JP7684080B2 - Substrate peeling apparatus, film forming apparatus, substrate carrier, substrate peeling method, and film forming method - Google Patents

Description

The present invention relates to a substrate peeling device that peels off a substrate held by a substrate carrier, a film forming device, a substrate carrier, a substrate peeling method, and a film forming method.

In recent years, the FPD (Flat Panel Display) industry has tended to use large glass substrates called mother glass in consideration of production efficiency. Large glass substrates are used so that a single mother glass can be divided into multiple image display sections for individual displays. For example, mother glass with a side length of more than 2 meters is subjected to a manufacturing process such as film formation, and is divided along the substrate cutting lines that divide the image display sections to produce final products of various desired sizes. In general, the thickness of mother glass is less than a few millimeters. Minimizing the effects of bending and breakage is an important issue, and in the manufacturing process, the mother glass is subjected to a vacuum film formation process while being transported together with the substrate carrier.

An adhesive material is preferably used to integrate the mother glass and the substrate carrier. The adhesive material must have the adhesive strength to hold the mother glass and the peelability to separate the glass in a short time, and it is preferable that it can be reused multiple times. For example, Patent Document 1 discloses a technology that includes multiple adhesive members for holding the substrate and peel pins that protrude from the sides of each adhesive member toward the substrate.

JP 2015-046517 A

In the technology disclosed in Patent Document 1, the adhesive member and peeling pins are placed over the entire substrate. Therefore, the adhesive member and peeling pins come into contact with the substrate in functional areas that require post-processing such as film formation, in other words, the image display area (display element area) of the final product. For example, local differences in heat conduction performance may occur due to contact with the adhesive member during vacuum film formation, which may impair the uniformity of film formation. Or, the peeling pin may hit the image display area and leave a mark. These may affect high-definition image display.

In view of the above-mentioned problems, some embodiments aim to peel off a substrate from a substrate carrier while minimizing the impact on the display element area on the substrate.

A substrate peeling apparatus according to one aspect of the present invention comprises:
A substrate peeling apparatus that peels off a substrate from a substrate carrier that holds the substrate by a plurality of adhesive suction pads, comprising:
The substrate carrier is provided with a plurality of the adhesive suction pads and a plurality of through holes along an outer periphery of the substrate held by the substrate and along a boundary between display element regions of the substrate held by the substrate,
a plurality of peeling pins provided to protrude from and retract from a substrate holding surface of the substrate carrier through the plurality of through holes ;
The adhesive suction pad is characterized by comprising an adhesive member and a metal ball that maintains the adhesive member in a flat shape when the lift platform is lowered and deforms the adhesive member when the lift platform is raised .

According to at least some embodiments, the substrate can be peeled off from the substrate carrier while minimizing the impact on the display element area on the substrate.

FIG. 2 is an explanatory diagram (plan view) illustrating an example of a substrate according to an embodiment of the present invention. FIG. 2 is an explanatory diagram (plan view) showing an example of a substrate carrier according to an embodiment of the present invention. FIG. 2 is an explanatory diagram (plan view) showing an example of a substrate carrier according to an embodiment of the present invention. 1 is a schematic cross-sectional view of a substrate carrier according to an embodiment of the present invention; 1 is a schematic cross-sectional view of a substrate carrier according to an embodiment of the present invention; 4 is a flowchart showing a processing procedure for a substrate according to an embodiment of the present invention. 5A to 5C are diagrams illustrating the operation of the substrate holding device according to the embodiment of the present invention. 5A to 5C are diagrams illustrating the operation of the substrate holding device according to the embodiment of the present invention. 5A to 5C are diagrams illustrating the operation of the substrate holding device according to the embodiment of the present invention. 5A to 5C are diagrams illustrating the operation of the substrate holding device according to the embodiment of the present invention. 5A to 5C are diagrams illustrating the operation of the inversion device according to the embodiment of the present invention. 5A to 5C are explanatory diagrams illustrating an operation during a film forming process according to an embodiment of the present invention. 1A to 1C are schematic explanatory diagrams of a substrate peeling operation according to an embodiment of the present invention. 1A to 1C are schematic explanatory diagrams of a substrate peeling operation according to an embodiment of the present invention. 5A to 5C are diagrams illustrating the operation of the substrate peeling apparatus according to the first embodiment of the present invention. FIG. 11 is an explanatory diagram (plan view) showing an example of a peeling pin unit according to a second embodiment of the present invention. 10A to 10C are diagrams illustrating the operation of the substrate peeling device according to the second embodiment of the present invention. FIG. 11 is an explanatory diagram (schematic cross-sectional view) showing an example of a peeling pin unit according to a third embodiment of the present invention. 11A to 11C are diagrams illustrating the operation of the substrate peeling device according to the third embodiment of the present invention. 1 is an explanatory diagram of an organic EL display device according to an embodiment of the present invention.

The following describes the embodiments and examples of the present invention with reference to the attached drawings. The dimensions, materials, shapes, and relative positions of the components described in this specification do not limit the scope of the present invention unless otherwise specified. In this specification, "adhesion" refers to the property that arises due to intermolecular forces between an adhesive material having adhesive properties and the surface of an adherend, such as a glass substrate, when the adhesive material comes into contact with the surface of the adherend. "Peeling" refers to the separation of the adhesive material from the adherend.

The substrate peeling apparatus, film forming apparatus, substrate carrier, substrate peeling method, and film forming method according to the embodiments of the present invention will be described below. These apparatus and methods can be preferably applied to electronic device manufacturing apparatuses and electronic device manufacturing methods. Various methods such as vapor deposition and sputtering can be used as the film forming method, and various materials can be used as the film forming material. The substrate peeling method and film forming method of the present embodiment can also be regarded as a program for causing a computer to execute them, or a storage medium storing the program. The storage medium may be a non-transitory storage medium readable by a computer.

In the embodiments and examples described below, the direction of travel of the substrate carrier and substrate is the X-axis direction, the direction perpendicular to the direction of travel within the substrate plane is the Y-axis direction, and the direction perpendicular to the substrate plane (the vertical direction in the present embodiments and examples) is the Z-axis direction.

(Embodiment)
In this embodiment, the substrate is described as a mother glass, but the substrate material applicable to the embodiment is not limited to glass.

<Mother glass>
FIG. 1 is a plan view showing an example of a mother glass 10 as a substrate according to the present embodiment. As shown in the figure, the vertices of the mother glass 10 are represented by O, P, Q, and R. The mother glass 10 is cut into three image display sections 11, 12, and 13 in a later process. These image display sections 11, 12, and 13 correspond to the display element region. A line JK connecting a point J on the side OR and a point K on the side PQ, and a line GH connecting a point G on the side OP and a point H on the side JK are cutting lines to be cut in a later process. In FIG. 1, the region corresponding to the cutting line is referred to as an inner region 14 as a boundary, and the peripheral portion of the mother glass 10 is referred to as an outer region 15 as an outer periphery. After cutting, the area other than the inner region 14 and the outer region 15 corresponds to the display element region.

