JP7653785B2 - Substrate cleaning apparatus and substrate cleaning method - Google Patents

Description

The present invention relates to a substrate cleaning device and a substrate cleaning method that clean a substrate by contacting a cleaning tool with the substrate.

Substrate processing equipment is used to carry out various processes on various substrates, such as FPD (Flat Panel Display) substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, or solar cell substrates. Substrate cleaning equipment is used to clean substrates.

The substrate cleaning device described in Patent Document 1 includes a spin chuck, a rotating support, a support arm, and a cleaning brush. The spin chuck suction-holds the center of the bottom surface of the substrate, thereby rotatably holding the substrate in a horizontal position. The rotating support extends vertically at a position to the side of the spin chuck and is rotatable around an axis that also extends vertically. The support arm extends horizontally from the upper end of the rotating support at a position above the spin chuck and is movable vertically. The cleaning brush is provided at the tip of the support arm and is configured to clean the top surface of the substrate by contacting the top surface of the substrate.

In the above substrate cleaning device, when cleaning the top surface of the substrate, the support arm moves up and down and rotates while the substrate held by the spin chuck rotates. This causes the cleaning brush to be pressed against the top surface of the substrate, and the pressed cleaning brush moves over the substrate.

Here, if the pressing force of the cleaning brush against the substrate during cleaning is excessively small, the substrate may not be cleaned sufficiently. Therefore, in the substrate cleaning device of Patent Document 1, an air cylinder that urges the cleaning brush toward the substrate is provided at the tip of the support arm. The pressing force of the cleaning brush is controlled by an electropneumatic regulator that adjusts the flow rate of air supplied to the air cylinder.

In addition, a spring is provided at the tip of the support arm to offset the weight of the cleaning brush and its surrounding parts acting on the air cylinder. By offsetting the weight of the cleaning brush and its surrounding parts, it becomes possible to control the pressing force of the cleaning brush against the substrate without taking into account the weight of the cleaning brush and its surrounding parts.

JP 2004-306033 A

In the above-mentioned substrate cleaning device, by increasing the contact area of the cleaning brush with the substrate, it is possible to shorten the path that the cleaning brush must move over the substrate when cleaning the substrate. Alternatively, it is no longer necessary to move the cleaning brush over the substrate when cleaning the substrate. This shortens the substrate cleaning time and improves the throughput of the cleaning process.

However, if the contact area of the cleaning brush with the substrate is increased, the cleaning brush and its surrounding components will also become larger, resulting in a significant increase in the weight of the cleaning brush and its surrounding components. In this case, if an attempt is made to offset the weight of the cleaning brush and its surrounding components with a spring, the cleaning brush may swing up and down significantly due to the expansion and contraction of the spring. If the cleaning brush moves up and down significantly as it moves near the substrate, the cleaning brush may unintentionally come into contact with the substrate. In addition, the elastic force of the spring also acts on the air cylinder. Therefore, if the elastic force of the spring is increased in response to an increase in the weight of the cleaning brush, it may become difficult to adjust the pressing force of the cleaning brush against the substrate.

A configuration that does not use the above-mentioned spring is therefore conceivable. However, in this case, the force that needs to be controlled by the air cylinder becomes larger, and the time required for that control becomes longer. In this case, it is not possible to improve the throughput of the cleaning process.

The object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method that enable improvement of the throughput of the cleaning process.

(1) A substrate cleaning apparatus according to a first aspect of the present invention is a substrate cleaning apparatus for cleaning a substrate, the substrate cleaning apparatus comprising: a substrate holding part for holding the substrate in a horizontal position; a first cleaning tool arranged to be able to contact one of an upper surface and a lower surface of the substrate held by the substrate holding part; a first fluid cylinder for applying an upward force to the first cleaning tool; and a first cylinder driving part for driving the first fluid cylinder , the first cylinder driving part being arranged to maintain a state in which the first cylinder driving part applies an upward first force to the first cleaning tool during a standby state in which the power supply to the substrate cleaning apparatus is turned on and the substrate cleaning apparatus is not performing a cleaning process on the substrate and the first cleaning tool is not in contact with the one surface of the substrate. The first fluid cylinder is driven , and when cleaning of one side of the substrate is started, the first cleaning tool moves from a position away from the one side of the substrate toward a position in contact with the one side of the substrate, and the first cylinder driving unit further applies a second force that is upward and different from the first force to the first cleaning tool before the first cleaning tool reaches a position in contact with the one side of the substrate when cleaning of the one side of the substrate is started, and drives the first fluid cylinder so that, during cleaning of the one side of the substrate, the second force is applied to the first cleaning tool while the first cleaning tool is in contact with the one side of the substrate, causing the first cleaning tool to press against the one side with a predetermined force.

The time required to control the first fluid cylinder increases as the amount of change in the force generated by the first fluid cylinder increases. In the above substrate cleaning apparatus, during standby, the first fluid cylinder applies a first upward force to the first cleaning tool. Meanwhile, during cleaning, the first fluid cylinder applies a second upward force to the first cleaning tool. Therefore, by reducing the difference between the first force and the second force, the time required to control the first fluid cylinder can be shortened when switching from the standby state to the cleaning state. This improves the throughput of substrate processing in which one side of a substrate is cleaned .
(2 ) The cylinder driving unit may drive the first fluid cylinder so that a first force is applied from the first fluid cylinder to the first cleaning tool when the substrate cleaning apparatus transitions from a powered-off state in which no force is applied from the first fluid cylinder to the first cleaning tool to a standby state.

( 3 ) The first force may be determined such that when the first fluid cylinder applies an upward first force to the first cleaning tool, the weight of at least a portion of the first cleaning tool is offset.

In this case, when switching from the standby state to the cleaning state, the time required to control the first fluid cylinder due to the weight of the first cleaning tool is reduced.

( 4 ) The substrate cleaning apparatus may further include a first cleaning tool holder that holds the first cleaning tool, and the first fluid cylinder may apply an upward first or second force to the first cleaning tool via the first cleaning tool holder.

In this case, there is no need to attach the first cleaning tool directly to the first fluid cylinder. This increases the freedom of layout of the first cleaning tool and the first fluid cylinder.

( 5 ) The substrate cleaning apparatus may further include a support member that supports the first fluid cylinder, and a support member moving unit configured to be able to move the support member at least in the vertical direction and that moves the support member between a contact position where the first cleaning tool contacts one side of the substrate held by the substrate holding unit and a standby position where the first cleaning tool is separated from the one side of the substrate held by the substrate holding unit.

In this case, it becomes possible to control the first fluid cylinder and control the movement of the support member in parallel. This makes it possible to further improve the throughput of substrate processing.

( 6 ) The support member may comprise a casing member formed to accommodate the first fluid cylinder and the first cleaning tool holding portion, and at least a portion of the first cleaning tool may be held by the first cleaning tool holding portion so as to be located outside the casing member.

In this case, the first fluid cylinder and the first cleaning tool holder are housed in a casing member, which prevents particles generated from the first fluid cylinder and the first cleaning tool holder from scattering.

( 7 ) The substrate cleaning apparatus may further include a load sensor that detects an upward force applied from the first fluid cylinder to the first cleaning tool, and the first cylinder drive unit may adjust the force applied by the first fluid cylinder to the first cleaning tool based on an output of the load sensor.

In this case, the force that the first fluid cylinder applies to the first cleaning tool can be adjusted more accurately based on the output of the load sensor. Therefore, when cleaning one side of the substrate, the first cleaning tool can be pressed against the one side of the substrate with a predetermined force.

( 8 ) The first cleaning tool includes a brush having a contact surface that faces one side of the substrate held by the substrate holding part and is capable of contacting the one side of the substrate, and in a plan view, the length between the two most distant points on the contact surface of the brush may be greater than 1/3 of the diameter of the substrate.

In this case, at least a portion of one surface of the substrate can be efficiently cleaned over a wide area.

( 9 ) The substrate cleaning apparatus may further include an abnormality detection unit that detects when the first cleaning tool is not in contact with one surface of the substrate during cleaning of the one surface.

In this case, the user can easily and quickly determine the occurrence of an abnormality in the substrate cleaning device based on the detection results.

( 10 ) The substrate cleaning apparatus further includes a second cleaning tool provided to be capable of contacting the other of the upper and lower surfaces of the substrate held by the substrate holding unit, a second fluid cylinder that applies an upward force to the second cleaning tool, and a second cylinder driving unit that drives the second fluid cylinder, wherein the second cylinder driving unit drives the second fluid cylinder to apply an upward third force to the second cleaning tool during standby, and when cleaning the other side of the substrate, drives the second fluid cylinder so that, with the second cleaning tool in contact with the other side of the substrate, the second cleaning tool presses the other side with a predetermined force by applying an upward fourth force different from the third force to the second cleaning tool.

The time required to control the second fluid cylinder increases as the change in force generated by the second fluid cylinder increases. With the above configuration, by reducing the difference between the third force and the fourth force, the time required to control the second fluid cylinder can be shortened when switching from the standby state to the cleaning state. This improves the throughput of substrate processing in which one side and the other side of a substrate are cleaned.

( 11 ) A substrate cleaning method according to a second aspect of the present invention is a substrate cleaning method using a substrate cleaning apparatus for cleaning a substrate, the substrate cleaning apparatus including a substrate holding part, a first cleaning tool, and a first fluid cylinder, the substrate cleaning method including the steps of: holding the substrate in a horizontal position by the substrate holding part; having the first cleaning tool stand by during standby when the power supply to the substrate cleaning apparatus is turned on and the substrate is not being cleaned and the first cleaning tool is not in contact with the one surface of the substrate ; and cleaning the one surface by bringing the first cleaning tool into contact with the one surface of the substrate held by the substrate holding part, the step of having the first cleaning tool stand by includes the steps of: moving the first cleaning tool upward during standby; The step of cleaning the one side of the substrate includes driving the first fluid cylinder so as to maintain a first force applied to the first cleaning tool in an upward direction, the first cleaning tool moving from a position away from the one side of the substrate toward a position in contact with the one side of the substrate as cleaning of the one side of the substrate is started, and the step of cleaning the one side of the substrate includes applying a second force to the first cleaning tool which is directed upward and different from the first force before the first cleaning tool reaches a position in contact with the one side of the substrate as cleaning of the one side of the substrate is started, and driving the first fluid cylinder so that, with the first cleaning tool in contact with the one side of the substrate, the second force is applied to the first cleaning tool, causing the first cleaning tool to press against the one side with a predetermined force.

The time required to control the first fluid cylinder increases as the amount of change in the force generated in the first fluid cylinder increases. In the above substrate cleaning method, during standby, the first fluid cylinder applies a first upward force to the first cleaning tool. Meanwhile, during cleaning, the first fluid cylinder applies a second upward force to the first cleaning tool. Therefore, by reducing the difference between the first force and the second force, the time required to control the first fluid cylinder can be shortened when switching from the standby state to the cleaning state. This improves the throughput of substrate processing in which one surface of a substrate is cleaned .
(12 ) The step of putting the first cleaning tool on standby may include driving the first fluid cylinder so that a first force is applied from the first fluid cylinder to the first cleaning tool when transitioning from a state in which the power of the substrate cleaning apparatus is turned off and no force is applied from the first fluid cylinder to the first cleaning tool to a standby state.

( 13 ) The first force may be determined such that when the first fluid cylinder applies an upward first force to the first cleaning tool, a weight of at least a portion of the first cleaning tool is offset.

In this case, when switching from the standby state to the cleaning state, the time required to control the first fluid cylinder due to the weight of the first cleaning tool is reduced.

( 14 ) The substrate cleaning method may further include a step of detecting a force applied upward from the first fluid cylinder to the first cleaning tool by a load sensor, and a step of adjusting the force applied by the first fluid cylinder to the first cleaning tool based on an output of the load sensor.

In this case, the force that the first fluid cylinder applies to the first cleaning tool can be adjusted more accurately based on the output of the load sensor. Therefore, when cleaning one side of the substrate, the first cleaning tool can be pressed against the one side of the substrate with a predetermined force.

( 15 ) The step of cleaning one side of the substrate may include detecting that the first cleaning tool is not in contact with the one side.

In this case, the user can easily and quickly determine the occurrence of an abnormality in the substrate cleaning device based on the detection results.

