JP7698293B2 - X-ray diffraction measurement system - Google Patents

Description

The present invention relates to an X-ray diffraction measurement system that includes an X-ray diffraction measurement device that irradiates an object to be measured with X-rays and images a diffraction ring using the X-rays diffracted by the object to be measured, and a moving device that moves the object to be measured relative to the X-ray diffraction measurement device, and that is capable of imaging the diffraction ring while performing planar oscillation.

Conventionally, there has been known an X-ray diffraction measuring device that irradiates an object to be measured with X-rays at a predetermined angle of incidence, images a diffraction ring using the X-rays diffracted by the object to be measured, detects the shape of the imaged diffraction ring, and performs an analysis using the cos α method to measure the residual stress of the object to be measured. For example, as shown in Patent Document 1, this X-ray diffraction measuring device images a diffraction ring on an imaging plate and detects the shape of the imaged diffraction ring using a reading function consisting of a laser detection device and a laser scanning mechanism. The device shown in Patent Document 1 has a function of irradiating visible parallel light with the same optical axis as the X-rays (hereinafter referred to as emitted X-rays) emitted toward the object to be measured, a function of photographing an area near the irradiation point of visible light, and a function of detecting the distance from the X-ray irradiation point to the imaging surface of the diffraction ring (hereinafter referred to as the irradiation point-imaging surface distance) using the position of the irradiation point of visible light on the captured image. By using this function, the measurement point (X-ray irradiation point) of the object to be measured can be set to the intended location, and the irradiation point-imaging surface distance can be set to the intended value. In addition, the X-ray diffraction measurement device shown in Patent Document 2 adds to the device shown in Patent Document 1 a function to move a camera that captures the area around the visible light irradiation point, and a function to move the camera to a position where the reflected light from the visible light measurement object passes through the center of the camera's imaging lens based on the input irradiation point-imaging surface distance and X-ray incidence angle. By using this function, the X-ray incidence angle can be set to the intended value in addition to the irradiation point-imaging surface distance. In addition, there is a device that detects the shape of the diffraction ring by placing a solid-state imaging element on the imaging surface and detecting the X-ray intensity distribution with the solid-state imaging element, such as the X-ray diffraction measurement device shown in Patent Document 3. This X-ray diffraction measurement device can simultaneously capture and read the diffraction ring, which are performed by the devices shown in Patent Documents 1 and 2, and can perform measurements in a short time.

When measuring the residual stress of a measurement object using such an X-ray diffraction measurement device, if the measurement object is very small or the crystal grains are large, a clear diffraction ring may not be detected. Specifically, the detected diffraction ring may be discontinuous, or the radial X-ray intensity distribution of the diffraction ring may be a curve that deviates significantly from a normal distribution curve. Even in such cases, a clear diffraction ring can be obtained in many cases by irradiating X-rays while moving the measurement object in a direction parallel to its surface relative to the X-ray irradiation point (hereinafter referred to as planar oscillation) as in the X-ray diffraction measurement device shown in Patent Document 4. In addition, if the surface of the measurement object is uneven, the surface profile of the measurement object can be detected in advance as shown in Patent Document 4, and when irradiating X-rays to image the diffraction ring, the X-ray diffraction measurement device can be moved in the height direction so that the distance between the irradiation point and the imaging surface is always at a set value, allowing for accurate measurements. Furthermore, as with the X-ray diffraction measurement device shown in Patent Document 5, even if X-rays and visible parallel light are irradiated simultaneously and the height direction position of the X-ray diffraction measurement device is controlled so that the irradiation point position on the captured image obtained by camera shooting is a set position, the distance between the irradiation point and the imaging surface is always at a set value, making it possible to perform highly accurate measurements.

Patent No. 5835191 Patent No. 6844103 Patent No. 6313010 Patent No. 6221199 Patent No. 6492388

However, the X-ray diffraction measurement devices in Patent Documents 4 and 5 require a mechanism for changing the height position of the device and a system for controlling this mechanism, which results in problems with the device becoming larger and the cost of the device increasing. In addition, when the measurement surface of the object to be measured has a series of irregularities at short intervals, it becomes difficult to control the distance between the irradiation point and the imaging surface to be constant, and there is also the problem that the X-ray incidence angle changes significantly depending on the X-ray irradiation point, making it impossible to perform accurate measurements.

The present invention was made to solve this problem, and its purpose is to provide an X-ray diffraction measurement system that includes an X-ray diffraction measurement device that irradiates an object to be measured with X-rays and images a diffraction ring using the X-rays diffracted by the object to be measured, and a moving device that moves the object to be measured relative to the X-ray diffraction measurement device, and that can image the diffraction ring while performing planar oscillation, and that can prevent the device from becoming larger and the costs from increasing even if a control system that images the diffraction ring with the irradiation point-imaging surface distance constant is provided. Also, the purpose is to provide an X-ray diffraction measurement device that can perform accurate measurements even when the measurement surface of the object to be measured has continuous unevenness at short intervals.

In order to achieve the above object, the present invention is characterized in that an X-ray diffraction measurement system is provided with an X-ray emitting means for emitting X-rays toward a target object to be measured, a diffraction ring imaging means for receiving diffracted X-rays generated in the object to be measured when the object is irradiated with X-rays by the X-ray emitting means on an imaging plane that perpendicularly intersects with the optical axis of the X-rays emitted by the X-ray emitting means and imaging a diffraction ring, which is an image of the diffracted X-rays, on the imaging plane, and a housing in which the X-ray emitting means and the diffraction ring imaging means are disposed, and a moving device for moving the object to be measured in a direction approximately parallel to the surface of the object to be measured relative to the X-ray diffraction measurement device, the visible light emitting means emitting parallel visible light with an optical axis equal to the optical axis of the emitted X-rays, which are the X-rays emitted toward the object to be measured, and the visible light emitting means is provided with a half mirror that passes the emitted X-rays on the optical path of the emitted X-rays and reflects the visible light. a camera having an imaging lens that forms an image of an area including a visible light irradiation point generated when the visible light emitting means irradiates visible light, and an imager that is placed at the location where the image is formed by the imaging lens and outputs an image signal representing the formed image; an image creation means that creates a photographed image from the image signal output by the imager of the camera; and an X-ray emission control means that detects the position of the visible light irradiation point in the photographed image created by the image creation means when the measurement object is moved by the moving device and X-rays are emitted by the X-ray emitting means and visible light is emitted by the visible light emitting means, and causes the X-ray emitting means to emit X-rays only when the deviation of the position of the visible light irradiation point detected from the position of the visible light irradiation point in the photographed image is within an allowable range when the distance from the X-ray irradiation point formed on the measurement object by the emitted X-rays to the imaging surface is a set value.

According to this, when the X-ray emitting means irradiates the object to be measured with X-rays, the visible light emitting means can irradiate parallel visible light with the same optical axis, and the point of irradiation of the X-rays can be recognized as a point of irradiation of visible light regardless of the distance between the irradiation point and the imaging surface. Then, when the point of irradiation of the visible light is photographed by a camera and an image captured by the camera is created by the image creation means, the point of irradiation of the visible light in the captured image appears in a different position depending on the distance between the irradiation point and the imaging surface. Therefore, when the measurement object is moved by the moving device, X-rays are irradiated toward the measurement object by the X-ray emitting means, and the diffraction ring is imaged on the imaging surface by the diffraction ring imaging means (i.e., when the diffraction ring is imaged while performing planar oscillation), visible light is irradiated by the visible light emitting means, and the X-ray emission control means causes the X-ray emitting means to emit X-rays when the deviation of the visible light irradiation point position in the captured image from the visible light irradiation point position in the captured image when the irradiation point-imaging surface distance is a set value is within the allowable range, so that the diffraction ring can be imaged with the irradiation point-imaging surface distance being approximately constant. The X-ray emission control means can be configured with a computer device, and in terms of hardware, no mechanisms or devices are required other than the X-ray diffraction measurement device and the moving device that moves the measurement object, so that the size and cost of the device can be suppressed.

Another feature of the present invention is that the X-ray emission control means adjusts the orientation of the housing relative to the object to be measured so that a light receiving point is generated in the captured image created by the image creation means, where the reflected visible light from the object to be measured is collected by the imaging lens and received by the image capture device; when the object to be measured is moved by the moving device and X-rays are emitted by the X-ray emission means and visible light is emitted by the visible light emission means, the position of the light receiving point in the captured image is detected, and the X-ray emission means is caused to emit X-rays only when the positional deviation of the visible light irradiation point is within an allowable range and the position of the light receiving point is within a preset range.

In this way, in addition to the distance between the irradiation point and the imaging surface being a set value, X-rays are irradiated and a diffraction ring is imaged only when the X-ray incidence angle is approximately the set value and the normal to the location of the X-ray irradiation point on the measurement object is approximately included in a plane (hereinafter referred to as the reference plane) that contains the optical axis of the outgoing X-ray and the line of the imaging surface at a rotation angle of 0. Therefore, accurate measurements can be performed even if the surface of the measurement object has continuous irregularities at short intervals.

Another feature of the present invention is that the X-ray emission control means causes the X-ray emission means to emit X-rays only when the deviation of the position of the irradiation point in the captured image is within an allowable range, the position of the light receiving point is within a preset range, and the deviation of at least one of the area of the irradiation point and the area of the light receiving point in the captured image from the preset area is within an allowable range.

With this, when the surface of the object to be measured has a continuous stepped unevenness, such as a measurement object with many pits, X-ray irradiation is stopped when the X-ray irradiation point falls on a stepped part of the unevenness. Therefore, X-rays can be irradiated and a diffraction ring imaged only when the distance between the irradiation point and the imaging surface and the X-ray incidence angle are approximately set values in most areas of the X-ray irradiation point and the reference plane approximately includes the normal to the X-ray irradiation point on the measurement object, allowing for highly accurate measurements.