Note that while FIG. 1 shows an example in which three image display sections are chamfered from the mother glass 10, the embodiment is not limited to this, and multiple image display size chamfers are possible, and the chamfering pattern is not limited to the illustrated example. The substrate size can also be selected appropriately.

<Substrate carrier>
The substrate carrier 100 according to this embodiment will be described with reference to Figures 2 to 5. The actual scale may differ from that shown in the drawings in order to emphasize the characteristic configuration.

The substrate carrier 100 has adhesive materials and peeling pins arranged discretely on the outer periphery 15 of the mother glass 10 and on the boundary areas 14 corresponding to the display element areas, avoiding the image display area. The boundary areas 14 are areas corresponding to the substrate cutting lines along which the mother glass will be cut in a later process.

2 is a schematic plan view showing an example of the substrate carrier 100 according to the present embodiment. The mother glass 10 is placed on the substrate holding surface 110x of the substrate carrier 100, and the mother glass 10 is adsorbed to the suction pad 120, so that the mother glass 10 is held by the substrate carrier 100. In other words, the substrate carrier 100 and the mother glass 10 are configured to be integrated. In FIG. 2, the mother glass installation site 10x is indicated by a dotted line. The substrate carrier 100 includes a flat plate-shaped member 110. The flat plate-shaped member 110 has a plurality of through holes 111 and 112 formed along the inner region 14 and the outer region 15 of the mother glass 10, respectively. The through holes 111 are used to insert the substrate mounting pins 240 for mounting the mother glass 10 and the peeling pins 341 used when peeling the substrate, and the through holes 112 are used to install the adhesive suction pads 120.

The substrate carrier 100 also includes multiple supports 130 for supporting the periphery of the mother glass 10 against the flat plate-like member 110. Various known techniques, such as general clamps, can be used as the supports 130. The mother glass 10 placed on the substrate carrier 100 is fixed to the substrate holding surface 110x by the multiple suction pads 120 and supports 130, and is integrated with the substrate carrier 100.

Next, the process of peeling the mother glass 10 from the substrate carrier 100 after a predetermined process such as a film formation process will be described. Here, the case of peeling the mother glass 10 using a peeling pin will be described with reference to Figs. 3 to 5. Fig. 3(A) also shows the adhesive member 123 of the suction pad 120 attached to the substrate carrier 100 and the peeling pin 341. In addition, to make the positional relationship easier to understand, only the outer edge of the mother glass 10 is shown by dotted lines. Figs. 4 and 5 are partial cross-sectional views of the substrate carrier 100, and are cross-sectional views taken along lines E-E' and F-F' in Fig. 3(A), respectively.

The suction pad 120 is attached to the flat plate member 110 in a state where it is inserted through the suction pad through hole 112. The fixed portion 127 of the shaft 126 in the suction pad 120 is integrated with the fixing member 150 by a known method and fixed to the flat plate member 110. The fixing means between the fixing member 150 and the flat plate member 110 may be a known technique (not shown), such as a bolt.

The peeling pins 341 can be moved in and out of the substrate holding surface 110x through the peeling pin through holes 111 to move the mother glass 10 closer to or farther away from the substrate holding surface 110x. The peeling pins 341 may be moved independently one by one using a drive mechanism (not shown), or multiple peeling pins 341 may be moved together using a peeling pin stand.

It is also possible to use a suction pad with a peeling function without using a peeling pin. FIG. 3B shows an example of a suction pad with a peeling function attached to the substrate carrier 100. This suction pad includes an adhesive member 123, a lifting platform 125, and a number of metal balls 124 provided between them. When the lifting platform 125 is lowered, the adhesive member 123 maintains its flat shape and is capable of adsorbing the substrate (mother glass 10). When the lifting platform 125 is raised, the adhesive member 123 is deformed by the metal balls 124, and the adhesive force with the substrate decreases. This allows the substrate to be peeled off from the substrate carrier 100.

The shape and dimensions of the flat plate member 110 are set appropriately according to the dimensions of the mother glass 10 and the dimensions of the image display section to be chamfered. The dimensions, number and arrangement of the through holes 111, 112, the suction pads 120 and the supports 130 are also set appropriately according to the dimensions of the mother glass 10 and the chamfering dimensions.

<Suction pad>
The suction pad 120 will be described in more detail with reference to FIG. 4. The suction pad 120 is provided with an adhesive member 123 on a metal shaft 126 via an adhesive layer (not shown). As the material of the adhesive member 123, it is preferable to adopt fluororubber that does not contain siloxane bonds in order to suppress the generation of outgassing that adversely affects the manufacturing process under vacuum. Similarly, it is preferable to use a known adhesive or double-sided tape that does not emit outgas components as the material constituting the adhesive layer. In this embodiment, a stainless steel shaft 126 with a diameter of 10 mm is used, and an adhesive member 123 made of fluororubber with a diameter of 10 mm and a thickness of 0.5 mm is used. The adhesive member 123 is configured to be adjustable in the vertical direction in the figure within a certain range using a spacer (not shown) or the like so that the amount of protrusion from the substrate holding surface 110x can be managed. The above-mentioned protrusion amount depends on the size of the members constituting the suction pad 120 and the compression characteristics of the adhesive member 123, but is less than the thickness of the mother glass 10. The diameter of the through hole 112 for the suction pad is larger than the outer diameter of the shaft 126, and the suction pad 120 is allowed to move up and down in the vertical direction as well as to swing to a certain degree.

<Film forming apparatus and film forming method>
The film forming apparatus according to this embodiment includes various substrate processing devices, such as a device for holding a substrate on the substrate carrier 100, a device for forming a thin film on the substrate using a film forming source, and a substrate peeling device for peeling the substrate on which the thin film has been formed from the substrate carrier 100. The substrate is subjected to various processes while being transported. The substrate processing steps will be described below with reference to the flow chart shown in FIG.

The substrate processing process is roughly divided into 1. substrate holding process, 2. inversion process, 3. mask holding process, 4. film forming process, and 5. substrate peeling process, and these series of processes are performed in a vacuum atmosphere. 1. Substrate holding process is further composed of (a) preparation process, (b) substrate placement process, and (c) substrate adhesion process. The process will be explained below in the order of the process.

