JP7734082B2 - laser processing machine - Google Patents

Description

The present invention relates to a laser processing machine.

Laser processing machines, which use a laser beam to perform cutting processes on plate-shaped workpieces such as sheet metal, are known. Laser processing machines irradiate the workpiece with a laser beam, cutting it using thermal energy. Laser processing machines cut parts of the desired shape from the workpiece by moving the processing head that irradiates the laser beam.

When performing micromachining to cut out tiny parts from a thin workpiece, the cut-out tiny parts can fall off. Therefore, when performing micromachining, a table with a mesh structure with small gaps is used, and the workpiece is placed on this table and laser processing is performed.

When performing laser processing, if the gas pressure of the assist gas injected during processing causes the workpiece to flutter or shift position, it can lead to processing defects. A method is known for fixing the workpiece by sucking air from below the table (see, for example, Patent Document 1).

Japanese Patent Application Laid-Open No. 2016-203244

However, in order to suck up the workpiece on the table, a separate suction means must be installed, and adding the associated control functions leads to increased costs. Furthermore, as the workpiece becomes thinner, the position of the workpiece can shift due to various factors, not just during machining.

A laser processing machine according to one embodiment of the present invention comprises a pallet on which a workpiece is placed, a processing head disposed above the pallet and irradiating a laser beam toward the workpiece to perform laser processing, a dust collection chamber disposed to surround the space below the pallet and collecting dust generated during laser processing, a dust collection duct connected to the dust collection chamber and using the airflow drawn in by the dust collection device to suck in air from within the dust collection chamber, a processing table smaller than the pallet and disposed in a designated section within the pallet on which the workpiece is placed, a suction table disposed to surround the space below the processing table, a suction duct connected to the suction table and using the airflow drawn in by the dust collection device to suck in air from within the suction table, a switching device connected to the dust collection duct and the suction duct and switching the airflow drawn in by the dust collection device between the dust collection duct and the suction duct, and a control device for controlling the dust collection device. The control device has switchable operating modes for controlling the dust collector: a first operating mode in which operation of the dust collector is initiated in conjunction with the start of laser processing, and a second operating mode in which operation of the dust collector is initiated in conjunction with instructions from the operator.

In one aspect of the laser processing machine of the present invention, air within the dust collection chamber is sucked through the dust collection duct by the flow of air drawn in by the dust collection device. The flow of air drawn in by the dust collection device can be switched from the dust collection duct to the suction duct by a switching device. By switching the air flow to the suction duct, air within the suction table can be sucked in. Since suction can be applied to a limited area of the processing table located in a specified section within the pallet, a workpiece can be fixed to the processing table. Because the dust collection device that sucks in air within the dust collection chamber is used to suck in the suction table, there is no need to provide a separate suction means dedicated to sucking in the suction table.

In addition, by having the control device switch the operating mode to the second operating mode, the dust collection device can be operated at any time, regardless of the operating state of the laser processing machine.

According to one aspect of the present invention, by using a dust collection device, workpieces can be secured inexpensively and when necessary, regardless of the operating state of the laser processing machine.

FIG. 1 is a diagram showing a schematic diagram of the main configuration of a laser processing machine according to this embodiment. FIG. 2 is a perspective view showing the basic structure of a laser processing machine. FIG. 3 is a perspective view showing a laser processing machine equipped with a suction table and a processing table. FIG. 4 is a diagram for explaining the state of the pallet mounted on the laser processing machine shown in FIG. FIG. 5 is a diagram for explaining the state of the pallet mounted on the laser processing machine shown in FIG. FIG. 6 is a diagram illustrating setting buttons for setting the operation mode. FIG. 7 is a diagram for explaining the operating states of the dust collector corresponding to the operating states of the laser processing machine and the operating modes for controlling the dust collector.

The laser processing machine according to this embodiment will be described below with reference to the drawings. Figure 1 is a diagram showing a schematic diagram of the main components of the laser processing machine according to this embodiment.

