JP7650746B2 - METAL WIRING MANUFACTURING METHOD, MANUFACTURING APPARATUS, AND METAL WIRING MANUFACTURING CONDITION SETTING PROGRAM - Google Patents

Description

The present invention relates to a method for manufacturing metal wiring, a metal wiring manufacturing device, a metal wiring manufacturing condition setting program, a computer-readable recording medium, and a device on which the program is recorded.

A circuit substrate has a structure in which conductive wiring is applied to a substrate. The manufacturing method of a circuit substrate is generally as follows. First, a photoresist is applied to the substrate to which metal foil has been attached. Next, the photoresist is exposed and developed to obtain a negative shape of the desired circuit pattern. Next, the metal foil not covered by the photoresist is removed by chemical etching to form a pattern. This makes it possible to manufacture a high-performance conductive substrate. However, conventional methods have drawbacks, such as the large number of steps, the complexity, and the need for photoresist materials.

In response to this, direct wiring printing technology has been drawing attention, in which a desired wiring pattern is directly printed on a substrate using a dispersion (hereinafter also referred to as a "paste material") in which fine particles selected from the group consisting of metal fine particles and metal oxide fine particles are dispersed. This technology has extremely high productivity, with a small number of steps and no need to use photoresist materials.

As an example of direct printed wiring technology, the following Patent Document 1 describes a method of applying a paste material to the entire surface of a substrate, irradiating the paste material with laser light in a pattern and selectively thermally baking it to obtain a desired wiring pattern. In Patent Document 1, for example, a galvanometer scanner is used for scanning the laser light, and the laser light is repeatedly scanned in a single stroke to irradiate an area of the desired size and shape with the laser light. In addition, in areas where the scanning lines constituting the metal wiring have different lengths, the scanning speed of the laser light is made different and the scanning period is made substantially the same, preventing differences in the amount of heat stored by one scan from occurring at different points and making the resistance value of the metal wiring uniform.

On the other hand, as an example of a laser processing device, the following Patent Document 2 describes a laser marker equipped with a galvanometer scanner that can process even if the processing surface of the workpiece has a three-dimensional shape (i.e., is not flat). In a laser processing device capable of three-dimensional processing, since the workpiece has a three-dimensional shape, two-dimensional processing patterns such as character strings must be specified three-dimensionally. However, Patent Document 2 provides a three-dimensional processing data setting device that can easily set processing information by converting the coordinates of the two-dimensional processing pattern and displaying it in three dimensions together with the three-dimensional processing surface of the workpiece.

JP 2019-140284 A Patent No. 5013699

However, the inventors of the present application have found that when the processing surface of the workpiece has a three-dimensional undulating shape (for example, when the base material is a curved plate or a three-dimensional molded body of various shapes), even if a laser processing device capable of three-dimensional processing is used, there is a problem in that the heating conditions vary depending on the positional relationship between the scanning point on the processing surface and the laser output device, making it difficult to obtain metal wiring with a uniform resistance value.

In view of these problems, the problem that the present invention aims to solve is to provide a metal wiring manufacturing method, a metal wiring manufacturing device, and a metal wiring manufacturing condition setting program that can obtain metal wiring with a uniform resistance value even when the processing surface of the workpiece has a three-dimensional shape.

As a result of intensive research and repeated experiments to solve the above problems, the inventors of the present application unexpectedly found that the above problems could be solved by the following configuration, and thus completed the present invention.
That is, the present invention is as follows.

[1] A method for manufacturing metal wiring, comprising irradiating a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a base material as a processing surface of an object to be processed with laser light repeatedly or in one direction in a main scanning direction with a predetermined scanning period to form a scanning line having a predetermined width while displacing the scanning line in a sub-scanning direction different from the main scanning direction for each scanning period to form a metal wiring, the method comprising the steps of:
generating profile information indicating a three-dimensional shape of at least a processing surface of the object to be processed;
A step of designating a processing surface to be irradiated with laser light;
generating profile information indicative of one or more XY two-dimensional machining patterns;
generating an XYZ three-dimensional coordinate data group that specifies a region to be irradiated with laser light on the specified processing surface based on the XY two-dimensional processing pattern;
a step of associating information on laser light irradiation conditions with the XYZ three-dimensional coordinate data group; and a step of forming metal wiring by irradiating the specified processing surface with laser light under the associated laser light irradiation conditions using the XYZ three-dimensional coordinate data group.
A method for manufacturing a metal wiring comprising the steps of:
[2] The method for producing a metal wiring according to the above aspect 1, wherein the particles are sintered by the irradiation of the laser light.
[3] The method for producing a metal wiring according to the above aspect 1 or 2, wherein the film is a coating film formed on the substrate.
[4] The step of generating the profile information further includes a step of virtually displaying the three-dimensional shape or the XY two-dimensional processing pattern in a three-dimensional or two-dimensional form.
The method for producing a metal wiring according to any one of the above aspects 1 to 3.
[5] The step of generating the XYZ three-dimensional coordinate data group is a step of projecting the XY two-dimensional processing pattern in a Z-axis direction and converting the XY two-dimensional processing pattern into the XYZ three-dimensional coordinate data group so as to virtually match the XY two-dimensional processing pattern.
The method for producing a metal wiring according to any one of the above aspects 1 to 4.
[6] In the associating step,
Specify the XYZ coordinate α indicating the virtual laser light source,
a virtual incidence angle is calculated for all XYZ coordinates in the XYZ three-dimensional coordinate data group, the virtual incidence angle being an acute angle formed by a normal line of the specified machining surface at the XYZ coordinate β with respect to a straight line connecting the XYZ coordinate α and an XYZ coordinate β selected from the XYZ three-dimensional coordinate data group; and
The method for manufacturing a metal wiring according to any one of the above aspects 1 to 5, wherein the group of virtual incident angle data is associated with information on the laser light irradiation conditions.
[7] Dividing the virtual incident angle data group into two or more divided groups according to a preset virtual incident angle threshold value;
7. The method for manufacturing a metal wiring according to claim 6, wherein the group of virtual incident angle data is associated with information on laser light irradiation conditions that are made different for each of the division groups.
[8] In the associating step,
if an acute angle formed by a straight line drawn from the XYZ coordinate α to the XYZ coordinate β and a normal line of the specified machining surface at the XYZ coordinate β is equal to or greater than a predetermined angle θ, the XYZ three-dimensional coordinate data group is divided into an XYZ three-dimensional coordinate data group having an angle equal to or greater than the predetermined angle θ and an XYZ three-dimensional coordinate data group having an angle less than the predetermined angle θ;
8. The method for manufacturing metal wiring according to claim 7, wherein each of the divided XYZ three-dimensional coordinate data groups is associated with information on the laser light irradiation conditions.
[9] The method for producing a metal wiring according to the above aspect 8, wherein the predetermined angle θ is within a range of 40° to 50°.
[10] The method for manufacturing metal wiring according to aspect 8, wherein in the dividing step, the predetermined angle θ is set as a plurality of angles, namely, a predetermined angle θ1 and a predetermined angle θ2, and the XYZ three-dimensional coordinate data group is divided into three angles: less than the predetermined angle θ1, equal to or greater than the predetermined angle θ1 and less than the predetermined angle θ2, and equal to or greater than the predetermined angle θ2.
[11] The predetermined angle θ1 is within a range of 30° to 40°,
11. The method for producing a metal wiring according to claim 10, wherein the predetermined angle θ2 is greater than the predetermined angle θ1 and is within a range of 40° to 50°.
[12] The method for manufacturing a metal wiring according to aspect 6, wherein the group of virtual incident angle data is associated with information on laser light irradiation conditions that are varied for each virtual incident angle value indicated by the group of virtual incident angle data.
[13] The method for manufacturing a metal wiring according to any one of the above aspects 1 to 12, wherein the displacement is such that the scan line widths overlap each other by 5% to 99.5%.
[14] The method for producing a metal wiring according to any one of the above aspects 1 to 13, wherein the metal includes at least one selected from the group consisting of copper, silver, gold, tin, and aluminum.
[15] The method for producing a metal wiring according to any one of the above aspects 1 to 14, wherein the metal oxide is copper oxide.
[16] The method for producing a metal wiring according to any one of the above aspects 1 to 15, wherein the film is formed from a dispersion containing the particles and a dispersant.
[17] The method for producing a metal wiring according to the above aspect 16, wherein the dispersant contains a phosphorus-containing organic compound.
[18] The method for producing a metal wiring according to any one of the above aspects 1 to 17, wherein the laser light has an emission wavelength with a center wavelength of 355 nm or more and 550 nm or less.
[19] The laser light irradiation conditions are preset conditions based on property data of the film,
19. The method for manufacturing a metal wiring according to any one of the above aspects 1 to 18, wherein the property data includes data on a thickness of the film and a penetration length at a wavelength of the laser light.
[20] The method for producing a metal wiring according to the above-mentioned aspect 19, wherein the film has a thickness of 0.1 μm to 20 μm and a laser penetration length at a wavelength of 355 nm of 0.1 μm to 10 μm.
[21] A metal wiring manufacturing device for forming metal wiring by irradiating a laser beam that displays a laser spot of a predetermined size on a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a base material, as a processing surface of a processing object, in a main scanning direction with a predetermined scanning period or in one direction, to form a scanning line having a predetermined width, while displacing the laser beam in a sub-scanning direction different from the main scanning direction for each scanning period,
The metal wiring manufacturing apparatus comprises:
A laser oscillator that generates laser light;
A laser scanning device that scans the laser light emitted from the laser oscillation device; and a laser light irradiation control device that controls the laser oscillation device and the laser scanning device.
Equipped with
The laser light irradiation control device,
a processing surface profile generating means for generating profile information indicating a three-dimensional shape relating to at least a processing surface of the object to be processed;
A processing pattern generating means for generating profile information indicating one or more XY two-dimensional processing patterns;
a coordinate data group generating means for generating an XYZ three-dimensional coordinate data group for designating a region to be irradiated with laser light on the designated processing surface based on the XY two-dimensional processing pattern;
and an irradiation condition associating means for associating information on laser light irradiation conditions with the group of XYZ three-dimensional coordinate data.
[22] The metal wiring manufacturing apparatus according to aspect 21, wherein the laser light irradiation control device further includes a display device capable of virtually displaying the three-dimensional shape or the XY two-dimensional processing pattern in a three-dimensional or two-dimensional form.
[23] The metal wiring manufacturing apparatus according to aspect 21 or 22, wherein the coordinate data group generation means is a coordinate conversion means that converts the XY two-dimensional processing pattern into the XYZ three-dimensional coordinate data group by projecting the XY two-dimensional processing pattern in the Z-axis direction onto the specified processing surface and virtually matching the pattern.
[24] The laser light irradiation control device further includes:
a virtual incidence angle calculation means for generating a group of virtual incidence angle data by designating an XYZ coordinate α indicating a virtual laser light source, and calculating a virtual incidence angle, which is an acute angle formed by a normal line of the processing surface at the XYZ coordinate β with respect to a straight line connecting the XYZ coordinate α and an XYZ coordinate β selected from the group of XYZ three-dimensional coordinate data, for all XYZ coordinates in the group of XYZ three-dimensional coordinate data;
24. The metal wiring manufacturing apparatus according to any one of aspects 21 to 23, further comprising a coordinate data group division means for dividing the XYZ three-dimensional coordinate data group into an XYZ three-dimensional coordinate data group having an angle equal to or greater than the predetermined angle θ and an XYZ three-dimensional coordinate data group having an angle less than the predetermined angle θ, when an acute angle formed by a straight line drawn from the XYZ coordinate α to the XYZ coordinate β and a normal to the processing surface at the XYZ coordinate β is a predetermined angle θ or more.
[25] A laser light irradiation control device that controls a laser oscillator and a laser scanner to irradiate a laser beam that displays a laser spot of a predetermined size on a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a base material as a processing surface of an object to be processed, repeatedly or in one direction in a main scanning direction with a predetermined scanning period to form a scanning line having a predetermined width, while displacing the laser beam in a sub-scanning direction different from the main scanning direction for each scanning period to form a metal wiring, based on one or more two-dimensional processing pattern data,
a processing surface profile generating means for generating profile information indicating a three-dimensional shape relating to at least a processing surface of the object to be processed;
A processing pattern generating means for generating profile information indicating one or more XY two-dimensional processing patterns;
a coordinate data group generating means for generating an XYZ three-dimensional coordinate data group for designating a region to be irradiated with laser light on the designated processing surface based on the XY two-dimensional processing pattern;
and an irradiation condition associating means for associating information on laser irradiation conditions with the group of XYZ three-dimensional coordinate data.
[26] The laser light irradiation control device according to aspect 25, further comprising a display device capable of virtually displaying the three-dimensional shape or the XY two-dimensional processing pattern in a three-dimensional or two-dimensional form.
[27] The laser light irradiation control device according to aspect 25 or 26, wherein the coordinate data group generation means is a coordinate conversion means which converts the XY two-dimensional processing pattern into the XYZ three-dimensional coordinate data group by projecting the XY two-dimensional processing pattern in the Z-axis direction onto the specified processing surface and virtually matching the pattern.
[28] The laser light irradiation control device further includes:
a virtual incidence angle calculation means for generating a group of virtual incidence angle data by designating an XYZ coordinate α indicating a virtual laser light source, and calculating a virtual incidence angle, which is an acute angle formed by a normal line of the processing surface at the XYZ coordinate β with respect to a straight line connecting the XYZ coordinate α and an XYZ coordinate β selected from the group of XYZ three-dimensional coordinate data, for all XYZ coordinates in the group of XYZ three-dimensional coordinate data;
A laser light irradiation control device as described in any one of aspects 25 to 27 above, further comprising a coordinate data group division means for dividing the XYZ three-dimensional coordinate data group into an XYZ three-dimensional coordinate data group having an angle equal to or greater than the predetermined angle θ and an XYZ three-dimensional coordinate data group having an angle less than the predetermined angle θ, when an acute angle formed by a straight line drawn from the XYZ coordinate α to the XYZ coordinate β and a normal to the processing surface at the XYZ coordinate β is a predetermined angle θ or more.
[29] A program for setting metal wiring manufacturing conditions for forming metal wiring by repeatedly or unidirectionally irradiating a laser beam in a main scanning direction with a predetermined scanning period onto a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a base material as a processing surface of an object to be processed, to form a scanning line having a predetermined width, while displacing the laser beam in a sub-scanning direction different from the main scanning direction for each scanning period,
generating profile information indicating a three-dimensional shape of at least a processing surface of the object to be processed;
Specify the surface to be processed by irradiating the laser beam,
generating profile information indicative of one or more XY two-dimensional processing patterns;
generating an XYZ three-dimensional coordinate data group for specifying a region to be irradiated with laser light on the specified processing surface based on the XY two-dimensional processing pattern; and associating information on laser light irradiation conditions with the XYZ three-dimensional coordinate data group;
A metal wiring manufacturing condition setting program that causes a laser light irradiation control device to execute the above.
[30] The step of generating the profile information further includes a step of virtually displaying the three-dimensional shape or the XY two-dimensional processing pattern in a three-dimensional or two-dimensional form.
30. The metal wiring manufacturing condition setting program according to aspect 29.
[31] The step of generating the XYZ three-dimensional coordinate data group is a step of projecting the XY two-dimensional processing pattern in a Z-axis direction and converting the XY two-dimensional processing pattern into the XYZ three-dimensional coordinate data group so as to virtually match the XY two-dimensional processing pattern.
31. The metal wiring manufacturing condition setting program according to aspect 29 or 30.
[32] A computer-readable recording medium or a recording device storing the metal wiring manufacturing condition setting program according to any one of the above aspects 29 to 31.

