JP7712480B2 - Component push-up device and component mounting device - Google Patents

Description

The present invention relates to a component push-up device that pushes up and peels off a die (bare chip) from below a wafer sheet when picking up the die from a wafer attached to the wafer sheet, and a component mounting device equipped with this component push-up device.

Conventionally, component mounting devices are known that pick up dies (bare chips) from a diced wafer and mount them on a board. In these component mounting devices, a wafer is brought into a designated position (component placement area) inside the device by a wafer feeder, and a wafer camera captures the image of the wafer to recognize it. The die is then picked up by a head equipped with a die holding function, and this operation is repeated.

The component mounting device is equipped with a component push-up device that pushes up the die from below the wafer attached to the wafer sheet, thereby peeling the die from the wafer sheet prior to picking. The component push-up device has a cylindrical suction housing and one or more push-up pins that are provided in a central portion and can be raised and lowered, and while the wafer sheet is negatively pressure-adsorbed from the underside by the suction housing, the die is pushed up from below by the push-up pins.

Dies come in a wide variety of sizes, and it is necessary to use suction housings and push-up pins that are appropriate for the die size. For this reason, operators often manually replace the suction housings and push-up pins. In recent years, a component push-up device has been proposed in which multiple types of push-up tools (peeling promotion heads) equipped with suction housings and push-up pins are kept on standby, as in Patent Document 1, and the push-up tools are automatically replaced for the push-up units (chip peeling promotion units).

This component push-up device is a type of component push-up device in which a component push-up unit moves relative to a wafer to push up a die. The push-up unit is provided with a push-up head (peeling promotion head mounting part) that can rotate between a vertical position and a horizontal position, and the push-up tool is removably mounted on the tool mounting part of the push-up head. The standby push-up tool is arranged sideways. When replacing the push-up tool, the push-up head is displaced from a vertical position to a horizontal position, and moves up and down and horizontally to the standby position of the push-up tool. Then, first, the push-up tool mounted on the tool mounting part is locked by the locking arm, and in this state, the push-up head retreats to remove the push-up tool from the tool mounting part. Next, the push-up head moves to the position of the replacement push-up tool, and the said push-up tool is mounted on the tool mounting part. After that, the push-up head is reset from the horizontal position to the vertical position, and the replacement of the push-up tool is completed.

As described above, the component thrust-up device of Patent Document 1 requires a drive mechanism and its control for a total of four axes, including three axes (X-axis, Y-axis, and Z-axis) for linear movement of the thrust-up head and one axis for rotation, as a drive system for changing the thrust-up tool. In addition, the same number of locking arms and their drive mechanisms as the number of thrust-up tools to be kept on standby are also required. As a result, the configuration and control of the drive system for changing the thrust-up tools are generally complex.

JP 2008-258524 A

The present invention has been made in consideration of the above-mentioned problems, and its purpose is to enable automatic replacement of a push-up tool equipped with a suction housing and a push-up pin in a component push-up device with a simpler configuration and control.

A component push-up device according to one aspect of the present invention is a component push-up device that pushes up a die from below a wafer attached to a wafer sheet, thereby peeling the die from the wafer sheet, and is provided with a suction surface that negatively suctions the underside of the wafer sheet, and a plurality of push-up tools each having a push-up pin that is provided so as to be able to protrude from the suction surface toward the wafer sheet side, a tool mounting section to which the plurality of push-up tools are selectively and vertically detachably mounted, a push-up head that is movable relative to the wafer sheet in a direction along the wafer sheet and in a vertical direction, and a tool storage table that is capable of supporting each of the plurality of push-up tools in the same position as when the tools are mounted on the tool mounting section. the push-up tool is attached to the tool mounting section by the holding member and returned to the tool storage table by controlling the push-up head and the tool transfer mechanism; and a control unit that controls the push-up head and the tool transfer mechanism to perform a tool returning operation of removing the push-up tool attached to the tool mounting section by the holding member and returning it to the tool storage table and/or a tool mounting operation of holding the push-up tool supported on the tool storage table by the holding member and mounting it on the tool mounting section.

In addition, a component mounting device according to one aspect of the present invention includes a component supply section in which wafers that have been diced and attached to a wafer sheet are placed, a head that picks up and transfers dies from the wafer placed in the component supply section, and the above-mentioned component push-up device that pushes up the dies from below the wafer sheet when the head picks up the dies.

FIG. 1 is a plan view of a main body of a component mounting apparatus according to the present invention (a component mounting apparatus equipped with a component push-up device according to the present invention). FIG. 2 is a plan view showing the wafer table and the wafer table drive mechanism. FIG. 3 is a schematic perspective view of the push-up unit and the tool storage unit. FIG. 4 is a cross-sectional view of the tip portion of the thrust head. FIG. 5 is a perspective view of a head body of the thrust-up head, a thrust-up tool, and a tool storage table. FIG. 6 is a block diagram showing a control system of the component mounting apparatus. FIG. 7 is a flowchart showing the control of the thrust-up tool replacement process. FIG. 8 is an explanatory diagram of the operation of each part when replacing the thrust-up tool. FIG. 9 is an explanatory diagram of the operation of each part when replacing the thrust-up tool. FIG. 10 is an explanatory diagram of the operation of each part when replacing the thrust-up tool. FIG. 11 is a schematic diagram showing an image of the suction surface of the push-up head (suction housing) captured by the wafer camera. FIG. 12 is an explanatory diagram of height detection of the thrust-up tool.

[Description of component mounting device 1]
1 is a top plan view showing the overall configuration of a component mounting device 1 according to an embodiment of the present invention. The component mounting device 1 is a hybrid type component mounting device capable of mounting a die 7a (component) diced from a wafer 7 on a substrate P in addition to completed components such as transistors and capacitors. The component mounting device 1 includes a device main body 100 and a control unit 200 (see FIG. 6). In the figure, XYZ rectangular coordinates are shown to clarify the directional relationship.

The device main body 100 includes a base 2, a conveyor 3, a head unit 4, a part supply section 5, a push-up unit 40 and a tool storage unit 60.

The base 2 is a mounting base for various devices provided in the device main body 100. The conveyor 3 is a transport line for the board P, installed on the base 2 to extend in the X direction. The conveyor 3 carries the board P from outside the machine to a predetermined mounting work position, and after the mounting work is completed, carries the board P from the mounting work position to outside the machine. The position where the board P is shown in Figure 1 is the mounting work position. The component supply units 5 are provided on both the -Y side and +Y side of the conveyor 3.

The head unit 4 picks up components in the component supply section 5, moves to the mounting work position, and mounts the components on the board P. The head unit 4 has a plurality of heads 4H, each equipped with a suction nozzle that holds the components by negative pressure suction during the pick-up. The heads 4H can move forward and backward (up and down) in the Z direction relative to the head unit 4, and can rotate around an axis. The head unit 4 is equipped with a board recognition camera 12 that images the board P. The federal mark affixed to the board P is recognized from the image captured by the board recognition camera 12.

The device main body 100 includes a head unit drive mechanism D1 that allows the head unit 4 to move horizontally (XY direction) between the component supply unit 5 and the substrate P held at the mounting work position. The head unit drive mechanism D1 includes a pair of Y-axis rails 13, a Y-axis motor 14, and a ball screw shaft 15 on the +X side and -X side, respectively, provided on an elevated frame 11, and a support frame 16 that is installed between the pair of Y-axis rails 13. The ball screw shaft 15 is screwed into a nut provided on the support frame 16. The head unit drive mechanism D1 also includes a guide member (not shown) mounted on the support frame 16, an X-axis motor 17, and a ball screw shaft 18. The guide member supports the head unit 4 so that it can move in the X direction, and the ball screw shaft 18 is screwed into a nut (not shown) provided on the head unit 4.