First, referring to Figure 1, an overview of the laser processing machine 10 will be described. The laser processing machine 10 comprises a pallet 50 on which the workpiece W is placed, a processing head 30 that is positioned above the pallet 50 and performs laser processing by irradiating a laser beam toward the workpiece W, a dust collection chamber 60 that surrounds the space below the pallet 50 and collects dust generated during laser processing, a dust collection duct 61 that is connected to the dust collection chamber 60 and uses the air flow drawn in by a dust collection device 90 to suck air from within the dust collection chamber 60, and a dust collection duct 61 that is smaller than the pallet 50 and is positioned in a predetermined section within the pallet 50. The system comprises a processing table 80 on which the workpiece W is placed, a suction table 81 arranged to surround the space below the processing table 80, a suction duct 85 connected to the suction table 81 and which sucks air from inside the suction table 81 using the flow of air drawn in by the dust collector 90, a switching device 70 connected to the dust collection duct 61 and the suction duct 85 and which switches the flow of air drawn in by the dust collector 90 between the dust collection duct 61 and the suction duct 85, and a control device 100 which controls the dust collector 90.

The control device 100 has two switchable operating modes for controlling the dust collector 90: a first operating mode in which the dust collector 90 starts operating in conjunction with the start of laser processing, and a second operating mode in which the dust collector 90 starts operating in conjunction with instructions from the operator.

Figure 2 is a perspective view showing the basic structure of a laser processing machine. Next, the basic structure of the laser processing machine 10 according to this embodiment will be described. In this specification, directions are defined as the left-right and front-rear directions that are perpendicular to the horizontal direction, and the up-down direction that is perpendicular to the horizontal direction. The left-right and front-rear directions are parallel to the in-plane direction of the workpiece W placed on the pallet 50, and the up-down direction corresponds to the direction perpendicular to the plane of the workpiece W placed on the pallet 50.

The laser processing machine 10 is a processing machine that cuts the workpiece W using thermal energy by irradiating the workpiece W with a laser beam. The laser processing machine 10 includes a main body 11, a head drive mechanism 15, a processing head 30, a pallet 50, a control device 100, and a laser oscillator 110.

The main body 11 is formed in a roughly rectangular parallelepiped shape and is placed on an installation surface such as a floor. Side frames 12 extending in the left-right direction are disposed on the front and rear edges of the main body 11. The side frames 12 on the front and rear edges are disposed parallel to each other.

The head drive mechanism 15 moves the processing head 30 in the front-to-back and left-to-right directions. The head drive mechanism 15 includes an X-axis carriage 16 and a Y-axis carriage 17.

The X-axis carriage 16 has a gate-like shape. The X-axis carriage 16 is supported by a pair of side frames 12 and is configured to be movable along the side frames 12. The X-axis carriage 16 is driven by an X-axis drive unit (not shown) provided on the side frames 12, and moves left and right.

The Y-axis carriage 17 is supported by the X-axis carriage 16 and is configured to be movable along the X-axis carriage 16. The Y-axis carriage 17 is driven by a Y-axis drive unit (not shown) provided on the X-axis carriage 16, and moves in the forward and backward directions.

The processing head 30 irradiates the workpiece W with a laser beam from above, performing laser processing on the workpiece W. A laser beam emitted from a laser oscillator 110 is transmitted to the processing head 30 via a process fiber (not shown). The laser beam is irradiated onto the workpiece W from a nozzle provided at the tip of the processing head 30.

The machining head 30 is mounted on the Y-axis carriage 17. By driving the X-axis drive unit and the Y-axis drive unit to move the X-axis carriage 16 and the Y-axis carriage 17, the machining head 30 can be moved left and right and forward and backward, respectively. The head drive mechanism 15 also has a Z-axis drive unit (not shown), and the machining head 30 is driven by the Z-axis drive unit to move up and down.

The processing head 30 can perform laser processing within a predetermined processing range by moving left and right and forward and backward using the head drive mechanism 15. The laser processing machine 10 of this embodiment is designed for small-sized workpieces W, and the processing range is set to a range that can process workpieces W up to a maximum size of 4' x 4' (1219 mm x 1219 mm).

The pallet 50 is supported horizontally by a pair of side frames 12. A workpiece W is placed on the pallet 50. The pallet 50 has a square shape and can accommodate workpieces W of the same size as the processing area or smaller. The structure of the pallet 50 and the associated laser processing machine 10 will be described later.

The pallet 50 is supported for left-right movement via guide members (not shown) fixed to the side frames 12. The guide members slidably support rails provided on the pallet 50, thereby guiding the linear movement of the pallet 50.

