JP7630770B2 - Vehicle lighting device and vehicle lamp - Google Patents

Description

Embodiments of the present invention relate to a vehicle lighting device and a vehicle lamp.

2. Description of the Related Art From the standpoint of energy saving and life extension, vehicle lighting devices equipped with light emitting diodes have become increasingly popular instead of vehicle lighting devices equipped with filaments.
In recent years, there has been a demand for reducing the weight and therefore the size of vehicle lighting devices from the standpoint of improving the driving distance (fuel efficiency) per unit volume of fuel such as gasoline or diesel, or extending the driving range of electric vehicles.

When a vehicle lighting device equipped with a light-emitting element is turned on, light is emitted from the light-emitting element, and heat is generated in the light-emitting element and in resistors electrically connected to the light-emitting element. In addition, in the case of a vehicle lighting device, the vehicle lighting device may be placed in a high-temperature environment of about 85°C.

When the temperature of the light-emitting element exceeds the maximum junction temperature due to heat generated in the light-emitting element or resistor, the environmental temperature, etc., the light-emitting element may break down or its lifespan may be shortened. In this case, if the vehicle lighting device is made smaller, the cross-sectional area of the part through which the heat of the vehicle lighting device is transmitted becomes smaller, making it difficult to dissipate the heat generated in the light-emitting element, etc.
Furthermore, in recent years, there has been a demand for vehicle lighting devices with higher luminous flux, and this has led to an increase in the current flowing through the light-emitting elements, etc. When the current flowing through the light-emitting elements, etc. is increased, the heat generated in the light-emitting elements, etc. increases, and the temperature of the light-emitting elements that are turned on tends to become even higher.

Therefore, there was a need to develop technology that could reduce the size of vehicle lighting devices and improve their heat dissipation.

JP 2013-25935 A

The problem that the present invention aims to solve is to provide a vehicle lighting device and a vehicle lamp that can reduce the size of the vehicle lighting device and improve heat dissipation.

The vehicle lighting device according to the embodiment includes a conductive socket; a substrate having a base including a metal provided at one end of the socket, an insulating layer provided on a surface of the base opposite to the socket side, and a wiring pattern provided on a surface of the insulating layer opposite to the base side; a light-emitting element electrically connected to the wiring pattern; a holding portion provided inside a hole provided in the socket, having insulating properties, and an end on the substrate side provided at a position farther from the substrate than the opening of the hole on the substrate side; a plurality of power supply terminals provided inside the holding portion , one end of which protrudes from the end of the holding portion on the substrate side and is electrically connected to the wiring pattern; and a cylindrical portion provided on each of the plurality of power supply terminals, having insulating properties, and extending between the end of the holding portion on the substrate side and the substrate . The power supply terminal extends inside the cylindrical portion and protrudes from one end of the cylindrical portion. In the thickness direction of the base, the vicinity of one end of the cylindrical portion is located inside the base , and the other end of the cylindrical portion is provided at the end of the holding portion on the substrate side.

According to an embodiment of the present invention, it is possible to provide a vehicle lighting device and a vehicle lamp that can reduce the size of the vehicle lighting device and improve heat dissipation.

1 is a schematic perspective view illustrating a vehicle lighting device according to an embodiment of the present invention; 2 is a cross-sectional view of the vehicle lighting device shown in FIG. 1 taken along line AA. 4 is a schematic cross-sectional view illustrating a cylindrical portion. FIG. 1 is a schematic partial cross-sectional view illustrating a vehicle lamp.

Below, an embodiment will be illustrated with reference to the drawings. Note that in each drawing, similar components are given the same reference numerals and detailed explanations are omitted as appropriate.

(Vehicle lighting device)
The vehicle lighting device 1 according to the present embodiment can be installed in, for example, an automobile or a railroad car. Examples of the vehicle lighting device 1 installed in an automobile include a front combination light (for example, a combination of a daytime running lamp (DRL), a position lamp, a turn signal lamp, etc.) and a rear combination light (for example, a combination of a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, etc.). However, the uses of the vehicle lighting device 1 are not limited to these.

