JP7712481B2 - Component push-up device and component mounting device - Google Patents

Description

The present invention relates to a component push-up device that pushes up and peels off a die (bare chip) from below a wafer sheet when picking up the die from a wafer attached to the wafer sheet, and a component mounting device equipped with this component push-up device.

Conventionally, component mounting devices are known that pick up dies (bare chips) from a diced wafer and mount them on a board. In these component mounting devices, a wafer is brought into a designated position (component placement area) inside the device by a wafer feeder, and a wafer camera captures the image of the wafer to recognize it. The die is then picked up by a head equipped with a die holding function, and this operation is repeated.

The component mounting device is equipped with a component push-up device that pushes up the die from below the wafer attached to the wafer sheet, thereby peeling the die from the wafer sheet prior to picking. The component push-up device has a cylindrical suction housing and one or more push-up pins that are provided in a central portion and can be raised and lowered, and while the wafer sheet is negatively pressure-adsorbed from the underside by the suction housing, the die is pushed up from below by the push-up pins.

Dies come in a wide variety of sizes, and it is necessary to use suction housings and push-up pins that are appropriate for the die size. For this reason, operators often manually replace the suction housings and push-up pins. In recent years, a component push-up device has been proposed in which multiple types of push-up tools (peeling promotion heads) equipped with suction housings and push-up pins are kept on standby, as in Patent Document 1, and the push-up tools are automatically replaced for the push-up units (chip peeling promotion units).

This component push-up device is a type of component push-up device in which a component push-up unit moves relative to a wafer to push up a die. The push-up unit is provided with a push-up head (peeling promotion head mounting part) that can rotate between a vertical position and a horizontal position, and the push-up tool is removably mounted on the tool mounting part of the push-up head. The standby push-up tool is arranged sideways. When replacing the push-up tool, the push-up head is displaced from a vertical position to a horizontal position, and moves up and down and horizontally to the standby position of the push-up tool. Then, first, the push-up tool mounted on the tool mounting part is locked by the locking arm, and in this state, the push-up head retreats to remove the push-up tool from the tool mounting part. Next, the push-up head moves to the position of the replacement push-up tool, and the said push-up tool is mounted on the tool mounting part. After that, the push-up head is reset from the horizontal position to the vertical position, and the replacement of the push-up tool is completed.

In the component push-up device of Patent Document 1 as described above, it is thought that misalignment between the tool mounting part (mounting hole) and the push-up tool due to individual differences or movement errors in the push-up tool may hinder smooth attachment and detachment of the head to the tool mounting part. This phenomenon can lead to deterioration of the fit due to wear of the push-up tool and tool mounting part, shortening the life of these parts, and ultimately affecting the push-up performance of the die, so measures are necessary. However, Patent Document 1 makes no mention of this point.

JP 2008-258524 A

The present invention has been made in consideration of the above-mentioned problems, and aims to provide technology that contributes to smoother attachment and detachment of a push-up tool to a tool mounting part in a part push-up device that can automatically replace the push-up tool.

A component push-up device according to one aspect of the present invention is a component push-up device that peels off a die from a wafer sheet by pushing the die up from below the wafer attached to the wafer sheet, and includes a push-up tool having an adsorption surface that negatively adsorbs the underside of the wafer sheet and a push-up pin that can protrude from the adsorption surface toward the wafer sheet side, a push-up head having a tool mounting portion to which the push-up tool is attached, and a tool transport mechanism that includes a holding member capable of holding the push-up tool, holds and transports the push-up tool using the holding member, and attaches and detaches the push-up tool to and from the tool mounting portion, the tool mounting portion being formed such that the push-up tool can be attached and detached by moving the push-up tool relatively in a first direction, and the holding member includes a head portion that holds the push-up tool, and a head support portion that supports the head portion so that the head portion can be elastically displaced in a second direction perpendicular to the first direction.

In addition, a component mounting device according to one aspect of the present invention includes a component supply unit in which a wafer that has been diced and adhered to a wafer sheet is placed, a head that picks up and transfers a die from the wafer placed in the component supply unit, and a component push-up device as described in any one of claims 1 to 6 that pushes up the die from below the wafer sheet when the head picks up the die.

FIG. 1 is a plan view of a main body of a component mounting apparatus according to the present invention (a component mounting apparatus equipped with a component push-up device according to the present invention). FIG. 2 is a plan view showing the wafer table and the wafer table drive mechanism. FIG. 3 is a schematic perspective view of the push-up unit and the tool storage unit. FIG. 4 is a cross-sectional view of the tip portion of the thrust head. FIG. 5 is a cross-sectional view of the push-up tool and the head main body in a separated state. FIG. 6 is a perspective view of a head main body of the thrust-up head, a thrust-up tool, and a tool storage table. 7A and 7B are diagrams showing a support structure for the chuck head in the base frame, where FIG. 7A is a perspective view and FIG. 7B is a plan view. FIG. 8 is an explanatory diagram of the operation of each part when replacing the thrust-up tool. FIG. 9 is an explanatory diagram of the operation of each part when replacing the thrust-up tool. FIG. 10 is an explanatory diagram of the operation of each part when replacing the thrust-up tool. FIG. 11 is a schematic side view of the chuck head during the tool mounting operation.

[Description of component mounting device 1]
1 is a plan view from above showing a device body 100 of a component mounting device 1 according to an embodiment of the present invention. The component mounting device 1 is a hybrid type component mounting device capable of mounting a die 7a (component) diced from a wafer 7 on a substrate P in addition to completed components such as transistors and capacitors. In the figure, an XYZ rectangular coordinate system is shown to clarify the directional relationship.

The device main body 100 includes a base 2, a conveyor 3, a head unit 4, a component supply section 5, a push-up unit 40, and a tool storage unit 60. The base 2 is a mounting base for various devices equipped in the device main body 100. The conveyor 3 is a transport line for the substrate P, installed on the base 2 to extend in the X direction. The conveyor 3 carries the substrate P from outside the machine to a predetermined mounting work position, and after the mounting work, carries the substrate P from the mounting work position to outside the machine. The position where the substrate P is shown in Figure 1 is the mounting work position. The component supply sections 5 are provided on both sides of the conveyor 3, on the -Y side and the +Y side.