A handle (not shown) is provided on the left end of the pallet 50, which the worker grasps to move the pallet 50. By grasping the handle and moving the pallet 50 left and right, the worker can move the pallet 50 between the normal position and the pulled-out position.

When the pallet 50 is in the normal position, it is housed in the main body 11 (as shown in Figure 2). At this time, almost the entire area of the pallet 50 is included in the processing range of the processing head 30. When the pallet 50 is in the normal position and pulled out to the left, the pallet 50 moves to the pulled-out position. When the pallet 50 is in the pulled-out position, part of the pallet 50 is pulled out from the main body 11.

The control device 100 is composed of a box-shaped housing and a circuit board housed inside this housing. The control device 100 is located at the lower right end of the main body 11 and is fixed to the main body 11.

The control device 100 is composed of a computer having a hardware processor such as a CPU (Central Processing Unit), memory, and various interfaces. The memory and various interfaces are connected to the hardware processor via a bus. The various functions of the control device 100 are realized by having the hardware processor execute programs stored in the memory.

As shown in FIG. 1, the control device 100 controls the head drive mechanism 15 and the laser oscillator 110 in accordance with the processing program to perform laser processing on the workpiece W. The control device 100 also starts or stops the operation of the dust collection device 90 in accordance with the operating state of the laser processing machine 10 and instructions from the operator.

An operation unit 105 is connected to the control device 100. The operation unit 105 is a device through which the operator performs input operations. For example, the operation unit 105 is mainly composed of a display and a touch panel that allows the operator to perform input operations in accordance with the information displayed on the display. By operating the operation unit 105, the operator can input various instructions to the laser processing machine 10, including operational settings for the laser processing machine 10. The operator can also ascertain various information related to the laser processing machine 10 from the information displayed on the operation unit 105.

The laser oscillator 110 generates a laser beam and supplies it to the processing head 30. As shown in Figure 2, the laser oscillator 110 is composed of a box-shaped housing and electronic and electrical components housed inside the housing. The laser oscillator 110 is located at the upper right end of the main body 11 and is fixed to the main body 11.

Figure 3 is a perspective view showing a laser processing machine equipped with a suction table and a processing table. Figure 4 is a diagram explaining the state of the pallet mounted on the laser processing machine shown in Figure 2. Figure 5 is a diagram explaining the state of the pallet mounted on the laser processing machine shown in Figure 3. Below, the structure of the pallet 50 and the structure of the laser processing machine 10 related to the pallet 50 will be explained in detail with reference to Figures 3 to 5 in addition to Figures 1 and 2.

As shown in Figures 2 and 4, the pallet 50 comprises a frame 51 and multiple skids 52.

The frame body 51 is a frame member that has a square shape when viewed from above the pallet 50. A partition plate 51a extending in the left-right direction is provided in the center of the frame body 51 in the front-to-rear direction.

The multiple skids 52 are attached to the frame 51 and are work support members that support the workpiece W. Each skid 52 is a plate-shaped member extending in the front-to-rear direction, and the multiple skids 52 are arranged at intervals in the left-to-right direction. The multiple skids 52 are respectively arranged in the front region of the pallet 50 located forward of the partition plate 51a, and in the rear region of the pallet 50 located rearward of the partition plate 51a. Both ends of the skids 52 are supported by the frame members and partition plate 51a that make up the frame 51. Each skid 52 can be attached to and detached from the frame 51.

The skid 52 is made of a metal material such as steel, for example mild steel. The skid 52 is arranged in an upright position along the vertical direction. The upper edge of the skid 52 has multiple protrusions that each protrude upward. The multiple protrusions are spaced apart in the front-to-rear direction. Each protrusion is formed vertically long in the vertical direction, and has a mountain-like shape that narrows as it extends upward. The workpiece W is supported at the upper edge of the skid 52, i.e., at the apex of each protrusion.

The multiple skids 52 are arranged with large intervals between them in the left-right direction, and are primarily used to place large workpieces W with large cut-out parts.

As shown in Figures 3 and 5, a processing table 80 can be installed on the pallet 50 to place a small workpiece W, such as a thin plate, and perform fine processing. The processing table 80 is smaller than the pallet 50 and is placed in a designated section within the pallet 50. For example, by removing the skid 52 attached to the front area of the pallet 50, a designated section for installing the processing table 80 can be secured. The processing table 80 is removably installed on a suction table 81, which will be described later.

