JP7645473B2 - ACF attachment device and ACF attachment method - Google Patents

Description

The present invention relates to an ACF (Anisotropic Conductive Film) attachment device and an ACF attachment method for attaching an ACF to a substrate.

Conventionally, there are devices that attach ACF as an adhesive material for bonding components to a board. There are also devices that inspect whether the ACF has been properly attached to the board based on an image (image data) generated by a camera capturing an image of the state after this type of device has attached the ACF to the board (see, for example, Patent Document 1).

JP 2003-229453 A

In conventional devices that attach ACF to a substrate (ACF attachment devices), for example, if the ACF is not properly attached to the substrate (i.e., if it is defective), the operation of the device is stopped to prevent the substrate determined to be defective from being sent directly to subsequent processes by the device.

Here, for example, in the case of soft substrates such as flexible (film) substrates, peeling off an ACF attached to a substrate determined to be defective from the substrate can damage the substrate, such as scratching or deformation, making the damaged substrate unusable. Therefore, it is desirable to suppress the occurrence of defective substrates, which are substrates to which ACF is not properly attached.

The present invention provides an ACF attachment device that can reduce the occurrence of defective boards.

The ACF attachment device according to one aspect of the present invention includes a supply unit that supplies a tape consisting of a base layer and an ACF (Anisotropic Conductive Film) layer, a cutting unit that cuts the ACF layer of the tape supplied from the supply unit, a pressing unit that peels the cut ACF layer from the base layer and presses it onto a substrate, a light source that is supported by the base layer and irradiates illumination light onto the cutting position of the cut ACF layer, an ACF imaging unit that is supported by the base layer and images the ACF layer including the cutting position under the illumination light, and a control unit that controls the pressing unit based on an image of the ACF layer including the cutting position captured by the ACF imaging unit.

In addition, the ACF attachment method according to one aspect of the present invention includes a supplying step of supplying a tape consisting of a base layer and an ACF (Anisotropic Conductive Film) layer, a cutting step of cutting the ACF layer of the tape supplied in the supplying step, an irradiation step of irradiating an illumination light onto a cutting position of the ACF layer supported by the base layer and cut, an ACF imaging step of imaging the ACF layer supported by the base layer and including the cutting position under the illumination light, and a control step of controlling a pressure bonding unit for peeling the cut ACF layer from the base layer and bonding it to a substrate based on the image of the ACF layer including the cutting position captured in the ACF imaging step.

These comprehensive or specific aspects may be realized as a system, method, integrated circuit, computer program, or computer-readable recording medium such as a CD-ROM, or may be realized as any combination of a system, method, integrated circuit, computer program, and recording medium.

The present invention provides an ACF attachment device that can reduce the occurrence of defective boards.

FIG. 1 is a schematic front view showing an ACF joining device according to an embodiment. FIG. 2 is a side view for explaining the positional relationship between an imaging unit and a light source included in the ACF joining device according to the embodiment. FIG. 3 is a perspective view showing a substrate according to the embodiment. FIG. 4 is a diagram for explaining a first example of an image generated by imaging using an ACF imaging unit included in the ACF joining device according to the embodiment. FIG. 5 is a diagram for explaining a second example of an image generated by imaging using the ACF imaging unit included in the ACF joining device according to the embodiment. FIG. 6 is a block diagram showing a functional configuration of the ACF joining device according to the embodiment. FIG. 7 is a flowchart showing a processing procedure of the ACF joining device according to the embodiment. FIG. 8 is a side view for explaining the positional relationship between an imaging unit and a light source provided in an ACF joining device according to a modified example. FIG. 9 is a top view for explaining the positional relationship between an imaging unit and a light source included in an ACF joining device according to a modified example. FIG. 10 is a cross-sectional view for explaining a light source provided in an ACF bonding device according to a modified example.

The ACF attachment device and the like according to the embodiments of the present invention will be described in detail below with reference to the drawings. Note that each of the embodiments described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangement and connection form, steps and order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims that show the highest concept of the present invention will be described as optional components.

The figures are schematic diagrams and are not necessarily precise illustrations. In each figure, the same components are given the same reference numerals.

In addition, in this specification and the drawings, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional Cartesian coordinate system. The X-axis and Y-axis are mutually orthogonal, and are both orthogonal to the Z-axis. In addition, in the following embodiments, the X-axis may be described as the positive direction of the substrate transport direction, the positive Z-axis may be described as the upward direction, and the negative Z-axis may be described as the downward direction.

In the following embodiments, the ACF application device will be described as being viewed from the negative Y-axis direction as a front view, from the side of the X-axis direction as a side view, and from the positive Z-axis direction as a top view.

(Embodiment)
[composition]
First, the configuration of an ACF joining device according to the embodiment will be described.

Figure 1 is a schematic front view of an ACF pasting device 100 according to an embodiment. Specifically, Figure 1 is a diagram showing a specific example of the hardware configuration of the ACF pasting device 100. Figure 2 is a side view for explaining the positional relationship between the imaging unit (ACF imaging unit 170 and board imaging unit 180) and the light source (ACF light source 60 and board light source 61) provided in the ACF pasting device 100 according to an embodiment. Figure 3 is a perspective view showing a board 400 according to an embodiment.

In addition, in Figures 1 and 2, the direction in which the imaging units (ACF imaging unit 170 and board imaging unit 180) capture images is indicated by a dashed line arrow, and the direction in which the light sources (ACF light source 60 and board light source 61) irradiate illumination light (optical axis direction) is indicated by a dashed line arrow.

Also, in Figure 1, the computer 90 is illustrated as a functional block.

The ACF attachment device 100 is a device that attaches an ACF (ACF layer 310) for bonding components to a substrate 400. Specifically, the ACF attachment device 100 attaches the ACF layer 310 of the tape 300 to the substrate 400 placed on the stage 70 using a pressure bonding head 50.

