JP7728154B2 - Printed wiring board manufacturing method - Google Patents
Printed wiring board manufacturing methodInfo
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- JP7728154B2 JP7728154B2 JP2021188018A JP2021188018A JP7728154B2 JP 7728154 B2 JP7728154 B2 JP 7728154B2 JP 2021188018 A JP2021188018 A JP 2021188018A JP 2021188018 A JP2021188018 A JP 2021188018A JP 7728154 B2 JP7728154 B2 JP 7728154B2
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Description
本明細書によって開示される技術は、プリント配線板の製造方法に関する。 The technology disclosed in this specification relates to a method for manufacturing printed wiring boards.
特許文献１は、支持フィルムの一方の面に半硬化状態の絶縁層が設けられた絶縁層形成部材を準備する工程と、パッドと半硬化状態の絶縁層が接触するように絶縁層形成部材を貼り付ける工程と、絶縁層形成部材を貼り付けられた後に絶縁層を硬化させる工程、とを有する配線基板の製造方法を開示している。 Patent Document 1 discloses a method for manufacturing a wiring board that includes the steps of preparing an insulating layer-forming member having a semi-cured insulating layer provided on one side of a support film, attaching the insulating layer-forming member so that the semi-cured insulating layer contacts the pad, and curing the insulating layer after the insulating layer-forming member has been attached.
［特許文献１の課題］
特許文献１の技術では、絶縁層形成部材が貼り付けられる際、支持フィルム及び半硬化状態の絶縁層が加圧されると考えられる。加圧により、半硬化状態の絶縁層の一部が支持フィルムの外周縁から外方にはみ出ると考えられる。はみ出た絶縁層の一部はブリードと呼ばれる。ブリードの一部は支持フィルムの上方に突出すると考えられる。ブリードが上方に突出すると、配線基板の平坦性が損なわれると考えられる。その結果、配線基板の品質が低下すると考えられる。
[Problems of Patent Document 1]
In the technology of Patent Document 1, it is believed that pressure is applied to the support film and the semi-cured insulating layer when the insulating layer-forming member is attached. It is believed that the pressure causes a portion of the semi-cured insulating layer to protrude outward from the outer periphery of the support film. The protruding portion of the insulating layer is called bleed. It is believed that a portion of the bleed protrudes upward from the support film. If the bleed protrudes upward, it is believed that the flatness of the wiring board will be impaired. As a result, it is believed that the quality of the wiring board will be reduced.
本発明のプリント配線板の製造方法は、絶縁層上に導体回路を有する導体層を形成することと、第１面と前記第１面と反対側の第２面とを有する熱硬化性の樹脂絶縁層と前記樹脂絶縁層の前記第１面上に形成される第１保護膜とを有し、前記第１面に垂直な光で前記樹脂絶縁層と前記第１保護膜が投影される場合に前記第１保護膜の外周縁の各辺が前記樹脂絶縁層の各辺と重なる形成部材を準備することと、前記導体回路と前記第２面が接触するように前記導体層上に前記形成部材を貼り付けることと、前記貼り付けることの後に前記第１保護膜を前記樹脂絶縁層から取り除くことと、前記取り除くことの後に前記第１面の全面を押圧して前記第１面を平坦化すること、とを有する。 The method for manufacturing a printed wiring board of the present invention includes forming a conductor layer having a conductor circuit on an insulating layer; preparing a forming member having a thermosetting resin insulating layer having a first surface and a second surface opposite the first surface, and a first protective film formed on the first surface of the resin insulating layer, wherein each side of the outer periphery of the first protective film overlaps each side of the resin insulating layer when the resin insulating layer and the first protective film are projected with light perpendicular to the first surface; attaching the forming member to the conductor layer so that the conductor circuit and the second surface contact; removing the first protective film from the resin insulating layer after the attaching; and pressing the entire first surface to flatten the first surface after the removing.
