JP7637346B2 - Vehicle lighting device and vehicle lamp - Google Patents

Description

Embodiments of the present invention relate to a vehicle lighting device and a vehicle lamp.

2. Description of the Related Art From the standpoint of energy saving and life extension, vehicle lighting devices equipped with light emitting elements such as light emitting diodes are becoming more and more popular instead of vehicle lighting devices equipped with filaments.
In this case, the vehicle lighting device equipped with the light-emitting element follows the functions and uses of the vehicle lighting device equipped with the filament.
Therefore, in recent years, there has been a demand for adding new functions and uses to vehicle lighting devices equipped with light-emitting elements to make them multifunctional and multipurpose.

JP 2013-247061 A

The problem that this invention aims to solve is to provide a vehicle lighting device and vehicle lamp that can be multifunctional and multipurpose.

A vehicle lighting device according to an embodiment includes a socket and a light-emitting module provided on one end of the socket. The light-emitting module has a light-emitting element capable of emitting light having a wavelength equal to or less than that of visible light, and an element capable of emitting ultrasonic waves. When the light-emitting element radiates ultraviolet light, a phosphor that converts the ultraviolet light into visible light is provided.

According to an embodiment of the present invention, it is possible to provide a vehicle lighting device and a vehicle lamp that can be multifunctional and multipurpose.

1 is a schematic perspective view illustrating a vehicle lighting device according to an embodiment of the present invention; 2 is a cross-sectional view of the vehicle lighting device shown in FIG. 1 taken along line AA. FIG. 2 is a schematic plan view of a light-emitting module. 1A is a circuit diagram illustrating a case where a light-emitting element and a first element are provided in one circuit, and FIG. 1B is a circuit diagram illustrating a case where a light-emitting element and a first element are provided in separate circuits. 11 is a schematic plan view illustrating a light-emitting module using a second element. FIG. 1A is a circuit diagram illustrating a case where a light-emitting element and a second element are provided in one circuit, and FIG. 1B is a circuit diagram illustrating a case where a light-emitting element and a second element are provided in separate circuits. 1 is a schematic partial cross-sectional view illustrating a vehicle lamp.

Below, an embodiment will be illustrated with reference to the drawings. Note that in each drawing, similar components are given the same reference numerals and detailed explanations are omitted as appropriate.

(Vehicle lighting device)
The vehicle lighting device 1 according to the present embodiment can be installed in, for example, an automobile or a railroad car. Examples of the vehicle lighting device 1 installed in an automobile include a front combination light (for example, a combination of a daytime running lamp (DRL), a position lamp, a turn signal lamp, etc.) and a rear combination light (for example, a combination of a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, etc.). However, the uses of the vehicle lighting device 1 are not limited to these.

FIG. 1 is a schematic perspective view illustrating a vehicle lighting device 1 according to the present embodiment.
FIG. 2 is a cross-sectional view of the vehicle lighting device 1 taken along line AA in FIG.
FIG. 3 is a schematic plan view of the light-emitting module 20. As shown in FIG.
As shown in FIGS. 1 and 2 , a vehicle lighting device 1 may be provided with, for example, a socket 10, a light emitting module 20, a power supply unit 30, and a heat transfer unit 40.

The socket 10 has, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15.
The mounting portion 11 is provided on the surface of the flange 13 opposite to the side on which the heat dissipation fins 14 are provided. The outer shape of the mounting portion 11 may be columnar. The outer shape of the mounting portion 11 is, for example, cylindrical. The mounting portion 11 has a recess 11a that opens to the end face opposite to the flange 13 side.

The bayonet 12 is provided on the outer surface of the mounting portion 11. The bayonet 12 protrudes toward the outside of the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 are provided. The bayonets 12 can be used when mounting the vehicle lighting device 1 to the housing 101 of the vehicle lamp 100. The bayonet 12 can be used for a twist lock.

The flange 13 has a plate shape. The flange 13 has, for example, a disk shape. The outer surface of the flange 13 is located further outward from the vehicle lighting device 1 than the outer surface of the bayonet 12.

The heat dissipation fin 14 is provided on the flange 13 on the side opposite the mounting portion 11. At least one heat dissipation fin 14 can be provided. The socket 10 illustrated in Figures 1 and 2 is provided with multiple heat dissipation fins. The multiple heat dissipation fins 14 can be arranged in a predetermined direction. The heat dissipation fin 14 is, for example, plate-shaped.

