JP7658760B2 - Resin composition and molded article thereof - Google Patents

Description

The present invention relates to a resin composition containing a specific polycarbonate resin, an acrylic resin, an impact modifier and a specific antistatic agent.

Conventionally, methacrylic resins and polycarbonate resins (hereinafter sometimes referred to as PC) are known as transparent resins, and they are used in a wide range of fields such as electrical and electronic components, optical components, automotive components, and mechanical components in the form of molded products, films, and sheets.

Methacrylic acid resins such as polymethyl methacrylate (hereinafter sometimes referred to as PMMA) have high transparency and high surface hardness (pencil hardness H to 3H), and are widely used as optical materials such as lenses and optical fibers. However, their glass transition temperature is low at around 100°C, and their heat resistance is poor, limiting their use in fields requiring heat resistance. Another problem is that they have low impact resistance.

Polycarbonate resin made from bisphenol A is widely used in vehicles and building materials due to its excellent heat resistance, impact resistance, flame retardancy and transparency. Among these applications, high weather resistance is required, especially for outdoor use, but the weather resistance of polycarbonate resin is generally not as good as other transparent materials such as acrylic resin, and yellowing and devitrification occur when exposed to the outdoors. In addition, the surface is very soft (pencil hardness 4B to 2B) and is easily scratched.

It is known that blends of PC and PMMA are essentially incompatible and produce opaque materials. For example, Patent Document 1 shows that blends of PC and PMMA are opaque and do not exhibit the physical properties of both polymers.

A resin composition using a polycarbonate resin with a special structure and an acrylic resin has been reported (Patent Document 2), which has achieved excellent transparency, weather resistance, and surface hardness. However, according to the inventors' investigations, the resin composition described in Patent Document 2 has issues with impact resistance.

These polycarbonate resins and acrylic resins have poor antistatic properties, and there is a problem that dust easily adheres to the surface of the molded product due to static electricity. Therefore, in order to solve these problems, a method is known in which hydrophilic polyamide-based polymers such as polyetheresteramide and polyetheramide are blended to impart antistatic performance (Patent Document 3). However, although hydrophilic polyamide-based polymers have the advantage of being able to impart sustained antistatic properties, they have the problem of reducing surface hardness and deflection temperature under load. As another method for solving the problem of antistatic properties, a method of adding a surfactant, for example, a method of using a phosphonium sulfonate salt (Patent Document 4) and a method of using a surfactant such as a glycerin fatty acid ester (Patent Document 5) have been proposed. In addition, a method of using a specific ion pair compound (Patent Document 6) has also been proposed. However, the methods described in Patent Documents 4 to 6 have not been reported on sustained antistatic properties or their effects on surface hardness, and verification is insufficient. In addition, some surfactants and ion-pair compounds have a low thermal decomposition temperature, which means that not only do the antistatic agents decompose during processing, but the decomposition products of the antistatic agents also decompose the polycarbonate resin, and verification of their thermal stability (hereafter referred to as thermal stability) has also been insufficient.

Therefore, no polycarbonate resin composition has been reported to date that has good thermal stability, surface hardness, and impact resistance, and that does not experience a decrease in surface hardness compared to the base resin, and that has sustained antistatic properties.

U.S. Pat. No. 4,319,003 JP 2015-232091 A JP 2002-129026 A Patent No. 4606762 Patent No. 6215717 Patent No. 6724737

The object of the present invention is to provide a resin composition and a molded article thereof that have good thermal stability, surface hardness, and impact resistance, and that have sustained antistatic properties without a decrease in surface hardness compared to the base resin.

As a result of extensive research, the inventors have discovered that by adding an acrylic resin, an impact modifier, and an ion pair compound having a specific structure to a polycarbonate resin containing a specific spiro ring structure, a resin composition having excellent properties such as thermal stability, surface hardness, impact resistance, and sustained antistatic properties can be obtained, and have completed the present invention.

That is, according to the present invention, the object of the invention is achieved as follows:

1. A resin composition comprising 100 parts by weight of a polycarbonate resin (A) containing 5 to 85 mol % of carbonate structural units (a) represented by the following formula (1) out of 100 mol % of all carbonate structural units, and an acrylic resin (B), 5 to 60 parts by weight of an impact modifier (C), and 0.1 to 10 parts by weight of an ion pair compound (D), wherein the ion pair compound has a melting point of 100°C or lower, a 10% weight loss temperature measured by TG-TDA of 250°C or higher, and satisfies the following formula [I]:
R _I > R _D -30 [I]
(In the formula, R _I is the contact angle (°) of a water droplet of a resin composition having an ion pair compound content of 2 parts by weight per 100 parts by weight of polycarbonate resin, and R _D is the contact angle (°) of a water droplet of a polycarbonate resin.)

(In the formula, W represents an alkylene group having 1 to 20 carbon atoms or a cycloalkylene group having 6 to 20 carbon atoms, R represents a branched or linear alkyl group having 1 to 20 carbon atoms or a cycloalkyl group having 6 to 20 carbon atoms which may have a substituent, and m represents an integer from 0 to 10.)

2. The polycarbonate resin (A) contains a carbonate structural unit represented by the formula (1) (
2. The resin composition according to item 1 above, which comprises (a) and another carbonate structural unit (b), the carbonate structural unit (b) being a carbonate structural unit (b) derived from at least one compound selected from the group consisting of an aliphatic diol compound, an alicyclic diol compound, and an aromatic dihydroxy compound.

3. The resin composition according to the preceding paragraph 1 or 2, in which the weight ratio of the polycarbonate resin (A) to the acrylic resin (B) is 30:70 to 99:1.

4. The resin composition according to any one of items 1 to 3 above, in which the acrylic resin (B) contains 40 to 100 mol % of structural units derived from methyl methacrylate.

5. The resin composition according to any one of items 1 to 4 above, wherein the ion pair compound has a 10% weight loss temperature measured by TG-TDA of 270° C. or higher and satisfies the following formula [II]:
R _I > R _D -20 [II]
(In the formula, _R1 is the contact angle (°) of a water droplet of a resin composition having an ion pair compound content of 2 parts by weight per 100 parts by weight of polycarbonate resin, and _RD is the contact angle (°) of a water droplet of the polycarbonate resin.)

6. The resin composition according to any one of items 1 to 5 above, wherein the cation of the ion-pair compound contains an organic ammonium ion or an organic phosphonium ion represented by the following formula (3), or the anion of the ion-pair compound contains a sulfonylimide ion represented by the following formula (4) or a fluorosulfonate ion represented by the following formula (5).

[In the formula, R ₁ and R ₂ each represent a hydrocarbon group, and M represents a N atom or a P atom.]

[In the formula, R ₃ and R ₄ each represent a perfluoroalkyl group.]

[In the formula, _R5 represents a perfluoroalkyl group.]

7. The resin composition according to any one of items 1 to 6 above, wherein the cation of the ion-pair compound contains an organic phosphonium ion represented by the following formula (6), or the anion of the ion-pair compound contains a sulfonylimide ion represented by the following formula (7) or a fluorosulfonate ion represented by the following formula (8).

[In the formula, _R1 represents an alkyl group having 1 or more carbon atoms, and _R2 represents an alkyl group having 4 or more carbon atoms.]

[In the formula, R ₃ and R ₄ each represent a perfluoroalkyl group having 1 to 4 carbon atoms.]

[In the formula, R ₅ represents a perfluoroalkyl group having 1 to 4 carbon atoms.]

8. The resin composition according to any one of the preceding paragraphs 1 to 7, wherein the cation of the ion-pair compound contains an organic phosphonium ion represented by the following formula (9), or the anion of the ion-pair compound contains a sulfonylimide ion represented by the following formula (10) or a fluorosulfonate ion represented by the following formula (11).

[In the formula, _R1 represents an alkyl group having 4 or more carbon atoms, and _R2 represents an alkyl group having 12 or more carbon atoms.]

[In the formula, R ₃ and R ₄ each represent a trifluoromethyl group.]

[In the formula, _R5 represents a perfluorobutyl group.]

9. The resin composition according to any one of items 1 to 8, having a notched Charpy impact strength measured in accordance with ISO 179 of 10 kJ/m2 or ^more .

10. The resin composition according to any one of items 1 to 9 above, which has a pencil hardness of H or more as measured according to JIS K5400.

11. The resin composition according to any one of items 1 to 10 above, wherein the surface resistivity of a molded article is 1×10 ¹⁵ (Ω/□) or less.

12. A molded article obtained by injection molding a resin composition described in any one of the preceding paragraphs 1 to 11.

13. A film or sheet formed from the resin composition described in any one of the preceding paragraphs 1 to 11.

The present invention makes it possible to provide a resin composition that has excellent properties such as thermal stability, surface hardness, impact resistance, and sustained antistatic properties by adding an impact modifier and an ion pair compound having a specific structure to a resin component consisting of a polycarbonate resin containing a specific spiro ring structure and an acrylic resin. Therefore, the industrial effects achieved are exceptional.

The present invention is described in detail below.

(Polycarbonate resin (A))
The polycarbonate resin used in the resin composition of the present invention is a polycarbonate resin containing 5 to 85 mol % of carbonate structural units (a) represented by the following formula (1) relative to 100 mol % of all carbonate structural units.

(In the formula, W represents an alkylene group having 1 to 20 carbon atoms or a cycloalkylene group having 6 to 20 carbon atoms, R represents a branched or linear alkyl group having 1 to 20 carbon atoms or a cycloalkyl group having 6 to 20 carbon atoms which may have a substituent, and m represents an integer from 0 to 10.)

The carbonate structural unit (a) represented by the above formula (1) is derived from a diol having a spiro ring structure. Examples of diol compounds having such a spiro ring structure include alicyclic diol compounds such as 3,9-bis(2-hydroxyethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane, 3,9-bis(2-hydroxy-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane, 3,9-bis(2-hydroxy-1,1-diethylethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane, and 3,9-bis(2-hydroxy-1,1-dipropylethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane.

Preferably, 3,9-bis(2-hydroxy-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane is used.

The polycarbonate resin used in the resin composition of the present invention contains 5 to 85 mol %, preferably 10 to 80 mol %, more preferably 15 to 75 mol %, and even more preferably 20 to 70 mol % of the carbonate structural unit (a) represented by the above formula (1) out of 100 mol % of all carbonate structural units. When the carbonate structural unit (a) is within the above range, the resin composition does not become cloudy due to phase separation during extrusion or molding of the resin composition with the acrylic resin, and polymerization is easy without crystallization during polymerization of the polycarbonate resin, which is preferable.

The polycarbonate resin used in the resin composition of the present invention contains the carbonate structural unit (a) represented by the above formula (1) and is used as a copolymer with another carbonate structural unit (b).

The carbonate structural unit (b) is preferably a carbonate structural unit (b) derived from at least one compound selected from the group consisting of an aliphatic diol compound, an alicyclic diol compound, and an aromatic dihydroxy compound. In addition, from the standpoint of surface hardness and weather resistance, the carbonate structural unit (b) is preferably a carbonate structural unit (b) derived from at least one compound selected from the group consisting of an aliphatic diol compound and an alicyclic diol compound.

