaning are reduced.

(2) In the substrate processing apparatus according to the first aspect,
The conveying device is
a transfer holder configured to be movable while holding a substrate;
a transport drive unit that moves the transport holder,
The control unit further includes:
by controlling the transport drive unit, the transport holder is caused to enter and exit the processing chamber from the outside of the processing chamber during the loading operation and the unloading operation of the transport device;
The cleaning liquid supply unit may be controlled to stop supplying the brush cleaning liquid from the cleaning nozzle to the brush while the transport holder is located inside the processing chamber.

In this case, the brush cleaning liquid is not discharged from the cleaning nozzle when the transport holder of the transport device is inside the processing chamber. This prevents the brush cleaning liquid from adhering to the transport holder and to the substrate being transported by the transport holder.

(3) In the substrate processing apparatus according to the first or second aspect,
The brush cleaning unit includes:
The brush;
a brush moving unit configured to be able to move the brush between a cleaning position in which the brush contacts the underside of the substrate held by the first substrate holding unit and a standby position spaced apart from the substrate held by the first substrate holding unit,
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The control unit is
The cleaning liquid supply unit may be controlled to stop supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position.

According to the above configuration, the supply of brush cleaning liquid from the cleaning nozzle to the brush is stopped when there is no substrate in the processing chamber and the brush is in a position other than the standby position. This prevents a decrease in work efficiency and a decrease in cleanliness in the processing chamber caused by the brush cleaning liquid being discharged at an unintended position when a user works in the substrate processing apparatus due to repairs or a malfunction of the substrate processing apparatus.

(4) The substrate processing apparatus according to the 4th paragraph comprises:
a first substrate holder configured to be able to hold a substrate;
a brush cleaning unit configured to bring a brush into contact with the substrate held by the first substrate holding unit to clean the underside of the substrate;
a second substrate holding part configured to be able to hold a substrate;
a processing section that performs a predetermined process on the substrate held by the second substrate holding section;
a relative movement unit that performs a relative movement operation to change a relative position between the first substrate holding unit and the substrate by moving at least one of the first substrate holding unit, the second substrate holding unit, and the substrate in order to switch a state in which the substrate is held by the first substrate holding unit to a state in which the substrate is held by the second substrate holding unit;
A cleaning nozzle configured to be able to discharge a brush cleaning liquid for cleaning the brush to the brush;
a cleaning liquid supply unit for supplying the brush cleaning liquid to the cleaning nozzle;
The control unit controls the cleaning liquid supply unit to stop the supply of the brush cleaning liquid to the cleaning nozzle during the relative movement operation by the relative movement unit.

In the substrate processing apparatus, a substrate is held by a first substrate holding part. A brush comes into contact with the substrate held by the first substrate holding part, thereby cleaning the underside of the substrate. The substrate is also held by a second substrate holding part. A predetermined process is performed on the substrate held by the second substrate holding part. The brush is cleaned by a brush cleaning solution discharged from a cleaning nozzle. This prevents the substrate from being cleaned by a brush with a reduced level of cleanliness.

In addition, according to the above-mentioned substrate processing apparatus, brush cleaning liquid is not supplied to the cleaning nozzle during the relative movement operation by the relative movement part. When the supply of brush cleaning liquid is stopped, the brush cleaning liquid does not splash in the vicinity of the substrate. This prevents the brush cleaning liquid from adhering to the substrate and its surrounding members when switching from a state in which the substrate is held by the first substrate holding part to a state in which the substrate is held by the second substrate holding part.

As a result, the substrate is prevented from being cleaned with a brush of reduced cleanliness, and the deterioration of the substrate's cleanliness and the deterioration of the substrate's cleaning environment caused by brush cleaning are reduced.

(5) In the substrate processing apparatus according to the above (4),
the brush cleaning unit is configured to be capable of cleaning a first region of an underside of a substrate held by the first substrate holding unit by bringing the brush into contact with the first region, and to clean a second region, different from the first region, of an underside of a substrate held by the second substrate holding unit by bringing the brush into contact with the second region,
The control unit is
while the substrate is held by the first substrate holding unit, controlling the brush cleaning unit to cause the brush cleaning unit to clean a first region of the underside of the substrate;
While the substrate is held by the second substrate holding part, the brush cleaning part may be controlled to function as the processing part, causing the brush cleaning part to clean a second region of the underside of the substrate.

In this case, a first region of the underside of the substrate is cleaned while the substrate is held by the first substrate holder, and a second region of the underside of the substrate is cleaned while the substrate is held by the second substrate holder.

(6) In the substrate processing apparatus according to the fourth or fifth aspect,
The substrate processing apparatus includes:
a processing chamber that accommodates the first substrate holding unit, the brush cleaning unit, the second substrate holding unit, the processing unit, the cleaning nozzle, and the cleaning liquid supply unit;
The brush cleaning unit includes:
The brush;
a brush moving unit configured to be able to move the brush between a cleaning position in which the brush contacts the underside of the substrate held by the first substrate holding unit and a standby position spaced apart from the substrate held by the first substrate holding unit,
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The control unit is
The cleaning liquid supply unit may be controlled to stop supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position.

According to the above configuration, the supply of brush cleaning liquid from the cleaning nozzle to the brush is stopped when there is no substrate in the processing chamber and the brush is in a position other than the standby position. This prevents a decrease in work efficiency and a decrease in cleanliness in the processing chamber caused by the brush cleaning liquid being discharged at an unintended position when a user works in the substrate processing apparatus due to repairs or a malfunction of the substrate processing apparatus.