The ACF attachment device 100 is, for example, part of a component mounting system for producing display panels and the like. In this component mounting system, for example, the ACF attachment device 100 attaches an ACF layer 310, which is an ACF, to an electrode portion 410 provided on a substrate 400, and a component pressure bonding device (not shown) thermocompresses the substrate 400 and the component via the ACF. The ACF attachment device 100 attaches the ACF layer 310 to the substrate 400, which has been transported from an upstream device by a substrate transport device (not shown). The substrate 400 to which the ACF layer 310 has been attached is transported by the substrate transport device (not shown) to a component pressure bonding device located downstream of the ACF attachment device 100, for example.

The tape 300 is composed of an ACF layer 310 and a base layer 320, which is a separator for supporting the ACF layer 310. The ACF layer 310 is a layer made of tape-shaped ACF. The base layer 320 is a tape-shaped film made of a resin such as polyethylene terephthalate.

The ACF attachment device 100 cuts (half-cuts) the ACF layer 310 to a predetermined size so that it remains held by the base layer 320 with the cutter 40. Furthermore, the ACF attachment device 100 peels the ACF layer 310 from the base layer 320 by sandwiching the base layer 320 with two peeling pins of the peeling unit 30 and moving them in the negative direction of the X-axis. Furthermore, the ACF attachment device 100 generates an image (image data) by capturing an image of the alignment mark 420 of the substrate 400 with the substrate imaging unit 180 while irradiating the substrate 400 with illumination light from the substrate light source 61, and adjusts the position of the substrate 400 placed on the stage 70 by adjusting the position of the stage 70 based on the image, and attaches the piece 311, which is the ACF layer 310 cut to a predetermined size, to the substrate 400 with the pressure bonding head 50.

An example of the substrate 400 is a film-like flexible substrate made of resin or the like. The substrate 400 may also be a rigid substrate such as a glass substrate.

Examples of components that can be attached to the substrate 400 via the ACF layer 310 include electronic components such as ICs (Integrated Circuits), TCPs (Tape Carrier Packages), and FPCs (Flexible Printed Circuits).

As shown in FIG. 1, the ACF application device 100 includes a reel 10, a tape support unit 20, a feed roller 21, a peeling unit 30, a cutter 40, a bonding head 50, an ACF light source 60, a substrate light source 61, a stage 70, a backup stage 80, an ACF imaging unit 170, and a substrate imaging unit 180.

Although not shown, these components are supported by a drive mechanism for driving (moving) the components such as guides and motors, and by support members for fixing their positions.

In addition, these components, or the drive mechanism for driving these components, are communicatively connected to a computer 90 provided in the ACF attachment device 100 via wireless or control lines, etc., and are controlled by the computer 90 to perform the specified operations.

The computer 90 controls each of the components of the ACF pasting device 100. The computer 90 is realized, for example, by a communication interface for communicating with each of the components of the ACF pasting device 100, a non-volatile memory in which a program is stored, a volatile memory that is a temporary storage area for executing the program, an input/output port for sending and receiving signals, a processor for executing the program, etc.

The reel 10 is a reel that stores the tape 300 and supplies the stored tape 300. One end of the tape 300 is connected to the feed roller 21, and the tape 300 is wound up and supplied below the crimping head 50 as the feed roller 21 rotates.

The tape support section 20 is a support member that supports the tape 300 located between the reel 10 and the feed roller 21.

The feed roller 21 is a storage section that is rotated by a motor (not shown) to wind up the tape 300.

The peeling unit 30 is a mechanism for peeling the ACF layer 310 from the base layer 320. The peeling unit 30 has, for example, two peeling pins and a drive mechanism for driving the two peeling pins. The peeling unit 30, for example, sandwiches the base layer 320 and moves it in the negative direction of the X-axis to peel the ACF layer 310 from the base layer 320. Specifically, after the piece 311 is attached to the substrate 400 by the pressure bonding head 50, the peeling unit 30 sandwiches the base layer 320 with the two peeling pins and moves the two peeling pins in the negative direction of the X-axis. As a result, the peeling pins enter between the base layer 320 and the ACF layer 310 (piece 311) in contact with the substrate 400, and the piece 311 in contact with the substrate 400 can be peeled off from the base layer 320.

The cutter 40 is a blade that cuts the ACF layer 310 supported by the base layer 320. For example, the cutter 40 cuts the ACF layer 310 by moving up and down as a drive mechanism having a guide and a motor (not shown) driven by the computer 90. Specifically, the cutter 40 does not cut the base layer 320, but cuts the ACF layer 310, that is, by half-cutting, to form a piece 311 that is the cut ACF layer 310. As a result, the ACF layer 310 is cut to a predetermined size by the cutter 40 and moved by the feed roller 21 to below the crimping head 50 and above the backup stage 80 while being supported by the base layer 320.

The cutter 40, for example, clamps the tape 300 from above and below, and cuts only the ACF layer 310 out of the ACF layer 310 and the base layer 320, but the components located above the tape 300 are not shown in each figure.

The bonding head 50 is a head that bonds the ACF layer 310 (more specifically, the slice 311) to the substrate 400. For example, the bonding head 50 is moved up and down by a drive mechanism having a guide and a motor (not shown) driven by the computer 90, thereby bonding the ACF layer 310 (more specifically, the slice 311) to the substrate 400.

The stage 70 is a base on which the substrate 400 is placed. Specifically, the stage 70 holds the substrate 400 in a state where it does not overlap the edge of the substrate 400 when viewed from above (i.e., the end of the substrate 400 protrudes). The stage 70 is, for example, a three-axis stage that is controlled by the computer 90 and can move in the X, Y, and Z directions.

The backup stage 80 is a base that supports the edge of the substrate 400 placed on the stage 70. The backup stage 80 is, for example, a one-axis stage that is controlled by the computer 90 and can move in the Z direction.

