JP7670577B2 - Shock absorbing structure - Google Patents

Description

The present invention relates to a shock absorbing structure that protects components mounted on a device from external forces.

Patent Document 1 discloses a device for non-invasively measuring the blood pressure of a subject. The device is equipped with a shock absorbing structure for protecting a pump that delivers or draws in fluid to control the internal pressure of a cuff that is attached to the subject's arm, etc.

JP 2010-088513 A

The objective of the present invention is to provide a shock absorbing structure that enhances the protection of components while minimizing the increase in size of the device on which it is mounted.

One aspect of the present invention to achieve the above object is a shock absorbing structure, comprising:
A housing and
a circuit board housed in the housing and having electronic components mounted thereon;
A holding member housed in the housing and having a rigidity lower than that of the housing;
It is equipped with
The holding member is
A pillar portion having both ends in contact with the housing;
a beam portion extending in a cantilever shape from the column portion and supporting the circuit board;
It is equipped with:

With the above-mentioned configuration, an external force applied to the housing is transmitted through both ends of the pillars of the holding member, which are arranged to be in active contact with the housing. Because the rigidity of the holding member is lower than that of the housing, the external force can be transmitted with active cushioning.

In addition, the circuit board is supported by a beam extending in a cantilever shape from the column so as to be separated from the force transmission path, further reducing the transmission of external forces applied to the housing to the circuit board.

In other words, the holding member can be given the function of supporting the circuit board including electronic components within the housing, and the function of protecting the circuit board from external forces applied to the housing. This makes it possible to prevent the shock absorbing structure from becoming too large, compared to when a configuration for protecting the circuit board from external forces and a configuration for supporting the circuit board within the housing are provided separately. Therefore, it is possible to increase the protection ability of the electronic components while preventing the device in which the shock absorbing structure is mounted from becoming too large.

One aspect of the present invention to achieve the above object is a shock absorbing structure, comprising:
A housing and
a circuit board housed in the housing and having electronic components mounted thereon;
A holding member housed in the housing and having a rigidity lower than that of the housing;
An apparatus component housed in the housing and having a higher rigidity than the holding member;
It is equipped with
the circuit board has an opening;
The holding member is
A support portion supporting the circuit board;
a post portion disposed within the opening and in contact with the housing;
a base portion in contact with the housing at a position different from the column portion;
a holder that holds the device component between the post and the base;
It is equipped with
The circuit board is supported by the support portion so as to be slidable along the column portion.

According to the above-mentioned configuration, an external force applied to the housing is transmitted through the pillar and base of the holding member, which are arranged so as to be in active contact with the housing. Since the rigidity of the holding member is lower than that of the housing, the external force can be transmitted with active cushioning. On the other hand, since a device component with a higher rigidity than the holding member is held between the pillar and base, the device component can function as a reinforcing material for the holding member.

In addition, because the circuit board is slidable along the column, the transmission of external forces applied to the housing to the circuit board can be further suppressed through the relative displacement between the holding member and the circuit board.

In other words, the holding member can be given the function of supporting the circuit board including electronic components within the housing, and the function of protecting the circuit board from external forces applied to the housing. Also, a separate structure for reinforcing the holding member can be omitted. This makes it possible to prevent the shock absorbing structure from becoming larger, compared to a case in which a structure for protecting the circuit board from external forces, a structure for supporting the circuit board within the housing, and a structure for reinforcing the holding member are provided separately. Therefore, it is possible to increase the protection capability of electronic components while preventing the device in which the shock absorbing structure is mounted from becoming larger.

One aspect of the present invention to achieve the above object is a shock absorbing structure, comprising:
A housing and
a circuit board housed in the housing and having electronic components mounted thereon;
A holding member housed in the housing and having a rigidity lower than that of the housing;
It is equipped with
the circuit board is sandwiched between a part of the housing and a part of the holding member,
When the housing is deformed by an external force, a part of the housing deforms a part of the holding member, displacing the circuit board in a direction away from the housing.

