JP7777285B2 - Vehicle lighting device and vehicle lamp - Google Patents

Description

Embodiments of the present invention relate to a vehicle lighting device and a vehicle lamp.

2. Description of the Related Art From the viewpoint of energy saving and long life, vehicle lighting devices equipped with light emitting elements such as light emitting diodes are becoming increasingly popular instead of vehicle lighting devices equipped with filaments.
In recent years, there has been a demand for miniaturization of vehicle lighting devices. To this end, a vehicle lighting device has been proposed that includes a substrate, a chip-shaped light-emitting element mounted on the substrate, a frame that surrounds the light-emitting element, and a sealing portion that is provided inside the frame and covers the light-emitting element.

By providing a frame surrounding the light-emitting element, light emitted from the light-emitting element and incident on the inner wall of the frame can be reflected toward the front of the vehicle lighting device, thereby improving the light extraction efficiency.

Here, light leaking from the side of the chip-shaped light-emitting element or light reflected at the interface between the sealing portion and the outside air may be incident on the surface of the substrate exposed inside the frame. Therefore, if the light incident on the surface of the substrate exposed inside the frame can be reflected toward the front side of the vehicle lighting device, the light extraction efficiency can be further improved.

For example, it is conceivable to apply a highly reflective resin to the surface of the substrate exposed inside the frame. However, because a chip-shaped light-emitting element is provided inside the frame, the resin applied to the surface of the substrate may adhere to the light-emitting surface (top surface) of the light-emitting element. If the resin adheres to the light-emitting surface of the light-emitting element, the amount of light emitted may be reduced.
Therefore, there has been a demand for the development of a technology that can improve the light extraction efficiency and prevent the resin from adhering to the light emitting surface of the light emitting element.

JP 2017-010948 A

The problem that this invention aims to solve is to provide a vehicle lighting device and vehicle lamp that can improve light extraction efficiency and prevent resin from adhering to the light-emitting surface of the light-emitting element.

A vehicle lighting device according to an embodiment includes a socket, a substrate provided on one end of the socket, at least one light-emitting element provided on the substrate, a frame portion provided on the side of the substrate where the light-emitting element is provided, the frame-shaped frame portion surrounding the light-emitting element, and a joint portion provided between the substrate and the frame portion and having a higher reflectivity for light emitted from the light-emitting element than the substrate. In a direction perpendicular to the central axis of the frame portion, the distance between an end of an inner wall of the frame portion facing the substrate and a side surface of the light-emitting element is L (mm), and the distance between an end of a portion of the joint portion provided inside the frame portion facing the light-emitting element and an end of the inner wall of the frame portion facing the substrate is L1 (mm) , and the thickness of the light-emitting element is 0.12 mm or less, and the distance L (mm) is 0.57 mm or less , the following formula is satisfied:
L/3 (mm)≦L1 (mm)<L/2 (mm)

Embodiments of the present invention provide a vehicle lighting device and vehicle lamp that can improve light extraction efficiency and prevent resin from adhering to the light-emitting surface of the light-emitting element.

1 is a schematic exploded view illustrating a vehicle lighting device according to an embodiment of the present invention; 2 is a cross-sectional view of the vehicle lighting device shown in FIG. 1 taken along line AA. FIG. 3 is a schematic enlarged view of part B in FIG. 2 . FIG. 2 is a schematic partial cross-sectional view illustrating a vehicle lamp.

Embodiments will be illustrated below with reference to the drawings. Note that in each drawing, similar components will be assigned the same reference numerals and detailed descriptions will be omitted where appropriate.

(Vehicle lighting device)
The vehicle lighting device 1 according to the present embodiment can be installed in, for example, an automobile, a railway vehicle, etc. Examples of the vehicle lighting device 1 installed in an automobile include those used as front combination lights (e.g., a combination of daytime running lamps (DRLs), position lamps, turn signal lamps, etc.) and rear combination lights (e.g., a combination of stop lamps, tail lamps, turn signal lamps, backup lamps, fog lamps, etc.). However, the uses of the vehicle lighting device 1 are not limited to these.