According to the present invention, it is possible to obtain metal wiring with a uniform resistance value even when the processing surface of the workpiece has a three-dimensional shape.

3A to 3C are schematic diagrams showing an example of metal wiring and scanning with a light beam in a method for manufacturing metal wiring according to an embodiment of the present invention; 1 is a perspective view showing a state in which a three-dimensional processed surface is irradiated with laser light in a method for manufacturing metal wiring according to an embodiment of the present invention; FIG. 3 is a cross-sectional view showing a detail of FIG. 2 . 1 is a schematic diagram showing overlapping scanning lines in a method for manufacturing metal wiring according to an embodiment of the present invention; 1 is a block diagram showing an example of a configuration of a metal wiring manufacturing apparatus and a laser light irradiation control device according to an embodiment of the present invention; 1 is a schematic diagram showing an example of a laser scanning device in a metal wiring manufacturing apparatus according to an embodiment of the present invention; 5 is a flowchart showing an example of an operation of a condition setting process in a metal wiring manufacturing condition setting program according to an embodiment of the present invention.

The following describes in detail the embodiments of the present invention (hereinafter also referred to as "the present embodiment"); however, the present invention is not limited to these embodiments.

[Terminology definition]
In this specification, the term "scanning period" (F) is the reciprocal of the time (1/s, Hz) required from the start of one repeating scan (which may be in one direction or repeated) to the start of the next repeating scan, the term "main scanning direction" is the direction in which the scan moves (e.g., the X-axis direction), and the term "sub-scanning direction" is the direction in which the scan moves for each repeating scan that is different from (e.g., perpendicular to) the "main scanning direction" (e.g., the Y-axis direction).
The term "scanning line" refers to a linear region in which a single point irradiated with laser light (hereinafter referred to as the irradiation point) moves across the surface of a film containing metal and/or metal oxide particles on the processing surface of an object to be processed, causing the metal and/or metal oxide particles contained in the surface to form a conductor through sintering, contact between particles, etc.
The term "scan length" (L) refers to the width in the main scanning direction of a scan line formed on a processing surface by a laser spot by scanning in the main scanning direction.
The term "workpiece" refers to an object having a processing surface to be irradiated with laser light.
The term "film containing metal and/or metal oxide particles (hereinafter referred to as "film to be processed")" refers to a film that is present on the processing surface of an object to be processed and that forms metal wiring by irradiating with laser light.
The term "virtual angle of incidence of laser light" refers to the acute angle formed by the normal to the processing surface at the irradiation point on the processing surface with respect to a straight line connecting the virtual laser light source and the irradiation point on the processing surface.
The term "virtual laser light source" refers to a point in three-dimensional XYZ coordinates that is defined as a reference point for calculating a virtual angle of incidence.

<Metal Wiring Manufacturing Method>
One embodiment of the present invention is a method for manufacturing metal wiring, which includes irradiating a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a base material as a processing surface of a processing object with laser light that displays a laser spot of a predetermined size in a main scanning direction with a predetermined scanning period or in one direction to form a scanning line having a predetermined width while displacing the scanning line in a sub-scanning direction different from the main scanning direction for each scanning period to form a metal wiring, the method comprising the steps of:
generating profile information indicating a three-dimensional shape of at least a processing surface of the object to be processed;
A step of designating a processing surface to be irradiated with laser light;
generating profile information indicative of one or more XY two-dimensional machining patterns;
generating an XYZ three-dimensional coordinate data group that specifies a region to be irradiated with laser light on the specified processing surface based on the XY two-dimensional processing pattern;
a step of associating information on laser light irradiation conditions with the XYZ three-dimensional coordinate data group; and a step of forming metal wiring by irradiating the specified processing surface with laser light under the associated laser light irradiation conditions using the XYZ three-dimensional coordinate data group.
The present invention relates to a method for manufacturing a metal wiring.

Figure 1 is a schematic diagram showing an example of metal wiring and light beam scanning in the manufacturing method of metal wiring according to the present embodiment. As shown in Figure 1, a case will be described as an example in which metal wiring 1 having a three-dimensional pattern that is rectangular in plan view is obtained on processing surfaces 2a and 2b of a processing object (work) with different inclinations. The metal wiring 1 is produced by scanning laser light 4 with the X-axis direction in Figure 1 as the main scanning direction and the Y-axis direction as the sub-scanning direction. The laser light 4 irradiates the entire three-dimensional pattern by repeating scanning in the main scanning direction with a predetermined scanning period and scanning displaced in the sub-scanning direction. The solid line I indicates a region (scanning line) in which a portion (irradiation point) irradiated with one point of laser light 4 moves on the surface of the processing film 5, and metal particles contained in the surface form a conductor by sintering, contact between particles, etc. Sintering can be advantageous in forming low-resistance metal wiring. Although not shown in Figure 1, the solid line I is a single continuous line, and forms a three-dimensional pattern as if drawn in one stroke.

Here, attention is paid to point A located on the processing surface 2a and point B located on the processing surface 2b. In FIG. 1, the irradiation direction of the laser light 4 is the same as the Z-axis direction. Therefore, if the angle between the normal line N _a of the processing surface 2a at point A and the laser light 4a is θ _a , and the angle between the normal line N _b of the processing surface 2b at point B and the laser light 4b is θ _b , then θ _a ≠ θ _b . In this case, if the laser light 4 is scanned under the same irradiation conditions at points A and B, the heating temperature of the surface of the processing film will be different between points A and B. Therefore, the degree to which metal particles form a conductor on the surface of the processing film by sintering, contact between particles, etc. (hereinafter referred to as the degree of conductivity) will be different between points A and B. As a result, the resistance value will differ depending on the position in the metal wiring 1, resulting in non-uniformity.

Therefore, the inventors of the present application have found that by setting appropriate irradiation conditions for each of the XYZ three-dimensional coordinate data groups of the three-dimensional pattern, it is possible to suppress variations in the degree of conductivity of the metal particles and easily obtain metal wiring 1 with a uniform resistance value without being restricted by the three-dimensional shape of the processing surface 2. That is, the manufacturing method of metal wiring 1 according to the present embodiment includes a process of forming metal wiring 1 by repeatedly scanning a light beam on a three-dimensional surface containing metal particles to form a conductor by sintering the metal particles and contacting each other, and is characterized in that information on laser light irradiation conditions is associated with the XYZ three-dimensional coordinate data group of the three-dimensional pattern. Below, an example embodiment of each process of the present invention will be described.