Another feature of the present invention is that it includes a movement control means that reduces the movement speed of the moving device when the X-ray emission control means causes the X-ray emission means to emit X-rays, and that increases the movement speed of the moving device when the X-ray emission control means causes the X-ray emission means to stop emitting X-rays.

With this, even if the surface of the object to be measured has a series of irregularities at short intervals, the time for which X-rays are emitted can be extended and the time for which X-ray emission is stopped can be shortened, thereby shortening the time required to image the diffraction ring and improving measurement efficiency.

Another feature of the present invention is that it includes a time measurement means for integrating and measuring the control time during which the X-ray emission means and the X-ray emission control means perform control, an estimated movement distance calculation means for calculating an estimated value of the distance traveled by the moving device until the emission time reaches the upper limit using the emission time and control time measured by the time measurement means, a preset upper limit value of the emission time, and a preset moving speed of the moving device, and a comparison means for comparing the estimated value of the distance calculated by the estimated movement distance calculation means with a preset upper limit value of the movement distance by the moving device and taking action based on the comparison result.

According to this, immediately after starting to image the diffraction ring while performing planar oscillation, the estimated movement distance calculation means calculates an estimated value of the distance, and the comparison means compares the estimated value of the distance calculated with a preset upper limit of the movement distance, and if the estimated value of the distance is greater than the upper limit of the movement distance, some kind of response can be taken. In other words, if the time for X-ray emission is shorter than the time for stopping emission due to a cause such as a large degree of unevenness on the surface of the measurement object, and it is estimated that the distance of planar oscillation before the imaging of the diffraction ring is completed will exceed the upper limit of the size of the measurement object, etc., some kind of response can be taken immediately after the imaging of the diffraction ring is started, so that it is possible to eliminate the need to spend extra time on the measurement. Note that various responses can be considered for the X-ray diffraction measurement system, such as displaying a warning on the display device, generating an alarm, or canceling the measurement.

1 is an overall schematic diagram showing an X-ray diffraction measurement system including an X-ray diffraction measurement device of the present invention. 2 is an enlarged view of the X-ray diffraction measurement device and a stage moving device in FIG. 1. 3 is an enlarged partial cross-sectional view showing an X-ray emission mechanism and a laser emitter in the X-ray diffraction measurement apparatus of FIG. 2. 13 is a diagram showing, by way of images captured by a camera, the conditions for X-ray emission when imaging a diffraction ring by setting the irradiation point-to-imaging surface distance and setting the X-ray incidence angle to a reference value. 13 is a diagram showing, by way of images captured by a camera, the conditions for X-ray emission when imaging a diffraction ring by setting the irradiation point-to-imaging surface distance and the X-ray incidence angle. 2 is a flow diagram of a program executed by the controller of FIG. 1 when imaging the diffraction ring. FIG. 2 is a flow diagram of another program executed by the controller of FIG. 1 when imaging the diffraction ring. 1 is a diagram showing the emission region of the emitted X-rays relative to the surface profile of the measurement object OB when imaging the diffraction ring.

The configuration of an X-ray diffraction measurement system including the X-ray diffraction measurement device of the present invention will be described with reference to Figures 1 to 3. The X-ray diffraction measurement device of the present invention is the same as the X-ray diffraction measurement device shown in Patent Document 2, a prior art document, except that the visible light emission mechanism has been changed to a laser emitter 40. Therefore, the same parts as the X-ray diffraction measurement device shown in Patent Document 2 will be described briefly, stating that they are the same, and the differences will be described in detail. The same parts as the X-ray diffraction measurement device shown in Patent Document 1 will also be described briefly, stating that they are the same.

1 and 2, this X-ray diffraction measurement system is composed of an X-ray diffraction measurement device 1, a computer device 90, a high-voltage power supply 95, an arm-type moving device (only the tip 51 is shown), and a stage moving device 60. This X-ray diffraction measurement system moves the stage St of the stage moving device 60 in a direction parallel to the surface of the stage St, irradiates X-rays from the X-ray diffraction measurement device 1 onto the measurement object OB to capture an image of the diffraction ring, reads the shape of the captured diffraction ring, and measures characteristic values such as residual stress of the measurement object OB from the shape. Then, when moving the stage St to capture the diffraction ring, the controller 91 controls the X-ray irradiation from the X-ray diffraction measurement device 1 onto the measurement object OB only when the determined conditions are met. The conditions for the X-ray irradiation include the condition of the distance between the irradiation point and the imaging surface, but it is possible to select whether or not to include the condition of the X-ray incidence direction and the condition of the area of the irradiation point and the light receiving point of the visible laser light in the image captured by the camera CA, which will be described later. In the following explanation, the direction perpendicular to the paper surface of Figures 1 and 2 is the X-axis direction, the horizontal direction is the Y-axis direction, and the vertical direction is the Z-axis direction.

1 and 2, the X-ray diffraction measurement device 1 includes, in a housing 50, an X-ray tube 10, a table 16 to which an imaging plate 15 is attached, a spindle motor 27 that rotates the table 16 and passes the X-rays emitted from the X-ray tube 10 through a through hole formed on the rotation axis, a laser detection device 30 that emits a laser light for reading the diffraction ring and an LED light for erasing it, a camera CA that takes an image of the vicinity of the X-ray irradiation point, and a moving mechanism 100 that moves the laser detection device 30 in a direction parallel to the imaging plate 15. The X-ray diffraction measurement device 1 also includes, in the housing 50, various circuits that are connected to these devices and control their operation and input detection signals, and the various circuits surrounded by a two-dot chain line shown outside the housing 50 in FIG. 1 are contained within the two-dot chain line inside the housing 50. These various circuits are connected to a computer device 90 and operate according to commands input from a controller 91 of the computer device 90. The controller 91 outputs commands to various circuits based on input from the input device 92 and the operation of the installed program, and inputs data output by the various circuits and values input from the input device 92, storing them in memory. The stored data is then processed to display the measurement results of residual stress, etc., and images captured by the camera CA, etc., on the display device 93. The X-ray diffraction measurement system also includes a high-voltage power supply 95, which outputs to the X-ray tube 10 a voltage and current for the X-ray tube 10 to emit X-rays. These configurations are the same as those of the X-ray diffraction measurement device shown in Patent Document 2.

2, the housing 50 of the X-ray diffraction measurement device 1 has a rectangular parallelepiped shape with a slope formed on each of the top and bottom surfaces to eliminate one corner, and a step on the bottom surface. In detail, the housing 50 is formed to have a first bottom wall 50a, a second bottom wall 50c, a front wall 50b, a rear wall 50e, a top wall 50f, a side wall (not shown), a bottom slope wall 50h connecting the first bottom wall 50a and the second bottom wall 50c, a connecting wall 50d provided to eliminate the corner where the second bottom wall 50c and the front wall 50b intersect, and a top slope wall 50g provided to eliminate the corner where the rear wall 50e and the top wall 50f intersect. The second bottom wall 50c has a circular hole 50c1 through which X-rays are emitted during diffraction ring imaging, and diffracted X-rays generated by the object to be measured OB pass through the circular hole 50c1 and are received by the imaging plate 15. The bottom inclined wall 50h also has a rectangular long hole 50h1 whose long dimension is parallel to the side wall, and since this hole is positioned in the imaging direction of the camera CA, the camera CA images the vicinity of the X-ray irradiation point through the long hole 50h1. The shape of the housing 50 is the same as that of the X-ray diffraction measurement device shown in Patent Document 2.

2, one of the side walls of the housing 50 is rotatably connected to the tip 51 of the arm-type moving device, and the direction of the rotation axis is parallel to the front wall 50b, rear wall 50e, and top wall 50f of the X-ray diffraction measurement device 1, and perpendicular to the side wall. In other words, the direction of the rotation axis is perpendicular to the reference plane (a plane including the optical axis of the emitted X-rays and the line of the imaging plate 15, which is the imaging surface, at a rotation angle of 0). This allows the angle of incidence of X-rays with respect to the measurement object OB to be changed by rotating the connection part between the tip 51 of the arm-type moving device and the side wall. In addition, the arm-type moving device has multiple joints, and the position and posture of the X-ray diffraction measurement device 1 can be changed and fixed in various ways.

The controller 91 of the computer device 90 is an electronic control device whose main component is a microcomputer equipped with a CPU, ROM, RAM, large-capacity storage device, etc., and in response to commands input from the input device 92, executes a program stored in the large-capacity storage device to control the operation of the X-ray diffraction measurement device 1, and performs calculations using the input digital data to calculate characteristic values such as residual stress. The controller 91 also displays on the display device 93 the measurement conditions and operating status of the X-ray diffraction measurement system input from the input device 92, as well as characteristic values such as residual stress obtained as a result of the calculations, and an X-ray intensity distribution diagram of the diffraction ring.

The stage moving device 60 is composed of a Y-axis direction moving mechanism consisting of a stage St, a frame body 61, a feed motor 62, a screw rod 63, and a bearing unit 64, and an X-axis direction moving mechanism consisting of a frame body 65, a feed motor 66, a screw rod (not shown), and a bearing unit (not shown). In the Y-axis direction moving mechanism, the stage St is sandwiched between the frame body 61 and can move only in the Y-axis direction, and there is a hole in the center with a female thread in the Y-axis direction, which engages with the screw rod 63 with a male thread. When the feed motor 62 rotates forward or backward, the screw rod 63 rotates forward or backward, and the stage St moves in the Y-axis direction. In the X-axis direction moving mechanism, the frame body 61 of the Y-axis direction moving mechanism has a mechanism similar to that of the stage St, and when the feed motor 66 rotates forward or backward, the screw rod rotates forward or backward, and the Y-axis direction moving mechanism moves in the X-axis direction. By operating these X-axis direction movement mechanism and Y-axis direction movement mechanism, the stage St and the measurement object OB placed on the stage St move in the X-axis direction and the Y-axis direction.