FIG. 1 is a schematic exploded view illustrating a vehicle lighting device 1 according to the present embodiment.
FIG. 2 is a cross-sectional view of the vehicle lighting device 1 taken along line AA in FIG.
As shown in FIGS. 1 and 2, a vehicle lighting device 1 includes, for example, a socket 10, a light-emitting module 20, a power supply unit 30, and a heat transfer unit 40.

The socket 10 includes, for example, a mounting portion 11 , a bayonet 12 , a flange 13 , heat dissipation fins 14 , and a connector holder 15 .
The mounting portion 11 is provided on one surface 13a of the flange 13. The outer shape of the mounting portion 11 can be columnar. For example, the outer shape of the mounting portion 11 is cylindrical. The mounting portion 11 has, for example, a recess 11a that opens at the end opposite to the flange 13 side.

The bayonet 12 is provided, for example, on the side of the mounting portion 11. The bayonet 12 protrudes toward the outside of the vehicle lighting device 1. The bayonet 12 faces the flange 13. Multiple bayonets 12 may be provided. The bayonet 12 is used when mounting the vehicle lighting device 1 to, for example, the housing 101 of the vehicle lamp 100 described below. The bayonet 12 can be used for a twist lock.

The flange 13 is, for example, plate-shaped. The flange 13 is, for example, approximately disk-shaped. The flange 13 has a surface 13a and a surface 13b opposite surface 13a. The side of the flange 13 is located further outward from the vehicle lighting device 1 than the side of the bayonet 12.

The heat dissipation fin 14 is provided, for example, on the surface 13b of the flange 13. At least one heat dissipation fin 14 can be provided. For example, as shown in FIG. 2, the socket 10 can be provided with multiple heat dissipation fins 14. The multiple heat dissipation fins 14 can be arranged side by side in a predetermined direction. The heat dissipation fin 14 has, for example, a plate or cylindrical shape.

The connector holder 15 is provided, for example, on the surface 13b of the flange 13. The connector holder 15 can be provided alongside the heat dissipation fins 14. The connector holder 15 is cylindrical, and a connector 105 having a sealing member 105a inside is inserted into it.

The socket 10 has the function of holding the light-emitting module 20 and the power supply unit 30, and the function of transferring heat generated in the light-emitting module 20 to the outside. For this reason, it is preferable that the socket 10 be made from a material with high thermal conductivity. For example, the socket 10 can be made from a metal such as an aluminum alloy.

In recent years, it has become desirable for the socket 10 to be lightweight and capable of efficiently dissipating heat generated in the light-emitting module 20. Therefore, it is more preferable for the socket 10 to be formed from, for example, a highly thermally conductive resin. Highly thermally conductive resins include, for example, resin and a filler made of an inorganic material. Highly thermally conductive resins are, for example, resins such as PET (Polyethylene terephthalate) or nylon mixed with fillers made of carbon or aluminum oxide.

If the socket 10 contains a highly thermally conductive resin and has the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 molded as a single unit, it can efficiently dissipate heat generated in the light-emitting module 20. It can also reduce the weight of the socket 10. In this case, the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 can be molded as a single unit using a method such as injection molding. It is also possible to use insert molding to mold the socket 10 and heat transfer portion 40 as a single unit, or to mold the socket 10, power supply portion 30, and heat transfer portion 40 as a single unit.

The light emitting module 20 (substrate 21 ) is provided on one end side of the socket 10 .
The light emitting module 20 includes, for example, a substrate 21 , a light emitting element 22 , a frame 23 , a sealing portion 24 , an element 25 , and a bonding portion 26 .

The substrate 21 is adhered to the surface 40a of the heat transfer section 40. In this case, it is preferable to use an adhesive with high thermal conductivity. For example, the adhesive can be an adhesive mixed with an inorganic filler.

