JP7602797B2 - Resin sealing equipment - Google Patents

Description

The present invention relates to a resin sealing device.

Semiconductor packages equipped with plate-shaped members such as heat spreaders that improve heat dissipation efficiency and shield plates that block electromagnetic noise are manufactured by a resin sealing device that resin-seals such plate-shaped members together with electronic components such as semiconductor chips (see, for example, Patent Documents 1 and 2). The plate-shaped members are placed in a predetermined position within the mold of the resin sealing device in a process prior to resin sealing.

Patent No. 6639931 Patent No. 6298719

However, in order to maximize productivity, the plate-shaped member is carried into the mold as a rectangular plate without pilot holes and is sealed with resin. Compared to substrates such as lead frames, where positional errors can be corrected by inserting pilot pins into pilot holes, it is difficult to accurately position the plate-shaped member at a predetermined position within the mold.

Therefore, the present invention aims to provide a resin sealing device that can position plate-shaped members with high precision.

The resin sealing device according to one aspect of the present invention includes an index that aligns a plate-shaped member to be resin-sealed together with an electronic component in a mold and restricts horizontal movement in a first direction, and a pick-and-place that lifts the plate-shaped member from the index and places the plate-shaped member at either a predetermined position in the mold or a predetermined position in a loader that carries the plate-shaped member into the mold. The pick-and-place includes a holding member that lifts the plate-shaped member in a state in which horizontal movement in the first direction is restricted by the index and lowers the plate-shaped member at a predetermined position in the mold or the loader, and first and second guide pins that are arranged to sandwich the plate-shaped member from at least a second direction intersecting the first direction and restrict the horizontal movement of the plate-shaped member in the second direction.

According to this aspect, the plate-shaped member that has been positioned in a first direction by the index is positioned in a second direction by pick-and-place and placed in a mold or loader. Since the positioning accuracy is improved when the plate-shaped member is directly or indirectly brought into the mold, the plate-shaped member can be positioned with high accuracy in a resin-sealed product.

In the above aspect, each of the first and second guide pins may extend vertically below the bottom surface of the plate-like member raised by the holding member.

When the plate-shaped member is lowered from the pick-and-place, there is a small gap between the holding member and the mold or loader. According to this embodiment, the plate-shaped member that has left the holding member falls along the first and second guide pins. The horizontal movement of the plate-shaped member during the fall can be restricted so that it does not shift position in the first direction.

In the above aspect, each of the first and second guide pins may have a constant cross-sectional area in the vertical direction.

According to this aspect, the gap between the plate-like member and each guide pin does not widen throughout the entire time the plate-like member falls from the holding member. This makes it possible to more reliably prevent misalignment compared to when the first and second guide pins are tapered.

In the above embodiment, a drive source may be provided to change the distance between the first and second guide pins.

According to this aspect, the pick and place is lowered toward the index by widening the gap between the first and second guide pins so as not to interfere with the plate-like member, and the gap between the first and second guide pins is narrowed to transport the plate-like member in a state in which it is positioned with high precision in the second direction, and then the plate-like member can be carried into the loader or mold.

In the above aspect, the holding member may be a hook that faces the plate-shaped member from the first direction, and a hook-shaped claw provided at the tip of the hook may come into contact with the bottom surface of the plate-shaped member to lift it up.

According to this aspect, the bottom surface of the plate-like member is hooked with a hook and lifted, so the plate-like member is less likely to be loaded than when the outer edge of the plate-like member is clamped. When the plate-like member is held by the pickup with the guide pin, and when the lifted plate-like member is lowered, it is less likely to shift position, so the positional relationship determined by the index and the first and second guide pins can be maintained.

In the above embodiment, the holding member may be an adsorption holding member that adsorbs and lifts the plate-like member.

According to this aspect, there is no need to lay out an index or the like so as not to interfere with the opening and closing hook, so the resin sealing device can be made more compact than when the plate-shaped member is lifted by the claws of the hook.

In the above embodiment, the plate-shaped member may be a heat spreader, a shield plate, or a plate-shaped resin.

According to this aspect, the first and second guide pins are arranged close to the outer edge of the plate-shaped member, and horizontal movement can be restricted without using pilot holes, making this suitable for heat spreaders, shield plates, or plate-shaped resins that do not have pilot holes.

The present invention provides a resin sealing device that can position plate-shaped members with high precision.