In addition to the above-mentioned mechanical parts, the stage moving device 60 also includes feed motor control circuits 67, 69 and position detection circuits 68, 70. When a command for the moving position is input from the controller 91 to these circuits, the stage St moves in the X-axis and Y-axis directions. When a command for the moving position is input from the controller 91 to the feed motor control circuits 67, 69, the feed motor control circuits 67, 69 output a drive signal to the feed motors 62, 66 until the moving position input from the position detection circuits 68, 70 becomes the moving position commanded. When a command for the moving direction and moving speed is input from the controller 91, the feed motor control circuits 67, 69 output a drive signal to the feed motors 62, 66 so that the number of pulses per unit time input from the encoders 62a, 66a built into the feed motors 62, 66 becomes the number of pulses corresponding to the moving speed commanded. In addition, the position detection circuits 68, 70 accumulate and count the number of pulses of the pulse train signals input from the encoders 62a, 66a, convert them into a moving distance, and output the moving distance as a moving position. As a result, the stage St moves to a position specified by the controller 91 and moves in a direction specified by the controller 91 at a speed specified by the controller 91. When the power supply of the X-ray diffraction measurement system is turned on, a command to move to the origin is input from the controller 91 to the feed motor control circuits 67, 69 and the position detection circuits 68, 70, and the feed motor control circuits 67, 69 output a drive signal to move the stage St toward the feed motors 62, 66. When the stage St moves to the movement limit position and the pulse train signals from the encoders 62a, 66a stop, the position detection circuits 68, 70 reset the integrated count to 0 and output a drive signal stop signal to the feed motor control circuits 67, 69. After this, the position detection circuits 68, 70 output the movement distance with the movement limit position as the origin as the movement position.

1 and 2, the X-ray tube 10 is fixed at the top of the housing 50. This fixing is performed after positioning by fitting the side of the X-ray tube 10 into a groove that is a part of the cylindrical side formed in the plate 26. The plate 26 is fixed to the housing 50 together with the fixed moving mechanism 100, and the central axis of the X-ray tube 10 is approximately parallel to the top wall 50f and the side wall. When the X-ray tube 10 receives a high voltage from the high-voltage power supply 95, it emits X-rays from the circular emission port 11 on the side. As shown in FIG. 3, the plate 26 has a through hole 26a formed at a position that matches the emission port 11, and the emitted X-rays pass through the through hole 26a and proceed. When a command is input from the controller 91, the X-ray control circuit 71 shown in FIG. 1 controls the drive current and drive voltage supplied from the high-voltage power supply 95 to the X-ray tube 10 so that the X-ray tube 10 emits X-rays of a constant intensity. The X-ray tube 10 also includes a cooling device (not shown), and the X-ray control circuit 71 also controls the drive signal supplied to this cooling device. This configuration is the same as that of the X-ray diffraction measurement device shown in Patent Document 2.

As shown in FIG. 2, the moving mechanism 100 is integrated with the plate 26 and has a mechanism for moving the moving stage 101 in the central axis direction of the X-ray tube 10. There is a convex part on the opposite side of the paper of the moving stage 101, and this convex part fits into a groove formed in a block 109 fixed to the plate 26 and a plate-shaped guide 105 fixed to the block 110. The moving stage 101 has a screw rod 103 with a male screw inserted into a hole with a female screw, and the screw rod 103 is connected to the feed motor 102 and the bearing part 104, and moves in the direction of the groove formed in the plate-shaped guide 105 (the central axis direction of the X-ray tube 10) by the rotation of the feed motor 102. A connecting block 106 is fixed to the lower part of the moving stage 101, and the connecting block 106 fixes a fixed block 107, and the fixed block 107 fixes the laser detection device 30 to the upper part and the camera CA to the lower part. Therefore, when the moving stage 101 moves, the laser detection device 30 and the camera CA also move in the same direction. This configuration is the same as the X-ray diffraction measurement device shown in Patent Document 2.

An encoder 102a is built into the feed motor 102, and when the feed motor 102 rotates, the encoder 102a outputs a pulse train signal to the position detection circuit 72 and the feed motor control circuit 73 shown in FIG. 1. The position detection circuit 72 and the feed motor control circuit 73 operate according to a command from the controller 91, and the position detection circuit 72 counts the input pulse train signal to output the movement position, which is the movement distance with the movement limit position as the origin, to the feed motor control circuit 73 and the controller 91. When the movement position is input from the controller 91, the feed motor control circuit 73 outputs a drive signal to the feed motor 102 until the movement position input from the position detection circuit 72 becomes equal to the movement position input from the controller 91. Furthermore, when the movement direction and movement speed are input from the controller 91, the feed motor control circuit 73 outputs a drive signal so that the number of pulses per unit time of the input pulse train signal becomes the number of pulses equivalent to the input movement speed. These functions of the position detection circuit 72 and the feed motor control circuit 73 cause the laser detection device 30 and the camera CA to move to a position specified by the controller 91 and to move in a direction specified by the controller 91 at a specified speed. These configurations and functions are the same as those of the X-ray diffraction measurement device shown in Patent Document 2.

As shown in FIG. 3, the motor fixing block 111 is fixed to the block 110 and the block 112 fixed to the plate-shaped plate 26, and the triangular block 48 is fixed to the surface on the plate-shaped plate 26 side so as to face the through hole 26a. Therefore, the X-rays emitted from the exit port 11 of the X-ray tube 10 and passing through the through hole 26a of the plate-shaped plate 26 proceed in the direction of the triangular block 48. The triangular block 48 has a shape obtained by cutting a cube at an angle of 45°, and a through hole 48b is formed from the inclined surface toward the lower surface so that the optical axis of the X-rays emitted from the X-ray tube 10 and the central axis coincide with each other. In addition, the triangular block 48 has a through hole 48a formed so that the central axis is perpendicular to the central axis of the through hole 48b from the horizontal surface, and the inclined surface of the triangular block 48 has a hole where the through hole 48b and the through hole 48a intersect with each other. A thin square half mirror 49 is fitted into the hole where the two through holes of the triangular block 48 intersect, and the half mirror 49 is made of a material that transmits most X-rays and reflects most visible light. This material is, for example, polyimide. As a result, most of the X-rays that pass through the through hole 26a and enter the triangular block 48 pass through the half mirror 49 and through the through hole 48b and enter the through hole 21a formed in the motor fixing block 111. Also, as described below, visible laser light whose optical axis coincides with the central axis of the through hole 48a enters the through hole 48a, but most of the visible laser light that enters the through hole 48a is reflected by the half mirror 49 and, like the X-rays, passes through the through hole 48b and enters the through hole 21a.

The central axis of the through hole 21a, together with each of the through holes through which the X-rays pass, which will be described later, coincides with the optical axis of the X-rays emitted from the X-ray tube 10 and the central axis of the through holes 26a and 48b. The X-rays and laser light incident on the through hole 21a pass through the through hole 28a of the passage member 28 fixed to the tip of the through hole 27b formed in the spindle motor 27 fixed to the motor fixing block 111. The output shaft 27a of the spindle motor 27 has a through hole 27a1 formed therein, and the through hole 27b is connected to the through hole 27a1 with its central axis aligned. Therefore, the X-rays and laser light passing through the through hole 28a pass through the through hole 27b and the through hole 27a1. The table 16 is disk-shaped, and the through hole 16a formed in its central axis is fixed to the output shaft 27a so that it is aligned with the through hole 27a1 of the output shaft 27a of the spindle motor 27. The table 16 has a protrusion 17 that protrudes downward from the center of the bottom surface around the central axis, and a screw thread is formed on the outer circumferential surface of the protrusion 17. The imaging plate 15 is attached to the bottom surface of the table 16 so that the through hole 15a fits into the protrusion 17, and the imaging plate 15 is fixed to the table 16 by screwing a nut-shaped fastener 18 onto the outer circumferential surface of the protrusion 17. This structure is the same as the X-ray diffraction measurement device shown in Patent Document 2.

A through hole 17a is also formed in the protruding portion 17 so as to be aligned with the through holes 27a1 and 16a, and a through hole 18a is formed in the fixing device 18. Therefore, the X-rays and laser light that pass through the through holes 27b and 27a1 pass through the through holes 16a, 17a, and 18a, become approximately parallel X-rays and laser light, and are emitted from the circular hole 50c1 of the housing 50. The structure in which the X-rays emitted from the X-ray tube 10 pass through the through holes is the same as that of the X-ray diffraction measurement device shown in Patent Document 2, except for the presence of the triangular block 48 and the half mirror 49. However, in this embodiment, visible laser light is emitted simultaneously with the X-rays, and the half mirror 49 passes the X-rays and reflects the visible laser light, so that the visible laser light can be emitted simultaneously with the same optical axis as the emitted X-rays. This makes it possible to recognize the irradiation point of the emitted X-rays irradiated on the measurement object OB as the irradiation point of the visible light. When X-rays are irradiated onto the object to be measured OB, diffracted X-rays are generated, which pass through the circular hole 50c1 and are received by the imaging plate 15, and a diffraction ring is imaged on the imaging plate 15 at the location where the intensity of the diffracted X-rays is strong.

An encoder 27c is incorporated in the spindle motor 27, and when the spindle motor 27 rotates, the encoder 27c outputs a pulse train signal to the spindle motor control circuit 74 and the rotation angle detection circuit 75 shown in FIG. 1. The encoder 27c also outputs an index signal to the controller 91 and the rotation angle detection circuit 75 every time the spindle motor 27 rotates once. When the rotation speed is input from the controller 91, the spindle motor control circuit 74 outputs a drive signal to the spindle motor 27 so that the number of pulses per unit time of the pulse train signal input from the encoder 27c corresponds to the input rotation speed. The rotation angle detection circuit 75 counts the number of pulses of the input pulse train signal, calculates the rotation angle from the count value, outputs it to the controller 91, and resets the count value to "0" when an index signal is input. This is the position of the rotation angle of 0°. The functions of the spindle motor 27, the spindle motor control circuit 74, and the rotation angle detection circuit 75 are the same as those of the X-ray diffraction measurement device of Patent Document 2.

