JP7610482B2 - METAL WIRING MANUFACTURING METHOD, METAL WIRING MANUFACTURING APPARATUS, LASER LIGHT IRRADIATION CONTROL DEVICE, AND LASER LIGHT IRRADIATION CONTROL PROGRAM - Google Patents

Description

The present invention relates to a method for manufacturing metal wiring, a metal wiring manufacturing apparatus, a laser light irradiation control device, and a laser light irradiation control program.

A circuit board has a structure in which conductive wiring is applied on a substrate. The manufacturing method of a circuit board is generally as follows. First, a photoresist is applied to a substrate to which metal foil has been attached. Next, the photoresist is exposed and developed to obtain a negative shape of the desired circuit pattern. Next, the metal foil not covered with the photoresist is removed by chemical etching to form a pattern. This makes it possible to manufacture a high-performance conductive substrate. However, conventional methods have drawbacks such as a large number of steps, cumbersomeness, and the need for photoresist materials. In response to this, a direct wiring printing technology has been attracting attention, in which the desired metal wiring is directly printed on a substrate using a dispersion in which particles selected from the group consisting of metal particles and metal oxide particles are dispersed. This technology has a small number of steps, does not require the use of photoresist materials, and is therefore extremely productive.

As an example of direct printed wiring technology, a coating film is formed by printing a dispersion on a substrate by screen printing, inkjet printing, etc., and then the coating film is thermally sintered by scanning irradiation with laser light, etc., to obtain low-resistance metal wiring. By irradiating laser light only to the areas that require thermal sintering, the desired metal wiring can be easily formed even if the heat resistance of the substrate is relatively low. For example, a method has been proposed in the past in which a coating film formed by applying a dispersion containing fine particles of metal or metal oxide to a substrate is scanned with laser light. However, this method has problems such as variations in the resistance value of the metal wiring due to variations in the heating conditions of the coating film by the laser light, and high resistance of the metal wiring due to insufficient heating of the coating film.

Patent document 1 describes a method for manufacturing metal wiring, which includes a process of repeatedly scanning a light beam over a surface containing metal particles to sinter the metal particles and form a metal wiring, and is characterized in that the speed at which the light beam is scanned is varied depending on the length of the scanning line that constitutes the metal wiring.

JP 2019-140284 A

When scanning a film with a laser beam by scanning the film back and forth or one way in a first direction while moving the spot in a second direction different from the first direction, the laser is scanned without gaps on the film. If the scanning length differs significantly depending on the location, it is extremely difficult to make the irradiation conditions uniform throughout the irradiation area.

The present invention aims to solve the above problems and provide a metal wiring manufacturing method, a metal wiring manufacturing apparatus, a laser light irradiation control device, and a laser light irradiation control program that are capable of manufacturing metal wiring with low resistance and high reliability.

The present disclosure encompasses the following aspects.
[1] A method for manufacturing a metal wiring, comprising: a laser light irradiation step of irradiating a laser light to a predetermined irradiation area of a film containing a metal and/or metal oxide to form a metal wiring,
The laser light irradiation step includes the following steps:
a division step of dividing a closed figure of a two-dimensional pattern for determining an irradiation region, which is created in advance and is composed of one or more closed figures, into a first closed figure which is a parallelogram and a second closed figure which is other than a parallelogram, thereby generating the second closed figure and an arbitrary first closed figure;
an irradiation unit pattern generating step of dividing the second closed figure into two or more third closed figures by a dividing line, and generating each of the third closed figures and each of the first closed figures, if any, as an irradiation unit pattern;
a parameter assignment step of assigning preset scanning parameters to each irradiation unit pattern; and an irradiation step of irradiating the irradiation area with laser light by scanning a spot of laser light in a first direction while moving the spot in a second direction different from the first direction so as to fill each irradiation unit pattern in accordance with the irradiation unit pattern and the scanning parameters;
Including,
The method, wherein the dividing line is a line segment that divides the second closed figure such that a difference Δd between a maximum width dmax and a minimum width dmin of a plurality of the third closed figures in a pre-specified width direction d is smaller than a difference ΔD between a maximum width Dmax and a minimum width Dmin of the second closed figure in a maximum span direction D.
[2] The method according to aspect 1, wherein the film subjected to the laser light irradiation step is formed on a substrate.
[3] The method according to aspect 2, wherein the film subjected to the laser light irradiation step is a coating film formed on the substrate.
[4] The method according to any one of the above aspects 1 to 3, wherein the width direction d is perpendicular or parallel to the parting line.
[5] The method according to any one of aspects 1 to 4, wherein in the irradiation unit pattern generating step, the number of division lines is specified for each second closed figure, and then the division lines are specified so that a difference between a maximum width and a minimum width of a third closed figure in a direction perpendicular to the division lines is minimized.
[6] The method according to any one of aspects 1 to 5, wherein the division line generates, from each of the second closed figures, a plurality of third closed figures having substantially the same dmax and/or Δd.
[7] In each second closed figure,
the dividing line is two or more line segments parallel to the maximum span direction D and constitutes a part or all of a long side of a maximum inscribed rectangle of the third closed figure,
The method according to any one of Aspects 1 to 6, wherein the short side lengths of the maximum inscribed rectangles are approximately the same.
[8] The first direction is
The method according to any one of Aspects 1 to 7, wherein the direction of the division line is a long side direction or a short side direction of the first closed figure if the division line exists, and a direction perpendicular or parallel to the division line of the second closed figure.
[9] The method according to any one of aspects 1 to 8, wherein a ratio of the minimum scanning length to the maximum scanning length of each irradiation unit pattern is 0.25 or more and 1.0 or less.
[10] The method according to any one of aspects 1 to 9, wherein the irradiation region is a region obtained by projecting the irradiation unit pattern onto a three-dimensional shape pattern of a film surface obtained in advance.
[11] The method according to any one of aspects 1 to 10, wherein the two-dimensional pattern for determining the irradiation region is generated by generating a three-dimensional pattern for determining the irradiation region on a three-dimensional shape pattern of a film surface obtained in advance, and then projecting the three-dimensional pattern for determining the irradiation region two-dimensionally.
[12] The two-dimensional pattern for determining an irradiation region is
A two-dimensional base pattern previously generated on an XY plane is projected onto a previously acquired XYZ three-dimensional shape pattern of the film surface to generate a three-dimensional pattern for determining an irradiation region;
Measuring a dimension B1 of a span portion B in the Y-axis direction on the two-dimensional base pattern;
Measuring a dimension B2 of a projection portion of the span portion B on the three-dimensional pattern for determining an irradiation region;
multiplying the dimension B1 of the two-dimensional base pattern by B1/B2 to generate a reduced correction pattern;
is a reduced correction pattern generated by
11. The method according to any one of aspects 1 to 10, wherein in the irradiating step, an X-axis direction is designated as the first direction, and a Y-axis direction is designated as the second direction.
[13] The method according to any one of aspects 1 to 12, wherein the scanning parameters include one or more selected from the group consisting of a laser scanning speed, a laser output intensity, and a laser spot diameter.
[14] The method according to any one of aspects 1 to 13, wherein the laser light is scanned while overlapping in a line width direction of a scanning line.
[15] The method according to claim 14, wherein the overlap is 10% or more and 99% or less of the line width.
[16] The method according to any one of aspects 1 to 15, wherein the film contains copper and/or copper oxide.
[17] The method according to any one of aspects 1 to 16, wherein the membrane further comprises a dispersant.
[18] A metal wiring manufacturing apparatus for forming metal wiring by irradiating a laser beam to a preset irradiation region of a film containing a metal and/or metal oxide in a structure, the metal wiring manufacturing apparatus comprising:
The metal wiring manufacturing apparatus comprises:
a structure holder that holds the structure;
A laser oscillator that generates laser light;
A laser beam scanning device that scans the laser beam emitted from the laser oscillation device; and a processing device that controls the laser oscillation device and the laser beam scanning device.
Equipped with
The processing device comprising:
outputting a scanning control signal according to a plurality of irradiation unit patterns and scanning parameters assigned to each of the plurality of irradiation unit patterns to the laser oscillation device and the laser light scanning device, and operating the laser oscillation device and the laser light scanning device so as to move a spot of laser light in a second direction different from the first direction while scanning the spot of laser light in a first direction so as to fill the irradiation unit pattern;
the irradiation unit pattern is composed of a third closed figure generated by dividing a second closed figure other than a parallelogram by a division line, and optionally, a first closed figure that is a parallelogram;
the dividing line being a line segment dividing the second closed figure such that a difference Δd between a maximum width dmax and a minimum width dmin of the plurality of third closed figures in a pre-specified width direction d is smaller than a difference ΔD between a maximum width Dmax and a minimum width Dmin of the second closed figure in a maximum span direction D.
[19] The metal wiring manufacturing apparatus according to aspect 18, wherein the laser beam scanning device is a galvanometer scanner including a galvanometer motor and a galvanometer mirror.
[20] The metal wiring manufacturing apparatus according to aspect 18 or 19, wherein the scanning parameters include one or more selected from the group consisting of a laser scanning speed, a laser output intensity, and a laser spot diameter.
[21] A laser light irradiation control device that controls a laser oscillator and a laser light scanning device of a metal wiring manufacturing apparatus to irradiate a laser light to a preset irradiation region of a film containing a metal and/or metal oxide, comprising:
a coordinate data generating unit that distinguishes a first closed figure, which is a parallelogram, from a second closed figure, which is a shape other than a parallelogram, from the input two-dimensional pattern for determining an irradiation region, divides the second closed figure into two or more third closed figures by a division line, and generates coordinate data for each of the first and third closed figures as irradiation unit patterns;
a scanning control signal generating unit that assigns preset scanning parameters to the coordinate data and generates a scanning control signal according to the coordinate data and the scanning parameters;
an output unit that outputs the scanning control signal to a laser oscillator and a laser beam scanning device;
a dividing line that divides the second closed figure such that a difference Δd between a maximum width dmax and a minimum width dmin of a plurality of the third closed figures in a pre-specified width direction d is smaller than a difference ΔD between a maximum width Dmax and a minimum width Dmin of the second closed figure in a maximum span direction D of the second closed figure.
[22] The laser light irradiation control device according to aspect 21, wherein the width direction d is perpendicular or parallel to the division line.
[23] The laser light irradiation control device according to aspect 21 or 22, further comprising: specifying the number of division lines for each second closed figure; and then specifying the division lines so as to minimize the difference between the maximum width and the minimum width of the third closed figure in a direction perpendicular to the division lines.
[24] The laser light irradiation control device according to any one of aspects 21 to 23, wherein the division line generates, from each of the second closed figures, a plurality of third closed figures each having substantially the same dmax and/or Δd.
[25] In each second closed figure,
the dividing line is two or more line segments parallel to the maximum span direction D and constitutes a part or all of a long side of a maximum inscribed rectangle of the third closed figure,
25. The laser light irradiation control device according to any one of Aspects 21 to 24, wherein the short side lengths of the maximum inscribed rectangles are approximately the same.
[26] The scanning parameters include a scanning direction, and the scanning direction is
26. The laser light irradiation control device according to any one of aspects 21 to 25, wherein the direction of the long side or short side of the first closed figure if it exists, and the direction of the dividing line of the second closed figure is perpendicular or parallel to the dividing line.
[27] The laser light irradiation control device according to any one of aspects 21 to 26, wherein a ratio of a minimum scanning length to a maximum scanning length of each irradiation unit pattern is 0.25 or more and 1.0 or less.
[28] The laser light irradiation control device according to any one of aspects 21 to 27, wherein the irradiation region is a region obtained by projecting the irradiation unit pattern onto a three-dimensional shape pattern of a film surface obtained in advance.
[29] The laser light irradiation control device according to any one of aspects 21 to 28, wherein the two-dimensional pattern for determining the irradiation region is generated by generating a three-dimensional pattern for determining the irradiation region on a three-dimensional shape pattern of a film surface obtained in advance, and then projecting the three-dimensional pattern for determining the irradiation region into two dimensions.
[30] The two-dimensional pattern for determining an irradiation region is
A two-dimensional base pattern previously generated on an XY plane is projected onto a previously acquired XYZ three-dimensional shape pattern of the film surface to generate a three-dimensional pattern for determining an irradiation region;
Measuring a dimension B1 of a span portion B in the Y-axis direction on the two-dimensional base pattern;
Measuring a dimension B2 of a projection portion of the span portion B on the three-dimensional pattern for determining an irradiation region;
multiplying the dimension B1 of the two-dimensional base pattern by B1/B2 to generate a reduced correction pattern;
is a reduced correction pattern generated by
29. The laser light irradiation control device according to any one of aspects 21 to 28, wherein the X-axis direction is the direction of the scanning length of the laser light, and the Y-axis direction is the direction of the scanning width of the laser light.
[31] The laser light irradiation control device according to any one of aspects 21 to 30, wherein the scanning parameters include one or more selected from the group consisting of a laser scanning speed, a laser output intensity, and a laser spot diameter.
[32] A laser light irradiation control program for controlling a laser oscillator and a laser light scanner of a metal wiring manufacturing apparatus to irradiate a laser beam to a preset irradiation region of a film containing a metal and/or metal oxide, comprising:
Distinguishing a first closed figure, which is a parallelogram, from a second closed figure, which is a shape other than a parallelogram, from the input two-dimensional pattern for determining an irradiation region, dividing the second closed figure into two or more third closed figures by a dividing line, and generating respective coordinate data for the first and third closed figures as irradiation unit patterns;
Assigning preset scanning parameters to the coordinate data;
generating a scan control signal according to the coordinate data and the scan parameters;
outputting the scanning control signal;
and making the laser light irradiation control device execute the above steps,
a dividing line that divides the second closed figure such that a difference Δd between a maximum width dmax and a minimum width dmin of a plurality of the third closed figures in a pre-specified width direction d is smaller than a difference ΔD between a maximum width Dmax and a minimum width Dmin of the second closed figure in a maximum span direction D.
[33] The laser light irradiation control program according to aspect 32, wherein the width direction d is a direction perpendicular or parallel to the parting line.
[34] The laser light irradiation control program according to aspect 32 or 33, further comprising: specifying the number of division lines for each second closed figure; and then specifying the division lines so as to minimize a difference between a maximum width and a minimum width of the third closed figure in a direction perpendicular to the division lines.
[35] The laser light irradiation control program according to any one of Aspects 32 to 34, wherein the dividing line generates, from each of the second closed figures, a plurality of third closed figures having substantially the same dmax and/or Δd.
[36] In each second closed figure,
the dividing line is two or more line segments parallel to the maximum span direction D and constitutes a part or all of a long side of a maximum inscribed rectangle of the third closed figure,
The laser light irradiation control program according to any one of Aspects 32 to 35, wherein the short side lengths of the maximum inscribed rectangles are approximately the same.
[37] The scanning parameters include a scanning direction, and the scanning direction is
The laser light irradiation control program according to any one of Aspects 32 to 36, wherein the direction of the division line is a long side direction or a short side direction of the first closed figure if the first closed figure exists, and a direction perpendicular or parallel to the division line of the second closed figure.
[38] The laser light irradiation control program according to any one of aspects 32 to 37, wherein a ratio of the minimum scanning length to the maximum scanning length of each irradiation unit pattern is 0.25 or more and 1.0 or less.
[39] The laser light irradiation control program according to any one of aspects 32 to 38, wherein the irradiation region is a region obtained by projecting the irradiation unit pattern onto a three-dimensional shape pattern of a film surface obtained in advance.
[40] The laser light irradiation control program according to any one of aspects 32 to 39, wherein the two-dimensional pattern for determining the irradiation region is generated by generating a three-dimensional pattern for determining the irradiation region on a three-dimensional shape pattern of a film surface obtained in advance, and then projecting the three-dimensional pattern for determining the irradiation region into two dimensions.
[41] The two-dimensional pattern for determining an irradiation region is
A two-dimensional base pattern previously generated on an XY plane is projected onto a previously acquired XYZ three-dimensional shape pattern of the film surface to generate a three-dimensional pattern for determining an irradiation region;
Measuring a dimension B1 of a span portion B in the Y-axis direction on the two-dimensional base pattern;
Measuring a dimension B2 of a projection portion of the span portion B on the three-dimensional pattern for determining an irradiation region;
multiplying the dimension B1 of the two-dimensional base pattern by B1/B2 to generate a reduced correction pattern;
is a reduced correction pattern generated by
40. The laser light irradiation control program according to any one of Aspects 32 to 39, wherein the X-axis direction is the direction of the scanning length of the laser light, and the Y-axis direction is the direction of the scanning width of the laser light.
[42] The laser light irradiation control program according to any one of aspects 32 to 41, wherein the scanning parameters include one or more selected from the group consisting of a laser scanning speed, a laser output intensity, and a laser spot diameter.
[43] The laser light irradiation control program according to any one of aspects 32 to 42, which causes the laser light scanning device to scan with the laser light while overlapping in a line width direction of a scanning line.
[44] The laser light irradiation control program according to aspect 43, wherein the overlap is from 10% to 99% of the line width.
[45] A computer-readable recording medium or recording device storing the program according to any one of aspects 32 to 44.

