JP7603853B2 - Circuit board dividing jig - Google Patents

Description

This disclosure relates to a substrate dividing jig.

JP 63-191599 A (Patent Document 1) describes a substrate dividing device. The substrate dividing device described in Patent Document 1 has a base and a slide plate. The base has a vertical wall. The slide plate is arranged on the base so as to face the vertical wall. A printed circuit board is sandwiched between the vertical wall and the slide plate.

The printed circuit board includes multiple circuit boards. A V-groove is formed between adjacent circuit boards. The V-groove extends along the upper end of the vertical wall portion and the upper end of the sliding plate. By tilting the portion of the printed circuit board that is not clamped between the vertical wall portion and the sliding plate, the printed circuit board is divided along the V-groove.

Japanese Unexamined Patent Publication No. 191599/1983

However, when dividing a printed circuit board using the board dividing device described in Patent Document 1, the printed circuit board is not supported sufficiently, so a large strain is applied to the printed circuit board, which may result in damage to the printed circuit board or the components mounted on the printed circuit board.

This disclosure has been made in consideration of the problems of the conventional technology as described above. More specifically, this disclosure provides a substrate dividing tool that can suppress damage to the substrate or components mounted on the substrate during division.

The substrate dividing jig of the present disclosure is a jig for dividing a substrate having a first dividing line. The substrate dividing jig includes a base plate unit having a first base plate and a second base plate arranged adjacent to each other in a first direction, and a first substrate holding unit and a second substrate holding unit. A first boundary between the first base plate and the second base plate is along a second direction perpendicular to the first direction. The first base plate includes a first surface and a second surface that is the opposite surface to the first surface. The second base plate includes a third surface and a fourth surface that is the opposite surface to the third surface. Substrates are arranged on the first surface and the third surface such that the first dividing line faces the first boundary. The first base plate is connected to the second base plate so as to be rotatable around a first rotation axis along the second direction. The first substrate holding unit and the second substrate holding unit respectively clamp the substrate between the first surface and the third surface.

The substrate dividing tool disclosed herein makes it possible to prevent damage to the substrate or components mounted on the substrate during division.

FIG. 2 is an exploded perspective view of the substrate dividing jig 100. FIG. 2 is a perspective view of the base plate unit 10. 1 is a perspective view of the base plate unit 10 when the first base plate 11 is rotated relative to the second base plate 12. FIG. FIG. 5 is a cross-sectional view taken along line VV in FIG. 4. 2 is a perspective view of the base plate unit 10 with a substrate 40 disposed thereon. FIG. 1 is a perspective view of the substrate dividing jig 100 with a substrate 40 placed thereon. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7. 1 is a perspective view of the substrate dividing jig 100 when the first base plate 11 is rotated relative to the second base plate 12 with the substrate 40 placed thereon. FIG. 13 is a perspective view of the substrate dividing jig 200 when the first base plate 11 is rotated relative to the second base plate 12 with the substrate 40 placed thereon. FIG. 13 is a perspective view of the substrate dividing jig 200 when the first portion 11e and the third portion 12e are rotated relative to the second portion 11f and the fourth portion 12f, respectively. FIG.

The details of the embodiments of the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are given the same reference symbols, and redundant explanations will not be repeated.

Embodiment 1.
A description will now be given of a substrate dividing jig according to the embodiment 1. The substrate dividing jig according to the embodiment 1 is designated as a substrate dividing jig 100.

(Configuration of substrate dividing jig 100)
The configuration of the substrate dividing jig will be described below.

Figure 1 is an exploded perspective view of a substrate dividing jig 100. As shown in Figure 1, the substrate dividing jig 100 has a base plate unit 10, a first substrate holding unit 20, and a second substrate holding unit 30.

Figure 2 is an oblique view of the base plate unit 10. As shown in Figure 2, the base plate unit 10 has a first base plate 11 and a second base plate 12. The first base plate 11 and the second base plate 12 are flat plate-shaped members. The first base plate 11 and the second base plate 12 are formed from a heat-resistant material. The first base plate 11 and the second base plate 12 are formed, for example, from a resin material impregnated with a glass cloth woven with a filler and glass fibers.