( 16 ) The substrate cleaning method may further include a step of having a second cleaning tool stand by for cleaning the other side of the upper and lower surfaces of the substrate held by the substrate holding part, and a step of cleaning the other side by contacting the second cleaning tool with the other side of the substrate held by the substrate holding part, wherein the step of having the second cleaning tool stand by includes driving the second fluid cylinder to apply an upward third force to the second cleaning tool, and the step of cleaning the other side of the substrate may include driving the second fluid cylinder, with the second cleaning tool in contact with one side of the substrate, to apply an upward fourth force different from the third force to the second cleaning tool, thereby causing the second cleaning tool to press the other side with a predetermined force.

The time required to control the second fluid cylinder increases as the change in force generated by the second fluid cylinder increases. With the above configuration, by reducing the difference between the third force and the fourth force, the time required to control the second fluid cylinder can be shortened when switching from the standby state to the cleaning state. This improves the throughput of substrate processing in which one side and the other side of a substrate are cleaned.

The present invention makes it possible to improve the throughput of cleaning processes.

1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention; FIG. 2 is an external perspective view showing an internal configuration of the substrate cleaning apparatus of FIG. 1 . 2 is a block diagram showing a configuration of a control system of a substrate cleaning apparatus according to an embodiment of the present invention. FIG. 2 is a schematic diagram for explaining the configuration of a lower surface brush operating unit in FIG. 1 . FIG. 11 is a schematic side view showing a basic operation of a lower surface brush operating part when the lower surface of a substrate is cleaned by the lower surface cleaning device. FIG. 11 is a schematic side view showing a basic operation of a lower surface brush operating part when the lower surface of a substrate is cleaned by the lower surface cleaning device. FIG. 7 is a time chart for explaining the change in force applied upward from the air cylinder to the lower surface brush during underside cleaning of the substrate shown in FIGS. 5 and 6 . 2 is a schematic diagram for explaining the configuration of an upper surface brush operating unit in FIG. 1 . FIG. 11A to 11C are schematic side views showing the basic operation of an upper surface brush operating part when the upper surface of a substrate is cleaned by the upper surface cleaning device. 11A to 11C are schematic side views showing the basic operation of an upper surface brush operating part when the upper surface of a substrate is cleaned by the upper surface cleaning device. 11 is a time chart for explaining the change in force applied upward from the air cylinder to the upper surface brush during cleaning of the upper surface of the substrate shown in FIGS. 9 and 10 . 2 is a schematic diagram for explaining an example of an overall operation of the substrate cleaning apparatus of FIG. 1 . 2 is a schematic diagram for explaining an example of an overall operation of the substrate cleaning apparatus of FIG. 1 . 2 is a schematic diagram for explaining an example of an overall operation of the substrate cleaning apparatus of FIG. 1 . 2 is a schematic diagram for explaining an example of an overall operation of the substrate cleaning apparatus of FIG. 1 . 2 is a schematic diagram for explaining an example of an overall operation of the substrate cleaning apparatus of FIG. 1 . 2 is a schematic diagram for explaining an example of an overall operation of the substrate cleaning apparatus of FIG. 1 . 2 is a schematic diagram for explaining an example of an overall operation of the substrate cleaning apparatus of FIG. 1 . 2 is a schematic diagram for explaining an example of an overall operation of the substrate cleaning apparatus of FIG. 1 . 2 is a schematic diagram for explaining an example of an overall operation of the substrate cleaning apparatus of FIG. 1 . 2 is a schematic diagram for explaining an example of an overall operation of the substrate cleaning apparatus of FIG. 1 . 2 is a schematic diagram for explaining an example of an overall operation of the substrate cleaning apparatus of FIG. 1 . 2 is a schematic diagram for explaining an example of an overall operation of the substrate cleaning apparatus of FIG. 1 .

The substrate cleaning apparatus and substrate cleaning method according to the embodiment of the present invention will be described below with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate (wafer), a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. In this embodiment, the upper surface of the substrate is the circuit formation surface (front surface), and the lower surface of the substrate is the surface opposite the circuit formation surface (rear surface). In this embodiment, the substrate has a circular shape excluding the notch.

[1] Configuration of the Substrate Cleaning Apparatus Fig. 1 is a schematic plan view of a substrate cleaning apparatus according to one embodiment of the present invention, and Fig. 2 is an external perspective view showing the internal configuration of the substrate cleaning apparatus 1 of Fig. 1. In the substrate cleaning apparatus 1 according to this embodiment, mutually orthogonal X-, Y-, and Z-directions are defined to clarify the positional relationships. In Fig. 1 and certain figures following Fig. 2, the X-, Y-, and Z-directions are appropriately indicated by arrows. The X- and Y-directions are mutually orthogonal in a horizontal plane, and the Z-direction corresponds to the up-down direction (vertical direction).

As shown in FIG. 1, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a pedestal device 30, a transfer device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an upper surface cleaning device 80, and an opening/closing device 90. These components are provided in a unit housing 2. In FIG. 2, the unit housing 2 is indicated by a dotted line.

The unit housing 2 has a rectangular bottom surface 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom surface 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall 2b. This opening is an entrance 2x for the substrate W, and is used when the substrate W is loaded into and unloaded from the unit housing 2. In FIG. 2, the entrance 2x is indicated by a thick dotted line. In the following description, the direction in the Y direction from inside the unit housing 2 through the entrance 2x to the outside of the unit housing 2 (the direction from the side wall 2c to the side wall 2b) is referred to as the front, and the opposite direction (the direction from the side wall 2b to the side wall 2c) is referred to as the rear.

As shown in FIG. 1, an opening/closing device 90 is provided in the portion of the side wall 2b where the loading/unloading opening 2x is formed and in the area nearby. The opening/closing device 90 includes a shutter 91 configured to be able to open and close the loading/unloading opening 2x, and a shutter driver 92 that drives the shutter 91. In FIG. 2, the shutter 91 is indicated by a thick two-dot chain line. The shutter driver 92 drives the shutter 91 to open the loading/unloading opening 2x when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1. The shutter driver 92 also drives the shutter 91 to close the loading/unloading opening 2x when the substrate W is cleaned in the substrate cleaning apparatus 1.

A pedestal device 30 is provided in the center of the bottom surface portion 2a. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal drive unit 33. The linear guide 31 includes two rails and is provided so as to extend in the Y direction from the vicinity of the side wall portion 2b to the vicinity of the side wall portion 2c in a plan view. The movable pedestal 32 is provided so as to be movable in the Y direction on the two rails of the linear guide 31. The pedestal drive unit 33 includes, for example, a pulse motor, and moves the movable pedestal 32 in the Y direction on the linear guide 31.

The lower holding device 20 and the lower surface cleaning device 50 are arranged on the movable base 32 in the Y direction. The lower holding device 20 includes an adsorption holding unit 21 and an adsorption holding drive unit 22. The adsorption holding unit 21 is a so-called spin chuck, and has a circular adsorption surface capable of adsorbing and holding the lower surface of the substrate W, and is configured to be rotatable around an axis extending in the vertical direction (axis in the Z direction). In FIG. 1, the outer shape of the substrate W adsorbed and held by the lower holding device 20 is indicated by a two-dot chain line. In the following description, when the substrate W is adsorbed and held by the adsorption holding unit 21, the area of the lower surface of the substrate W to be adsorbed by the adsorption surface of the adsorption holding unit 21 is referred to as the lower surface central portion. On the other hand, the area of the lower surface of the substrate W that surrounds the lower surface central portion is referred to as the lower surface outer region.

The suction-holding drive unit 22 includes a motor. The motor of the suction-holding drive unit 22 is provided on the movable base 32 so that the rotation shaft protrudes upward. The suction-holding unit 21 is attached to the upper end of the rotation shaft of the suction-holding drive unit 22. A suction path is formed on the rotation shaft of the suction-holding drive unit 22 for suctioning and holding the substrate W in the suction-holding unit 21. The suction path is connected to an air suction device (not shown). The suction-holding drive unit 22 rotates the suction-holding unit 21 around the rotation shaft.

A transfer device 40 is further provided on the movable base 32 near the lower holding device 20. The transfer device 40 includes a plurality of support pins 41 (three in this example), a pin connecting member 42, and a pin lifting and lowering drive unit 43. The pin connecting member 42 is formed to surround the suction holding unit 21 in a plan view, and connects the plurality of support pins 41. The plurality of support pins 41 extend upward a certain length from the pin connecting member 42 while being connected to each other by the pin connecting member 42. The pin lifting and lowering drive unit 43 raises and lowers the pin connecting member 42 on the movable base 32. As a result, the plurality of support pins 41 rise and lower relative to the suction holding unit 21.

The underside cleaning device 50 includes a underside brush 51, two liquid nozzles 52, a gas ejection unit 53, a underside brush lifting unit 54, a underside brush moving unit 55, a underside brush operating unit 55a, a underside brush lifting drive unit 55b, a underside brush moving drive unit 55c, and a underside brush support unit 59. The underside brush moving unit 55 is provided so as to be movable in the Y direction relative to the lower holding device 20 within a certain area on the movable base 32. As shown in FIG. 2, the underside brush lifting unit 54 is provided on the underside brush moving unit 55, and the underside brush support unit 59 is provided on the underside brush lifting unit 54. The underside brush lifting unit 54 supports the underside brush support unit 59 so that it can be raised and lowered. The underside brush support unit 59 has an upper surface 59u that is inclined obliquely downward in a direction away from the suction holding unit 21 (rearward in this example).

1, the lower brush 51 is formed of, for example, a PVA (polyvinyl alcohol) sponge or a PVA sponge with dispersed abrasive grains, and has a circular contact surface that can contact the lower surface of the substrate W. The lower brush 51 is attached to the upper surface 59u of the lower brush support part 59 so that the contact surface faces upward and can rotate around an axis that passes through the center of the contact surface and extends in the vertical direction. In a plan view, the area of the contact surface of the lower brush 51 is larger than the area of the suction surface of the suction holder 21. In a plan view, the length between the two most distant points on the contact surface of the lower brush 51 is larger than 1/3 and smaller than 1/2 of the diameter of the substrate W. With this configuration, at least a portion of the lower surface of the substrate W can be efficiently cleaned over a wide area without making the lower brush 51 excessively large.

Each of the two liquid nozzles 52 is attached to the upper surface 59u of the lower brush support part 59 so that it is located near the lower brush 51 and the liquid outlet faces upward. A lower cleaning liquid supply part 56 (FIG. 3) is connected to the liquid nozzle 52. The lower cleaning liquid supply part 56 supplies cleaning liquid to the liquid nozzle 52. When the substrate W is cleaned by the lower brush 51, the liquid nozzle 52 supplies the cleaning liquid supplied from the lower cleaning liquid supply part 56 to the lower surface of the substrate W. In this embodiment, pure water (deionized water) is used as the cleaning liquid supplied to the liquid nozzle 52. Note that, instead of pure water, carbonated water, ozone water, hydrogen water, electrolytic ionized water, SC1 (a mixed solution of ammonia and hydrogen peroxide), TMAH (tetramethylammonium hydroxide), or the like can also be used as the cleaning liquid supplied to the liquid nozzle 52.

The gas ejection unit 53 is a slit-shaped gas injection nozzle having a gas ejection port extending in one direction. The gas ejection unit 53 is attached to the upper surface 59u of the lower brush support unit 59 so that it is located between the lower brush 51 and the suction holding unit 21 in a plan view and the gas ejection port faces upward. The gas ejection unit 53 is connected to an ejected gas supply unit 57 (FIG. 3). The ejected gas supply unit 57 supplies gas to the gas ejection unit 53. In this embodiment, nitrogen gas is used as the gas supplied to the gas ejection unit 53. The gas ejection unit 53 ejects the gas supplied from the ejected gas supply unit 57 onto the lower surface of the substrate W when the substrate W is cleaned by the lower brush 51 and when the lower surface of the substrate W is dried, as described later. In this case, a band-shaped gas curtain extending in the X direction is formed between the lower brush 51 and the suction holding unit 21. Instead of nitrogen gas, an inert gas such as argon gas or helium gas can be used as the gas supplied to the gas outlet 53.

The lower surface brush operating unit 55a includes an air cylinder, and when the substrate W is cleaned with the lower surface brush 51, the air cylinder is driven to press the lower surface brush 51 against the lower surface of the substrate W with a predetermined force. The lower surface brush operating unit 55a further includes a motor, and when the substrate W is cleaned with the lower surface brush 51, the motor is driven in a state in which the lower surface brush 51 is in contact with the lower surface of the substrate W. This causes the lower surface brush 51 to rotate. Details of the lower surface brush operating unit 55a will be described later.