The head unit 4 picks up components in the component supply section 5, moves to the mounting work position, and mounts the components on the board P. The head unit 4 has a plurality of heads 4H, each equipped with a suction nozzle that holds the components by negative pressure suction during the pick-up. The heads 4H can move forward and backward (up and down) in the Z direction relative to the head unit 4, and can rotate around an axis. The head unit 4 is equipped with a board recognition camera 12 that images the board P. The federal mark affixed to the board P is recognized from the image captured by the board recognition camera 12.

The device main body 100 includes a head unit drive mechanism D1 that allows the head unit 4 to move horizontally (XY direction) between the component supply unit 5 and the substrate P held at the mounting work position. The head unit drive mechanism D1 includes a pair of Y-axis rails 13, a Y-axis motor 14, and a ball screw shaft 15 on the +X side and -X side, respectively, provided on an elevated frame 11, and a support frame 16 that is installed between the pair of Y-axis rails 13. The ball screw shaft 15 is screwed into a nut provided on the support frame 16. The head unit drive mechanism D1 also includes a guide member (not shown) mounted on the support frame 16, an X-axis motor 17, and a ball screw shaft 18. The guide member supports the head unit 4 so that it can move in the X direction, and the ball screw shaft 18 is screwed into a nut (not shown) provided on the head unit 4.

Operation of the head unit drive mechanism D1 moves the head unit 4 in the horizontal direction. In other words, the ball screw shaft 15 is rotated by the Y-axis motor 14, causing the head unit 4 to move in the Y direction together with the support frame 16, and the ball screw shaft 18 is rotated by the X-axis motor 17, causing the head unit 4 to move in the X direction relative to the support frame 16.

The component supply unit 5 includes a first component supply unit 5A located on the -Y axis of the conveyor 3, and a second component supply unit 5B located on the +Y side. In the first component supply unit 5A, multiple tape feeders 19 are arranged in parallel along the conveyor 3. The tape feeders 19 are a type of component supply device that feeds by unwinding a tape on which completed components such as the transistors and capacitors mentioned above are stored at regular intervals.

The second component supply section 5B is equipped with a wafer supply device 6 which supplies a plurality of dies 7a in the form of a wafer 7, a component transfer unit 33 which picks up the die 7a from the wafer 7 and transfers it to a predetermined transfer position for the head unit 4, a wafer camera 39, and a component recognition camera 10.

The wafer supply device 6 includes a wafer storage elevator 22, a wafer table 20, and a wafer pull-out unit 23. The wafer storage elevator 22 stores wafer sheets 8a with wafers 7 attached thereto in multiple vertical stages while the wafer sheets 8a are held by wafer holders 8. The wafer storage elevator 22 raises and lowers the wafers 7 stored in the multiple stages as a unit, and positions any wafer 7 at a height corresponding to the height of the wafer table 20.

The wafer table 20 is arranged on the -Y side of the wafer storage elevator 22. The wafer table 20 is a workbench for removing parts that holds the wafer holder 8 (wafer 7). The wafer supply device 6 is equipped with a wafer table drive mechanism D2 that enables the wafer table 20 to move horizontally (XY directions).

Figure 2 is a plan view showing the wafer table 20 and wafer table drive mechanism D2. The wafer table drive mechanism D2 comprises a pair of X-axis rails 30 on the +Y side and -Y side, an X-axis motor 31, a ball screw shaft 32, and a plate-shaped support frame 26 mounted on the pair of X-axis rails 30. The ball screw shaft 32 is screwed into a nut provided on the support frame 26. The wafer table drive mechanism D2 also comprises a pair of Y-axis rails 27 on the +X side and -X side provided on the support frame 26, a Y-axis motor 28, and a ball screw shaft 32. The ball screw shaft 32 is screwed into a nut provided on the wafer table 20.

Operation of this wafer table drive mechanism D2 moves the wafer table 20 in the horizontal direction. That is, the ball screw shaft 32 is rotated by the X-axis motor 31, causing the wafer table 20 to move in the X direction together with the support frame 26, and the ball screw shaft 29 is rotated by the Y-axis motor 28, causing the wafer table 20 to move in the Y direction relative to the support frame 26. When the transfer head 34, which will be described later, picks up the die 7a, the target die 7a is positioned at a predetermined pickup position P1 defined by the XY coordinates by the movement of the wafer table 20.

The wafer withdrawal unit 23 takes in and out the wafer holder 8 between the wafer storage elevator 22 and the wafer table 20. The wafer withdrawal unit 23 includes a withdrawal head 24 capable of engaging the wafer holder 8, and a withdrawal head drive unit 25 that moves the withdrawal head 24 in the Y direction.

The wafer pull-out unit 23 moves the wafer holder 8 by moving the pull-out head 24 in the Y direction while the wafer holder 8 is engaged by the pull-out head 24. In other words, the wafer 7 is moved together with the wafer holder 8 into and out of the wafer storage elevator 22. This movement of the wafer holder 8 into and out of the wafer storage elevator 22 is made possible by positioning the wafer table 20 at a predetermined wafer insertion/removal position closely facing the -Y side of the wafer storage elevator 22.

The component transfer unit 33 includes a transfer head 34 that picks up the die 7a placed at the pickup position P1 from the wafer 7, a transfer table 38 for transferring the die 7a to the head unit 4, and a transfer head drive mechanism D3 that enables the transfer head 34 to move.

The transfer head 34 is equipped with a suction nozzle 34a that holds the die 7a by negative pressure suction. The transfer head 34 picks up the die 7a at the pick-up position P1 by negative pressure suction. The suction nozzle 34a can move forward and backward (up and down) in the Z direction relative to the base part of the transfer head 34, and can rotate around a horizontal axis. By rotating the transfer head 34 around the horizontal axis, it is possible to invert the position of the die 7a upside down.