Aliphatic diol compounds include 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, 1.9-nonanediol, 1,10-decanediol, 1,12-dodecanediol, 2-methyl-1,3-propanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, 2-n-butyl-2-ethyl-1,3-propanediol, and 2,2-diethyl-1,3-propanediol. , 2,4-diethyl-1,5-pentanediol, 1,2-hexane glycol, 1,2-octyl glycol, 2-ethyl-1,3-hexanediol, 2,3-diisobutyl-1,3-propanediol, 2,2-diisoamyl-1,3-propanediol, 2-methyl-2-propyl-1,3-propanediol, etc., and 1,8-octanediol, 1.9-nonanediol, 1,10-decanediol, and 1,12-dodecanediol are preferably used.

Examples of alicyclic diol compounds include cyclohexanediols such as 1,2-cyclohexanediol, 1,3-cyclohexanediol, 1,4-cyclohexanediol, and 2-methyl-1,4-cyclohexanediol; cyclohexanedimethanols such as 1,2-cyclohexanedimethanol, 1,3-cyclohexanedimethanol, and 1,4-cyclohexanedimethanol; norbornane dimethanols such as 2,3-norbornane dimethanol and 2,5-norbornane dimethanol; tricyclodecane dimethanol, pentacyclopentadecane dimethanol, 1,3-adamantanediol, 2,2-adamantanediol, decalin dimethanol, 2,2,4,4-tetramethyl-1,3-cyclobutanediol, and isosorbide; and cyclohexanedimethanols and isosorbide are preferably used.

Examples of aromatic dihydroxy compounds include α,α'-bis(4-hydroxyphenyl)-m-diisopropylbenzene (bisphenol M), 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 1,1-bis(4-hydroxyphenyl)cyclohexane, 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfide, bisphenol A, 2,2-bis(4-hydroxy-3-methylphenyl)propane (bisphenol C), 2,2-bis(4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropane (bisphenol AF), and 1,1-bis(4-hydroxyphenyl)decane, with bisphenol A being preferred.

The carbonate structural unit (b) is preferably contained in an amount of 15 to 95 mol % of the total carbonate structural units (100 mol %), more preferably 20 to 90 mol %, even more preferably 25 to 85 mol %, and particularly preferably 30 to 80 mol %. When the carbonate structural unit (b) is within the above range, a resin composition having an excellent balance of thermal stability, surface hardness, impact resistance, and sustained antistatic properties can be obtained.

(Production method of polycarbonate resin (A))
The polycarbonate resin used in the resin composition of the present invention is produced by a reaction means known per se for producing ordinary polycarbonate resins, for example, a method of reacting a diol component with a carbonate precursor such as a carbonic acid diester. The basic means for these production methods will now be briefly described.

The transesterification reaction using a carbonic acid diester as a carbonate precursor is carried out by stirring a predetermined ratio of diol components with a carbonic acid diester under heating in an inert gas atmosphere, and distilling off the resulting alcohol or phenol. The reaction temperature varies depending on the boiling point of the resulting alcohol or phenol, but is usually in the range of 120 to 300°C. The reaction is completed by reducing the pressure from the beginning and distilling off the resulting alcohol or phenol. If necessary, a terminal terminator, an antioxidant, etc. may be added.

The carbonic acid diester used in the transesterification reaction may be an ester of an aryl group or an aralkyl group having 6 to 12 carbon atoms, which may be substituted. Specific examples include diphenyl carbonate, ditolyl carbonate, bis(chlorophenyl) carbonate, and m-cresyl carbonate. Of these, diphenyl carbonate is particularly preferred. The amount of diphenyl carbonate used is preferably 0.97 to 1.10 moles, more preferably 1.00 to 1.06 moles, per mole of the total of the dihydroxy compounds.

In addition, in the melt polymerization method, a polymerization catalyst can be used to increase the polymerization rate. Examples of such polymerization catalysts include alkali metal compounds, alkaline earth metal compounds, nitrogen-containing compounds, and metal compounds.

As such compounds, organic acid salts, inorganic salts, oxides, hydroxides, hydrides, alkoxides, quaternary ammonium hydroxides, etc. of alkali metals or alkaline earth metals are preferably used, and these compounds can be used alone or in combination.

Examples of alkali metal compounds include sodium hydroxide, potassium hydroxide, cesium hydroxide, lithium hydroxide, sodium bicarbonate, sodium carbonate, potassium carbonate, cesium carbonate, lithium carbonate, sodium acetate, potassium acetate, cesium acetate, lithium acetate, sodium stearate, potassium stearate, cesium stearate, lithium stearate, sodium borohydride, sodium benzoate, potassium benzoate, cesium benzoate, lithium benzoate, disodium hydrogen phosphate, dipotassium hydrogen phosphate, dilithium hydrogen phosphate, disodium phenylphosphate, disodium, dipotassium, dicesium, and dilithium salts of bisphenol A, and sodium, potassium, cesium, and lithium salts of phenol.

Examples of alkaline earth metal compounds include magnesium hydroxide, calcium hydroxide, strontium hydroxide, barium hydroxide, magnesium carbonate, calcium carbonate, strontium carbonate, barium carbonate, magnesium diacetate, calcium diacetate, strontium diacetate, barium diacetate, barium stearate, etc.

Examples of nitrogen-containing compounds include quaternary ammonium hydroxides having alkyl or aryl groups, such as tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, and trimethylbenzylammonium hydroxide. Other examples include tertiary amines, such as triethylamine, dimethylbenzylamine, and triphenylamine, and imidazoles, such as 2-methylimidazole, 2-phenylimidazole, and benzimidazole. Other examples include bases or basic salts, such as ammonia, tetramethylammonium borohydride, tetrabutylammonium borohydride, tetrabutylammonium tetraphenylborate, and tetraphenylammonium tetraphenylborate.

Examples of metal compounds include zinc aluminum compounds, germanium compounds, organotin compounds, antimony compounds, manganese compounds, titanium compounds, zirconium compounds, etc. These compounds may be used alone or in combination of two or more.

The amount of the polymerization catalyst used is preferably 1×10 ⁻⁹ to 1×10 ⁻² equivalents, more preferably 1×10 ⁻⁸ to 1×10 ⁻⁵ equivalents, and even more preferably 1×10
It is selected in the range of ⁻⁷ to 1×10 ⁻³ equivalents.

A catalyst deactivator can also be added in the later stages of the reaction. Known catalyst deactivators are effectively used as catalyst deactivators, and among these, ammonium salts and phosphonium salts of sulfonic acid are preferred. Furthermore, salts of dodecylbenzenesulfonic acid such as tetrabutylphosphonium salt of dodecylbenzenesulfonic acid, and salts of paratoluenesulfonic acid such as tetrabutylammonium salt of paratoluenesulfonic acid are preferred.

As sulfonic acid esters, methyl benzenesulfonate, ethyl benzenesulfonate, butyl benzenesulfonate, octyl benzenesulfonate, phenyl benzenesulfonate, methyl paratoluenesulfonate, ethyl paratoluenesulfonate, butyl paratoluenesulfonate, octyl paratoluenesulfonate, phenyl paratoluenesulfonate, etc. are preferably used. Among these, tetrabutylphosphonium dodecylbenzenesulfonate is most preferably used.

When at least one polymerization catalyst selected from alkali metal compounds and/or alkaline earth metal compounds is used, the amount of these catalyst deactivators used is preferably 0.5 to 50 moles per mole of the catalyst, more preferably 0.5 to 10 moles, and even more preferably 0.8 to 5 moles.

(Specific Viscosity of Polycarbonate Resin (A): η _SP )
The specific viscosity (η _SP ) of the polycarbonate resin used in the resin composition of the present invention is preferably 0.2 to 1.5. When the specific viscosity is in the range of 0.2 to 1.5, the strength and moldability of the molded product become better. It is more preferably 0.25 to 1.0, even more preferably 0.3 to 0.7, and particularly preferably 0.3 to 0.5.

The specific viscosity referred to in the present invention is determined by dissolving 0.7 g of polycarbonate resin in 100 ml of methylene chloride at 20° C. using an Ostwald viscometer.
Specific viscosity (η _SP )=(t−t ₀ )/t ₀
[ _t0 is the number of seconds that methylene chloride falls, and t is the number of seconds that the sample solution falls]

Specific viscosity can be measured, for example, as follows: First, polycarbonate resin is dissolved in methylene chloride in an amount 20 to 30 times its weight, and the soluble portion is collected by celite filtration. The solution is then removed and the mixture is thoroughly dried to obtain a solid that is soluble in methylene chloride. 0.7 g of this solid is dissolved in 100 ml of methylene chloride, and the specific viscosity at 20°C is determined using an Ostwald viscometer.

(Acrylic resin (B))
The acrylic resin used in the resin composition of the present invention is an acrylic resin as a thermoplastic resin. The following compounds can be mentioned as monomers used in the acrylic resin. For example, methyl methacrylate, methacrylic acid, methyl acrylate, acrylic acid, benzyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, stearyl (meth)acrylate, glycidyl (meth)acrylate, hydroxypropyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, norbornyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, Examples of the acrylate include acrylate, acrylic (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-(meth)acroyloxyethyl succinate, 2-(meth)acroyloxyethyl maleate, 2-(meth)acroyloxyethyl phthalate, 2-(meth)acryloyloxyethyl hexahydrophthalate, pentamethylpiperidyl (meth)acrylate, tetramethylpiperidyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, cyclopentyl methacrylate, cyclopentyl acrylate, cyclohexyl methacrylate, cyclohexyl acrylate, cycloheptyl methacrylate, cycloheptyl acrylate, cyclooctyl methacrylate, cyclooctyl acrylate, cyclododecyl methacrylate, and cyclododecyl acrylate.

These may be polymerized alone or in combination of two or more. Among these, it is preferable to use methyl methacrylate and/or methyl acrylate. In particular, it is preferable to use 40 to 100 mol% of methyl methacrylate as a monomer component, more preferably 50 to 100 mol%, and even more preferably 60 to 99 mol%. When the proportion of methyl methacrylate as a monomer component is within the above range, the thermal decomposition resistance is excellent, molding defects such as silver are less likely to occur during molding, and the heat distortion temperature is better. In addition, other monomers that can be polymerized with these acrylic monomers, such as polyolefin monomers and vinyl monomers, may be used in combination.

The molecular weight of the acrylic resin is not particularly limited, but as long as the weight average molecular weight is in the range of 30,000 or more and 300,000 or less, a composition with excellent mechanical properties and heat resistance can be provided without causing appearance defects such as uneven flow when molded into a composition.

The acrylic resin used in the resin composition of the present invention preferably has a specific viscosity in the range of 0.12 to 0.55. If the specific viscosity is less than 0.12, the molded product may become brittle. If the specific viscosity is higher than 0.55, the melt viscosity of the resin may increase, resulting in poor moldability.