(Step of generating profile information indicating three-dimensional shape)
First, as shown in FIG. 5, the machining surface profile generating means 49, which is a functional block of the processing device 48, generates profile information indicating the three-dimensional shape of the workpiece or the machining surface 2. Examples of the machining surface profile generating means 49 include a method of converting a data file of profile information indicating the three-dimensional shape created in advance to the shape of the workpiece or the machining surface 2, or a method of reading and generating profile information acquired by actually recognizing the image of the workpiece or the machining surface 2 with an image recognition device (not shown) such as an image sensor. As one aspect, this process may include a step of virtually displaying the profile information indicating the generated three-dimensional shape on the display device 45 in a three-dimensional form. In one aspect, the profile information indicating the three-dimensional shape is generated by input from the input device 46.

(Process of specifying the processing surface)
Next, the machining surface designation means, which is a functional block of the processing device 48, designates the machining surface 2 to be irradiated with the laser beam from the profile information indicating the three-dimensional shape of the object to be machined (work) or the plurality of machining surfaces 2 generated in the previous process. As one aspect of the machining surface designation means, a method is used in which the user interactively designates the machining surface 2 to be irradiated with the laser beam from the three-dimensional shapes of the object to be machined (work) or the plurality of machining surfaces 2 displayed on the display of the display device 45.

(Step of generating profile information indicating a two-dimensional processing pattern)
Next, the processing pattern generating means 50, which is a functional block of the processing device 48, generates profile information indicating a two-dimensional processing pattern of the desired shape of the metal wiring 1. One embodiment of the processing pattern generating means 50 includes a method of converting a data file of profile information indicating a previously created two-dimensional shape into the shape of the two-dimensional processing pattern, and a method of generating a two-dimensional processing pattern based on parameters for specifying the shape of the two-dimensional processing pattern inputted by a user from the input device 46 in an interactive manner. As another embodiment, this process may include a step of virtually displaying the generated two-dimensional processing pattern shape in a two-dimensional or three-dimensional form on the display device 45.

(Process of generating XYZ three-dimensional coordinate data group)
Next, the coordinate data group generating means 52, which is a functional block of the processing device 48, generates an XYZ three-dimensional coordinate data group that specifies the region to be irradiated with the laser beam. In one aspect, the process of generating the XYZ three-dimensional coordinate data group is a process of projecting the two-dimensional processing pattern generated in the previous process (for example, projecting the XY two-dimensional processing pattern in the Z-axis direction) and converting it into an XYZ three-dimensional coordinate data group by performing coordinate conversion so as to virtually match the three-dimensional processing surface 2 having three-dimensional coordinate information. In another aspect, an XYZ three-dimensional coordinate data group representing the three-dimensional processing pattern after the coordinate conversion is generated, and the processing pattern may be virtually pasted on the three-dimensional processing surface 2 on the display of the display device 45 and displayed three-dimensionally. In addition to the above aspect, the XYZ three-dimensional coordinate data group may be generated by a method of directly drawing a three-dimensional processing pattern on the processing surface 2.

(Associating step)
Next, the irradiation condition associating means 55, which is a functional block of the processing device 48, associates information on the laser beam irradiation conditions with a group of XYZ three-dimensional coordinate data specifying the region to be irradiated with the laser beam. This makes it possible to set appropriate laser irradiation conditions at each point regardless of the positional relationship between the scanning point on the processing surface 2 and the laser output device, thereby making it possible to make the resistance value of the entire metal wiring 1 uniform. The irradiation conditions are specified by scanning parameters, which will be described later.

In one embodiment, in this process, the irradiation condition data generating means 51, which is a functional block of the processing device 48, generates the laser irradiation conditions. One embodiment of the irradiation condition data generating means 51 is a method in which the scanning parameters are manually set from the input device 46, or a method in which the irradiation conditions are automatically generated by a program based on the data structure stored in the storage device 44.

In one embodiment, the laser irradiation conditions may be generated by specifying an arbitrary region of the three-dimensional processing pattern and setting (e.g., manually) scanning parameters for each region. In another embodiment, the three-dimensional processing pattern may be divided into a plurality of regions, and different laser irradiation conditions may be generated between the regions. For example, a threshold may be set at a numerical value selected from the absolute values of the XYZ coordinates, the value of the virtual angle of incidence described below, the distance from an arbitrarily determined reference plane, etc., and the three-dimensional processing pattern may be divided into a plurality of regions by the threshold. In another embodiment, the laser irradiation conditions may be continuously changed in conjunction with the above numerical values. In addition, the irradiation condition data generating means 51 may generate the laser irradiation conditions by reading scanning parameters that are preset based on property data of the processed film (e.g., the thickness of the processed film, data on the penetration length at the wavelength of the laser light 4, etc.).

Scanning parameters that define the laser irradiation conditions can be set, for example, the central wavelength of the laser light 4, the pulse frequency, the output, the spot diameter, the defocus value, the scanning line spacing, the scanning speed, the scanning direction, the number of scans, etc.

In one aspect of the present invention, the association process may include the following process of calculating a virtual angle of incidence and a process of dividing the three-dimensional coordinate data group. Preferred examples of each process are described below.

(Step of calculating virtual angle of incidence)
In the step of calculating the virtual incidence angle, the virtual incidence angle calculation means 53, which is a functional block of the processing device 48, calculates the virtual incidence angle of the laser light 4 in each of all XYZ three-dimensional coordinate data groups representing the three-dimensional processing pattern generated in the step of generating the XYZ three-dimensional coordinate data group, thereby generating a virtual incidence angle data group. This allows information on the virtual incidence angle that affects the heating conditions by laser light irradiation to be given to the XYZ three-dimensional coordinate data group that specifies the area to be irradiated with laser light. In one aspect, in the above-mentioned associating step, information on the virtual incidence angle may be included as the laser light irradiation condition to be associated with the XYZ three-dimensional coordinate data group. In addition, for example, a formula may be used to automatically read the laser light irradiation conditions that are different for each virtual incidence angle value, and associate them with the XYZ three-dimensional coordinate data group.

(Virtual angle of incidence)
The virtual angle of incidence will be described below with reference to Fig. 2 and Fig. 3. Fig. 2 is a perspective view showing a state in which a laser beam is irradiated onto a three-dimensional processed surface in a manufacturing method for metal wiring according to one embodiment of the present invention, and Fig. 3 is a cross-sectional view showing the details of Fig. 2. As shown in Fig. 2, the virtual angle of incidence is an acute angle formed by a normal N of the processed surface 2 at the XYZ coordinate β with respect to a straight line drawn from the XYZ coordinate α indicating the virtual laser light source to the XYZ coordinate β which is an arbitrary irradiation point on the processed surface 2.

In one aspect, the XYZ coordinate α representing the virtual laser light source is specified so that the ratio of the number of data items with a virtual incidence angle of 0° to the total number of data items in the virtual incidence angle data group is maximized. If multiple candidate XYZ coordinates are found, any one of them may be selected as the XYZ coordinate α.

The optical axis and focal length of the laser light irradiated to the workpiece can be changed by using a mirror, an fθ lens, a beam expander, etc. In addition, in order to irradiate the workpiece with the laser light at a predetermined spot diameter, the distance between the laser light source and the workpiece is usually set to be slightly different from the focal length of the laser light 4. In this way, the value of the actual incidence angle of the laser light 4 irradiated to a certain irradiation point of the workpiece is not necessarily fixed, and is not necessarily the same as the value of the virtual incidence angle. However, the virtual incidence angle calculated in this embodiment reflects the actual incidence mode of the laser light 4 on the workpiece relatively well, while it can be easily calculated regardless of the surface shape of the workpiece, so it is advantageous as an index for determining the laser light irradiation conditions. The relationship between the virtual incidence angle of the present disclosure and the actual incidence angle of the laser light 4 irradiated to the workpiece can be calculated geometrically based on the characteristic values of the members (e.g., fθ lenses, etc.) that can be used for laser light irradiation.

(Step of Dividing Three-Dimensional Coordinate Data Group)
In the step of dividing the three-dimensional coordinate data group, the coordinate data group dividing means 54, which is a functional block of the processing device 48, divides the XYZ three-dimensional coordinate data group according to the virtual incident angle calculated in the step of calculating the virtual incident angle. The XYZ three-dimensional coordinate data group is divided into two or more divided groups according to a preset virtual incident angle threshold. This allows the laser irradiation conditions to be set collectively for each divided XYZ three-dimensional coordinate data group, so that the condition setting can be performed efficiently. The scanning path of the laser light 4 may be set for each area divided in this step. Alternatively, the scanning path may be set for the entire three-dimensional processing pattern as one area, and the laser light 4 may be scanned by changing only the laser irradiation conditions at each point.

In one aspect of the present invention, the virtual angle of incidence can be divided into two cases: a case where the virtual angle of incidence is equal to or greater than a predetermined angle θ, and a case where the virtual angle of incidence is less than the predetermined angle θ. Here, the predetermined angle θ is preferably within a range of 20° to 60°, preferably within a range of 30° to 55°, and preferably within a range of 40° to 50°. In another aspect of the present invention, the predetermined angle θ can be set multiple times as a predetermined angle θ1 and a predetermined angle θ2, and the XYZ three-dimensional coordinate data group can be divided into three cases: less than the predetermined angle θ1, at least the predetermined angle θ1 and less than the predetermined angle θ2, and at least the predetermined angle θ2. Here, it is preferable that the predetermined angle θ1 is 30° to 40°, and the predetermined angle θ2 is greater than the predetermined angle θ1 and within a range of 40° to 50°.

In the above, a method of calculating the virtual incident angle by specifying the XYZ coordinate α indicating the virtual laser light source so that the ratio of the number of data with a virtual incident angle of 0° to the total number of data in the virtual incident angle data group is maximized has been shown, but in another aspect of the present disclosure, the XYZ coordinate α indicating the virtual laser light source may be specified in a manner different from the above. For example, the XYZ coordinate α indicating the virtual laser light source may be specified so that the average value or maximum value of all data in the virtual incident angle data group is minimized. Furthermore, in another aspect of the present disclosure, instead of the XYZ coordinate α indicating the virtual laser light source, a plane coordinate α' indicating a virtual plane may be used, and the acute angle formed by the normal N of the virtual plane and the normal N of the processing surface 2 at the XYZ coordinate β, which is an arbitrary irradiation point on the processing surface 2, may be set as the virtual incident angle.

(Output process)
After the final metal wiring manufacturing conditions are generated and the setting work is completed by the above procedure, the processing device 48 outputs a control signal for controlling the laser scanning device 42 and the laser oscillation device 43 based on the XYZ three-dimensional coordinate data group with which the laser irradiation conditions are associated in the above-mentioned associating step. The control signal is transmitted to the laser scanning device 42 and the laser oscillation device 43 via the interface device 47. In one aspect, the XYZ three-dimensional coordinate data group with which the laser irradiation conditions are associated may be stored in the storage device 44 as metal wiring manufacturing condition data, or may be output from the interface device 47 as metal wiring manufacturing condition data.

(Process for forming metal wiring)
In one aspect of the process for forming metal wiring, this process includes a process for forming a process film 5, which is a film containing a metal and/or a metal oxide, on the surface of the base material 3, and an irradiation process for irradiating the film with laser light 4. Preferred examples of each process will be described below.