1 and 2, the central axis direction of the X-ray tube 10 is parallel to the imaging plate 15, and as described above, the laser detection device 30 moves in the central axis direction of the X-ray tube 10, so that the laser detection device 30 moves in a direction parallel to the imaging plate 15. When the laser detection device 30 moves from the position shown in FIG. 2 to the right side of the figure, the laser light emitted from the laser detection device 30 is irradiated onto the imaging plate 15, and this irradiation point moves in the radial direction of the imaging plate 15 due to the movement of the laser detection device 30. The position of the laser detection device 30 on the fixed block 107 is adjusted so that the moving line of the laser light on the imaging plate 15 passes through the center of the imaging plate 15. In addition, the position of the laser detection device 30 is adjusted so that the focus of the laser light emitted from the objective lens of the laser detection device 30 coincides with the imaging plate 15. These structures are the same as those of the X-ray diffraction measurement device in Patent Document 2.

The position on the imaging plate 15 at a rotation angle of 0° is the position where the laser light from the laser detection device 30 is irradiated when the encoder 27c outputs an index signal during diffraction ring reading, and this position is a line because it is at each radial position of the imaging plate 15. Then, before the diffraction ring is imaged on the imaging plate 15 by irradiating the measurement object OB with X-rays, the rotation angle of the table 16 is set to 0° by a command output from the controller 91 to the spindle motor control circuit 74 and the rotation angle detection circuit 75. Therefore, during diffraction ring imaging, the line of the rotation angle of 0° on the imaging plate 15 is the line where the laser light from the laser detection device 30 is irradiated when the laser detection device 30 is moved to the right side in FIG. 2. The optical axis of the emitted X-rays and the line of the rotation angle of 0° on the imaging plate 15 intersect, and as described above, the plane formed by the optical axis of the emitted X-rays and the line of the rotation angle of 0° is called the reference plane. The reference plane is the YZ plane in FIG. 2.

The structure of the laser detection device 30 is the same as that of Patent Document 1, and it irradiates the imaging plate 15 with laser light and detects the intensity of diffracted X-rays at the laser light irradiation position from the intensity of the light emitted from the imaging plate 15. By irradiating the laser light and rotating the spindle motor 27 and moving the laser detection device 30 by the moving mechanism 100, the irradiation point of the laser light on the imaging plate 15 moves in a spiral shape, and the intensity of diffracted X-rays at each position on the imaging plate 15 can be detected. At this time, the rotation angle detection circuit 75 detects the rotation angle and the position detection circuit 72 detects the movement position at the same timing as the laser detection device 30 detects the intensity of the diffracted X-rays, and if these data groups are input to the controller 91 and the movement position is converted into a radial position, these data groups are the intensity distribution data of the diffracted X-rays on the imaging plate 15 (diffraction ring reading data). The laser detection control circuit 77 shown in FIG. 1 is a circuit that represents a plurality of circuits shown in FIG. 1 of Patent Document 1 that control the laser detection device 30 and a plurality of circuits that input signals from the laser detection device 30 and output data, all together. The laser detection control circuit 77 performs control of the laser detection device 30, such as laser light emission, intensity control of the emitted laser light, and focusing control of the laser light irradiation point on the imaging plate 15, and outputs instantaneous value data of a signal corresponding to the diffracted X-ray intensity input from the laser detection device 30 to the controller 91, in response to a command input from the controller 91. These functions of the laser detection control circuit 77 are the same as those of the X-ray diffraction measurement device of Patent Document 2. In addition, the laser detection device 30 is provided with an LED light source, and when the LED light is irradiated from the LED light source to the imaging plate 15, the captured diffraction ring is erased. When a command is input from the controller 91, the LED drive circuit 84 outputs a drive signal that causes the LED light source to emit LED light of a predetermined intensity. This function of the laser detection device 30 and the LED drive circuit 84 is also the same as that of the X-ray diffraction measurement device of Patent Document 2.

As shown in FIG. 3, the laser emitter 40 is attached to the motor fixing block 111 on the surface facing the plate 26 by fastening the tips of semicircular belts 47-1 and 47-2 to the motor fixing block 111 with bolts, and emits visible laser light toward the triangular block 48. The laser emitter 40 is composed of a cylindrical frame 41, a laser light source 42, a disk-shaped block 43, a cylindrical block 44, a collimating lens 45, and a lens frame 46, and emits parallel laser light by collimating the laser light emitted from the laser light source 42 with the collimating lens 45. As described above, the optical axis of this laser light coincides with the central axis of the through hole 48a of the triangular block 48, and is reflected by the half mirror 49, so that it is emitted from the X-ray diffraction measurement device 1 with the same optical axis as the optical axis of the emitted X-ray. The laser light source 42 is fixed to a cylindrical block 44, and the cylindrical block 44 is fixed to the inside of the cylindrical frame 41, thereby attaching the laser light source 42 to the inside of the frame 41. A disk-shaped block 43 having a hole 43a is fixed to the end of the frame 41 near the laser light source 42, and when the cylindrical block 44 is fixed to the inside of the frame 41, the laser light source 42 can be pressed against the disk-shaped block 43 to determine the position of the laser light source 42, and wiring to the laser light source 42 can be performed through the hole 43a. The collimating lens 45 is fixed to a hole 46a of a lens frame 46, and the lens frame 46 is fixed to the inside of the frame 41, thereby fixing the lens frame 46 to the other end of the frame 41. A driving signal for emitting a laser beam of a set intensity is input to the laser light source 42 from a laser driving circuit 85 shown in FIG. 1, and the laser driving circuit 85 outputs a driving signal when an operation command is input from a controller 91. Therefore, when the controller 91 outputs an operation command to the laser drive circuit 85 and the X-ray control circuit 71, the emitted X-rays and visible laser light are emitted on the same optical axis from the circular hole 50c1 of the X-ray diffraction measurement device 1.

2, the fixed block 107 of the moving mechanism 100 has a convex portion 108 on the bottom surface, and a cylindrical hole 108a is formed in the convex portion 108, and a cylindrical camera CA is fixed to the cylindrical hole 108a. The camera CA has a structure in which a cylindrical portion with an imaging lens attached is attached to a cylindrical frame body with an imager attached to the bottom surface, and the camera CA is fixed to the convex portion 108 by fixing the frame body to the hole 108a. The optical axis of the imaging lens of the camera CA is made to enter the imager approximately perpendicularly and is included in the reference plane (a plane including the optical axis of the emitted X-ray and the line of the rotation angle 0), and the moving direction of the fixed block 107 by the moving mechanism 100 is parallel to the line of the rotation angle 0, so that the optical axis of the imaging lens is included in the reference plane at all moving positions of the camera CA. These structures are the same as those of the X-ray diffraction measurement device of Patent Document 2. In addition, when the distance between the irradiation point and the imaging surface and the X-ray incidence angle are set in the controller 91 by input from the input device 92, the controller 91 outputs a command to the feed motor control circuit 73, and the movement position of the camera CA is set. The movement position is a movement position where the reflected light of the laser light from the measurement object OB passes through the center of the imaging lens of the camera CA when visible laser light is irradiated with the distance between the irradiation point and the imaging surface and the X-ray incidence angle as set, and the normal of the measurement object OB at the X-ray irradiation point is included in the reference plane. The controller 91 stores a relationship table between the distance between the irradiation point and the imaging surface, the X-ray incidence angle, and the movement position of the camera CA, and when the distance between the irradiation point and the imaging surface and the X-ray incidence angle are input, the controller 91 calculates the movement position of the camera CA from the relationship table and outputs it to the feed motor control circuit 73. This function is also the same as that of the X-ray diffraction measurement device of Patent Document 2.

The camera CA is a digital camera, and the imager is composed of a CCD light receiver or a CMOS light receiver, and outputs a signal of an intensity corresponding to the light receiving intensity for each imager to the sensor signal extraction circuit 87. The sensor signal extraction circuit 87 outputs the signal intensity data for each imager of the imager together with data indicating the position (i.e. pixel position) of each imager or in the order of pixel position to the controller 91, and the controller 91 creates a captured image from the input data and displays it on the screen of the display device 93. At this time, the controller 91 also displays a cross line that divides the captured image into four equal parts, centered on a point on the captured image corresponding to the point where the optical axis of the imaging lens of the camera CA intersects with the imager, independently of the captured image. In addition, when the movement position of the camera CA is set as described above, a cross mark is displayed independently of the captured image at a point on the captured image corresponding to the point where the line connecting the X-ray irradiation point, which is the irradiation point-imaging surface distance as set, and the center of the imaging lens of the camera CA intersects with the imager. When the laser emitter 40 emits visible laser light, the captured image shows a laser light irradiation point and a light receiving point, which is a point where the laser light is reflected by the measurement object OB, focused by the imaging lens of the camera CA, and received by the imager. This cross mark is the point where the irradiation point and light receiving point on the captured image should be matched to achieve the set irradiation point-imaging surface distance and X-ray incidence angle. This function of the camera CA, the sensor signal extraction circuit 87, and the controller 91 is the same as that of the X-ray diffraction measurement device shown in Patent Document 2. Furthermore, the controller 91 detects the positions of the visible laser light irradiation point and light receiving point in the captured image by executing an installed program described later, and controls the output of an X-ray emission command and an emission stop command to the X-ray control circuit 71 based on the detected positions. This control will be described in detail later.

