JP7597472B2 - 研削装置 - Google Patents
研削装置 Download PDFInfo
- Publication number
- JP7597472B2 JP7597472B2 JP2022551894A JP2022551894A JP7597472B2 JP 7597472 B2 JP7597472 B2 JP 7597472B2 JP 2022551894 A JP2022551894 A JP 2022551894A JP 2022551894 A JP2022551894 A JP 2022551894A JP 7597472 B2 JP7597472 B2 JP 7597472B2
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- housing
- sensor
- chuck
- liquid level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/08—Protective coverings for parts of machine tools; Splash guards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
20 チャック
30 工具駆動部
40 筐体
50 ノズル
80 液面レベルセンサ(センサ)
81 センサカバー
W 基板
Claims (10)
- 基板を保持するチャックと、
前記チャックを収容する筐体と、
前記筐体の内部で前記基板に押し当てた研削工具を駆動する工具駆動部と、
前記筐体の内部で前記基板に対して研削液を供給するノズルと、
前記筐体の内部に位置し、前記研削液を含む液体の排出口が研削屑で詰まることで前記筐体の内部に溜まる前記液体の液面レベルを検出するセンサと、
前記チャックと前記センサとの間に位置し、前記チャックに保持された前記基板から前記センサに向かう前記液体をその途中で遮るセンサカバーと、を備える、研削装置。 - 前記筐体は、前記チャックの側方に位置する複数の側面パネルを含み、
前記センサは、複数の前記側面パネルの角に位置する、請求項1に記載の研削装置。 - 上方から見て、前記センサカバーは、前記角を形成する複数の前記側面パネルのそれぞれに対して傾斜する傾斜板を有し、
前記センサは、複数の前記側面パネルと前記傾斜板で囲まれた空間に位置する、請求項2に記載の研削装置。 - 前記筐体は、前記チャックの下方に位置し、落下する前記研削液及び前記研削屑を受けるパンを含み、
前記パンは、その周縁に、樋を有し、
上方から見て、前記センサは、前記樋と重なっている、請求項1~3のいずれか1項に記載の研削装置。 - 複数の前記チャックを回転中心線の周りに保持し、前記回転中心線を中心に回転するテーブルと、
前記筐体の内部を、前記テーブルの前記回転中心線の周りに4つの部屋に仕切る固定仕切壁と、
前記パンは、その上面に、互いに隣り合う2つの前記部屋と残り2つの前記部屋との境界線から離れるほど下方に傾斜する2つの傾斜面を有し、
前記パンは、2つの前記傾斜面の下縁に沿って2つの前記樋を有し、
上方から見て、1つの前記センサは1つの前記樋と重なっており、別の前記センサは別の前記樋と重なっている、請求項4に記載の研削装置。 - 前記樋は、その溝底の最も高さの低い部位に、前記研削液及び前記研削屑を排出する排出口を含み、
上方から見て、前記センサは、前記排出口の近傍に位置する、請求項4又は5に記載の研削装置。 - 前記センサとは別に、前記液面レベルを検出する第2センサを備える、請求項1~6のいずれか1項に記載の研削装置。
- 前記筐体の外部に、前記筐体の内部と連通する鉛直管を備え、
前記第2センサは、前記鉛直管に取り付けられる、請求項7に記載の研削装置。 - 前記センサは、前記液面レベルの変位を計測する変位計を含み、
前記第2センサは、前記液面レベルの設定値への到達を検出するスイッチを含む、請求項7又は8に記載の研削装置。 - 複数の前記チャックを回転中心線の周りに保持し、前記回転中心線を中心に回転するテーブルと、
前記筐体の内部を、前記テーブルの前記回転中心線の周りに4つの部屋に仕切る固定仕切壁と、
前記筐体は、複数の前記チャックの下方に位置し、落下する前記研削液及び前記研削屑を受けるパンを含み、
前記パンは、その上面に、互いに隣り合う2つの前記部屋と残り2つの前記部屋との境界線から離れるほど下方に傾斜する2つの傾斜面を有し、
前記液面レベルの前記設定値は、2つの前記傾斜面の頂きの高さよりも低い、請求項9に記載の研削装置。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020161264 | 2020-09-25 | ||
| JP2020161264 | 2020-09-25 | ||
| PCT/JP2021/033569 WO2022065111A1 (ja) | 2020-09-25 | 2021-09-13 | 研削装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022065111A1 JPWO2022065111A1 (ja) | 2022-03-31 |
| JP7597472B2 true JP7597472B2 (ja) | 2024-12-10 |
Family
ID=80845375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022551894A Active JP7597472B2 (ja) | 2020-09-25 | 2021-09-13 | 研削装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230364740A1 (ja) |
| JP (1) | JP7597472B2 (ja) |
| KR (1) | KR20230073282A (ja) |
| CN (1) | CN116194246A (ja) |
| WO (1) | WO2022065111A1 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7845927B2 (ja) * | 2022-06-20 | 2026-04-14 | 株式会社ディスコ | 研削装置 |
| CN118372169B (zh) * | 2024-06-27 | 2024-09-03 | 北京特思迪半导体设备有限公司 | 一种回转上片结构及晶圆加工系统 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013188813A (ja) | 2012-03-13 | 2013-09-26 | Disco Corp | 研削装置 |
| JP5878613B2 (ja) | 2013-10-31 | 2016-03-08 | 株式会社荏原製作所 | 研磨方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4808278B2 (ja) | 1999-01-06 | 2011-11-02 | 株式会社東京精密 | 平面加工装置及び方法 |
| JP5635892B2 (ja) * | 2010-12-07 | 2014-12-03 | 株式会社ディスコ | 研削装置 |
| JP6736372B2 (ja) | 2016-06-17 | 2020-08-05 | 株式会社ディスコ | 加工装置 |
| CN208019882U (zh) * | 2018-02-07 | 2018-10-30 | 合肥金瓷机电科技有限公司 | 一种数控机床 |
| US20190299360A1 (en) * | 2018-04-02 | 2019-10-03 | Ebara Corporation | Polishing apparatus and substrate processing apparatus |
| JP2019185645A (ja) * | 2018-04-17 | 2019-10-24 | 株式会社ディスコ | 表示システム及び加工装置 |
| CN208759301U (zh) * | 2018-07-27 | 2019-04-19 | 东京毅力科创株式会社 | 加工装置 |
| JP7080766B2 (ja) * | 2018-08-07 | 2022-06-06 | 株式会社荏原製作所 | 液面検出センサと組み合わせて使用されるセンサターゲットカバー、および湿式処理装置 |
-
2021
- 2021-09-13 CN CN202180063228.3A patent/CN116194246A/zh active Pending
- 2021-09-13 JP JP2022551894A patent/JP7597472B2/ja active Active
- 2021-09-13 WO PCT/JP2021/033569 patent/WO2022065111A1/ja not_active Ceased
- 2021-09-13 KR KR1020237013450A patent/KR20230073282A/ko active Pending
- 2021-09-13 US US18/246,517 patent/US20230364740A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013188813A (ja) | 2012-03-13 | 2013-09-26 | Disco Corp | 研削装置 |
| JP5878613B2 (ja) | 2013-10-31 | 2016-03-08 | 株式会社荏原製作所 | 研磨方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20230364740A1 (en) | 2023-11-16 |
| WO2022065111A1 (ja) | 2022-03-31 |
| CN116194246A (zh) | 2023-05-30 |
| JPWO2022065111A1 (ja) | 2022-03-31 |
| KR20230073282A (ko) | 2023-05-25 |
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