(Clause 7) The substrate processing apparatus according to Clause 7 comprises:
a first substrate holder configured to be able to hold a substrate;
a brush cleaning unit configured to be able to clean an underside of the substrate by bringing a brush into contact with the substrate held by the first substrate holding unit;
A cleaning nozzle configured to be able to discharge a brush cleaning liquid for cleaning the brush to the brush;
a cleaning liquid supply unit for supplying the brush cleaning liquid to the cleaning nozzle;
and a control unit that controls the cleaning liquid supply unit to stop the supply of the brush cleaning liquid to the cleaning nozzle for at least a portion of the period during which the substrate is held by the first substrate holding unit.

In the substrate processing apparatus, the substrate is held by a first substrate holder. The underside of the substrate is cleaned by contacting a brush with the substrate held by the first substrate holder. The brush is cleaned with a brush cleaning solution discharged from a cleaning nozzle. This prevents the substrate from being cleaned by a brush with a reduced level of cleanliness.

In addition, according to the above substrate processing apparatus, brush cleaning liquid is not supplied to the cleaning nozzle during at least a portion of the period during which the substrate is held by the first substrate holding unit. When the supply of brush cleaning liquid is stopped, the brush cleaning liquid does not splash in the vicinity of the substrate. This prevents the brush cleaning liquid from adhering to the substrate and its surrounding components during at least a portion of the period during which the substrate is held by the first substrate holding unit.

As a result, the substrate is prevented from being cleaned with a brush of reduced cleanliness, and the deterioration of the substrate's cleanliness and the deterioration of the substrate's cleaning environment caused by brush cleaning are reduced.

(8) In the substrate processing apparatus according to the seventh aspect,
the first substrate holder is configured to be able to rotate the substrate held by the first substrate holder;
the control unit controls the first substrate holding unit to rotate the first substrate holding unit at a predetermined speed to dry the substrate after the underside of the substrate is cleaned by the brush cleaning unit;
At least a portion of the period during which the substrate is held by the first substrate holding part may include the period from the time drying of the substrate by rotation of the first substrate holding part begins to the time the first substrate holding part releases the substrate from its held state.

In this case, the brush cleaning liquid is prevented from adhering to the substrate during and after drying.

(Item 9) In the substrate processing apparatus according to item 7 or 8,
The substrate processing apparatus includes:
a processing chamber that accommodates the first substrate holding unit, the brush cleaning unit, the cleaning nozzle, and the cleaning liquid supply unit;
The brush cleaning unit includes:
The brush;
a brush moving unit configured to be able to move the brush between a cleaning position in which the brush contacts the underside of the substrate held by the first substrate holding unit and a standby position spaced apart from the substrate held by the first substrate holding unit,
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The control unit may control the cleaning liquid supply unit to stop the supply of brush cleaning liquid from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in a position other than the standby position.

According to the above configuration, the supply of brush cleaning liquid from the cleaning nozzle to the brush is stopped when there is no substrate in the processing chamber and the brush is in a position other than the standby position. This prevents a decrease in work efficiency and a decrease in cleanliness in the processing chamber caused by the brush cleaning liquid being discharged at an unintended position when a user works in the substrate processing apparatus due to repairs or a malfunction of the substrate processing apparatus.

(10th paragraph) The substrate processing apparatus according to the 10th paragraph comprises:
a first substrate holder configured to be able to hold a substrate;
a brush for contacting an underside of the substrate to clean said underside;
a brush moving unit configured to be able to move the brush between a cleaning position in which the brush contacts the underside of the substrate held by the first substrate holding unit and a standby position that is below the first substrate holding unit and spaced apart from the substrate held by the first substrate holding unit;
a second substrate holding portion provided at a position above the first substrate holding portion and configured to be able to hold a substrate;
a processing section that performs a predetermined process on the substrate held by the second substrate holding section;
A cleaning nozzle configured to be able to discharge a brush cleaning liquid for cleaning the brush to the brush;
a cleaning liquid supply unit for supplying the brush cleaning liquid to the cleaning nozzle;
and a control unit that controls the cleaning liquid supply unit to stop the supply of the brush cleaning liquid to the cleaning nozzle when the substrate is held by the second substrate holding unit and the brush is in a position other than the standby position.

In the substrate processing apparatus, a substrate is held by a first substrate holding part. A brush comes into contact with the substrate held by the first substrate holding part, thereby cleaning the underside of the substrate. The substrate is also held by a second substrate holding part. A predetermined process is performed on the substrate held by the second substrate holding part. The brush is cleaned by a brush cleaning solution discharged from a cleaning nozzle. This prevents the substrate from being cleaned by a brush with a reduced level of cleanliness.

In addition, according to the above substrate processing apparatus, the first substrate holding part is located above the standby position of the brush. Furthermore, the second substrate holding part is located even higher than the first substrate holding part. Therefore, even if brush cleaning liquid is discharged onto the brush when the brush is in the standby position, the splashes are unlikely to reach the second substrate holding part or its surrounding area.

In contrast, when the brush is in a position other than the standby position, for example when the brush is located above the standby position, the distance between the brush and the second substrate holding part is shorter. When brush cleaning liquid is discharged onto the brush in this state, splashes of the brush cleaning liquid are more likely to reach the second substrate holding part and its surrounding area than when the brush is in the standby position.

Therefore, in the above-mentioned substrate processing apparatus, when the substrate is held by the second substrate holding unit and the brush is in a position other than the standby position, the brush cleaning liquid is not supplied to the cleaning nozzle. This reduces adhesion of the brush cleaning liquid to the substrate and its surrounding components when the substrate is held by the second substrate holding unit.