According to one aspect of the present invention, a method for manufacturing metal wiring, a metal wiring manufacturing apparatus, a laser light irradiation control device, and a laser light irradiation control program can be provided that are capable of manufacturing metal wiring with low resistance and high reliability.

5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 5A to 5C are diagrams illustrating a procedure for forming an irradiation unit pattern in the present embodiment. 1 is a schematic diagram showing a configuration example of a metal wiring manufacturing apparatus according to an embodiment of the present invention; 1 is a block diagram showing an example of the configuration of a metal wiring manufacturing apparatus according to an embodiment of the present invention; 5 is a flowchart illustrating a process executed by a laser light irradiation control program according to the present embodiment. 5 is a flowchart illustrating a process executed by a laser light irradiation control program according to the present embodiment. 5 is a flowchart illustrating a process executed by a laser light irradiation control program according to the present embodiment. 5 is a flowchart illustrating a process executed by a laser light irradiation control program according to the present embodiment. FIG. 2 is a diagram illustrating a procedure for evaluating electrical conductivity in the examples and comparative examples. FIG. 2 is a diagram illustrating a procedure for evaluating electrical conductivity in the examples and comparative examples.

The inventors discovered that by dividing the irradiation area into multiple irradiation unit patterns and scanning the laser according to scanning conditions set individually for each irradiation unit pattern, it is possible to level out the scanning length within the irradiation range scanned under one scanning condition, thereby reducing the variation in the degree of heating depending on the part of the film, and thus making it possible to manufacture metal wiring with low resistance and high reliability.

<Metal Wiring Manufacturing Method>
One aspect of the present invention provides a method for manufacturing a metal wiring, comprising a laser light irradiation step of forming a metal wiring by irradiating a laser light to a predetermined irradiation region of a film containing a metal and/or a metal oxide. In one aspect, the laser light irradiation step includes the following steps:
A division step of dividing a closed figure of a two-dimensional pattern for determining an irradiation region, which is created in advance and is composed of one or more closed figures, into a first closed figure which is a parallelogram and a second closed figure which is other than a parallelogram, thereby generating the second closed figure and an arbitrary first closed figure;
an irradiation unit pattern generating step of dividing the second closed figure into two or more third closed figures by a dividing line, and generating each of the third closed figures and each of the first closed figures, if any, as an irradiation unit pattern;
A parameter assignment step of assigning preset scanning parameters to each irradiation unit pattern;
an irradiation step of irradiating an irradiation region with laser light by scanning a spot of laser light in a first direction while moving the spot of laser light in a second direction different from the first direction so as to fill each irradiation unit pattern according to the irradiation unit pattern and the scanning parameters;
Includes.

<Membrane formation>
In one embodiment, the film containing metal and/or metal oxide to be subjected to the laser light irradiation step may be formed by coating, lamination, deposition, or the like. For example, a coating film containing metal and/or metal oxide may be formed on the surface of the substrate. In one embodiment, the film may be a coating film formed by applying a paste material containing metal and/or metal oxide. Before application, the surface of the substrate may be washed in advance. The paste material contains metal and/or metal oxide, and may optionally contain an organic substance, and may further contain a solvent. In one embodiment, the solvent is capable of dissolving or dispersing, preferably dissolving, the organic substance, and dispersing metal and/or metal oxide (e.g., particles thereof). More detailed preferred examples of the substrate and coating film will be described later.

The coating method is not particularly limited, but can be die coating, spin coating, slit coating, bar coating, knife coating, spray coating, dip coating, or other coating methods. After the above coating, the solvent remaining in the coating may be removed as necessary. In this manner, a structure is obtained that includes a substrate and a coating containing a metal and/or metal oxide disposed on the substrate.

<Laser light irradiation process>
In this process, a laser beam is irradiated to a preset irradiation area of a film containing a metal and/or metal oxide to form a metal wiring. The type of laser light source that can be used includes YAG (yttrium aluminum garnet), YVO4 (yttrium vanadate), Yb (ytterbium), semiconductors (GaAs, GaAlAs, GaInAs), carbon dioxide gas, fiber laser, etc. As the laser beam, not only a fundamental wave but also a higher harmonic wave may be extracted and used as necessary. In one embodiment, the laser beam irradiation process includes the following steps.

[Sectional Step]
1A-C, in this step, the closed figure of the two-dimensional pattern for determining the irradiation area, which is created in advance and is composed of one or more closed figures, is divided into a first closed figure, which is a parallelogram, and a second closed figure, which is a non-parallelogram, to generate the second closed figure and an arbitrary first closed figure. The division may be performed by software or manually. For example, referring to FIGS. 1A and 1B, the closed figure of the two-dimensional pattern for determining the irradiation area P, which is composed of closed figures 1, 2, and 3, is divided into a part P1 composed of the first closed figure 1 and a part P2 composed of the second closed figures 2 and 3. When the irradiation area of the laser light is the first closed figure, that is, the shape of a parallelogram, by setting the sides of the parallelogram in the first and second directions, it is possible to irradiate the laser light with a constant scanning length and scanning width, so that division by a division line for leveling the scanning length is not necessary. Therefore, in this step, the second closed figure that requires division by a division line is selected.

[Irradiation unit pattern generation step]
In this step, each of the second closed figures is divided into two or more third closed figures by a division line L, and each third closed figure and each first closed figure, if any, are generated as irradiation unit patterns. In a typical embodiment, the division line is a straight line. For example, referring to FIG. 1C, the second closed figure 2 is divided into third closed figures 2a and 2b by the division line L, and the second closed figure 3 is divided into third closed figures 3a and 3b by the division line L. This allows for the generation of an irradiation unit pattern group P3 composed of a plurality of irradiation unit patterns.

In one aspect, the division line is a line segment that divides the second closed figure so that the difference Δd (hereinafter sometimes simply referred to as Δd) between the maximum width dmax and minimum width dmin of the multiple third closed figures in a pre-specified width direction d is smaller than the difference ΔD (hereinafter sometimes simply referred to as ΔD) between the maximum width Dmax and minimum width Dmin in the maximum span direction D of the second closed figure (i.e., the direction giving the maximum span length of the second closed figure). For example, with reference to Figures 2A to C and Figures 3A and B, the division line L may be specified so that Δd in the width direction da of the third closed figure 2a and the width direction db of the third closed figure 2b is smaller than ΔD in the maximum span direction D of the second closed figure 2; with reference to Figures 4A to E, the division line L may be specified so that Δd in the width direction da of the third closed figure 3a and the width direction db of the third closed figure 3b is smaller than ΔD in the maximum span direction D of the second closed figure 3; and with further reference to Figures 5A to C, the division line L may be specified so that Δd in the width direction dc of the third closed figure 3c and the width direction dd of the third closed figure 3d is smaller than ΔD in the maximum span direction D of the second closed figure 3. The division line L need only be a line that makes the Δd of at least one of the multiple third closed figures generated from one second closed figure smaller than ΔD, but in a typical embodiment, the division line L is a line that makes the Δd of all of the multiple third closed figures generated from one second closed figure smaller than ΔD.

The width direction d of the third closed figure can be arbitrarily specified as desired. In a preferred embodiment, the width direction d is a direction perpendicular or parallel to the division line, for example, as shown in FIG. 3A. In addition, when the third closed figure is in contact with multiple division lines, perpendicular or parallel to the division line means perpendicular or parallel to at least one of the multiple division lines. The width directions d of multiple third closed figures generated from one second closed figure may be the same or different from each other, but if they are the same, it tends to be easier to control the laser light irradiation conditions, which is preferable. In a preferred embodiment, the width direction d of the third closed figure is the direction in which Δd is minimized. For example, compared to the width directions da and db shown in FIG. 2B, the width directions da and db shown in FIG. 3A can minimize Δd (for example, Δd is zero), which is more preferable.

In one aspect, the division lines may be specified according to a preset number and/or direction condition. For example, for each second closed figure, the number of division lines may be specified first, and then the direction of the division lines may be specified so that Δd is minimized when the direction perpendicular to the division lines is specified as the width direction d of the third closed figure. For example, from the viewpoint of minimizing the number of third closed figures generated from one second closed figure, a procedure is possible in which one division line is specified first to attempt division of the second closed figure, and if ΔD>Δd is realized for all third closed figures, the division process is terminated, and if not, the number of division lines is increased to two and the division process is attempted again. Alternatively, the direction of the division line may be specified first, and then the number of division lines may be specified so that Δd is equal to or less than a predetermined value when the direction perpendicular to the division line is specified as the width direction d of the third closed figure. In this case, an upper limit may be set on the number of division lines. In other words, if it is not possible to achieve a Δd of less than the specified value for all third closed figures with the upper limit number of dividing lines, it is possible to change the direction of the dividing lines and try the dividing process again.

In one aspect, the dividing lines generate a plurality of third closed figures from each second closed figure, each having substantially the same dmax and/or Δd. For example, referring to FIG. 6A, the second closed figure 4 may be divided by dividing lines L1, L2, and L3 to generate third closed figures 4a, 4b, 4c, and 4d having substantially the same dmax and Δd in each of the width directions da, db, dc, and dd. In this case, relatively similar laser light irradiation conditions can be used between the third closed figures, which is preferable because process control is easy.

In one embodiment, the division line is two or more line segments parallel to the maximum span direction D. In this case, setting the direction parallel to the division line as the first direction is advantageous in terms of reducing the resistance of the metal wiring and improving reliability, since it allows for an increase in the scan length and a reduction in the number of scans. For example, referring to FIG. 6B, the second closed figure 4 may be divided into third closed figures 4e, 4f, 4g, and 4h by division lines L4, L5, and L6 parallel to the maximum span direction D, and referring to FIG. 7A, the second closed figure 5 may be divided into third closed figures 5a, 5b, 5c, 5d, 5e, and 5f by division lines L1, L2, L3, L4, and L5 parallel to the maximum span direction D.

