JP7677882B2 - Resin molding device and method for manufacturing resin molded product - Google Patents

Description

The present invention relates to a resin molding device and a method for manufacturing a resin molded product.

The resin molding device for semiconductor elements shown in Patent Document 1 is configured so that while capturing an image with a camera attached to the substrate loader, pilot pins of a mold are inserted into positioning holes in the substrate loader to align the substrate, and the substrate is then placed on the mold. After this alignment, the substrate is sealed with resin.

Japanese Patent Application Publication No. 3-227537

As described above, when a substrate having semiconductor elements fixed thereto is handled or transported before or after the elements are fixed, the corners of the substrate may be bent, cracked, or fall off. If a substrate with such damage is placed in a mold, this may result in poor molding of the resin material or damage to the mold.

The present invention was made to solve this problem, and aims to provide a resin molding device and a method for manufacturing resin molded products that can prevent molding defects in resin materials and damage to molds.

The resin molding device according to the present invention comprises a transport path along which resin molding objects are transported, and an inspection unit that inspects the resin molding objects, at least a portion of which is placed on the transport path, prior to molding with a resin material. The inspection unit is disposed above the transport path and comprises at least two cameras spaced apart in a direction perpendicular to the transport direction of the resin molding objects, and is configured to capture images of different inspection points of the resin molding objects on the transport path using each of the cameras.

The method for manufacturing a resin molded product according to the present invention includes the steps of: capturing images of a resin molding object, at least a portion of which is on a transport path, using at least two cameras spaced apart in a direction perpendicular to the transport direction of the resin molding object prior to molding with a resin material; determining pass/fail based on the images captured; transporting the resin molding object determined to be a pass/fail product in the pass/fail determination to a resin molding section; and performing resin molding on the resin molding object in the resin molding section, with each camera configured to capture images of different inspection locations of the resin molding object on the transport path.

The present invention can prevent molding defects in resin materials and damage to the mold.

FIG. 2 is a plan view showing a resin molding apparatus; FIG. 2 is a plan view illustrating an example of a substrate. FIG. 13 is a side view of the inspection unit as viewed from the Y direction. FIG. 4 is a side view of the inspection unit as viewed from the X direction. FIG. 2 is a plan view of the backlight unit. 6 is a cross-sectional view taken along line AA in FIG. 5. 1 is a flowchart of an inspection. FIG. FIG. 1 is an example of a photograph and an image showing a non-defective product. 1 is an example of a photograph and image showing a defective product. 1 is an example of a photograph and image showing a defective product. 1 is an example of a photograph and image showing a defective product. FIG. 11 is a side view showing an example of a camera layout when capturing an image with one camera. FIG. 11 is a plan view showing another example of the substrate.

One embodiment of a resin molding device according to the present invention will be described below with reference to the drawings. In addition, each drawing may be drawn in a schematic manner with objects appropriately omitted or exaggerated for ease of understanding.

1. Configuration of Resin Molding Device
FIG. 1 is a schematic plan view of a resin molding apparatus 100 according to the present embodiment. The resin molding apparatus 100 is configured to perform resin molding (resin sealing) by compression molding on a substrate (resin molding object) W to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements and resin-sealed electronic components (hereinafter, these will be collectively referred to as electronic components) are connected, thereby manufacturing a resin molded product. In more detail, after fixing electronic components to one surface of the substrate W, this surface is sealed with resin. After that, after fixing electronic components to the other surface of the substrate W, this surface is sealed with resin. In this way, when sealing each surface of the substrate W with resin, the resin molding apparatus 100 according to the present embodiment is used, and the electronic components are fixed to the substrate by another device. In the following description, the description will be made according to the X direction and Y direction shown in FIG. 1. The inspection unit 9 will be described in detail later.

Examples of the substrate W used here include semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, ceramic substrates, etc. The substrate W may be a carrier used in FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). The substrate W may or may not already have wiring applied thereto. As shown in FIG. 2, the substrate W is formed in a rectangular shape in a plan view, and first to fourth circular through holes Wa to Wd for positioning are formed at the four corners.

As shown in FIG. 1, the resin molding apparatus 100 has a substrate supply/storage module A (hereinafter also simply referred to as "module A"), two resin molding modules B (hereinafter also simply referred to as "module B"), a resin material supply module C (hereinafter also simply referred to as "module C"), and a first control unit 14. As the first control unit, for example, a PLC (Programmable Logic Controller), a PC (Personal Computer), etc. can be used. The first control unit 14 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), etc., and is configured to control each of the modules A to C according to information processing. Each of the modules A to C will be described in detail below. Each of the modules is detachable and replaceable with another module. In addition, in the resin molding apparatus 100, each of the modules A to C can be increased or decreased.