The lower brush lifting drive unit 55b includes a stepping motor or an air cylinder, and lifts and lowers the lower brush support unit 59 supported by the lower brush lifting unit 54 relative to the lower brush moving unit 55. The lower brush moving drive unit 55c includes a motor, and moves the lower brush moving unit 55 in the Y direction on the movable base 32. Here, the position of the lower holding device 20 on the movable base 32 is fixed. Therefore, when the lower brush moving unit 55 moves in the Y direction by the lower brush moving drive unit 55c, the lower brush moving unit 55 moves relative to the lower holding device 20. In the following description, the position of the lower cleaning device 50 when it is closest to the lower holding device 20 on the movable base 32 is called the approach position, and the position of the lower cleaning device 50 when it is farthest from the lower holding device 20 on the movable base 32 is called the separation position.

A cup device 60 is further provided in the center of the bottom surface portion 2a. The cup device 60 includes a cup 61 and a cup drive unit 62. The cup 61 is provided so as to surround the lower holding device 20 and the base device 30 in a plan view and is movable up and down. In FIG. 2, the cup 61 is indicated by a dotted line. The cup drive unit 62 moves the cup 61 between a lower cup position and an upper cup position depending on which part of the lower surface of the substrate W is to be cleaned by the lower surface brush 51. The lower cup position is a height position where the upper end of the cup 61 is located below the substrate W that is adsorbed and held by the adsorption holding unit 21. The upper cup position is a height position where the upper end of the cup 61 is located above the adsorption holding unit 21.

A pair of upper holding devices 10A, 10B are provided at a height position above the cup 61, facing each other across the base device 30 in a plan view. The upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck drive unit 13A, and an upper chuck drive unit 14A. The upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck drive unit 13B, and an upper chuck drive unit 14B.

The lower chucks 11A, 11B are disposed symmetrically with respect to a vertical plane that extends in the Y direction (front-to-back direction) through the center of the suction holding unit 21 in a plan view, and are provided so as to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A, 11B has two support pieces that can support the peripheral portion of the lower surface of the substrate W from below the substrate W. The lower chuck driving units 13A, 13B move the lower chucks 11A, 11B so that the lower chucks 11A, 11B approach each other, or so that the lower chucks 11A, 11B move away from each other.

The upper chucks 12A, 12B, like the lower chucks 11A, 11B, are arranged symmetrically with respect to a vertical plane that passes through the center of the suction holding unit 21 in the Y direction (front-rear direction) in a plan view, and are provided so as to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A, 12B has two holding pieces that are configured to abut against two parts of the outer periphery of the substrate W and to be able to hold the outer periphery of the substrate W. The upper chuck driving units 14A, 14B move the upper chucks 12A, 12B so that the upper chucks 12A, 12B approach each other, or so that the upper chucks 12A, 12B move away from each other.

As shown in FIG. 1, an upper surface cleaning device 70 is provided on one side of the cup 61 so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and a rotating shaft drive unit 74.

The rotating support shaft 71 is supported by a rotating shaft drive unit 74 so as to extend vertically on the bottom surface portion 2a and to be movable up and down and rotatable. As shown in FIG. 2, the arm 72 is provided at a position above the upper holding device 10B and extends horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is attached to the tip of the arm 72.

An upper surface cleaning fluid supply unit 75 (Figure 3) is connected to the spray nozzle 73. The upper surface cleaning fluid supply unit 75 supplies cleaning liquid and gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid and gas supplied from the upper surface cleaning fluid supply unit 75 to generate a mixed fluid, and sprays the generated mixed fluid downward.

In addition, the cleaning liquid supplied to the spray nozzle 73 may be carbonated water, ozone water, hydrogen water, electrolytic ion water, SC1 (a mixed solution of ammonia and hydrogen peroxide), or TMAH (tetramethylammonium hydroxide), instead of pure water. Also, the gas supplied to the spray nozzle 73 may be an inert gas such as argon gas or helium gas, instead of nitrogen gas.

The rotating shaft driving unit 74 includes one or more pulse motors and air cylinders, etc., and raises and lowers the rotating support shaft 71 and rotates the rotating support shaft 71. With the above configuration, the spray nozzle 73 can be moved in an arc over the top surface of the substrate W that is attracted and held by the suction holding unit 21 and rotated, thereby cleaning the entire top surface of the substrate W.

As shown in FIG. 1, an upper surface cleaning device 80 is provided on the other side of the cup 61 so as to be located near the upper holding device 10A in a plan view. The upper surface cleaning device 80 includes a rotating support shaft 81, an upper surface brush support part 82, an upper surface brush 83, a rotating shaft drive part 84, a liquid discharge nozzle 85, and an upper surface brush operation part 86.

The rotating support shaft 81 is supported by the rotating shaft drive unit 84 so as to extend vertically on the bottom surface portion 2a and to be movable up and down and rotatable. As shown in FIG. 2, the upper surface brush support unit 82 is provided at a position above the upper holding device 10A and extends horizontally from the upper end of the rotating support shaft 81. An upper surface brush 83 is provided at the tip of the upper surface brush support unit 82 so as to protrude downward.

In this embodiment, the upper brush 83 has basically the same configuration as the lower brush 51. That is, the upper brush 83 is formed, for example, from a PVA sponge or a PVA sponge with dispersed abrasive grains, and has a circular contact surface that can contact the upper surface of the substrate W. The upper brush 83 is attached to the upper brush support part 82 so that the contact surface faces downward and can rotate around an axis that passes through the center of the contact surface and extends in the vertical direction.

In a plan view, the length between the two most distant points on the contact surface of the upper surface brush 83 is greater than 1/3 and less than 1/2 the diameter of the substrate W. With this configuration, at least a portion of the upper surface of the substrate W can be efficiently cleaned over a wide area without making the upper surface brush 83 excessively large.

The rotating shaft drive unit 84 includes one or more pulse motors and air cylinders, etc., and raises and lowers the rotating support shaft 81 and rotates the rotating support shaft 81. The liquid discharge nozzle 85 is fixed above the cup 61 so that the liquid discharge port faces the center of the substrate W held by the lower holding device 20. The upper surface cleaning fluid supply unit 75 (FIG. 3) is connected to the liquid discharge nozzle 85. The upper surface cleaning fluid supply unit 75 supplies cleaning liquid to the liquid discharge nozzle 85. When the substrate W is cleaned by the upper surface brush 83, the liquid discharge nozzle 85 discharges the cleaning liquid supplied from the upper surface cleaning fluid supply unit 75 to the substrate W. Pure water (deionized water) is used as the cleaning liquid supplied to the liquid discharge nozzle 85. Note that, instead of pure water, carbonated water, ozone water, hydrogen water, electrolytic ion water, SC1, TMAH, etc. can also be used as the cleaning liquid supplied to the liquid discharge nozzle 85.

The upper surface brush operating unit 86 includes an air cylinder, and when the substrate W is cleaned with the upper surface brush 83, the air cylinder is driven to press the upper surface brush 83 against the upper surface of the substrate W with a predetermined force. The upper surface brush operating unit 86 further includes a motor, and when the substrate W is cleaned with the upper surface brush 83, the motor is driven with the upper surface brush 83 in contact with the upper surface of the substrate W. This causes the upper surface brush 83 to rotate.

According to the above configuration, as the rotary support shaft 81 rises and falls and rotates, the upper surface brush 83 comes into contact with the upper surface of the substrate W which is being attracted and held by the suction holding unit 21 and rotating. In this state, cleaning liquid is supplied onto the substrate W from the liquid discharge nozzle 85, and the upper surface brush 83 is pressed against the upper surface of the substrate W and rotates. Furthermore, the upper surface brush 83 moves in an arc shape above the substrate W. This makes it possible to physically clean the entire upper surface of the substrate W. The upper surface brush operating unit 86 will be described in detail later.

Figure 3 is a block diagram showing the configuration of a control system for substrate cleaning apparatus 1 according to one embodiment of the present invention. The control unit 9 in Figure 3 includes a CPU (central processing unit), RAM (random access memory), ROM (read only memory), and a storage device. The RAM is used as a working area for the CPU. The ROM stores system programs. The storage device stores control programs. The CPU executes the substrate cleaning program stored in the storage device on the RAM to control the operation of each part of substrate cleaning apparatus 1.

As shown in FIG. 3, the control unit 9 mainly controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B to receive the substrate W that is brought into the substrate cleaning apparatus 1 and hold it at a position above the suction holding unit 21. The control unit 9 also mainly controls the suction holding driving unit 22 to suction and hold the substrate W by the suction holding unit 21 and to rotate the suction-held substrate W.

The control unit 9 also mainly controls the pedestal drive unit 33 to move the movable pedestal 32 relative to the substrate W held by the upper holding devices 10A and 10B. The control unit 9 also controls the pin lift drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the suction holder 21.

The control unit 9 also controls the lower surface brush operating unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush movement drive unit 55c, the lower surface cleaning liquid supply unit 56, and the gas jet supply unit 57 to clean the underside of the substrate W. The control unit 9 also controls the cup drive unit 62 to use the cup 61 to catch the cleaning liquid that splashes from the substrate W when cleaning the substrate W adsorbed and held by the adsorption holding unit 21.

The control unit 9 also controls the rotating shaft drive unit 74, the upper surface cleaning fluid supply unit 75, the rotating shaft drive unit 84, and the upper surface brush operation unit 86 to clean the upper surface of the substrate W. Furthermore, the control unit 9 controls the shutter drive unit 92 to open and close the loading/unloading opening 2x of the unit housing 2 when loading and unloading the substrate W in the substrate cleaning apparatus 1.

[2] Details of the lower surface brush operating unit 55a (1) Configuration of the lower surface brush operating unit 55a Fig. 4 is a schematic diagram for explaining the configuration of the lower surface brush operating unit 55a in Fig. 1. Fig. 4 shows a schematic side view of the configuration of the lower surface brush operating unit 55a and its peripheral members in Fig. 1. As shown in Fig. 4, the lower surface brush operating unit 55a includes a rotating shaft 511, a lower surface brush holding member 512, a rotational force transmission mechanism 513, a motor 514, a motor drive unit 515, a shaft member 516, an air cylinder 520, an electropneumatic regulator 521, a linear guide 531, a load sensor 550, a sensor support member 551, and a descent detection unit 560.

In the underside cleaning device 50 according to this embodiment, the underside brush support section 59 is made of a casing member configured to house the components of the underside brush operating section 55a excluding the motor drive section 515 and the electro-pneumatic regulator 521. This makes it possible to prevent particles generated by the operation of the underside brush holding member 512, the rotational force transmission mechanism 513, the motor 514, the shaft member 516, and the air cylinder 520 from scattering inside the unit housing 2.

In FIG. 4, the shape of the lower brush support part 59 is shown conceptually in order to explain the configuration of the lower brush operating part 55a. Therefore, in FIG. 4, the upper surface 59u of the lower brush support part 59 is not inclined. Also, in FIG. 4, the liquid nozzle 52 and the gas ejection part 53 are not shown.

The lower brush support part 59 is supported by the lower brush lifting part 54 and the lower brush moving part 55 in FIG. 2. Inside the lower brush support part 59, an air cylinder 520 is provided on the bottom of the lower brush support part 59. The lower brush holding member 512 has one end and the other end in the horizontal direction. The air cylinder 520 supports the approximately central part between the one end and the other end of the lower brush holding member 512. An electric air regulator 521 is connected to the air cylinder 520. The air cylinder 520 applies an upward force to the lower brush holding member 512 by supplying air through the electric air regulator 521. The force applied to the lower brush holding member 512 from the air cylinder 520 is adjusted and changed, so that the lower brush holding member 512 moves up and down within a predetermined range (hereinafter referred to as the movable height range). The electric air regulator 521 may be housed inside the lower brush support part 59.

A rotating shaft 511 is rotatably provided at one end of the lower brush holding member 512 so as to extend upward. The lower brush 51 is attached to the upper end of the rotating shaft 511. When attached to the rotating shaft 511, the lower brush 51 is located outside (above) the lower brush support part 59.

A motor 514 is attached near the other end of the lower brush holding member 512. A motor drive unit 515 is connected to the motor 514. The rotation shaft of the motor 514 extends in the vertical direction. A rotation force transmission mechanism 513 is provided between the rotation shaft 511 and the rotation shaft of the motor 514. The rotation force transmission mechanism 513 includes two pulleys attached to the rotation shaft 511 and the rotation shaft of the motor 514, respectively, and a belt connecting the two pulleys, and transmits the rotation force generated in the motor 514 to the rotation shaft 511. This causes the lower brush 51 to rotate. The motor drive unit 515 may be housed inside the lower brush support unit 59.