The connector holder 15 is provided on the side of the flange 13 opposite the mounting portion 11. The connector holder 15 can be provided alongside the heat dissipation fins 14. The connector holder 15 can be provided near the periphery of the flange 13. The connector holder 15 is cylindrical, and a connector 105 having a seal member 105a inside can be inserted into it.

The socket 10 has a function of holding the light-emitting module 20 and the power supply unit 30, and a function of transmitting heat generated in the light-emitting module 20 to the outside. Therefore, it is preferable that the socket 10 is formed from a material with high thermal conductivity. For example, the socket 10 can be formed from a metal such as an aluminum alloy. In recent years, it is also desired that the socket 10 can efficiently dissipate heat generated in the light-emitting module 20 and is lightweight. Therefore, the socket 10 is formed from, for example, a highly thermally conductive resin. The highly thermally conductive resin includes, for example, a resin and a filler using an inorganic material. The highly thermally conductive resin is, for example, a resin such as PET (Polyethylene terephthalate) or nylon mixed with a filler using carbon or aluminum oxide.

If the socket 10 contains a highly thermally conductive resin and has the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 molded as a single unit, the heat generated in the light-emitting module 20 can be efficiently dissipated. The weight of the socket 10 can also be reduced. In this case, the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 can be molded as a single unit using a method such as injection molding. The socket 10 and the power supply portion 30 can also be molded as a single unit using a method such as insert molding.

The light emitting module 20 is provided on one end side of the socket 10 .
As shown in FIGS. 1 and 3, the light emitting module 20 includes, for example, a substrate 21, a light emitting element 22, a frame portion 23, a sealing portion 24, an element 25, and a first element 26.
The substrate 21 can be bonded onto the heat transfer section 40, for example. In this case, the adhesive is preferably an adhesive with high thermal conductivity. For example, the adhesive can be an adhesive mixed with a filler using an inorganic material. The inorganic material is preferably a material with high thermal conductivity (for example, ceramics such as aluminum oxide or aluminum nitride). The thermal conductivity of the adhesive can be, for example, 0.5 W/(m·K) or more and 10 W/(m·K) or less.

The substrate 21 has a plate shape. The planar shape of the substrate 21 is, for example, a rectangle. The substrate 21 can be formed from, for example, an inorganic material such as ceramics (for example, aluminum oxide or aluminum nitride), or an organic material such as paper phenol or glass epoxy. The substrate 21 may also be a metal core substrate in which the surface of a metal plate is covered with an insulating material. When the light-emitting element 22 generates a large amount of heat, it is preferable to form the substrate 21 using a material with high thermal conductivity from the viewpoint of heat dissipation. Examples of materials with high thermal conductivity include ceramics such as aluminum oxide or aluminum nitride, highly thermally conductive resins, and metal core substrates. The substrate 21 may have a single-layer structure or a multi-layer structure.

In addition, a wiring pattern 21a is provided on the surface of the substrate 21. The wiring pattern 21a can be formed, for example, from a material whose main component is silver or a material whose main component is copper.

A covering portion can also be provided to cover the wiring pattern 21a and the film resistors described below. The covering portion can include, for example, a glass material.

The light-emitting element 22 emits light having a wavelength equal to or shorter than that of visible light. The wavelength of visible light is, for example, 360 nm or more and 830 nm or less. For example, the light-emitting element 22 may be a light-emitting element that emits ultraviolet light, or a light-emitting element that emits visible light such as red light.

The light emitting element 22 is provided on the side of the substrate 21 opposite to the socket 10 side (the heat transfer section 40 side). The light emitting element 22 is electrically connected to the wiring pattern 21a. At least one light emitting element 22 may be provided. When a plurality of light emitting elements 22 are provided, the plurality of light emitting elements 22 may be connected in series with each other.
The light emitting element 22 may be, for example, a light emitting diode, an organic light emitting diode, a laser diode, or the like.

The light-emitting element 22 can be, for example, a chip-shaped light-emitting element. The chip-shaped light-emitting element 22 can be mounted on the wiring pattern 21a by COB (Chip On Board). The chip-shaped light-emitting element 22 can be, for example, an upper electrode type light-emitting element, an upper and lower electrode type light-emitting element, a flip-chip type light-emitting element, etc. The light-emitting element 22 illustrated in Figures 1 to 3 is an upper and lower electrode type light-emitting element. The electrode of the upper electrode type light-emitting element or the upper electrode of the upper and lower electrode type light-emitting element can be electrically connected to the wiring pattern 21a by the wiring 21b. In this case, the wiring 21b can be connected by, for example, a wire bonding method. The flip-chip type light-emitting element 22 can be directly mounted on the wiring pattern 21a.