FIG. 1 is a schematic perspective view illustrating a vehicle lighting device 1 according to the present embodiment.
FIG. 2 is a cross-sectional view of the vehicle lighting device 1 taken along line AA in FIG.
As shown in FIGS. 1 and 2 , a vehicle lighting device 1 includes, for example, a socket 10, a light-emitting module 20, a power supply unit 30, and a heat transfer unit 40.

The socket 10 has, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15.
The mounting portion 11 is provided, for example, on a surface of the flange 13 opposite to the side on which the heat dissipation fins 14 are provided. The outer shape of the mounting portion 11 can be columnar. The outer shape of the mounting portion 11 is, for example, cylindrical. The mounting portion 11 has, for example, a recess 11a that opens at the end opposite to the flange 13 side.

The bayonet 12 is provided, for example, on the side of the mounting portion 11. The bayonet 12 protrudes, for example, toward the outside of the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 may be provided. The bayonet 12 is used when mounting the vehicle lighting device 1, for example, to the housing 101 of the vehicle lamp 100 described below. The bayonet 12 may be used for a twist lock.

The flange 13 is, for example, plate-shaped. The flange 13 is, for example, approximately disk-shaped. The side of the flange 13 is located outward of the vehicle lighting device 1 from the side of the bayonet 12.

The heat dissipation fin 14 is provided, for example, on the side of the flange 13 opposite the mounting portion 11. At least one heat dissipation fin 14 can be provided. For example, the socket 10 illustrated in FIG. 1 is provided with multiple heat dissipation fins 14. The multiple heat dissipation fins 14 can be arranged in a predetermined direction. The heat dissipation fin 14 is, for example, plate-shaped or cylindrical.

The connector holder 15 is provided, for example, on the side of the flange 13 opposite the mounting portion 11. The connector holder 15 can be provided alongside the heat dissipation fins 14. The connector holder 15 is cylindrical, and a connector 105 having a seal member 105a therein is inserted into it.

The socket 10 has the function of holding the light-emitting module 20 and the power supply unit 30, and the function of transferring heat generated in the light-emitting module 20 to the outside. Therefore, it is preferable that the socket 10 is formed from a material with high thermal conductivity. For example, the socket 10 can be formed from a metal such as an aluminum alloy.

In recent years, it is also desirable for the socket 10 to be lightweight and capable of efficiently dissipating heat generated in the light-emitting module 20. For this reason, it is more preferable for the socket 10 to be formed from, for example, a highly thermally conductive resin. The highly thermally conductive resin includes, for example, a resin and a filler using an inorganic material. The highly thermally conductive resin is, for example, a resin such as PET (Polyethylene terephthalate) or nylon mixed with a filler using carbon, aluminum oxide, or the like.

If the socket 10 contains a highly thermally conductive resin and has the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 molded as a single unit, the heat generated in the light-emitting module 20 can be efficiently dissipated. The weight of the socket 10 can also be reduced. In this case, the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 can be molded as a single unit using a method such as injection molding. The socket 10 and the power supply portion 30 can also be molded as a single unit using a method such as insert molding.

The light emitting module 20 includes, for example, a substrate 21 , a light emitting element 22 , a frame portion 23 , a sealing portion 24 , and an element 25 .
The substrate 21 has a plate shape. The planar shape of the substrate 21 is, for example, a rectangle. The substrate 21 is provided on one end side of the socket 10. The substrate 21 is, for example, bonded to the upper surface of the heat transfer section 40. When the heat transfer section 40 is not provided, the substrate 21 is, for example, bonded to the bottom surface 11a1 of the recess 11a. In this case, it is preferable that the adhesive be an adhesive with high thermal conductivity. For example, the adhesive can be an adhesive mixed with a filler using an inorganic material. The thermal conductivity of the adhesive is, for example, 0.5 W/(m·K) or more and 10 W/(m·K) or less.

