JP7799145B2 - Resin sealing device and resin sealing method - Google Patents

Description

The present invention relates to a resin sealing device and a resin sealing method.

One example of a resin sealing device that melts resin onto a workpiece including a substrate and electronic components to seal the electronic components is a resin sealing device that molds resin onto a functional component along with the workpiece.

Patent Document 1 discloses a method and apparatus for manufacturing resin-sealed electronic components in which a plate-shaped member is placed on a release film, resin is then placed on the plate-shaped member, a release film is attached to the cavity surface of the lower mold, and an electronic component fixed to the upper mold is immersed in the resin.

Patent No. 6039198

However, with a configuration like that of Patent Document 1, the plate-shaped member is not fixed to the attached release film, which can lead to a decrease in reliability due to factors such as misalignment of the plate-shaped member or resin seeping into the gap between the release film and the plate-shaped member during molding. If the plate-shaped member is a heat sink, molding resin on the top surface of the plate-shaped member can affect heat dissipation, making it necessary to remove the resin. Furthermore, molded products that do not reach the specified thickness due to the removal of the resin formed on the top surface of the plate-shaped member are discarded as defective products.

The present invention was made in light of these circumstances, and its object is to provide a highly reliable resin sealing device and resin sealing method.

One aspect of the present invention relates to a resin sealing apparatus that melts resin onto workpieces including a substrate and electronic components to seal the electronic components. The resin sealing apparatus includes a work supply unit that supplies the workpieces, a resin supply unit that supplies resin, a functional component supply unit that supplies functional components, and a resin molding unit that seals the workpieces and functional components with resin. The resin molding unit has a resin sealing mold. The resin sealing mold has a lower mold with an upper surface on which the workpiece is placed and an upper mold with a molding surface that forms a cavity with a bottom surface facing the upper surface of the lower mold and is provided with suction holes that open to the molding surface. The resin sealing apparatus further includes a first loader hand that enters the resin sealing mold while holding the workpiece and transfers the workpiece to the lower mold, a film supply unit that supplies film to the molding surface of the upper mold, and a hole opening mechanism that forms a through hole in the portion of the film that is adsorbed to the molding surface by suction through the suction holes and that is adsorbed to the bottom surface of the cavity. The hole opening mechanism is provided in the first loader hand.

According to this aspect, in the upper mold cavity structure, through holes can be formed in the film while the film is being adsorbed onto the molding surface of the upper mold. This prevents misalignment between the suction holes in the upper mold and the through holes in the film, allowing the functional component to be adsorbed in the correct position.

In the above aspect, the hole opening mechanism may include a protrusion that protrudes toward the suction hole in the upper mold that opens into the bottom surface of the cavity.

In the above embodiment, the suction holes opening to the bottom surface of the cavity may have a tapered shape with a diameter that increases toward the bottom surface.

In the above aspect, a second loader hand may be further provided to load the resin and functional components into the resin sealing mold.

In the above aspect, the resin molding unit may mold the resin so that at least a portion of the functional component is exposed.

In the above aspect, the functional component may be a heat dissipation component or a shielding component.

A resin encapsulation method according to another aspect of the present invention is a resin encapsulation method using a resin encapsulation apparatus that melts resin onto workpieces including a substrate and electronic components to encapsulate the electronic components. The resin encapsulation apparatus includes a work supply unit that supplies the workpieces, a resin supply unit that supplies resin, a functional component supply unit that supplies functional components, and a resin molding unit that encapsulates the workpieces and functional components. The resin molding unit has a resin encapsulation mold. The resin encapsulation mold includes a lower mold having an upper surface on which the workpiece is placed, and an upper mold having a molding surface that forms a cavity with a bottom surface facing the upper surface of the lower mold and is provided with suction holes that open onto the molding surface. The resin encapsulation method further includes supplying a film to the molding surface of the upper mold, adsorbing the film onto the molding surface by suction through the suction holes in the upper mold, entering a first loader hand holding the workpiece into the resin encapsulation mold and transferring the workpiece to the lower mold, and forming a through hole in the portion of the film adsorbed onto the molding surface that is adsorbed onto the bottom surface of the cavity using a hole-opening mechanism provided in the first loader hand.

This configuration prevents misalignment between the suction holes in the upper mold and the through holes in the film, allowing the functional component to be adsorbed in the correct position.

In the above aspect, forming a through hole in the film may include protruding a protrusion of the hole-opening mechanism toward one of the suction holes in the upper mold that opens into the bottom surface of the cavity.

In the above aspect, the method may further include inserting the second loader hand holding the resin and functional component into the resin sealing mold and transferring the resin and functional component to the upper mold, and adsorbing the functional component to the film by suction through the suction hole via the through hole.

The present invention provides a highly reliable resin sealing device and resin sealing method.

FIG. 1 is a plan view schematically illustrating a configuration of a resin sealing apparatus according to an embodiment. FIG. 2 is a plan view schematically showing a more detailed configuration of a first loader and a second loader. 1 is a cross-sectional view schematically showing the configuration of a resin-sealing mold and a molded product. FIG. 2 is a cross-sectional view schematically showing the configuration of a first loader hand. FIG. 4 is a cross-sectional view schematically showing the configuration of a second loader hand. 1 is a flowchart showing an example of a resin sealing method using the resin sealing apparatus according to the present embodiment. 10A and 10B are diagrams showing a process of adsorbing a film onto a molding surface. 10A and 10B are diagrams showing a process of transferring a workpiece to a lower die and a process of forming a through hole in a film. 10A and 10B are diagrams illustrating a process of supplying resin to a second loader hand. 10A and 10B are diagrams showing a process of supplying a functional member to a second loader hand; 10A and 10B are diagrams showing a process of transferring the resin and the functional member to the upper mold; FIG. 10 is a diagram showing a mold clamping process.