The number, size, arrangement, etc. of the light-emitting elements 22 are not limited to those shown in the example, and can be changed as appropriate depending on the size and use of the vehicle lighting device 1.

In addition, although the above describes an example in which the light-emitting element 22 is a chip-shaped light-emitting element, the light-emitting element 22 can also be a surface-mount type light-emitting element such as a PLCC (Plastic Leaded Chip Carrier) type, or a light-emitting element having leads such as a bullet type. When using a surface-mount type light-emitting element or a light-emitting element having leads, the frame portion 23 and the sealing portion 24 described below can be omitted.

However, if the light-emitting elements 22 are chip-shaped, many light-emitting elements 22 can be provided in a small area. This makes it possible to reduce the size of the light-emitting module 20, and therefore the size of the vehicle lighting device 1.

The frame portion 23 is provided on the side of the substrate 21 opposite the socket 10 side (the heat transfer portion 40 side). The frame portion 23 has a frame shape and is provided on the substrate 21 via an adhesive layer 27. The frame portion 23 surrounds the light-emitting element 22. The frame portion 23 can be formed from a resin. The resin can be, for example, a thermoplastic resin such as PBT (polybutylene terephthalate), PC (polycarbonate), PET, nylon, PP (polypropylene), PE (polyethylene), or PS (polystyrene).

The frame 23 can have the function of defining the formation range of the sealing portion 24 and the function of a reflector. Therefore, the frame 23 can contain titanium oxide particles or a white resin to improve the reflectance.

The sealing portion 24 can be provided inside the frame portion 23. The sealing portion 24 can be provided so as to cover the area surrounded by the frame portion 23. The sealing portion 24 can be provided so as to cover the light-emitting element 22. The sealing portion 24 can include a resin having translucency. The sealing portion 24 can be formed, for example, by filling the inside of the frame portion 23 with resin. The filling of the resin can be performed, for example, using a dispenser. The resin to be filled can be, for example, a silicone resin.

For example, if the light-emitting element 22 is a light-emitting element that irradiates ultraviolet light, the sealing portion 24 can contain a phosphor. If the sealing portion 24 contains a phosphor, the ultraviolet light irradiated from the light-emitting element 22 can be converted into visible light by the phosphor. The phosphor can be, for example, a YAG phosphor (yttrium aluminum garnet phosphor). However, the type of phosphor can be changed as appropriate so as to obtain a predetermined emission color depending on the application of the vehicle lighting device 1.

In addition, an optical element can be provided on the sealing portion 24 as necessary. The optical element can be, for example, a convex lens. The optical element, which is a convex lens, focuses light so that a predetermined light distribution characteristic can be obtained. Note that the optical element is not limited to a convex lens, and may be, for example, a concave lens.

The element 25 can be a passive element or an active element used to configure a light-emitting circuit having the light-emitting element 22. The element 25 is provided, for example, on the periphery of the frame portion 23 and is electrically connected to the wiring pattern 21a. At least one element 25 can be provided.

The element 25 may be, for example, a resistor 25a, a control element 25b, a capacitor 25c, and a pull-down resistor 25d.
However, the type of element 25 is not limited to the exemplified ones, and can be changed as appropriate depending on the configuration of the light-emitting circuit having the light-emitting element 22. For example, in addition to the above-mentioned ones, the element 25 may be a positive characteristic thermistor, a negative characteristic thermistor, an inductor, a surge absorber, a varistor, a transistor such as a FET or a bipolar transistor, an integrated circuit, a computing element, etc.

The resistor 25a can be provided on the side of the substrate 21 opposite the socket 10 side (the heat transfer section 40 side). The resistor 25a is electrically connected to the wiring pattern 21a. The resistor 25a can be, for example, a surface mount resistor, a resistor with leads (metal oxide film resistor), or a film resistor formed using a screen printing method or the like. The resistor 25a illustrated in Figures 1 and 3 is a film resistor.