When the vehicle lighting device 1 equipped with the light-emitting element 22 is turned on, light is emitted from the light-emitting element 22 and heat is generated in the light-emitting element 22 and the element 25 electrically connected to the light-emitting element 22. The generated heat is transmitted to the socket 10 via the substrate 21 and is released from the socket 10 to the outside. Therefore, from the viewpoint of heat dissipation, it is preferable to form the substrate 21 using a material with high thermal conductivity. For example, the substrate 21 can be formed from ceramics such as aluminum oxide or aluminum nitride, highly thermally conductive resin, etc.

The substrate 21 can also be a metal core substrate. The substrate 21 illustrated in FIG. 2 is a metal core substrate. If the substrate 21 is a metal core substrate, the heat generated in the light emitting element 22 and the element 25 can be efficiently transferred to the socket 10.

As shown in FIG. 2, a substrate 21, which is a metal core substrate, has a base 21a and an insulating layer 21b.
The base 21a is plate-shaped and contains a metal, such as aluminum, an aluminum alloy, copper, or a copper alloy, that has high thermal conductivity.
The insulating layer 21b can be provided on the surface of the base 21a opposite to the socket 10 side. The insulating layer 21b can also be provided on the surface of the base 21a on the socket 10 side. The insulating layer 21b can be made of an insulating material. The insulating layer 21b can be made of an organic material such as a resin, or an inorganic material such as a ceramic.

A wiring pattern 21c is provided on the surface of the insulating layer 21b opposite the base 21a. The wiring pattern 21c is formed, for example, from a material whose main component is silver or a material whose main component is copper. The surface of the wiring pattern 21c may also be plated with gold or nickel-palladium-gold.

The substrate 21 may also be provided with a covering portion 21e that covers the wiring pattern 21c and a film resistor, which will be described later. For example, the covering portion 21e may be provided so as to cover the area of the substrate 21 outside the area in which the frame portion 23 is provided. In this case, the portion of the wiring pattern 21c where the element 25 is mounted and the portion of the wiring pattern 21c where the multiple power supply terminals 31, which will be described later, are soldered may be exposed from the covering portion 21e.

The covering portion 21e may include, for example, white resist or glass. If the covering portion 21e is formed from a highly reflective material such as white resist, the light emitted from the light-emitting element 22 and incident on the covering portion 21e can be reflected toward the front side of the vehicle lighting device 1. This can improve the efficiency of use of the light emitted from the light-emitting element 22.

The light-emitting element 22 is provided on the substrate 21. The light-emitting element 22 is electrically connected to the wiring pattern 21c. At least one light-emitting element 22 can be provided. When multiple light-emitting elements 22 are provided, the multiple light-emitting elements 22 can be connected in series.

The light emitting element 22 may be, for example, a light emitting diode, an organic light emitting diode, a laser diode, or the like.
The light-emitting element 22 may be a chip-shaped light-emitting element, a surface-mount type light-emitting element such as a PLCC (Plastic Leaded Chip Carrier) type, or a light-emitting element having a lead wire such as a bullet type. The light-emitting element 22 illustrated in Figs. 1 and 2 is a chip-shaped light-emitting element. In this case, in consideration of the miniaturization of the light-emitting module 20 and thus the miniaturization of the vehicle lighting device 1, it is preferable to use a chip-shaped light-emitting element. In the following, as an example, a case where the light-emitting element 22 is a chip-shaped light-emitting element will be described.