The transfer table 38 is a transfer table for transferring the die 7a held by the suction nozzle 34a to the head 4H of the head unit 4. The transfer table 38 is disposed at a predetermined transfer position adjacent to the mounting work position.

The transfer head drive mechanism D3 includes a rail 37 that movably supports the transfer head 34, a ball screw shaft 36 arranged parallel to the rail 37, and a motor 35. The ball screw shaft 36 is screwed into a nut provided on the transfer head 34. The transfer head drive mechanism D3 moves the transfer head 34 in the space between the pickup position P1 and the transfer table 38 by driving the ball screw shaft 36 to rotate by the motor 35.

The wafer camera 39 captures an image from above of a portion of the wafer 7 held on the wafer table 20 at the pickup position P1, i.e., the die 7a within the camera's field of view. Based on this captured image, the position of the die 7a to be picked up is recognized. The wafer camera 39 is supported by an elevated frame (not shown) so that it is positioned above the transfer head 34 when the transfer head 34 is placed at the pickup position P1. This avoids interference with the transfer head 34.

The component recognition camera 10 is disposed at a position adjacent to the +X side of the transfer table 38. The component recognition camera 10 captures an image of the components (die 7a and completed components) adsorbed to the head 4H of the head unit 4 from below before mounting them on the substrate P. Based on this captured image, the state of the components adsorbed by the head 4H is recognized.

3 is a schematic perspective view of the push-up unit 40 and the tool storage unit 60. In this example, the push-up unit 40 and the tool storage unit 60 correspond to the "component push-up device" of the present invention, and in the following description, the push-up unit 40 and the tool storage unit 60 may be referred to as the "component push-up device."

2 and 3, the push-up unit 40 and tool storage unit 60 are disposed below the component supply section 5, specifically below the support frame 26 of the wafer table drive mechanism D2. A circular opening 20a is provided in the wafer table 20, and an opening (not shown) is provided in the support frame 26 at a position that may overlap with this opening 20a. The push-up unit 40 is disposed below these openings. In other words, when the wafer holder 8 is held on the wafer table 20, the wafer 7 is disposed inside the opening 20a. The push-up unit 40 pushes up the die 7a through each opening of the support frame 26 and the wafer table 20.

The thrust unit 40 includes a thrust head 41 and a thrust head drive mechanism D6. As shown in Figures 3 and 4(a), the thrust head 41 includes a shaft-shaped head main body 42 extending in the Z direction and a thrust tool 45 attached to the upper end of the head main body 42. Note that Figure 4(a) is a cross-sectional view of the tip portion of the thrust head 41.

The thrust head 41 is arranged so that the head body 42 is located at the pickup position P1. The head body 42 is cylindrical and has a thrust main shaft 44 at its center that moves back and forth (up and down) in the Z direction.

The push-up tool 45 includes a suction housing 46 (sometimes called an "suction dome") for suctioning the wafer sheet 8a from below, and a pin holder 48 disposed inside the suction housing 46. The suction housing 46 is a cylindrical member with a top that includes an suction surface portion 46a having a circular suction surface in a plan view for negatively suctioning the wafer sheet 8a, and a cylindrical portion 46b extending downward from the periphery of the suction surface portion 46a. A plurality of pin holes 47 are formed in a predetermined arrangement in the suction surface portion 46a.

The push-up tool 45 is detachably attached to the tip (upper end) of the head body 42 via the suction housing 46. Specifically, a tool mounting portion 43 having a smaller diameter than other parts is formed at the tip of the head body 42, and the cylindrical portion 46b of the suction housing 46 is fitted into this tool mounting portion 43, thereby mounting the push-up tool 45 to the head body 42. In other words, the push-up tool 45 is configured to be detachable from the tool mounting portion 43 by moving the push-up tool 45 relative to the tool mounting portion 43 in the Z direction (corresponding to the "first direction" of the present invention). The mounting structure of the push-up tool 45 to the head body 42 may be, for example, a structure in which a circular recess is formed as the tool mounting portion 43 at the tip of the head body 42, and the push-up tool 45 is fitted into the circular recess. In the following description, for convenience, it may be said that the push-up tool 45 is mounted on the push-up head 41.

The pin holder 48 is a member in which one or more push-up pins 50 are erected on a disk-shaped pin base 49, and is held in the suction housing 46 in a state in which it can move in the Z direction along the inner circumferential surface of the cylindrical portion 46b. As shown in FIG. 4B, the pin holder 48 is pushed up against the suction housing 46 by the forward (upward) movement of the push-up main shaft 44. As a result, the push-up pin 50 protrudes upward from the suction surface portion 46a through the pin hole 47. When the push-up main shaft 44 moves backward (downward), the pin holder 48 descends against the suction housing 46 by its own weight or by the biasing force of an elastic member (spring, etc.) not shown in the figure. As a result, the push-up pin 50 retreats into the suction housing 46 (pin hole 47). That is, the push-up pin 50 is provided so as to be able to protrude upward from the suction surface portion 46a.

When the die 7a is picked up, negative pressure is supplied into the suction housing 46 through the head main body 42. This negative pressure causes the wafer sheet 8a to be adsorbed through the pin holes 47. In other words, with the wafer sheet 8a being negatively adsorbed through the suction surface 46a of the suction housing 46, the push-up pins 50 protrude from the suction surface 46a, pushing up the die 7a through the wafer sheet 8a.

The number, arrangement, size (diameter, length) and tip shape of the push-up pins 50 vary depending on the size of the die 7a and the circuit formed thereon. A tool storage unit 60 (described later) holds and stores a plurality of push-up tools 45 of different configurations, and when picking the die 7a, a push-up tool 45 predetermined for each type of die 7a (wafer 7) is attached to the push-up head 41.