As a result, the substrate is prevented from being cleaned with a brush of reduced cleanliness, and the deterioration of the substrate's cleanliness and the deterioration of the substrate's cleaning environment caused by brush cleaning are reduced.

(11) In the substrate processing apparatus according to the above (10),
The substrate processing apparatus includes:
a processing chamber that accommodates the first substrate holding unit, the brush, the brush moving unit, the second substrate holding unit, the processing unit, the cleaning nozzle, and the cleaning liquid supply unit;
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The control unit is
The cleaning liquid supply unit may be controlled to stop supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position.

According to the above configuration, the supply of brush cleaning liquid from the cleaning nozzle to the brush is stopped when there is no substrate in the processing chamber and the brush is in a position other than the standby position. This prevents a decrease in work efficiency and a decrease in cleanliness in the processing chamber caused by the brush cleaning liquid being discharged at an unintended position when a user works in the substrate processing apparatus due to repairs or a malfunction of the substrate processing apparatus.

(12) The substrate processing apparatus according to the 12th aspect comprises:
a first substrate holder configured to be able to hold a substrate;
a brush cleaning unit configured to bring a brush into contact with the substrate held by the first substrate holding unit to clean the underside of the substrate;
a second substrate holding portion provided at a position above the first substrate holding portion and configured to be able to hold a substrate;
a processing section that performs a predetermined process on the substrate held by the second substrate holding section;
A cleaning nozzle configured to be able to discharge a brush cleaning liquid for cleaning the brush to the brush;
a cleaning liquid supply unit for supplying the brush cleaning liquid to the cleaning nozzle;
an operation unit for inputting supply conditions of the brush cleaning liquid by the cleaning liquid supply unit during the period when the processing unit performs the predetermined processing on the substrate; and
a receiving unit that receives the supply conditions of the brush cleaning liquid inputted by the operation unit;
and a control unit that adjusts the supply state of the brush cleaning liquid to the cleaning nozzle during the period when the specified processing is being performed on the substrate by the processing unit by controlling the cleaning liquid supply unit in accordance with the supply conditions received by the receiving unit.

In the substrate processing apparatus, a substrate is held by a first substrate holding part. A brush comes into contact with the substrate held by the first substrate holding part, thereby cleaning the underside of the substrate. The substrate is also held by a second substrate holding part. A predetermined process is performed on the substrate held by the second substrate holding part. The brush is cleaned by a brush cleaning solution discharged from a cleaning nozzle. This prevents the substrate from being cleaned by a brush with a reduced level of cleanliness.

During the period during which the substrate held by the second substrate holding unit is subjected to a predetermined process (hereinafter referred to as the predetermined process period), depending on the state of the process, even if the brush cleaning liquid discharged onto the brush adheres to the substrate, such adhesion may not affect the cleanliness of the substrate. Also, depending on the relative position of the brush to the substrate, the brush cleaning liquid discharged onto the brush may not splash to the substrate and its surrounding components. Furthermore, the effect that the brush cleaning liquid discharged onto the brush during the predetermined process period has on the substrate and its surrounding components is predictable to a certain extent.

According to the substrate processing apparatus described above, the user can input the supply conditions of the brush cleaning liquid using the operation unit, taking into consideration the effect that the brush cleaning liquid discharged onto the brush will have on the substrate and its surrounding components during a specified processing period. As a result, the supply state of the brush cleaning liquid from the cleaning nozzle to the brush is adjusted according to the supply conditions of the brush cleaning liquid input by the user. For example, by inputting the desired supply conditions, the user can stop the discharge of the brush cleaning liquid at a timing during the specified processing period when the brush cleaning liquid discharged onto the brush will adversely affect the cleanliness of the substrate.

As a result, the substrate is prevented from being cleaned with a brush of reduced cleanliness, and the deterioration of the substrate's cleanliness and the deterioration of the substrate's cleaning environment caused by brush cleaning are reduced.

(13) In the substrate processing apparatus according to the 12th aspect,
The substrate processing apparatus includes:
a processing chamber that accommodates the first substrate holding unit, the brush cleaning unit, the second substrate holding unit, the processing unit, the cleaning nozzle, and the cleaning liquid supply unit;
The brush cleaning unit includes:
The brush;
a brush moving unit configured to be able to move the brush between a cleaning position in which the brush contacts the underside of the substrate held by the first substrate holding unit and a standby position spaced apart from the substrate held by the first substrate holding unit,
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The control unit is
The cleaning liquid supply unit may be controlled to stop supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position.

According to the above configuration, the supply of brush cleaning liquid from the cleaning nozzle to the brush is stopped when there is no substrate in the processing chamber and the brush is in a position other than the standby position. This prevents a decrease in work efficiency and a decrease in cleanliness in the processing chamber caused by the brush cleaning liquid being discharged at an unintended position when a user works in the substrate processing apparatus due to repairs or a malfunction of the substrate processing apparatus.

(Item 14) A substrate processing method according to item 14,
carrying a substrate into a processing chamber using a transport device configured to be capable of performing a loading operation of loading a substrate into the processing chamber and an unloading operation of unloading a substrate from the processing chamber;
a step of holding the substrate carried in by the transfer device in the processing chamber with a first substrate holding part;
a step of bringing a brush into contact with the substrate held by the first substrate holder in the processing chamber to clean the underside of the substrate;
supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle in the processing chamber, thereby discharging the brush cleaning liquid from the cleaning nozzle onto the brush;
and removing the substrate from the processing chamber using the transport device;
The step of ejecting the brush cleaning liquid onto the brush includes stopping the supply of the brush cleaning liquid to the cleaning nozzle during at least a portion of the period during which the transport device performs the loading operation and the unloading operation.