Embodiments of the present invention will be described below with reference to the drawings. The drawings of each embodiment are illustrative, and the dimensions and shapes of each part are schematic. The technical scope of the present invention should not be interpreted as being limited to these embodiments.

<Resin sealing equipment>
The configuration of a resin sealing apparatus 1 according to an embodiment of the present invention will be described with reference to Figures 1 to 5. Figure 1 is a plan view that schematically shows the configuration of a resin sealing apparatus according to one embodiment. Figure 2 is a plan view that schematically shows the configuration of a first loader and a second loader in more detail. Figure 3 is a cross-sectional view that schematically shows the configuration of a resin sealing mold and a molded product. Figure 4 is a cross-sectional view that schematically shows the configuration of a first loader hand. Figure 5 is a cross-sectional view that schematically shows the configuration of a second loader hand.

Figures 1 and 2 show the layout when viewed from above. Each drawing is conveniently labeled with directions (front, back, left, right, top, bottom) to clarify the relationship between the drawings and to help understand the relative positions of each component.

The resin sealing apparatus 1 is a manufacturing device that melts resin R onto a workpiece W, which includes a substrate S and electronic components P, to resin-encapsulate the electronic components P and produce a molded product M. The resin sealing apparatus 1 also molds resin R onto a functional component H along with the workpiece W. The functional component H is, for example, a plate-shaped component, and is exposed on the side opposite the exposed substrate S of the molded product M. The substrate S is, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, a semiconductor substrate, etc. The electronic component P is, for example, a semiconductor element such as an IC chip, but is not limited to this, and may also be various active elements, passive elements, MEMS devices, etc. The functional component H is, for example, a heat dissipation component that dissipates heat generated by the electronic component P or a shielding component that blocks electromagnetic waves, but is not limited to the above. The resin R is, for example, a granular thermosetting resin. The shape of the resin R is not limited to the above, and it may also be liquid or tablet-like.

The resin sealing device 1 according to this embodiment is a compression-type resin sealing device. However, the resin sealing device according to one embodiment of the present invention is not limited to the above and may also be a transfer-type resin sealing device.

As shown in FIG. 1, the resin sealing apparatus 1 includes a work supply unit 10, a resin supply unit 40, a functional component supply unit 50, resin molding units 20 and 30, a molded product recovery unit 90, a first loader 60, and a second loader 70. The work supply unit 10, the resin supply unit 40, the resin molding units 20 and 30, and the molded product recovery unit 90 are arranged side by side in the left-right direction. The resin supply unit 40 and the functional component supply unit 50 are arranged side by side in the front-to-rear direction.

The work supply unit 10 supplies workpieces W to the first loader hand 61 of the first loader 60. The work supply unit 10 includes a workpiece storage section 11, a workpiece transfer section 13, a workpiece preheating section 15, and a workpiece supply control panel 19. When viewed from above as shown in Figure 1, the workpiece supply unit 10 is located, for example, at the left end of the resin sealing device 1.

The work storage unit 11 stores multiple workpieces W and delivers the workpieces W sequentially. For example, the work storage unit 11 is equipped with multiple workpiece magazines and a workpiece elevation. The workpiece magazine set in the work storage unit 11 stores multiple workpieces W stacked vertically. The workpiece elevation adjusts the position of the workpiece magazine in order to deliver the workpieces W to the workpiece transfer unit 13.

The workpiece transfer unit 13 transfers the workpiece W received from the workpiece storage unit 11 to the workpiece preheating unit 15. For example, the workpiece transfer unit 13 is equipped with a workpiece index that receives and aligns the workpiece W sent out by the workpiece storage unit 11, and a workpiece pick and place that transfers the workpiece W aligned by the workpiece index to the workpiece preheating unit 15.

The workpiece preheating section 15 preheats the workpiece W received from the workpiece transfer section 13 and transfers it to the first loader hand 61 of the first loader 60. Preheating the workpiece W before it is transported to the resin molding units 20, 30 prevents deformation of the workpiece W due to sudden temperature changes inside the resin sealing molds 21, 31. For example, the workpiece preheating section 15 is equipped with a preheat rail that heats the workpiece W from its edges. The workpiece preheating section 15 may also be equipped with a hot plate that heats the entire surface of the workpiece W.

The work supply control panel 19 is a control panel for controlling the operation of the work supply unit 10. When viewed from above as shown in Figure 1, the work supply control panel 19 is located on the front side of the work supply unit 10. For example, the work supply control panel 19 is equipped with a display unit that displays the control parameters of the work supply unit 10, and an input unit for inputting the control parameters of the work supply unit 10.

The work supply unit 10 may further include a volume measurement unit that measures the volume of the work W, an appearance inspection unit that inspects the appearance of the work W, and the like.

The molded product recovery unit 90 recovers the molded product M from the first loader hand 61 of the first loader 60. The molded product recovery unit 90 includes a molded product receiving section 91, a molded product delivery section 93, and a molded product storage section 95. When viewed from above as shown in FIG. 1, the molded product recovery unit 90 is disposed, for example, at the right end of the resin sealing apparatus 1. The molded product recovery unit 90 is disposed on the opposite side of the resin molding units 20, 30 from the work supply unit 10 in the left-right direction, but this is not limited to this. The molded product recovery unit 90 may also be disposed on the same side of the resin molding units 20, 30 as the work supply unit 10 in the left-right direction.

