JP7656749B2 - Electronic Components - Google Patents

Description

The present invention relates to electronic components.

A known electronic component includes a rectangular parallelepiped body, a plurality of external electrodes, and a plurality of internal electrodes (see, for example, Patent Document 1). The body has a pair of end faces facing each other in a first direction, and at least one side face adjacent to the pair of end faces. The plurality of external electrodes are respectively arranged on both ends of the body in the first direction. Each of the plurality of external electrodes has a conductive resin layer that contains a number of metal particles and resin and is arranged on at least one side face. The plurality of external electrodes are respectively arranged on both ends of the body in the first direction. The plurality of internal electrodes are arranged within the body, and have one end exposed to a corresponding one of the pair of end faces. Each of the plurality of internal electrodes is connected at the one end to a corresponding one of the plurality of external electrodes.

JP 2018-006501 A

In a configuration in which each external electrode has a conductive resin layer, migration may occur in the external electrodes. If migration occurs in the external electrodes, multiple external electrodes may short-circuit. Migration is thought to occur, for example, due to the following events:
The electric field generated between the internal electrode and the conductive resin layer to which the internal electrode is not electrically connected acts on the metal particles, ionizing the atoms of the metal particles. The generated metal ions are attracted to the electric field generated between the external electrodes and migrate from the conductive resin layer. The metal ions that migrate from the conductive resin layer react with electrons supplied from the element body, for example, and are precipitated as metal on the surface of the element body.

One aspect of the present invention aims to provide an electronic component that suppresses short circuits between multiple external electrodes even when migration occurs in the external electrodes.

An electronic component according to one aspect of the present invention includes a rectangular parallelepiped body, a plurality of external electrodes, a plurality of internal electrodes, and an external conductor. The body has a pair of end faces facing each other in a first direction, and at least one side face adjacent to the pair of end faces. The plurality of external electrodes are disposed on both ends of the body in the first direction. Each of the plurality of external electrodes has a conductive resin layer that contains a number of metal particles and resin and is disposed on at least one side face. The plurality of internal electrodes are disposed within the body, and have one end exposed on a corresponding one of the pair of end faces. The external conductor is disposed between the conductive resin layers on at least one side face, and is spaced apart from each conductive resin layer. Each of the plurality of internal electrodes is connected at one end to a corresponding one of the plurality of external electrodes, and is not connected to the external conductor. The external conductor is made of a conductive material that is less susceptible to migration than metal particles.

In one embodiment of the present invention, the external conductor is made of a conductive material that is less susceptible to migration than metal particles. Therefore, even if migration growing from the conductive resin layer reaches the external conductor, the migration is less likely to grow beyond the external conductor. The external conductor is not connected to the multiple internal electrodes. As a result, the multiple external electrodes are less likely to short-circuit.

In the above aspect, the at least one side surface may include a pair of first side surfaces facing each other in the second direction and a pair of second side surfaces facing each other in the third direction. The internal electrodes may be disposed within the element body so as to face each other in the second direction. Each conductive resin layer and each external conductor may be disposed on each second side surface.
In a configuration in which the conductive resin layer is disposed on the second side surface, an electric field generated between the conductive resin layer disposed on the second side surface and an internal electrode that is not electrically connected to the conductive resin layer acts on the metal particles, and therefore migration may grow from the conductive resin layer disposed on the second side surface.
However, in a configuration in which the external conductor is disposed on the second side surface, migration is unlikely to grow beyond the external conductor, and therefore, even in a configuration in which the conductive resin layer is disposed on the second side surface, the external electrodes are unlikely to short-circuit.

Each conductive resin layer and each external conductor may be further disposed on each first side surface.
In a configuration in which a conductive resin layer is disposed on the first side surface, an electric field generated between the conductive resin layer disposed on the first side surface and an internal electrode that is not electrically connected to the conductive resin layer acts on the metal particles, and therefore migration may grow from the conductive resin layer disposed on the first side surface.
However, in a configuration in which the external conductor is disposed on the first side surface, migration is unlikely to grow beyond the external conductor, and therefore, even in a configuration in which the conductive resin layer is disposed on the first side surface, the external electrodes are unlikely to short-circuit.

The external conductors arranged on each second side surface and the external conductors arranged on each first side surface may be integrally formed.

Each conductive resin layer may be further disposed on each first side surface. In two conductive resin layers located on the same first side surface, one conductive resin layer may have an edge facing the other conductive resin layer. Among the multiple internal electrodes, an outermost internal electrode located on the outermost side in the second direction may be adjacent in the second direction to the conductive resin layer to which the outermost internal electrode is electrically connected and which is disposed on the first side surface. With a plane including an end face to which the outermost internal electrode is exposed as a reference plane, a first length of the outermost internal electrode in the first direction from the reference plane may be larger than a second length in the first direction from the reference plane to an edge of the conductive resin layer to which the outermost internal electrode is electrically connected and which is disposed on the first side surface, and may be smaller than a third length from the reference plane to an edge of the conductive resin layer to which the outermost internal electrode is not electrically connected and which is disposed on the first side surface.
In a configuration in which the first length is longer than the second length, the internal electrode adjacent to the outermost internal electrode in the second direction and the conductive resin layer adjacent to the same outermost internal electrode in the second direction are not electrically connected to each other, but are unlikely to face each other in the second direction, and an electric field is unlikely to be generated between the conductive resin layer and the internal electrode that are not electrically connected to each other.
In a configuration in which the first length is shorter than the third length, the outermost internal electrode is unlikely to face the conductive resin layer to which the outermost internal electrode is not electrically connected and which is disposed on the first side surface in the second direction, and an electric field is unlikely to be generated between the conductive resin layer, which is not electrically connected to each other and which is disposed on the first side surface, and the outermost internal electrode.
As a result, the configuration in which the first length is greater than the second length and less than the third length suppresses the occurrence of migration from the conductive resin layer disposed on the first side surface.

A pair of dummy conductors may be provided, each of which is adjacent to a corresponding one of the pair of first side faces in the second direction. Each conductive resin layer may be further disposed on each first side face. Each dummy conductor may be opposed in the second direction to the conductive resin layer disposed on the first side face, such that an internal electrode adjacent to the dummy conductor in the second direction is not electrically connected to the dummy conductor.
In the configuration in which the dummy conductor is provided, the dummy conductor is located between the conductive resin layer located on the first side surface and the internal electrode not electrically connected to the conductive resin layer located on the first side surface. The dummy conductor separates the conductive resin layer located on the first side surface from the internal electrode not electrically connected to the conductive resin layer located on the first side surface. Therefore, an electric field is unlikely to be generated between the conductive resin layer located on the first side surface and the internal electrode not electrically connected to the conductive resin layer located on the first side surface. Even if an electric field is generated between the conductive resin layer located on the first side surface and the internal electrode not electrically connected to the conductive resin layer located on the first side surface, the strength of the electric field is small. As a result, the configuration in which the dummy conductor is provided suppresses the occurrence of migration from the conductive resin layer located on the first side surface.

In the above aspect, the at least one side surface may include a pair of first side surfaces facing each other in the second direction and a pair of second side surfaces facing each other in the third direction. One of the pair of second side surfaces may be arranged to form a mounting surface. Each conductive resin layer may be arranged to continuously cover a portion of one of the second side surfaces and a portion of the end surface corresponding to each of the first side surfaces. The multiple internal electrodes may be arranged within the element body to face each other in the second direction. The external conductor may be arranged on one of the second side surfaces.
In a configuration in which the conductive resin layer is disposed so as to continuously cover a portion of one of the second side faces and a portion of the end face corresponding to each of the first side faces, the conductive resin layer has a portion located on one of the second side faces. In a configuration in which the conductive resin layer has the portion located on one of the second side faces, as described above, migration may grow from the portion located on one of the second side faces.
However, in a configuration in which the external conductor is disposed on one of the second side faces, migration is unlikely to grow beyond the external conductor, and therefore, even in a configuration in which the conductive resin layer has the above-mentioned portion located on one of the second side faces, the multiple external electrodes are unlikely to short-circuit.

An outer conductor may further be disposed on each of the first sides.
The conductive resin layer also has a portion located on the first side surface. In a configuration in which the conductive resin layer has the portion located on the first side surface, as described above, migration may grow from the portion located on the first side surface.
However, in a configuration in which an external conductor is disposed on each first side surface, migration is unlikely to grow beyond the external conductor, and therefore, even in a configuration in which the conductive resin layer has the above-mentioned portion located on the first side surface, the multiple external electrodes are unlikely to short-circuit.

The external conductor arranged on one of the second sides and the external conductors arranged on each of the first sides may be integrally formed.

In the two conductive resin layers located on the same first side surface, one of the conductive resin layers may have an edge facing the other conductive resin layer. Among the multiple internal electrodes, an outermost internal electrode located outermost in the second direction may be adjacent in the second direction to the conductive resin layer to which the outermost internal electrode is electrically connected and which is arranged on the first side surface. Taking a plane including an end face to which the outermost internal electrode is exposed as a reference plane, a fourth length of the outermost internal electrode in the first direction from the reference plane to an edge of the conductive resin layer to which the outermost internal electrode is electrically connected and which is arranged on the first side surface may be greater than a fifth length in the first direction from the reference plane to an edge of the conductive resin layer to which the outermost internal electrode is electrically connected and which is arranged on the first side surface, and may be smaller than a sixth length from the reference plane to an edge of the conductive resin layer to which the outermost internal electrode is not electrically connected and which is arranged on the first side surface.
In a configuration in which the conductive resin layer is arranged to continuously cover a portion of one of the second side faces and a portion of the end face corresponding to each of the first side faces, the conductive resin layer also has a portion located on the first side face.
In the configuration in which the fourth length is longer than the fifth length, the internal electrode adjacent to the outermost internal electrode in the second direction and the conductive resin layer (the portion located on the first side surface) adjacent to the same outermost internal electrode in the second direction are not electrically connected to each other, but are unlikely to face each other in the second direction, and an electric field is unlikely to be generated between the conductive resin layer and the internal electrode that are not electrically connected to each other.
In a configuration in which the fourth length is shorter than the sixth length, the outermost internal electrode is unlikely to face the portion to which the outermost internal electrode is not electrically connected and which is located on the first side surface in the second direction, and an electric field is unlikely to be generated between the portion to which the outermost internal electrode is not electrically connected and which is located on the first side surface and the outermost internal electrode.
As a result, the configuration in which the fourth length is greater than the fifth length and less than the sixth length suppresses the occurrence of migration from the portion located on the first side surface.

A pair of dummy conductors may be provided, each of which is adjacent to a corresponding one of the pair of first side faces in the second direction. Each conductive resin layer may be further disposed on each first side face. Each dummy conductor may be opposed in the second direction to the conductive resin layer disposed on the first side face, such that an internal electrode adjacent to the dummy conductor in the second direction is not electrically connected to the dummy conductor.
As described above, the conductive resin layer also has a portion located on the first side surface.
In the configuration including the dummy conductor, the dummy conductor is located between the portion located on the first side surface and the internal electrode that is not electrically connected to the portion located on the first side surface. The dummy conductor separates the portion located on the first side surface from the internal electrode that is not electrically connected to the portion located on the first side surface. Therefore, an electric field is unlikely to be generated between the portion located on the first side surface and the internal electrode that is not electrically connected to the portion located on the first side surface. Even if an electric field is generated between the portion located on the first side surface and the internal electrode that is not electrically connected to the portion located on the first side surface, the strength of the electric field is small. As a result, the configuration including the dummy conductor suppresses the occurrence of migration from the portion located on the first side surface.

In the above aspect, the at least one side surface may include a pair of first side surfaces facing each other in the second direction and a pair of second side surfaces facing each other in the third direction. One of the pair of first side surfaces may be arranged to form a mounting surface. Each conductive resin layer may be arranged to continuously cover a portion of one of the first side surfaces and a portion of the end surface corresponding to each of the second side surfaces. The multiple internal electrodes may be arranged within the element body to face each other in the second direction. The external conductor may be arranged on each of the second side surfaces.
In a configuration in which the conductive resin layer is disposed so as to continuously cover a portion of one of the first side surfaces and a portion of the end surface corresponding to each of the second side surfaces, the conductive resin layer has a portion located on the second side surface. In a configuration in which the conductive resin layer has the portion located on the second side surface, as described above, migration may grow from the portion located on the second side surface.
However, in a configuration in which an external conductor is disposed on each second side surface, migration is unlikely to grow beyond the external conductor, and therefore, even in a configuration in which the conductive resin layer has the above-mentioned portion located on the second side surface, the multiple external electrodes are unlikely to short-circuit.