The material of the film resistor is, for example, ruthenium oxide (RuO ₂ ). The film resistor is formed, for example, by using a screen printing method and a baking method. If the resistor 25a is a film resistor, the contact area between the resistor 25a and the substrate 21 can be increased, so that heat dissipation can be improved. In addition, a plurality of resistors 25a can be formed at once. Therefore, productivity can be improved. In addition, the variation in resistance value among the plurality of resistors 25a can be suppressed.

Here, since there is variation in the forward voltage characteristics of the light-emitting element 22, if the applied voltage between the anode terminal and the ground terminal is constant, variation occurs in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light irradiated from the light-emitting element 22. Therefore, in order to keep the brightness of the light irradiated from the light-emitting element 22 within a predetermined range, the value of the current flowing through the light-emitting element 22 is set within a predetermined range by the resistor 25a connected in series to the light-emitting element 22. In this case, the resistance value of the resistor 25a is changed to keep the value of the current flowing through the light-emitting element 22 within the predetermined range.

If the resistor 25a is a surface mount resistor or a resistor with leads, a resistor 25a having an appropriate resistance value is selected according to the forward voltage characteristics of the light emitting element 22. If the resistor 25a is a film resistor, the resistance value can be increased by removing a portion of the resistor 25a. For example, by irradiating a film resistor with laser light, a portion of the film resistor can be easily removed. Note that the number and size of the resistors 25a are not limited to those exemplified, and can be changed as appropriate according to the number and specifications of the light emitting elements 22.

The control element 25b can be provided on the side of the substrate 21 opposite the socket 10 side (the heat transfer section 40 side). The control element 25b is electrically connected to the wiring pattern 21a. The control element 25b can be provided, for example, to prevent a reverse voltage from being applied to the light-emitting element 22 and to prevent pulse noise from the reverse direction from being applied to the light-emitting element 22. The control element 25b is, for example, a surface-mounted diode or a diode with leads. The control element 25b illustrated in Figures 1 and 3 is a surface-mounted diode.

The capacitor 25c can be provided on the side of the board 21 opposite the socket 10 side (the heat transfer section 40 side). The capacitor 25c is electrically connected to the wiring pattern 21a. The capacitor 25c can be provided, for example, to reduce noise or smooth out voltage. The capacitor 25c can be, for example, a chip capacitor, a surface mount capacitor, or a capacitor with leads. The capacitor 25c illustrated in FIG. 3 is a surface mount capacitor.

The pull-down resistor 25d can be provided on the side of the substrate 21 opposite the socket 10 side (the heat transfer section 40 side). The pull-down resistor 25d is electrically connected to the wiring pattern 21a. The pull-down resistor 25d can be provided, for example, to detect continuity of the light-emitting element 22 and to prevent erroneous lighting. The pull-down resistor 25d can be, for example, a surface-mount resistor, a resistor with leads, or a chip resistor. The pull-down resistor 25d illustrated in Figures 1 and 3 is a surface-mount resistor.

The first element 26 is provided to make the vehicle lighting device 1 multifunctional and multipurpose. A typical vehicle lighting device has the function of emitting visible light and is used for applications that use visible light. Therefore, the first element 26 is provided separately from the light-emitting element 22 to add new functions and applications to the vehicle lighting device 1.

The first element 26 can be, for example, a light-emitting element that emits infrared light. The first element 26 can be, for example, a light-emitting diode that emits infrared light, or a laser diode that emits infrared light.

The first element 26 is provided on the side of the substrate 21 opposite the socket 10 side (heat transfer section 40 side). The first element 26 can be provided on at least one of the inside and outside of the frame section 23. The first element 26 is electrically connected to the wiring pattern 21a. At least one first element 26 can be provided. When multiple first elements 26 are provided, the multiple first elements 26 can be connected in series with each other.

The first element 26 can be a surface-mounted first element 26, a bullet-shaped first element 26 having lead wires, or a chip-shaped first element 26. The electrical connection between the chip-shaped first element 26 and the wiring pattern 21a can be the same as that of the light-emitting element 22 described above.

When the first element 26 is provided inside the frame portion 23, the first element 26 can be a chip-shaped first element 26. If the first element 26 is provided inside the frame portion 23, the light-emitting module 20 can be made smaller, and therefore the vehicle lighting device 1 can be made smaller.

When the first element 26 is provided outside the frame 23, the first element 26 may be any of a surface-mounted first element 26, a first element 26 having a lead wire, and a chip-shaped first element 26. If the first element 26 is provided outside the frame 23, the number of first elements 26 can be increased, or a first element 26 with a large light-emitting surface can be provided. This allows further expansion of functions and applications. When the chip-shaped first element 26 is provided outside the frame 23, the chip-shaped first element 26 can be covered with a translucent resin, as in the sealing portion 24 described above. The first element 26 illustrated in FIG. 1 and FIG. 3 is a surface-mounted element provided outside the frame 23.