As shown in Figure 5, a tapered portion 461 is formed at the opening edge of the cylindrical portion 46b of the push-up tool 45 (suction housing 46), and a tapered portion 431 is formed on the outer circumferential surface of the tip of the tool mounting portion 43. With this configuration, when the push-up tool 45 is mounted on the tool mounting portion 43, the push-up tool 45 is guided so that the center of the tool mounting portion 43 and the center of the push-up tool 45 coincide with each other. Note that Figure 5 is a cross-sectional view of the push-up tool and the head main body in a separated state.

The push-up head drive mechanism D6 is, for example, a cylinder mechanism that uses air as a drive source. The push-up head drive mechanism D6 operates to move the push-up head 41 back and forth (up and down) at the pickup position P1. Specifically, the push-up head 41 moves back and forth between a predetermined push-up height position where the suction surface portion 46a abuts against the lower surface of the wafer sheet 8a and a predetermined standby height position (position shown in FIG. 3) that is retreated downward from the push-up height position. In addition, a first tool detection sensor Se1 is arranged on the -Y side of the push-up head 41 arranged at the standby height position, which can detect the presence or absence of the push-up tool 45 at the tip of the push-up head 41.

2 and 3, the tool storage unit 60 is provided adjacent to the +X side of the push-up unit 40. The tool storage unit 60 includes a tool storage section 60A and a tool transfer mechanism 60B. The tool storage section 60A holds and stores multiple types of push-up tools 45, and the tool transfer mechanism 60B transports the push-up tools 45 between the push-up unit 40 and the tool storage section 60A.

The tool storage section 60A comprises a tool storage table 61 that holds the push-up tool 45, a storage table drive mechanism D4 that moves the tool storage table 61, and a code reading sensor Se3.

2 and 3, the tool storage table 61 is disposed adjacent to the head main body 42 of the push-up head 41 on the +X side. The tool storage table 61 is rectangular in plan view, elongated in the X direction, and has a number of tool holding portions 62 on its upper surface. The tool holding portions 62 are circular recesses formed on the upper surface of the tool storage table 61. The inner diameter of the tool holding portions 62 is set to a dimension that allows the push-up tool 45 (suction housing 46) to fit therein, and the push-up tool 45 is supported on the tool storage table 61 with its lower end loosely fitted into the tool holding portion 62.

In this example, the tool storage table 61 is provided with three tool holding sections 62 arranged in a row at equal intervals in the X direction. As shown in FIG. 2, in a plan view, each tool holding section 62 is provided so that its center is located on a straight line L1 that passes through the center of the head body section 42 of the thrust head 41 and extends in the X direction. The first tool 45A is stored in the tool holding section 62 at the -X side end (referred to as the first tool holding section 62A as appropriate), the second tool 45B is stored in the tool holding section 62 in the middle (referred to as the second tool holding section 62B as appropriate), and the third tool 45C is stored in the tool holding section 62 at the +X side end (referred to as the third tool holding section 62C as appropriate). In FIG. 2 and FIG. 3, the first tool 45A is attached to the thrust head 41, and therefore the first tool holding section 62A is empty.

6 is a perspective view showing the head body 42 of the thrust head 41, the thrust tool 45, and the tool storage table 61. As shown in FIG. 6, a positioning protrusion 43a is provided on the outer peripheral surface of the tool mounting portion 43 of the head body 42, and a positioning recess 56 is provided on the outer peripheral surface of the thrust tool 45 (suction housing 46). The thrust tool 45 is mounted on the tool mounting portion 43 in a state where it is positioned around the vertical axis by the engagement of the positioning protrusion 43a and the positioning recess 56. Meanwhile, a positioning protrusion 63 is provided on the inner peripheral surface of each tool holding portion 62 of the tool storage table 61, and the thrust tool 45 is held in the tool holding portion 62 in a state where it is positioned around the vertical axis by the engagement of the positioning protrusion 63 and the positioning recess 56.

Here, the positioning protrusion 43a of the head main body 42 and each positioning protrusion 63 of each tool holding part 62 are both on the straight line L in a plan view and are both provided on the -X side. In other words, the push-up tool 45 is held on the tool storage table 61 in the same posture (in this example, the vertical direction and the orientation around the axis are both the same) as when it is attached to the tool mounting part 43 of the head main body 42. A second tool detection sensor Se2 is embedded in the inner bottom surface of each tool holding part 62, making it possible to detect the presence or absence of the push-up tool 45 in each tool holding part 62.

The storage table drive mechanism D4 is, for example, a screw feed mechanism driven by a motor. Operation of this storage table drive mechanism D4 causes the tool storage table 61 to move horizontally in the X direction, so that the push-up tool 45 (45A-45B) held on the tool storage table 61 is selectively positioned at a predetermined tool insertion/removal position P2 defined by the XY coordinates. The storage table drive mechanism D4 may also be a cylinder mechanism driven by air.

The code reading sensor Se3 is a sensor that reads the identification mark of each push-up tool 45 held on the tool storage table 61. The code reading sensor Se3 is disposed on the -Y side of the tool insertion/removal position P2, and reads the identification information recorded in the identification information recording unit provided on the side of the push-up tool 45 disposed at the tool insertion/removal position P2.

Specifically, as shown in Fig. 6, a notched flat code section 52 is formed on the outer periphery on the -Y side of the cylindrical section 46b of the push-up tool 45 (suction housing 46), and a one-dimensional or two-dimensional identification code 54 is provided on this flat code section 52 as an identification information recording section. The code reading sensor Se3 reads this identification code 54. This allows the push-up tool 45 held by each tool holding section 62 to be recognized.

2 and 3, the tool transfer mechanism 60B includes a chuck head 65 and a chuck head drive mechanism D5 that moves the chuck head 65 in the Z and X directions. The chuck head 65 is an electrically driven or air driven parallel open/close type chuck device that has a pair of claws 66 that can be opened and closed in the X direction on the -Y side of a roughly rectangular head main body 65a. The chuck head 65 holds the push-up tool 45 by clamping the push-up tool 45 from both sides in the X direction with the pair of claws 66.