本発明の実施形態の製造方法では、導体層上に形成部材が貼り付けられる際に、樹脂絶縁層の一部が第１保護膜の外周縁から外方にはみ出て第１保護膜の上方に突出し得る。ただし、本発明の実施形態の製造方法では、第１保護膜が樹脂絶縁層から取り除かれた後に、第１面の全面が押圧されて第１面が平坦化される。平坦化後の第１面には上方に突出する部分が存在しない。その結果、本発明の製造方法で製造されるプリント配線板の平坦性が損なわれることが抑制される。高い品質のプリント配線板が提供される。 In the manufacturing method of an embodiment of the present invention, when a forming member is attached to the conductor layer, a portion of the resin insulating layer may protrude outward from the outer edge of the first protective film and protrude above the first protective film. However, in the manufacturing method of an embodiment of the present invention, after the first protective film is removed from the resin insulating layer, the entire first surface is pressed to flatten the first surface. After flattening, there are no upwardly protruding portions on the first surface. As a result, the flatness of the printed wiring board manufactured by the manufacturing method of the present invention is prevented from being impaired. A high-quality printed wiring board is provided.
［実施形態］
図１は実施形態のプリント配線板２を示す断面図である。図１に示されるように、プリント配線板２は、絶縁層４と第１導体層１０と樹脂絶縁層２０と第２導体層６０とビア導体７０とを有する。
[Embodiment]
1 is a cross-sectional view showing a printed wiring board 2 according to an embodiment. As shown in FIG. 1, the printed wiring board 2 has an insulating layer 4, a first conductor layer 10, a resin insulating layer 20, a second conductor layer 60, and via conductors 70.
絶縁層４は熱硬化性樹脂を用いて形成される。絶縁層４はシリカ等の無機粒子を含んでもよい。絶縁層４は、ガラスクロス等の補強材を含んでもよい。 The insulating layer 4 is formed using a thermosetting resin. The insulating layer 4 may contain inorganic particles such as silica. The insulating layer 4 may also contain a reinforcing material such as glass cloth.
第１導体層１０は絶縁層４上に形成されている。第１導体層１０はパッド１２と信号配線１４とを含む。図に示されていないが、第１導体層１０はパッド１２と信号配線１４以外の導体回路も含んでいる。第１導体層１０は銅によって形成される。第１導体層１０は、シード層１０ａとシード層１０ａ上の電解めっき膜１０ｂで形成されている。 The first conductor layer 10 is formed on the insulating layer 4. The first conductor layer 10 includes pads 12 and signal wiring 14. Although not shown in the figure, the first conductor layer 10 also includes conductor circuits other than the pads 12 and signal wiring 14. The first conductor layer 10 is formed of copper. The first conductor layer 10 is formed of a seed layer 10a and an electrolytic plating film 10b on the seed layer 10a.
樹脂絶縁層２０は絶縁層４と第１導体層１０上に形成されている。樹脂絶縁層２０は第１面２０Ｆ（図中の上面）と第１面２０Ｆと反対側の第２面２０Ｂ（図中の下面）を有する。樹脂絶縁層２０にはパッド１２を露出する開口２２が形成されている。樹脂絶縁層２０は熱硬化性樹脂で形成されている。熱硬化性樹脂はエポキシ系樹脂とポリマー系樹脂と無機フィラーとを含む。 The resin insulating layer 20 is formed on the insulating layer 4 and the first conductor layer 10. The resin insulating layer 20 has a first surface 20F (the upper surface in the figure) and a second surface 20B (the lower surface in the figure) opposite the first surface 20F. An opening 22 is formed in the resin insulating layer 20 to expose the pad 12. The resin insulating layer 20 is made of a thermosetting resin. The thermosetting resin contains an epoxy-based resin, a polymer-based resin, and an inorganic filler.
第２導体層６０は樹脂絶縁層２０の第１面２０Ｆ上に形成されている。第２導体層６０はランド６２と信号配線６４とを含む。図に示されていないが、第２導体層６０はランド６２と信号配線６４以外の導体回路も含んでいる。第２導体層６０は銅によって形成される。第２導体層６０は、シード層６０ａとシード層６０ａ上の電解めっき膜６０ｂで形成されている。 The second conductor layer 60 is formed on the first surface 20F of the resin insulating layer 20. The second conductor layer 60 includes lands 62 and signal wiring 64. Although not shown in the figure, the second conductor layer 60 also includes conductor circuits other than the lands 62 and signal wiring 64. The second conductor layer 60 is formed of copper. The second conductor layer 60 is formed of a seed layer 60a and an electrolytic plating film 60b on the seed layer 60a.