A linear guide 531 is provided near the air cylinder 520 at the bottom of the lower brush support portion 59. The linear guide 531 has a through hole that extends a certain length in the vertical direction. A shaft member 516 is provided in a part of the lower brush holding member 512 so as to extend downward. The shaft member 516 is inserted into the through hole of the linear guide 531 so as to be movable in the vertical direction. As a result, when the force applied to the lower brush holding member 512 by the air cylinder 520 changes and the lower brush holding member 512 moves, the linear guide 531 restricts the direction of movement to the direction of the through hole (vertical direction).

The sensor support member 551 extends upward from the bottom of the lower brush support portion 59, passing near the other end of the lower brush holding member 512, then bends horizontally to a position above the other end of the lower brush holding member 512.

In the following description, the sum of the weights of the multiple components supported by the air cylinder 520 is referred to as the lower surface brush total weight. In addition, the pressure force to be applied to the substrate W from the lower surface brush 51 when cleaning the underside of the substrate W is referred to as the lower surface cleaning pressure force. In this embodiment, the lower surface cleaning pressure force is smaller than the lower surface brush total weight.

A load sensor 550 is attached to a portion of the sensor support member 551 located above the other end of the lower brush holding member 512. When the air cylinder 520 applies a force to the lower brush holding member 512 that exceeds the total weight of the lower brushes, the other end of the lower brush holding member 512 abuts against the load sensor 550. At this time, the load sensor 550 outputs a signal indicating the force applied to the lower brush holding member 512 by the air cylinder 520 minus the total weight of the lower brushes. The signal output from the load sensor 550 is given to the control unit 9 in FIG. 3.

For example, when the total weight of the lower brushes is 10 (N) and an upward force of 13 (N) is being applied from the air cylinder 520 to the lower brush holding member 512, the load sensor 550 outputs a signal indicating 3 (N). The signal output from the load sensor 550 is provided to the control unit 9 in FIG. 3.

A descent detection unit 560 is attached to the portion of the sensor support member 551 that extends in the vertical direction. The descent detection unit 560 is, for example, a reflective photoelectric sensor, and outputs a signal indicating whether the lower brush holding member 512 is at the lower end of the movable height range, in other words, whether the lower brush holding member 512 is at the lowest position. The signal output from the descent detection unit 560 is provided to the control unit 9 in FIG. 3.

(2) Basic Operation of the Lower Surface Brush Operating Unit 55a Figures 5 and 6 are schematic side views showing the basic operation of the lower surface brush operating unit 55a when the lower surface of the substrate W is cleaned by the lower surface cleaning device 50. Figure 7 is a time chart for explaining the change in force applied upward from the air cylinder 520 to the lower surface brush 51 during cleaning of the lower surface of the substrate W shown in Figures 5 and 6. In the time chart of Figure 7, the vertical axis represents the force applied upward from the air cylinder 520 to the lower surface brush 51, and the horizontal axis represents time.

At time t0 when the power supply to the substrate cleaning device 1 is turned off, as shown in the upper part of FIG. 5, the lower brush holding member 512 is supported by the air cylinder 520 and is positioned at the lower end of the movable height range. Also, at this time, as shown in FIG. 7, no force is applied to the lower brush 51 from the air cylinder 520.

Next, at time t1 when the power supply of the substrate cleaning device 1 is turned on, control of the electropneumatic regulator 521 is started to apply a first force f1 upward from the air cylinder 520 to the lower surface brush 51. The electropneumatic regulator 521 is controlled by the control unit 9 in FIG. 3.

The first force f1 is determined in advance so that at least a part of the weight of the lower brush 51 is offset. More specifically, the first force f1 is determined so that at least a part of the total weight of the lower brush is offset. In this example, the components supported by the air cylinder 520 are the lower brush 51, the lower brush holding member 512, the rotational force transmission mechanism 513, the motor 514, and the shaft member 516. For example, when the total weight of the lower brush is 10 (N), the first force f1 may be determined as 10 (N) or 9 (N). The first force f1 is determined so as to be smaller than the total weight of the lower brush plus the lower cleaning pressure force. When the force applied to the lower brush 51 from the air cylinder 520 at time t2 reaches the first force f1, the lower brush operating unit 55a enters a standby state.

Next, at time t3 when the cleaning process of the substrate W by the bottom surface cleaning device 50 starts, control of the electropneumatic regulator 521 is started to apply a second force f2 from the air cylinder 520 to the bottom surface brush 51. The second force f2 is the sum of the total weight of the bottom surface brushes and the bottom surface cleaning pressure force.

After time t3 has elapsed, when the force applied to the lower brush holding member 512 by the air cylinder 520 exceeds the total weight of the lower brushes, the lower brush holding member 512 rises from the lower end of the movable height range. Thereafter, as shown in the middle of Figure 5, the other end of the lower brush holding member 512 comes into contact with the load sensor 550, causing the lower brush holding member 512 to stop. In this way, the upper end of the movable height range of the lower brush holding member 512 is at the height position of the load sensor 550.

When the lower brush holding member 512 is in contact with the load sensor 550, the electro-pneumatic regulator 521 is controlled based on the output of the load sensor 550 so that an accurate lower cleaning pressure is applied from the lower brush holding member 512 to the load sensor 550.

Next, from time t4 to time t5, the lower brush support part 59 moves as shown by the hollow arrow in the lower part of FIG. 5 due to the operation of the lower brush lifting part 54 and the lower brush moving part 55 in FIG. 1. Also, as shown in the upper part of FIG. 6, the contact surface of the lower brush 51 is pressed against the lower surface of the substrate W. At this time, the lower brush holding member 512 is pressed down together with the lower brush 51 within the lower brush support part 59, and the lower brush holding member 512 moves away from the load sensor 550. As a result, the lower brush 51 presses against the lower surface of the substrate W with a lower cleaning pressing force. In this state, the motor 514 operates to rotate the lower brush 51 around an axis extending in the vertical direction, and the lower surface of the substrate W is cleaned.

After that, at time t5 when cleaning of a predetermined area on the underside of the substrate W is completed, as shown in FIG. 7, control of the electropneumatic regulator 521 is started to apply a first force f1 from the air cylinder 520 to the underside brush 51. Also, from time t5 to time t6, the lower surface brush 51 is moved to a position separated from the substrate W by the operation of the lower surface brush lifting unit 54 and the lower surface brush moving unit 55 in FIG. 1. Then, the lower surface brush operating unit 55a again goes into a standby state.

The time required to control the air cylinder 520 increases as the change in force generated by the air cylinder 520 increases. According to the above basic operation, in the lower surface brush operating unit 55a, the first force f1 is applied to the lower surface brush 51 in advance when the cleaning process is on standby. Therefore, by reducing the difference between the first force f1 and the second force f2, it is possible to shorten the time required to control the electro-pneumatic regulator 521 to apply the second force f2 to the lower surface brush 51 when the cleaning process of the underside of the substrate W is started from the standby state. This improves the throughput of the substrate processing for cleaning the underside of the substrate W.

As shown in the middle of Figure 6, if the substrate W is damaged during underside cleaning of the substrate W, the force applied to the underside brush 51 from the air cylinder 520 may cause the underside brush holding member 512 to come into contact with the load sensor 550. In this case, the control unit 9 in Figure 3 detects that the underside brush 51 is not in contact with the substrate W based on the output signal of the load sensor 550 during underside cleaning of the substrate W. The detection result is presented to the user by a display device or audio device, allowing the user to easily and quickly grasp the occurrence of an abnormality in the underside cleaning device 50.

Also, as shown in the lower part of Figure 6, if the air cylinder 520 fails during underside cleaning of the substrate W, the lower surface brush holding member 512 may descend to the lower end of the movable height range. In this case, the control unit 9 in Figure 3 detects that the lower surface brush 51 is not in contact with the substrate W based on the output signal of the descent detection unit 560 during underside cleaning of the substrate W. The detection result is presented to the user by a display device or audio device, allowing the user to easily and quickly grasp the occurrence of an abnormality in the underside cleaning device 50.

In the above basic operation example, the movement of the lower brush support part 59 starts after the second force f2 is applied to the lower brush holding member 512 at time t4, but the movement of the lower brush support part 59 may start from time t3. In this case, it becomes possible to control the electro-pneumatic regulator 521 and control for moving the lower brush support part 59 in parallel. Therefore, the throughput of substrate processing can be further improved.

[3] Details of the upper surface brush operating unit 86 (1) Configuration of the upper surface brush operating unit 86 Fig. 8 is a schematic diagram for explaining the configuration of the upper surface brush operating unit 86 in Fig. 1. In Fig. 8, the configuration of the upper surface brush operating unit 86 and its peripheral members in Fig. 1 is shown in a schematic side view, similar to the example of the lower surface brush operating unit 55a in Fig. 4. As shown in Fig. 8, the upper surface brush operating unit 86 includes a rotating shaft 811, an upper surface brush holding member 812, a rotational force transmission mechanism 813, a motor 814, a motor driving unit 815, a shaft member 816, an air cylinder 820, an electropneumatic regulator 821, a linear guide 831, a load sensor 850, and a sensor support member 851.

In the upper surface cleaning device 80 according to this embodiment, the upper surface brush support part 82 is made of a casing member configured to house the components of the upper surface brush operating part 86 excluding the motor drive part 815 and the electro-pneumatic regulator 821. This makes it possible to prevent particles generated by the operation of the upper surface brush holding member 812, the rotational force transmission mechanism 813, the motor 814, the shaft member 816, and the air cylinder 820 from scattering within the unit housing 2. In FIG. 8, the shape of the upper surface brush support part 82 is conceptually shown to explain the configuration of the upper surface brush operating part 86.

The upper brush support part 82 is supported by the rotating support shaft 81 in FIG. 2. Inside the upper brush support part 82, an air cylinder 820 is provided on the bottom of the upper brush support part 82. The upper brush holding member 812 has one end and the other end in the horizontal direction. The air cylinder 820 supports the approximately central part between the one end and the other end of the upper brush holding member 812. An electric air regulator 821 is connected to the air cylinder 820. The air cylinder 820 applies an upward force to the upper brush holding member 812 by supplying air through the electric air regulator 821. The force applied to the upper brush holding member 812 from the air cylinder 820 is adjusted and changed, so that the upper brush holding member 812 moves in the vertical direction. The electric air regulator 821 may be housed inside the upper brush support part 82.

A rotating shaft 811 is rotatably provided at one end of the upper brush holding member 812 so as to extend upward and downward. The upper brush 83 is attached to the lower end of the rotating shaft 811. When attached to the rotating shaft 811, the upper brush 83 is located outside (below) the upper brush support part 82.

A motor 814 is attached near the other end of the upper brush holding member 812. A motor drive unit 815 is connected to the motor 814. The rotation shaft of the motor 814 extends in the vertical direction. A rotation force transmission mechanism 813 is provided between the rotation shaft 811 and the rotation shaft of the motor 814. The rotation force transmission mechanism 813 transmits the rotation force generated in the motor 814 to the rotation shaft 811. This causes the upper brush 83 to rotate. The motor 814 may be housed inside the upper brush support unit 82.

A linear guide 831 is provided near the air cylinder 820 at the bottom of the upper brush support portion 82. The linear guide 831 has a through hole that extends a certain length in the vertical direction. A shaft member 816 is provided in a part of the upper brush holding member 812 so as to extend downward. The shaft member 816 is inserted into the through hole of the linear guide 831 so as to be movable in the vertical direction. As a result, when the force applied to the upper brush holding member 812 from the air cylinder 820 changes and the upper brush holding member 812 moves, the linear guide 831 restricts the direction of movement to the direction of the through hole (vertical direction).

The sensor support member 851 extends a predetermined distance upward from the bottom of the lower brush support part 59, then bends horizontally to a position below the other end of the upper brush holding member 812.

In the following description, the sum of the weights of the multiple components supported by the air cylinder 820 is referred to as the upper surface brush total weight. In addition, the pressing force to be applied to the substrate W from the upper surface brush 83 when cleaning the upper surface of the substrate W is referred to as the upper surface cleaning pressing force. In this embodiment, the upper surface cleaning pressing force is smaller than the upper surface brush total weight.

A load sensor 850 is attached to a portion of the sensor support member 851 located below the other end of the upper brush holding member 812. When the air cylinder 820 is not applying force to the upper brush holding member 812, the other end of the upper brush holding member 812 abuts against the load sensor 850. In addition, when the air cylinder 820 is applying a force to the upper brush holding member 812 that is less than the total weight of the upper brushes, the other end of the upper brush holding member 812 abuts against the load sensor 850. At this time, the load sensor 850 outputs a signal indicating the weight of the total weight of the upper brushes that is not offset by the air cylinder 820.