The chuck head drive mechanism D5 includes, for example, a slider 72 that moves in the X direction by a screw feed mechanism driven by a motor, and a base frame 68 that moves in the Z direction by a screw feed mechanism driven by a motor. The base frame 68 is a block-shaped structure that is flat in the vertical direction, and the chuck head 65 is supported by this base frame 68. By operating the chuck head drive mechanism D5, the base frame 68 moves in the X direction together with the slider 72, and the base frame 68 moves in the Z direction relative to the slider 72. This moves the chuck head 65 in the X direction and the Z direction. The chuck head drive mechanism D5 may be configured to move the slider 72 and the base frame 68 by a cylinder mechanism driven by air.

7(a) is a perspective view showing the support structure of the chuck head 65 on the base frame 68. As shown in the figure, the chuck head 65 is supported on the upper surface of the base frame 68 via a connecting portion 80 and a plurality of positioning portions 82.

The connecting portion 80 is interposed between the base frame 68 and the chuck head 65 to connect them, and a part or all of the connecting portion 80 elastically deforms to allow the chuck head 65 to be displaced in the XY directions (i.e., horizontal direction/corresponding to the "second direction" of the present invention) relative to the base frame 68. The connecting portion 80 includes, for example, an axial portion fixed to one of the lower surface of the head main body portion 65a and the upper surface of the base frame 68, a cylindrical portion fixed to the other side into which the axial portion is inserted, and an elastic body such as rubber, resin, or a spring interposed between the axial portion and the cylindrical portion, and the elastic body elastically deforms to allow the chuck head 65 to be displaced in the XY directions.

The positioning portion 82 positions the chuck head 65 relative to the base frame 68 in the XY directions. The positioning portion 82 is composed of a positioning protrusion 84 provided on the upper surface of the base frame 68 and a positioning recess 87 provided on the lower surface of the chuck head 65.

The positioning protrusion 84 is, for example, a well-known ball plunger, and is provided with a cylinder portion 85a arranged upright on the upper surface of the base frame 68, a sphere 85b held at the tip (upper end) of the cylinder portion 85a so that it can freely rise and fall and roll, and a coil spring 85c that urges the sphere 85b toward the tip of the cylinder portion 85a. The positioning recess 87 is provided on the lower surface of the positioning block 86 fixed to the lower surface of the chuck head 65. The positioning recess 87 is a conical recess that is concave upward so that the inner diameter gradually decreases from the bottom to the top, and the tip of the positioning protrusion 84, i.e., the sphere 85b, is pressed against its center. As a result, the chuck head 65 is positioned at a position where the center of the positioning protrusion 84 coincides with the center of the positioning recess 87.

7(b) is a schematic plan view showing the arrangement of the connecting portion 80 and the positioning protrusion 84. As shown in the figure, in a plan view of the chuck head 65, for example, the connecting portion 80 is arranged at the center of gravity of the head main body 65a, and the positioning portions 82 are arranged at four locations surrounding the connecting portion 80. The positioning portions 82 are arranged so that the linear distances d1 between their centers C2 and the center C1 of the connecting portion 80 are equal, and the linear distances d2 between the centers of adjacent ones in the X direction and the Y direction are equal. The position at which the elastic body of the connecting portion 80 is not deformed is set as the reference position Rp of the chuck head 65, and the chuck head 65 is positioned at this reference position Rp by the positioning portion 82.

2, in a plan view, the pair of jaws 66 are disposed at positions intersecting the straight line L, and the chuck head 65 moves in the X and Z directions by the operation of the chuck head drive mechanism D5. Therefore, the chuck head 65 clamps the push-up tool 45 on the straight line L.

Notched flat chuck portions 53 are provided on the outer periphery of the cylindrical portion 46b of the push-up tool 45 held by the tool holding portion 62 on the +X side and on the -X axis. The flat chuck portions 53 are parallel to each other. Meanwhile, each claw 66 has a clamping surface parallel to the flat portion 53, and the chuck head 65 clamps the flat chuck portion 53 of the push-up tool 45 with the clamping surfaces of the pair of claws 66. Therefore, the push-up tool 45 is held and transported by the chuck head 65 while maintaining the position in which it is placed on the tool holding portion 62.

In this example, the chuck head 65, base frame 68, connecting portion 80 and positioning portion 82 correspond to the "head holding member" of the present invention, the chuck head 65 corresponds to the "head portion" of the present invention, the base frame 68, connecting portion 80 and positioning portion 82 correspond to the "head support portion" of the present invention, and the base frame 68 corresponds to the "base portion" of the present invention.

[Basic Operation of Component Mounting Apparatus 1]
The basic operation of mounting the die 7a on the substrate P in the component mounting device 1 described above is as follows. First, the wafer table 20 is placed at the wafer loading/unloading position, and the wafer holder 8 is pulled out from the wafer storage elevator 22 to the wafer table 20 by the wafer pull-out unit 23. As a result, the wafer sheet 8a to which the assembly (wafer 7) of multiple dies 7a, 7a... is affixed is placed on the wafer table 20.

Next, the die 7a to be picked up is positioned at the pick-up position P1 by moving the wafer table 20, and the wafer camera 39 captures an image of the die 7a. At this time, the transfer head 34 of the component transfer unit 33 retreats from the pick-up position P1. The wafer camera 39 captures the image in order to recognize the die 7a that the transfer head 34 will pick up in a later picking operation.

When the imaging of the die 7a is completed, the transfer head 34 is positioned at the pick-up position P1, and the suction nozzle 34a picks up the die 7a recognized by the imaging by the wafer camera 39. At this time, the die 7a is pushed up by the push-up head 41. In detail, the push-up head 41 is displaced (raised) from the standby height position to the push-up height position, and the wafer sheet 8a is negatively pressure-adsorbed by the suction surface portion 46a. Thereafter, the push-up main shaft 44 is operated to cause the push-up pin 50 to protrude from the suction surface portion 46a, thereby pushing up the die 7a through the wafer sheet 8a.