This configuration makes it possible to prevent the deformation of the housing due to external forces from affecting the circuit board. In other words, the holding member can be given the function of supporting the circuit board including electronic components within the housing, and the function of protecting the circuit board from external forces applied to the housing. This makes it possible to prevent the shock absorbing structure from becoming too large, compared to a case in which a configuration for protecting the circuit board from external forces and a configuration for supporting the circuit board within the housing are provided separately. Therefore, it is possible to increase the protection ability of the electronic components while preventing the device in which the shock absorbing structure is mounted from becoming too large.

2 illustrates an external appearance of a holding member according to the first embodiment; 2 illustrates an external appearance of the shock absorbing structure including a cross section taken along line II-II in FIG. 1 and seen from the direction of the arrows. 3 illustrates a cross section of the shock absorbing structure as viewed from the direction of arrow III in FIG. 2 . 13 illustrates an external appearance of a holding member according to a second embodiment. 5 illustrates an external appearance of the shock absorbing structure including a cross section seen from the direction of the arrow along line VV in FIG. 4. 6 illustrates a cross section of a portion of the shock absorbing structure as viewed from the direction of arrow VI in FIG. 5 . 7 illustrates a state in which an external force is applied to the housing illustrated in FIG. 6 .

An example of an embodiment will be described in detail below with reference to the attached drawings. In the attached drawings, arrow F indicates the forward direction of the illustrated structure. Arrow B indicates the rearward direction of the illustrated structure. Arrow U indicates the upward direction of the illustrated structure. Arrow D indicates the downward direction of the illustrated structure. Arrow R indicates the rightward direction of the illustrated structure. Arrow L indicates the leftward direction of the illustrated structure. These directional expressions are used for convenience of explanation and do not limit the posture or direction of the illustrated structure in actual use.

The term "front-rear direction" used in this specification means a direction along the above-mentioned front and rear directions. The term "up-down direction" used in this specification means a direction along the above-mentioned upward and downward directions. The term "left-right direction" used in this specification means a direction along the above-mentioned left and right directions.

As used herein, the expression "extending in the front-to-rear direction" includes extending at an angle relative to the front-to-rear direction, and means extending at an angle closer to the front-to-rear direction than the up-down and left-to-right directions.

As used herein, the expression "extending in the vertical direction" includes extending at an angle relative to the vertical direction, and means extending at an angle closer to the vertical direction than the front-to-back and left-to-right directions.

As used herein, the expression "extending in the left-right direction" includes extending at an angle relative to the left-right direction, and means extending at an angle closer to the left-right direction than the front-back and up-down directions.

The shock absorbing structure 10 according to the first embodiment will be described with reference to Figures 1 to 3. Figure 1 illustrates the external appearance of a retaining member 11 included in the shock absorbing structure 10. Figure 2 illustrates the external appearance of the shock absorbing structure 10, including a cross section taken along line II-II in Figure 1 and seen from the direction of the arrows. Figure 3 illustrates a cross section of the shock absorbing structure 10 taken from the direction of arrow III in Figure 2.

As illustrated in Figures 2 and 3, the shock absorbing structure 10 includes a housing 12. The housing 12 includes an upper housing 121 and a lower housing 122. The upper housing 121 and the lower housing 122 are joined together to define an accommodation space 123.

As illustrated in FIG. 1, the shock absorbing structure 10 includes a circuit board 13. Electronic components are mounted on the circuit board 13. The electronic components according to this embodiment include a piezoelectric diaphragm pump 131, illustrated in FIGS. 2 and 3. The circuit board 13 is housed in the housing 12 while being held by a holding member 11. That is, the holding member 11 is also housed in the housing 12.

The shock absorbing structure 10 according to this embodiment can be mounted on a portable blood pressure monitor for non-invasively measuring the blood pressure of a subject. In other words, the housing 12 can be part of the blood pressure monitor. The piezoelectric diaphragm pump 131 is used to send air to a cuff (not shown) used for blood pressure measurement and to inhale air from the cuff. Air is an example of a fluid.

The retaining member 11 has a passage 111 that allows air to pass through. The passage 111 extends in the front-rear direction within the retaining member 11. The passage 111 is configured to communicate with the cuff. The passage 111 is an example of a fluid passage.