For example, when the total weight of the upper brushes is 10 (N) and an upward force of 7 (N) is being applied from the air cylinder 820 to the upper brush holding member 812, the load sensor 850 outputs a signal indicating 3 (N). In addition, when the total weight of the upper brushes is 10 (N) and no upward force is being applied from the air cylinder 820 to the upper brush holding member 812, the load sensor 850 outputs a signal indicating 10 (N). The signal output from the load sensor 850 is given to the control unit 9 in FIG. 3.

(2) Basic Operation of Upper Surface Brush Operating Unit 86 Figures 9 and 10 are schematic side views showing the basic operation of the upper surface brush operating unit 86 when the upper surface of the substrate W is cleaned by the upper surface cleaning device 80. Figure 11 is a time chart for explaining the change in force applied upward from the air cylinder 820 to the upper surface brush 83 during cleaning of the upper surface of the substrate W shown in Figures 9 and 10. In the time chart of Figure 11, the vertical axis represents the force applied upward from the air cylinder 820 to the upper surface brush 83, and the horizontal axis represents time.

At time t10 when the power supply to the substrate cleaning device 1 is turned off, as shown in the upper part of FIG. 9, the upper brush holding member 812 is supported by the air cylinder 820 and abuts against the load sensor 850. At this time, as shown in FIG. 11, no force is applied from the air cylinder 820 to the upper brush 83.

Next, at time t11 when the power supply of the substrate cleaning device 1 is turned on, control of the electropneumatic regulator 821 is started to apply a third force f3 upward from the air cylinder 520 to the upper surface brush 83. The electropneumatic regulator 821 is controlled by the control unit 9 in FIG. 3.

The third force f3 is determined in advance so that at least a part of the weight of the upper brush 83 is offset. More specifically, the third force f3 is determined so that at least a part of the total weight of the upper brush is offset. In this example, the components supported by the air cylinder 820 are the upper brush 83, the upper brush holding member 812, the rotational force transmission mechanism 813, the motor 814, and the shaft member 816. For example, when the total weight of the upper brush is 10 (N), the third force f3 may be determined as 10 (N) or 9 (N). Here, the force obtained by subtracting the upper cleaning pressure force from the total weight of the upper brush is set as the fourth force f4. In this case, the third force f3 is determined to be smaller than twice the force of the fourth force f4. When the force applied to the upper brush 83 from the air cylinder 820 reaches the third force f3 at time t12, the upper brush operating unit 86 is in a standby state.

Next, at time t13 when the cleaning process of the substrate W by the upper surface cleaning device 80 starts, as shown in the middle part of Figure 9, control of the electropneumatic regulator 821 is started to apply a fourth force f4 from the air cylinder 820 to the upper surface brush 83.

Next, at time t14, a fourth force f4 is applied upward from the air cylinder 820 to the upper surface brush 83. In this state, an upper surface cleaning pressure force is applied to the load sensor 850 from the other end of the upper surface brush holding member 812. Here, with the upper surface brush holding member 812 abutting against the load sensor 850, the electro-pneumatic regulator 821 is controlled based on the output of the load sensor 850 so that an accurate upper surface cleaning pressure force is applied from the upper surface brush holding member 812 to the load sensor 850.

Next, from time t14 to time t15, the upper brush support part 82 moves up and down and rotates as shown by the white arrow in the lower part of FIG. 9 by the operation of the rotation shaft drive part 84 in FIG. 1. Also, as shown in the upper part of FIG. 10, the contact surface of the upper brush 83 is pressed against the upper surface of the substrate W. At this time, the upper brush holding member 812 is pushed up together with the upper brush 83 within the upper brush support part 82, and the upper brush holding member 812 moves away from the load sensor 850. As a result, the upper brush 83 presses against the upper surface of the substrate W with an upper surface cleaning pressing force. In this state, the motor 814 operates to rotate the upper brush 83 around an axis extending in the vertical direction, and the upper surface of the substrate W is cleaned.

After that, at time t15 when cleaning of a predetermined area on the upper surface of the substrate W is completed, as shown in FIG. 11, control of the electropneumatic regulator 821 is started to apply a third force f3 from the air cylinder 820 to the upper surface brush 83. Also, from time t15 to time t16, the upper surface brush 83 is moved to a position separated from the substrate W by the operation of the rotation shaft drive unit 84 in FIG. 1. Then, the upper surface brush operation unit 86 goes into a standby state again.

The time required to control the air cylinder 820 increases as the change in the force generated by the air cylinder 820 increases. According to the above basic operation, in the upper surface brush operating unit 86, the third force f3 is applied to the upper surface brush 83 in advance when the cleaning process is on standby. Therefore, by reducing the difference between the third force f3 and the fourth force f4, it is possible to shorten the time required to control the electropneumatic regulator 821 to apply the fourth force f4 to the upper surface brush 83 when the cleaning process of the upper surface of the substrate W is started from the standby state. This improves the throughput of the substrate processing for cleaning the upper surface of the substrate W.

As shown in the lower part of Figure 10, if the substrate W is damaged during bottom surface cleaning, the upper surface brush holding member 812 may descend and come into contact with the load sensor 850. In this case, the control unit 9 in Figure 3 detects that the upper surface brush 83 is not in contact with the substrate W based on the output signal of the load sensor 850 during the top surface cleaning of the substrate W. The detection result is presented to the user by a display device or audio device, allowing the user to easily and quickly grasp the occurrence of an abnormality in the bottom surface cleaning device 50.

In the above basic operation example, the movement of the upper brush support part 82 starts after the fourth force f4 is applied to the upper brush holding member 812 at time t14, but the movement of the upper brush support part 82 may start from time t13. In this case, it becomes possible to control the electropneumatic regulator 821 and control for moving the upper brush support part 82 in parallel. Therefore, the throughput of substrate processing can be further improved.

[4] Overall Operation of the Substrate Cleaning Apparatus 1 FIGS. 12 to 23 are schematic diagrams for explaining an example of the overall operation of the substrate cleaning apparatus 1 of FIG. 1. In each of FIGS. 12 to 23, a plan view of the substrate cleaning apparatus 1 is shown in the upper part. A side view of the lower holding device 20 and its periphery as viewed along the Y direction is shown in the middle part, and a side view of the lower holding device 20 and its periphery as viewed along the X direction is shown in the lower part. The side view in the middle part corresponds to the side view of line A-A in FIG. 1, and the side view in the lower part corresponds to the side view of line B-B in FIG. 1. In order to facilitate understanding of the shape and operating state of each component in the substrate cleaning apparatus 1, the enlargement and reduction ratios of some components are different between the plan view in the upper part and the side views in the middle and lower parts. In addition, in FIGS. 12 to 23, the cup 61 is indicated by a two-dot chain line, and the outer shape of the substrate W is indicated by a thick dashed line.

In the initial state before the substrate W is loaded into the substrate cleaning device 1, the shutter 91 of the opening/closing device 90 closes the loading/unloading port 2x. As shown in FIG. 1, the lower chucks 11A and 11B are maintained in a state in which the distance between the lower chucks 11A and 11B is sufficiently larger than the diameter of the substrate W. The upper chucks 12A and 12B are also maintained in a state in which the distance between the upper chucks 12A and 12B is sufficiently larger than the diameter of the substrate W. The movable base 32 of the base device 30 is arranged so that the center of the suction holder 21 is located at the center of the cup 61 in a plan view. The lower surface cleaning device 50 is arranged at an approaching position on the movable base 32. The lower surface brush lifting unit 54 of the lower surface cleaning device 50 supports the lower surface brush support unit 59 so that the contact surface of the lower surface brush 51 is located below the suction holder 21. The transfer device 40 is in a state in which the multiple support pins 41 are located below the suction holder 21. In addition, in the cup device 60, the cup 61 is in the lower cup position. In the following description, the center position of the cup 61 in a planar view is referred to as the planar reference position rp. In addition, the position of the movable base 32 on the bottom surface portion 2a when the center of the suction holding portion 21 is at the planar reference position rp in a planar view is referred to as the first horizontal position.

In addition, in the initial state, a first force f1 acting upward is applied to the lower surface brush 51 of the lower surface cleaning device 50. Also, a third force f3 acting upward is applied to the upper surface brush 83 of the upper surface cleaning device 80.

First, the substrate W is loaded into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading/unloading opening 2x immediately before the substrate W is loaded. Then, as indicated by the thick solid arrow a1 in FIG. 12, the hand (substrate holding part) RH of the substrate transport robot (not shown) loads the substrate W into a position approximately in the center of the unit housing 2 through the loading/unloading opening 2x. At this time, the substrate W held by the hand RH is positioned between the lower chuck 11A and upper chuck 12A and the lower chuck 11B and upper chuck 12B.

Next, as shown by the thick solid arrow a2 in Figure 13, the lower chucks 11A and 11B approach each other so that the multiple support pieces of the lower chucks 11A and 11B are positioned below the peripheral edge of the lower surface of the substrate W. In this state, the hand RH descends and exits through the loading/unloading opening 2x. As a result, multiple portions of the peripheral edge of the lower surface of the substrate W held by the hand RH are supported by the multiple support pieces of the lower chucks 11A and 11B. After the hand RH exits, the shutter 91 closes the loading/unloading opening 2x.

Next, as shown by the thick solid arrow a3 in FIG. 14, the upper chucks 12A and 12B approach each other so that the multiple holding pieces of the upper chucks 12A and 12B abut against the outer peripheral edge of the substrate W. The multiple holding pieces of the upper chucks 12A and 12B abut against multiple parts of the outer peripheral edge of the substrate W, and the substrate W supported by the lower chucks 11A and 11B is further held by the upper chucks 12A and 12B. In this way, the center of the substrate W held by the upper holding devices 10A and 10B overlaps or nearly overlaps with the planar reference position rp in a planar view. Also, as shown by the thick solid arrow a4 in FIG. 14, the suction holding unit 21 is shifted a predetermined distance from the planar reference position rp and the movable base 32 moves forward from the first horizontal position so that the center of the lower brush 51 is located at the planar reference position rp. At this time, the position of the movable base 32 located on the bottom surface portion 2a is called the second horizontal position.

15, the lower brush support part 59 supported by the lower brush lifting part 54 rises so that the contact surface of the lower brush 51 comes into contact with the center of the lower surface of the substrate W. Just before the lower brush support part 59 rises, the force applied upward to the lower brush 51 of the lower cleaning device 50 is changed from the first force f1 to a second force f2. As a result, the lower brush 51 is pressed against the lower surface of the substrate W by the lower cleaning pressing force. Also, as shown by the thick solid arrow a6 in FIG. 15, the lower brush 51 rotates (spins) around an axis in the vertical direction. As a result, contaminants adhering to the center of the lower surface of the substrate W are physically peeled off by the lower brush 51.

15, an enlarged side view of the portion where the lower brush 51 contacts the lower surface of the substrate W is shown in a bubble. As shown in the bubble, when the lower brush 51 contacts the substrate W, the liquid nozzle 52 and the gas ejection part 53 are held in a position close to the lower surface of the substrate W. At this time, the liquid nozzle 52 ejects the cleaning liquid toward the lower surface of the substrate W at a position close to the lower brush 51, as shown by the outlined arrow a51. As a result, the cleaning liquid supplied to the lower surface of the substrate W from the liquid nozzle 52 is guided to the contact part between the lower brush 51 and the substrate W, and the contaminants removed from the rear surface of the substrate W by the lower brush 51 are washed away by the cleaning liquid. In this way, in the lower surface cleaning device 50, the liquid nozzle 52 is provided on the lower surface brush support part 59 together with the lower surface brush 51. As a result, the cleaning liquid can be efficiently supplied to the portion of the lower surface of the substrate W cleaned by the lower surface brush 51. Therefore, the consumption of the cleaning liquid is reduced and excessive scattering of the cleaning liquid is suppressed.

The rotational speed of the lower surface brush 51 when cleaning the underside of the substrate W is maintained at a speed that prevents the cleaning liquid supplied from the liquid nozzle 52 to the underside of the substrate W from splashing to the sides of the lower surface brush 51.

Here, the upper surface 59u of the lower surface brush support part 59 is inclined obliquely downward in a direction away from the suction holding part 21. In this case, when cleaning liquid containing contaminants falls from the lower surface of the substrate W onto the lower surface brush support part 59, the cleaning liquid received by the upper surface 59u is guided in a direction away from the suction holding part 21.