The substrate 21 is plate-shaped. The planar shape of the substrate 21 is, for example, rectangular. The substrate 21 can be formed from, for example, inorganic materials such as ceramics (e.g., aluminum oxide or aluminum nitride), or organic materials such as paper phenol or glass epoxy. The substrate 21 may also be a metal core substrate in which the surface of a metal plate is coated with an insulating material. If the light-emitting element 22 generates a large amount of heat, it is preferable to form the substrate 21 using a material with high thermal conductivity from the perspective of heat dissipation. Examples of materials with high thermal conductivity include ceramics such as aluminum oxide or aluminum nitride, highly thermally conductive resins, and metal core substrates. The substrate 21 may have a single-layer structure or a multi-layer structure.

In addition, a wiring pattern 21a is provided on the surface of the substrate 21. The wiring pattern 21a is formed, for example, from a material whose main component is silver or a material whose main component is copper.

A covering portion can also be provided to cover the wiring pattern 21a and the film resistors described below. The covering portion can include, for example, a glass material.

The light-emitting element 22 may be, for example, a light-emitting diode, an organic light-emitting diode, a laser diode, etc.

The light-emitting element 22 is provided on the substrate 21 (the side opposite the heat transfer section 40). The light-emitting element 22 is electrically connected to the wiring pattern 21a. At least one light-emitting element 22 can be provided. If multiple light-emitting elements 22 are provided, the multiple light-emitting elements 22 can be connected in series with each other.

The light-emitting element 22 may be a chip-type light-emitting element. If the light-emitting element 22 is a chip-type light-emitting element, the light-emitting module 20 can be made smaller, and therefore the vehicle lighting device 1 can be made smaller. The chip-type light-emitting element 22 can be mounted on the wiring pattern 21a by COB (Chip On Board). The chip-type light-emitting element 22 may be, for example, an upper electrode type light-emitting element, a top and bottom electrode type light-emitting element, or a flip-chip type light-emitting element.
The number, size, arrangement, etc. of the light-emitting elements 22 are not limited to those exemplified above, and can be changed as appropriate depending on the size, use, etc. of the vehicle lighting device 1.

The frame portion 23 is frame-shaped and is provided on the side of the substrate 21 where the light-emitting element 22 is provided. The frame portion 23 surrounds the light-emitting element 22. The frame portion 23 has, for example, the function of defining the formation area of the sealing portion 24 and the function of a reflector.

The frame 23 is formed, for example, from a resin. The resin can be a thermoplastic resin such as PBT (polybutylene terephthalate), PC (polycarbonate), PET, nylon, PP (polypropylene), PE (polyethylene), or PS (polystyrene).

In addition, to increase the reflectivity of the light emitted from the light-emitting element 22, the resin can contain titanium oxide particles or a white resin can be used.

Furthermore, the inner wall of the frame portion 23 may be perpendicular to the surface of the substrate 21, or may be inclined relative to the surface of the substrate 21. For example, as shown in FIG. 2, the inner wall of the frame portion 23 may be inclined toward the outside of the frame portion 23 as it approaches the end of the frame portion 23 opposite the substrate 21 side.

If the frame portion 23 has a high reflectivity or if the inner wall of the frame portion 23 is an inclined surface, it becomes easier for light that enters the inner wall of the frame portion 23 to be emitted toward the front side of the vehicle lighting device 1. This improves the light extraction efficiency.

The sealing portion 24 is provided inside the frame portion 23. The sealing portion 24 is provided so as to cover the area surrounded by the frame portion 23. The sealing portion 24 is provided so as to cover the light-emitting element 22. The sealing portion 24 contains a translucent resin. The sealing portion 24 is formed, for example, by filling the inside of the frame portion 23 with resin. The resin is filled using, for example, a dispenser. The resin to be filled is, for example, silicone resin.

The sealing portion 24 may also contain a phosphor. The phosphor may be, for example, a YAG-based phosphor (yttrium aluminum garnet-based phosphor). However, the type of phosphor can be changed as appropriate to obtain a desired emission color depending on the application of the vehicle lighting device 1.