1 is a plan view illustrating a schematic configuration of a resin sealing apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a schematic configuration of the mold and the molded product shown in FIG. 1 . 2 is a plan view illustrating the movement of the first loader and the second loader illustrated in FIG. 1 . FIG. 4 is a perspective view of an index that constitutes the plate-like member delivery portion. FIG. 2 is a perspective view of a pick-and-place that constitutes the plate-shaped member delivery section. FIG. 5 is a cross-sectional view of the index shown in FIG. 4 . 11 is a cross-sectional view showing the movement of the pick and place lifting the plate-shaped member from the index. FIG. 8 is an enlarged cross-sectional view of a tip of the holding member shown in FIG. 7.

A preferred embodiment of the present invention will be described with reference to the attached drawings. In each drawing, parts with the same reference numerals have the same or similar configuration. The drawings of each embodiment are illustrative, and the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be interpreted as being limited to the embodiment. Each configuration will be described in detail below with reference to Figures 1 to 8.

Figure 1 is a plan view that shows a schematic configuration of a resin sealing device 1 according to one embodiment. For the sake of clarity and to aid in understanding the positional relationships of each component, each drawing is conveniently labeled with front-rear and left-right directions. The left-right direction is an example of a first direction, and the front-rear direction is an example of a second direction. In addition, the short-side direction of a plate-like member H formed in a strip shape is another example of the first direction, and the long-side direction is another example of the second direction.

The resin sealing device 1 is a manufacturing device that melts resin R on a workpiece W including a substrate S and an electronic component P to resin-seal the electronic component P and produce a molded product M. The resin sealing device 1 also resin-seals a plate-shaped member H together with the workpiece W. The plate-shaped member H is provided, for example, so as to be exposed on the side opposite to the side on which the substrate S of the molded product M is exposed. The substrate S is, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, a semiconductor substrate, etc. The electronic component P is, for example, a semiconductor element such as an IC chip, but is not limited thereto, and may be various active elements, passive elements, MEMS devices, etc.

The plate-shaped member H is, for example, a heat spreader that releases heat generated by the electronic component P or a shield plate that blocks electromagnetic noise, and is exposed after molding, but is not limited to these. The plate-shaped member may be a strip of solid or semi-solid plate-shaped resin (including sheet-shaped resin if it can be positioned by a guide pin). In the case of a plate-shaped resin, it melts itself and molds the electronic component P, and is not necessarily intended to be exposed. The resin R is, for example, a granular thermosetting resin. The resin R may be a powdered thermosetting resin. The shape of the resin R is not limited to granular, and may be liquid or tablet. The resin sealing device 1 according to this embodiment is a compression type resin sealing device. The resin sealing device 1 is not limited to a compression type, and may be a transfer type resin sealing device.

As shown in FIG. 1, the resin sealing device 1 includes, for example, a work supply unit 10, a resin supply unit 40, a plate-shaped member supply unit 50, press units 20 and 30, a molded product recovery unit 90, a first loader 60, and a second loader 70. Only one of the press units 20 and 30 may be used. In the illustrated example, the work supply unit 10, the resin supply unit 40, the press units 20 and 30, and the molded product recovery unit 90 are arranged side by side in the left-right direction, and the plate-shaped member supply unit 50 is arranged in the front-rear direction of the resin supply unit 40.

The first loader 60 is configured to be movable along the first guide portion 60R. The first guide portion 60R extends in the left-right direction across the work supply unit 10, the press units 20, 30, the resin supply unit 40, and the molded product recovery unit 90. The second loader 70 is configured to be movable along the second guide portion 70R. The second guide portion 70R is provided, for example, on the resin supply unit 40 and extends in the front-rear direction. In the illustrated example, the second guide portion 70R intersects with the first guide portion 60R.

The work supply unit 10 supplies the work W. In the illustrated example, the work supply unit 10 is arranged at the left end of the planar layout of the resin sealing device 1. The work supply unit 10 includes, for example, a work storage section 11, a work transfer section 13, a work preheating section 15, etc. The work supply unit 10 may further include a volume measurement section that measures the volume of the work W, an appearance inspection section that inspects the appearance of the work W, etc.