As illustrated in FIG. 1, the holding member 11 has a pillar portion 112. The pillar portion 112 extends in the vertical direction. The pillar portion 112 has an upper end portion 112a and a lower end portion 112b. As illustrated in FIG. 3, the upper end portion 112a contacts the inner wall surface of the upper housing 121. The lower end portion 112b contacts the inner wall surface of the lower housing 122. The upper end portion 112a and the lower end portion 112b are examples of both ends of the pillar portion.

As shown in FIG. 1, the holding member 11 has a beam portion 113. The beam portion 113 extends in a cantilever shape in the left-right direction from the column portion 112. The circuit board 13 is held by the beam portion 113.

The holding member 11 is formed to have a lower rigidity than the housing 12. For example, this rigidity relationship can be realized by forming the holding member 11 using a material that is softer than the material used to form the housing 12. Alternatively, this rigidity relationship can be realized by forming the holding member 11 and the housing 12 from the same material and adjusting the thickness and shape accordingly.

According to the above-mentioned configuration, an external force applied to the housing 12 is transmitted through the pillar portion 112 of the holding member 11, which is arranged so as to be in active contact with the housing 12. For example, an external force applied to the upper housing 121 is transmitted through the upper end portion 112a of the pillar portion 112 to the lower end portion 112b, and is released to the lower housing 122. Conversely, an external force applied to the lower housing 122 is transmitted through the lower end portion 112b of the pillar portion 112 to the upper end portion 112a, and is released to the upper housing 121.

The rigidity of the holding member 11 is lower than that of the housing 12, so that the transmission of external forces can be performed with active cushioning. In addition, the circuit board 13 is held by a beam portion 113 that extends in a cantilever shape from the column portion 112 so as to be separated from the above-mentioned force transmission path, so that the transmission of external forces applied to the housing 12 to the circuit board 13 can be further suppressed.

In other words, the holding member 11 can be given the function of supporting the circuit board 13 including electronic components within the housing 12, and the function of protecting the circuit board 13 from external forces applied to the housing 12. This makes it possible to prevent the shock absorbing structure 10 from becoming larger, compared to a case in which a configuration for protecting the circuit board 13 from external forces and a configuration for supporting the circuit board 13 within the housing 12 are provided separately. Therefore, it is possible to increase the protection capability of the electronic components while preventing the blood pressure monitor in which the shock absorbing structure 10 is mounted from becoming larger.

As shown in FIG. 3, the lower housing 122 has a shoulder 122a that protrudes inward. The beam 113 of the holding member 11 can be placed on the shoulder 122a without being fixed thereto.

This configuration increases the degree of freedom of displacement of the beam portion 113 that extends in a cantilever shape from the column portion 112 of the holding member 11. By actively displacing the beam portion 113 in response to an external force transmitted to the column portion 112, it becomes easier to release the external force that may act on the circuit board 13. This further increases the ability to protect electronic components.

In addition or instead, the tip 113a of the beam portion 113 may be positioned to face the lower housing 122 with a gap therebetween.

This configuration not only increases the degree of freedom of displacement of the beam portion 113, but also makes it difficult for external forces applied to the housing 12 from the side to be transmitted to the beam portion 113. This further improves the ability to protect electronic components.

In this embodiment, the holding member 11, which has a passage 111 through which the air sent out and drawn in by the piezoelectric diaphragm pump 131 passes, is a one-piece molded product. The holding member 11 can be formed, for example, by injection molding.

In other words, in addition to the above-mentioned support and cushioning functions, the retaining member 11 can also be made to function as an air flow path. This can reduce the number of parts in the device on which the shock absorbing structure 10 is mounted, and can form a passage 111 with high dimensional accuracy.

While the piezoelectric diaphragm pump 131 has the advantages of being space-saving and quiet during operation, it is known that it is not suitable for installation in portable devices that are relatively prone to being dropped or bumped due to its low resistance to vibration and shock. However, by adopting the shock absorbing structure 10 as described above, the piezoelectric diaphragm pump 131 can be actively adopted in portable blood pressure monitors.

The shock absorbing structure 20 according to the second embodiment will be described with reference to Figs. 4 to 7. Fig. 4 illustrates the appearance of the retaining member 21 included in the shock absorbing structure 20. Fig. 5 illustrates the appearance of the shock absorbing structure 20 including a cross section taken along line V-V in Fig. 4 and seen from the direction of the arrows. Fig. 6 illustrates a cross section of a portion of the shock absorbing structure 20 taken from the direction of arrow VI in Fig. 5.