The substrate light source 61 is a light source that irradiates illumination light onto the substrate 400 placed on the stage 70. The substrate light source 61 irradiates illumination light toward the substrate 400, for example, from below.

The substrate imaging unit 180 is a camera that captures an image of the substrate 400 placed on the stage 70. Specifically, the substrate imaging unit 180 captures an image of the alignment mark 420 on the substrate 400 to generate an image (image data) including the alignment mark 420. The substrate imaging unit 180 captures an image of the substrate 400 from above, for example.

As shown in FIG. 2, the substrate light source 61 and the substrate imaging unit 180 are disposed opposite each other. The edge of the substrate 400 that protrudes from the stage 70 is disposed between the substrate light source 61 and the substrate imaging unit 180. The substrate light source 61 irradiates illumination light from below the substrate 400 toward the edge of the substrate 400. The substrate 400 has, for example, translucency that allows the illumination light to pass through. The substrate imaging unit 180 detects the illumination light that has passed through the substrate 400, thereby imaging the alignment mark on the substrate 400.

The light source used for the board light source 61 is, for example, an LED (Light Emitting Diode), but any light source such as a fluorescent lamp or a light bulb may be used.

The ACF light source 60 is a light source that irradiates illumination light onto the ACF layer 310 of the tape 300. Specifically, the ACF light source 60 irradiates illumination light toward the cutting position 500 shown in FIG. 1.

The cutting position 500 is the position in the ACF layer 310 that is cut by the cutter 40.

The ACF light source 60 irradiates illumination light, for example, from below the ACF layer 310 toward the cutting position 500. Specifically, for example, the ACF light source 60 irradiates illumination light, for example, from below the ACF layer 310 and in a direction intersecting the vertical direction (the Z-axis direction in this embodiment), in other words, from a direction intersecting the normal direction of the ACF layer 310, toward the cutting position 500. In other words, the ACF light source 60 irradiates illumination light from diagonally below the ACF layer 310.

The normal direction of the ACF layer 310 refers to the direction of the normal to either the surface of the ACF layer 310 that is pressed against the substrate 400 or the surface opposite to that surface.

The ACF imaging unit 170 is a camera that images the cutting position 500 and the ACF layer 310 in the vicinity of the cutting position 500. The ACF imaging unit 170 images the cutting position 500, for example, from below the ACF layer 310. Specifically, for example, the ACF imaging unit 170 images the cutting position 500 from below the ACF layer 310 and in a direction that intersects with the vertical direction (the Z-axis direction in this embodiment), in other words, from a direction that intersects with the normal direction of the ACF layer 310. In other words, the ACF imaging unit 170 images the ACF layer 310 from diagonally below.

Figure 4 is a diagram for explaining a first example of an image generated by imaging by the ACF imaging unit 170 provided in the ACF pasting device 100 according to the embodiment. Specifically, (a) of Figure 4 is a diagram for explaining a first example of how the ACF imaging unit 170 provided in the ACF pasting device 100 according to the embodiment captures an image, and (b) of Figure 4 is a diagram that shows a schematic example of an image generated by imaging by the ACF imaging unit 170 in the state shown in (a) of Figure 4.

In addition, in FIG. 4 and FIG. 5 described later, the direction in which the imaging unit (ACF imaging unit 170) captures images is indicated by a dashed arrow.

As shown in FIG. 4(a), for example, the ACF imaging unit 170 images the cutting position 500 of the ACF layer 310 from below the tape 300.

Here, as shown in FIG. 4B, if the ACF layer 310 is not cut properly, the ACF layer 310 may peel off from the base layer 320, forming a defective portion 330. If the ACF layer 310 is attached to the substrate 400 in such a state that the defective portion 330 is formed, the component may not be properly attached to the substrate 400 via the ACF layer 310. Therefore, the ACF layer 310 is peeled off from the substrate 400 to which the ACF layer 310 with the defective portion 330 is attached (i.e., the defective substrate), and the ACF layer 310 is attached again. However, if the substrate 400 is, for example, a substrate that is easily deformed or scratched, such as a flexible substrate as described above, damage such as deformation or scratches may occur when the ACF layer 310 is peeled off, making it impossible to reuse the substrate.

Therefore, before bonding the ACF layer 310 to the substrate 400, the ACF bonding device 100 judges whether the cut shape of the ACF layer 310 is good or bad (e.g., whether there is a defective part 330 or not) based on an image generated by imaging the cutting position 500, and performs a process of bonding the ACF layer 310 to the substrate 400 based on the judgment result. In this way, the ACF bonding device 100 prevents the generation (manufacturing) of defective substrates.

Figure 5 is a diagram for explaining a second example of an image generated by imaging by the ACF imaging unit 170 provided in the ACF pasting device 100 according to the embodiment. Specifically, (a) of Figure 5 is a diagram for explaining a second example of how the ACF imaging unit 170 provided in the ACF pasting device 100 according to the embodiment captures an image, and (b) of Figure 5 is a diagram that shows a schematic example of an image generated by imaging by the ACF imaging unit 170 in the state shown in (a) of Figure 5.

Note that FIG. 5(a) shows a state in which, for example, the tape 300 is moved by the feed roller 21 from the state shown in FIG. 4(a) and then the ACF layer 310 is cut by the cutter 40 to form a slice 311.

As shown in FIG. 5(a), for example, the ACF imaging unit 170 images the cutting position 500 of the ACF layer 310 from below the tape 300. As shown in FIG. 4(a) and FIG. 5(a), for example, the ACF application device 100 uses the ACF imaging unit 170 to image the ACF layer 310 each time it is cut, and judges whether both ends of the piece 311 to be applied to the substrate 400 (for example, both ends in the extending direction of the tape 300) are good or bad (i.e., whether the cut shape of the piece 311 is good or bad).