ビア導体７０は開口２２内に形成されている。ビア導体７０は第１導体層１０と第２導体層６０を接続する。図１ではビア導体７０はパッド１２とランド６２を接続する。ビア導体７０はシード層６０ａとシード層６０ａ上の電解めっき膜６０ｂで形成されている。 The via conductor 70 is formed in the opening 22. The via conductor 70 connects the first conductor layer 10 and the second conductor layer 60. In FIG. 1, the via conductor 70 connects the pad 12 and the land 62. The via conductor 70 is formed by the seed layer 60a and the electrolytic plating film 60b on the seed layer 60a.
［実施形態のプリント配線板２の製造方法］
図２Ａ～図２Ｊは実施形態のプリント配線板２の製造方法を示す。図２Ａ～図２Ｅ、図２Ｇ～図２Ｊは断面図である。図２Ｆは平面図である。
[Method for manufacturing printed wiring board 2 according to the embodiment]
2A to 2J show a method for manufacturing the printed wiring board 2 according to the embodiment. 2A to 2E and 2G to 2J are cross-sectional views. 2F is a plan view.
図２Ａは絶縁層４と絶縁層４上に形成されている第１導体層１０を示す。第１導体層１０はセミアディティブ法によって形成される。 Figure 2A shows an insulating layer 4 and a first conductor layer 10 formed on the insulating layer 4. The first conductor layer 10 is formed by a semi-additive method.
図２Ｂに示されるように、樹脂絶縁層２０と樹脂絶縁層２０の第１面２０Ｆ上に形成される第１保護膜３２とを有する形成部材３０が準備される。この時点では樹脂絶縁層２０は半硬化状態である。第１保護膜３２は樹脂絶縁層２０の第１面２０Ｆを完全に覆っている。形成部材３０が平面視される場合、第１保護膜３２の外周縁の各辺と樹脂絶縁層２０の外周縁の各辺は重なる。即ち樹脂絶縁層２０の第１面２０Ｆに垂直な光で樹脂絶縁層２０と第１保護膜３２が投影される場合に、第１保護膜３２の外周縁の各辺と樹脂絶縁層２０の外周縁の各辺は重なる。第１保護膜３２の例は、ポリエチレンテレフタレート（ＰＥＴ）製のフィルムである。第１保護膜３２と樹脂絶縁層２０との間に離型剤が形成されている。 As shown in FIG. 2B, a forming member 30 is prepared, including a resin insulating layer 20 and a first protective film 32 formed on the first surface 20F of the resin insulating layer 20. At this point, the resin insulating layer 20 is in a semi-cured state. The first protective film 32 completely covers the first surface 20F of the resin insulating layer 20. When the forming member 30 is viewed in a planar view, each side of the outer periphery of the first protective film 32 overlaps with each side of the outer periphery of the resin insulating layer 20. In other words, when the resin insulating layer 20 and the first protective film 32 are projected using light perpendicular to the first surface 20F of the resin insulating layer 20, each side of the outer periphery of the first protective film 32 overlaps with each side of the outer periphery of the resin insulating layer 20. An example of the first protective film 32 is a film made of polyethylene terephthalate (PET). A release agent is formed between the first protective film 32 and the resin insulating layer 20.
図２Ｃに示されるように、第１導体層１０のパッド１２と信号配線１４に第２面２０Ｂが接触するように、絶縁層４と第１導体層１０上に形成部材３０が貼り付けられる。この際、第１保護膜３２及び半硬化状態の樹脂絶縁層２０に熱と圧力が加えられる。第１保護膜３２と樹脂絶縁層２０は、第１保護膜３２上に配置された加圧板５０によって絶縁層４に向かって加圧される。加圧板５０は例えばＳＵＳ（ステンレス鋼）板である。実施形態では、形成部材３０が貼り付けられることにより、半硬化状態の樹脂絶縁層２０が変形する。樹脂絶縁層２０の一部が第１保護膜３２の外周縁から外方にはみ出る。はみ出た樹脂絶縁層２０の一部はブリード２３と呼ばれる。ブリード２３は、第１保護膜３２の上方に突出する突出部２１を有する。樹脂絶縁層２０の加熱は図示しない加熱機構によって行われる。加熱によって樹脂絶縁層２０の硬化が進行する。 As shown in FIG. 2C , a forming member 30 is attached to the insulating layer 4 and the first conductor layer 10 so that the second surface 20B contacts the pads 12 and signal wiring 14 of the first conductor layer 10. At this time, heat and pressure are applied to the first protective film 32 and the semi-cured resin insulating layer 20. The first protective film 32 and the resin insulating layer 20 are pressed toward the insulating layer 4 by a pressure plate 50 placed on the first protective film 32. The pressure plate 50 is, for example, a stainless steel (SUS) plate. In this embodiment, the semi-cured resin insulating layer 20 is deformed when the forming member 30 is attached. A portion of the resin insulating layer 20 protrudes outward from the outer periphery of the first protective film 32. The protruding portion of the resin insulating layer 20 is called a bleed 23. The bleed 23 has a protrusion 21 that protrudes above the first protective film 32. The resin insulating layer 20 is heated by a heating mechanism (not shown). Heating promotes hardening of the resin insulation layer 20.