The molded product receiving section 91 delivers the molded product M received from the first loader hand 61 of the first loader 60 to the molded product delivery section 93. For example, the molded product receiving section 91 is equipped with a cooling pallet for cooling the molded product M.

The molded product delivery section 93 delivers the molded products M received from the molded product receiving section 91 to the molded product storage section 95. For example, the molded product delivery section 93 is equipped with a molded product index that receives and aligns the molded products M sent out by the molded product receiving section 91, and a molded product pick and place that delivers the molded products M aligned by the molded product index to the molded product storage section 95.

The molded product storage section 95 receives and stores the molded products M. For example, the molded product storage section 95 is equipped with multiple molded product magazines and a molded product elevation. The molded product magazine set in the molded product storage section 95 stores multiple molded products M stacked vertically. The molded product elevation adjusts the position of the molded product magazine to receive the molded products M from the molded product delivery section 93.

The molded product recovery unit 90 may further include a volume measurement unit that measures the volume of the molded product M, an appearance inspection unit that inspects the appearance of the molded product M, and the like. If the resin sealing device according to one embodiment of the present invention is a transfer-type resin sealing device, the molded product recovery unit may also include a degating unit that separates unnecessary resin, known as cull or liner, from the molded product M, and a scrap box for collecting the separated unnecessary resin.

The resin molding unit 20 molds the resin R onto the workpiece W and the functional component H. The resin molding unit 20 molds the resin R so that at least a portion of the functional component H is exposed. The resin molding unit 20 includes a resin sealing mold 21, a film handler 27, and a resin molding control panel 29. When viewed from above as shown in Figure 1, the resin molding unit 20 is connected, for example, to the right side of the work supply unit 10.

The resin sealing mold 21 is a pair of openable and closable molds that fill the internal cavity 25 with resin R to form a mold. The resin sealing mold 21 comprises a lower mold 22 and an upper mold 23. The surface of the lower mold 22 facing the upper mold 23 is flat, and the surface of the upper mold 23 facing the lower mold 22 (hereinafter referred to as the "molding surface") has a cavity 25 formed in it. In other words, the resin sealing mold 21 is a compression molding mold with a movable upper cavity structure.

The lower mold 22 comprises a lower plate 22A and a cavity plate 22B. The cavity plate 22B is fixedly assembled to the upper surface of the lower plate 22A (the surface facing the upper mold 23). The lower mold 22 is provided with a suction hole 22C that penetrates the lower plate 22A and the cavity plate 22B. The suction hole 22C opens to the upper surface of the cavity plate 22B. The suction hole 22C is a suction hole for sucking the workpiece W set on the lower mold 22.

The upper mold 23 comprises an upper plate 23A, a cavity piece 23B, a clamper 23C, and a biasing member 23D. The cavity piece 23B is fixedly attached to the underside of the upper plate 23A (the surface facing the lower mold 22). The clamper 23C is configured in a frame shape surrounding the cavity piece 23B. The clamper 23C is attached to the upper plate 23A via the biasing member 23D so that it can move up and down. The cavity piece 23B forms the bottom surface of the cavity 25, and the clamper 23C forms the side surface of the cavity 25. The upper mold 23 is provided with suction holes 23E and 23F that penetrate the clamper 23C, and a suction hole 23G that penetrates the upper plate 23A and cavity piece 23B. The suction hole 23E opens to the underside of the clamper 23C. Suction hole 23F opens on the inner surface of clamper 23C facing cavity piece 23B. Suction hole 23G opens on the underside of cavity piece 23B (the bottom surface of cavity 25). Suction hole 23G has a taper 23T whose diameter increases toward the molding surface. Suction holes 23E, 23F, and 23G are used to suck in film F set on upper mold 23. Suction hole 23G is also used to suck in functional member H set on the underside of film F. Specifically, suction hole 22G sucks in functional member H through a through hole T provided in film F.

The film handler 27 supplies film F to the resin sealing mold 21. Film F is a release film that prevents resin R from penetrating the gaps in the upper mold 23 and facilitates the release of the molded product M from the upper mold 23. The film handler 27 includes an unwinding section that supplies unused film F and a winding section that collects used film F. The film handler 27 corresponds to an example of a "film supply section" according to the present invention. Suitable materials for film F include polymeric materials with excellent heat resistance, ease of release, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene-ethylene copolymer), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), PET (polyethylene terephthalate), PP (polypropylene), and PVDC (polyvinyl chloride). The material for film F is not limited to the above, and may also be, for example, fluorine-impregnated glass cloth. The thickness of film F is selected appropriately depending on the physical properties of the material; for example, it is approximately 50 μm. The shape of the film F is not limited to a roll, but may also be a strip.

The resin molding control panel 29 is a control panel for controlling the operation of the resin molding unit 20. When viewed from above as shown in Figure 1, the resin molding control panel 29 is located on the front side of the resin molding unit 20. For example, the resin molding control panel 29 is equipped with a display unit that displays the control parameters of the resin molding unit 20, and an input unit that inputs the control parameters of the resin molding unit 20.