(Impact Modifier (C))
The resin composition of the present invention contains an impact modifier (C). The impact modifier (C) is preferably a core-shell type polymer consisting of a core which is a rubber polymer and a shell obtained by graft polymerization to the rubber polymer. By making it a core-shell type polymer, dispersibility in polycarbonate becomes good, and high impact strength tends to be obtained.

The average particle size of the impact modifier (C) is preferably 10 nm or more. More preferably, it is 30 nm or more, and even more preferably, it is 50 nm or more. If the average particle size is less than 10 nm, sufficient impact strength tends not to be obtained. The average particle size is measured in the latex state of the rubber-like polymer and the graft copolymer. The volume average particle size was measured using a MICROTRAC UPA150 manufactured by Nikkiso Co., Ltd. as a measuring device.

The rubber-like polymer corresponding to the core of the impact modifier (C) is a rubber-like polymer of a vinyl monomer, or a polymer of a diene monomer and a vinyl monomer, and it is preferable that the vinyl monomer is at least one selected from a (meth)acrylic acid monomer and a (meth)acrylic acid alkyl ester monomer, since this improves the impact strength of the resin composition of the present invention and is also preferable from the viewpoint of raw material costs.

The (meth)acrylic acid monomer refers to an acrylic acid monomer, a methacrylic acid monomer, or a mixture thereof. The (meth)acrylic acid alkyl ester monomer refers to an acrylic acid alkyl ester monomer, a methacrylic acid alkyl ester monomer, or a mixture thereof.

A specific example of a diene monomer is 1,3-butadiene. Specific examples of (meth)acrylic acid monomers and (meth)acrylic acid alkyl ester monomers include acrylic acid, methacrylic acid, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, 2-hydroxyethyl methacrylate, and glycidyl methacrylate. Polymers obtained from such monomers include, for example, butadiene-acrylic acid ester copolymers.

From the viewpoint of improving impact resistance, it is preferable that the glass transition temperature (Tg) of the rubber-like polymer is 0°C or lower. It is more preferable that it is -20°C or lower, and even more preferable that it is -40°C or lower.

The shell portion of the impact modifier (C) is at least one vinyl monomer. The shell portion can be formed by graft polymerization with at least one vinyl monomer.

Examples of vinyl monomers include aromatic vinyl compounds, vinyl cyanide compounds, unsaturated carboxylic acids, and unsaturated carboxylic acid esters. Among aromatic vinyl compounds, styrene and α-methylstyrene are preferred, among vinyl cyanide compounds, acrylonitrile and methacrylonitrile are preferred, and among unsaturated carboxylic acids and unsaturated carboxylic acid esters, acrylic acid, methacrylic acid, acrylic acid esters and methacrylic acid esters having alkyl esters with 1 to 12 carbon atoms are preferred. Since they have excellent dispersibility in polycarbonate resins and the resulting resin composition has excellent transparency, it is preferred that the vinyl monomer used in the graft polymerization is an unsaturated carboxylic acid ester, or a mixture of an unsaturated carboxylic acid ester and an aromatic vinyl compound.

Furthermore, one or more reactive groups selected from epoxy groups, hydroxy groups, carboxy groups, alkoxy groups, isocyanate groups, acid anhydride groups, and acid chloride groups can be introduced into the graft portion of the impact modifier (C). This can improve dispersibility and impact resistance compared to the use of a rubber graft copolymer that does not contain reactive groups.

In addition, the impact modifier (C) used in the present invention can be made transparent by using one having a refractive index of 1.485 or more and 1.495 or less. In this case, the refractive index is preferably 1.487 or more and 1.494 or less, and more preferably 1.490 or more and 1.493 or less.

The impact modifier (C) may be produced by any of bulk polymerization, solution polymerization, suspension polymerization, and emulsion polymerization, but emulsion polymerization, i.e., emulsion graft polymerization, is preferred. Specifically, latex is added to a reaction vessel equipped with a stirrer, followed by addition of a vinyl monomer, a polymerization initiator, and water, and optionally a chain transfer agent and an oxidation-reduction agent, followed by heating and stirring.

There are no particular limitations on the types of polymerization initiator, chain transfer agent, and redox agent used here, and known agents can be used. There are also no particular limitations on the method of adding each raw material to the reaction vessel, and they may be added all at once before the start of polymerization, or added in portions. The graft polymerization is carried out in one or more stages, and the monomer composition in each stage may be the same or different. The monomers may be added all at once, continuously, or in a combination of these.

When the emulsion polymerization method is employed, a known polymerization initiator, that is, a thermal decomposition type polymerization initiator such as 2,2'-azobisisobutyronitrile, hydrogen peroxide, potassium persulfate, ammonium persulfate, etc., can be used. Alternatively, a redox type polymerization initiator can be used in combination with a peroxide such as an organic peroxide such as t-butylperoxyisopropyl carbonate, paramenthane hydroperoxide, cumene hydroperoxide, dicumyl peroxide, t-butyl hydroperoxide, di-t-butyl peroxide, t-hexyl peroxide, etc., or an inorganic peroxide such as hydrogen peroxide, potassium persulfate, ammonium persulfate, etc., and a reducing agent such as sodium formaldehyde sulfoxylate, glucose, etc., a transition metal salt such as iron (II) sulfate, etc., a chelating agent such as disodium ethylenediaminetetraacetate, etc., and a phosphorus-based flame retardant such as sodium pyrophosphate, etc., if necessary.

When a redox type polymerization initiator system is used, the polymerization can be carried out even at a low temperature where the peroxide does not substantially decompose thermally, and therefore the polymerization temperature can be set within a wide range, which is preferable. Among them, it is preferable to use an aromatic ring-containing peroxide such as cumene hydroperoxide or dicumyl peroxide as the redox type polymerization initiator. The amount of the polymerization initiator used, and the amount of the reducing agent, transition metal salt, chelating agent, etc. used when a redox type polymerization initiator is used, can be within the known range.

When synthesizing the impact resistance modifier (C) by emulsion polymerization, the polymerization emulsifier that can be used may be any of the conventionally known polymerization emulsifiers, such as alkali metal salts of higher fatty acids, such as disproportionated rosin acid, oleic acid, and stearic acid, or alkali metal salts of phosphoric acid compounds, and further alkali metal salts of sulfonic acid and sulfuric acid compounds.

When the impact modifier (C) is obtained by emulsion polymerization, for example, the latex of the impact modifier (C) is mixed with an acid such as hydrochloric acid or a divalent or higher metal salt such as calcium chloride, magnesium chloride, magnesium sulfate, aluminum chloride, or calcium acetate to coagulate, and then the mixture is heat-treated, dehydrated, washed, and dried according to a known method to separate the impact modifier from the aqueous medium (also called the coagulation method). Alternatively, the impact modifier can be precipitated by adding a water-soluble organic solvent such as an alcohol such as methanol, ethanol, or propanol, or acetone to the latex, and then separated from the solvent by centrifugation or filtration, and then dried and isolated. As another method, a method can be mentioned in which a slightly water-soluble organic solvent such as methyl ethyl ketone is added to the latex containing the impact modifier used in the present invention to extract the impact modifier component in the latex into the organic solvent layer, and after separating the organic solvent layer, the impact modifier component is precipitated by mixing with water or the like. The latex can also be directly powdered by a spray drying method.

In addition, in the present invention, the resin composition may be one in which the impact modifier (C) is previously contained in the acrylic resin (B) and then contained in the polycarbonate resin. Specific examples of acrylic resins containing an impact modifier include, but are not limited to, the following:

For example, Mitsubishi Chemical Corporation's ACRYPET IRK304, IRL309, VRL40, Kuraray Co., Ltd.'s PARAPET GR00100, GR04970, GR-H60, Daicel-Evonik Co., Ltd.'s PLEXIGLAS AG100, zk6HF, Asahi Kasei Corporation's DELPET SR8350, SR8500, etc.

(Ion Pair Compound (D))
The ion pair compound used in the present invention is used as an antistatic agent, has a melting point of 100° C. or lower, a 10% weight loss temperature measured by TG-TDA of 250° C. or higher, and satisfies the following formula [I]:
R _I > R _D -30 [I]
(In the formula, R _I is the contact angle (°) of a water droplet of a resin composition having an ion pair compound content of 2 parts by weight per 100 parts by weight of polycarbonate resin, and R _D is the contact angle (°) of a water droplet of a polycarbonate resin.)

The necessity for the melting point of the ion pair compound to be 100°C or less is explained below. It is known that adding an ion pair compound with a low melting point, particularly one that is liquid at room temperature, to a resin makes the resin composition antistatic. The reason for this is that an ion pair compound with a low melting point has an organic compound portion of a certain size, which weakens the Coulomb force between positive and negative charges and increases the affinity with the matrix resin, and is therefore thought to disperse appropriately in the resin composition and exhibit antistatic properties. In particular, when considering addition to polycarbonate resin, a compound with a melting point of 100°C or less is suitable for imparting good antistatic properties. On the other hand, an ion pair compound with a melting point of more than 100°C is difficult to disperse in aromatic polycarbonate resin because the Coulomb force is strong or the organic compound portion is small and has low affinity with the resin, and therefore does not exhibit good antistatic properties. The melting point of the ion pair compound is preferably 90°C or less.

The reason why the 10% weight loss temperature measured by TG-TDA must be 250°C or higher is explained below. If this temperature is low, the ion pair compound is more likely to thermally decompose in environments where the resin compound is exposed to high temperatures, such as melt kneading and injection molding, and the compounds produced by this thermal decomposition also contribute to the thermal decomposition of the resin polymer, causing problems such as molding instability and reduced mechanical properties due to a decrease in molecular weight. The 10% weight loss temperature of the ion pair compound measured by TG-TDA is preferably 260°C or higher, and more preferably 270°C or higher.

The reason why formula [1] should be satisfied is explained below. The more hydrophobic the ion pair compound is, the more the ion pair compound is prevented from dissolving in water when the resin composition containing the ion pair compound comes into contact with water, and the more the sustained antistatic property is improved. The degree of hydrophobicity of the ion pair compound can be defined by the contact angle of a water droplet with the resin composition to which the ion pair compound is added. If formula [I] is not satisfied, this means that the ion pair compound is more hydrophilic, and the ion pair compound dissolves more in water when the resin composition comes into contact with water, and sustained antistatic property cannot be ensured. Furthermore, in order to ensure better sustained antistatic property, it is more preferable that the following formula [II] is satisfied.
R _I > R _D -20 [II]
(In the formula, R _I is the contact angle (°) of a water droplet of a resin composition having an ion pair compound content of 2 parts by weight per 100 parts by weight of polycarbonate resin, and R _D is the contact angle (°) of a water droplet of a polycarbonate resin.)

Ion pair compounds that have a melting point of 100°C or less, a 10% weight loss temperature measured by TG-TDA of 250°C or more, and satisfy formula [1] preferably have a cation that contains an organic ammonium ion or an organic phosphonium ion represented by the following formula (3), or an anion that contains a sulfonylimide ion represented by the following formula (4) or a fluorosulfonate ion represented by the following formula (5).