図２Ｄに示されるように、第１保護膜３２が樹脂絶縁層２０の第１面２０Ｆから取り除かれる。 As shown in Figure 2D, the first protective film 32 is removed from the first surface 20F of the resin insulation layer 20.
図２Ｅに示されるように、樹脂絶縁層２０の第１面２０Ｆに第１保護膜３２とは異なる第２保護膜４２が貼り付けられる。第２保護膜４２は樹脂絶縁層２０よりも大きい。第２保護膜４２は第１面２０Ｆを完全に覆っている。第２保護膜４２の例は、ポリエチレンテレフタレート（ＰＥＴ）製のフィルムである。第２保護膜４２と樹脂絶縁層２０との間に離型剤が形成されている。 As shown in Figure 2E, a second protective film 42, which is different from the first protective film 32, is attached to the first surface 20F of the resin insulating layer 20. The second protective film 42 is larger than the resin insulating layer 20. The second protective film 42 completely covers the first surface 20F. An example of the second protective film 42 is a film made of polyethylene terephthalate (PET). A release agent is formed between the second protective film 42 and the resin insulating layer 20.
図２Ｆは、図２Ｅ時点の第２保護膜４２と樹脂絶縁層２０を模式的に示す平面図である。図２Ｆに示されるように、樹脂絶縁層２０の第１面２０Ｆに垂直な光で樹脂絶縁層２０と第２保護膜４２が投影される場合に、第２保護膜４２の外周縁の各辺は樹脂絶縁層２０の外周縁の各辺より外側に存在する。樹脂絶縁層２０と第２保護膜４２が平面視される場合、第２保護膜４２の外周縁の各辺は樹脂絶縁層２０の外周縁の各辺より外側に存在する。 Figure 2F is a plan view schematically showing the second protective film 42 and resin insulating layer 20 at the time of Figure 2E. As shown in Figure 2F, when the resin insulating layer 20 and second protective film 42 are projected using light perpendicular to the first surface 20F of the resin insulating layer 20, each side of the outer periphery of the second protective film 42 lies outside each side of the outer periphery of the resin insulating layer 20. When the resin insulating layer 20 and second protective film 42 are viewed in plan, each side of the outer periphery of the second protective film 42 lies outside each side of the outer periphery of the resin insulating layer 20.
樹脂絶縁層２０の第１面２０Ｆ上に第２保護膜４２が貼り付けられる際（図２Ｅ参照）、第２保護膜４２及び樹脂絶縁層２０に熱と圧力が加えられる。図２Ｅに示されるように、第２保護膜４２と樹脂絶縁層２０は、第２保護膜４２上に配置された加圧板５０によって絶縁層４に向かって加圧される。樹脂絶縁層２０の第１面２０Ｆの全面が第２保護膜４２によって押圧される。樹脂絶縁層２０が変形する。上記の通り、第２保護膜４２の外周縁の各辺は樹脂絶縁層２０の各辺より外側に存在する（図２Ｆ参照）。そのため、樹脂絶縁層２０の一部が第２保護膜４２の外周縁から外方にはみ出ることがない。ブリード２３の一部が第２保護膜４２の上方に突出することがない。第２保護膜４２の貼り付けにより、樹脂絶縁層２０の第１面２０Ｆが平坦化される。ブリード２３の突出部２１（図２Ｄ）が消失する。平坦化後の第１面２０Ｆには上方に突出する部分が存在しない。また、樹脂絶縁層２０の加熱は図示しない加熱機構によって行われる。この加熱によって樹脂絶縁層２０の硬化がさらに進行する。 When the second protective film 42 is attached to the first surface 20F of the resin insulation layer 20 (see FIG. 2E), heat and pressure are applied to the second protective film 42 and the resin insulation layer 20. As shown in FIG. 2E, the second protective film 42 and the resin insulation layer 20 are pressed toward the insulation layer 4 by a pressure plate 50 placed on the second protective film 42. The entire first surface 20F of the resin insulation layer 20 is pressed by the second protective film 42. The resin insulation layer 20 is deformed. As described above, each side of the outer periphery of the second protective film 42 is located outside each side of the resin insulation layer 20 (see FIG. 2F). Therefore, no part of the resin insulation layer 20 protrudes beyond the outer periphery of the second protective film 42. No part of the bleed 23 protrudes above the second protective film 42. The attachment of the second protective film 42 flattens the first surface 20F of the resin insulation layer 20. The protruding portion 21 (Figure 2D) of the bleed 23 disappears. After planarization, there are no upwardly protruding portions on the first surface 20F. The resin insulation layer 20 is heated by a heating mechanism (not shown). This heating further promotes hardening of the resin insulation layer 20.