The resin molding unit 30 includes a resin sealing mold 31, a film handler 37, and a resin molding control panel 39. When viewed from above as shown in Figure 1, the resin molding unit 30 is connected, for example, to the left side of the molded product recovery unit 90. Note that the configuration of the resin molding unit 30 is similar to that of the resin molding unit 20, so a description of the resin sealing mold 31, film handler 37, and resin molding control panel 39 will be omitted.

In addition, at least some of the functions of the resin molding control panels 29, 39 may be consolidated into the work supply control panel 19. For example, the control parameters of the resin molding units 20, 30 may be displayed on the display unit of the work supply control panel 19, and the control parameters of the resin molding units 20, 30 may be input into the input unit of the work supply control panel 19. If all of the functions of the control panels for each unit are consolidated into the work supply control panel 19, the resin molding control panels 29, 39 may be omitted.

The resin supply unit 40 supplies granular resin R to the second loader hand 71 of the second loader 70. When viewed from above as shown in Figure 1, the resin supply unit 40 is connected to the right side of the resin molding unit 20 and to the left side of the resin molding unit 30. The resin supply unit 40 includes a resin supply section 41.

The resin supply unit 41 includes a hopper 42 and a feeder 43, as will be described later with reference to FIG. 9, for example. The hopper 42 is an example of a resin storage unit that stores resin R. The feeder 43 is an example of a resin supply unit that feeds resin R received from the hopper 42. If the resin is liquid, the resin supply unit may include a syringe that stores the resin, a piston that pushes out the resin, and a pinch valve that opens and closes the tip of the syringe. If the resin supply unit supplies liquid resin, the resin supply unit may apply the liquid resin onto the workpiece.

The resin supply unit 40 may further include a weight measuring unit that measures the weight of the resin R, a resin preheating unit that preheats the resin R, a resin guard that serves as a frame that defines the area in which the resin R is dispersed, a vibration unit that disperses the resin R by vibration, an inspection unit that inspects the degree of dispersion of the resin R, etc.

The functional component supply unit 50 supplies functional components H to the second loader hand 71 of the second loader 70. The functional component supply unit 50 includes a functional component storage section 51 and a functional component transfer section 53. When viewed from above as shown in FIG. 1, the functional component supply unit 50 is connected to the front side of the resin supply unit 40. In other words, the functional component supply unit 50 is located on the front side of the resin sealing apparatus 1. Here, the front side of the resin sealing apparatus 1 is the side on which the workpiece supply control panel 19 and the resin molding control panels 29, 39 are located in the front-rear direction. The functional component supply unit 50 is located alongside the workpiece supply control panel 19 and the resin molding control panels 29, 39 in the left-right direction. The functional component supply unit 50 is located on the opposite side of the resin supply section 41 when viewed from the first guide section 60R, which will be described later.

The functional component storage section 51 stores multiple functional components H and delivers them sequentially. For example, the functional component storage section 51 is equipped with multiple functional component magazines and a functional component elevation. The functional component magazine set in the functional component storage section 51 stores multiple functional components H stacked vertically. The functional component elevation adjusts the position of the functional component magazine in order to deliver the functional components H to the functional component delivery section 53.

The functional component delivery unit 53 delivers the functional components H received from the functional component storage unit 51 to the second loader hand 71 of the second loader 70. For example, the functional component delivery unit 53 is equipped with a functional component index that receives and aligns the functional components H sent out by the functional component storage unit 51, and a functional component pick-and-place that delivers the functional components H aligned by the functional component index to the second loader hand 71.

The functional component supply unit 50 may further include a volume measurement unit that measures the volume of the functional component H, an appearance inspection unit that inspects the appearance of the functional component H, a functional component preheating unit that preheats the functional component H, etc.

The first loader 60 transports the workpiece W from the workpiece supply unit 10 to the resin molding units 20 and 30. The first loader 60 is configured to be movable along a first guide portion 60R. The first guide portion 60R extends in the left-right direction across the workpiece supply unit 10, the resin molding units 20 and 30, the resin supply unit 40, and the molded product recovery unit 90. When viewed from above as shown in FIG. 1, the first guide portion 60R is located, for example, behind the resin sealing molds 21 and 31 and in front of the resin supply portion 41. In the configuration example shown in FIG. 1, the first loader 60 transports the molded product M from the resin molding units 20 and 30 to the molded product recovery unit 90. However, a molded product recovery loader separate from the first loader 60 may be provided to transport the molded product M.

As shown in Figure 2, the first loader 60 includes a first loader hand 61, a first base 62, and a first guide rod 63.

The first loader hand 61 is configured to be able to move forward and backward from the rear relative to the resin sealing mold 21. As shown in Figure 4, the first loader hand 61 also includes a holding mechanism 61A and a hole opening mechanism 61B.

The holding mechanism 61A holds the workpiece W or molded product M. The holding mechanism 61A is provided below the first loader hand 61, i.e., on the side facing the lower mold 22 when the first loader hand 61 enters the resin sealing mold 21. The holding mechanism 61A has, for example, an L-shaped opening and closing claw 64 that supports the underside of the workpiece W or molded product M, but is not limited to this. The holding mechanism 61A may adsorb the workpiece W or molded product M using electrostatic force, or may adsorb the workpiece W or molded product M by suction and exhaust.