After picking up the die 7a, the transfer head 34 moves from above the wafer table 20 to above the transfer table 38. If the die 7a is to be handed over to the head unit 4 with the suction nozzle 34a still in the suction position, the die 7a is released onto the transfer table 38. The transfer head 34 then retreats from above the transfer table 38, and the head unit 4 moves above the transfer table 38, and the head 4H picks up the die 7a from the transfer table 38. After picking up the die 7a, the head unit 4 moves above the component recognition camera 10, above the substrate P at the mounting work position, and then descends. This allows the die 7a to be mounted on the substrate P.

On the other hand, when the die 7a is handed over to the head unit 4 in a position that is upside down from the position suctioned by the suction nozzle 34a, for example, the suction nozzle 34a rotates above the transfer table 38, thereby inverting the position of the die 7a upside down. The head unit 4 then moves above the transfer head 34, and the head 4H picks up the die 7a directly from the suction nozzle 34a. After picking up the die 7a, the head unit 4 moves above the component recognition camera 10, as described above, above the substrate P at the mounting work position. As a result, the die 7a is mounted on the substrate P.

Thereafter, the wafer table 20 moves so that the die 7a to be picked up is positioned at the pick-up position P1, while the transfer head 34 repeats picking up the die 7a and the head 4H repeats mounting the die 7a onto the substrate P.

As described above, the optimal form of the push-up tool 45 used when picking the die 7a varies depending on the size of the die 7a and the circuit formed thereon. Therefore, when the type of die 7a is changed, the push-up tool 45 attached to the push-up head 41 is replaced accordingly.

[Replacement Operation and Effects of Thrust-Up Tool 45]
Next, the replacement operation of the push-up tool 45 will be described with reference to Figures 8 to 12. Here, the operation from the state of the push-up unit 40 and the tool storage unit 60 shown in Figures 3 and 8 will be described. Figure 8 is an explanatory diagram of the operation of each part when replacing the push-up tool, and (a) is a plan view, and (b) is a side view from the -Y side, which respectively show the push-up unit 40 and the tool storage unit 60.

3 and 8, the first tool 45A is attached to the thrust head 41, and therefore the first tool holding portion 62A of the tool storage table 61 is empty. The tool storage unit 60 is arranged so that the second tool holding portion 62B is located at the tool insertion/removal position P2, and the chuck head 65 is arranged at a standby position above the tool insertion/removal position P2.

First, as shown in FIG. 9(a), the chuck head 65 moves from the standby position to above the thrust head 41, then descends in place to clamp the first tool 45A attached to the thrust head 41 with the claws 66. This allows the chuck head 65 to hold the first tool 45A. Next, as shown in FIG. 9(b), the chuck head 65 rises while holding the first tool 45A, moves above the standby position, i.e., the tool insertion/removal position P2, and then descends. In this case, an empty tool holding section 62 (i.e., the first tool holding section 62A) is detected based on the presence or absence of a signal output from the second tool detection sensor Se2, and if the empty tool holding section 62 is not located at the tool insertion/removal position P2, the tool storage table 61 moves so that the empty tool holding section 62 is located at the tool insertion/removal position P2.

9(c), the chuck head 65 releases the first tool 45A to the first tool holding part 62A and then rises. This returns the first tool 45A to the tool storage table 61 (first tool holding part 62A), and the tool return operation is completed.

In this tool return operation, the first tool 45A is held in the chuck head 65 in the same position as when it was attached to the throw-up head 41, with the chuck flat portion 53 being clamped by the claws 66. Therefore, the first tool 45A returned to the first tool holding portion 62A can be positioned by the positioning recess 56 and the positioning protrusion 63, and is held in the first tool holding portion 62A in the same position as when it was attached to the throw-up head 41.

When the first tool 45A is returned to the tool storage table 61, the tool mounting operation begins. First, as shown in FIG. 10(a), the tool storage table 61 moves in the X direction, and the push-up tool 45 to be mounted (here, the third tool 45C) is positioned at the tool insertion/removal position P2.

When the third tool 45C is placed at the tool insertion/removal position P2, as shown in Figures 10(b) and (c), the chuck head 65 descends from the standby position to hold the third tool 45C, then rises to above the head body 42 of the thrust head 41, and then descends. This allows the third tool 45C to be attached to the thrust head 41.

The operation of the chuck head 65 in this case will be described in detail with reference to Figure 11. Figure 11 is a schematic diagram of the chuck head in a side view during the tool attachment operation.

For example, when the third tool 45C is mounted on the tool mounting part 43, it is assumed that a misalignment state occurs in which the central axis Ax1 of the cylindrical part 46b of the third tool 45C and the central axis Ax2 of the tool mounting part 43 are mutually misaligned in the XY direction due to a movement error of the chuck head 65, as shown in FIG. 11(a). In this case, when the third tool 45C approaches the head body part 42, the third tool 45C is guided by the tapered part 461 of the third tool 45C and the tapered part 431 of the tool mounting part 43 so that the central axes Ax1 and AX2 coincide with each other. Due to this guidance, a lateral (XY direction) load is applied to the third tool 45C. At this time, since the chuck head 65 is supported so as to be elastically displaceable in the XY direction with respect to the base frame 68 as described above, the load of the third tool 45C is input as an external force, and the chuck head 65 is displaced together with the third tool 45C, as shown in FIG. 11(b). In other words, the chuck head 65 together with the third tool 45C is displaced from the reference position Rp with respect to the base frame 68 so that the load acting on the third tool 45C is eliminated.

Therefore, when the third tool 45C is attached to the tool mounting portion 43, the third tool 45C is suppressed or prevented from being forcibly attached to the tool mounting portion 43 while a load is applied to the third tool 45C.

When the attachment of the third tool 45C is completed, the chuck head 65 moves to the standby position above the tool insertion/removal position P2 as shown in FIG. 10(d). This completes the tool return operation.

