JP7700231B2 - Optical multiplex communication device, working machine, and communication method - Google Patents

Description

The present disclosure relates to an optical multiplex communication device that performs multiplex communication using optical signals, a work machine equipped with the optical multiplex communication device, and a communication method.

Conventionally, work machines that perform multiplex communication using optical signals have been proposed. For example, the electronic component mounting device of Patent Document 1 performs multiplex communication using optical signals between an optical multiplexing device provided in a mounting head and an optical multiplexing device provided in a controller that controls the operation of the mounting head. The optical multiplexing device of Patent Document 1 is connected to the opposing optical multiplexing device via multiple transmission paths. When a communication abnormality occurs in any of the multiple transmission paths, the optical multiplexing device performs communication according to the total communication speed of the remaining normal transmission paths.

International Publication No. WO2015/019393

However, for example, if there is one transmission line connecting two optical multiplexing devices, if a communication abnormality occurs in that transmission line, it becomes difficult to perform alternative processing such as sending data through another transmission line. In addition, it becomes difficult to obtain information to confirm what kind of abnormality has occurred in the optical multiplexing device of the communication partner.

The present disclosure has been made in consideration of the above-mentioned problems, and aims to provide an optical multiplexing communication device, a work machine, and a communication method that can transmit abnormal data related to a communication abnormality to a communication partner device when a communication abnormality occurs in a communication path using an optical signal.

In order to solve the above problems, this specification discloses an optical multiplex communication device comprising: a transmitting module that transmits transmission data by multiplex communication using optical signals; a receiving module that receives reception data by the multiplex communication; and a communication control unit that controls the transmitting module to perform abnormality optical communication when a communication abnormality occurs in the multiplex communication, by controlling on/off of the optical signal output from the transmitting module, so that abnormality data related to the communication abnormality is transmitted from the transmitting module as data represented by the on/off of the optical signal, and controls the transmitting module so that a first time from the time the communication abnormality is detected to the time the transmission of the abnormal data starts in the abnormality optical communication is longer than a second time from the time the communication abnormality is detected to the time a communication partner device that transmits the abnormal data from the transmitting module starts receiving processing of the abnormal data in the abnormality optical communication.
Furthermore, the contents of the present disclosure are not limited to implementation as an optical multiplex communication device, but may also be usefully implemented as a work machine equipped with an optical multiplex communication device and as a communication method.

According to the optical multiplexing communication device, work machine, and communication method disclosed herein, when a communication abnormality occurs in a communication path using an optical signal, abnormality data related to the communication abnormality can be transmitted to the communication partner device.

FIG. 2 is a perspective view showing a schematic configuration of a component mounting machine and a loader according to the embodiment; FIG. 1 is a block diagram of a multiplex communication system. 4 is a block diagram showing a connection configuration between a fixed portion substrate and a head substrate. FIG. 2 is a diagram showing a connection configuration of an FPGA, a transmission module, and a reception module on a head substrate. FIG. FIG. 4 is a diagram showing a data structure of log data. 6 is a flowchart showing a process after the start-up of the component mounting machine.

Hereinafter, a component mounting machine 20, which is one embodiment of a work machine equipped with an optical multiplexing communication device according to the present disclosure, will be described with reference to the drawings. FIG. 1 is a perspective view showing a schematic configuration of the component mounting machine 20 and the loader 13. In the following description, the direction in which the component mounting machine 20 in FIG. 1 transports the board 17 is referred to as the X direction (left-right direction), the direction perpendicular to the X direction and parallel to the board plane of the board 17 is referred to as the Y direction (front-back direction), and the direction perpendicular to the X direction and the Y direction is referred to as the Z direction (up-down direction).

The component mounting machine 20 is provided, for example, in a production line (not shown) in which multiple component mounting machines 20 are connected in the X direction, and transports the board 17 from left to right. This production line, for example, performs mounting of electronic components on the transported board 17 by the multiple component mounting machines 20. As shown in Figure 1, the component mounting machine 20 includes a base 21 and a module 22. The base 21 is fixed to the base of an adjacent component mounting machine (not shown).

The module 22 is a device that mounts electronic components on the board 17, and is placed on the base 21. The module 22 includes a board transport device 23, a feeder table 24, a mounting head 25, and a head moving mechanism 27. The board transport device 23 is provided in the module 22, and transports the board 17 in the X direction in each of the two lanes. The feeder table 24 is provided on the front side of the module 22, and includes a plurality of slots (not shown) arranged in the X direction. A feeder 29 (e.g., a tape feeder) that supplies electronic components is mounted in each slot of the feeder table 24. In addition, a touch panel 26 (see FIG. 2) and a device lamp 28 (see FIG. 2) that inputs operations to the component mounting machine 20 are provided on the upper cover (not shown) of the module 22. FIG. 1 shows a state in which the upper cover, the touch panel 26, and the device lamp 28 are removed.

The mounting head 25 has a holding member 25A that holds the electronic components supplied from the feeder 29. For example, the holding member 25A may be a suction nozzle that is supplied with negative pressure to hold the electronic components, or a chuck that grips and holds the electronic components. The mounting head 25 has, for example, a plurality of servo motors 75 (see FIG. 2) as a driving source that changes the overall position of the plurality of holding members 25A or the position of each of the holding members 25A. For example, the mounting head 25 rotates a holder that holds the plurality of holding members 25A based on the drive of the servo motor 75, rotates each of the plurality of holding members 25A around an axis along the Z direction, or raises and lowers the holding members 25A in the vertical direction. The mounting head 25 mounts the electronic components held by the holding members 25A on the board 17.

In addition, the head movement mechanism 27 moves the mounting head 25 to any position in the X and Y directions in the upper portion of the module 22. More specifically, the head movement mechanism 27 includes an X-axis slide mechanism 27A that moves the mounting head 25 in the X direction, and a Y-axis slide mechanism 27B that moves the mounting head 25 in the Y direction. The X-axis slide mechanism 27A is attached to the Y-axis slide mechanism 27B.

The X-axis slide mechanism 27A also includes a slave 61 (see FIG. 2) that is connected to an industrial network, for example. The industrial network here is, for example, EtherCAT (registered trademark). Note that the industrial network of the present disclosure is not limited to EtherCAT (registered trademark), and other networks (communication standards) such as MECHATROLINK (registered trademark)-III and Profinet (registered trademark) can be used. The slave 61 is connected to various elements such as relays and sensors provided in the X-axis slide mechanism 27A, and processes signals input and output by the various elements based on control data received from the device main body 41 (see FIG. 2) via multiplex communication described later.

The Y-axis slide mechanism 27B has a linear motor (not shown) as a drive source. The X-axis slide mechanism 27A moves to any position in the Y direction based on the drive of the linear motor of the Y-axis slide mechanism 27B. In addition, the X-axis slide mechanism 27A has a linear motor 77 (see FIG. 2) as a drive source. The mounting head 25 is attached to the X-axis slide mechanism 27A and moves to any position in the X direction based on the drive of the linear motor 77 of the X-axis slide mechanism 27A. Therefore, the mounting head 25 moves to any position in the X and Y directions within the module 22 in conjunction with the drive of the X-axis slide mechanism 27A and the Y-axis slide mechanism 27B.

The mounting head 25 is attached to the X-axis slide mechanism 27A via a connector and can be attached and detached with a single touch, allowing the mounting head 25 to be changed to one with different performance and functions. Therefore, the mounting head 25 is detachable from the component mounting machine 20. A mark camera 69 (see FIG. 2) for photographing the board 17 is fixed to the X-axis slide mechanism 27A in a downward facing state. The mark camera 69 can photograph any position of the board 17 from above as the head moving mechanism 27 moves. Image data photographed by the mark camera 69 is transmitted from the X-axis slide mechanism 27A to the device main body 41 by multiplex communication described later, and is image-processed by the image processing board 87 (see FIG. 2) of the device main body 41. The image processing board 87 acquires information about the board 17 (such as marks), mounting position errors, etc., through image processing.