If the cut shape of the piece 311 is good, that is, if there are no defective parts 330, 331 such as curling at either end of the piece 311, the ACF application device 100 applies the piece 311 to the substrate 400. On the other hand, if the piece 311 is defective, that is, if there are defective parts 330, 331, the ACF application device 100 does not apply the ACF layer 310 to the substrate 400. If the piece 311 is defective, the ACF application device 100 applies the piece 311 to a member other than the substrate 400, such as a jig, or does not apply the defective piece 311 and sends it directly using the feed roller 21.

The state in which segment 311 is determined to be defective may be set arbitrarily in advance, and is not particularly limited. For example, segment 311 may be determined to be defective when it is turned up, as in defective portion 330. Alternatively, segment 311 may be determined to be defective when it is torn (e.g., chipped). Alternatively, segment 311 may be determined to be defective when the length in the X-axis direction of segment 311 is outside a specified range.

For example, the computer 90 determines whether the cut portion of the ACF layer 310 is a straight line, and if it is determined that the cut portion is a straight line, it determines the ACF layer 310 (more specifically, the segment 311) as good, and if it is determined that the cut portion is not a straight line, it determines that the ACF layer 310 is bad. For example, the computer 90 may store appropriate image data for determining that the ACF layer 310 is good or bad by comparing the appropriate image data with the image data generated by the ACF imaging unit 170. In addition, whether the length of the segment 311 in the X-axis direction is outside the specified range may be determined based on, for example, the amount of deviation from the reference position of the cut position between the segment 311 and the subsequent ACF layer 310 in (b) of FIG. 5.

As shown in FIG. 2, for example, the ACF light source 60 is located on the opposite side of the ACF imaging unit 170 with respect to the backup stage 80 and the bonding head 50 in the supply direction of the tape 300 (in this embodiment, the X-axis direction) and in the direction intersecting the vertical direction (in this embodiment, the Y-axis direction). This makes it easier for the reflected light of the ACF layer 310 irradiated from the ACF light source 60 to be incident on the ACF imaging unit 170.

The light source used for the ACF light source 60 is, for example, an LED, but any light source such as a fluorescent lamp or a light bulb may be used.

Next, we will explain the characteristic functional configuration of the ACF attachment device 100 that has the above hardware configuration.

Figure 6 is a block diagram showing the functional configuration of the ACF pasting device 100 according to the embodiment.

The ACF attachment device 100 includes a supply unit 110, a cutting unit 120, a crimping unit 130, a determination unit 140, a control unit 150, a board holding unit 160, an ACF imaging unit 170, a board imaging unit 180, a light source 190, and a memory unit 200.

The supply unit 110 is a mechanism for supplying the tape 300 consisting of the base layer 320 and the ACF layer 310. Specifically, the supply unit 110 supplies the tape 300 below the bonding unit 130 (more specifically, the bonding head 50). The supply unit 110 is realized, for example, by the reel 10, the tape support unit 20, the feed roller 21, and a motor (not shown) that rotates the feed roller 21.

The cutting unit 120 is a mechanism that cuts the ACF layer 310 of the tape 300 supplied from the supply unit 110. Specifically, the cutting unit 120 cuts only the ACF layer 310 of the ACF layer 310 and the base layer 320 of the tape 300. The cutting unit 120 is realized, for example, by a cutter 40 and a drive mechanism having a guide and a motor (not shown) that move the cutter 40 up and down.

The bonding unit 130 is a mechanism for peeling the cut ACF layer 310 (i.e., the piece 311) from the base material layer 320 and bonding it to the substrate 400. The bonding unit 130 is realized, for example, by a bonding head 50, a drive mechanism having a guide and a motor (not shown) for moving the bonding head 50 up and down, and a peeling unit 30.

The light source 190 is a light source that is supported by the base layer 320 and irradiates illumination light onto the cutting position 500 of the cut ACF layer 310. The light source 190 has, for example, an ACF light source 60.

In addition, in this embodiment, the light source 190 is disposed below the board imaging unit 180, facing the board imaging unit 180, and irradiates illumination light onto the edge of the board 400 from below the board 400. For example, the light source 190 has a board light source 61 in addition to the ACF light source 60. That is, the light source 190 is realized, for example, by the ACF light source 60 and the board light source 61.

Also, for example, the light source 190 (more specifically, the ACF light source 60) is disposed at a position where it irradiates the cutting position 500 with illumination light from a direction intersecting with the normal direction of the ACF layer 310 (the Z-axis direction in this embodiment). Alternatively, for example, the ACF light source 60 is disposed at a position where it irradiates the cutting position 500 with illumination light from a direction intersecting with the direction in which the cutting unit 120 cuts the ACF layer 310. Alternatively, for example, the ACF light source 60 is disposed at a position where it irradiates the cutting position 500 with illumination light from a direction intersecting with the direction in which the bonding head 50 crimps the ACF layer 310 to the substrate 400.

The ACF imaging unit 170 is a camera that captures an image of the ACF layer 310, which is supported by the base layer 320 and includes the cutting position 500, under illumination light irradiated by the light source 190.

The substrate holding unit 160 is a base that holds the substrate 400 having the alignment mark 420 on its edge without overlapping the edge when viewed from above. The substrate holding unit 160 is configured to be freely movable in the X, Y and Z axis directions, for example, under the control of the control unit 150. The substrate holding unit 160 is realized, for example, by a stage 70.

The substrate imaging unit 180 is a camera that captures an image of the alignment mark 420 on the substrate 400 held by the substrate holding unit 160 using transmitted light that is irradiated from a light source 190 (e.g., substrate light source 61) and passes through the edge of the substrate 400.