Operation of the head unit drive mechanism D1 moves the head unit 4 in the horizontal direction. In other words, the ball screw shaft 15 is rotated by the Y-axis motor 14, causing the head unit 4 to move in the Y direction together with the support frame 16, and the ball screw shaft 18 is rotated by the X-axis motor 17, causing the head unit 4 to move in the X direction relative to the support frame 16.

The component supply unit 5 includes a first component supply unit 5A located on the -Y axis of the conveyor 3, and a second component supply unit 5B located on the +Y side. In the first component supply unit 5A, multiple tape feeders 19 are arranged in parallel along the conveyor 3. The tape feeders 19 are a type of component supply device that feeds by unwinding a tape on which completed components such as the transistors and capacitors mentioned above are stored at regular intervals.

The second component supply section 5B is equipped with a wafer supply device 6 which supplies a plurality of dies 7a in the form of a wafer 7, a component transfer unit 33 which picks up the die 7a from the wafer 7 and transfers it to a predetermined transfer position for the head unit 4, a wafer camera 39, and a component recognition camera 10.

The wafer supply device 6 includes a wafer storage elevator 22, a wafer table 20, and a wafer pull-out unit 23. The wafer storage elevator 22 stores wafer sheets 8a with wafers 7 attached thereto in multiple vertical stages while the wafer sheets 8a are held by wafer holders 8. The wafer storage elevator 22 raises and lowers the wafers 7 stored in the multiple stages as a unit, and positions any wafer 7 at a height corresponding to the height of the wafer table 20.

The wafer table 20 is arranged on the -Y side of the wafer storage elevator 22. The wafer table 20 is a workbench for removing parts that holds the wafer holder 8 (wafer 7). The wafer supply device 6 is equipped with a wafer table drive mechanism D2 that enables the wafer table 20 to move horizontally (XY directions).

Figure 2 is a plan view showing the wafer table 20 and wafer table drive mechanism D2. The wafer table drive mechanism D2 comprises a pair of X-axis rails 30 on the +Y side and -Y side, an X-axis motor 31, a ball screw shaft 32, and a plate-shaped support frame 26 mounted on the pair of X-axis rails 30. The ball screw shaft 32 is screwed into a nut provided on the support frame 26. The wafer table drive mechanism D2 also comprises a pair of Y-axis rails 27 on the +X side and -X side provided on the support frame 26, a Y-axis motor 28, and a ball screw shaft 32. The ball screw shaft 32 is screwed into a nut provided on the wafer table 20.

Operation of this wafer table drive mechanism D2 moves the wafer table 20 in the horizontal direction. That is, the ball screw shaft 32 is rotated by the X-axis motor 31, causing the wafer table 20 to move in the X direction together with the support frame 26, and the ball screw shaft 29 is rotated by the Y-axis motor 28, causing the wafer table 20 to move in the Y direction relative to the support frame 26. When the head 4H picks up the die 7a, the movement of the wafer table 20 positions the target die 7a at a predetermined pickup position P1 defined by the XY coordinates.

The wafer withdrawal unit 23 takes in and out the wafer holder 8 between the wafer storage elevator 22 and the wafer table 20. The wafer withdrawal unit 23 includes a withdrawal head 24 capable of engaging the wafer holder 8, and a withdrawal head drive unit 25 that moves the withdrawal head 24 in the Y direction.

The wafer pull-out unit 23 moves the wafer holder 8 by moving the pull-out head 24 in the Y direction while the wafer holder 8 is engaged by the pull-out head 24. In other words, the wafer 7 is moved together with the wafer holder 8 into and out of the wafer storage elevator 22. This movement of the wafer holder 8 into and out of the wafer storage elevator 22 is made possible by positioning the wafer table 20 at a predetermined wafer insertion/removal position closely facing the -Y side of the wafer storage elevator 22.

The component transfer unit 33 includes a transfer head 34 that picks up the die 7a placed at the pickup position P1 from the wafer 7, a transfer table 38 for transferring the die 7a to the head unit 4, and a transfer head drive mechanism D3 that enables the transfer head 34 to move.

The transfer head 34 is equipped with a suction nozzle 34a that holds the die 7a by negative pressure suction. The transfer head 34 picks up the die 7a at the pick-up position P1 by negative pressure suction. The suction nozzle 34a can move forward and backward (up and down) in the Z direction relative to the base part of the transfer head 34, and can rotate around a horizontal axis. By rotating the transfer head 34 around the horizontal axis, it is possible to invert the position of the die 7a upside down.

The negative pressure passage that supplies negative pressure to the suction nozzle 34a is equipped with a negative pressure sensor Se4 (see FIG. 6) capable of detecting the negative pressure level. A position sensor Se5 (see FIG. 6) such as an encoder is built into the motor (not shown) for moving the transfer head 34 back and forth, and the Z coordinate of the transfer head 34, i.e., the height, can be detected based on the position information detected by the position sensor Se5. The "negative pressure level" detected by the negative pressure sensor Se4 and the "position information" detected by the position sensor Se5 are information capable of detecting the height of the push-up tool 45 attached to the push-up head 41, as described below. Therefore, in this example, the negative pressure sensor Se4 and the position sensor Se5 correspond to the "acquisition unit" of the present invention.

The transfer table 38 is a transfer table for transferring the die 7a held by the suction nozzle 34a to the head 4H of the head unit 4. The transfer table 38 is disposed at a predetermined transfer position adjacent to the mounting work position.

The transfer head drive mechanism D3 includes a rail 37 that movably supports the transfer head 34, a ball screw shaft 36 arranged parallel to the rail 37, and a motor 35. The ball screw shaft 36 is screwed into a nut provided on the transfer head 34. The transfer head drive mechanism D3 moves the transfer head 34 in the space between the pickup position P1 and the transfer table 38 by driving the ball screw shaft 36 to rotate by the motor 35.

The wafer camera 39 captures an image from above of a portion of the wafer 7 held on the wafer table 20 at the pickup position P1, i.e., the die 7a within the camera's field of view. Based on this captured image, the position of the die 7a to be picked up is recognized. The wafer camera 39 is supported by an elevated frame (not shown) so that it is positioned above the transfer head 34 when the transfer head 34 is placed at the pickup position P1. This avoids interference with the transfer head 34.

The component recognition camera 10 is disposed at a position adjacent to the +X side of the transfer table 38. The component recognition camera 10 captures an image of the components (die 7a and completed components) adsorbed to the head 4H of the head unit 4 from below before mounting them on the substrate P. Based on this captured image, the state of the components adsorbed by the head 4H is recognized.

3 is a schematic perspective view of the push-up unit 40 and the tool storage unit 60. As shown in FIGS. 2 and 3, the push-up unit 40 and the tool storage unit 60 are disposed below the component supply section 5, specifically, below the support frame 26 of the wafer table drive mechanism D2. The wafer table 20 is provided with a circular opening 20a, and the support frame 26 is provided with an opening (not shown) at a position that may overlap with the opening 20a. The push-up unit 40 is disposed below these openings. In other words, when the wafer holder 8 is held on the wafer table 20, the wafer 7 is disposed inside the opening 20a. The push-up unit 40 pushes up the die 7a through the openings of the support frame 26 and the wafer table 20.