The hole-opening mechanism 61B forms through-holes T in the film F adsorbed to the molding surface of the upper mold 23. The hole-opening mechanism 61B is located above the first loader hand 61, i.e., on the side facing the upper mold 23 when the first loader hand 61 enters the resin-sealing mold 21. The hole-opening mechanism 61B includes, for example, an expandable member 66, a pressing member 67 connected to the top of the expandable member 66, and a protrusion 68 protruding from the top surface of the pressing member 67. The expandable member 66 is configured to be expandable and contractible in the vertical direction using a cylinder or linear motor, etc., and moves the pressing member 67 in the vertical direction. The protrusion 68 is a needle-shaped member that tapers toward its upper tip.

As shown in Figure 2, the first base 62 is connected to the first guide portion 60R so that it can move left and right, but its movement in the front and rear directions is restricted.

As shown in Figure 2, the first guide rod 63 is connected to the first base 62 and supports the first loader hand 61. The first guide rod 63 is configured to be extendable and retractable in the front-to-rear direction, allowing the first loader hand 61 to move in the front-to-rear direction.

As an example, after receiving the workpiece W at the workpiece transfer section 13, the first loader hand 61 is transported to the right by the first base 62 and moves to the rear of the resin sealing mold 21. Next, while holding the workpiece W, the first loader hand 61 enters the resin sealing mold 21 from the rear by extending the first guide rod 63. That is, the first loader hand 61 loads the workpiece W into the resin sealing mold 21. After delivering the workpiece W to the lower mold 22 of the resin sealing mold 21, the first loader hand 61 retracts the first guide rod 63 and retreats to the rear of the resin sealing mold 21. After the molded product M is molded and the resin sealing mold 21 is opened, the first loader hand 61 unloads the molded product M from the resin sealing mold 21 by performing the same operation as when the workpiece W was loaded. The first loader hand 61 is then transported to the right by the first base 62 and delivers the molded product M at the molded product receiving section 91.

The second loader 70 transports the resin R and the functional component H. The second loader 70 is configured to be movable along the second guide portion 70R. The second guide portion 70R is provided, for example, on the resin supply unit 40 and extends in the front-to-rear direction. When viewed from above as shown in Figure 1, the second guide portion 70R intersects, for example, with the first guide portion 60R.

Note that the second loader 70 may, for example, simultaneously transport both the resin R and the functional component H, but this is not limited to this. One of the resin R and the functional component H may be transported first, followed by the other.

As shown in FIG. 2, the second loader 70 includes a second loader hand 71, a second base 72, and a second guide rod 73. The second loader hand 71 transports the resin R and the functional component H to the resin sealing mold 21.

The second loader hand 71 is configured to be able to move forward and backward from the right side relative to the resin sealing mold 21. As shown in Figure 5, the second loader hand 71 also includes a pressing member 75, an expandable member 76 such as a cylinder or linear motor, and a resin guard 77.

The pressing member 75 functions as the bottom surface of the tray for the resin R. When transferring the resin R and functional component H to the upper mold 23, the pressing member 75 presses the resin R and functional component H against the mold surface of the upper mold 23. The expandable member 76 is configured to be expandable and contractible in the vertical direction, and moves the pressing member 75 in the vertical direction. The resin guard 77 is a frame that surrounds the pressing member 75 and functions as the side surface of the tray for the resin R. The second loader hand 71 may also be equipped with side rails, chuck claws, a suction mechanism, etc. that hold the functional component H. The resin guard 77 may be detachable; for example, it may be attached when the resin R is supplied and removed once the resin R has been fused by preheating.

As shown in Figure 2, the second base 72 is connected to the second guide portion 70R so as to be movable in the front-to-rear direction, but movement in the left-to-right direction is restricted.

As shown in FIG. 2, the second guide rod 73 is connected to the second base 72 and supports the second loader hand 71. The second guide rod 73 is configured to be extendable and rotatable from the point where it is connected to the second base 72. As a result, the second guide rod 73 moves the second loader hand 71 forward/backward or left/right, and also rotates the second loader hand 71 around the second base 72.

As an example, after receiving resin R at the resin supply section 41, the second loader hand 71 is transported forward by the second base 72 and moves to position P1 in front of the resin supply section 41. Next, the second loader hand 71 moves to position P2 behind the functional component delivery section 53 by pivoting the second guide rod 73. Next, the second loader hand 71 moves to the functional component delivery section 53 by extending the second guide rod 73. Then, after receiving the functional component H, the second loader hand 71 returns to position P2 by retracting the second guide rod 73. Next, the second loader hand 71 moves to position P3 to the right of the resin sealing mold 21 by pivoting the second guide rod 73. Next, the second loader hand 71, while holding the resin R and functional component H, enters the resin sealing mold 21 from the right by extending the second guide rod 73. That is, the second loader hand 71 loads the resin R and functional component H into the resin sealing mold 21. After delivering the resin R and functional component H to the resin sealing mold 21, the second loader hand 71 retracts to the right of the resin sealing mold 21 as the second guide rod 73 contracts.

Note that the second loader hand 71 receives, for example, the resin R and then the functional component H, and then simultaneously loads both into the resin sealing mold 21, but this is not limited to this. The second loader hand 71 may receive the functional component H and then the resin R. The second loader hand 71 may also load one of the resin R and the functional component H into the resin sealing mold 21 and then the other into the resin sealing mold 21.

In this way, if the second loader hand 71 can move from the resin supply unit 40 to the functional component delivery section 53 by extending and retracting the second guide rod 73, it is possible to add a functional component supply unit 50 without having to extend the second guide section 70R to the functional component supply unit 50.

In addition, the mechanism for rotating the second guide rod 73 may be omitted from the second loader 70. In this case, for example, the second guide section 70R extends in the front-to-rear direction from the resin supply unit 40 to the functional component supply unit 50, and the second loader hand 71 moves between the resin supply section 41 and the functional component delivery section 53 via the second base 72.

