JP7746097B2 - Tube Joining Device - Google Patents

Description

The present invention relates to a tube connecting device.

A conventionally known technique for joining tubes with internal lumens involves cutting the ends of each tube and then pressing the cut ends together to form a pressure joint. This technique is widely used in a variety of industrial fields, and one example is its application to medical technologies such as peritoneal dialysis.

Peritoneal dialysis is a method in which a specific dialysis solution is introduced into the patient's body using a tube (catheter) implanted in the peritoneal cavity, and then water and waste products that have migrated into the dialysis solution are removed from the body via the peritoneum. For example, Patent Document 1 describes a tube joining device that uses a heated cutting element to cut two tubes to be joined, then swaps the ends of the tubes to join them.

JP 2013-146354 A

For example, in the lumen of a tube used to discharge the above-mentioned dialysis fluid from the body, substances containing lipids and proteins adhering to the inner surface of the tube may remain as foreign matter. If a cutting member is used to cut a tube with foreign matter remaining in the lumen, the foreign matter will leak out of the tube and adhere to the surface of the cutting member. Furthermore, if foreign matter adhering to the cutting member adheres to the ends of the tube during the process of cutting and joining the tubes together, this may reduce the joining strength of the tube or cause pinholes.

The present invention aims to solve the above problems by providing a tube joining device that can prevent a decrease in joining strength and the occurrence of pinholes, even when foreign matter remains in the tube lumen.

A tube joining device is a tube joining device that cuts a first tube and a second tube, and then swaps and joins a first cut end of the first tube and a second cut end of the second tube, the tube joining device having a tube holding section that holds the first tube and the second tube, a holder section that holds a cutting member that cuts the first tube and the second tube held in the tube holding section, and a control section that controls the operation of each section of the device, wherein the control section performs a cutting operation that brings the cutting member relatively close to the first tube and the second tube when cutting the first tube and the second tube, and a retraction operation that moves the cutting member relatively away from the first tube and the second tube after cutting the first tube and the second tube, and the control section controls the cutting member to move away from the first tube and the second tube during the cutting operation. and a position change operation is performed to change the position of at least one of the first tube and the second tube, the cutting member, and the holder unit after cutting the first tube and the second tube so that a first path along which the cutting member approaches the first tube and the second tube relatively and a second path along which the cutting member moves away from the first tube and the second tube relatively during the retraction operation are different paths, the control unit moves the cutting member toward the first tube and the second tube along the first path during the cutting operation, and moves the cutting member away from the first tube and the second tube along the second path during the retraction operation, and the control unit changes the position of the cutting member and/or the holder unit after cutting the first tube and the second tube so that the first path and the second path are different paths.

The tube joining device of the present invention can prevent a decrease in joining strength and the occurrence of pinholes, even if foreign matter remains in the tube lumen.

1 is a schematic perspective view of a tube connecting device according to an embodiment. FIG. FIG. 2 is a functional block diagram of the tube connecting device. FIG. 4 is a view showing a holder part of the tube connecting device. FIG. 2 is a diagram showing a rotation mechanism of the tube connecting device. FIG. 4 is a diagram illustrating a first tube and a second tube. 10A and 10B are diagrams for explaining the cutting and joining operation of the tube joining device. 10A and 10B are diagrams for explaining the cutting and joining operation of the tube joining device. 10A and 10B are diagrams for explaining the cutting and joining operation of the tube joining device. 10A and 10B are diagrams for explaining the cutting and joining operation of the tube joining device. 10A and 10B are diagrams for explaining the cutting and joining operation of the tube joining device. 10A and 10B are diagrams for explaining the cutting and joining operation of the tube joining device. 10A and 10B are diagrams for explaining the function and effect of the tube connecting device. 10A and 10B are diagrams for explaining the function and effect of the tube connecting device. 10A and 10B are diagrams for explaining the function and effect of the tube connecting device. 10A and 10B are diagrams for explaining the function and effect of the tube connecting device. 10A and 10B are diagrams for explaining the function and effect of the tube connecting device. 10A and 10B are diagrams for explaining the function and effect of the tube connecting device. FIG. 10 is a diagram for explaining a tube connecting device according to a comparative example. FIG. 10 is a diagram for explaining a tube connecting device according to a comparative example.