The first base plate 11 and the second base plate 12 are arranged adjacent to each other in the first direction DR1. The first boundary 13, which is the boundary between the first base plate 11 and the second base plate 12, is along the second direction DR2. The second direction DR2 is a direction perpendicular to the first direction DR1. The direction perpendicular to the first direction DR1 and the second direction DR2 is the third direction DR3.

The first base plate 11 has a first surface 11a and a second surface 11b. The first surface 11a and the second surface 11b are end surfaces of the first base plate 11 in the third direction DR3. The second surface 11b is the opposite surface to the first surface 11a. The second base plate 12 has a third surface 12a and a fourth surface 12b. The third surface 12a and the fourth surface 12b are end surfaces of the second base plate 12 in the third direction DR3. The fourth surface 12b is the opposite surface to the third surface 12a.

A first recess 11c is formed in the first surface 11a. The first surface 11a is recessed toward the second surface 11b at the first recess 11c. The first recess 11c is formed, for example, by performing pocket machining on the first surface 11a. A second recess 12c is formed in the third surface 12a. The third surface 12a is recessed toward the fourth surface 12b at the second recess 12c. The second recess 12c is formed, for example, by performing pocket machining on the third surface 12a. In a plan view, the combined shape of the outer shape of the first recess 11c and the outer shape of the second recess 12c is rectangular.

A plurality of third recesses 11d are formed in the bottom surface of the first recess 11c. The bottom surface of the first recess 11c is recessed toward the second surface 11b at the third recess 11d. The third recess 11d is formed, for example, by performing a countersinking process on the bottom surface of the first recess 11c. A plurality of fourth recesses 12d are formed in the bottom surface of the second recess 12c. The bottom surface of the fourth recess 12d is recessed toward the fourth surface 12b at the fourth recess 12d. The fourth recess 12d is formed by performing a countersinking process on the bottom surface of the second recess 12c.

Figure 3 is an oblique view of the base plate unit 10 when the first base plate 11 is rotated relative to the second base plate 12. As shown in Figure 3, the first base plate 11 is connected to the second base plate 12 so as to be rotatable about a first rotation axis along the second direction DR2. The first base plate 11 and the second base plate 12 are connected, for example, by a hinge 14 (see Figure 2).

As shown in FIG. 2, the base plate unit 10 further has a plurality of clamps 15. The clamps 15 are attached to a portion of the first surface 11a around the first recess 11c and to a portion of the third surface 12a around the second recess 12c. The clamps 15 are rotatable about a rotation axis along the third direction DR3. The clamps 15 have a clamp plate 15a. By rotating the clamps 15 about a rotation axis along the third direction DR3, the clamp plate 15a can be positioned above the bottom surface of the first recess 11c or above the bottom surface of the second recess 12c.

1, the first board holding unit 20 has a first top plate 21 and a plurality of first pins 22. The first top plate 21 is a flat member. The first top plate 21 has a main surface 21a and a main surface 21b. The main surface 21a and the main surface 21b are end surfaces in the thickness direction of the first top plate 21. The main surface 21b is the opposite surface to the main surface 21a. A plurality of through holes 21c are formed in the first top plate 21. The through holes 21c penetrate the first top plate 21 along the thickness direction. The number of the plurality of through holes 21c is equal to the number of the plurality of first pins 22. The shape of the through holes 21c in a plan view is, for example, circular.

One end of the first pin 22 is inserted into the through hole 21c. This allows the first pin 22 to be attached to the first top plate 21. The first pin 22 is, for example, cylindrical. The first pin 22 protrudes from the main surface 21b. The distance between the other end of the first pin 22 and the main surface 21b is constant for each of the multiple first pins 22. It is preferable that the distance between two adjacent first pins 22 is 30 mm or less.

The second board holding unit 30 has a second top plate 31 and a plurality of second pins 32. The second top plate 31 is a flat member. The second top plate 31 has a main surface 31a and a main surface 31b. The main surface 31a and the main surface 31b are end surfaces in the thickness direction of the second top plate 31. The main surface 31b is the opposite surface to the main surface 31a. A plurality of through holes 31c are formed in the second top plate 31. The through holes 31c penetrate the second top plate 31 along the thickness direction. The number of the plurality of through holes 31c is equal to the number of the plurality of second pins 32. The shape of the through holes 31c in a plan view is, for example, circular.