<1-1. Module A>
Module A is a module that supplies pre-molding substrates W and stores molded substrates W, and includes a substrate supply unit 1, a substrate storage unit 2, a substrate placement unit 3, a substrate transport mechanism 4, and an inspection unit 7. Substrate supply unit 1 is configured to supply pre-molding substrates W onto substrate placement unit 3. Substrate storage unit 2 is configured to store molded substrates W (resin molded products). Substrate placement unit 3 is configured to be able to place two substrates thereon, for example, and moves in the Y direction when two substrates W that have passed from substrate supply unit 1 through inspection unit 7 are placed thereon. Substrate placement unit 3 is also configured to move in the Y direction between a position corresponding to substrate supply unit 1 and a position corresponding to substrate storage unit 2. Substrate transport mechanism 4 is configured to move in the X direction and the Y direction across module A and module B, and for example, holds pre-molding substrates W on substrate placement unit 3 in module A and transports them to module B. Alternatively, the molded substrate W manufactured in the module B is placed on the substrate placement portion 3 of the module A.

<1-2. Module B>
Each module B is a module that molds a resin material, and has a compression molding section 5 that manufactures a molded substrate W (a resin molded product) by compression molding. In this compression molding, for example, a known resin material P in a black powder form (including granular form) is used. The compression molding section 5 has an upper mold 52, a lower mold 51 facing the upper mold 52, and a mold clamping mechanism 53. The upper mold 52 is configured to hold the substrate W on its lower surface. On the other hand, the lower mold 51 has a bottom member and a side member for forming a concave cavity 51C. That is, the bottom member forms the bottom surface of the cavity 51C, and the side member forms the side surface of the cavity 51C. In the cavity 51C, the resin material P prepared in the module C is placed, as described later. The mold clamping mechanism 53 is configured to clamp the upper mold 52 and the lower mold 51 in which the resin material P is placed.

<1-3. Module C>
The module C is a module for supplying a resin material. As shown in FIG. 1, the module C has a moving table 61, a resin material storage section 62, and a resin material supply section 63. A release film (not shown) is placed on the moving table 61, and a frame-shaped resin material storage section 62 is placed thereon. The resin material P is supplied from the resin material supply section 63 to a space 621 surrounded by the resin material storage section 62. In order to confirm that the resin material P is evenly spread in the space 621, for example, the resin material P can be photographed from above with a camera (not shown) and the variation can be confirmed by image processing. When the variation is confirmed, the method of supplying the resin material P from the resin material supply section 63 can be changed. For example, the amount of the resin material P supplied to the area where the resin material P was not insufficient can be reduced, and the amount of the resin material P supplied to the area where the resin material P was insufficient can be increased. In this way, the prepared resin material P is transported to the module B and formed into a substrate W.

<2. Board Inspection Section>
Next, the inspection unit 7 for the substrate W provided in the module A will be described with reference to Fig. 3 and Fig. 4. Fig. 3 is a side view of the inspection unit as viewed from the Y direction, and Fig. 4 is a side view of the inspection unit as viewed from the X direction.

As described above, electronic components are fixed to the substrate W, but during handling and transportation before and after the electronic components are fixed, defects such as bending of the corners of the substrate W, cracking of the substrate W around the through holes Wa to Wd, and falling off of the corners may occur. If such defects occur, there is a risk of molding defects of the resin material P or damage to the mold when the mold is closed in the module B. Therefore, the inspection unit 7 inspects for the occurrence of such defects prior to the mold closing. Specifically, the first to fourth through holes Wa to Wd, which are prone to defects, and their surroundings are inspected. Hereinafter, the inspection points at the four corners of the substrate W shown in FIG. 2 will be referred to as the first to fourth inspection points S1 to S4. These first to fourth inspection points S1 to S4 are set to include the first to fourth through holes Wa to Wd and their surroundings.