<<1. Substrate holding process >>
This process is a process in which the mother glass 10 as a substrate is held by the substrate carrier 100, and is performed by the substrate holding device shown in FIG. 7. This substrate holding device includes a substrate holding chamber R1, a substrate mounting pin unit 200 (substrate moving mechanism) that moves the mother glass 10 up and down in the Z-axis direction, a pressing unit 400 that presses the mother glass 10, and a support table 500 that supports the substrate carrier 100. The substrate carrier 100 includes a flat plate-like member 110. This flat plate-like member 110 is supported by the support table 500 and configured so that the substrate holding surface 110x is parallel to the horizontal plane. Note that FIG. 7 shows a case in which a ball screw mechanism is used as a mechanism for moving the substrate mounting pin 240 and the shaft portion 440 provided in the pressing unit 400 up and down, but other known techniques such as a rack and pinion system may also be used. These mechanisms are controlled by a power source 710 and a control unit 720.

The substrate mounting pin unit 200 includes a motor 210, a screw shaft 220 rotated by the motor 210, a nut portion 230 that moves up and down along the screw shaft 220 as the screw shaft 220 rotates, and a substrate mounting pin 240 that is fixed to the nut portion 230 and moves up and down together with the nut portion 230. A number of balls are arranged to circulate infinitely between the inner peripheral surface of the nut portion 230 and the outer peripheral surface of the screw shaft 220.

The pressing unit 400 includes a motor 410, a screw shaft 420 rotated by the motor 410, a nut portion 430 that moves up and down along the screw shaft 420 as the screw shaft 420 rotates, a shaft portion 440 that is fixed to the nut portion 430 and moves up and down together with the nut portion 430, and a pressing portion 450 provided at the tip of the shaft portion 440. Note that a plurality of balls are configured to circulate endlessly between the inner peripheral surface of the nut portion 430 and the outer peripheral surface of the screw shaft 420. A plurality of pressing portions 450 are provided so that each corresponds to one of the plurality of suction pads 120.

The substrate holding chamber R1 is divided into a substrate processing area A1, a first drive source arrangement area A2, and a second drive source arrangement area A3. The first drive source arrangement area A2 is provided vertically below the substrate processing area A1, and the second drive source arrangement area A3 is provided vertically above it. The substrate processing area A1 contains the substrate carrier 100 and other components. The first drive source arrangement area A2 contains the motor 210 and other components of the substrate mounting pin unit 200, and the second drive source arrangement area A3 contains the motor 410 and other components of the pressing unit 400.

The above configuration can prevent foreign matter generated by the rotation of the motors 210 and 410 and foreign matter generated at the sliding portion of the ball screw from entering the substrate processing area A1. Note that instead of arranging all of the areas A1, A2, and A3 within the vacuum atmosphere of the substrate holding chamber R1, for example, the substrate processing area A1 may be arranged within the vacuum atmosphere of the substrate holding chamber R1, and the first drive source arrangement area A2 and the second drive source arrangement area A3 may be arranged in the air atmosphere.

<<<1(a). Preparation process >>>
In a preparation state before the holding operation of the mother glass 10 is performed, both the substrate mounting pins 240 and the pressing part 450 are waiting at the uppermost position in the vertical direction. The substrate mounting pins 240 are in a state of protruding from the pin through holes 111 of the flat plate-like member 110 of the substrate carrier 100 vertically upward from the substrate holding surface 110x. The adhesive member 123 of the suction pad 120 is fixed to the flat plate-like member 110, protruding slightly from the substrate holding surface 110x (see FIG. 4). In addition, the pressing part 450 is separated from the substrate carrier 100. In this state, the mother glass 10 is carried into the substrate processing area A1 of the substrate holding chamber R1, and the mother glass 10 is placed on the substrate mounting pins 240 as shown in FIG. 7. The mother glass 10 is transported into the substrate holding chamber R1 by a transport robot (not shown) or the like. The transport robot is a known technology, so its description is omitted.

<<<<1(b) Substrate Mounting Step>>>
When the motor 210 moves the substrate mounting pins 240 vertically downward, the tips of the substrate mounting pins 240 pass through the pin through holes 111 of the flat member 110 and move downward from the surface opposite the substrate holding surface 110x. As a result, the mother glass 10 comes into contact with the adhesive member 123 of the suction pad 120.

Figure 8 shows the state where the substrate mounting pins 240 have moved downward and the mother glass 10 is in contact with the adhesive material 123 of the suction pad 120. When multiple image display units are cut from the mother glass 10, the adhesive material 123 is not present on the glass surfaces corresponding to the image display units (see Figure 1). As the substrate mounting pins 240 move downward, undulations may remain in the mother glass 10, but the undulations in the mother glass 10 can be reduced by adjusting the downward movement of the substrate mounting pins 240.

<<<1(c) Substrate adhesion process>>>
Next, the mother glass 10 is pressed using a pressing mechanism. The pressing unit 450 is moved vertically downward by the motor 410, so that the contact surface between the adhesive member 123 of the suction pad 120 and the mother glass 10 can be sufficiently secured. At this time, instead of pressing the multiple pressing units 450 against the mother glass simultaneously, the pressing area may be controlled so as to gradually change from a specific start point to a specific end point. For example, it is preferable to start pressing from the center of the mother glass 10 in the longitudinal direction and control it so that it is pressed sequentially toward both ends. FIG. 9 shows a state in which the pressing unit 450 moves downward and the mother glass 10 comes into contact with and adheres (adsorbs) to the adhesive member 123 slightly protruding from the flat plate-like member 110.

As shown in FIG. 10, the motor 410 moves the pressing part 450 vertically upward, and the periphery of the mother glass 10 is fixed to the substrate carrier 100 by the support 130, and the mother glass 10 is integrated with the substrate carrier 100. In this way, the substrate holding process in the substrate holding chamber R1 is completed.

<<2. Reversal process>>
11A and 11B are schematic cross-sectional views of the inversion device. The inversion device includes an inversion chamber R2. In the inversion chamber R2, a holding member 610 for holding the substrate carrier 100, a rotating shaft 620 fixed to the holding member 610, a motor 630 for rotating the rotating shaft 620, and a support member 640 for supporting the rotating shaft 620 are provided.

The substrate carrier 100 integrated with the mother glass 10 is transported from the substrate holding chamber R1 to the inversion chamber R2 by a known transport robot (not shown) and held by the holding member 610 (see FIG. 11(A)). The substrate carrier 100 is then rotated 180 degrees, and the mother glass 10 faces vertically downward (hangs) relative to the substrate carrier 100 (see FIG. 11(B)).

<<3. Mask holding process>>
The substrate carrier 100 holding the mother glass 10 is transported from the reversal chamber R2 to the alignment chamber. The mask 20 waiting in the alignment chamber and the mother glass 10 are aligned, and the substrate carrier 100 is placed above the mask 20 in an aligned state. A suitable known technique may be adopted as a means for fixing the substrate carrier 100 and the mask 20. For example, a means using magnetism such as an electromagnet or a mechanical mechanism such as a clamp may be adopted. It is also possible to not fix the substrate carrier 100 and the mask 20, but to place the substrate carrier 100 on the mask 20 on a transport member such as a roller, and to move the substrate carrier 100 and the mask 20 together on the transport member.