The determination unit 140 is a processing unit that determines whether the cut shape of the cut ACF layer 310 is good or bad based on an image of the ACF layer 310 including the cutting position 500 captured by the ACF imaging unit 170. For example, the determination unit 140 determines whether or not there is any curling, chipping, etc. at both ends of the cut ACF layer 310. For example, the determination unit 140 determines whether or not there is any curling, chipping, etc. at both ends of the cut ACF layer 310 based on whether or not both ends of the ACF layer 310 in the image are straight lines. For example, if there is no curling, chipping, etc. at both ends of the cut ACF layer 310, the determination unit 140 determines that the cut shape of the cut ACF layer 310 is good, and if there is curling, chipping, etc., the determination unit 140 determines that the cut shape of the cut ACF layer 310 is bad.

Alternatively, the determination unit 140 may determine whether the length of the segment 311 (in this embodiment, the length in the X-axis direction) is within a specified range (i.e., whether it is within the specified range or outside the preset range) as a determination of the quality of the cut shape of the cut ACF layer 310. For example, if the length of the segment 311 is within the specified range, the determination unit 140 determines the ACF layer 310 (more specifically, the segment 311) as good, and if the length of the segment 311 is determined to be outside the specified range, the determination unit 140 determines the ACF layer 310 as bad. For example, if the deviation amount of the cut position between the segment 311 and the ACF layer 310 following the segment 311 from a predetermined reference position as shown in (b) of FIG. 5 is less than a predetermined deviation amount, the determination unit 140 determines that the length of the segment 311 is within the specified range, and if the deviation amount is equal to or greater than the predetermined deviation amount, the determination unit 140 determines that the length of the segment 311 is outside the specified range.

The determination unit 140 may determine whether the cut shape of one end of the cut ACF layer 310 is good or bad. Alternatively, the determination unit 140 may determine whether the cut shape of one end of the cut ACF layer 310 is good or bad, and if it is determined to be good, may further determine whether the cut shape of the other end is good or bad.

The determination unit 140 is realized, for example, by a processor such as a CPU (Central Processing Unit) of the computer 90 and a control program stored in a memory or the like of the computer 90 and executed by the processor.

The control unit 150 is a processing unit that controls the operation and operation timing of each component of the ACF pasting device 100, such as the supply unit 110, the cutting unit 120, the pressing unit 130, the substrate holding unit 160, the ACF imaging unit 170, the substrate imaging unit 180, and the light source 190. The control unit 150 also controls the pressing unit 130 based on an image of the ACF layer 310 including the cutting position captured by the ACF imaging unit 170 (i.e., an image generated by the ACF imaging unit 170 by capturing the cutting position 500). Specifically, for example, when the judgment result of the cut shape of the cut ACF layer 310 by the judgment unit 140 is good, the control unit 150 causes the pressing unit 130 to peel the cut ACF layer 310 from the base layer 320 and press (also referred to as pasting or affixing) it to the substrate 400. On the other hand, when the judgment result of the judgment unit 140 is bad, the control unit 150 does not cause the bonding unit 130 to press the cut ACF layer 310 onto the substrate 400. In this case, for example, the control unit 150 does not cause the bonding unit 130 to press the cut ACF layer 310 onto the substrate 400, but drives a stage or the like on which members such as jigs other than the substrate 400 are arranged to be positioned below the bonding unit 130 (more specifically, the bonding head 50), and controls the bonding unit 130 to press the cut ACF layer 310 whose cut shape is judged to be bad onto the member.

The control unit 150 is realized, for example, by a processor such as a CPU possessed by the computer 90, a control program stored in a memory possessed by the computer 90 and executed by the processor, and a communication interface for communicating with the cutting unit 120, the crimping unit 130, etc.

The memory unit 200 is a storage device that stores various data indicating the size of the substrate 400, the attachment position and attachment direction of the cut ACF layer 310, the operation of each component, the timing of the operation, the timing of transferring the substrate 400 to a component pressure bonding device or the like located downstream of the ACF attachment device 100, control programs executed by the judgment unit 140 and the control unit 150, etc., appropriate information used by the judgment unit 140 to judge the quality of the cut shape of the cut ACF layer 310 (for example, the above-mentioned image data used by the judgment unit 140 to judge the quality of the cut shape of the ACF layer 310, information indicating a specified range of the length of the slice 311, information indicating the reference position of the cut position, information for judging the quality of the cut shape based on the deviation amount of the cut position from the reference position (for example, the above-mentioned predetermined deviation amount) and other threshold information). The memory unit 200 is realized, for example, by a flash memory, a HDD (Hard Disk Drive), etc.

[Processing Procedure]
Next, a process procedure of the ACF joining device 100 according to the embodiment will be described in detail.

Figure 7 is a flowchart showing the processing steps of the ACF attachment device 100 according to the embodiment.

First, the control unit 150 controls the supply unit 110 to cause the supply unit 110 to supply the tape 300 (S101). For example, the control unit 150 controls the feed roller 21 to move the tape 300 in the positive direction of the X-axis from the state of the tape 300 shown in FIG. 4(a). Note that the following description will be given assuming that the cut state of the end of the ACF layer 310 on the positive side of the X-axis is good.

Next, the control unit 150 controls the cutting unit 120 to cut the ACF layer 310 (S102). Specifically, the control unit 150 causes the cutting unit 120 to cut only the ACF layer 310 out of the ACF layer 310 and the base layer 320 of the tape 300.

Next, the control unit 150 controls the light source 190 to irradiate illumination light onto the cutting position 500 of the ACF layer 310 (S103). Specifically, the control unit 150 causes the ACF light source 60 to irradiate illumination light onto the cutting position 500 of the ACF layer 310.

Next, the control unit 150 controls the ACF imaging unit 170 to image the cutting position 500 of the ACF layer 310 while the light source 190 is irradiating the cutting position 500 of the ACF layer 310 with illumination light (S104). Specifically, the control unit 150 causes the ACF imaging unit 170 to image the cutting position 500 of the ACF layer 310, thereby causing the ACF imaging unit 170 to generate an image including the cutting position of the ACF layer 310.