The element 25 can be a passive element or an active element used to configure a light-emitting circuit having the light-emitting element 22. The element 25 is provided, for example, on the periphery of the frame portion 23 and is electrically connected to the wiring pattern 21a. At least one element 25 can be provided.

The element 25 may be, for example, a resistor 25a and a control element 25b.
However, the type of element 25 is not limited to the example given, and can be changed as appropriate depending on the configuration of the light-emitting circuit having the light-emitting element 22. For example, in addition to the above, the element 25 may be a capacitor, a positive temperature coefficient thermistor, a negative temperature coefficient thermistor, an inductor, a surge absorber, a varistor, a transistor such as an FET or a bipolar transistor, an integrated circuit, an arithmetic element, or the like.

Resistor 25a is provided on substrate 21. Resistor 25a is electrically connected to wiring pattern 21a. Resistor 25a can be, for example, a surface-mount resistor, a resistor with leads (metal oxide film resistor), or a film resistor formed using a screen printing method. Note that the resistor 25a illustrated in Figure 1 is a film resistor.

The material of the film resistor is, for example, ruthenium oxide (RuO ₂ ). The film resistor is formed, for example, by screen printing and firing. If the resistor 25 a is a film resistor, the contact area between the resistor 25 a and the substrate 21 can be increased, thereby improving heat dissipation. Furthermore, multiple resistors 25 a can be formed at once, thereby improving productivity. Furthermore, variations in the resistance values of the multiple resistors 25 a can be suppressed.

Here, since there is variation in the forward voltage characteristics of the light-emitting element 22, if the applied voltage between the anode terminal and the ground terminal is constant, variation will occur in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light emitted from the light-emitting element 22. Therefore, to ensure that the brightness of the light emitted from the light-emitting element 22 falls within a predetermined range, the value of the current flowing through the light-emitting element 22 is kept within a predetermined range by using resistor 25a connected in series to the light-emitting element 22. In this case, by changing the resistance value of resistor 25a, the value of the current flowing through the light-emitting element 22 is kept within the predetermined range.

If the resistor 25a is a surface-mount resistor or a resistor with leads, select a resistor 25a with an appropriate resistance value according to the forward voltage characteristics of the light-emitting element 22. If the resistor 25a is a film resistor, the resistance value can be increased by removing a portion of the resistor 25a. For example, irradiating a film resistor with laser light can easily remove a portion of the film resistor. Note that the number and size of the resistors 25a are not limited to those shown in the example, and can be changed as appropriate depending on the number and specifications of the light-emitting elements 22.

The control element 25b is provided on the substrate 21. The control element 25b is electrically connected to the wiring pattern 21a. The control element 25b is provided, for example, to prevent reverse voltage from being applied to the light-emitting element 22 and to prevent reverse pulse noise from being applied to the light-emitting element 22. The control element 25b is, for example, a surface-mounted diode or a diode with leads. The control element 25b illustrated in Figure 1 is a surface-mounted diode.

The joint 26 is provided between the frame 23 and the substrate 21. The joint 26 bonds the frame 23 onto the substrate 21.
The details of the joint 26 will be described later.

The power supply unit 30 includes, for example, a plurality of power supply terminals 31 and a holding unit 32 .
The plurality of power supply terminals 31 may be rod-shaped. One end of each of the plurality of power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. The plurality of power supply terminals 31 are arranged, for example, side by side in a predetermined direction. One end of each of the plurality of power supply terminals 31 is soldered to the wiring pattern 21a provided on the substrate 21. The other end of each of the plurality of power supply terminals 31 is exposed inside the hole of the connector holder 15. The connector 105 is fitted into the plurality of power supply terminals 31 exposed inside the hole of the connector holder 15. The plurality of power supply terminals 31 are formed of a metal such as a copper alloy. Note that the shape, arrangement, material, and the like of the plurality of power supply terminals 31 are not limited to those exemplified and can be changed as appropriate.