<<4. Film forming process >>
In this embodiment, a vacuum deposition method is used as an example of a film formation method. FIG. 12 is a schematic cross-sectional view of a deposition apparatus. The deposition apparatus includes a film formation chamber R3, and an evaporation source 30 is provided inside the film formation chamber R3 as a film formation source. The substrate carrier 100, which integrally holds the mother glass 10 and the mask 20, is transported from the alignment chamber to the film formation chamber R3. The substrate carrier 100 passes through a space in which the film formation material is evaporated or sublimated from the evaporation source 30, forming a thin film on the mother glass 10. It is also possible to adopt a configuration in which a plurality of film formation chambers are provided, each of which has a different film formation source, the substrate carrier 100 is transported in sequence, and a plurality of types of thin films are sequentially formed on the mother glass 10. When the film formation is completed, the mask 20 combined with the mother glass 10 is removed. Alternatively, a different mask may be combined again to repeat the film formation process.

<<5. Substrate Peeling Process>>
After the film formation process is performed as described above, the mother glass 10 as a substrate is peeled off from the substrate carrier 100. The peeled off mother glass 10 is then cut along a cutting line to obtain a plurality of image display units as the final product. In this embodiment, the mother glass 10 is configured to be peeled off from the substrate carrier 100 in a short time without adversely affecting the image display unit (display element region) in the mother glass 10. Below, an overview of substrate peeling according to this embodiment will be described before describing a specific substrate peeling device, substrate peeling method, and substrate peeling process.

<<<<Outline of Substrate Peeling>>>
The substrate (particularly the mother glass) may crack at a bent portion of the substrate that occurs in the boundary area between the peeled area and the unpeeled area within the substrate surface during peeling. This is presumably because the stress due to the bending of the substrate and the stress due to the deformation of the substrate caused by the peeling operation overlap, causing the stress to concentrate locally. In addition, if a configuration is adopted in which the adhesive member 123 of the suction pad 120 or the peeling pin 341 is abutted against the image display unit, there is a risk of adversely affecting high-definition image display. It is also known that if an attempt is made to peel the substrate from the adhesive member 123 while keeping the surface of the adhesive member 123 parallel to the substrate surface, a large force is required, making it difficult to peel the substrate and increasing the load on the substrate. Furthermore, it has been found through experiments and the like that it is more difficult to peel the substrate from the adhesive member 123 near the center of gravity of the substrate than in an area away from the center of gravity.

In light of the above, in this embodiment, a method for peeling the substrate has been devised. Below, an overview of substrate peeling according to this embodiment will be described with reference to Figs. 13 and 14. Fig. 13 is a plan view of the substrate carrier 100X, and shows the substrate carrier 100X applied to a mother glass having 10 chamfered image display sections. Fig. 14 (A) is a graph showing the relationship between the position of the peeling pin and the amount of protrusion (height) of the tip of the peeling pin from the substrate holding surface, and Fig. 14 (B) is a graph showing the relationship between the elapsed time of the peeling operation and the moving speed of the peeling pin.

In this embodiment, a configuration is adopted in which the adhesive material 123 and the peeling pin 341 do not come into contact with the display element region (image display section) of the substrate. Specifically, a configuration is adopted in which the substrate carrier 100X is provided with a plurality of suction pads 120 and a plurality of peeling sections for peeling the substrate, so as to be aligned with the outer periphery of the substrate held and the boundary section corresponding to the display element region of the substrate held. Note that, when the suction pad 120 having a peeling function is employed, the peeling section corresponds to the suction pad 120. Also, when the peeling pin 341 is employed, the peeling section corresponds to the through hole 111 through which the peeling pin 341 appears and disappears. FIG. 13 shows an example of the latter. In this embodiment, the above-mentioned boundary section corresponds to the cutting line when the substrate is cut. That is, the boundary section is an area including the cutting line and having a predetermined width with respect to the cutting line. However, the boundary section in the embodiment also includes the case where the boundary section is a part that becomes a boundary between display element regions in a final product in which two or more display element regions (image display sections) are provided.

This configuration allows the substrate to be peeled off from the substrate carrier while minimizing the impact on the display element area on the substrate.

Next, additional configurations in the embodiment will be described. In addition to the configuration (method) in which the adhesive material 123 and the peeling pin 341 do not come into contact with the display element area of the substrate, it is desirable to adopt an appropriate combination of one or more of the following configurations. Note that the following configurations are not essential, and even without the following configurations, it is possible to peel the substrate from the substrate carrier while minimizing the impact on the display element area on the substrate. Furthermore, when combining the following configurations, multiple configurations can be appropriately combined as much as possible. An appropriate combination can be adopted depending on the dimensions, weight, etc. of the substrate.

(1) It is desirable to perform the peeling operation in the order of the suction pads 120 arranged on the outside and then the suction pads 120 arranged on the inside so that the substrate is peeled from the outside to the inside of the substrate. When suction pads 120 that also have a peeling function are used, the peeling operation from the suction pads 120 arranged on the outside should be performed before the peeling operation from the suction pads 120 arranged on the inside.

In the case where the peeling pins 341 are employed, when all the peeling pins 341 protrude from the substrate holding surface 110x during the peeling operation, the peeling pins 341 arranged on the outside may protrude more from the substrate holding surface 110x than the peeling pins 341 arranged on the inside. For example, by making the movement speed of the peeling pins 341 different, the peeling pins 341 arranged on the outside may protrude more from the substrate holding surface 110x than the peeling pins 341 arranged on the inside. In other words, the movement speed of the peeling pins 341 arranged on the outside may be made faster than that of the peeling pins 341 arranged on the inside. In addition, by making the movement start timing of the peeling pins 341 different, the peeling pins 341 arranged on the outside may protrude more from the substrate holding surface 110x than the peeling pins 341 arranged on the inside. In other words, the movement start timing of the peeling pins 341 arranged on the outside may be made earlier than that of the peeling pins 341 arranged on the inside. Furthermore, by making the lengths of the peeling pins 341 different, the peeling pins 341 arranged on the outside can protrude more from the substrate holding surface 110x than the peeling pins 341 arranged on the inside. In other words, the length of the peeling pins 341 arranged on the outside can be made longer than that of the peeling pins 341 arranged on the inside. These may also be combined as appropriate.