The outer conductor may further be disposed on one of the first sides.
The conductive resin layer also has a portion located on one of the first side faces. In a configuration in which the conductive resin layer has the portion located on one of the first side faces, as described above, there is a risk that migration will grow from the portion located on one of the first side faces.
However, in a configuration in which the external conductor is disposed on one of the first side surfaces, migration is unlikely to grow beyond the external conductor, and therefore, even in a configuration in which the conductive resin layer has the above-mentioned portion located on one of the first side surfaces, the multiple external electrodes are unlikely to short-circuit.

The external conductors arranged on each second side surface and the external conductor arranged on one of the first side surfaces may be integrally provided.

In the two conductive resin layers located on one of the first side faces, one of the conductive resin layers may have an edge facing the other conductive resin layer. Among the multiple internal electrodes, an outermost internal electrode located outermost in the second direction may be adjacent in the second direction to the conductive resin layer to which the outermost internal electrode is electrically connected and which is located on one of the first side faces. Taking a plane including an end face to which the outermost internal electrode is exposed as a reference plane, a fourth length of the outermost internal electrode in the first direction from the reference plane to an edge of the conductive resin layer to which the outermost internal electrode is electrically connected and which is located on one of the first side faces may be greater than a fifth length in the first direction from the reference plane to an edge of the conductive resin layer to which the outermost internal electrode is electrically connected and which is located on one of the first side faces, and may be smaller than a sixth length from the reference plane to an edge of the conductive resin layer to which the outermost internal electrode is not electrically connected and which is located on one of the first side faces.
In a configuration in which the conductive resin layer is arranged to continuously cover a portion of one of the first side surfaces and a portion of the end face corresponding to each of the second side surfaces, the conductive resin layer also has a portion located on one of the first side surfaces.
In the configuration in which the fourth length is longer than the fifth length, the internal electrode adjacent to the outermost internal electrode in the second direction and the conductive resin layer (the portion located on one of the first side faces) adjacent to the same outermost internal electrode in the second direction are not electrically connected to each other, but are unlikely to face each other in the second direction, and an electric field is unlikely to be generated between the conductive resin layer and the internal electrode that are not electrically connected to each other.
In a configuration in which the fourth length is shorter than the sixth length, the outermost internal electrode is unlikely to face the portion to which the outermost internal electrode is not electrically connected and which is located on one of the first side faces in the second direction, and an electric field is unlikely to be generated between the outermost internal electrode and the portion to which the outermost internal electrode is not electrically connected and which is located on one of the first side faces.
As a result, the configuration in which the fourth length is greater than the fifth length and less than the sixth length suppresses the occurrence of migration from the portion located on one of the first side surfaces.

A dummy conductor may be provided that is located in the same layer as the outermost internal electrode and spaced apart from the outermost internal electrode. The dummy conductor may be electrically connected to an external electrode that is not electrically connected to the outermost internal electrode that is located in the same layer as the dummy conductor.
In a configuration in which the dummy conductor is located in the same layer as the outermost internal electrode, structural defects are unlikely to occur in the element.

Dummy conductors may be provided, each adjacent to one of the first side faces in the second direction. The dummy conductors may be opposed in the second direction to the conductive resin layer disposed on one of the first side faces, such that the internal electrodes adjacent to the dummy conductors in the second direction are not electrically connected to the dummy conductors.
As described above, the conductive resin layer also has a portion located on one of the first side surfaces.
In the configuration including the dummy conductor, the dummy conductor is located between the portion located on one of the first side faces and the internal electrode not electrically connected to the portion located on one of the first side faces. The dummy conductor separates the portion located on one of the first side faces from the internal electrode not electrically connected to the portion located on one of the first side faces. Therefore, an electric field is unlikely to be generated between the portion located on one of the first side faces and the internal electrode not electrically connected to the portion located on one of the first side faces. Even if an electric field is generated between the portion located on one of the first side faces and the internal electrode not electrically connected to the portion located on one of the first side faces, the strength of the electric field is small. As a result, the configuration including the dummy conductor suppresses the occurrence of migration from the portion located on one of the first side faces.

The metal particles contained in the conductive resin layer may include silver particles, and the conductive material may include copper.

One aspect of the present invention provides an electronic component that suppresses short circuits between multiple external electrodes even when migration occurs in the external electrodes.

FIG. 1 is a perspective view of a multilayer capacitor in accordance with an embodiment. FIG. 2 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with this embodiment. FIG. 3 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with this embodiment. FIG. 4 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with this embodiment. FIG. 5 is a diagram showing a mounting structure of the multilayer capacitor according to this embodiment. FIG. 6 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 7 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 8 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 9 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 10 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 11 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 12 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 13 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 14 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 15 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 16 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 17 is a perspective view of a multilayer capacitor according to a modified example of this embodiment. FIG. 18 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 19 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 20 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 21 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 22 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 23 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 24 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 25 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 26 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 27 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 28 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 29 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 30 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 31 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 32 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 33 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 34 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 35 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 36 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 37 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 38 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 39 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 40 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. FIG. 41 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment.

Below, an embodiment of the present invention will be described in detail with reference to the attached drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and duplicate descriptions will be omitted.

The configuration of the multilayer capacitor C1 according to this embodiment will be described with reference to Figures 1 to 4. Figure 1 is a perspective view of the multilayer capacitor according to this embodiment. Figures 2, 3, and 4 are views showing the cross-sectional configuration of the multilayer capacitor according to this embodiment. In this embodiment, the electronic component is, for example, the multilayer capacitor C1.

As shown in FIG. 1, the multilayer capacitor C1 includes a rectangular parallelepiped body 3, a plurality of external electrodes 5, and an external conductor 21. In this embodiment, the multilayer capacitor C1 includes a pair of external electrodes 5. The pair of external electrodes 5 and the external conductor 21 are disposed on the outer surface of the element body 3. The pair of external electrodes 5 are spaced apart from each other. Each external electrode 5 and each external conductor 21 are also spaced apart from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges.

The element body 3 has a pair of side surfaces 3a facing each other, a pair of side surfaces 3c facing each other, and a pair of end surfaces 3e facing each other. The pair of side surfaces 3a, the pair of side surfaces 3c, and the pair of end surfaces 3e are rectangular. The direction in which the pair of side surfaces 3a face each other is the second direction D2. The direction in which the pair of side surfaces 3c face each other is the third direction D3. The direction in which the pair of end surfaces 3e face each other is the first direction D1. The multilayer capacitor C1 is solder mounted to an electronic device. The electronic device includes, for example, a circuit board or an electronic component. In the multilayer capacitor C1, one side surface 3a faces the electronic device. The one side surface 3a is arranged to form a mounting surface. The one side surface 3a is the mounting surface. Of the pair of side surfaces 3c, one side surface 3c may be arranged to form a mounting surface. For example, when the side surface 3a forms the first side surface, the side surface 3c forms the second side surface.

The second direction D2 is a direction perpendicular to each side surface 3a and perpendicular to the third direction D3. The first direction D1 is a direction parallel to each side surface 3a and each side surface 3c, and perpendicular to the second direction D2 and the third direction D3. The third direction D3 is a direction perpendicular to each side surface 3c, and the first direction D1 is a direction perpendicular to each end surface 3e. In this embodiment, the length of the element body 3 in the first direction D1 is greater than the length of the element body 3 in the second direction D2 and is greater than the length of the element body 3 in the third direction D3. The first direction D1 is the longitudinal direction of the element body 3. The length of the element body 3 in the second direction D2 and the length of the element body 3 in the third direction D3 may be equal to each other. The length of the element body 3 in the second direction D2 and the length of the element body 3 in the third direction D3 may be different from each other.

The length of the element body 3 in the second direction D2 is the height of the element body 3. The length of the element body 3 in the third direction D3 is the width of the element body 3. The length of the element body 3 in the first direction D1 is the length of the element body 3. In this embodiment, the height of the element body 3 is 0.1 to 2.5 mm, the width of the element body 3 is 0.1 to 5.0 mm, and the length of the element body 3 is 0.2 to 5.7 mm. For example, the height of the element body 3 is 2.5 mm, the width of the element body 3 is 2.5 mm, and the length of the element body 3 is 3.2 mm.

The pair of side faces 3c extend in the second direction D2 so as to connect the pair of side faces 3a. The pair of side faces 3c also extend in the first direction D1. The pair of end faces 3e extend in the second direction D2 so as to connect the pair of side faces 3a. The pair of end faces 3e also extend in the third direction D3.

The element body 3 has four ridges 3g, four ridges 3i, and four ridges 3j. The ridges 3g are located between the end face 3e and the side face 3a. The ridges 3i are located between the end face 3e and the side face 3c. The ridges 3j are located between the side faces 3a and 3c. In this embodiment, the ridges 3g, 3i, and 3j are rounded to be curved. The element body 3 is subjected to so-called R-chamfering. The end face 3e and the side face 3a are indirectly adjacent to each other via the ridges 3g. The end face 3e and the side face 3c are indirectly adjacent to each other via the ridges 3i. The side faces 3a and 3c are indirectly adjacent to each other via the ridges 3j.

The element body 3 is configured by stacking a plurality of dielectric layers in the second direction D2. The element body 3 has a plurality of dielectric layers stacked on top of each other. In the element body 3, the stacking direction of the plurality of dielectric layers coincides with the second direction D2. Each dielectric layer is configured, for example, from a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material includes, for example, dielectric ceramics such as BaTiO3 _- based, Ba(Ti,Zr) _O3- based, or (Ba,Ca)TiO3 _- based. In the actual element body 3, each dielectric layer is integrated to such an extent that the boundaries between the dielectric layers are not visible.

As shown in Figures 2 to 4, the multilayer capacitor C1 has a plurality of internal electrodes 7 and a plurality of internal electrodes 9. Each of the internal electrodes 7, 9 is an internal conductor disposed within the element body 3. Each of the internal electrodes 7, 9 is made of a conductive material that is typically used as an internal conductor for a multilayer electronic component. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. The internal electrodes 7, 9 are configured as a sintered body of a conductive paste that includes the above-mentioned conductive material. In this embodiment, the internal electrodes 7, 9 are made of Ni.

The internal electrodes 7 and the internal electrodes 9 are arranged at different positions (layers) in the second direction D2. The internal electrodes 7 and the internal electrodes 9 are arranged alternately in the element body 3 so as to face each other at an interval in the second direction D2. The internal electrodes 7 and the internal electrodes 9 have mutually different polarities. One end of the internal electrodes 7, 9 is exposed at the corresponding end face 3e. The internal electrodes 7, 9 have one end exposed at the corresponding end face 3e.
The multiple internal electrodes 7 and the multiple internal electrodes 9 are arranged alternately in the second direction D2. The multiple internal electrodes 7, 9 are arranged in the element body 3 so as to be aligned in the second direction D2. Each internal electrode 7, 9 is located in a plane approximately parallel to the side surface 3a. The internal electrodes 7 and 9 face each other in the second direction D2. The direction in which the internal electrodes 7 and 9 face each other (second direction D2) is perpendicular to the direction parallel to the side surface 3a (third direction D3 and first direction D1).

In this embodiment, the multiple internal electrodes 7 include one internal electrode 7A located outermost in the second direction D2. The internal electrode 7A is the outermost internal electrode. In this embodiment, the multiple internal electrodes 9 include one internal electrode 9A located outermost in the second direction D2. The internal electrode 9A is the outermost internal electrode. Each of the internal electrodes 7, 9 is not exposed to a pair of side surfaces 3a and a pair of side surfaces 3c.
In FIG. 3, for the sake of explanation, the internal electrodes 7, 9 (internal electrodes 7A, 9A) are intentionally illustrated shifted from each other in the third direction D3.

As shown in FIG. 1, the external electrodes 5 are disposed on both ends of the element body 3 in the first direction D1. Each external electrode 5 is disposed on the corresponding end face 3e side of the element body 3. In this embodiment, each external electrode 5 is disposed on a pair of side faces 3a, a pair of side faces 3c, and one end face 3e. As shown in FIG. 2 and FIG. 3, the external electrode 5 has a plurality of electrode portions 5a, 5c, 5e. The electrode portion 5a is disposed on the side face 3a and the ridge portion 3g. Each electrode portion 5c is disposed on the side face 3c and the ridge portion 3i. The electrode portion 5e is disposed on the end face 3e. The external electrode 5 also has an electrode portion disposed on the ridge portion 3j.