When the socket 10 is formed from, for example, a metal such as an aluminum alloy or a highly thermally conductive resin containing a carbon-based filler, the socket 10 is electrically conductive. Therefore, the retaining portion 32 is provided to insulate the multiple power supply terminals 31 from the conductive socket 10. The retaining portion 32 also has the function of holding the multiple power supply terminals 31. The retaining portion 32 is formed from, for example, an insulating resin. The retaining portion 32 can be, for example, press-fitted into a hole in the socket 10 or adhered to the inner wall of the hole. Note that when the socket 10 is formed from, for example, a highly thermally conductive resin containing an aluminum oxide-based filler, the socket 10 is electrically insulating. In such cases, the retaining portion 32 can be omitted.

The heat transfer part 40 is plate-shaped and is provided between the socket 10 and the light-emitting module 20 (substrate 21). The surface 40a of the heat transfer part 40 is exposed from the end of the socket 10 on the side where the light-emitting module 20 is provided. The heat transfer part 40 can be embedded in the bottom surface 11a1 of the recess 11a, or it can be adhered to the bottom surface 11a1 of the recess 11a, or it can be adhered to a convex base provided on the bottom surface 11a1 of the recess 11a.

The heat transfer section 40 is provided to facilitate the transfer of heat generated in the light-emitting module 20 to the socket 10. For this reason, it is preferable that the heat transfer section 40 be formed from a material with high thermal conductivity (e.g., a metal such as aluminum, an aluminum alloy, copper, or a copper alloy).

The heat transfer section 40 can also be omitted. However, in recent years, there has been a demand for higher luminous flux in vehicle lighting devices 1, and the current flowing through the light-emitting elements 22 has tended to increase. This has resulted in an increase in the amount of heat generated in the light-emitting module 20. Furthermore, in recent years, there has been a demand for smaller vehicle lighting devices 1, and the cross-sectional area of the mounting section 11 has tended to become smaller. If the cross-sectional area of the mounting section 11 becomes smaller, it becomes more difficult for the heat generated in the light-emitting module 20 to be transferred to the heat dissipation fins 14, and heat dissipation via the heat dissipation fins 14 may become more difficult. Therefore, when considering the need for higher luminous flux and smaller size in vehicle lighting devices 1, it is preferable to provide the heat transfer section 40.

Next, the joint 26 will be further described.
FIG. 3 is a schematic enlarged view of part B in FIG.
As described above, the bonding portion 26 adheres the frame portion 23 to the substrate 21. The bonding portion 26 is, for example, a hardened adhesive. In this case, as shown in FIG. 3 , the bonding portion 26 can be made to protrude into the inside of the frame portion 23. By making the bonding portion 26 protrude into the inside of the frame portion 23, it is possible to prevent the occurrence of a portion (a gap) between the frame portion 23 and the substrate 21 where the bonding portion 26 is absent. This makes it possible to improve the adhesive strength between the frame portion 23 and the substrate 21 and to prevent moisture and the like from penetrating into the inside of the frame portion 23 via the bonding portion 26.

Here, a portion of the light emitted from the light-emitting element 22 is reflected at the interface between the sealing portion 24 and the outside air, and heads toward the substrate 21. At this time, a portion of the light headed toward the substrate 21 is incident on portion 26a of the joint 26, which is located inside the frame portion 23. Therefore, if the reflectivity of portion 26 for light emitted from the light-emitting element 22 is higher than the reflectivity of the substrate 21, it becomes easier for the light that has entered portion 26a to be reflected toward the interface between the sealing portion 24 and the outside air. This makes it possible to improve the light extraction efficiency.

For example, the joint 26 may contain a resin such as silicone or epoxy, and particles such as titanium oxide. For example, the joint 26 may contain a white resin. For example, the joint 26 may be a cured adhesive containing particles such as titanium oxide, or a cured adhesive containing a white resin.