In the substrate processing method, a substrate is carried into a processing chamber by a transport device and held by a first substrate holder. A brush comes into contact with the substrate held by the first substrate holder, thereby cleaning the underside of the substrate. The brush is cleaned with a brush cleaning solution discharged from a cleaning nozzle. This prevents the substrate from being cleaned by a brush with a reduced level of cleanliness.

Furthermore, according to the above substrate processing method, brush cleaning liquid is not supplied to the cleaning nozzle during at least a portion of the substrate loading and unloading operations performed by the transport device. Therefore, when the supply of brush cleaning liquid is stopped, the brush cleaning liquid does not splash around the substrate in the processing chamber. Therefore, during at least one of the substrate loading and unloading operations performed by the transport device, adhesion of brush cleaning liquid to a portion of the transport device that enters the processing chamber in association with the substrate loading or unloading operation is reduced. Also, adhesion of brush cleaning liquid to a portion of the substrate transported by the transport device in association with the substrate loading or unloading operation is reduced.

As a result, the substrate is prevented from being cleaned with a brush whose cleanliness has been degraded, and the deterioration in the cleanliness of the substrate and the substrate cleaning environment caused by brush cleaning is reduced.

(Item 15) A substrate processing method according to item 15,
holding the substrate by a first substrate holder;
a step of bringing a brush into contact with the substrate held by the first substrate holding part to clean the underside of the substrate;
holding the substrate by a second substrate holder;
performing a predetermined process on the substrate held by the second substrate holding unit;
performing a relative movement operation to change a relative position between the first substrate holding part and the substrate by moving at least one of the first substrate holding part, the second substrate holding part, and the substrate in order to switch a state in which the substrate is held by the first substrate holding part to a state in which the substrate is held by the second substrate holding part;
and supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle, thereby discharging the brush cleaning liquid from the cleaning nozzle to the brush,
The step of discharging the brush cleaning liquid to the brush includes stopping the supply of the brush cleaning liquid to the cleaning nozzle during the relative movement operation.

In the substrate processing method, the substrate is held by a first substrate holding part. A brush comes into contact with the substrate held by the first substrate holding part, thereby cleaning the underside of the substrate. The substrate is also held by a second substrate holding part. A predetermined process is performed on the substrate held by the second substrate holding part. The brush is cleaned with a brush cleaning solution discharged from a cleaning nozzle. This prevents the substrate from being cleaned by a brush with a reduced level of cleanliness.

In addition, according to the above substrate processing method, brush cleaning liquid is not supplied to the cleaning nozzle during the relative movement operation. When the supply of brush cleaning liquid is stopped, the brush cleaning liquid does not splash around the substrate. This prevents the brush cleaning liquid from adhering to the substrate and its surrounding members when switching from a state in which the substrate is held by the first substrate holding part to a state in which the substrate is held by the second substrate holding part.

As a result, the substrate is prevented from being cleaned with a brush whose cleanliness has been degraded, and the deterioration in the cleanliness of the substrate and the substrate cleaning environment caused by brush cleaning is reduced.

(Item 16) A substrate processing method according to item 16,
holding a substrate by a first substrate holder;
a step of bringing a brush into contact with the substrate held by the first substrate holding part to clean the underside of the substrate;
and supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle, thereby discharging the brush cleaning liquid from the cleaning nozzle to the brush,
The step of ejecting the brush cleaning liquid onto the brush includes stopping the supply of the brush cleaning liquid to the cleaning nozzle for at least a portion of the period during which the substrate is held by the first substrate holding part.

In the substrate processing method, the substrate is held by a first substrate holder. The underside of the substrate is cleaned by contacting a brush with the substrate held by the first substrate holder. The brush is cleaned with a brush cleaning solution discharged from a cleaning nozzle. This prevents the substrate from being cleaned by a brush with a reduced level of cleanliness.

In addition, according to the above substrate processing method, brush cleaning liquid is not supplied to the cleaning nozzle during at least a portion of the period during which the substrate is held by the first substrate holding unit. When the supply of brush cleaning liquid is stopped, the brush cleaning liquid does not splash in the vicinity of the substrate. This prevents the brush cleaning liquid from adhering to the substrate and its surrounding members during at least a portion of the period during which the substrate is held by the first substrate holding unit.

As a result, the substrate is prevented from being cleaned with a brush of reduced cleanliness, and the deterioration of the substrate's cleanliness and the deterioration of the substrate's cleaning environment caused by brush cleaning are reduced.

(Item 17) A substrate processing method according to item 17,
holding a substrate by a first substrate holder;
a step of moving a brush, which contacts an underside of a substrate to clean the underside, between a cleaning position where the brush contacts the underside of the substrate held by the first substrate holding part and a standby position that is below the first substrate holding part and spaced apart from the substrate held by the first substrate holding part;
holding a substrate by a second substrate holding part provided at a position above the first substrate holding part;
performing a predetermined process on the substrate held by the second substrate holding unit;
and supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle, thereby discharging the brush cleaning liquid from the cleaning nozzle to the brush,
The step of ejecting the brush cleaning liquid onto the brush includes stopping the supply of the brush cleaning liquid to the cleaning nozzle while the substrate is held by the second substrate holding portion and the brush is in a position other than the standby position.