The external electrode 5 is formed on five surfaces, namely, a pair of side surfaces 3a, one end surface 3e, and a pair of side surfaces 3c, as well as on the ridges 3g, 3i, and 3j. The electrode portions 5a, 5c, and 5e adjacent to each other are connected and electrically connected. The electrode portion 5e covers one end of the corresponding internal electrode 7, 9 in its entirety. The electrode portion 5e is directly connected to the corresponding internal electrode 7, 9. The external electrode 5 is electrically connected to the corresponding internal electrode 7, 9. As shown in Figs. 2 and 3, the external electrode 5 has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The third electrode layer E3 constitutes the outermost layer of the external electrode 5. Each of the electrode portions 5a and 5c has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. Each of the electrode portions 5e has a first electrode layer E1 and a third electrode layer E3.

The first electrode layer E1 of the electrode unit 5a is disposed on the side surface 3a and the ridge portion 3g. The first electrode layer E1 of the electrode unit 5a is formed so as to cover a part of the side surface 3a and the entire ridge portion 3g. The first electrode layer E1 of the electrode unit 5a is in contact with the part of the side surface 3a and the entire ridge portion 3g. That is, in the electrode unit 5a, the first electrode layer E1 is in direct contact with the element body 3. The part of the side surface 3a is covered by the first electrode layer E1, and the remaining part excluding the part is exposed from the first electrode layer E1. The part of the side surface 3a is a partial region of the side surface 3a near the end surface 3e. The first electrode layer E1 of the electrode unit 5a is located on the side surface 3a. The first electrode layer E1 does not have to be formed on the side surface 3a. That is, the first electrode layer E1 does not have to be disposed on the side surface 3a.
The second electrode layer E2 of the electrode unit 5a is disposed on the first electrode layer E1 and the side surface 3a. In the electrode unit 5a, the second electrode layer E2 is formed so as to cover the first electrode layer E1 and a part of the side surface 3a. In the electrode unit 5a, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the side surface 3a. The second electrode layer E2 of the electrode unit 5a is formed so as to cover the first electrode layer E1 of the electrode unit 5a. In the electrode unit 5a, the second electrode layer E2 indirectly covers the side surface 3a so that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3a. The second electrode layer E2 of the electrode unit 5a is located on the side surface 3a.
The third electrode layer E3 of the electrode portion 5a is disposed on the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 covers the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode portion 5a, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode portion 5a is located on the side surface 3a.

The first electrode layer E1 of the electrode portion 5c is disposed on the side surface 3c and the ridge portion 3i. The first electrode layer E1 of the electrode portion 5c is formed so as to cover a part of the side surface 3c and the entire ridge portion 3i. The first electrode layer E1 of the electrode portion 5c is in contact with the part of the side surface 3c and the entire ridge portion 3i. That is, in the electrode portion 5c, the first electrode layer E1 is in direct contact with the element body 3. The part of the side surface 3c is covered by the first electrode layer E1, and the remaining part excluding the part is exposed from the first electrode layer E1. The part of the side surface 3c is a partial area of the side surface 3c near the end surface 3e. The first electrode layer E1 of the electrode portion 5c is located on the side surface 3c. The first electrode layer E1 does not have to be formed on the side surface 3c. That is, the first electrode layer E1 does not have to be disposed on the side surface 3c.
The second electrode layer E2 of the electrode portion 5c is disposed on the first electrode layer E1 and on the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is formed so as to cover the first electrode layer E1 and a part of the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the side surface 3c. The second electrode layer E2 of the electrode portion 5c is formed so as to cover the first electrode layer E1 of the electrode portion 5c. In the electrode portion 5c, the second electrode layer E2 indirectly covers the side surface 3c such that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3c. The second electrode layer E2 of the electrode portion 5c is located on the side surface 3c.
The third electrode layer E3 of the electrode portion 5c is disposed on the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 covers the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode portion 5c, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode portion 5c is located on the side surface 3c.

The first electrode layer E1 of the electrode portion 5e is disposed on the end surface 3e. The first electrode layer E1 of the electrode portion 5e is formed so as to cover the entire end surface 3e. The first electrode layer E1 of the electrode portion 5e is in contact with the entire end surface 3e. That is, in the electrode portion 5e, the first electrode layer E1 is in direct contact with the end surface 3e.
The second electrode layer E2 of the electrode unit 5e is disposed on the first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 is formed so as to cover the entire first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 is in direct contact with the first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 indirectly covers the end surface 3e such that the first electrode layer E1 is located between the second electrode layer E2 and the end surface 3e. The second electrode layer E2 of the electrode unit 5e is located on the end surface 3e.
The third electrode layer E3 of the electrode unit 5e is disposed on the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 covers the entire second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 is in contact with the entire second electrode layer E2. That is, in the electrode unit 5e, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit 5e is located on the end surface 3e.
The electrode unit 5e may not have the second electrode layer E2. When the electrode unit 5e does not have the second electrode layer E2, the third electrode layer E3 in the electrode unit 5e covers the entire first electrode layer E1 and is in direct contact with the first electrode layer E1.

The first electrode layer E1 is formed by baking a conductive paste applied to the surface of the element body 3. The first electrode layer E1 is formed so as to cover the part of the side surface 3a, the part of the side surface 3c, one end surface 3e, and the ridges 3g, 3i, and 3j. The first electrode layer E1 is formed by sintering metal components (metal particles) contained in the conductive paste. The first electrode layer E1 is a sintered metal layer. The first electrode layer E1 is a sintered metal layer formed on the element body 3. In this embodiment, the first electrode layer E1 is a sintered metal layer made of Cu. The first electrode layer E1 may be a sintered metal layer made of Ni. The first electrode layer E1 contains a base metal. The conductive paste contains, for example, particles made of Cu or Ni, a glass component, an organic binder, and an organic solvent. The first electrode layer E1 of each electrode portion 5a, 5c, and 5e is integrally formed.

The second electrode layer E2 is formed by curing the conductive resin applied onto the first electrode layer E1. The second electrode layer E2 is formed over the first electrode layer E1 and the element body 3. The first electrode layer E1 is a base metal layer for forming the second electrode layer E2. The second electrode layer E2 is a conductive resin layer that covers the first electrode layer E1. The conductive resin contains, for example, a resin, a conductive material, and an organic solvent. The resin is, for example, a thermosetting resin. The conductive material is, for example, metal particles. The metal particles are, for example, silver particles. In this embodiment, the second electrode layer E2 contains a plurality of silver particles. That is, the second electrode layer E2 contains a plurality of metal particles. The thermosetting resin is, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin. The second electrode layer E2 is in contact with a part of the ridge portion 3j. The second electrode layer E2 of each electrode portion 5a, 5c, and 5e is integrally formed.

The third electrode layer E3 is formed by plating on the second electrode layer E2 and on the first electrode layer E1 (the portion exposed from the second electrode layer E2). The third electrode layer E3 may have a multi-layer structure. In this case, the third electrode layer E3 has, for example, a Ni plating layer and a solder plating layer. The Ni plating layer is formed on the second electrode layer E2 and the first electrode layer E1. The solder plating layer is formed on the Ni plating layer. The solder plating layer covers the Ni plating layer. The Ni plating layer has better solder erosion resistance than the metal contained in the second electrode layer E2. The third electrode layer E3 may have a Sn plating layer, a Cu plating layer, or an Au plating layer instead of the Ni plating layer. The solder plating layer includes, for example, a Sn plating layer, a Sn-Ag alloy plating layer, a Sn-Bi alloy plating layer, or a Sn-Cu alloy plating layer. The third electrode layer E3 of each electrode portion 5a, 5c, and 5e is integrally formed.

The internal electrode 7 and the second electrode layer E2 of the electrode portion 5a to which the internal electrode 7 is not electrically connected face each other in the second direction D2. The internal electrode 7 and the second electrode layer E2 of the electrode portion 5c to which the internal electrode 7 is not electrically connected face each other in the third direction D3.
The internal electrode 9 and the second electrode layer E2 of the electrode portion 5a to which the internal electrode 9 is not electrically connected face each other in the second direction D2. The internal electrode 9 and the second electrode layer E2 of the electrode portion 5c to which the internal electrode 9 is not electrically connected face each other in the third direction D3.

As shown in Fig. 4, the external conductor 21 is disposed on a pair of side surfaces 3a and a pair of side surfaces 3c. The external conductor 21 has a portion 21a disposed on each side surface 3a and a portion 21c disposed on each side surface 3c. In this embodiment, the portion 21a and the portion 21c are provided integrally. The portion 21a and the portion 21c may be provided separately.
The portion 21a is disposed between the electrode portions 5a located on the same side surface 3a as the portion 21a, and is spaced apart from the electrode portion 5a. That is, the portion 21a is disposed between the second electrode layers E2 located on the same side surface 3a as the portion 21a, and is spaced apart from the second electrode layers E2.
The portion 21c is disposed between the electrode portions 5c located on the same side surface 3c as the portion 21c, and is spaced apart from the electrode portion 5c. That is, the portion 21c is disposed between the second electrode layers E2 located on the same side surface 3c as the portion 21c, and is spaced apart from the second electrode layer E2.
The internal electrodes 7 and 9 are not connected to the external conductor 21 (portions 21a and 21c). The external conductor 21 is spaced apart from the internal electrodes 7 and 9.

The external conductor 21 is, for example, a sintered metal layer. The external conductor 21 is, for example, a sintered metal layer made of copper. Copper is a conductive material that is less susceptible to migration than silver (silver particles contained in the second electrode layer E2). The external conductor 21 may be a sintered metal layer made of nickel (Ni). The external conductor 21 may be, for example, a conductive resin layer. In this case, the conductive material contained in the conductive resin layer may be, for example, a plurality of copper particles. The conductive material contained in the conductive resin layer may be, for example, a plurality of nickel particles.

When the external conductor 21 is a sintered metal layer, the external conductor 21 is formed, for example, by baking a conductive paste applied to the surface of the element body 3. In this case, the external conductor 21 is formed by sintering a metal component contained in the conductive paste. The external conductor 21 is formed so as to cover a part of each side surface 3a, a part of each side surface 3c, and a part of each ridge portion 3j. The conductive paste contains, for example, copper particles, a glass component, an organic binder, and an organic solvent.
A plating layer may be formed on the surface of the external conductor 21. The plating layer may have the same configuration as the third electrode layer E3, for example.

When the multilayer capacitor C1 is solder-mounted on an electronic device, an external force acting on the multilayer capacitor C1 from the electronic device may act on the element body 3 through the electrode portion 5c. The external force is transmitted to the electrode portion 5c from a solder fillet formed during solder mounting. The electronic device may include, for example, a circuit board or an electronic component.
In the multilayer capacitor C1, the electrode portion 5c has the second electrode layer E2. Therefore, it is difficult for an external force to act from the electrode portion 5c to the element body 3. As a result, the multilayer capacitor C1 suppresses the occurrence of cracks in the element body 3.

There is also a risk that an external force acting on the multilayer capacitor C1 from the electronic device will act on the element body 3 through the electrode portions 5a.
In the multilayer capacitor C1, the electrode portion 5a has the second electrode layer E2. Therefore, it is difficult for an external force to act from the electrode portion 5a to the element body 3. As a result, the multilayer capacitor C1 further suppresses the occurrence of cracks in the element body 3.

In the multilayer capacitor C1, the second electrode layer E2 is disposed on the side surface 3c. The second electrode layer E2 of the electrode portion 5c and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 face each other in the third direction D3. In this case, an electric field generated between the second electrode layer E2 of the electrode portion 5c and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 acts on the silver particles contained in the second electrode layer E2. Therefore, there is a risk that migration will grow from the second electrode layer E2 of the electrode portion 5c.
In the multilayer capacitor C1, the external conductor 21 (portion 21c) is disposed on the side surface 3c. Therefore, even if migration grows from the second electrode layer E2 of the electrode portion 5c, the migration is unlikely to grow beyond the portion 21c. As a result, even in the multilayer capacitor C1 in which the second electrode layer E2 is disposed on the side surface 3c, the external electrode 5 is unlikely to short-circuit.

In the multilayer capacitor C1, the second electrode layer E2 is disposed on the side surface 3a. The second electrode layer E2 of the electrode portion 5a and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 face each other in the second direction D2. In this case, an electric field generated between the second electrode layer E2 of the electrode portion 5a and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 acts on the silver particles contained in the second electrode layer E2. Therefore, there is a risk that migration will grow from the second electrode layer E2 of the electrode portion 5a.
In the multilayer capacitor C1, the external conductor 21 (portion 21a) is disposed on the side surface 3a. Therefore, even if migration grows from the second electrode layer E2 of the electrode portion 5a, the migration is unlikely to grow beyond the portion 21a. As a result, even in the multilayer capacitor C1 in which the second electrode layer E2 is disposed on the side surface 3a, the external electrode 5 is unlikely to short-circuit.