The thrust unit 40 includes a thrust head 41 and a thrust head drive mechanism D6. As shown in Figures 3 and 4(a), the thrust head 41 includes a shaft-shaped head main body 42 extending in the Z direction and a thrust tool 45 attached to the upper end of the head main body 42. Note that Figure 4(a) is a cross-sectional view of the tip portion of the thrust head 41.

The thrust head 41 is arranged so that the head body 42 is located at the pickup position P1. The head body 42 is cylindrical and has a thrust main shaft 44 at its center that moves back and forth (up and down) in the Z direction.

The push-up tool 45 includes a suction housing 46 (sometimes called an "suction dome") for suctioning the wafer sheet 8a from below, and a pin holder 48 disposed inside the suction housing 46. The suction housing 46 is a cylindrical member with a top that includes a suction surface portion 46a having a circular suction surface in a plan view for negatively suctioning the wafer sheet 8a, and a cylindrical portion 46b extending downward from its periphery. A plurality of pin holes 47 are formed in a predetermined arrangement in the suction surface portion 46a.

A push-up tool 45 is removably attached to the tip (top end) of the head body 42 via the suction housing 46. Specifically, a tool attachment section 43 having a smaller diameter than the other parts is formed at the tip of the head body 42, and the cylindrical section 46b of the suction housing 46 is fitted into this tool attachment section 43, thereby attaching the push-up tool 45 to the head body 42. In the following description, for convenience, it may also be said that the push-up tool 45 is attached to the push-up head 41.

The pin holder 48 is a member in which one or more push-up pins 50 are erected on a disk-shaped pin base 49, and is held in the suction housing 46 in a state in which it can move in the Z direction along the inner circumferential surface of the cylindrical portion 46b. As shown in FIG. 4B, the pin holder 48 is pushed up against the suction housing 46 by the forward (upward) movement of the push-up main shaft 44. As a result, the push-up pin 50 protrudes upward from the suction surface portion 46a through the pin hole 47. When the push-up main shaft 44 moves backward (downward), the pin holder 48 descends against the suction housing 46 by its own weight or by the biasing force of an elastic member (spring, etc.) not shown in the figure. As a result, the push-up pin 50 retreats into the suction housing 46 (pin hole 47). That is, the push-up pin 50 is provided so as to be able to protrude upward from the suction surface portion 46a.

When the die 7a is picked up, negative pressure is supplied into the suction housing 46 through the head main body 42. This negative pressure causes the wafer sheet 8a to be adsorbed through the pin holes 47. In other words, with the wafer sheet 8a being negatively adsorbed through the suction surface 46a of the suction housing 46, the push-up pins 50 protrude from the suction surface 46a, pushing up the die 7a through the wafer sheet 8a.

The number, arrangement, size (diameter, length) and tip shape of the push-up pins 50 vary depending on the size of the die 7a and the circuit formed thereon. A tool storage unit 60 (described later) holds and stores a plurality of push-up tools 45 of different configurations, and when picking the die 7a, a push-up tool 45 predetermined for each type of die 7a (wafer 7) is attached to the push-up head 41.

The thrust head drive mechanism D6 is, for example, a cylinder mechanism that uses air as a drive source. The thrust head drive mechanism D6 operates to move the thrust head 41 back and forth (up and down) at the pickup position P1. Specifically, the thrust head 41 moves back and forth between a predetermined thrust height position where the suction surface portion 46a abuts against the lower surface of the wafer sheet 8a and a predetermined standby height position (position shown in FIG. 3) that is retreated downward from the thrust height position. In addition, a first tool detection sensor Se1 (corresponding to the "sensor" of the present invention) that can detect the presence or absence of the thrust tool 45 at the tip of the thrust head 41 is arranged on the -Y side of the thrust head 41 arranged at the standby height position.

2 and 3, the tool storage unit 60 is provided adjacent to the +X side of the push-up unit 40. The tool storage unit 60 includes a tool storage section 60A and a tool transfer mechanism 60B. The tool storage section 60A holds and stores multiple types of push-up tools 45, and the tool transfer mechanism 60B transports the push-up tools 45 between the push-up unit 40 and the tool storage section 60A.

The tool storage section 60A comprises a tool storage table 61 that holds the push-up tool 45, a storage table drive mechanism D4 that moves the tool storage table 61, and a code reading sensor Se3.

2 and 3, the tool storage table 61 is disposed adjacent to the head main body 42 of the push-up head 41 on the +X side. The tool storage table 61 is rectangular in plan view, elongated in the X direction, and has a number of tool holding portions 62 on its upper surface. The tool holding portions 62 are circular recesses formed on the upper surface of the tool storage table 61. The inner diameter of the tool holding portions 62 is set to a dimension that allows the push-up tool 45 (suction housing 46) to fit therein, and the push-up tool 45 is supported on the tool storage table 61 with its lower end loosely fitted into the tool holding portion 62.

In this example, the tool storage table 61 is provided with three tool holding sections 62 arranged in a row at equal intervals in the X direction. As shown in FIG. 2, in a plan view, each tool holding section 62 is provided so that its center is located on a straight line L1 that passes through the center of the head body section 42 of the thrust head 41 and extends in the X direction. The first tool 45A is stored in the tool holding section 62 at the -X side end (referred to as the first tool holding section 62A as appropriate), the second tool 45B is stored in the tool holding section 62 in the middle (referred to as the second tool holding section 62B as appropriate), and the third tool 45C is stored in the tool holding section 62 at the +X side end (referred to as the third tool holding section 62C as appropriate). In FIG. 2 and FIG. 3, the first tool 45A is attached to the thrust head 41, and therefore the first tool holding section 62A is empty.

5 is a perspective view showing the head body 42 of the thrust head 41, the thrust tool 45, and the tool storage table 61. As shown in FIG. 5, a positioning protrusion 43a is provided on the outer peripheral surface of the tool mounting portion 43 of the head body 42, and a positioning recess 56 is provided on the outer peripheral surface of the thrust tool 45 (suction housing 46). The thrust tool 45 is mounted on the tool mounting portion 43 in a state where it is positioned around the vertical axis by the engagement of the positioning protrusion 43a and the positioning recess 56. Meanwhile, a positioning protrusion 63 is provided on the inner peripheral surface of each tool holding portion 62 of the tool storage table 61, and the thrust tool 45 is held in the tool holding portion 62 in a state where it is positioned around the vertical axis by the engagement of the positioning protrusion 63 and the positioning recess 56.

Here, the positioning protrusion 43a of the head main body 42 and each positioning protrusion 63 of each tool holding part 62 are both on the straight line L in a plan view and are both provided on the -X side. In other words, the push-up tool 45 is held on the tool storage table 61 in the same posture (in this example, the vertical direction and the orientation around the axis are both the same) as when it is attached to the tool mounting part 43 of the head main body 42. A second tool detection sensor Se2 is embedded in the inner bottom surface of each tool holding part 62, making it possible to detect the presence or absence of the push-up tool 45 in each tool holding part 62.

The storage table drive mechanism D4 is, for example, a screw feed mechanism driven by a motor. Operation of this storage table drive mechanism D4 causes the tool storage table 61 to move horizontally in the X direction, so that the push-up tool 45 (45A-45B) held on the tool storage table 61 is selectively positioned at a predetermined tool insertion/removal position P2 (corresponding to the "holding position" of the present invention) defined by the XY coordinates. The storage table drive mechanism D4 may also be formed by a cylinder mechanism driven by air.