The work storage unit 11 stores multiple workpieces W and delivers the workpieces W sequentially. The work transfer unit 13 delivers the workpieces W received from the work storage unit 11 to the workpiece preheating unit 15. The workpiece preheating unit 15 preheats the workpieces W received from the workpiece transfer unit 13 and delivers them to the first loader 60. The workpiece transfer unit 13 receives the workpieces W delivered by the work storage unit 11 and delivers them to the workpiece preheating unit 15.

The molded product recovery unit 90 recovers the molded product M. In the illustrated example, the molded product recovery unit 90 is disposed at the right end of the planar layout of the resin sealing device 1. The molded product recovery unit 90 includes, for example, a molded product receiving section 91, a molded product delivery section 93, and a molded product storage section 95. The molded product recovery unit 90 may further include a volume measurement section that measures the volume of the molded product M, an appearance inspection section that inspects the appearance of the molded product M, and the like.

When the resin sealing device 1 is of the transfer type, the molded product recovery unit may further include a degate section that separates unnecessary resin, called cull or liner, from the molded product M, and a scrap box for recovering the separated unnecessary resin.

The molded product receiving section 91 delivers the molded product M received from the first loader 60 to the molded product transfer section 93. The molded product receiving section 91 is equipped with, for example, a cooling pallet for cooling the molded product M. The molded product transfer section 93 delivers the molded product M received from the molded product receiving section 91 to the molded product storage section 95. The molded product transfer section 93 receives the molded product M sent out by the molded product receiving section 91 and delivers it to the molded product storage section 95. The molded product storage section 95 receives and stores the molded product M.

The press units 20 and 30 mold the resin R onto the workpiece W and the plate-like member H. In the illustrated example, the press unit 20 is connected to the right side of the workpiece supply unit 10 in the planar layout of the resin sealing apparatus 1, and the press unit 30 is connected to the left side of the molded product recovery unit 90 in the planar layout of the resin sealing apparatus 1. The press unit 20 includes, for example, a mold 21, a film handler 27, etc. Similarly, the press unit 30 includes, for example, a mold 31, a film handler 37, etc.

The film handler 27 supplies film F to the mold 21. Film F is a release film that prevents resin R from entering the gaps in the upper mold 23 and makes it easy to peel off the molded product M from the upper mold 23. The film handler 27 includes, for example, an unwinding section that supplies unused film F and a winding section that collects used film F. Note that the configuration of the press unit 30 is similar to that of the press unit 20, so a description of the mold 31, film handler 37, etc. will be omitted.

The resin supply unit 40 supplies granular resin R to the second loader 70. In the illustrated example, the resin supply unit 40 is connected to the right side of the press unit 20 and to the left side of the press unit 30. The resin supply unit 40 includes, for example, a resin supply section 41, a weight measuring section that measures the weight of the resin R, a resin preheating section that preheats the resin R, a resin guard used as a frame that surrounds the resin R, a vibration section that disperses the resin R by vibration, and an inspection section that inspects the dispersion of the resin R.

The resin supply unit 41 includes, for example, a hopper, a feeder, and the like. The hopper stores resin R. The feeder delivers the resin R received from the hopper. If the resin is liquid, the resin supply unit may include a syringe that stores the resin, a piston that pushes out the resin, a pinch valve that opens and closes the tip of the syringe, and the like. If the resin supply unit supplies liquid resin, the resin supply unit may apply the liquid resin onto the workpiece.

The plate-shaped member supply unit 50 supplies the plate-shaped member H to the molds 21 and 31 via the second loader 70. The plate-shaped member supply unit 50 may be configured to supply the plate-shaped member H directly to the molds 21 and 31. In the illustrated example, the plate-shaped member supply unit 50 is connected to the front side of the resin supply unit 40. The plate-shaped member supply unit 50 includes, for example, a plate-shaped member storage section 51, a plate-shaped member delivery section 53, etc.

The plate-shaped member storage unit 51 stores multiple plate-shaped members H and sequentially delivers the plate-shaped members H. The plate-shaped member storage unit 51 includes, for example, multiple plate-shaped member magazines, each of which stores multiple plate-shaped members H stacked on top of each other, and a plate-shaped member elevation that adjusts the positions of the multiple plate-shaped member magazines to deliver the plate-shaped members H.