In this case, as shown in Figure 3, if the distance L1 (mm) between the end 26a1 of the portion 26a on the light-emitting element 21 side and the end 23a of the inner wall of the frame 23 on the substrate 21 side is increased in a direction perpendicular to the central axis 23b of the frame 23, the amount of light incident on the portion 26a increases, thereby improving the light extraction efficiency.

However, when adhering the frame 23 onto the substrate 21, if the adhesive reaches the side surface 22a of the light-emitting element 22 closest to the inner wall of the frame 23, there is a risk that the adhesive will creep up onto the light-emitting surface of the light-emitting element 22. If the adhesive creeps up onto the light-emitting surface of the light-emitting element 22, there is a risk that the amount of light emitted from the light-emitting element 22 will decrease.

In recent years, the light-emitting element 22 has become smaller in size, and the thickness of the light-emitting element 22 has become thinner. Furthermore, there is a demand for a smaller light-emitting module 20 in order to reduce the size of the vehicle lighting device 1. In order to reduce the size of the light-emitting module 20, it is necessary to reduce the size of the frame 23. When the frame 23 is reduced in size, the distance L (mm) between the end 23 a of the inner wall of the frame 23 on the substrate 21 side and the side surface 22 a of the light-emitting element 22 closest to the inner wall of the frame 23 becomes smaller in a direction perpendicular to the central axis 23 b of the frame 23.
For example, in recent years, the distance L (mm) may be 0.57 mm or less, and the thickness of the light emitting element 22 may be 0.12 mm or less.
Therefore, the adhesive can easily reach the side surface 22 a of the light emitting element 22 that is closest to the inner wall of the frame portion 23 .

According to the inventor's findings, if "L/3 (mm) ≦ L1 (mm)" is satisfied, it is possible to obtain light extraction efficiency that is approximately the same as when "L1 (mm) = L (mm)" (when the adhesive reaches the side surface 22a of the light-emitting element 22).

In other words, in recent years, the frame portion 23 has become smaller and the distance L (mm) has become shorter, so if "L/3 (mm) ≦ L1 (mm)" is satisfied, it is possible to obtain light extraction efficiency that is roughly equivalent to that when "L1 (mm) = L (mm)" is satisfied.

On the other hand, to prevent the adhesive from creeping up onto the light-emitting surface of the light-emitting element 22, it is sufficient to make "L1 (mm) < L (mm)". However, the position of the end 26a1 of portion 26a on the light-emitting element 21 side varies depending on the viscosity and amount of the adhesive, the force pressing the frame portion 23 against the adhesive, etc.

According to the inventor's findings, by ensuring that "L1 (mm) < L/2 (mm)", it is possible to prevent the adhesive from creeping up onto the light-emitting surface of the light-emitting element 22, even if the thickness of the light-emitting element 22 is thin or there are variations in the viscosity of the adhesive, the amount of adhesive, and the force with which the frame portion 23 is pressed against the adhesive.

In other words, if "L/3 (mm) ≦ L1 (mm) < L/2 (mm)" is satisfied, the light extraction efficiency can be improved and the adhesion of resin to the light emission surface of the light-emitting element 22 can be suppressed.

(Vehicle lighting fixtures)
Next, the vehicle lamp 100 will be illustrated.
In the following, as an example, a case will be described in which the vehicular lamp 100 is a front combination light provided on an automobile. However, the vehicular lamp 100 is not limited to a front combination light provided on an automobile. The vehicular lamp 100 may be a vehicular lamp provided on an automobile, a railroad car, or the like.

FIG. 4 is a schematic partial cross-sectional view illustrating the vehicle lamp 100. As shown in FIG.
As shown in FIG. 4 , the vehicle lamp 100 includes, for example, the vehicle lighting device 1, a housing 101, a cover 102, an optical element 103, a seal member 104, and a connector 105.