One end of the second pin 32 is inserted into the through hole 31c. This allows the second pin 32 to be attached to the second top plate 31. The second pin 32 is, for example, cylindrical. The second pin 32 protrudes from the main surface 31b. The distance between the other end of the second pin 32 and the main surface 31b is constant for each of the multiple second pins 32. It is preferable that the distance between two adjacent second pins 32 is 30 mm or less.

The first top plate 21 and the second top plate 31 are formed, for example, from a metal material. Specific examples of metal materials include iron alloys such as stainless steel, copper alloys, and aluminum alloys. However, the first top plate 21 and the second top plate 31 may be formed from a material other than a metal. The first top plate 21 and the second top plate 31 may be formed, for example, from reinforced glass or a resin material impregnated with a metal filler. In other words, it is sufficient that the first top plate 21 and the second top plate 31 are formed from a rigid material. The first pin 22 and the second pin 32 are formed, for example, from a resin material such as an epoxy resin.

Figure 4 is a plan view of substrate 40. Figure 5 is a cross-sectional view taken along line V-V in Figure 4. As shown in Figures 4 and 5, substrate 40 includes a plurality of substrates 41. In the example shown in Figures 4 and 5, substrate 40 includes two substrates 41. These two substrates 41 may be referred to as substrate 41a and substrate 41b, respectively. Substrate 40 has main surface 40a and main surface 40b. Main surface 40a and main surface 40b are end surfaces in the thickness direction of substrate 40. Main surface 40b is the opposite surface to main surface 40a.

A first dividing line 42 is formed on the substrate 40. The first dividing line 42 is composed of a groove 42a and a groove 42b. The grooves 42a and 42b are formed on the main surface 40a and the main surface 40b, respectively. The grooves 42a and 42b are V-shaped in cross section and face each other in the thickness direction of the substrate 40. The grooves 42a and 42b are formed, for example, by a dividing machine slicer having a pair of blades facing each other. However, the first dividing line 42 is not limited to this. The first dividing line 42 may be, for example, a perforation formed by a router.

The substrate 40 has a base material 43, conductor patterns 44 and 45, and solder resist 46 and solder resist 47.

The substrate 43 is, for example, a CEM-3 substrate, which is a laminate having a core material of glass cloth impregnated with a flame-retardant epoxy resin and a reinforcing layer formed of glass cloth impregnated with epoxy resin, which is arranged on both main surfaces of the core material. However, the substrate 43 is not limited to this. The substrate 43 may be, for example, an FR-4 substrate, which is a glass cloth impregnated with epoxy resin, or a paper phenol substrate, which is insulating paper impregnated with phenol resin. The substrate 43 has a main surface 43a and a main surface 43b. The main surface 43a and the main surface 43b are end surfaces in the thickness direction of the substrate 43. The main surface 43a and the main surface 43b are on the main surface 40a side and the main surface 40b side, respectively. The main surface 43b is the opposite surface to the main surface 43a.

The conductor patterns 44 and 45 are arranged on the main surface 43a and the main surface 43b, respectively. The conductor patterns 44 and 45 are formed, for example, by patterning copper foil by etching. The solder resist 46 is arranged on the main surface 43a so as to cover the conductor pattern 44. However, the solder resist 46 has an opening formed therein that exposes the electrode pads of the conductor pattern 44. The solder resist 47 is arranged on the main surface 43b so as to cover the conductor pattern 45. However, the solder resist 47 has an opening formed therein that exposes the electrode pads of the conductor pattern 45.

A plurality of components 50 are mounted on the substrate 40. The components 50 are, for example, ceramic capacitors 51 and semiconductor packages 52. However, the components 50 are not limited to these. Some of the plurality of components 50 are joined to the electrode pads of the conductor pattern 44 by joints 53. The remaining portions of the plurality of components 50 are joined to the electrode pads of the conductor pattern 45 by joints 53. The joints 53 are formed of, for example, a solder alloy. The solder alloy is, for example, a Sn (tin)-3.0Ag (silver)-0.5Cu (copper) solder alloy, a Sn-Ag solder alloy, a Sn-Cu solder alloy, a Sn-Zn (zinc) solder alloy, or a Sn-Sb (antimony) alloy. The joints 53 are formed by, for example, a flow method or a reflow method.