The mounting head 25 also includes a slave 62 (see FIG. 2) connected to the above-mentioned industrial network. The slave 62 is connected to various elements such as relays and sensors provided in the mounting head 25. The slave 62 processes signals input and output by various elements based on control data received from the device main body 41 (see FIG. 2) via multiplex communication described below. The mounting head 25 also includes an IPS camera 71 that captures an image of an electronic component held by the holding member 25A. The IPS camera 71 is a side camera that captures an image of an electronic component held by the holding member 25A of the mounting head 25 from the side. Image data captured by the IPS camera 71 is transmitted from the mounting head 25 to the device main body 41 via multiplex communication, and is image-processed in the image processing board 87 (see FIG. 2) of the device main body 41. The image processing board 87 acquires errors in the holding position of the electronic component in the holding member 25A through image processing. The IPS camera 71 may be a bottom camera that captures an image of the electronic component held by the holding member 25A from below.

The mounting head 25 is also provided with a headlamp 25B. The headlamp 25B is, for example, an LED, and is provided in a position that is visible from outside the component mounting machine 20 when the mounting head 25 is attached to the X-axis slide mechanism 27A. The headlamp 25B blinks depending on the operating state of the mounting head 25. In particular, the headlamp 25B in this embodiment turns on or off in conjunction with the on/off of an optical signal in the abnormality optical communication described below. It should be noted that the headlamp 25B is not limited to an LED, and may be another light-emitting device such as a halogen lamp.

In addition, in the component mounting machine 20 of this embodiment, the feeder 29 is automatically replaced by the loader 13 moving on the production line. As shown in FIG. 1, an upper guide rail 31 and a lower guide rail 33 extending in the X-axis direction, a rack gear 35, and a non-contact power supply coil 37 are provided on the front side of the base 21. Each of the upper guide rail 31, the lower guide rail 33, and the rack gear 35 is connected to the upper guide rail 31, etc. of an adjacent component mounting machine (not shown). The non-contact power supply coil 37 supplies power to the loader 13.

The loader 13 has a gripper (not shown) that clamps the feeder 29, and rollers that are inserted into the upper guide rail 31 and the lower guide rail 33, and moves in the X-axis direction by rotating a gear that meshes with the rack gear 35 based on the drive of the motor. The loader 13 receives power from a non-contact power supply coil 37 to drive the motor. As shown in FIG. 2, the device main body 41 of the component mounting machine 20 is connected to a host computer that manages the production line. Based on the control of this host computer, the loader 13 replenishes and collects the feeders 29 for the multiple component mounting machines 20 lined up on the production line. The component mounting machine 20 may be configured so that the user can manually replace the feeders 29.

Next, the multiplex communication system equipped in the component mounting machine 20 will be described. FIG. 2 is a block diagram showing the configuration of the multiplex communication system applied to the component mounting machine 20. FIG. 3 is a block diagram showing the connection configuration between the fixed part substrate 45 and the head substrate 97 described later. In order to make the explanation of the optical multiplex communication device of the present application easier to understand, FIG. 3 omits illustrations of the X-axis slide mechanism 27A described later, the device on the fixed part substrate 45 side that performs multiplex communication with the X-axis slide mechanism 27A (such as the receiving module 93B), the servo amplifier 83 of the device main body 41, and the like.

As shown in FIG. 1, the component mounting machine 20 includes an apparatus main body 41 and a fixed part board 45 in a module 22. The apparatus main body 41 and the fixed part board 45 are provided in the module 22 below the board transport device 23. As shown in FIG. 2, in the component mounting machine 20 of this embodiment, data transmission between the fixed part board 45 fixed in the module 22 and the movable part (X-axis slide mechanism 27A and mounting head 25) that moves within the module 22 is performed by optical communication (multiplex communication) via optical fiber cables 81, 82.

The device main body 41 has a servo amplifier 83, a device control main board 85, and an image processing board 87. The fixed part board 45 has an FPGA (Field Programmable Gate Array) 91, a memory device 92, transmission modules 93A and 94A, and reception modules 93B and 94B. The X-axis slide mechanism 27A has an X-axis board 95, a slave 61, a mark camera 69, a linear motor 77, and a linear scale 78. The mounting head 25 has a head board 97, a slave 62, an IPS camera 71, a servo motor 75, and an encoder 76.

In the component mounting machine 20 of this embodiment, various data of the devices of the mounting head 25 and the X-axis slide mechanism 27A are transmitted and received by multiplex communication using optical signals. The various data here are, for example, the linear scale signal (control signal and scale value) of the linear scale 78 of the X-axis slide mechanism 27A and the encoder signal (control signal and encoder value) of the encoder 76 of the mounting head 25. The various data are, for example, image data of the mark camera 69 and the IPS camera 71. The various data are control data of the slave 61 of the X-axis slide mechanism 27A and the slave 62 of the mounting head 25. The data to be multiplexed is not limited to these data, and various data transmitted and received by the component mounting machine 20 can be used.

The FPGA 91 on the fixed part board 45 multiplexes data input from the servo amplifier 83, device control main board 85, and image processing board 87 of the device main body 41. For example, at startup, the FPGA 91 reads configuration information CF1 from the storage device 92 and constructs a logic circuit that performs multiplexing processing. Similarly, configuration information CF2 is stored in the storage device 105 of the X-axis board 95 of the X-axis slide mechanism 27A. Configuration information CF3 is stored in the storage device 115 of the head board 97 of the mounting head 25.

The FPGA 91 multiplexes the input data, for example, by time division multiplexing (TDM). The FPGA 91 multiplexes various data input from the servo amplifier 83, etc., according to a fixed time (time slot) assigned to the input port, and transmits the multiplexed data to the X-axis slide mechanism 27A and the mounting head 25 via the transmission modules 93A and 94A. The FPGA 91 also separates the multiplexed data received from the X-axis slide mechanism 27A, etc.

The storage device 92 also stores log data DT1. The log data DT1 stores data for investigating the cause and circumstances of a communication anomaly related to multiplex communication. For example, when the FPGA 91 is supplied with power and constructs a logic circuit for storing logs, it starts the process of storing the log data DT1 in the storage device 92. Details of the log data DT1 will be described later.

The X-axis board 95 of the X-axis slide mechanism 27A has a transmission module 101A, a reception module 101B, an FPGA 103, and a storage device 105. The X-axis board 95 of the X-axis slide mechanism 27A and the head board 97 of the mounting head 25 have the same configuration as the fixed board 45. For this reason, in the description of the X-axis board 95 and the head board 97, the description of the same configuration as the fixed board 45 will be omitted as appropriate. The transmission module 93A and the reception module 93B of the fixed board 45 are connected to the transmission module 101A and the reception module 101B of the X-axis slide mechanism 27A via the optical fiber cable 81. The FPGA 103 multiplexes the image data of the mark camera 69, the linear scale signal of the linear scale 78, the control data of the slave 61, and the like. The configuration information CF2 and the log data DT2 are stored in the storage device 105 of the X-axis board 95, similar to the storage device 92 of the fixed board 45 described above. The FPGA 103 constructs a logic circuit based on the configuration information CF2 of the storage device 92. The FPGA 103 also executes a process of storing the log data DT2 in the storage device 105.

Similarly, the head substrate 97 of the mounting head 25 has a transmitting module 111A, a receiving module 111B, an FPGA 113, and a storage device 115. The transmitting module 94A and the receiving module 94B of the fixed portion substrate 45 are connected to the transmitting module 111A and the receiving module 111B of the mounting head 25 via an optical fiber cable 82. The FPGA 113 multiplexes image data from the IPS camera 71 of the mounting head 25, the encoder signal from the encoder 76, the control data of the slave 62, and the like. The FPGA 113 also constructs a logic circuit based on the configuration information CF3 stored in the storage device 115. The FPGA 113 also executes a process of storing the log data DT3 in the storage device 115.