図２Ｇに示されるように、第２保護膜４２の上からレーザ光Ｌが照射される。レーザ光Ｌは第２保護膜４２と樹脂絶縁層２０を同時に貫通する。第１導体層１０のパッド１２に至るビア導体用の開口２２が形成される。レーザ光Ｌは例えばＵＶレーザ光、ＣＯ２レーザ光である。開口２２によりパッド１２が露出される。 As shown in Figure 2G, laser light L is irradiated from above the second protective film 42. The laser light L simultaneously penetrates the second protective film 42 and the resin insulating layer 20. An opening 22 for a via conductor is formed, leading to the pad 12 on the first conductor layer 10. The laser light L is, for example, UV laser light or CO2 laser light. The pad 12 is exposed through the opening 22.
図２Ｈに示されるように、樹脂絶縁層２０の第１面２０Ｆから第２保護膜４２が取り除かれる。 As shown in Figure 2H, the second protective film 42 is removed from the first surface 20F of the resin insulation layer 20.
図２Ｉに示されるように、樹脂絶縁層２０の第１面２０Ｆ上にシード層６０ａが形成される。シード層６０ａは無電解めっきによって形成される。シード層６０ａ上にめっきレジスト１００が形成される。めっきレジスト１００は、ランド６２と信号配線６４（図１）を形成するための開口を有する。 As shown in FIG. 2I, a seed layer 60a is formed on the first surface 20F of the resin insulating layer 20. The seed layer 60a is formed by electroless plating. A plating resist 100 is formed on the seed layer 60a. The plating resist 100 has openings for forming the lands 62 and signal wiring 64 (FIG. 1).
図２Ｊに示されるように、めっきレジスト１００から露出するシード層６０ａ上に電解めっき膜６０ｂが形成される。電解めっき膜６０ｂは開口２２を充填する。第１面２０Ｆ上のシード層６０ａと電解めっき膜６０ｂによって、ランド６２と信号配線６４が形成される。第２導体層６０が形成される。開口２２内のシード層６０ａと電解めっき膜６０ｂによってビア導体７０が形成される。ビア導体７０は、パッド１２とランド６２を接続する。 As shown in FIG. 2J, an electrolytic plated film 60b is formed on the seed layer 60a exposed from the plating resist 100. The electrolytic plated film 60b fills the opening 22. The seed layer 60a and electrolytic plated film 60b on the first surface 20F form a land 62 and a signal wiring 64. The second conductor layer 60 is formed. The seed layer 60a and electrolytic plated film 60b in the opening 22 form a via conductor 70. The via conductor 70 connects the pad 12 and the land 62.
その後、めっきレジスト１００が除去される。電解めっき膜６０ｂから露出するシード層６０ａが除去される。第２導体層６０とビア導体７０は同時に形成される。加熱処理が施され、樹脂絶縁層２０が完全に硬化される。実施形態のプリント配線板２（図１）が得られる。 Then, the plating resist 100 is removed. The seed layer 60a exposed from the electrolytic plating film 60b is removed. The second conductor layer 60 and via conductors 70 are formed simultaneously. A heat treatment is performed, and the resin insulating layer 20 is completely cured. The printed wiring board 2 (Figure 1) of the embodiment is obtained.