(Process of forming film to be treated)
As shown in Fig. 6, in one embodiment, in the process of forming the film to be treated, the film to be treated 5 is formed on the surface of the substrate 3. The film may be formed by coating, lamination, deposition, or the like, and for example, a coating film containing a metal and/or a metal oxide may be formed on the surface of the substrate. In one embodiment, the film is a coating film formed by applying a paste material containing a metal and/or a metal oxide. Before application, the surface of the substrate 3 may be cleaned in advance. The method of applying the film to be treated 5 is not particularly limited, and coating methods such as die coating, spin coating, slit coating, bar coating, knife coating, spray coating, and dip coating can be used.

The paste material contains a metal and/or metal oxide, as described below, and may optionally contain an organic substance, as described below, and may further contain a solvent. In one embodiment, the solvent is capable of dissolving or dispersing, preferably dissolving, the organic substance, as described below, and dispersing the metal and/or metal oxide (e.g., particles thereof).

(Irradiation process)
In the irradiation process, the processing device 48 operates the laser scanning device 42 and the laser oscillation device 43 in conjunction with each other to scan the laser light 4 on the film 5 to be processed, thereby manufacturing the metal wiring 1. The processing device 48 generates a control signal for controlling the laser scanning device 42 and the laser oscillation device 43 based on the generated manufacturing condition data of the metal wiring. The laser scanning device 42 scans the laser light 4 on the specified processing surface 2 under the laser light irradiation conditions (e.g., spot diameter of the laser light 4, defocus value, scanning line interval, scanning speed, scanning direction, number of scans) associated with the XYZ three-dimensional coordinate data group specifying the laser light irradiation planned area by the control signal. In addition, the laser oscillation device 43 oscillates the laser light 4 under the laser light irradiation conditions (e.g., center wavelength, pulse frequency, output of the laser light 4) associated with the XYZ three-dimensional coordinate data group specifying the laser light irradiation planned area by the control signal.

The above describes a method in which the processing device 48 of the laser light irradiation control device 41 controls the laser scanning device 42 and the laser oscillation device 43 to manufacture metal wiring, but in one embodiment, the laser scanning device 42 and/or the laser oscillation device 43 may generate a control signal based on the output metal wiring manufacturing condition data.

The oxygen concentration in the atmosphere during irradiation is preferably 5% by volume or less, or 2% by volume or less, or 1% by volume or less. Although a lower oxygen concentration is more desirable, from the viewpoint of ease of process management, it may be, for example, 0.001% by volume or more, 0.01% by volume or more, or 0.05% by volume or more.

(Scan line overlap)
The amount of movement of the irradiation point of the laser light 4 in the sub-scanning direction (Y-axis direction in one embodiment) can be set arbitrarily, but in this embodiment, it is preferable to set the amount of movement so that adjacent scan lines overlap each other. Fig. 4 is a schematic diagram showing overlapping scan lines in the metal wiring manufacturing method according to this embodiment. As shown in Fig. 4, a certain scan line 11 and an adjacent scan line 12 overlap each other. As a result, the amount of heat storage increases in the overlapping region where the scan lines 11 and 12 overlap, thereby increasing the conductivity of the copper particles and, as a result, the resistance value of the metal wiring 1 can be lowered.

The ratio of the width W2 of the overlapping area of the scanning lines 11, 12 to the width W1 (e.g., 320 μm) of the scanning lines 11, 12 is defined as the overlap rate (%) with the scanning lines 11, 12. The overlap rate is preferably 10% to 99%, or 20% to 95%, or 30% to 90%, or 40% to 85%. When the overlap rate is 10% or more, the sintering of the metal and/or metal oxide, the formation of a conductor by contact between particles, etc., proceeds smoothly, and when it is 99% or less, wiring can be manufactured at an industrially practical production speed.

In addition, if adjacent scanning lines overlap each other due to scanning with the laser light 4, the scanning directions, i.e., the main scanning directions of the irradiation points (X-axis direction in one embodiment) (indicated by arrow D in FIG. 1) may be opposite to each other or may be the same direction, as shown in FIG. 1.

The metal wiring 1 manufactured in this manner can have a higher degree of conductivity than one with a lower overlap rate, making it possible to produce a non-brittle and rigid metal wiring 1. For example, when the metal wiring 1 is formed on a flexible substrate and bent, the metal wiring 1 can conform to the flexible substrate without cracking.

Scanning parameters
Examples of scanning parameters that define the irradiation conditions include the following.
(center wavelength, pulse frequency)
In one embodiment, the laser light 4 has an emission wavelength with a central wavelength of 350 nm or more and 550 nm or less, preferably 355 nm or 532 nm. The laser light 4 may be a CW wave (continuous wave), but may be a pulse wave from the viewpoint of preventing diffusion of heat and proceeding with baking instantaneously by irradiating a light beam with a high peak value. The width of one pulse of the pulse wave is preferably 1 to 100 nanoseconds, 2 to 50 nanoseconds, or 3 to 30 nanoseconds from the viewpoint of suppressing ablation of the film 5 to be treated during irradiation with the light beam.

(output)
By adjusting the output of the laser light 4 within an appropriate range, the amount of energy absorbed by the film 5 to be treated can be controlled, and the formation of a conductor due to internal sintering, contact between particles, etc. can be favorably promoted. The output density of the laser light 4 is preferably 0.001 mW/μm ² or more and 2.000 mW/μm ² or less, or 0.005 mW/μm ² or more and 1.900 mW/μm ² or less, or 0.010 mW/μm ² or more and 1.800 mW/μm ² or less, or 0.015 mW/μm ² or more and 1.500 mW/μm ² or less. When the output density is 0.001 mW/μm ² or more, the formation of a conductor due to sintering, contact between particles, etc. in the film 5 to be treated proceeds favorably, and the metal wiring 1 has a low resistance. Furthermore, when the power is 2.000 mW/μm ² or less, carbonization or ablation of the film 5 to be treated is unlikely to occur, and the desired metal wiring 1 can be easily formed.

(spot diameter, overlap rate, scanning line spacing)
The laser light 4 may be irradiated to the film 5 to be treated with a desired spot diameter. The spot diameter may be adjusted by the amount of deviation of the laser light 4 from the focus. In one embodiment, the laser light 4 is preferably irradiated to the film 5 to be treated multiple times in an overlapping manner. For example, as described above, the laser light 4 is repeatedly scanned onto the film 5 to be treated while overlapping in the sub-scanning direction of the scanning line (Y-axis direction in one embodiment). The scanning line interval of the laser light 4 may be set according to the purpose, for example, so that a desired overlap rate is obtained at a desired spot diameter.

(Defocus value)
The defocus value may be appropriately specified in order to adjust the spot diameter to a desired range. In a preferred embodiment, the defocus value may be set in the range of −10.0 mm to 10.0 mm when the focusing position in the height in the irradiation direction of the laser light is set to 0.

(Scanning Speed)
The scanning speed (V) (unit: mm/sec) of the laser light 4 is calculated according to the following formula from the laser scanning length (L) (unit: mm) calculated based on the irradiation pattern shape and the desired scanning period (F) (unit: Hz) (e.g., 15 Hz).
Scanning speed (V) = scanning period (F) x scanning length (L)

(scanning direction, number of scans)
The scanning direction of the laser light 4 (indicated by arrow D in FIG. 1 ) may be specified depending on the purpose. The scanning direction may be set to a different direction for each region divided in the step of dividing the three-dimensional coordinate data group. The number of scans of the laser light is the number of times one scan is repeated. The number of scans may be set depending on the purpose, for example, so that a desired overlap rate is obtained for a desired spot diameter.

[Processing object]
The workpiece to be processed (work) refers to an object having a processing surface to be irradiated with laser light. In one embodiment, the workpiece to be processed (work) is composed of a substrate 3 and a film containing a metal and/or a metal oxide. Examples of the substrate 3 and the film containing a metal and/or a metal oxide suitable for manufacturing the metal wiring of this embodiment include the following.

(Substrate)
The shape of the substrate 3 is not particularly limited as long as it constitutes a surface on which the target film 5 is disposed. The material of the substrate 3 is preferably an insulating material in order to ensure electrical insulation from the metal wiring described below. However, it is not necessary that the entire substrate 3 is made of an insulating material. It is sufficient that only the portion that constitutes the surface on which the target film 5 is disposed is made of an insulating material.

The surface of the substrate 3 on which the treated film 5 is disposed may be flat or curved, or may include steps or the like. The substrate 3 may be a three-dimensional object, and examples thereof include the housings of electrical devices such as mobile phone terminals, smartphones, smart glasses, televisions, and personal computers. Other examples of three-dimensional objects in the automotive field include dashboards, instrument panels, steering wheels, chassis, and the like.

(Films Containing Metals and/or Metal Oxides)
The metal contained in the treated film 5, which is a film containing a metal and/or a metal oxide, is, for example, copper, silver, gold, tin, silicon, aluminum, zirconium, titanium, hafnium, tantalum, tin, chromium, cobalt, magnesium, manganese, molybdenum, nickel, tungsten, zinc, indium, etc., and may be an alloy or a mixture containing two or more of these. Examples of the metal oxide include oxides of the metals exemplified above, and copper oxide (CuO and _Cu2O ) is particularly preferable.

The metal and/or metal oxide may be a particle or a complex. In the case of a particle, it may have a core/shell structure. For example, the core and/or shell may be a metal and/or metal oxide, and the core and shell may contain different metals and/or metal oxides.

The particles may be, for example, fine particles containing copper oxide. The average primary particle diameter of the fine particles containing copper oxide is preferably 1 nm or more and 100 nm or less, more preferably 1 nm or more and 50 nm or less, and even more preferably 1 nm or more and 20 nm or less. The smaller the average primary particle diameter, the easier it is to control the penetration length of the light beam, which will be described later, and therefore the smaller the average primary particle diameter, the more preferable it is. The average primary particle diameter is a value measured by a transmission electron microscope or a scanning electron microscope. When the average primary particle diameter is 25 nm or less, a transmission electron microscope can be used, and when it exceeds 25 nm, a scanning electron microscope can be used.

The film 5 to be treated may contain an organic substance in addition to the metal and/or metal oxide. In one embodiment, the organic substance functions as a dispersant that improves the dispersibility of the metal and/or metal oxide, and the film 5 to be treated is formed from a dispersion containing the above particles and a dispersant. The organic substance may be capable of absorbing light.

Examples of dispersants include organic substances with a number average molecular weight of 300 to 300,000. If the number average molecular weight is 300 or more, the insulating properties are excellent and the contribution to improving the dispersion stability of the paste material as the material of the treated film 5 is large. In addition, if the number average molecular weight is 300,000 or less, the treated film 5 is easily baked by light irradiation, which is preferable. The dispersant preferably has a group that has affinity for metals or metal oxides, and from this viewpoint, phosphorus-containing organic compounds are preferable, and polymeric phosphate esters are more preferable. Phosphorus-containing organic compounds are also advantageous in that they can form electrically insulating insulating regions between wiring patterns. In this disclosure, the number average molecular weight is a value obtained by using gel permeation chromatography and converting it into standard polystyrene.

In the treated film 5, the mass ratio of the phosphorus-containing organic compound content to the metal and/or metal oxide content is preferably 0.01 to 0.4, or 0.03 to 0.35, or 0.05 to 0.25, or 0.1 to 0.2. The above ranges are preferable because the phosphorus-containing organic compound has a significant advantage in improving light absorption and in adsorbing to the metal and/or metal oxide to fix them to the substrate 3.