The plate-shaped member delivery section 53 delivers the plate-shaped member H received from the plate-shaped member storage section 51 to the second loader 70 or the molds 21, 31. The plate-shaped member delivery section 53 includes, for example, a plate-shaped member index 100 that receives and aligns the plate-shaped member H sent out by the plate-shaped member storage section 51, and a plate-shaped member pick-and-place 200 that delivers the plate-shaped member H aligned by the index 100 to the second loader 70 or the molds 21, 31. The plate-shaped member delivery section 53 will be described in detail later with reference to Figures 4 to 8.

Figure 2 is a cross-sectional view showing the schematic configuration of the mold 21 and molded product M shown in Figure 1. The mold 21 is a pair of openable and closable resin sealing molds that fill the internal cavity 25 with resin R for molding. The mold 21 includes a lower mold 22 and an upper mold 23. In the example shown, the mold 21 is configured as a resin sealing mold with a so-called upper cavity structure, in which the cavity 25 is formed in the upper mold 23.

As shown in FIG. 2, the upper mold 23 includes an upper plate 23A, a cavity piece 23B, a clamper 23C, and a biasing member 23D. The cavity piece 23B is fixedly attached to the lower surface of the upper plate 23A. The clamper 23C is configured in a frame shape so as to surround the cavity piece 23B. The clamper 23C is attached to the upper plate 23A via the biasing member 23D so as to be movable up and down.

The lower mold 22 includes a lower plate 22A and a cavity plate 22B. The cavity plate 22B is fixed and assembled to the upper surface of the lower plate 22A. The upper mold 23 includes suction passages 23E and 23F that pass through the clamper 23C, and a suction passage 23G that passes through the upper plate 23A and the cavity piece 23B. The lower mold 22 includes a suction passage 22C that passes through the lower plate 22A and the cavity plate 22B.

When the predetermined position where the pick and place 200 places the plate-shaped member H is located within the die 21, the plate-shaped member H brought into the die 21 by the pick and place 200 is placed on the workpiece W. The workpiece W is positioned by being sucked into the suction passage 22C of the lower die 22. The workpiece W may also be sucked into the suction passage 23G of the upper die 23. In that case, the plate-shaped member H may be placed within the cavity of the lower die 22.

When the predetermined position where the pick and place 200 places the plate-shaped member H is within the second loader 70, the plate-shaped member H carried into the mold 21 by the second loader 70 may be configured to be adsorbed to the suction path 23G of the upper mold 23. In this case, a through hole T is formed in the film F at a position corresponding to the suction path 23G. Alternatively, the plate-shaped member H carried into the mold 21 by the second loader 70 may be configured to be placed on the workpiece W. Alternatively, the plate-shaped member H may be placed in the second loader 70, and then the resin R may be sprayed on the plate-shaped member H, and the plate-shaped member H and the resin R may be placed in the cavity of the lower mold 22.

Figure 3 is a plan view that shows the schematic movement of the first loader and the second loader shown in Figure 1. The first loader 60 includes, for example, a first loader hand 61, a first base 62, a first guide rod 63, etc. The second loader 70 includes, for example, a second loader hand 71, a second base 72, a second guide rod 73, etc.

As shown in FIG. 3, the first loader 60 is configured to be movable along the first guide portion 60R and transports the workpiece W or the molded product M. The first loader hand 61 is equipped with a holding mechanism for the workpiece W or the molded product M. The first loader hand 61 is also configured to be capable of moving forward and backward relative to the molds 21, 31. The first base 62 is connected to the first guide portion 60R so as to be movable in the left-right direction, and movement in the front-back direction is restricted.

The first base 62 supports the first loader hand 61 via the first guide rod 63. When viewed in a plan view, the first guide rod 63 extends and retracts from the point where it is connected to the first base 62. As a result, the first guide rod 63 moves the first loader hand 61 in the forward and backward directions.

After the first loader hand 61 receives the workpiece W at the workpiece transfer section 13, for example, it is transported to the right by the first base 62 and moves to a position facing the die 21 in the front-to-rear direction. Next, the first loader hand 61 enters the die 21 from the rear by the extension and contraction of the first guide rod 63, and carries the workpiece W into the die 21.

After delivering the workpiece W to the die 21, the first loader hand 61 retracts to the rear of the die 21 due to the extension and contraction of the first guide rod 63. After removing the molded product M from the die 21 by the same operation as when the workpiece W was delivered, the first loader hand 61 is transported to the right by the first base 62 and moves to the molded product receiving section 91, where it delivers the molded product M.