In the multilayer capacitor C1, the electrode portion 5e has a second electrode layer E2. The second electrode layer E2 of the electrode portion 5e relieves the stress acting on the solder fillet formed in the electrode portion 5e. Therefore, the multilayer capacitor C1 suppresses the occurrence of solder cracks.

Next, the mounting structure of the multilayer capacitor C1 will be described with reference to FIG. 5. FIG. 5 is a diagram showing the mounting structure of the multilayer capacitor according to this embodiment.

As shown in FIG. 5, the electronic component device includes a multilayer capacitor C1 and an electronic device ED. The electronic device ED is, for example, a circuit board or an electronic device. The multilayer capacitor C1 is solder-mounted to the electronic device ED. The electronic device ED has a main surface EDa and two pad electrodes PE. Each pad electrode PE is arranged on the main surface EDa. The two pad electrodes PE are spaced apart from each other. The multilayer capacitor C1 is arranged on the electronic device ED so that the side surface 3a constituting the mounting surface faces the main surface EDa. Each internal electrode 7, 9 is located in a plane approximately parallel to the main surface EDa. When the side surface 3c constitutes the mounting surface, each internal electrode 7, 9 is located in a plane approximately perpendicular to the main surface EDa.

When the multilayer capacitor C1 is solder-mounted, the molten solder wets and rises up the external electrode 5 (third electrode layer E3). When the wetted solder solidifies, a solder fillet SF is formed on the external electrode 5. The corresponding external electrodes 5 and pad electrodes PE are connected to each other via the solder fillets SF.
The external conductor 21 is not connected to the pad electrode PE. The electronic device ED may include a dummy pad that is not electrically connected to the pad electrode PE. In this case, the external conductor 21 may be connected to the dummy pad via a solder fillet.

Next, the structure of a multilayer capacitor _C11 according to a modified example of this embodiment will be described with reference to Figures 6 to 9. Figures 6, 7, 8, and 9 are diagrams showing the cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. The multilayer capacitor _C11 according to this modified example is generally similar or the same as the multilayer capacitor C1 described above, but this modified example differs from the present embodiment described above in terms of the structures of the internal electrodes 7A, 9A and the external conductor 21. Below, the differences between the present embodiment and this modified example will be mainly described.

As shown in Figures 6 and 7, the internal electrode 7A has a pair of ends _7Ae1 , _7Ae2 facing each other in the first direction D1. The end _7Ae1 is exposed to the end surface 3e. The end _7Ae2 is located within the element body 3. As shown in Figures 6 and 8, the internal electrode 9A has a pair of ends _9Ae1 , _9Ae2 facing each other in the first direction D1. The end _9Ae1 is exposed to the end surface 3e. The end _9Ae2 is located within the element body 3. For example, when each of the ends _7Ae1 , _9Ae1 constitutes a first end, each of the ends _7Ae2 , _9Ae2 constitutes a second end.

The second electrode layers E2 of the electrode portion 5a are located on the side surface 3a. Each of the second electrode layers E2 located on the same side surface 3a has an edge E2a _-e . On the same side surface 3a, the edge E2a- _e of one second electrode layer E2 faces the edge E2a- _e of the other second electrode layer E2.

6, the length L11 of the internal electrode 7A in the first direction D1 from the reference plane _PL1 is greater than the length _L21 in the first direction D1 from the reference plane PL1 to the edge E2ae of the second electrode layer _E2 electrically connected to the internal electrode 7A. Therefore, when the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is electrically connected are viewed from the second direction _D2 , the end 7Ae2 is exposed from the second electrode layer E2 to which the internal electrode 7A is electrically connected.
The length _L11 is smaller than the length _L31 in the first direction D1 from the reference plane PL1 to the edge E2a _-e of the second electrode layer E2 to which the internal electrode 7A is not electrically connected. Therefore, when the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is not electrically connected are viewed from the second direction D2, the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is not electrically connected do not overlap each other.
The reference plane PL1 includes an end surface 3e where an end 7Ae ₁ of the internal electrode 7A is exposed. For example, when the length L1 ₁ constitutes a first length, the length L2 ₁ constitutes a second length, and the length L3 ₁ constitutes a third length.

The length _L12 of the internal electrode 9A in the first direction D1 from the reference plane PL2 is greater than the length _L22 in the first direction D1 from the reference plane PL2 to the edge _E2ae of the second electrode layer E2 electrically connected to the internal electrode 9A. Therefore, when the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is electrically connected are viewed from the second direction D2, the edge _9Ae2 is exposed from the second electrode layer E2 to which the internal electrode 9A is electrically connected.
The length _L12 is smaller than the length _L32 in the first direction D1 from the reference plane PL2 to the edge E2a _-e of the second electrode layer E2 to which the internal electrode 9A is not electrically connected. Therefore, when the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected are viewed from the second direction D2, the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected do not overlap each other.
The reference plane PL2 includes an end surface 3e where an end 9Ae ₁ of the internal electrode 9A is exposed. For example, when the length L1 ₂ constitutes a first length, the length L2 ₂ constitutes a second length, and the length L3 ₂ constitutes a third length.

A length _L4-1 in the first direction D1 from the reference plane PL1 to the other end of the internal electrode 9 is smaller than a length _L2-1 . Therefore, when the internal electrode 9 that is not electrically connected to the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is electrically connected are viewed from the second direction D2, the internal electrode 9 and the second electrode layer E2 to which the internal electrode 7A is electrically connected overlap each other.
A length _L4-2 in the first direction D1 from the reference plane PL2 to the other end of the internal electrode 7 is smaller than a length _L2-2 . Therefore, when the internal electrode 7 that is not electrically connected to the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is electrically connected are viewed from the second direction D2, the internal electrode 7 and the second electrode layer E2 to which the internal electrode 9A is electrically connected overlap each other.

Length L1 ₁ and length L1 ₂ may be the same or different. Length L2 ₁ and length L2 ₂ may be the same or different. Length L3 ₁ and length L3 ₂ may be the same or different. Length L4 ₁ and length L4 ₂ may be the same or different.

The multilayer capacitor _C11 includes a plurality of conductors 11 and 13. The multilayer capacitor _C11 includes two conductors 11 and 13. In Fig. 7 and Fig. 8, for the purpose of explanation, the internal electrodes 7 and 9 (internal electrodes 7A and 9A) and the conductors 11 and 13 are intentionally illustrated shifted from each other in the third direction D3.
The conductor 11 is located in the same layer as the internal electrode 7A and is spaced apart from the internal electrode 7A. The conductor 11 has one end exposed at the corresponding end face 3e. One end of the conductor 11 is exposed at the end face 3e where one end of the internal electrode 9 is exposed. One end of the conductor 11 is entirely covered by the corresponding electrode portion 5e. The conductor 11 is directly connected to the corresponding electrode portion 5e. The conductor 11 is electrically connected to the corresponding external electrode 5. In the multilayer capacitor _C1-1 , the conductor 11 is electrically connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 9 is electrically connected. That is, the conductor 11 is electrically connected to the external electrode 5 to which the internal electrode 7 is not electrically connected.
The conductor 13 is located in the same layer as the internal electrode 9A and is spaced apart from the internal electrode 9A. The conductor 13 has one end exposed at the corresponding end face 3e. One end of the conductor 13 is exposed at the end face 3e where one end of the internal electrode 7 is exposed. One end of the conductor 13 is entirely covered by the corresponding electrode portion 5e. The conductor 13 is directly connected to the corresponding electrode portion 5e. The conductor 13 is electrically connected to the corresponding external electrode 5. In the multilayer capacitor _C1-1 , the conductor 13 is electrically connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 7 is electrically connected. That is, the conductor 13 is electrically connected to the external electrode 5 to which the internal electrode 9 is not electrically connected.
The conductors 11 and 13 constitute dummy conductors that are unlikely to contribute to the formation of capacitance.

In the multilayer capacitor _C1-1 , the lengths _L1-1 and _L1-2 are greater than the lengths _L2-1 and _L2-2 . Therefore, the internal electrodes 7 and 9 adjacent to the internal electrodes 7A and 9A in the second direction D2 and the second electrode layers E2 included in the electrode portions 5a adjacent to the internal electrodes 7A and 9A in the second direction D2 are not electrically connected to each other, but are unlikely to face each other in the second direction D2. An electric field is unlikely to be generated between the second electrode layers E2 and the internal electrodes 7 and 9 that are not electrically connected to each other.
The lengths _L11 and _L12 are smaller than the lengths _L31 and _L32 . Therefore, the internal electrodes 7A and 9A are unlikely to face, in the second direction D2, the second electrode layer E2 included in the electrode portion 5a to which the internal electrodes 7A and 9A are not electrically connected. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrodes 7A and 9A that are not electrically connected to each other.
As a result, the multilayer capacitor _C11 suppresses migration from occurring in the second electrode layer E2 of the electrode portion 5a. Therefore, the external conductor 21 does not need to have each portion 21a. In other words, the external conductor 21 does not need to be disposed on each side surface 3a. It is sufficient that the external conductor 21 is disposed on a pair of side surfaces 3c.

In the multilayer capacitor _C11 , the conductor 11 is electrically connected to the external electrode 5 to which the internal electrode 7A is not electrically connected, and the conductor 13 is electrically connected to the external electrode 5 to which the internal electrode 9A is not electrically connected.
In a configuration in which the conductors 11 and 13 are located in the same layer as the internal electrodes 7A and 9A, structural defects are unlikely to occur in the element body 3.

Next, the structure of a multilayer capacitor _C12 according to a modified example of this embodiment will be described with reference to Figures 10 to 12. Figures 10, 11, and 12 are diagrams showing the cross-sectional structure of the multilayer capacitor according to the modified example of this embodiment. The multilayer capacitor _C12 according to this modified example is generally similar or the same as the multilayer capacitor _C11 shown in Figures 6 to 9, but this modified example differs from the multilayer capacitor _C11 in terms of the structure of the conductors 11, 13. Below, the differences between the multilayer capacitor _C11 and this modified example will be mainly described.

The multilayer capacitor _C12 includes a pair of conductors 11 and 13. In Fig. 11 and Fig. 12, for the sake of explanation, the internal electrodes 7A and 9A and the conductors 11 and 13 are intentionally illustrated shifted from each other in the third direction D3. In the multilayer capacitor _C12 as well, the conductors 11 and 13 form dummy conductors that are unlikely to contribute to the formation of capacitance.

The conductor 11 is adjacent to one side surface 3a in the second direction D2. The conductor 11 is adjacent to the internal electrode 9A in the second direction D2. The conductor 11 is located between one side surface 3a and the internal electrode 9A. The conductor 11 includes a portion 11a and a portion 11b.
The portion 11a faces in the second direction D2 the second electrode layer E2 to which the internal electrode 9A is not electrically connected and which is disposed on one side surface 3a. Thus, the conductor 11 faces in the second direction D2 the second electrode layer E2 to which the internal electrode 9A is not electrically connected.
The portion 11b faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 9A is electrically connected and which is disposed on one side surface 3a.
For example, if portion 11a constitutes a first portion, portion 11b constitutes a second portion.

The portion 11a is spaced apart from the portion 11b in the first direction D1 and is not electrically connected to any of the second electrode layers E2. The portion 11a does not have an end exposed on the surface of the element body 3.
The portion 11b is electrically connected to the second electrode layer E2 facing the portion 11b in the second direction D2. The portion 11b has an end exposed at the end face 3e where the internal electrode 9A is exposed. The end of the portion 11b exposed at the end face 3e is directly connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 9A is electrically connected. The portion 11b is electrically connected to the external electrode 5 to which the internal electrode 9A is electrically connected.

The conductor 13 is adjacent to the other side surface 3a in the second direction D2. The conductor 13 is adjacent to the internal electrode 7A in the second direction D2. The conductor 13 is located between the other side surface 3a and the internal electrode 7A. The conductor 13 includes a portion 13a and a portion 13b.
The portion 13a faces in the second direction D2 the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on the other side surface 3a. Thus, the conductor 13 faces in the second direction D2 the second electrode layer E2 to which the internal electrode 7A is not electrically connected.
The portion 13b faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 7A is electrically connected and which is disposed on the other side surface 3a.