In the substrate processing method, the substrate is held by a first substrate holding part. A brush comes into contact with the substrate held by the first substrate holding part, thereby cleaning the underside of the substrate. The substrate is also held by a second substrate holding part. A predetermined process is performed on the substrate held by the second substrate holding part. The brush is cleaned with a brush cleaning solution discharged from a cleaning nozzle. This prevents the substrate from being cleaned by a brush with a reduced level of cleanliness.

In addition, according to the above substrate processing method, the first substrate holding part is positioned above the standby position of the brush. Furthermore, the second substrate holding part is positioned even higher than the first substrate holding part. Therefore, even if brush cleaning liquid is discharged onto the brush when the brush is in the standby position, the splashes are unlikely to reach the second substrate holding part or its surrounding area.

In contrast, when the brush is in a position other than the standby position, for example when the brush is located above the standby position, the distance between the brush and the second substrate holding part is shorter. When brush cleaning liquid is discharged onto the brush in this state, splashes of the brush cleaning liquid are more likely to reach the second substrate holding part and its surrounding area than when the brush is in the standby position.

Therefore, in the above substrate processing method, when the substrate is held by the second substrate holding part and the brush is in a position other than the standby position, the brush cleaning liquid is not supplied to the cleaning nozzle. This reduces adhesion of the brush cleaning liquid to the substrate and its surrounding members when the substrate is held by the second substrate holding part.

As a result, the substrate is prevented from being cleaned with a brush of reduced cleanliness, and the deterioration of the substrate's cleanliness and the deterioration of the substrate's cleaning environment caused by brush cleaning are reduced.

(Item 18) A substrate processing method according to item 18,
holding a substrate by a first substrate holder;
a step of bringing a brush into contact with the substrate held by the first substrate holding part to clean the underside of the substrate;
holding a substrate by a second substrate holding part provided at a position above the first substrate holding part;
performing a predetermined process on the substrate held by the second substrate holding unit;
supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle, thereby discharging the brush cleaning liquid from the cleaning nozzle onto the brush;
and when a supply condition of the brush cleaning liquid to the cleaning nozzle during a period in which the substrate held by the second substrate holding unit is subjected to the predetermined process is input to an operation unit, accepting the supply condition of the brush cleaning liquid input by the operation unit;
The step of ejecting the brush cleaning liquid onto the brush includes adjusting a supply state of the brush cleaning liquid to the cleaning nozzle during the period during which the specified processing is performed on the substrate in accordance with the supply conditions received in the receiving step.

In the substrate processing method, the substrate is held by a first substrate holding part. A brush comes into contact with the substrate held by the first substrate holding part, thereby cleaning the underside of the substrate. The substrate is also held by a second substrate holding part. A predetermined process is performed on the substrate held by the second substrate holding part. The brush is cleaned with a brush cleaning solution discharged from a cleaning nozzle. This prevents the substrate from being cleaned by a brush with a reduced level of cleanliness.

During the period during which the substrate held by the second substrate holding unit is subjected to a predetermined process (hereinafter referred to as the predetermined process period), depending on the state of the process, even if the brush cleaning liquid discharged onto the brush adheres to the substrate, such adhesion may not affect the cleanliness of the substrate. Also, depending on the relative position of the brush to the substrate, the brush cleaning liquid discharged onto the brush may not splash to the substrate and its surrounding components. Furthermore, the effect that the brush cleaning liquid discharged onto the brush during the predetermined process period has on the substrate and its surrounding components is predictable to a certain extent.

According to the above substrate processing method, the user can input the supply conditions of the brush cleaning liquid using the operation unit, taking into consideration the effect that the brush cleaning liquid discharged onto the brush will have on the substrate and its surrounding components during a specified processing period. As a result, the supply state of the brush cleaning liquid from the cleaning nozzle to the brush is adjusted according to the supply conditions of the brush cleaning liquid input by the user. For example, by inputting the desired supply conditions, the user can stop the discharge of the brush cleaning liquid at a timing during the specified processing period when the brush cleaning liquid discharged onto the brush will adversely affect the cleanliness of the substrate.

As a result, the substrate is prevented from being cleaned with a brush of reduced cleanliness, and the deterioration of the substrate's cleanliness and the deterioration of the substrate's cleaning environment caused by brush cleaning are reduced.

According to the substrate processing apparatus of the above embodiment, the decrease in cleanliness of the substrate after cleaning and the decrease in cleanliness of the cleaning environment of the substrate are reduced, thereby suppressing the occurrence of substrate processing defects. Therefore, the yield of products obtained by substrate processing is improved. This reduces unnecessary substrate processing, thereby realizing energy saving in substrate processing. Furthermore, when chemical liquids are used in the processing of the substrates, the increased yield reduces the use of unnecessary chemical liquids, which contributes to reducing pollution of the global environment.