The chip-shaped light-emitting element 22 can be mounted on the wiring pattern 21c by COB (Chip On Board). The chip-shaped light-emitting element 22 can be, for example, an upper electrode type light-emitting element, an upper and lower electrode type light-emitting element, a flip-chip type light-emitting element, etc. The chip-shaped light-emitting element 22 illustrated in Figures 1 and 2 is an upper and lower electrode type light-emitting element. The electrode of the upper electrode type light-emitting element or the upper electrode of the upper and lower electrode type light-emitting element can be electrically connected to the wiring pattern 21c by the wiring 21d. In this case, the wiring 21b can be connected by, for example, a wire bonding method. The flip-chip type light-emitting element 22 can be directly mounted on the wiring pattern 21c.

The number, size, arrangement, etc. of the light-emitting elements 22 are not limited to those shown in the example, and can be changed as appropriate depending on the size and use of the vehicle lighting device 1.

The frame portion 23 is provided on the substrate 21. The frame portion 23 has a frame shape and is adhered to the substrate 21. The light-emitting element 22 is disposed in the area surrounded by the frame portion 23. The frame portion 23 is formed from, for example, a resin. The resin can be, for example, a thermoplastic resin such as PBT (polybutylene terephthalate), PC (polycarbonate), PET, nylon, PP (polypropylene), PE (polyethylene), or PS (polystyrene).

The frame 23 can have the function of defining the formation range of the sealing portion 24 and the function of a reflector. Therefore, the frame 23 can contain titanium oxide particles or white resin to improve the reflectance.

The frame portion 23 can also be omitted. However, if the frame portion 23 is provided, the efficiency of using the light emitted from the light-emitting element 22 can be improved. In addition, the area in which the sealing portion 24 is formed can be reduced, which allows the light-emitting module 20 to be made smaller, and therefore the vehicle lighting device 1 to be made smaller.

The sealing portion 24 is provided inside the frame portion 23. The sealing portion 24 is provided so as to cover the area surrounded by the frame portion 23. The sealing portion 24 is provided so as to cover the light-emitting element 22. The sealing portion 24 contains a resin having light-transmitting properties. The sealing portion 24 is formed, for example, by filling the inside of the frame portion 23 with resin. The filling of the resin is performed, for example, using a dispenser or the like. The resin to be filled is, for example, a silicone resin or the like.
When the frame portion 23 is omitted, for example, a dome-shaped sealing portion 24 is provided on the substrate 21 .

The sealing portion 24 may also contain a phosphor. The phosphor may be, for example, a YAG phosphor (yttrium aluminum garnet phosphor). However, the type of phosphor may be changed as appropriate to obtain a desired emission color depending on the application of the vehicle lighting device 1.

The element 25 can be a passive element or an active element used to configure a light-emitting circuit having the light-emitting element 22. The element 25 is provided on the substrate 21. For example, the element 25 can be provided on the periphery of the frame portion 23. The element 25 is electrically connected to the wiring pattern 21c. At least one element 25 can be provided.

The element 25 may be, for example, a resistor 25a and a control element 25b.
However, the type of element 25 is not limited to the exemplified ones, and can be changed as appropriate depending on the configuration of the light-emitting circuit having the light-emitting element 22. For example, the element 25 may be a capacitor, a positive characteristic thermistor, a negative characteristic thermistor, an inductor, a surge absorber, a varistor, a transistor such as a FET or a bipolar transistor, an integrated circuit, a computing element, etc., in addition to those mentioned above.

The resistor 25a is provided on the substrate 21. The resistor 25a is electrically connected to the wiring pattern 21c. The resistor 25a is connected in series to the light-emitting element 22 via the wiring pattern 21c. The resistor 25a can be, for example, a surface-mount resistor, a resistor with leads (metal oxide film resistor), or a film resistor formed using a screen printing method or the like. The resistor 25a illustrated in FIG. 1 is a film resistor.

The material of the film resistor is, for example, ruthenium oxide (RuO ₂ ). The film resistor is formed, for example, by using a screen printing method and a baking method. If the resistor 25a is a film resistor, the contact area between the resistor 25a and the substrate 21 can be increased, so that heat dissipation can be improved. In addition, a plurality of resistors 25a can be formed at once. Therefore, productivity can be improved. In addition, the variation in resistance value among the plurality of resistors 25a can be suppressed.