Also, by adopting a configuration in which the suction pads 120 arranged on the outside have a smaller suction force than the suction pads 120 arranged on the inside, the substrate can be peeled from the outside to the inside of the substrate. In this case, it is possible to adopt a suction pad 120 that also has a peeling function, or a configuration that includes a peeling pin 341. In the latter case, a configuration that changes the movement speed of the peeling pin 341 on the inside and outside, a configuration that changes the timing at which the peeling pin 341 starts moving, and a configuration that changes the length of the peeling pin 341 may be appropriately combined.

(2) During the peeling operation, when all the peeling pins 341 protrude from the substrate holding surface 110x, the peeling pin 341 with the smallest protruding amount from the substrate holding surface 110x is preferably provided so as to protrude and retract from the substrate holding surface 110x through the through hole 111 provided at the boundary. It is more preferable that the peeling pin 341 with the smallest protruding amount is provided so as to protrude and retract from the substrate holding surface 110x through a through hole (for example, a through hole at the position indicated by O in FIG. 13) arranged at a position that does not overlap with the center of gravity G0 of the substrate. Note that position O corresponds to the boundary and the position closest to the center of gravity G0. When the substrate is peeled, peeling proceeds from the outside of the substrate toward the inside in a substantially concentric manner, and finally, peeling is performed by the peeling pin 341 protruding and retracting from the through hole 111 at position O. As described above, the vicinity of the center of gravity G0 of the substrate is more difficult to peel than the region away from the center of gravity G0, and if the substrate is finally peeled near the center of gravity G0, a large load will be placed on the substrate. In contrast, the substrate is finally peeled using the peeling pin 341 that appears and disappears from the through hole 111 provided at the position O that does not overlap with the center of gravity G0 of the substrate, thereby suppressing the load on the substrate.

Here, in order to peel from the outside of the substrate toward the inside in a substantially concentric manner, it is necessary to make the protruding amount (height) of the peeling pins 341 protruding from the through holes 111 at the same distance from the position O the same. In FIG. 13, multiple concentric circles are shown by dotted lines. For example, when all the peeling pins 341 protrude from the substrate holding surface 110x during the peeling operation, the tips of all the peeling pins 341 may be positioned on a virtual curved surface (spherical surface or elliptical spherical surface) or a conical surface. FIG. 14(A) is a graph showing the relationship between the position of the peeling pins 341 and the protruding amount (height) from the substrate holding surface 110x when the peeling pins 341 protrude from each of the multiple through holes 111 arranged at the boundary portion L in FIG. 13. Graph L1 shows the case where the tips of all the peeling pins 341 are positioned on a virtual conical surface. The black circles in graph L1 show the positions of the tips of some of the peeling pins 341. Graph L2 shows the case where the tips of all the peeling pins 341 are located on a virtual curved surface. The white circles in graph L2 show the positions of the tips of some of the peeling pins 341. By adopting this configuration, peeling proceeds from the outside of the substrate toward the inside in a roughly concentric manner, and finally, peeling is performed by the peeling pins 341 that appear and disappear from the through holes 111 at position O.

When peeling, the greater the inclination between the surface of the adhesive material 123 and the substrate surface, the easier it is to peel off the substrate, and the less stress is placed on the substrate. In other words, it is desirable to increase the height difference between the peeling pins 341 on both sides of the suction pad 120. In the above graph L1, it can be seen that the height difference between the peeling pins 341 on both sides of the suction pad 120 can be increased regardless of the position of the suction pad 120. In contrast, in the graph L2, it can be seen that the height difference between the peeling pins 341 on both sides of the suction pad 120 becomes small near position O. Therefore, it can be seen that it is more preferable to configure all the peeling pins 341 so that their tips are positioned on a virtual conical surface when all the peeling pins 341 protrude from the substrate holding surface 110x during the peeling operation.

(3) In a state in which the first peeling pin 341 and the second peeling pin 341 protruding from the through holes 111 on both sides of the suction pad 120 protrude from the substrate holding surface 110x, it is preferable that the protruding amount of the first peeling pin 341 from the substrate holding surface 110x and the protruding amount of the second peeling pin 341 from the substrate holding surface 110x are different. As a result, during peeling, the surface of the adhesive member 123 and the substrate surface are inclined rather than parallel, making it easier to peel off the substrate and reducing the load on the substrate. Therefore, it is desirable to configure all the suction pads (adhesive members 123) provided on the substrate carrier 100X and the peeling pins 341 protruding from the through holes 111 on both sides of the suction pads. That is, when focusing on any suction pad 120 provided on the substrate carrier 100X, the first peeling pin 341 and the second peeling pin 341 protruding from the through holes 111 on either side of the pad may be configured as described above. For example, in the configuration shown in FIG. 13, when all the peeling pins 341 protrude from the substrate holding surface 110x during the peeling operation, the tips of all the peeling pins 341 may be positioned on an imaginary curved surface or a conical surface.

(4) During the peeling operation, the moving speed of the multiple peeling pins 341 may be changed to slow down. In this case, when the substrate is peeled from the outside to the inside, the peeling speed is slowed down in the vicinity of the center of gravity G0 of the substrate. As described above, it is difficult to peel the substrate from the adhesive material 123 in the vicinity of the center of gravity G0 of the substrate, so the load on the substrate can be reduced by slowing down the peeling speed. Note that FIG. 14(B) is a graph showing the relationship between the elapsed time and the moving speed of the peeling pins 341. In this embodiment, the moving speed is uniformly slowed down midway for all of the peeling pins 341. Also, in this embodiment, the speed is slowed down only in one step midway, but the speed may be slowed down in multiple steps or continuously.

(5) The suction pads 120 arranged on the outside should have a greater suction force than the suction pads 120 arranged on the inside. For example, in the substrate carrier 100X, the suction pads 120 arranged along the outer periphery of the substrate held can have a greater suction force than the suction pads 120 arranged along the boundary between the display element regions of the substrate held. Also, in FIG. 13, the suction force of the suction pads 120 arranged near position O can be made smaller, and the suction force of the suction pads 120 arranged farther from position O can be made larger. By configuring as described above, the substrate can be easily peeled off even near the center of gravity G0, where peeling is difficult, and the load on the substrate can be reduced.

Based on the above overview, we will now explain in more detail the substrate peeling device, substrate peeling method, and substrate peeling process.

<<<<Example 1 for substrate peeling>>>
After the film formation is completed and the mask is removed, the substrate carrier 100 is transported to the substrate peeling chamber R4 of the substrate peeling apparatus. Fig. 15 is a schematic cross-sectional view showing the schematic configuration of the substrate peeling apparatus according to the first embodiment, and shows the state in which the substrate carrier 100 having the suction pad 120 having the peeling function shown in Fig. 3(B) is transported to the substrate peeling chamber R4.