The first loader 60 and second loader 70 operate in the same way with respect to the resin sealing mold 31 of the resin molding unit 30 as they do with respect to the resin sealing mold 21 of the resin molding unit 20. Therefore, a description of the operation of the first loader 60 and second loader 70 with respect to the resin sealing mold 31 will be omitted. However, the operation of the second loader 70 with respect to the resin sealing mold 31 is the left-right reverse of the operation of the second loader 70 with respect to the resin sealing mold 21.

Note that either resin molding unit 20 or resin molding unit 30 may be omitted. That is, only one resin molding unit may be provided, and one resin supply unit may supply resin to one resin molding unit. Three or more resin molding units may also be provided. In this case, two or more resin supply units may be provided. For example, two resin molding units and a resin supply unit provided between the two resin molding units to supply resin to the two resin molding units may be considered as one unit group, and multiple unit groups may be arranged side by side in the left-right direction.

In this embodiment, the first loader 60 functions as a work loader that loads the workpiece W into the resin sealing molds 21, 31, and also functions as a molded product unloader that unloads the molded product M from the resin sealing molds 21, 31. However, the function of the first loader 60 may be limited to that of a work loader. That is, the resin sealing apparatus may further include a third loader as a molded product unloader. Such a third loader may, for example, share a transport path with the first loader and be configured to be movable along the first guide section. The resin sealing apparatus may also further include a third guide section for transporting the third loader.

In this embodiment, the workpiece W and molded product M are transported between units by the first loader 60, but this is not limited to this. For example, the workpiece preheating unit and molded product receiving unit may be configured to be movable left and right along the first guide unit. Specifically, the workpiece preheating unit may transport the workpiece from the workpiece supply unit to the resin molding unit and hand it over to a loader provided in the resin molding unit. Alternatively, the molded product receiving unit may receive the molded product from the loader in the resin supply unit and transport it from the resin molding unit to the molded product recovery unit. If the resin sealing device has multiple resin molding units, such a loader may be provided in each of the multiple resin molding units.

<Resin sealing method>
Next, a resin sealing method using the resin sealing apparatus 1 according to one embodiment will be described with reference to FIGS. 6 to 12. FIG. 6 is a flowchart showing an example of a resin sealing method using the resin sealing apparatus according to this embodiment. FIG. 7 is a diagram showing a process of adsorbing a film onto a molding surface. FIG. 8 is a diagram showing a process of transferring a workpiece to a lower mold and a process of forming a through hole in the film. FIG. 9 is a diagram showing a process of supplying resin to a second loader hand. FIG. 10 is a diagram showing a process of supplying a functional member to the second loader hand. FIG. 11 is a diagram showing a process of transferring resin and a functional member to an upper mold. FIG. 12 is a diagram showing a mold clamping process. Note that the resin sealing mold 21 of the resin molding unit 20 will be described as an example, and a description of the resin sealing mold 31 of the resin molding unit 30, which operates in a similar manner, will be omitted.

First, set film F on the molding surface (S10).

As shown in Figure 7, film F is supplied to the upper mold 23 by the film handler 27. Next, film F is adsorbed onto the molding surface by suction through suction holes 23E, 23F, and 23G of the upper mold 23. Film F continuously covers the cavity piece 23B to the clamper 23C, sealing the gap between cavity piece 23B and clamper 23C.

Next, the workpiece W is set on the lower mold 22 (S20).

As shown in FIG. 8 , first, the first loader hand 61, which holds the workpiece W in the holding mechanism 61A, is inserted into the resin sealing mold 21. Next, the opening and closing claws 64 are opened in the space between the lower mold 22 and the upper mold 23, and the workpiece W is handed over to the lower mold 22. To avoid damaging the workpiece W at this time, the first loader hand 61 may be lowered to the immediate vicinity of the lower mold 22. Next, the workpiece W is sucked onto the surface of the lower mold 22 facing the upper mold 23 by suction through the suction holes 22C of the lower mold 22. At this time, to prevent poor suction due to warping of the workpiece W, the first loader hand 61 may have a function to press the workpiece W from above (not shown).

Next, through holes T are formed in the film F (S30).

As shown in Figure 8, while the first loader hand 61 remains inserted into the resin sealing mold 21, the expandable member 66 of the hole-opening mechanism 61B is extended, and the pressing member 67 is pressed against the cavity piece 23B through the film F. At this time, the protrusion 68 protrudes toward the suction hole 23G of the upper mold 23. The protrusion 68 penetrates the film F to form a through-hole T. Note that because the suction hole 23G tapers toward the molding surface, it can accommodate the protrusion 68 further in than a suction hole without a taper. This allows the diameter of the through-hole T formed in the film F to be larger.

After forming the through-hole T in the film F, the opening mechanism 61B contracts the elastic member 66, separating the pressing member 67 and protrusion 68 from the upper mold 23. When the pressing member 67 and protrusion 68 return to their original positions, the first loader hand 61 is withdrawn from the resin sealing mold 21.

Note that the order in which steps S20 and S30 are performed is not limited to the above. Step S20 may be performed after step S30, or steps S20 and S30 may be performed simultaneously.

Next, the resin R and functional component H are set in the upper mold 23 (S40).