FPGAs 91, 103, and 113 are examples of the communication control unit of the present disclosure. The communication control unit of the present disclosure is not limited to an FPGA, and may be, for example, another programmable logic device such as a programmable logic device (PLD) or a composite programmable logic device (CPLD). The communication control unit is not limited to a programmable logic device, and may be, for example, an application specific integrated circuit (ASIC) specialized for processing communication data. The communication control unit may be configured to execute a program in a CPU and perform multiplexing processing, etc., through software processing. The communication control unit may be configured to combine a programmable logic device, an ASIC, and software processing.

The storage devices 92, 105, and 115 are non-volatile memories such as EEPROMs. The storage devices 92, 105, and 115 are not limited to non-volatile memories, but may be volatile memories such as SRAMs, or may be configured to include both non-volatile and volatile memories. The storage devices are not limited to memories, but may be other storage devices such as hard disks, or may be configured to combine RAM, ROM, and hard disks.

Next, the connection configuration of the optical fiber cables 81 and 82 will be described. The connection configuration of the optical fiber cable 81 is the same as that of the optical fiber cable 82. In the following description, the optical fiber cable 82 will be mainly described, and the description of the optical fiber cable 81 will be omitted as appropriate. As shown in FIG. 3, the optical fiber cable 82 has, for example, an optical fiber line 82A for transmitting from the mounting head 25 to the fixed part substrate 45 and an optical fiber line 82B for transmitting in the opposite direction, and performs bidirectional communication. The optical fiber cable 82 has, for example, an optical fiber line 82A and an optical fiber line 82B for transmitting in the opposite direction, and has improved bending resistance by adjusting the arrangement and thickness of the optical fiber lines 82A and 82B. As a result, even if the optical fiber cables 81 and 82 are bent due to the movement of the mounting head 25 or the X-axis slide mechanism 27A, data can be transmitted stably without damaging the optical fiber lines 82A and 82B. The multiplex communication lines of the optical fiber cables 81 and 82 are, for example, full duplex communication of 5 Gbps or 10 Gbps.

The communication connecting the fixed part substrate 45, the mounting head 25, and the X-axis slide mechanism 27A is not limited to optical communication using the optical fiber cables 81 and 82, but may be, for example, optical wireless communication using a laser or the like. The fixed part substrate 45 and the head substrate 97 may also perform two-way communication (single-core communication) using a single optical fiber line. For example, the fixed part substrate 45 and the head substrate 97 may perform two-way communication using a single optical fiber line by switching between different wavelengths and transmission timings.

The fixed part substrate 45 is also connected to two optical relay connectors 125, 126 for connecting the optical fiber lines 82A, 82B, respectively. Similarly, the head substrate 97 is connected to two optical relay connectors 127, 128 for connecting the optical fiber lines 82A, 82B, respectively. The optical fiber line 82A is connected to the receiving module 94B via the optical relay connector 125, and is connected to the transmitting module 111A via the optical relay connector 127. The optical fiber line 82A transmits an optical signal from the transmitting module 111A to the receiving module 94B. Similarly, the optical fiber line 82B is connected to the transmitting module 94A via the optical relay connector 126, and is connected to the receiving module 111B via the optical relay connector 128. The optical fiber line 82B transmits an optical signal from the transmitting module 94A to the receiving module 111B.

Figure 4 shows the connection configuration of the FPGA 113, the transmission module 111A, and the reception module 111B of the head substrate 97. As shown in Figures 2 and 3, for example, the FPGA 113 multiplexes image data acquired from the IPS camera 71 and the encoder signal acquired from the encoder 76, and outputs the multiplexed data to the transmission module 111A as transmission data TXDATA. The transmission module 111A converts the transmission data TXDATA from an electrical signal to an optical signal, and outputs it to the optical fiber line 82A via the optical relay connector 127. The reception module 94B of the fixed part substrate 45 converts the optical signal input from the optical fiber line 82A via the optical relay connector 125 into an electrical signal and outputs it to the FPGA 91. The FPGA 91 executes a process (demultiplexing process) of separating the multiplexed data based on the input electrical signal, and extracts the above-mentioned image data, etc. from the multiplexed data. The FPGA 91 outputs various types of data separated from the multiplexed data to the image processing board 87 of the device main body 41 and the like.

Similarly, the FPGA 91 of the fixed part substrate 45 multiplexes data such as an instruction signal for imaging the IPS camera 71 and an instruction (control signal) for acquiring the encoder signal of the encoder 76, and outputs the multiplexed data to the transmission module 94A. The transmission module 94A converts the multiplexed data from an electrical signal to an optical signal, and outputs it to the optical fiber line 82B via the optical relay connector 126. The reception module 111B of the head substrate 97 converts the optical signal input from the optical fiber line 82B via the optical relay connector 128 to an electrical signal, and outputs it to the FPGA 113 as the received data RXDTATA (see FIG. 4). The FPGA 113 executes a process of separating the input received data RXDTATA (multiplexed data), and extracts the above-mentioned instruction signals from the multiplexed data. The FPGA 113 outputs the extracted various data to the IPS camera 71, etc. As a result, multiplex communication (optical communication) in which various types of data are multiplexed is carried out between the fixed portion substrate 45 and the mounting head 25 .

Similarly to the mounting head 25, the fixed part board 45 also performs multiplex communication using optical signals with the X-axis slide mechanism 27A. The transmitting module 93A and the receiving module 93B of the fixed part board 45 are connected to the transmitting module 101A and the receiving module 101B of the X-axis slide mechanism 27A via an optical fiber cable 81 (2-core). The FPGA 91 of the fixed part board 45 performs multiplex communication with the FPGA 103 of the X-axis board 95 via the optical fiber cable 81.

The device main body 41 executes control of the X-axis slide mechanism 27A and the mounting head 25 through the multiplex communication. The servo amplifier 83 of the device main body 41 executes initialization processing for the linear scale 78 of the X-axis slide mechanism 27A, acquisition processing of the linear scale signal, etc. The linear scale 78 transmits a scale value indicating the slide position of the X-axis slide mechanism 27A to the servo amplifier 83 through multiplex communication. The servo amplifier 83 is connected to the linear motor 77 of the X-axis slide mechanism 27A through a power line (not shown), and executes feedback control of the linear motor 77 by changing the power supplied to the linear motor 77 based on the scale value of the linear scale 78. The device control main board 85 controls the servo amplifier 83 based on the production program received from the host computer, etc. As a result, the X-axis slide mechanism 27A moves to a position in the X direction based on the production program.

Similarly, the servo amplifier 83 executes processes such as acquiring the encoder value for the encoder 76 of the mounting head 25. The encoder 76 transmits the encoder value indicating the rotational position of the servo motor 75 to the servo amplifier 83 via multiplex communication. As described above, the servo motor 75 functions as a drive source for driving the holding member 25A of the mounting head 25. The servo amplifier 83 is connected to the servo motor 75 of the mounting head 25 via a power line (not shown), and executes feedback control of the servo motor 75 based on the encoder value. As a result, the mounting head 25 rotates and moves the holding member 25A up and down based on the production program.

The device control main board 85 is also capable of controlling relays, sensors, and the like equipped in the X-axis slide mechanism 27A and the mounting head 25 via the above-mentioned industrial network. The device control main board 85 functions as a master in the industrial network and transmits control data to the slave 61 of the X-axis slide mechanism 27A and the slave 62 of the mounting head 25 via multiplex communication.

For example, as shown in Figure 3, the device control main board 85 of the device body 41 is connected to the fixed board 45 via a LAN cable 131. When EtherCAT (registered trademark) is used as the industrial network standard, the device control main board 85 transmits frame data FD (see Figure 3) in which the data areas of each slave are set as the above-mentioned control data to the fixed board 45 via the LAN cable 131. The frame data FD is transferred, for example, in a circular manner through the FPGA 91 and slaves 61 and 62 via multiplex communication.