The feature of this embodiment is that when X-rays are irradiated onto the measurement object OB while performing planar oscillation and a diffraction ring is imaged on the imaging plate 15, the emission and stopping of X-rays are controlled based on the positions of the irradiation point and the receiving point in the image captured by the camera CA and other characteristics, and this control is performed by executing a program installed in the controller 91. The program will be described below in the description of a method of performing X-ray diffraction measurement by planar oscillation of the measurement object OB using an X-ray diffraction measurement system including the X-ray diffraction measurement device 1 configured as described above.

First, the operator turns on the power supply to operate the X-ray diffraction measurement system, sets the measurement object OB on the stage movement device 60, and inputs the XY direction position or the movement direction in the X-axis direction or the movement direction in the Y-axis direction from the input device 92 to move the stage St so that the X-ray irradiation point (irradiation point of laser light) is approximately at the intended position. Next, the operator inputs the intended irradiation point-imaging surface distance and X-ray incidence angle. At this time, it is also possible to set only the irradiation point-imaging surface distance and leave the X-ray incidence angle at a preset reference value. When the input is made, the controller 91 calculates the movement position of the camera CA from a relationship table stored in advance and outputs it to the feed motor control circuit 73, and the camera CA is at the set position. Next, the operator inputs a command to adjust the position and attitude from the input device 92. As a result, the controller 91 outputs a command to the laser drive circuit 85 and the sensor signal extraction circuit 87, and the measurement object OB is irradiated with visible laser light, and the captured image and a cross mark are displayed on the display device 93. The operator operates the arm-type moving device to adjust the position and attitude of the X-ray diffraction measurement device 1 so that the X-ray irradiation point (the irradiation point of the laser light) is in the intended position (the starting position of the planar oscillation) and so that the irradiation point and the light receiving point match the cross mark on the captured image.

At this time, if only the distance between the irradiation point and the imaging surface is set and the X-ray incidence angle is left at the preset reference value Θs, the visible laser light is irradiated according to the set value, and if the normal of the measurement object OB is included in the reference plane, the irradiation point and the light receiving point will appear in the center of the captured image. This is because, as shown in FIG. 4, the reference value Θs of the X-ray incidence angle is set to half the angle at which the optical axis of the imaging lens of the camera CA intersects with the optical axis of the emitted X-ray, so if the visible laser light is irradiated according to the set value and the normal of the measurement object OB is included in the reference plane, the reflected light from the measurement object OB will coincide with the optical axis of the imaging lens. Therefore, the cross mark of the captured image that matches the irradiation point and the light receiving point will be the same as the cross line that divides the captured image into four equal parts. In contrast, if both the distance between the irradiation point and the imaging surface and the X-ray incidence angle are set, the visible laser light is irradiated according to the set value, and if the normal of the measurement object OB is included in the reference plane, the irradiation point and the light receiving point will appear in a position shifted from the center of the captured image. This is because, as shown in Figure 5, if the X-ray incidence angle Θ1 is set to a value other than the reference value Θs, visible laser light is emitted according to the set value, and even if the normal of the measurement object OB is included in the reference plane, the reflected light from the measurement object OB does not coincide with the optical axis of the imaging lens. Therefore, the cross mark for matching the irradiation point and the light receiving point in the captured image is displayed separately from the cross lines that divide the image into four equal parts.

When the adjustment of the position and attitude of the X-ray diffraction measurement device 1 is completed, the operator inputs a command to end the position and attitude adjustment from the input device 92, ends the laser light irradiation and the display of the captured image by the camera CA, and then inputs the conditions for the planar oscillation. First, the operator inputs the direction of the planar oscillation (X-axis direction or Y-axis direction in FIG. 2) and the speed of the planar oscillation, and inputs what conditions to include as conditions for irradiating X-rays during the planar oscillation in addition to the distance between the irradiation point and the imaging surface (the position of the irradiation point on the captured image). The conditions to be input include the direction of incidence of the X-rays (the position of the light receiving point on the captured image) and the areas of the irradiation point and the light receiving point. The direction of incidence of the X-rays is the combination of the X-ray incidence angle and the deviation angle of the normal of the object OB from the reference plane. The operator determines and inputs the conditions to be included based on the surface condition of the object OB, the required measurement accuracy, and the time required for measurement. Next, if the operator wants to make the movement speed during the planar oscillation faster when X-ray irradiation is stopped than during X-ray irradiation, he or she also inputs the movement speed. Next, the operator inputs the upper limit of the travel distance during planar oscillation. This is to prevent the travel distance due to planar oscillation from exceeding the upper limit of the length of the object to be measured OB before the X-ray exposure time reaches the X-ray exposure time for imaging the diffraction ring that is set in advance.

Next, the operator inputs a command to start measurement from the input device 92. As a result, the controller 91 rotates the spindle motor 27 at a low speed, sets the imaging plate 15 to a rotation angle of 0, and then starts the program of the flow shown in FIG. 6 and the program of the flow shown in FIG. 7. In addition, a program for detecting the irradiation point position, the light receiving point position, and the area of the irradiation point and the light receiving point is started every time photographed image data is input. The following will be explained along the flow shown in FIG. 6. When a command to start measurement is input from the input device 92, the controller 91 starts the program in step S1, and in step S2, sets n, which is a number that distinguishes between X-ray emission and X-ray emission stop, to 1. n means that 0 is X-ray emission, and 1 means that X-ray emission is stopped. Next, in step S3, the integrated time A, which is the X-ray irradiation time, is reset to 0, and in step S4, the moving position T1 output by the circuit corresponding to the moving direction of the planar oscillation among the position detection circuits 68 and 70 is taken into memory. Next, in step S5, a movement command and a movement speed are output to one of the feed motor control circuits 67 and 69, which corresponds to the movement direction of the planar oscillation. The movement speed at this time is the movement speed during X-ray irradiation, which is smaller than the movement speed during X-ray irradiation stop. As a result, the stage St starts moving at the movement speed set in the movement direction previously set by the input from the input device 92. Next, in step S6, a command is output to the laser drive circuit 85 to start laser light irradiation, and in step S7, a command is output to the sensor signal extraction circuit 87 to start outputting the photographed image data of the camera CA to the controller 91. As described above, the controller 91 starts a program for detecting the irradiation point position, the light receiving point position, and the area of the irradiation point and the light receiving point each time the photographed image data is input, so that the data of the irradiation point position, the light receiving point position, and the area of the irradiation point and the light receiving point are obtained at approximately the same timing as the photographed image data of the camera CA is input. Steps S8 to S12 are a flow for waiting until captured image data is input, and while waiting, it is also determined whether the X-ray exposure time and travel distance exceed the upper limit. This determination will be described later. When captured image data is input, step S8 determines YES and proceeds to step S13, and in steps S13 to S17, it is determined whether the acquired values of the irradiation point position, light receiving point position, and area of the irradiation point and light receiving point are within the allowable range.

However, as described above, the condition for irradiating X-rays requires the distance between the irradiation point and the imaging surface (the position of the irradiation point on the photographed image), but the direction of incidence of X-rays (the position of the light receiving point on the photographed image) and the area of the irradiation point and the light receiving point can be selected to be included in the condition. Therefore, except for determining whether the irradiation point position is within the allowable range in step S13, the determination is made after determining whether it is included in the condition. If all are within the allowable range, the processing of steps S18 to S23 is performed, and if any one is outside the allowable range, the processing of steps S24 to S29 is performed. Steps S18 to S23 are processes for emitting X-rays. As described above, n is a value that distinguishes between X-ray emission and X-ray emission stop with 0 and 1, and is 0 when the program starts, so YES is determined in step S18 and the program proceeds to step S19. In step S19, a command is output to the X-ray control circuit 71, X-rays are irradiated to the measurement object OB, and a diffraction ring begins to be imaged on the imaging plate 15. Next, in step S20, measurement of the accumulated time A, which is the X-ray exposure time, is started, and in steps S21 and S22, if the measurement conditions were previously input to make the movement speed during X-ray irradiation stop greater than the movement speed during X-ray irradiation, the low movement speed, which is the movement speed during X-ray irradiation, is output to the feed motor control circuit 67 or 69. However, since the movement speed is low at the time the program starts, the movement speed does not change. Next, in step S23, n, which distinguishes between X-ray emission and X-ray emission stop, is set to 0 (X-ray emission in progress) and the process returns to step S8. After this, even if it is determined that all are within the allowable range in the processes of steps S13 to S17, if n is 0, it is determined as No in step S18 and the process returns to step S8, so that the processes initially performed in steps S18 to S23, such as X-ray irradiation, measurement of accumulated time A, and movement at low speed, continue as they are.

If any of the following conditions is outside the allowable range in the processing of steps S18 to S23, the processing of steps S24 to S29 is performed. However, since n, which distinguishes between X-ray emission and X-ray emission stopped, is 1 (X-ray emission stopped) at the start of the program, if any of the following conditions is outside the allowable range at the start of the program, the result of step S24 is No and the program returns to step S8, so the initial state continues as it is. Then, since all conditions are within the allowable range in the processing of steps S13 to S17 and n is 0 (X-ray emission in progress) after the processing of steps S18 to S23 is performed, the result of step S24 is YES and the processing of steps S25 to S29 is performed. This process is a process of stopping X-ray irradiation, stopping the measurement of the integrated time A, switching to a high-speed movement speed, and setting n to 1 (X-ray emission stopped). If any of the processes in steps S18 to S23 are out of the allowable range, the process returns to step S8 after that, and this state continues. If all of the processes in steps S13 to S17 are within the allowable range, the process switches to X-ray irradiation, measurement of the integrated time A, and a low-speed movement speed as described above in the processes in steps S18 to S23. In this way, in the processes in steps S13 to S17, switching is performed between X-ray irradiation, measurement of the integrated time A, and low-speed movement and stopping X-ray irradiation, stopping measurement of the integrated time A, and high-speed movement depending on whether the irradiation point position on the captured image, the light-receiving point position on the captured image, and the areas of the irradiation point and the light-receiving point are all within the allowable range. As mentioned above, you can select whether or not to include the position of the light receiving point on the captured image, the area of the irradiation point and the light receiving point, and the switching of the movement speed as conditions for X-ray irradiation.