Here, since there is variation in the forward voltage characteristics of the light-emitting element 22, if the applied voltage between the anode terminal and the ground terminal is constant, variation occurs in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light irradiated from the light-emitting element 22. Therefore, in order to keep the brightness of the light irradiated from the light-emitting element 22 within a predetermined range, the value of the current flowing through the light-emitting element 22 is set within a predetermined range by the resistor 25a connected in series to the light-emitting element 22. In this case, the resistance value of the resistor 25a is changed to keep the value of the current flowing through the light-emitting element 22 within the predetermined range.

If the resistor 25a is a surface mount resistor or a resistor with leads, a resistor 25a having an appropriate resistance value is selected according to the forward voltage characteristics of the light emitting element 22. If the resistor 25a is a film resistor, the resistance value can be increased by removing a portion of the resistor 25a. For example, by irradiating a film resistor with laser light, a portion of the film resistor can be easily removed. Note that the number and size of the resistors 25a are not limited to those exemplified, and can be changed as appropriate according to the number and specifications of the light emitting elements 22.

The control element 25b is provided on the substrate 21. The control element 25b is electrically connected to the wiring pattern 21c. The control element 25b is provided, for example, to prevent a reverse voltage from being applied to the light-emitting element 22 and to prevent pulse noise from the reverse direction from being applied to the light-emitting element 22. The control element 25b is, for example, a surface-mounted diode or a diode with leads. The control element 25b illustrated in FIG. 1 is a surface-mounted diode.

Other optical elements can be provided as necessary. The optical elements can be provided, for example, on the sealing portion 24. The optical elements can be, for example, a convex lens, a concave lens, a light guide, etc.

The heat transfer section 40 is provided, for example, between the substrate 21 and the bottom surface 11a1 of the recess 11a. The heat transfer section 40 can be adhered, for example, to the bottom surface 11a1 of the recess 11a. The adhesive that adheres the heat transfer section 40 to the bottom surface 11a1 of the recess 11a is preferably an adhesive with high thermal conductivity. The adhesive can be, for example, the same as the adhesive that adheres the substrate 21 to the heat transfer section 40.

The heat transfer section 40 can also be embedded in the bottom surface 11a1 of the recess 11a by insert molding. The heat transfer section 40 can also be attached to the bottom surface 11a1 of the recess 11a via a layer of thermally conductive grease (heat dissipating grease). There are no particular limitations on the type of thermally conductive grease, but it can be, for example, modified silicone mixed with a filler using a material with high thermal conductivity (for example, ceramics such as aluminum oxide or aluminum nitride). The thermal conductivity of the thermally conductive grease can be, for example, 1 W/(m·K) or more and 5 W/(m·K) or less.

The heat transfer section 40 is provided to facilitate the transfer of heat generated in the light-emitting module 20 to the socket 10. For this reason, the heat transfer section 40 is preferably formed from a material with high thermal conductivity. The heat transfer section 40 has a plate shape, and can be formed from a metal such as aluminum, an aluminum alloy, copper, or a copper alloy.
In addition, when the amount of heat generated in the light-emitting module 20 is small, the heat transfer section 40 can be omitted.

The power supply unit 30 has, for example, a plurality of power supply terminals 31, a holding portion 32, and a tube portion 33. The plurality of power supply terminals 31 can be rod-shaped. One end of each of the plurality of power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. The plurality of power supply terminals 31 are arranged, for example, in a predetermined direction. One end of each of the plurality of power supply terminals 31 is soldered to the wiring pattern 21c provided on the substrate 21. That is, the plurality of power supply terminals 31 are provided inside the socket 10, and one end is electrically connected to the wiring pattern 21c. The other end of each of the plurality of power supply terminals 31 is exposed inside the hole of the connector holder 15. The connector 105 is fitted to the plurality of power supply terminals 31 exposed inside the hole of the connector holder 15. The plurality of power supply terminals 31 are formed, for example, from a metal such as a copper alloy. The shape, arrangement, material, etc. of the multiple power supply terminals 31 are not limited to those shown in the example, and can be changed as appropriate.