7A and 7B, in one embodiment, when the division lines L1 to L5 are two or more line segments parallel to the maximum span direction D of the second closed figure 5, the division lines form part or all of the long sides of the maximum inscribed rectangles R1, R2, R3, R4, and R5 of at least a part of the third closed figures 5a, 5b, 5c, 5d, 5e, and 5f (5b, 5c, 5d, 5e, and 5f in FIG. 7A), and the short side lengths s1, s2, s3, s4, and s5 of the maximum inscribed rectangles may be approximately the same. By designating the short side direction as the first direction and the long side direction as the second direction, respectively, the same or similar laser light irradiation conditions can be applied to most of the multiple third closed figures generated from one second closed figure, which is preferable because process control is easy.

In one aspect, the irradiation unit pattern may be projected onto a previously acquired three-dimensional shape pattern of the film surface to form an irradiation area. Referring to FIG. 8, the irradiation area R is formed by projecting an irradiation unit pattern group P3 composed of a plurality of irradiation unit patterns onto a three-dimensional shape pattern 81 of the film surface. The three-dimensional shape pattern of the film surface can be acquired by a conventionally known means, for example, by reading and acquiring the shape of the film surface with an image recognition device such as an image sensor. Each irradiation unit pattern is projected onto the acquired three-dimensional shape pattern. The alignment of the irradiation unit pattern with the three-dimensional shape pattern of the film surface may be performed by software known to those skilled in the art, or manually. In one embodiment, an XYZ coordinate system and its reference point (origin) are specified, and a three-dimensional shape pattern 81 on the film surface is positioned within the XYZ coordinate system so that the height in the Z axis direction is minimized. The irradiation unit pattern group P3 is positioned on the XY plane above the three-dimensional shape pattern in the Z axis direction (i.e., in the + direction). If desired, the irradiation unit pattern group P3 and the three-dimensional shape pattern 81 on the film surface can be aligned using a top view image or the like, and then the shape of the irradiation unit pattern group P3 can be projected in the Z direction onto the three-dimensional shape pattern 81 to generate an irradiation area.

Referring to FIG. 9, in one embodiment, the two-dimensional pattern P for determining the irradiation area may be generated by generating a three-dimensional pattern 82 for determining the irradiation area on a three-dimensional shape pattern 81 of the film surface previously acquired, and then projecting the three-dimensional pattern 82 for determining the irradiation area in two dimensions. When the three-dimensional pattern for determining the irradiation area generated in this manner is used, it is possible to set the irradiation area more precisely taking into account the three-dimensional shape of the film surface, which is particularly advantageous in reducing the resistance of the metal wiring and improving its reliability. The two-dimensional pattern P for determining the irradiation area generated by the above projection is pattern-divided in the above-mentioned procedure to generate the irradiation unit pattern group P3. Referring again to FIG. 8, in one embodiment, the irradiation area R may be formed by back-projecting the irradiation unit pattern group P3 onto the three-dimensional shape pattern 81.

10A and 10B, in one embodiment, the two-dimensional pattern P for determining the irradiation region is:
A two-dimensional base pattern 80 previously generated on an XY plane is projected onto a previously acquired XYZ three-dimensional shape pattern 81 of a film surface to generate a three-dimensional pattern 82 for determining an irradiation region;
Measuring a dimension B1 of a span portion B in the Y-axis direction on the two-dimensional base pattern 80;
Measuring a dimension B2 of a projection portion of the span portion B on the three-dimensional pattern 82 for determining an irradiation region;
Multiplying the dimension B1 of the two-dimensional base pattern 80 by B1/B2 to generate a reduced correction pattern;
The reduced correction pattern may be generated by the above method. In one aspect, the dimension B1 in the Y-axis direction is measured over the entire X-axis region of the two-dimensional base pattern 80 having the X-axis dimension A1 and the Y-axis dimension B1, and the dimension B2 of the portion corresponding to each dimension B1 is measured, and for each pair of the dimension B1 and the dimension B2, B1/B2 is calculated and the dimension B1 is reduced and corrected. When the two-dimensional pattern for determining the irradiation region generated in this manner is used, it is possible to set the irradiation region more precisely taking into account the three-dimensional shape of the film surface, which is particularly advantageous in reducing the resistance of the metal wiring and improving its reliability. The reduced correction pattern is divided into patterns in the above-mentioned procedure to generate the irradiation unit pattern group P3. Referring again to FIG. 8, in one aspect, the irradiation region R may be formed by back-projecting the irradiation unit pattern group P3 onto the three-dimensional shape pattern 81. In one aspect, in the irradiation step described below, the X-axis direction may be designated as the first direction, and the Y-axis direction may be designated as the second direction.

[Parameter assignment step]
In this step, preset scanning parameters are assigned to each of the above-mentioned irradiation unit patterns. This allows a scanning control signal including position information of each irradiation unit pattern and the scanning parameters associated therewith to be generated. The laser oscillation device and the laser light scanning device of the metal wiring manufacturing apparatus, as well as mechanisms such as an output adjustment mechanism and a spot adjustment mechanism, can receive such scanning control signals and perform laser light irradiation under desired conditions. The scanning parameters may be the same or different between the irradiation unit patterns.
Examples of the scanning parameters include the following:

(center wavelength, pulse frequency)
In one embodiment, the central wavelength of the laser light is 350 nm or more and 600 nm or less, preferably 355 nm or 532 nm. The laser light may be a CW wave (continuous wave), but may be a pulse wave from the viewpoint of preventing diffusion of heat and proceeding with baking instantaneously by irradiating a light beam with a high peak value. The width of one pulse of the pulse wave is preferably 1 to 100 nanoseconds, 2 to 50 nanoseconds, or 3 to 30 nanoseconds from the viewpoint of suppressing ablation of the film during light irradiation.

(Membrane penetration depth)
In one embodiment, a light beam penetrates into the film containing a metal and/or metal oxide with an appropriate penetration depth. The penetration depth is the depth x of a film containing a metal and/or metal oxide, when a light beam is incident with a light intensity _I0 in the thickness direction of the film, until the light intensity is attenuated to _I0 /e due to light absorption by the film. When the light absorbance of a film containing a metal and/or metal oxide at a certain wavelength is α, the light intensity _I0 /e and x at that wavelength are expressed by the following formula:
I ₀ /e=I ₀ ×e ^(-αx)
Therefore, x and α satisfy the following formula:
x=1/α
Satisfy the relationship.

In one embodiment, a film containing a metal and/or metal oxide is irradiated with laser light at a penetration depth of 0.25 μm to 10.00 μm. The penetration depth is more preferably 0.30 μm to 8.00 μm, even more preferably 0.35 μm to 6.00 μm, and most preferably 0.40 μm to 4.50 μm. When the penetration depth is 0.25 μm or more, the laser light penetrates well into the inside of the film, and not only the surface of the film but also the internal sintering and the formation of a conductor due to contact between particles proceed well, resulting in low resistance of the metal wiring. On the other hand, when the penetration depth is 10.00 μm or less, the light penetrates well into the inside of the film and is absorbed well, resulting in good internal sintering and the formation of a conductor due to contact between particles, resulting in low resistance of the metal wiring.

The penetration depth can be adjusted by the content of the metal and/or metal oxide contained in the film containing the metal and/or metal oxide, the particle size when the metal and/or metal oxide is particulate, the amount of other components (organic substances, etc.), etc. For example, decreasing the content of the metal and/or metal oxide and decreasing the particle size tends to increase the penetration depth, while increasing the content and increasing the particle size tends to decrease the penetration depth. In addition, the presence of a light-absorbing organic material (for example, a phosphorus-containing organic compound described below) tends to decrease the penetration depth.

(power density)
By adjusting the power density of the laser light to an appropriate range, the amount of energy absorbed by the film can be controlled, and the formation of a conductor due to internal sintering and contact between particles can be favorably promoted. The power density of the laser light is preferably 0.001 mW/μm ² or more and 2.000 mW/μm ² or less, or 0.005 mW/μm ² or more and 1.900 mW/μm ² or less, or 0.010 mW/μm ² or more and 1.800 mW/μm 2 or less, or 0.015 mW/μm ² or more and 1.500 mW/μm ² or less. When the power density is 0.001 mW/μm ² or more, the film is favorably sintered, and the metal wiring is made conductive due to contact between particles, etc., and the metal wiring has low resistance. Also, when the power density is 2.000 mW/μm ² or ^less , carbonization or ablation of the film is unlikely to occur, and the desired metal wiring can be easily formed.

(spot diameter, overlap rate, scanning line spacing)
The laser light may be irradiated to the film with a desired spot diameter. The spot diameter may be adjusted by the amount of deviation of the laser light from the focus. In one embodiment, the laser light is preferably irradiated on the film multiple times in an overlapping manner. For example, the laser light is repeatedly scanned on the film while overlapping in the line width direction of the scanning line. In this case, the overlap rate (i.e., the ratio in the scanning line width direction of the portion irradiated the first time to the portion irradiated the second time) is preferably 10% or more and 99% or less, or 20% or more and 95% or less, or 30% or more and 90% or less, or 40% or more and 85% or less. When the overlap rate is 10% or more, the formation of a conductor by sintering of metal and/or metal oxide, contact between particles, etc., proceeds well, and when it is 99% or less, wiring can be manufactured at an industrially practical production speed. The direction of the scanning line of the second irradiation may be the same direction as the scanning line of the first irradiation (i.e., one-way scanning) or the opposite direction (i.e., reciprocating scanning). The scanning line interval of the laser light may be set according to the purpose, for example, so that a desired overlap rate is obtained for a desired spot diameter.

(Defocus value)
The defocus value may be appropriately specified in order to adjust the spot diameter to a desired range. In a preferred embodiment, the defocus value may be set in the range of −10.0 mm to 10.0 mm when the focusing position in the height in the irradiation direction of the laser light is set to 0.

(Angle of Incidence)
The incident angle of the laser light to the film is preferably 0 to 50 degrees, or 0 to 48 degrees, or 0 to 45 degrees. When the incident angle is 50 degrees or less, sintering of the film caused by the laser light being reflected on the surface of the film or a small amount of light entering the film, or insufficient formation of a conductor caused by contact between particles, etc. can be prevented, and the resistance value of the metal wiring can be made low and uniform.

(Scanning Speed)
The scanning speed (V) (unit: mm/sec) of the laser light is calculated from the laser light scanning length (L) (unit: mm) calculated based on the irradiation pattern shape and the desired scanning period (F) (unit: Hz) (e.g., 15 Hz) according to the following formula.
Scanning speed (V) = scanning period (F) x scanning length (L)

(Scanning direction)
The laser beam scanning direction may be specified depending on the purpose. For example, the scanning direction may be a direction in which the maximum scanning length is the shortest, a direction in which the difference between the maximum scanning length and the minimum scanning length is the smallest, a direction in which the number of scans is the smallest, etc., in each irradiation unit pattern.

In one aspect, the scanning parameters include one or more selected from the group consisting of laser scanning speed, laser power density, and laser spot diameter.

In one aspect, a combination of the numerical values of multiple parameter elements (e.g., laser scanning speed, laser output intensity, and laser spot diameter) may be used as one template. Multiple such templates may be prepared, and one template selected from the multiple templates may be assigned to each irradiation unit pattern. In a typical aspect, the same scanning parameters are applied within each irradiation unit pattern, but different scanning parameters may be assigned to different parts within one irradiation unit pattern.

The scanning parameters may be set in advance based on the results of a study of the relationship between the properties of the film and the laser light irradiation conditions suitable for the properties. In this embodiment, the film is irradiated with laser light to form a metal wiring, which is a fired product of the film. The film in this embodiment is a thin film containing metal and/or metal oxide, and in one aspect further contains an organic substance such as a dispersant. In such a film, the fired state is greatly influenced by the laser light irradiation requirements. For example, when the scanning speed is slowed without changing the output intensity of the laser light, the film tends to be heated more significantly, but the degree of heating of the film varies depending on the properties of the film (chemical composition, thickness, laser light penetration length, form (presence of holes, etc.), etc.). Therefore, it is desirable to appropriately select the scanning parameters according to the properties of the film. In one aspect, a plurality of data sets including film property data and scanning parameter data (e.g., the above-mentioned template) associated with the film property data are generated and stored, and when assigning scanning parameters, the data set is read, and scanning parameters associated with film property data that is the same as or similar to the properties of the film actually used are selected and assigned to the irradiation unit pattern.
Alternatively, the scanning parameters may be generated based on direct input of numerical values from a user.

The scanning control signal may include information regarding the designation of the pattern that is to be first irradiated with laser light among the irradiation unit patterns constituting the irradiation unit pattern group, the start position of the laser light scanning in each irradiation unit pattern, etc.

[Irradiation step]
In this step, the laser light is irradiated to the irradiation area by scanning the spot of the laser light in a first direction while moving the spot of the laser light in a second direction different from the first direction so as to fill each irradiation unit pattern according to the irradiation unit pattern and the scanning parameters assigned thereto. In a typical aspect, the second direction is a direction perpendicular to the first direction. In one aspect, the first direction is a direction perpendicular or parallel to the width direction d of the third closed figure. In another aspect, the first direction is a direction perpendicular or parallel to at least one of one or more division lines dividing the second closed figure. In another aspect, the first direction is a long side direction or a short side direction of the first closed figure if it exists.

The ratio of the minimum scan length to the maximum scan length of each irradiation unit pattern is preferably 0.25 or more, or 0.27 or more, or 0.3 or more, from the viewpoint of obtaining the advantage of the equalization of the scan length better. The above ratio is most preferably 1.0, but may be, for example, 1.0 or less, or 0.97 or less, or 0.95 or less, depending on the desired shape of the irradiation area.