The processing table 80 has a fixed height in the vertical direction, and the workpiece W can be placed on its upper surface. The processing table 80 has a mesh structure with spacing smaller than the spacing between the skids 52 arranged on the pallet 50, and has multiple through-holes that penetrate each in the vertical direction. The mesh structure can be a honeycomb shape with a hexagonal cross section in the horizontal direction, or a lattice shape with a rectangular cross section in the horizontal direction.

As shown in Figures 1, 2, and 3, the laser processing machine 10 further includes a dust collection chamber 60, a dust collection duct 61, a suction table 81, a suction duct 85, a switching device 70, and a dust collection device 90. Note that the dust collection device 90 is not shown in Figures 2 and 3.

The dust collection chamber 60 is located to surround the space below the pallet 50 when it is in its normal position, and is a space for collecting dust generated around the pallet 50 during laser processing. This dust includes fumes and spatter (molten metal). The dust generated during laser processing is guided into the dust collection chamber 60 by the assist gas sprayed from the processing head 30 and the flow of air drawn into the dust collection duct 61.

The dust collection duct 61 sucks in air from within the dust collection chamber 60. One end of the dust collection duct 61 is connected to the dust collection chamber 60, and the other end of the dust collection duct 61 is connected to the switching device 70. The dust collection duct 61 sucks in air from within the dust collection chamber 60 using the flow of air drawn in by the dust collection device 90. By sucking in the air from within the dust collection chamber 60, dust generated during laser processing can be collected.

As shown in Figures 1 and 3, the suction table 81 is a table used when placing the processing table 80 on the pallet 50, and is configured to be detachable from the pallet 50. The suction table 81 is a rectangular box with an open top. The suction table 81 is formed to be the same size as the processing table 80, and the processing table 80 can be detachably placed above the suction table 81. By attaching the processing table 80 to the suction table 81, the two are integrated, and the space below the processing table 80 is enclosed by the suction table 81.

The suction duct 85 sucks air from inside the suction table 81. One end of the suction duct 85 is connected to the suction table 81, and the other end of the suction duct 85 is connected to the switching device 70. The suction duct 85 sucks air from inside the suction table 81 using the flow of air drawn in by the dust collector 90. By sucking air from inside the suction table 81, negative pressure is created on the underside of the processing table 80. The negative pressure causes the workpiece W placed on the top surface of the processing table 80 to be sucked in, fixing the workpiece W to the processing table 80.

The processing table 80 and suction table 81 can be installed on the pallet 50 by pulling the pallet 50 out from its normal position and leaving it in the pulled-out position. The worker removes the skid 52 in the front area of the pallet 50, opening up the front area of the pallet 50. This allows the processing table 80 and suction table 81 to be installed on the pallet 50.

As shown in Figures 3 and 5, the suction duct 85 is composed of a first duct portion 85a and a second duct portion 85b, and can be divided into two elements. The frame 51 of the pallet 50 is provided with a communication portion 53 that connects the inside and outside of the frame 51. The first duct portion 85a connects the connection joint 83 of the suction table 81 to the communication portion 53. The second duct portion 85b connects the communication portion 53 to the switching device 70. The first duct portion 85a and the second duct portion 85b are connected to each other via the communication portion 53 of the pallet 50.

In addition, since the peripheral edge of the upper surface of the suction table 81 forms a contact surface that comes into contact with the peripheral edge of the lower surface of the processing table 80, a sealing material may be provided to fill the gap between the suction table 81 and the processing table 80. Examples of sealing materials include sponge. Furthermore, protrusions or notches may be formed on the peripheral edge of the upper surface of the suction table 81 to position the processing table 80 when it is installed. Furthermore, the processing table 80 and the suction table 81 do not need to be separate entities, but may be formed as an integrated structure.

As shown in FIG. 1, the switching device 70 is connected to the dust collection duct 61 and the suction duct 85. The switching device 70 is connected to a collecting duct 75 that leads to the dust collector 90. The dust collector 90 is equipped with an exhaust fan that is rotated by a power mechanism such as a motor. When the exhaust fan rotates, negative pressure is created inside the dust collector 90, and air inside the collecting duct 75 is drawn into the dust collector 90.