The second loader 70 transports the resin R and/or the plate-shaped member H. In the illustrated example, the second loader 70 transports the resin R and the plate-shaped member H simultaneously, but this is not limited to this. One of the resin R and the plate-shaped member H may be transported first, and then the other.

The second loader hand 71 is equipped with a holding mechanism for the resin R and the plate-shaped member H. Specifically, the second loader hand 71 is equipped with a resin guard 77 as a frame that surrounds the resin R. The second loader hand 71 may also be equipped with side rails, a chuck, a suction mechanism, etc. that hold the plate-shaped member H.

In the resin supply section 41, the resin R is sent from a hopper to the second loader hand 71. The resin R is leveled in an area surrounded by the resin guard 77 by a vibration section or the like. When the predetermined position where the pick and place 200 places the plate-shaped member H is within the second loader 70, the plate-shaped member H brought into the second loader 70 by the pick and place 200 is placed in the predetermined position of the leveled resin R.

The second loader hand 71 is configured to be able to move forward and backward relative to the molds 21, 31. The second base 72 is connected to the second guide part 70R so that it can move forward and backward, and movement in the left and right direction is restricted. If there is a low risk of the resin R falling out of the second loader hand 71, the resin guard 77 of the second loader hand 71 may be omitted.

The second base 72 supports the second loader hand 71 via the second guide rod 73. When viewed in a plan view, the second guide rod 73 extends and retracts and rotates from the point where it is connected to the second base 72. As a result, the second guide rod 73 moves the second loader hand 71 in the front-back or left-right directions, and also rotates the second loader hand 71 around the second base 72.

After the second loader hand 71 receives the resin R at the resin supply unit 41, for example, it is transported forward by the second base 72 and moves to position P1 opposite the resin supply unit 41 in the front-rear direction. Next, the second loader hand 71 moves to position P2 opposite the plate-shaped member delivery unit 53 in the front-rear direction by the rotation of the second guide rod 73. Next, the second loader hand 71 moves to the plate-shaped member delivery unit 53 by the extension and contraction of the second guide rod 73 to receive the plate-shaped member H, and then returns to position P2.

Next, the second loader hand 71 moves to position P3 facing the mold 21 in the left-right direction by pivoting the second guide rod 73. Next, the second loader hand 71 enters the mold 21 from the right by extending and contracting the second guide rod 73, and carries the resin R and the plate-shaped member H into the mold 21. After delivering the resin R and the plate-shaped member H to the mold 21, the second loader hand 71 retreats to the right of the mold 21 by extending and contracting the second guide rod 73.

Note that the second loader hand 71, for example, receives the resin R and then the plate-shaped member H, and carries both into the mold 21 at the same time, but this is not limited to the above. The second loader hand 71 may receive the plate-shaped member H and then the resin R. The second loader hand 71 may also carry one of the resin R and the plate-shaped member H into the mold 21 and then the other into the mold 21.

In this way, if the second loader hand 71 moves to the plate-like material delivery section 53 by the extension and contraction of the second guide rod 73, the plate-like material supply unit 50 can be inserted and removed without extending the second guide section 70R to the plate-like material supply unit 50. The mechanism for rotating the second guide rod 73 may be omitted in the second loader 70. In that case, the second guide section 70R may be extended to the plate-like material supply unit 50.

Figure 4 is a perspective view of the index 100 constituting the plate-shaped member delivery section 53. Figure 5 is a perspective view of the pick-and-place 200 constituting the plate-shaped member delivery section 53. As described above, the plate-shaped member delivery section 53 includes the index 100 that receives and aligns the plate-shaped members H sent out by the plate-shaped member storage section 51, and the pick-and-place 200 that delivers the plate-shaped members H aligned by the index 100 to the second loader 70 or the molds 21, 31.

The index 100 includes, for example, a pair of rails 110L, 110R, a chuck for moving the plate-shaped member H, and the like. As shown in FIG. 4, the pair of rails 110L, 110R extend along the second direction, and a notch (recess) 120 is formed at a position corresponding to the claws provided at the tip of each of the holding members 230L, 230R of the pick and place 200.