[In the formula, R ₁ and R ₂ each represent a hydrocarbon group, and M represents a N atom or a P atom.]

[In the formula, R ₃ and R ₄ each represent a perfluoroalkyl group.]

[In the formula, _R5 represents a perfluoroalkyl group.]

In addition, in formula (3), M is preferably a P atom, _R1 is preferably an alkyl group having 1 or more carbon atoms, and _R2 is preferably an alkyl group having 4 or more carbon atoms. Furthermore, it is more preferable that _R1 is an alkyl group having 4 or more carbon atoms, and _R2 is more preferably an alkyl group having 12 or more carbon atoms. It is preferable that _R1 is an alkyl group having 10 or less carbon atoms, and _R2 is an alkyl group having 20 or less carbon atoms.

In formula (4), R ₃ and R ₄ are each preferably a perfluoroalkyl group having 1 to 4 carbon atoms, more preferably a trifluoromethyl group, and in formula (5), R ₅ is preferably a perfluoroalkyl group having 1 to 4 carbon atoms, more preferably a perfluorobutyl group.

(Method for producing a resin composition containing a polycarbonate resin, an acrylic resin, an impact modifier, and an ion pair compound)
The resin composition of the present invention is preferably prepared by blending a polycarbonate resin, an acrylic resin, an impact modifier, and an antistatic agent in a molten state. As a method for blending in a molten state, an extruder is generally used, and the molten resin is kneaded at a temperature of 200 to 320°C, preferably 220 to 300°C, more preferably 230 to 290°C, and then pelletized. This results in pellets of a resin composition in which both resins are uniformly blended. The configuration of the extruder, the configuration of the screw, and the like are not particularly limited. If the molten resin temperature in the extruder exceeds 320°C, the resin may become discolored or may undergo thermal decomposition. On the other hand, if the resin temperature is below 200°C, the resin viscosity may be too high and the extruder may be overloaded.

(Weight ratio)
The weight ratio of the polycarbonate resin (A) and the acrylic resin (B) used in the present invention is preferably in the range of 30:70 to 99:1. More preferably, it is in the range of 35:65 to 95:5, even more preferably in the range of 40:60 to 93:7, particularly preferably in the range of 45:55 to 92:8, and most preferably in the range of 50:50 to 90:10. By keeping it in the above range, a resin composition having superior surface hardness and impact resistance can be obtained.

The impact modifier (C) used in the present invention is blended in the range of 5 to 60 parts by weight per 100 parts by weight of the total of the polycarbonate resin and the acrylic resin. The range is preferably 7 to 55 parts by weight, more preferably 8 to 50 parts by weight, even more preferably 9 to 48 parts by weight, and particularly preferably 10 to 45 parts by weight. By using the above range, a resin composition with excellent surface hardness and impact resistance can be obtained.

The ion pair compound (D) used in the present invention is contained in the range of 0.1 to 10 parts by weight per 100 parts by weight of the total of the polycarbonate resin and the acrylic resin. The range is preferably 0.3 to 8 parts by weight, more preferably 0.5 to 7 parts by weight, and even more preferably 1 to 6 parts by weight. By keeping the range above, it is possible to obtain a resin composition that is excellent in thermal stability, surface hardness, impact resistance, and sustained antistatic properties.

(Additives)
The resin composition of the present invention may contain additives such as a heat stabilizer, a plasticizer, a light stabilizer, a polymerized metal deactivator, a flame retardant, a lubricant, a surfactant, an antibacterial agent, an ultraviolet absorber, a release agent, and a colorant depending on the application and need.

(Heat stabilizer)
The resin composition of the present invention preferably contains a heat stabilizer in order to suppress the molecular weight reduction and the deterioration of the color tone during extrusion and molding. Examples of the heat stabilizer include phosphorus-based heat stabilizers, phenol-based heat stabilizers, and sulfur-based heat stabilizers, and these can be used alone or in combination of two or more. It is preferable to blend a phosphite compound as the phosphorus-based stabilizer. Examples of the phosphite compound include pentaerythritol-type phosphite compounds, phosphite compounds that react with dihydric phenols and have a cyclic structure, and phosphite compounds that have other structures.

Specific examples of the pentaerythritol-type phosphite compounds include distearyl pentaerythritol diphosphite, bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-ethylphenyl)pentaerythritol diphosphite, phenyl bisphenol A pentaerythritol diphosphite, bis(nonylphenyl)pentaerythritol diphosphite, dicyclohexyl pentaerythritol diphosphite, and the like. Among these, distearyl pentaerythritol diphosphite and bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite are preferred.

Examples of phosphite compounds that react with the above dihydric phenols to form a cyclic structure include 2,2'-methylenebis(4,6-di-tert-butylphenyl)(2,4-di-tert-butylphenyl)phosphite, 2,2'-methylenebis(4,6-di-tert-butylphenyl)(2-tert-butyl-4-methylphenyl)phosphite, 2,2'-methylenebis(4-methyl-6-tert-butylphenyl)(2-tert-butyl-4-methylphenyl)phosphite, Examples of such phosphite include 2,2'-ethylidenebis(4-methyl-6-tert-butylphenyl)(2-tert-butyl-4-methylphenyl)phosphite, 2,2'-methylene-bis-(4,6-di-t-butylphenyl)octylphosphite, and 6-tert-butyl-4-[3-[(2,4,8,10)-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphepin-6-yl)oxy]propyl]-2-methylphenol.

Examples of phosphite compounds having the above other structures include triphenyl phosphite, tris(nonylphenyl)phosphite, tridecyl phosphite, trioctyl phosphite, trioctadecyl phosphite, didecyl monophenyl phosphite, dioctyl monophenyl phosphite, diisopropyl monophenyl phosphite, monobutyl diphenyl phosphite, monodecyl diphenyl phosphite, monooctyl diphenyl phosphite, 2,2-methylenebis(4,6-di-tert-butylphenyl)octyl phosphite, tris(diethylphenyl)phosphite, tris(di-iso-propylphenyl)phosphite, tris(di-n-butylphenyl)phosphite, tris(2,4-di-tert-butylphenyl)phosphite, and tris(2,6-di-tert-butylphenyl)phosphite.

In addition to various phosphite compounds, examples include phosphate compounds, phosphonite compounds, and phosphonate compounds.

Examples of the phosphate compound include tributyl phosphate, trimethyl phosphate, tricresyl phosphate, triphenyl phosphate, trichlorophenyl phosphate, triethyl phosphate, diphenyl cresyl phosphate, diphenyl monoorthoxenyl phosphate, tributoxyethyl phosphate, dibutyl phosphate, dioctyl phosphate, diisopropyl phosphate, and the like, and preferably triphenyl phosphate and trimethyl phosphate.

Phosphonite compounds include tetrakis(2,4-di-tert-butylphenyl)-4,4'-biphenylene diphosphonite, tetrakis(2,4-di-tert-butylphenyl)-4,3'-biphenylene diphosphonite, tetrakis(2,4-di-tert-butylphenyl)-3,3'-biphenylene diphosphonite, tetrakis(2,6-di-tert-butylphenyl)-4,4'-biphenylene diphosphonite, tetrakis(2,6-di-tert-butylphenyl)-4,3'-biphenylene diphosphonite, tetrakis(2,6-di-tert-butylphenyl)-3,3'-biphenylene diphosphonite, bis(2,4-di-tert-butylphenyl)-4-phenyl-phenylphosphonite, bis Examples of the phosphonite include (2,4-di-tert-butylphenyl)-3-phenyl-phenyl phosphonite, bis(2,6-di-n-butylphenyl)-3-phenyl-phenyl phosphonite, bis(2,6-di-tert-butylphenyl)-4-phenyl-phenyl phosphonite, and bis(2,6-di-tert-butylphenyl)-3-phenyl-phenyl phosphonite. Tetrakis(di-tert-butylphenyl)-biphenylene diphosphonite and bis(di-tert-butylphenyl)-phenyl-phenyl phosphonite are preferred, and tetrakis(2,4-di-tert-butylphenyl)-biphenylene diphosphonite and bis(2,4-di-tert-butylphenyl)-phenyl-phenyl phosphonite are more preferred. Such phosphonite compounds can be used in combination with the phosphite compounds having an aryl group substituted with two or more alkyl groups, and are therefore preferred.

Examples of phosphonate compounds include dimethyl benzenephosphonate, diethyl benzenephosphonate, and dipropyl benzenephosphonate.

Among the above phosphorus-based heat stabilizers, trisnonylphenyl phosphite, trimethyl phosphate, tris(2,4-di-tert-butylphenyl) phosphite, bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, and bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite are preferably used.

The above phosphorus-based heat stabilizers can be used alone or in combination of two or more kinds. The phosphorus-based heat stabilizer is preferably blended in an amount of 0.001 to 1 part by weight, more preferably 0.01 to 0.5 parts by weight, and even more preferably 0.01 to 0.3 parts by weight per 100 parts by weight of the resin composition.

The resin composition used in the present invention may contain a hindered phenol-based heat stabilizer or a sulfur-based heat stabilizer in combination with a phosphorus-based heat stabilizer to suppress a decrease in molecular weight or deterioration in color during extrusion and molding.

Examples of hindered phenol-based heat stabilizers include, but are not limited to, those that have an antioxidant function, such as n-octadecyl-3-(4'-hydroxy-3',5'-di-t-butylphenyl)propionate, tetrakis{methylene-3-(3',5'-di-t-butyl-4-hydroxyphenyl)propionate}methane, distearyl(4-hydroxy-3-methyl-5-t-butylbenzyl)malonate, triethylene glycol-bis{3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate}, 1,6-hexanediol-bis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, pentaerythrityl-tetrakis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, 2,2-thiazole-bis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, tetrakis(methylene- ...) and tetrakis(methylene-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate). diethylene bis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, 2,2-thiobis(4-methyl-6-t-butylphenol), 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, tris(3,5-di-t-butyl-4-hydroxybenzyl)isocyanurate, 2,4-bis{(octylthio (e)methyl)-o-cresol, isooctyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2,5,7,8-tetramethyl-2(4',8',12'-trimethyltridecyl)chroman-6-ol, 3,3',3",5,5',5"-hexa-t-butyl-a,a',a"-(mesitylene-2,4,6-triyl)tri-p-cresol, etc.

Among these, n-octadecyl-3-(4'-hydroxy-3',5'-di-t-butylphenyl)propionate, pentaerythrityl-tetrakis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, 3,3',3",5,5',5"-hexa-t-butyl-a,a',a'-(mesitylene-2,4,6-triyl)tri-p-cresol, 2,2-thiodiethylenebis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, etc. are preferred.

These hindered phenol-based heat stabilizers may be used alone or in combination of two or more.

The hindered phenol-based heat stabilizer is preferably mixed in an amount of 0.001 to 1 part by weight, more preferably 0.01 to 0.5 parts by weight, and even more preferably 0.01 to 0.3 parts by weight per 100 parts by weight of the resin composition.