The code reading sensor Se3 (corresponding to the "first reading unit" and "second reading unit" of the present invention) is a sensor that reads the identification mark of each push-up tool 45 held on the tool storage table 61. The code reading sensor Se3 is disposed on the -Y side of the tool insertion/removal position P2, and reads the identification information recorded in the identification information recording unit provided on the side of the push-up tool 45 disposed at the tool insertion/removal position P2.

Specifically, as shown in Figure 5, a notched flat code portion 52 is formed on the outer periphery on the -Y side of the cylindrical portion 46b of the push-up tool 45 (suction housing 46), and a one-dimensional or two-dimensional identification code 54 is provided on this flat code portion 52 as an identification information recording portion, for example. The code reading sensor Se3 reads this identification code 54. Note that the identification mark is not limited to a one-dimensional or two-dimensional identification code, and various sensors capable of reading an identification mark can be applied to the code reading sensor Se3.

2 and 3, the tool transfer mechanism 60B includes a chuck head 65 and a chuck head drive mechanism D5 that moves the chuck head 65 in the Z direction and the X direction. The chuck head 65 is an electrically driven or air driven parallel opening and closing type chuck device equipped with a pair of claws 66 that can be opened and closed in the X direction. The chuck head 65 holds the push-up tool 45 by clamping the push-up tool 45 from both sides in the X direction with the pair of claws 66.

The chuck head drive mechanism D5 includes, for example, a slider 72 that moves in the X direction by a screw feed mechanism driven by a motor, and a base frame 68 that similarly moves in the Z direction by a screw feed mechanism driven by a motor. The chuck head 65 is attached to the base frame 68. By operating the chuck head drive mechanism D5, the base frame 68 moves in the X direction together with the slider 72, and the base frame 68 moves in the Z direction relative to the slider 72. This moves the chuck head 65 in the X and Z directions. The chuck head drive mechanism D5 may be configured to move the slider 72 and the base frame 68 by a cylinder mechanism driven by air.

2, in a plan view, the pair of jaws 66 are disposed at positions intersecting the straight line L, and the chuck head 65 moves only in the X and Z directions by the operation of the chuck head drive mechanism D5. Therefore, the chuck head 65 clamps the push-up tool 45 on the straight line L.

The cylindrical portion 46b of the push-up tool 45 held by the tool holding portion 62 has a notched flat chuck portion 53 on the outer periphery on the +X side and on the -X axis. The flat chuck portions 53 are parallel to each other. Meanwhile, each claw 66 has a clamping surface parallel to the flat portion 53, and the chuck head 65 clamps the flat chuck portion 53 of the push-up tool 45 with the clamping surfaces of the pair of claws 66. Therefore, the push-up tool 45 is held and transported by the chuck head 65 while maintaining the position in which it is placed on the tool holding portion 62.

[Basic Operation of Component Mounting Apparatus 1]
The basic operation of mounting the die 7a on the substrate P in the component mounting device 1 described above is as follows. First, the wafer table 20 is placed at the wafer loading/unloading position, and the wafer holder 8 is pulled out from the wafer storage elevator 22 to the wafer table 20 by the wafer pull-out unit 23. As a result, the wafer sheet 8a to which the assembly (wafer 7) of multiple dies 7a, 7a... is affixed is placed on the wafer table 20.

Next, the die 7a to be picked up is positioned at the pick-up position P1 by moving the wafer table 20, and the wafer camera 39 captures an image of the die 7a. At this time, the transfer head 34 of the component transfer unit 33 retreats from the pick-up position P1. The wafer camera 39 captures the image in order to recognize the die 7a that the transfer head 34 will pick up in a later picking operation.

When the imaging of the die 7a is completed, the transfer head 34 is positioned at the pick-up position P1, and the suction nozzle 34a picks up the die 7a recognized by the imaging by the wafer camera 39. At this time, the die 7a is pushed up by the push-up head 41. In detail, the push-up head 41 is displaced (raised) from the standby height position to the push-up height position, and the wafer sheet 8a is negatively pressure-adsorbed by the suction surface portion 46a. Thereafter, the push-up main shaft 44 is operated to cause the push-up pin 50 to protrude from the suction surface portion 46a, thereby pushing up the die 7a through the wafer sheet 8a.

After picking up the die 7a, the transfer head 34 moves from above the wafer table 20 to above the transfer table 38. If the die 7a is to be handed over to the head unit 4 with the suction nozzle 34a still in the suction position, the die 7a is released onto the transfer table 38. The transfer head 34 then retreats from above the transfer table 38, and the head unit 4 moves above the transfer table 38, and the head 4H picks up the die 7a from the transfer table 38. After picking up the die 7a, the head unit 4 moves above the component recognition camera 10, above the substrate P at the mounting work position, and then descends. This allows the die 7a to be mounted on the substrate P.

On the other hand, when the die 7a is handed over to the head unit 4 in a position that is upside down from the position suctioned by the suction nozzle 34a, for example, the suction nozzle 34a rotates above the transfer table 38, thereby inverting the position of the die 7a upside down. The head unit 4 then moves above the transfer head 34, and the head 4H picks up the die 7a directly from the suction nozzle 34a. After picking up the die 7a, the head unit 4 moves above the component recognition camera 10, as described above, above the substrate P at the mounting work position. As a result, the die 7a is mounted on the substrate P.

Thereafter, the wafer table 20 moves so that the die 7a to be picked up is positioned at the pick-up position P1, while the transfer head 34 repeats picking up the die 7a and the head 4H repeats mounting the die 7a onto the substrate P.

As mentioned above, the optimal form of the push-up tool 45 used when picking the die 7a varies depending on the size of the die 7a and the circuit formed thereon. Therefore, when the type of die 7a is changed, the push-up tool 45 attached to the push-up head 41 is replaced accordingly. This will be described in detail later.

[Description of the control system of component mounting apparatus 1]
6 is a block diagram showing a control system of the component mounting device 1. As described above, the component mounting device 1 is equipped with the control unit 200, a display unit 90 that displays various information related to the component mounting process, etc., and an input unit 91 that receives input operations of various commands to the control unit 200.

The control unit 200 is configured with a CPU, ROM, RAM, peripheral circuits, etc. The control unit 200 controls the operation of each component of the device main body 100 by the CPU executing a control program stored in the ROM. The control unit 200 includes, as its main functional components, a mounting control unit 81, a transport control unit 82, a component supply control unit 83, a component push-up control unit 84, an imaging control unit 85, a memory unit 86, and a display control unit 87.

The mounting control unit 81 controls the overall operation of the component mounting process in the device main body 100, mainly the operation of the head unit drive mechanism D1 and the drive mechanism of the head 4H. The transport control unit 82 controls the transport operation of the substrate P by the conveyor 3.

The component supply control unit 83 controls the supply operation of the die 7a. That is, it controls the operation of each unit 22, 23, and D2 of the wafer supply device 6, and the operation of the component transfer unit 33. The component supply control unit 83 also controls the operation of the tape feeder 19.

The component push-up control unit 84 comprehensively controls the operations of the push-up unit 40 and the tool storage unit 60. In particular, when changing the type of die 7a (wafer 7) to be mounted, the component push-up control unit 84 executes the tool exchange process described below, in which the push-up tool 45 attached to the push-up head 41 is replaced with another push-up tool 45 held on the tool storage table 61 in response to an input operation by the operator via the input unit 91. In addition, various types of judgment processes are executed in the tool exchange process based on the input signals from the sensors Se1 to Se5.