After the film formation process is performed and the mask is removed, the integrated mother glass 10 and substrate carrier 100 are re-inverted by an inverting device and then transported to the substrate peeling chamber R4. The substrate carrier 100 transported to the substrate peeling chamber R4 is placed on the support table 500, and the support 130 is released (see FIG. 15(A)). Then, the metal ball 124 is raised by the lifting table 125 provided on the suction pad 120, and the mother glass 10 is peeled off from the substrate carrier 100. At this time, the adhesive member 123 arranged in the outer region 15 of the mother glass 10 is peeled off before the adhesive member 123 arranged in the inner region 14 is peeled off (see FIG. 15(B)). This makes it possible to reduce the bending of the mother glass 10 in the boundary region between the peeled outer region 15 and the unpeeled inner region 14, and shorten the peeling cycle time without damaging the mother glass 10.

<<<<Example 2 of Substrate Peeling>>>
16 is a plan view of a peeling pin unit 350 constituting a substrate peeling apparatus according to Example 2. In this example, a configuration is adopted in which the mother glass 10 supported and fixed to the substrate holding surface 110x by the suction pad 120 and the support 130 is peeled off from the suction pad 120 by a peeling pin after the support 130 is released.

In the peeling pin unit 350, 26 peeling pins 341 are installed on a peeling pin stand 360. The specifications of the peeling pins 341, such as the number, outer diameter, and length, can be appropriately changed according to the size of the adhesive material 123 and the mother glass 10, the chamfering pattern of the image display unit, etc. The peeling pin 341 is made of a material that has a small amount of outgassing components and can be used under vacuum, and for example, the main body is made of a metal such as stainless steel, and the tip portion that comes into contact with the mother glass 10 is made of fluororesin, fluororubber, or the like.

For ease of explanation, in FIG. 16, each peeling pin 341 is distinguished by coordinates, and in the figure, the peeling pin at the bottom left of the peeling pin stand 360 is distinguished as (x1, y1), and the peeling pin at the top right of the stand is distinguished as (x7, y5). This substrate peeling device is configured to peel the inner region 14 and outer region 15 of the mother glass 10, in other words, the periphery of each display element region (image display section), with the peeling pins 341. There are no peeling pins 341 at the coordinates corresponding to the image display sections 11, 12, and 13 shown in FIG. 1, for example, (x3, y4), (x3, y2), and (x6, y3).

Figure 17 (A) is a schematic cross-sectional view of the substrate carrier 100 transported to the substrate peeling chamber R4 and the substrate peeling chamber R4 in which the peeling pin unit 350 is installed, showing the state in which the support 130 is released. Each peeling pin 341 is configured to be able to move independently up and down in the figure using a driving mechanism such as a motor or a ball screw. As shown in Figure 17 (B), in this embodiment, the movement speed of the peeling pin 341 in the outer region 15 is configured to be faster than the movement speed of the peeling pin 341 in the inner region 14. As a result, the peeling of the mother glass 10 is performed first in the outer region 15, and the bending of the mother glass 10 in the boundary region between the outer region 15 and the inner region 14 is reduced, and the peeling cycle time can be shortened without damaging the mother glass 10.

The moving speed of the peeling pin 341 may be constant, and the timing at which the peeling pin 341 starts moving in the outer region 15 may be earlier than the timing at which the peeling pin 341 starts moving in the inner region 14. Even in this case, the mother glass 10 can be peeled off first in the outer region 15, and the same effect can be obtained.

<<<<Example 3 of Substrate Peeling>>>
In this embodiment, the length of the peeling pin 341 varies depending on the position where the pin is disposed. In this embodiment, when all the peeling pins 341 protrude from the substrate holding surface 110x, the protruding amount (height) of the peeling pin 341 gradually increases in a substantially concentric manner toward the outer region from the intersection point of the two boundaries (corresponding to the coordinates (x5, y3) in FIG. 16 ).

Figure 18(A) corresponds to a schematic cross-sectional view taken along A1-A2, which connects pins (x1, y1) and (x7, y1), and along A3-A4, which connects pins (x1, y5) and (x7, y5), in Figure 16. Figure 18(B) corresponds to a schematic cross-sectional view taken along C1-C2, which connects pins (x1, y1) and (x1, y5), in Figure 16. Figure 18(C) corresponds to a schematic cross-sectional view taken along B1-B2, which connects pins (x1, y3) and (x7, y3), in Figure 16. Figure 18(D) corresponds to a schematic cross-sectional view taken along D1-D2, which connects pins (x5, y1) and (x5, y5), in Figure 16. FIG. 18(E) corresponds to a schematic cross-sectional view taken along line C3-C4 connecting pins (x7, y1) and (x7, y5) in FIG. 16.

The height of the peeling pins 341 is the lowest at pin (x5, y3), and the pin heights on the concentric circle centered at pin (x5, y3) are equal. The height of the peeling pins 341 gradually increases as it moves away from (x5, y3). The tips of all the peeling pins 341 are configured to be located on an imaginary conical surface with (x5, y3) as the apex. The height difference between adjacent peeling pins 341 is approximately 1 mm to 2 mm, and the maximum height difference between the peeling pins 341 is approximately 20 mm.

FIG. 19A is a schematic cross-sectional view of the substrate carrier 100 transported to the substrate removal chamber R4 and the substrate removal chamber R4 in which the removal pin unit 350 is installed, showing a state in which the support 130 has been released.

As described above, if an attempt is made to peel the substrate from the adhesive member 123 while keeping the surface of the adhesive member 123 parallel to the surface of the substrate, a large force is required, making it difficult to peel the substrate and placing a large load on the substrate. This may result in the mother glass 10, which is the substrate, cracking. This is because if the substrate is simultaneously pushed up by a pair of peeling pins 341 on either side of the adhesive member 123 while the substrate is adhered to the adhesive member 123, the forces on both sides of the adhesive member 123 are balanced, resulting in a large peel resistance.

By adopting the configuration shown in each embodiment and making the heights of the peeling pins 341 on either side of the adhesive member 123 (suction pad 120) different, the line of action of the adhesive force and the direction of action of the peeling pin 341 are shifted, and a moment force is applied, thereby reducing the peeling resistance.

In the case of Example 3, by moving the peeling pin stand 360, all the peeling pins 341 with different heights can be moved together in advance, and the peeling timing of the mother glass 10 can be made to vary depending on the position. In the case of Example 3, as shown in FIG. 19(B), the peeling of the mother glass 10 starts from the outer region 15, progresses toward the inner region 14, and is completed at the pin (x5, y3). In this example as well, the bending of the mother glass 10 in the boundary region between the outer region 15 and the inner region 14 can be reduced, thereby shortening the peeling cycle time without damaging the mother glass 10.