The switching device 70 is a rectangular box. Air sucked in by the dust collection duct 61 and air sucked in by the suction duct 85 flows through the switching device 70 to the collection duct 75. The switching device 70 switches the flow of air drawn in by the dust collection device 90 between the dust collection duct 61 and the suction duct 85.

The method for controlling the dust collector 90 by the control device 100, which is one of the features of this embodiment, will be described below with reference to Figures 1, 6, and 7. Figure 6 is a diagram illustrating the setting buttons for setting the operating mode. Figure 7 is a diagram illustrating the operating states of the dust collector corresponding to the operating states of the laser processing machine and the operating modes for controlling the dust collector.

The dust collector 90 provided in the laser processing machine 10 functions to collect dust generated by laser processing by sucking in air from the dust collection chamber 60 when a workpiece W is placed on the skid 52 and laser processing is performed. On the other hand, when a thin workpiece W is processed using the processing table 80, the air flow drawn in by the dust collector 90 is switched to the suction duct 85 side. At this time, the dust collector 90 functions to secure the workpiece W to the processing table 80 by sucking in air from the suction table 81. In other words, the dust collector 90 serves two purposes: dust collection and securing the workpiece W to the processing table 80.

To accommodate different uses of the dust collector 90, the control device 100 has two operating modes for controlling the dust collector 90. The control device 100 can be used by switching between the two operating modes.

The first operating mode is a mode in which the dust collector 90 operates in conjunction with the laser processing operation by the laser processing machine 10 (hereinafter referred to as the "automatic operation mode"). When this automatic operation mode is selected, the control device 100, upon determining that laser processing has begun, starts operation of the dust collector 90 without any instructions from the operator. This automatic operation mode is an operating mode selected to operate the dust collector 90 as a dust collection function. The automatic operation mode is set as the initial operating mode.

On the other hand, the second operating mode is a mode in which the dust collector 90 operates in conjunction with instructions (input operations) from the operator (hereinafter referred to as the "manual operating mode"). When the manual operating mode is selected, the control device 100 determines that the operator has instructed the dust collector 90 to start operating, and starts operating the dust collector 90. Therefore, when the manual operating mode is selected, the control device 100 starts operating the dust collector 90 even before laser processing begins. This manual operating mode is an operating mode selected to operate the dust collector 90 as a function for fixing the workpiece W to the processing table 80.

Among the operation settings that define the operation of the laser processing machine 10, there is a setting item that is used when using the processing table 80. When the operator selects that setting item, setting buttons 106 for setting the operation mode, as shown in Figure 6, are displayed on the operation unit 105. The setting buttons 106 include an ON button 106a for selecting manual operation mode, and an OFF button 106b for not selecting manual operation mode, i.e., for selecting automatic operation mode. Because the initial setting for the operation mode is automatic operation mode, the setting button 106 also defaults to the OFF button 106b selected. The control device 100 switches the operation mode according to the selection made with the setting buttons 106.

When the ON button 106a is operated and the manual operation mode is selected, the control device 100 determines that the operator has issued an instruction to start operating the dust collector 90. The control device 100 then starts operating the dust collector 90 at the timing when the ON button 106a is operated. If laser processing is started while the dust collector 90 is operating, the control device 100 ends the operation of the dust collector 90 at the timing when the laser processing ends. The control device 100 determines the timing to end the laser processing based on a processing end code specified in the processing program. Examples of processing end codes that can be used include a code such as G50 that instructs a return to the origin, or a code such as M30 that instructs the end of the program.

On the other hand, if the ON button 106a is not operated and the automatic operation mode remains selected, the control device 100 starts the operation of the dust collector 90 when laser processing starts. The control device 100 determines the timing to start laser processing based on a processing start code specified in the processing program. The processing start code can be, for example, a code such as M103 that commands the lowering of the processing head 30. Then, as in the manual operation mode, the control device 100 ends the operation of the dust collector 90 when laser processing ends.

Referring to Figure 7, the relationship between the operating state of the laser processing machine 10 and the operating state of the dust collection device 90 will be explained. The circles in Figure 7 indicate states in which the dust collection device 90 is operating. First, the flow of operation of the laser processing machine 10 when laser processing the workpiece W using the processing table 80 will be explained.