The irradiation area may be set as a two-dimensional or three-dimensional area. A three-dimensional irradiation area may be specified on a three-dimensional shape pattern of the film surface, as described above with reference to Figures 8, 9, 10A and 10B.

The oxygen concentration in the atmosphere during irradiation is preferably 5% by volume or less, or 2% by volume or less, or 1% by volume or less. Although a lower oxygen concentration is more preferable, from the viewpoint of ease of process control, it may be, for example, 0.001% by volume or more, 0.01% by volume or more, or 0.05% by volume or more.
For example, the metal wiring of this embodiment can be manufactured by the above-mentioned procedure.

<Substrate and film>
Examples of the substrate and the film containing a metal and/or a metal oxide suitable for producing the metal wiring of this embodiment include the following.

[Substrate]
The shape of the substrate is not particularly limited as long as it constitutes a surface on which a film containing a metal and/or metal oxide is disposed. The substrate is preferably made of an insulating material in order to ensure electrical insulation from the metal wiring described below. However, it is not necessary that the entire substrate is made of an insulating material. It is sufficient that only the portion constituting the surface on which the film containing a metal and/or metal oxide is disposed is made of an insulating material.

The surface of the substrate on which the film containing metal and/or metal oxide is disposed may be flat or curved, or may be a surface including steps. More specifically, the substrate may be a substrate (e.g., a plate, film, or sheet) or a three-dimensional object (e.g., a housing, etc.). The plate is, for example, a support used in a circuit board such as a printed circuit board. The film or sheet is, for example, a base film that is a thin-film insulator used in a flexible printed circuit board.

Examples of three-dimensional objects include the housings of electrical devices such as mobile phone terminals, smartphones, smart glasses, televisions, and personal computers. Other examples of three-dimensional objects include dashboards, instrument panels, steering wheels, and chassis in the automotive field.

Specific examples of the substrate include a substrate made of an inorganic material (hereinafter referred to as an "inorganic substrate") or a substrate made of a resin (hereinafter referred to as a "resin substrate").

The inorganic substrate is, for example, composed of glass, silicon, mica, sapphire, quartz, clay film, ceramic material, etc. As the resin substrate, polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN) are preferable because they have excellent adhesion to metal wiring, are easily distributed in the market, are available at low cost, and are advantageous from a business perspective. At least one selected from the group consisting of polypropylene (PP), polyamide (PA), acrylonitrile-butadiene-styrene (ABS), polyethylene (PE), polycarbonate (PC), polyacetal (POM), polybutylene terephthalate (PBT), modified polyphenylene ether (m-PPE), and polyphenylene sulfide (PPS) is preferable, especially in the case of a housing, because it has excellent adhesion to metal wiring, excellent moldability and mechanical strength after molding, and has heat resistance sufficient to withstand laser irradiation when forming the metal wiring.

When the substrate is, for example, a plate, film or sheet, the thickness can be 1 μm to 10 mm, and is preferably 25 μm to 250 μm. When the thickness of the substrate is 250 μm or less, the electronic device produced can be made lighter, more space-saving and more flexible, which is preferable.

When the substrate is a three-dimensional object, its maximum dimension (i.e., the maximum length of one side) can be, for example, 1 μm to 10 mm, and preferably 200 μm to 5 mm. Substrates with a thickness in the above range have good mechanical strength and heat resistance after molding.

[Film containing metal and/or metal oxide]
(Metals and/or Metal Oxides)
The metal contained in the film containing a metal and/or a metal oxide is, for example, silver, copper, silicon, aluminum, zirconium, titanium, hafnium, tantalum, tin, chromium, cobalt, magnesium, manganese, molybdenum, nickel, tungsten, zinc, indium, tin, etc., and may be an alloy or a mixture containing two or more of these. In addition, examples of the metal oxide include oxides of the metals exemplified above, and copper oxide (CuO and _Cu2O ) is particularly preferred.

The metal and/or metal oxide may be a particle or a complex. In the case of a particle, it may have a core/shell structure. For example, the core and/or shell may be a metal and/or metal oxide, and the core and shell may contain different metals and/or metal oxides.

The particles may be, for example, fine particles containing copper oxide. The average primary particle diameter of the fine particles containing copper oxide is preferably 1 nm or more and 100 nm or less, more preferably 1 nm or more and 50 nm or less, and even more preferably 1 nm or more and 20 nm or less. The smaller the average primary particle diameter, the easier it is to control the penetration length of the light beam, which will be described later, and therefore is preferable. The average primary particle diameter is a value measured by a transmission electron microscope or a scanning electron microscope. When the average primary particle diameter is 25 nm or less, a transmission electron microscope is used, and when it exceeds 25 nm, a scanning electron microscope is used for measurement.

(Organic matter)
The film containing a metal and/or metal oxide may contain an organic substance in addition to the metal and/or metal oxide. In one embodiment, the organic substance functions as a dispersant that improves the dispersibility of the metal and/or metal oxide. The organic substance may be capable of absorbing light.

Examples of dispersants include organic substances with a number average molecular weight of 300 to 300,000. If the number average molecular weight is 300 or more, the insulating properties are excellent and the contribution to improving the dispersion stability of the paste material as a material for a film containing a metal and/or metal oxide is large. In addition, if the number average molecular weight is 300,000 or less, the film containing a metal and/or metal oxide is easily baked by light irradiation, which is preferable. The dispersant preferably has a group having affinity for a metal or metal oxide, and from this viewpoint, a phosphorus-containing organic compound is preferable, and a polymeric phosphate ester is more preferable. The phosphorus-containing organic compound is also advantageous in that it can form an electrically insulating insulating region between wiring patterns. In this disclosure, the number average molecular weight is a value obtained by using gel permeation chromatography and converting it into standard polystyrene.

In a film containing a metal and/or metal oxide, the mass ratio of the phosphorus-containing organic compound content to the metal and/or metal oxide content is preferably 0.01 to 0.4, or 0.03 to 0.35, or 0.05 to 0.25, or 0.1 to 0.2. The above ranges are preferable in that the phosphorus-containing organic compound has a significant advantage in improving light absorption and in adsorbing to the metal and/or metal oxide to fix them to the substrate.

It is preferable that the phosphorus-containing organic compound is one that is easily decomposed or evaporated by light and/or heat. By using an organic substance that is easily decomposed or evaporated by light and/or heat, organic residues are less likely to remain after firing, and metal wiring with low resistivity can be obtained.

The decomposition temperature of the phosphorus-containing organic compound is not limited, but is preferably 600°C or less, more preferably 400°C or less, and even more preferably 300°C or less. From the viewpoint of the stability of the phosphorus-containing organic compound, the decomposition temperature may preferably be 160°C or more, 210°C or more, or 260°C or more.

The absorption characteristics of the phosphorus-containing organic compound are not limited, but it is preferable that the phosphorus-containing organic compound can absorb the light used for firing the film containing metal and/or metal oxide. In one embodiment, it is preferable to use a phosphorus-containing organic compound that absorbs light of 355 nm, 405 nm, 445 nm, 450 nm, 532 nm, 1064 nm, etc. as the emission wavelength of laser light. When the substrate is a resin, it is preferable that the phosphorus-containing organic compound can absorb light of wavelengths of 355 nm, 405 nm, 445 nm, 450 nm, and/or 532 nm. In the above, the ability to absorb light means that the absorption coefficient measured by an ultraviolet-visible spectrophotometer is 0.10 cm ^-1 or more.

（式中、Ｒは１価の有機基である。）
で表されるリン酸モノエステルは、酸化銅への吸着性及び基材への密着性に優れるため、好ましい。Ｒとしては、置換又は非置換の炭化水素基等を例示できる。 The structure of the phosphorus-containing organic compound is preferably a monoester or diester of phosphoric acid, since it has a hydroxyl group that has affinity for copper oxide. For example, the structure of the phosphorus-containing organic compound is represented by the following general formula (1):

(In the formula, R is a monovalent organic group.)
The phosphoric acid monoester represented by the following formula is preferred because it has excellent adsorption to copper oxide and adhesion to a substrate. Examples of R include substituted or unsubstituted hydrocarbon groups.

で表される構造を有する化合物を例示できる。 An example of a phosphoric acid monoester is represented by the following formula (2):

Examples of the compound include compounds having a structure represented by the following formula:

（式中、ｌは、１～２０の数であり、ｍは、１～２０の数であり、ｎは、１～２０の数である。）
で表される構造を有する化合物も例示できる。 Furthermore, an example of a phosphoric acid monoester is represented by the following formula (3):

(In the formula, l is a number from 1 to 20, m is a number from 1 to 20, and n is a number from 1 to 20.)
Compounds having a structure represented by the following formula are also exemplified.

In the formula, l may preferably be 1 to 15, or 1 to 10.
In the formula, m may preferably be 1 to 15, or 1 to 10.
In the formula, n may preferably be 1 to 15, or 1 to 10.

The organic structures of phosphorus-containing organic compounds include polyethylene glycol (PEG), polypropylene glycol (PPG), polyimide, polyester (e.g., polyethylene terephthalate (PET), polyethylene naphthalate (PEN)), polyethersulfone (PES), polycarbonate (PC), polyvinyl alcohol (PVA), polyvinyl butyral (PVB), polyacetal, polyarylate (PAR), polyamide (PA), polyamideimide (PAI), polyetherimide (PEI), polyphenylene ether (PPE), polyphenylene sulfide (PPS), polyetherketone (PEK), polyphthalamide (PPA), polyethernitrile (PENt), polybenzimidazole (PBI), polycarbodiimide, polymethacrylamide, nitrile rubber, acrylic rubber, polyethylene tetrafluoride, epoxy resin, phenol, etc. The polymer may have a structure derived from a compound such as polymethylmethacrylate resin (PMMA), polybutene, polypentene, ethylene-propylene copolymer, ethylene-butene-diene copolymer, polybutadiene, polyisoprene, ethylene-propylene-diene copolymer, butyl rubber, polymethylpentene (PMP), polystyrene (PS), styrene-butadiene copolymer, polyethylene (PE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polyether ether ketone (PEEK), phenol novolac, benzocyclobutene, polyvinylphenol, polychloropyrene, polyoxymethylene, polysulfone (PSF), polysulfide, silicone resin, aldose, cellulose, amylose, pullulan, dextrin, glucan, fructan, chitin, etc. (specifically, the structure ...methylmethacrylate resin (PMMA), polybutene, polypentene, ethylene-propylene copolymer, polymethylmethacrylate resin (PMMA), polybutene, poly Phosphorus-containing organic compounds having a polymer skeleton selected from polyethylene glycol, polypropylene glycol, polyacetal, polybutene, and polysulfide are preferred because they are easily decomposed and do not leave residues in the metal wiring obtained after firing.

As the phosphorus-containing organic compound, commercially available products can be used, specifically, DISPERBYK (registered trademark)-102, DISPERBYK-103, DISPERBYK-106, DISPERBYK-109, DISPERBYK-110, DISPERBYK-111, DISPERBYK-118, DISPERBYK-140, DISPERBYK-150, DISPERBYK-160, DISPERBYK-170, DISPERBYK-182, DISPERBYK-190, DISPERBYK-203, DISPERBYK-214, DISPERBYK-221, DISPERBYK-225, DISPERBYK-230, DISPERBYK-240, DISPERBYK-251, DISPERBYK-252, DISPERBYK-253, DISPERBYK-265, DISPERBYK-266, DISPERBYK-277, DISPERBYK-278, DISPERBYK-279, DISPERBYK-281, DISPERBYK-282, DISPERBYK-283, DISPERBYK-284, DISPERBYK-285, DISPERBYK-286, DISPERBYK-287, DISPERBYK-288, DISPERBYK-289, DISPERBYK-290, DISPERBYK-291, DISPERBYK-292, DISPERBYK-293, DISPERBYK-294, DISPERBYK-295, DISPERBYK-296, DISPERBYK-297, DISPERBYK-298, DISPERBYK-299, DISPERBYK-300, DISPERBYK-301, DISPERBYK-30 RBYK-145, DISPERBYK-168, DISPERBYK-180, DISPERBYK-182, DISPERBYK-187, DISPERBYK-190, DISP ERBYK-191, DISPERBYK-193, DISPERBYK-194N, DISPERBYK-199, DISPERBYK-2000, DISPERBYK-2001, DISPERBYK-2008, DISPERBYK-2009, DISPERBYK-2010, DISPERBYK-2012, DISPERBYK-2013, DISPERB YK-2015, DISPERBYK-2022, DISPERBYK-2025, DISPERBYK-2050, DISPERBYK-2152, DISPERBYK-2055, Examples include DISPERBYK-2060, DISPERBYK-2061, DISPERBYK-2164, DISPERBYK-2096, DISPERBYK-2200, BYK-405, BYK-607, BYK-9076, BYK-9077, BYK-P105, Plysurf (registered trademark) M208F and Plysurf DBS manufactured by Daiichi Kogyo Seiyaku Co., Ltd. These may be used alone or in combination.