1...substrate cleaning device, 2...unit housing, 2a...bottom surface portion, 2b...side wall portion, 2c...side wall portion, 2d...side wall portion, 2e...side wall portion, 2x...loading/unloading port, 9A...chuck control unit, 9B...suction control unit, 9C...pedestal control unit, 9D...delivery control unit, 9E...lower surface cleaning control unit, 9F...cup control unit, 9G...upper surface cleaning control unit, 9H...bevel cleaning control unit, 9I...loading/unloading control unit, 9J...condition reception unit, 10A, 10B...upper holding device, 11A, 11B...lower chuck, 12A, 12B...upper chuck, 13A, 13 B...lower chuck drive unit, 14A, 14B...upper chuck drive unit, 20...lower holding device, 21...suction holding unit, 22...suction holding drive unit, 30...pedestal device, 31...linear guide, 32...movable base, 33...pedestal drive unit, 40...delivery device, 41...support pin, 42...pin connecting member, 43...pin lift drive unit, 50...lower surface cleaning device, 51...lower surface brush, 52...substrate nozzle, 52a, 52b...brush nozzle, 53...gas ejection unit, 54...lift support unit, 54u...upper surface, 55a...lower surface brush rotation drive unit, 55b...lower surface brush lifting drive unit, 56...lower surface cleaning liquid supply unit, 57...brush cleaning liquid supply unit, 58...gaseous gas supply unit, 60...cup device, 61...cup, 62...cup drive unit, 70...upper surface cleaning device, 71, 81...rotating support shaft, 72, 82...arm, 73...spray nozzle, 74...upper surface cleaning drive unit, 75...upper surface cleaning fluid supply unit, 80...edge cleaning device, 83...bevel brush, 84...bevel brush drive unit, 90...opening/closing device, 91...shutter, 92...shutter drive unit, 100...substrate processing device placement, 110... indexer block, 120... processing block, 140... carrier placement stage, 150, 163... transport section, 161, 162... cleaning section, 170... control device, 180... operation panel, 200... indexer robot, 210... hand support member, 220, 320... transport drive section, 300... main robot, 310... hand support member, C... carrier, Ia, Ib, Ic, Id, Ma, Mb, Mc, Md... hand, PASS1, PASS2... substrate placement section, W... substrate, rp... plane reference position

Claims (15)