First, as shown in FIG. 9, resin R is supplied to the second loader hand 71. The resin R is leveled to a substantially uniform height in the area surrounded by the resin guard 77 by a vibrator or the like (not shown). The resin R is preheated, causing the granules of resin R to fuse together. Next, as shown in FIG. 10, a functional component H is supplied onto the resin R in the second loader hand 71. The functional component H may be fused to the resin R, or may be detachably placed on top.

Next, as shown in FIG. 11, the second loader hand 71 holding the resin R and functional component H is inserted into the resin sealing mold 21. Next, in the space between the lower mold 22 and the upper mold 23, the expandable member 76 is extended, and the pressing member 75 presses the resin R and functional component H through the film F onto the cavity piece 23B. The functional component H is adsorbed onto the film F by suction through the suction hole 23G of the upper mold 23 via the through-hole T. If the resin R is not fused to the functional component H when pressed by the pressing member 75, the resin R is fused to the functional component H by heating with the upper mold 23 while pressing with the pressing member 75. Note that the upper mold 23 is heated to 100°C to 200°C, depending on the type of resin R, so that the resin R can be easily fused to the functional component H. After the resin R and the functional component H are delivered to the upper mold 23, the expandable member 76 is contracted to separate the pressing member 75 from the upper mold 23. When the pressing member 75 returns to its original position, the second loader hand 71 is withdrawn from the resin sealing mold 21. In this embodiment, both the resin R and the functional component H are held by the second loader hand 71, and the resin R and the functional component H are simultaneously carried into the resin sealing mold 21 and delivered to the upper mold 23. However, this is not limited to this. For example, the resin R and the functional component H may be held separately by the same loader hand and carried into the resin sealing mold 21, and the functional component H may be adsorbed to the upper mold 23, and then the resin R may be fused to the functional component H. In other words, the functional component H and the resin R may be delivered to the resin sealing mold 21 in this order during one advance/retract of one loader hand into/from the resin sealing mold 21. Alternatively, the functional component H may be held by a loader hand and carried into the resin sealing mold 21, and the functional component H may be adsorbed to the upper mold 23. The loader hand may then be withdrawn from the resin sealing mold 21, and the resin R may be held by the loader hand and carried into the resin sealing mold 21, where it may be fused to the functional component H. That is, the functional component H may be delivered to the resin sealing mold 21 when one loader hand moves into or out of the resin sealing mold 21 for the first time, and the resin R may be delivered to the resin sealing mold 21 when it moves into or out of the resin sealing mold 21 for the second time. Alternatively, the functional component H may be held by a first loader hand and carried into the resin sealing mold 21, and the functional component H may be adsorbed to the upper mold 23. Then, the resin R may be held by a second loader hand and carried into the resin sealing mold 21, where it may be fused to the functional component H.

Finally, the resin R is molded (S50).
12, the resin sealing mold 21 is clamped, and the resin R is heated while being pressed by the lower mold 22 and the upper mold 23. Once the resin R has hardened, the mold is opened, and the molded product M is carried out by the first loader hand 61.

As described above, according to one aspect of the resin sealing apparatus 1 of the present invention, the first loader hand 61 that carries in the workpiece W is provided with a hole-opening mechanism 61B that forms a through-hole T in the portion of the film F that has been adsorbed onto the bottom surface of the cavity and that has been adsorbed onto the upper mold 23. Furthermore, in a resin sealing method using the resin sealing apparatus 1, the first loader hand 61 that has entered the resin sealing mold 21 delivers the workpiece W from the holding mechanism 61A and uses the hole-opening mechanism 61B to form a through-hole T in the portion of the film F that has been adsorbed onto the bottom surface of the cavity.

This allows the upper mold cavity structure to form through holes in the film while the film is being sucked onto the molding surface of the upper mold. This prevents misalignment between the suction holes in the upper mold and the through holes in the film, allowing the functional component to be sucked in the correct position.

In the above aspect, the hole opening mechanism may include a protrusion that protrudes toward the suction hole in the upper mold that opens into the bottom surface of the cavity.

According to this aspect, by aligning the suction holes and protrusions in advance, through holes can be formed in the film simply by raising and lowering the protrusions of the hole-opening mechanism, providing a simple device configuration.

In the above embodiment, the suction holes opening to the bottom surface of the cavity may have a tapered shape with a diameter that increases toward the bottom surface.

In the above aspect, a second loader hand may be further provided to load the resin and functional components into the resin sealing mold.

In the above aspect, the resin molding unit may mold the resin so that at least a portion of the functional component is exposed.

In this embodiment, the functional components are exposed, allowing heat generated by the electronic components to be dissipated to the outside through the functional components.

In the above aspect, the functional component may be a heat dissipation component or a shielding component.

A resin encapsulation method according to another aspect of the present invention is a resin encapsulation method using a resin encapsulation apparatus that melts resin onto workpieces including a substrate and electronic components to encapsulate the electronic components. The resin encapsulation apparatus includes a work supply unit that supplies the workpieces, a resin supply unit that supplies resin, a functional component supply unit that supplies functional components, and a resin molding unit that encapsulates the workpieces and functional components. The resin molding unit has a resin encapsulation mold. The resin encapsulation mold includes a lower mold having an upper surface on which the workpiece is placed, and an upper mold having a molding surface that forms a cavity with a bottom surface facing the upper surface of the lower mold and is provided with suction holes that open onto the molding surface. The resin encapsulation method further includes supplying a film to the molding surface of the upper mold, adsorbing the film onto the molding surface by suction through the suction holes in the upper mold, entering a first loader hand holding the workpiece into the resin encapsulation mold and transferring the workpiece to the lower mold, and forming a through hole in the portion of the film adsorbed onto the molding surface that is adsorbed onto the bottom surface of the cavity using a hole-opening mechanism provided in the first loader hand.