The slaves 61 and 62 drive relays and sensors based on the data contained in the area of the frame data FD assigned to their own device. The slaves 61 and 62 also write the signal values acquired from the relays and sensors into the area of the frame data FD assigned to their own device and transfer them via multiplex communication. The frame data FD is transferred, for example, in the order of the device control main board 85, FPGA 91, slave 61, FPGA 91, slave 62, FPGA 91, and returns to the device control main board 85. This allows the device control main board 85 to control the relays of each device.

In addition, image data captured by the mark camera 69 and the IPS camera 71 are also transmitted by multiplex communication. For example, image data captured by the mark camera 69 is transmitted from the X-axis slide mechanism 27A to the device main body 41 by multiplex communication, and is image-processed in the image processing board 87 (see FIG. 2) of the device main body 41.

The configuration of the multiplex communication system shown in FIG. 2 is an example and can be changed as appropriate. For example, a linear scale signal attached to a linear motor (not shown) of the Y-axis slide mechanism 27B (see FIG. 1) may be transmitted by multiplex communication. A signal of a relay of the Y-axis slide mechanism 27B may be transmitted by multiplex communication. Data transmitted and received between the host computer and the loader 13 may be transmitted by multiplex communication. The fixed part board 45 may also include a slave controlled by the device control main board 85. The slave 61 may also be a circuit block (such as an IP core) of the FPGA 103, that is, a part of the FPGA 103. The component mounting machine 20 may not include equipment related to the industrial network (such as a circuit that functions as a master of the device control main board 85, slaves 61 and 62, etc.).

2, the device main body 41 is connected to the touch panel 26. The touch panel 26 outputs, for example, a signal corresponding to a user's operation input to the device control main board 85. The touch panel 26 also changes the display content based on the control of the device main body 41. In particular, the touch panel 26 of this embodiment displays information related to abnormalities in multiplex communication, which will be described later.

The device main body 41 is also connected to a device lamp 28. The device lamp 28 is, for example, an LED, and is attached to an outer wall (such as an upper cover) of the device that is visible to users working on the production line. The device lamp 28 flashes depending on the operating state of the component mounting machine 20. In particular, the device lamp 28 in this embodiment turns on or off in conjunction with the on/off of an optical signal in the abnormality optical communication described below. It should be noted that the device lamp 28 is not limited to an LED, and may be another light-emitting device such as a halogen lamp.

With the above-mentioned configuration, the device control main board 85 controls the component mounting machine 20 based on the production program received from the host computer. The device control main board 85 is, for example, a processing circuit mainly composed of a CPU, and executes processing based on the production program. The device control main board 85 receives data collected by the industrial network, the linear scale signal of the linear scale 78, the encoder signal of the encoder 76, etc. through multiplex communication. In addition, the device control main board 85 inputs the results (such as the error of the holding position) of the image data captured by the mark camera 69 and the IPS camera 71 processed by the image processing board 87. Based on these data, the device control main board 85 determines the next control contents (such as the type of electronic component to be mounted and the mounting position). The device control main board 85 controls various devices according to the determined control contents.

Next, the log data DT1, DT2, and DT3 will be described. In the following description, the log data DT3 of the mounting head 25 will be mainly described, and the description of the other log data DT1 and DT2 that is similar to that of the log data DT3 will be omitted as appropriate. Figure 5 shows an example of the data configuration of the log data DT3. For example, when the FPGA 113 constructs a logic circuit that stores a log when the component mounting machine 20 is powered on, it reserves a memory area in the storage device 92 for storing the log data DT3, and sets a ring buffer area 121 and a required data area 122 within the reserved memory area.

As described above, the log data DT1, DT2, and DT3 store data for investigating the cause and circumstances of a communication abnormality related to multiplex communication. Specifically, the FPGA 113 stores data related to commands, errors, operation data, etc. in the ring buffer area 121, for example, as shown in FIG. 5. The data related to commands is, for example, a command (such as an image capture instruction) transmitted from the fixed part substrate 45 to the mounting head 25 by multiplex communication, or a command generated in the mounting head 25 (a command to operate a relay, etc.). The data related to commands is data such as the type of command, arguments, and execution time. The data on errors is, for example, information indicating a failure to establish multiplex communication, information on an internal error generated in the mounting head 25, and information on an error obtained from a device connected to the mounting head 25. The operation data is, for example, a trace log when a relay, a sensor, etc. of the mounting head 25 is operated during the mounting operation of the component mounting machine 20. Each time new data occurs, the FPGA 113 updates the oldest data stored in the ring buffer area 121 with the new data. That is, the FPGA 113 creates a ring buffer in the ring buffer area 121 and updates the data as needed. The ring buffer area 121 stores data such as a command or error that occurred immediately before updating the ring buffer is stopped.

Similarly, the FPGA 91 of the fixed part board 45 stores, for example, commands, errors, operation data, etc. that occur during the control of the fixed part board 45 in the ring buffer area 121 of the log data DT1 (see FIG. 5). Also, the FPGA 103 of the X-axis board 95 stores, for example, commands, errors, operation data, etc. that occur during the control of the X-axis slide mechanism 27A in the ring buffer area 121 of the log data DT2.

Furthermore, FPGA 113 stores data based on predetermined conditions in mandatory data area 122. The conditions for the data to be stored in mandatory data area 122 are set, for example, by the vendor of component mounting machine 20 in configuration information CF1 or setting data of storage device 92. The data to be stored in mandatory data area 122 may be data other than the data stored in ring buffer area 121, or may be data that overlaps with data (temporarily stored data) in ring buffer area 121.

As shown in FIG. 5, an abnormality code is stored in the mandatory data area 122. This abnormality code is identification information that indicates the cause of the communication abnormality. There are various causes of communication abnormalities, such as a decrease in the optical output of the transmitting module 111A due to aging, a decrease in the light receiving sensitivity of the receiving module 111B, a communication interruption due to external noise, an abnormality in the board power supply, or an abnormality in the board temperature. The abnormality code is information that can identify the causes mentioned above and various causes shown below the mandatory data area 122 in FIG. 5.

Furthermore, the current value of the received photocurrent is stored in the essential data area 122. As shown in Fig. 4, for example, the FPGA 113 inputs the received photocurrent Io from the receiving module 111B to an analog/digital port (A/D port). The FPGA 113 converts the analog received photocurrent Io into a digital signal using an AD conversion circuit or the like, and detects the current value of the received photocurrent Io. For example, the FPGA 113 stores the received photocurrent Io in the essential data area 122 in the following data format:
TRACE91, OPT, START=25mA, ERR=10mA
As shown in FIG. 5, the FPGA 113 assigns an identification number (trace TR01 to TR100) to data stored as log data DT3, for example. The above-mentioned TRACE is information indicating which of the identification numbers it is. In the example shown in FIG. 5, among TR0 to TR100, TR91 to TR100 are used as the required data area 122. Also, the above-mentioned OPT indicates that it is related to an optical signal. START indicates the current value of the received optical current Io at the start of multiplex communication. ERR indicates the current value of the received optical current Io at the time of communication abnormality. In the above-mentioned example, it is shown that the received optical current Io was 25 mA at the start of communication, but dropped to 10 mA at the time of communication abnormality.

In addition to the above-mentioned received photocurrent Io, the essential data area 122 stores information such as the board power supply voltage, the number of error corrections, the number of disconnections of the multiplex communication, the disconnection time, whether the fan has been stopped, the board temperature, and the cumulative power supply time. For example, if the power supply supplied to the head board 97 is cut off or the voltage drops, a communication abnormality occurs. The FPGA 113 detects the voltage and current values supplied to the head board 97 in the same manner as the above-mentioned received photocurrent Io, and stores them in the essential data area 122. In addition, if errors in the multiplexed data occur frequently due to external noise, logic circuit abnormalities, failures, etc., a communication abnormality occurs. The FPGA 113 determines errors in the multiplexed data using, for example, a Reed-Solomon code, and appropriately stores the number of corrections made after detecting errors in the essential data area 122. In addition, when the FPGA 113 detects a disconnection of the multiplex communication due to a decrease in the received photocurrent Io, etc., it stores in the required data area 122 the cumulative number of times that a disconnection has occurred (disconnection count), the number of disconnections per unit time, the duration of the disconnection from disconnection to recovery (disconnection time), and the like.