As described above, it is preferable that the socket 10 is made of a material with high thermal conductivity. However, materials with high thermal conductivity may have electrical conductivity. For example, metals such as aluminum alloys and highly thermally conductive resins containing carbon-based fillers have electrical conductivity. Therefore, the holding portion 32 is provided to insulate the multiple power supply terminals 31 from the conductive socket 10. The holding portion 32 also has the function of holding the multiple power supply terminals 31. If the socket 10 is made of a highly thermally conductive resin with insulating properties (for example, a highly thermally conductive resin containing a filler using aluminum oxide), the holding portion 32 can be omitted. In this case, the socket 10 holds the multiple power supply terminals 31. The holding portion 32 is made of, for example, a resin with insulating properties. The holding portion 32 can be pressed into a hole 10a provided in the socket 10 or adhered to the inner wall of the hole 10a.

When the light-emitting element 22 is turned on, heat is generated in the light-emitting element 22 and the element 25 electrically connected to the light-emitting element 22. In the case of the vehicle lighting device 1, the vehicle lighting device 1 may be placed in a high-temperature environment of about 85°C. If the temperature of the turned-on light-emitting element 22 exceeds the maximum junction temperature due to the heat generated in the light-emitting element 22 or the environmental temperature, the light-emitting element 22 may break down or have a shortened lifespan.

In recent years, there has been a demand for a vehicle lighting device 1 with a higher luminous flux, and the current flowing through the light-emitting element 22 may be increased. If the current flowing through the light-emitting element 22 is increased, the heat generated in the light-emitting element 22 and element 25 increases.

Furthermore, from the viewpoint of improving fuel efficiency or extending the driving range of electric vehicles, there is a demand for reducing the weight of the vehicle lighting device 1 and therefore the size of the vehicle lighting device 1. In this case, if the socket 10 is made smaller, the cross-sectional area of the mounting portion 11 in a direction perpendicular to the central axis of the socket 10 will be reduced. If the cross-sectional area of the mounting portion 11 is reduced, the cross-sectional area of the portion through which heat is transmitted between the light-emitting module 20 and the heat dissipation fins 14 will be reduced, making it difficult for heat generated in the light-emitting element 22 and the like to be transmitted to the heat dissipation fins 14. Therefore, if the socket 10 and therefore the vehicle lighting device 1 are made smaller, there is a risk that the heat dissipation performance will be reduced.

In this case, if the substrate 21 is a metal core substrate, the heat generated in the light-emitting element 22 and the element 25 can be efficiently conducted to the socket 10 even if the vehicle lighting device 1 is made compact.
Therefore, if the substrate 21 is a metal core substrate, the vehicle lighting device 1 can be made smaller and its heat dissipation properties can be improved.

However, as shown in FIG. 1, the power supply terminal 31 is soldered to the wiring pattern 21c. The wiring pattern 21c is provided on the surface of the insulating layer 21b opposite the base 21a. Therefore, the power supply terminal 31 extends inside the board 21 in the thickness direction of the board 21. As mentioned above, the base 21a of the board 21 contains metal, so if the power supply terminal 31 and the base 21a come into contact with each other, a short circuit will occur.

Therefore, the power supply unit 30 is provided with a cylindrical portion 33 .
FIG. 3 is a schematic cross-sectional view illustrating the cylindrical portion 33. As shown in FIG.
FIG. 3 is a cross-sectional view of the vehicle lighting device 1 taken along line BB in FIG.