When the attachment of the third tool 45C is completed and the jaws 66 are opened to release the third tool 45C from the chuck head 65, the elastic force of the connecting portion 80 (elastic body) resets the chuck head 65 to the reference position Rp as shown in Fig. 11(c). As a result, the chuck head 65 is positioned at the reference position Rp by the positioning portion 82.

As described above, in the component push-up device (push-up unit 40 and tool storage unit 60) of the component mounting device 1, if a load is generated on the push-up tool 45 when the push-up tool 45 is attached to the head main body portion 42 (tool attachment portion 43), the chuck head 65 is displaced in the XY direction together with the push-up tool 45 so as to relieve the load. This allows the push-up tool 45 to be attached in a state in which the load on the push-up tool 45 is suppressed or relieved.

This situation also occurs when removing the push-up tool 45 attached to the head main body 42. That is, as shown in Figures 9(a) and (b), when the push-up tool 45 is held by the chuck head 65, if the center of opening and closing of the pair of claws 66 is shifted to the left or right (X direction) from the center of the push-up tool 45, a lateral load (XY direction) may be generated on the push-up tool 45 when it is clamped. In this case, too, the chuck head 65 is displaced in the XY direction relative to the base frame 68 so that the load is eliminated.

Therefore, with the component push-up device described above, the operation of mounting and removing the push-up tool 45 on the head main body 42 becomes smoother. In other words, the operation of replacing the push-up tool 45 becomes smoother. This effectively suppresses or prevents inconveniences caused by mounting or removing the push-up tool 45 while the load is still present, such as deterioration of the fitting condition due to wear of the push-up tool 45 or the head main body 42 (tool mounting portion 43), and ultimately a decrease in the push-up performance of the die.

In this case, since the chuck head 65 is arranged so as to be elastically displaceable relative to the base frame 68, it is possible to displace the chuck head 65 by the minimum necessary movement amount according to the magnitude of the load, thereby relieving the load.

In addition, in the part push-up device, the chuck head 65 is positioned at the reference position Rp by the positioning unit 82, and this positioning state is released and the chuck head 65 is displaced only when the load is applied. Therefore, while controlling the operation of the chuck head 65 based on the reference position Rp, the chuck head 65 can be displaced as described above only when necessary, and the position of the chuck head 65 is prevented from becoming unstable and losing its positional accuracy during transport of the push-up tool 45.

In this part push-up device, when the chuck head 65 is displaced in the XY direction from the reference position Rp, the chuck head 65 is reset to the reference position Rp by the biasing force of the positioning portion 82 in addition to the elastic force of the connecting portion 80 (elastic body). Therefore, it is possible to more reliably reset the chuck head 65 displaced from the reference position Rp to the reference position Rp. In detail, the diameter of the positioning recess 87 of the positioning portion 82 is set based on the assumed value of the misalignment so that the sphere 85b of the positioning protrusion 84 is located within the positioning recess 87. As a result, the positioning portion 82 is configured so that the sphere 85b is always pressed against the inclined surface of the positioning recess 87 by the elastic force of the coil spring 85c within the range in which the chuck head 65 is displaced relative to the base frame 68 by the load. In other words, the positioning portion 82 is configured to generate a biasing force that biases the chuck head 65 displaced from the reference position Rp toward the reference position Rp. Therefore, according to this component push-up device, the chuck head 65 displaced from the reference position Rp can be reliably reset to the reference position Rp.

Moreover, as shown in FIG. 7(b), the four positioning portions 82 are arranged to evenly surround the connecting portion 80, so that the centering effect allows the chuck head 65 to be stably positioned at the reference position Rp.

The component mounting device 1 described above is one example of an embodiment of the component mounting device of the present invention (a component mounting device equipped with the component push-up device of the present invention), and the specific configurations of the component mounting device 1 and the component push-up device (the push-up unit 40 and the tool storage unit 60) can be modified as appropriate without departing from the gist of the present invention.

For example, the configuration that enables the chuck head 65 to be elastically displaced in the XY directions relative to the base frame 68, and the structure that positions the chuck head 65 at the reference position Rp are not limited to the structures of the embodiment, and can be modified as appropriate.

In addition, in the component mounting device 1, the push-up head 41 is arranged at the pick-up position P1, and the wafer 7 moves in the XY direction relative to the push-up head 41, so that the die 7a to be picked up is arranged at the pick-up position P1. However, the opposite arrangement is also possible. That is, the push-up head 41 may be moved in the XY direction relative to the wafer 7 which is fixedly arranged, and arranged below the die 7a to be picked up. In this case, the push-up head 41 may be moved to a specified tool exchange area, and the tool storage unit 60 may be arranged in a position adjacent to the tool exchange area so that tool exchange can be performed for the push-up head 41 arranged in this tool exchange area.

[Inventions included in the above embodiments]
A component push-up device according to one aspect of the present invention is a component push-up device that peels a die from a wafer sheet by pushing the die up from below a wafer attached to the wafer sheet, and includes a push-up tool having an suction surface that negatively adsorbs the underside of the wafer sheet and a push-up pin that can protrude and retract from the suction surface toward the wafer sheet side, a push-up head having a tool mounting portion to which the push-up tool is attached, and a tool transport mechanism that includes a holding member capable of holding the push-up tool, holds and transports the push-up tool using the holding member and attaches and detaches the push-up tool to and from the tool mounting portion, the tool mounting portion is formed such that the push-up tool can be attached and detached by moving the push-up tool relatively in a first direction, and the holding member includes a head portion that holds the push-up tool, and a head support portion that supports the head portion so that the head portion can be elastically displaced in a second direction perpendicular to the first direction.

According to the configuration of this component push-up device, for example, when a push-up tool held by a holding member is attached to the tool mounting part, the head portion holding the push-up tool displaces in the second direction together with the push-up tool relative to the head support portion so that the push-up tool fits into the tool mounting part without load. Similarly, when the push-up tool is held by the holding member and removed from the tool mounting part, the head portion displaces in the second direction so that the push-up tool can be removed without load. This makes it easier to attach and detach the push-up tool to and from the tool mounting part.