Note that the component 50 joined to the electrode pad of the conductor pattern 44 on the substrate 41a and the component 50 joined to the electrode pad of the conductor pattern 44 on the substrate 41b may be referred to as component 50a and component 50b, respectively.

Figure 6 is an oblique view of the base plate unit 10 with a substrate 40 arranged thereon. Figure 7 is an oblique view of the substrate dividing jig 100 with a substrate 40 arranged thereon. Figure 8 is a cross-sectional view taken along line VIII-VIII in Figure 7. As shown in Figures 6, 7 and 8, the substrate 40 is arranged on the first surface 11a and the third surface 12a. More specifically, the substrate 40 is arranged in the first recess 11c and the second recess 12c. The main surface 40a faces the bottom surface of the first recess 11c and the bottom surface of the second recess 12c.

The components 50a and 50b are disposed in the third recess 11d and the fourth recess 12d, respectively. When the substrate 40 is disposed on the first surface 11a and the third surface 12a, the first boundary 13 faces the first dividing line 42.

The first board holding unit 20 is arranged to sandwich the board 40 between the first surface 11a. More specifically, the multiple first pins 22 sandwich the board 40 between the bottom surface of the first recess 11c. However, the multiple first pins 22 preferably sandwich the board 40 between the bottom surface of the first recess 11c where the third recess 11d is not formed. The second board holding unit 30 is arranged to sandwich the board 40 between the third surface 12a. More specifically, the multiple second pins 32 sandwich the board 40 between the bottom surface of the second recess 12c. However, the multiple second pins 32 preferably sandwich the board 40 between the bottom surface of the second recess 12c where the fourth recess 12d is not formed.

(Method of dividing substrate 40 using substrate dividing jig 100)
A method for dividing the substrate 40 using the substrate dividing jig 100 will be described below.

In the method of dividing the substrate 40 using the substrate dividing jig 100, first, the substrate dividing jig 100 and the substrate 40 are prepared. Second, the substrate 40 is placed on the bottom surface of the first recess 11c and the second recess 12c in a state in which the pressing tool 15 is rotated so that the pressing plate 15a is not positioned above the bottom surface of the first recess 11c and above the bottom surface of the second recess 12c. Third, the substrate 40 is fixed to the base plate unit 10 by rotating the pressing tool 15 so that the pressing plate 15a is positioned above the bottom surface of the first recess 11c and above the bottom surface of the second recess 12c.

Fourthly, in the method of dividing the substrate 40 using the substrate dividing jig 100, a first substrate holding unit 20 is positioned so as to clamp the substrate 40 between the bottom surface of the first recess 11c, and a second substrate holding unit 30 is positioned so as to clamp the substrate 40 between the bottom surface of the second recess 12c.

9 is a perspective view of the substrate dividing jig 100 when the first base plate 11 is rotated relative to the second base plate 12 with the substrate 40 placed thereon. As shown in FIG. 9, in the method of dividing the substrate 40 using the substrate dividing jig 100, the first base plate 11 is rotated relative to the second base plate 12 about the first rotation axis while holding the base plate unit 10, the first substrate holding unit 20, and the second substrate holding unit 30, so that the second surface 11b approaches the fourth surface 12b (i.e., the base plate unit 10 is folded in a mountain shape). This divides the substrate 40 along the first dividing line 42, and a plurality of substrates 41 are obtained.

(Effects of the substrate dividing jig 100)
The effects of the substrate dividing jig 100 will be described below.

When dividing the substrate 40, if localized strain is applied to the portion of the substrate 40 that will become substrate 41a and the portion of the substrate 40 that will become substrate 41b, damage may occur to the substrates 41a and 41b and the components 50 mounted thereon. Such damage is particularly likely to occur when the components 50 are ceramic capacitors 51 formed by laminating brittle ceramics.