1, the inspection unit 7 is provided on the transport path between the substrate supply unit 1 and the substrate placement unit 3, and inspects the substrate W while it is being transported in the X direction (transport direction) from the substrate supply unit 1 to the substrate placement unit 3. As shown in FIG. 3 and FIG. 4, a first camera 71 and a second camera 72 are provided above the substrate W being transported, spaced apart in the Y direction. The distance between the first camera 71 and the second camera 72 in the Y direction is roughly the same as the width of the substrate W in the Y direction, with the first camera 71 being located directly above and slightly inside the first side W1 of the substrate W, and the second camera 72 being located directly above and slightly inside the second side W2 of the substrate W. However, the positions of both cameras 71 and 72 in the Y direction are adjustable, and for example, the distance between the two cameras 71 and 72 can be adjusted to match the width of the substrate W in the Y direction.

Each camera 71, 72 includes an image sensor such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

Directly below each of the cameras 71 and 72, first and second illumination units 73 and 74 are disposed, respectively. Each of the illumination units 73 and 74 is configured with a known ring illumination and has a ring-shaped housing and a light source such as an LED disposed inside the housing. Each of the cameras 71 and 72 is configured to capture an image of a corner of the substrate W through the internal space of the ring-shaped housing.

A backlight unit 8 is disposed below the substrate W being transported. This backlight unit 8 will be described with reference to Figures 5 and 6. Figure 5 is a plan view of the backlight unit, and Figure 6 is a cross-sectional view taken along line A-A in Figure 5.

As shown in Figs. 5 and 6, the backlight unit 8 has a base plate 81, a pair of support plates 82 spaced apart in the Y direction on the base plate 81, and a pair of backlights 83, 84 supported by each of the support plates 82. Each of the backlights 83, 84 is disposed approximately directly below the first camera 71 and the second camera 72.

At least four through holes 811 are formed in the base plate 81 aligned in the X and Y directions. A screw 85 is inserted into each through hole 811 from the bottom surface of the base plate 81, and the tip of each screw 85 protrudes from the top surface of the base plate 81. Two slits 85 extending in the Y direction are formed in parallel in each support plate 82 arranged on the base plate 81. Each slit 85 has a narrow first portion 861 formed on the bottom surface of the support plate 82, and a second portion 862 that is continuous above the first portion 861 and is wider than the first portion 861. The tip of each screw 85 is inserted into the first portion 861 of each slit 85 from the bottom side and extends to the second portion 862. In the second portion 862, a nut 87 is attached to the tip of each screw 85. The outer diameter of each nut 87 is larger than the width of the first portion 861, which prevents the nuts 87 from coming loose and prevents the support plate 82 from coming off the base plate 81.

With the above configuration, each support plate 82 can move back and forth in the Y direction relative to the base plate 81 together with the backlights 83 and 84, guided by the screws 85, slits 86, and nuts 87. Therefore, the Y direction positions of each backlight 83 and 84 can be adjusted to match the positions of each camera 71 and 72.

As shown in Figs. 3 and 4, the inspection unit 7 is provided with a second control unit 75, a storage unit 76, and a display (display unit) 77. The second control unit 75 includes a CPU, RAM, ROM, etc., and is configured to control the cameras 71, 72, the illumination units 73, 74, the backlights 83, 84, the display 77, etc. in accordance with information processing. The storage unit 76 is configured with a known storage medium such as an HDD or SSD, and stores images captured by the cameras 71, 72, etc. Furthermore, the display 77 displays the inspection results.

<3. Circuit Board Inspection Method>
Next, the inspection of the board by the inspection unit 7 configured as above will be described with reference to Figures 7 to 9. Figure 7 is a flowchart of the inspection, and Figures 8 and 9 are cross-sectional views showing the inspection process.

First, the substrate W is transported from the substrate supply unit 1 toward the substrate placement unit 3. Although not shown, electronic components are fixed to the upper surface of the substrate W being transported here. Then, as shown in FIG. 8, in the process of transporting the substrate W to the substrate placement unit 3, the substrate W is stopped when the first and second inspection points S1, S2 are located below the first and second cameras 71, 72 (step S01). The position of the substrate W at this time is referred to as the first position. When the substrate W stops at the first position, the first camera 71 takes an image of the first inspection point S1 (step S02). At this time, light is emitted from the first illumination unit 73 and the backlight 83 in synchronization with the image taken by the first camera 71. The backlight 83 is mainly used to highlight the outline of the substrate W, and the first illumination unit 73 is used to highlight the presence or absence of damage to the substrate W. The captured image is stored in the memory unit 76, and the second control unit 75 judges whether the substrate W is good or bad.