In the above-mentioned component push-up device, the head support portion comprises a base portion and a connecting portion interposed between the base member and the head portion to connect them, and the connecting portion is configured such that a part or all of it elastically deforms to displace the head portion in the second direction relative to the base member.

In the configuration of this component push-up device, the connecting portion interposed between the base portion and the head portion elastically deforms, displacing the head portion in the second direction. With this configuration, when a load is generated on the push-up tool when it is fitted into the tool attachment portion (when an external force in the second direction is input), the connecting portion deforms according to the magnitude of the load so that the load is relieved. In other words, it is possible to displace the head portion in the second direction by an amount of movement corresponding to the magnitude of the load.

In the above-mentioned component push-up device, the head support portion further includes a positioning portion that positions the head portion at a predetermined reference position relative to the base portion in the two directions, and the positioning portion is configured to allow displacement of the head portion in the second direction when an external force in the second direction is input to the head portion.

According to the configuration of this component push-up device, if a load is generated on the push-up tool when it is fitted into the tool attachment part (if an external force in the second direction is input), the head part is displaced in the second direction from the reference position, and otherwise the head part is positioned at the reference position by the positioning part. Therefore, while maintaining the positional accuracy of the head part, it is possible to displace the head part only when a load is generated on the push-up tool when it is fitted into the tool attachment part.

In this case, the positioning portion is configured to generate a biasing force that biases the head portion toward the reference position when displaced in the second direction from the reference position.

This configuration of the component lifting device makes it possible to more reliably reset the head portion that has been displaced in the second direction from the reference position back to the reference position.

In the above-mentioned component push-up device, the positioning portion may be provided at a plurality of positions surrounding the connecting portion. With this configuration, it is possible to more accurately reset the head portion displaced in the second direction from the reference position to the reference position.

The above-mentioned component push-up device further includes a tool storage table capable of supporting each of the multiple push-up tools, and the tool transfer mechanism is configured to perform a tool return operation in which the push-up tool attached to the push-up head is removed by the holding member and returned to the tool storage table, and/or a tool mounting operation in which the push-up tool supported on the tool storage table is held by the holding member and mounted on the tool mounting portion of the push-up head.

The configuration of this component push-up device makes it possible to smoothly attach and detach the push-up tool to the tool mounting section during tool return operations and tool mounting operations.

In the above-mentioned component push-up device, the tool mounting portion may be formed so that the push-up tool is fitted therein. In this case, at least one of the tool mounting portion and the push-up tool is provided with a tapered portion that guides the push-up tool relative to the tool mounting portion.

With the configuration of this component push-up device, when the push-up tool is attached to the tool mounting section, the push-up tool can be guided so that the centers of the two are aligned, allowing the push-up tool to be smoothly fitted into the tool mounting section.

In addition, a component mounting device according to one aspect of the present invention includes a component supply section in which wafers that have been diced and attached to a wafer sheet are placed, a head that picks up and transfers dies from the wafer placed in the component supply section, and the above-mentioned component push-up device that pushes up the dies from below the wafer sheet when the head picks up the dies.

This component mounting device configuration is equipped with the component push-up device described above, making it possible to more smoothly attach and detach the push-up tool to and from the tool mounting section.

Claims (6)

A component push-up device that pushes up a die from below a wafer attached to a wafer sheet, thereby peeling the die from the wafer sheet, comprising:
a push-up tool including a suction surface that negatively suctions the lower surface of the wafer sheet and a push-up pin that can protrude from the suction surface toward the wafer sheet;
a push-up head having a tool mounting portion to which the push-up tool is attached;
a tool transfer mechanism including a holding member capable of holding the push-up tool, the holding member holding and transporting the push-up tool, and the tool transfer mechanism attaching and detaching the push-up tool to and from the tool attachment portion,
the tool mounting portion is formed so that the push-up tool can be attached and detached by relatively moving the push-up tool in a first direction,
the holding member includes a head portion that holds the push-up tool, and a head support portion that supports the head portion so as to be elastically displaceable in a second direction perpendicular to the first direction,
the head support portion includes a base portion, a connecting portion interposed between the base portion and the head portion to connect them, and a positioning portion that positions the head portion at a predetermined reference position with respect to the base portion in the second direction,
the connecting portion displaces the head portion in the second direction relative to the base portion by elastically deforming a part or all of the connecting portion,
The component push-up device, characterized in that the positioning portion allows the head portion to be displaced in the second direction when an external force in the second direction is input to the head portion. 2. The part push-up device according to claim 1,
The component push-up device, characterized in that, when the positioning portion is displaced from the reference position in the second direction, the positioning portion generates a biasing force that biases the head portion toward the reference position. 3. The part lifting device according to claim 1,
The component push-up device, characterized in that the positioning portions are provided at a plurality of positions surrounding the connecting portion. 3. The part lifting device according to claim 1 ,
Further comprising a tool storage table capable of supporting each of the plurality of push-up tools;
The component push-up device is characterized in that the tool transfer mechanism performs a tool return operation in which the push-up tool attached to the push-up head is removed by the holding member and returned to the tool storage table, and/or a tool mounting operation in which the push-up tool supported on the tool storage table is held by the holding member and mounted on the tool mounting portion of the push-up head. 3. The part lifting device according to claim 1 ,
The tool mounting portion is formed so that the push-up tool can be fitted therein,
Component push-up device, characterized in that at least one of the tool mounting portion and the push-up tool is provided with a tapered portion that guides the push-up tool relative to the tool mounting portion. a component supply unit on which the diced wafers attached to the wafer sheet are placed;
A head that picks up and transfers a die from a wafer arranged in the component supply unit;
3. A component mounting apparatus comprising: a component push-up device according to claim 1 , which pushes up the die from below the wafer sheet when the die is picked up by the head.