(Hydrazine and Hydrazine Hydrate)
The film containing a metal and/or metal oxide preferably contains hydrazine and/or hydrazine hydrate from the viewpoint of reduction sintering of the metal and/or metal oxide. Hydrazine and/or hydrazine hydrate can be contained in the film containing a metal and/or metal oxide. When the film contains hydrazine and/or hydrazine hydrate, the hydrazine and/or hydrazine hydrate functions as a reducing agent, and the resistance of the wiring obtained after light irradiation is further reduced. The content of hydrazine and/or hydrazine hydrate in the film is preferably within the following range based on the amount of hydrazine and on the mass basis with respect to the total content of the metal and/or metal oxide in the film.
0.0001≦[(hydrazine mass)/(total mass of metal and/or metal oxide)]≦0.10
When the mass ratio of hydrazine and/or hydrazine hydrate is 0.0001 or more, the resistance of the metal wiring is low, which is preferable, and when the mass ratio is 0.10 or less, the long-term stability of the structure is good, which is preferable.

The content of organic matter is preferably 0.1% by mass or more, or 0.5% by mass or more, or 1% by mass or more, and preferably 30% by mass or less, or 20% by mass or less, or 10% by mass or less, based on 100% by mass of the paste material used to form the film.

Specific examples of solvents that can be used include alcohols (monohydric alcohols and polyhydric alcohols (e.g., glycols)), ethers of alcohols (e.g., glycols), and esters of alcohols (e.g., glycols). These may be used alone or in combination, and are selected according to the coating method, taking into consideration volatility, coating equipment, and solvent resistance of the substrate to be coated, etc.

As the solvent, monoalcohols having 10 or less carbon atoms are more preferred. Among them, from the viewpoint of suppressing the decrease in dispersibility of the metal and/or metal oxide and from the viewpoint of reducing the resistance value of the wiring, it is even more preferred that the monoalcohol has 8 or less carbon atoms. Among monoalcohols having 8 or less carbon atoms, monoalcohols having 2 to 4 carbon atoms, specifically ethanol, n-propanol, i-propanol, n-butanol, i-butanol, sec-butanol, and t-butanol, are even more preferred because their dispersibility, volatility, and viscosity are particularly suitable for applying the paste material. These monoalcohols may also be used alone or in combination.

The amount of solvent in 100% by mass of the paste material used to form the film is preferably 30% by mass or more and 95% by mass or less, more preferably 40% by mass or more and 95% by mass or less, and most preferably 50% by mass or more and 90% by mass or less.

The paste material used to form the film may further contain a reducing agent. When the paste material contains a reducing agent, particularly low resistance wiring is obtained, which is preferable. As the reducing agent, the above-mentioned hydrazine and/or hydrazine hydrate is preferable. The content of the reducing agent is preferably 0.01 mass% or more, or 0.02 mass% or more, or 0.05 mass% or more, and preferably 30 mass% or less, or 10 mass% or less, or 5 mass% or less, based on 100 mass% of the paste material.

<Characteristics of metal wiring>
The metal wiring produced in this embodiment may have the following exemplary characteristics.

In one aspect, the thickness of the metal wiring produced by the present disclosure may be preferably 0.1 μm or more, or 0.5 μm or more, or 1 μm or more, and may be preferably 20 μm or less, or 10 μm or less, or 8 μm or less.

In one embodiment, the surface of the metal wiring produced by the present disclosure may have holes having an opening area of 0.3 μm ² or more and 700 μm ² or less. From the viewpoint of reducing abnormalities occurring on the metal wiring, the opening area of the holes is in one embodiment 0.3 μm ² or more and 700 μm ² or less, preferably 0.3 μm ² or more and 600 μm ² or less, more preferably 0.5 μm ² or more and 500 μm ² or less.

In one embodiment, the area ratio of holes having an opening area of 0.3 ^μm2 or more and 700 μm2 or ^less to the surface area of the metal wiring is 0.5% or more and 70% or less. In one embodiment, the area ratio is 0.5% or more and 70% or less, preferably 1% or more and 50% or less, more preferably 1.5% or more and 30% or less, even more preferably 2% or more and 25% or less, even more preferably 2.5% or more and 20% or less, and even more preferably 3% or more and 20% or less, from the viewpoint of reducing abnormal parts occurring on the metal wiring.

When irradiated with laser light, the film usually shrinks in volume, but in metal wiring where the area ratio of the holes is within the above range, the stress caused by the film shrinking in volume when irradiated with laser light is alleviated, or the heat generated when irradiated with laser light is dissipated outside the film, so abnormalities such as cracks and partial scorching of the substrate can be reduced.

It is preferable that at least one hole having a cross-sectional area of 0.3 μm ² or more and 700 μm ² or less exists in the cross section of the metal wiring. From the viewpoint of reducing abnormal parts occurring on the metal wiring, the cross-sectional area of the hole is preferably 0.3 μm ² or more and 700 μm ² or less, more preferably 0.3 μm ² or more and 600 μm ² or less, and even more preferably 0.5 μm ² or more and 500 μm ² or less. When a hole exists in the cross-sectional direction of the metal wiring, the stress when the film shrinks in volume during laser light irradiation is relaxed, or the heat during laser light irradiation is dissipated outside the film, so that abnormal parts such as cracks and partial scorching of the substrate can be reduced.

The confirmation of the presence of holes having the above opening area or cross-sectional area and the calculation of the above area ratio are carried out using a scanning electron microscope (SEM) under the following conditions.
Measuring device: Scanning electron microscope (e.g., FlexSEM1000, manufactured by Hitachi High-Tech Corporation)
Measurement conditions: Acceleration voltage 5 kV
Measurement mode: Secondary electron observation (for surface observation), or backscattered electron observation (for cross-sectional observation)
Observation magnification: 2000x (for surface observation) or 2500x (for cross-sectional observation)
Field of view size for observation and image analysis: 40 μm × 40 μm (for surface observation), or a rectangle of [metal wiring thickness] × [length 40 μm in the direction perpendicular to the thickness direction]

The area of the holes and the above-mentioned area ratio are values obtained from the SEM image by image analysis using the analysis software ImageJ (open source, public domain image processing software). Specifically, the image is binarized (in one embodiment, the threshold value is 80) so that the holes can be identified, the area ratio between the holes and the non-hole parts is obtained, and the above-mentioned area ratio is calculated.

The size of the holes may be controlled by the scanning speed and spot diameter of the laser light when irradiating the laser light. Increasing the scanning speed of the laser light tends to increase the size of the holes, and decreasing the scanning speed of the laser light tends to decrease the size of the holes. In addition, increasing the spot diameter tends to increase the size of the holes, and decreasing the spot diameter tends to decrease the size of the holes.

The above-mentioned area ratio of the holes on the surface of the metal wiring may be controlled by the overlap rate when the laser light is irradiated in an overlapping manner as described above. A lower overlap rate tends to increase the area ratio, and a higher overlap rate tends to decrease the area ratio.

<Metal wiring manufacturing device, laser light irradiation control device, laser light irradiation control program>
One aspect of the present invention provides a metal wiring manufacturing apparatus for forming metal wiring in a structure including a substrate and a film containing a metal and/or metal oxide disposed on the substrate by irradiating a laser beam to a preset irradiation area of the film.
Another aspect of the present invention provides a laser oscillator and a laser beam scanning device of a metal wiring manufacturing apparatus for irradiating laser beams onto a preset irradiation area of a film containing a metal and/or metal oxide, as well as a laser beam irradiation control device that optionally controls mechanisms such as an output adjustment mechanism and a spot adjustment mechanism, and a laser beam control program.

11 is a schematic diagram showing an example of the configuration of the metal wiring manufacturing apparatus of this embodiment, and FIG. 12 is a block diagram showing an example of the configuration of the metal wiring manufacturing apparatus of this embodiment. Referring to FIGS. 11 and 12, in one embodiment, the metal wiring manufacturing apparatus 100 includes a structure holding unit 101 for holding a structure, a laser oscillation unit 102 for generating laser light, a laser light scanning unit 103 for scanning the laser light La emitted from the laser oscillation unit 102, and a processing unit 104 for controlling the laser oscillation unit 102 and the laser light scanning unit 103, and typically further includes a storage unit 105, a display unit 106, an input unit 107, and an interface unit 108, which is also one aspect of the output unit of the present disclosure. The metal wiring manufacturing apparatus 100 may further include mechanisms such as an output adjustment mechanism (not shown) and a spot adjustment mechanism (not shown). The form of the apparatus constituting the metal wiring manufacturing apparatus 100 is not limited, and each apparatus may constitute a separate device, or two or more apparatuses may constitute one device.

The processing device 104, together with the storage device 105, the display device 106, the input device 107, and the interface device 108, constitutes the laser light irradiation control device 400. The laser light irradiation control device 400 may be configured as dedicated hardware, or a program may be installed on a general-purpose computer to function as the laser light irradiation control device 400. The processing device 104 outputs a scanning control signal via the interface device 108 to the laser oscillation device 102 and the laser light scanning device 103, and optionally to mechanisms such as an output adjustment mechanism and a spot adjustment mechanism, to control the operation of these devices.

<Structure holding part 101>
The structure holder 101 holds the structure 11 including the base material 11a and the film 11b, and in one embodiment, is a sample chamber. The sample chamber may have a window. The window may be a window for the base material 11a. The window has a light transmittance that allows the laser light La to reach the film 11b arranged on the window. In one embodiment, the light transmittance of the window at a wavelength of 355 nm is 80% or more. The light transmittance is ideally 100%, but from the viewpoint of ease of forming the window portion, it may be, for example, 98% or less, or The light transmittance may be 95% or less. The light transmittance is a value measured by an ultraviolet-visible spectrophotometer. The sample chamber may have an inert gas inlet, for example, an inert gas generator ( The structure holder 101 may be configured to move the structure in three dimensional directions (X, Y, Z). Alternatively, a driving mechanism (such as a motor) for tilting may be provided.

<Laser Oscillation Device 102>
The laser oscillator 102 is configured to emit a laser beam of a desired wavelength. The laser oscillator 102 is, for example, a laser oscillator. The laser light source may be YAG (yttrium aluminum garnet), YVO4 (yttrium vanadate), Yb (ytterbium), a semiconductor (GaAs, GaAlAs, GaInAs), a fiber laser, carbon dioxide gas, or the like. As the laser beam, not only a fundamental wave but also a harmonic wave may be extracted as necessary. The laser oscillator may include a cooling device or the like. In one embodiment, the laser oscillator may be configured to emit a pulsed beam. The width of one pulse of the pulsed wave may be preferably 1 to 100 nanoseconds, or 2 to 50 nanoseconds, or 3 to 30 nanoseconds. In this case, the laser oscillator may include a pulse suppression mechanism that suppresses the initial pulse of the pulsed beam. The pulse suppression mechanism prevents the film from being irradiated with an excessively large pulsed beam at the start of emission, thereby preventing ablation or carbonization. The pulse suppression mechanism may have, for example, a first pulse suppression function (FPS function), that is, a function of predicting the excess output of the initial pulse in advance and reducing the excess output.

<Laser Light Scanning Device 103>
The laser beam scanning device 103 scans the laser beam La emitted from the laser oscillation device 102. In one aspect, the laser beam scanning device is a galvanometer scanner including a galvanometer motor and a galvanometer mirror, and FIG. 11 illustrates the galvanometer scanner. The galvanometer scanner as the laser beam scanning device 103 includes an X-axis galvanometer mirror 103a, an X-axis galvanometer motor 103b, a Y-axis galvanometer mirror 103c, and a Y-axis galvanometer motor 103d. The galvanometer scanner may include an fθ lens (not shown), a Z-axis adjustment drive lens (not shown), and the like. The X-axis galvanometer motor 103b and the Y-axis galvanometer motor 103d are electrically connected to the processing device 104.

The galvanometer scanner is configured to be able to control the rotation angle and rotation speed of the X-axis galvanometer motor 103b and the Y-axis galvanometer motor 103d in accordance with a scanning control signal from the processing device 104. The laser light La is scanned by the laser light scanning device 103 and irradiated onto the surface of the film 11b.

Although a galvanometer scanner has been exemplified as the laser light scanning device 103 above, laser light scanning devices other than a galvanometer scanner can also be used. For example, instead of a galvanometer scanner, the laser light scanning device 103 may use an X-Y stage as a mounting base that can move the structure 11 in both the X-axis and Y-axis directions, and move the structure 11 instead of moving the irradiation point p of the laser light La.

The galvanometer scanner as the laser light scanning device 103 shown in FIG. 11 uses an X-axis galvanometer mirror 103a and a Y-axis galvanometer mirror 103c for movement in the X-axis and Y-axis directions, respectively, but it is also possible to use a galvanometer mirror for either the X-axis or the Y-axis, for example, to use a galvanometer mirror for movement only in the X-axis direction and a motor of the mounting table (not shown) on which the structure 11 is placed for movement in the Y-axis direction.

<Output adjustment mechanism>
The metal wiring manufacturing apparatus may have an output adjustment mechanism (not shown) for adjusting the output of the laser light. By adjusting the output, it is possible to suppress ablation or carbonization during laser light irradiation. One example of the output adjustment mechanism is an attenuator disposed on the path of the laser light. The attenuator is electrically connected to the processing device 104, and can change the output value to an arbitrary value in response to a control signal from the processing device 104. Alternatively, the output adjustment mechanism may be configured so that the output value can be changed by manual operation.

<Spot adjustment mechanism>
The metal wiring manufacturing apparatus may have a spot adjustment mechanism (not shown) for adjusting the spot diameter at the focal position of the laser light. The spot adjustment mechanism prevents ablation or carbonization by controlling the concentration density of the laser light to adjust the spot diameter. An example of the spot adjustment mechanism is a device for expanding or contracting the diameter of the light beam incident on the galvano scanner, and for example, a beam expander can be used. By changing the diameter of the laser light, the spot diameter at the focal point focused by the focusing lens can be changed. By expanding the diameter of the laser light, the spot diameter becomes smaller, and by contracting the diameter of the laser light, the spot diameter becomes larger. In one aspect, the beam expander may be controlled according to the laser light irradiation position in the Z-axis direction.