Next, the judgment unit 140 judges whether the cut shape of the cut ACF layer 310 is good or bad based on the image of the ACF layer 310 including the cutting position 500 captured by the ACF imaging unit 170 (S105).

When the determination unit 140 determines that the cut shape of the cut ACF layer 310 is good (Yes in S105), the control unit 150 controls the supply unit 110 to move the cut ACF layer 310 below the bonding unit 130 (more specifically, the bonding head 50) and causes the substrate holding unit 160 to hold the substrate 400 (S106). For example, the control unit 150 controls a substrate transport unit (not shown) that transports the substrate 400 to cause the substrate holding unit 160 to hold the substrate 400.

Next, the control unit 150 controls the light source 190 to irradiate illumination light onto the substrate 400 placed on the substrate holding unit 160 (S107). Specifically, the control unit 150 causes the substrate light source 61 to irradiate illumination light onto the alignment mark 420 of the substrate 400 placed on the substrate holding unit 160.

Next, the control unit 150 controls the board imaging unit 180 to image the alignment mark 420 while the light source 190 is irradiating the alignment mark 420 with illumination light (S108). Specifically, the control unit 150 causes the board imaging unit 180 to image the alignment mark 420, thereby causing the board imaging unit 180 to generate an image including the alignment mark 420.

Next, the control unit 150 controls the substrate holding unit 160 based on the image including the alignment mark 420 generated by the substrate imaging unit 180 to move the substrate 400 so that the edge of the substrate 400 is positioned above the backup stage 80, that is, below the bonding unit 130 (more specifically, the bonding head 50) (S109).

Next, the control unit 150 controls the bonding unit 130 to cause the bonding unit 130 to bond (in other words, attach) the cut ACF layer 310 to the substrate 400 (S110). For example, the control unit 150 lowers the bonding head 50 to attach the cut ACF layer 310 to the substrate 400. Furthermore, the control unit 150 raises the bonding head 50. Furthermore, the control unit 150 controls the peeling unit 30 to move the two peeling pins sandwiching the base layer 320 in the negative direction of the X-axis, thereby peeling the cut ACF layer 310 from the base layer 320. As a result, the cut ACF layer 310 is peeled off from the base layer 320 and attached to the substrate 400.

If the determination unit 140 determines that the cut shape of the cut ACF layer 310 is defective (No in S105), the control unit 150 discards the cut ACF layer 310 (piece 311) without attaching it to the substrate 400 (S111). For example, the control unit 150 drives a stage or the like on which members such as jigs other than the substrate 400 are arranged to place it below the bonding unit 130 (more specifically, the bonding head 50), and controls the bonding unit 130 to bond the cut ACF layer 310 whose cut shape is determined to be defective to the member, thereby discarding the cut ACF layer 310. Alternatively, for example, the control unit 150 rotates the feed roller 21 without attaching the cut ACF layer 310 to the substrate 400, and moves it, for example, toward the positive X-axis direction shown in FIG. 1.

Note that the process in step S106 in which the control unit 150 causes the substrate holding unit 160 to hold the substrate 400 may be performed before S101, or may be performed between steps S101 and S105.

Furthermore, steps S107 and S108 may be executed after step S106.

[Modification]
In the above, the ACF light source 60 and the substrate light source 61 are realized as different light sources, but the ACF light source 60 and the substrate light source 61 may be realized as a single light source.

Figure 8 is a side view for explaining the positional relationship between the imaging section (ACF imaging section 170 and board imaging section 180) and the light source (shared light source 62) provided in the ACF bonding device according to the modified example. Figure 9 is a top view for explaining the positional relationship between the imaging section (ACF imaging section 170 and board imaging section 180) and the light source (shared light source 62) provided in the ACF bonding device according to the modified example.

The ACF application device according to the modified example is similar to the ACF application device 100 except for the specific configuration of the light source 190.

In addition, in FIG. 8, the direction in which the imaging units (ACF imaging unit 170 and board imaging unit 180) capture images is indicated by a dashed-dotted arrow, the direction in which the light source (shared light source 62) irradiates illumination light (optical axis direction) is indicated by a dashed-dotted arrow, and the illumination range of the illumination light is indicated by a dashed-dotted line. The illumination range is, for example, a range that is 1/2 the maximum intensity of the illumination light.

In addition, in FIG. 9, the electrode portion 410 and alignment mark 420 of the substrate 400 are omitted from the illustration.

Also, in Figure 9, the location of the crimping head 50 is shown by a dashed line.

As shown in FIG. 8, the shared light source 62 is a light source that irradiates the substrate 400 (more specifically, the edge of the substrate 400) with illumination light from below the substrate 400. The shared light source 62 is disposed below the substrate imaging unit 180, facing the substrate imaging unit 180. The substrate imaging unit 180 images the alignment mark 420 of the substrate 400 held by the substrate holding unit 160 using transmitted light that is irradiated from the shared light source 62 and passes through the edge of the substrate 400.

The shared light source 62 also irradiates illumination light onto the cutting position 500 of the ACF layer 310. For example, the shared light source 62 is positioned so that the ACF layer 310 is located within the irradiation range of the illumination light irradiated by the shared light source 62.

As a result, the shared light source 62 functions as a light source 60 for the ACF and also as a light source 61 for the substrate.

Figure 10 is a cross-sectional view for explaining a light source (shared light source 62) provided in an ACF attachment device according to a modified example. Note that, among the components provided in the shared light source 62, Figure 10 shows a cross section of only the holder 64 and the polarizing film 65.

In addition, in FIG. 10, the optical axis of the illumination light emitted by the shared light source 62 is indicated by a dashed line, and the illumination range of the illumination light is indicated by a two-dot chain line.

The shared light source 62 includes an LED light source 63, a holder 64, and a polarizing film 65.

The LED light source 63 is a light source having an LED that emits illumination light. A holder 64 is attached to the illumination port of the LED light source 63 through which the illumination light is emitted.