Examples of sulfur-based heat stabilizers include dilauryl-3,3'-thiodipropionate, ditridecyl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, distearyl-3,3'-thiodipropionate, laurylstearyl-3,3'-thiodipropionate, pentaerythritol tetrakis (3-laurylthiopropionate), bis[2-methyl-4-(3-laurylthiopropionyloxy)-5-tert-butylphenyl]sulfide, octadecyl disulfide, mercaptobenzimidazole, 2-mercapto-6-methylbenzimidazole, and 1,1'-thiobis(2-naphthol). Of the above, pentaerythritol tetrakis (3-laurylthiopropionate) is preferred.

These sulfur-based heat stabilizers may be used alone or in combination of two or more.

The sulfur-based heat stabilizer is preferably mixed in an amount of 0.001 to 1 part by weight, more preferably 0.01 to 0.5 parts by weight, and even more preferably 0.01 to 0.3 parts by weight per 100 parts by weight of the resin composition.

When using a combination of a phosphite-based heat stabilizer, a phenol-based heat stabilizer, and a sulfur-based heat stabilizer, the total amount of these is preferably 0.001 to 1 part by weight, more preferably 0.01 to 0.3 parts by weight, per 100 parts by weight of the resin composition.

(Release Agent)
In order to further improve the releasability from a mold during melt molding, the resin composition of the present invention may contain a mold release agent within a range that does not impair the object of the present invention.

Such release agents include higher fatty acid esters of monohydric or polyhydric alcohols, higher fatty acids, paraffin wax, beeswax, olefin waxes, olefin waxes containing carboxy groups and/or carboxylic anhydride groups, silicone oils, organopolysiloxanes, etc.

As the higher fatty acid ester, partial or full esters of monohydric or polyhydric alcohols having 1 to 20 carbon atoms and saturated fatty acids having 10 to 30 carbon atoms are preferred. Examples of partial or full esters of monohydric or polyhydric alcohols and saturated fatty acids include stearic acid monoglyceride, stearic acid diglyceride, stearic acid triglyceride, stearate monosorbitate, stearyl stearate, behenic acid monoglyceride, behenyl behenate, pentaerythritol monostearate, pentaerythritol tetrastearate, pentaerythritol tetrapelargonate, propylene glycol monostearate, stearyl stearate, palmityl palmitate, butyl stearate, methyl laurate, isopropyl palmitate, biphenyl biphenate, sorbitan monostearate, 2-ethylhexyl stearate, etc.

Among these, stearic acid monoglyceride, stearic acid triglyceride, pentaerythritol tetrastearate, and behenyl behenate are preferably used.

As the higher fatty acid, a saturated fatty acid having 10 to 30 carbon atoms is preferable. Examples of such fatty acids include myristic acid, lauric acid, palmitic acid, stearic acid, and behenic acid.

These release agents may be used alone or in combination of two or more. The amount of such release agents is preferably 0.01 to 5 parts by weight per 100 parts by weight of the resin composition.

(Ultraviolet absorber)
The resin composition of the present invention may contain an ultraviolet absorber. Examples of the ultraviolet absorber include benzotriazole-based ultraviolet absorbers, benzophenone-based ultraviolet absorbers, triazine-based ultraviolet absorbers, cyclic iminoester-based ultraviolet absorbers, and cyanoacrylate-based ultraviolet absorbers, and among these, benzotriazole-based ultraviolet absorbers are preferred.

Benzotriazole-based ultraviolet absorbers include, for example, 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-5'-tert-butylphenyl)benzotriazole, 2-(2'-hydroxy-5'-tert-octylphenyl)benzotriazole, 2-(2'-hydroxy-3',5'-di-tert-butylphenyl)benzotriazole, 2-(2'-hydroxy-3',5'-di-tert-amylphenyl)benzotriazole, 2-(2'-hydroxy-3'-dodecyl-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-3',5'-bis(α,α'-dimethylbenzyl)phenylbenzotriazole, 2-[2'-hydroxy Benzotriazole-based ultraviolet absorbers such as benzotriazole-based ultraviolet absorbers are typified by 2-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3',5'-di-tert-butylphenyl)-5-chlorobenzotriazole, 2,2'methylenebis[4-(1,1,3,3-tetramethylbutyl)-6-(2H-benzotriazol-2-yl)phenol], and methyl-3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenylpropionate-polyethylene glycol condensate.

The proportion of such ultraviolet absorbers is preferably 0.01 to 2 parts by weight, more preferably 0.1 to 1 part by weight, and even more preferably 0.2 to 0.5 parts by weight, per 100 parts by weight of the resin composition.

(Light stabilizer)
The resin composition of the present invention may contain a light stabilizer. The inclusion of a light stabilizer has the advantages of being excellent in terms of weather resistance and making it difficult for cracks to occur in a molded product.

Examples of light stabilizers include 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate, didecanoic acid bis(2,2,6,6-tetramethyl-1-octyloxy-4-piperidinyl) ester, bis(1,2,2,6,6-pentamethyl-4-piperidinyl)-[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butyl malonate, 2,4-bis[N-butyl-N-(1-cyclohexyloxy-2,2,6,6 -tetramethylpiperidin-2-yl)amino]-6-(2-hydroxyethylamine)-1,3,5-triazine, bis(1,2,2,6,6-pentamethyl-4-piperidinyl)sebacate, methyl(1,2,2,6,6-pentamethyl-4-piperidinyl)sebacate, bis(2,2,6,6-tetramethyl-4-piperidyl)carbonate, bis(2,2,6,6-tetramethyl-4-piperidyl)succinate, bis(2,2,6,6-tetramethyl 4-benzoyloxy-2,2,6,6-tetramethylpiperidine, 4-octanoyloxy-2,2,6,6-tetramethylpiperidine, bis(2,2,6,6-tetramethyl-4-piperidyl)diphenylmethane-p,p'-dicarbamate, bis(2,2,6,6-tetramethyl-4-piperidyl)benzene-1,3-disulfonate, bis(2,2,6,6-tetramethyl-4-piperidyl)phenylphosphat Examples of light stabilizers include hindered amines such as dimethylaminoethyl ester, nickel bis(octylphenyl sulfide, nickel complex-3,5-di-t-butyl-4-hydroxybenzyl phosphate monoethylate, and nickel complexes such as nickel dibutyldithiocarbamate. These light stabilizers may be used alone or in combination of two or more. The content of the light stabilizer is preferably 0.001 to 1 part by weight, more preferably 0.01 to 0.5 parts by weight, based on 100 parts by weight of the resin composition.

(Epoxy stabilizer)
In order to improve hydrolysis resistance, an epoxy compound may be blended into the resin composition of the present invention within the range not impairing the object of the present invention.

Epoxy stabilizers include epoxidized soybean oil, epoxidized linseed oil, phenyl glycidyl ether, allyl glycidyl ether, t-butylphenyl glycidyl ether, 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexyl carboxylate, 3,4-epoxy-6-methylcyclohexylmethyl-3',4'-epoxy-6'-methylcyclohexyl carboxylate, 2,3-epoxycyclohexylmethyl-3',4'-epoxycyclohexyl carboxylate, 4-(3,4-epoxy-5-methylcyclohexyl)butyl-3',4'-epoxycyclohexyl carboxylate, 3,4-epoxycyclohexylethylene oxide, cyclohexylmethyl-3,4-epoxycyclohexylcarboxylate, 3,4-epoxy-6-methylcyclohexylmethyl-6'-methylcyclohexylcarboxylate, bisphenol A diglycidyl ether, tetrabromobisphenol A glycidyl ether, diglycidyl ester of phthalic acid, diglycidyl ester of hexahydrophthalic acid, bis-epoxydicyclopentadienyl ether, bis-epoxyethylene glycol, bis-epoxycyclohexyl adipate, butadiene diepoxide, tetrafluoroethylene glycol ... phenylethylene epoxide, octyl epoxythalate, epoxidized polybutadiene, 3,4-dimethyl-1,2-epoxycyclohexane, 3,5-dimethyl-1,2-epoxycyclohexane, 3-methyl-5-t-butyl-1,2-epoxycyclohexane, octadecyl-2,2-dimethyl-3,4-epoxycyclohexyl carboxylate, N-butyl-2,2-dimethyl-3,4-epoxycyclohexyl carboxylate, cyclohexyl-2-methyl-3,4-epoxycyclohexyl carboxylate, N-butyl-2-isopropyl-3,4-epoxy-5-methylcyclohexyl carboxylate, octadecyl-3,4-epoxycyclohexyl carboxylate, 2-ethylhexyl-3',4'-epoxycyclohexyl carboxylate, 4,6-dimethyl-2,3-epoxycyclohexyl-3',4'-epoxycyclohexyl carboxylate, 4,5-epoxy tetrahydrophthalic anhydride, 3-t-butyl-4,5-epoxy tetrahydrophthalic anhydride, diethyl-4,5-epoxy-cis-1,2-cyclohexyl dicarboxylate, di-n-butyl-3-t-butyl-4,5-epoxy-cis-1,2-cyclohexyl dicarboxylate, etc. Bisphenol A diglycidyl ether is preferred in terms of compatibility, etc.

It is desirable to mix such epoxy stabilizers in an amount of 0.0001 to 5 parts by weight, preferably 0.001 to 1 part by weight, and more preferably 0.005 to 0.5 parts by weight, per 100 parts by weight of the resin composition.

(Bluing agent)
The resin composition of the present invention can be blended with a bluing agent to eliminate the yellow color of the lens due to the polymer or ultraviolet absorbing agent. As the bluing agent, any agent that is used for polycarbonate can be used without any problem. In general, anthraquinone dyes are easily available and are preferred.

Specific examples of bluing agents include Solvent Violet 13 (CA. No. (Color Index No.) 60725), Solvent Violet 31 (CA. No. 68210), Solvent Violet 33 (CA. No. 60725), Solvent Blue 94 (CA. No. 61500), Solvent Violet 36 (CA. No. 68210), Solvent Blue 97 (Bayer's "Macrolex Violet RR"), and Solvent Blue 45 (CA. No. 61110).

These bluing agents may be used alone or in combination of two or more. These bluing agents are preferably mixed in an amount of 0.1×10 ⁻⁴ to 2×10 ⁻⁴ parts by weight per 100 parts by weight of the resin composition.

(Flame retardant)
The resin composition of the present invention may also contain a flame retardant. Examples of the flame retardant include halogen-based flame retardants such as brominated epoxy resin, brominated polystyrene, brominated polycarbonate, brominated polyacrylate, and chlorinated polyethylene, phosphate-based flame retardants such as monophosphate compounds and phosphate oligomer compounds, organic phosphorus-based flame retardants other than phosphate-based flame retardants such as phosphinate compounds, phosphonate compounds, phosphonitrile oligomer compounds, and phosphonic acid amide compounds, organic metal salt-based flame retardants such as organic sulfonic acid alkali (earth) metal salts, boric acid metal salt-based flame retardants, and stannic acid metal salt-based flame retardants, as well as silicone-based flame retardants, ammonium polyphosphate-based flame retardants, and triazine-based flame retardants. In addition, flame retardant assistants (e.g., sodium antimonate, antimony trioxide, etc.) and drip prevention agents (polytetrafluoroethylene having fibril forming ability, etc.) may be added separately and used in combination with the flame retardant.