In addition, a resistor 26a may be provided that is connected in series to the first element 26. The resistor 26a may be a current limiting resistor that prevents an excessive current from flowing through the first element 26. The resistor 26a may be, for example, a surface mount resistor, a resistor with leads (metal oxide film resistor), or a film resistor formed using a screen printing method or the like. The resistor 26a illustrated in FIG. 1 and FIG. 3 is a film resistor.

FIG. 4A is a circuit diagram illustrating a case where the light emitting element 22 and the first element 26 are provided in one circuit.
FIG. 4B is a circuit diagram illustrating a case in which the light emitting element 22 and the first element 26 are provided in separate circuits.
4A and 4B show a case where one light emitting element 22 and one first element 26 are provided, and the element 25 and resistor 26a are omitted in order to avoid complication.

As shown in FIG. 4(a), when the light-emitting element 22 and the first element 26 are provided in one circuit, the light-emitting element 22 and the first element 26 can be connected in series. In this way, the light-emitting element 22 and the first element 26 can be lit by one lighting circuit. This can reduce manufacturing costs.

As shown in FIG. 4(b), if the light-emitting element 22 and the first element 26 are provided in separate circuits, the first element 26 can be turned on even when the light-emitting element 22 is turned off. This allows for a further expansion of functions and applications.

Next, the function and effect of the first element 26 will be described.
In recent years, vehicles are equipped with around monitors, in-vehicle cameras, rear monitors, side monitors, etc. These monitors and cameras are equipped with an imaging device that receives infrared rays and an irradiation device that emits infrared rays. In general, infrared rays irradiated from the irradiation device provided on the monitor or camera and reflected by an object are received by the imaging device and converted into an optical image. In this case, if the amount of infrared light reflected by the object is increased, a clearer optical image can be obtained.

The vehicle lighting device 1 according to this embodiment is provided with a first element 26, which allows the amount of infrared light irradiated to the object to be increased. This allows the amount of infrared light reflected by the object to be increased, making it possible to obtain a clearer optical image.

In addition, because infrared rays are invisible, people inside or outside the vehicle will not feel uncomfortable even if infrared rays are emitted from the vehicle lighting device 1. Furthermore, the functionality of the visible light emitted from the vehicle lighting device 1 is not impaired.

In recent years, vehicles may be equipped with vibration sensors and the like as a crime prevention measure. Therefore, when the vibration sensor or the like is turned on, infrared light can be emitted from the vehicle lighting device 1. In this way, optical images can be captured more clearly when an abnormal situation occurs. In addition, when the vibration sensor or the like is turned on, visible light and infrared light can be emitted from the vehicle lighting device 1. In this way, a clear optical image can be obtained from the irradiated infrared light, and a warning can be issued from the irradiated visible light.

Next, returning to FIG. 1 and FIG. 2, the power supply unit 30 and the heat transfer unit 40 will be described.
The power supply unit 30 includes, for example, a plurality of power supply terminals 31 and a holding unit 32 .
The power supply terminals 31 may be rod-shaped. The power supply terminals 31 may be arranged in a predetermined direction. One end of each of the power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. One end of each of the power supply terminals 31 is soldered to the wiring pattern 21a. The other end of each of the power supply terminals 31 is exposed inside the hole of the connector holder 15. The connector 105 is fitted into the power supply terminals 31 exposed inside the hole of the connector holder 15. The power supply terminals 31 are formed of a metal such as a copper alloy. The shape, arrangement, material, number, etc. of the power supply terminals 31 are not limited to those exemplified, and may be changed as appropriate.

As described above, it is preferable that the socket 10 is made of a material with high thermal conductivity. However, materials with high thermal conductivity may have electrical conductivity. For example, metals such as aluminum alloys and highly thermally conductive resins containing fillers made of carbon have electrical conductivity. Therefore, the holding portion 32 is provided to insulate the multiple power supply terminals 31 from the socket 10, which has electrical conductivity. The holding portion 32 also has the function of holding the multiple power supply terminals 31. Note that, when the socket 10 is made of a highly thermally conductive resin having insulating properties (for example, a highly thermally conductive resin containing a filler made of aluminum oxide), the holding portion 32 can be omitted. In this case, the socket 10 holds the multiple power supply terminals 31. The holding portion 32 can be made of a resin having insulating properties. The holding portion 32 can be, for example, pressed into a hole 10a provided in the socket 10 or adhered to the inner wall of the hole 10a.