Embodiments of the present invention will be described below with reference to the attached drawings.

Figures 1 to 5 are diagrams explaining the overall configuration and configuration of each part of a tube connecting device 1 according to an embodiment of the present invention. Figure 6 is a diagram explaining the first tube 210 and second tube 220 that are connected by the tube connecting device 1. Figures 7 to 12 are diagrams showing, in simplified form, the cutting and connecting operations of the tube connecting device 1. Figures 13 to 20 are diagrams explaining the effects of the tube connecting device 1 according to this embodiment and a comparative tube connecting device.

In each figure, the front-to-rear direction of the tube joining device 1 is indicated by arrow X, the left-to-right direction is indicated by arrow Y, and the height direction is indicated by arrow Z. The above-mentioned "left-to-right direction" is approximately the same direction as the direction in which each tube 210, 220 is arranged (the extension direction of each tube 210, 220) when each tube 210, 220 is set in the tube joining device 1.

The drawings labeled "rotating side" in Figures 13 to 20 are schematic drawings of the wafer 100 and each tube 210, 220 as viewed from the "rotating side" indicated by the arrow in Figure 9. Furthermore, the drawings labeled "fixed side" in Figures 13 to 20 are schematic drawings of the wafer 100 and each tube 210, 220 as viewed from the "fixed side" indicated by the arrow in Figure 9.

<Tube joining device>
As shown in FIG. 6, the tube connecting device 1 in this embodiment is configured as a medical device that cuts and connects a first tube 210 on the peritoneal dialysis fluid bag T11 side and a second tube 220 on the peritoneal catheter T26 side of a patient (user H) undergoing peritoneal dialysis.

As shown in Figure 1, the tube joining device 1 can be used in combination with a wafer cassette WC containing multiple wafers 100 (corresponding to a "cutting member") used for cutting.

When cutting each tube 210, 220, the tube joining device 1 presses the first tube 210 and second tube 220 set in the tube joining device 1 against each other and crushes them, as shown in Figure 9, and then cuts (melts) them using a heated wafer 100. After cutting each tube 210, 220, the tube joining device 1 swaps the cut first end 210a of the first tube 210 with the cut second end 220a of the second tube 220, and joins (welds) each tube 210, 220 while they are pressed against each other, as shown in Figures 10 and 11.

As shown in Figure 1, the tube joining device 1 generally comprises a housing 10, a tube holding unit 20 that holds the first tube 210 and the second tube 220, a holder unit 30 (see Figure 4) that holds a wafer 100 that cuts the first tube 210 and the second tube 220 held by the tube holding unit 20, a control unit 40 (see Figure 3) that controls the operation of each unit of the device, a lid unit 50 attached to the housing 10, and a rotation mechanism 80 (see Figure 5) that rotates the first tube 210 and the second tube 220 relative to each other after cutting.

The housing 10 is composed of a roughly hexahedral case with an upper portion and a lower portion that forms the side surfaces. The components of the tube connecting device 1 are assembled to the housing 10.

In addition to the components described in this specification, the housing 10 can also be optionally equipped with other components necessary for the operation of the tube connecting device 1, such as a panel with operation buttons for receiving operation instructions from the user, an electrical connector or battery that enables the supply of power to the tube connecting device 1, and other components necessary for the operation of the tube connecting device 1.

The housing 10 is provided with a storage section 11a that can store a wafer cassette WC, and an ejection button 11b that is operated to remove the wafer cassette WC from the storage section 11a. User H can set the wafer cassette WC in the housing 10 by inserting it into the storage section 11a.

The tube joining device 1 has a feeder 91 (see Figure 3) that transports wafers 100 set in a wafer cassette WC to the cutting position Y0 of each tube 210, 220, and a heating unit 92 (see Figure 3) that heats the wafers 100 transported to the feeder 91. After completing the cutting and joining operations, the feeder 91 moves the wafers 100 to a position where they can be removed from the housing 10 (for example, the gap 13 in the housing 10 shown in Figure 1).

The feed unit 91 can be configured, for example, by a known transport member equipped with a feed screw mechanism that pushes the rear end 106 (see Figure 13) of the wafer 100 toward the holder unit 30 (see Figure 4). The heating unit 92 can be configured, for example, by a known heater that supplies current to the wafer to heat it.