Furthermore, if the substrate temperature of the head substrate 97 rises, a processing error may occur in the FPGA 113, which may result in a communication abnormality. The FPGA 113 monitors, for example, the cooling fan and temperature sensor provided on the head substrate 97. The FPGA 113 stores, for example, the time that the cooling fan was operating in the required data area 122. Alternatively, the FPGA 113 may store, in the required data area 122, the presence or absence of operation of the cooling fan, its rotation speed, etc., when a communication abnormality is detected or when a temperature abnormality is detected by the temperature sensor. The FPGA 113 also stores, in the required data area 122, the substrate temperature of the head substrate 97 detected by the temperature sensor at the start of communication or when a communication abnormality occurs.

In addition, the FPGA 113 stores in the required data area 122 the cumulative energization time for which the transmission module 111A was energized before the communication abnormality was detected. As shown in FIG. 4, the transmission module 111A has a changeover switch 133 connected between the power supply voltage Vcc that supplies power to the transmission module 111A and the transmission module 111A. The changeover switch 133 is turned on/off based on a changeover signal SW output from the FPGA 113. The changeover switch 133 is, for example, a field effect transistor (MOSFET), and the changeover signal SW is, for example, a gate voltage. The changeover switch 133 is not limited to a MOSFET, and may be another transistor such as a bipolar transistor. Alternatively, the changeover switch 133 may be a switching device other than a transistor, such as a relay switch.

When the changeover switch 133 is turned on, the transmission module 111A outputs an optical signal of a predetermined intensity. When the changeover switch 133 is turned off, the transmission module 111A stops outputting the optical signal. For example, the FPGA 113 measures the accumulated time during which the switching signal SW is in the on state as the accumulated power-on time. Alternatively, the FPGA 113 may measure the accumulated time during which the switching signal SW is in the on state since the previous communication abnormality was detected as the accumulated power-on time.

FPGA 113 stores an abnormality code indicating the type of abnormality, such as the above-mentioned decrease in received photocurrent, decrease in power supply voltage, increase in the number of error corrections, communication disconnection, abnormal stop of the fan, increase in board temperature, etc., in the required data area 122. The other FPGAs 91 and 103 also store log data DT1 and DT2 of the fixed part board 45 and the X-axis slide mechanism 27A, similar to FPGA 113. Note that the contents and types of the log data DT3 described above are merely examples.

Next, the processing when a communication abnormality occurs in the multiplex communication of FPGAs 91, 103, and 113 will be described. Figure 6 shows the processing after startup of the component mounting machine 20. In the following explanation, as an example, the processing of FPGA 113 when a communication abnormality occurs in the optical fiber line 82A that transmits multiplexed data from the head substrate 97 to the fixed portion substrate 45 will be mainly described. Note that similar processing can be performed in the other FPGAs 91 and 103.

First, in step (hereinafter simply referred to as S) 11 of Fig. 6, the system of the component mounting machine 20 is started and the startup process is executed. Power is supplied from the power supply device of the component mounting machine 20 to each device such as the device main body 41, the fixed part board 45, the X-axis slide mechanism 27A, the mounting head 25, etc. When power is supplied, the FPGA 113 of the mounting head 25 reads the configuration information CF3 from the memory device 115 and executes a configuration that constructs a logic circuit that executes multiplexing processing, separation processing, log storage processing, etc. (S13). The FPGA 113 starts the process of storing the log data DT3 in the memory device 115 (S13).

The FPGA 113 starts the process of establishing multiplex communication with the FPGA 91 of the opposing fixed part substrate 45 (S15). The FPGA 113 establishes communication by, for example, transmitting and receiving data defined by the communication protocol of the multiplex communication with the FPGA 91 using the transmission module 111A or the like.

Next, the FPGA 113 judges whether the communication establishment process executed in S15 was successful (S17). For example, when the FPGA 113 receives response data from the FPGA 91 within a predetermined time in response to the confirmation data sent from the FPGA 113, the FPGA 113 judges that the communication establishment was successful (S17: YES). When the communication establishment is successful, the FPGA 113 transmits and receives multiplexed data by multiplex communication via the optical fiber cable 82, and starts communication related to the mounting work (S19). The FPGA 113 multiplexes the image data of the IPS camera 71, the frame data FD of the slave 62, the encoder signal of the encoder 76, etc., and transmits and receives them between the FPGA 91. Similarly, multiplex communication between the X-axis board 95 and the fixed part board 45 is started. This starts the mounting work by the component mounting machine 20.

When the FPGA 113 starts the process of S19, it judges whether or not a communication abnormality such as a communication interruption has occurred during communication in the multiplex communication via the optical fiber cable 82 (S21). For example, if a communication interruption abnormality has not occurred in the multiplex communication of the optical fiber cable 82 (S21: NO), the FPGA 113 judges whether or not to continue the mounting work (S23). The FPGA 113 judges whether or not a condition for ending the mounting work has been met in S23. The condition for ending the mounting work is, for example, a condition in which it is difficult to continue the mounting work, such as a condition in which an operation to turn off the power of the component mounting machine 20 is performed, a condition in which an operation to replace the mounting head 25 is performed, or a condition in which an error occurs during the mounting work.

FPGA 113 executes the process from S19 until the condition for ending the mounting operation is met (S23: NO). FPGA 113 executes the operation based on the control of device main body 41 using multiplexed data via multiplex communication. Also, when the condition for ending the mounting operation is met (S23: YES), FPGA 113 ends the process shown in Figure 6. For example, when the condition for stopping the power supply is met in S23 and the process in Figure 6 is ended, if the power supply is turned back on, FPGA 113 executes the process from S11 in Figure 6 again.

Also, for example, if an operation to replace the mounting head 25 is performed in S23, the FPGA 113 executes the process from S13 when power is supplied after the replacement. That is, even when the replacement of the mounting head 25 is performed and the supply of power to the FPGA 113 is resumed, the FPGA 113 executes the determination of communication establishment (S17) and the determination of an abnormality such as communication interruption (S21) in the same manner as when the power of the component mounting machine 20 is turned on. Also, for example, if an error occurs in the mounting operation in S23, the FPGA 113 detects recovery from the error and then executes the process from S15 again.

On the other hand, in S17, for example, if the FPGA 113 cannot obtain response data from the FPGA 91 within a predetermined time in response to the confirmation data transmitted from the FPGA 113, it determines that communication cannot be established (S17: NO) and executes S25. Alternatively, for example, if the FPGA 113 cannot process the multiplexed data due to some cause (such as the above-mentioned increase in the substrate temperature or the decrease in the power supply voltage of the substrate) and fails to establish communication (S17: NO), it executes S25. Also, in S21, if the FPGA 113 detects a communication interruption abnormality (such as external noise or a processing error) during communication and it is difficult to continue communication (S21: NO), it executes S25. For example, the output of the transmission module 111A may decrease due to aging deterioration, and may decrease to the extent that communication cannot be normally ensured. If communication establishment fails due to such a decrease in output (S17: NO), or if communication is disconnected during communication (S21: NO), the FPGA 113 executes S25.

In S25, the FPGA 113 performs abnormal optical communication to perform one-sided communication by on/off control of the optical signal. As described above, when the changeover switch 133 (see FIG. 4) is turned on and the power supply voltage Vcc is supplied, the transmission module 111A outputs an optical signal of a predetermined intensity. Also, when the changeover switch 133 is turned off and the power supply voltage Vcc is stopped, the transmission module 111A stops outputting the optical signal. Therefore, the FPGA 113 can turn on/off the optical signal output from the transmission module 111A by controlling the changeover switch 133 on/off based on the switching signal SW. The FPGA 113 transmits the log data DT3 to the FPGA 91 via the optical fiber line 82A by turning on/off the optical signal of the transmission module 111A based on the log data DT3 stored in the storage device 115 (S25).