The holder 64 is a cylindrical body that guides the illumination light emitted from the LED light source 63. The holder 64 may be formed using any material, such as metal or resin. The inner surface of the holder 64 may be provided with a material that has a high reflectance to the illumination light (e.g., a reflectance of 90% or more). For example, the holder 64 may be realized by a cylindrical body formed of resin, metal, etc., and a film that is provided on the inner surface of the cylindrical body and has a high reflectance to the illumination light.

An LED light source 63 is attached to one end of the holder 64, and a polarizing film 65 is attached to the other end.

The polarizing film 65 is disposed at the other end of the holder 64, and is a film for widening the viewing angle (light distribution angle) of the illumination light irradiated from the other end. The material used for the polarizing film 65 is not particularly limited as long as it has the function of widening the viewing angle (light distribution angle) of the illumination light. The polarizing film 65 has, for example, a film-like rubber body in which fine silicone rubber strips are arranged parallel to each other in transparent silicone rubber, and a film-like polycarbonate body disposed on both sides of the rubber body.

Generally, the light emitted from an LED often has a narrow angle distribution, unlike light from fluorescent lamps and the like. Therefore, by widening the distribution angle of the illumination light emitted from the LED light source 63 by the polarizing film 65, the shared light source 62 can irradiate the illumination light onto the substrate 400 and also onto the ACF layer 310.

[Effects, etc.]
As described above, the ACF application device 100 according to the embodiment includes a supply unit 110 that supplies the tape 300 composed of the base layer 320 and the ACF layer 310, a cutting unit 120 that cuts the ACF layer 310 of the tape 300 supplied from the supply unit 110, a pressing unit 130 that peels the cut ACF layer 310 (e.g., piece 311) from the base layer 320 and presses it onto the substrate 400, a light source 190 (e.g., ACF light source 60) that is supported by the base layer 320 and irradiates illumination light onto a cutting position 500 of the cut ACF layer 310, an ACF imaging unit 170 that is supported by the base layer 320 and images the ACF layer 310 including the cutting position 500 under the illumination light, and a control unit 150 that controls the pressing unit 130 based on an image of the ACF layer 310 including the cutting position 500 imaged by the ACF imaging unit 170.

Accordingly, since the ACF imaging unit 170 can image the cutting position 500 while irradiating the ACF layer 310 with illumination light by the light source 190, even if the contrast between the ACF layer 310 and the base layer 320 is low, the ACF imaging unit 170 can generate a high-definition image showing the cut shape of the cut ACF layer 310. Therefore, based on such a high-definition image, the control unit 150 can accurately control the bonding unit 130, for example, to cause the bonding unit 130 to bond the cut ACF layer 310 to the substrate 400, or to bond the cut ACF layer 310 to a member other than the substrate 400 if the cut ACF layer 310 is defective. Therefore, the ACF pasting device 100 can suppress the occurrence of defective substrates.

For example, the ACF attachment device 100 further includes a judgment unit 140 that judges whether the cut shape of the cut ACF layer 310 is good or bad based on an image of the ACF layer 310 including the cut position 500 captured by the ACF imaging unit 170. In this case, for example, if the judgment result of the cut shape by the judgment unit 140 is good, the control unit 150 causes the bonding unit 130 to peel the cut ACF layer 310 from the base layer 320 and press it onto the substrate 400, and if the judgment result is bad, the control unit 150 does not cause the bonding unit 130 to press the cut ACF layer 310 onto the substrate 400.

Accordingly, if the cut ACF layer 310 is defective based on the determination result of the determination unit 140, the control unit 150 can appropriately discard the cut ACF layer 310 without pressing it against the substrate 400. This further reduces the occurrence of defective substrates. Also, as described above, the ACF imaging unit 170 can generate a high-resolution image showing the cut shape of the cut ACF layer 310. Therefore, the determination unit 140 can accurately determine whether the cut shape is good or bad because it determines whether the cut shape is good or bad based on such a high-resolution image.

Also, for example, the ACF bonding device 100 further includes a substrate holding unit 160 that holds a substrate 400 having an alignment mark 420 on its edge in a state where the substrate 400 does not overlap the edge when viewed from above, and a substrate imaging unit 180 that images the alignment mark 420 of the substrate 400 held by the substrate holding unit 160 from above. In this case, for example, the light source 190 (e.g., the shared light source 62) is disposed below the substrate imaging unit 180 and facing the substrate imaging unit 180. Also, for example, the substrate imaging unit 180 images the alignment mark 420 of the substrate 400 held by the substrate holding unit 160 by using transmitted light irradiated from the light source 190 and transmitted through the edge.

In other words, the light source 190 may be realized by a single light source that functions as the ACF light source 60 and the board light source 61, like the shared light source 62. This simplifies the configuration of the ACF attachment device 100 compared to the case where multiple light sources are used.

Also, for example, the light source 190 (e.g., the ACF light source 60 or the shared light source 62) is positioned so as to irradiate illumination light onto the cutting position 500 from a direction intersecting the normal direction of the ACF layer 310.

Directly below the tape 300, components of the ACF attachment device 100, such as the backup stage 80, are often arranged. Furthermore, for example, the backup stage 80 often has a heating section such as a heater, and in such a case, it is difficult to make it translucent to transmit the illumination light. Therefore, by arranging the light source 190 so that the illumination light is irradiated to the cutting position 500 in a direction intersecting the normal direction of the ACF layer 310, that is, from an oblique direction, the illumination light can be appropriately irradiated to the cutting position 500 without being obstructed by the components of the ACF attachment device 100. In addition, by irradiating the illumination light from an oblique direction, the difference in light intensity due to the irradiation position of the illumination light can be suppressed compared to when the illumination light is irradiated directly below, so that the ACF imaging unit 170 can generate a high-definition image showing the cut shape of the cut ACF layer 310.