The imaging control unit 85 controls the imaging operations of the component recognition camera 10, the board recognition camera 12, and the wafer camera 39. The imaging control unit 85 is equipped with an image processing unit 85a, and generates a digital image of the subject based on the image signals output from each of the cameras 10, 12, and 39. Specifically, it generates digital images of the components picked up by the head 4H, the fiducial marks on the board P, and the die 7a.

The memory unit 86 stores various programs executed in the component mounting process and the correction data acquisition process, as well as various data referenced when executing the programs. The various data include board data and tool data. The board data includes information such as the type of board P, the components to be mounted on each type of board P, and the mounting position (coordinates) of the components. The tool data (tool information) is information related to the suction nozzle and the push-up tool 45. This tool data includes data defining the push-up tool 45 (identification information) to be used for pushing up each type of die 7a, and data such as the number and arrangement of the push-up pins 50 provided on each push-up tool 45.

The display control unit 87 controls the display by the display unit 90 (corresponding to the "notification unit" of the present invention) and causes the display unit 90 to display various information and images according to the status of the component mounting process. The display unit 90 is composed of a liquid crystal display device or the like, and the input unit 91 is composed of a keyboard and a mouse. The display unit 90 and the input unit 91 may be configured as one unit, such as a touch panel.

In this example, of the component mounting device 1, mainly the push-up unit 40, the tool storage unit 60 and the control unit 200 (component push-up control unit 84) correspond to the "component push-up device" of the present invention.

[Control of thrust tool replacement process]
Next, the control of the replacement process of the push-up tool 45 by the control unit 200 will be described based on the flowchart of FIG. 7 and with reference to FIGS.

7 is executed in accordance with the type change of the die 7a (wafer 7). Specifically, it is executed after the wafer holder 8 on the wafer table 20 is returned to the wafer storage elevator 22 and before the switched wafer holder 8 is pulled out onto the wafer table 20. In this case, based on the substrate data and tool data stored in the memory unit 86, the identification information of the push-up tool 45 corresponding to the switched die 7a and a button to execute tool exchange are displayed on the display unit 90. In response to this, when the operator operates the execute button via the input unit 91, the control according to the flowchart is started. Note that the exchange process of the push-up tool 45 may be started in synchronization with the type change of the die 7a (wafer 7) regardless of the operator's operation.

First, the control unit 200 determines whether or not the push-up tool 45 is attached to the push-up head 41 based on the output signal from the first tool detection sensor Se1 (step S1). If the answer is Yes, the control unit 200 transitions the process to step S3. If the answer is No, the control unit 200 controls the tool storage unit 60 to execute a tool return process (corresponding to the "tool return operation" of the present invention) that returns the push-up tool 45 attached to the push-up head 41 to the tool storage table 61 (step S21).

The operation of each part of the tool storage unit 60 during the tool return process is as follows. Note that the explanation here is based on the state of the push-up unit 40 and the tool storage unit 60 as shown in Figures 3 and 8. Figure 8 is an explanatory diagram of the operation of each part when replacing a push-up tool, and (a) is a plan view, and (b) is a side view from the -Y side, each showing the push-up unit 40 and the tool storage unit 60 as a schematic diagram.

3 and 8, the first tool 45A is attached to the thrust head 41, and therefore the first tool holding portion 62A of the tool storage table 61 is empty. The tool storage unit 60 is arranged so that the second tool holding portion 62B is located at the tool insertion/removal position P2, and the chuck head 65 is arranged at a standby position above the tool insertion/removal position P2. The thrust head 41 is arranged at the standby height position.

In the process of step S21, first, as shown in FIG. 9(a), the chuck head 65 moves from the standby position to above the thrust head 41, then descends in place to clamp the first tool 45A attached to the thrust head 41 with the claws 66. As a result, the chuck head 65 holds the first tool 45A. Next, as shown in FIG. 9(b), the chuck head 65 rises while holding the first tool 45A, moves to the standby position, i.e., above the tool insertion/removal position P2, and then descends. In this case, an empty tool holding portion 62 (i.e., the first tool holding portion 62A) is detected based on the presence or absence of a signal output from the second tool detection sensor Se2, and if the empty tool holding portion 62 is not located at the tool insertion/removal position P2, the position of the tool storage table 61 is adjusted so that the empty tool holding portion 62 is located at the tool insertion/removal position P2.

9(c), the jaws 66 are opened to release the first tool 45A to the first tool holding part 62A, and then the chuck head 65 rises. As a result, the first tool 45A is removed from the thrust head 41 and returned to the tool storage table 61 (first tool holding part 62A).

In the processing of step S21, the first tool 45A is held in the chuck head 65 in the same posture as when it was attached to the throw-up head 41, by clamping the chuck flat portion 53 with the claws 66. Therefore, the first tool 45A returned to the first tool holding portion 62A can be positioned by the positioning recess 56 and the positioning protrusion 63, and the first tool 45A is held in the first tool holding portion 62A in the same posture as when it was attached to the throw-up head 41.

When the process of step S21 is completed, the control unit 200 proceeds to step S3. In step S3, the control unit 200 determines whether the recognition of the identification code 54 of each push-up tool 45 is completed. If the result is Yes, the control unit 200 proceeds to step S5. On the other hand, if the result is No, the control unit 200 briefly moves the tool storage table 61 in the X direction and reads the identification code 54 of the push-up tool 45 (45A to 45C) held in each tool holding unit 62A to 62C by the code reading sensor Se3 (step S23). As a result, the control unit 200 recognizes which push-up tool 45 (tool 45A to 45C) is held in each of the tool holding units 62 (62A to 62C) of the tool storage table 61, and determines whether the push-up tool 45 to be attached is included. If the push-up tool 45 to be attached is not included, the control unit 200 proceeds to step S25, which will be described later. Note that the reading of the identification code 54 in step S23 corresponds to the function of the code reading sensor Se3 as the "first reading unit" of the present invention.

In step S5, the control unit 200 controls the tool storage unit 60 to perform a tool mounting process (corresponding to the "tool mounting operation" of the present invention) for mounting the thrust tool 45 on the thrust head 41 (head main body portion 42). The operation of each part of the tool storage unit 60 in the tool mounting process of step S5 is as follows.

10(a), the tool storage table 61 moves in the X direction, and the push-up tool 45 to be attached (here, the third tool 45C) is placed at the tool insertion/removal position P2. In this case, based on the recognition result of step S23, the tool storage table 61 moves so that the push-up tool 45 to be attached is placed at the tool insertion/removal position P2.

When the third tool 45C is placed at the tool insertion/removal position P2, the identification code 54 of the third tool 45C is read and stored by the code reading sensor Se3. The reading of the identification code 54 here corresponds to the function of the code reading sensor Se3 as the "second reading unit" of the present invention.

Next, as shown in Figure 10(b), the chuck head 65 descends from the standby position to hold the third tool 45C. Then, as shown in Figure 10(c), the chuck head 65 rises and moves above the head main body 42 of the thrust head 41, and then descends. This allows the third tool 45C to be attached to the thrust head 41. After the third tool 45C is attached to the thrust head 41, the chuck head 65 moves to the standby position above the tool insertion/removal position P2, as shown in Figure 10(d).

When the replacement process of the push-up tool 45 is completed, the control unit 200 determines whether the push-up tool 45 (third tool 45C) attached to the push-up head 41 is the push-up tool 45 specified in the tool data, i.e., whether it is the push-up tool 45 corresponding to the switched die 7a, based on the identification code 54 (identification information) of the third tool 45C read by the code reading sensor Se3 in the process of step S5 (step S7).

If the answer is No, the control unit 200 executes a predetermined error process. For example, the control unit 200 displays an error message on the display unit 90, stops the component mounting device 1 (step S25), and ends control of the flowchart.

If the answer to step S7 is Yes, the control unit 200 determines whether the push-up tool 45 is properly attached to the push-up head 41 (head body 42) based on the signal output from the first tool detection sensor Se1 (step S9). Specifically, it determines whether the push-up tool 45 is detected by the first tool detection sensor Se1. If the answer to step S7 is No, the control unit 200 proceeds to step S25 and executes the error processing described above.

If the answer to step S9 is Yes, the control unit 200 controls the wafer camera 39 to capture an image of the suction surface 46a of the push-up tool 45 attached to the push-up head 41 (step S11). The push-up head 41 and the wafer camera 39 are positioned at the pickup position P1, but as described above, the wafer holder 8 is not held by the wafer table 20 during the push-up tool replacement process. Therefore, the wafer camera 39 can capture an image of the suction surface 46a of the third tool 45C from above through the openings in the wafer table 20 and the support frame 26.

Next, the control unit 200 determines whether the push-up pins 50 are appropriate for the push-up tool 45 based on the image data of the suction surface portion 46a acquired in the processing of step S11 and the tool data of the push-up tool 45 (step S13). Specifically, the control unit 200 recognizes the number and arrangement of the push-up pins 50 from the acquired image and determines whether the number and arrangement match the tool data. If the answer is No, the control unit 200 proceeds to the processing of step S25 and executes the error processing described above.

For example, assume that the data for the push-up pins 50 of the third tool 45C in the tool data is data in which the push-up pins 50 are arranged at four locations around the center O of the suction surface portion 46a as a reference, as shown in Fig. 11(a). In this case, if the number of push-up pins 50 in the acquired image does not match the number of push-up pins 50 in the tool data, as shown in Fig. 11(b), or if the arrangement of the push-up pins 50 in the acquired image does not match the arrangement of the push-up pins 50 in the tool data, as shown in Fig. 11(c), the control unit 200 determines No in step S13.

If the answer is Yes in step S13, the control unit 200 controls the wafer supply device 6 to pull out the wafer holder 8 holding the wafer 7 to be switched onto the wafer table 20. Furthermore, the control unit 200 controls the component transfer unit 33 and the push-up unit 40 to use the transfer head 34 to perform a process of detecting the height of the push-up tool 45 attached to the push-up head 41, i.e., the height of the suction surface portion 46a (step S18).

Specifically, the push-up head 41 is placed at the push-up height position, and the wafer sheet 8a is negatively pressure-adsorbed by the suction surface 46a of the push-up tool 45. In this state, the suction nozzle 34a is moved from above the die 7a to approach the die 7a, and the height of the third tool 45C is detected based on the output signal from the negative pressure sensor Se4. In more detail, as shown in FIG. 12, the suction nozzle 34a is lowered from the measurement start height Sp above the die 7a to the measurement end height Ep, and the change point of the negative pressure level detected by the negative pressure sensor Se4, that is, the tip height of the suction nozzle 34a at the time when the suction nozzle 34a adsorbs the die 7a, is detected as the height of the push-up tool 45. The tip height of the suction nozzle 34a is obtained based on the position information detected by the position sensor Se5 (encoder).

Next, the control unit 200 determines whether the mounting state of the push-up tool 45 is appropriate based on the height of the third tool 45C detected in the processing of step S18. Specifically, it determines whether the height of the third tool 45C is within the allowable value Ar, that is, between the upper limit value Uh and the lower limit value Lh shown in Figure 12. The symbol Sh in Figure 12 indicates a reference value, which is equal to the height of the upper surface of the die 7a when the push-up tool 45 is properly mounted on the push-up head 41.

If the answer is No in step S19, the control unit 200 proceeds to step S25 and executes the error processing described above. On the other hand, if the answer is Yes in step S19, the control of this flowchart ends. This starts the mounting operation of mounting the switched die 7a on the substrate P.

[Action and Effect]
In the component mounting device 1 described above, as described above, the control unit 200 controls the tool storage unit 60 to execute a tool return process for removing the push-up tool 45 attached to the push-up head 41 (tool attachment unit 43) and returning it to the tool storage table 61, and a tool attachment process for holding the push-up tool 45 (45A to 45C) supported by the tool storage table 61 by the chuck head 65 and attaching it to the push-up head 41 (tool attachment unit 43). Therefore, automation of the replacement work of the push-up tool 45 is achieved.

Moreover, the push-up tool 45 is detachably attached to the push-up head 41 (tool attachment section 43) in the vertical direction, and the push-up tool 45 (45A-45C) is supported on the tool storage table 61 in the same orientation as when it is attached to the push-up head 41. The tool transfer mechanism 60B is configured so that the chuck head 65 moves only in the Z and X directions to transfer the push-up tool 45. Therefore, with this component mounting device 1, it is possible to automate the replacement work of the push-up tool 45 with a very simple mechanism and control that only moves the chuck head 65 linearly in the Z and X directions.

In addition, in the component mounting device 1, the push-up tool 45 to be mounted is identified from among the multiple push-up tools 45 (45A to 45C) held in the tool storage table 61 based on the tool data stored in the memory unit 86 and the identification code 54 (identification information) read by the code reading sensor Se3 in the process of step S23, and the tool mounting process is executed. Therefore, it is possible to accurately identify the push-up tool 45 corresponding to the type of die 7a and execute the tool mounting process.

Moreover, when the tool mounting process is executed, the identification code 54 of the push-up tool 45 placed at the tool insertion/removal position P2 is read by the code reading sensor Se3, and it is determined whether the push-up tool 45 is the push-up tool 45 specified in the tool data (step S7 in FIG. 7). If they are different, an error message is displayed on the display unit 90 and the component mounting device 1 is stopped. Therefore, even if an inappropriate push-up tool 45 is attached to the push-up head 41 in relation to the die 7a after the product type change, the picking operation of the die 7a will not start immediately.

In addition, in the component mounting device 1, after the tool mounting process is performed, it is determined whether or not the push-up tool 45 is attached to the push-up head 41 based on the presence or absence of a signal output from the first tool detection sensor Se1 (step S9 in FIG. 7), and if it is not attached, the error process described above is executed. Therefore, it is prevented that the picking operation of the die 7a is started without the push-up tool 45 being attached to the push-up head 41.

In addition, in the component mounting device 1, after the tool mounting process is performed, the push-up head 41 (suction surface portion 46a) is imaged by the wafer camera 39. Then, based on the image data, it is determined whether the push-up pins 50 (number and arrangement) provided on the push-up tool 45 are appropriate (steps S11 and S13 in FIG. 7), and if they are not appropriate, the error process described above is executed. This prevents the die 7a picking operation from being started while the push-up tool 45 with inappropriate push-up pins 50 is still attached to the push-up head 41.

In addition, in the component mounting device 1, after the tool mounting process is performed, the height of the push-up tool 45 mounted on the push-up head 41 is detected, and it is determined whether or not this height is within the allowable value Ar (steps S18 and S19). If the height is outside the allowable value Ar, the error process described above is executed. This prevents the die 7a picking operation from being started while the push-up tool 45 is in an incompletely mounted state, such as floating, of the push-up tool 45.

The component mounting device 1 described above is one example of an embodiment of the component mounting device of the present invention (a component mounting device equipped with the component push-up device of the present invention), and the specific configurations of the component mounting device 1 and the component push-up device (the push-up unit 40 and the tool storage unit 60) can be modified as appropriate without departing from the gist of the present invention.

For example, the component mounting apparatus 1 of the embodiment is configured to pick up a die 7a from a wafer 7 with a transfer head 34 of a component transfer unit 33, and transfer the die 7a to a head 4H of a head unit 4 indirectly via a transfer table 38, or directly from the transfer head 34. However, the component mounting apparatus 1 may be configured to pick up a die 7a directly from a wafer 7, for example, with a head 4H of a head unit 4. In this case, the processing of steps S18 and S19 in FIG. 7 may be performed based on the negative pressure level of a negative pressure passage for supplying negative pressure to the head 4H, and position information detected by a position sensor such as an encoder built into a motor for raising and lowering the head 4H.

In addition, in the embodiment, if the height of the push-up tool 45 is determined to be outside the allowable value Ar in the process of step S19 in FIG. 7, an error message is immediately displayed on the display unit 90 and the component mounting device 1 is stopped. However, if the height of the push-up tool 45 is determined to be outside the allowable value Ar, a retry operation may be performed. Specifically, the push-up tool 45 is held by the chuck head 65, and the chuck head 65 is raised once and then lowered. Then, after the retry operation, the height detection process of the push-up tool 45 is performed again, and if the height of the push-up tool 45 is outside the allowable value Ar, the error process described above may be performed. With this configuration, it is possible to automatically correct an incomplete mounting state of the push-up tool 45, such as floating of the push-up tool 45.

In the embodiment, the height of the push-up tool 45 attached to the push-up head 41 is detected based on information acquired by the negative pressure sensor Se4 and the position sensor Se5, but the height of the push-up tool 45 attached to the push-up head 41 may be directly detected by, for example, an optical sensor.

In the embodiment, the identification code 54 of the thrust tool 45 arranged at the tool insertion/removal position P2 is read by the code reading sensor Se3, and it is determined whether the thrust tool 45 is the thrust tool 45 specified in the tool data based on the identification information recorded in the identification code 54 (step S7 in FIG. 7). However, the reading of the identification code 54 for the determination process of step S7 may be performed by a code reading sensor other than the code reading sensor Se3. In this case, the other code reading sensor (corresponding to the "second reading unit" of the present invention) may be provided so as to be capable of reading the identification code 54 at any position within the movement path of the thrust tool 45 held and moved by the chuck head 65.

In addition, in the component mounting device 1, the push-up head 41 is arranged at the pick-up position P1, and the wafer 7 moves in the XY direction relative to the push-up head 41, so that the die 7a to be picked up is arranged at the pick-up position P1. However, the opposite arrangement is also possible. That is, the push-up head 41 may be moved in the XY direction relative to the wafer 7 which is fixedly arranged, and arranged below the die 7a to be picked up. In this case, the push-up head 41 may be moved to a specified tool exchange area, and the tool storage unit 60 may be arranged in a position adjacent to the tool exchange area so that tool exchange can be performed for the push-up head 41 arranged in this tool exchange area.

[Inventions included in the above embodiments]
A component push-up device according to one aspect of the present invention is a component push-up device that pushes up a die from below a wafer attached to the wafer sheet, thereby peeling the die from the wafer sheet, and includes a plurality of push-up tools, each of which has an adsorption surface that adsorbs the underside of the wafer sheet under negative pressure and a push-up pin that is arranged so as to be able to protrude from the adsorption surface toward the wafer sheet side, a tool mounting section to which the plurality of push-up tools are selectively and vertically detachably mounted, a push-up head that is movable relatively to the wafer sheet in a direction along the wafer sheet and in a vertical direction, and a tool storage table that is capable of supporting each of the plurality of push-up tools in the same posture as when the plurality of push-up tools are mounted on the tool mounting section. the push-up tool is attached to the tool mounting section by the holding member and returned to the tool storage table by controlling the push-up head and the tool transfer mechanism; and a control unit that controls the push-up head and the tool transfer mechanism to perform a tool returning operation of removing the push-up tool attached to the tool mounting section by the holding member and returning it to the tool storage table and/or a tool mounting operation of holding the push-up tool supported on the tool storage table by the holding member and mounting it on the tool mounting section.

According to this component push-up device, the control unit controls the push-up head and the tool transfer mechanism to perform a tool return operation in which the push-up tool attached to the push-up head is removed and returned to the tool storage table, and/or a tool mounting operation in which the push-up tool supported on the tool storage table is held by a holding member and mounted on the tool mounting section of the push-up head. In other words, the task of replacing the push-up tool with respect to the push-up head is automated.

Moreover, in this component push-up device, the push-up tool is detachably attached in the vertical direction to the tool mounting part, and the push-up tool is supported on the tool storage table in the same orientation as when it is attached to the tool mounting part. The tool transfer mechanism is configured to transfer the push-up tool between the push-up head and the tool storage table by moving the holding member in the vertical and horizontal directions while holding the push-up tool. Therefore, it is possible to automate the replacement work of the push-up tool with a simple mechanism and control that only moves the holding member linearly.

In the above-mentioned component push-up device, each of the multiple push-up tools has a recording unit in which its respective identification information is recorded, and the component push-up device further has a first reading unit capable of reading the identification information recorded in the information recording unit of the push-up tool supported on the tool storage table, and a memory unit in which tool information, which is information relating to each of the push-up tools, is stored, and the tool information includes information that defines the correspondence between the die type and the push-up tool used for that type, and the control unit identifies the push-up tool to be attached from among the multiple push-up tools supported on the tool storage table based on the tool information and the identification information read by the first reading unit, and performs the tool attachment operation.

With the configuration of this component push-up device, in response to changes in the type of die, etc., it is possible to accurately identify the push-up tool corresponding to the die from among the multiple push-up tools supported on the tool storage table and perform the tool mounting operation.

In this case, it is preferable that a second reading unit capable of reading the identification information is further provided at any position within the movement path of the push-up tool supported on the tool storage table from the holding position where the push-up tool is held by the holding member to the position where the push-up tool is attached to the tool mounting section when the tool mounting operation is performed.

This component push-up device configuration makes it possible to stop the device due to an error based on the reading results of the second reading unit. This makes it possible to prevent die picking operations from starting with an inappropriate push-up tool still attached to the tool attachment unit.

In addition, in the above-mentioned component push-up device, a common reading unit is provided as the first reading unit and the second reading unit, and the common reading unit is arranged to be movable relative to the tool storage table and is configured to read the identification information of the push-up tool placed in the holding position.

With this configuration, it is possible to read the identification information of multiple push-up tools supported on the tool storage table using a common (single) reading unit.

In addition, the above-mentioned component push-up device may be provided with a sensor that detects the push-up tool when it is attached to the tool mounting section, and the control unit may be configured to determine whether or not the push-up tool has been attached to the tool mounting section based on whether or not the push-up tool has been detected by the sensor after the tool mounting operation is performed.

With this configuration, during the tool mounting operation, it is possible to confirm that the push-up tool has been mounted on the tool mounting section, thereby preventing die picking operations from starting before the push-up tool is mounted.