The portion 13a is spaced apart from the portion 13b in the first direction D1 and is not electrically connected to any of the second electrode layers E2. The portion 13a does not have an end exposed on the surface of the element body 3.
The portion 13b is electrically connected to the second electrode layer E2 facing the portion 13b in the second direction D2. The portion 13b has an end exposed at the end face 3e where the internal electrode 7A is exposed. The end of the portion 13b exposed at the end face 3e is directly connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 7A is electrically connected. The portion 13b is electrically connected to the external electrode 5 to which the internal electrode 7A is electrically connected.
For example, if portion 13a constitutes a first portion, portion 13b constitutes a second portion.

The end _7Ae2 overlaps with the conductor 13 (portion 13a) when viewed from the second direction D2. In the positional relationship between the internal electrode 9A, the second electrode layer E2 to which the internal electrode 9A is not electrically connected and which is disposed on one side surface 3a, and the conductor 13 (portion 13a), the conductor 13 (portion 13a) is located between the internal electrode 9A and the second electrode layer E2. Therefore, in the above positional relationship, the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected and which is disposed on one side surface 3a do not face each other in the second direction D2.

The end _9Ae2 overlaps with the conductor 11 (portion 11a) when viewed from the second direction D2. In the positional relationship between the internal electrode 7A, the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on the other side surface 3a, and the conductor 11 (portion 11a), the conductor 11 (portion 11a) is located between the internal electrode 7A and the second electrode layer E2. Therefore, in the above positional relationship, the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on the other side surface 3a do not face each other in the second direction D2.

In the multilayer capacitor _C12 , the conductor 11 is located between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2. The conductor 11 separates the second electrode layer E2 from the internal electrode 7A that is not electrically connected to the second electrode layer E2. Therefore, an electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2. Even if an electric field is generated between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2, the strength of the electric field is small.
The conductor 13 is located between the second electrode layer E2 and the internal electrode 9A that is not electrically connected to the second electrode layer E2. The conductor 13 separates the second electrode layer E2 from the internal electrode 9A that is not electrically connected to the second electrode layer E2. Therefore, an electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 9A that is not electrically connected to the second electrode layer E2. Even if an electric field is generated between the second electrode layer E2 and the internal electrode 9A that is not electrically connected to the second electrode layer E2, the strength of the electric field is small.
As a result, the multilayer capacitor _C12 suppresses migration from occurring in the second electrode layer E2 of the electrode portion 5a. Therefore, the external conductor 21 does not need to have each portion 21a. In other words, the external conductor 21 does not need to be disposed on each side surface 3a. It is sufficient that the external conductor 21 is disposed on a pair of side surfaces 3c.

In the multilayer capacitor _C12 , the conductor 11 includes a portion 11a and a portion 11b, and the conductor 13 includes a portion 13a and a portion 13b.
The portion 11a faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 9A adjacent to the conductor 11 in the second direction D2 is not electrically connected. The portion 11b faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 9A is electrically connected.
The portion 13a faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 7A adjacent to the conductor 13 in the second direction D2 is not electrically connected. The portion 13b faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 7A is electrically connected.
In the multilayer capacitor _C12 , the configuration on one end face 3e side from the center in the first direction D1 is unlikely to differ from the configuration on the other end face 3e side from the center in the first direction D1. Therefore, structural defects are unlikely to occur in the element body 3.

In the multilayer capacitor _C12 , the end _7Ae2 overlaps with the conductor 13 (portion 13a) when viewed from the second direction D2. Therefore, an electric field is even less likely to be generated between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2. The end _9Ae2 overlaps with the conductor 11 (portion 11a) when viewed from the second direction D2. Therefore, an electric field is even less likely to be generated between the second electrode layer E2 and the internal electrode 9A that is not electrically connected to the second electrode layer E2. As a result, the multilayer capacitor _C12 further suppresses migration from the second electrode layer E2 of the electrode portion 5a.

Next, the structure of a multilayer capacitor _C13 according to a modified example of this embodiment will be described with reference to Figures 13 to 16. Figures 13, 14, 15, and 16 are diagrams showing the cross-sectional structure of the multilayer capacitor according to the modified example of this embodiment. The multilayer capacitor _C13 according to this modified example is generally similar or the same as the multilayer capacitor _C12 shown in Figures 10 to 12, but this modified example differs from the multilayer capacitor _C12 in terms of the structure of the conductors 11, 13. Below, the differences between the multilayer capacitor _C12 and this modified example will be mainly described.

In the multilayer capacitor _C13 , the portion 11a and the portion 11b are integral. The conductor 11 has no end exposed on the surface of the element body 3. The conductor 11 is not connected to any of the external electrodes 5. In other words, the conductor 11 is not electrically connected to the second electrode layer E2. The conductor 11 is not connected to the external conductor 21 either.
The portions 13a and 13b are integral. The conductor 13 has no ends exposed on the surface of the element body 3. The conductor 13 is not connected to any of the external electrodes 5. In other words, the conductor 13 is not electrically connected to the second electrode layer E2. The conductor 13 is not connected to the external conductor 21 either.
14 and 15, for the sake of explanation, the internal electrodes 7, 9 and the conductors 11, 13 are intentionally illustrated shifted from each other in the third direction D3.

In this modified example, the external conductor 21 does not have to be arranged on each side surface 3a. The external conductor 21 only needs to be arranged on a pair of side surfaces 3c.

The end _7Ae2 faces the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on the other side surface 3a in the second direction D2. That is, the end _7Ae2 is exposed from the conductor 13 (portion 13a) when viewed from the second direction D2.
The end _9Ae2 faces the second electrode layer E2, which is not electrically connected to the internal electrode 9A and is disposed on one side surface 3a, in the second direction D2. That is, the end _9Ae2 is exposed from the conductor 11 (portion 11a) when viewed from the second direction D2.
In the multilayer capacitor _C13 , the length of the internal electrodes 7, 9 in the second direction D2 is increased, making it possible to increase the capacitance of the multilayer capacitor.

Next, the configuration of the multilayer capacitor _C14 according to a modified example of this embodiment will be described with reference to Figs. 17 to 21. Fig. 17 is a perspective view of the multilayer capacitor according to the modified example of this embodiment. Figs. 18, 19, 20, and 21 are views showing the cross-sectional configuration of the multilayer capacitor according to the modified example of this embodiment. The multilayer capacitor _C14 according to this modified example is generally similar to or the same as the multilayer capacitor C1 described above, but this modified example differs from the present embodiment described above in terms of the configurations of the external electrode 5 (second electrode layer E2) and the external conductor 21. Below, the differences between the present embodiment and this modified example described above will be mainly described.
18 to 20, for the sake of explanation, the internal electrodes 7, 9 and the conductors 11, 13 are intentionally illustrated shifted from one another in the third direction D3.

As shown in Figures 18 to 20, the external electrode 5 has a plurality of electrode portions _5a1 , _5a2 , 5c, and 5e. The electrode portion _5a1 is disposed on one side surface 3a constituting the mounting surface, and on a ridge portion 3g adjacent to the one side surface 3a. The electrode portion _5a2 is disposed on the other side surface 3a and on a ridge portion 3g adjacent to the other side surface 3a. Each electrode portion 5c is disposed on the side surface 3c and on the ridge portion 3i. The electrode portion 5e is disposed on the end surface 3e. The external electrode 5 also has an electrode portion disposed on the ridge portion 3j.
The electrode portions _5a1 , _5a2 , 5c, and 5e adjacent to each other are electrically connected to each other. The electrode portions _5a1 , 5c, and 5e each have a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The electrode portion _5a2 has the first electrode layer E1 and the third electrode layer E3.

The first electrode layer E1 of the electrode unit _5a1 is disposed on one side surface 3a and on the ridge portion 3g. The first electrode layer E1 of the electrode unit _5a1 is formed so as to cover a portion of the one side surface 3a and the entire ridge portion 3g. The first electrode layer E1 of the electrode unit _5a1 is in contact with the portion of the one side surface 3a and the entire ridge portion 3g. That is, in the electrode unit _5a1 , the first electrode layer E1 is in direct contact with the element body 3. The portion of the one side surface 3a is covered by the first electrode layer E1, and the remaining portion excluding the portion is exposed from the first electrode layer E1. The portion of the one side surface 3a is a partial region of the one side surface 3a near the end surface 3e. The first electrode layer E1 of the electrode unit _5a1 is located on the one side surface 3a. In the electrode unit _5a1 , the first electrode layer E1 does not have to be formed on the one side surface 3a. In other words, the first electrode layer E1 does not have to be disposed on one side surface 3a.
The second electrode layer E2 of the electrode portion _5a1 is disposed on the first electrode layer E1 and on one side surface 3a. In the electrode portion _5a1 , the second electrode layer E2 is formed so as to cover the first electrode layer E1 and a part of the one side surface 3a. In the electrode portion _5a1 , the second electrode layer E2 is in direct contact with the first electrode layer E1 and the one side surface _3a . The second electrode layer E2 of the electrode portion 5a1 is formed so as to cover the first electrode layer E1 of the electrode portion _5a1 . In the electrode portion _5a1 , the second electrode layer E2 indirectly covers the one side surface 3a so that the first electrode layer E1 is located between the second electrode layer E2 and the one side surface 3a. The second electrode layer E2 of the electrode portion _5a1 is located on the one side surface 3a. Each second electrode layer E2 located on the same one side surface 3a has an edge _E2ae . On the same one side surface 3a, an edge E2a _-e of one second electrode layer E2 faces an edge E2a- _e of the other second electrode layer E2.
The third electrode layer E3 of the electrode unit _5a1 is disposed on the second electrode layer E2. In the electrode unit _5a1 , the third electrode layer E3 covers the second electrode layer E2. In the electrode unit _5a1 , the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode unit _5a1 , the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode unit _5a1 , the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit _5a1 is located on one side surface 3a.

The first electrode layer E1 of the electrode unit _5a2 is disposed on the other side surface 3a and the ridge portion 3g. The first electrode layer E1 of the electrode unit _5a2 is formed so as to cover a part of the other side surface 3a and the entire ridge portion 3g. The first electrode layer E1 of the electrode unit _5a2 is in contact with the part of the other side surface 3a and the entire ridge portion 3g. That is, in the electrode unit _5a2 , the first electrode layer E1 is in direct contact with the element body 3. The part of the other side surface 3a is covered by the first electrode layer E1, and the remaining part excluding the part is exposed from the first electrode layer E1. The part of the other side surface 3a is a partial area of the other side surface 3a near the end surface 3e. The first electrode layer E1 of the electrode unit _5a2 is located on the other side surface 3a. The first electrode layer E1 does not have to be formed on the other side surface 3a. In other words, the first electrode layer E1 does not have to be disposed on the other side surface 3a.
The third electrode layer E3 of the electrode unit _5a2 is disposed on the first electrode layer E1. In the electrode unit _5a2 , the third electrode layer E3 covers the first electrode layer E1. In the electrode unit _5a2 , the third electrode layer E3 is in contact with the first electrode layer E1. That is, in the electrode unit _5a2 , the third electrode layer E3 is in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit _5a2 is located on the other side surface 3a. The electrode unit _5a2 does not have a second electrode layer E2. That is, the other side surface 3a is not covered with the second electrode layer E2.

The second electrode layer E2 of the electrode portion 5c is disposed on the first electrode layer E1 and the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is formed so as to cover a part of the first electrode layer E1 and a part of the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is in direct contact with the part of the first electrode layer E1 and the part of the side surface 3c. The second electrode layer E2 of the electrode portion 5c is formed so as to cover the part of the first electrode layer E1 of the electrode portion 5c. The part of the side surface 3c is, for example, a corner region of the side surface 3c near the side surface 3a and the end surface 3e. In the electrode portion 5c, the second electrode layer E2 indirectly covers the part of the side surface 3c so that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3c. The part of the first electrode layer E1 of the electrode portion 5c is covered by the second electrode layer E2, and the remaining part except for the part is exposed from the second electrode layer E2. The second electrode layer E2 of the electrode portion 5c is located on the side surface 3c.
The third electrode layer E3 of the electrode portion 5c is disposed on the first electrode layer E1 and the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 covers the entire second electrode layer E2 and covers the entire portion of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in contact with the entire second electrode layer E2 and is in contact with the entire portion of the first electrode layer E1 exposed from the second electrode layer E2. That is, in the electrode portion 5c, the third electrode layer E3 is in direct contact with the first electrode layer E1 and the second electrode layer E2. The third electrode layer E3 of the electrode portion 5c is located on the side surface 3c.

The electrode portion 5c has a plurality of regions _5c1 and _5c2 . In this modified example, the electrode portion 5c has only two regions _5c1 and _5c2 . The region _5c2 is located closer to the side surface 3a than the region _5c1 . The region _5c1 has a first electrode layer E1 and a third electrode layer E3. The region _5c1 does not have a second electrode layer E2. The region _5c2 has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The region _5c1 is a region where the first electrode layer E1 is exposed from the second electrode layer E2. The region _5c2 is a region where the first electrode layer E1 is covered with the second electrode layer E2.