There are various methods for determining pass/fail, but here we will mainly look at three types of damage. In a normal state without damage, the captured image will look like that shown in Figure 10. That is, the outline of the corner of the substrate W is on the specified line L, and the through hole Wa is free of cracks and is located in the specified position.

Figure 11 shows a crack in a substrate. That is, a crack has occurred in a corner of the substrate W, and if a crack is detected in the captured image, it is deemed that a crack has occurred and the substrate is judged to be defective.

Figure 12 shows a fallen substrate. That is, if a corner of the substrate W is chipped and the chipping is detected from the captured image, it is assumed that the substrate has fallen off and is determined to be a defective product.

Figure 13 shows a bent substrate. That is, if the corner of the substrate W is bent, the outline of the corner of the substrate W in the captured image will deviate from the specified line L, and therefore, if such a condition is detected, it is deemed that a bend has occurred and the substrate is determined to be defective.

The images shown in Figs. 10 to 13 can be displayed on a display to indicate pass/fail in each case. For example, if the product is good, a symbol or letter such as O or GOOD can be displayed to indicate that, and if the product is defective, a symbol or letter such as × or BAD can be displayed to indicate that. The method of image processing for detecting defects is not particularly limited, and known methods can be applied as appropriate. For example, defects can be determined by binarizing the captured image and detecting chips, cracks, and contours. In addition, if cracks and detachments occur, the copper wiring in the substrate W is exposed, so when light with a wavelength that detects this copper wiring (e.g., red light) is irradiated from the first illumination unit 73 and the backlight 83, an image can be obtained in which the exposed copper wiring appears white. Therefore, the occurrence of cracks and detachments can be easily detected. The above pass/fail judgment is the same for the pass/fail judgment of images captured at the second to fourth inspection points S2 to S4, so a description thereof will be omitted below.

Next, the second camera 72 photographs the second inspection location S2 (step S03). As with the photographing of the first inspection location S1, light is emitted from the second illumination unit 74 and the backlight 84 in synchronization with the photographing by the second camera 72. The photographed image is stored in the memory unit 76, and the second control unit 75 judges whether the image is good or bad in the same manner as described above.

Next, as shown in FIG. 9, the substrate W is moved toward the substrate mounting portion 3, and the substrate W is stopped when the third and fourth inspection points S3, S4 are located below the first and second cameras 71, 72 (step S04). The position of the substrate W at this time is referred to as the second position. When the substrate W stops at the second position, the first camera 71 photographs the third inspection point S3 in the same way as the first inspection point S1 (step S05). Following this, the second camera 72 photographs the fourth inspection point S4 in the same way as the second inspection point (step S06).

After the four inspection points S1 to S4 have been photographed, the substrate W is moved to the substrate placement section 3. The second control section 75 then determines whether there are any defects in the images photographed at the four inspection points S1 to S4 (step S07). If there is even one defect (NO in step S07), the display 77 displays a message indicating that the substrate is defective, and the substrate W is then collected by an operator or the collection mechanism of the device (step S08). On the other hand, if there are no defects at any of the four inspection points S1 to S4 (YES in step S07) and two good substrates W are placed on the substrate placement section 3 (YES in step S09), these are transported to module B (step S10). If only one substrate W is placed on the substrate placement section (NO in step S09), the same process as above is carried out until another substrate W is transported. Then, in module B, the surface on which the electronic components are formed is sealed with resin (step S11). Thus, molding with resin is completed.

In the above explanation, an example has been described in which electronic components are fixed to one surface of the substrate W and this surface is sealed with resin, but electronic components are fixed to the other surface of the substrate W that has been sealed with resin in this manner in another device. The substrate W is then again housed in the substrate supply section 1, and after inspection of the four inspection points S1 to S4 is carried out using the same process as described above, the other surface is sealed with a resin material.

<4. Features>
According to the resin molding apparatus 100 of this embodiment, the following effects can be obtained.

(1) Prior to molding with resin material P, defective products with damage to the four corners of the substrate W can be detected, and such defective products can be removed. This makes it possible to prevent molding defects in the resin material P and damage to the mold due to the occurrence of such defective products when the mold is closed in module B.

(2) Since two cameras are provided and each captures an image of one adjacent corner, the position of each camera 71, 72 from the substrate W can be lowered. For example, when attempting to capture two corners with one camera, the two corners must be within the capture range of the camera 101 as shown in FIG. 14, so the camera 101 must be placed at a high position away from the substrate W. Depending on the structure of the resin molding device 100, this may make it impossible to position the camera 101. In contrast, by using two cameras 71, 72 as in this embodiment and configuring each camera 71, 72 to capture an image of each corner, the positions of the cameras 71, 72 can be lowered.