The FPGA 113 turns on/off so that the optical signal output intermittently has information on the log data DT3. For example, the FPGA 113 assigns on to "1" and off to "0" and transmits a pulse signal (on/off optical signal) indicating the log data DT3 by a data string consisting of "1, 0". Similarly, the FPGA 103 of the X-axis slide mechanism 27A changes the switching signal (not shown) of the changeover switch depending on the case where multiple communication of the optical fiber cable 81 cannot be established, turns on/off the optical signal output from the transmission module 101A, and transmits the log data DT2 to the fixed part board 45. The FPGA 91 of the fixed part board 45 may change the switching signal (not shown) depending on the case where communication cannot be established, turns on/off the output of the transmission modules 93A and 94A, and transmits the log data DT1 to the X-axis slide mechanism 27A or the mounting head 25.

On the other hand, as shown in FIG. 4, the receiving module 111B outputs a detection signal OD indicating the presence or absence of an optical signal input to the FPGA 113. For example, when the receiving module 111B receives an optical signal from the opposing transmitting module 94A, it outputs a high-level detection signal OD (bit "1") to the FPGA 113, and when the input of the optical signal is stopped, it outputs a low-level detection signal OD (bit "0") to the FPGA 113. The receiving module 94B of the fixed part board 45 also has a similar configuration to the receiving module 111B. When performing optical communication during an abnormality, the receiving module 94B outputs a detection signal indicating the presence or absence of an optical signal input from the transmitting module 111A to the FPGA 91. This allows the log data DT3 to be transmitted from the mounting head 25 to the fixed part board 45 by turning the optical signal on and off.

Similarly, when the receiving module 93B of the fixed portion substrate 45 executes abnormal optical communication with the transmitting module 101A, it outputs a detection signal indicating the presence or absence of an optical signal input to the FPGA 91. Also, when the receiving module 101B of the X-axis substrate 95 executes abnormal optical communication with the transmitting module 93A, it outputs a detection signal indicating the presence or absence of an optical signal input to the FPGA 103.

The component mounting machine 20 may be configured to transmit log data DT2 and DT3 only from the movable part side (X-axis slide mechanism 27A and mounting head 25) when a communication abnormality occurs, and not transmit log data DT1 from the fixed part side (fixed part board 45). In this case, the fixed part board 45 does not need to be equipped with a changeover switch for switching the power supply to the transmitting modules 93A and 94A. Also, the receiving module 101B of the X-axis slide mechanism 27A and the receiving module 111B of the mounting head 25 may be configured not to output the detection signal OD.

The FPGA 113 controls the switching signal SW so that the on/off data sequence of the optical signal output from the transmission module 111A becomes serial communication such as the UART standard or the RS-232C standard. For example, when the FPGA 113 starts optical communication during an abnormality, it first transmits a start bit, then log data DT3, then a parity bit, and a stop bit, and executes asynchronous serial communication. Information on the communication protocol used for this optical communication during an abnormality is stored, for example, in the storage device 92, 115, etc. The FPGA 113 uses this communication protocol information when starting optical communication during an abnormality. Alternatively, information on the logic circuit that processes optical communication during an abnormality may be set in the configuration information CF3, and the logic circuit may be constructed in the FPGA 113.

The FPGA 113 transmits the log data DT3 to the FPGA 91 (fixed part substrate 45 side) by executing the optical communication at the time of the abnormality described above. As described above, the ring buffer area 121 of the log data DT3 stores data such as the command and error that occurred immediately before the storage process was stopped. The required data area 122 also includes the value of the received photocurrent Io of the receiving module 111B in the multiplex communication when the communication abnormality was detected, and the cumulative current application time for the transmitting module 111A until the communication abnormality was detected. The required data area 122 also includes an abnormality code indicating the type of abnormality that occurred in the head substrate 97 when the communication abnormality occurred, and information on the substrate temperature of the head substrate 97 when the communication abnormality was detected. The FPGA 113 may transmit at least one of the required data areas 122 described above to the transmitting module 111A.

This allows information useful in investigating the cause of the communication abnormality, such as the received photocurrent Io and the cumulative power-on time, to be transmitted to the fixed part substrate 45. For example, even if the output of the transmitting module 94A decreases due to aging and the communication path of the optical fiber line 82B is broken, information on the received photocurrent Io, etc. can be transmitted via the remaining optical fiber line 82A. By checking the received photocurrent Io of the log data DT3 received by the FPGA 91 via optical communication during an abnormality, the user can confirm that the decrease in output of the transmitting module 94A is the cause of the communication abnormality. As a result, the transmitting module 94A can be replaced, for example, and the communication abnormality can be quickly restored.

6, once the FPGA 113 executes S25, it repeatedly executes S25 until the power supply to the head substrate 97 is stopped. For example, the FPGA 113 repeatedly transmits the same log data DT3 unilaterally via the optical fiber line 82A without checking a response from the communication partner FPGA 91 via the optical fiber line 82B. Therefore, the FPGA 113 continues to transmit the log data DT3 until, for example, the power of the component mounting machine 20 is turned off or the mounting head 25 is removed from the component mounting machine 20. This allows the log data DT3 to be transmitted to the FPGA 91 more reliably by repeatedly transmitting the log data DT3. For example, when a temporary communication abnormality occurs, such as a communication abnormality due to external noise, the log data DT3 can be transmitted after the abnormality is eliminated.

In addition, FPGA 113 may stop transmitting log data DT3 based on a specified condition. For example, FPGA 113 may repeatedly transmit log data DT3 up to a specified upper limit number of times or upper limit time. FPGA 113 may also be configured to transmit log data DT3 only once. FPGA 113 may also transmit data other than log data DT3 by optical communication in the event of an abnormality.

In addition, in this embodiment, the time until the transmitting device starts transmitting the log data DT1 to DT3 in the abnormal optical communication is longer than the time until the receiving device starts the reception process. Specifically, for example, the time from when the FPGA 113 detects a communication abnormality in S17 to when it starts transmitting the log data DT3 in S25 is set as the first time. Also, the time from when the FPGA 91 detects a communication abnormality in the optical fiber cable 82 to when it starts the reception process of the log data DT3 in the abnormal optical communication based on the detection signal of the receiving module 94B is set as the second time. In this case, the first time is set to be longer than the second time. For example, the above-mentioned first time and second time are set in the logic circuit that processes the abnormal optical communication of the configuration information CF1 and CF3.

According to this, by making the first time from when a communication abnormality is detected until the sending side starts transmission longer than the second time during which the receiving side can start the receiving process, the log data DT3 to be sent first can be more reliably received by the receiving side. Note that the component mounting machine 20 may start the sending and receiving processes the same amount of time after the sending and receiving sides detect the communication abnormality, or may start sending or receiving at the stage when preparations can begin without setting a time. In other words, even if the receiving process ends up starting first, the log data DT3, etc. may be sent by repeatedly sending as described above.

The component mounting machine 20 also includes a fixed board 45 that performs multiplex communication and abnormality optical communication with the X-axis board 95 and the head board 97, and a device main body 41. The device main body 41 is connected to the fixed board 45 and performs multiplex communication with the head board 97 of the mounting head 25, etc., via the fixed board 45. The device main body 41 transmits and receives data that controls the operation of the mounting head 25 and the X-axis slide mechanism 27A as transmission data TXDATA and reception data RXDTATA by multiplex communication, and controls the operation of the mounting head 25, etc. In a component mounting machine 20 that includes movable parts such as the mounting head 25, there is a risk that the optical fiber line 82A, etc. will be broken by operating the mounting head 25, etc. On the other hand, when a communication abnormality occurs, if the above-mentioned abnormality optical communication is not performed, and instead the user removes the mounting head 25 from the component mounting machine 20 and reads out the log data DT3 from the mounting head 25, or uses a test light source to investigate the optical fiber cable 82 (communication path), the user's investigation burden increases. In contrast, by transmitting the log data DT3 to the fixed part board 45 side by the above-mentioned abnormality optical communication, the user can relatively easily investigate the cause of the communication abnormality.