When the lower surface of the substrate W is cleaned by the lower brush 51, the gas ejection unit 53 ejects gas toward the lower surface of the substrate W at a position between the lower brush 51 and the suction holder 21, as shown by the white arrow a52 in the blowout in FIG. 15. In this embodiment, the gas ejection unit 53 is attached to the lower brush support unit 59 so that the gas ejection port extends in the X direction. In this case, when gas is ejected from the gas ejection unit 53 toward the lower surface of the substrate W, a band-shaped gas curtain extending in the X direction is formed between the lower brush 51 and the suction holder 21. This prevents the cleaning liquid containing contaminants from scattering toward the suction holder 21 when the lower surface of the substrate W is cleaned by the lower brush 51. Therefore, when the lower surface of the substrate W is cleaned by the lower brush 51, the cleaning liquid containing contaminants is prevented from adhering to the suction holder 21, and the suction surface of the suction holder 21 is kept clean.

In the example of FIG. 15, the gas ejection part 53 ejects gas obliquely upward from the gas ejection part 53 toward the lower surface brush 51, as shown by the white arrow a52, but the present invention is not limited to this. The gas ejection part 53 may eject gas from the gas ejection part 53 toward the lower surface of the substrate W along the Z direction.

Next, in the state shown in Figure 15, when cleaning of the central portion of the underside of the substrate W is completed, the rotation of the lower brush 51 is stopped and the lower brush support portion 59 is lowered so that the contact surface of the lower brush 51 is separated from the substrate W by a predetermined distance (greater than 0 mm and less than or equal to 10 mm, for example, approximately 5 mm). At this time, the force applied upward to the lower brush 51 is changed from the second force f2 to the first force f1. In addition, the ejection of cleaning liquid from the liquid nozzle 52 onto the substrate W is stopped. At this time, the injection of gas from the gas ejection portion 53 onto the substrate W continues.

Then, as shown by the thick solid arrow a7 in FIG. 16, the movable base 32 moves backward so that the suction holder 21 is positioned at the planar reference position rp. That is, the movable base 32 moves from the second horizontal position to the first horizontal position. At this time, gas continues to be sprayed from the gas outlet 53 onto the substrate W, so that the central portion of the underside of the substrate W is sequentially dried by the gas curtain.

Next, as shown by the thick solid arrow a8 in Fig. 17, the lower brush support portion 59 descends so that the contact surface of the lower brush 51 is positioned below the suction surface (upper end) of the suction holding portion 21. Also, as shown by the thick solid arrow a9 in Fig. 17, the upper chucks 12A, 12B move away from each other so that the multiple holding pieces of the upper chucks 12A, 12B move away from the outer circumferential end of the substrate W. At this time, the substrate W is supported by the lower chucks 11A, 11B.

Then, as shown by the thick solid arrow a10 in FIG. 17, the pin connecting member 42 rises so that the upper ends of the multiple support pins 41 are positioned slightly above the lower chucks 11A and 11B. As a result, the substrate W supported by the lower chucks 11A and 11B is received by the multiple support pins 41.

Next, as shown by the thick solid arrow a11 in FIG. 18, the lower chucks 11A and 11B move away from each other. At this time, the lower chucks 11A and 11B move to positions where they do not overlap the substrate W supported by the multiple support pins 41 in a plan view. As a result, both upper holding devices 10A and 10B return to their initial states.

19, the pin connecting member 42 is lowered so that the upper ends of the multiple support pins 41 are positioned below the suction holding unit 21. As a result, the substrate W supported on the multiple support pins 41 is received by the suction holding unit 21. In this state, the suction holding unit 21 suctions and holds the central portion of the lower surface of the substrate W. In this way, the center of the substrate W suction-held by the lower holding device 20 overlaps or nearly overlaps with the planar reference position rp in a planar view. Simultaneously with the descent of the pin connecting member 42 or after the descent of the pin connecting member 42 is completed, the cup 61 rises from the lower cup position to the upper cup position as shown by the thick solid arrow a13 in FIG. 19.

Next, as shown by the thick solid arrow a14 in FIG. 20, the suction holder 21 rotates around the vertical axis (the axis of the rotation axis of the suction holder drive unit 22). As a result, the substrate W suction-held by the suction holder 21 rotates in a horizontal position.

Next, cleaning liquid is discharged from the liquid discharge nozzle 85 of FIG. 1 toward the upper surface of the rotating substrate W. Note that the liquid discharge nozzle 85 is not shown in FIG. 20. In addition, the rotating support shaft 81 of the upper surface cleaning device 80 rotates and descends. As a result, as shown by the thick solid arrow a15 in FIG. 20, the upper surface brush 83 moves to a position above the center of the substrate W and is pressed against the center of the upper surface of the substrate W by an upper surface cleaning pressing force. Before the rotating support shaft 81 rotates, the force applied upward to the upper surface brush 83 is changed from the third force f3 to a fourth force f4.

As shown by the thick solid arrow a16 in FIG. 20, the upper surface brush 83 moves to the position of the outer circumferential edge of the substrate W, and then returns to its initial position. In this manner, the upper surface of the substrate W is physically cleaned by the upper surface brush 83. After the substrate W has been cleaned by the upper surface brush 83, the force applied upward to the upper surface brush 83 is changed from the fourth force f4 to the third force f3.

Next, the rotating support shaft 71 of the upper surface cleaning device 70 rotates and descends. As a result, as shown by the thick solid arrow a17 in FIG. 21, the spray nozzle 73 moves to a position above the substrate W and descends so that the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixed fluid of cleaning liquid and gas onto the upper surface of the substrate W. The rotating support shaft 71 also rotates. As a result, as shown by the thick solid arrow a18 in FIG. 21, the spray nozzle 73 moves to a position above the rotating substrate W. By spraying the mixed fluid over the entire upper surface of the substrate W, the entire upper surface of the substrate W after cleaning by the upper surface brush 83 is cleaned again.

When the upper surface of the substrate W is cleaned by the spray nozzle 73, the lower brush support part 59 rises so that the contact surface of the lower brush 51 comes into contact with the outer region of the lower surface of the substrate W. Just before the lower brush support part 59 rises, the force applied upward to the lower brush 51 of the lower cleaning device 50 is changed from the first force f1 to the second force f2. In addition, as shown by the thick solid arrow a19 in FIG. 21, the lower brush 51 rotates (spins) around an axis in the vertical direction. Furthermore, the liquid nozzle 52 ejects cleaning liquid toward the lower surface of the substrate W, and the gas ejection part 53 ejects gas toward the lower surface of the substrate W. In this state, the lower brush moving part 55 moves forward and backward between the approach position and the separated position on the movable base 32, as shown by the thick solid arrow a20 in FIG. As a result, the entire outer region of the lower surface of the substrate W, which is attracted and held by the suction holding unit 21 and rotated, is cleaned by the lower surface brush 51. After cleaning the outer region of the lower surface of the substrate W, the lower surface brush 51 descends so as to move away from the substrate W. At this time, the force applied upward to the lower surface brush 51 is changed from the second force f2 to the first force f1.

The outer area of the lower surface of the substrate W may be cleaned when the upper surface of the substrate W is cleaned by the upper surface brush 83, instead of when the upper surface of the substrate W is cleaned by the spray nozzle 73.

As described above, when cleaning of the upper surface and the outer area of the lower surface of the substrate W is completed, the upper surface brush 83, the spray nozzle 73 and the lower surface brush 51 are held in their initial positions. In this state, the suction holder 21 rotates at high speed, shaking off the cleaning liquid adhering to the substrate W and drying the entire substrate W.

22, the cup 61 descends from the upper cup position to the lower cup position. In addition, in preparation for a new substrate W being loaded into the unit housing 2, the lower chucks 11A and 11B approach each other to positions where they can support the new substrate W, as shown by the thick solid arrow a22 in FIG. 22.

Finally, the substrate W is unloaded from the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading/unloading opening 2x just before the substrate W is unloaded. Thereafter, as indicated by the thick solid arrow a23 in FIG. 23, the hand (substrate holder) RH of the substrate transport robot (not shown) enters the unit housing 2 through the loading/unloading opening 2x. Next, the hand RH receives the substrate W on the suction holder 21 and exits through the loading/unloading opening 2x. After the hand RH exits, the shutter 91 closes the loading/unloading opening 2x.

[5] Effects (1) In the above-described bottom surface cleaning device 50, during standby, the air cylinder 520 applies an upward first force f1 to the bottom surface brush 51. Meanwhile, during cleaning, the air cylinder 520 applies an upward second force f2 to the bottom surface brush 51. Therefore, by reducing the difference between the first force f1 and the second force f2, it is possible to shorten the time required to control the air cylinder 520 when switching from the standby state to the cleaning state. This improves the throughput of the process of cleaning the bottom surface of the substrate W.

(2) In the above-described top surface cleaning device 80, the air cylinder 820 applies a third upward force f3 to the top surface brush 83 during standby. Meanwhile, the air cylinder 820 applies a fourth upward force f4 to the top surface brush 83 during cleaning. Therefore, by reducing the difference between the third force f3 and the fourth force f4, it is possible to shorten the time required to control the air cylinder 820 when switching from the standby state to the cleaning state. This improves the throughput of the process of cleaning the top surface of the substrate W.

(3) In the above-mentioned underside cleaning device 50, the air cylinder 520 supports the underside brush holding member 512 except for both ends. In this case, the support state of the underside brush holding member 512 by the air cylinder 520 is more stable than when the air cylinder 520 supports either of both ends of the underside brush holding member 512. This makes it possible to stably press the underside brush 51 against the underside of the substrate W with a underside cleaning pressure when cleaning the substrate W. In addition, since there is no need to provide the air cylinder 520 near both ends of the lower side brush holding member 512, the structure around the lower side brush 51 is prevented from becoming large. Therefore, it becomes possible to properly clean the underside of the substrate W while preventing the structure around the lower side brush 51 from becoming large.

(4) In the above-mentioned upper surface cleaning device 80, the air cylinder 820 supports the upper surface brush holding member 812 except for both ends. In this case, the support state of the upper surface brush holding member 812 by the air cylinder 820 is more stable than when the air cylinder 820 supports either of both ends of the upper surface brush holding member 812. This makes it possible to stably press the upper surface brush 83 against the upper surface of the substrate W with the upper surface cleaning pressing force when cleaning the substrate W. In addition, since there is no need to provide the air cylinder 820 near both ends of the upper surface brush holding member 812, the structure around the upper surface brush 83 is prevented from becoming large. Therefore, it becomes possible to properly clean the upper surface of the substrate W while preventing the structure around the upper surface brush 83 from becoming large.

[6] Other embodiments (1) The lower surface brush operating unit 55a of the lower surface cleaning device 50 according to the above embodiment is provided with the air cylinder 520 as a configuration for applying an upward force to the lower surface brush 51, but the present invention is not limited to this. The lower surface brush operating unit 55a may be provided with, instead of the air cylinder 520, an oil cylinder, for example, as a fluid cylinder. In this case, the lower surface brush operating unit 55a is provided with an oil hydraulic pressure supply device instead of the electro-pneumatic regulator 521. The oil hydraulic pressure supply device controls the force generated in the oil cylinder by adjusting the hydraulic pressure of the oil applied to the oil cylinder.

In addition, the upper surface brush operating unit 86 of the upper surface cleaning device 80 according to the above embodiment is provided with an air cylinder 820 as a configuration for applying an upward force to the upper surface brush 83, but the present invention is not limited to this. Instead of the air cylinder 820, the upper surface brush operating unit 86 may be provided with a fluid cylinder, for example an oil cylinder. In this case, the upper surface brush operating unit 86 is provided with an oil hydraulic pressure supply device instead of the electro-pneumatic regulator 821.

(2) The lower surface brush operating unit 55a of the lower surface cleaning device 50 according to the above embodiment is provided with a load sensor 550 and a descent detection unit 560, but the present invention is not limited to this. The lower surface brush operating unit 55a does not have to be provided with a load sensor 550 and a descent detection unit 560. In addition, the upper surface brush operating unit 86 of the upper surface cleaning device 80 according to the above embodiment is provided with a load sensor 850, but the present invention is not limited to this. The upper surface brush operating unit 86 does not have to be provided with a load sensor 850.