The second electrode layer E2 of the electrode portion 5e is disposed on the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is formed so as to cover a part of the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is in direct contact with the part of the first electrode layer E1. The second electrode layer E2 of the electrode portion 5e is formed so as to cover the part of the first electrode layer E1 of the electrode portion 5e. In the electrode portion 5e, the second electrode layer E2 indirectly covers a part of the end face 3e so that the first electrode layer E1 is located between the second electrode layer E2 and the end face 3e. The part of the end face 3e is, for example, a part of the end face 3e near the side face 3a. The first electrode layer E1 of the electrode portion 5e is covered by the second electrode layer E2 in the part, and is exposed from the second electrode layer E2 in the remaining part excluding the part.
The third electrode layer E3 of the electrode unit 5e is disposed on the first electrode layer E1 and the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 covers the entire second electrode layer E2 and covers the entire portion of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 is in contact with the entire second electrode layer E2 and is in contact with the entire portion of the first electrode layer E1 exposed from the second electrode layer E2. That is, in the electrode unit 5e, the third electrode layer E3 is in direct contact with the first electrode layer E1 and the second electrode layer E2. The third electrode layer E3 of the electrode unit 5e is located on the end surface 3e.
The electrode unit 5e may not have the second electrode layer E2. When the electrode unit 5e does not have the second electrode layer E2, the third electrode layer E3 in the electrode unit 5e covers the entire first electrode layer E1 and is in direct contact with the first electrode layer E1.

The electrode portion 5e has a plurality of regions 5e ₁ and 5e _2. In this modification, the electrode portion 5e has only two regions 5e ₁ and 5e _2. The region 5e ₂ is located closer to the side surface 3a than the region 5e _1. The region 5e ₁ has a first electrode layer E1 and a third electrode layer E3. The region 5e ₁ does not have a second electrode layer E2. The region 5e ₂ has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. In the electrode portion 5e, the third electrode layer E3 is formed so as to cover the entire end surface 3e when viewed from the first direction D1. In this modification, the third electrode layer E3 indirectly covers the entire end surface 3e. The region 5e ₁ is a region where the first electrode layer E1 is exposed from the second electrode layer E2. The region 5e ₂ is a region where the first electrode layer E1 is covered with the second electrode layer E2.

In the multilayer capacitor C1, the second electrode layer E2 continuously covers only a part of the side surface 3a, only a part of the end surface 3e, and only a part of each of the pair of side surfaces 3c. That is, the second electrode layer E2 has a portion that is provided so as to continuously cover only a part of the side surface 3a, only a part of the end surface 3e, and only a part of each of the pair of side surfaces 3c. The part of the end surface 3e is a part of the end surface 3e closer to the side surface 3a. The part of each of the side surfaces 3c is a part of the side surface 3c closer to the side surface 3a. The second electrode layer E2 covers the entire ridge line portion 3g adjacent to one side surface 3a, only a part of the ridge line portion 3i, and only a part of the ridge line portion 3j. A part of the part of the first electrode layer E1 that covers the ridge line portion 3i is exposed from the second electrode layer E2. For example, the first electrode layer E1 of each region 5c ₁ and 5e ₁ is exposed from the second electrode layer E2.
In a configuration in which the electrode portion 5e does not have the second electrode layer E2, the second electrode layer E2 continuously covers only a portion of one side surface 3a and only a portion of each of the pair of side surfaces 3c. That is, the second electrode layer E2 has a portion that is provided so as to continuously cover only a portion of the side surface 3a and only a portion of each of the pair of side surfaces 3c.

An internal electrode (in this modified example, for example, internal electrode 9A) adjacent to one side surface 3a in the second direction and the second electrode layer E2 of the electrode portion _5a1 to which the internal electrode is not electrically connected are opposed to each other in the second direction D2.
The internal electrode 7 and the second electrode layer E2 of the electrode portion 5c (region _5c2 ) to which the internal electrode 7 is not electrically connected face each other in the third direction D3. The internal electrode 9 (in this modification, the internal electrode 9A) and the second electrode layer E2 of the electrode portion 5c (region _5c2 ) to which the internal electrode 9 is not electrically connected face each other in the third direction D3.

As shown in Fig. 21, the external conductor 21 has a portion 21a disposed on one side surface 3a and a portion 21c disposed on each side surface 3c. The external conductor 21 is not disposed on the other side surface 3a. In this modification, the portion 21a and the portion 21c are also integrally provided. The portion 21a and the portion 21c may be provided separately.
The portion 21a is disposed between the electrode portions 5a1 located on the same one side surface _3a as the portion 21a is disposed on, and is spaced apart from the electrode portion _5a1 . In other words, the portion 21a is disposed between the second electrode layers E2 located on the same one side surface 3a as the portion 21a is disposed on, and is spaced apart from the second electrode layers E2.
As in the above-described embodiment, portion 21c is disposed between second electrode layers E2 located on the same side 3c on which portion 21c is disposed, and is spaced apart from the second electrode layer E2.

In the multilayer capacitor _C14 , the second electrode layer E2 is disposed so as to continuously cover a part of one side surface 3a, a part of each side surface 3c, and a part of the corresponding end surface 3e. The second electrode layer E2 has a part located on the side surface 3c. Therefore, in the multilayer capacitor _C14 , as described above, migration may grow from the part located on the side surface 3c, i.e., the second electrode layer E2 of the electrode portion 5c (region _5c2 ).
In the multilayer capacitor C1, the external conductor 21 (portion 21c) is disposed on the side surface 3c. Therefore, even if migration grows from the second electrode layer E2 of the electrode portion 5c (region _5c2 ), the migration is unlikely to grow beyond the portion 21c. As a result, even in the multilayer capacitor _C14 having a portion where the second electrode layer E2 is located on the side surface 3c, the external electrode 5 is unlikely to be short-circuited.

In the multilayer capacitor _C14 , the second electrode layer E2 has a portion located on one side surface 3a. Therefore, in the multilayer capacitor _C14 , as described above, there is a risk that migration may grow from the portion located on one side surface 3a, i.e., the second electrode layer E2 of the electrode portion _5a1 .
In the multilayer capacitor C1, the external conductor 21 (portion 21a) is disposed on one side surface 3a. Therefore, even if migration grows from the second electrode layer E2 of the electrode portion _5a1 , the migration is unlikely to grow beyond the portion 21a. As a result, even in the multilayer capacitor _C14 having a portion where the second electrode layer E2 is located on one side surface 3a, the external electrode 5 is unlikely to short-circuit.
The electrode portion _5a2 does not have a second electrode layer E2. Therefore, the external conductor 21 does not need to have a portion disposed on the other side surface 3a. In other words, the external conductor 21 does not need to be disposed on the other side surface 3a. It is sufficient that the external conductor 21 is disposed on one side surface 3a and a pair of side surfaces 3c.

Next, the structure of a multilayer capacitor _C15 according to a modified example of this embodiment will be described with reference to Fig. 22 and Fig. 23. Fig. 22 and Fig. 23 are diagrams showing the cross-sectional structure of the multilayer capacitor according to the modified example of this embodiment. The multilayer capacitor _C15 according to this modified example is generally similar or the same as the multilayer capacitor _C14 described above, but this modified example differs from the multilayer capacitor _C14 in terms of the structures of the internal electrodes 9A and the external conductors 21. The following mainly describes the differences between the multilayer capacitor _C14 and this modified example.

The internal electrode 9A is adjacent to the electrode portion _5a1 electrically connected to the internal electrode 9A in the second direction D2. The electrode portion _5a1 is located on one of the side surfaces 3a adjacent to the internal electrode 9A in the second direction D2. As described above, the electrode portion _5a1 has the second electrode layer E2.
The second electrode layer E2 of the electrode portion _5a1 is located on one side surface 3a. Each second electrode layer E2 located on one side surface 3a has an edge E2a- _e . On one side surface 3a, the edge E2a-e of one second electrode layer E2 faces the edge E2a _{-e of} the other second electrode layer E2.

The multilayer capacitor _C15 includes a conductor 13, similar to the multilayer capacitor _C11 . The conductor 13 is located in the same layer as the internal electrode 9A and is spaced apart from the internal electrode 9A. In this modification, the conductor 13 also constitutes a dummy conductor that does not contribute to the formation of capacitance. In Fig. 23, for the sake of explanation, the internal electrodes 7A, 9, 9A and the conductor 13 are intentionally shown shifted from each other in the third direction D3.

22, the length L1 ₂ is greater than the length L2 _2. Therefore, when the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is electrically connected are viewed from the second direction D2, the end 9Ae ₂ is exposed from the second electrode layer E2 to which the internal electrode 9A is electrically connected.
The length L1 ₂ is smaller than the length L3 _2. Therefore, when the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected are viewed from the second direction D2, the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected do not overlap with each other.
In this variation, for example, if length L1 ₂ constitutes the seventh length, length L2 ₂ constitutes the eighth length, and length L3 ₂ constitutes the ninth length.

In the multilayer capacitor _C15 , the length _L12 is greater than the length _L22 . Therefore, the internal electrode 7 adjacent to the internal electrode 9A in the second direction D2 and the second electrode layer E2 included in the electrode portion _5a1 adjacent to the internal electrode 9A in the second direction D2 are not electrically connected to each other, but are unlikely to face each other in the second direction D2. An electric field is unlikely to be generated between the second electrode layer E2 of the electrode portion _5a1 and the internal electrode 7 that are not electrically connected to each other.
The length _L12 is smaller than the length _L32 . Therefore, the internal electrode 9A is unlikely to face, in the second direction D2, the second electrode layer E2 included in the electrode portion _5a1 to which the internal electrode 9A is not electrically connected. An electric field is unlikely to be generated between the second electrode layer E2 of the electrode portion _5a1 and the internal electrode 9A that are not electrically connected to each other.
As a result, the multilayer capacitor _C15 , like the multilayer capacitor _C11 , suppresses migration from occurring in the second electrode layer E2 of the electrode portion _5a1 . For this reason, the external conductor 21 does not need to have a portion 21a disposed on one side surface 3a. That is, the external conductor 21 does not need to be disposed on one side surface 3a as shown in FIG. 22. In this modification, the external conductor 21 does not need to be disposed on a pair of side surfaces 3a. It is sufficient that the external conductor 21 is disposed on a pair of side surfaces 3c as shown in FIG. 23.

In the multilayer capacitor _C15 as well, the conductor 13 is located in the same layer as the internal electrode 9A. Therefore, structural defects are unlikely to occur in the element body 3.

Next, the structure of a multilayer capacitor _C16 according to a modified example of this embodiment will be described with reference to Fig. 24 and Fig. 25. Fig. 24 and Fig. 25 are diagrams showing the cross-sectional structure of the multilayer capacitor according to the modified example of this embodiment. The multilayer capacitor _C16 according to this modified example is generally similar or the same as the multilayer capacitor C15 described _above , but this modified example differs from the multilayer capacitor _C15 in the structure of the conductor 13. Below, the differences between the multilayer capacitor _C15 and this modified example will be mainly described.

The multilayer capacitor _C16 includes a conductor 13, similar to the multilayer capacitor _C12 . In Fig. 25, for the sake of explanation, the internal electrodes 7A, 9 and the conductor 13 are intentionally illustrated shifted from each other in the third direction D3. In the multilayer capacitor _C16 , the conductor 13 also constitutes a dummy conductor that does not easily contribute to the formation of capacitance.

The conductor 13 is adjacent to one side surface 3a in the second direction D2. The conductor 13 is adjacent to the internal electrode 7A in the second direction D2. The conductor 13 is located between one side surface 3a and the internal electrode 7A. The conductor 13 includes a portion 13a and a portion 13b.
The portion 13a faces in the second direction D2 the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on one side surface 3a. That is, the portion 13a faces in the second direction D2 the second electrode layer E2 of the electrode portion _5a1 to which the internal electrode 7A is not electrically connected. Therefore, the conductor 13 faces in the second direction D2 the second electrode layer E2 of the electrode portion _5a1 to which the internal electrode 7A is not electrically connected.
The portion 13b faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 7A is electrically connected and which is disposed on one side surface 3a. That is, the portion 13b faces, in the second direction D2, the second electrode layer E2 of the electrode portion _5a1 to which the internal electrode 7A is electrically connected.