For example, the device main body 41 acquires the log data DT2, DT3 received by the FPGA 91 and the log data DT1 of the storage device 92 from the fixed part board 45, and displays the acquired information of the log data DT1 to DT3 on the touch panel 26. For example, the device main body 41 may display information indicating that a communication abnormality has been detected together with the log data DT1 to DT3. This allows the user to investigate the cause of the communication abnormality while the mounting head 25 is mounted by checking the value of the received photocurrent Io displayed on the touch panel 26. The device main body 41 may acquire and display only the log data related to the communication path in which the communication abnormality occurred (log data DT1, DT2 in the case of the optical fiber cable 81, and log data DT1, DT3 in the case of the optical fiber cable 82). The device main body 41 may also transmit the information of the log data DT1 to DT3 to another device such as a host computer.

In addition, if a communication error occurs between the head substrate 97 and the fixed portion substrate 45, the head substrate 97 transmits log data DT3 from the mounting head 25 to the device side that includes the fixed portion substrate 45. This allows log data DT3 and the like of the movable portion such as the mounting head 25 to be transmitted to the device main body 41 side.

As described above, the device control main board 85 of the device body 41 communicates with the slave 62 connected to the head board 97 via the industrial network. When the fixed board 45 acquires the log data DT3 from the head board 97, it transmits the log data DT3 to the device control main board 85 via the industrial network. For example, the FPGA 91 writes the log data DT3 in an area of the frame data FD that is assigned to the slave 62 of the mounting head 25, and transmits it to the device control main board 85, which is the master, via the LAN cable 131. This allows the log data DT3 to be transferred to the device body 41 by effectively using the memory area assigned to the slave 62 that cannot communicate due to a communication abnormality. Alternatively, the FPGA 91 may write and transfer the log data DT3 in a memory area assigned to a slave of its own device (such as a slave for the fixed board 45) or in a memory area of the slave 61.

FPGA113 also controls the switching signal SW so that the communication speed of the bit string represented by the on/off of the optical signal described above is a low communication speed of, for example, 9600 bps. Therefore, the communication speed (for example, 9600 bps) for transmitting the log data DT3 in the abnormal optical communication is slower than the communication speed (for example, 5 Gbps) for transmitting the multiplexed data (transmission data TXDATA) in the multiplex communication. According to this, even if a communication abnormality occurs and the processing capacity of FPGA113 is reduced due to a rise in the temperature of the board, the processing load of FPGA113 can be reduced by performing the low-speed abnormal optical communication, and the log data DT3 can be transmitted. In other words, by performing communication with a low processing load during a communication abnormality, the log data DT3 can be transmitted more reliably.

As shown in Fig. 4, the transmitting module 111A inputs the transmission data TXDATA from the FPGA 113 and transmits the input transmission data TXDATA by multiplex communication. The receiving module 111B outputs the reception data RXDTA received by multiplex communication to the FPGA 113. In this configuration, the multiplexed data (the transmission data TXDATA and the reception data RXDTA) transmitted by multiplex communication can be processed and managed by the FPGA 113.

6, if the multiplex communication cannot be established (S17: NO) or if the ongoing multiplex communication is disconnected (S21: YES), the FPGA 113 transmits the log data DT3 to the transmission module 111A by abnormality optical communication (S25). This makes it possible to transmit the log data DT3 when communication establishment fails or when communication that was once established is disconnected.

In addition, in the abnormal optical communication of S25 described above, the component mounting machine 20 blinks the light emitting device in conjunction with the on/off of the optical signal. In more detail, for example, when the FPGA 113 of the head board 97 starts abnormal optical communication in response to a communication abnormality in the optical fiber cable 82, it turns on the head lamp 25B in conjunction with turning on the optical signal of the transmission module 111A in S25. Also, the FPGA 113 turns off the head lamp 25B in conjunction with turning off the optical signal of the transmission module 111A. This allows the head lamp 25B to be turned on in conjunction with the on/off control of the abnormal optical communication of the optical fiber cable 82 (in conjunction with the bit string).

Furthermore, for example, when abnormality-time optical communication is started in response to a communication abnormality in the optical fiber cable 82, the device main body 41 blinks the device lamp 28 in conjunction with the on/off of the optical signal from the transmission module 111A. The device main body 41 may also blink the device lamp 28 in accordance with a bit string indicating the on/off of the optical signal detected from the frame data FD. This makes it possible to notify a user present near the component mounting machine 20 that abnormality-time optical communication has been started.

The above-mentioned light emission control is an example. For example, the X-axis board 95 may blink the lamp of the X-axis board 95 in accordance with the on/off of the optical communication during an abnormality of the optical fiber cable 81. Also, the FPGA 113 and the device main body 41 may not blink the head lamp 25B etc. in perfect agreement with the on/off of the optical signal. For example, the FPGA 113 may blink the head lamp 25B at a predetermined period in accordance with the start of the optical communication during an abnormality. Also, the component mounting machine 20 may be provided with a device lamp 28 that is turned on only during the optical communication during an abnormality. And, the device main body 41 may not blink the device lamp 28 during the optical communication during an abnormality, but may turn on the device lamp 28 until the optical communication during an abnormality is completed. This makes it possible to notify the user that the optical communication during an abnormality has started and is continuing. Also, the device main body 41 may transmit the log data DT1 etc. to a higher-level management device etc. by the optical signal by blinking the device lamp 28 in accordance with the bit string.

Incidentally, the component mounting machine 20 is an example of a work machine. The head lamp 25B and the device lamp 28 are examples of light-emitting devices. The touch panel 26 is an example of a display unit. The X-axis slide mechanism 27A and the mounting head 25 are examples of movable parts. The device main body 41 is an example of a main body control unit. The fixed part board 45 is an example of a main body side optical multiplex communication device. The FPGAs 91, 103, and 113 are examples of a communication control unit. The fixed part board 45 is an example of an optical multiplex communication device and a main body side optical multiplex communication device. The X-axis board 95 and the head board 97 are examples of an optical multiplex communication device. The log data DT1, DT2, and DT3 are examples of abnormal data.

As described above, the present embodiment provides the following effects.
In one aspect of this embodiment, when a communication abnormality occurs in multiplex communication using optical signals, the FPGA 113 controls the optical signal output from the transmitting module 111A to turn on/off, and causes the transmitting module 111A to perform abnormal optical communication by transmitting log data DT3 from the transmitting module 111A as data represented by the on and off of the optical signal (S25).

In this way, when an abnormality occurs in the multiplex communication, log data DT3 that can be used to investigate the cause of the communication abnormality can be transmitted to the fixed part board 45 on the device main body 41 side using only the optical fiber line 82A of the transmission path out of the two-way communication. As a result, the fixed part board 45, the device main body 41, etc. can obtain information for confirming what kind of abnormality has occurred in the head board 97, etc. of the communication partner.

Incidentally, the present disclosure is not limited to the above-described embodiments, and it goes without saying that various improvements and modifications are possible without departing from the spirit and scope of the present disclosure.
For example, in the above embodiment, the FPGA 113 transmits the log data DT3 in response to the occurrence of a communication abnormality. However, the FPGA 113 may execute the transmission process of the log data DT3 only when a communication abnormality occurs in the receiving path (optical fiber line 82B) of the multiplex communication, or may transmit the log data DT3 only when a communication abnormality is detected in the transmitting path (optical fiber line 82A).
Furthermore, the communication speed of the abnormal-time optical communication may be equal to or higher than the communication speed of the multiplex communication.
The transmitting module 111A etc. may input the transmission data TXDATA from a device other than the FPGA 113.
The receiving module 111B etc. may output the received data to a device other than the FPGA 113.