Among the flame retardants mentioned above, compounds that do not contain chlorine or bromine atoms are more suitable as flame retardants for the molded article of the present invention, which is characterized by its reduced environmental impact, because they reduce factors that are considered undesirable when incinerating or thermally recycling the material.

When a flame retardant is added, the amount is preferably in the range of 0.05 to 50 parts by weight per 100 parts by weight of the resin composition. At 0.05 parts by weight or more, sufficient flame retardancy is likely to be achieved, and at 50 parts by weight or less, the strength and heat resistance of the molded product will be excellent.

(Molded products)
The resin composition of the present invention can be molded and processed into a molded product (including a sheet or a film) by any method such as injection molding, compression molding, injection compression molding, melt film forming, or casting, and can be used as a molded product such as an optical lens, an optical disk, an optical film, a plastic substrate, an optical card, a liquid crystal panel, a headlamp lens, a light guide plate, a diffusion plate, a protective film, an OPC binder, a front plate, a housing, a tray, a water tank, a lighting cover, a signboard, a plastic window, etc. In particular, it can be used as a member requiring high surface hardness such as a front plate, a housing, a tray, a water tank, a lighting cover, a signboard, or a plastic window.

(Impact Strength)
The resin composition of the present invention preferably has a notched Charpy impact strength of 10 kJ/ ^m2 or more, more preferably 11 kJ/ ^m2 or more, even more preferably 12 kJ/ ^m2 or more, and particularly preferably 13 kJ/ ^m2 or more, measured in accordance with ISO 179. Note that a notched Charpy impact strength of 100 kJ/m2 or ^less provides sufficient functionality.

(Pencil hardness)
The resin composition of the present invention preferably has a pencil hardness of H or more. From the viewpoint of being more excellent in scratch resistance, it is more preferable that the pencil hardness is 2H or more. A pencil hardness of 4H or less provides sufficient functionality. The pencil hardness can be increased by increasing the weight ratio of the acrylic resin. In the present invention, the pencil hardness refers to a hardness at which no scratch marks are left when the resin composition of the present invention is rubbed with a pencil having a specific pencil hardness, and is defined as follows according to the JIS
It is preferable to use as an index the pencil hardness used in the surface hardness test of a coating film, which can be measured according to K-5600. The pencil hardness becomes softer in the order of 9H, 8H, 7H, 6H, 5H, 4H, 3H, 2H, H, F, HB, B, 2B, 3B, 4B, 5B, and 6B, with the hardest being 9H and the softest being 6B.

(Antistatic properties)
The resin composition of the present invention preferably has a surface resistivity of 1×10 ¹⁵ Ω/□ or less, more preferably 1×10 14 Ω/□ or less, and even more preferably 1×10 ¹³ Ω/□ or less, as measured using a high resistance resistivity meter MCP-HT450 manufactured by Mitsubishi Chemical Analytical Corporation at a measurement voltage of ¹⁰⁰⁰ V.

(Surface Treatment)
Molded articles formed from the resin composition of the present invention can be subjected to various surface treatments. The surface treatment referred to here is a method for forming a new layer on the surface of a resin molded article, such as vapor deposition (physical vapor deposition, chemical vapor deposition, etc.), plating (electroplating, electroless plating, hot-dip plating, etc.), painting, coating, printing, etc., and any commonly used method can be applied. Specific examples of the surface treatment include various surface treatments such as hard coat, water-repellent/oil-repellent coat, ultraviolet absorbing coat, infrared absorbing coat, and metallizing (vapor deposition, etc.). Hard coat is a particularly preferred and necessary surface treatment.

The present invention will be described in detail below with reference to examples, but the present invention is not limited thereto. In the examples, "parts" means "parts by weight." The resins and evaluation methods used in the examples are as follows.

[Evaluation method]
<Evaluation of polycarbonate resin>
1. Polymer composition ratio (NMR)
Each repeating unit was measured by proton NMR using JNM-AL400 manufactured by JEOL Ltd., and the polymer composition ratio (molar ratio) was calculated.

2. Specific Viscosity: Measured using an Ostwald viscometer from a solution prepared by dissolving 0.7 g of polycarbonate resin in 100 ml of methylene chloride at 20°C.
Specific viscosity (η _SP )=(t−t ₀ )/t ₀
[ _t0 is the number of seconds that methylene chloride falls, and t is the number of seconds that the sample solution falls]

<Evaluation of ion pair compounds>
1. Melting point: Materials that are liquid at room temperature (20° C.) are recorded as <20° C. Materials that are not liquid at room temperature are recorded as the melting point by reading the peak position corresponding to the melting point from a heat quantity versus temperature chart obtained using a DSC analyzer (DSC214 manufactured by NETZSCH) at a heating rate of 10° C./min.

2. Heat Resistance The 10% weight loss temperature was measured using a TG-DTA analyzer (Thermo plus EVO2 manufactured by Rigaku Corporation) under conditions of an air atmosphere and a temperature increase rate of 20° C./min.

<Evaluation of Resin Composition>
1. Hydrophilicity of Molded Article Surface Using a contact angle measuring device (GI-1000 manufactured by Elma Sales Co., Ltd.), the water drop contact angle (R _D ) of a polycarbonate resin and the water drop contact angle (R _{I )} of a resin composition containing 2 parts by weight of each ion pair compound per 100 parts by weight of the polycarbonate resin were measured by dropping a drop of water onto a flat plate test piece obtained by injection molding under conditions of 23°C x 50% humidity.

2. Antistatic properties (before wiping with water)
A flat test piece of 45 mm x 50 mm x 2 mm was prepared by injection molding under the above conditions, and measurements were performed under the following conditions. That is, the flat test piece was prepared under conditions of 23°C and 50% relative humidity for 48 hours or more, and then the surface specific resistivity was measured using a resistivity meter (high resistance resistivity meter MCP-HT450 manufactured by Mitsubishi Chemical Analyc Corporation) under a measurement voltage of 1000 V. The smaller the value, the better the antistatic performance. The surface resistivity was rated as ◎ when it was 1 x 10 ¹⁴ Ω/□ or less, ◯ when it was greater than 1 x 10 ¹⁴ Ω/□ and less than 1 x 10 ¹⁵ Ω/□, and × when it was greater than 1 x 10 ¹⁵ Ω/□.

3. Antistatic properties (after wiping with water)
A 500 g cylindrical weight was wrapped in a water-soaked Kimtowel (manufactured by Nippon Paper Crecia Co., Ltd.), placed on the flat test piece, and slid 10 times to wipe the surface with water. Next, the surface was lightly wiped three times with a dry Kimwipe to wipe off water droplets. Thereafter, the surface resistivity was evaluated using the same method as in 2. above. A surface resistivity of 1×10 ¹⁴ Ω/□ or less was evaluated as ⊚, and a surface resistivity of 1×10
The case where the resistance was more than ¹⁴ Ω/□ and 1×10 ¹⁵ Ω/□ or less was marked as ◯, and the case where the resistance was more than 1×10 ¹⁵ Ω/□ was marked as ×.

4. Thermal stability In injection molding, the resin was allowed to reside in the cylinder for 10 minutes, and then the viscosity average molecular weight (M ₁ ) of the molded product injected and the viscosity average molecular weight (M ₀ ) of the melt-kneaded pellets were measured. Cases that satisfied _{M 0} -M ₁ ≦1,000 were marked with ◯, and cases that did not were marked with ×.

In the present invention, the viscosity average molecular weight is determined by first determining the specific viscosity (η _SP ) calculated by the following formula [III] from a solution prepared by dissolving 0.7 g of polycarbonate resin in 100 ml of methylene chloride at 20° C. using an Ostwald viscometer, and then calculating the viscosity average molecular weight M from the determined specific viscosity (η _SP ) using the following formulas [IV] and [V].
Specific viscosity (η _SP )=(t−t ₀ )/t ₀ [III]
[ _t0 is the number of seconds that methylene chloride falls, and t is the number of seconds that the sample solution falls]
η _SP /c = [η] + 0.45 × [η] ² c (where [η] is the intrinsic viscosity) [IV]
[η]=1.23× ^10-4 M ^0.83 [V]

5. Surface hardness (pencil hardness)
According to JIS K5400, a line was drawn on the surface of the molded article in a thermostatic chamber at an atmospheric temperature of 23° C. with a pencil held at a 45° angle and a load of 750 g, and the surface condition was evaluated visually. Pencil hardness of 2H or more was rated as ⊚, H as ◯, and F or less as ×.

6. Notched Charpy Impact Strength The notched Charpy impact strength of the ISO bending test pieces obtained by the following method was measured according to ISO 179. Charpy impact strengths of 10 kJ/m2 or ^more were evaluated as ◯, and those of less than ¹⁰ kJ/m2 were evaluated as ×.

[Resins and additives used]
<Polycarbonate resin (A)>
PC-1 (Example):
Structural units derived from isosorbide (hereinafter referred to as ISS)/structural units derived from 3,9-bis(2-hydroxy-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro(5,5)undecane (hereinafter referred to as SPG)/structural units derived from 1,9-nonanediol (hereinafter referred to as ND)=72/21/7 (mol %), specific viscosity 0.396
PC-2 (Example):
Structural units derived from ISS/structural units derived from SPG/structural units derived from ND=58/38/4 (mol %), specific viscosity 0.425
PC-3 (comparative example):
Structural units derived from ISS/structural units derived from ND=88/12 (mol %), specific viscosity 0.366

<Acrylic resin (B)>
B-1 (Example): Acrypet VH001 manufactured by Mitsubishi Chemical Corporation (acrylic resin copolymerized with 95 mol % of methyl methacrylate and 5 mol % of methyl acrylate)

<Impact modifier composite acrylic resin (B+C)>
B+C (Example): Acrypet VRL40 manufactured by Mitsubishi Chemical Corporation

<Impact Modifier (C)>
C-1 (Example): Kane Ace M-230 manufactured by Kaneka Corporation
C-2 (Example): Metablen W-377 manufactured by Mitsubishi Chemical Corporation
C-3 (Example): Metablen E-870A manufactured by Mitsubishi Chemical Corporation

<Ion Pair Compound (D)>
D-1: Trihexyl(tetradecyl)phosphonium bis(trifluoromethylsulfonyl)imide (Kanto Chemical Co., Ltd.)
D-2: Tributyl(dodecyl)phosphonium bis(trifluoromethylsulfonyl)imide (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.)
D-3: 1-ethyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)imide (P12N111 manufactured by Mitsubishi Materials Corporation)
D-4: 1-ethylpyridinium bis(trifluoromethylsulfonyl)imide (EPYN111 manufactured by Mitsubishi Materials Corporation)
D-5: 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide (EMIN111 manufactured by Mitsubishi Materials Corporation)
D-6: 1-butyl-3-methylimidazolium perfluorobutanesulfonate (BMIEF41 manufactured by Mitsubishi Materials Corporation)
D-7: 1-butyl-3-methylimidazolium dicyanamide (Tokyo Chemical Industry Co., Ltd.)
D-8 (Comparative Example): 1-butyl-3-methylimidazolium chloride (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
D-9 (Comparative Example): Potassium perfluorobutanesulfonate (Megafac F-114P, manufactured by Dai Nippon Ink and Chemicals, Inc.)
D-10 (Comparative Example): Dodecylbenzenesulfonic acid tetrabutylphosphonium salt (DBS-P) (manufactured by Takemoto Oil Co., Ltd.)