2 and 3, the tube portion 33 has a tubular shape and is provided on each of the multiple power supply terminals 31. The tube portion 33 has, for example, a cylindrical shape or a square tube shape. The power supply terminal 31 extends inside the tube portion 33 and protrudes from one end of the tube portion 33. In the thickness direction of the base 21a, the vicinity of one end of the tube portion 33 is located inside the base 21a. For example, the base 21a has a hole penetrating in the thickness direction, and the vicinity of one end of the tube portion 33 can be provided inside the hole. The vicinity of one end of the tube portion 33 may be pressed into the hole, may be provided inside the hole through a gap, or may be bonded to the hole. The other end of the tube portion 33 can be provided, for example, at the end of the holding portion 32.

The cylindrical portion 33 has insulating properties. The cylindrical portion 33 can be formed, for example, from an inorganic material such as ceramics, or an organic material such as resin. If the cylindrical portion 33 has insulating properties, it is possible to prevent a short circuit between the power supply terminal 31 and the base 21a of the substrate 21.

When the vehicle lighting device 1 is made smaller, the planar dimensions of the substrate 21 may become smaller. Also, as shown in FIG. 1, multiple power supply terminals 31 may be arranged side by side along the sides of the substrate 21. In such cases, the distance between the power supply terminals 31 may be shortened depending on the planar dimensions of the substrate 21. If the tube portion 33 is provided, it is possible to prevent the power supply terminals 31 from shorting out with adjacent power supply terminals 31 even if the distance between the power supply terminals 31 is shortened.

In the thickness direction of base 21a, one end of tubular portion 33 may be positioned flush with the surface of insulating layer 21b opposite to base 21a, or between the surface of insulating layer 21b opposite to base 21a and the surface of insulating layer 21b on the base 21a side.
3, it is preferable that one end of the tube portion 33 protrudes from the surface of the insulating layer 21b opposite to the base 21a in the thickness direction of the base 21a, so that when the power supply terminal 31 is soldered to the wiring pattern 21c, the solder can be prevented from reaching the base 21a.

As described above, the heat transfer section 40 may be provided between the board 21 and the socket 10. When the heat transfer section 40 is provided, a hole or a notch for inserting the tubular section 33 may be provided in the heat transfer section 40. If the tubular section 33 having insulating properties is provided, it is possible to prevent a short circuit between the power supply terminal 31 and the heat transfer section 40 containing metal.

As explained above, if the substrate 21 is a metal core substrate and the tube portion 33 is provided, the vehicle lighting device 1 can be further miniaturized and its heat dissipation properties can be improved.

(Vehicle lighting fixtures)
Next, the vehicle lamp 100 will be illustrated.
In the following, as an example, a case where the vehicular lamp 100 is a front combination light provided on an automobile will be described. However, the vehicular lamp 100 is not limited to a front combination light provided on an automobile. The vehicular lamp 100 may be any vehicular lamp provided on an automobile, a railroad car, or the like.

FIG. 4 is a schematic partial cross-sectional view illustrating the vehicle lamp 100. As shown in FIG.
As shown in FIG. 4 , the vehicle lamp 100 includes, for example, the vehicle lighting device 1, a housing 101, a cover 102, an optical element 103, a seal member 104, and a connector 105.

The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 is box-shaped with one end open. The housing 101 is formed, for example, from a light-opaque resin. The bottom surface of the housing 101 is provided with a mounting hole 101a into which the portion of the mounting portion 11 with the bayonet 12 is inserted. A recess is provided around the mounting hole 101a into which the bayonet 12 provided on the mounting portion 11 is inserted. Note that although the mounting hole 101a is directly provided in the housing 101 in the above example, a mounting member having the mounting hole 101a may be provided on the housing 101.

When mounting the vehicle lighting device 1 to the vehicle lamp 100, the part of the mounting part 11 on which the bayonet 12 is provided is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. Then, for example, the bayonet 12 is held in place by a fitting provided on the periphery of the mounting hole 101a. This type of mounting method is called a twist lock.