To visually show the processing of steps S13 to S29, as shown in the captured images of Figures 4 and 5, X-rays are irradiated onto the measurement object OB when the irradiation point P is inside the tolerance frame LMP, the light-receiving point P is inside the tolerance frame LMR, and there are no large chips at the irradiation point P and the light-receiving point P. If the irradiation point P is outside the tolerance frame LMP, the light-receiving point R is outside the tolerance frame LMR, or there are large chips at the irradiation point P and the light-receiving point P, the measurement object OB is not irradiated with X-rays. This means that X-rays are not irradiated onto the measurement object OB if the distance between the irradiation point and the imaging surface is outside the tolerance range, if the X-ray incidence angle or the deviation of the normal of the measurement object OB at the X-ray irradiation point from the reference plane is outside the tolerance range, or if the X-ray irradiation point falls on a location with a step. As a result, when the distance between the irradiation point and the imaging surface and the X-ray incidence angle are approximately constant, the deviation of the normal of the object to be measured OB at the X-ray irradiation point from the reference plane is within an allowable range, and the area of the X-ray irradiation point is almost flat, a diffraction ring is imaged on the imaging plate 15. As mentioned above, it is possible to select whether or not to include the conditions of the position of the light receiving point R and the areas of the irradiation point P and the light receiving point R.

As shown in Figures 4 and 5, there is a difference in size between the irradiation point P and the light receiving point R. This difference is due to the difference between the case where scattered light generated at the irradiation point enters the imaging lens of the camera CA and is imaged by the imager, and the case where reflected light from the irradiation point enters the imaging lens, is collected in front of the imager, and is then received slightly diffused. Therefore, if the size of the irradiation point P and the light receiving point R for each irradiation point-imaging surface distance is stored in the memory of the controller 91, and the setting value of the irradiation point-imaging surface distance is input from the input device 92 before measurement, the controller 91 can identify and detect the position of the bright part in the captured image by the irradiation point P and the light receiving point R. Note that when the difference in size between the irradiation point P and the light receiving point R is small, the emitted laser light can be slightly diffused or converged from parallel light at the stage of manufacturing the laser emitter 40 so that a clear difference in size occurs between the irradiation point P and the light receiving point R.

In addition, as can be seen by considering the case where the distance between the irradiation point and the imaging surface is reduced in Figures 4 and 5, when the distance between the irradiation point and the imaging surface is reduced, the tip of the fixed block 107 moves closer to the center of the imaging plate 15, and the fixed block 107 prevents the imaging plate 15 from receiving the diffracted X-rays, resulting in a portion of the diffraction ring imaged on the imaging plate 15 being missing. However, if the width of the laser detection device 30 and the fixed block 107 in the X-axis direction in Figure 2 is reduced, this missing is small and has almost no effect on the measurement accuracy of the residual stress obtained as a measurement result.

When the controller 91 repeats the process of steps S8 to S29, X-rays are intermittently irradiated onto the measurement object OB, and the accumulated time A, which is the X-ray irradiation time, increases in value. Then, when it reaches the upper limit value set in advance, it is judged as YES in step S9 and goes to step S31, and in the process of steps S31 to S34, the X-ray irradiation, the laser light irradiation, the image signal output of the camera CA, and the movement of the stage St are stopped, and the program ends in step S35. Even if the accumulated time A does not reach the upper limit value, when the movement distance of the stage St reaches the upper limit value set before the measurement, the difference |T2-T1| between the movement position T1 captured in step S4 and the movement position T2 captured in step S10 reaches the upper limit value, so it is judged as YES in step S11, and "measurement impossible" is displayed on the display device 93 in step S30, and it goes to step S31. Then, in steps S31 to S34, the same process as the above-mentioned process is performed, and the program ends in step S35. Furthermore, if the operator inputs "stop measurement" from the input device 92 during measurement, step S12 is judged as YES and the program proceeds to step S31, where the same processing as described above is performed in steps S31 to S34, and the program ends in step S35.

The controller 91 starts the program of the flow shown in FIG. 7 at the same time as the program of the flow shown in FIG. 6. The program of the flow shown in FIG. 7 is a program that displays the percentage of time during which X-ray irradiation is performed from the start of measurement, the estimated movement distance until the end of X-ray irradiation (end of imaging of the diffraction ring), and the current movement distance on the display device 93, and displays a warning if the estimated movement distance exceeds the upper limit of the movement distance. The following will be explained along the flow shown in FIG. 7. When a command to start measurement is input from the input device 92, the controller 91 starts the program in step S51, and in step S52, sets m, which means the number of times to calculate and judge the numerical values described later, to 1. Next, in step S53, the integrated time B, which is the measurement time, is reset to 0, and in step S54, the measurement of the integrated time B is started and the time is displayed on the display device 93. Next, by repeating the judgment of No in step S55, the system waits until the accumulated time B reaches ΔT, and when the accumulated time B reaches ΔT, the system proceeds to step S56, where the ratio of time during which X-rays are emitted (accumulated time A/accumulated time B) is calculated and displayed on the display device 93. Next, in step S57, an estimated moving distance is calculated by (low moving speed x accumulated time A + high moving speed x accumulated time B) and displayed on the display device 93. Next, in step S58, it is determined whether the estimated moving distance exceeds the upper limit of the moving distance, and if it does not exceed the upper limit, the system judges YES and proceeds to step S60, and if it does exceed the upper limit, the system judges No and displays a warning on the display device 93 indicating that the upper limit of the moving distance is exceeded in step S59, and proceeds to step S60. When the operator confirms that the warning display has been issued on the display device 93, he or she selects and implements an appropriate response. The response method is either to continue the measurement and see if the ratio of time during which X-rays are emitted improves, or to input "stop measurement" from the input device 92 to stop the measurement. This makes it possible to stop the measurement earlier than when the movement distance exceeds the upper limit in step S11 of the program in the flow of FIG. 6 and the answer is YES, the display device 93 displays "measurement impossible" and the measurement is stopped.

Next, in step S60, the controller 91 displays the difference between the moving position T2 and the moving position T1, which is the current moving distance, on the display device 93. Next, in step S61, it is determined that the accumulated time A has not reached the upper limit, in step S62, it is determined that the current moving distance has not reached the upper limit, in step S63, it is determined that "stop measurement" has not been input, and in step S64, m is incremented and the process returns to step S55. Therefore, by the processing of steps S56 to S64, the display device 93 displays the percentage of time during which X-rays are being emitted, the estimated moving distance until the end of X-ray irradiation, and the current moving distance, and if the estimated moving distance exceeds the upper limit of the moving distance, a warning is also displayed. When returning to step S55, it waits until the accumulated time B becomes 2ΔT, goes to step S56, and the same processing as the processing described above is performed in steps S56 to S64, and returns to step S55. Next, it waits until the accumulated time B becomes 3ΔT, and the same processing as the processing described above is performed. In this way, each time ΔT of accumulated time B elapses (ΔT, 2ΔT, 3ΔT, ...), the display device 93 displays the percentage of time during which X-rays are being emitted, the estimated distance traveled until the end of X-ray irradiation, and the current distance traveled, and if the estimated distance traveled exceeds the upper limit of the distance traveled, a warning is displayed. Then, when accumulated time A, which is the X-ray irradiation time, reaches the upper limit, or |T2-T1|, which is the current distance traveled, reaches the upper limit, or "stop measurement" is input, a YES judgment is made in any of steps S61 to S63, the program proceeds to step S65, and ends.

When the programs in the flow charts in Fig. 6 and Fig. 7 are completed, the programs for detecting the positions of the irradiation point, the light receiving point, and the areas of the irradiation point and the light receiving point each time the photographed image data is input are also completed, and the controller 91 operates another program to continue the measurement. When the integrated time A reaches the upper limit and the programs in the flow charts in Fig. 6 and Fig. 7 are completed, the diffraction ring is read, the diffraction ring is erased, and characteristic values such as residual stress are calculated. When the travel distance reaches the upper limit or when "stop measurement" is input and the program is completed, the diffraction ring is erased. The operation of each circuit of the controller 91 and the X-ray diffraction measuring device 1 in these steps is the same as that of the X-ray diffraction measuring system shown in Patent Document 2. Then, when the calculation of characteristic values such as residual stress is completed, the controller 91 displays on the display device 93 characteristic values such as residual stress, measurement conditions such as the distance between the irradiation point and the imaging surface and the X-ray incidence angle, and a map based on the diffracted X-ray intensity at each point of the diffraction ring. In addition, data on the position of the irradiation point on the captured image acquired at regular time intervals may be converted into the distance between the irradiation point and the imaging surface, and the surface profile of the measurement object OB on the line of planar oscillation may be calculated and displayed. When the measurement is completed, the operator removes the measurement object OB from the stage St, places another measurement object OB on it, and performs the same operation as described above to perform the next measurement.

Figure 8 shows the locations where X-rays are irradiated when the diffraction ring is imaged while the measurement object OB, whose surface has a complex profile, is oscillated in a plane using the above-mentioned X-ray diffraction measurement system. Figure 8 (A) shows a case where there are continuous stepped pits on the surface of the measurement object OB. In this case, the input from the input device 92 before measurement includes the area of the irradiation point and the light receiving point in addition to the position of the irradiation point in the captured image, and then the X-ray diffraction measurement is started. In this way, when the emitted X-rays (visible laser light) are applied to the stepped location as shown in Figure 8 (A), a large circular chip occurs at the irradiation point and the light receiving point in the captured image, and the area changes significantly, so the X-ray irradiation is stopped. In addition, the deviation of the irradiation point position on the captured image from the set position is large, so the X-ray irradiation is stopped for the pit portion. Therefore, the X-ray is irradiated only to the area without pits on the surface, as shown by M in the figure.