<Other ingredients>
E: Surfactant type antistatic agent (non-ion pair) (Poem DL-100, manufactured by Riken Vitamin Co., Ltd.)
F: Block polymer having a structure in which a polyamide block and a polyether block are ester-bonded (Pelestat NC6321, manufactured by Sanyo Chemical Industries, Ltd.)

[Reference Example 1]
<Production of polycarbonate resin>
364 parts of isosorbide (hereinafter abbreviated as ISS), 221 parts of 3,9-bis(2-hydroxy-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro(5,5)undecane (hereinafter abbreviated as SPG), 39 parts of 1,9-nonanediol (hereinafter abbreviated as ND), 750 parts of diphenyl carbonate (hereinafter abbreviated as DPC), and 0.8×10 ⁻² parts of tetramethylammonium hydroxide and 0.6×10 ⁻⁴ parts of barium stearate as catalysts were heated to 200° C. under a nitrogen atmosphere and melted. Thereafter, the temperature was raised to 220° C. over 30 minutes and the degree of vacuum was adjusted to 20.0 kPa. Thereafter, the temperature was raised to 240° C. over another 30 minutes and the degree of vacuum was adjusted to 10 kPa. After maintaining the temperature for 10 minutes, the degree of vacuum was reduced to 133 Pa or less over 1 hour. After the reaction was completed, the reaction mixture was discharged from the bottom of the reaction tank under nitrogen pressure, and while being cooled in a water tank, it was cut with a pelletizer to obtain pellets (PC-1).

<Production of Resin Composition>
Polycarbonate resin PC-1 and ion pair compound D-1 were mixed at a weight ratio of 100:2 and then fed to an extruder. Extrusion was performed using a vented twin screw extruder [Kobe Steel KTX-30] with a diameter of 30 mmφ, melt kneading at a screw speed of 150 rpm, discharge rate of 20 kg/h, and vent vacuum of 3 kPa to obtain pellets. The extrusion temperature was 250°C from the feed port to the die. A part of the obtained pellets was dried in a hot air circulation dryer at 90°C for 6 hours or more, and then a three-stage plate (1 mmt, 2 mmt, 3 mmt) for evaluation was molded using an injection molding machine at a cylinder temperature of 250°C and a mold temperature of 70°C, and the hydrophilicity of the molded product surface was evaluated by a water drop contact angle drop test. The evaluation results are shown in Table 1.

[Reference Examples 2 to 7]
<Production of Resin Composition>
Except for using polycarbonate resin PC-1 and ion pair compounds D-2 to D-7 and mixing them in a weight ratio of 100:2, the same operation as in Reference Example 1 was performed and the same evaluation was performed. Reference Example 2 corresponds to the case where ion pair compound D-2 was used, Reference Example 3 corresponds to the case where ion pair compound D-3 was used, Reference Example 4 corresponds to the case where ion pair compound D-4 was used, Reference Example 5 corresponds to the case where ion pair compound D-5 was used, Reference Example 6 corresponds to the case where ion pair compound D-6 was used, and Reference Example 7 corresponds to the case where ion pair compound D-7 was used. The evaluation results are shown in Table 1.

[Reference Comparative Examples 1 to 3]
<Production of Resin Composition>
Except for using polycarbonate resin PC-1 and ion-pair compounds D-8 to D-10 and mixing them at a weight ratio of 100:2, the same operations as in Reference Example 1 were carried out and the same evaluations were carried out. Reference Comparative Example 1 corresponds to the case where ion-pair compound D-8 was used, Reference Comparative Example 2 corresponds to the case where ion-pair compound D-9 was used, and Reference Comparative Example 3 corresponds to the case where ion-pair compound D-10 was used. The evaluation results are shown in Table 1. When ion-pair compound D-8 was used, thermal decomposition occurred during molding, and a molded product could not be obtained.

[Examples 1 to 5, Comparative Example 1]
<Production of Resin Composition>
Polycarbonate resin PC-1, impact modifier composite acrylic resin B+C, and ion pair compound D-1 were mixed to a weight ratio of 70:30:1 to 70:30:11, and melt kneading and injection molding were performed in the same manner as in Reference Example 1 to mold a three-stage plate for evaluation (1 mmt, 2 mmt, 3 mmt). Using the molded three-stage plate, evaluations of antistatic properties, surface hardness, and impact resistance were performed based on the above evaluation method. In addition, during injection molding, a molded product (retention molded product) was also produced by retaining the resin in the cylinder for 10 minutes and then injecting it, and the thermal stability was evaluated by measuring the viscosity average molecular weight of the melt kneaded pellets and the retention molded product. Note that the polymerization ratio of the ion pair compound D-1 was 1 in Example 1 and 2 in Example 2.
corresponds to a polymerization ratio of 2, Example 3 corresponds to a polymerization ratio of 3, Example 4 corresponds to a polymerization ratio of 5, Example 5 corresponds to a polymerization ratio of 8, and Comparative Example 1 corresponds to a polymerization ratio of 11. The evaluation results are shown in Tables 2 and 3.

[Example 6]
<Production of Resin Composition>
The polycarbonate resin PC-1, the impact modifier composite acrylic resin B+C, and the ion pair compound D-2 were mixed in a weight ratio of 70:30:2, and the same operations and evaluations were carried out as in Example 1. The evaluation results are shown in Table 2.

[Examples 7 to 8]
<Production of Resin Composition>
The same operations as in Example 1 were carried out, and the same evaluations were carried out, except that polycarbonate resin PC-1, impact modifier composite acrylic resin B+C, and ion pair compound D-3 were used and mixed so as to give a weight ratio of 70:30:2 to 70:30:5. As for the polymerization ratio of ion pair compound D-3, Example 7 corresponds to a polymerization ratio of 2, and Example 8 corresponds to a polymerization ratio of 5. The evaluation results are shown in Table 2.

[Example 9]
<Production of Resin Composition>
The polycarbonate resin PC-1, the impact modifier composite acrylic resin B+C, and the ion pair compound D-4 were mixed in a weight ratio of 70:30:2, and the same operations and evaluations were carried out as in Example 1. The evaluation results are shown in Table 2.

[Examples 10 to 11]
<Production of Resin Composition>
The same operations as in Example 1 were carried out, and the same evaluations were carried out, except that polycarbonate resin PC-1, impact modifier composite acrylic resin B+C, and ion pair compound D-5 were used and mixed so as to give a weight ratio of 70:30:2 to 70:30:5. As for the polymerization ratio of ion pair compound D-5, Example 10 corresponds to a polymerization ratio of 2, and Example 11 corresponds to a polymerization ratio of 5. The evaluation results are shown in Table 2.

[Examples 12 to 13]
<Production of Resin Composition>
The same operations as in Example 1 were carried out, and the same evaluations were carried out, except that polycarbonate resin PC-1, impact modifier composite acrylic resin B+C, and ion pair compound D-6 were used and mixed so as to give a weight ratio of 70:30:2 to 70:30:5. As for the polymerization ratio of ion pair compound D-6, Example 12 corresponds to a polymerization ratio of 2, and Example 13 corresponds to a polymerization ratio of 5. The evaluation results are shown in Table 2.

[Example 14]
<Production of Resin Composition>
The polycarbonate resin PC-1, the impact modifier composite acrylic resin B+C, and the ion pair compound D-7 were mixed in a weight ratio of 70:30:2, and the same operations and evaluations were carried out as in Example 1. The evaluation results are shown in Table 2.

[Comparative Example 2]
<Production of Resin Composition>
Except for using polycarbonate resin PC-1, impact modifier composite acrylic resin B+C, and ion pair compound D-8 and mixing them in a weight ratio of 70:30:2, the same operation as in Example 1 was attempted. However, the resin was significantly deteriorated due to heat during processing, and a sample could not be obtained.

[Comparative Example 3]
<Production of Resin Composition>
The polycarbonate resin PC-1, the impact modifier composite acrylic resin B+C, and the ion pair compound D-9 were mixed in a weight ratio of 70:30:2, and the same operations and evaluations were carried out as in Example 1. The evaluation results are shown in Table 3.

[Comparative Example 4]
<Production of Resin Composition>
The same operations and evaluations were carried out as in Example 1, except that polycarbonate resin PC-1, impact modifier composite acrylic resin B+C, and ion pair compound D-10 were mixed in a weight ratio of 70:30:2. The evaluation results are shown in Table 3.

[Comparative Example 5]
<Production of Resin Composition>
The same operations and evaluations were carried out as in Example 1, except that polycarbonate resin PC-1, impact modifier composite acrylic resin B+C, and antistatic agent E were mixed in a weight ratio of 70:30:2. The evaluation results are shown in Table 3.

[Comparative Examples 6 to 7]
<Production of Resin Composition>
Except for using polycarbonate resin PC-1, impact modifier composite acrylic resin B+C, and antistatic agent F and mixing them in a weight ratio of 70:30:4 to 70:30:10, the same operations as in Example 1 were carried out and the same evaluations were carried out. Note that, with respect to the polymerization ratio of antistatic agent F, Comparative Example 6 corresponds to a polymerization ratio of 4, and Comparative Example 7 corresponds to a polymerization ratio of 10. The evaluation results are shown in Table 3.

[Examples 15 to 16]
<Production of Resin Composition>
The same operations as in Example 1 were carried out, and the same evaluations were carried out, except that polycarbonate resin PC-1, acrylic resin B-1, impact modifier C-1, and ion pair compound D-1 were used and mixed so as to give a weight ratio of 70:15:15:2 to 70:15:15:5. As for the polymerization ratio of ion pair compound D-6, Example 15 corresponds to a polymerization ratio of 2, and Example 16 corresponds to a polymerization ratio of 5. The evaluation results are shown in Table 4.

[Example 17]
<Production of Resin Composition>
The same operations and evaluations were carried out as in Example 1, except that polycarbonate resin PC-1, acrylic resin B-1, impact modifier C-1, and ion pair compound D-3 were used and mixed in a weight ratio of 70:15:15:2. The evaluation results are shown in Table 4.

[Example 18]
<Production of Resin Composition>
The same operations and evaluations were carried out as in Example 1, except that polycarbonate resin PC-1, acrylic resin B-1, impact modifier C-1, and ion pair compound D-6 were used and mixed in a weight ratio of 70:15:15:2. The evaluation results are shown in Table 4.