<<<Other Examples of Substrate Peeling>>>
As described above, a configuration may be adopted in which the suction pad 120 (adhesive member 123) having a stronger adhesive strength than the outer region 15 is disposed in the inner region 14, so that the adhesive member 123 in the outer region 15 is peeled off first. In this case as well, the bending of the mother glass 10 in the boundary region between the outer region 15 and the inner region 14 can be reduced, and the peeling cycle time can be shortened without damaging the mother glass 10.

Conversely, the suction pads 120 arranged in the outer region 15 can be configured to have a greater suction force than the suction pads 120 arranged on the inside. In this case, there is an advantage in that it is easier to peel the substrate from the adhesive material 123 near the center of gravity of the substrate, which is difficult to peel.

When adopting a configuration in which the adhesive strength of the suction pad 120 is different on the inside and outside, it is possible to select which of the inside and outside adhesive strengths should be stronger, depending on the dimensions and weight of the substrate and which of the configurations shown in the various embodiments above are combined. Note that when changing the adhesive strength, it is not only possible to change the adhesive strength between the suction pad 120 arranged in the internal region 14 and the suction pad 120 arranged in the external region 15, but it is also possible to configure the adhesive strength to gradually decrease or increase in a roughly concentric manner from position O in FIG. 13 toward the outside.

The adhesive strength of the suction pad 120 can be set appropriately by changing the type of material that constitutes the adhesive member 123, the thickness, and the contact area.

<Method of Manufacturing Electronic Device>
Next, an example of a method for manufacturing an electronic device using the film forming apparatus according to this embodiment will be described. The configuration of an organic EL display device will be shown as an example of the electronic device, and a method for manufacturing the organic EL display device will be illustrated.

First, the organic EL display device to be manufactured will be described. Fig. 20A is an overall view of an organic EL display device 800, and Fig. 20B shows a cross-sectional structure of one pixel.

As shown in FIG. 20A, a display area 801 of an organic EL display device 800 has a plurality of pixels 802 each having a plurality of light-emitting elements arranged in a matrix. As will be described in detail later, each light-emitting element has a structure including an organic layer sandwiched between a pair of electrodes. Note that the pixel here refers to the smallest unit that allows a desired color to be displayed in the display area 801. In the case of the organic EL display device according to this embodiment, the pixel 802 is configured by a combination of a first light-emitting element 802R, a second light-emitting element 802G, and a third light-emitting element 802B that emit light different from each other. The pixel 802 is often configured by a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited as long as it is at least one color.

Figure 20 (B) is a schematic partial cross-sectional view taken along line S-S in Figure 20 (A). The pixel 802 is made up of a plurality of light-emitting elements, and each light-emitting element has a first electrode (anode) 804, a hole transport layer 805, one of the light-emitting layers 806R, 806G, and 806B, an electron transport layer 807, and a second electrode (cathode) 808 on a substrate 803. Of these, the hole transport layer 805, the light-emitting layers 806R, 806G, and 806B, and the electron transport layer 807 are organic layers. In this embodiment, the light-emitting layer 806R is an organic EL layer that emits red light, the light-emitting layer 806G is an organic EL layer that emits green light, and the light-emitting layer 806B is an organic EL layer that emits blue light. The light-emitting layers 806R, 806G, and 806B are formed in patterns corresponding to the light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively.

The first electrode 804 is formed separately for each light-emitting element. The hole transport layer 805, the electron transport layer 807, and the second electrode 808 may be formed in common for the multiple light-emitting elements 802R, 802G, and 802B, or may be formed for each light-emitting element. In order to prevent the first electrode 804 and the second electrode 808 from shorting due to foreign matter, an insulating layer 809 is provided between the first electrodes 804. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 810 is provided to protect the organic EL element from moisture and oxygen.

In FIG. 20B, the hole transport layer 805 and the electron transport layer 807 are shown as a single layer, but depending on the structure of the organic EL display element, they may be formed of multiple layers including a hole blocking layer and an electron blocking layer. In addition, a hole injection layer having an energy band structure that can smoothly inject holes from the first electrode 804 to the hole transport layer 805 can be formed between the first electrode 804 and the hole transport layer 805. Similarly, an electron injection layer can be formed between the second electrode 808 and the electron transport layer 807.

Next, we will explain in detail an example of a manufacturing method for an organic EL display device.

First, a circuit (not shown) for driving the organic EL display device and a substrate (mother glass) 803 on which a first electrode 804 is formed are prepared.

Acrylic resin is formed by spin coating on the substrate 803 on which the first electrode 804 is formed, and the acrylic resin is patterned by lithography so that an opening is formed in the area where the first electrode 804 is formed, forming an insulating layer 809. This opening corresponds to the light-emitting area where the light-emitting element actually emits light.

The substrate 803 on which the insulating layer 809 is patterned is placed on a substrate carrier on which an adhesive member is arranged. The substrate 803 is held by the adhesive member. The substrate is then carried into a first organic material deposition apparatus, and after inversion, a hole transport layer 805 is deposited as a common layer on the first electrodes 804 in the display region. The hole transport layer 805 is deposited by vacuum deposition. In practice, the hole transport layer 805 is formed to be larger than the display region 801, so no high-resolution mask is required.

Next, the substrate 803 on which the hole transport layer 805 has been formed is carried into a second organic material deposition apparatus. The substrate and the mask are aligned, the substrate is placed on the mask, and a red-emitting light-emitting layer 806R is deposited on the portion of the substrate 803 where the red-emitting element is to be located.

Similar to the deposition of the light-emitting layer 806R, the third organic material deposition apparatus deposits the light-emitting layer 806G that emits green light, and the fourth organic material deposition apparatus deposits the light-emitting layer 806B that emits blue light. After the deposition of the light-emitting layers 806R, 806G, and 806B is completed, the fifth deposition apparatus deposits the electron transport layer 807 over the entire display area 801. The electron transport layer 807 is formed as a layer common to the three light-emitting layers 806R, 806G, and 806B.

The substrate on which the electron transport layer 807 has been formed is moved using a metallic deposition material deposition device to deposit the second electrode 808.

Then, the substrate is transferred to a plasma CVD device, where a protective layer 810 is formed, completing the film formation process on the substrate 803. After inversion, the adhesive member is peeled off from the substrate 803 as described in the above embodiment or example, thereby separating the substrate 803 from the substrate carrier. The organic EL display device 800 is then completed after cutting.

If the substrate 803 on which the insulating layer 809 is patterned is exposed to an atmosphere containing moisture or oxygen from the time it is carried into the deposition apparatus until the deposition of the protective layer 810 is completed, the light-emitting layer made of the organic EL material may be deteriorated by moisture or oxygen. Therefore, in this embodiment, the substrate is carried in and out of the deposition apparatus in a vacuum atmosphere or an inert gas atmosphere.