<Processing device 104>
The processing device 104 is, for example, a central processing unit (CPU). The processing device 104 may be, for example, a digital signal processor (DSP), a large scale integration (LSI), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or the like.

The processing device 104 controls the laser oscillation device 102 and the laser light scanning device 103, and further controls the output adjustment mechanism and/or the spot adjustment mechanism if they are present. The processing device 104 outputs a scanning control signal according to a plurality of irradiation unit patterns and scanning parameters assigned to each of the plurality of irradiation unit patterns to the laser oscillation device 102 and the laser light scanning device 103, and to mechanisms such as an output adjustment mechanism and a spot adjustment mechanism, via an interface device 108 as an output unit. This causes the laser oscillation device 102 and the laser light scanning device 103, and to mechanisms such as an output adjustment mechanism and a spot adjustment mechanism, to operate so that the irradiation point p of the laser light La is moved in a second direction (for example, the Y-axis direction in FIG. 11) different from the first direction while scanning in a first direction (for example, the X-axis direction in FIG. 11) so as to fill the irradiation unit pattern.

In one embodiment, the processing device 104 functions as a coordinate data generating unit 410 and a scanning control signal generating unit 420 by reading each program stored in the storage device 105 and operating according to the read programs.

The coordinate data generation unit 410 distinguishes between a first closed figure, which is a parallelogram, and a second closed figure, which is not a parallelogram, from the input two-dimensional pattern for determining the irradiation area of the present disclosure, divides the second closed figure into two or more third closed figures by a division line, and generates coordinate data for each of the first and third closed figures as irradiation unit patterns.

In one embodiment, the coordinate data generation unit 410 has a pattern generation means 411, a closed figure shape determination means 412, a closed figure division means 413, a closed figure size evaluation means 414, and a data conversion means 415.

The scanning control signal generating unit 420 assigns preset scanning parameters to the coordinate data generated by the coordinate data generating unit 410, and generates a scanning control signal according to the coordinate data and the scanning parameters.

The interface device 108, which serves as an output unit, outputs the scanning control signal generated by the scanning control signal generating unit 420 to the laser oscillation device 102 and the laser light scanning device 103, as well as to any mechanism such as an output adjustment mechanism and a spot adjustment mechanism.

<Storage device 105>
The storage device 105 includes a memory device such as a RAM (Random Access Memory) or a ROM (Read Only Memory), a fixed disk device such as a hard disk, or a portable storage device such as a flexible disk or an optical disk. The storage device 105 also stores computer programs, databases, tables, and the like used for various processes of the metal wiring manufacturing apparatus 100 or the laser light irradiation control device 400. The computer programs may be installed in the storage device 105 from a computer-readable portable recording medium using a known setup program or the like. The portable recording medium is, for example, a CD-ROM (compact disc read only memory), a DVD-ROM (digital versatile disc read only memory), or the like.

The storage device 105 stores a laser light irradiation control program consisting of a coordinate data generation program, a scan control signal generation program, and a scan control signal output program. Each of these programs is a functional module implemented by software running on a processor. The program stored in the storage device 105 causes the laser light irradiation control device to distinguish a first closed figure, which is a parallelogram, from a second closed figure other than a parallelogram from the input two-dimensional pattern for determining an irradiation area of the present disclosure, divide the second closed figure into two or more third closed figures by a division line, generate coordinate data for each of the first and third closed figures as irradiation unit patterns, assign preset scanning parameters to the coordinate data, generate a scan control signal according to the coordinate data and the scan parameters, and output a scan control signal.

<Display device 106, input device 107, interface device 108>
The display device 106 may be a display (such as an organic EL display) or the like, and displays information input to the input device 107, the state of the processing device 104, and the like.
The input device 107 may be an input device such as a keyboard or a mouse, and accepts input from a user.
The interface device 108 may be a hardware interface such as a USB, a network interface such as a wired LAN (Local Area Network) or a wireless LAN, etc., and enables communication between the laser oscillation device 102 and the laser light scanning device 103 as well as any other mechanisms and the processing device 104.

<Laser Light Irradiation Control Processing>
13A to 13D are flow charts for explaining the processing executed by the laser light irradiation control program of this embodiment. Below, examples of the operations of the metal wiring manufacturing apparatus 100 and the laser light irradiation control device 400 will be explained with reference to the flow charts shown in Figs. 13A to 13D. The flow of operations explained below is executed mainly by the processing device 104 in cooperation with each element of the metal wiring manufacturing apparatus 100 based on a program stored in advance in the storage device 105.

First, the pattern generating means 411 generates a two-dimensional pattern for determining the irradiation area (step S101). The two-dimensional pattern for determining the irradiation area is generated by input from an external device in which two-dimensional pattern information for determining the irradiation area is stored in advance, input by a user's drawing, or reading out two-dimensional pattern information for determining the irradiation area that is stored in advance in the storage device 105.

In one embodiment, the two-dimensional pattern for determining the irradiation area may be generated by the following procedure. Referring to FIG. 13B, the pattern generating means 411 first generates a two-dimensional base pattern having an X-axis length A1 and a Y-axis length B1 (step S11), and generates an XYZ three-dimensional shape pattern of the film surface (step S12). The XYZ three-dimensional shape pattern may be generated based on shape information acquired by an image recognition device such as an image sensor. Next, the pattern generating means 411 projects the two-dimensional base pattern onto the XYZ three-dimensional shape pattern to generate a three-dimensional pattern for determining the irradiation area (step S13), measures the length B2 of the three-dimensional pattern for determining the irradiation area in a direction perpendicular to the X-axis direction (step S14), and multiplies the Y-axis length B1 of the two-dimensional base pattern by B1/B2 to generate a reduced correction pattern (step S15), completing the series of steps. This reduced correction pattern is the two-dimensional pattern for determining the irradiation area.

Referring again to FIG. 13A, after step S101, the closed figure shape determination means 412 distinguishes the closed figures constituting the two-dimensional pattern for determining the irradiation area into a first closed figure that is a parallelogram and a second closed figure that is not a parallelogram (step S102).

After step S102, the closed figure division means 413 divides the second closed figure into two or more third closed figures by division lines (step S103). Figures 12C and 12D are flowcharts showing an example of the processing performed in step S103.

Referring to FIG. 12C, in one example, the closed figure division means 413 first identifies the maximum span direction D of the second closed figure (step S311), then specifies the direction that will be the width direction d of the third closed figure (step S312), then specifies a division line (step S313), then divides the second closed figure according to the division line (S314), and ends the series of steps. In this example, after specifying the width direction d, the division line is specified so that Δd in the width direction d of the third closed figure is smaller than ΔD in the maximum span direction D of the second closed figure.

Referring to FIG. 12D, in another example, the closed figure division means 413 first identifies the maximum span direction D (step S321), then specifies a division line (step S322), then specifies a direction that will be the width direction d of the third closed figure (step S323), then divides the second closed figure along the division line (step S324), and ends the series of steps. In this example, after specifying the division line, the width direction d is specified so that Δd of the third closed figure generated by the division line is smaller than ΔD of the second closed figure.

In step S103, the user may perform one or more of the following: identifying the maximum span direction D of the second closed figure, specifying the direction that will be the width direction d of the third closed figure, specifying a division line, and dividing the second closed figure according to the division line. In step S103 according to one embodiment, the closed figure division means 413 outputs shape data of the second closed figure and obtains shape data of the third closed figure.

Following step S103, the closed figure size evaluation means 414 determines whether the value of Δd of the third closed figure is smaller than the value of ΔD of the second closed figure (step S104). If Δd is smaller than ΔD, the third closed figure and each of the first closed figures, if any, are generated as a two-dimensional irradiation unit pattern (step S105). On the other hand, if Δd is not smaller than ΔD, the process returns to step S103, and the closed figure division means 413 executes division of the closed figure.

After step S105, the pattern generating means 411 determines whether or not to project the irradiation unit pattern onto the three-dimensional shape pattern of the film surface based on the settings of the coordinate data generating program or input from the user (step S106).

If projection processing is performed in step S106, the pattern generating means 411 generates a three-dimensional shape pattern of the film surface (step S107), and projects the irradiation unit pattern onto the three-dimensional shape pattern to generate a three-dimensional irradiation unit pattern (step S108). The three-dimensional shape pattern may be generated based on shape information acquired by an image recognition device such as an image sensor, but if a three-dimensional shape pattern of the film surface has already been generated in the above-mentioned step S11, that pattern may be used.

The data conversion means 415 acquires the data of the three-dimensional irradiation unit pattern generated in step S108, converts it into coordinate data, and generates coordinate data indicating the three-dimensional irradiation unit pattern (step S109).

On the other hand, if no projection processing is performed in step S106, the data conversion means 414 acquires the data of the two-dimensional irradiation unit pattern generated in step S105, converts it into coordinate data, and generates coordinate data indicating the two-dimensional irradiation unit pattern (step S109).

In one embodiment, the processes of steps S106 to S108 are omitted, and the pattern generating means 411 does not need to determine whether or not to project the scanning area pattern onto the three-dimensional shape pattern of the film surface.

By the above processing, an irradiation unit pattern is generated that is composed of a third closed figure generated by dividing a second closed figure other than a parallelogram by a division line, and, optionally, a first closed figure that is a parallelogram, and the division line is a line segment that divides the second closed figure such that Δd in a pre-specified width direction d of the multiple third closed figures is smaller than ΔD in the maximum span direction D of the second closed figure.

Next, the scanning control signal generating unit 420 generates scanning parameters that define the laser light irradiation conditions by input from an external device in which scanning parameter information is previously stored, input from the user, reading out scanning parameter information previously stored in the storage device 105, etc. (step S110), and generates a scanning control signal by assigning the scanning parameters to the coordinate data generated in step S109 (step S111). The interface device 108 as an output unit outputs the generated scanning control signal to the laser oscillation device 102 and laser light scanning device 103 of the metal wiring manufacturing device 100, and optionally to mechanisms such as an output adjustment mechanism and a spot adjustment mechanism (step S112), completing the series of steps.

Note that in the metal wiring manufacturing apparatus, laser light irradiation control device, and laser light control program disclosed herein, specific examples of various aspects other than those described above (e.g., generation of irradiation unit patterns using division lines, details of scanning parameters, etc.) may be similar to those described above in <Metal wiring manufacturing method>, and the description will not be repeated here.

<Recording media or recording devices>
One aspect of the present invention also provides a computer-readable recording medium or recording device that stores the laser light irradiation control program of the present disclosure. The computer may have a general hardware configuration including a CPU, a main memory, a storage, an input/output device, a hardware interface, and the like. The recording medium may be a memory device such as a RAM or a ROM, or a portable storage device such as a CD-ROM, a DVD-ROM, or an optical disk. The above program includes those that are stored in the recording medium and distributed, as well as those that are distributed by downloading through a network line such as the Internet. The recording device may be a general-purpose or dedicated device in which the above program is implemented in an executable state in the form of software, firmware, or the like. Each process and function included in the program may be executed by a program software that can be executed by a computer, or the process of each part may be realized by a predetermined hardware, or a form in which the program software and a partial hardware module that realizes some elements of the hardware are mixed.

The following examples further illustrate exemplary aspects of the present invention, but the present invention is not limited to these examples.

[Example 1]
(Preparation of Paste Material)
80 g of copper(II) acetate monohydrate (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) was dissolved in a mixed solvent consisting of 800 g of water and 400 g of 1,2-propylene glycol (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.), 20 g of hydrazine hydrate (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) was added, and the mixture was stirred, and then separated into a supernatant and a precipitate by centrifugation.

0.4 g of DISPERBYK-145 (product name, manufactured by BYK-Chemie) (BYK-145) as a phosphorus-containing organic compound and 6.6 g of ethanol (manufactured by Fujifilm Wako Pure Chemical Industries) as a dispersion medium were added to 2.8 g of the obtained precipitate, and dispersed using a homogenizer. Dilution and concentration with ethanol were further repeated, thereby obtaining a paste material containing cuprous oxide fine particles including cuprous oxide (copper(I) oxide). The final composition was 2.8 g of precipitate, 0.4 g of BYK-145, 6.6 g of ethanol, and 0.01 g of hydrazine hydrate.

(Membrane formation)
A polycarbonate substrate was prepared as a base material, and the surface was subjected to UV ozone treatment. The paste material was then spin-coated (500 rpm x 30 seconds), dried at 25°C for 10 minutes, and then dried at 60°C for 2 hours to obtain Structure 1 in which a film having a thickness of 3.0 μm was formed on the base material.

(Preparation of metal wiring manufacturing equipment)
A metal wiring manufacturing apparatus was prepared, which consisted of a Talon 355 manufactured by SpectraPhysics Co., Ltd. as a laser oscillator, a YD-300 manufactured by Yaskawa Electric Co., Ltd. as a galvanometer scanner, a SUF-500 manufactured by Satako Co., Ltd. as a nitrogen generator, a glass window portion attached to one side of a box-shaped sample chamber made of aluminum alloy A5052, a nitrogen gas inlet and an exhaust gas outlet, and an oxygen concentration meter disposed inside the sample chamber, and a ZBook 15 G5 manufactured by Hewlett-Packard Co. as a computer. The light transmittance of the glass of the window portion at a wavelength of 355 nm was measured using an ultraviolet-visible spectrophotometer (UV-3600 manufactured by Shimadzu Corporation), and was 92.2%.