From the viewpoint of the reduction sintering property of the metal and/or metal oxide, the film 5 to be treated preferably contains hydrazine and/or hydrazine hydrate. Hydrazine and/or hydrazine hydrate can be contained in the film 5 to be treated. When the film contains hydrazine and/or hydrazine hydrate, the hydrazine and/or hydrazine hydrate functions as a reducing agent, and the resistance of the wiring obtained after light irradiation is further reduced. The content of hydrazine and/or hydrazine hydrate in the film is preferably within the following range based on the amount of hydrazine and on the mass basis with respect to the total content of the metal and/or metal oxide in the film.
0.0001≦[(hydrazine mass)/(total mass of metal and/or metal oxide)]≦0.10
When the mass ratio of hydrazine and/or hydrazine hydrate is 0.0001 or more, the resistance of the metal wiring is low, which is preferable, and when the mass ratio is 0.10 or less, the long-term stability of the structure is good, which is preferable.

In one embodiment, the thickness of the treated film 5 may be preferably 0.1 μm or more, or 0.5 μm or more, or 1 μm or more, and may be preferably 20 μm or less, or 10 μm or less, or 8 μm or less.

(Laser penetration depth)
In one embodiment, the laser light 4 penetrates into the film 5 to be treated with an appropriate penetration depth. The penetration depth is the depth x of the film to which the light intensity is attenuated to I/e due to light absorption by the film when a light beam is incident in the thickness direction of the film 5 to be treated with a light intensity I. When the absorbance of light of a certain wavelength of the film 5 to be treated, which contains a metal and/or metal oxide, is α, the light intensity I/e and x at that wavelength are expressed by the following formula:
I0/e = I0 x e(-αx)
Therefore, x and α satisfy the following formula:
x=1/α
Satisfy the relationship.

In one embodiment, the laser penetration depth into the film 5 to be treated is preferably 0.1 μm to 10 μm when the thickness of the film 5 to be treated is 0.1 μm to 20 μm and the wavelength of the laser light 4 is 355 nm. When the penetration depth is 0.1 μm or more, the laser light 4 penetrates well into the film 5 to be treated, and conductor formation due to sintering not only the surface of the film 5 to be treated but also the inside and contact between particles proceeds well, resulting in low resistance of the metal wiring. On the other hand, when the penetration depth is 10 μm or less, the light penetrates well into the film 5 to be treated and is absorbed well, resulting in good sintering of the inside and formation of conductors due to contact between particles, resulting in low resistance of the metal wiring.

≪Metal wiring manufacturing equipment≫
Another embodiment of the present invention is a metal wiring manufacturing apparatus for forming metal wiring by irradiating a laser beam that displays a laser spot of a predetermined size on a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a substrate as a processing surface of a processing object, in a main scanning direction with a predetermined scanning period or in one direction, to form a scanning line having a predetermined width, while displacing the laser beam in a sub-scanning direction different from the main scanning direction for each scanning period to form a metal wiring, based on one or more two-dimensional processing pattern data,
The metal wiring manufacturing apparatus comprises:
A laser oscillator that generates laser light;
A laser scanning device that scans the laser light emitted from the laser oscillation device; and a laser light irradiation control device that controls the laser oscillation device and the laser scanning device.
Equipped with
The laser light irradiation control device,
a processing surface profile generating means for generating profile information indicating a three-dimensional shape relating to at least a processing surface of the object to be processed;
A processing pattern generating means for generating profile information indicating one or more XY two-dimensional processing patterns;
a coordinate data group generating means for generating an XYZ three-dimensional coordinate data group for designating a region to be irradiated with laser light on the designated processing surface based on the XY two-dimensional processing pattern;
The metal wiring manufacturing apparatus further comprises an irradiation condition associating means for associating information on laser light irradiation conditions with the group of XYZ three-dimensional coordinate data.

Another aspect of the present invention is a laser light irradiation control device that controls a laser oscillator and a laser scanner to form metal wiring by irradiating a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a substrate as a processing surface of a processing object with laser light that displays a laser spot of a predetermined size repeatedly or in one direction in a main scanning direction with a predetermined scanning period to form a scanning line having a predetermined width, while displacing the laser light in a sub-scanning direction different from the main scanning direction for each scanning period to form metal wiring, based on one or more two-dimensional processing pattern data,
a processing surface profile generating means for generating profile information indicating a three-dimensional shape relating to at least a processing surface of the object to be processed;
A processing pattern generating means for generating profile information indicating one or more XY two-dimensional processing patterns;
a coordinate data group generating means for generating an XYZ three-dimensional coordinate data group for designating a region to be irradiated with laser light on the designated processing surface based on the XY two-dimensional processing pattern;
The laser beam irradiation control device further comprises irradiation condition associating means for associating information on laser beam irradiation conditions with the group of XYZ three-dimensional coordinate data.
Hereinafter, a metal wiring manufacturing apparatus 40 according to one embodiment of the present invention will be described with reference to FIGS.

Figure 5 is a block diagram showing an example of a metal wiring manufacturing apparatus 40 and a laser light irradiation control device 41 according to one embodiment of the present invention. The metal wiring manufacturing apparatus 40 shown in Figure 5 includes a laser light irradiation control device 41, a laser scanning device 42, and a laser oscillation device 43. The laser light irradiation control device 41 includes a storage device 44, a display device 45, an input device 46, an interface device 47, and a processing device 48. Note that the display device 45 and the input device 46 can be omitted.

[Laser light irradiation control device]
(Storage device)
The storage device 44 is a device for storing programs or data, and includes a memory device such as a RAM (Random Access Memory) or a ROM (Read Only Memory), a fixed disk device such as a hard disk, or a portable storage device such as a flexible disk or an optical disk. The storage device 44 stores an operating system program, a driver program, an application program, a database, a table, and the like used in processing by the processing device 48. Programs may be installed in the storage device 44 from a computer-readable portable recording medium such as a CD-ROM (Compact Disc Read Only Memory) or a DVD-ROM (Digital Versatile Disc Read Only Memory) using a known setup program or the like.

(Processing Equipment)
The processing device 48 includes one or more processors and their peripheral circuits. The processing device 48 is, for example, a CPU (Central Processing Unit) and controls the overall operation of the laser light irradiation control device 41. The processing device 48 also outputs control signals to the laser oscillation device 43 and the laser scanning device 42 via the interface device 47 to control the operations of these devices. The processing device 48 may be a DSP (Digital Signal Processor), an LSI (Large Scale Integration), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or the like. The processing device 48 executes processing based on a program previously stored in the storage device 44.

The processing device 48 realizes the functions of a machining surface profile generating means 49, a machining pattern generating means 50, an irradiation condition data generating means 51, a coordinate data group generating means 52, and an irradiation condition associating means 55. Each of these units is a functional module realized by a program executed by the processing device 48. In one embodiment, the processing device 48 may further realize the function of a virtual incident angle calculating means 53. In another embodiment, the processing device 48 may further realize the function of a coordinate data group dividing means 54.

(Display Device)
The display device 45 is a device that displays profile information showing the three-dimensional or two-dimensional shape of the generated processing surface or processing pattern, irradiation conditions, etc. A display such as an LCD (Liquid Crystal Display) can be used as the display device 45. In addition, if a touch panel system is used, the input device 46 can also be used as the display device 45.

(Input device)
The input device 46 is a device for inputting data such as profile information showing the three-dimensional shape of the processing surface 2 of the object to be processed (workpiece), profile information showing the two-dimensional or three-dimensional shape of the laser processing pattern, and various irradiation conditions of the laser light 4, and may be, for example, an input device such as a mouse, a keyboard, or a tablet. In one embodiment, a touch panel or the like is used for the display of the display device 45, allowing the user to input and operate by directly touching the screen with their hands. In addition, voice input or other existing input means can be used, or these can be used in combination.

(Interface device)
The interface device 47 may be a hardware interface such as a USB, or a network interface such as a wired LAN (Local Area Network) or a wireless LAN, and enables communication between the laser oscillator device 43 and the laser scanning device 42 and the laser light irradiation control device 41.

[Laser Scanning Device, Laser Oscillation Device]
The laser scanning device 42 and the laser oscillation device 43 are operated in conjunction with each other by a control signal generated by the processing device 48 of the laser light irradiation control device 41 to manufacture the metal wiring 1. The laser scanning device 42 is, for example, a galvano scanner, and the laser oscillation device 43 is, for example, a laser oscillator. The laser oscillation device 43 oscillates the laser light 4 under laser light irradiation conditions (e.g., center wavelength, pulse frequency, output of the laser light 4) associated with a group of XYZ three-dimensional coordinate data specifying a region to be irradiated with the laser light by the control signal. The laser scanning device 42 scans the laser light emitted from the laser oscillation device 43 on the specified processing surface 2 by the control signal under laser light irradiation conditions (e.g., spot diameter, defocus value, scanning line interval, scanning speed, scanning direction, number of scans of the laser light 4) associated with a group of XYZ three-dimensional coordinate data specifying a region to be irradiated with the laser light.

In one embodiment, the laser scanning device 42 and the laser oscillation device 43 may each have a control device therein. The laser scanning device 42 and the laser oscillation device 43 may generate a control signal for controlling the laser scanning device 42 and/or the laser oscillation device 43 based on the metal wiring manufacturing condition data output from the laser light irradiation control device 41.

FIG. 6 is a schematic diagram showing an example of a laser scanning device 42 in a metal wiring manufacturing apparatus 40 according to an embodiment of the present invention, in which the laser scanning device 42 is a galvanometer scanner. The laser light 4 emitted from the laser oscillation device 43 is scanned by the laser scanning device 42 and irradiated onto the film 5 to be treated on the object to be processed (work). In one aspect of the present invention, the metal wiring manufacturing apparatus 40 may be equipped with a work loading device (not shown) that moves the object to be processed (work) in the X-axis direction, Y-axis direction, or Z direction, and the laser light irradiation control device 41 may generate a control signal for operating the work loading device.

(Galvanometer scanner)
6, the galvanometer scanner as the laser scanning device 42 has an X-axis galvanometer mirror 42a, an X-axis galvanometer motor 42b, a Y-axis galvanometer mirror 42c, a Y-axis galvanometer motor 42d, and a Z-axis adjustment drive lens. Note that the fθ lens, which is a condenser lens, and the Z-axis adjustment drive lens are omitted in the figure. The X-axis galvanometer motor 42b, the Y-axis galvanometer motor 42d, and the Z-axis adjustment drive lens are electrically connected to the laser light irradiation control device 41.

The galvanometer scanner is configured to be able to control the rotation angle and rotation speed of the X-axis galvanometer motor 42b and the Y-axis galvanometer motor 42d and the focal length of the Z-axis adjustment drive lens according to a control signal from the laser light irradiation control device 41. The laser light 4 is scanned by the laser scanning device 42 and irradiated onto the surface of the processing target film 5 containing metal and/or metal oxide formed on the processing target (work).