A processing chamber;
a transport device configured to be capable of performing a carry-in operation for carrying a substrate into the processing chamber and an unloading operation for carrying a substrate out of the processing chamber;
a first substrate holder provided in the processing chamber and configured to hold a substrate carried in by the transfer device;
a brush cleaning unit provided in the processing chamber and configured to be able to clean an underside of the substrate by bringing a brush into contact with the substrate held by the first substrate holding unit;
a cleaning nozzle provided in the processing chamber and configured to be able to discharge a brush cleaning liquid to the brush for cleaning the brush;
a cleaning liquid supply unit for supplying the brush cleaning liquid to the cleaning nozzle;
a control unit that controls the cleaning liquid supply unit to stop the supply of the brush cleaning liquid to the cleaning nozzle during at least a part of a period during which the carry-in operation and the carry-out operation are performed by the transport device ,
The brush cleaning unit includes:
The brush;
a brush moving unit configured to be able to move the brush between a cleaning position in which the brush contacts the underside of the substrate held by the first substrate holding unit and a standby position spaced apart from the substrate held by the first substrate holding unit,
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The control unit is
A substrate processing apparatus that controls the cleaning liquid supply unit to stop supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position . The conveying device is
a transfer holder configured to be movable while holding a substrate;
a transport drive unit that moves the transport holder,
The control unit further includes:
by controlling the transport drive unit, the transport holder is caused to enter and exit the processing chamber from the outside of the processing chamber during the loading operation and the unloading operation of the transport device;
The substrate processing apparatus according to claim 1 , wherein at least a part of a period during which the transport device performs the loading operation and the unloading operation is performed is a period during which the transport holder is located inside the processing chamber . a first substrate holder configured to be able to hold a substrate;
a brush cleaning unit configured to bring a brush into contact with the substrate held by the first substrate holding unit to clean the underside of the substrate;
a second substrate holding part configured to be able to hold a substrate;
a processing section that performs a predetermined process on the substrate held by the second substrate holding section;
a relative movement unit that performs a relative movement operation to change a relative position between the first substrate holding unit and the substrate by moving at least one of the first substrate holding unit, the second substrate holding unit, and the substrate in order to switch a state in which the substrate is held by the first substrate holding unit to a state in which the substrate is held by the second substrate holding unit;
A cleaning nozzle configured to be able to discharge a brush cleaning liquid for cleaning the brush to the brush;
a cleaning liquid supply unit for supplying the brush cleaning liquid to the cleaning nozzle;
a control unit that controls the cleaning liquid supply unit to stop supplying the brush cleaning liquid to the cleaning nozzle during the relative movement operation by the relative movement unit;
a processing chamber that accommodates the first substrate holding unit, the brush cleaning unit, the second substrate holding unit, the processing unit, the cleaning nozzle, and the cleaning liquid supply unit ,
The brush cleaning unit includes:
The brush;
a brush moving unit configured to be able to move the brush between a cleaning position in which the brush contacts the underside of the substrate held by the first substrate holding unit and a standby position spaced apart from the substrate held by the first substrate holding unit,
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The control unit is
A substrate processing apparatus that controls the cleaning liquid supply unit to stop supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position . the brush cleaning unit is configured to be capable of cleaning a first region of an underside of a substrate held by the first substrate holding unit by bringing the brush into contact with the first region, and to clean a second region, different from the first region, of an underside of a substrate held by the second substrate holding unit by bringing the brush into contact with the second region,
The control unit is
while the substrate is held by the first substrate holding unit, controlling the brush cleaning unit to cause the brush cleaning unit to clean a first region of the underside of the substrate;
The substrate processing apparatus of claim 3 , further comprising: controlling the brush cleaning unit while the substrate is held by the second substrate holding unit, the brush cleaning unit being the processing unit and causing the brush cleaning unit to clean a second region of the underside of the substrate. a first substrate holder configured to be able to hold a substrate;
a brush cleaning unit configured to bring a brush into contact with the substrate held by the first substrate holding unit to clean the underside of the substrate;
A cleaning nozzle configured to be able to discharge a brush cleaning liquid for cleaning the brush to the brush;
a cleaning liquid supply unit for supplying the brush cleaning liquid to the cleaning nozzle;
a control unit that controls the cleaning liquid supply unit to stop supplying the brush cleaning liquid to the cleaning nozzle for at least a portion of a period during which the substrate is held by the first substrate holding unit ; and
a processing chamber that accommodates the first substrate holding unit, the brush cleaning unit, the cleaning nozzle, and the cleaning liquid supply unit ,
The brush cleaning unit includes:
The brush;
a brush moving unit configured to be able to move the brush between a cleaning position in which the brush contacts the underside of the substrate held by the first substrate holding unit and a standby position spaced apart from the substrate held by the first substrate holding unit,
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The control unit controls the cleaning liquid supply unit to stop the supply of brush cleaning liquid from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in a position other than the standby position . the first substrate holder is configured to be able to rotate the substrate held by the first substrate holder;
the control unit controls the first substrate holding unit to rotate the first substrate holding unit at a predetermined speed to dry the substrate after the underside of the substrate is cleaned by the brush cleaning unit;
6. The substrate processing apparatus of claim 5, wherein at least a portion of the period during which the substrate is held by the first substrate holding part includes a period from the time drying of the substrate by rotation of the first substrate holding part begins to the time the substrate is released from its held state by the first substrate holding part. a first substrate holder configured to be able to hold a substrate;
a brush for contacting an underside of the substrate to clean said underside;
a brush moving unit configured to be able to move the brush between a cleaning position in which the brush contacts the underside of the substrate held by the first substrate holding unit and a standby position that is below the first substrate holding unit and spaced apart from the substrate held by the first substrate holding unit;
a second substrate holding portion provided at a position above the first substrate holding portion and configured to be able to hold a substrate;
a processing section that performs a predetermined process on the substrate held by the second substrate holding section;
A cleaning nozzle configured to be able to discharge a brush cleaning liquid for cleaning the brush to the brush;
a cleaning liquid supply unit for supplying the brush cleaning liquid to the cleaning nozzle;
a control unit that controls the cleaning liquid supply unit to stop the supply of the brush cleaning liquid to the cleaning nozzle when the substrate is held by the second substrate holding unit and the brush is in a position other than the standby position ;
a processing chamber that accommodates the first substrate holding unit, the brush, the brush moving unit, the second substrate holding unit, the processing unit, the cleaning nozzle, and the cleaning liquid supply unit ,
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The control unit is
A substrate processing apparatus that controls the cleaning liquid supply unit to stop supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position . a first substrate holder configured to be able to hold a substrate;
a brush cleaning unit configured to bring a brush into contact with the substrate held by the first substrate holding unit to clean the underside of the substrate;
a second substrate holding portion provided at a position above the first substrate holding portion and configured to be able to hold a substrate;
a processing section that performs a predetermined process on the substrate held by the second substrate holding section;
A cleaning nozzle configured to be able to discharge a brush cleaning liquid for cleaning the brush to the brush;
a cleaning liquid supply unit for supplying the brush cleaning liquid to the cleaning nozzle;
an operation unit for inputting supply conditions of the brush cleaning liquid by the cleaning liquid supply unit during the period when the processing unit performs the predetermined processing on the substrate; and
a receiving unit that receives the supply conditions of the brush cleaning liquid inputted by the operation unit;
a control unit that adjusts a supply state of the brush cleaning liquid to the cleaning nozzle during a period in which the processing unit performs the predetermined processing on the substrate by controlling the cleaning liquid supply unit in accordance with the supply conditions received by the receiving unit ; and