The heat transfer section 40 is provided between the socket 10 and the light emitting module 20 (substrate 21). The heat transfer section 40 has, for example, a plate shape.
2, the heat transfer part 40 can be embedded in the bottom surface 11a1 of the recess 11a by insert molding. The heat transfer part 40 can also be attached to the inside of the recess that opens to the bottom surface 11a1 of the recess 11a by using an adhesive with high thermal conductivity or by using a layer of thermally conductive grease (heat dissipating grease).

The heat transfer unit 40 can be attached to the bottom surface 11a1 of the recess 11a using, for example, an adhesive with high thermal conductivity. The heat transfer unit 40 can also be attached to the bottom surface 11a1 of the recess 11a via a layer of thermally conductive grease.

The heat transfer section 40 is provided to facilitate the transfer of heat generated in the light-emitting module 20 to the socket 10. For this reason, the heat transfer section 40 is made of a material with high thermal conductivity. The heat transfer section 40 can be made of a metal such as an aluminum alloy, for example.
In addition, if the socket 10 is made of a metal such as an aluminum alloy, or if the amount of heat generated in the light-emitting module 20 is small, the heat transfer section 40 can be omitted.

Next, the second element 126 will be described.
The second element 126 is provided to provide the vehicle lighting device 1 with multiple functions and multiple purposes. A typical vehicle lighting device has a function of emitting visible light and is used for applications that use visible light. Therefore, the second element 126 is provided separately from the light-emitting element 22 to add new functions and applications to the vehicle lighting device 1.

FIG. 5 is a schematic plan view illustrating a light emitting module using the second element 126. As shown in FIG.
The second element 126 may be an element that irradiates ultrasonic waves. For example, the second element 126 may be an ultrasonic sensor. Note that the frequency of the ultrasonic waves may be, for example, 40 kHz or more and 200 kHz or less.

The second element 126 is provided on the side of the substrate 21 opposite the socket 10 side (the heat transfer section 40 side). The second element 126 can be provided on the outside of the frame section 23. The second element 126 is electrically connected to the wiring pattern 21a. At least one second element 126 can be provided.

FIG. 6A is a circuit diagram illustrating a case where the light emitting element 22 and the second element 126 are provided in one circuit.
FIG. 6B is a circuit diagram illustrating a case in which the light emitting element 22 and the second element 126 are provided in separate circuits.
6A and 6B show a case where one light emitting element 22 and one second element 126 are provided, and the element 25 is omitted, in order to avoid complication.

As shown in FIG. 6(a), when the light-emitting element 22 and the second element 126 are provided in one circuit, the light-emitting element 22 and the second element 126 can be connected in series. In this way, the light-emitting element 22 can be lit and the second element 126 can be operated by one lighting circuit. This can reduce manufacturing costs.

As shown in FIG. 6(b), if the light-emitting element 22 and the second element 126 are provided in separate circuits, the second element 126 can be operated even when the light-emitting element 22 is turned off. This allows for a further expansion of functions and applications.

Next, the function and effect of the second element 126 will be described.
As described above, the vehicle is provided with an around monitor, an in-vehicle camera, a back monitor, a side monitor, etc. Therefore, it is possible to capture an optical image of an object using these monitors and cameras, and to detect the distance to the object using the second element 126. Therefore, it is possible to grasp the object in more detail.

In addition, because ultrasonic waves are inaudible, people inside or outside the vehicle will not feel uncomfortable even if ultrasonic waves are emitted from the vehicle lighting device 1. Furthermore, the functionality of the visible light emitted from the vehicle lighting device 1 is not impaired.

As mentioned above, a vehicle may be equipped with a vibration sensor or the like as a crime prevention measure. Therefore, when the vibration sensor or the like is turned on, ultrasonic waves can be emitted from the vehicle lighting device 1. In this way, when an abnormality occurs, the optical image and the distance to the object can be known. This makes it possible to grasp the abnormality in more detail.