In the above, an example of scanning the laser light 4 by the laser scanning device 42 has been shown, but the metal wiring 1 having a desired pattern may be produced by moving the work loading device (not shown) in the X-axis, Y-axis, and Z-axis directions. The work loading device may also have a function of tilting the stage from a horizontal state. The laser scanning device 42 (galvanometer scanner) shown in FIG. 6 uses the X-axis galvanometer mirror 42a and the X-axis galvanometer motor 42b for movement in the X-axis and Y-axis directions, respectively, but it is also possible to use the galvanometer mirror for either the X-axis or the Y-axis, for example, to use the galvanometer mirror for movement only in the X-axis direction and the motor of the work loading device for movement in the Y-axis direction. Similarly, it is also possible to use the galvanometer mirror for movement in the X-axis and Y-axis directions and the motor of the work loading device for movement in the Z-axis direction.

<Metal wiring manufacturing condition setting program>
Yet another embodiment of the present invention is a program for setting metal wiring manufacturing conditions to form metal wiring by repeatedly or unidirectionally irradiating a laser beam in a main scanning direction with a predetermined scanning period on a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a substrate as a processing surface of a processing object, to form a scanning line having a predetermined width, while displacing the scanning line in a sub-scanning direction different from the main scanning direction for each scanning period,
generating profile information indicating a three-dimensional shape of at least a processing surface of the object to be processed;
Specify the surface to be processed by irradiating the laser beam,
generating profile information indicative of one or more XY two-dimensional processing patterns;
generating an XYZ three-dimensional coordinate data group for specifying a region to be irradiated with laser light on the specified processing surface based on the XY two-dimensional processing pattern; and associating information on laser light irradiation conditions with the XYZ three-dimensional coordinate data group;
The present invention relates to a metal wiring manufacturing condition setting program, or a computer-readable recording medium or device having the program stored therein, which causes a laser light irradiation control device to execute the above-mentioned steps.

The computer may have a general hardware configuration including a CPU, main memory, storage, input/output devices, hardware interfaces, etc. The recording medium may include memory devices such as RAM and ROM, and portable storage devices such as CD-ROM, DVD-ROM, and optical disks. The programs may be distributed by downloading over a network such as the Internet, in addition to those stored on the recording medium. The recorded devices may include general-purpose or dedicated devices in which the programs are implemented in an executable state in the form of software or firmware. The processes and functions included in the program may be executed by computer-executable program software, or the processes of each part may be realized by a specific hardware, or a mixture of program software and partial hardware modules that realize some elements of the hardware.

Note that in the metal wiring manufacturing condition setting program disclosed herein, specific examples of various aspects other than those specifically described below may be similar to those described above in <Method of manufacturing metal wiring>, and the description will not be repeated here. In one aspect, the metal wiring manufacturing condition setting program causes a computer to execute the following process shown in the flowchart of FIG. 7.

(Step of generating profile information indicating a three-dimensional shape)
7, first, the machining surface profile generating means 49, which is a functional block of the processing device 48, generates profile information indicating the three-dimensional shape of the workpiece (work) or the machining surface 2 (step S101). The generation method may include a method of converting a data file of profile information indicating the three-dimensional shape created in advance to the shape of the workpiece (work) or the machining surface 2, or a method of reading and acquiring profile information acquired by actually recognizing the image of the workpiece (work) or the machining surface 2 with an image recognition device such as an image sensor. As one aspect, the above step S101 may include a step of virtually displaying the generated three-dimensional shape on the display device 45 in a three-dimensional form.

(Step to specify the machining surface)
Next, the processing surface designation means, which is a functional block of the processing device 48, designates the processing surface 2 to be irradiated with the laser beam from among the three-dimensional shapes of the object to be processed (work) or the multiple processing surfaces 2 generated in the above step S101 (step S102). As an embodiment of the processing surface designation means, a method is used in which the user interactively designates the processing surface 2 to be irradiated with the laser beam from among the three-dimensional shapes of the object to be processed (work) or the multiple processing surfaces 2 displayed on the display of the display device 45.

(Step of generating profile information indicative of a two-dimensional processing pattern)
Next, the processing pattern generating means 50, which is a functional block of the processing device 48, generates profile information indicating a two-dimensional processing pattern of the desired shape of the metal wiring 1 (step S103). One embodiment of the processing pattern generating means 50 includes a method of converting a data file of profile information indicating a previously created two-dimensional shape into the shape of the two-dimensional processing pattern, and a method of generating a two-dimensional processing pattern based on parameters for specifying the shape of the two-dimensional processing pattern inputted by a user in an interactive manner from the input device 46. As another embodiment, the above step S103 may include a step of virtually displaying the generated two-dimensional processing pattern shape in a two-dimensional or three-dimensional form on the display device 45.

(Step of generating XYZ three-dimensional coordinate data group)
Next, the coordinate data group generating means 52, which is a functional block of the processing device 48, generates an XYZ three-dimensional coordinate data group that specifies the region to be irradiated with the laser beam (step S104). In one aspect, the step of generating the XYZ three-dimensional coordinate data group is a step of projecting the two-dimensional processing pattern generated in the above step S103 (for example, projecting the XY two-dimensional processing pattern in the Z-axis direction) and converting the data into an XYZ three-dimensional coordinate data group by performing coordinate conversion so as to virtually match the three-dimensional processing surface 2 having three-dimensional coordinate information.

In one aspect of the present invention, after step S104 and before the associating step (step S108), the following steps may be included: calculating a virtual angle of incidence (step S105), dividing the three-dimensional coordinate data group (step S106), and generating irradiation condition data (step S107). Each step will be described below. Note that steps S105, S106, and S107 can be omitted.

(Step of calculating virtual angle of incidence)
In the step of calculating the virtual incidence angle, the virtual incidence angle calculation means 53, which is a functional block of the processing device 48, calculates the virtual incidence angle of the laser beam 4 in each of the XYZ three-dimensional coordinate data groups representing the three-dimensional processing pattern generated in the above step S104, thereby generating a virtual incidence angle data group (step S105). This makes it possible to impart information on the virtual incidence angle that affects the heating conditions by the laser beam irradiation to the XYZ three-dimensional coordinate data group that specifies the region to be irradiated with the laser beam.

(Step of Dividing Three-Dimensional Coordinate Data Group)
In the step of dividing the three-dimensional coordinate data group, the coordinate data group dividing means 54, which is a functional block of the processing device 48, divides the XYZ three-dimensional coordinate data group by the virtual incident angle calculated in the above step S105 (step S106). This allows the laser irradiation conditions to be set collectively for each divided XYZ three-dimensional coordinate data group, so that the condition setting can be performed efficiently. As one aspect, in step S106, a threshold value may be set at a numerical value selected from the absolute value of the XYZ coordinates, the value of the virtual incident angle, the distance from an arbitrarily determined reference plane, etc., and the three-dimensional processing pattern may be divided into a plurality of regions by the threshold value.

(Step of generating irradiation condition data)
In the step of generating the irradiation condition data, the irradiation condition data generating means 51, which is a functional block of the processing device 48, generates the laser irradiation conditions (step S107). The irradiation conditions are defined by the above-mentioned scanning parameters. One aspect of step S107 is a method of manually setting the scanning parameters from the input device 46, or a method of automatically generating the irradiation conditions based on the data structure stored in the storage device 44. In another aspect, for the three-dimensional processing pattern divided into a plurality of regions in the above-mentioned S106, different laser irradiation conditions may be generated between the regions. In another aspect, the laser irradiation conditions may be continuously changed in conjunction with a numerical value selected from the absolute values of the XYZ coordinates, the above-mentioned virtual angle of incidence, the distance from an arbitrarily determined reference plane, etc.

(Associating step)
Next, the irradiation condition associating means 55, which is a functional block of the processing device 48, associates information on the laser beam irradiation conditions with the XYZ three-dimensional coordinate data group that specifies the region to be irradiated with the laser beam (step S108). Examples of scanning parameters that define the laser irradiation conditions include the central wavelength of the laser beam, the pulse frequency, the output, the spot diameter, the defocus value, the scanning line interval, the scanning speed, the scanning direction, and the number of scans. This allows appropriate laser irradiation conditions to be set at each point regardless of the positional relationship between the scanning point on the processing surface 2 and the laser output device, so that the resistance value of the entire metal wiring 1 can be made uniform.

(Output step)
After the final metal wiring manufacturing conditions are generated and the setting work is completed by the above procedure, the processing device 48 outputs a control signal for controlling the laser scanning device 42 and the laser oscillation device 43 based on the XYZ three-dimensional coordinate data group with which the laser irradiation conditions are associated in the above step S108 (step S109). The control signal is transmitted to the laser scanning device 42 and the laser oscillation device 43 via the interface device 47. In one aspect, the XYZ three-dimensional coordinate data group with which the laser irradiation conditions are associated may be stored in the storage device 44 as metal wiring manufacturing condition data, or may be output from the interface device 47 as metal wiring manufacturing condition data.

[Example 1]
(Preparation of Paste Material)
80 g of copper(II) acetate monohydrate (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) was dissolved in a mixed solvent consisting of 800 g of water and 400 g of 1,2-propylene glycol (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.), 20 g of hydrazine hydrate (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) was added, and the mixture was stirred, and then separated into a supernatant and a precipitate by centrifugation.

0.4 g of DISPERBYK-145 (product name, manufactured by BYK-Chemie) (BYK-145) as a phosphorus-containing organic compound and 6.6 g of ethanol (manufactured by Fujifilm Wako Pure Chemical Industries) as a dispersion medium were added to 2.8 g of the obtained precipitate, and dispersed using a homogenizer. Dilution and concentration with ethanol were further repeated, thereby obtaining a paste material containing cuprous oxide fine particles including cuprous oxide (copper(I) oxide). The final composition was 2.8 g of precipitate, 0.4 g of BYK-145, 6.6 g of ethanol, and 0.01 g of hydrazine hydrate.

(Formation of treated film)
A flat polyimide film substrate (the arithmetic mean surface roughness Ra of the surface on which the treated film is formed is 0.24 μm) was prepared as the substrate 3, and the surface was subjected to UV ozone treatment, after which the paste material was spin-coated (500 rpm x 30 seconds), dried at 25°C for 10 minutes, and then dried at 90°C for 2 hours, to obtain a structure 1 in which a coating film having a thickness of 3.5 μm was formed on the substrate 3. Furthermore, a polygonal half-pipe shape made of vinyl chloride was prepared, and the structure 1 was attached to the inner surface of the half-pipe without any gaps to obtain a structure 2.

(Metal wiring manufacturing equipment)
A metal wiring manufacturing apparatus was prepared, which consisted of a Talon 355 manufactured by SpectraPhysics Co., Ltd. as a laser oscillator, a YD-300 manufactured by Yaskawa Electric Co., Ltd. as a galvanometer scanner, a SUF-500 manufactured by Satako Co., Ltd. as a nitrogen generator, a glass window portion attached to one side of a box-shaped sample chamber made of aluminum alloy A5052, a nitrogen gas inlet and an exhaust gas outlet, and an oxygen concentration meter disposed inside the sample chamber, and a ZBook 15 G5 manufactured by Hewlett-Packard Co. as a computer. The light transmittance of the glass of the window portion at a wavelength of 355 nm was measured using an ultraviolet-visible spectrophotometer (UV-3600 manufactured by Shimadzu Corporation), and was 92.2%.