When dividing the substrate 40 using the substrate dividing jig 100, the portion of the substrate 40 that will become substrate 41a is clamped between the first surface 11a and the first substrate holding unit 20, and the portion of the substrate 40 that will become substrate 41b is clamped between the second surface 11b and the second substrate holding unit 30. Therefore, when dividing the substrate 40 using the substrate dividing jig 100, the entire substrate 40 is sufficiently supported, and localized strain is unlikely to be applied to the portion of the substrate 40 that will become substrate 41a and the portion of the substrate 40 that will become substrate 41b. Therefore, the substrate dividing jig 100 can prevent damage to the substrates 41a, 41b, and the components 50 mounted thereon.

When the first recess 11c and the second recess 12c are formed on the first surface 11a and the third surface 12a, respectively, the substrate 40 can be easily positioned by placing the substrate 40 on the bottom surface of the first recess 11c and the bottom surface of the second recess 12c. When the third recess 11d and the fourth recess 12d are formed on the bottom surface of the first recess 11c and the bottom surface of the second recess 12c, respectively, interference between the component 50a and the first base plate 11 and interference between the component 50b and the second base plate 12 can be avoided.

When the first pins 22 are arranged to sandwich the substrate 40 between the bottom surface of the first recess 11c where the third recess 11d is not formed, and the second pins 32 are arranged to sandwich the substrate 40 between the bottom surface of the second recess 12c where the fourth recess 12d is not formed, the first pins 22 are prevented from pressing the portion of the substrate 40 where the main surface 40a is not supported by the first base plate 11, and the second pins 32 are prevented from pressing the portion of the substrate 40 where the main surface 40a is not supported by the second base plate 12. Therefore, in this case, local strain is further reduced in the portion of the substrate 40 that becomes the substrate 41a and the portion of the substrate 40 that becomes the substrate 41b, and damage to the substrate 41a, the substrate 41b, and the components 50 mounted thereon can be further suppressed.

(Modification)
The first board holding unit 20 may not have the first pin 22, and the second board holding unit 30 may not have the second pin 32. In this case, as long as the size of the board 40 and the position of the first dividing line 42 are the same, the board dividing tool 100 can be used without modification even if other points of the board 40 are different. Also, in this case, the degree of freedom of the position of the component 50 on the board 40 is improved, so that the design constraints of the board 40 are reduced.

Embodiment 2.
A substrate dividing jig according to embodiment 2 will be described. The substrate dividing jig according to embodiment 1 is designated as substrate dividing jig 200. Here, differences from substrate dividing jig 100 will be mainly described, and overlapping descriptions will not be repeated.

(Configuration of substrate dividing jig 200)
The configuration of the substrate dividing jig 200 will be described below.

Figure 10 is an oblique view of the substrate dividing jig 200 when the first base plate 11 is rotated relative to the second base plate 12 with the substrate 40 placed thereon. Figure 11 is an oblique view of the substrate dividing jig 200 when the first portion 11e and the third portion 12e are rotated relative to the second portion 11f and the fourth portion 12f, respectively. As shown in Figures 10 and 11, the substrate dividing jig 200 has a base plate unit 10, a first substrate holding unit 20, and a second substrate holding unit 30. In this regard, the configuration of the substrate dividing jig 200 is common to the configuration of the substrate dividing jig 100.

In the substrate dividing jig 200, the first base plate 11 has a first portion 11e and a second portion 11f, and the second base plate 12 has a third portion 12e and a fourth portion 12f. The first portion 11e and the third portion 12e are arranged adjacent to each other in the first direction DR1. The second portion 11f and the fourth portion 12f are arranged adjacent to each other in the first direction DR1.

The second boundary 16, which is the boundary between the first portion 11e and the second portion 11f, is along the first direction DR1. The third boundary 17, which is the boundary between the third portion 12e and the fourth portion 12f, is along the first direction DR1 and is an extension of the second boundary 16. The first portion 11e is connected to the second portion 11f by, for example, a hinge (not shown) so as to be rotatable about a second rotation axis along the first direction DR1. The third portion 12e is connected to the fourth portion 12f by, for example, a hinge (not shown) so as to be rotatable about the second rotation axis.

The substrate 40 has a second dividing line 48 formed thereon, which is perpendicular to the first dividing line 42. The second dividing line 48 is, for example, formed by a groove formed on the main surface 40a and a groove formed on the main surface 40b. These grooves are V-shaped in cross section and face each other in the thickness direction of the substrate 40. The substrate 40 is arranged so that the second dividing line 48 faces the second boundary 16 and the third boundary 17. In the example shown in Figures 10 and 11, the substrate 40 includes four substrates 41. These four substrates may be referred to as substrate 41c, substrate 41d, substrate 41e, and substrate 41f.

The substrate dividing jig 200 may further include a third substrate holding unit 60. The third substrate holding unit 60 includes a third top plate 61 and a plurality of third pins 32. The third top plate 61 is a flat member. The third top plate 61 has a main surface 61a and a main surface 61b. The main surface 61a and the main surface 61b are end surfaces in the thickness direction of the third top plate 61. The main surface 61b is the opposite surface to the main surface 61a. A plurality of through holes 61c are formed in the third top plate 61. The through holes 61c penetrate the third top plate 61 along the thickness direction. The number of the plurality of through holes 61c is equal to the number of the plurality of third pins 62. The shape of the through holes 61c in a plan view is, for example, circular.

One end of the third pin 62 is inserted into the through hole 61c. This allows the third pin 62 to be attached to the third top plate 61. The third pin 62 is, for example, cylindrical. The third pin 62 protrudes from the main surface 61b. The distance between the other end of the third pin 62 and the main surface 61b is constant for each of the multiple third pins 62.

The third top plate 61 is formed, for example, from a metal material. Specific examples of metal materials include iron alloys such as stainless steel, copper alloys, and aluminum alloys. However, the third top plate 61 may be formed from a material other than a metal. The third top plate 61 may be formed, for example, from reinforced glass or a resin material impregnated with a metal filler. In other words, it is sufficient that the third top plate 61 is formed from a rigid material. The third pin 62 is formed, for example, from a resin material such as epoxy resin. In these respects, the configuration of the substrate dividing jig 200 differs from the configuration of the substrate dividing jig 100.

(Method of dividing the substrate 40 using the substrate dividing jig 200)
A method for dividing the substrate 40 using the substrate dividing jig 200 will be described below.

In the method of dividing the substrate 40 using the substrate dividing jig 200, first, the substrate dividing jig 200 and the substrate 40 are prepared. Second, the substrate 40 is placed on the bottom surface of the first recess 11c and the second recess 12c in a state in which the pressing tool 15 is rotated so that the pressing plate 15a is not located above the bottom surface of the first recess 11c and above the bottom surface of the second recess 12c. Third, the substrate 40 is fixed to the base plate unit 10 by rotating the pressing tool 15 so that the pressing plate 15a is located above the bottom surface of the first recess 11c and above the bottom surface of the second recess 12c.

In the method of dividing the substrate 40 using the substrate dividing tool 200, the first substrate holding unit 20 is arranged so as to sandwich the substrate 40 between the bottom surface of the first recess 11c, and the second substrate holding unit 30 is arranged so as to sandwich the substrate 40 between the bottom surface of the second recess 12c. In the method of dividing the substrate 40 using the substrate dividing tool 200, the first base plate 11 is rotated around the first rotation axis relative to the second base plate 12 so that the second surface 11b approaches the fourth surface 12b (i.e., the base plate unit 10 is folded in a mountain shape) while holding the base plate unit 10, the first substrate holding unit 20, and the second substrate holding unit 30. As a result, the substrate 40 is divided along the first dividing line 42, and the substrate 41a and the substrate 41b are obtained.

Sixthly, in the method of dividing the substrate 40 using the substrate dividing jig 200, a third substrate holding unit 60 is positioned so as to clamp the substrate 41a between the bottom surface of the first recess 11c and the substrate 41b between the bottom surface of the second recess 12c.

In the method of dividing the substrate 40 using the substrate dividing jig 200, in the seventh step, while holding the base plate unit 10 and the third substrate holding unit 60, the first portion 11e is rotated about the second rotation axis relative to the second portion 11f so that the second surface 11b of the first portion 11e approaches the second surface 11b of the second portion 11f (i.e., the first base plate 11 is folded in a mountain shape). At this time, the third portion 12e is rotated about the second rotation axis relative to the fourth portion 12f so that the fourth surface 12b of the third portion 12e approaches the fourth surface 12b of the fourth portion 12f (i.e., the second base plate 12 is folded in a mountain shape). As a result, the substrates 41a and 41b are divided along the second dividing line 48, and the substrates 41c, 41d, 41e, and 41f are obtained.