The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 is box-shaped with one end open. The housing 101 is formed, for example, from a light-opaque resin. The bottom surface of the housing 101 is provided with a mounting hole 101a into which the portion of the mounting portion 11 with the bayonet 12 is inserted. A recess is provided around the periphery of the mounting hole 101a into which the bayonet 12 provided on the mounting portion 11 is inserted. Note that while the mounting hole 101a is provided directly on the housing 101 in the example shown, a mounting member having the mounting hole 101a may also be provided on the housing 101.

When attaching the vehicle lighting device 1 to the vehicle lamp 100, the portion of the mounting part 11 with the bayonet 12 is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. This causes the bayonet 12 to be held in place by a fitting provided on the periphery of the mounting hole 101a. This type of attachment method is called a twist lock.

The cover 102 is provided to cover the opening of the housing 101. The cover 102 is formed from a translucent resin or the like. The cover 102 may also have functions such as a lens.

Light emitted from the vehicle lighting device 1 is incident on the optical element 103. The optical element 103 reflects, diffuses, guides, and collects the light emitted from the vehicle lighting device 1, and forms a predetermined light distribution pattern. For example, the optical element 103 illustrated in Figure 4 is a reflector. In this case, the optical element 103 reflects the light emitted from the vehicle lighting device 1 and forms a predetermined light distribution pattern.

The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 is annular and made of an elastic material such as rubber or silicone resin. When the vehicle lighting device 1 is attached to the vehicle lamp 100, the seal member 104 is sandwiched between the flange 13 and the housing 101. This allows the seal member 104 to seal the internal space of the housing 101. Furthermore, the elastic force of the seal member 104 presses the bayonet 12 against the housing 101. This prevents the vehicle lighting device 1 from detaching from the housing 101.

The connector 105 is fitted to the ends of multiple power supply terminals 31 exposed inside the connector holder 15. A power source (not shown) and the like are electrically connected to the connector 105. Therefore, by fitting the connector 105 to the ends of the multiple power supply terminals 31, the light-emitting element 22 can be electrically connected to a power source (not shown) and the like.

The connector 105 is also provided with a sealing member 105a. When the connector 105 having the sealing member 105a is inserted into the connector holder 15, the interior of the connector holder 15 is sealed to be watertight.

The above describes several embodiments of the present invention, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in a variety of other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the spirit of the invention. These embodiments and their variations are included within the scope and spirit of the invention, as well as within the scope of the invention and its equivalents as set forth in the claims. Furthermore, the above-described embodiments can be implemented in combination with each other.

1. Vehicle lighting device; 10. Socket; 11. Mounting portion; 20. Light-emitting module; 21. Board; 22. Light-emitting element; 22a. Side surface; 23. Frame portion; 23a. End portion; 23b. Center axis; 24. Sealing portion; 26. Joint portion; 26a. Portion; 26a1. End portion; 100. Vehicle lamp; 101. Housing

Claims (4)

Socket and;
a substrate provided on one end side of the socket;
at least one light emitting element disposed on the substrate;
a frame portion provided on the substrate on the side where the light emitting element is provided, the frame portion having a frame shape and surrounding the light emitting element;
a bonding portion provided between the substrate and the frame portion, the bonding portion having a reflectance higher than that of the substrate with respect to light emitted from the light-emitting element;
Equipped with
In a direction perpendicular to the central axis of the frame portion,
The distance between the end of the inner wall of the frame portion on the substrate side and the side surface of the light-emitting element is L (mm),
The distance between the end of the joint portion provided inside the frame portion on the light-emitting element side and the end of the inner wall of the frame portion on the substrate side is L1 (mm) ,
The thickness of the light-emitting element is 0.12 mm or less,
A vehicle lighting device that satisfies the following formula when the distance L (mm) is 0.57 mm or less .
L/3 (mm)≦L1 (mm)<L/2 (mm) The vehicle lighting device according to claim 1, wherein the joint contains resin and titanium oxide particles. The vehicle lighting device according to claim 1, wherein the joint contains a white resin. The vehicle lighting device according to any one of claims 1 to 3;
a housing to which the vehicle lighting device is attached;
A vehicle lighting fixture equipped with: