JP7709872B2 - Joint, manufacturing method thereof, and electrode-embedded member - Google Patents

Description

The present invention relates to a joint, a manufacturing method thereof, and an electrode-embedded member.

AlN components used in semiconductor manufacturing equipment are sometimes joined to metal components to add various functions.

Patent Document 1 discloses a joint in which an aluminum nitride member and a metal member are joined with an Al brazing material, and a semiconductor holding device. As a preferred embodiment, an example is disclosed in which the aluminum nitride member is a semiconductor holding member having a mounting surface for mounting a semiconductor wafer, and the metal member is a heat transfer member for transferring heat between the semiconductor holding member and the outside. In addition, examples of heat transfer members are disclosed that are made of tungsten, molybdenum, copper, or alloys of these. These metal members function as heat sinks and have a certain thickness.

Patent Document 2 discloses an aluminum nitride sintered body having a sintered metal layer of 15 to 100 μm thickness made of tungsten or molybdenum formed on at least a portion of the joining surface, with the objective of providing an aluminum nitride sintered body and a manufacturing method thereof that incorporates a sintered metal layer that is relatively thick and highly conductive, has extremely little warping, and has a high bonding strength between the sintered metal layer and the substrate, and is suitable for use as an electrode-embedded member, and the sheet resistance of the sintered metal layer is 1 Ω/□ or less, and the warping of the sintered metal layer is 100 μm/100 mm or less.

Japanese Patent Application Publication No. 9-249465 JP 2005-159334 A Japanese Patent Application Publication No. 5-246769 Japanese Unexamined Patent Publication No. 62-78167

Journal of the Japan Institute of Metals, Vol. 45, No. 2 (1981) P. 184-P. 189

AlN ceramics used in semiconductor manufacturing processes are sometimes integrated with high-melting-point metals (metals with a melting point of 2000°C or higher) used in heat sinks, etc. To do this, the high-melting-point metal needs to be thicker than a certain amount, but such a structure cannot be achieved with a sintered metal layer such as that described in Patent Document 2.

According to Non-Patent Document 1, it has been said that it is difficult to create a bonded body because AlN and high-melting-point metals do not react without a bonding material. For this reason, conventionally, bonds between AlN ceramic and high-melting-point metals have been produced by joining them with a brazing material or the like at the bonding interface (Patent Documents 1, 3, 4).

However, when these bonded bodies are used in semiconductor manufacturing processes, the methods of Patent Documents 1, 3, and 4 raise concerns about erosion of the brazing material that forms the bonding layer and contamination from the bonding layer. For this reason, there has been a demand for an AlN-high melting point metal bonded body that is a bonded body of AlN ceramic and a thick high melting point metal and that reduces the risk of contamination and erosion from the bonding material.

The present invention was made in consideration of these circumstances, and aims to provide a bonded body that can suppress erosion and contamination of the bonded surface, has strong bonding strength, and has a thick metal member, a manufacturing method thereof, and an electrode-embedded member.

(1) In order to achieve the above object, the present invention provides a joined body of a ceramic member mainly composed of AlN and a metal member composed of Mo, W or a Mo alloy as a high melting point metal having a melting point of 2000° C or more, wherein the ceramic member has an electrode embedded therein, the ceramic member is joined to at least one main surface of the metal member, the ceramic member includes a second phase composed of _Y2O3 as _a metal oxide, the metal member has a maximum thickness of 1 mm or more in a direction perpendicular to one main surface of the metal member, and the joint interface between the ceramic member and the metal member has a metal concentration and an oxygen concentration constituting the second phase of the ceramic member that are greater than the metal concentration and the oxygen concentration inside the ceramic member, respectively.

In this way, the concentration of the metal and oxygen constituting the second phase at the bonding interface between the ceramic member mainly composed of AlN and the metal member made of a high melting point metal are greater than the metal concentration and oxygen concentration inside the ceramic member, respectively, and the ceramic member and the metal member are bonded via these, resulting in a bonded body that suppresses erosion and contamination of the bonding surface. In addition, the thick metal member allows the metal member to be used for various purposes, such as as a heat sink or heat spreader, or to increase the strength and dimensional accuracy of the ceramic member. If the maximum thickness of the metal member is less than 1 mm, the effect of increasing dimensional accuracy will not be fully exerted, so it is preferable that the maximum thickness be 1 mm or more.

(2) In the bonded body of the present invention, the ceramic member contains a Group 4 metal, and the metal member has the Group 4 metal diffused therein.

In this way, the ceramic member contains a Group 4 metal, and the Group 4 metal is diffused into the metal member, which increases the bond strength between the ceramic member and the metal member and increases the reliability of the bonded structure.

(3) In the bonded body of the present invention, the metal member is characterized in that it contains 1 wt % or less of a second metal oxide.

In this way, by the metal member containing 1 wt % or less of the second metal oxide, the bonding strength between the ceramic member and the metal member is increased, and the reliability of the bonded body is improved.

(4) The bonded body of the present invention is also characterized in that a ceramic member is further bonded to the other main surface of the metal member opposite to the one main surface of the metal member.

In this way, by joining ceramic members to both main surfaces of a metal member, the range of uses for the joint is further expanded.

(5) The electrode-embedded member of the present invention is characterized by comprising a joint body according to any one of (1) to (3) above and an electrode embedded in the ceramic member of the joint body.

Since AlN has high thermal conductivity and high insulation, an electrode-embedded member in which electrodes are embedded in the ceramic member of a joint of a ceramic member and a metal member can be used as a heater module with excellent thermal conductivity.

(6) Also, the present invention provides a method for producing a joined body of a ceramic member mainly composed of AlN and a metal member composed of Mo, W or a Mo alloy as a high-melting point metal having a melting point of 2000°C or more, the method comprising the steps of : granulating a powder obtained by adding a raw material powder of _Y2O3 as a _metal oxide to an AlN raw material powder to produce a granulated powder; stacking the granulated powder or a molded body formed from the granulated powder, and a plate-shaped high-melting point metal having a thickness of 1 mm or more on a carbon mold so that one main surface of the plate-shaped high-melting point metal is perpendicular to a stacking direction; inserting a carbon punch into the carbon mold to form a stack; embedding an electrode in the molded body, or stacking the electrode on the carbon mold so that the electrode is sandwiched between the molded bodies; and uniaxially pressing and sintering the stack.

This results in a bonded ceramic and metal member that suppresses erosion and contamination of the bonding surfaces. The thick metal member can be used for a variety of purposes, such as using it as a heat sink or to increase the strength and dimensional accuracy of the ceramic member.

According to the present invention, a bonded body is obtained in which erosion and contamination of the bonding surface between a ceramic member mainly composed of AlN and a metal member made of a high melting point metal is suppressed. In addition, since the metal member is thick, it can be used for various purposes, such as using the metal member as a heat sink or increasing the strength and dimensional accuracy of the ceramic member.

FIG. 1 is a schematic cross-sectional view showing an example of a bonded body according to an embodiment of the present invention. FIG. 11 is a schematic cross-sectional view showing a modified example of a bonded body according to an embodiment of the present invention. 1 is a schematic cross-sectional view showing an example of an electrode-embedded member according to an embodiment of the present invention. 1A to 1E are cross-sectional views each showing a schematic diagram of a manufacturing method according to an embodiment of the present invention. 1A is a SEM image of a cross section of Example 1. 1B to 1D are photographs showing EPMA analysis mapping of the cross section of Example 1, respectively.

Next, an embodiment of the present invention will be described with reference to the drawings. To facilitate understanding of the description, the same reference numbers are used for the same components in each drawing, and duplicate descriptions will be omitted. Note that in the configuration diagrams, the size of each component is shown conceptually and does not necessarily represent the actual dimensional ratio.

[Embodiment]
[Configuration of the joint]
First, a bonded body according to an embodiment of the present invention will be described. FIG. 1 is a schematic cross-sectional view showing an example of a bonded body according to an embodiment of the present invention. A bonded body 10 according to an embodiment of the present invention is formed by bonding a ceramic member 20 mainly composed of AlN and a metal member 30 made of a high-melting point metal. A ceramic member mainly composed of AlN means that it contains 90 wt% or more of AlN. In addition, a metal member made of a high-melting point metal refers to one that can be applied with a melting point of 2000° C. or more, such as molybdenum (Mo), tungsten (W), tantalum (Ta), etc., and has a purity of 99 wt% or more. This suppresses deformation of the metal member 30 even at the temperature during uniaxial pressure firing. At the same time, a high-melting point metal oxide having a relatively high melting point of 900° C. or more is formed at the interface between AlN and the metal member 30, so that deformation of the bonding interface between AlN and the metal member 30 can be suppressed.

In the bonded body 10, the ceramic member 20 is bonded to at least one of the main surfaces of the metal member 30. The metal member 30 preferably has a maximum diameter that is 50% or more of the maximum diameter of the ceramic member 20. The ceramic member 20 is preferably bonded to the entire surface of one of the main surfaces of the metal member 30. These characteristics allow the metal member 30 to be used in a variety of forms according to various applications. The ceramic member 20 is preferably bonded directly to one of the main surfaces of the metal member 30 without using another member. This is because using another member may reduce the bond strength.

The ceramic member 20 includes a second phase made of a metal oxide. The metal constituting the metal oxide of the second phase is preferably one or more selected from Y and Ca, and more preferably Y. The metal oxide constituting the second phase may be a sintering aid for a ceramic member mainly composed of AlN. In that case, the metal oxide constituting the second phase may be added in a necessary amount as a sintering aid for the ceramic member. For example, when Y is added as a sintering aid, it may be added in an amount of 0.1 wt % or more _and 5 wt % or less in terms of _Y2O3 .

The metal member 30 has a maximum thickness of 1 mm or more in a direction perpendicular to one of the main surfaces 32 of the metal member 30. In this way, the metal member 30 has a large thickness, and can be used for various purposes, such as using the metal member 30 as a heat sink or heat spreader, or improving the strength and dimensional accuracy of the ceramic member 20. The one of the main surfaces 32 of the metal member 30 is the bonding surface with the ceramic member 20. The metal member 30 being thick means that the maximum thickness in a direction perpendicular to one of the main surfaces 32 of the metal member 30 is 1 mm or more. If the maximum thickness of the metal member 30 is less than 1 mm, the effect of improving the dimensional accuracy is not fully exerted, so it is preferable that the thickness is 1 mm or more.

The maximum thickness in the direction perpendicular to one of the main surfaces 32 of the metal member 30 is preferably set according to the intended application. Considering that there have been no joints with thick metal members 30 as in the present invention, depending on the application, for example, it is preferably 2 mm or more, more preferably 3 mm or more, and even more preferably 4 mm or more.

At the bonding interface between the ceramic member 20 and the metal member 30, the concentration of the metal constituting the second phase of the ceramic member 20 and the oxygen concentration are greater than the concentration of the metal and the oxygen concentration inside the ceramic member 20, respectively. In this way, the concentration of the metal and the oxygen concentration of the second phase constituting the bonding interface between the ceramic member 20 mainly composed of AlN and the metal member 30 made of a high melting point metal are greater than the concentration of the metal and the oxygen concentration inside the ceramic member 20, respectively, so that the ceramic member 20 and the metal member 30 are bonded via these, and a bonded body in which erosion and contamination of the bonding surface is suppressed is obtained.

The bonded interface between the ceramic member 20 and the metal member 30 refers to the interface where the concentration of the metal element that mainly constitutes the metal member 30 drops sharply in cross-sectional elemental mapping by EDX or EPMA. The inside of the ceramic member 20 refers to a region at least 1 mm away from the bonded interface where the concentration of the metal that constitutes the second phase of the ceramic member 20 is uniform.

Changes in the concentration of metals present in the ceramic member 20, the metal member 30, or their joint interface can be determined by comparing the intensity (number of counts) of characteristic X-rays in the relevant area using EPMA. This allows for a relative evaluation of the differences in metal and oxygen concentration near and inside the interface.

It is preferable that the ceramic member 20 further contains a Group 4 metal, and that the metal member 30 has the Group 4 metal diffused therein. In this way, the ceramic member 20 contains a Group 4 metal, and the metal member 30 has the Group 4 metal diffused therein, thereby increasing the bonding strength between the ceramic member 20 and the metal member 30, and increasing the reliability of the bonded body 10. It is preferable that the Group 4 metal is one or more selected from Ti and Hf, and more preferably Ti.

It is preferable that the metal member 30 contains 1 wt% or less of the second metal oxide. When the metal member 30 contains 1 wt% or less of the second metal oxide, the bonding strength between the ceramic member 20 and the metal member 30 is increased, and the reliability of the bonded body 10 is improved. The metal constituting the second metal oxide is preferably one or more selected from Y, Ce, and Ca, and is more preferably Y or Ce. The metal constituting the second metal oxide may be the same as the metal constituting the second phase metal oxide of the ceramic member 20. These metal oxide components already contained in the metal member 30 can increase the metal and oxygen concentration at the bonding interface, thereby increasing the bonding strength.

2 is a schematic cross-sectional view showing a modified example of the bonded body according to the embodiment of the present invention. As shown in FIG. 2, it is preferable that a ceramic member 20 is further bonded to the other main surface 34 of the metal member 30 opposite to the one main surface 32. In this way, by bonding the ceramic members 20 to both main surfaces of the metal member 30, the uses of the bonded body 10 are further expanded. In addition, by sandwiching a plate-shaped high-melting point metal (metal member 30) between the ceramic members 20, it is possible to suppress warping of the bonded body 10, and it is possible to produce a bonded body 10 with high dimensional accuracy. Note that the one main surface 32 and the other main surface 34 are referred to as both main surfaces 32, 34, or the main surfaces 32, 34 together. In addition, the bonded body 10 may have a ceramic member 20 bonded to a surface other than the main surfaces 32, 34.

[Configuration of electrode-embedded member]
Next, an electrode-embedded member according to an embodiment of the present invention will be described. Fig. 3 is a schematic cross-sectional view showing an example of an electrode-embedded member according to an embodiment of the present invention. An electrode-embedded member 50 according to an embodiment of the present invention includes a bonded body 10 and an electrode 40 embedded in a ceramic member 20 of the bonded body 10.

The joined body 10 is the joined body 10 described above. The electrode 40 is embedded in the ceramic member 20 of the joined body 10. The electrode 40 can be in various shapes, such as a mesh shape or a foil shape. The electrode 40 can also be made of various materials, such as molybdenum and tungsten. The electrode 40 can be used as a heater electrode.

The electrode embedding member 50 may be provided with terminal holes and terminals (not shown).

The bonded body and electrode-embedded member of the present invention are members that suppress erosion and contamination of the bonding surface of a ceramic member whose main component is AlN and a metal member made of a high-melting point metal. In addition, since the thickness of the metal member of the bonded body and electrode-embedded member of the present invention is thick, the metal member can be used as a heat sink or heat spreader, or to increase the strength and dimensional accuracy of the ceramic member, making it applicable to a variety of uses.

[Method of manufacturing the bonded body]
Next, a method for manufacturing the bonded body 10 configured as described above will be described. Figures 4(a) to 4(e) are cross-sectional views each showing a schematic diagram of one stage of the manufacturing process of the manufacturing method according to the embodiment of the present invention.

First, the metal oxide raw powder is added to the AlN raw powder, and the resulting powder is granulated to produce the granulated powder 22. The AlN raw powder is preferably highly pure, and the purity is preferably 96% or more, more preferably 98% or more. The average particle size of the AlN powder is preferably 0.1 μm or more and 1.0 μm or less, more preferably 0.3 μm or more and 0.8 μm or less. When Y ₂ O ₃ is used as the metal oxide raw powder, for example, 0.1 wt % to 5 wt % of Y ₂ O ₃ is added to the AlN raw powder, and a binder such as a PVA-based binder, a dispersant, and a solvent are added to prepare a slurry, and the granulated powder 22 is granulated by a spray dryer or the like.

Next, a plate-shaped high melting point metal 36 having a thickness of 1 mm or more is prepared, and the granulated powder 22 or a compact formed from the granulated powder and the plate-shaped high melting point metal 36 having a thickness of 1 mm or more are stacked in a bottomed carbon mold 60 (molding mold) so that one main surface of the plate-shaped high melting point metal 36 is perpendicular to the stacking direction.

As another example of stacking the green bodies, one or more green bodies are produced using the obtained granulated powder 22. The green bodies can be formed by known methods such as uniaxial pressing or cold isostatic pressing (CIP). The method of forming the green bodies is not limited to pressing, and can also be, for example, green sheet stacking or casting.

When producing the electrode-embedded member 50, the granulated powder 22 is temporarily pressed when it is stacked, the electrode 40 is placed, and the granulated powder 22 is further added and temporarily pressed, or the compacts are stacked, the electrode 40 is placed, and the compacts are further stacked, so that the electrode 40 is embedded in the portion that will become the ceramic member 20 after sintering.

Next, a carbon punch 70 is inserted into the carbon mold 60 to form the laminate 12. The laminate 12 may be two layers, a layer of granulated powder 22 or a molded body that will become the ceramic member 20 after sintering, and a plate-shaped high-melting point metal 36 that will become the metal member 30 after sintering, or it may be three layers in which the plate-shaped high-melting point metal 36 is sandwiched between layers of granulated powder 22 or a molded body. In addition, the side surface in the stacking direction may have a portion where the plate-shaped high-melting point metal 36 is exposed, or the plate-shaped high-melting point metal 36 may be covered with the granulated powder 22 or the molded body. Figure 4 shows a case where the plate-shaped high-melting point metal 36 is covered with the granulated powder 22 and is made into three layers.

Next, the laminate 12 is uniaxially pressurized and sintered to produce the bonded body 10. The sintering conditions are, for example, a temperature of 1700°C to 2000°C, a pressure of 1 MPa or more, and a holding time of 0.1 hours to 10 hours.

After firing, a process may be provided to process the plate-shaped high-melting point metal 36 into a predetermined shape. At this time, if the side surface in the stacking direction of the plate-shaped high-melting point metal 36 is covered with a ceramic member, processing may be performed to expose the plate-shaped high-melting point metal 36. Also, if the plate-shaped high-melting point metal 36 is a three-layer structure sandwiched between layers of ceramic members 20, processing may be performed to remove a part of the ceramic members 20 or all of one of the ceramic members 20. Also, a process may be provided to process the shape of the plate-shaped high-melting point metal 36. At this time, processing is performed so that the maximum thickness of the plate-shaped high-melting point metal 36 in the direction perpendicular to one main surface 32 does not fall below 1 mm.

In addition, when an electrode-embedded member 50 is used, a process for exposing a portion of the electrode 40 and a process for connecting a terminal to the electrode 40 may be provided.

In addition, the method of producing and laminating a molded body may include a step of degreasing the molded body to produce a degreased body and a step of calcining the degreased body to produce a calcined body. In this case, for example, the degreasing temperature is preferably 400°C or higher and 800°C or lower, and the degreasing time is preferably 1 hour or higher and 120 hours or lower. The degreasing atmosphere is preferably an air atmosphere or a nitrogen atmosphere, and more preferably an air atmosphere. Also, for example, the calcination temperature is preferably 1200°C or higher and 1700°C or lower, and the calcination time is preferably 0.5 hours or higher and 12 hours or lower. The calcination atmosphere is preferably a nitrogen or inert gas atmosphere, but may be a vacuum atmosphere or the like.

This method makes it possible to manufacture a joint or electrode-embedded member that suppresses erosion and contamination of the joint surface between a ceramic member whose main component is AlN and a metal member made of a high-melting point metal.

[Example]
(Preparation of Conjugate)
Example 1
5 wt % _{of Y2O3} was added to the AlN raw material powder, and a binder (PVA), a dispersant, and a solvent were added to prepare a slurry, which was then granulated by a spray dryer.Mo with a diameter of Φ50 mm and a thickness of 5 mm was prepared as a plate-shaped high-melting point metal to be the metal member.

Next, the granulated powder was filled into a bottomed carbon mold and pressed with a carbon punch to produce a molded body with a diameter of Φ80 mm and a thickness of 10 mm. Next, Mo was placed on the molded body. Next, the carbon mold was further filled with granulated powder to embed the Mo. At this time, the granulated powder was filled and molded with the carbon punch so that the thickness from the top surface of the Mo was 10 mm.

Then, with the carbon punch inserted into the carbon mold, uniaxial hot press sintering was performed for 2 hours at a temperature of 1800°C, a pressure of 4 MPa, and a _N2 atmosphere. As a result, a metal member made of Mo with a diameter of 50 mm could be embedded inside an AlN sintered body with a diameter of 80 mm. In this way, the bonded body of Example 1 was produced. After that, multiple test pieces of Example 1 with dimensions of 3 mm x 4 mm x 19 mm were cut out so that the lamination direction was the long side.

Example 2
A joint body of Example 2 was produced under the same process and conditions as Example 1, except that the granulated powder of Example 1 was changed to AlN raw material powder to which 5 wt % of Y ₂ O ₃ and 0.9 wt % of TiN were added.

Example 3
A joint body of Example 3 was produced under the same process and conditions as Example 1, except that the high melting point metal was replaced with an alloy of Mo with 0.4 wt % Y ₂ O ₃ added.

Example 4
A joint body of Example 4 was produced using the same process and conditions as in Example 1, except that the high melting point metal was replaced with W.

(Measurement of Bonding Strength)
The bond strength of the bonded bodies was measured by a three-point bending strength test in accordance with JIS R1601 2008 (room temperature bending strength test method for fine ceramics). The span was 10 mm, and the bond surface was placed at the center in the longitudinal direction, and the measurement was performed by aligning the knife edge with the bond surface. Five test pieces were prepared for each sample, and the average of the five measurements was used as the bond strength value for each sample.

(Measurement results)
It was found that sufficient bonding strength was obtained, with the bonding strength being 77 MPa in Example 1 and 90 MPa in Example 4. The bonding strength was 115 MPa in Example 2, which was higher than that of the sample in Example 1. Moreover, the bonding strength was 103 MPa in Example 3, which was higher than that of the sample in Example 1.

Example 5
(Preparation of electrode-embedded member)
In Example 5, a heater electrode was embedded in an AlN sintered body (ceramic member) located on Mo in the manufacturing method of Example 1, to fabricate a heater module that can be used in processes under high temperatures.

The granulated powder was prepared in the same manner as in Example 1. In addition, a plate-shaped Mo with a diameter of Φ300 mm and a thickness of 8 mm was prepared as a plate-shaped high-melting point metal to be used as the metal member.

First, a heater laminate was produced. The granulated powder was filled into a bottomed carbon mold and pressed with a carbon punch to produce a molded body with a diameter of Φ320 mm and a thickness of 8 mm. Next, a heater electrode was placed on the molded body. The heater electrode was a Mo mesh (wire diameter 0.1 mm, mesh size #50, plain weave) cut into a specified pattern to match the resistance value of the heater electrode. Next, the carbon mold was further filled with granulated powder and the heater electrode was embedded to produce a heater laminate. At this time, the granulated powder was filled and molded with a carbon punch so that the thickness from the top surface of the heater electrode was 8 mm.

Next, a plate-shaped Mo was placed on the heater laminate. The carbon mold on which the Mo was placed was further filled with granulated powder to embed the Mo. At this time, the plate-shaped Mo was molded with a carbon punch so that the thickness from the top surface was 8 mm, and a laminate was produced. In this way, a heater laminate and a laminate in which plate-shaped high-melting point metal were stacked were produced.

Then, with the carbon punch inserted into the carbon mold, uniaxial hot press firing was performed at a temperature of 1800°C, a pressure of 4 MPa, and an _N2 atmosphere for 4 hours. After firing, external processing (Φ300 mm x 18 mm) was performed. Drilling terminal holes for connecting each electrode to an external power source, connecting the terminals, and fabricating the necessary insulating structure were performed simultaneously during processing after firing. In this manner, the electrode-embedded member of Example 5 was fabricated.

(evaluation)
The manufactured heater module could be heated to 400° C. by passing electricity through the heater electrodes from an external power source.

Next, the cut surface of the sample of Example 1 perpendicular to the stacking direction was subjected to elemental analysis and mapping using EPMA. Figures 5(a) to (d) are photographs showing the EPMA mapping of Example 1. Figure 5(a) is an SEM image of the analyzed field of view of the cross section of Example 1. Figures 5(b) to (d) are photographs in which Mo, Y, and O were mapped, respectively. The gray and white areas indicate the areas where Mo, Y, and O were detected, respectively.

As shown in Figures 5(a) to (d), it was found that Y and O are present in the ceramic member (AlN), but are present in greater amounts at the bonding interface between the ceramic member and the high-melting-point metal member (Mo). In other words, it was confirmed that at the bonding interface between the ceramic member and the metal member, the metal concentration and oxygen concentration constituting the second phase of the ceramic member are greater than the metal concentration and oxygen concentration, respectively, inside the ceramic member.

The bonded body of the present invention is likely to have a chemical bond between Mo and AlN due to the high concentration of metal and oxygen that constitute the second phase of the ceramic member at the bonding interface between the ceramic member and the metal member. In addition, the manufacturing method of the present invention exceeds the recrystallization temperature of Mo during sintering, so it is presumed that Mo penetrates into the irregularities on the surface of the AlN sintered body due to plastic deformation of Mo at the bonding surface, exerting an anchor effect, resulting in even higher bonding strength.

From the above, it has been confirmed that the bonded body and electrode-embedded member of the present invention are bonded bodies and electrode-embedded members that can suppress erosion and contamination of the bonded surfaces, have strong bond strength, and have thick metal members. It has also been confirmed that the manufacturing method of the present invention can manufacture such bonded bodies or electrode-embedded members.

The present invention is not limited to the above-described embodiment, and it goes without saying that it covers various modifications and equivalents that fall within the spirit and scope of the present invention. Furthermore, the structure, shape, number, position, size, etc. of the components shown in each drawing are for convenience of explanation and may be changed as appropriate.

REFERENCE SIGNS LIST 10 Bonded body 12 Laminated body 20 Ceramic member 22 Granulated powder 30 Metal member 32 One main surface 34 The other main surface 36 Plate-shaped high melting point metal 40 Electrode 50 Electrode-embedded member 60 Carbon mold 70 Carbon punch

Claims (5)

A joined body of a ceramic member mainly composed of AlN and a metal member made of Mo, W or a Mo alloy as a high melting point metal having a melting point of 2000°C or more,
The ceramic member has an electrode embedded therein,
The ceramic member is joined to at least one main surface of the metal member,
The ceramic member includes a second phase composed of Y ₂ O ₃ as a metal oxide,
The metal member has a maximum thickness of 1 mm or more in a direction perpendicular to one main surface of the metal member,
A bonded body characterized in that at a bonding interface between the ceramic member and the metal member, the concentration of the metal constituting the second phase of the ceramic member and the oxygen concentration are greater than the concentration of the metal and the oxygen concentration inside the ceramic member, respectively. The ceramic member contains Ti as a Group 4 metal,
2. The joint body according to claim 1, wherein Ti as the Group 4 metal is diffused in the metal member. The bonded body according to claim 1 or 2, characterized in that the metal member contains 1 wt% or less of a second metal oxide. The joined body according to any one of claims 1 to 3, characterized in that a ceramic member is further joined to the other main surface of the metal member opposite to one of the main surfaces. A method for manufacturing a joined body of ceramic members mainly composed of AlN and metal members made of Mo, W or a Mo alloy as a high melting point metal having a melting point of 2000°C or more, comprising:
The AlN raw powder is mixed with Y as a metal oxide. ₂ O ₃ A step of granulating the powder to which the raw material powder is added to produce a granulated powder;
A step of stacking the granulated powder or a compact formed from the granulated powder and the plate-shaped high-melting point metal having a thickness of 1 mm or more on a carbon mold such that one main surface of the plate-shaped high-melting point metal is perpendicular to a stacking direction;
embedding an electrode in the molded body or stacking the electrode on the carbon mold so as to sandwich the electrode between the molded bodies;
inserting a carbon punch into the carbon mold to form a laminate;
and a step of uniaxially pressurizing and sintering the laminate.