(3) Since the timing of capturing images by the first camera 71 and the second camera 72 are staggered, adverse effects on captured images caused by the illumination units 73, 74 and backlights 83, 84 can be eliminated. For example, when capturing images simultaneously by the first camera 71 and the second camera 72, the light from the second illumination unit 74 may affect the image captured by the first camera 71, which may result in an inappropriate image not being captured. In contrast, staggering the timing of capturing images by the first camera 71 and the second camera 72 allows an appropriate image to be captured without being affected by the adjacent illumination units 73, 74 and backlights 83, 84.

(4) The first and second illumination units 73 and 74 use ring illumination, so light can be irradiated obliquely over 360 degrees onto the inspection points S1 to S4. This makes it possible to prevent shadows from appearing and to obtain images that are easy to inspect.

(5) The quality of the substrate W can be shown on the display 77, allowing the worker to visually check the quality each time.

5. Modifications
Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the spirit of the present invention. For example, the following modifications are possible. In addition, the gist of the following modifications can be combined as appropriate.

(1) The substrate shown in the above embodiment is just one example, and inspection can be performed on substrates of various shapes. For example, the positions and number of the through holes Wa to Wd are not particularly limited, and they may be formed anywhere on the periphery of the substrate W. It is also possible for the substrate W to have no through holes formed therein, and even with such a substrate W, it is meaningful to perform inspection since the periphery is easily damaged.

(2) The inspection points S1 to S4 are not limited to those in the above embodiment, and other positions besides the four corners may be inspected. For example, if a through hole is formed in a position other than the four corners, the position where the through hole is formed may be inspected. It is also possible to inspect a position where no through hole is formed, and to inspect the periphery of the substrate W, for example, a position on either the first side W1 or the second side W2. Therefore, the number of inspection points is not limited to four as in the above embodiment, and may be three or less, or five or more. Then, the substrate may be stopped each time and images may be taken according to the number of inspection points.

(3) In the above embodiment, the two cameras 71 and 72 are arranged side by side in the Y direction, but this is not limited thereto. For example, as shown in FIG. 15, the two cameras 71 and 72 can be arranged offset in the X direction. For example, in a substrate with a narrow width in the Y direction, the first lighting unit 73 and the second lighting unit 74 may interfere with each other, or the two cameras 71 and 72 may interfere with each other. However, by arranging the cameras 71 and 72 as shown in FIG. 15, such interference can be prevented. That is, the two cameras 71 and 72 may be arranged at intervals not only in a direction perpendicular to the transport direction, but also in a direction intersecting the transport direction. However, if the positions of the two cameras 71 and 72 in the X direction are offset in this way, the substrate W needs to be stopped four times to capture the four corners. Also, three or more cameras can be used as necessary.

(4) The first and second lighting units 73, 74 can be other than ring lighting, and can be, for example, coaxial lighting, dome lighting, bar lighting, etc. Note that it is also possible not to provide the backlights 83, 84.

(5) In the above embodiment, the timing of the image capture by the first and second cameras is staggered, but they can also capture images simultaneously. However, in order to reduce the adverse effects of the lighting unit as described above, it is preferable to provide a partition or the like between the two cameras 71, 72 and the lighting units 73, 74, etc.

(6) In the above embodiment, a resin molding device that performs resin molding by compression molding was described, but the present invention can also be applied to a resin molding device that performs resin molding by transfer molding.

71 First camera 72 Second camera 73 First lighting unit (upper lighting unit)
74 Second lighting section (upper lighting section)
77 Display (display unit)
83, 84 Backlight (lower lighting section)
100 Resin molding device W Substrate

Claims (10)