Figure 8B shows a case where the surface has a continuous triangular cross-sectional shape, such as a bolt or screw. In this case, the input from the input device 92 before the measurement includes the position of the light receiving point in addition to the position of the irradiation point in the captured image, and then the X-ray diffraction measurement is started. In this way, as shown by M in Figure 8B, in a part of the surface, the deviation of the position of the irradiation point in the captured image from the set position falls within the allowable range, and the position of the light receiving point falls within the set range, so that the X-ray is irradiated. There are also places on the right slope of the triangular cross-sectional shape where the deviation of the position of the irradiation point from the set position falls within the allowable range, but the reflected light of the laser light travels in a completely different direction, so no light receiving point occurs in the captured image, and no X-ray is irradiated. In this way, even if the measurement object OB has a complex surface profile, by setting the conditions appropriately, the distance between the irradiation point and the imaging surface and the X-ray incidence angle are approximately set values, the reference plane approximately includes the normal to the X-ray irradiation point on the measurement object OB, and the diffraction ring can be imaged by irradiating X-rays only when most of the area of the X-ray irradiation point is flat. Note that in both (A) and (B) of FIG. 8, if the moving speed of the planar oscillation is reduced when X-rays are irradiated and the moving speed of the planar oscillation is increased when X-ray irradiation is stopped, the time until diffraction ring imaging is completed can be shortened and X-ray diffraction measurement can be performed more efficiently.

As can be understood from the above description, in the above embodiment, the X-ray emitting means is composed of the X-ray tube 10 and through holes 26a, 48b, 27b, 27a1, 18a, etc., which emit X-rays toward the object to be measured OB, and the diffraction ring imaging device receives the diffracted X-rays generated at the object to be measured OB when the X-ray emitting means irradiates the object to be measured OB with X-rays, and captures a diffraction ring, which is an image of the diffracted X-rays, on the imaging plate 15. In the X-ray diffraction measurement system, which is composed of an X-ray diffraction measurement device 1 having a housing 50 in which an X-ray emitting means and a diffraction ring imaging means are arranged, and a stage moving device 60 for moving a measurement object OB in a direction approximately parallel to a surface of the measurement object OB relative to the X-ray diffraction measurement device 1, a laser emitter 40 emits a parallel visible laser beam with an optical axis equal to the optical axis of an emitted X-ray, which is an X-ray emitted toward the measurement object OB, and a half mirror that passes the emitted X-ray on the optical path of the emitted X-ray and reflects the visible laser beam is provided. -49; a camera CA having an imaging lens that forms an image of an area including the irradiation point of the laser light generated when the laser emitter 40 irradiates visible laser light, and an imager that is placed at the location where the image is formed by the imaging lens and outputs an image signal representing the formed image; an image creation means consisting of a sensor signal extraction circuit 88 that creates a photographed image from the image signal output by the imager of the camera CA and a program in the controller 91; and a control program in the controller 91 that detects the position of the irradiation point of the laser light in the photographed image created by the image creation means when the stage moving device 60 moves the measurement object OB and the X-ray emission means emits X-rays and the laser emitter 40 emits visible laser light, and causes the X-ray emission means to emit X-rays only when the deviation of the position of the irradiation point of the laser light detected from the position of the irradiation point of the laser light in the photographed image is within the allowable range when the distance from the X-ray irradiation point formed on the measurement object OB by the emitted X-rays to the imaging plate 15 is a set value.

According to this, when X-rays are irradiated toward the measurement object OB by the X-ray emitting means, the laser emitter 40 can irradiate parallel visible laser light with the same optical axis, and the irradiation point of the X-rays can be recognized as the irradiation point of the laser light regardless of the distance between the irradiation point and the imaging surface. Then, when the irradiation point of the laser light is photographed by the camera CA and an image captured by the camera CA is created by the image creation means, the irradiation point of the laser light in the captured image appears at a different position depending on the distance between the irradiation point and the imaging surface. Therefore, when the measurement object OB is moved by the stage moving device 60, the X-ray emitting means irradiates X-rays toward the measurement object OB, and the diffraction ring is imaged on the imaging plate 15 by the diffraction ring imaging means (i.e., when the diffraction ring is imaged while performing planar oscillation), the laser emitter 40 irradiates visible laser light, and when the deviation of the position of the irradiation point of the laser light in the captured image from the position of the irradiation point of the laser light in the captured image when the irradiation point-imaging surface distance is a set value is within the allowable range, the X-ray emitting means is caused to emit X-rays, so that the diffraction ring can be imaged with the irradiation point-imaging surface distance being approximately constant. The control program in the controller 91 is installed in a computer device, and in terms of hardware, no mechanism or device is required other than the X-ray diffraction measurement device 1 and the stage moving device 60 that moves the measurement object OB, so that the size and cost of the device can be suppressed.

In the above embodiment, the control program in the controller 91 adjusts the attitude of the housing 50 with respect to the object to be measured OB so that the captured image created by the image creation means consisting of the sensor signal extraction circuit 88 and the program in the controller 91 has a light receiving point, which is a point where the reflected light of the visible laser light from the object to be measured OB is collected by the imaging lens and received by the imager. The stage moving device 60 moves the object to be measured OB, and when the X-ray emission means emits X-rays and the laser emitter 40 emits visible laser light, the control program causes the X-ray emission means to emit X-rays only when the positional deviation of the irradiation point of the visible light is within an allowable range and the position of the light receiving point is within a preset range.

In this way, X-rays are irradiated and a diffraction ring is imaged only when the distance between the irradiation point and the imaging surface is approximately the set value, the X-ray incidence angle is approximately the set value, and the reference plane approximately includes the normal to the X-ray irradiation point on the measurement object OB, so accurate measurements can be performed even if the surface of the measurement object OB has continuous irregularities at short intervals.

In addition, in the above embodiment, the control program in the controller 91 causes the X-ray emission means to emit X-rays only when the deviation of the position of the irradiation point of the laser light in the captured image is within an allowable range, the position of the light receiving point is within a preset range, and the deviation of the area of the irradiation point and the area of the light receiving point in the captured image from the preset area is within an allowable range.

According to this, when the surface of the measurement object OB has a continuous stepped unevenness, such as a measurement object OB with many pits, X-ray irradiation is stopped when the X-ray irradiation point falls on a stepped part of the unevenness, so that X-rays can be irradiated and a diffraction ring imaged only when the distance between the irradiation point and the imaging surface and the X-ray incidence angle are approximately set values in most areas of the X-ray irradiation point and the reference plane approximately includes the normal to the location of the X-ray irradiation point on the measurement object OB, allowing for highly accurate measurements.

In addition, in the above embodiment, the control program in the controller 91 reduces the moving speed of the stage moving device 60 when the control program in the controller 91 causes the X-ray emission means to emit X-rays, and increases the moving speed of the stage moving device 60 when the control program in the controller 91 causes the X-ray emission means to stop emitting X-rays. The control program in the controller 91 and the feed motor control circuits 67, 69 are used to provide a movement control means.

With this, even if the surface of the object to be measured OB has a series of irregularities at short intervals, the time for which X-rays are emitted can be lengthened and the time for which X-ray emission is stopped can be shortened, thereby shortening the time required to image the diffraction ring and improving measurement efficiency.

In the above embodiment, the controller 91 includes a time measurement means for accumulating and measuring an integrated time A, which is the time during which the X-ray emission means emits X-rays, and an integrated time B, which is the time during which the control program in the controller 91 performs control; a program in the controller 91 for calculating an estimate of the distance moved by the stage movement device 60 until the integrated time A reaches its upper limit, using the integrated time A and integrated time B measured by the time measurement means, a preset upper limit of the integrated time A, and a preset moving speed of the stage movement device 60; and another program in the controller 91 for comparing the estimated distance calculated by the program in the controller 91 with a preset upper limit of the moving distance by the stage movement device 60, and displaying a warning on the display device 93 based on the comparison result.

According to this, immediately after starting to image the diffraction ring while performing planar oscillation, a program in the controller 91 calculates an estimate of the movement distance, and compares the estimate of the distance calculated by another program in the controller 91 with a preset upper limit of the movement distance. If the estimate of the movement distance exceeds the upper limit of the movement distance, a warning can be displayed on the display device 93. In other words, if the time for X-ray emission is shorter than the time for stopping emission due to a cause such as a large degree of unevenness on the surface of the measurement object OB, and it is estimated that the distance of the planar oscillation until the image of the diffraction ring is completed will exceed the upper limit of the size of the measurement object OB, a warning can be displayed on the display device 93 immediately after the measurement is started, so that if the operator stops the measurement, it is possible to avoid wasting extra time on the measurement.

Furthermore, the implementation of the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the purpose of the present invention.

In the above embodiment, the X-ray diffraction measurement device 1 changes the moving position of the camera CA according to the set values of the irradiation point-imaging surface distance and the X-ray incidence angle, as in the X-ray diffraction measurement device shown in Patent Document 2 of the prior art document, and if the visible laser light is irradiated according to the set values and the normal of the X-ray irradiation point on the measurement object OB is included in the reference plane, the irradiation point and the light receiving point of the laser light are generated in the captured image. In other words, the X-ray diffraction measurement device 1 is capable of measuring by arbitrarily setting the irradiation point-imaging surface distance and the X-ray incidence angle. However, as in the X-ray diffraction measurement device shown in Patent Document 2 of the prior art document, even if the irradiation point and the light receiving point of the laser light are generated in the captured image only when the irradiation point-imaging surface distance and the X-ray incidence angle are the reference values or a predetermined combination is used, it is possible to implement the present invention. In that case, the irradiation point-imaging surface distance and the X-ray incidence angle can be set only to the reference values, or the position of the light receiving point and the area of the light receiving point in the captured image can be excluded from the conditions.