The cover 102 is provided to cover the opening of the housing 101. The cover 102 is formed from a translucent resin or the like. The cover 102 can also have a function such as a lens.

Light emitted from the vehicle lighting device 1 is incident on the optical element 103. The optical element 103 reflects, diffuses, guides, and collects the light emitted from the vehicle lighting device 1, and forms a predetermined light distribution pattern. For example, the optical element 103 illustrated in FIG. 4 is a reflector. In this case, the optical element 103 reflects the light emitted from the vehicle lighting device 1 to form a predetermined light distribution pattern.

The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 is annular and made of an elastic material such as rubber or silicone resin.

When the vehicle lighting device 1 is attached to the vehicle lamp 100, the seal member 104 is sandwiched between the flange 13 and the housing 101. Therefore, the seal member 104 can seal the internal space of the housing 101. In addition, the elastic force of the seal member 104 presses the bayonet 12 against the housing 101. Therefore, it is possible to prevent the vehicle lighting device 1 from detaching from the housing 101.

The connector 105 is fitted to the ends of the multiple power supply terminals 31 exposed inside the connector holder 15. The connector 105 is electrically connected to a power source (not shown). Therefore, by fitting the connector 105 to the ends of the multiple power supply terminals 31, the light-emitting element 22 can be electrically connected to a power source (not shown).

The connector 105 is also provided with a seal member 105a. When the connector 105 having the seal member 105a is inserted into the connector holder 15, the inside of the connector holder 15 is sealed to be watertight.

Although several embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the gist of the invention. These embodiments and their variations are included within the scope and gist of the invention, as well as within the scope of the invention and its equivalents described in the claims. Furthermore, the above-mentioned embodiments can be implemented in combination with each other.

1 Vehicle lighting device, 10 Socket, 11 Mounting part, 20 Light emitting module, 21 Substrate, 21a Base, 21b Insulating layer, 21c Wiring pattern, 22 Light emitting element, 25 Element, 30 Power supply part, 31 Power supply terminal, 33 Cylinder part

Claims (5)

A conductive socket;
a substrate provided on one end side of the socket, the substrate including a base including a metal, an insulating layer provided on a surface of the base opposite to the socket side, and a wiring pattern provided on a surface of the insulating layer opposite to the base side;
a light-emitting element electrically connected to the wiring pattern;
a retaining portion that is provided inside a hole that is provided in the socket, has insulating properties, and has an end portion on the board side that is provided at a position farther away from the board than an opening of the hole on the board side;
a plurality of power supply terminals provided inside the holding portion , the power supply terminals having one end protruding from the end of the holding portion on the substrate side and electrically connected to the wiring pattern;
a cylindrical portion provided on each of the plurality of power supply terminals, the cylindrical portion having insulating properties and extending between the end of the holding portion on the substrate side and the substrate ;
Equipped with
the power supply terminal extends inside the cylindrical portion and protrudes from one end of the cylindrical portion,
A vehicle lighting device, wherein in the thickness direction of the base, the vicinity of one end of the tubular portion is located inside the base , and the other end of the tubular portion is provided at the end of the holding portion on the substrate side . The vehicle lighting device according to claim 1, wherein the base has a hole penetrating the thickness direction, and the vicinity of one end of the tube portion is provided inside the hole. The vehicle lighting device according to claim 1 or 2, wherein one end of the tubular portion protrudes from a surface of the insulating layer opposite the base side in the thickness direction of the base. The vehicle lighting device according to claim 1 or 2, wherein in the thickness direction of the base, one end of the tubular portion is flush with the surface of the insulating layer opposite the base side, or is located between the surface of the insulating layer opposite the base side and the surface of the insulating layer on the base side. A vehicle lighting device according to any one of claims 1 to 4;
A housing in which the vehicle lighting device is mounted;
A vehicle lamp equipped with:

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