In addition, the above-mentioned component push-up device may further include an imaging unit that images the suction surface of the push-up tool after the tool mounting operation is performed, and the control unit may be configured to recognize the push-up pins from the image of the suction surface captured by the imaging unit and determine the suitability of the push-up pins provided on the push-up tool based on the recognition result.

This configuration automates the determination of whether the push-up pins on the push-up tool are appropriate, i.e., the number and arrangement of the push-up pins. This prevents the die picking operation from starting while a push-up tool with inappropriate push-up pins is still attached.

In addition, the above-mentioned component push-up device may further include an acquisition unit that acquires information capable of detecting the height of the push-up tool attached to the push-up head after the tool attachment operation, and the control unit may be configured to determine whether the attachment state of the push-up tool is good or bad based on the information acquired by the acquisition unit.

With this configuration, when the push-up tool is incompletely attached to the tool mounting part, such as when the push-up tool is floating relative to the tool mounting part, it is possible to prevent die picking operations from being started in that state.

In this case, if the control unit determines that the attachment state of the tool is not good, it may perform a retry operation in which the holding member is raised once and then lowered while holding the thrust-up tool by the holding member.

With this configuration, when an incomplete attachment state of the thrust tool is detected, it is possible to correct the incomplete attachment state without relying on manual work by an operator.

In addition, the above-mentioned component push-up device may further include an alarm unit that issues an error alarm when the push-up tool to be attached is not among the multiple push-up tools supported on the tool storage table.

With this configuration, the operator is notified that the push-up tool to be attached is not available, making it possible to quickly place the desired push-up tool on the tool storage table.

In addition, a component mounting apparatus according to one aspect of the present invention includes a component supply unit in which wafers that have been diced and attached to a wafer sheet are placed, a head that picks up and transfers dies from the wafer placed in the component supply unit, and any one of the above component push-up devices that pushes up the die from below the wafer sheet when the head picks up the die.

With the configuration of this component mounting device, since it is equipped with the component push-up device as described above, it is possible to automate the replacement work of the push-up tool with simple mechanism and control.

Claims (9)

1. A component push-up device for peeling a die from a wafer sheet by pushing up the die from below the wafer attached to the wafer sheet, comprising:
a plurality of push-up tools each including a suction surface that negatively suctions the lower surface of the wafer sheet, and a push-up pin that is provided so as to be able to protrude from the suction surface toward the wafer sheet;
a push-up head including a tool mounting portion to which the plurality of push-up tools are selectively and vertically detachably mounted, the push-up head being movable relative to the wafer sheet in a direction along the wafer sheet and in a vertical direction;
a tool storage table capable of supporting each of the plurality of push-up tools in the same posture as when the push-up tools are attached to the tool attachment portion;
a recording unit provided in each of the plurality of push-up tools and recording identification information of each of the push-up tools;
a tool transfer mechanism including a holding member capable of holding the push-up tool, the tool transfer mechanism transferring the push-up tool between the push-up head and the tool storage table by moving the holding member in a vertical and horizontal direction while holding the push-up tool;
a control unit that controls the push-up head and the tool transfer mechanism to execute a tool returning operation of removing the push-up tool attached to the tool mounting section by the holding member and returning it to the tool storage table, and/or a tool mounting operation of holding the push-up tool supported on the tool storage table by the holding member and mounting it on the tool mounting section;
a first reading unit capable of reading identification information recorded in the recording unit of the push-up tool supported on the tool storage table;
A storage unit in which tool information, which is information about each of the push-up tools, is stored,
the tool information includes information defining a correspondence relationship between a type of the die and a push-up tool used for the type of the die,
the control unit identifies a push-up tool to be attached from among the plurality of push-up tools supported on the tool storage table based on the tool information and the identification information read by the first reading unit, and executes the tool attachment operation;
The component push-up device is characterized in that, when the tool mounting operation is performed, the component push-up device further comprises a second reading unit capable of reading the identification information at any position within the movement path of the push-up tool supported on the tool storage table from a holding position where the push-up tool is held by the holding member to a position where the push-up tool is mounted to the tool mounting section. 2. The part push-up device according to claim 1,
A common reading unit is provided as the first reading unit and the second reading unit,
The common reading unit is provided so as to be movable relative to the tool storage table, and reads the identification information of the push-up tool placed at the holding position. 3. The part lifting device according to claim 1,
a sensor for detecting the push-up tool when the push-up tool is attached to the tool attachment portion;
The component push-up device is characterized in that, after the tool mounting operation is performed, the control unit determines whether or not the push-up tool has been mounted on the tool mounting section based on whether or not the push-up tool has been detected by the sensor. 3. The part lifting device according to claim 1 ,
an imaging unit configured to image the suction surface of the push-up tool after the tool mounting operation is performed;
The control unit recognizes the push-up pins from the image of the suction surface captured by the imaging unit, and determines whether the push-up pins provided on the push-up tool are suitable based on the recognition result. 3. The part lifting device according to claim 1 ,
an acquisition unit that acquires information capable of detecting a height of the thrust tool attached to the thrust head after the tool attachment operation;
The component push-up device is characterized in that the control unit determines whether the push-up tool is properly attached based on the information acquired by the acquisition unit. 6. The component push-up device according to claim 5,
This component push-up device is characterized in that, when the control unit determines that the attachment state of the push-up tool is not good, it performs a retry operation in which the holding member is raised and then lowered while the push-up tool is held by the holding member. 3. The part lifting device according to claim 1,
A component push-up device further comprising an alarm unit that issues an error alarm when the push-up tool to be attached is not present among the plurality of push-up tools supported on the tool storage table. 1. A component push-up device for peeling a die from a wafer sheet by pushing up the die from below the wafer attached to the wafer sheet, comprising:
a plurality of push-up tools each including a suction surface that negatively suctions the lower surface of the wafer sheet, and a push-up pin that is provided so as to be able to protrude from the suction surface toward the wafer sheet;
a push-up head including a tool mounting portion to which the plurality of push-up tools are selectively and vertically detachably mounted, the push-up head being movable relative to the wafer sheet in a direction along the wafer sheet and in a vertical direction;
a tool storage table capable of supporting each of the plurality of push-up tools in the same posture as when the push-up tools are attached to the tool attachment portion;
a tool transfer mechanism including a holding member capable of holding the push-up tool, the tool transfer mechanism transferring the push-up tool between the push-up head and the tool storage table by moving the holding member in a vertical and horizontal direction while holding the push-up tool;
a control unit that controls the push-up head and the tool transfer mechanism to execute a tool returning operation of removing the push-up tool attached to the tool mounting section by the holding member and returning it to the tool storage table, and/or a tool mounting operation of holding the push-up tool supported on the tool storage table by the holding member and mounting it on the tool mounting section;
and an acquisition unit that acquires information capable of detecting a height of the thrust tool attached to the thrust head after the tool attachment operation,
The control unit determines whether the attachment state of the push-up tool is good or not based on the information acquired by the acquisition unit, and if it determines that the attachment state of the push-up tool is not good, performs a retry operation in which the holding member is raised and then lowered while the push-up tool is held by the holding member. a component supply unit on which the diced wafers attached to the wafer sheet are placed;
A head that picks up and transfers a die from a wafer arranged in the component supply unit;
A component mounting apparatus comprising: a component push-up device according to claim 1 , which pushes up the die from below the wafer sheet when the head picks up the die.