In the above, the cases where the first element 26 and the light-emitting element 22 are provided and the case where the second element 126 and the light-emitting element 22 are provided have been exemplified, but the first element 26, the second element 126, and the light-emitting element 22 may be provided. That is, at least one of the first element 26 and the second element 126 and the light-emitting element 22 may be provided.
For example, the light emitting module 20 can have a first circuit in which the light emitting element 22 and at least one of the first element 26 and the second element 126 are provided.
For example, the light emitting module 20 can have a second circuit in which the light emitting element 22 is provided, and a third circuit in which at least one of the first element 26 and the second element 126 is provided.

(Vehicle lighting fixtures)
Next, the vehicle lamp 100 will be illustrated.
In the following, as an example, a case where the vehicular lamp 100 is a front combination light provided on an automobile will be described. However, the vehicular lamp 100 is not limited to a front combination light provided on an automobile. The vehicular lamp 100 may be any vehicular lamp provided on an automobile, a railroad car, or the like.

FIG. 7 is a schematic partial cross-sectional view illustrating the vehicle lamp 100. As shown in FIG.
As shown in FIG. 7, the vehicle lamp 100 includes, for example, the vehicle lighting device 1, a housing 101, a cover 102, an optical element unit 103, a seal member 104, and a connector 105.

The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 is box-shaped with one end open. The housing 101 can be made of, for example, a light-opaque resin. The bottom surface of the housing 101 is provided with a mounting hole 101a into which the portion of the mounting portion 11 with the bayonet 12 is inserted. The periphery of the mounting hole 101a is provided with a recess into which the bayonet 12 provided on the mounting portion 11 is inserted. Note that although the case in which the mounting hole 101a is directly provided on the housing 101 has been exemplified, a mounting member having the mounting hole 101a may be provided on the housing 101.

When attaching the vehicle lighting device 1 to the vehicle lamp 100, the part of the mounting part 11 on which the bayonet 12 is provided is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. Then, the bayonet 12 is held in place by the fitting provided on the periphery of the mounting hole 101a. This type of attachment method is called a twist lock.

The cover 102 is provided to cover the opening of the housing 101. The cover 102 can be formed from a translucent resin or the like. The cover 102 can also have a function such as a lens. The cover 102 can transmit visible light and infrared light emitted from the light-emitting module 20. The cover 102 can also be provided with a hole or the like for transmitting the ultrasonic waves emitted from the second element 126.

Mainly, visible light emitted from the light-emitting module 20 enters the optical element unit 103. The optical element unit 103 reflects, diffuses, guides, and collects the visible light emitted from the light-emitting module 20, and forms a predetermined light distribution pattern. For example, the optical element unit 103 illustrated in FIG. 7 is a reflector. In this case, the optical element unit 103 reflects the visible light emitted from the light-emitting module 20 so that a predetermined light distribution pattern is formed.

The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 may be annular. The seal member 104 may be made of an elastic material such as rubber or silicone resin.

The connector 105 is fitted to the ends of the multiple power supply terminals 31 exposed inside the connector holder 15. The connector 105 is electrically connected to a power source, etc. The connector 105 is also provided with a ring-shaped seal member 105a. When the connector 105 is inserted into the connector holder 15, the seal member 105a seals the inside of the connector holder 15 to make it watertight.

Although several embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the gist of the invention. These embodiments and their variations are included within the scope and gist of the invention, as well as within the scope of the invention and its equivalents described in the claims. Furthermore, the above-mentioned embodiments can be implemented in combination with each other.

1 Vehicle lighting device, 10 Socket, 11 Mounting part, 20 Light emitting module, 21 Substrate, 22 Light emitting element, 26 First element, 100 Vehicle lamp, 101 Housing, Second 126 element

Claims (4)

A socket;
A light emitting module provided on one end side of the socket;
Equipped with
The light emitting module includes:
A light-emitting element capable of emitting light having a wavelength equal to or shorter than that of visible light;
An element capable of emitting ultrasonic waves;
having
When the light emitting element irradiates ultraviolet light, a fluorescent material that converts the ultraviolet light into visible light is provided . The vehicle lighting device according to claim 1 , wherein the light-emitting module includes a first circuit provided with the light-emitting element and the element capable of emitting ultrasonic waves . The vehicle lighting device according to claim 1 , wherein the light-emitting module includes a second circuit provided with the light-emitting element, and a third circuit provided with the element capable of emitting ultrasonic waves . A vehicle lighting device according to any one of claims 1 to 3;
A housing in which the vehicle lighting device is mounted;
A vehicle lamp equipped with:

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