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JP7624866B2 - Method for producing multi-stage expanded polyamide resin beads - Google Patents
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JP7624866B2 - Method for producing multi-stage expanded polyamide resin beads - Google Patents

Method for producing multi-stage expanded polyamide resin beads Download PDF

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JP7624866B2
JP7624866B2 JP2021067892A JP2021067892A JP7624866B2 JP 7624866 B2 JP7624866 B2 JP 7624866B2 JP 2021067892 A JP2021067892 A JP 2021067892A JP 2021067892 A JP2021067892 A JP 2021067892A JP 7624866 B2 JP7624866 B2 JP 7624866B2
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expanded
polyamide
beads
internal pressure
polyamide resin
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JP2022068821A (en
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哲 大塚
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JSP Corp
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Priority to PCT/JP2021/037922 priority Critical patent/WO2022085538A1/en
Priority to EP21882679.0A priority patent/EP4234615A4/en
Priority to CN202180069512.1A priority patent/CN116490547A/en
Priority to US18/030,561 priority patent/US20230407035A1/en
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Description

本発明は、ポリアミド系樹脂発泡粒子の製造方法であって、より詳しくは、多段発泡により高発泡倍率のポリアミド系樹脂発泡粒子の提供を可能とするポリアミド系樹脂多段発泡粒子の製造方法に関する。 The present invention relates to a method for producing expanded polyamide resin beads, and more specifically, to a method for producing multi-stage expanded polyamide resin beads that can provide expanded polyamide resin beads with a high expansion ratio through multi-stage expansion.

ポリアミド系樹脂は、一般的な樹脂材料の中では耐熱性が高く、また耐摩耗性、耐薬品性等にも優れた樹脂として知られている。このポリアミド系樹脂を発泡させた発泡成形体は、それらの優れた特性を保ちつつ、より軽量化を図ることが可能である。そのため、ポリアミド系樹脂発泡成形体は、自動車部品その他の用途への展開が期待される。たとえば、特許文献1には、耐熱性及び遮音性に優れたポリアミド系樹脂発泡成形体が開示されている。 Among common resin materials, polyamide resins are known to have high heat resistance, as well as excellent abrasion resistance and chemical resistance. Foam molded products made from this polyamide resin can be made lighter while retaining these excellent properties. For this reason, polyamide resin foam molded products are expected to be used in automobile parts and other applications. For example, Patent Document 1 discloses a polyamide resin foam molded product with excellent heat resistance and sound insulation.

近年、より軽量な発泡粒子成形体が求められることがある。熱可塑性樹脂発泡粒子の技術分野において、発泡粒子成形体を軽量化させる手法として、多段発泡法が知られている。多段発泡法とは、発泡粒子に加圧空気または二酸化炭素等の物理発泡剤を含浸させて内圧を付与した後、加熱して元の発泡粒子よりも見掛け密度の小さな発泡粒子を得る発泡手法をいう。特許文献1においても、ビーズ発泡成形に用いられるポリアミド系樹脂発泡粒子の発泡倍率を上げるために、多段発泡を行うことが記載されている。 In recent years, there has been a demand for lighter expanded bead moldings. In the technical field of thermoplastic resin expanded beads, a multi-stage expansion method is known as a method for reducing the weight of expanded bead moldings. The multi-stage expansion method refers to an expansion method in which expanded beads are impregnated with a physical foaming agent such as pressurized air or carbon dioxide to apply internal pressure, and then heated to obtain expanded beads with a lower apparent density than the original expanded beads. Patent Document 1 also describes the use of multi-stage expansion to increase the expansion ratio of polyamide resin expanded beads used in bead expansion molding.

WO2016/147582WO2016/147582

しかしながら、従来、ポリアミド系樹脂発泡粒子の多段発泡は、ポリオレフィン系樹脂発泡粒子等と比較して生産性に劣るという課題のあるものであった。たとえば、特許文献1に記載されたポリアミド系樹脂発泡粒子の多段発泡は、ポリアミド系樹脂発泡粒子に物理発泡剤を含浸させる際の温度を高温に保たなければならず、装置に対する負荷が大きく、製造コストの高いものであった。また、特に見掛け密度の小さなポリアミド系樹脂発泡粒子を製造する場合には、ポリアミド系樹脂発泡粒子に対して物理発泡剤を含浸させ加圧した状態を24時間保持し、次いで230℃で加熱して再発泡させるという工程を2度繰り返すことが記載されており、装置に対する負荷が大きいことに加え、長時間を要するものであった。そのため、従来の多段発泡法によるポリアミド系樹脂多段発泡粒子の製造方法は、生産性が低く工業生産に不適であった。 However, conventionally, multi-stage expansion of polyamide-based resin expanded particles has a problem of inferior productivity compared to polyolefin-based resin expanded particles. For example, in the multi-stage expansion of polyamide-based resin expanded particles described in Patent Document 1, the temperature must be kept high when impregnating the polyamide-based resin expanded particles with a physical foaming agent, which places a large load on the equipment and results in high production costs. In addition, when producing polyamide-based resin expanded particles with a particularly small apparent density, it is described that the polyamide-based resin expanded particles are impregnated with a physical foaming agent, the pressurized state is maintained for 24 hours, and then heated at 230°C to re-expand, and this process is repeated twice, which places a large load on the equipment and requires a long time. Therefore, the conventional method for producing multi-stage polyamide-based resin expanded particles using the multi-stage expansion method has low productivity and is not suitable for industrial production.

本発明は、上述のような課題に鑑みてなされた新規なポリアミド系樹脂多段発泡粒子の製造方法に関する。すなわち、本発明は、見掛け密度の小さなポリアミド系樹脂多段発泡粒子の製造において、たとえば常温といった、従来よりも低温の条件で、または短時間の条件で、ポリアミド系樹脂発泡粒子に内圧を付与して発泡させる多段発泡を可能とする生産性に優れたポリアミド系樹脂多段発泡粒子の製造方法を提供するものである。 The present invention relates to a novel method for producing multi-stage expanded polyamide resin beads, which was made in consideration of the above-mentioned problems. That is, the present invention provides a method for producing multi-stage expanded polyamide resin beads with excellent productivity, which enables multi-stage expansion by applying internal pressure to the expanded polyamide resin beads under conditions that are lower than conventional conditions, such as room temperature, or for a short period of time, in the production of multi-stage expanded polyamide resin beads with low apparent density.

本発明のポリアミド系樹脂多段発泡粒子の製造方法は、ポリアミド系樹脂発泡粒子を耐圧容器に入れ、前記耐圧容器内で、ポリアミド系樹脂発泡粒子に物理発泡剤を含浸させて大気圧超の内圧を付与する内圧付与工程、および
前記内圧付与工程において得られた内圧が付与されたポリアミド系樹脂発泡粒子を加熱して発泡させ、前記内圧付与工程に用いられたポリアミド系樹脂発泡粒子よりも見掛け密度の小さいポリアミド系樹脂多段発泡粒子を得る加熱発泡工程、を備え、
前記内圧付与工程において、含水率1%以上の吸湿状態のポリアミド系樹脂発泡粒子に、前記吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも高い温度下で前記物理発泡剤を含浸させることを特徴とする。
The method for producing multi-stage expanded polyamide-based resin beads of the present invention comprises an internal pressure applying step of placing expanded polyamide-based resin beads in a pressure-resistant container and impregnating the expanded polyamide-based resin beads with a physical blowing agent in the pressure-resistant container to apply an internal pressure exceeding atmospheric pressure, and a heat-expanding step of heating and expanding the expanded polyamide-based resin beads to which the internal pressure obtained in the internal pressure applying step has been applied, thereby obtaining multi-stage expanded polyamide-based resin beads having an apparent density smaller than that of the expanded polyamide-based resin beads used in the internal pressure applying step,
The internal pressure application step is characterized in that the polyamide-based resin foamed particles in a hygroscopic state having a water content of 1% or more are impregnated with the physical foaming agent at a temperature higher than the change point temperature of the storage modulus of the hygroscopic polyamide-based resin foamed particles.

本発明は、たとえば常温といった、従来よりも低温で、または短時間で、見掛け密度の低いポリアミド系樹脂多段発泡粒子を製造することが可能であり、生産性の高いポリアミド系樹脂多段発泡粒子の製造方法を提供する。 The present invention provides a highly productive method for producing multi-stage expanded polyamide resin beads that can be produced at lower temperatures than conventional methods, such as room temperature, or in a shorter time.

ポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度と含水率の関係をプロットしたグラフである。1 is a graph plotting the relationship between the temperature at which the storage modulus of expanded polyamide resin particles changes and the moisture content. JIS K7095:2012に倣い測定されるポリアミド系樹脂発泡粒子の貯蔵弾性率と温度との関係を例示的に示すグラフである。1 is a graph showing an example of the relationship between the storage modulus and temperature of expanded polyamide resin beads measured in accordance with JIS K7095:2012. ポリアミド系樹脂発泡粒子の熱流束示差走査熱量測定法に基づき測定されたDSC曲線の一例である。1 is an example of a DSC curve of expanded polyamide resin particles measured based on a heat flux differential scanning calorimetry method.

以下に、本発明のポリアミド系樹脂多段発泡粒子の製造方法について説明する。
尚、以下の説明において、適宜、本発明の好ましい数値範囲を示す場合がある。この場合に、数値範囲の上限および下限に関する好ましい範囲、より好ましい範囲、特に好ましい範囲は、上限および下限のすべての組み合わせから決定することができる。
The method for producing the multi-stage expanded polyamide resin beads of the present invention will be described below.
In the following description, preferred numerical ranges of the present invention may be shown as appropriate. In this case, preferred ranges, more preferred ranges, and particularly preferred ranges regarding the upper and lower limits of the numerical ranges can be determined from all combinations of the upper and lower limits.

本発明のポリアミド系樹脂多段発泡粒子の製造方法は、内圧付与工程および加熱発泡工程を含む。
上記内圧付与工程は、耐圧容器内で、含水率1%以上の吸湿状態のポリアミド系樹脂発泡粒子に物理発泡剤を含浸させて大気圧超の内圧を付与する工程である。以下の説明では、内圧付与工程に供された「含水率1%以上の吸湿状態のポリアミド系樹脂発泡粒子」を、単に「吸湿状態のポリアミド系樹脂発泡粒子」と呼ぶ場合がある。
また上記加熱発泡工程は、内圧付与工程において得られた内圧が付与されたポリアミド系樹脂発泡粒子を加熱して発泡させ、上記内圧付与工程に用いられたポリアミド系樹脂発泡粒子よりも、見掛け密度の小さいポリアミド系樹脂多段発泡粒子を得る工程である。
本発明は、内圧付与工程の全実施時間の50%を超える時間において、当該内圧付与工程における耐圧容器内の温度を、吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも高く調整するという特徴を有する。
以下の説明では、加熱発泡工程に供される「内圧付与工程において得られた内圧が付与されたポリアミド系樹脂発泡粒子」を単に「内圧が付与されたポリアミド系樹脂発泡粒子」と呼ぶ場合がある。また加熱発泡工程の実施により得られた「内圧付与工程に用いられたポリアミド系樹脂発泡粒子よりも見掛け密度の小さいポリアミド系樹脂多段発泡粒子」を単に「見掛け密度の小さいポリアミド系樹脂多段発泡粒子」あるいは単に「ポリアミド系樹脂多段発泡粒子」と呼ぶ場合がある。
The method for producing multi-stage expanded polyamide resin beads of the present invention includes an internal pressure application step and a heat expansion step.
The internal pressure application step is a step of impregnating expanded polyamide-based resin particles in a hygroscopic state having a moisture content of 1% or more with a physical blowing agent in a pressure-resistant container to apply an internal pressure exceeding atmospheric pressure. In the following description, the "expanded polyamide-based resin particles in a hygroscopic state having a moisture content of 1% or more" subjected to the internal pressure application step may be simply referred to as "expanded polyamide-based resin particles in a hygroscopic state."
The heating and expanding step is a step in which the polyamide-based resin expanded beads to which the internal pressure obtained in the internal pressure applying step has been applied are heated and expanded to obtain multi-stage polyamide-based resin expanded beads having an apparent density smaller than that of the polyamide-based resin expanded beads used in the internal pressure applying step.
The present invention is characterized in that the temperature inside the pressure-resistant vessel during the internal pressure application process is adjusted to be higher than the change point temperature of the storage modulus of the expanded polyamide resin particles in a hygroscopic state for a period of time exceeding 50% of the total implementation time of the internal pressure application process.
In the following description, the "polyamide-based resin expanded beads to which internal pressure has been applied, obtained in the internal pressure application step" to be subjected to the heat-expanding step may be simply referred to as "polyamide-based resin expanded beads to which internal pressure has been applied." Also, the "multi-stage polyamide-based resin expanded beads having a lower apparent density than the polyamide-based resin expanded beads used in the internal pressure application step" obtained by carrying out the heat-expanding step may be simply referred to as "multi-stage polyamide-based resin expanded beads having a lower apparent density" or simply "multi-stage polyamide-based resin expanded beads."

上記構成を備える本発明のポリアミド系樹脂多段発泡粒子の製造方法(以下、本発明の製造方法ともいう)は、生産性に優れ、かつ高発泡倍率のポリアミド系樹脂発泡粒子を工業的に提供可能である。即ち、本発明の製造方法は、たとえば常温といった、従来よりも低温で、または短時間で、見掛け密度の低いポリアミド系樹脂多段発泡粒子を製造することが可能である。 The method for producing multi-stage expanded polyamide resin beads of the present invention (hereinafter also referred to as the production method of the present invention) having the above-mentioned configuration is highly productive and can industrially provide polyamide resin expanded beads with a high expansion ratio. In other words, the production method of the present invention can produce multi-stage expanded polyamide resin beads with a low apparent density at a lower temperature than conventional methods, such as room temperature, or in a short time.

かかる本発明は、ポリオレフィン系樹脂とは異なるポリアミド系樹脂特有の性質に着眼することでなされたものである。
即ち、本発明者は、従来のポリアミド系樹脂発泡粒子を用いた多段発泡の生産性が低いという課題について検討したところ、ポリアミド系樹脂は、ポリプロピレン系樹脂などのポリオレフィン系樹脂と比較し、顕著にガスバリア性が高いため、ポリアミド系樹脂発泡粒子に物理発泡剤を含浸させ難いということが推察された。そして、これにより、従来、見掛け密度の低いポリアミド系樹脂多段発泡粒子を得ようとすると、発泡粒子に発泡剤を含浸させる工程において、加圧した状態を長時間保持するか、あるいは高温条件下で加圧する必要があるものと思われた。
そこで本発明者は、ポリアミド系樹脂が水分を有意に含むことで、ガスバリア性が低くなることに着眼した。また、含水したポリアミド系樹脂の挙動の変化の指標は、動的粘弾性から求められる貯蔵弾性率の変化点温度で確認できることを見出した。つまり、図1に示すとおり、ポリアミド系樹脂発泡粒子は、有意に含水することで、貯蔵弾性率の変化点温度が下がり、当該変化点温度を上回る温度で加熱されることで、当該発泡粒子を構成するポリアミド系樹脂のガスバリア性が低下すると考え、本発明の製造方法を完成させた。尚、図1は、ポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度と含水率の関係をプロットしたグラフであり、ポリアミド系樹脂発泡粒子に関し、含水率(%)が増加するにしたがい貯蔵弾性率の変化点温度が低下する傾向を示すものである。
The present invention was made by focusing on the unique properties of polyamide resins, which differ from those of polyolefin resins.
That is, the present inventors have studied the problem of low productivity of multi-stage expansion using conventional polyamide-based resin expanded beads, and have inferred that polyamide-based resin has a significantly higher gas barrier property than polyolefin-based resins such as polypropylene-based resins, and therefore it is difficult to impregnate polyamide-based resin expanded beads with a physical foaming agent. As a result, it has been considered necessary to maintain a pressurized state for a long time or to pressurize under high temperature conditions in the process of impregnating expanded beads with a foaming agent in order to obtain multi-stage polyamide-based resin expanded beads with a low apparent density.
The present inventors have focused on the fact that the gas barrier property of polyamide resins is reduced when the polyamide resin contains a significant amount of moisture. They have also found that an index of the change in behavior of polyamide resins containing moisture can be confirmed by the change temperature of the storage modulus obtained from dynamic viscoelasticity. That is, as shown in FIG. 1, the change temperature of the storage modulus of expanded polyamide resin particles decreases when the expanded polyamide resin particles contain a significant amount of moisture, and the gas barrier property of the polyamide resin constituting the expanded polyamide resin particles decreases when the expanded polyamide resin particles are heated at a temperature higher than the change temperature. Based on this idea, the present inventors have completed the manufacturing method of the present invention. Note that FIG. 1 is a graph plotting the relationship between the change temperature of the storage modulus of expanded polyamide resin particles and the moisture content, and shows a tendency that the change temperature of the storage modulus of expanded polyamide resin particles decreases as the moisture content (%) increases.

本発明者は、吸湿することで貯蔵弾性率の変化点温度が下がるとともにガスバリア性の低下したポリアミド系樹脂発泡粒子に対し、当該変化点温度を超える比較的低い温度下で加圧することにより良好に物理発泡剤を含浸させて高い内圧を付与するという技術思想に至った。かかる技術思想は、上記変化点温度を超えて比較的高い温度下で加圧することによって、加圧時間を短縮化させつつ、高い内圧を付与することを含む。 The inventors have come up with the technical idea of pressurizing expanded polyamide resin particles, which have a lowered storage modulus change temperature and reduced gas barrier properties due to moisture absorption, at a relatively low temperature above the change temperature, thereby impregnating the particles with a physical foaming agent and imparting a high internal pressure. This technical idea involves pressurizing the particles at a relatively high temperature above the change temperature, thereby shortening the pressurization time and imparting a high internal pressure.

高い内圧が付与されたポリアミド系樹脂発泡粒子を用いて、加熱発泡させることで、見掛け密度の低いポリアミド系樹脂多段発泡粒子を生産性良く製造することができる。
以下に、本発明の製造方法について、より詳細に説明する。
By using expanded polyamide resin beads to which a high internal pressure has been applied and expanding the beads by heating, multi-stage expanded polyamide resin beads having a low apparent density can be produced with good productivity.
The production method of the present invention will be described in more detail below.

(プレ工程)
まず本発明における内圧付与工程を実施する前のプレ工程について説明する。プレ工程は、ポリアミド系樹脂粒子の準備を行う第一準備工程、および上記ポリアミド系樹脂粒子を用いてポリアミド系樹脂発泡粒子を製造する第二準備工程を含む。
尚、以下で説明するプレ工程の一部または全部は、本発明の製造方法とは区別して実施されてもよいし、本発明の製造方法に任意で追加される工程として本発明の製造方法に取り込まれても良い。
(Pre-process)
First, the pre-processing before the internal pressure applying process in the present invention will be described. The pre-processing includes a first preparatory process for preparing polyamide-based resin particles, and a second preparatory process for producing expanded polyamide-based resin particles using the polyamide-based resin particles.
It should be noted that some or all of the pre-processing steps described below may be carried out separately from the manufacturing method of the present invention, or may be incorporated into the manufacturing method of the present invention as an optional additional process.

(第一準備工程)
第一準備工程において、準備されるポリアミド系樹脂粒子は、市販品であってもよいし、公知の方法により製造されたポリアミド系樹脂粒子であってもよい。
ポリアミド系樹脂粒子の製造方法としては、例えば、以下の方法が挙げられる。まず、ポリアミド系樹脂と、必要に応じて気泡調整剤、末端封鎖剤、及び着色剤等の添加剤を押出機に投入し溶融混練して溶融混練物とする。次いで、押出機先端に付設されたダイの小孔からストランド状に溶融混練物を押し出して所定のサイズにカットして造粒することによりポリアミド系樹脂粒子を製造することができる。なお、ストランド状の溶融混錬物のカット方法としては、押出された上記溶融混錬物をペレタイザーで所定の重量となるように切断するストランドカット法、上記溶融混練物を気相中に押出した直後に切断するホットカット法、上記溶融混練物を水中に押出した直後に切断するアンダーウォーターカット法(UWC法)等が挙げられる。
(First preparation process)
In the first preparation step, the polyamide-based resin particles prepared may be commercially available products, or may be polyamide-based resin particles produced by a known method.
The method for producing polyamide-based resin particles includes, for example, the following methods. First, a polyamide-based resin and, if necessary, additives such as a bubble regulator, an end-capping agent, and a colorant are put into an extruder and melt-kneaded to form a melt-kneaded product. Next, the melt-kneaded product is extruded in a strand shape from a small hole in a die attached to the tip of the extruder, cut to a predetermined size, and granulated to produce polyamide-based resin particles. In addition, the cutting method for the strand-like melt-kneaded product includes a strand cut method in which the extruded melt-kneaded product is cut to a predetermined weight with a pelletizer, a hot cut method in which the melt-kneaded product is extruded into a gas phase and cut immediately thereafter, and an underwater cut method (UWC method) in which the melt-kneaded product is extruded into water and cut immediately thereafter.

ポリアミド系樹脂粒子の製造に用いられるポリアミド系樹脂は、1種単独の樹脂でもよく、2種以上を組み合わせた混合樹脂でもよい。
上記ポリアミド系樹脂としては、ポリアミド、またはポリアミド共重合体が挙げられ、ポリアミド共重合体が好ましい。
上記ポリアミドとしては、例えば、ポリ(カプロラクタム)としても知られるポリ(6-アミノヘキサン酸)(ポリカプロアミド、ナイロン6)、ポリ(ラウロラクタム)(ナイロン12)、ポリ(ヘキサメチレンアジパミド)(ナイロン66)、ポリ(7-アミノヘプタン酸)(ナイロン7)、ポリ(8-アミノオクタン酸)(ナイロン8)、ポリ(9-アミノノナン酸)(ナイロン9)、ポリ(10-アミノデカン酸)(ナイロン10)、ポリ(11-アミノウンデカン酸)(ナイロン11)、ポリ(ヘキサメチレンセバカミド)(ナイロン610)、ポリ(デカメチレンセバカミド)(ナイロン1010)、ポリ(ヘキサメチレンアゼラミド)(ナイロン69)、ポリ(テトラメチレンアジパミド)(ナイロン46)、ポリ(テトラメチレンセバカミド)(ナイロン410)、ポリ(ペンタメチレンアジパミド)(ナイロン56)、及びポリ(ペンタメチレンセバカミド)(ナイロン510)等のホモポリマーが挙げられる。
ポリアミド共重合体とは、2種以上の繰り返し単位を有し、それぞれの繰り返し単位の少なくとも一部にアミド結合を有するものを意味する。
上記ポリアミド共重合体としては、例えば、ポリカプロアミド/ポリヘキサメチレンアジパミドコポリマー(ナイロン6/66)、カプロラクタム/ヘキサメチレンジアミノアジピン酸/ラウリルラクタム(ナイロン6/66/12)、及びカプロラクタム/ラウリルラクタム共重合体(ナイロン6/12)等が挙げられる。
ポリアミド系樹脂は、これらのポリアミド及びポリアミド共重合体を1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。以上のポリアミド系樹脂の中でも、ナイロン6、ナイロン66、及びナイロン6/66から選択される1種または2種以上を組み合わせたポリアミド系樹脂であることが好ましく、ナイロン6/66であることがより好ましい。
The polyamide-based resin used in the production of the polyamide-based resin particles may be a single resin or a mixed resin of two or more types.
The polyamide-based resin may be polyamide or a polyamide copolymer, with the polyamide copolymer being preferred.
Examples of the polyamides include poly(6-aminohexanoic acid) also known as poly(caprolactam) (polycaproamide, nylon 6), poly(laurolactam) (nylon 12), poly(hexamethylene adipamide) (nylon 66), poly(7-aminoheptanoic acid) (nylon 7), poly(8-aminooctanoic acid) (nylon 8), poly(9-aminononanoic acid) (nylon 9), poly(10-aminodecanoic acid) (nylon 10), poly(11-aminobutanoic acid) (nylon 11), poly(12-aminobutanoic acid) (nylon 12), poly(1 ... Examples of homopolymers include poly(pentamethylene adipamide) (nylon 11), poly(hexamethylene sebacamide) (nylon 610), poly(decamethylene sebacamide) (nylon 1010), poly(hexamethylene azelamide) (nylon 69), poly(tetramethylene adipamide) (nylon 46), poly(tetramethylene sebacamide) (nylon 410), poly(pentamethylene adipamide) (nylon 56), and poly(pentamethylene sebacamide) (nylon 510).
The polyamide copolymer means a copolymer having two or more kinds of repeating units, at least a part of each repeating unit having an amide bond.
Examples of the polyamide copolymer include polycaproamide/polyhexamethylene adipamide copolymer (nylon 6/66), caprolactam/hexamethylenediaminoadipic acid/lauryllactam (nylon 6/66/12), and caprolactam/lauryllactam copolymer (nylon 6/12).
The polyamide-based resin may be one of these polyamides and polyamide copolymers, or a combination of two or more of them. Among the above polyamide-based resins, a polyamide-based resin selected from one or a combination of two or more of nylon 6, nylon 66, and nylon 6/66 is preferred, and nylon 6/66 is more preferred.

上記ポリアミド系樹脂の融点は、たとえば得られる多段発泡粒子を成形してなる発泡粒子成形体の耐熱性を高める観点からは、180℃以上であることが好ましく、185℃以上であることがより好ましく、190℃以上であることがさらに好ましい。一方、内圧が付与されたポリアミド系樹脂発泡粒子を加熱媒体により加熱する際の装置への負荷を低減する観点からは、上記融点は、280℃以下であることが好ましく、260℃以下であることがより好ましく、240℃以下であることがさらに好ましい。
なお、上述するポリアミド系樹脂の融点とは、発泡粒子を構成する樹脂がポリアミド系樹脂1種単独である場合、そのポリアミド系樹脂の融点を指す。発泡粒子が、2種以上のポリアミド系樹脂の混合物から構成されている場合、上述するポリアミド系樹脂の融点とは、予め押出機等で混練した混合物の融点を指す。
The melting point of the polyamide resin is preferably 180° C. or higher, more preferably 185° C. or higher, and even more preferably 190° C. or higher, from the viewpoint of improving the heat resistance of the expanded bead molded article obtained by molding the resulting multi-stage expanded beads. On the other hand, from the viewpoint of reducing the load on the device when the internally pressurized expanded polyamide resin beads are heated by a heating medium, the melting point is preferably 280° C. or lower, more preferably 260° C. or lower, and even more preferably 240° C. or lower.
The melting point of the polyamide resin mentioned above refers to the melting point of the polyamide resin when the resin constituting the expanded beads is a single polyamide resin, whereas when the expanded beads are composed of a mixture of two or more polyamide resins, the melting point of the polyamide resin mentioned above refers to the melting point of the mixture kneaded in advance in an extruder or the like.

ポリアミド系樹脂の融点は、JIS K7121-1987に基づき、熱流束示差走査熱量測定法により、10℃/分の加熱速度で30℃から融解ピーク終了時よりも30℃高い温度まで加熱溶融(1回目の昇温)させ、次いでその温度にて10分間保った後、10℃/分の冷却速度で30℃まで冷却し、再度、加熱速度10℃/分で融解ピーク終了時よりも30℃高い温度まで加熱溶融させて得られる2回目のDSC曲線の融解ピークの頂点の温度(融解ピーク温度)として求めることができる。DSC曲線が複数の融解ピークを有する場合、最も大きな面積を有する融解ピークの融解ピーク温度をポリアミド系樹脂の融点として採用する。ポリアミド系樹脂を温度23℃、相対湿度50%の環境下で24時間以上静置して状態調節した後に上記融点の測定を行う。なお、測定装置として、たとえば高感度型示差走査熱量計「EXSTAR DSC7020」(エスアイアイ・ナノテクノロジー社製)などを使用することができる。 The melting point of a polyamide resin can be determined by heat flux differential scanning calorimetry based on JIS K7121-1987, by heating and melting (first heating) from 30°C to a temperature 30°C higher than the end of the melting peak at a heating rate of 10°C/min, then holding at that temperature for 10 minutes, cooling to 30°C at a cooling rate of 10°C/min, and again heating and melting to a temperature 30°C higher than the end of the melting peak at a heating rate of 10°C/min, as the temperature at the apex of the melting peak (melting peak temperature) of the second DSC curve. When a DSC curve has multiple melting peaks, the melting peak temperature of the melting peak with the largest area is taken as the melting point of the polyamide resin. The polyamide resin is allowed to stand for 24 hours or more in an environment at a temperature of 23°C and a relative humidity of 50% to condition it, and then the melting point is measured. As a measuring device, for example, a high-sensitivity differential scanning calorimeter "EXSTAR DSC7020" (manufactured by SII NanoTechnology Co., Ltd.) can be used.

上記ポリアミド系樹脂は、曲げ弾性率が1000MPa以上であることが好ましく、1200MPa以上であることがより好ましく、1500MPa以上であることがさらに好ましい。なお、アミド系エラストマーは、概ね曲げ弾性率が600MPa以下である。ポリアミド系樹脂の曲げ弾性率が上記範囲であれば、曲げ弾性率が高いことに由来して多段発泡後に常温に晒されても収縮しにくく、見掛け密度の小さな多段発泡粒子がより得られ易くなるため好ましい。なお、ポリアミド系樹脂の曲げ弾性率の上限は概ね3000MPa程度である。 The above polyamide resin preferably has a flexural modulus of 1000 MPa or more, more preferably 1200 MPa or more, and even more preferably 1500 MPa or more. The amide elastomer generally has a flexural modulus of 600 MPa or less. If the flexural modulus of the polyamide resin is within the above range, it is preferable because the high flexural modulus makes it difficult to shrink even when exposed to room temperature after multi-stage expansion, and it is easier to obtain multi-stage expanded particles with a small apparent density. The upper limit of the flexural modulus of the polyamide resin is approximately 3000 MPa.

ポリアミド系樹脂の曲げ弾性率は、試験片を温度23℃、湿度50%の状態で24時間以上静置した後、JIS K7171:2016に準拠して測定することにより求めることができる。 The flexural modulus of polyamide resins can be determined by leaving a test piece at rest for at least 24 hours at a temperature of 23°C and a humidity of 50%, and then measuring it in accordance with JIS K7171:2016.

前記ポリアミド系樹脂の密度は、1.05g/cm以上であることが好ましく、1.1g/cm以上であることが好ましい。なお、アミド系エラストマーの密度は概ね1.05g/cm未満である。ポリアミド系樹脂の密度は、ISO1183-3に記載の方法に基づいて求めることができる。 The density of the polyamide resin is preferably 1.05 g/cm 3 or more, and more preferably 1.1 g/cm 3 or more. The density of the amide elastomer is generally less than 1.05 g/cm 3. The density of the polyamide resin can be determined based on the method described in ISO1183-3.

上記ポリアミド系樹脂粒子には、本発明の目的、効果を阻害しない範囲において、ポリアミド系樹脂以外の他の熱可塑性樹脂や熱可塑性エラストマー等の他の重合体を含有させてもよい。他の熱可塑性樹脂としては、例えば、ポリエチレン系樹脂、ポリプロピレン系樹脂、ポリスチレン系樹脂、酢酸ビニル樹脂、熱可塑性ポリエステル樹脂、アクリル酸エステル樹脂、メタクリル酸エステル樹脂等が挙げられる。熱可塑性エラストマーとしては、例えば、スチレン系熱可塑性エラストマー、オレフィン系熱可塑性エラストマー、アミド系熱可塑性エラストマー等が挙げられる。上記他の重合体の含有量は、ポリアミド系樹脂粒子を構成するポリアミド系樹脂100重量部に対して20重量部以下であることが好ましく、10重量部以下であることがより好ましく、5重量部以下であることが更に好ましく、ポリアミド系樹脂以外の他の重合体を含有しないことが特に好ましい。
ポリアミド系樹脂粒子を構成する樹脂成分中のポリアミド系樹脂の含有量は、50重量%以上であり、耐熱性、耐摩耗性、及び耐薬品性に優れたポリアミド系樹脂発泡粒子を得る観点からは、好ましくは70重量%以上であり、より好ましくは80重量%以上であり、更に好ましくは90重量%以上であり、ポリアミド系樹脂粒子を構成する樹脂成分がポリアミド系樹脂のみからなることが特に好ましい。
The polyamide resin particles may contain other polymers such as thermoplastic resins other than polyamide resins and thermoplastic elastomers, as long as the object and effect of the present invention are not hindered. Examples of other thermoplastic resins include polyethylene resins, polypropylene resins, polystyrene resins, vinyl acetate resins, thermoplastic polyester resins, acrylic ester resins, and methacrylic ester resins. Examples of thermoplastic elastomers include styrene thermoplastic elastomers, olefin thermoplastic elastomers, and amide thermoplastic elastomers. The content of the other polymers is preferably 20 parts by weight or less, more preferably 10 parts by weight or less, and even more preferably 5 parts by weight or less, relative to 100 parts by weight of the polyamide resin constituting the polyamide resin particles, and is particularly preferably not to contain other polymers other than polyamide resins.
The content of polyamide-based resin in the resin components constituting the polyamide-based resin particles is 50% by weight or more, and from the viewpoint of obtaining polyamide-based resin expanded particles having excellent heat resistance, abrasion resistance, and chemical resistance, the content is preferably 70% by weight or more, more preferably 80% by weight or more, and even more preferably 90% by weight or more, and it is particularly preferable that the resin components constituting the polyamide-based resin particles consist only of polyamide-based resin.

ポリアミド系樹脂粒子には、ポリアミド系樹脂の他に、通常使用される気泡調整剤、末端封鎖剤、帯電防止剤、導電性付与剤、耐候剤、滑剤、酸化防止剤、紫外線吸収剤、難燃剤、金属不活性化剤、着色剤(顔料、染料等)、結晶核剤、及び充填材等の各種の添加剤を、必要に応じて適宜配合することができる。気泡調整剤としては、タルク、塩化ナトリウム、炭酸カルシウム、シリカ、酸化チタン、石膏、ゼオライト、ホウ砂、水酸化アルミニウム、ミョウバン、及びカーボン等の無機系気泡調整剤、リン酸系化合物、アミン系化合物、及びポリテトラフルオロエチレン(PTFE)等の有機系気泡調整剤が挙げられる。これらの各種添加剤の添加量は、成形体の使用目的により異なるが、ポリアミド系樹脂粒子を構成する樹脂成分100重量部に対して25重量部以下であることが好ましい。より好ましくは15重量部以下、更に好ましくは10重量部以下、より更に好ましくは5重量部以下である。 In addition to the polyamide resin, the polyamide resin particles can be appropriately blended with various additives such as commonly used bubble regulators, end blocking agents, antistatic agents, conductive agents, weather resistance agents, lubricants, antioxidants, UV absorbers, flame retardants, metal deactivators, colorants (pigments, dyes, etc.), crystal nucleating agents, and fillers, as necessary. Examples of bubble regulators include inorganic bubble regulators such as talc, sodium chloride, calcium carbonate, silica, titanium oxide, gypsum, zeolite, borax, aluminum hydroxide, alum, and carbon, and organic bubble regulators such as phosphoric acid compounds, amine compounds, and polytetrafluoroethylene (PTFE). The amount of these various additives to be added varies depending on the purpose of use of the molded body, but is preferably 25 parts by weight or less per 100 parts by weight of the resin components constituting the polyamide resin particles. More preferably, it is 15 parts by weight or less, even more preferably 10 parts by weight or less, and even more preferably 5 parts by weight or less.

上記ポリアミド系樹脂粒子は、単層樹脂粒子であってもよいし、多層構造の多層樹脂粒子であってもよい。多層構造とは、芯層と当該芯層を被覆する被覆層を有し、芯層と被覆層とが異なる性質のポリアミド系樹脂により構成された構造を指す。上記多層樹脂粒子は、後述する第二準備工程で発泡させることにより、発泡状態の芯層と当該芯層を被覆する非発泡状態の被覆層とを有する発泡粒子となる。ポリアミド系樹脂粒子が上記多層樹脂粒子である場合、被覆層を構成するポリアミド系樹脂の融点は芯層を構成するポリアミド系樹脂の融点よりも低いことが好ましく、融点(Tmc)よりも20℃以上低いことがより好ましい。これにより、高い耐熱性を維持しつつ、より低圧の成形スチームにより型内成形できるポリアミド系樹脂発泡粒子が提供される。 The polyamide-based resin particles may be single-layer resin particles or multi-layer resin particles having a multi-layer structure. The multi-layer structure refers to a structure having a core layer and a coating layer covering the core layer, the core layer and the coating layer being composed of polyamide-based resins having different properties. The multi-layer resin particles are expanded in the second preparation step described below to become expanded particles having a foamed core layer and a non-foamed coating layer covering the core layer. When the polyamide-based resin particles are the multi-layer resin particles, the melting point of the polyamide-based resin constituting the coating layer is preferably lower than the melting point of the polyamide-based resin constituting the core layer, and more preferably 20°C or more lower than the melting point (Tmc). This provides polyamide-based resin expanded particles that can be molded in a mold with lower pressure molding steam while maintaining high heat resistance.

次に第二準備工程について説明する。第二準備工程は第一準備工程において準備されたポリアミド系樹脂粒子に発泡剤を含浸させて発泡性のポリアミド系樹脂粒子を得る工程と、当該発泡性のポリアミド系樹脂粒子を発泡させる工程とを含む。第二準備工程における発泡を1段発泡と呼ぶ場合があり、またこれにより得られた発泡粒子を1段発泡粒子と呼ぶ場合がある。
ポリアミド系樹脂粒子に発泡剤を含浸させて発泡性のポリアミド系樹脂粒子を得る工程において、ポリアミド系樹脂粒子への発泡剤の含浸方法は特に限定されるものではないが、オートクレーブ等の加圧可能な密閉容器内でポリアミド系樹脂粒子を分散媒に分散させ、該ポリアミド系樹脂粒子に発泡剤を含浸させることが好ましい。なお、発泡剤の含浸時間を短縮する観点から、ポリアミド系樹脂粒子への発泡剤の含浸は、加圧および加熱させながら行うことが好ましい。
Next, the second preparation step will be described. The second preparation step includes a step of impregnating the polyamide-based resin particles prepared in the first preparation step with a foaming agent to obtain expandable polyamide-based resin particles, and a step of expanding the expandable polyamide-based resin particles. The expansion in the second preparation step may be called first-stage expansion, and the expanded particles thus obtained may be called first-stage expanded particles.
In the process of impregnating the polyamide-based resin particles with a foaming agent to obtain expandable polyamide-based resin particles, the method of impregnating the polyamide-based resin particles with the foaming agent is not particularly limited, but it is preferable to disperse the polyamide-based resin particles in a dispersion medium in a pressurizable closed vessel such as an autoclave, and impregnate the polyamide-based resin particles with the foaming agent. From the viewpoint of shortening the impregnation time of the foaming agent, it is preferable to impregnate the polyamide-based resin particles with the foaming agent while applying pressure and heating.

上記発泡剤としては、物理発泡剤を用いることができる。物理発泡剤としては、有機系物理発泡剤として、プロパン、ブタン、ペンタン、ヘキサン、ヘプタン等の脂肪族炭化水素、シクロペンタン、シクロヘキサン等の脂環式炭化水素、クロロフルオロメタン、トリフルオロメタン、1,1-ジフルオロエタン、1,1,1,2-テトラフルオロエタン、メチルクロライド、エチルクロライド、及びメチレンクロライド等のハロゲン化炭化水素、ジメチルエーテル、ジエチルエーテル、及びメチルエチルエーテル等のジアルキルエーテル等が挙げられる。また、無機系物理発泡剤として、二酸化炭素、窒素、ヘリウム、アルゴン、空気等が挙げられる。
物理発泡剤の中でも、環境への影響が少ないとともに可燃性がなく安全性に優れるという観点から、無機系物理発泡剤が好ましく、二酸化炭素又は空気がより好ましく、空気が更に好ましい。
As the foaming agent, a physical foaming agent can be used. Examples of the physical foaming agent include organic physical foaming agents such as aliphatic hydrocarbons such as propane, butane, pentane, hexane, and heptane, alicyclic hydrocarbons such as cyclopentane and cyclohexane, halogenated hydrocarbons such as chlorofluoromethane, trifluoromethane, 1,1-difluoroethane, 1,1,1,2-tetrafluoroethane, methyl chloride, ethyl chloride, and methylene chloride, and dialkyl ethers such as dimethyl ether, diethyl ether, and methyl ethyl ether. Examples of the inorganic physical foaming agent include carbon dioxide, nitrogen, helium, argon, and air.
Among the physical blowing agents, from the viewpoints of having little impact on the environment, being non-flammable and having excellent safety, inorganic physical blowing agents are preferred, carbon dioxide or air is more preferred, and air is even more preferred.

続いて、発泡剤を含浸した発泡性のポリアミド系樹脂粒子を発泡させる。
発泡性のポリアミド系樹脂粒子を発泡させる方法は特に限定されない。たとえば、上記工程により密閉容器中でポリアミド系樹脂粒子に発泡剤を含浸させて発泡性のポリアミド系樹脂粒子を得た後、当該密閉容器の一端を開放させることにより発泡性のポリアミド系樹脂粒子を水等の分散媒とともに密閉容器よりも低圧下(通常は大気圧下)に放出して発泡させるダイレクト発泡法や、上記ポリアミド系樹脂粒子に発泡剤を含浸させて発泡性のポリアミド系樹脂粒子を得る工程により得られた発泡性のポリアミド系樹脂粒子を発泡させずに取り出し、別の発泡装置にて熱風等により加熱して発泡させる含浸発泡法などが挙げられる。密閉容器内においける分散媒体の温度を均一に調整し易いという観点からダイレクト発泡方法が特に好ましい。
Next, the expandable polyamide resin particles impregnated with a foaming agent are expanded.
The method of expanding the expandable polyamide-based resin particles is not particularly limited. For example, the direct expansion method is to obtain expandable polyamide-based resin particles by impregnating the polyamide-based resin particles with a foaming agent in a closed container by the above-mentioned process, and then release the expandable polyamide-based resin particles together with a dispersion medium such as water under a pressure lower than that of the closed container (usually under atmospheric pressure) to expand the polyamide-based resin particles by opening one end of the closed container, and the impregnation expansion method is to take out the expandable polyamide-based resin particles obtained by the process of impregnating the polyamide-based resin particles with a foaming agent without expanding them, and heat them with hot air or the like in a separate expansion device to expand them. The direct expansion method is particularly preferred from the viewpoint of easily adjusting the temperature of the dispersion medium in the closed container uniformly.

ダイレクト発泡法によるポリアミド系樹脂発泡粒子の製造では、通常、発泡粒子の取り扱い性等を考慮して密閉容器から放出されて発泡したポリアミド系樹脂発泡粒子は、その後、乾燥工程において乾燥される。本発明は、上記乾燥工程を実施してもよいし、実施しなくてもよい。 In the production of expanded polyamide resin particles by the direct foaming method, the expanded polyamide resin particles are usually released from a sealed container and expanded, taking into consideration the handleability of the expanded particles, etc., and are then dried in a drying step. In the present invention, the above-mentioned drying step may or may not be performed.

[含水工程]
本発明の製造方法は、含水率1%以上の吸湿状態のポリアミド系樹脂発泡粒子を用いるため、上述のとおり得られたポリアミド系樹脂発泡粒子を用いる場合、適宜、含水工程を実施し、含水率1%以上の吸湿状態のポリアミド系樹脂発泡粒子を準備する。尚、含水工程は、ポリアミド系樹脂発泡粒子を耐圧容器に投入する前に実施してもよいし、耐圧容器に投入した後、当該耐圧容器内において実施してもよい。
[Water-containing step]
Since the manufacturing method of the present invention uses polyamide-based resin expanded particles in a hygroscopic state with a moisture content of 1% or more, when using the polyamide-based resin expanded particles obtained as described above, a moisture impregnation step is appropriately carried out to prepare polyamide-based resin expanded particles in a hygroscopic state with a moisture content of 1% or more. The moisture impregnation step may be carried out before the polyamide-based resin expanded particles are put into a pressure vessel, or may be carried out in the pressure vessel after the polyamide-based resin expanded particles are put into the pressure vessel.

上記含水工程は、ポリアミド系樹脂発泡粒子の含水率を所望の範囲に調整することができる方法であればよい。たとえば、ポリアミド系樹脂発泡粒子を標準状態(大気圧、常温の条件で外気に直接または間接に露出させた状態)に12時間以上、好ましくは24時間以上晒す第一含水方法、高温高湿状態(たとえば湿度80%、温度40℃)に3時間以上、好ましくは5時間以上晒す第二含水方法、ポリアミド系樹脂発泡粒子を水に浸漬させて1分から4時間程度静置する第三含水方法、またはポリアミド系樹脂発泡粒子を水と共に袋または容器などに入れ、手動または機械的に撹拌あるいは混合する第四含水方法等が挙げられる。これらの含水工程は組み合わせて実施することもできる。
これらの含水方法によれば、発泡粒子ごとの含水率のバラつきを抑制しつつポリアミド系樹脂発泡粒子の含水率を所望の範囲に調整することができる。その結果、後述する内圧付与工程において、発泡粒子の内圧をより均一なものとすることができ、サイズのバラつきの小さな多段発泡粒子群を得ることができる。
上記第一含水方法は、含水率1%から4%程度のポリアミド系樹脂粒子を得るのに適している。また上記第二含水方法、第三含水方法及び第四含水方法は、含水率4%以上、あるいは4.5%以上のポリアミド系樹脂粒子を得るのに適している。また、より短時間で均一な含水率を有する発泡粒子を得る観点からは第二含水方法が好ましい。
尚、第一含水方法において、ポリアミド系樹脂発泡粒子を大気圧、常温の条件で外気に直接または間接に露出させた状態とは、たとえば、一般的な室内で、開放された容器、袋あるいはトレーなどにポリアミド系樹脂発泡粒子を収容した状態、および閉鎖されているが非密封状態の容器あるいは袋などにポリアミド系樹脂発泡粒子を収容した状態のいずれも含む。
The water-imparting step may be any method capable of adjusting the water content of the expanded polyamide resin particles to a desired range. For example, the first water-imparting method exposes the expanded polyamide resin particles to a standard state (atmospheric pressure, normal temperature, directly or indirectly exposed to the outside air) for 12 hours or more, preferably 24 hours or more, the second water-imparting method exposes the expanded polyamide resin particles to a high temperature and high humidity state (e.g., humidity 80%, temperature 40°C) for 3 hours or more, preferably 5 hours or more, the third water-imparting method immerses the expanded polyamide resin particles in water and leaves it to stand for about 1 minute to 4 hours, or the fourth water-imparting method places the expanded polyamide resin particles together with water in a bag or container, and manually or mechanically stirs or mixes them, etc. These water-imparting steps may also be carried out in combination.
These water-containing methods can adjust the water content of the expanded polyamide resin beads to a desired range while suppressing the variation in the water content of each expanded bead, which results in a more uniform internal pressure in the internal pressure application step described below, and allows the production of a group of multi-stage expanded beads with less variation in size.
The first moisture-containing method is suitable for obtaining polyamide-based resin particles having a moisture content of about 1% to 4%. The second, third and fourth moisture-containing methods are suitable for obtaining polyamide-based resin particles having a moisture content of 4% or more, or 4.5% or more. The second moisture-containing method is preferred from the viewpoint of obtaining expanded particles having a uniform moisture content in a shorter time.
In the first moisture-containing method, the state in which the expanded polyamide resin particles are directly or indirectly exposed to the outside air under atmospheric pressure and room temperature conditions includes, for example, a state in which the expanded polyamide resin particles are contained in an open container, bag, tray, etc. in an ordinary room, and a state in which the expanded polyamide resin particles are contained in a closed but non-sealed container or bag, etc.

[内圧付与工程]
次に、内圧付与工程について説明する。
内圧付与工程は、ポリアミド系樹脂発泡粒子を用い、耐圧容器内で、含水率1%以上の吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも高い温度下で物理発泡剤を含浸させて大気圧超の内圧を付与する工程である。
[Internal pressure application process]
Next, the internal pressure applying step will be described.
The internal pressure application process is a process in which expanded polyamide-based resin particles are used and impregnated with a physical blowing agent in a pressure-resistant vessel at a temperature higher than the inflection point temperature of the storage modulus of the expanded polyamide-based resin particles in a hygroscopic state with a water content of 1% or more, thereby applying an internal pressure higher than atmospheric pressure.

(ポリアミド系樹脂発泡粒子の含水率)
内圧付与工程に用いられる含水率1%以上の吸湿状態のポリアミド系樹脂発泡粒子は、たとえば上述するプレ工程及び必要に応じて実施される含水工程により準備される。本発明において、ポリアミド系樹脂発泡粒子の含水率は、カールフィッシャー水分量計を用いて測定することができ、具体的な測定装置の例としては、たとえばカールフィッシャー電量法に基づき含水率を測定する平沼産業株式会社製の微量水分量測定装置(AQ-2200A)が挙げられる。
ポリアミド系樹脂発泡粒子の含水率の測定は、具体的には以下の方法により測定することができる。まず、約0.2gのポリアミド系樹脂発泡粒子を秤量し、試験片とする。次いで、加熱水分気化装置(たとえば平沼産業社製の自動加熱水分気化装置SE320)を用いて試験片を温度160℃まで加熱することにより、試験片の内部の水分を気化させる。この水分を加熱水分気化装置に接続された上記カールフィッシャー水分測定装置へ導き、水分量を測定し、発泡粒子の含水率を算出する。なお、測定条件(滴定条件)としては、待ち時間:40秒、電解電流:MEDIUM、最小電解量:5μgを採用することができる。
(Moisture Content of Expanded Polyamide Resin Beads)
The polyamide-based resin expanded particles in a hygroscopic state with a moisture content of 1% or more used in the internal pressure application step are prepared, for example, by the above-mentioned pre-step and a moisture-imparting step that is performed as necessary. In the present invention, the moisture content of the polyamide-based resin expanded particles can be measured using a Karl Fischer moisture meter, and a specific example of the measuring device is a trace moisture measuring device (AQ-2200A) manufactured by Hiranuma Sangyo Co., Ltd., which measures the moisture content based on the Karl Fischer coulometric method.
Specifically, the moisture content of the expanded polyamide resin particles can be measured by the following method. First, about 0.2 g of expanded polyamide resin particles is weighed to prepare a test piece. Next, the test piece is heated to a temperature of 160° C. using a thermal moisture vaporizer (for example, an automatic thermal moisture vaporizer SE320 manufactured by Hiranuma Sangyo Co., Ltd.) to vaporize the moisture inside the test piece. This moisture is introduced into the Karl Fischer moisture measuring device connected to the thermal moisture vaporizer, the moisture amount is measured, and the moisture content of the expanded particles is calculated. The measurement conditions (titration conditions) can be a waiting time of 40 seconds, electrolysis current of medium, and minimum amount of electrolysis of 5 μg.

尚、ポリプロピレン系樹脂発泡粒子等の多段発泡においては、通常、含水率0.1%以下の乾燥状態である発泡粒子を耐圧容器に投入して常温付近の温度で発泡剤を含浸させて内圧を付与することが行われている。しかし、本発明の製造方法では、かかる一般的な製造方法とは異なり、含水率1%以上の吸湿状態のポリアミド系樹脂発泡粒子に物理発泡剤を含浸させてポリアミド系樹脂多段発泡粒子を製造する。
含水率1%未満の乾燥状態のポリアミド系樹脂発泡粒子に物理発泡剤を含浸させた場合、発泡剤を十分に含浸させるために、常温を上回る高温の条件で加熱するか、あるいは長時間の加熱を要し、耐圧容器等の装置にかかる負荷が大きく生産性の観点で好ましくない。
In the multi-stage expansion of polypropylene resin expanded particles and the like, expanded particles in a dry state with a moisture content of 0.1% or less are usually placed in a pressure vessel and impregnated with a blowing agent at a temperature close to room temperature to apply internal pressure. However, the production method of the present invention differs from such a general production method in that polyamide resin expanded particles in a hygroscopic state with a moisture content of 1% or more are impregnated with a physical blowing agent to produce polyamide resin multi-stage expanded particles.
When polyamide resin expanded particles in a dry state having a moisture content of less than 1% are impregnated with a physical blowing agent, in order to sufficiently impregnate the particles with the blowing agent, heating is required at a temperature higher than room temperature or for a long period of time, which places a large load on devices such as a pressure-resistant container and is not preferable from the viewpoint of productivity.

ポリアミド系樹脂発泡粒子の含水率が高いほど、貯蔵弾性率の変化点温度が低くなるため、より低い温度で当該ポリアミド系樹脂発泡粒子に物理発泡剤を含浸させることができ、あるいは、温度を維持し物理発泡剤を含浸させる時間を短縮化させることができる。かかる観点からは、吸湿状態のポリアミド系樹脂発泡粒子の含水率は、3.0%以上であることが好ましく、4.5%以上であることがより好ましく、5.0%以上であることがさらに好ましい。
一方、上記含水率の上限は特に規定されない。ただし、図1に示すとおり、含水率が高くなると貯蔵弾性率の変化点温度の低下の度合いが小さくなり平衡状態になることから、上記含水率の上限は概ね20%程度である。また、得られる多段発泡粒子を型内成形する際の充填性の観点からは、上記含水率の上限は18%以下であることが好ましく、15%以下であることがより好ましい。
なお、ポリアミド系樹脂発泡粒子の含水率が高いほど貯蔵弾性率の変化点温度が低くなる理由は、ポリアミド系樹脂の分子間の水素結合が水分子に置き換えられ、ポリアミド系樹脂の分子運動が変化するためであると考えられる。
The higher the moisture content of the expanded polyamide resin particles, the lower the temperature at which the storage modulus changes, and therefore the polyamide resin particles can be impregnated with a physical blowing agent at a lower temperature, or the time required for impregnation with a physical blowing agent can be shortened by maintaining the temperature. From this viewpoint, the moisture content of the expanded polyamide resin particles in a hygroscopic state is preferably 3.0% or more, more preferably 4.5% or more, and even more preferably 5.0% or more.
On the other hand, the upper limit of the moisture content is not particularly specified. However, as shown in Fig. 1, as the moisture content increases, the degree of decrease in the temperature at the change point of the storage modulus decreases and an equilibrium state is reached, so the upper limit of the moisture content is generally about 20%. From the viewpoint of the filling property when the obtained multi-stage expanded beads are molded in a mold, the upper limit of the moisture content is preferably 18% or less, and more preferably 15% or less.
The reason why the change point temperature of the storage modulus becomes lower as the water content of the expanded polyamide resin particles becomes higher is believed to be because the hydrogen bonds between the polyamide resin molecules are replaced by water molecules, causing a change in the molecular motion of the polyamide resin.

(内圧付与工程における温度について)
次に、内圧付与工程における温度について説明する。内圧付与工程では、内圧付与工程における耐圧容器内の温度を、吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも高く調整する。また、より効率的に発泡粒子に内圧を付与する観点から、内圧付与工程の全実施時間の50%を超える時間において、内圧付与工程における耐圧容器内の温度を、吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも高く調整することが好ましい。ここで内圧付与工程の全実施時間とは、内圧付与工程の開始時から内圧が付与されたポリアミド系樹脂発泡粒子が取り出されるまでの時間をいう。本発明に関し、内圧付与工程の開始時とは、当該耐圧容器内に投入されたポリアミド系樹脂発泡粒子の含水率が1%以上である状態と、当該耐圧容器内に物理発泡剤が圧入されている状態が揃った最初の時点をいう。内圧付与工程の全実施時間の50%を超える時間とは、全実施時間において連続する時間であってもよく、断続的な時間の総和であってもよい。本発明は、たとえば、内圧付与工程開始時は吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも低い温度から開始し、内圧付与工程の任意のタイミングで、耐圧容器内の温度をその時点でのポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度を上回る温度に調整する態様を包含する。
より十分に内圧を付与するという観点からは、内圧付与工程において耐圧容器内の温度を吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも高く調整する時間は、内圧付与工程の全実施時間の70%以上であることがより好ましく80%以上であることがさらに好ましく、90%以上であることが特に好ましく、実質的に100%であることが最も好ましい。
上述する内圧付与工程の全実施時間の50%を超える時間における耐圧容器内の温度は、一定に調整してもよいし、変動させてもよい。尚、内圧付与工程中、ポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度は含水率の変動とともに変化する。そのため、上述する耐圧容器内の温度を判断するための指標になるポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度とは、温度を判断する際に示される貯蔵弾性率の変化点温度を指す。
上述に説明するとおり、乾燥状態の場合と比べて、吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度は低い。そのため、乾燥状態のポリアミド系樹脂発泡粒子を用いる場合に比べて低い温度で、または短時間で物理発泡剤を含浸させることができる。その結果、耐圧容器等の装置にかかる負荷を低減でき生産性に優れるものとなる。また、得られるポリアミド系樹脂多段発泡粒子の独立気泡率の低下や、樹脂の劣化に伴う変色等を抑制することができる。
(Regarding temperature in the internal pressure application process)
Next, the temperature in the internal pressure application process will be described. In the internal pressure application process, the temperature in the pressure vessel in the internal pressure application process is adjusted to be higher than the temperature at which the storage modulus of the expanded polyamide resin beads in a hygroscopic state changes. In addition, from the viewpoint of more efficiently applying internal pressure to the expanded beads, it is preferable to adjust the temperature in the pressure vessel in the internal pressure application process to be higher than the temperature at which the storage modulus of the expanded polyamide resin beads in a hygroscopic state changes for a time exceeding 50% of the total implementation time of the internal pressure application process. Here, the total implementation time of the internal pressure application process refers to the time from the start of the internal pressure application process to the time when the expanded polyamide resin beads to which internal pressure has been applied are taken out. In the present invention, the start of the internal pressure application process refers to the first time when the state in which the water content of the expanded polyamide resin beads put into the pressure vessel is 1% or more and the state in which the physical foaming agent is pressed into the pressure vessel are both met. The time exceeding 50% of the total implementation time of the internal pressure application process may be a continuous time in the total implementation time, or may be the sum of intermittent times. The present invention includes an embodiment in which, for example, the internal pressure application process is started at a temperature lower than the change point temperature of the storage modulus of the expanded polyamide-based resin beads in a hygroscopic state, and at any timing during the internal pressure application process, the temperature inside the pressure-resistant vessel is adjusted to a temperature higher than the change point temperature of the storage modulus of the expanded polyamide-based resin beads at that time.
From the viewpoint of applying a more sufficient internal pressure, the time during which the temperature inside the pressure vessel is adjusted to be higher than the change point temperature of the storage modulus of the polyamide-based resin foamed particles in a hygroscopic state in the internal pressure application step is more preferably 70% or more, even more preferably 80% or more, particularly preferably 90% or more, and most preferably essentially 100% of the total implementation time of the internal pressure application step.
The temperature inside the pressure vessel during the time exceeding 50% of the total implementation time of the internal pressure application process may be adjusted to a constant value or may be varied. During the internal pressure application process, the change point temperature of the storage modulus of the expanded polyamide resin particles changes with the change in the moisture content. Therefore, the change point temperature of the storage modulus of the expanded polyamide resin particles, which is an index for determining the temperature inside the pressure vessel, refers to the change point temperature of the storage modulus indicated when determining the temperature.
As described above, the temperature at which the storage modulus of the polyamide-based resin expanded particles in a hygroscopic state changes is lower than that in a dry state. Therefore, the polyamide-based resin expanded particles can be impregnated with a physical foaming agent at a lower temperature or in a shorter time than when dry polyamide-based resin expanded particles are used. As a result, the load on the equipment such as the pressure vessel can be reduced, and the productivity is excellent. In addition, the decrease in the closed cell ratio of the obtained polyamide-based resin multi-stage expanded particles and discoloration due to deterioration of the resin can be suppressed.

内圧付与工程における上記温度の範囲は、特に限定されないが、吸湿状態のポリアミド系樹脂発泡粒子に、当該内圧付与工程の開始時における吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも30℃以上高い温度で物理発泡剤を含浸させることが好ましい。これによって、物理発泡剤の含浸時間を有意に短縮化することが可能であり、またより高い内圧を付与することが可能である。
また、内圧付与工程実施中に、耐圧容器内において徐々に吸湿状態のポリアミド系樹脂発泡粒子の含水率が減少し、内圧付与工程の開始時よりも貯蔵弾性率の変化点温度が上昇する場合がある。これに対し、物理発泡剤を含浸させる温度を、内圧付与工程の開始時における吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも30℃以上高い温度で設定することによって、物理発泡剤を含浸させている途中で上記変化点温度が上昇した場合であっても、特段の問題なく、ポリアミド系樹脂発泡粒子の内圧を高めることができる。かかる観点から、上記内圧付与工程の温度は、内圧付与工程の開始時における吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも35℃高い温度以上であることがより好ましく、40℃高い温度以上であることがより好ましく、45℃高い温度以上であることが更に好ましい。一方、耐圧容器等の装置にかかる負荷を小さくする観点からは、上記内圧付与工程の温度は、内圧付与工程の開始時における吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも80℃高い温度以下であることが好ましく、70℃高い温度以下であることがより好ましく、60℃高い温度以下であることが更に好ましい。
The temperature range in the internal pressure application step is not particularly limited, but it is preferable to impregnate the hygroscopic polyamide resin foamed particles with the physical foaming agent at a temperature 30° C. or higher than the change point temperature of the storage modulus of the hygroscopic polyamide resin foamed particles at the start of the internal pressure application step, which makes it possible to significantly shorten the impregnation time of the physical foaming agent and to apply a higher internal pressure.
In addition, during the internal pressure application process, the moisture content of the polyamide-based resin foamed beads in a hygroscopic state may gradually decrease in the pressure vessel, and the temperature at the change point of the storage modulus may increase from the temperature at the start of the internal pressure application process. In contrast, by setting the temperature at which the physical foaming agent is impregnated at a temperature 30° C. or higher than the temperature at the change point of the storage modulus of the polyamide-based resin foamed beads in a hygroscopic state at the start of the internal pressure application process, the internal pressure of the polyamide-based resin foamed beads can be increased without any particular problems even if the change point temperature increases during the impregnation of the physical foaming agent. From this viewpoint, the temperature of the internal pressure application process is more preferably 35° C. or higher, more preferably 40° C. or higher, and even more preferably 45° C. or higher than the temperature at the change point of the storage modulus of the polyamide-based resin foamed beads in a hygroscopic state at the start of the internal pressure application process. On the other hand, from the viewpoint of reducing the load on equipment such as a pressure-resistant vessel, the temperature of the internal pressure application process is preferably not more than 80° C. higher than the change point temperature of the storage modulus of the expanded polyamide resin particles in a hygroscopic state at the start of the internal pressure application process, more preferably not more than 70° C. higher, and even more preferably not more than 60° C. higher.

内圧付与工程の全実施時間の50%を超える時間において、内圧付与工程における耐圧容器内の温度を、内圧付与工程の開始時における吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも30℃以上高い温度で物理発泡剤を含浸させることが好ましい。たとえば、内圧付与工程の開始時における吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度が-10℃である場合、20℃以上の温度で内圧付与工程における耐圧容器内の温度を、内圧付与工程の全実施時間の50%を超える時間において維持することが好ましい。 It is preferable to impregnate the physical foaming agent at a temperature in the pressure vessel during the internal pressure application process that is 30°C or higher than the change point temperature of the storage modulus of the hygroscopic polyamide resin foam particles at the start of the internal pressure application process for a time exceeding 50% of the total implementation time of the internal pressure application process. For example, if the change point temperature of the storage modulus of the hygroscopic polyamide resin foam particles at the start of the internal pressure application process is -10°C, it is preferable to maintain the temperature in the pressure vessel during the internal pressure application process at a temperature of 20°C or higher for a time exceeding 50% of the total implementation time of the internal pressure application process.

本発明においては、内圧付与工程の初期段階において、耐圧容器内の温度を、吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも高く調整することがより好ましい。ここで、内圧付与工程の初期段階とは、内圧付与工程の全実施時間のうち、開始時から5%経過時までの時点をいい、好ましくは3%経過時までの時点であり、より好ましくは1%経過時までの時点であり、最も好ましくは内圧付与工程の開始時点である。
さらに、このように内圧付与工程の初期段階から内圧付与工程の開始時における吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも30℃以上高い温度で物理発泡剤を含浸させ始め、内圧付与工程の終期段階まで連続して当該変化点温度より30℃以上高い温度が保たれることがより好ましい。ここで、内圧付与工程の終期段階とは、内圧付与工程の全実施時間のうち、開始時から95%経過時から100%経過時までの時点をいい、好ましくは、97%経過時から100%経過時までの時点をいい、より好ましくは99%経過時から100%経過時までの時点をいう。
In the present invention, it is more preferable to adjust the temperature inside the pressure vessel to be higher than the temperature at which the storage modulus of the hygroscopic polyamide resin foamed particles changes in the initial stage of the internal pressure application process. Here, the initial stage of the internal pressure application process refers to a point in time from the start of the internal pressure application process until 5% of the total implementation time of the internal pressure application process has elapsed, preferably until 3% has elapsed, more preferably until 1% has elapsed, and most preferably at the start of the internal pressure application process.
Furthermore, it is more preferable to start impregnating the physical foaming agent at a temperature 30° C. or more higher than the change point temperature of the storage modulus of the expanded polyamide resin particles in a hygroscopic state at the start of the internal pressure application process from the initial stage of the internal pressure application process, and to continuously maintain the temperature 30° C. or more higher than the change point temperature until the final stage of the internal pressure application process. Here, the final stage of the internal pressure application process refers to the time point from 95% to 100% of the total implementation time of the internal pressure application process from the start, preferably from 97% to 100%, and more preferably from 99% to 100%.

上記内圧付与工程の温度の上限の絶対値は特に具体的に特定されるものではなく、含水率、物理発泡剤の含浸時間等の他の条件を鑑みて決定することができる。ただし、装置にかかる負荷を低減し、またポリアミド系樹脂多段発泡粒子の独立気泡率の低下や、樹脂の劣化に伴う変色等を抑制する観点からは、内圧付与工程において物理発泡剤を含浸させる際の温度は、150℃以下であることが好ましく、120℃以下とすることがより好ましく、100℃以下とすることがさらに好ましく、80℃以下とすることがよりさらに好ましく、50℃以下とすることが特に好ましく、30℃以下とすることが最も好ましい。 The absolute upper limit of the temperature in the internal pressure application process is not particularly specified, and can be determined in consideration of other conditions such as the moisture content and the time for impregnation of the physical foaming agent. However, from the viewpoint of reducing the load on the device and suppressing a decrease in the closed cell rate of the polyamide resin multi-stage foamed particles and discoloration due to deterioration of the resin, the temperature when the physical foaming agent is impregnated in the internal pressure application process is preferably 150°C or less, more preferably 120°C or less, even more preferably 100°C or less, even more preferably 80°C or less, particularly preferably 50°C or less, and most preferably 30°C or less.

本発明において、貯蔵弾性率の変化点温度は、JIS K7095:2012に倣い、ポリアミド系樹脂発泡粒子の動的粘弾性測定(DMA)を測定して得られる貯蔵弾性率の変化点温度(温度と貯蔵弾性率とによる曲線からのガラス転移温度)を意味する。
具体的には、予め含水率を調整した1個の発泡粒子を治具で固定し、圧縮モード、周波数一定(1Hz)で温度を、-50℃から150℃まで昇温速度2℃/minの速度で昇温させて貯蔵弾性率を測定する。そして、図2に示すとおり、縦軸を貯蔵弾性率、横軸を温度として、測定結果をプロットしてグラフを作成する。図2は、JIS K7095:2012に倣い測定されるポリアミド系樹脂発泡粒子の貯蔵弾性率と温度との関係を例示的に示すグラフである。なお、DMA測定装置としては、たとえば日立ハイテクサイエンス社製DMA7100を使用することができる。
上記グラフにおいて、貯蔵弾性率の最初に急激に低下する前の直線部を高温側に延長した延長線L1と、貯蔵弾性率が最初に急激に低下した後の中間線の直線部を低温側に延長した延長線L2との交点Bから下方に引いた垂線が指し示す温度を貯蔵弾性率の変化点温度とする。なお、貯蔵弾性率の変化点温度が複数現れる場合は、最も低温側の変化点温度を採用する。上記測定を10個の発泡粒子について行い、その算術平均値をポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度とする。
In the present invention, the storage modulus change temperature refers to the storage modulus change temperature (glass transition temperature from a curve of temperature and storage modulus) obtained by measuring the dynamic mechanical properties (DMA) of the expanded polyamide resin particles in accordance with JIS K7095:2012.
Specifically, one expanded bead, the moisture content of which has been adjusted in advance, is fixed in a jig, and the temperature is raised from -50°C to 150°C at a rate of 2°C/min in compression mode at a constant frequency (1 Hz), to measure the storage modulus. Then, as shown in Figure 2, the measurement results are plotted in a graph with the storage modulus on the vertical axis and the temperature on the horizontal axis. Figure 2 is a graph showing an example of the relationship between the storage modulus and temperature of expanded polyamide resin beads measured according to JIS K7095:2012. As a DMA measuring device, for example, a DMA7100 manufactured by Hitachi High-Tech Science Corporation can be used.
In the graph, the temperature indicated by a perpendicular line drawn downward from the intersection B between an extension line L1, which is an extension to the high temperature side of the straight line portion before the initial rapid drop in the storage modulus, and an extension line L2, which is an extension to the low temperature side of the straight line portion of the midpoint after the initial rapid drop in the storage modulus, is taken as the change-point temperature of the storage modulus. If multiple change-point temperatures of the storage modulus appear, the change-point temperature on the lowest side is used. The above measurement is carried out for 10 expanded beads, and the arithmetic average value is taken as the change-point temperature of the storage modulus of the polyamide resin expanded beads.

なお、動的粘弾性測定(DMA)の測定によれば、貯蔵弾性率のほかに、損失弾性率、および損失正接を求めることができる。これらの物性値のうち、貯蔵弾性率は通常最も低温側に変化点温度が現れる物性値である。つまり、貯蔵弾性率の変化点温度は、測定される樹脂材料の分子運動の変化が生じ始める(弾性率が変化する)最も低い温度と考えられる。したがって、本発明において、貯蔵弾性率の変化点温度がポリアミド系樹脂発泡粒子に内圧を付与可能な下限温度の指標として適用できたと考えられる。 In addition to the storage modulus, the loss modulus and loss tangent can be determined by dynamic mechanical analysis (DMA). Of these physical properties, the storage modulus is the one whose transition temperature usually appears at the lowest temperature. In other words, the transition temperature of the storage modulus is considered to be the lowest temperature at which the molecular motion of the resin material being measured begins to change (the elastic modulus changes). Therefore, in the present invention, the transition temperature of the storage modulus can be used as an indicator of the lowest temperature at which internal pressure can be applied to the polyamide resin foam particles.

なお、ポリアミド系樹脂発泡粒子の動的粘弾性測定において貯蔵弾性率の測定が困難な場合や、測定値のバラつきが大きい場合には、予め当該ポリアミド系樹脂発泡粒子と同種のポリアミド系樹脂から構成される複数のポリアミド系樹脂発泡粒子においてその含水率と上記測定における貯蔵弾性率の変化点温度との関係性をプロットすることにより含水率と貯蔵弾性率の変化点との関係式を求め、当該貯蔵弾性率の測定が困難である発泡粒子の含水率の値から当該関係式を用いて計算することにより貯蔵弾性率の変化点温度を求めることもできる。 When it is difficult to measure the storage modulus in the dynamic viscoelasticity measurement of polyamide resin foam particles, or when there is a large variation in the measured values, the relationship between the moisture content and the temperature at which the storage modulus changes in the above measurement can be plotted in advance for multiple polyamide resin foam particles made of the same type of polyamide resin as the polyamide resin foam particles, to obtain a relationship between the moisture content and the temperature at which the storage modulus changes, and the temperature at which the storage modulus changes can be obtained by performing calculations using the relationship from the moisture content value of the foam particles whose storage modulus is difficult to measure.

(内圧付与工程における圧力について)
次に、内圧付与工程における耐圧容器内の圧力について説明する。吸湿状態のポリアミド系樹脂発泡粒子が投入された耐圧容器の内部は、物理発泡剤が圧入されることによって昇圧される。これによって、吸湿状態のポリアミド系樹脂発泡粒子に、物理発泡剤が含浸され内圧が付与される。物理発泡剤の圧入と、耐圧容器内の温度の昇温の関係は特に限定されず、上記圧入および上記昇温を同時に開始してもよいし、上記圧入および上記昇温のいずれか一方を先に開始してもよいし、まず上記昇温を開始し所定の温度になってから上記圧入を開始してもよい。
(Regarding the pressure in the internal pressure application process)
Next, the pressure inside the pressure vessel in the internal pressure application step will be described. The pressure inside the pressure vessel into which the hygroscopic polyamide-based resin foamed particles are charged is increased by injecting a physical foaming agent. As a result, the hygroscopic polyamide-based resin foamed particles are impregnated with the physical foaming agent and internal pressure is applied. The relationship between the injection of the physical foaming agent and the increase in temperature inside the pressure vessel is not particularly limited, and the injection and the temperature increase may be started simultaneously, or one of the injection and the temperature increase may be started first, or the temperature increase may be started first and then the injection may be started after a predetermined temperature is reached.

耐圧容器内の圧力の昇圧速度は特に限定されないが、吸湿状態のポリアミド系樹脂発泡粒子は吸湿前に比べて軟化している。そのため、急激な昇圧によって発泡粒子が潰れないよう配慮するという観点、装置に対する負荷軽減の観点、内圧付与に要する時間を短縮する観点等からは、0.01MPa/hr以上0.2MPa/hr以下の範囲の速度で耐圧容器内に物理発泡剤を圧入することが好ましい。
ポリアミド系樹脂発泡粒子の一般的な製造方法では、ポリアミド系樹脂のガスバリア性の高さを考慮して、0.01MPa/hrを超えない昇圧速度で物理発泡剤を圧入することが一般的である。しかし、本発明における内圧付与工程では、吸湿状態とすることでガスバリア性が低下したポリアミド系樹脂発泡粒子を用いるため、上述する昇圧でも十分に物理発泡剤を含浸させて内圧を付与することができる。
The rate at which the pressure in the pressure vessel is increased is not particularly limited, but since the polyamide resin foam particles in a moisture-absorbing state are softer than before moisture absorption, it is preferable to inject the physical foaming agent into the pressure vessel at a rate in the range of 0.01 MPa/hr to 0.2 MPa/hr from the viewpoints of preventing the foam particles from being crushed by a sudden increase in pressure, reducing the load on the device, and shortening the time required for applying internal pressure.
In a general method for producing expanded polyamide resin particles, in consideration of the high gas barrier property of polyamide resin, a physical foaming agent is generally injected at a pressure increase rate not exceeding 0.01 MPa/hr. However, in the internal pressure imparting step in the present invention, since expanded polyamide resin particles having reduced gas barrier property due to being in a hygroscopic state are used, the above-mentioned pressure increase can be sufficient to impregnate the physical foaming agent and impart internal pressure.

耐圧容器内の最終的な圧力は、特に限定されないが、0.2MPa(G)以上2.0MPa(G)以下の範囲であることが好ましく、0.3MPa(G)以上1.0MPa(G)以下の範囲であることがより好ましい。 The final pressure in the pressure vessel is not particularly limited, but is preferably in the range of 0.2 MPa (G) to 2.0 MPa (G), and more preferably in the range of 0.3 MPa (G) to 1.0 MPa (G).

尚、内圧付与工程において用いられる物理発泡剤は、上述する第二準備工程において記載する物理発泡剤と同様のものが例示される。 The physical foaming agent used in the internal pressure application process is, for example, the same as the physical foaming agent described in the second preparation process described above.

耐圧容器内における温度および適宜調整される昇圧条件等の調整よって、吸湿状態のポリアミド系樹脂発泡粒子に物理発泡剤を含浸させて大気圧超の内圧を付与する。かかる内圧が付与されたポリアミド系樹脂発泡粒子を後述する加熱発泡工程に用いることによって見掛け密度の小さいポリアミド系樹脂多段発泡粒子を製造することができる。より見掛け密度の小さいポリアミド系樹脂多段発泡粒子を得られやすいという観点からは、上記内圧は、0.1MPa(G)以上であることが好ましく、0.15MPa(G)以上であることがより好ましく、0.2MPa(G)以上であることがさらに好ましい。
一方、上記内圧の上限は特に限定されないが、耐圧容器の性能や経済的なバランスを鑑みると、概ね2MPa(G)以下であり、1MPa(G)以下であることが好ましい。
By adjusting the temperature in the pressure vessel and the pressure increase conditions appropriately, the polyamide-based resin expanded beads in a moisture-absorbed state are impregnated with a physical foaming agent to impart an internal pressure above atmospheric pressure. The polyamide-based resin expanded beads to which such internal pressure has been imparted are used in the heat expansion step described below to produce multi-stage polyamide-based resin expanded beads having a low apparent density. From the viewpoint of easily obtaining multi-stage polyamide-based resin expanded beads having a low apparent density, the internal pressure is preferably 0.1 MPa (G) or more, more preferably 0.15 MPa (G) or more, and even more preferably 0.2 MPa (G) or more.
On the other hand, the upper limit of the internal pressure is not particularly limited, but in consideration of the performance of the pressure-resistant container and the economical balance, it is generally 2 MPa (G) or less, and preferably 1 MPa (G) or less.

内圧付与工程において、吸湿状態のポリアミド系樹脂発泡粒子の内圧上昇速度が、0.003MPa/hr以上0.05MPa/hr以下の範囲となるように当該ポリアミド系樹脂発泡粒子に物理発泡剤を含浸させることが好ましい。これによって従来に比べ、短時間で高い内圧をポリアミド系樹脂発泡粒子に付与することができる。換言すると、乾燥状態のポリアミド系樹脂発泡粒子を用いた場合には、ガスバリア性が高いため、温度を高温に設定しない限り、上述する早い速度で内圧を付与することは困難であった。しかし、本発明は、吸湿状態であってガスバリア性の低いポリアミド系樹脂発泡粒子を用いるため、短縮された時間内に高い内圧を付与可能であり、生産性に優れる。かかる観点から、上記内圧上昇速度は、0.005MPa/hr以上であることがより好ましい。
ポリアミド系樹脂発泡粒子の内圧上昇速度は、内圧付与工程において得られたポリアミド系樹脂発泡粒子の内圧(MPa(G))から内圧付与を行う前の吸湿状態のポリアミド系樹脂発泡粒子の内圧(MPa(G))を差し引き、それを得るために要した加圧時間で除することにより算出される。前記吸湿状態の発泡粒子の内圧上昇速度は、内圧付与工程において、必ずしも一定の値となるものではなく、一時間あたりに上昇する内圧(MPa(G))の割合の平均値を意味するものである。
In the internal pressure imparting step, it is preferable to impregnate the polyamide-based resin expanded beads with a physical foaming agent so that the internal pressure rise rate of the hygroscopic polyamide-based resin expanded beads is in the range of 0.003 MPa/hr to 0.05 MPa/hr. This allows a high internal pressure to be imparted to the polyamide-based resin expanded beads in a short time compared to the conventional method. In other words, when dry polyamide-based resin expanded beads are used, it is difficult to impart internal pressure at the above-mentioned high speed unless the temperature is set to a high temperature because the gas barrier property is high. However, the present invention uses hygroscopic polyamide-based resin expanded beads with low gas barrier property, so that a high internal pressure can be imparted within a shortened time, and is excellent in productivity. From this viewpoint, it is more preferable that the internal pressure rise rate is 0.005 MPa/hr or more.
The internal pressure rise rate of the expanded polyamide resin beads is calculated by subtracting the internal pressure (MPa (G)) of the expanded polyamide resin beads in a hygroscopic state before the application of internal pressure from the internal pressure (MPa (G)) of the expanded polyamide resin beads obtained in the internal pressure application step, and dividing the result by the pressurization time required to obtain the subtracted internal pressure. The internal pressure rise rate of the expanded polyamide resin beads in a hygroscopic state does not necessarily become a constant value in the internal pressure application step, but means the average rate of the internal pressure (MPa (G)) rising per hour.

ポリアミド系樹脂発泡粒子の内圧Pは、下記式(1)および式(2)を用いて以下の方法により求めることができる。尚、小袋の重量W7はあらかじめ計測しておく。
具体的には、まず、耐圧容器から取り出した内圧が付与されたポリアミド系樹脂発泡粒子群(濡れた加圧発泡粒子群)から、任意の量の内圧が付与されたポリアミド系樹脂発泡粒子(濡れた加圧発泡粒子)を小袋にとり、重量W2を測定する。
さらに、当該ポリアミド系樹脂発泡粒子群(濡れた加圧発泡粒子群)から任意の量のサンプルを別途採取し、当該サンプル中の含水量をカールフィッシャー水分量計で予め測定する。カールフィッシャー水分量計で測定された水分量をW6、カールフィッシャー水分量計の測定に供したサンプル量をW5とする。
濡れた加圧発泡粒子に含まれる水分量W3は、濡れた加圧発泡粒子の重量W2から小袋の重量W7を引いた値を、上記カールフィッシャー水分量計の測定に供したサンプル量W5で除して、これにカールフィッシャー水分量計で測定された水分量W6を乗じることによって求めることができる。
乾燥加圧ビーズ重量W1は、濡れた加圧発泡粒子の重量W2から上記で求めた濡れた加圧発泡粒子中の水分量W3と袋の重量W7を合わせた値を引くことで求めることができる。
続いて、上記濡れた加圧発泡粒子を、80℃、大気圧下の恒温恒湿槽に小袋ごと収容し48時間静置して内圧を抜く。そして、圧が抜けたポリアミド系樹脂発泡粒子を恒温恒湿槽から取り出し、160℃、大気圧下の条件で20時間乾燥させる。そして小袋から取り出した乾燥したポリアミド系樹脂発泡粒子(乾燥発泡粒子)の重量W4を測定し、以下の式(1)にて内圧が付与されたポリアミド系樹脂発泡粒子に含有されていた空気量Waを算出する。尚、カールフィッシャー水分量計および測定条件は、上記ポリアミド系樹脂発泡粒子の含水率の測定と同様とする。
尚、ポリアミド系樹脂発泡粒子の圧が抜けたかどうかは、当該粒子の重量が減少しなくなったことで確認することができるが、たとえば、48時間程度の長時間、80℃の恒温恒湿に収容することで十分に圧が抜けた状態とすることができる。
[数1]
空気量Wa=W1-W4
=(W2-W3-W7)-W4
=[(W2-(W2-W7)/W5×W6)-W7]-W4・・・(1)
W1:乾燥加圧発泡粒子重量(g)
W2:小袋の重量を含む濡れた加圧ビーズ重量(g)
W3:濡れた加圧発泡粒子中の水分量(g)
W4:乾燥発泡粒子重量(g)
W5:カールフィッシャー水分量計の測定に供したサンプル量(g)
W6:カールフィッシャー水分量計で測定された水分量(g)
W7:小袋の重量(g)
Wa:空気量(g)
The internal pressure P of the expanded polyamide resin beads can be determined by the following method using the following formulas (1) and (2): The weight W7 of the small bag is measured in advance.
Specifically, first, from the group of polyamide-based resin foamed beads to which internal pressure has been applied (the group of wet pressure-expanded beads) that has been removed from the pressure-resistant container, a group of polyamide-based resin foamed beads to which an arbitrary amount of internal pressure has been applied (the wet pressure-expanded beads) is placed in a small bag, and the weight W2 is measured.
Furthermore, an arbitrary amount of sample is taken from the polyamide resin foamed particles (wet pressurized foamed particles), and the moisture content of the sample is measured in advance with a Karl Fischer moisture meter. The moisture content measured with the Karl Fischer moisture meter is designated as W6, and the amount of sample used for the measurement with the Karl Fischer moisture meter is designated as W5.
The moisture content W3 contained in the wetted pressure-foamed particles can be determined by subtracting the weight W7 of the small bag from the weight W2 of the wetted pressure-foamed particles, dividing the result by the sample weight W5 used in the measurement with the Karl Fischer moisture meter, and multiplying the result by the moisture content W6 measured with the Karl Fischer moisture meter.
The weight W1 of the dry pressurized beads can be calculated by subtracting the combined weight W7 of the bag and the amount of water W3 in the wet pressurized-foamed beads from the weight W2 of the wet pressurized-foamed beads.
Next, the wetted pressurized foamed particles are placed together with the pouch in a thermostatic chamber at 80°C and atmospheric pressure, and left to stand for 48 hours to release the internal pressure. The depressurized polyamide-based resin foamed particles are then removed from the thermostatic chamber and dried at 160°C and atmospheric pressure for 20 hours. The weight W4 of the dried polyamide-based resin foamed particles (dried foamed particles) removed from the pouch is then measured, and the amount of air Wa contained in the polyamide-based resin foamed particles to which internal pressure has been applied is calculated using the following formula (1). The Karl Fischer moisture meter and measurement conditions are the same as those used to measure the moisture content of the polyamide-based resin foamed particles.
Whether the polyamide resin foam particles have been decompressed can be confirmed by checking that the weight of the particles no longer decreases. For example, the particles can be stored in a constant temperature and humidity of 80° C. for a long period of time, such as about 48 hours, to ensure that the pressure has been fully released.
[Equation 1]
Air volume Wa = W1 - W4
=(W2-W3-W7)-W4
= [(W2-(W2-W7)/W5×W6)-W7]-W4...(1)
W1: Weight of dry pressurized foam particles (g)
W2: Weight of wet pressed beads including the weight of the sachet (g)
W3: Water content in wet compressed foam particles (g)
W4: Weight of dry foam particles (g)
W5: Amount of sample (g) used in the Karl Fischer moisture meter measurement
W6: Moisture content (g) measured with a Karl Fischer moisture meter
W7: Weight of the bag (g)
Wa: Air volume (g)

上述のとおり求められた空気量Wa(g)を以下の式(2)に用いて内圧Pが付与されたポリアミド系樹脂発泡粒子の内圧を求めることができる。
[数2]
内圧P(MPa(G))
=(Wa/28.8×0.0831×296)/(W4/発泡粒子の見掛け密度(kg/m)-W4/樹脂の密度(kg/m))・・・(2)
上記方法により測定されるポリアミド系樹脂発泡粒子の内圧P(MPa(G))は、ゲージ圧に相当する。ゲージ圧とは、絶対圧から大気圧を差し引いた値である。
The amount of air Wa (g) obtained as described above can be used in the following formula (2) to obtain the internal pressure of the expanded polyamide resin beads to which the internal pressure P has been applied.
[Equation 2]
Internal pressure P (MPa (G))
= (Wa/28.8×0.0831×296)/(W4/apparent density of expanded beads (kg/m 3 )−W4/density of resin (kg/m 3 )) (2)
The internal pressure P (MPa (G)) of the expanded polyamide resin beads measured by the above method corresponds to a gauge pressure, which is a value obtained by subtracting atmospheric pressure from absolute pressure.

ポリアミド系樹脂発泡粒子に付加された内圧が、内圧付与工程実施後、加熱発泡工程前に抜けにくくするという観点からは、内圧付与工程に用いられる吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも、内圧付与工程によって得られた内圧が付与されたポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度の方が高いことが望ましい。これにより、内圧が付与されたポリアミド系樹脂発泡粒子のガスバリア性を高めて、含浸された物理発泡剤を発泡粒子内部に保持することで、次工程における加熱発泡工程において、より高い発泡倍率のポリアミド系樹脂多段発泡粒子を製造し得る。
かかる観点から、内圧付与工程に用いられる吸湿状態のポリアミド系樹脂発泡粒子の含水率(A)と内圧付与工程によって得られた内圧が付与されたポリアミド系樹脂発泡粒子の含水率(B)との差[(A)-(B)]は0.5%以上であることが好ましく、1%以上であることがより好ましく、3%以上であることがさらに好ましい。
内圧付与工程によって得られた内圧が付与されたポリアミド系樹脂発泡粒子の含水率(B)の値は、付与された内圧が抜けにくくなり、見掛け密度の小さな多段発泡粒子をより安定して製造する観点から、10%以下であることが好ましく、8%以下であることがより好ましく、6%以下であることが更に好ましい。
上記内圧付与工程によって得られた内圧が付与されたポリアミド系樹脂発泡粒子の含水率(B)は、上記内圧付与工程の時間、温度、昇温速度、圧力、昇圧速度等を変更することにより調整することができる。
From the viewpoint of making it difficult for the internal pressure applied to the expanded polyamide resin particles to escape after the internal pressure application step and before the heat-expansion step, it is desirable that the change point temperature of the storage modulus of the expanded polyamide resin particles to which the internal pressure has been applied obtained by the internal pressure application step is higher than the change point temperature of the storage modulus of the expanded polyamide resin particles in a hygroscopic state used in the internal pressure application step. This improves the gas barrier properties of the expanded polyamide resin particles to which the internal pressure has been applied, and retains the impregnated physical foaming agent inside the expanded particles, thereby enabling the production of multi-stage expanded polyamide resin particles with a higher expansion ratio in the subsequent heat-expansion step.
From this viewpoint, the difference [(A)-(B)] between the moisture content (A) of the expanded polyamide-based resin beads in a hygroscopic state used in the internal pressure application step and the moisture content (B) of the expanded polyamide-based resin beads to which internal pressure has been applied obtained by the internal pressure application step is preferably 0.5% or more, more preferably 1% or more, and even more preferably 3% or more.
The value of the moisture content (B) of the polyamide-based resin expanded beads to which internal pressure has been applied, obtained by the internal pressure application step, is preferably 10% or less, more preferably 8% or less, and even more preferably 6% or less, from the viewpoint of making it difficult for the applied internal pressure to escape and more stably producing multi-stage expanded beads having a small apparent density.
The moisture content (B) of the polyamide resin foamed beads to which internal pressure has been applied, obtained by the internal pressure application step, can be adjusted by changing the time, temperature, temperature rise rate, pressure, pressure rise rate, etc. of the internal pressure application step.

上記内圧付与工程により、多段発泡用のポリアミド系樹脂発泡粒子が提供される。すなわち、「含水率1%以上の吸湿状態のポリアミド系樹脂発泡粒子に、前記吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも高い温度下で前記物理発泡剤を含浸させてなる、大気圧超の内圧を有する多段発泡用ポリアミド系樹脂発泡粒子」が提供される。 The above-mentioned internal pressure application process provides polyamide-based resin foam particles for multi-stage expansion. In other words, "polyamide-based resin foam particles for multi-stage expansion having an internal pressure above atmospheric pressure, which are obtained by impregnating polyamide-based resin foam particles in a hygroscopic state with a water content of 1% or more with the physical foaming agent at a temperature higher than the change point temperature of the storage modulus of the hygroscopic polyamide-based resin foam particles" are provided.

[加熱発泡工程]
上述する内圧付加工程の後、速やかに加熱発泡工程が実施される。上記加熱発泡工程は、内圧付与工程において得られた内圧が付与されたポリアミド系樹脂発泡粒子を加熱し、発泡させて、上記内圧付与工程に用いられたポリアミド系樹脂発泡粒子よりも見掛け密度の小さいポリアミド系樹脂多段発泡粒子を得る工程である。
加熱発泡工程において、「内圧付与工程に用いられたポリアミド系樹脂発泡粒子の見掛け密度」とは、第二準備工程において得られる、前記含水工程を行う前のポリアミド系樹脂発泡粒子の見掛け密度を意味する。つまり、本発明に関し、ポリアミド系樹脂発泡粒子の見掛け密度というときは、充分に乾燥したポリアミド系樹脂発泡粒子を用いて測定された見掛け密度のことをいう。
[Heat foaming process]
The heating and foaming step is immediately carried out after the internal pressure application step, in which the polyamide-based resin expanded beads to which the internal pressure obtained in the internal pressure application step has been applied are heated and foamed to obtain multi-stage polyamide-based resin expanded beads having an apparent density smaller than that of the polyamide-based resin expanded beads used in the internal pressure application step.
In the heat-expanding step, the "apparent density of the expanded polyamide-based resin beads used in the internal pressure application step" means the apparent density of the expanded polyamide-based resin beads obtained in the second preparation step before the moisture-containing step is carried out. In other words, in the present invention, the apparent density of the expanded polyamide-based resin beads refers to the apparent density measured using sufficiently dried expanded polyamide-based resin beads.

より具体的には、内圧が付与されたポリアミド系樹脂発泡粒子を容器に入れ、加熱して発泡させる。加熱発泡工程は、圧力下で行われてもよい。この場合の圧力は、特に限定されないが、たとえば0.03MPa以上0.4MPa以下程度の範囲で調整するとよい。 More specifically, the polyamide resin foam particles to which internal pressure has been applied are placed in a container and heated to cause foaming. The heating and foaming process may be carried out under pressure. The pressure in this case is not particularly limited, but may be adjusted, for example, to a range of 0.03 MPa or more and 0.4 MPa or less.

加熱方法は、熱可塑性樹脂発泡粒子の多段発泡において公知の加熱発泡工程と同様の加熱方法を適宜採用することができる。具体的には、加熱媒体としてたとえば水蒸気(スチーム)または加熱空気を用いて加熱することが好ましく、水蒸気を用いて加熱することがより好ましい。加熱媒体として水蒸気を用いることにより、容器内に供給される水蒸気に含まれる水分により、内圧が付加されたポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度を低下させることができ、これによって、より高発泡のポリアミド系樹脂多段発泡粒子が得られやすい。加熱時間は、例えば5秒以上120秒以下の範囲とすることができる。 The heating method can be appropriately selected from the same heating methods as known heating and foaming processes for multi-stage foaming of thermoplastic resin beads. Specifically, it is preferable to heat using, for example, water vapor (steam) or heated air as a heating medium, and it is more preferable to heat using water vapor. By using water vapor as a heating medium, the moisture contained in the water vapor supplied into the container can lower the change point temperature of the storage modulus of the polyamide resin foamed beads to which internal pressure has been applied, making it easier to obtain polyamide resin multi-stage foamed beads with higher foaming. The heating time can be, for example, in the range of 5 seconds to 120 seconds.

加熱発泡工程における容器内での加熱温度は特に限定さないが、密閉容器内に入れられた、内圧が付与されたポリアミド系樹脂発泡粒子を、当該内圧が付与されたポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも高く、かつ当該内圧が付与されたポリアミド系樹脂発泡粒子を構成するポリアミド系樹脂の融点よりも低い温度の加熱媒体により加熱し、発泡させることが好ましい。これにより、高い発泡倍率だけではなく、密閉容器内における発泡粒子同士のブロッキング(発泡粒子同士が融着することによって塊状となること)を回避し、独立気泡率の高い成形性に優れた発泡粒子が得られやすい。かかる観点から、加熱発泡工程に加熱媒体の温度は70℃以上190℃以下の範囲が好適である。加熱発泡工程における前記内圧が付与されたポリアミド系樹脂発泡粒子を構成するポリアミド系樹脂の融点とは、当該発泡粒子を構成するポリアミド系樹脂固有の融点を意味する。 The heating temperature in the container in the heat-foaming process is not particularly limited, but it is preferable to heat and foam the polyamide-based resin foam particles to which internal pressure has been applied, which are placed in a sealed container, with a heating medium having a temperature higher than the change point temperature of the storage modulus of the polyamide-based resin foam particles to which internal pressure has been applied, and lower than the melting point of the polyamide-based resin constituting the polyamide-based resin foam particles to which internal pressure has been applied. This makes it easy to obtain not only a high expansion ratio, but also foam particles with a high independent cell ratio and excellent moldability, by avoiding blocking between the foam particles in the sealed container (the foam particles melt together to form a mass). From this perspective, the temperature of the heating medium in the heat-foaming process is preferably in the range of 70°C to 190°C. The melting point of the polyamide-based resin constituting the polyamide-based resin foam particles to which internal pressure has been applied in the heat-foaming process means the melting point specific to the polyamide-based resin constituting the foam particles.

(ポリアミド系樹脂多段発泡粒子)
上述のとおり内圧付加工程および加熱発泡工程を実施することによって、見掛け密度の小さいポリアミド系樹脂多段発泡粒子を製造することができる。本発明の製造方法によれば、たとえば見掛け密度が100kg/m以下であるポリアミド系樹脂多段発泡粒子を得ることができ、さらに好ましくは上記見掛け密度を85kg/m以下、より好ましくは70kg/m以下に調整することが可能である。これによって軽量化に優れたポリアミド系樹脂発泡粒子成形体を提供することができる。2段発泡で上記範囲の見掛け密度にならない場合には、さらに3段発泡以上の発泡を実施してもよい。かかる範囲であれば、軽量性に優れたポリアミド系樹脂発泡粒子成形体を提供することができる。
(Polyamide resin multi-stage expanded particles)
By carrying out the internal pressure application step and the heat expansion step as described above, it is possible to produce multi-stage polyamide resin expanded beads having a small apparent density. According to the production method of the present invention, it is possible to obtain multi-stage polyamide resin expanded beads having an apparent density of, for example, 100 kg/m3 or less , and more preferably, the apparent density can be adjusted to 85 kg/m3 or less, more preferably 70 kg/m3 or less. This makes it possible to provide a polyamide resin expanded bead molding having excellent weight reduction. If the apparent density does not fall within the above range by two-stage expansion, three or more stages of expansion may be further carried out. If it is within this range, it is possible to provide a polyamide resin expanded bead molding having excellent weight reduction.

本発明の製造方法では、内圧付与工程に用いられたポリアミド系樹脂発泡粒子の見掛け密度よりも、加熱発泡工程によって得られたポリアミド系樹脂多段発泡粒子の見掛け密度の方が小さく、特に発泡倍率の大きなポリアミド系樹脂多段発泡粒子を容易に製造することができる。特に、軽量性により優れるポリアミド系樹脂多段発泡粒子を得る観点からは、内圧付与工程に用いられたポリアミド系樹脂発泡粒子の見掛け密度に対する、ポリアミド系樹脂多段発泡粒子の見掛け密度の比が、0.70以下であることが好ましく、0.65以下であることがより好ましく、0.60以下であることが更に好ましく、0.55以下であることが特に好ましい。 In the manufacturing method of the present invention, the apparent density of the polyamide-based resin multi-stage expanded beads obtained by the heat expansion step is smaller than the apparent density of the polyamide-based resin expanded beads used in the internal pressure application step, and multi-stage polyamide-based resin expanded beads having a particularly large expansion ratio can be easily manufactured. In particular, from the viewpoint of obtaining multi-stage polyamide-based resin expanded beads having superior light weight, the ratio of the apparent density of the polyamide-based resin multi-stage expanded beads to the apparent density of the polyamide-based resin expanded beads used in the internal pressure application step is preferably 0.70 or less, more preferably 0.65 or less, even more preferably 0.60 or less, and particularly preferably 0.55 or less.

本発明の製造方法に関し、ポリアミド系樹脂発泡粒子またはポリアミド系樹脂多段発泡粒子の見掛け密度は、以下の方法で測定される。
温度23℃の水の入ったメスシリンダーを用意し、該メスシリンダーに、相対湿度50%、23℃、1atmの条件にて2日間放置した約500cm3の発泡粒子の重量Wpを測定し、金網を使用して沈める。金網の体積を考慮して、水位上昇分より読みとられる発泡粒子の容積Vp[cm3]を測定し、発泡粒子の重量Wp[g]を容積Vpで割り算し(Wp/Vp)、単位を[kg/m3]に換算することにより、発泡粒子の見掛け密度を求めることができる。
In the production method of the present invention, the apparent density of the expanded polyamide resin beads or the multi-stage expanded polyamide resin beads is measured by the following method.
A graduated cylinder containing water at 23°C is prepared, and the weight Wp of about 500 cm3 of expanded beads that have been left in the graduated cylinder for two days under conditions of 50% relative humidity, 23°C, and 1 atm is measured and then submerged using a wire mesh. Taking into account the volume of the wire mesh, the volume Vp [ cm3 ] of the expanded beads is measured from the rise in the water level, and the weight Wp [g] of the expanded beads is divided by the volume Vp (Wp/Vp) and converted into units of [kg/ m3 ] to obtain the apparent density of the expanded beads.

本発明の製造方法により製造されたポリアミド系樹脂多段発泡粒子の独立気泡率は、80%以上であることが好ましく、85%以上であることがより好ましく、90%以上であることがさらに好ましい。独立気泡率が上記範囲を満足することで、発泡粒子の成形性が良好となり、発泡粒子を型内成形して作製した発泡粒子成形体は、二次発泡性、融着性に優れる傾向にある。
上記独立気泡率は、発泡粒子中の全気泡の容積に対する独立気泡の容積の割合であり、ASTM-D2856-70に記載されている手順Cに基づき空気比較式比重計を用いて求めることができる。
The closed cell ratio of the polyamide resin multi-stage expanded beads produced by the production method of the present invention is preferably 80% or more, more preferably 85% or more, and even more preferably 90% or more. When the closed cell ratio satisfies the above range, the moldability of the expanded beads becomes good, and the expanded bead molding produced by molding the expanded beads in a mold tends to be excellent in secondary expandability and fusion property.
The closed cell ratio is the ratio of the volume of closed cells to the volume of all cells in the expanded beads, and can be determined using an air comparison type pycnometer based on procedure C described in ASTM-D2856-70.

<高温ピークを備えるポリアミド系樹脂発泡粒子>
ところで、本出願人はより優れたポリアミド系樹脂発泡粒子を提供するために種々の研究を行い、熱流束示差走査熱量測定によって得られたDSC曲線において一般的なポリアミド系樹脂発泡粒子では発現しない高温ピークを有するポリアミド系樹脂発泡粒子を提案している(WO2020/050301A1)。かかる高温ピークを示すポリアミド系樹脂発泡粒子であれば、発泡粒子の耐熱性を高めることができると共に、発泡時に発泡粒子同士のブロッキングが好適に防止される。
<Polyamide resin foam particles with high temperature peak>
Meanwhile, the present applicant has conducted various studies in order to provide better expanded polyamide-based resin particles, and has proposed expanded polyamide-based resin particles having a high-temperature peak in a DSC curve obtained by heat flux differential scanning calorimetry that does not appear in general expanded polyamide-based resin particles (WO2020/050301A1). Expanded polyamide-based resin particles exhibiting such a high-temperature peak can enhance the heat resistance of the expanded particles and can suitably prevent blocking between the expanded particles during expansion.

ここで高温ピークとは、より具体的には、図3に示すとおり、JIS K7122-1987に基づき、熱流束示差走査熱量測定によって、ポリアミド系樹脂発泡粒子を、加熱速度10℃/minにて、30℃から融解ピーク終了時よりも30℃高い温度まで加熱溶融させる際に測定される1回目のDSC曲線において、ポリアミド系樹脂に固有の融解ピーク(固有ピークa)よりも高温側に頂点温度が現れる融解ピーク(高温ピークb)のことを指す。図3は、ポリアミド系樹脂発泡粒子の熱流束示差走査熱量測定法に基づき測定されたDSC曲線の一例である。かかる図3では1つの高温ピークbが出現した例を示したが、高温ピークbは2以上であってもよい。
該固有ピークの頂点温度より高温側に頂点温度が現れるすべての高温ピークの融解熱量の合計は、5J/g以上であることが好ましく、6J/g以上であることがより好ましく、7J/g以上であることがさらに好ましい。また、融解熱量の合計は、50J/g以下であることが好ましく、30J/g以下であることがより好ましく、20J/g以下であることがさらに好ましい。尚、上記高温ピークが2つ以上現れる場合には、該高温ピークの融解熱量は、全ての高温ピークの合計熱量を意味する。
More specifically, the high-temperature peak here refers to a melting peak (high-temperature peak b) whose apex temperature appears at a higher temperature than the melting peak (intrinsic peak a) inherent to the polyamide resin in the first DSC curve measured when the expanded polyamide resin particles are heated and melted from 30° C. to a temperature 30° C. higher than the end of the melting peak at a heating rate of 10° C./min by heat-flux differential scanning calorimetry based on JIS K7122-1987, as shown in FIG. 3. FIG. 3 is an example of a DSC curve measured by heat-flux differential scanning calorimetry of an expanded polyamide resin particle. Although FIG. 3 shows an example in which one high-temperature peak b appears, the number of high-temperature peaks b may be two or more.
The total heat of fusion of all high-temperature peaks whose peak temperatures appear on the higher side than the peak temperature of the intrinsic peak is preferably 5 J/g or more, more preferably 6 J/g or more, and even more preferably 7 J/g or more. The total heat of fusion is preferably 50 J/g or less, more preferably 30 J/g or less, and even more preferably 20 J/g or less. In addition, when two or more high-temperature peaks appear, the heat of fusion of the high-temperature peak means the total heat of all high-temperature peaks.

一方、固有ピークaは、ポリアミド系樹脂固有の結晶構造に由来する融解ピークである。固有ピークaの頂点温度は、後述する2回目のDSC曲線に現れる融解ピークの頂点温度と概ね一致する。
2回目のDSC曲線とは、1回目のDSC曲線の測定終了後のポリアミド系樹脂発泡粒子を、1回目のDSC曲線の測定後における融解ピーク終了時よりも30℃高い温度にて、10分間保った後、冷却速度10℃/minにて30℃まで冷却し、再度、加熱速度10℃/minにて融解ピーク終了時よりも30℃高い温度まで加熱溶融させる際に測定されるDSC曲線を指す。
1回目のDSC曲線における、高温ピークの融解熱量の具体的な求め方については、実施例にて記載する。
On the other hand, the intrinsic peak a is a melting peak derived from the crystalline structure inherent to the polyamide resin. The apex temperature of the intrinsic peak a is approximately the same as the apex temperature of the melting peak appearing in the second DSC curve described later.
The second DSC curve refers to a DSC curve measured when the expanded polyamide resin beads after the measurement of the first DSC curve are held for 10 minutes at a temperature 30° C. higher than the end of the melting peak after the measurement of the first DSC curve, cooled to 30° C. at a cooling rate of 10° C./min, and then heated and melted again at a heating rate of 10° C./min to a temperature 30° C. higher than the end of the melting peak.
A specific method for determining the heat of fusion of the high-temperature peak in the first DSC curve will be described in the Examples.

上記高温ピークbを示すポリアミド系樹脂発泡粒子は、プレ工程を構成する第二準備工程として、ダイレクト発泡法を採用することにより得ることができる。具体的には、ポリアミド系樹脂粒子が分散された密閉容器(発泡釜)内の温度を調整し、ポリアミド系樹脂の結晶化を促進させることによって得られる。
上記温度は、上述の趣旨が達成される範囲で適宜設定することができる。たとえば、ダイレクト発泡法において、分散時の温度(開始温度)から放出時の温度(発泡温度)まで密閉容器内の温度を昇温させる際、開始温度と発泡温度との間の任意の中間温度において一定時間、当該中間温度を保持する加熱保持工程を設ける方法が好適である。またこのような温度を実施する発泡工程において、密閉容器に添加される分散媒体として水などの水性媒体を選択することが好ましい。ポリアミド系樹脂粒子を水性媒体中に分散させて吸水させることで、当該ポリアミド系樹脂粒子を可塑化させ、最終的な発泡温度を可塑化前に比べて低く設定することができる。
The expanded polyamide resin particles exhibiting the high-temperature peak b can be obtained by adopting a direct foaming method as the second preparation step constituting the pre-step. Specifically, the temperature in a closed container (foaming tank) in which the polyamide resin particles are dispersed is adjusted to promote crystallization of the polyamide resin.
The temperature can be appropriately set within the range that achieves the above-mentioned purpose. For example, in the direct foaming method, when the temperature in the sealed container is raised from the temperature during dispersion (start temperature) to the temperature during release (foaming temperature), a method of providing a heating and holding step of holding the intermediate temperature at any intermediate temperature between the start temperature and the foaming temperature for a certain period of time is preferable. In the foaming step in which such a temperature is carried out, it is preferable to select an aqueous medium such as water as the dispersion medium added to the sealed container. By dispersing the polyamide-based resin particles in an aqueous medium and allowing them to absorb water, the polyamide-based resin particles are plasticized, and the final foaming temperature can be set lower than that before plasticization.

上記加熱保持工程は、上記ポリアミド系樹脂粒子が分散された密閉容器を、ポリアミド系樹脂の融点(Tm)よりも90℃低い温度(Tm-90℃)以上50℃低い温度(Tm-50℃)未満で1分以上60分以下の保持時間で保持する工程であることが好ましい。このように前記の条件で保持する工程を含むことで、上述する高温ピークを形成することができる。 The heating and holding step is preferably a step of holding the sealed container in which the polyamide-based resin particles are dispersed at a temperature that is 90°C lower than the melting point (Tm) of the polyamide-based resin (Tm - 90°C) or more and less than 50°C lower (Tm - 50°C) for a holding time of 1 minute or more and 60 minutes or less. By including a step of holding under the above conditions in this manner, the above-mentioned high-temperature peak can be formed.

上述のとおり高温ピークを有するポリアミド系樹脂発泡粒子は、発泡粒子の耐熱性を高めることができると共に、発泡時に発泡粒子同士のブロッキングが好適に防止されるものの、従来、多段発泡を実施しにくいとい問題があった。すなわち、高温ピークを示すほどに結晶化が促進されたポリアミド系樹脂発泡粒子は、高温ピークを有しないポリアミド系樹脂発泡粒子に比べて、さらにガスバリア性が高い傾向にあり、多段発泡時において物理発泡剤が含浸し難いという事情があった。 As described above, expanded polyamide resin beads having a high-temperature peak can increase the heat resistance of the expanded beads and effectively prevent blocking between the expanded beads during expansion, but in the past, there was a problem that it was difficult to carry out multi-stage expansion. In other words, expanded polyamide resin beads in which crystallization has been promoted to the extent that they show a high-temperature peak tend to have even higher gas barrier properties than expanded polyamide resin beads that do not have a high-temperature peak, and there was a situation in which it was difficult to impregnate them with a physical blowing agent during multi-stage expansion.

これに対し、本発明の製造方法であれば、高温ピークを有するポリアミド系樹脂発泡粒子の含水率を1%以上に調整し、上記内圧付与工程および加熱発泡工程を実施することで、以下の効果を享受する。即ち、本発明によれば、高温ピークを有するポリアミド系樹脂発泡粒子であっても、当該発泡粒子の貯蔵弾性率の変化点を低下させることができ、容易に物理発泡剤を含浸させて十分な内圧を付与することができる。その結果、高温ピークを有する見掛け密度の小さな多段発泡粒子をより容易に製造することができる。 In contrast, the manufacturing method of the present invention adjusts the moisture content of the polyamide resin expanded beads having a high-temperature peak to 1% or more, and performs the internal pressure application process and the heat expansion process, thereby achieving the following effects. That is, according to the present invention, even for polyamide resin expanded beads having a high-temperature peak, the change point of the storage modulus of the expanded beads can be lowered, and the expanded beads can be easily impregnated with a physical foaming agent to apply sufficient internal pressure. As a result, multi-stage expanded beads having a high-temperature peak and a small apparent density can be more easily manufactured.

上述のとおり、本発明において、吸湿状態のポリアミド系樹脂発泡粒子として、たとえば、1段発泡により得られた1段発泡粒子を上記含水工程により含水率1%以上に調整したポリアミド系樹脂発泡粒子を用いることができる。かかるポリアミド系樹脂発泡粒子を用いて本発明の製造方法により2段目の発泡(2段発泡)を実施することができる。
また、吸湿状態のポリアミド系樹脂発泡粒子として、上記加熱発泡工程により得られた見掛け密度の小さいポリアミド系樹脂多段発泡粒子であって含水率1%以上のものを用いることもできる。つまり、本発明は、2段発泡の実施に限定されるものではなく、本発明の実施により得られたポリアミド系樹脂多段発泡粒子であって含水率を適宜調整された発泡粒子を「吸湿状態のポリアミド系樹脂発泡粒子」として用い、さらに本発明の製造方法を繰り返すことによって、3段発泡、4段発泡・・・と繰り返しても良い。より小さい見掛け密度を実現するために、3段発泡以上の発泡を行うことができる。
尚、2段発泡により得られたポリアミド系樹脂多段発泡粒子をさらに3段発泡に供与する場合には、予め予備実験により3段発泡に供与されるポリアミド系樹脂多段発泡粒子の貯蔵弾性率の変化点温度を測定し把握しておくとよい。
As described above, in the present invention, the polyamide-based resin expanded particles in a hygroscopic state may be, for example, polyamide-based resin expanded particles obtained by adjusting the moisture content of the first-stage expanded particles obtained by the first-stage expansion to 1% or more by the moisture-containing step. The second-stage expansion (second-stage expansion) can be carried out by the production method of the present invention using such polyamide-based resin expanded particles.
Also, as the hygroscopic polyamide resin expanded particles, multi-stage polyamide resin expanded particles having a low apparent density obtained by the above-mentioned heat expansion step and a moisture content of 1% or more can be used. In other words, the present invention is not limited to the implementation of two-stage expansion, and the expanded particles having a properly adjusted moisture content, which are multi-stage polyamide resin expanded particles obtained by implementing the present invention, can be used as "hygroscopic polyamide resin expanded particles", and the manufacturing method of the present invention can be repeated to perform three-stage expansion, four-stage expansion, and so on. In order to achieve a smaller apparent density, three-stage or more expansion can be performed.
When the multi-stage expanded polyamide resin particles obtained by the second-stage expansion are to be subjected to a third-stage expansion, it is advisable to measure and grasp the change point temperature of the storage modulus of the multi-stage expanded polyamide resin particles to be subjected to the third-stage expansion in advance by a preliminary experiment.

以上に説明する本発明のポリアミド系樹脂多段発泡粒子を用いてなるポリアミド系樹脂発泡粒子成形体(以下、単に成形体ともいう)を製造することができる。製造方法は特に限定されず、従来公知の方法を採用することできる。たとえば、型内成形法は、上記成形体を製造するために好ましい。特にスチームを利用した型内成形法によれば、スチームによりポリアミド系樹脂多段発泡粒子を構成するポリアミド系樹脂が可塑化されるため、型内成形時の成形圧力を低くすることが可能となる。尚、得られた成形体は、軽量性に優れ、乾燥させることでポリアミド系樹脂本来の物性を発現できるようになり、高い耐熱性を有する成形体となる。
また、上記型内成形法において、ポリアミド系樹脂多段発泡粒子を成形型内に充填する方法としては、公知の方法を採用することができる。発泡粒子成形体の融着性を考慮し発泡粒子の二次発泡力を過度に向上させない範囲で、発泡粒子を加圧気体で加圧処理して、発泡粒子の気泡内に所定の内圧を付与してから型内に充填する方法、発泡粒子を加圧気体で圧縮した状態で加圧された型内に充填し、その後型内の圧力を開放する方法、発泡粒子を型内に充填する前に予め型を開いて成形空間を広げておき、充填後に型を閉じることで発泡粒子を機械的に圧縮する方法等を採用することができる。上記成形体は、耐熱性が高く、また耐摩耗性および耐薬品性等にも優れる上、成形品融着性や引張強度にも優れる。さらに、本発明の多段発泡粒子を用いてなる成形体は、特に軽量性に優れるものである。そのため上記成形体は、自動車部品、電気製品等に良好に利用可能である。
A polyamide resin multi-stage expanded bead molded article (hereinafter, simply referred to as a molded article) can be manufactured using the polyamide resin multi-stage expanded bead of the present invention described above. The manufacturing method is not particularly limited, and a conventionally known method can be adopted. For example, an in-mold molding method is preferable for manufacturing the molded article. In particular, according to the in-mold molding method using steam, the polyamide resin constituting the polyamide resin multi-stage expanded bead is plasticized by steam, so that it is possible to reduce the molding pressure during in-mold molding. The obtained molded article has excellent light weight, and by drying, the inherent physical properties of the polyamide resin can be expressed, resulting in a molded article with high heat resistance.
In addition, in the in-mold molding method, a known method can be adopted as a method for filling the polyamide resin multi-stage expanded beads into the mold. In consideration of the fusion property of the expanded bead molding, within a range that does not excessively improve the secondary expansion power of the expanded beads, a method of pressurizing the expanded beads with a pressurized gas to impart a predetermined internal pressure to the bubbles of the expanded beads and then filling the expanded beads into the mold, a method of filling the expanded beads in a compressed state with a pressurized gas into a pressurized mold and then releasing the pressure in the mold, a method of opening the mold in advance before filling the expanded beads into the mold to expand the molding space, and closing the mold after filling to mechanically compress the expanded beads, etc. can be adopted. The above molded body has high heat resistance, excellent abrasion resistance and chemical resistance, and is also excellent in molded product fusion property and tensile strength. Furthermore, the molded body made using the multi-stage expanded beads of the present invention is particularly excellent in light weight. Therefore, the above molded body can be favorably used for automobile parts, electrical products, etc.

以下に、本発明を実施例により詳細に説明するが、本発明はこれにより限定されるものではない。 The present invention will be described in detail below with reference to examples, but the present invention is not limited thereto.

以下に述べる実施例および比較例に関し、ポリアミド系樹脂発泡粒子、およびポリアミド系樹脂多段発泡粒子の各物性は以下の方法で測定した。尚、本段落において記載する測定方法は、ポリアミド系樹脂発泡粒子に関する測定方法として記載しているが、いずれの測定方法も、ポリアミド系樹脂多段発泡粒子の各測定に適用することができる。
<見掛け密度の測定方法>
温度23℃の水の入ったメスシリンダーを用意し、該メスシリンダーに、相対湿度50%、23℃、1atmの条件にて2日間放置した約500cm3のポリアミド系樹脂発泡粒子の重量Wpを測定し、金網を使用して沈めた。金網の体積を考慮して、水位上昇分より読みとられるポリアミド系樹脂発泡粒子の容積Vp[cm3]を測定し、発泡粒子の重量Wp[g]を容積Vpで割り算し(Wp/Vp)、単位を[kg/m3]に換算することにより、発泡粒子の見掛け密度を求めた。
<高温ピークの融解熱量の測定方法>
ポリアミド系樹脂発泡粒子の高温ピークの融解熱量は、熱流束示差走査熱量測定によって10℃/分の昇温速度で、30℃から融解ピーク終了時よりも30℃高い温度まで昇温して測定したときに得られる1回目のDSC曲線の高温ピークの面積から求めた。なお、測定装置として、高感度型示差走査熱量計「EXSTAR DSC7020」(エスアイアイ・ナノテクノロジー社製)を使用した。
発泡粒子の高温ピーク融解熱量は、図3に示すDSC曲線において、固有ピークaよりも高温側に現れる高温ピークbの面積に相当し、次のようにして求めた。まず、図3に示すようにDSC曲線上の150℃の点Iと、DSC曲線上の融解終了温度を示す点IIとを結ぶ直線を引いた。次に、固有ピークaと高温ピークbとの間の谷部にあたるDSC曲線上の点IIIを通りグラフ横軸の温度に対して垂直な直線と、点Iと点IIとを結んだ直線との交点を点IVとした。このようにして求めた点IVと点IIとを結ぶ直線、点IIIと点IVを結ぶ直線及び点IIIと点IIを結ぶDSC曲線によって囲まれる部分(斜線部分)の面積を高温ピークの融解熱量とした。
<独立気泡率の測定方法>
独立気泡率は、ポリアミド系樹脂発泡粒子中の全気泡の容積に対する独立気泡の容積の割合であり、ASTM-D2856-70に記載されている手順Cに基づき空気比較式比重計を用いて求めた。
<貯蔵弾性率の変化点温度の測定方法>
まずJIS K7095:2012に倣い、ポリアミド系樹脂発泡粒子の動的粘弾性測定(DMA)を測定して得られる貯蔵弾性率を測定してグラフを作成し、これにより変化点温度を特定した。DMA測定装置としては、日立ハイテクサイエンス社製DMA7100を使用した。
具体的には、予め含水率を調整した1個の発泡粒子を治具で固定し、圧縮モード、周波数一定(1Hz)で-50℃~150℃まで昇温速度2℃/minで温度を変化させて当該発泡粒子の貯蔵弾性率を測定した。そして、図2に示すとおり、縦軸を貯蔵弾性率、横軸を温度として、測定結果をプロットしてグラフを作成した。かかるグラフにおいて、貯蔵弾性率の最初に急激に低下する前の直線部を高温側に延長した延長線L1と、貯蔵弾性率が最初に急激に低下した後の中間線の直線部を低温側に延長した延長線L2との交点Bから下方に垂線を温度軸まで引き、当該垂線が指し示す温度を貯蔵弾性率の変化点温度とした。上記測定を10個の発泡粒子について行い、その算術平均値をポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度とした。
<含水率の測定方法>
ポリアミド系樹脂発泡粒子の含水率は、上述するカールフィッシャー法を用いて求めた。具体的には、まず、約0.2gのポリアミド系樹脂発泡粒子を秤量し、試験片とした。次いで、加熱水分気化装置(平沼産業社製の自動加熱水分気化装置SE320)を用いて試験片を温度160℃まで加熱することにより、試験片の内部の水分を気化させた。この水分を加熱水分気化装置に接続されたカールフィッシャー水分測定装置(平沼産業株式会社製AQ-2200A)へ導き、水分量を測定し、発泡粒子中の含水率を算出した。なお、測定条件(滴定条件)は、待ち時間:40秒、電解電流:MEDIUM、最小電解量:5μgとした。上記測定を5つの試験片について行い、その算術平均値をポリアミド系樹脂発泡粒子の含水率とした。
<内圧の測定方法>
ポリアミド系樹脂発泡粒子の内圧Pは、下記式(1)および式(2)を用いて以下の方法により求めた。尚、小袋の重量W7はあらかじめ計測した。
まず、内圧が付与されたポリアミド系樹脂発泡粒子群(濡れた加圧発泡粒子群)から、任意の量の内圧が付与されたポリアミド系樹脂発泡粒子(濡れた加圧発泡粒子)を小袋にとり、重量W2を測定した。
さらに、当該ポリアミド系樹脂発泡粒子群(濡れた加圧発泡粒子群)から任意の量のサンプルを別途採取し、当該サンプル中の含水量をカールフィッシャー水分量計で予め測定した。カールフィッシャー水分量計で測定された水分量をW6、カールフィッシャー水分量計の測定に供したサンプル量をW5とする。
濡れた加圧発泡粒子に含まれる水分量W3は、濡れた加圧発泡粒子の重量W2から小袋の重量W7を引いた値を、上記カールフィッシャー水分量計の測定に供したサンプル量W5で除して、これにカールフィッシャー水分量計で測定された水分量W6を乗じることによって求めた。
乾燥加圧ビーズ重量W1は、濡れた加圧発泡粒子の重量W2から上記で求めた濡れた加圧発泡粒子中の水分量W3と袋の重量W7を合わせた値を引くことで求めた。
続いて、上記濡れた加圧発泡粒子を、48時間程度80℃の恒温恒湿槽に小袋ごと収容し内圧を抜いた。そして、圧が抜けたポリアミド系樹脂発泡粒子を恒温恒湿槽から取り出し、160℃、20時間の条件で乾燥した。そして小袋から取り出した乾燥後のポリアミド系樹脂発泡粒子(乾燥発泡粒子)の重量W4を測定し、以下の式(1)にて内圧が付与されたポリアミド系樹脂発泡粒子に含有されていた空気量Waを算出した。尚、カールフィッシャー水分量計および測定条件は、上記ポリアミド系樹脂発泡粒子の含水率の測定と同様とした。
[数3]
空気量Wa=W1-W4
=(W2-W3-W7)-W4
=[(W2-(W2-W7)/W5×W6)-W7]-W4・・・(1)
W1:乾燥加圧発泡粒子重量(g)
W2:小袋の重量を含む濡れた加圧ビーズ重量(g)
W3:濡れた加圧発泡粒子中の水分量(g)
W4:乾燥発泡粒子重量(g)
W5:カールフィッシャー水分量計の測定に供したサンプル量(g)
W6:カールフィッシャー水分量計で測定された水分量(g)
W7:小袋の重量(g)
Wa:空気量(g)
上述のとおり求められた空気量Wa(g)を以下の式(2)に用いて内圧Pが付与されたポリアミド系樹脂発泡粒子の内圧を求めた。
[数4]
内圧P(MPa(G))
=(Wa/28.8×0.0831×296)/(W4/発泡粒子の見掛け密度(kg/m)-W4/樹脂の密度(kg/m))・・・(2)
In the following Examples and Comparative Examples, the properties of the polyamide resin expanded beads and the multi-stage polyamide resin expanded beads were measured by the following methods. Note that although the measurement methods described in this paragraph are described as measurement methods for the polyamide resin expanded beads, any of the measurement methods can be applied to the measurements of the multi-stage polyamide resin expanded beads.
<Method of measuring apparent density>
A graduated cylinder containing water at a temperature of 23°C was prepared, and the weight Wp of approximately 500 cm3 of expanded polyamide resin beads that had been left in the graduated cylinder for two days under conditions of 50% relative humidity, 23°C, and 1 atm was measured, and the beads were submerged using a wire net. Taking into account the volume of the wire net, the volume Vp [ cm3 ] of the expanded polyamide resin beads was measured from the rise in the water level, and the weight Wp [g] of the expanded beads was divided by the volume Vp (Wp/Vp) and converted into units of [kg/ m3 ] to obtain the apparent density of the expanded beads.
<Method for measuring heat of fusion of high-temperature peak>
The heat of fusion of the high-temperature peak of the expanded polyamide resin particles was determined from the area of the high-temperature peak of the first DSC curve obtained by measuring the temperature from 30° C. to a temperature 30° C. higher than the end of the melting peak at a heating rate of 10° C./min by heat flux differential scanning calorimetry. A high-sensitivity differential scanning calorimeter "EXSTAR DSC7020" (manufactured by SII NanoTechnology Inc.) was used as the measuring device.
The high-temperature peak heat of fusion of the expanded beads corresponds to the area of the high-temperature peak b appearing on the higher temperature side than the intrinsic peak a in the DSC curve shown in Fig. 3, and was calculated as follows. First, as shown in Fig. 3, a straight line was drawn connecting point I of 150°C on the DSC curve and point II showing the melting end temperature on the DSC curve. Next, point IV was determined as the intersection point between a line passing through point III on the DSC curve corresponding to the valley between the intrinsic peak a and the high-temperature peak b, which is perpendicular to the temperature on the horizontal axis of the graph, and the line connecting points I and II. The area of the part (shaded part) surrounded by the line connecting points IV and II, the line connecting points III and IV, and the DSC curve connecting points III and II thus calculated was determined as the heat of fusion of the high-temperature peak.
<Method for measuring closed cell ratio>
The closed cell ratio is the ratio of the volume of closed cells to the volume of all cells in the expanded polyamide resin beads, and was determined using an air comparison type specific gravity meter according to procedure C described in ASTM-D2856-70.
<Method for measuring the temperature at which storage modulus changes>
First, in accordance with JIS K7095: 2012, the dynamic mechanical properties (DMA) of the polyamide resin foam particles were measured to measure the storage modulus, and a graph was created to identify the change point temperature. The DMA measuring device used was a DMA7100 manufactured by Hitachi High-Tech Science Corporation.
Specifically, one expanded bead whose moisture content had been adjusted in advance was fixed in a jig, and the temperature was changed from -50°C to 150°C at a heating rate of 2°C/min in compression mode at a constant frequency (1 Hz) to measure the storage modulus of the expanded bead. As shown in Figure 2, the measurement results were plotted on a graph with the storage modulus on the vertical axis and the temperature on the horizontal axis. In the graph, a perpendicular line was drawn downward from the intersection B between an extension line L1, which is an extension line of the straight line before the initial rapid drop in the storage modulus to the high temperature side, and an extension line L2, which is an extension line of the intermediate line after the initial rapid drop in the storage modulus to the low temperature side, to the temperature axis, and the temperature indicated by the perpendicular line was taken as the change point temperature of the storage modulus. The above measurement was performed on 10 expanded beads, and the arithmetic average value was taken as the change point temperature of the storage modulus of the polyamide resin expanded beads.
<Method of measuring moisture content>
The moisture content of the polyamide resin expanded particles was determined using the Karl Fischer method described above. Specifically, first, about 0.2 g of the polyamide resin expanded particles was weighed and used as a test piece. Next, the test piece was heated to a temperature of 160° C. using a heating moisture vaporizer (automatic heating moisture vaporizer SE320 manufactured by Hiranuma Sangyo Co., Ltd.) to vaporize the moisture inside the test piece. This moisture was introduced into a Karl Fischer moisture measuring device (AQ-2200A manufactured by Hiranuma Sangyo Co., Ltd.) connected to the heating moisture vaporizer, the moisture amount was measured, and the moisture content in the expanded particles was calculated. The measurement conditions (titration conditions) were: waiting time: 40 seconds, electrolysis current: MEDIUM, minimum amount of electrolysis: 5 μg. The above measurement was performed on five test pieces, and the arithmetic average value was taken as the moisture content of the polyamide resin expanded particles.
<Method of measuring internal pressure>
The internal pressure P of the expanded polyamide resin beads was determined by the following method using the following formulas (1) and (2): The weight W7 of the small bag was measured in advance.
First, from the group of polyamide-based resin foamed beads to which internal pressure had been applied (group of wet pressure-expanded beads), polyamide-based resin foamed beads to which an arbitrary amount of internal pressure had been applied (wet pressure-expanded beads) were placed in a small bag, and the weight W2 was measured.
Furthermore, an arbitrary amount of sample was taken from the polyamide resin foamed particles (wet pressurized foamed particles), and the moisture content of the sample was measured in advance with a Karl Fischer moisture meter. The moisture content measured with the Karl Fischer moisture meter is W6, and the amount of sample used for the measurement with the Karl Fischer moisture meter is W5.
The moisture content W3 contained in the wetted pressure-foamed particles was determined by subtracting the weight W7 of the small bag from the weight W2 of the wetted pressure-foamed particles, dividing the result by the sample weight W5 used in the measurement with the Karl Fischer moisture meter, and multiplying the result by the moisture content W6 measured with the Karl Fischer moisture meter.
The weight W1 of the dry pressurized beads was calculated by subtracting the combined weight W7 of the bag and the amount of water W3 in the wet pressurized-foamed beads from the weight W2 of the wet pressurized-foamed beads.
Next, the wetted pressurized foamed particles were placed together with the pouch in a thermostatic chamber at 80°C for about 48 hours to release the internal pressure. The depressurized polyamide-based resin foamed particles were then removed from the thermostatic chamber and dried at 160°C for 20 hours. The weight W4 of the dried polyamide-based resin foamed particles (dried foamed particles) removed from the pouch was measured, and the amount of air Wa contained in the polyamide-based resin foamed particles to which internal pressure had been applied was calculated using the following formula (1). The Karl Fischer moisture meter and measurement conditions were the same as those used to measure the moisture content of the polyamide-based resin foamed particles.
[Equation 3]
Air volume Wa = W1 - W4
=(W2-W3-W7)-W4
= [(W2-(W2-W7)/W5×W6)-W7]-W4...(1)
W1: Weight of dry pressurized foam particles (g)
W2: Weight of wet pressed beads including the weight of the sachet (g)
W3: Water content in wet compressed foam particles (g)
W4: Weight of dry foam particles (g)
W5: Amount of sample (g) used in the Karl Fischer moisture meter measurement
W6: Moisture content (g) measured with a Karl Fischer moisture meter
W7: Weight of the bag (g)
Wa: Air volume (g)
The amount of air Wa (g) obtained as described above was used in the following formula (2) to obtain the internal pressure of the expanded polyamide resin beads to which the internal pressure P was applied.
[Equation 4]
Internal pressure P (MPa (G))
= (Wa/28.8×0.0831×296)/(W4/apparent density of expanded beads (kg/m 3 )−W4/density of resin (kg/m 3 )) (2)

[ポリアミド系樹脂粒子の製造]
ポリアミド系樹脂として、ポリアミド6/66コポリマー(ポリアミド6/ポリアミド66=85/15;UBEナイロン5033B、宇部興産株式会社製、融点197℃、密度1.14kg/m、曲げ弾性率1300MPa、MFR3.5g/10分)および気泡調整剤として「タルカンパウダーPK-S」(林化成株式会社製)をその含有量が8000重量ppmとなるように供給し、末端封鎖剤として「Stabaxol P」(ラインケミー社製)を1重量部となるように供給し、溶融混錬し、ストランド状に押し出して水中で冷却した後、ペレタイザーにて切断し、乾燥して、1個当たりの平均重量が2mgのポリアミド系樹脂粒子を得た。
[Production of polyamide resin particles]
As the polyamide resin, polyamide 6/66 copolymer (polyamide 6/polyamide 66=85/15; UBE Nylon 5033B, manufactured by Ube Industries, melting point 197°C, density 1.14 kg/ m3 , flexural modulus 1300 MPa, MFR 3.5 g/10 min) was used, and as the cell regulator, "Talc Powder PK-S" (manufactured by Hayashi Kasei Co., Ltd.) was supplied so that its content was 8000 ppm by weight. As an end-capping agent, "Stabaxol P" (manufactured by Rhein Chemie) was supplied so that its content was 1 part by weight. The mixture was melt-kneaded, extruded into strands, cooled in water, cut with a pelletizer, and dried to obtain polyamide resin particles each having an average weight of 2 mg.

[ポリアミド系樹脂発泡粒子の製造]
得られたポリアミド系樹脂粒子10kgと、分散液として水310リットルとを、撹拌機を備えた400リットルのオートクレーブ内に仕込み、更に、ポリアミド系樹脂粒子100重量部に対して、分散剤としてカオリン3.0重量部と、界面活性剤としてアルキルベンゼンスルホン酸ナトリウム0.08重量部とを分散液に添加した。
オートクレーブ内の内容物を撹拌しながら室温(23℃)から昇温し、136℃に到達後、該オートクレーブ内に発泡剤として二酸化炭素を、オートクレーブ内の圧力が4.0MPa(G)となるまで圧入した。このとき、室温(23℃)から136℃に到達するまでの昇温時間は30分であった。次に、136℃、4.0MPa(G)の状態を15分維持した。
その後、発泡剤が含浸されたポリアミド系樹脂粒子を分散液とともに大気圧(0.1MPa)下に放出した(発泡温度136℃)。得られたポリアミド系樹脂発泡粒子を60℃のオーブン内にて24時間養生し、その後徐冷することにより乾燥状態のポリアミド系樹脂発泡粒子を得た。
得られた発泡粒子の見掛け密度、高温ピークの融解熱量、独立気泡率を測定し、結果を表1~表2に示す。なお、実施例3~11、比較例2、3は、上記昇温、維持、発泡の各温度を136.5℃とした。
[Production of expanded polyamide resin particles]
10 kg of the obtained polyamide-based resin particles and 310 L of water as a dispersion liquid were charged into a 400 L autoclave equipped with a stirrer, and further, 3.0 parts by weight of kaolin as a dispersant and 0.08 parts by weight of sodium alkylbenzene sulfonate as a surfactant were added to the dispersion liquid per 100 parts by weight of the polyamide-based resin particles.
The contents in the autoclave were heated from room temperature (23°C) while stirring, and after the temperature reached 136°C, carbon dioxide as a foaming agent was injected into the autoclave until the pressure inside the autoclave reached 4.0 MPa (G). At this time, the temperature rise time from room temperature (23°C) to 136°C was 30 minutes. Next, the state of 136°C and 4.0 MPa (G) was maintained for 15 minutes.
Thereafter, the polyamide-based resin particles impregnated with the foaming agent were released together with the dispersion liquid under atmospheric pressure (0.1 MPa) (foaming temperature: 136° C.) The obtained expanded polyamide-based resin particles were cured in an oven at 60° C. for 24 hours, and then slowly cooled to obtain expanded polyamide-based resin particles in a dry state.
The apparent density, heat of fusion at the high temperature peak, and closed cell ratio of the obtained expanded beads were measured, and the results are shown in Tables 1 and 2. In Examples 3 to 11 and Comparative Examples 2 and 3, the temperature for the heating, maintenance, and expansion was set to 136.5°C.

[含水工程]
上述のとおり得られたポリアミド系樹脂発泡粒子を用いて、乾燥状態のポリアミド系樹脂発泡粒子および水をポリ袋内に入れた後、ポリ袋の口を閉じてよく振り、所定の含水率となるまで十分に混ぜ合わせる含水工程を実施して、水分含量を調整した。これにより得られた発泡粒子の含水率、および含水工程後の当該発泡粒子の貯蔵弾性率の変化点温度Tを測定し、表1~2に示した。
[Water-containing step]
The polyamide resin expanded particles obtained as described above were used, and the polyamide resin expanded particles in a dry state and water were placed in a plastic bag, and then the mouth of the plastic bag was closed and the mixture was shaken well to a predetermined water content, thereby carrying out a water-containing step to adjust the water content. The water content of the expanded particles obtained in this way and the temperature T at which the storage modulus of the expanded particles changed after the water-containing step were measured, and are shown in Tables 1 and 2.

[内圧付与工程]
上述のとおり含水率を調整してなるポリアミド系樹脂発泡粒子180gを、表1~表2に示す加圧温度に設定された3リットル耐圧容器内に入れた。表1~表2には、それぞれの加圧温度と、用いられたポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度と、の差もあわせて示す。
上記含水率を調整してなる発泡粒子を耐圧容器内に入れて密閉すると同時に、物理発泡剤として空気を圧入して内圧付与工程を開始した。物理発泡剤としての空気は、表1~2に示す昇圧速度で圧入し、当該耐圧容器内の圧力(加圧圧力)が0.6MPa(G)となった後は0.6MPa(G)で一定とした。このときの加圧時間(物理発泡剤を圧入してから内圧が付与されたポリアミド系樹脂発泡粒子を耐圧容器から取り出すまでの時間)および昇圧速度は表1~表2に示す。加圧温度は一定とした。
表1~2に示す加圧時間が経過した直後に、内圧が付与されたポリアミド系樹脂を耐圧容器から取り出し、当該ポリアミド系樹脂発泡粒子の内圧を測定した。また測定された内圧を加圧時間で除することによって内圧上昇速度を算出した。測定された内圧、および内圧上昇速度は、いずれも表1~表2に示す。
また上述のとおり得られた、内圧が付与されたポリアミド系樹脂発泡粒子の外観を観察し、黄変や皺のない場合には、良好(〇)と評価した。
[Internal pressure application process]
180 g of the expanded polyamide resin beads having the moisture content adjusted as described above was placed in a 3-liter pressure vessel set at the pressurizing temperature shown in Tables 1 and 2. Tables 1 and 2 also show the difference between each pressurizing temperature and the change point temperature of the storage modulus of the expanded polyamide resin beads used.
The expanded beads having the adjusted moisture content were placed in a pressure vessel and sealed, and at the same time, air was injected as a physical foaming agent to start the internal pressure imparting step. The air as a physical foaming agent was injected at the pressure increase rate shown in Tables 1 and 2, and after the pressure (pressurized pressure) in the pressure vessel reached 0.6 MPa (G), it was kept constant at 0.6 MPa (G). The pressurization time (the time from when the physical foaming agent was injected to when the polyamide resin expanded beads to which internal pressure was imparted were taken out of the pressure vessel) and the pressure increase rate are shown in Tables 1 and 2. The pressing temperature was kept constant.
Immediately after the pressurization time shown in Tables 1 and 2 had elapsed, the polyamide resin to which the internal pressure had been applied was removed from the pressure vessel, and the internal pressure of the expanded polyamide resin particles was measured. The internal pressure increase rate was calculated by dividing the measured internal pressure by the pressurization time. The measured internal pressure and the internal pressure increase rate are both shown in Tables 1 and 2.
The appearance of the polyamide resin foamed beads obtained as described above and to which internal pressure had been applied was observed, and those without yellowing or wrinkles were rated as good (.largecircle.).

[加熱発泡工程]
上述のとおり、内圧が付与されたポリアミド系樹脂発泡粒子を用いて、以下のとおり加熱発泡工程を実施した。
上述のとおり得られた内圧が付与されたポリアミド系樹脂発泡粒子180gを、水蒸気(元圧力0.3MPa(G))を圧入することにより圧力および温度が、表1~表2に示す値に設定された、撹拌機を備えた600リットルのオートクレーブ内に入れて密閉し、撹拌しながら、加圧および加熱し、発泡粒子をさらに発泡させた。上記内圧が付与されたポリアミド系樹脂発泡粒子を上記オートクレーブに入れてから15秒後に、オートクレーブを開放し、ポリアミド系樹脂発泡粒子を取り出した。得られたポリアミド系樹脂発泡粒子を40℃のオーブン内にて20時間養生し、その後徐冷して、ポリアミド系樹脂多段発泡粒子(2段発泡粒子)を得た。
[Heat foaming process]
The polyamide resin foamed particles to which internal pressure had been applied as described above were subjected to a heat expansion step as follows.
180 g of the polyamide-based resin expanded beads to which the internal pressure was applied as described above was placed in a 600-liter autoclave equipped with a stirrer, in which steam (original pressure 0.3 MPa (G)) was injected to set the pressure and temperature to the values shown in Tables 1 and 2, and the autoclave was sealed and pressurized and heated with stirring to further expand the expanded beads. 15 seconds after the polyamide-based resin expanded beads to which the internal pressure was applied were placed in the autoclave, the autoclave was opened and the polyamide-based resin expanded beads were taken out. The polyamide-based resin expanded beads obtained were cured in an oven at 40° C. for 20 hours and then slowly cooled to obtain multi-stage polyamide-based resin expanded beads (two-stage expanded beads).

上述のとおり得られたポリアミド系樹脂多段発泡粒子の見掛け密度および独立気泡率を測定した。またポリアミド系樹脂多段発泡粒子(2段発泡粒子)の見掛け密度を、上述する内圧付与工程に用いられた吸湿状態のポリアミド系樹脂発泡粒子(1段発泡粒子)の見掛け密度で除した見掛け密度比を算出した。上記見掛け密度、独立気泡率、見掛け密度比はいずれも表1~表2に示す。 The apparent density and closed cell ratio of the polyamide resin multi-stage expanded beads obtained as described above were measured. In addition, the apparent density ratio was calculated by dividing the apparent density of the polyamide resin multi-stage expanded beads (second-stage expanded beads) by the apparent density of the polyamide resin expanded beads (first-stage expanded beads) in a hygroscopic state used in the internal pressure application process described above. The apparent density, closed cell ratio, and apparent density ratio are all shown in Tables 1 and 2.

[ポリアミド系樹脂発泡粒子成型体の製造]
上述のとおり得られたポリアミド系樹脂多段発泡粒子を用いて以下のとおり発泡粒子成形体を作製した。
まず、得られたポリアミド系樹脂発泡粒子を縦200mm×横65mm×厚さ40mmの平板成形型に充填し、スチーム加熱による型内成形を行なって板状の発泡粒子成形体を得た。加熱方法は両面の型のドレン弁を開放した状態でスチームを5秒間供給して予備加熱(排気工程)を行ったのち、移動側型よりスチームを供給し、次いで固定側型よりスチームを供給した後、成形加熱スチーム圧力(成形圧力=成形蒸気圧)まで加熱した。
加熱終了後、放圧し、成形体の発泡力による表面圧力が0.02MPa(ゲージ圧)に低下するまで水冷したのち、型を開放し成形体を型から取り出した。得られた成形体は80℃のオーブンにて12時間養生し、その後、室温まで徐冷した。このようにして、発泡粒子成形体を得た。
[Production of polyamide resin foamed particle molded body]
The multi-stage expanded polyamide resin beads obtained as described above were used to produce an expanded bead molding as follows.
First, the obtained polyamide resin foamed beads were filled into a flat mold having a length of 200 mm, a width of 65 mm, and a thickness of 40 mm, and then the mold was molded by steam heating to obtain a plate-shaped foamed bead molding. The heating method was as follows: with the drain valves of both molds open, steam was supplied for 5 seconds to perform preheating (exhaust process), and then steam was supplied from the moving mold, and then steam was supplied from the fixed mold, and the mold was heated to the molding heating steam pressure (molding pressure = molding steam pressure).
After the heating, the pressure was released, and the molded product was cooled with water until the surface pressure due to the foaming force of the molded product decreased to 0.02 MPa (gauge pressure), and then the mold was opened and the molded product was removed from the mold. The obtained molded product was cured in an oven at 80° C. for 12 hours, and then slowly cooled to room temperature. In this way, an expanded bead molded product was obtained.

(成形可能範囲の評価)
上記発泡粒子成形体を、スチーム圧力を変化させて作製し、以下の基準で判断した。具体的には、スチーム圧力を0.10~0.20MPa(G)の間で0.02MPa(G)間隔で変化させた以外は前述した発泡粒子成形体の作製方法と同様にして発泡粒子成形体を成形した。
得られた発泡粒子成形体の融着性、表面性、回復性の3項目について以下のとおり評価した。そして、3項目いずれの評価でも良の評価を得たスチーム圧力を、発泡粒子成形体を成形可能な圧力と判断した。表1~2の「成形可能範囲」欄には、発泡粒子成形体を成形可能なスチーム圧力の範囲を示した。
(融着性評価)
発泡粒子成形体の融着率を、発泡粒子成形体を破断した際の破断面に露出した発泡粒子のうち、材料破壊した発泡粒子の数の割合に基づいて求めた。具体的には、まず、発泡粒子成形体から試験片(縦100mm×横100mm×厚み:成形体の厚み)を切り出し、カッターナイフで各試験片の厚み方向に約5mmの切り込みを入れた後、切り込み部から試験片を破断させた。次に、発泡粒子成形体の破断面に存在する発泡粒子の個数(n)と、材料破壊した発泡粒子の個数(b)を測定し、(b)と(n)の比(b/n)を百分率で表して融着率(%)とし、以下のとおり評価した。
良:融着率が90%以上であった。
不可:融着率が90%未満であった。
(Evaluation of moldable range)
The above-mentioned expanded bead moldings were produced by changing the steam pressure and evaluated according to the following criteria. Specifically, the expanded bead moldings were produced in the same manner as the expanded bead molding described above, except that the steam pressure was changed in increments of 0.02 MPa (G) between 0.10 and 0.20 MPa (G).
The resulting expanded bead moldings were evaluated for three items, namely, fusion property, surface property, and recovery property, as follows. The steam pressure that gave a good evaluation in all three items was determined to be the pressure at which the expanded bead molding could be made. The "Moldable range" column in Tables 1 and 2 shows the range of steam pressure at which the expanded bead molding could be made.
(Evaluation of adhesion)
The fusion rate of the expanded bead molding was determined based on the ratio of the number of foamed beads that were broken among the foamed beads exposed on the fracture surface when the expanded bead molding was broken. Specifically, first, a test piece (length 100 mm x width 100 mm x thickness: thickness of molding) was cut out from the expanded bead molding, and a cutter knife was used to make a cut of about 5 mm in the thickness direction of each test piece, and then the test piece was broken from the cut part. Next, the number (n) of the expanded beads present on the fracture surface of the expanded bead molding and the number (b) of the foamed beads that were broken were measured, and the ratio (b/n) of (b) and (n) was expressed as a percentage to obtain the fusion rate (%), which was evaluated as follows.
Good: The fusion rate was 90% or more.
Unacceptable: The fusion rate was less than 90%.

(表面評価)
発泡粒子成形体の表面状態を次のようにして評価した。
良:成形体表面の発泡粒子間隙が完全に埋まっている。
不可:成形体表面の発泡粒子間隙が埋まっていない。
(Surface Evaluation)
The surface condition of the expanded bead molding was evaluated as follows.
Good: Gaps between the foamed particles on the surface of the molded article are completely filled.
Poor: Gaps between the foam particles on the surface of the molded article are not filled.

(回復性評価)
型内成形で用いた平板形状の金型の寸法に対応する発泡粒子成形体における端部(端より10mm内側)と中心部(縦方向、横方向とも2等分する部分)の厚みを計測した。次いで、発泡粒子成形体の厚み比(成形体中心部の厚み/成形体端部の厚み×100(%))を算出し、以下のように評価した。
良:厚み比が90%以上である。
不可:厚み比が90%未満である。
(Resilience assessment)
The thicknesses of the end (10 mm inside from the end) and the center (part dividing the body in half in both the vertical and horizontal directions) of the expanded bead molding corresponding to the dimensions of the flat plate-shaped mold used in the in-mold molding were measured. Then, the thickness ratio of the expanded bead molding (thickness of the center part of the molding/thickness of the end part of the molding×100(%)) was calculated and evaluated as follows.
Good: The thickness ratio is 90% or more.
Unacceptable: The thickness ratio is less than 90%.

(1)ポリアミド系樹脂発泡粒子を耐圧容器に入れ、前記耐圧容器内で、ポリアミド系樹脂発泡粒子に物理発泡剤を含浸させて大気圧超の内圧を付与する内圧付与工程、および
前記内圧付与工程において得られた内圧が付与されたポリアミド系樹脂発泡粒子を加熱して発泡させ、前記内圧付与工程に用いられたポリアミド系樹脂発泡粒子よりも見掛け密度の小さいポリアミド系樹脂多段発泡粒子を得る加熱発泡工程、を備え、
前記内圧付与工程において、含水率1%以上の吸湿状態のポリアミド系樹脂発泡粒子に、前記吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも高い温度下で前記物理発泡剤を含浸させることを特徴とするポリアミド系樹脂多段発泡粒子の製造方法。
(2)前記内圧付与工程において、
前記吸湿状態のポリアミド系樹脂発泡粒子に、
当該内圧付与工程の開始時における前記吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも30℃以上高い温度下で前記物理発泡剤を含浸させる上記(1)に記載のポリアミド系樹脂多段発泡粒子の製造方法。
(3)前記内圧付与工程において、
前記吸湿状態のポリアミド系樹脂発泡粒子に、
120℃以下の温度下で前記物理発泡剤を含浸させる上記(1)又は(2)に記載のポリアミド系樹脂多段発泡粒子の製造方法。
(4)前記吸湿状態のポリアミド系樹脂発泡粒子の含水率が、3.0%以上である上記(1)から(3)のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。
(5)前記吸湿状態のポリアミド系樹脂発泡粒子の含水率が、4.5%以上である上記(1)から(4)のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。
(6)前記内圧付与工程において、
前記吸湿状態のポリアミド系樹脂発泡粒子の内圧上昇速度が0.003MPa/hr以上0.05MPa/hr以下となるよう前記物理発泡剤を含浸させる上記(1)から(5)のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。
(7)前記ポリアミド系樹脂多段発泡粒子の見掛け密度が、100kg/m以下である上記(1)から(6)のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。
(8)前記内圧付与工程に用いられたポリアミド系樹脂発泡粒子の見掛け密度に対する、前記ポリアミド系樹脂多段発泡粒子の見掛け密度の比が、0.70以下である上記(1)から(7)のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。
(9)前記加熱発泡工程において、
前記内圧が付与されたポリアミド系樹脂発泡粒子を、
当該内圧が付与されたポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも高く、かつ当該内圧が付与されたポリアミド系樹脂発泡粒子を構成するポリアミド系樹脂の融点よりも低い温度の加熱媒体により加熱し、発泡させる上記(1)から(8)のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。
(10)前記加熱発泡工程において、
前記内圧が付与されたポリアミド系樹脂発泡粒子を、水蒸気で加熱し、発泡させる上記(1)から(9)のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。
(11)前記内圧付与工程において、
前記ポリアミド系樹脂発泡粒子を耐圧容器に入れ、
前記耐圧容器内の昇圧速度が、0.01MPa/hr以上0.2MPa/hr以下となるよう前記耐圧容器内に前記物理発泡剤を圧入して、前記吸湿状態のポリアミド系樹脂発泡粒子に物理発泡剤を含浸させる上記(1)から(10)のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。

(1) The method comprises an internal pressure applying step of placing expanded polyamide-based resin particles in a pressure-resistant container, impregnating the expanded polyamide-based resin particles with a physical foaming agent in the pressure-resistant container, and applying an internal pressure exceeding atmospheric pressure to the expanded polyamide-based resin particles; and a heating and foaming step of heating and foaming the expanded polyamide-based resin particles to which the internal pressure obtained in the internal pressure applying step has been applied, thereby obtaining multi-stage expanded polyamide-based resin particles having an apparent density smaller than that of the expanded polyamide-based resin particles used in the internal pressure applying step.
A method for producing multi-stage polyamide-based resin expanded beads, characterized in that in the internal pressure application step, polyamide-based resin expanded beads in a hygroscopic state having a moisture content of 1% or more are impregnated with the physical foaming agent at a temperature higher than a change point temperature of the storage modulus of the polyamide-based resin expanded beads in the hygroscopic state.
(2) In the internal pressure applying step,
The polyamide resin foam particles in the hygroscopic state are
The method for producing multi-stage expanded polyamide resin beads described in (1) above, in which the physical foaming agent is impregnated at a temperature that is 30° C. or more higher than the change point temperature of the storage modulus of the expanded polyamide resin beads in a hygroscopic state at the start of the internal pressure application step.
(3) In the internal pressure applying step,
The polyamide resin foam particles in the hygroscopic state are
The method for producing multi-stage expanded polyamide resin particles according to the above (1) or (2), in which the physical foaming agent is impregnated at a temperature of 120° C. or less.
(4) The method for producing multi-stage expanded polyamide resin beads according to any one of (1) to (3) above, wherein the moisture content of the expanded polyamide resin beads in a hygroscopic state is 3.0% or more.
(5) The method for producing multi-stage expanded polyamide resin beads according to any one of (1) to (4) above, wherein the moisture content of the expanded polyamide resin beads in a hygroscopic state is 4.5% or more.
(6) In the internal pressure applying step,
The method for producing multi-stage expanded polyamide resin beads according to any one of (1) to (5), further comprising impregnating the polyamide resin beads with the physical foaming agent so that the rate of increase in internal pressure of the expanded polyamide resin beads in a moisture-absorbed state is 0.003 MPa/hr or more and 0.05 MPa/hr or less.
(7) The method for producing multi-stage expanded polyamide resin beads according to any one of (1) to (6) above, wherein the apparent density of the multi-stage expanded polyamide resin beads is 100 kg/m3 or less .
(8) The method for producing multi-stage expanded polyamide resin beads according to any one of (1) to (7) above, wherein the ratio of the apparent density of the multi-stage expanded polyamide resin beads to the apparent density of the expanded polyamide resin beads used in the internal pressure application step is 0.70 or less.
(9) In the heat foaming step,
The polyamide resin foamed particles to which the internal pressure has been applied are
The method for producing multi-stage expanded polyamide-based resin beads according to any one of (1) to (8), further comprising heating and expanding the beads by using a heating medium having a temperature higher than the inflection point temperature of the storage modulus of the expanded polyamide-based resin beads to which the internal pressure has been applied and lower than the melting point of the polyamide-based resin constituting the expanded polyamide-based resin beads to which the internal pressure has been applied.
(10) In the heat foaming step,
The method for producing multi-stage expanded polyamide resin beads according to any one of (1) to (9) above, further comprising heating the expanded polyamide resin beads to which the internal pressure has been applied with water vapor to expand the beads.
(11) In the internal pressure applying step,
The polyamide resin foam particles are placed in a pressure-resistant container,
The method for producing multi-stage expanded polyamide resin particles according to any one of (1) to (10) above, further comprising: injecting the physical foaming agent into the pressure-resistant vessel so that a pressure rise rate in the pressure-resistant vessel is from 0.01 MPa/hr to 0.2 MPa/hr, thereby impregnating the polyamide resin expanded particles in a moisture-absorbing state with the physical foaming agent.

Claims (11)

ポリアミド系樹脂発泡粒子を耐圧容器に入れ、前記耐圧容器内で、ポリアミド系樹脂発泡粒子に物理発泡剤を含浸させて大気圧超の内圧を付与する内圧付与工程、および
前記内圧付与工程において得られた内圧が付与されたポリアミド系樹脂発泡粒子を加熱して発泡させ、前記内圧付与工程に用いられたポリアミド系樹脂発泡粒子よりも見掛け密度の小さいポリアミド系樹脂多段発泡粒子を得る加熱発泡工程、を備え、
前記内圧付与工程において、含水率1%以上の吸湿状態のポリアミド系樹脂発泡粒子に、前記吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも高い温度下で前記物理発泡剤を含浸させることを特徴とするポリアミド系樹脂多段発泡粒子の製造方法。
the step of placing expanded polyamide-based resin particles in a pressure-resistant container and impregnating the expanded polyamide-based resin particles with a physical foaming agent in the pressure-resistant container to apply an internal pressure exceeding atmospheric pressure; and the step of heating and expanding the expanded polyamide-based resin particles to which the internal pressure obtained in the step of applying the internal pressure has been applied, thereby obtaining multi-stage expanded polyamide-based resin particles having an apparent density smaller than that of the expanded polyamide-based resin particles used in the step of applying the internal pressure.
A method for producing multi-stage polyamide-based resin expanded beads, characterized in that in the internal pressure application step, polyamide-based resin expanded beads in a hygroscopic state having a moisture content of 1% or more are impregnated with the physical foaming agent at a temperature higher than a change point temperature of the storage modulus of the polyamide-based resin expanded beads in the hygroscopic state.
前記内圧付与工程において、
前記吸湿状態のポリアミド系樹脂発泡粒子に、
当該内圧付与工程の開始時における前記吸湿状態のポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも30℃以上高い温度下で前記物理発泡剤を含浸させる請求項1に記載のポリアミド系樹脂多段発泡粒子の製造方法。
In the internal pressure applying step,
The polyamide resin foam particles in the hygroscopic state are
2. The method for producing multi-stage polyamide resin expanded beads according to claim 1, wherein the physical foaming agent is impregnated at a temperature that is 30° C. or more higher than the change point temperature of the storage modulus of the hygroscopic polyamide resin expanded beads at the start of the internal pressure application step.
前記内圧付与工程において、
前記吸湿状態のポリアミド系樹脂発泡粒子に、
120℃以下の温度下で前記物理発泡剤を含浸させる請求項1又は2に記載のポリアミド系樹脂多段発泡粒子の製造方法。
In the internal pressure applying step,
The polyamide resin foam particles in the hygroscopic state are
3. The method for producing multi-stage expanded polyamide resin beads according to claim 1, wherein the physical foaming agent is impregnated at a temperature of 120° C. or less.
前記吸湿状態のポリアミド系樹脂発泡粒子の含水率が、3.0%以上である請求項1から3のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。 The method for producing multi-stage polyamide resin expanded particles according to any one of claims 1 to 3, wherein the moisture content of the polyamide resin expanded particles in a hygroscopic state is 3.0% or more. 前記吸湿状態のポリアミド系樹脂発泡粒子の含水率が、4.5%以上である請求項1から4のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。 The method for producing multi-stage polyamide resin expanded beads according to any one of claims 1 to 4, wherein the moisture content of the polyamide resin expanded beads in a hygroscopic state is 4.5% or more. 前記内圧付与工程において、
前記吸湿状態のポリアミド系樹脂発泡粒子の内圧上昇速度が0.003MPa/hr以上0.05MPa/hr以下となるよう前記物理発泡剤を含浸させる請求項1から5のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。
In the internal pressure applying step,
6. The method for producing multi-stage expanded polyamide resin beads according to claim 1, wherein the physical foaming agent is impregnated into the expanded polyamide resin beads in a moisture-absorbed state so that the rate of increase in internal pressure of the expanded polyamide resin beads is 0.003 MPa/hr or more and 0.05 MPa/hr or less.
前記ポリアミド系樹脂多段発泡粒子の見掛け密度が、100kg/m以下である請求項1から6のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。 The method for producing multi-stage expanded polyamide resin beads according to any one of claims 1 to 6, wherein the multi-stage expanded polyamide resin beads have an apparent density of 100 kg/ m3 or less. 前記内圧付与工程に用いられたポリアミド系樹脂発泡粒子の見掛け密度に対する、前記ポリアミド系樹脂多段発泡粒子の見掛け密度の比が、0.70以下である請求項1から7のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。 The method for producing multi-stage polyamide resin expanded beads according to any one of claims 1 to 7, wherein the ratio of the apparent density of the multi-stage polyamide resin expanded beads to the apparent density of the polyamide resin expanded beads used in the internal pressure application step is 0.70 or less. 前記加熱発泡工程において、
前記内圧が付与されたポリアミド系樹脂発泡粒子を、
当該内圧が付与されたポリアミド系樹脂発泡粒子の貯蔵弾性率の変化点温度よりも高く、かつ当該内圧が付与されたポリアミド系樹脂発泡粒子を構成するポリアミド系樹脂の融点よりも低い温度の加熱媒体により加熱し、発泡させる請求項1から8のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。
In the heat foaming step,
The polyamide resin foamed particles to which the internal pressure has been applied are
9. The method for producing multi-stage polyamide-based resin expanded beads according to claim 1, wherein the polyamide-based resin expanded beads are heated and expanded by a heating medium having a temperature higher than a temperature at which the storage modulus of the polyamide-based resin expanded beads to which the internal pressure has been applied changes and lower than a melting point of the polyamide-based resin constituting the polyamide-based resin expanded beads to which the internal pressure has been applied.
前記加熱発泡工程において、
前記内圧が付与されたポリアミド系樹脂発泡粒子を、水蒸気で加熱し、発泡させる請求項1から9のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。
In the heat foaming step,
The method for producing multi-stage expanded polyamide resin beads according to any one of claims 1 to 9, wherein the expanded polyamide resin beads to which the internal pressure has been applied are heated with water vapor to be expanded.
前記内圧付与工程において、
前記ポリアミド系樹脂発泡粒子を耐圧容器に入れ、
前記耐圧容器内の昇圧速度が、0.01MPa/hr以上0.2MPa/hr以下となるよう前記耐圧容器内に前記物理発泡剤を圧入して、前記吸湿状態のポリアミド系樹脂発泡粒子に物理発泡剤を含浸させる請求項1から10のいずれか一項に記載のポリアミド系樹脂多段発泡粒子の製造方法。
In the internal pressure applying step,
The polyamide resin foam particles are placed in a pressure-resistant container,
11. The method for producing multi-stage expanded polyamide resin beads according to claim 1, wherein the physical foaming agent is pressurized into the pressure-resistant vessel so that a pressure rise rate in the pressure-resistant vessel is from 0.01 MPa/hr to 0.2 MPa/hr, thereby impregnating the polyamide resin expanded beads in a moisture-absorbed state with the physical foaming agent.
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JP2018131620A (en) 2017-02-13 2018-08-23 旭化成株式会社 Resin foamed particle and resin foam molded body
WO2020031803A1 (en) 2018-08-08 2020-02-13 旭化成株式会社 Pre-expanded polyamide beads, molded polyamide foam, and production method therefor
WO2020050301A1 (en) 2018-09-04 2020-03-12 株式会社ジェイエスピー Polyamide resin foamed particles and method for producing same
WO2020196893A1 (en) 2019-03-28 2020-10-01 旭化成株式会社 Polyamide resin prefoamed particle, polyamide resin foamed molded article, and method for manufacturing polyamide resin foamed molded article

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Publication number Priority date Publication date Assignee Title
JP2018131620A (en) 2017-02-13 2018-08-23 旭化成株式会社 Resin foamed particle and resin foam molded body
WO2020031803A1 (en) 2018-08-08 2020-02-13 旭化成株式会社 Pre-expanded polyamide beads, molded polyamide foam, and production method therefor
WO2020050301A1 (en) 2018-09-04 2020-03-12 株式会社ジェイエスピー Polyamide resin foamed particles and method for producing same
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