a conveying path along which the resin molding object is conveyed;
an inspection unit that inspects a resin molding object, at least a part of which is disposed on the transport path, prior to molding using a resin material;
Equipped with
the inspection unit is disposed above the transport path and includes at least two cameras spaced apart in a direction perpendicular to a transport direction of the resin molding object,
After capturing images of different inspection points of the resin molding object stopped during transportation on the transportation path by the respective cameras,
A resin molding apparatus configured to move the resin molding object on the conveying path, stop the object, and capture images of inspection points on the resin molding object that are different from the inspection points using each of the cameras. a conveying path along which a rectangular resin molding object is conveyed;
an inspection unit that inspects a resin molding object, at least a part of which is disposed on the transport path, prior to molding using a resin material;
Equipped with
the inspection unit is disposed above the transport path and includes at least two cameras spaced apart in a direction perpendicular to a transport direction of the resin molding object,
After capturing images of two corners of the resin molding object stopped during transport on the transport path by the cameras, the corners facing the downstream side in the transport direction of the resin molding object are captured.
A resin molding apparatus configured to move the resin molding object on the conveying path, stop the object, and capture images of two corners of the resin molding object facing upstream in the conveying direction by each of the cameras. a conveying path along which the resin molding object is conveyed;
an inspection unit that inspects a resin molding object, at least a part of which is disposed on the transport path, prior to molding using a resin material;
Equipped with
the inspection unit is disposed above the transport path and includes at least two cameras spaced apart in a direction perpendicular to a transport direction of the resin molding object,
The resin molding apparatus is configured so that each of the cameras captures an image of a different inspection point of the resin molding object that stops during transport on the transport path at a different timing. a conveying path along which the resin molding object is conveyed;
an inspection unit that inspects a resin molding object, at least a part of which is disposed on the transport path, prior to molding using a resin material;
Equipped with
the inspection unit is disposed above the transport path and includes at least two cameras spaced apart in a direction perpendicular to a transport direction of the resin molding object,
The cameras are configured to capture images of different inspection points of the resin molding object on the transport path,
The inspection unit further includes two upper illumination units that irradiate the resin molding object with light for imaging from above,
Each of the upper lighting units is disposed to correspond to each of the two cameras,
A resin molding apparatus configured to be able to change the distance between the two upper illumination units in a direction perpendicular to the conveying direction. a conveying path along which the resin molding object is conveyed;
an inspection unit that inspects a resin molding object, at least a part of which is disposed on the transport path, prior to molding using a resin material;
Equipped with
the inspection unit is disposed above the transport path and includes at least two cameras spaced apart in a direction perpendicular to a transport direction of the resin molding object,
The cameras are configured to capture images of different inspection points of the resin molding object on the transport path,
The inspection unit further includes two lower illumination units that irradiate the resin molding object with light for imaging from below,
Each of the lower illumination units is disposed to correspond to each of the two cameras,
The resin molding apparatus is configured so that the distance between the two lower illumination units can be changed in a direction perpendicular to the transport direction. a conveying path along which the resin molding object is conveyed;
an inspection unit that inspects a resin molding object, at least a part of which is disposed on the transport path, prior to molding using a resin material;
A display unit;
Equipped with
the inspection unit is disposed above the transport path and includes at least two cameras spaced apart in a direction perpendicular to a transport direction of the resin molding object,
The cameras are configured to capture images of different inspection points of the resin molding object on the transport path,
The display unit is configured to display an image captured by the camera and a pass/fail judgment result for the resin molding object based on the image. The resin molding device according to any one of claims 1 to 6, configured to change the distance between the two cameras in a direction intersecting the conveying direction. The resin molding device according to any one of claims 1, 3 to 7, wherein the two cameras are configured to capture images of each side of the resin molding object. A method for manufacturing a resin molded product using the resin molding apparatus according to any one of claims 1 to 6, comprising the steps of:
a step of capturing an image of a resin molding object, at least a portion of which is on a transport path, using at least two cameras arranged at an interval in a direction perpendicular to a transport direction of the resin molding object, prior to sealing with a resin material;
A step of determining whether the image is good or bad based on the image obtained by the imaging.
transporting the resin molding object determined to be a non-defective product in the quality determination to a resin molding section;
performing resin molding on the resin molding object in the resin molding section;
Equipped with
A method for manufacturing a resin molded product, wherein each of the cameras is configured to capture an image of a different inspection point of the resin molded object on the transport path. a step of capturing an image of a resin molding object, at least a portion of which is on a transport path, using at least two cameras arranged at an interval in a direction perpendicular to a transport direction of the resin molding object, prior to sealing with a resin material;
A step of determining whether the image is good or bad based on the image obtained by the imaging.
transporting the resin molding object determined to be a non-defective product in the quality determination to a resin molding section;
performing resin molding on the resin molding object in the resin molding section;
Equipped with
The cameras are configured to capture images of different inspection points of the resin molding object on the transport path,
In the step of imaging, an image of the resin molding object having one surface on which resin molding has been performed is captured,
In the step of performing resin molding, resin molding is performed on the other surface of the resin molding object.