The operator attaches the processing table 80 and suction table 81 to the pallet 50 and then places the workpiece W on the processing table 80. Next, the operator selects the ON button 106a of the setting buttons 106. When the ON button 106a of the setting buttons 106, i.e., manual operation mode, is selected, the control device 100 starts operating the dust collector 90, even if it is in standby mode before laser processing begins. When the dust collector 90 starts operating, the workpiece W on the processing table 80 is sucked in and fixed to the processing table 80. Because the workpiece W can be fixed once it is placed on the processing table 80, it is possible to prevent the workpiece W from shifting before laser processing begins. This makes it possible to prevent laser processing from starting with a misaligned workpiece W.

Next, when laser processing begins, the control device 100 continues operating the dust collector 90 and stops the operation of the dust collector 90 in conjunction with the completion of laser processing. As a result, the workpiece W is released from its fixed position after laser processing is completed, allowing the parts cut out from the workpiece W to be easily removed. Furthermore, since the operation of the dust collector 90 is not continued in situations where the workpiece W does not need to be fixed, the dust collector 90 can be operated economically.

In addition, in manual operation mode, once the dust collector 90 begins operating, it continues to operate during laser processing. Therefore, even if a reason arises to temporarily interrupt the processing operation while the laser processing machine 10 is operating, the control device 100 continues to operate the dust collector 90. Reasons for temporarily interrupting the processing operation include a program stop specified in the processing program to stop the processing operation and wait, or the occurrence of an alarm. Therefore, the workpiece W can continue to be fixed to the processing table 80 even between the time the processing operation is interrupted and the time it is resumed. This makes it possible to prevent the workpiece W from shifting while the processing operation is interrupted, and to prevent the processing operation from being resumed with the workpiece W shifted.

The purpose of continuing operation of the dust collector 90 even when the machining operation is interrupted is to prevent the workpiece W from shifting position, with the resumption of the machining operation in mind. Therefore, in the case of an interruption such as an emergency stop where the machining operation is not expected to be resumed afterwards, it is preferable to stop operation of the dust collector 90. Furthermore, in the case of an alarm being generated due to the dust collector 90, it is also preferable to stop operation of the dust collector 90.

It is also preferable that the control device 100 operate the dust collector 90 while performing adjustment operations of the laser processing machine 10, such as laser beam centering adjustment, focus adjustment, and tool diameter correction, or other so-called utility operations. The control device 100 also preferably continues operating the dust collector 90 after the utility operation. This ensures that the workpiece W remains fixed to the processing table 80 during and after the utility operation. This prevents laser processing from starting after the utility operation when the workpiece W remains misaligned.

Next, the flow of operation of the laser processing machine 10 when a workpiece W is placed on the skid 52 and laser processing is performed will be described. When a workpiece W is placed on the skid 52 and laser processing is performed, the ON button 106a is not operated and the OFF button 106b remains selected. As a result, the operating mode of the control device 100 remains in automatic operation mode. The control device 100 stops operation of the dust collector 90 while in standby mode for laser processing and starts operation of the dust collector 90 in conjunction with the start of laser processing. Once laser processing begins, the control device 100 continues operation of the dust collector 90 and stops operation of the dust collector 90 in conjunction with the end of laser processing. By operating the dust collector 90 in conjunction with the start and end of laser processing, the dust collector 90 operates only in the area where dust collection is required. This allows the dust collector 90 to be operated economically.

In automatic operation mode, if an event occurs that requires temporary interruption of laser processing operations by the laser processing machine 10, the control device 100 preferably temporarily stops operation of the dust collector 90. Furthermore, the control device 100 preferably operates the dust collector 90 while a utility operation is being performed, but stops operation of the dust collector 90 after the utility operation. This prevents the dust collector 90 from operating when it is not needed, allowing the dust collector 90 to operate efficiently.