実施形態の製造方法によると、第１導体層１０上に形成部材３０が貼り付けられる際に、樹脂絶縁層２０の一部が第１保護膜３２の外周縁から外方にはみ出るとともに第１保護膜３２の上方に突出し得る（図２Ｃ）。ただし、実施形態の製造方法では、第１保護膜３２が樹脂絶縁層２０から取り除かれた後に（図２Ｄ）、樹脂絶縁層２０の第１面２０Ｆに第２保護膜４２が貼り付けられる（図２Ｅ）。この結果、樹脂絶縁層２０の第１面２０Ｆの全面が押圧されて第１面２０Ｆが平坦化される（図２Ｅ）。樹脂絶縁層２０の突出部２１が消失する。平坦化後の第１面２０Ｆには上方に突出する部分が存在しない。その結果、実施形態の製造方法で製造されるプリント配線板２の平坦性が損なわれることが抑制される。高い品質のプリント配線板２が提供される。 According to the manufacturing method of the embodiment, when the forming member 30 is attached to the first conductor layer 10, a portion of the resin insulating layer 20 may protrude outward from the outer periphery of the first protective film 32 and may protrude above the first protective film 32 ( FIG. 2C ). However, in the manufacturing method of the embodiment, after the first protective film 32 is removed from the resin insulating layer 20 ( FIG. 2D ), the second protective film 42 is attached to the first surface 20F of the resin insulating layer 20 ( FIG. 2E ). As a result, the entire first surface 20F of the resin insulating layer 20 is pressed, flattening the first surface 20F ( FIG. 2E ). The protruding portion 21 of the resin insulating layer 20 disappears. After flattening, there is no upwardly protruding portion on the first surface 20F. As a result, the flatness of the printed wiring board 2 manufactured by the manufacturing method of the embodiment is prevented from being impaired. A high-quality printed wiring board 2 is provided.
［実施形態の改変例］
改変例では、得られるプリント配線板２は実施形態と同じである（図１）。第１改変例では製造方法の一部が実施形態と異なる。改変例では、形成部材３０の貼り付け（図２Ｃ）及び第１保護膜３２の除去（図２Ｄ）の後に行われる樹脂絶縁層２０の第１面２０Ｆの平坦化の方法が実施形態と異なる。
[Modification of the embodiment]
In the modified example, the resulting printed wiring board 2 is the same as that of the embodiment (FIG. 1). In the first modified example, a part of the manufacturing method differs from that of the embodiment. In the modified example, the method of planarizing the first surface 20F of the resin insulating layer 20, which is performed after attaching the forming member 30 (FIG. 2C) and removing the first protective film 32 (FIG. 2D), differs from that of the embodiment.
図３Ａに示されるように、改変例では、第２保護膜４２（図２Ｅ）の貼り付けに代えて、加圧板１５０によって樹脂絶縁層２０の第１面２０Ｆの全面が押圧される。即ち、加圧板１５０によって第１面２０Ｆの全面が直接押圧される。この結果、第１面２０Ｆが平坦化される。加圧板１５０は例えばラバー製の板である。加圧板１５０はＳＵＳ製の板であってもよい。加圧板１５０による加圧とともに加熱が行われる。加熱により樹脂絶縁層２０の硬化がさらに進行する。 As shown in Figure 3A, in this modified example, instead of attaching the second protective film 42 (Figure 2E), the entire first surface 20F of the resin insulation layer 20 is pressed by a pressure plate 150. That is, the entire first surface 20F is directly pressed by the pressure plate 150. As a result, the first surface 20F is flattened. The pressure plate 150 is, for example, a rubber plate. The pressure plate 150 may also be a stainless steel plate. Heat is applied in addition to pressure by the pressure plate 150. Heating further promotes hardening of the resin insulation layer 20.
図３Ｂに示されるように、第１面２０Ｆの平坦化の後に、第１面２０Ｆの上からレーザ光Ｌが照射される。第１導体層１０のパッド１２に至るビア導体用の開口２２が形成される。開口２２の形成以降の工程は、実施形態の図２Ｉ、図２Ｊで示される工程と同様である。 As shown in Figure 3B, after the first surface 20F is planarized, laser light L is irradiated from above the first surface 20F. Openings 22 for via conductors reaching the pads 12 on the first conductor layer 10 are formed. The processes subsequent to the formation of the openings 22 are the same as those shown in Figures 2I and 2J of the embodiment.