In the above embodiment, the camera CA is attached to the fixed block 107 together with the laser detection device 30, and the moving position of the camera CA is changed by moving the fixed block 107 in the radial direction of the imaging plate 15 using the moving mechanism 100. However, the moving mechanism for the camera CA may be of any type as long as the camera CA moves so as to change its distance from the optical axis of the emitted X-rays. For example, as shown in a modified example of Patent Document 2, a moving mechanism for only the camera CA may be provided.

In addition, in the above embodiment, the conditions for X-ray irradiation in diffraction ring imaging are the position of the irradiation point in the captured image, the position of the light receiving point in the captured image, and the areas of the irradiation point and light receiving point in the captured image, and it is possible to select whether or not to include conditions other than the position of the irradiation point in the captured image. However, if the measurement object OB is limited, these conditions may be fixed. In addition, it is possible to select whether or not to change the speed of the planar oscillation during X-ray irradiation and when X-ray irradiation is stopped, but this condition may also be fixed. In addition, in the above embodiment, the areas of the irradiation point and light receiving point in the captured image are used, but it is also possible to use the area of either one of them.

In the above embodiment, the controller 91 calculates the estimated travel distance using the program of the flow in FIG. 7, and when this value is greater than the upper limit of the travel distance, a warning is displayed on the display device 93. However, various methods can be adopted as a method of dealing with the case where the travel distance is greater than the upper limit. For example, when the estimated travel distance is greater than the upper limit of the travel distance for a preset time or more, the measurement may be automatically stopped, or the measurement may be automatically stopped when it is determined from the change curve of the estimated travel distance against time that there is no possibility that the estimated travel distance will fall below the upper limit of the travel distance. Also, instead of or in addition to displaying a warning on the display device 93, an alarm sound may be generated.

In the above embodiment, the operator inputs the intended irradiation point-imaging surface distance and X-ray incidence angle from the input device 92, but as long as these values are stored in the memory of the controller 91, any method of input may be used. For example, values previously stored in the memory may be called up, or input may be made via a network line. Alternatively, when information such as the material of the measurement object OB is input, a program installed in the controller 91 may select or calculate and store the optimal irradiation point-imaging surface distance and X-ray incidence angle.

In the above embodiment, the laser emitter 40 emits visible parallel laser light on the same optical axis as the emitted X-rays, but the emitted light does not have to be laser light as long as the visible parallel light can be emitted on the same optical axis as the emitted X-rays. For example, the light may be from an SLD (super luminescent diode) light source, or LED light may be converted into parallel light and emitted.

In the above embodiment, the X-ray diffraction measurement device 1 is an apparatus that images a diffraction ring on the imaging plate 15 and detects the shape of the diffraction ring by irradiating a laser from the laser detection device 30 and detecting the intensity of the light. However, the present invention can be realized with any X-ray diffraction measurement device that can image a diffraction ring and detect the shape of the imaged diffraction ring. For example, as in Patent Document 3, the present invention can be realized with an X-ray diffraction measurement device that has a solid-state imaging element having a flat surface with the same area as the imaging plate 15 and detects the intensity distribution of diffracted X-rays in the diffraction ring by the electrical signal output from each pixel of the solid-state imaging element when irradiating X-rays from the X-ray tube 10. The present invention can also be realized with an X-ray diffraction measurement device that scans while detecting the position with a micro-sized solid-state imaging element, and detects the intensity distribution of diffracted X-rays in the diffraction ring from the electrical signal output from each pixel of the solid-state imaging element and the scanning position of the solid-state imaging element. The present invention can also be realized with an X-ray diffraction measurement device that uses a scintillation counter that detects the fluorescence emitted from a scintillator with a photomultiplier tube (PMT) instead of a solid-state imaging element. In addition, the phrase "imaging the diffraction ring" in the claims includes cases where the diffracted X-ray intensity is detected at each position on the surface where the diffraction ring is formed, such as with a solid-state imaging device or a scintillation counter.

In the above embodiment, the X-ray diffraction measurement device 1 is a device that can image the diffraction ring and detect the shape of the imaged diffraction ring. However, the present invention can also be realized with an X-ray diffraction measurement device that only images the diffraction ring on the imaging plate 15. In such a device, the diffraction ring is read by removing the imaging plate 15 or table 16 from the X-ray diffraction measurement device 1 and using a separate device.

In the above embodiment, the planar oscillation is performed by changing the XY-direction position of the measurement object OB relative to the X-ray diffraction measurement device 1 using the stage movement device 60. However, instead of this, the stage movement device 60 may be eliminated, and a device may be provided that moves the X-ray diffraction measurement device 1 in the XY directions, and the XY-direction position of the measurement object OB may be changed relative to the X-ray diffraction measurement device 1 using this device.

1...X-ray diffraction measurement device, 10...X-ray tube, 11...exit port, 15...imaging plate, 15a, 16a, 17a, 18a, 21a, 26a, 27a1, 27b, 28a...through hole, 16...table, 17...protrusion, 18...fixing device, 26...plate-shaped plate, 27...spindle motor, 28...passage member, 30...laser detection device, 40...laser emitter, 41 ...frame, 42...laser light source, 43...disc-shaped block, 44...cylindrical block, 45...collimating lens, 46...lens frame, 47-1, 47-2...belt, 48...triangular block, 49...half mirror, 50...housing, 50a...first bottom wall, 50c...second bottom wall, 50b...front wall, connecting wall...50d, 50e...rear wall, 50f...top wall, top inclination Wall...50g, 50h...bottom inclined wall, 50c1...circular hole, 50h1...long hole, 51...tip of arm-type moving device, 60...stage moving device, 61...frame, 62...feed motor, 63...screw rod, 64...bearing, 65...frame, 66...feed motor, 90...computer device, 91...controller, 92...input device, 93...display device, 95...high voltage power supply, 100...moving mechanism, 101...moving stage, 102...feed motor, 103...screw rod, 104...bearing, 105...guide, 106...connecting block, 107...fixed block, 108...protruding portion, 109, 110...block, 111...motor fixing block, 112...block, OB...measurement object, CA...camera, St...stage

Claims (5)

An X-ray emission means for emitting X-rays toward a target object to be measured;
a diffraction ring imaging means for receiving diffracted X-rays generated at the object to be measured when X-rays are irradiated toward the object to be measured by the X-ray emitting means, on an imaging plane perpendicular to an optical axis of the X-rays emitted by the X-ray emitting means, and imaging a diffraction ring, which is an image of the diffracted X-rays, on the imaging plane;
an X-ray diffraction measurement system including an X-ray diffraction measurement device having a housing in which the X-ray emission means and the diffraction ring imaging means are disposed, and a moving device that moves the measurement object in a direction approximately parallel to a surface of the measurement object relative to the X-ray diffraction measurement device,
a visible light emitting means for emitting visible light having an optical axis coaxial with an optical axis of an emitted X-ray, which is an X-ray emitted toward the measurement object, the visible light emitting means including a half mirror for passing the emitted X-ray on an optical path of the emitted X-ray and reflecting the visible light;
a camera including an imaging lens that forms an image of an area including an irradiation point of visible light generated when the visible light output means emits visible light, and an imager that is disposed at a position where an image is formed by the imaging lens and outputs an image signal representing the formed image;
an image creation means for creating a photographed image from an image pickup signal output by an image pickup device of the camera;
and X-ray emission control means for detecting a position of a visible light irradiation point in a captured image created by the image creation means while the object to be measured is moved by the moving device and the X-ray emission means is emitting X-rays and the visible light emission means is emitting visible light, and causing the X-ray emission means to emit X-rays only when a deviation of the detected position of the visible light irradiation point from the position of the visible light irradiation point in the captured image when a distance from the X-ray irradiation point formed on the object to be measured by the emitted X-rays to the imaging surface is a set value. 2. The X-ray diffraction measurement system according to claim 1,
the X-ray emission control means adjusts an attitude of the housing with respect to the object to be measured so that a captured image created by the image creation means has a light receiving point, which is a point where the visible light reflected from the object to be measured is focused by the imaging lens and received by the image capture device; the X-ray emission control means moves the object to be measured by the moving device, and when the X-ray emission means is emitting X-rays and the visible light emission means is emitting visible light, detects the position of the light receiving point in the captured image, and causes the X-ray emission means to emit X-rays only when a deviation in the position of the irradiation point of the visible light is within an allowable range and the position of the light receiving point is within a predetermined range. 3. The X-ray diffraction measurement system according to claim 2,
The X-ray diffraction measurement system is characterized in that the X-ray emission control means causes the X-ray emission means to emit X-rays only when the deviation of the position of the irradiation point in the captured image is within an allowable range, the position of the light receiving point is within a predetermined range, and in addition, the deviation of at least one of the area of the irradiation point and the area of the light receiving point in the captured image from a predetermined area is within an allowable range. 4. The X-ray diffraction measurement system according to claim 1,
and movement control means for decreasing a movement speed of the movement device when the X-ray extraction control means causes the X-ray extraction means to emit X-rays, and for increasing the movement speed of the movement device when the X-ray extraction control means causes the X-ray extraction means to stop emitting X-rays. 5. The X-ray diffraction measurement system according to claim 1,
a time measurement means for measuring, by integration, an emission time during which the X-ray emission means is emitting X-rays and a control time during which the X-ray emission control means is performing control;
an estimated movement distance calculation means for calculating an estimated value of a distance moved by the moving device until the emission time reaches an upper limit value, using the emission time and control time measured by the time measurement means, a preset upper limit value of the emission time, and a preset moving speed of the moving device;
and a comparison means for comparing the estimated distance calculated by the estimated movement distance calculation means with a preset upper limit value of the movement distance by the movement device, and for stopping the measurement when the estimated value is greater than the upper limit value .

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