As described above, with the laser processing machine 10 of this embodiment, air within the dust collection chamber 60 is sucked through the dust collection duct 61 by the air flow drawn in by the dust collection device 90. The air flow drawn in by the dust collection device 90 can be switched from the dust collection duct 61 to the suction duct 85 by the switching device 70. By switching the air flow to the suction duct 85, air within the suction table 81 located within the pallet 50 can be sucked in. As a result, the processing table 80 located in a predetermined section within the pallet 50 can be sucked in in a limited manner. This provides the suction force necessary to suck in the workpiece W, thereby ensuring that the workpiece W is securely fixed to the processing table 80. Furthermore, because the air flow drawn in from the dust collection chamber 60 is used, there is no need to provide a separate suction means dedicated to sucking in the suction table 81. As a result, the workpiece W can be secured in place with an inexpensive configuration.

In addition, by switching the operating mode to the second operating mode by the control device 100, the dust collector 90 can be operated at any time. This allows the dust collector 90 to operate even when the laser processing machine 10 is not performing laser processing, thereby enabling the workpiece W to be effectively fixed to the processing table 80.

In the above-described embodiment, when manual operation mode is selected, the control device 100 continues operating the dust collector 90 until laser processing is completed. However, the control device 100 may also be configured to stop operation of the dust collector 90 when the OFF button 106b is pressed while processing is temporarily suspended. This makes it possible to respond to requests such as removing only one part during processing.

As described above, an embodiment of the present invention has been described. However, the descriptions and drawings that form part of this disclosure should not be understood as limiting this invention. Various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art from this disclosure.

REFERENCE SIGNS LIST 10 Laser processing machine 11 Main body 12 Side frame 15 Head drive mechanism 16 X-axis carriage 17 Y-axis carriage 30 Processing head 50 Pallet 51 Frame 51a Partition plate 52 Skid 53 Communication section 60 Dust collection chamber 61 Dust collection duct 70 Switching device 75 Collecting duct 80 Processing table 81 Suction table 83 Connection joint 85 Suction duct 85a First duct section 85b Second duct section 90 Dust collection device 100 Control device 105 Operation section 106 Setting button 106a ON button 106b OFF button 110 Laser oscillator W Workpiece

Claims (7)

a pallet for placing the workpiece;
a processing head disposed above the pallet and configured to irradiate a laser beam toward the workpiece to perform laser processing;
a dust collection chamber that is provided to surround the space below the pallet and collects dust generated by the laser processing;
a dust collection duct connected to the dust collection chamber and configured to suck air from the dust collection chamber by the airflow drawn in by the dust collection device;
a processing table formed to be smaller than the pallet, arranged in a predetermined section within the pallet, and on which the workpiece is placed;
a suction table provided to surround a space below the processing table;
a suction duct connected to the suction table, which sucks air from within the suction table by the flow of air drawn in by the dust collecting device;
a switching device connected to the dust collection duct and the suction duct, and switching the flow of air drawn by the dust collector between the dust collection duct and the suction duct;
a control device for controlling the dust collecting device,
The control device
A switchable operation mode for controlling the dust collecting device includes:
a first operation mode in which the operation of the dust collecting device is started in conjunction with the start of the laser processing;
a second operation mode in which the operation of the dust collecting device is started in conjunction with an instruction from an operator;
A laser processing machine having: The control device
The laser processing machine according to claim 1 , wherein, when the operation mode is the first operation mode, the operation of the dust collecting device is stopped in conjunction with the end of the laser processing. The control device
3. The laser processing machine according to claim 2, wherein when the operation mode is the first operation mode, if the laser processing operation is temporarily interrupted during operation of the laser processing machine, the operation of the dust collecting device is also temporarily stopped. The control device
4. The laser processing machine according to claim 2, wherein when the operation mode is the first operation mode, the dust collecting device is operated while an adjustment operation of the laser processing machine is being performed, and the operation of the dust collecting device is stopped in conjunction with the completion of the adjustment operation. The control device
The laser processing machine according to claim 1 , wherein when the operation mode is the second operation mode, the operation of the dust collecting device is stopped in conjunction with the end of the laser processing. The control device
6. The laser processing machine according to claim 5, wherein when the operation mode is the second operation mode, the operation of the dust collecting device continues even if the laser processing is temporarily interrupted during operation of the laser processing machine. The control device
7. The laser processing machine according to claim 5, wherein when the operation mode is the second operation mode, the dust collecting device is operated while an adjustment operation of the laser processing machine is being performed, and the operation of the dust collecting device continues even after the adjustment operation is completed.