The device main body 41 may not display the log data DT1 to DT3 on the touch panel 26. Furthermore, the device main body 41 may display only a portion of the log data DT1 to DT3 based on setting information.
Furthermore, the fixed part board 45 may transmit the information of the log data DT2 and DT3 to the device body part 41 without using the frame data FD of the industrial network. Furthermore, the fixed part board 45 does not need to transmit the log data DT1 to DT3 to the device body part 41.
6 is merely an example. For example, the FPGA 113 may transmit the log data DT3 only in either S17 or S21, that is, when communication is established or when an abnormality occurs in one of the communications during communication.
In the above embodiment, the FPGA 113 or the like executes the storage process of the log data DT3, but the storage process of the log data DT3 may be executed by another device, for example, a CPU mounted on the head substrate 97. In other words, the communication control unit of the present application does not need to execute the storage process of the abnormal data.
In the above embodiment, the FPGA 113 controlled the change-over switch 133 connected to the transmission module 111A, but another device, such as the CPU of the head substrate 97, may also control the change-over switch 133 to transmit the log data DT3.
After detecting a communication abnormality, the FPGA 113 may obtain the substrate temperature and the like and transmit the obtained data as the log data DT3. In other words, after detecting a communication abnormality, a part or all of the log data DT3 may be collected and transmitted.

In the above embodiment, the technology disclosed herein is applied to the multiplex communication system in the component mounting machine 20, but the present invention is not limited to this. For example, the host computer may perform multiplex communication to control the loader 13, and when a communication abnormality occurs in the multiplex communication, the abnormality optical communication may be executed.
The component mounting machine 20 does not need to be equipped with the head lamp 25B or the device lamp 28, and does not need to be flashed in conjunction with optical communication in the event of an abnormality.
In the above embodiment, the component mounting machine 20 that mounts electronic components on the board 17 is used as the working machine of the present disclosure, but the present disclosure is not limited to this. For example, the working machine may be various working machines such as a solder application device that applies solder to the board 17, a machine tool, or a nursing care robot. Alternatively, the working machine of the present application may be a die bonder that bonds a die having an electronic circuit to a lead frame, a board, or the like.

20 component mounting machine (work machine), 25 mounting head (movable part), 25B head lamp (light emitting device), 26 touch panel (display unit), 27A X-axis slide mechanism (movable part), 28 device lamp (light emitting device), 41 device main body (main body control unit), 45 fixed part board (optical multiplex communication device, main body side optical multiplex communication device), 91, 103, 113 FPGA (communication control unit), 93A, 94A, 101A, 111A transmitting module, 93B, 94B, 101B, 111B receiving module, 95 X-axis board (optical multiplex communication device), 97 head board (optical multiplex communication device), DT1, DT2, DT3 log data (abnormal data), TXDATA transmitted data, RXDTATA received data.

Claims (12)

a transmission module for transmitting transmission data by multiplex communication using optical signals;
a receiving module for receiving the received data by the multiplex communication;
a communication control unit that, when a communication abnormality occurs in the multiplex communication, causes the transmission module to execute abnormality-time optical communication by controlling on/off of the optical signal output from the transmission module, thereby causing the transmission module to transmit abnormality data related to the communication abnormality from the transmission module as data represented by on and off of the optical signal, and controls the transmission module so that a first time from the time when the communication abnormality is detected to the time when transmission of the abnormality data starts in the abnormality-time optical communication is longer than a second time from the time when the communication abnormality is detected to the time when a communication partner device that transmits the abnormal data from the transmission module starts receiving processing of the abnormality data in the abnormality-time optical communication;
An optical multiplex communication device comprising: The communication speed for transmitting the abnormal data in the abnormality-time optical communication is
2. The optical multiplex communication device according to claim 1, wherein the speed is slower than a communication speed for transmitting the transmission data in the multiplex communication. the transmission module which receives the transmission data from the communication control unit and transmits the received transmission data by the multiplex communication;
the receiving module outputs the received data received by the multiplex communication to the communication control unit;
3. The optical multiplexing communication device according to claim 1, further comprising: The optical multiplex communication device according to any one of claims 1 to 3, further comprising a communication control unit that transmits the abnormality data to the transmission module by the abnormality optical communication when a communication abnormality occurs in which the multiplex communication cannot be established or in which the ongoing multiplex communication is disconnected. The optical multiplexing communication device according to any one of claims 1 to 4, further comprising a communication control unit that, in the abnormal optical communication, causes the transmission module to repeatedly transmit the same abnormal data without checking a response from a communication partner to which the abnormal data is transmitted. 6. The optical multiplex communication device according to claim 1, further comprising a communication control unit that causes the transmitting module to transmit at least one piece of information as the abnormality data, the value of the received optical current of the receiving module in the multiplex communication when the communication abnormality is detected, the cumulative power supply time for the transmitting module until the communication abnormality is detected, an abnormality code indicating the type of abnormality that occurred in the optical multiplex communication device when the communication abnormality occurred, and the temperature of a board on which the communication control unit is mounted when the communication abnormality is detected. A movable part including the optical multiplex communication device according to any one of claims 1 to 6 ;
a main body side optical multiplex communication device which executes the multiplex communication and the abnormality optical communication with the optical multiplex communication device;
a main body control unit that is connected to the main body side optical multiplex communication device, executes the multiplex communication with the optical multiplex communication device of the movable part via the main body side optical multiplex communication device, transmits and receives data for controlling the operation of the movable part as the transmission data and the reception data by the multiplex communication, and controls the operation of the movable part;
A work machine equipped with the above. the main body control unit that executes communication with a slave connected to the optical multiplexing communication device through an industrial network;
the main body side optical multiplex communication device that transmits the abnormality data to the main body control unit via the industrial network when the abnormality data is acquired from the optical multiplex communication device;
The work machine according to claim 7 . A work machine having a movable part equipped with an optical multiplex communication device,
The optical multiplex communication device comprises:
a transmission module for transmitting transmission data by multiplex communication using optical signals;
a receiving module for receiving the received data by the multiplex communication;
a communication control unit that causes the transmission module to execute abnormality optical communication when a communication abnormality occurs in the multiplex communication, by controlling on/off of the optical signal output from the transmission module, thereby transmitting abnormality data related to the communication abnormality from the transmission module as data represented by on/off of the optical signal;
Equipped with
The working machine includes:
a main body side optical multiplex communication device which executes the multiplex communication and the abnormality optical communication with the optical multiplex communication device;
a main body control unit that is connected to the main body side optical multiplex communication device, executes the multiplex communication with the optical multiplex communication device of the movable part via the main body side optical multiplex communication device, transmits and receives data for controlling the operation of the movable part as the transmission data and the reception data by the multiplex communication, and controls the operation of the movable part;
a light-emitting device that turns on and off in conjunction with the on/off of the optical signal in the abnormality-state optical communication;
A work machine equipped with the above. The work machine according to claim 9, further comprising an optical multiplex communication device that, when a communication abnormality occurs in the multiplex communication with the main body side optical multiplex communication device, transmits the abnormal data from the movable part to an apparatus equipped with the main body side optical multiplex communication device by controlling the optical signal on/ off . 11. The work machine according to claim 9, further comprising: the main body control unit that acquires the abnormality data from the optical multiplex communication device and displays information about the acquired abnormality data on a display unit. a transmission module for transmitting transmission data by multiplex communication using optical signals;
a receiving module for receiving the received data by the multiplex communication;
A communication method in an optical multiplexing communication device comprising:
The communication method includes, when a communication abnormality occurs in the multiplex communication, causing the transmitting module to execute abnormality optical communication, in which the optical signal output from the transmitting module is controlled to be on/off, thereby transmitting abnormal data related to the communication abnormality from the transmitting module as data represented by the on and off of the optical signal, and controlling the transmitting module so that a first time from the time the communication abnormality is detected to the time the transmission of the abnormal data starts in the abnormality optical communication is longer than a second time from the time the communication abnormality is detected to the time a communication partner device that transmits the abnormal data from the transmitting module starts receiving processing of the abnormal data in the abnormality optical communication.

Images