As illustrated in FIG. 5, the shock absorbing structure 20 includes a housing 22. The housing 22 includes an upper housing 221 and a lower housing 222. The upper housing 221 and the lower housing 222 are joined together to define an accommodation space 223.

The shock absorbing structure 20 includes a circuit board 23 and a solenoid valve 24. Electronic components are mounted on the circuit board 23. For example, the electronic components may include circuit elements that drive the solenoid valve 24. The solenoid valve 24 is an example of an apparatus component.

As illustrated in FIG. 4, the holding member 21 includes a support portion 211. The support portion 211 is configured to support the circuit board 23 from below. As illustrated in FIG. 5, the circuit board 23 is housed in the housing 22 while being supported by the holding member 21. That is, the holding member 21 is also housed in the housing 22.

The holding member 21 has a pillar portion 212. The pillar portion 212 extends in the vertical direction. The pillar portion 212 has an upper end portion 212a. As illustrated in FIG. 6, the upper end portion 212a contacts the inner wall surface of the upper housing 221.

A through hole 231 is formed in the circuit board 23. The through hole 231 is an example of an opening. With the circuit board 23 supported by the support portion 211 of the holding member 21, the pillar portion 212 is disposed within the through hole 231. This allows the circuit board 23 to be supported by the support portion 211 so as to be slidable in the up-down direction along the pillar portion 212.

As illustrated in FIG. 4, the holding member 21 has a base 213. As illustrated in FIG. 5, the base 213 is in contact with the inner wall surface of the lower housing 222. In other words, the base 213 is in contact with the housing 22 at a position different from the column portion 212.

As illustrated in FIG. 4, the holding member 21 includes a holding portion 214. The holding portion 214 holds the solenoid valve 24 between the column portion 212 and the base portion 213. The solenoid valve 24 has higher rigidity than the holding member 21.

The holding member 21 is formed to have a lower rigidity than the housing 22. For example, this rigidity relationship can be realized by forming the holding member 21 using a material that is softer than the material used to form the housing 22. Alternatively, this rigidity relationship can be realized by forming the holding member 21 and the housing 22 from the same material and adjusting the thickness and shape accordingly.

According to the above-mentioned configuration, an external force applied to the housing 22 is transmitted through the pillar portion 212 and the base portion 213 of the holding member 21, which are arranged so as to be in active contact with the housing 22. For example, an external force applied to the upper housing 221 is transmitted to the base portion 213 through the pillar portion 212 and is released to the lower housing 222. Conversely, an external force applied to the lower housing 222 is transmitted to the pillar portion 212 through the base portion 213 and is released to the upper housing 221.

The rigidity of the holding member 21 is lower than that of the housing 22, so that external forces can be transmitted with active cushioning. On the other hand, the solenoid valve 24, which has a higher rigidity than the holding member 21, is held between the column portion 212 and the base portion 213, so that the solenoid valve 24 can function as a reinforcing material for the holding member 21.

In addition, because the circuit board 23 is slidable along the column portion 212, the transmission of external forces applied to the housing 22 to the circuit board 23 can be further suppressed through the relative displacement of the holding member 21 and the circuit board 23.

That is, the holding member 21 can be given the function of supporting the circuit board 23 including electronic components within the housing 22, and the function of protecting the circuit board 23 from external forces applied to the housing 22. In addition, a separate structure for reinforcing the holding member 21 can be omitted. This makes it possible to suppress an increase in size of the shock absorbing structure 20 compared to a case in which a structure for protecting the circuit board 23 from external forces, a structure for supporting the circuit board 23 within the housing 22, and a structure for reinforcing the holding member 21 are provided separately. Therefore, it is possible to increase the protection capability of the electronic components while suppressing an increase in size of the device in which the shock absorbing structure 20 is mounted.

As illustrated in FIG. 5, the upper housing 221 may include a rib 221a. As illustrated in FIG. 6, the peripheral edge of the circuit board 23 may be clamped between the rib 221a and the support portion 211 of the holding member 21. The rib 221a is an example of a part of the housing. The support portion 211 is an example of a part of the holding member.