(3) The lower surface brush operating unit 55a of the lower surface cleaning device 50 according to the above embodiment is provided with a rotational force transmission mechanism 513 and a motor 514 that rotate the lower surface brush 51, but the present invention is not limited to this. The lower surface brush operating unit 55a does not have to be provided with the rotational force transmission mechanism 513 and the motor 514. In addition, the upper surface brush operating unit 86 of the upper surface cleaning device 80 according to the above embodiment is provided with a rotational force transmission mechanism 813 and a motor 814 that rotate the upper surface brush 83, but the present invention is not limited to this. The upper surface brush operating unit 86 does not have to be provided with the rotational force transmission mechanism 813 and the motor 814.

(4) The substrate cleaning apparatus 1 according to the above embodiment may include either the bottom surface cleaning apparatus 50 or the top surface cleaning apparatus 80. The top surface cleaning apparatus 70 may not be provided in the substrate cleaning apparatus 1. In this case, the substrate cleaning apparatus 1 may include only either the bottom surface cleaning apparatus 50 or the top surface cleaning apparatus 80 as a configuration for cleaning the top or bottom surface of the substrate W, thereby realizing a reduction in the size of the substrate cleaning apparatus 1 and the number of parts.

(5) The substrate cleaning apparatus 1 according to the above embodiment may be configured to clean the outer peripheral edge of the substrate W held and rotated by the lower holding device 20. In this case, the substrate cleaning apparatus 1 can clean the entire upper surface, lower surface and outer peripheral edge of the substrate W.

(6) In the substrate cleaning apparatus 1 according to the above embodiment, when cleaning the central portion of the underside of the substrate W held by the upper holding devices 10A, 10B, cleaning liquid is supplied from the liquid nozzle 52 to the underside of the substrate W, but the present invention is not limited to this. Instead of supplying cleaning liquid from the liquid nozzle 52 to the underside of the substrate W when cleaning the central portion of the underside of the substrate W, cleaning liquid may be supplied from the liquid nozzle 52 to the underside brush 51 so that a certain amount of cleaning liquid is impregnated before cleaning the central portion of the underside of the substrate W. In this case, it is possible to prevent the cleaning liquid from splashing when cleaning the central portion of the underside of the substrate W.

(7) In the substrate cleaning apparatus 1 according to the above embodiment, when the upper surface of the substrate W is cleaned by the upper surface brush 83, cleaning liquid is supplied from the liquid discharge nozzle 85 to the upper surface of the substrate W, but the present invention is not limited to this. By arranging the liquid discharge nozzle 85 so as to face the upper surface brush 83 in a standby state, cleaning liquid may be supplied from the liquid discharge nozzle 85 to the upper surface brush 83 so that a certain amount of cleaning liquid is impregnated before the upper surface of the substrate W is cleaned by the upper surface brush 83.

(8) In the substrate cleaning apparatus 1 according to the above embodiment, the central portion of the underside of the substrate W is cleaned by the lower surface brush 51 while the substrate W is held by the upper holding device 10A, 10B. Also, the outer region of the underside of the substrate W is cleaned by the lower surface brush 51 while the substrate W is held by the lower holding device 20. Furthermore, the entire upper surface of the substrate W is cleaned by the upper surface brush 83 while the substrate W is held by the lower holding device 20.

Here, the portion of the upper surface of the substrate W that corresponds to the lower surface central portion (the portion opposite the lower surface central portion) is referred to as the upper surface central portion, and the portion of the upper surface of the substrate W that corresponds to the lower surface outer region (the portion opposite the lower surface outer region) is referred to as the upper surface outer region.

In addition to the above example, in the substrate cleaning apparatus 1, while the substrate W is held by the upper holding devices 10A, 10B, cleaning of the central portion of the lower surface of the substrate W by the lower brush 51 and cleaning of the central portion of the upper surface of the substrate W by the upper brush 83 may be performed simultaneously. Also, while the substrate W is held by the lower holding device 20, cleaning of the outer region of the lower surface of the substrate W by the lower brush 51 and cleaning of the outer region of the upper surface of the substrate W by the upper brush 83 may be performed simultaneously.

In these cases, when cleaning the central portion of the bottom surface and the central portion of the top surface of the substrate W, the central portion of the substrate W is sandwiched between the bottom brush 51 and the top brush 83. Also, when cleaning the outer regions of the bottom surface and the top surface, the peripheral portion of the substrate W is sandwiched between the bottom brush 51 and the top brush 83. This cancels out the bottom cleaning pressure force and the top cleaning pressure force applied to each portion of the substrate W, preventing the substrate W from being deformed by the pressure force applied to the substrate W from the bottom brush 51 and the top brush 83.

(9) Although the lower brush 51 and the upper brush 83 in the above embodiment basically have the same configuration, the lower brush 51 and the upper brush 83 may have different configurations. For example, the contact surface of the lower brush 51 and the contact surface of the upper brush 83 may have different shapes or sizes.

[7] Correspondence between each component of the claims and each element of the embodiment The following describes an example of the correspondence between each component of the claims and each element of the embodiment. In the above embodiment, the suction holding unit 21 and the upper holding devices 10A and 10B are examples of the substrate holding unit, the lower brush 51 (or the upper brush 83) is an example of the first cleaning tool and brush, the air cylinder 520 (or the air cylinder 820) is an example of the first fluid cylinder, the electropneumatic regulator 521 (or the electropneumatic regulator 821) is an example of the first cylinder driving unit, the first force f1 (or the third force f3) is an example of the first force, the second force f2 (or the fourth force f4) is an example of the second force, and the substrate cleaning device 1 is an example of the substrate cleaning device.

In addition, the lower brush holding member 512 (or the upper brush holding member 812) is an example of a first cleaning tool holding part, the lower brush support part 59 (or the upper brush support part 82) is an example of a support member and a casing member, the load sensor 550 (or the load sensor 850) is an example of a load sensor, and the component group including the load sensor 550, the descent detection part 560 and the control part 9 (or the component group including the load sensor 850 and the control part 9) is an example of an abnormality detection part.

In addition, the upper brush 83 (or the lower brush 51) is an example of a second cleaning tool, the air cylinder 820 (or the air cylinder 520) is an example of a second fluid cylinder, the electro-pneumatic regulator 821 (or the electro-pneumatic regulator 521) is an example of a second cylinder drive unit, the third force f3 (or the first force f1) is an example of a third force, and the fourth force f4 (or the second force f2) is an example of a fourth force.

Furthermore, the lower brush 51 and the upper brush 83 are examples of cleaning tools, the lower brush holding member 512 and the upper brush holding member 812 are examples of cleaning tool holding parts, the air cylinders 520, 820 are examples of fluid cylinders, and the electropneumatic regulators 521, 821 are examples of cylinder driving parts.

As each component of a claim, various other elements having the configuration or function described in the claim may be used.
[8] Reference form
(1) A substrate cleaning apparatus according to a first reference embodiment includes a substrate holding part that holds a substrate in a horizontal position, a first cleaning tool that is arranged to be able to contact one of the upper and lower surfaces of the substrate held by the substrate holding part, a first fluid cylinder that applies an upward force to the first cleaning tool, and a first cylinder driving part that drives the first fluid cylinder, wherein the first cylinder driving part drives the first fluid cylinder to apply an upward first force to the first cleaning tool when in standby, and when cleaning one surface of the substrate, drives the first fluid cylinder to apply an upward second force different from the first force to the first cleaning tool while the first cleaning tool is in contact with the one surface of the substrate, thereby causing the first cleaning tool to press against the one surface with a predetermined force.
The time required to control the first fluid cylinder increases as the amount of change in the force generated by the first fluid cylinder increases. In the above substrate cleaning apparatus, during standby, the first fluid cylinder applies a first upward force to the first cleaning tool. Meanwhile, during cleaning, the first fluid cylinder applies a second upward force to the first cleaning tool. Therefore, by reducing the difference between the first force and the second force, the time required to control the first fluid cylinder can be shortened when switching from the standby state to the cleaning state. This improves the throughput of substrate processing in which one side of a substrate is cleaned.
(2) The first force may be determined such that when the first fluid cylinder applies an upward first force to the first cleaning tool, the weight of at least a portion of the first cleaning tool is offset.
In this case, when switching from the standby state to the cleaning state, the time required to control the first fluid cylinder caused by the weight of the first cleaning tool is reduced.
(3) The substrate cleaning apparatus may further include a first cleaning tool holder that holds the first cleaning tool, and the first fluid cylinder may apply an upward first or second force to the first cleaning tool via the first cleaning tool holder.
In this case, it is not necessary to directly attach the first cleaning tool to the first fluid cylinder, which improves the degree of freedom in the layout of the first cleaning tool and the first fluid cylinder.
(4) The substrate cleaning apparatus may further include a support member that supports the first fluid cylinder, and a support member moving unit configured to move the support member at least in the vertical direction and that moves the support member between a contact position where the first cleaning tool contacts one side of the substrate held by the substrate holding unit and a standby position where the first cleaning tool is separated from the one side of the substrate held by the substrate holding unit.
In this case, it becomes possible to perform control of the first fluid cylinder and control for moving the support member in parallel, thereby further improving the throughput of substrate processing.
(5) The support member may comprise a casing member formed to accommodate the first fluid cylinder and the first cleaning tool holder, and at least a portion of the first cleaning tool may be held by the first cleaning tool holder so as to be located outside the casing member.
In this case, since the first fluid cylinder and the first cleaning tool holder are housed in the casing member, scattering of particles generated from the first fluid cylinder and the first cleaning tool holder is prevented.
(6) The substrate cleaning apparatus may further include a load sensor that detects an upward force applied from the first fluid cylinder to the first cleaning tool, and the first cylinder driving unit may adjust the force applied by the first fluid cylinder to the first cleaning tool based on the output of the load sensor.
In this case, the force applied by the first fluid cylinder to the first cleaning tool can be adjusted more accurately based on the output of the load sensor, and therefore, when cleaning the one surface of the substrate, the first cleaning tool can be pressed against the one surface of the substrate with a predetermined force.
(7) The first cleaning tool includes a brush having a contact surface that faces one side of the substrate held by the substrate holding part and is capable of contacting the one side of the substrate, and in a plan view, the length between the two most distant points on the contact surface of the brush may be greater than 1/3 of the diameter of the substrate.
In this case, at least a portion of one surface of the substrate can be efficiently cleaned over a wide area.
(8) The substrate cleaning apparatus may further include an abnormality detection unit that detects when the first cleaning tool is not in contact with one surface of the substrate during cleaning of the one surface.
In this case, the user can easily and quickly grasp the occurrence of an abnormality in the substrate cleaning apparatus based on the detection result.
(9) The substrate cleaning apparatus may further include a second cleaning tool arranged to be able to contact the other of the upper and lower surfaces of the substrate held by the substrate holding unit, a second fluid cylinder that applies an upward force to the second cleaning tool, and a second cylinder driving unit that drives the second fluid cylinder, wherein the second cylinder driving unit drives the second fluid cylinder to apply an upward third force to the second cleaning tool during standby, and when cleaning the other side of the substrate, drives the second fluid cylinder so that, with the second cleaning tool in contact with the other side of the substrate, it applies an upward fourth force to the second cleaning tool that is different from the third force, thereby causing the second cleaning tool to press against the other side with a predetermined force.
The time required to control the second fluid cylinder increases as the change in the force generated by the second fluid cylinder increases. According to the above configuration, by reducing the difference between the third force and the fourth force, the time required to control the second fluid cylinder can be shortened when switching from the standby state to the cleaning state. This improves the throughput of substrate processing in which one side and the other side of a substrate are cleaned.
(10) A substrate cleaning apparatus according to a second reference embodiment includes a substrate holding part that holds a substrate in a horizontal position, a cleaning tool configured to clean one of the upper and lower surfaces of a substrate held by the substrate holding part by contacting the one surface, a cleaning tool holding part having a first end and a second end and holding the cleaning tool at the first end, a fluid cylinder that supports the cleaning tool holding part and applies an upward force to the cleaning tool holding part so that the cleaning tool held by the cleaning tool holding part presses against the one surface of the substrate held by the substrate holding part, and a cylinder driving part that drives the fluid cylinder, and the fluid cylinder supports a portion of the cleaning tool holding part between the first end and the second end.
In the substrate cleaning apparatus, the fluid cylinder supports the cleaning tool holder except for the first end and the second end. In this case, the support state of the cleaning tool holder by the fluid cylinder is more stable than when the fluid cylinder supports either the first end or the second end of the cleaning tool holder. This makes it possible to stably press the cleaning tool against one side of the substrate with a predetermined force when cleaning the substrate. In addition, since there is no need to provide a fluid cylinder near the first end and the second end of the cleaning tool holder, the structure around the cleaning tool is prevented from becoming large. As a result, it is possible to properly clean one side of the substrate while preventing the structure around the cleaning tool from becoming large.
(11) A substrate cleaning method according to a third reference embodiment includes the steps of holding a substrate in a horizontal position using a substrate holding part, having a first cleaning tool waiting for cleaning one of an upper surface and a lower surface of the substrate held by the substrate holding part, and cleaning the one surface by contacting the first cleaning tool with the one surface of the substrate held by the substrate holding part, wherein the step of having the first cleaning tool waiting includes driving a first fluid cylinder to apply an upward first force to the first cleaning tool, and the step of cleaning the one surface of the substrate includes driving the first fluid cylinder, while the first cleaning tool is in contact with the one surface of the substrate, to apply an upward second force different from the first force to the first cleaning tool so that the first cleaning tool presses the one surface with a predetermined force.
The time required to control the first fluid cylinder increases as the amount of change in the force generated in the first fluid cylinder increases. In the above substrate cleaning method, during standby, the first fluid cylinder applies a first upward force to the first cleaning tool. Meanwhile, during cleaning, the first fluid cylinder applies a second upward force to the first cleaning tool. Therefore, by reducing the difference between the first force and the second force, the time required to control the first fluid cylinder can be shortened when switching from the standby state to the cleaning state. This improves the throughput of substrate processing in which one surface of a substrate is cleaned.
(12) The first force may be determined such that when the first fluid cylinder applies an upward first force to the first cleaning tool, the weight of at least a portion of the first cleaning tool is offset.
In this case, when switching from the standby state to the cleaning state, the time required to control the first fluid cylinder caused by the weight of the first cleaning tool is reduced.
(13) The substrate cleaning method may further include a step of detecting an upward force applied from the first fluid cylinder to the first cleaning tool by a load sensor, and a step of adjusting the force applied by the first fluid cylinder to the first cleaning tool based on an output of the load sensor.
In this case, the force applied by the first fluid cylinder to the first cleaning tool can be adjusted more accurately based on the output of the load sensor, and therefore, when cleaning the one surface of the substrate, the first cleaning tool can be pressed against the one surface of the substrate with a predetermined force.
(14) The step of cleaning one side of the substrate may include detecting that the first cleaning tool is not in contact with the one side.
In this case, the user can easily and quickly grasp the occurrence of an abnormality in the substrate cleaning apparatus based on the detection result.
(15) The substrate cleaning method may further include a step of having a second cleaning tool waiting for cleaning the other side of the upper and lower surfaces of the substrate held by the substrate holding part, and a step of cleaning the other side by contacting the second cleaning tool with the other side of the substrate held by the substrate holding part, wherein the step of having the second cleaning tool waiting includes driving the second fluid cylinder to apply an upward third force to the second cleaning tool, and the step of cleaning the other side of the substrate may include driving the second fluid cylinder, while the second cleaning tool is in contact with one side of the substrate, to apply an upward fourth force different from the third force to the second cleaning tool, thereby causing the second cleaning tool to press the other side with a predetermined force.
The time required to control the second fluid cylinder increases as the change in the force generated by the second fluid cylinder increases. According to the above configuration, by reducing the difference between the third force and the fourth force, the time required to control the second fluid cylinder can be shortened when switching from the standby state to the cleaning state. This improves the throughput of substrate processing in which one side and the other side of a substrate are cleaned.