a processing chamber that accommodates the first substrate holding unit, the brush cleaning unit, the second substrate holding unit, the processing unit, the cleaning nozzle, and the cleaning liquid supply unit ,
The brush cleaning unit includes:
The brush;
a brush moving unit configured to be able to move the brush between a cleaning position in which the brush contacts the underside of the substrate held by the first substrate holding unit and a standby position spaced apart from the substrate held by the first substrate holding unit,
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The control unit is
A substrate processing apparatus that controls the cleaning liquid supply unit to stop supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position . A processing chamber;
a substrate holder provided in the processing chamber and configured to hold a substrate;
a brush provided in the processing chamber and capable of cleaning a bottom surface of the substrate held by the substrate holder;
a cleaning nozzle provided in the processing chamber and configured to be able to discharge a brush cleaning liquid to the brush for cleaning the brush;
a cleaning liquid supply unit for supplying the brush cleaning liquid to the cleaning nozzle;
a brush moving unit configured to be able to move the brush between a cleaning position in which the brush contacts the underside of the substrate held by the substrate holding unit and a standby position spaced apart from the substrate held by the substrate holding unit;
a control unit that controls the cleaning liquid supply unit to stop the supply of brush cleaning liquid from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in a position other than the standby position. carrying a substrate into a processing chamber using a transport device configured to be capable of carrying the substrate into the processing chamber and carrying the substrate out of the processing chamber;
a step of holding the substrate carried in by the transfer device in the processing chamber with a first substrate holding part;
a step of bringing a brush into contact with the substrate held by the first substrate holder in the processing chamber to clean the underside of the substrate;
supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle in the processing chamber, thereby discharging the brush cleaning liquid from the cleaning nozzle onto the brush;
and removing the substrate from the processing chamber using the transport device;
the step of discharging the brush cleaning liquid onto the brush includes stopping the supply of the brush cleaning liquid to the cleaning nozzle during at least a part of a period during which the transport device performs the carry-in operation and the carry-out operation ,
the step of cleaning the underside of the substrate includes moving the brush between a cleaning position in which the brush contacts the underside of the substrate held by the first substrate holding part and a waiting position spaced apart from the substrate held by the first substrate holding part;
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The step of ejecting the brush cleaning liquid onto the brush further includes stopping the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position . holding the substrate by a first substrate holder;
a step of bringing a brush into contact with the substrate held by the first substrate holding part to clean the underside of the substrate;
holding the substrate by a second substrate holder;
performing a predetermined process on the substrate held by the second substrate holding unit;
performing a relative movement operation to change a relative position between the first substrate holding part and the substrate by moving at least one of the first substrate holding part, the second substrate holding part, and the substrate in order to switch a state in which the substrate is held by the first substrate holding part to a state in which the substrate is held by the second substrate holding part;
and supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle, thereby discharging the brush cleaning liquid from the cleaning nozzle to the brush,
The step of discharging the brush cleaning liquid onto the brush includes stopping the supply of the brush cleaning liquid to the cleaning nozzle during the relative movement operation,
the first substrate holder, the brush, the second substrate holder, and the cleaning nozzle are housed in a processing chamber;
the step of cleaning the underside of the substrate includes moving the brush between a cleaning position in which the brush contacts the underside of the substrate held by the first substrate holding part and a standby position spaced apart from the substrate held by the first substrate holding part;
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The step of ejecting the brush cleaning liquid onto the brush further includes stopping the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position . holding a substrate by a first substrate holder;
a step of bringing a brush into contact with the substrate held by the first substrate holding part to clean the underside of the substrate;
and supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle, thereby discharging the brush cleaning liquid from the cleaning nozzle to the brush,
the step of discharging the brush cleaning liquid onto the brush includes stopping the supply of the brush cleaning liquid to the cleaning nozzle during at least a portion of a period during which the substrate is held by the first substrate holding part ;
the first substrate holder, the brush, and the cleaning nozzle are housed in a processing chamber;
the step of cleaning the underside of the substrate includes moving the brush between a cleaning position in which the brush contacts the underside of the substrate held by the first substrate holding part and a waiting position spaced apart from the substrate held by the first substrate holding part;
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The step of ejecting the brush cleaning liquid onto the brush further includes stopping the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position . holding a substrate by a first substrate holder;
a step of moving a brush, which contacts an underside of a substrate to clean the underside, between a cleaning position where the brush contacts the underside of the substrate held by the first substrate holding part and a standby position that is below the first substrate holding part and spaced apart from the substrate held by the first substrate holding part;
holding a substrate by a second substrate holding part provided at a position above the first substrate holding part;
performing a predetermined process on the substrate held by the second substrate holding unit;
and supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle, thereby discharging the brush cleaning liquid from the cleaning nozzle to the brush,
the step of discharging the brush cleaning liquid onto the brush includes stopping the supply of the brush cleaning liquid to the cleaning nozzle while the substrate is held by the second substrate holding part and the brush is in a position other than the standby position ;
the first substrate holder, the brush, the second substrate holder, and the cleaning nozzle are housed in a processing chamber;
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The step of ejecting the brush cleaning liquid onto the brush further includes stopping the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position . holding a substrate by a first substrate holder;
a step of bringing a brush into contact with the substrate held by the first substrate holding part to clean the underside of the substrate;
holding a substrate by a second substrate holding part provided at a position above the first substrate holding part;
performing a predetermined process on the substrate held by the second substrate holding unit;
supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle, thereby discharging the brush cleaning liquid from the cleaning nozzle onto the brush;
and when a supply condition of the brush cleaning liquid to the cleaning nozzle during a period in which the substrate held by the second substrate holding unit is subjected to the predetermined process is input to an operation unit, accepting the supply condition of the brush cleaning liquid input by the operation unit;
the step of discharging the brush cleaning liquid onto the brush includes adjusting a supply state of the brush cleaning liquid to the cleaning nozzle during a period during which the predetermined process is performed on the substrate in accordance with the supply conditions received in the receiving step;
the first substrate holder, the brush, the second substrate holder, and the cleaning nozzle are housed in a processing chamber;
the step of cleaning the underside of the substrate includes moving the brush between a cleaning position in which the brush contacts the underside of the substrate held by the first substrate holding part and a standby position spaced apart from the substrate held by the first substrate holding part;
The cleaning nozzle is configured to be capable of discharging a brush cleaning liquid to the brush in the standby position,
The step of ejecting the brush cleaning liquid onto the brush further includes stopping the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position . holding the substrate by a substrate holder in the processing chamber;
a step of bringing a brush into contact with the substrate held by the substrate holder in the processing chamber to clean the underside of the substrate;
a step of supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle in the processing chamber, thereby discharging the brush cleaning liquid from the cleaning nozzle onto the brush;
the step of cleaning the underside of the substrate includes moving the brush between a cleaning position in which the brush contacts the underside of the substrate held by the substrate holder and a standby position spaced apart from the substrate held by the substrate holder;
A substrate processing method, wherein the step of ejecting the brush cleaning liquid onto the brush includes stopping the supply of brush cleaning liquid from the cleaning nozzle to the brush when no substrate is present in the processing chamber and the brush is in a position other than the standby position.

Images