The plate-shaped members H sequentially supplied by the plate-shaped member storage unit 51 are pushed out by a pusher (not shown) and wait in a state where they partially protrude from the housing of the plate-shaped member storage unit 51. A chuck (not shown) of the index 100 pulls out the plate-shaped member H along the rails 110L, 110R. The position of the plate-shaped member H in the second direction is determined by the amount of movement of the chuck. As shown in FIG. 4, the distance between the pair of rails 110L, 110R is approximately the same as the width of the plate-shaped member H in the first direction, so that the horizontal movement of the plate-shaped member H in the first direction is restricted.

As shown in FIG. 5, the pick and place 200 includes a base 210 and at least one hand 220 attached so as to be suspended from the base 210. The pick and place 200 lifts the plate-shaped member H from the index 100 and places the plate-shaped member H at either a predetermined position in the second loader 70 or a predetermined position in the molds 21 and 31.

The base 210 is configured to be able to move back and forth between the index 100 and the second loader 70 or the molds 21, 31. The base 210 may be equipped with a rotation mechanism for changing the orientation of each hand 220. In the example shown in FIG. 2, when the second guide rod 73 is rotated to bring the second loader 70 close to the plate-like member delivery section 53, the second loader 70 is positioned in an orientation rotated 90 degrees with respect to the molds 21, 31. By rotating the orientation of each hand 220 by 90 degrees, the plate-like member H can be placed at a predetermined position on the second loader 70 in an orientation rotated 90 degrees.

When three plate-shaped members H are to be loaded into the mold 21, 31, three hands 220 may be attached to the base 210. In this case, the base 210 may be moved to align the positions of the hands 220 with respect to the index 100, and all the hands 220 may be configured to receive the plate-shaped members H from the index 100.

Each hand 220 includes holding members 230L, 230R, first and second guide pins 241, 242, and driving sources 253, 254. The holding members 230L, 230R lift the bottom surface of the plate-shaped member H, whose horizontal movement in the first direction is restricted by the index 100, and lower the plate-shaped member into a predetermined position in the second loader 70 or the molds 21, 31.

The holding members 230L, 230R are hooks that face the plate-shaped member H from the first direction, and the hook-shaped claws at the tips of the hooks abut the bottom surface of the plate-shaped member H. The pair of holding members 230L, 230R are arranged to sandwich the plate-shaped member H in the first direction. A driving source 253 such as an air cylinder or a servo motor changes the distance between the holding members 230L, 230R. In the illustrated example, each hand 220 has four pairs of holding members 230L, 230R.

The first and second guide pins 241, 242 are arranged to sandwich the plate-shaped member H from the second direction, and regulate the horizontal movement of the plate-shaped member H in the second direction. A driving source 254 such as an air cylinder or a servo motor changes the distance between the first and second guide pins 241, 242. Each of the first and second guide pins 241, 242 has a straight shape without a taper, and has a constant cross-sectional area in the vertical direction. In addition, each of the first and second guide pins 241, 242 extends in the vertical direction below the bottom surface of the plate-shaped member H raised by the holding members 230L, 230R.

Figure 6 is a cross-sectional view of the index shown in Figure 4. Figure 7 is a cross-sectional view showing the movement of the pick and place 200 lifting the plate-shaped member H from the index 100. As shown in Figures 6 and 7, each notch 120 forms a gap larger than the tip of the holding members 230L, 230R of the pick and place 200 outside the outer edge of the plate-shaped member H placed on the pair of rails 110L, 110R, and forms a gap larger than the tip of the holding members 230L, 230R below the bottom surface of the plate-shaped member H.

Figure 8 is an enlarged cross-sectional view of the tip of the holding members 230L, 230R shown in Figure 7. As shown in Figure 8, the distance between the rails 110L, 110R is slightly larger than the width of the plate-shaped member H. The holding members 230L, 230R lift up the bottom surface of the plate-shaped member H with a small gap between them and the outer edge of the plate-shaped member H. In other words, the holding members 230L, 230R do not press and clamp the plate-shaped member H from the first direction, but support the plate-shaped member H from below in the vertical direction.

According to the resin sealing device 1 of this embodiment configured as described above, the plate-shaped member positioned in the first direction by the index is positioned in the second direction by pick-and-place and placed in the mold or loader. Since the positional accuracy is improved when the plate-shaped member is directly or indirectly brought into the mold, the plate-shaped member can be positioned with high accuracy in the resin-sealed product.