1...substrate cleaning device, 2...unit housing, 2a...bottom surface portion, 2b, 2c, 2d, 2e...side wall portion, 2x...loading/unloading port, 9, 111...control portion, 10A, 10B...upper holding device, 11A, 11B...lower chuck, 12A, 12B...upper chuck, 13A, 13B...lower chuck drive portion, 14A, 14B...upper chuck drive portion, 20...lower holding device, 21...suction holding portion, 22...suction holding drive portion, 30...pedestal device, 31, 531, 831...linear guide, 32... Movable base, 33...base drive unit, 40...delivery device, 41...support pin, 42...pin connecting member, 43...pin lift drive unit, 50...underside cleaning device, 51...underside brush, 52...liquid nozzle, 53...gas ejection unit, 54...underside brush lift unit, 55...underside brush moving unit, 55a...underside brush operating unit, 55b...underside brush lift drive unit, 55c...underside brush moving drive unit, 56...underside cleaning liquid supply unit, 57...ejected gas supply unit, 59...underside brush support unit, 59u...upper surface, 6 0...cup device, 61...cup, 62...cup drive unit, 70...upper surface cleaning device, 71, 81...rotating support shaft, 72...arm, 73...spray nozzle, 74...rotating shaft drive unit, 75...upper surface cleaning fluid supply unit, 80...upper surface cleaning device, 82...upper surface brush support unit, 83...upper surface brush, 84...rotating shaft drive unit, 85...liquid discharge nozzle, 86...upper surface brush operation unit, 90...opening/closing device, 91...shutter, 92...shutter drive unit, 511, 811...rotating shaft, 512...lower surface brush Brush holder, 513, 813...rotational force transmission mechanism, 514, 814...motor, 515, 815...motor drive unit, 516, 816...shaft member, 520, 820...air cylinder, 521, 821...electropneumatic regulator, 550, 850...load sensor, 551, 851...sensor support member, 560...descent detection unit, 812...upper brush holder, f1...first force, f2...second force, f3...third force, f4...fourth force, RH...hand, rp...plane reference position

Claims (16)

A substrate cleaning apparatus for cleaning a substrate, comprising:
a substrate holder that holds the substrate in a horizontal position;
a first cleaning tool provided to be capable of contacting one of an upper surface and a lower surface of the substrate held by the substrate holding part;
a first fluid cylinder that exerts an upward force on the first cleaning tool;
a first cylinder driving unit that drives the first fluid cylinder,
The first cylinder driving unit includes :
driving the first fluid cylinder so as to maintain a state in which a first upward force is applied to the first cleaning tool during a standby state in which the power supply of the substrate cleaning apparatus is turned on and a substrate cleaning process is not being performed in the substrate cleaning apparatus and the first cleaning tool is not in contact with the one surface of the substrate ;
When cleaning of the one surface of the substrate is started, the first cleaning tool moves from a position spaced apart from the one surface of the substrate toward a position in contact with the one surface of the substrate;
The first cylinder driving unit further includes:
applying a second force, which is directed upward and different from the first force, to the first cleaning tool before the first cleaning tool reaches a position where the first cleaning tool contacts the one surface of the substrate when cleaning of the one surface of the substrate is started ;
A substrate cleaning apparatus comprising: a first fluid cylinder that drives the first cleaning tool while the first cleaning tool is in contact with the one surface of the substrate during cleaning of the one surface of the substrate , and applies the second force to the first cleaning tool, thereby causing the first cleaning tool to press against the one surface with a predetermined force. 2. The substrate cleaning apparatus of claim 1, wherein the cylinder driving unit drives the first fluid cylinder so that the first force is applied from the first fluid cylinder to the first cleaning tool when the substrate cleaning apparatus transitions from a power-off state in which no force is applied from the first fluid cylinder to the first cleaning tool to the standby state . 3. The substrate cleaning apparatus of claim 1, wherein the first force is determined such that when the first fluid cylinder applies the first force upward to the first cleaning tool, a weight of at least a portion of the first cleaning tool is offset. Further comprising a first cleaning tool holder for holding the first cleaning tool,
4. The substrate cleaning apparatus according to claim 1 , wherein the first fluid cylinder applies the first or second upward force to the first cleaning tool via the first cleaning tool holder. a support member that supports the first fluid cylinder;
5. The substrate cleaning apparatus of claim 4, further comprising a support member moving unit configured to move the support member at least in the vertical direction and to move the support member between a contact position where the first cleaning tool contacts the one surface of the substrate held by the substrate holding unit and a standby position where the first cleaning tool is separated from the one surface of the substrate held by the substrate holding unit. the support member is a casing member formed to accommodate the first fluid cylinder and the first cleaning tool holder,
The substrate cleaning apparatus according to claim 5 , wherein at least a portion of the first cleaning tool is held by the first cleaning tool holder so as to be located outside the casing member. a load sensor that detects an upward force applied from the first fluid cylinder to the first cleaning tool;
7. The substrate cleaning apparatus according to claim 1 , wherein the first cylinder driving unit adjusts the force applied by the first fluid cylinder to the first cleaning tool based on an output of the load sensor. The first cleaning tool includes:
a brush having a contact surface that faces the one surface of the substrate held by the substrate holding portion and is capable of contacting the one surface of the substrate,
8. The substrate cleaning apparatus according to claim 1 , wherein a length between two points on the contact surface of the brush that are furthest apart in a plan view is greater than ⅓ of a diameter of the substrate. The substrate cleaning apparatus according to claim 1 , further comprising an abnormality detection unit that detects when the first cleaning tool is not in contact with the one surface of the substrate during cleaning of the one surface. a second cleaning tool provided to be capable of contacting the other of the upper and lower surfaces of the substrate held by the substrate holding part; and
a second fluid cylinder that exerts an upward force on the second cleaning tool;
and a second cylinder driving unit that drives the second fluid cylinder,
The substrate cleaning apparatus of any one of claims 1 to 9, wherein the second cylinder driving unit drives the second fluid cylinder so as to apply an upward third force to the second cleaning tool during standby, and drives the second fluid cylinder so as to apply an upward fourth force, different from the third force, to the second cleaning tool while the second cleaning tool is in contact with the other side of the substrate, thereby causing the second cleaning tool to press the other side with a predetermined force. A substrate cleaning method using a substrate cleaning apparatus for cleaning a substrate, comprising the steps of:
the substrate cleaning apparatus includes a substrate holder, a first cleaning tool, and a first fluid cylinder;
The substrate cleaning method includes:
holding the substrate in a horizontal position by the substrate holder;
a step of placing the first cleaning tool for cleaning one of the upper and lower surfaces of the substrate held by the substrate holding unit on standby during a standby period when the power supply of the substrate cleaning apparatus is turned on, a substrate cleaning process is not being performed, and the first cleaning tool is not in contact with the one surface of the substrate ;
and cleaning the one surface of the substrate held by the substrate holding part by contacting the first cleaning tool with the one surface of the substrate,
the step of putting the first cleaning tool on standby includes actuating the first fluid cylinder so as to maintain a state in which a first upward force is applied to the first cleaning tool during the standby state;
When cleaning of the one surface of the substrate is started, the first cleaning tool moves from a position spaced apart from the one surface of the substrate toward a position in contact with the one surface of the substrate;
The step of cleaning the one side of the substrate includes :
applying a second force, which is directed upward and different from the first force, to the first cleaning tool before the first cleaning tool reaches a position where the first cleaning tool contacts the one side of the substrate as a result of starting cleaning of the one side of the substrate;
A method for cleaning a substrate , comprising: applying the second force to the first cleaning tool while the first cleaning tool is in contact with the one surface of the substrate, thereby driving the first fluid cylinder so that the first cleaning tool presses against the one surface with a predetermined force. 12. The substrate cleaning method of claim 11, wherein the step of putting the first cleaning tool on standby includes driving the first fluid cylinder so that the first force is applied from the first fluid cylinder to the first cleaning tool when transitioning from a state in which the substrate cleaning apparatus is powered off and no force is applied from the first fluid cylinder to the standby state . 13. The method for cleaning a substrate according to claim 11 or 12, wherein the first force is determined such that a weight of at least a portion of the first cleaning tool is offset when the first fluid cylinder applies the first force in an upward direction to the first cleaning tool. detecting an upward force applied from the first fluid cylinder to the first cleaning tool by a load sensor;
The substrate cleaning method according to claim 11 , further comprising the step of : adjusting the force applied by the first fluid cylinder to the first cleaning tool based on an output of the load sensor. The substrate cleaning method according to claim 11 , wherein the step of cleaning the one side of the substrate includes detecting that the first cleaning tool is not in contact with the one side. a step of having a second cleaning tool stand by for cleaning the other of the upper surface and the lower surface of the substrate held by the substrate holding part;
and cleaning the other surface of the substrate held by the substrate holding part by contacting the second cleaning tool with the other surface,
the step of parking the second cleaning tool includes actuating a second fluid cylinder to apply a third upward force to the second cleaning tool;
The substrate cleaning method according to any one of claims 11 to 15, wherein the step of cleaning the other side of the substrate includes driving the second fluid cylinder so that, while the second cleaning tool is in contact with the one side of the substrate, the second cleaning tool presses the other side with a predetermined force by applying a fourth force to the second cleaning tool in an upward direction and different from the third force.

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