10... Mother glass (substrate) 10x... Mother glass installation area 11, 12, 13... Image display section 14... Internal area 15... External area 100, 100X... Substrate carrier 110... Flat plate-like member 110x... Substrate holding surface 111, 112... Through hole 120... Suction pad 123... Adhesive member 341... Peeling pin

Claims (19)

A substrate peeling apparatus that peels off a substrate from a substrate carrier that holds the substrate by a plurality of adhesive suction pads, comprising:
The substrate carrier is provided with a plurality of the adhesive suction pads and a plurality of through holes along an outer periphery of the substrate held by the substrate and along a boundary between display element regions of the substrate held by the substrate,
a plurality of peeling pins provided to protrude from and retract from a substrate holding surface of the substrate carrier through the plurality of through holes ;
The adhesive suction pad is characterized in that it comprises an adhesive member and a metal ball that maintains the adhesive member in a flat shape when the lifting platform is lowered and deforms the adhesive member when the lifting platform is raised . The substrate peeling device according to claim 1, characterized in that the boundary portion corresponds to a cutting line along which the substrate is cut in a subsequent process. The substrate peeling device according to claim 1, characterized in that, when all the peeling pins protrude from the substrate holding surface during a peeling operation, the peeling pins arranged on the outside protrude more from the substrate holding surface than the peeling pins arranged on the inside. The substrate peeling device according to claim 3, characterized in that the movement speeds of the peeling pins are different, so that the peeling pins arranged on the outside protrude more from the substrate holding surface than the peeling pins arranged on the inside. The substrate peeling device according to claim 3, characterized in that the peeling pins start moving at different times, so that the peeling pins arranged on the outside protrude more from the substrate holding surface than the peeling pins arranged on the inside. The substrate peeling device according to claim 3, characterized in that the peeling pins are of different lengths, so that the peeling pins arranged on the outside protrude more from the substrate holding surface than the peeling pins arranged on the inside. A substrate peeling device according to any one of claims 3 to 6, characterized in that, when all the peeling pins protrude from the substrate holding surface during a peeling operation, the peeling pin that protrudes the least from the substrate holding surface is arranged to protrude from and retract from the substrate holding surface through the through hole provided in the boundary portion. The substrate peeling device according to claim 7, characterized in that the peeling pin that protrudes the least from the substrate holding surface is arranged to protrude from and retract from the substrate holding surface through the through hole that is arranged at a position that does not overlap with the center of gravity of the substrate. A substrate peeling device according to any one of claims 1 to 6, characterized in that when all of the peeling pins protrude from the substrate holding surface during the peeling operation, the tips of all of the peeling pins are positioned on an imaginary conical surface. A substrate peeling device as described in any one of claims 1 to 6, characterized in that when a first peeling pin and a second peeling pin protruding from the through holes on either side of any one of the adhesive suction pads protrude from the substrate holding surface, the amount of protrusion of the first peeling pin from the substrate holding surface and the amount of protrusion of the second peeling pin from the substrate holding surface are different. A substrate peeling device according to any one of claims 1 to 6, characterized in that the moving speed of the multiple peeling pins is changed to slow down. 12. The substrate peeling apparatus according to claim 1, wherein the adhesive suction pads arranged on the outside have a smaller suction force than the adhesive suction pads arranged on the inside. 12. The substrate peeling apparatus according to claim 1, wherein the adhesive suction pads arranged on the outside have a stronger suction force than the adhesive suction pads arranged on the inside. a deposition source for forming a thin film on a substrate held by the substrate carrier;
A substrate peeling apparatus according to any one of claims 1 to 13,
A film forming apparatus comprising: 1. A substrate carrier comprising a plurality of adhesive suction pads for holding a substrate, comprising:
A plurality of the adhesive suction pads are arranged along an outer periphery of the held substrate and a boundary portion corresponding to a display element region of the held substrate ,
The adhesive suction pad also has a function of peeling off the substrate ,
The adhesive suction pad is characterized in that it comprises an adhesive member and a metal ball that maintains the adhesive member in a flat shape when the lifting platform is lowered and deforms the adhesive member when the lifting platform is raised . 1. A method for peeling a substrate from a substrate carrier that holds the substrate by a plurality of adhesive suction pads, comprising the steps of:
holding the substrate by a plurality of the adhesive suction pads provided on the substrate carrier along the outer periphery of the substrate and along the boundary between display element regions of the substrate;
peeling the substrate by causing a plurality of peeling pins to protrude from and retract from a substrate holding surface of the substrate carrier through a plurality of through holes provided in the substrate carrier along the outer periphery and the boundary portion, respectively;
Including ,
The adhesive suction pad is characterized in that it comprises an adhesive member and a metal ball that maintains the adhesive member in a flat shape when the lifting platform is lowered and deforms the adhesive member when the lifting platform is raised . 1. A method for forming a thin film on a substrate held by a substrate carrier, comprising the steps of:
holding the substrate by a plurality of adhesive suction pads provided on the substrate carrier so as to respectively follow the outer periphery of the substrate and the boundary between display element regions of the substrate;
forming a thin film on the substrate held by the substrate carrier using a film deposition source;
peeling the substrate by causing a plurality of peeling pins to protrude from and retract from a substrate holding surface of the substrate carrier through a plurality of through holes provided in the substrate carrier along the outer periphery and the boundary portion, respectively;
Including,
The film forming method is characterized in that the adhesive suction pad comprises an adhesive member and a metal ball that maintains the adhesive member in a flat shape when the lifting platform is lowered and deforms the adhesive member when the lifting platform is raised . 1. A method for peeling a substrate from a substrate carrier that holds the substrate by a plurality of adhesive suction pads, comprising the steps of:
holding the substrate by a plurality of the adhesive suction pads provided on the substrate carrier along the outer periphery of the substrate and along the boundary between display element regions of the substrate;
peeling off the substrate by the adhesive suction pad;
Including,
The adhesive suction pad is characterized in that it comprises an adhesive member and a metal ball that maintains the adhesive member in a flat shape when the lifting platform is lowered and deforms the adhesive member when the lifting platform is raised . 1. A method for forming a thin film on a substrate held by a substrate carrier, comprising the steps of:
holding the substrate by a plurality of adhesive suction pads provided on the substrate carrier so as to respectively follow the outer periphery of the substrate and the boundary between display element regions of the substrate;
forming a thin film on the substrate held by the substrate carrier using a film deposition source;
peeling off the substrate by the adhesive suction pad;
Including,
The film forming method is characterized in that the adhesive suction pad comprises an adhesive member and a metal ball that maintains the adhesive member in a flat shape when the lifting platform is lowered and deforms the adhesive member when the lifting platform is raised .

Images