Since each of the first and second guide pins 241, 242 extends below the plate-like member H lifted by the holding members 230L, 230R, the plate-like member H that has left the holding members 230L, 230R falls along the first and second guide pins 241, 242. The horizontal movement of the plate-like member H during the fall can be restricted so that it does not shift position in the first direction. Since the first and second guide pins 241, 242 have a straight shape without a taper, the gap between the plate-like member H and each guide pin 241, 242 does not widen throughout the fall from the holding members 230L, 230R.

Since it is equipped with a drive source 254, by narrowing the gap between the first guide pin 241 and the second guide pin 242, the plate-shaped member H can be loaded into the second loader 70 or the molds 21, 31 while being positioned with high precision in the second direction. Since the horizontal movement of the plate-shaped member H can be restricted without using pilot holes, it is suitable for resin sealing of heat spreaders and shield plates, in which pilot holes are difficult to form.

The above-described embodiments are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangements, materials, conditions, shapes, sizes, etc., are not limited to those exemplified, and may be modified as appropriate. Furthermore, configurations shown in different embodiments may be partially substituted or combined.

For example, the hand 220 of the pick and place 200 may further include third and fourth guide pins arranged to sandwich the plate-shaped member H from the first direction and restrict the horizontal movement of the plate-shaped member H in the first direction. According to this aspect, the plate-shaped member H separated from the holding members 230L, 230R falls along the first to fourth guide pins. The horizontal movement of the plate-shaped member H during the fall can be restricted so that it does not shift in position in both the first and second directions. Alternatively, in addition to the holding members 230L, 230R facing in the first direction, a holding member facing in the second direction may be further provided. Also, for example, the holding member is not limited to a hook shape that lifts the bottom surface of the plate-shaped member. It may be an adsorption holding member equipped with an adsorption pad or the like that can adsorb and hold the top surface of the plate-shaped member.

Reference Signs List 1: resin sealing apparatus, 10: work supply unit, 11: work storage section, 13: work transfer section, 15: work preheating section, 20, 30: press unit, 21, 31: mold, 25, 35: cavity, 27, 37: film handler, 40: resin supply unit, 41: resin supply section, 50: plate-shaped member supply unit, 51: plate-shaped member storage section, 53: plate-shaped member transfer section,
60...first loader, 60R...first guide portion, 61...first loader hand, 62...first base, 63...first guide rod, 70...second loader, 70R...second guide portion, 71...second loader hand, 72...second base, 73...second guide rod, 77...resin guard, 90...molded product recovery unit, 91...molded product receiving portion, 93...molded product delivery portion, 95...molded product storage portion, 100...index, 110L, 110R...rail, 120...notch, 200...pick and place, 210...base, 220...hand, 230L, 230R...holding member, 241, 242...first and second guide pins, 253, 254...driving source, F...film, H...plate-shaped member, M...molded product, P...electronic component, R...resin, S...substrate, W...work.

Claims (7)

an index that aligns a plate-like member to be resin-sealed together with the electronic component in the mold and restricts horizontal movement in a first direction;
a pick-and-place step of lifting the plate-like member from the index and placing the plate-like member at a predetermined position in the mold or at a predetermined position in a loader that carries the plate-like member into the mold;
The pick and place method includes:
a holding member that lifts up the plate-like member in a state in which the horizontal movement in the first direction is restricted by the index, and lowers the plate-like member to the predetermined position in the mold or the loader;
and first and second guide pins arranged to sandwich the plate-like member from at least a second direction intersecting the first direction and restrict horizontal movement of the plate-like member in the second direction.
Resin sealing equipment. Each of the first and second guide pins extends in the vertical direction below a bottom surface of the plate-like member lifted by the holding member.
The resin sealing apparatus according to claim 1 . Each of the first and second guide pins has a constant cross-sectional area in the vertical direction.
The resin sealing apparatus according to claim 1 or 2. A drive source is provided for changing the distance between the first and second guide pins.
The resin sealing apparatus according to claim 1 . The holding member is a hook facing the plate-like member from the first direction, and a hook-shaped claw provided at a tip of the hook abuts against a bottom surface of the plate-like member to lift it up.
The resin sealing device according to claim 1 . The resin sealing device according to any one of claims 1 to 4, characterized in that the holding member is an adsorption holding member that adsorbs and lifts the plate-like member. The plate-shaped member is a heat spreader, a shield plate, or a plate-shaped resin.
The resin sealing device according to claim 1 .

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