改変例の製造方法によると、第１保護膜３２が樹脂絶縁層２０から取り除かれた後に（図２Ｄ）、樹脂絶縁層２０の第１面２０Ｆの全面が加圧板１５０によって押圧される（図３Ａ）。第１面２０Ｆが平坦化される。樹脂絶縁層２０の突出部２１（図２Ｄ）が消失する。平坦化後の第１面２０Ｆには上方に突出する部分が存在しない。プリント配線板２の平坦性が損なわれることが抑制される。高い品質のプリント配線板２が提供される。 In the modified manufacturing method, after the first protective film 32 is removed from the resin insulating layer 20 (FIG. 2D), the entire first surface 20F of the resin insulating layer 20 is pressed by a pressure plate 150 (FIG. 3A). The first surface 20F is flattened. The protruding portion 21 (FIG. 2D) of the resin insulating layer 20 disappears. After flattening, there are no upwardly protruding portions on the first surface 20F. This prevents the flatness of the printed wiring board 2 from being impaired. A high-quality printed wiring board 2 is provided.
２ ：プリント配線板
４ ：絶縁層
１０ ：第１導体層
１２ ：パッド
１４ ：信号配線
２０ ：樹脂絶縁層
２０Ｆ ：第１面
２０Ｂ ：第２面
２１ ：突出部
３０ ：形成部材
３２ ：第１保護膜
４２ ：第２保護膜
５０ ：加圧板
2: Printed wiring board 4: Insulating layer 10: First conductor layer 12: Pad 14: Signal wiring 20: Resin insulating layer 20F: First surface 20B: Second surface 21: Protrusion 30: Forming member 32: First protective film 42: Second protective film 50: Pressure plate
Claims (4)
第１面と前記第１面と反対側の第２面とを有する熱硬化性の樹脂絶縁層と前記樹脂絶縁層の前記第１面上に形成される第１保護膜とを有し、前記第１面に垂直な光で前記樹脂絶縁層と前記第１保護膜が投影される場合に前記第１保護膜の外周縁の各辺が前記樹脂絶縁層の各辺と重なる形成部材を準備することと、
前記導体回路と前記第２面が接触するように前記導体層上に前記形成部材を貼り付けることと、
前記貼り付けることの後に前記第１保護膜を前記樹脂絶縁層から取り除くことと、
前記取り除くことの後に前記第１面の全面を押圧して前記第１面を平坦化すること、とを有するプリント配線板の製造方法。 forming a conductor layer having a conductor circuit on an insulating layer;
preparing a forming member having a thermosetting resin insulating layer having a first surface and a second surface opposite to the first surface, and a first protective film formed on the first surface of the resin insulating layer, wherein when the resin insulating layer and the first protective film are projected with light perpendicular to the first surface, each side of the outer periphery of the first protective film overlaps each side of the resin insulating layer;
attaching the forming member onto the conductor layer so that the conductor circuit and the second surface are in contact;
removing the first protective film from the resin insulating layer after the attaching;
and after the removing, pressing the entire first surface to flatten the first surface.
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| JP2007243210A (en) | 2007-04-19 | 2007-09-20 | Matsushita Electric Ind Co Ltd | Heat dissipation substrate and manufacturing method thereof |
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| WO2018008657A1 (en) | 2016-07-08 | 2018-01-11 | 住友ベークライト株式会社 | Sealing film, sealing method for electronic component mounted substrate, and electronic component mounted substrate coated with sealing film |
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|---|---|---|---|---|
| JP2008251918A (en) | 2007-03-30 | 2008-10-16 | Fujifilm Corp | Permanent pattern forming method and printed circuit board |
| JP2007243210A (en) | 2007-04-19 | 2007-09-20 | Matsushita Electric Ind Co Ltd | Heat dissipation substrate and manufacturing method thereof |
| JP2015195240A (en) | 2014-03-31 | 2015-11-05 | 信越化学工業株式会社 | Semiconductor device, stacked semiconductor device, post-sealing stacked semiconductor device, and manufacturing method thereof |
| JP2016193591A (en) | 2015-03-31 | 2016-11-17 | 太陽インキ製造株式会社 | Laminated film |
| WO2018008657A1 (en) | 2016-07-08 | 2018-01-11 | 住友ベークライト株式会社 | Sealing film, sealing method for electronic component mounted substrate, and electronic component mounted substrate coated with sealing film |
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