The ACF attachment method according to the embodiment includes a supply step (S101) of supplying a tape 300 consisting of a base layer 320 and an ACF layer, a cutting step (S102) of cutting the ACF layer 310 of the tape 300 supplied in the supply step, an irradiation step (S103) of irradiating the cutting position 500 of the cut ACF layer 310 supported by the base layer 320 with illumination light, an ACF imaging step (S104) of imaging the ACF layer 310 supported by the base layer 320 and including the cutting position 500 under illumination light, and a control step (e.g., S105 or S111) of controlling the pressure bonding unit 130 to peel the cut ACF layer 310 from the base layer 320 and pressure bond it to the substrate 400 based on the image of the ACF layer 310 including the cutting position captured in the ACF imaging step.

This provides the same effect as the ACF attachment device 100.

(Other embodiments)
Although the ACF joining device and the like according to the present embodiment have been described above based on the above embodiment, the present invention is not limited to the above embodiment.

For example, all or part of the components of the processing unit, such as the determination unit and control unit, of the ACF application device may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit, such as a CPU or processor, reading and executing a software program recorded on a recording medium, such as a HDD or semiconductor memory.

The components of the processing unit of the ACF application device may be composed of one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

The one or more electronic circuits may include, for example, a semiconductor device, an IC, or an LSI (Large Scale Integration). The IC or LSI may be integrated into one chip or into multiple chips. Here, we refer to it as an IC or LSI, but depending on the degree of integration, it may be called a system LSI, a VLSI (Very Large Scale Integration), or an ULSI (Ultra Large Scale Integration). Also, an FPGA (Field Programmable Gate Array) that is programmed after the LSI is manufactured can be used for the same purpose.

The present invention can be realized not only as an ACF pasting device, but also as a program including, as steps, the processes performed by each component of the ACF pasting device, and a computer-readable recording medium such as a DVD (Digital Versatile Disc) on which the program is recorded. In other words, the above-mentioned comprehensive or specific aspects may be realized as a system, device, integrated circuit, computer program, or computer-readable non-transitory recording medium, or as any combination of a system, device, integrated circuit, computer program, and recording medium.

In addition, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art may conceive, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope of the spirit of the present invention.

The ACF attachment device according to the present invention can be used as an ACF attachment device that attaches ACF to a substrate and is provided in mounting devices that manufacture display panels.

REFERENCE SIGNS LIST 10 reel 20 tape support section 21 feed roller 30 peeling section 40 cutter 50 pressure bonding head 60 ACF light source 61 substrate light source 62 shared light source 63 LED light source 64 holder 65 polarizing film 70 stage 80 backup stage 90 computer 100 ACF bonding device 110 supply section 120 cutting section 130 pressure bonding section 140 judgment section 150 control section 160 substrate holding section 170 ACF imaging section 180 substrate imaging section 190 light source 200 memory section 300 tape 310 ACF layer 311 section 320 substrate layer 330, 331 defective section 400 substrate 410 electrode section 420 alignment mark 500 cutting position

Claims (4)

a supply unit that supplies a tape including a base layer and an ACF (Anisotropic Conductive Film) layer;
a cutting unit that cuts the ACF layer of the tape supplied from the supply unit;
a pressure-bonding unit for peeling the cut ACF layer from the base layer and pressure-bonding the ACF layer to a substrate;
a light source that irradiates illumination light onto a cutting position of the ACF layer that is supported by the base layer and cut;
an ACF imaging unit that is supported by the base layer and images the ACF layer including the cutting position under the illumination light;
A control unit that controls the pressure bonding unit based on an image of the ACF layer including the cutting position captured by the ACF imaging unit;
a substrate holder that holds the substrate having an alignment mark on an edge portion in a state where the substrate does not overlap with the edge portion in a top view;
a substrate imaging unit configured to image, from above, the alignment mark of the substrate held by the substrate holding unit,
the light source is disposed below the board imaging unit and facing the board imaging unit,
the substrate imaging unit images the alignment mark of the substrate held by the substrate holding unit using transmitted light that is irradiated from the light source and passes through the edge portion;
ACF application device. Further, a determination unit is provided that determines whether or not a cut shape of the cut ACF layer is good based on an image of the ACF layer including the cutting position captured by the ACF imaging unit,
The control unit is
When the judgment result of the cut shape by the judgment unit is good, the pressure-bonding unit is caused to peel the cut ACF layer from the base material layer and pressure-bond the ACF layer to the substrate,
If the judgment result is bad, the pressure bonding unit does not press the cut ACF layer onto the substrate.
The ACF joining device according to claim 1 . The light source is disposed so as to irradiate the illumination light to the cutting position from a direction intersecting a normal direction of the ACF layer.
3. The ACF joining device according to claim 1 or 2 . A supplying step of supplying a tape including a base layer and an ACF (Anisotropic Conductive Film) layer;
a cutting step of cutting the ACF layer of the tape supplied in the supplying step;
an irradiation step of irradiating an illumination light onto a cutting position of the ACF layer supported by the base layer and cut;
an ACF imaging step of imaging the ACF layer supported by the base layer and including the cutting position under the illumination light;
a control step of controlling a pressure bonding unit for peeling the cut ACF layer from the base layer and pressure bonding the ACF layer to a substrate based on an image of the ACF layer including the cutting position captured in the ACF imaging step;
a substrate holding step of holding the substrate having an alignment mark on an edge portion by a substrate holding part in a state where the substrate does not overlap with the edge portion in a top view;
a substrate imaging step of imaging the alignment mark of the substrate held by the substrate holding unit from above by a substrate imaging unit;
the illumination light is emitted from a light source disposed below the substrate imaging unit and facing the substrate imaging unit;
In the substrate imaging step, an image of the alignment mark of the substrate held by the substrate holding unit is captured by transmitted light irradiated from the light source and transmitted through the edge portion.
How to attach ACF.

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