The metal wiring manufacturing device described above was equipped with an attenuator that could be controlled by a computer, which adjusted the output of the laser light. The laser oscillator also had an internal FPS function that prevented an excessively large initial pulse from being generated at the start of emission. Furthermore, a beam expander was provided at a position before the laser light was introduced into the galvano scanner, and the size of the spot diameter at the focal position was controlled by expanding or reducing the diameter of the laser light.

(Installation of sample)
The structure 2 was placed in the sample chamber. Nitrogen gas, which is an inert gas, was allowed to flow until the oxygen concentration measured by an oxygen concentration meter installed in the sample chamber reached 1% by volume or less. The structure 2 was positioned so that the angles of incidence of the laser light at the start point of the scanning line (i.e., the start point of irradiation) were 30°, 45°, and 60°.

(Laser beam firing and conductivity evaluation)
The laser light irradiation conditions were changed at a certain angle θ as the boundary for the incident angle of the laser light. Here, θ was set to 48°. While being controlled by a computer, a galvano scanner was used to irradiate the structure 2 in a nitrogen gas atmosphere with laser light (center wavelength 355 nm, frequency 300 kHz, pulse width 15 ns, output 420 mW, output density 0.025 mW/μm ² ) at the portion with an incident angle of 30° and 45°. In addition, the structure 2 was irradiated under the same conditions as those for irradiating the portion with an incident angle of 30° and 45°, except that the output was 628 mW and the output density was 0.037 mW/μm ² at the portion with an incident angle of 60°.

The focal position of the laser light (spot diameter 146 μm) was moved 5 mm in the main scanning direction (+X direction in the XYZ three-dimensional coordinate system) at a maximum speed of 5 mm/sec (scanning line 1), then moved 20 μm in the sub-scanning direction (+Y direction in the XYZ three-dimensional coordinate system), which is a direction perpendicular to the main scanning direction, and moved again in the main scanning direction (-X direction in the XYZ three-dimensional coordinate system) at a maximum speed of 5 mm/sec (scanning line 2). The ratio (overlap rate) of the width of the area where the scanning lines 1 and 2 overlap with respect to the width of the scanning lines 1 and 2, 146 μm, was about 86%. By repeating this operation and scanning while moving the irradiation point in the sub-scanning direction by 20 μm each, a copper-containing metal wiring having a desired length (scanning length) of 5 mm x width 1 mm was obtained at each of the portions with angles of incidence of 30°, 45°, and 60°.
Although the angles of incidence were different, the laser beam was irradiated continuously in a single stroke.

The conductivity of the resulting metal wiring was evaluated using a digital multimeter AD7461 (manufactured by ADVANTEST). A tester was placed on both ends of the metal wiring in the longitudinal direction to evaluate the resistance value. The average resistance value when the evaluation was repeated three times was 0.25 Ω at an incidence angle of 30°, 0.3 Ω at 45°, and 0.26 Ω at 60°, resulting in wiring with a nearly uniform resistance value.

[Reference Example 1]
The predetermined angle θ was set to 61° in the same manner as in Example 1. When the incident angle was 60°, the same laser irradiation conditions as in Example 1 were used, except that the same conditions were used for the incident angles of 30° and 45°. The copper-containing metal wiring with dimensions of 5 mm length x 1 mm width was obtained at each of the incident angles of 30°, 45°, and 60°. The conductivity of the obtained metal wiring was evaluated using a digital multimeter AD7461 (manufactured by ADVANTEST). A tester was applied to both ends of the metal wiring in the longitudinal direction to evaluate the resistance value. The average resistance value when evaluated three times was 0.25Ω at an incident angle of 30°, 0.3Ω at 45°, and 1.9Ω at 60°, and the wiring had a significantly high resistance value at the incident angle of 60°.

The present invention can obtain metal wiring with uniform resistance even when the machining surface of the workpiece changes three-dimensionally, making it suitable for use in direct wiring printing technology, in which paste material applied to a substrate is selectively thermally fired to directly print the desired wiring pattern shape.

REFERENCE SIGNS LIST 1 Metal wiring 2 Processing surface 3 Substrate 4 Laser light 5 Film to be processed 11, 12 Scanning line 40 Metal wiring manufacturing device 41 Laser light irradiation control device 42 Laser scanning device 42a X-axis galvanometer mirror 42b X-axis galvanometer motor 42c Y-axis galvanometer mirror 42d Y-axis galvanometer motor 43 Laser oscillation device 44 Storage device 45 Display device 46 Input device 47 Interface device 48 Processing device 49 Processing surface profile generation means 50 Processing pattern generation means 51 Irradiation condition data generation means 52 Coordinate data group generation means 53 Virtual incident angle calculation means 54 Coordinate data group division means 55 Irradiation condition association means I Scanning line D Scanning direction L Scanning length P Irradiation point θ Virtual incident angle

Claims (36)