[Example 19]
<Production of Resin Composition>
The same operations and evaluations were carried out as in Example 1, except that polycarbonate resin PC-1, acrylic resin B-1, impact modifier C-2, and ion pair compound D-1 were used and mixed in a weight ratio of 70:15:15:2. The evaluation results are shown in Table 4.

[Example 20]
<Production of Resin Composition>
The same operations and evaluations were carried out as in Example 1, except that polycarbonate resin PC-1, acrylic resin B-1, impact modifier C-3, and ion pair compound D-1 were used and mixed in a weight ratio of 70:15:15:2. The evaluation results are shown in Table 4.

[Example 21]
<Production of polycarbonate resin>
Using 294 parts of ISS, 400 parts of SPG, 22 parts of ND and 750 parts of DPC as raw materials, the same procedure as in Reference Example 1 was repeated to obtain pellets (PC-2).
<Production of Resin Composition>
The same operations and evaluations were carried out as in Example 1, except that polycarbonate resin PC-2, acrylic resin B-1, impact modifier C-1, and ion pair compound D-1 were used and mixed in a weight ratio of 70:10:20:2. The evaluation results are shown in Table 4.
Polycarbonate resin PC-2 and ion pair compound D-1 were mixed in a ratio of 100:2, and the same procedure as in Reference Example 1 was carried out to evaluate the hydrophilicity of the surface of the molded article by a water drop contact angle drop test. The water drop contact angle _R1 was 70°. The water drop contact angle R _D of the surface of the molded article obtained from only polycarbonate resin PC-2 was 76°.

[Example 22]
<Production of Resin Composition>
The same operations and evaluations were carried out as in Example 1, except that polycarbonate resin PC-1, acrylic resin B-1, impact modifier C-1, and ion pair compound D-1 were used and mixed in a weight ratio of 40:30:30:2. The evaluation results are shown in Table 4.

[Example 23]
<Production of Resin Composition>
The same operations and evaluations were carried out as in Example 1, except that polycarbonate resin PC-1, acrylic resin B-1, impact modifier C-1, and ion pair compound D-1 were used and mixed in a weight ratio of 80:10:10:2. The evaluation results are shown in Table 4.

[Comparative Example 8]
<Production of Resin Composition>
The same operations and evaluations were carried out as in Example 1, except that polycarbonate resin PC-1, acrylic resin B-1, impact modifier C-1, and ion pair compound D-10 were used and mixed in a weight ratio of 70:15:15:2. The evaluation results are shown in Table 5.

[Comparative Example 9]
<Production of polycarbonate resin>
450 parts of isosorbide (hereinafter abbreviated as ISS), 67 parts of 1,9-nonanediol (hereinafter abbreviated as ND), 750 parts of diphenyl carbonate (hereinafter abbreviated as DPC), and 0.0033 parts of barium stearate as a catalyst were heated to 150°C under a nitrogen atmosphere and melted. Thereafter, the mixture was sent to a reaction vessel, and the heat medium temperature of the condenser was adjusted to 40°C, the internal resin temperature to 170°C, and the degree of vacuum was adjusted to 13.4 kPa over 30 minutes. Thereafter, the degree of vacuum was adjusted to 3.4 kPa over 20 minutes, and the temperature was maintained for 10 minutes. The degree of vacuum was further reduced to 0.9 kPa over 30 minutes, the internal resin temperature was adjusted to 220°C, and the temperature was maintained for 10 minutes, after which the degree of vacuum was reduced to 0.2 kPa.
The resin temperature was increased from 220°C to 240°C over 30 minutes, and after reaching a specified viscosity, the resin was discharged from the bottom of the reaction tank under nitrogen pressure, and while cooling in a water tank, it was cut with a pelletizer to obtain pellets (PC-3). Using the obtained pellets, injection molding was performed in the same manner as in Example 1, and the same evaluation was performed. The evaluation results are shown in Table 5.

[Comparative Example 10]
<Production of Resin Composition>
Except for using polycarbonate resin PC-3 and ion pair compound D-1 and mixing them in a weight ratio of 100:2, the same operations as in Example 1 were carried out and the same evaluations were carried out. The evaluation results are shown in Table 5.

[Comparative Example 11]
The polycarbonate resin PC-3, the impact modifier C-1, and the ion pair compound D-1 were mixed in a weight ratio of 70:30:2, and the same operations and evaluations were carried out as in Example 1. The evaluation results are shown in Table 5.

[Comparative Example 12]
The polycarbonate resin PC-3, the impact modifier composite acrylic resin B+C, and the ion pair compound D-1 were mixed in a weight ratio of 70:30:2, and the same operations and evaluations were carried out as in Example 1. The evaluation results are shown in Table 5.

[Comparative Example 13]
The same operations and evaluations were carried out as in Example 1, except that polycarbonate resin PC-3, acrylic resin B-1, impact modifier C-1, and ion pair compound D-1 were used and mixed in a weight ratio of 70:15:15:2. The evaluation results are shown in Table 5.

[Comparative Example 14]
Except for using polycarbonate resin PC-1, acrylic resin B-1, and ion pair compound D-1 and mixing them in a weight ratio of 70:30:2, the same operations and evaluations were carried out as in Example 1. The evaluation results are shown in Table 5.

[Comparative Example 15]
<Production of Resin Composition>
Except for using polycarbonate resin PC-1 and ion pair compound D-1 and mixing them in a weight ratio of 100:2, the same operations as in Example 1 were carried out and the same evaluations were carried out. The evaluation results are shown in Table 5.

[Comparative Example 16]
<Production of Resin Composition>
The polycarbonate resin PC-1, the impact modifier C-1, and the ion pair compound D-1 were mixed in a weight ratio of 70:30:2, and the same operations and evaluations were carried out as in Example 1. The evaluation results are shown in Table 5.

The resin composition of the present invention is useful as a component for optical lenses, optical disks, optical films, plastic substrates, optical cards, liquid crystal panels, headlamp lenses, light guide plates, diffusion plates, protective films, OPC binders, front panels, housings, trays, aquariums, lighting covers, signs, plastic windows, etc.

Claims (11)

The resin composition contains 5 to 60 parts by weight of an impact modifier (C) and 0.1 to 10 parts by weight of an ion pair compound (D) relative to a total of 100 parts by weight of a polycarbonate resin (A) containing 5 to 85 mol% of carbonate structural units (a) represented by the following formula (1) out of 100 mol% of all carbonate structural units, and an acrylic resin (B), the weight ratio of the polycarbonate resin (A) to the acrylic resin (B) being 30:70 to 99:1, the ion pair compound has a melting point of 100°C or less, a 10% weight loss temperature measured by TG-TDA of 250°C or more, and satisfies the following formula [I] , and the cation of the ion pair compound contains an organic ammonium ion or organic phosphonium ion represented by the following formula (3), or the anion of the ion pair compound contains a sulfonylimide ion represented by the following formula (4) or a fluorosulfonate ion represented by the following formula (5) .
R _I > R _D -30 [I]
(In the formula, R _I is the contact angle (°) of a water droplet of a resin composition having an ion pair compound content of 2 parts by weight per 100 parts by weight of polycarbonate resin, and R _D is the contact angle (°) of a water droplet of a polycarbonate resin.)
(In the formula, W represents an alkylene group having 1 to 20 carbon atoms or a cycloalkylene group having 6 to 20 carbon atoms, R represents a branched or linear alkyl group having 1 to 20 carbon atoms or a cycloalkyl group having 6 to 20 carbon atoms which may have a substituent, and m represents an integer of 0 to 10.)
[(R ₁ ) ₃ R ₂ M] ⁺ (3)
[In the formula, R ₁ and R ₂ each represent a hydrocarbon group, and M represents a N atom or a P atom.]
(R ₃ SO ₂ ) (R ₄ SO ₂ )N ^- (4)
[In the formula, R ₃ and R ₄ each represent a perfluoroalkyl group.]
R ₅ SO ₃ ^- (5)
[In the formula, R5 _represents a perfluoroalkyl group.] The resin composition according to claim 1, wherein the polycarbonate resin (A) is composed of a carbonate structural unit (a) represented by the formula (1) and another carbonate structural unit (b), and the carbonate structural unit (b) is a carbonate structural unit (b) derived from at least one compound selected from the group consisting of an aliphatic diol compound, an alicyclic diol compound, and an aromatic dihydroxy compound. 3. The resin composition according to claim 1, wherein the acrylic resin (B) contains 40 to 100 mol % of a structural unit derived from methyl methacrylate. The resin composition according to any one of claims 1 to 3 , characterized in that the ion pair compound has a 10% weight loss temperature measured by TG-TDA of 270°C or higher and satisfies the following formula [II]:
R _I > R _D -20 [II]
(In the formula, R _I is the contact angle (°) of a water droplet of a resin composition having an ion pair compound content of 2 parts by weight per 100 parts by weight of polycarbonate resin, and R _D is the contact angle (°) of a water droplet of a polycarbonate resin.) The resin composition according to any one of claims 1 to 4, wherein a cation of the ion-pair compound contains an organic phosphonium ion represented by the following formula (6), or an anion of the ion-pair compound contains a sulfonylimide ion represented by the following formula (7) or a fluorosulfonate ion represented by the following formula ( 8 ).
[(R ₁ ) ₃ R ₂ P] ⁺ (6)
[In the formula, _R1 represents an alkyl group having 1 or more carbon atoms, and _R2 represents an alkyl group having 4 or more carbon atoms.]
(R ₃ SO ₂ ) (R ₄ SO ₂ )N ^- (7)
[In the formula, R ₃ and R ₄ each represent a perfluoroalkyl group having 1 to 4 carbon atoms.]
R ₅ SO ₃ ^- (8)
[In the formula, R ₅ represents a perfluoroalkyl group having 1 to 4 carbon atoms.] The resin composition according to any one of claims 1 to 5, wherein a cation of the ion-pair compound contains an organic phosphonium ion represented by the following formula (9), or an anion of the ion-pair compound contains a sulfonylimide ion represented by the following formula ( 10 ) or a fluorosulfonate ion represented by the following formula (11).
[(R ₁ ) ₃ R ₂ P] ⁺ (9)
[In the formula, _R1 represents an alkyl group having 4 or more carbon atoms, and _R2 represents an alkyl group having 12 or more carbon atoms.]
(R ₃ SO ₂ ) (R ₄ SO ₂ )N ^- (10)
[In the formula, R ₃ and R ₄ each represent a trifluoromethyl group.]
R ₅ SO ₃ ^- (11)
[In the formula, _R5 represents a perfluorobutyl group.] The resin composition according to any one of claims 1 to 6 , having a notched Charpy impact strength measured according to ISO 179 of 10 kJ/m2 or ^more . The resin composition according to any one of claims 1 to 7 , which has a pencil hardness of H or more as measured in accordance with JIS K5400. The resin composition according to any one of claims 1 to 8 , wherein the surface resistivity of a molded article is 1 x 10 ¹⁵ (Ω/□) or less. A molded article obtained by injection molding the resin composition according to any one of claims 1 to 9 . A film or sheet formed from the resin composition according to any one of claims 1 to 9 .