In the multilayer capacitor _C16 , similarly to the multilayer capacitor _C12 , the conductor 13 separates the second electrode layer E2 of the electrode portion _5a1 from the internal electrode 7A that is not electrically connected to the second electrode layer E2 of the electrode portion _5a1 . Therefore, an electric field is unlikely to be generated between the second electrode layer E2 of the electrode portion _5a1 and the internal electrode 7A that is not electrically connected to the second electrode layer E2 of the electrode portion _5a1 . Even if an electric field is generated between the second electrode layer E2 of the electrode portion _5a1 and the internal electrode 7A that is not electrically connected to the second electrode layer E2 of the electrode portion _5a1 , the strength of the electric field is small.
As a result, the multilayer capacitor _C16 , like the multilayer capacitor _C12 , suppresses migration from occurring in the second electrode layer E2 of the electrode portion _5a1 . Therefore, also in this modification, the external conductor 21 does not need to have a portion 21a disposed on one side surface 3a. That is, the external conductor 21 does not need to be disposed on one side surface 3a as shown in FIG. 24. Also in this modification, the external conductor 21 does not need to be disposed on a pair of side surfaces 3a. It is sufficient that the external conductor 21 is disposed on a pair of side surfaces 3c as shown in FIG. 25.

In the multilayer capacitor _C16 , the conductor 13 also includes a portion 13a and a portion 13b. Therefore, the configuration on one end face 3e side from the center in the first direction D1 is unlikely to differ from the configuration on the other end face 3e side from the center in the first direction D1. As a result, structural defects are unlikely to occur in the element body 3.

In the multilayer capacitor _C12 , the end _7Ae2 overlaps with the conductor 13 (portion 13a) when viewed from the second direction D2. Therefore, an electric field is even less likely to be generated between the second electrode layer E2 of the electrode portion _5a1 and the internal electrode 7A that is not electrically connected to the second electrode layer E2 of the electrode portion _5a1 . As a result, the multilayer capacitor _C11 further suppresses the occurrence of migration.

Next, the structure of a multilayer capacitor _C17 according to a modified example of this embodiment will be described with reference to Fig. 26 and Fig. 27. Fig. 26 and Fig. 27 are diagrams showing the cross-sectional structure of the multilayer capacitor according to the modified example of this embodiment. The multilayer capacitor _C17 according to this modified example is generally similar or the same as the multilayer capacitor _C16 described above, but this modified example differs from the multilayer capacitor _C16 in the structure of the conductor 13. The following mainly describes the differences between the multilayer capacitor _C16 and this modified example.

In the multilayer capacitor _C17 , like the multilayer capacitor _C13 , the portion 13a and the portion 13b are integral. The conductor 13 has no end exposed on the surface of the element body 3. The conductor 13 is not connected to any of the external electrodes 5. In other words, the conductor 13 is not electrically connected to the second electrode layer E2 either.
In FIG. 27, for the sake of explanation, the internal electrodes 7A and 9 and the conductor 13 are intentionally illustrated shifted from one another in the third direction D3.

In this modified example, the external conductor 21 does not have to be disposed on each side surface 3a as shown in FIG. 26. The external conductor 21 only needs to be disposed on one side surface 3c as shown in FIG. 27.

Next, the structure of a multilayer capacitor _C18 according to a modified example of this embodiment will be described with reference to Figures 28 to 31. Figures 28, 29, 30, and 31 are diagrams showing the cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. The multilayer capacitor _C18 according to this modified example is generally similar or the same as the multilayer capacitor _C14 described above, but this modified example differs from the multilayer capacitor C14 in the structure of the internal electrodes ₇ , 9. The following mainly describes the differences between the multilayer capacitor _C14 and this modified example.

As shown in Figures 28 to 30, the internal electrodes 7 and the internal electrodes 9 are arranged at different positions (layers) in the third direction D3. The internal electrodes 7 and the internal electrodes 9 are arranged alternately in the element body 3 so as to face each other at an interval in the third direction D3. In this case, the element body 3 is configured by stacking a plurality of dielectric layers in the third direction D3. In the multilayer capacitor _C1-8 , the stacking direction of the plurality of dielectric layers coincides with the third direction D3. In Figure 28, for the sake of explanation, the internal electrodes 7 and 9 are intentionally shown shifted from each other in the second direction D2.
The multiple internal electrodes 7 and the multiple internal electrodes 9 are arranged alternately in the third direction D3. The multiple internal electrodes 7, 9 are arranged in the element body 3 so as to be aligned in the third direction D3. Each internal electrode 7, 9 is located in a plane approximately parallel to each side surface 3c. The internal electrodes 7 and 9 face each other in the third direction D3. The direction in which the internal electrodes 7 and 9 face each other (the third direction D3) is perpendicular to the direction parallel to each side surface 3c (the second direction D2 and the first direction D1).

The internal electrode 7 and the second electrode layer E2 of the electrode portion _5a1 to which the internal electrode 7 is not electrically connected face each other in the second direction D2. The internal electrode 7 and the second electrode layer E2 of the electrode portion 5c to which the internal electrode 7 is not electrically connected face each other in the third direction D3. The internal electrode 9 and the second electrode layer E2 of the electrode portion _5a1 to which the internal electrode 9 is not electrically connected face each other in the second direction D2. The internal electrode 9 and the second electrode layer E2 of the electrode portion 5c to which the internal electrode 9 is not electrically connected face each other in the third direction D3.

In this modified example, as shown in FIG. 31, the external conductor 21 has a portion 21a disposed on one side 3a and a portion 21c disposed on each side 3c. The external conductor 21 does not have a portion 21a disposed on the other side 3a. In other words, in this modified example, it is sufficient that the external conductor 21 is disposed on one side 3a and a pair of side surfaces 3c.

Next, the structure of a multilayer capacitor _C19 according to a modified example of this embodiment will be described with reference to Figures 32 to 35. Figures 32, 33, 34, and 35 are diagrams showing the cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. The multilayer capacitor _C19 according to this modified example is generally similar or the same as the multilayer capacitor _C18 described above, but this modified example differs from the multilayer capacitor _C14 in terms of the structures of the internal electrodes 7A, 9A and the external conductor 21. Below, the differences between the multilayer capacitor _C14 and this modified example will be mainly described.

The internal electrode 7A is adjacent to the electrode portion 5c electrically connected to the internal electrode 7A in the third direction D3. The electrode portion 5c electrically connected to the internal electrode 7A is located on one of the side surfaces 3c adjacent to the internal electrode 7A in the third direction D3.
The internal electrode 9A is adjacent to the electrode portion 5c electrically connected to the internal electrode 9A in the third direction D3. The electrode portion 5c electrically connected to the internal electrode 9A is located on the other side surface 3c adjacent to the internal electrode 9A in the third direction D3.
As described above, each electrode portion 5c has the second electrode layer E2.

The second electrode layers E2 of the electrode portion 5c are located on the side surface 3c. Each of the second electrode layers E2 located on the same side surface 3c has an edge _E2ce . On the same side surface 3c, the edge _E2ce of one second electrode layer E2 faces the edge _E2ce of the other second electrode layer E2.

34, the length _L11 of the internal electrode 7A is greater than the length L51 in the first direction D1 from the reference plane _PL1 to the edge _E2ce of the second electrode layer E2 electrically connected to the internal electrode 7A. Therefore, when the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is electrically connected are viewed from the third direction D3, the end _7Ae2 is exposed from the second electrode layer E2 to which the internal electrode 7A is electrically connected.
The length _L11 of the internal electrode 7A is smaller than the length _L61 in the first direction D1 from the reference plane PL1 to the edge _E2ce of the second electrode layer E2 to which the internal electrode 7A is not electrically connected. Therefore, when the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is not electrically connected are viewed from the third direction D3, the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is not electrically connected do not overlap each other.
In this modification, for example, if length L1 ₁ constitutes the fourth length, length L5 ₁ constitutes the fifth length, and length L6 ₁ constitutes the sixth length.

The length _L12 of the internal electrode 9A is greater than the length _L52 in the first direction D1 from the reference plane PL2 to the edge _E2ce of the second electrode layer E2 electrically connected to the internal electrode 9A. Therefore, when the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is electrically connected are viewed from the third direction D3, the edge _9Ae2 is exposed from the second electrode layer E2 to which the internal electrode 9A is electrically connected.
The length _L12 is smaller than the length _L62 in the first direction D1 from the reference plane PL2 to the edge _E2ce of the second electrode layer E2 to which the internal electrode 9A is not electrically connected. Therefore, when the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected are viewed from the third direction D3, the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected do not overlap each other.
For example, if length L1 ₂ constitutes a fourth length, length L5 ₂ constitutes a fifth length, and length L6 ₂ constitutes a sixth length.

Length L1 ₁ and length L1 ₂ may be the same or different. Length L5 ₁ and length L5 ₂ may be the same or different. Length L6 ₁ and length L6 ₂ may be the same or different.

The multilayer capacitor _C19 , like the multilayer capacitor _C11 , includes a plurality of conductors 11, 13. The multilayer capacitor _C19 includes two conductors 11, 13. In Fig. 32 and Fig. 33, for the sake of explanation, the internal electrodes 7, 9 (internal electrodes 7A, 9A) and the conductors 11, 13 are intentionally illustrated shifted from each other in the third direction D3. In this modification, the conductors 11, 13 also constitute dummy conductors that are unlikely to contribute to the formation of capacitance.

In the multilayer capacitor _C19 , the lengths _L11 , _L12 are greater than the lengths _L51 , _L52 . Therefore, the internal electrodes 7, 9 adjacent to the internal electrodes 7A, 9A in the third direction D3 and the second electrode layers E2 included in the electrode portions 5c adjacent to the internal electrodes 7A, 9A in the third direction D3 are not electrically connected to each other, but are unlikely to face each other in the third direction D3. An electric field is unlikely to be generated between the second electrode layers E2 and the internal electrodes 7, 9 that are not electrically connected to each other.
The lengths _L11 and _L12 are smaller than the lengths _L61 and _L62 . Therefore, the internal electrodes 7A and 9A are unlikely to face, in the third direction D3, the second electrode layer E2 included in the electrode portion 5c to which the internal electrodes 7A and 9A are not electrically connected. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrodes 7A and 9A that are not electrically connected to each other.
As a result, the multilayer capacitor _C19 suppresses migration from occurring in the second electrode layer E2 of the electrode portion 5c. Therefore, the external conductor 21 does not need to have each portion 21c. That is, the external conductor 21 does not need to be disposed on each side surface 3c as shown in Fig. 35. It is sufficient that the external conductor 21 is disposed on one side surface 3a.

Next, the structure of a multilayer capacitor _C110 according to a modified example of this embodiment will be described with reference to Figs. 36 to 38. Figs. 36, 37, and 38 are diagrams showing the cross-sectional structure of the multilayer capacitor according to the modified example of this embodiment. The multilayer capacitor _C110 according to this modified example is generally similar or the same as the multilayer capacitor _C19 described above, but this modified example differs from the multilayer capacitor C19 in the structure of the conductor _13. Below, the differences between the multilayer capacitor _C19 and this modified example will be mainly described.

The multilayer capacitor C1 ₁₀ includes a plurality of conductors 11, 13, similar to the multilayer capacitor C1 _2. In Fig. 36 and Fig. 37, for the sake of explanation, the internal electrodes 7A, 9A and the conductors 11, 13 are intentionally illustrated shifted from each other in the third direction D3. In the multilayer capacitor C1 ₁₀ , the conductors 11, 13 also constitute dummy conductors that are unlikely to contribute to the formation of capacitance.

The conductor 11 is adjacent to one side surface 3c in the third direction D3. The conductor 11 is adjacent to the internal electrode 9A in the third direction D3. The conductor 13 is located between one side surface 3c and the internal electrode 9A. The conductor 11 includes a portion 11a and a portion 11b.
The portion 11a faces, in the third direction D3, the second electrode layer E2 to which the internal electrode 9A is not electrically connected and which is disposed on one side surface 3c. That is, the portion 11a faces, in the third direction D3, the second electrode layer E2 of the electrode portion 5c to which the internal electrode 9A is not electrically connected. Therefore, the conductor 11 faces, in the third direction D3, the second electrode layer E2 of the electrode portion 5c to which the internal electrode 9A is not electrically connected.
The portion 11b faces, in the third direction D3, the second electrode layer E2 to which the internal electrode 9A is electrically connected and which is disposed on one side surface a. That is, the portion 11b faces, in the third direction D3, the second electrode layer E2 of the electrode portion 5c to which the internal electrode 9A is electrically connected.