The metal wiring manufacturing device described above was equipped with an attenuator that could be controlled by a computer, which adjusted the output of the laser light. The laser oscillator also had an internal FPS function that prevented an excessively large initial pulse from being generated at the start of emission. Furthermore, a beam expander was provided at a position before the laser light was introduced into the galvano scanner, and the size of the spot diameter at the focal position was controlled by expanding or reducing the diameter of the laser light.

(Installation of sample)
Structure 1 was placed in the sample chamber. Nitrogen gas, which is an inert gas, was allowed to flow into the sample chamber until the oxygen concentration measured by an oxygen concentration meter installed in the sample chamber reached 1 mass % or less.

(Laser beam firing)
The L-shaped closed figure pattern shown in FIG. 14A is divided by a division line L into closed figure pattern a and closed figure pattern b.
For the closed figure pattern a, the scanning parameters were set by the software so that the irradiation position of the laser light was moved 1 mm in the scanning direction (direction parallel to the division line) at a maximum speed of 30 mm/sec (first irradiation), then moved 30 μm in the direction perpendicular to the scanning direction, and moved again at a maximum speed of 30 mm/sec in the scanning direction (second irradiation). Other scanning parameters were (center wavelength 355 nm, frequency 300 kHz, pulse width 15 ns, power 550 mW, power density 0.03 mW/ ^μm2 ).
For the closed figure pattern b, the scanning parameters were set by the software so that the irradiation position of the laser light was moved 5 mm in the scanning direction (direction perpendicular to the division line) at a maximum speed of 30 mm/sec (first irradiation), then moved 30 μm in the direction perpendicular to the scanning direction, and moved again in the scanning direction at a maximum speed of 30 mm/sec (second irradiation). Other scanning parameters were central wavelength 355 nm, frequency 300 kHz, pulse width 15 ns, output 950 mW, and output density 0.06 mW/ ^μm2 .

By irradiating the area of closed figure pattern a and then the area of closed figure pattern b with laser light under the above laser light irradiation conditions, a copper-containing metal wiring having the dimensions shown in Figure 14A was obtained.

(Conductivity evaluation)
The conductivity of the obtained metal wiring was evaluated using a digital multimeter AD7461 (manufactured by ADVANTEST Co., Ltd.) For the evaluation, the metal wiring was cut into part c and part d along the cutting line C shown in FIG.
The resistance value of part c (6 mm x 3 mm) was evaluated by a four-terminal measurement method with a tester placed on both ends in the longitudinal direction, and was 0.41 Ω (average value of three measurements). The volume resistivity was 30.8 μΩcm.
The resistance value of part d (2 mm x 1 mm) was evaluated by a four-terminal measurement method with a tester placed on both ends in the longitudinal direction, and was found to be 0.40 Ω (average value of three measurements). The volume resistivity was 30.0 μΩcm.
Part c and part d showed almost the same volume resistivity, confirming that metal wiring with little resistance variation was obtained.

(Overlap rate)
The spot diameter of the laser light used in Example 1 was measured using a beam profiler SP928 manufactured by Ophir Corp., and was found to be 142 μm in diameter. The overlap rate of the scanning lines when scanning in Example 1 was calculated to be 78.9%.

[Comparative Example 1]
Samples were fabricated and resistance values were measured in the same manner as in Example 1, except for the setting of the laser light irradiation pattern.
For the L-shaped closed figure pattern shown in Fig. 14A, without dividing it by a dividing line, the scanning parameters were set by the software so that the irradiation position of the laser light was moved 6 mm in the scanning direction (longitudinal direction) at a maximum speed of 30 mm/sec (first irradiation) from point p as the starting point, then moved 30 μm in the direction perpendicular to the scanning direction and moved again at a maximum speed of 30 mm/sec in the scanning direction (second irradiation). In this way, it was moved 3 mm in the direction perpendicular to the scanning direction.
Next, the scanning parameters were set by the software so that the irradiation position of the laser light was moved 1 mm in the scanning direction at a maximum speed of 30 mm/sec, then moved 30 μm in the direction perpendicular to the scanning direction, and then moved again in the scanning direction at a maximum speed of 30 mm/sec. Other scanning parameters were (central wavelength 355 nm, frequency 300 kHz, pulse width 15 ns, power 950 mW, power density 0.06 mW/ ^μm2 ).
Under the above laser light irradiation conditions, a copper-containing metal wiring having the dimensions shown in FIG. 14A was obtained.

The conductivity of the obtained metal wiring was evaluated using a digital multimeter AD7461 (manufactured by ADVANTEST Co., Ltd.) For the evaluation, the metal wiring was cut into part d and part d along the cutting line C shown in FIG.
The resistance value of part c (6 mm x 3 mm) was evaluated by a four-terminal measurement method with a tester placed on both ends in the longitudinal direction, and was 0.42 Ω (average value of three measurements). The volume resistivity was 31.5 μΩ cm.
The film in part d (2 mm x 1 mm) had been blown away, making it impossible to measure the resistance.

[Example 2]
For the closed figure pattern a, the spot diameter of the laser beam used was 33 μm, the output was 80 mW, and the output density ^was 0.09 mW/μm2, and for the closed figure pattern b, the spot diameter of the laser beam used was 33 μm, the output was 155 mW, and the output density was 0.18 mW/μm2 ^. Except for this, the formation of metal wiring, the evaluation of the spot diameter and overlap rate, and the evaluation of electrical conductivity were performed in the same manner as in Example 1. The overlap rate of the scanning lines was calculated to be 9.1%.
The resistance value of part c (6 mm x 3 mm) was evaluated by a four-terminal measurement method with a tester placed on both ends in the longitudinal direction, and was 1.01 Ω (average value of three measurements). The volume resistivity was 75.8 μΩcm.
The resistance value of part d (2 mm x 1 mm) was evaluated by a four-terminal measurement method with a tester placed on both ends in the longitudinal direction, and was found to be 1.52 Ω (average value of three measurements). The volume resistivity was 114 μΩ cm.
Although a difference in volume resistivity was observed between part c and part d, it was confirmed that metal wiring with relatively little variation in resistance was obtained.

[Example 3]
The formation of metal wiring, evaluation of the spot diameter and overlap rate, and evaluation of electrical conductivity were carried out in the same manner as in Example 2, except that the value of the movement in the direction perpendicular to the scanning direction was set to 20 μm.
The overlap rate of the scan lines was calculated to be 39.4%.
The resistance value of part c (6 mm x 3 mm) was evaluated by a four-terminal measurement method with a tester placed on both ends in the longitudinal direction, and was found to be 0.30 Ω (average value of three measurements). The volume resistivity was 22.5 μΩ cm.
The resistance value of part d (2 mm x 1 mm) was evaluated by a four-terminal measurement method with a tester placed on both ends in the longitudinal direction, and was found to be 0.32 Ω (average value of three measurements). The volume resistivity was 24.0 μΩcm.
Part c and part d showed almost the same volume resistivity, confirming that metal wiring with little resistance variation was obtained.

[Example 4]
For the closed figure pattern a, the spot diameter of the laser light used was 142 μm, the output was 350 mW, and the output density was 0.02 mW/μm2 ^. For the closed figure pattern b, the spot diameter of the laser light used was 142 μm, the output was 700 mW, the output density was 0.04 mW/ ^μm2 , and the movement value in the direction perpendicular to the scanning direction was 1 μm. The formation of metal wiring, evaluation of spot diameter and overlap rate, and conductivity evaluation were performed in the same manner as in Example 1, except that for each of the closed figure pattern a, the spot diameter of the laser light used was 142 μm, the output was 700 mW, the output density was 0.04 mW/μm2, and the movement value in the direction perpendicular to the scanning direction was 1 μm.
The overlap rate of the scan lines was calculated to be 99.3%.
The resistance value of part c (6 mm x 3 mm) was evaluated by a four-terminal measurement method with a tester placed on both ends in the longitudinal direction, and was found to be 1.55 Ω (average value of three measurements). The volume resistivity was 116.3 μΩcm.
The resistance value of part d (2 mm x 1 mm) was evaluated by a four-terminal measurement method with a tester placed on both ends in the longitudinal direction, and was found to be 2.39 Ω (average value of three measurements). The volume resistivity was 179.3 μΩ cm.
Although a difference in volume resistivity was observed between part c and part d, it was confirmed that metal wiring with relatively little variation in resistance was obtained.

[Example 5]
(Generation step of irradiation unit pattern)
Metal wiring was produced in the same manner as in Example 1, except that the closed figure pattern shown in Fig. 6A was used for metal wiring formation. At this time, the diameter of the circle in Fig. 6A was set to 10 mm, and the number of division lines was set to 3. Next, the positions of the division lines were set so that the difference between the maximum width and the minimum width of each closed figure in the direction perpendicular to the division lines was minimized, and the dmax at this time was almost the same for each closed figure, being 3.26 mm.

(Conductivity evaluation)
The conductivity of the obtained metal wiring was evaluated using a digital multimeter AD7461 (manufactured by ADVANTEST Co., Ltd.) For the evaluation, the metal wiring was cut into parts 4a, 4b, 4c, and 4d along parting lines L1, L2, and L3 shown in FIG.
When a tester was placed on both ends of part 4a in the longitudinal direction and the resistance value was evaluated by a four-terminal measurement method, it was 1.12 Ω (average value of three measurements).
Similarly, parts 4b, 4c, and 4d were also evaluated, and the values were 1.21 Ω for part 4b (average value of three measurements), 1.26 Ω for part 4c (average value of three measurements), and 1.08 Ω for part 4d (average value of three measurements).
Parts 4a to 4d showed approximately the same resistance value, confirming that metal wiring with little resistance variation was obtained.

[Example 6]
(Irradiation unit pattern generation step)
Metal wiring was produced in the same manner as in Example 1, except that the closed figure pattern shown in Figures 7A and 7B was used for metal wiring formation. In this case, the closed figure 5 had a length of 10 mm in the maximum span direction D and a length of 6 mm in the direction perpendicular to the maximum span direction D. Partition lines L1 to L5 were set, and maximum inscribed rectangles R1 to R5 that contact the insides of the closed figures 5b to 5f were set. In this case, the short side lengths s1 to s5 were 1 mm.

(Parameter assignment step and irradiation step)
For the maximum inscribed rectangle R1 to R5, the laser light irradiation position was moved 1 mm in the first direction, which is the short side direction (width direction db to df), at a maximum speed of 25 mm/sec (first irradiation), then moved 30 μm in the second direction, which is the long side direction (maximum diagonal direction D), and moved again in the first direction at a maximum speed of 25 mm/sec (second irradiation), so that the scanning parameters were set by the software to fill the entire rectangle. Other scanning parameters were (center wavelength 355 nm, frequency 300 kHz, pulse width 15 ns, output 219 mW, output density 0.11 mW/μm ² ). Under the above laser light irradiation conditions, the laser light was irradiated to the area of the maximum inscribed rectangle R1, then the area of the maximum inscribed rectangle R2, and so on up to the maximum inscribed rectangle R5, thereby obtaining a copper-containing metal wiring having the dimensions shown in FIG. 7B.

(Conductivity evaluation)
The conductivity of the obtained metal wiring was evaluated using a digital multimeter AD7461 (manufactured by ADVANTEST Co., Ltd.). For the evaluation, the metal wiring was cut into two equal parts along a line passing through the midpoint of the short side length s3 of the maximum inscribed figure R3 and parallel to the maximum span direction D. For one side of the maximum inscribed figure R1 side from the cutting line, a tester was applied to both ends of the maximum span direction D to evaluate the resistance value by a four-terminal measurement method, which was 0.34Ω (average value of three measurements). For the other side of the maximum inscribed figure R5 side from the cutting line, a tester was applied to both ends of the maximum span D to evaluate the resistance value by a four-terminal measurement method, which was 0.29Ω (average value of three measurements).
It was confirmed that both exhibited approximately the same volume resistivity, resulting in metal wiring with little resistance variation.

The metal wiring obtained by one embodiment of the present invention can be suitably used to produce wiring materials for electronic circuit boards, mesh electrodes, electromagnetic shielding materials, and heat dissipation materials.