This configuration prevents misalignment between the suction holes in the upper mold and the through holes in the film, allowing the functional component to be adsorbed in the correct position.

In the above aspect, forming a through hole in the film may include protruding a protrusion of the hole-opening mechanism toward one of the suction holes in the upper mold that opens into the bottom surface of the cavity.

According to this aspect, the first loader hand can simultaneously transport the workpiece and the hole-drilling mechanism, simplifying the process.

In the above aspect, the method may further include inserting the second loader hand holding the resin and functional component into the resin sealing mold and transferring the resin and functional component to the upper mold, and adsorbing the functional component to the film by suction from the suction hole through the through hole.

In this embodiment, the functional component and resin can be simultaneously loaded using the second loader hand and held by suction on the upper mold using the through-holes and suction holes, simplifying the loading and suction processes.

The embodiments described above are intended to facilitate understanding of the present invention and are not intended to limit the scope of the present invention. The elements included in the embodiments, as well as their arrangement, materials, conditions, shape, size, etc., are not limited to those illustrated and can be modified as appropriate. Furthermore, configurations shown in different embodiments can be partially substituted or combined.

REFERENCE SIGNS LIST 1...Resin sealing apparatus 10...Work supply unit 20, 30...Resin molding unit 21, 31...Resin sealing mold 25, 35...Cavity 27, 37...Film handler 40...Resin supply unit 50...Functional member supply unit 60...First loader 61...First loader hand 61A...Holding mechanism 64...Opening/closing claw 61B...Opening mechanism 66...Expandable member 67...Pressing member 68...Protrusion 70...Second loader 71...Second loader hand 75...Pressing member 76...Expandable member 77...Resin guard 90...Molded product recovery unit W...Work P...Electronic component S...Substrate R...Resin H...Functional member F...Film

Claims (9)

A resin sealing apparatus that melts resin onto a workpiece including a substrate and electronic components to resin-seal the electronic components,
a work supply unit that supplies the work;
a resin supply unit that supplies the resin;
a functional member supply unit that supplies a functional member;
a resin molding unit that performs resin sealing on the workpiece and the functional component,
the resin molding unit has a resin sealing mold,
The resin-sealed mold is
a lower mold having an upper surface on which the workpiece is placed;
an upper mold having a molding surface that forms a cavity having a bottom surface facing the top surface of the lower mold, and having a suction hole that opens onto the molding surface;
The resin sealing device includes:
a first loader hand that enters the resin sealing mold while holding the workpiece and transfers the workpiece to the lower mold;
a film supply unit that supplies a film to the molding surface of the upper mold;
an opening mechanism for forming a through-hole in a portion of the film that is sucked onto the molding surface and that is sucked onto the bottom surface of the cavity by sucking through the suction hole;
a workpiece holder that holds the workpiece;
Furthermore,
the hole opening mechanism is provided on a side of the first loader hand facing the upper mold ,
The workpiece holding portion is provided on a side of the first loader hand facing the lower mold.
Resin sealing equipment. the hole opening mechanism includes a protrusion protruding toward one of the suction holes of the upper mold that opens into the bottom surface of the cavity.
The resin sealing device according to claim 1 . The suction hole opening at the bottom surface of the cavity has a taper whose diameter increases toward the bottom surface.
The resin sealing device according to claim 2 . a second loader hand that carries the resin and the functional component into the resin sealing mold;
The resin sealing device according to claim 1 . the resin molding unit molds the resin so that at least a portion of the functional component is exposed.
The resin sealing device according to claim 1 . The functional member is a heat dissipation member or a shielding member.
The resin sealing device according to claim 1 . A resin sealing method using a resin sealing device that melts resin on a workpiece including a substrate and electronic components to resin-seal the electronic components,
The resin sealing device includes:
a work supply unit that supplies the work;
a resin supply unit that supplies the resin;
a functional member supply unit that supplies a functional member;
a resin molding unit that performs the resin sealing on the workpiece and the functional component,
the resin molding unit has a resin sealing mold,
The resin-sealed mold is
a lower mold having an upper surface on which the workpiece is placed;
an upper mold having a molding surface that forms a cavity having a bottom surface facing the top surface of the lower mold, and having a suction hole that opens onto the molding surface;
The resin sealing method includes:
supplying a film to the molding surface of the upper mold;
adsorbing the film onto the molding surface by suction through the suction holes of the upper mold;
a first loader hand holding the workpiece by a workpiece holding portion is inserted into the resin sealing mold, and the workpiece is transferred to the lower mold;
forming a through hole in a portion of the film sucked onto the molding surface, the portion being sucked onto the bottom surface of the cavity, by a hole-opening mechanism provided on a side of the first loader hand facing the upper mold ,
The workpiece holding portion is provided on a side of the first loader hand facing the lower mold.
Resin sealing method. forming the through holes in the film includes projecting a protrusion of the hole-opening mechanism toward one of the suction holes in the upper mold that opens in the bottom surface of the cavity;
The resin sealing method according to claim 7. a second loader hand holding the resin and the functional component is inserted into the resin sealing mold, and the resin and the functional component are transferred to the upper mold;
The functional component is adsorbed onto the film by suction through the suction hole through the through hole.
The resin sealing method according to claim 7 or 8.