The conductor 13 is adjacent to the other side surface 3c in the third direction D3. The conductor 13 is adjacent to the internal electrode 7A in the third direction D3. The conductor 13 is located between the other side surface 3c and the internal electrode 7A. The conductor 13 includes a portion 13a and a portion 13b.
The portion 13a faces, in the third direction D3, the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on the other side surface 3c. That is, the portion 13a faces, in the third direction D3, the second electrode layer E2 of the electrode portion 5c to which the internal electrode 7A is not electrically connected. Therefore, the conductor 13 faces, in the third direction D3, the second electrode layer E2 of the electrode portion 5c to which the internal electrode 7A is not electrically connected.
The portion 13b faces, in the third direction D3, the second electrode layer E2 to which the internal electrode 7A is electrically connected and which is disposed on the other side surface 3c. That is, the portion 13b faces, in the third direction D3, the second electrode layer E2 of the electrode portion 5c to which the internal electrode 7A is electrically connected.

In the multilayer capacitor _C1-10 , similarly to the multilayer capacitor _C1-2 , the conductor 11 separates the second electrode layer E2 of the electrode portion 5c from the internal electrode 9A that is not electrically connected to the second electrode layer E2 of the electrode portion 5c. Therefore, an electric field is unlikely to be generated between the second electrode layer E2 of the electrode portion 5c and the internal electrode 9A that is not electrically connected to the second electrode layer E2 of the electrode portion 5c. Even if an electric field is generated between the second electrode layer E2 of the electrode portion 5c and the internal electrode 9A that is not electrically connected to the second electrode layer E2 of the electrode portion 5c, the strength of the electric field is small.
The conductor 13 separates the second electrode layer E2 of the electrode portion 5c from the internal electrode 7A that is not electrically connected to the second electrode layer E2 of the electrode portion 5c. Therefore, an electric field is unlikely to be generated between the second electrode layer E2 of the electrode portion 5c and the internal electrode 7A that is not electrically connected to the second electrode layer E2 of the electrode portion 5c. Even if an electric field is generated between the second electrode layer E2 of the electrode portion 5c and the internal electrode 7A that is not electrically connected to the second electrode layer E2 of the electrode portion 5c, the strength of the electric field is small.
As a result, the multilayer capacitor _C110 suppresses migration from occurring in the second electrode layer E2 of the electrode portion 5c. Therefore, in this modification, the external conductor 21 does not need to have each portion 21c. That is, the external conductor 21 does not need to be disposed on each side surface 3c as shown in Fig. 38. The external conductor 21 only needs to be disposed on one side surface 3a as shown in Figs. 36 and 37.

Next, the structure of a multilayer capacitor _C111 according to a modified example of this embodiment will be described with reference to Fig. 39 to Fig. 41. Fig. 39, Fig. 40, and Fig. 41 are diagrams showing the cross-sectional structure of the multilayer capacitor according to the modified example of this embodiment. The multilayer capacitor _C111 according to this modified example is generally similar or the same as the multilayer capacitor _C110 described above, but this modified example differs from the multilayer capacitor _C110 in terms of the structures of the conductors 11, 13. Below, the differences between the multilayer capacitor _C110 and this modified example will be mainly described.

In the multilayer capacitor _C1-11 , like the multilayer capacitor _C1-3 , the portion 11a and the portion 11b are integral. The conductor 11 has no end exposed on the surface of the element body 3. The conductor 11 is not connected to any of the external electrodes 5. In other words, the conductor 11 is not electrically connected to the second electrode layer E2 either.
The portions 13a and 13b are integral. The conductor 13 has no ends exposed on the surface of the element body 3. The conductor 13 is not connected to any of the external electrodes 5. In other words, the conductor 13 is not electrically connected to the second electrode layer E2 either.
In Figures 39 and 40, for the sake of explanation, the internal electrodes 7A, 9A and the conductors 11, 13 are intentionally illustrated shifted from each other in the third direction D3.

In this modified example, the external conductor 21 does not have to be disposed on each side surface 3c as shown in Figs. 39 and 40. The external conductor 21 only needs to be disposed on one side surface 3a as shown in Fig. 41.

Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention.

The multilayer capacitors C1 ₁ and C1 ₉ do not necessarily have to include the conductors 11 and 13. When the multilayer capacitors C1 ₁ and C1 ₉ include the conductors 11 and 13, structural defects are unlikely to occur in the element body 3, as described above.
The multilayer capacitor C1 ₅ does not necessarily have to include the conductor 13. When the multilayer capacitor C1 ₅ includes the conductor 13, structural defects are unlikely to occur in the element body 3, as described above.

In the present embodiment and the modified example, the multilayer capacitors C1, C1 ₁ to C1 ₁₁ are used as examples of electronic components, but applicable electronic components are not limited to multilayer capacitors. Applicable electronic components include, for example, multilayer electronic components such as multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, and multilayer composite components, or electronic components other than multilayer electronic components.

3... Element body, 3a, 3c... Side surface, 3e... End surface, 5... External electrode, 5a, 5a ₁ , 5a ₂ , 5c, 5e... Electrode portion, 7, 7A, 9, 9A... Internal electrode, 11, 13... Conductor, 21... Outer conductor, C1 ₁ , C1 ₁ to C1 ₁₁ ...Laminated capacitor, D1...first direction, D2...second direction, D3...third direction, E1...first electrode layer, E2...second electrode layer, E3...third electrode layer, PL1, PL2...reference plane.

Claims (21)

an element body having a rectangular parallelepiped shape and including a pair of end faces facing each other in a first direction and at least one side face adjacent to the pair of end faces;
a plurality of external electrodes respectively disposed on both ends of the element body in the first direction, each having a conductive resin layer including a plurality of metal particles and a resin and disposed on at least one of the side surfaces;
a plurality of internal electrodes disposed within the element body, the internal electrodes having one end exposed on a corresponding one of the pair of end faces;
an external conductor disposed between the conductive resin layers on the at least one side surface and spaced apart from each of the conductive resin layers;
Each of the plurality of external electrodes has a plating layer that constitutes an outermost layer of the external electrode,
each of the plurality of internal electrodes is connected at the one end to a corresponding one of the plurality of external electrodes and is not connected to the external conductor;
the outer conductor is made of a conductive material which is less susceptible to migration than the metal particles;
a plating layer is formed on a surface of the outer conductor ,
the metal particles contained in the conductive resin layer include silver particles,
The conductive material comprises copper . The at least one side surface includes a pair of first side surfaces facing each other in the second direction and a pair of second side surfaces facing each other in the third direction,
the internal electrodes are disposed within the element body so as to face each other in the second direction,
The electronic component according to claim 1 , wherein each of the conductive resin layers and the external conductors is disposed on each of the second side surfaces. The electronic component according to claim 2, wherein each of the conductive resin layers and the external conductors is further disposed on each of the first side surfaces. The electronic component according to claim 3, wherein the external conductor arranged on each of the second side surfaces and the external conductor arranged on each of the first side surfaces are integrally formed. Each of the conductive resin layers is further disposed on each of the first side surfaces,
In the two conductive resin layers located on the same first side surface, one of the conductive resin layers has an edge facing the other of the conductive resin layers,
Among the plurality of internal electrodes, an outermost internal electrode located outermost in the second direction is adjacent to the conductive resin layer in the second direction to which the outermost internal electrode is electrically connected and which is disposed on the first side surface,
3. The electronic component according to claim 2, wherein a plane including the end face to which the outermost internal electrode is exposed is taken as a reference plane, and a first length of the outermost internal electrode from the reference plane in the first direction is greater than a second length in the first direction from the reference plane to the edge of the conductive resin layer to which the outermost internal electrode is electrically connected and which is disposed on the first side face, and is smaller than a third length from the reference plane to the edge of the conductive resin layer to which the outermost internal electrode is not electrically connected and which is disposed on the first side face. a pair of dummy conductors each adjacent to a corresponding one of the pair of first side surfaces in the second direction;
Each of the conductive resin layers is further disposed on each of the first side surfaces,
3. The electronic component of claim 2, wherein each of the dummy conductors is not electrically connected to the internal electrode adjacent to the dummy conductor in the second direction and faces the conductive resin layer arranged on the first side in the second direction. The at least one side surface includes a pair of first side surfaces facing each other in the second direction and a pair of second side surfaces facing each other in the third direction,
one of the pair of second side surfaces is arranged to form a mounting surface;
each of the conductive resin layers is disposed so as to continuously cover a portion of one of the second side surfaces, a portion of each of the first side surfaces, and a portion of the corresponding end surface;
the internal electrodes are disposed within the element body so as to face each other in the second direction,
The electronic component according to claim 1 , wherein the outer conductor is disposed on the one second side surface. The electronic component according to claim 7, wherein the outer conductor is further disposed on each of the first sides. The electronic component according to claim 8, wherein the external conductor arranged on one of the second side surfaces and the external conductor arranged on each of the first side surfaces are integrally provided. In the two conductive resin layers located on the same first side surface, one of the conductive resin layers has an edge facing the other of the conductive resin layers,
Among the plurality of internal electrodes, an outermost internal electrode located outermost in the second direction is adjacent to the conductive resin layer in the second direction to which the outermost internal electrode is electrically connected and which is disposed on the first side surface,
8. The electronic component according to claim 7, wherein a plane including the end face to which the outermost internal electrode is exposed is taken as a reference plane, and a fourth length of the outermost internal electrode from the reference plane in the first direction is greater than a fifth length in the first direction from the reference plane to the edge of the conductive resin layer to which the outermost internal electrode is electrically connected and which is disposed on the first side face, and is smaller than a sixth length from the reference plane to the edge of the conductive resin layer to which the outermost internal electrode is not electrically connected and which is disposed on the first side face. a pair of dummy conductors each adjacent to a corresponding one of the pair of first side surfaces in the second direction;
The electronic component according to claim 7 , wherein each of the dummy conductors is not electrically connected to the internal electrode adjacent to the dummy conductor in the second direction and faces the conductive resin layer arranged on the first side in the second direction. The at least one side surface includes a pair of first side surfaces facing each other in the second direction and a pair of second side surfaces facing each other in the third direction,
one of the pair of first side surfaces is arranged to form a mounting surface;
each of the conductive resin layers is disposed so as to continuously cover a portion of one of the first side surfaces, a portion of each of the second side surfaces, and a portion of the corresponding end surface;
the internal electrodes are disposed within the element body so as to face each other in the second direction,
The electronic component of claim 1 , wherein the outer conductor is disposed on each of the second sides. The electronic component according to claim 12, wherein the outer conductor is further disposed on the one first side surface. The electronic component according to claim 13, wherein the external conductor arranged on each of the second side surfaces and the external conductor arranged on one of the first side surfaces are integrally provided. Among the two conductive resin layers located on one of the first side surfaces, one of the conductive resin layers has an edge facing the other of the conductive resin layers,
Among the plurality of internal electrodes, an outermost internal electrode located outermost in the second direction is electrically connected to the outermost internal electrode and is adjacent to the conductive resin layer disposed on the one first side surface in the second direction,
13. The electronic component according to claim 12, wherein a plane including the end face to which the outermost internal electrode is exposed is taken as a reference plane, and a seventh length of the outermost internal electrode in the first direction from the reference plane is greater than an eighth length in the first direction from the reference plane to the edge of the conductive resin layer to which the outermost internal electrode is electrically connected and which is disposed on the one first side face, and is smaller than a ninth length from the reference plane to the edge of the conductive resin layer to which the outermost internal electrode is not electrically connected and which is disposed on the one first side face. a dummy conductor located in the same layer as the outermost internal electrode and spaced apart from the outermost internal electrode;
The electronic component according to claim 5 , 10 , or 15 , wherein the dummy conductor is electrically connected to the external electrode to which the outermost internal electrode located in the same layer as the dummy conductor is not electrically connected. each of the first and second conductors further includes a dummy conductor adjacent to the one of the first side surfaces in the second direction;
The electronic component described in claim 12, wherein the dummy conductor is not electrically connected to the internal electrode adjacent to the dummy conductor in the second direction and faces the conductive resin layer arranged on the one first side surface in the second direction. The electronic component according to claim 1 , wherein the plating layer of each of the plurality of external electrodes and the plating layer formed on the surface of the external conductor have the same layer structure. 19. The electronic component according to claim 18, wherein the plating layer of each of the plurality of external electrodes and the plating layer formed on the surface of the external conductor include a Ni plating layer and a solder plating layer formed on the Ni plating layer. The electronic component according to claim 1 , wherein the plating layer on each of the plurality of external electrodes and the plating layer formed on a surface of the external conductor are exposed. The electronic component according to any one of claims 1 to 20 , wherein the outer conductor comprises a sintered metal layer.

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