A method for manufacturing metal wiring, which comprises irradiating a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a base material as a processing surface of an object to be processed with laser light that displays a laser spot of a predetermined size repeatedly or in one direction in a main scanning direction with a predetermined scanning period to form a scanning line having a predetermined width while displacing the scanning line in a sub-scanning direction different from the main scanning direction for each scanning period to form a metal wiring, comprises the steps of:
generating profile information indicating a three-dimensional shape of at least a processing surface of the object to be processed;
A step of designating a processing surface to be irradiated with laser light;
generating profile information indicative of one or more XY two-dimensional machining patterns;
generating an XYZ three-dimensional coordinate data group that specifies a region to be irradiated with laser light on the specified processing surface based on the XY two-dimensional processing pattern;
a step of associating information on laser light irradiation conditions with the XYZ three-dimensional coordinate data group; and a step of forming metal wiring by irradiating the specified processing surface with laser light under the associated laser light irradiation conditions using the XYZ three-dimensional coordinate data group.
Including,
In the step of associating,
Specify the XYZ coordinate α indicating the virtual laser light source,
a virtual incidence angle is calculated for all XYZ coordinates in the XYZ three-dimensional coordinate data group, the virtual incidence angle being an acute angle formed by a normal line of the specified machining surface at the XYZ coordinate β with respect to a straight line connecting the XYZ coordinate α and an XYZ coordinate β selected from the XYZ three-dimensional coordinate data group; and
The method for manufacturing metal wiring further comprises associating the group of virtual incident angle data with information on the laser light irradiation conditions . Dividing the virtual incident angle data group into two or more divided groups according to a preset virtual incident angle threshold value;
The method for manufacturing a metal wiring according to claim 1 , wherein the group of virtual incident angle data is associated with information on laser light irradiation conditions that are made different for each of the divided groups. In the step of associating,
if an acute angle formed by a straight line drawn from the XYZ coordinate α to the XYZ coordinate β and a normal line of the specified machining surface at the XYZ coordinate β is equal to or greater than a predetermined angle θ, the XYZ three-dimensional coordinate data group is divided into an XYZ three-dimensional coordinate data group having an angle equal to or greater than the predetermined angle θ and an XYZ three-dimensional coordinate data group having an angle less than the predetermined angle θ;
3. The method for manufacturing metal wiring according to claim 2 , wherein each of the divided XYZ three-dimensional coordinate data groups is associated with information on the laser light irradiation conditions. 4. The method for manufacturing a metal wiring according to claim 3 , wherein the predetermined angle θ is within a range of 40° to 50°. 4. The method for manufacturing metal wiring according to claim 3, wherein in the dividing step, the predetermined angle θ is set as a plurality of predetermined angles θ1 and θ2, and the XYZ three-dimensional coordinate data group is divided into three: less than the predetermined angle θ1, at least the predetermined angle θ1 and less than the predetermined angle θ2, and at least the predetermined angle θ2 . The predetermined angle θ1 is within a range of 30° to 40°,
6. The method for manufacturing a metal wiring according to claim 5 , wherein the predetermined angle θ2 is larger than the predetermined angle θ1 and is within a range of 40° to 50°. 2. The method for manufacturing a metal wiring according to claim 1 , wherein the group of virtual incident angle data is associated with information on laser light irradiation conditions that are varied for each virtual incident angle value indicated by the group of virtual incident angle data. the laser light irradiation conditions are preset conditions based on property data of the film,
The method for manufacturing a metal wiring according to any one of claims 1 to 7, wherein the property data includes data on a thickness of the film and a penetration length at a wavelength of the laser light. A method for manufacturing metal wiring, which comprises irradiating a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a base material as a processing surface of an object to be processed with laser light that displays a laser spot of a predetermined size repeatedly or in one direction in a main scanning direction with a predetermined scanning period to form a scanning line having a predetermined width while displacing the scanning line in a sub-scanning direction different from the main scanning direction for each scanning period to form a metal wiring, comprises the steps of:
generating profile information indicating a three-dimensional shape of at least a processing surface of the object to be processed;
A step of designating a processing surface to be irradiated with laser light;
generating profile information indicative of one or more XY two-dimensional machining patterns;
generating an XYZ three-dimensional coordinate data group that specifies a region to be irradiated with laser light on the specified processing surface based on the XY two-dimensional processing pattern;
a step of associating information on laser light irradiation conditions with the XYZ three-dimensional coordinate data group; and a step of forming metal wiring by irradiating the specified processing surface with laser light under the associated laser light irradiation conditions using the XYZ three-dimensional coordinate data group.
Including,
the laser light irradiation conditions are preset conditions based on property data of the film,
A method for manufacturing metal wiring, wherein the property data includes data on the thickness of the film and the penetration length at the wavelength of the laser light . 10. The method for producing a metal wiring according to claim 9 , wherein the film has a thickness of 0.1 μm to 20 μm and a laser penetration length at a wavelength of 355 nm of 0.1 μm to 10 μm. The method for producing a metal wiring according to claim 1 , wherein the particles are sintered by the irradiation of the laser light. The method for producing a metal wiring according to any one of claims 1 to 11 , wherein the film is a coating film formed on the substrate. The step of generating the profile information further includes a step of virtually displaying the three-dimensional shape or the XY two-dimensional processing pattern in a three-dimensional or two-dimensional form.
The method for producing a metal wiring according to any one of claims 1 to 12 . The step of generating the XYZ three-dimensional coordinate data group is a step of projecting the XY two-dimensional processing pattern in a Z-axis direction and converting the XY two-dimensional processing pattern into the XYZ three-dimensional coordinate data group so as to virtually match the XY two-dimensional processing pattern.
The method for producing a metal wiring according to any one of claims 1 to 13 . The method for manufacturing a metal wiring according to any one of claims 1 to 14 , wherein the displacement is such that the scan line widths overlap each other by 5% to 99.5%. 16. The method for producing a metal wiring according to claim 1, wherein the metal includes at least one selected from the group consisting of copper, silver, gold, tin, and aluminum. The method for producing a metal wiring according to any one of claims 1 to 16 , wherein the metal oxide is copper oxide. The method for producing a metal wiring according to any one of claims 1 to 17 , wherein the film is formed from a dispersion containing the particles and a dispersant. The method for producing a metal wiring according to claim 18 , wherein the dispersant contains a phosphorus-containing organic compound. The method for manufacturing a metal wiring according to any one of claims 1 to 19 , wherein the laser light has an emission wavelength with a center wavelength of 355 nm or more and 550 nm or less. A metal wiring manufacturing device for forming metal wiring by irradiating a laser beam that displays a laser spot of a predetermined size on a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a substrate as a processing surface of a processing object, in a main scanning direction with a predetermined scanning period or in one direction, to form a scanning line having a predetermined width, while displacing the laser beam in a sub-scanning direction different from the main scanning direction for each scanning period,
The metal wiring manufacturing apparatus comprises:
A laser oscillator that generates laser light;
A laser scanning device that scans the laser light emitted from the laser oscillation device; and a laser light irradiation control device that controls the laser oscillation device and the laser scanning device.
Equipped with
The laser light irradiation control device,
a processing surface profile generating means for generating profile information indicating a three-dimensional shape relating to at least a processing surface of the object to be processed;
A processing pattern generating means for generating profile information indicating one or more XY two-dimensional processing patterns;
a coordinate data group generating means for generating an XYZ three-dimensional coordinate data group for designating a region to be irradiated with laser light on a designated processing surface based on the XY two-dimensional processing pattern;
an irradiation condition associating means for associating information on laser light irradiation conditions with the XYZ three-dimensional coordinate data group ;
The laser light irradiation control device further includes:
a virtual incidence angle calculation means for generating a group of virtual incidence angle data by designating an XYZ coordinate α indicating a virtual laser light source, and calculating a virtual incidence angle, which is an acute angle formed by a normal line of the processing surface at the XYZ coordinate β with respect to a straight line connecting the XYZ coordinate α and an XYZ coordinate β selected from the group of XYZ three-dimensional coordinate data, for all XYZ coordinates in the group of XYZ three-dimensional coordinate data;
a coordinate data group dividing means for dividing the XYZ three-dimensional coordinate data group into an XYZ three-dimensional coordinate data group having an angle equal to or greater than the predetermined angle θ and an XYZ three-dimensional coordinate data group having an angle less than the predetermined angle θ, when an acute angle formed by a straight line drawn from the XYZ coordinate α to the XYZ coordinate β and a normal line to the processing surface at the XYZ coordinate β is equal to or greater than a predetermined angle θ;
The metal wiring manufacturing apparatus has the laser light irradiation conditions are preset conditions based on property data of the film,
22. The metal wiring manufacturing apparatus according to claim 21, wherein the property data includes data on a thickness of the film and a penetration length at a wavelength of the laser light. A metal wiring manufacturing device for forming metal wiring by irradiating a laser beam that displays a laser spot of a predetermined size on a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a substrate as a processing surface of a processing object, in a main scanning direction with a predetermined scanning period or in one direction, to form a scanning line having a predetermined width, while displacing the laser beam in a sub-scanning direction different from the main scanning direction for each scanning period,
The metal wiring manufacturing apparatus comprises:
A laser oscillator that generates laser light;
A laser scanning device that scans the laser light emitted from the laser oscillation device; and a laser light irradiation control device that controls the laser oscillation device and the laser scanning device.
Equipped with
The laser light irradiation control device,
a processing surface profile generating means for generating profile information indicating a three-dimensional shape relating to at least a processing surface of the object to be processed;
A processing pattern generating means for generating profile information indicating one or more XY two-dimensional processing patterns;
a coordinate data group generating means for generating an XYZ three-dimensional coordinate data group for designating a region to be irradiated with laser light on a designated processing surface based on the XY two-dimensional processing pattern;
and an irradiation condition associating means for associating information on laser light irradiation conditions with the XYZ three-dimensional coordinate data group, the laser light irradiation conditions being conditions preset based on property data of the film, the property data including data on the thickness of the film and the penetration length at the wavelength of the laser light . The laser light irradiation control device further includes a display device capable of virtually displaying the three-dimensional shape or the XY two-dimensional processing pattern in a three-dimensional or two-dimensional form. The metal wiring manufacturing apparatus according to any one of claims 21 to 23 . The metal wiring manufacturing apparatus according to any one of claims 21 to 24, wherein the coordinate data group generation means is a coordinate conversion means that converts the XY two-dimensional processing pattern into the XYZ three-dimensional coordinate data group so as to project the XY two-dimensional processing pattern in the Z-axis direction onto the specified processing surface and virtually match it . A laser light irradiation control device controls a laser oscillator and a laser scanner to irradiate a laser beam that displays a laser spot of a predetermined size on a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a substrate as a processing surface of an object to be processed, in a main scanning direction repeatedly or in one direction with a predetermined scanning period to form a scanning line having a predetermined width, while displacing the laser beam in a sub-scanning direction different from the main scanning direction for each scanning period to form a metal wiring, based on one or more two-dimensional processing pattern data;
a processing surface profile generating means for generating profile information indicating a three-dimensional shape relating to at least a processing surface of the object to be processed;
A processing pattern generating means for generating profile information indicating one or more XY two-dimensional processing patterns;
a coordinate data group generating means for generating an XYZ three-dimensional coordinate data group for designating a region to be irradiated with laser light on a designated processing surface based on the XY two-dimensional processing pattern;
an irradiation condition associating means for associating information on laser light irradiation conditions with the XYZ three-dimensional coordinate data group ;
The laser light irradiation control device further includes:
a virtual incidence angle calculation means for generating a group of virtual incidence angle data by designating an XYZ coordinate α indicating a virtual laser light source, and calculating a virtual incidence angle, which is an acute angle formed by a normal line of the processing surface at the XYZ coordinate β with respect to a straight line connecting the XYZ coordinate α and an XYZ coordinate β selected from the group of XYZ three-dimensional coordinate data, for all XYZ coordinates in the group of XYZ three-dimensional coordinate data;
a coordinate data group dividing means for dividing the XYZ three-dimensional coordinate data group into an XYZ three-dimensional coordinate data group having an angle equal to or greater than the predetermined angle θ and an XYZ three-dimensional coordinate data group having an angle less than the predetermined angle θ, when an acute angle formed by a straight line drawn from the XYZ coordinate α to the XYZ coordinate β and a normal line to the processing surface at the XYZ coordinate β is equal to or greater than a predetermined angle θ;
A laser light irradiation control device having the above structure. the laser light irradiation conditions are preset conditions based on property data of the film,
27. The laser light irradiation control device according to claim 26, wherein the property data includes data on a thickness of the film and a penetration depth at the wavelength of the laser light. A laser light irradiation control device controls a laser oscillator and a laser scanner to irradiate a laser beam that displays a laser spot of a predetermined size on a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a substrate as a processing surface of an object to be processed, in a main scanning direction repeatedly or in one direction with a predetermined scanning period to form a scanning line having a predetermined width, while displacing the laser beam in a sub-scanning direction different from the main scanning direction for each scanning period to form a metal wiring, based on one or more two-dimensional processing pattern data;
a processing surface profile generating means for generating profile information indicating a three-dimensional shape relating to at least a processing surface of the object to be processed;
A processing pattern generating means for generating profile information indicating one or more XY two-dimensional processing patterns;
a coordinate data group generating means for generating an XYZ three-dimensional coordinate data group for designating a region to be irradiated with laser light on a designated processing surface based on the XY two-dimensional processing pattern;
a laser light irradiation control device having an irradiation condition associating means for associating information on laser light irradiation conditions with the XYZ three-dimensional coordinate data group, the laser light irradiation conditions being conditions that are preset based on property data of the film, and the property data including data on the thickness of the film and the penetration length at the wavelength of the laser light . The laser light irradiation control device according to any one of claims 26 to 28, further comprising a display device capable of virtually displaying the three-dimensional shape or the XY two-dimensional processing pattern in a three-dimensional or two-dimensional form. The laser light irradiation control device according to any one of claims 26 to 29, wherein the coordinate data group generation means is a coordinate conversion means that converts the XY two-dimensional processing pattern into the XYZ three-dimensional coordinate data group so as to project the XY two-dimensional processing pattern in the Z-axis direction onto the specified processing surface and virtually match it . A program for setting metal wiring manufacturing conditions for forming metal wiring by repeatedly or unidirectionally irradiating a laser beam in a main scanning direction with a predetermined scanning period onto a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a substrate as a processing surface of an object to be processed, thereby forming a scanning line having a predetermined width, while displacing the laser beam in a sub-scanning direction different from the main scanning direction for each scanning period,
generating profile information indicating a three-dimensional shape of at least a processing surface of the object to be processed;
Specify the surface to be processed by irradiating the laser beam,
generating profile information indicative of one or more XY two-dimensional processing patterns;
generating an XYZ three-dimensional coordinate data group for designating a region to be irradiated with laser light on a designated processing surface based on the XY two-dimensional processing pattern; and associating information on laser light irradiation conditions with the XYZ three-dimensional coordinate data group ;
In the above association,
Specify the XYZ coordinate α indicating the virtual laser light source,
a virtual incidence angle is calculated for all XYZ coordinates in the XYZ three-dimensional coordinate data group, the virtual incidence angle being an acute angle formed by a normal line of the specified machining surface at the XYZ coordinate β with respect to a straight line connecting the XYZ coordinate α and an XYZ coordinate β selected from the XYZ three-dimensional coordinate data group; and
Associating the virtual incident angle data group with information on the laser light irradiation conditions;
A metal wiring manufacturing condition setting program that causes a laser light irradiation control device to execute the above. the laser light irradiation conditions are preset conditions based on property data of the film,
32. The metal wiring manufacturing condition setting program according to claim 31, wherein the property data includes data on a thickness of the film and a penetration length at a wavelength of the laser light. A program for setting metal wiring manufacturing conditions for forming metal wiring by repeatedly or unidirectionally irradiating a laser beam in a main scanning direction with a predetermined scanning period onto a part of a three-dimensional surface of a film containing metal and/or metal oxide particles arranged on a substrate as a processing surface of an object to be processed, thereby forming a scanning line having a predetermined width, while displacing the laser beam in a sub-scanning direction different from the main scanning direction for each scanning period,
generating profile information indicating a three-dimensional shape of at least a processing surface of the object to be processed;
Specify the surface to be processed by irradiating the laser beam,
generating profile information indicative of one or more XY two-dimensional processing patterns;
generating an XYZ three-dimensional coordinate data group specifying a region to be irradiated with laser light on a specified processing surface based on the XY two-dimensional processing pattern; and associating, with the XYZ three-dimensional coordinate data group, information on laser light irradiation conditions, the laser light irradiation conditions being conditions preset based on property data of the film, the property data including data on the thickness of the film and the penetration length at the wavelength of the laser light .
A metal wiring manufacturing condition setting program that causes a laser light irradiation control device to execute the above. The step of generating the profile information further includes a step of virtually displaying the three-dimensional shape or the XY two-dimensional processing pattern in a three-dimensional or two-dimensional form.
The metal wiring manufacturing condition setting program according to any one of claims 31 to 33 . The step of generating the XYZ three-dimensional coordinate data group is a step of projecting the XY two-dimensional processing pattern in a Z-axis direction and converting the XY two-dimensional processing pattern into the XYZ three-dimensional coordinate data group so as to virtually match the XY two-dimensional processing pattern.
The metal wiring manufacturing condition setting program according to any one of claims 31 to 34 . A computer-readable recording medium or a recording device storing the metal wiring manufacturing condition setting program according to any one of claims 31 to 35 .

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