As illustrated in FIG. 7, when the upper housing 221 is deformed by an external force, the rib 221a deforms the support portion 211 while displacing the circuit board 23 downward along the pillar portion 212. In other words, the rib 221a displaces the circuit board 23 in a direction away from the deforming upper housing 221.

This configuration makes it possible to prevent the deformation of the upper housing 221 caused by external forces from affecting the circuit board 23. This further enhances the ability to protect the electronic components.

The above-described embodiment is merely an example to facilitate understanding of the present invention. The configurations according to the above-described embodiments may be modified or improved as appropriate without departing from the spirit and scope of the present invention.

The configuration described with reference to the holding member 11 according to the first embodiment can be applied to the holding member 21 according to the second embodiment. For example, a pump can be mounted on the circuit board 23, and a passage through which air sent out and sucked in by the pump passes can be formed in the holding member 21. The type of pump is not limited to a piezoelectric diaphragm pump. In this case, it is preferable that the holding member 21 is an integrally molded product.

The configuration described with reference to the holding member 21 according to the second embodiment can be applied to the holding member 11 according to the first embodiment. For example, a device component having higher rigidity than the holding member 11 can be held between the upper end 112a and the lower end 112b of the column portion 112.

In the shock absorbing structure 20 according to the second embodiment, if the circuit board 23 can slide along the pillar portion 212 of the retaining member 21, the pillar portion 212 does not necessarily need to be disposed within the through hole 231. The pillar portion 212 can be disposed within a notch or groove formed in the circuit board 23. The notch or groove is an example of an opening.

If there is a need to protect a circuit board on which electronic components with relatively low resistance to vibration and shock are mounted, the use of the device on which the shock absorbing structures according to the above embodiments are mounted is not particularly limited. Examples of such other electronic components include cement resistors and electrolytic capacitors.

10: Shock absorbing structure, 11: Holding member, 111: Passage, 112: Pillar, 112a: Upper end, 112b: Lower end, 113: Beam, 113a: Tip, 12: Housing, 122a: Shoulder, 13: Circuit board, 131: Piezoelectric diaphragm pump, 20: Shock absorbing structure, 21: Holding member, 211: Support, 212: Pillar, 213: Base, 214: Holding part, 22: Housing, 221a: Rib, 23: Circuit board, 231: Through hole, 24: Solenoid valve

Claims (8)

A housing and
a circuit board housed in the housing and having electronic components mounted thereon;
A holding member housed in the housing and having a rigidity lower than that of the housing;
It is equipped with
The holding member is
A pillar portion having both ends in contact with the housing;
a beam portion extending in a cantilever shape from the column portion and supporting the circuit board;
It is equipped with
the electronic component is a pump that pumps or draws in a fluid;
The holding member has a fluid passage that allows the fluid to pass through.
Shock absorbing structure. The beam portion is placed on a part of the housing without being fixed thereto.
The shock absorbing structure according to claim 1 . The tip of the beam portion faces the housing with a gap therebetween.
The shock absorbing structure according to claim 1 or 2. a device component housed in the housing and having a higher rigidity than the holding member;
The device part is held by the column.
The shock absorbing structure according to any one of claims 1 to 3. A housing and
a circuit board housed in the housing and having electronic components mounted thereon;
A holding member housed in the housing and having a rigidity lower than that of the housing;
It is equipped with
the electronic component is a pump that pumps or draws in a fluid;
the holding member has a fluid passage that allows the fluid to pass through,
the circuit board is sandwiched between a part of the housing and a part of the holding member,
When the housing is deformed by an external force, a part of the housing deforms a part of the holding member and displaces the circuit board in a direction away from the housing.
Shock absorbing structure. The pump is a piezoelectric diaphragm pump.
The shock absorbing structure according to claim 1 or 5 . The holding member is an integrally molded product.
The shock absorbing structure according to claim 1 or 5 . The fluid passage is configured to be in communication with a cuff for non-invasively measuring the blood pressure of a subject.
The shock absorbing structure according to claim 1 or 5 .

Images