1 First closed figure 2, 3, 4, 5 Second closed figure 2a, 2b, 3a, 3b, 3c, 3d, 4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 5a, 5b, 5c, 5d, 5e, 5f Third closed figure 80 Two-dimensional base pattern 81 Three-dimensional shape pattern of film surface 82 Three-dimensional pattern P for determining irradiation area Two-dimensional pattern P1, P2 for determining irradiation area Part P3 Irradiation unit pattern group L, L1, L2, L3, L4, L5 Partition line R1, R2, R3, R4, R5 Maximum inscribed rectangle D Maximum span direction da, db, dc, dd, de, df, dg, dh Width direction Dmax, dmax Maximum width Dmin, dmin Minimum width R Irradiation area 11 Structure 11a Substrate 11b Film 100 Metal wiring manufacturing apparatus 101 Structure holding unit 102 Laser oscillation apparatus 103 Laser light scanning apparatus 103a X-axis galvanometer mirror 103b X-axis galvanometer motor 103c Y-axis galvanometer mirror 103d Y-axis galvanometer motor 104 Processing apparatus 400 Laser light irradiation control apparatus

Claims (45)

A method for manufacturing a metal wiring, comprising: a laser light irradiation step of forming a metal wiring by irradiating a laser light to a predetermined irradiation area of a film containing a metal and/or a metal oxide,
The laser light irradiation step includes the following steps:
a division step of dividing a closed figure of a two-dimensional pattern for determining an irradiation region, which is created in advance and is composed of one or more closed figures, into a first closed figure which is a parallelogram and a second closed figure which is other than a parallelogram, thereby generating the second closed figure and an arbitrary first closed figure;
an irradiation unit pattern generating step of dividing the second closed figure into two or more third closed figures by a dividing line, and generating each of the third closed figures and each of the first closed figures, if any, as an irradiation unit pattern;
a parameter assignment step of assigning preset scanning parameters to each irradiation unit pattern; and an irradiation step of irradiating the irradiation area with laser light by scanning a spot of laser light in a first direction while moving the spot in a second direction different from the first direction so as to fill each irradiation unit pattern in accordance with the irradiation unit pattern and the scanning parameters;
Including,
The method, wherein the dividing line is a line segment that divides the second closed figure such that a difference Δd between a maximum width dmax and a minimum width dmin of a plurality of the third closed figures in a pre-specified width direction d is smaller than a difference ΔD between a maximum width Dmax and a minimum width Dmin of the second closed figure in a maximum span direction D. The method according to claim 1, wherein the film subjected to the laser light irradiation step is formed on a substrate. The method according to claim 2, wherein the film subjected to the laser light irradiation step is a coating film formed on the substrate. The method according to any one of claims 1 to 3, wherein the width direction d is perpendicular or parallel to the parting line. The method according to any one of claims 1 to 4, wherein in the irradiation unit pattern generation step, the number of division lines is specified for each second closed figure, and then the division lines are specified so that the difference between the maximum width and the minimum width of the third closed figure in the direction perpendicular to the division lines is minimized. The method according to any one of claims 1 to 5, wherein the dividing line generates, from each second closed figure, a plurality of third closed figures each having substantially the same dmax and/or Δd. In each second closed figure,
the dividing line is two or more line segments parallel to the maximum span direction D and constitutes a part or all of a long side of a maximum inscribed rectangle of the third closed figure,
The method according to any one of claims 1 to 6, wherein the short side lengths of the maximum inscribed rectangles are approximately the same. The first direction is
The method according to any one of claims 1 to 7, wherein the direction of the dividing line is a long or short side direction of the first closed figure, if present, and a direction perpendicular or parallel to the dividing line of the second closed figure. The method according to any one of claims 1 to 8, wherein the ratio of the minimum scanning length to the maximum scanning length of each irradiation unit pattern is 0.25 or more and 1.0 or less. The method according to any one of claims 1 to 9, wherein the irradiation area is an area obtained by projecting the irradiation unit pattern onto a three-dimensional shape pattern of the film surface that has been previously acquired. The method according to any one of claims 1 to 10, wherein the two-dimensional pattern for determining the irradiation region is generated by generating a three-dimensional pattern for determining the irradiation region on a three-dimensional shape pattern of the film surface previously acquired, and then projecting the three-dimensional pattern for determining the irradiation region two-dimensionally. The two-dimensional pattern for determining an irradiation region is
A two-dimensional base pattern previously generated on an XY plane is projected onto a previously acquired XYZ three-dimensional shape pattern of the film surface to generate a three-dimensional pattern for determining an irradiation region;
Measuring a dimension B1 of a span portion B in the Y-axis direction on the two-dimensional base pattern;
Measuring a dimension B2 of a projection portion of the span portion B on the three-dimensional pattern for determining an irradiation region;
multiplying the dimension B1 of the two-dimensional base pattern by B1/B2 to generate a reduced correction pattern;
is a reduced correction pattern generated by
The method according to any one of claims 1 to 10, wherein in the irradiating step, an X-axis direction is designated as the first direction and a Y-axis direction is designated as the second direction. The method according to any one of claims 1 to 12, wherein the scanning parameters include one or more selected from the group consisting of laser scanning speed, laser output intensity, and laser spot diameter. The method according to any one of claims 1 to 13, wherein the laser light is scanned while overlapping in the line width direction of the scanning line. The method of claim 14, wherein the overlap is greater than or equal to 10% and less than or equal to 99% of the line width. The method according to any one of claims 1 to 15, wherein the film comprises copper and/or copper oxide. The method according to any one of claims 1 to 16, wherein the membrane further comprises a dispersant. 1. A metal wiring manufacturing apparatus for forming metal wiring by irradiating a laser beam to a preset irradiation area of a film in a structure including a film containing a metal and/or metal oxide, comprising:
The metal wiring manufacturing apparatus comprises:
a structure holder that holds the structure;
A laser oscillator that generates laser light;
A laser beam scanning device that scans the laser beam emitted from the laser oscillation device; and a processing device that controls the laser oscillation device and the laser beam scanning device.
Equipped with
The processing device comprising:
outputting a scanning control signal according to a plurality of irradiation unit patterns and scanning parameters assigned to each of the plurality of irradiation unit patterns to the laser oscillation device and the laser light scanning device, and operating the laser oscillation device and the laser light scanning device so as to move a spot of laser light in a second direction different from the first direction while scanning the spot of laser light in a first direction so as to fill the irradiation unit pattern;
the irradiation unit pattern is composed of a third closed figure generated by dividing a second closed figure other than a parallelogram by a division line, and optionally, a first closed figure that is a parallelogram;
the dividing line being a line segment dividing the second closed figure such that a difference Δd between a maximum width dmax and a minimum width dmin of the plurality of third closed figures in a pre-specified width direction d is smaller than a difference ΔD between a maximum width Dmax and a minimum width Dmin of the second closed figure in a maximum span direction D. The metal wiring manufacturing apparatus according to claim 18, wherein the laser light scanning device is a galvanometer scanner equipped with a galvanometer motor and a galvanometer mirror. The metal wiring manufacturing apparatus according to claim 18 or 19, wherein the scanning parameters include one or more selected from the group consisting of laser scanning speed, laser output intensity, and laser spot diameter. A laser light irradiation control device that controls a laser oscillation device and a laser light scanning device of a metal wiring manufacturing apparatus to irradiate a laser light to a preset irradiation area of a film containing a metal and/or metal oxide,
a coordinate data generating unit that distinguishes a first closed figure, which is a parallelogram, from a second closed figure, which is a shape other than a parallelogram, from the input two-dimensional pattern for determining an irradiation region, divides the second closed figure into two or more third closed figures by a division line, and generates coordinate data for each of the first and third closed figures as irradiation unit patterns;
a scanning control signal generating unit that assigns preset scanning parameters to the coordinate data and generates a scanning control signal according to the coordinate data and the scanning parameters;
an output unit that outputs the scanning control signal to a laser oscillator and a laser beam scanning device;
a dividing line that divides the second closed figure such that a difference Δd between a maximum width dmax and a minimum width dmin of a plurality of the third closed figures in a pre-specified width direction d is smaller than a difference ΔD between a maximum width Dmax and a minimum width Dmin of the second closed figure in a maximum span direction D of the second closed figure. The laser light irradiation control device according to claim 21, wherein the width direction d is perpendicular or parallel to the division line. The laser light irradiation control device according to claim 21 or 22, which specifies the number of division lines for each second closed figure, and then specifies the division lines so that the difference between the maximum width and the minimum width of the third closed figure in the direction perpendicular to the division lines is minimized. The laser light irradiation control device according to any one of claims 21 to 23, wherein the dividing line generates a plurality of third closed figures from each second closed figure, the dmax and/or the Δd being substantially the same as each other. In each second closed figure,
the dividing line is two or more line segments parallel to the maximum span direction D and constitutes a part or all of a long side of a maximum inscribed rectangle of the third closed figure,
The laser light irradiation control device according to any one of claims 21 to 24, wherein the short side lengths of the maximum inscribed rectangles are substantially the same. The scanning parameters include a scanning direction, the scanning direction being:
The laser light irradiation control device according to any one of claims 21 to 25, wherein the direction of the long side or short side of the first closed figure, if present, is perpendicular or parallel to the dividing line of the second closed figure. A laser light irradiation control device according to any one of claims 21 to 26, wherein the ratio of the minimum scanning length to the maximum scanning length of each irradiation unit pattern is 0.25 or more and 1.0 or less. The laser light irradiation control device according to any one of claims 21 to 27, wherein the irradiation area is an area formed by projecting the irradiation unit pattern onto a three-dimensional shape pattern of the film surface that has been previously acquired. The laser light irradiation control device according to any one of claims 21 to 28, wherein the two-dimensional pattern for determining the irradiation area is generated by generating a three-dimensional pattern for determining the irradiation area on a three-dimensional shape pattern of the film surface acquired in advance, and then projecting the three-dimensional pattern for determining the irradiation area in two dimensions. The two-dimensional pattern for determining an irradiation region is
A two-dimensional base pattern previously generated on an XY plane is projected onto a previously acquired XYZ three-dimensional shape pattern of the film surface to generate a three-dimensional pattern for determining an irradiation region;
Measuring a dimension B1 of a span portion B in the Y-axis direction on the two-dimensional base pattern;
Measuring a dimension B2 of a projection portion of the span portion B on the three-dimensional pattern for determining an irradiation region;
multiplying the dimension B1 of the two-dimensional base pattern by B1/B2 to generate a reduced correction pattern;
is a reduced correction pattern generated by
The laser light irradiation control device according to any one of claims 21 to 28, wherein the X-axis direction is the direction of the scanning length of the laser light, and the Y-axis direction is the direction of the scanning width of the laser light. The laser light irradiation control device according to any one of claims 21 to 30, wherein the scanning parameters include one or more selected from the group consisting of laser scanning speed, laser output intensity, and laser spot diameter. A laser light irradiation control program for controlling a laser oscillator and a laser light scanner of a metal wiring manufacturing apparatus in order to irradiate a laser light onto a preset irradiation region of a film containing a metal and/or metal oxide, comprising:
Distinguishing a first closed figure, which is a parallelogram, from a second closed figure, which is a shape other than a parallelogram, from the input two-dimensional pattern for determining an irradiation region, dividing the second closed figure into two or more third closed figures by a dividing line, and generating respective coordinate data for the first and third closed figures as irradiation unit patterns;
Assigning preset scanning parameters to the coordinate data;
generating a scan control signal according to the coordinate data and the scan parameters;
outputting the scanning control signal;
and making the laser light irradiation control device execute the above steps,
a dividing line that divides the second closed figure such that a difference Δd between a maximum width dmax and a minimum width dmin of a plurality of the third closed figures in a pre-specified width direction d is smaller than a difference ΔD between a maximum width Dmax and a minimum width Dmin of the second closed figure in a maximum span direction D. The laser light irradiation control program according to claim 32, wherein the width direction d is perpendicular or parallel to the parting line. The laser light irradiation control program according to claim 32 or 33, which specifies the number of division lines for each second closed figure, and then specifies the division lines so that the difference between the maximum width and the minimum width of the third closed figure in a direction perpendicular to the division lines is minimized. The laser light irradiation control program according to any one of claims 32 to 34, wherein the dividing line generates a plurality of third closed figures from each second closed figure, the dmax and/or the Δd being substantially the same. In each second closed figure,
the dividing line is two or more line segments parallel to the maximum span direction D and constitutes a part or all of a long side of a maximum inscribed rectangle of the third closed figure,
The laser light irradiation control program according to any one of claims 32 to 35, wherein the short side lengths of the maximum inscribed rectangles are substantially the same. The scanning parameters include a scanning direction, the scanning direction being:
The laser light irradiation control program according to any one of claims 32 to 36, wherein the dividing line is in a long side direction or a short side direction of the first closed figure if the first closed figure exists, and is perpendicular or parallel to the dividing line of the second closed figure. The laser light irradiation control program according to any one of claims 32 to 37, wherein the ratio of the minimum scanning length to the maximum scanning length of each irradiation unit pattern is 0.25 or more and 1.0 or less. The laser light irradiation control program according to any one of claims 32 to 38, wherein the irradiation area is an area obtained by projecting the irradiation unit pattern onto a three-dimensional shape pattern of a film surface that has been previously acquired. The laser light irradiation control program according to any one of claims 32 to 39, wherein the two-dimensional pattern for determining the irradiation area is generated by generating a three-dimensional pattern for determining the irradiation area on a three-dimensional shape pattern of the film surface previously acquired, and then projecting the three-dimensional pattern for determining the irradiation area two-dimensionally. The two-dimensional pattern for determining an irradiation region is
A two-dimensional base pattern previously generated on an XY plane is projected onto a previously acquired XYZ three-dimensional shape pattern of the film surface to generate a three-dimensional pattern for determining an irradiation region;
Measuring a dimension B1 of a span portion B in the Y-axis direction on the two-dimensional base pattern;
Measuring a dimension B2 of a projection portion of the span portion B on the three-dimensional pattern for determining an irradiation region;
multiplying the dimension B1 of the two-dimensional base pattern by B1/B2 to generate a reduced correction pattern;
is a reduced correction pattern generated by
40. The laser light irradiation control program according to claim 32, wherein the X-axis direction is the direction of the scanning length of the laser light, and the Y-axis direction is the direction of the scanning width of the laser light. The laser light irradiation control program according to any one of claims 32 to 41, wherein the scanning parameters include one or more selected from the group consisting of laser scanning speed, laser output intensity, and laser spot diameter. The laser light irradiation control program according to any one of claims 32 to 42, which causes the laser light scanning device to scan the laser light while overlapping it in the line width direction of the scanning line. The laser light irradiation control program of claim 43, wherein the overlap is greater than or equal to 10% and less than or equal to 99% of the line width. A computer-readable recording medium or recording device storing the program according to any one of claims 32 to 44.

Images