(Effects of the substrate dividing jig 200)
The effects of the substrate dividing jig 200 will be described below.

By using the substrate dividing jig 200, the substrate 40 can be divided efficiently because the dividing process can be performed multiple times on the substrate 40 by simply setting the substrate 40 on the substrate dividing jig 200 once.

The embodiments disclosed herein are illustrative in all respects and should not be considered limiting. The basic scope of the present disclosure is indicated by the claims, not the above embodiments, and is intended to include all modifications within the meaning and scope of the claims.

10 base plate unit, 11 first base plate, 12 second base plate, 11a first surface, 11b second surface, 11c first recess, 11d third recess, 11e first part, 11f second part, 12a third surface, 12b fourth surface, 12c second recess, 12d fourth recess, 12e third part, 12f fourth part, 13 first boundary, 14 hinge, 15 clamp, 15a clamp plate, 16 second boundary, 17 third boundary, 20 first board clamp unit, 21 first top plate, 21a main surface, 21b main surface, 21c through hole, 30 second board clamp unit, 31 second top plate, 31a, 31b main surface, 31c through hole, 40 board, 40a, 40b Main surface, 41, 41a, 41b, 41c, 41d, 41e, 41f substrate, 42 first dividing line, 42a, 42b groove, 43 base material, 43a, 43b main surface, 44, 45 conductor pattern, 46, 47 solder resist, 48 second dividing line, 50, 50a, 50b component, 51 ceramic capacitor, 52 semiconductor package, 53 joint, 60 third substrate holding unit, 61 third top plate, 61a, 61b main surface, 61c through hole, 100, 200 substrate dividing jig, DR1 first direction, DR2 second direction, DR3 third direction.

Claims (2)

A substrate dividing tool for dividing a substrate having a first dividing line,
a base plate unit including a first base plate and a second base plate arranged adjacent to each other in a first direction;
A first substrate holding unit and a second substrate holding unit are provided,
a first boundary between the first base plate and the second base plate is along a second direction perpendicular to the first direction;
The first base plate includes a first surface and a second surface opposite to the first surface,
the second base plate includes a third surface and a fourth surface opposite the third surface;
the substrate is disposed on the first surface and the third surface such that the first division line faces the first boundary;
the first base plate is coupled to the second base plate so as to be rotatable about a first rotation axis along the second direction,
the first substrate holding unit and the second substrate holding unit respectively hold the substrate between the first surface and the third surface,
A first recess and a second recess are formed in the first surface and the third surface, respectively;
the substrate has a fifth surface and a sixth surface opposite the fifth surface;
the substrate is disposed on a bottom surface of the first recess and a bottom surface of the second recess such that the fifth surface faces the bottom surfaces of the first recess and the second recess ;
a third recess and a fourth recess are formed on a bottom surface of the first recess and a bottom surface of the second recess, respectively;
a first component and a second component mounted on the fifth surface are disposed in the third recess and the fourth recess, respectively;
the first substrate holding unit has a first top plate and a first pin attached to the first top plate and in contact with the substrate;
the second substrate holding unit has a second top plate and a second pin attached to the second top plate and in contact with the substrate;
A substrate dividing jig, wherein the first pin and the second pin are each positioned in contact with the sixth surface so as to avoid the third recess and the fourth recess when the first substrate holding unit and the second substrate holding unit are clamping the substrate. the substrate has a second division line perpendicular to the first division line,
The first base plate has a first portion and a second portion.
the second base plate has a third portion and a fourth portion;
the first portion and the third portion are disposed adjacent to each other in the first direction,
the second portion and the fourth portion are disposed adjacent to each other in the first direction,
a second boundary between the first portion and the second portion is aligned along the first direction,
a third boundary between the third portion and the fourth portion is aligned along the first direction,
And it is on an extension of the second boundary,
the first portion is coupled to the second portion so as to be rotatable about a second rotation axis along the first direction;
the third portion is connected to the fourth portion so as to be rotatable about the second axis of rotation;
The substrate dividing jig according to claim 1 , wherein the substrate is disposed on the first surface and the third surface such that the second dividing line faces the second boundary and the third boundary.

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