As shown in FIG. 13, the wafer 100 can be made of a metal plate-like member having a first side 101, a second side 102, an upper end 103, a lower end 104, a leading end 105, and a trailing end 106. The wafer 100 can be made of, for example, a copper plate. However, there are no particular restrictions on the specific material or shape of the wafer 100, as long as it is possible to cut each tube 210, 220 from it.

As shown in FIG. 4, during the cutting and joining operation, the wafer 100 is transported to the holder unit 30 attached to the housing 10. The lower end 104 of the wafer 100 is supported by the main body 31 of the holder unit 30. The upper end 103 of the wafer 100 is positioned so as to be exposed from the holder unit 30. As shown in FIG. 13, the upper end 103 of the wafer 100 functions as a cutting unit for cutting each tube 210, 220.

As shown in Figures 1 and 2, the tube holding portion 20 has a first holding portion 21 and a second holding portion 22 arranged at a predetermined distance from the first holding portion 21 in the left-right direction Y.

As shown in FIG. 1, the first holding portion 21 has a first recess 21a into which the first tube 210 can be fitted, and a second recess 21b into which the second tube 220 can be fitted.

As shown in FIG. 1, the second holding portion 22 has a first recess 22a into which the first tube 210 can be fitted, and a second recess 22b into which the second tube 220 can be fitted.

When using the tube connecting device 1, user H fits the first tube 210 into the first recess 21a of the first holding portion 21 and the first recess 22a of the second holding portion 22, and fits the second tube 220 into the second recess 21b of the first holding portion 21 and the second recess 22b of the second holding portion 22. By performing these steps, user H can easily set each tube 210, 220 into the housing 10.

Each holding section 21, 22 may be equipped with a sensor that detects whether each tube 210, 220 is properly set.

The position at which the wafer 100 cuts each tube 210, 220 is a predetermined position between the first holding part 21 and the second holding part 22 (for example, position Y0 shown in Figure 2).

When the lid portion 50 is closed on the housing 10, it shields the area around the tube holding portion 20 from the outside. By closing the lid portion 50, the tube connecting device 1 prevents the cutting and joining positions of each tube 210, 220 from being exposed to the outside. This allows the tube connecting device 1 to perform cutting and joining operations in a sterile environment.

The housing 10 and lid 50 may be provided with a locking mechanism to prevent the lid 50 from being accidentally released from its closed state.

As shown in Figure 4, the holder unit 30 includes a main body 31 capable of holding the wafer 100, and a bearing unit 33 that holds the main body 31 of the wafer 100 so that it can rotate around a predetermined rotation axis A.

The holder unit 30 is configured to ascend and descend in conjunction with the operation of the cam C1. In each drawing, the ascending movement of the holder unit 30 and the ascending movement of the wafer 100 accompanying the ascending movement of the holder unit 30 are indicated by arrow u, and the descending movement of the holder unit 30 and the descending movement of the wafer 100 accompanying the descending movement of the holder unit 30 are indicated by arrow d.

The holder section 30 is rotatably held via a predetermined rotation axis arranged in the bearing section 33. When a rotational driving force is supplied to the cam C1 from the cam motor M1, the cam C1 rotates. The outer peripheral surface of the cam C1 is formed in a non-circular shape. As the rotational position of the cam C1 changes, the contact position between the outer peripheral surface of the cam C1 and the holder section 30 changes. The holder section 30 moves up and down in accordance with the change in the contact position with the cam C1.

The tube joining device 1 can be configured so that the position of the holder unit 30 and/or wafer 100 can be changed after the cutting operation. The direction in which the position of the holder unit 30 and/or wafer 100 can be changed is, for example, the front-to-rear direction of the tube joining device 1 (a direction intersecting the extension direction of each tube 210, 220 set in the tube holding unit 20, and indicated by arrows X1-X2 in Figure 4).

As shown in Figure 5, the rotation mechanism 80 has a base portion 25 installed in the housing 10 and a tube storage portion 60.

As shown in FIG. 1, the base portion 25 is disposed between the first holding portion 21 and the second holding portion 22. As shown in FIG. 1, the tube storage portion 60 is disposed in the lid portion 50.

When the lid portion 50 is closed on the housing 10, as shown in FIG. 5, the tubes 210, 220 are positioned between the base portion 25 and the tube storage portion 60 in a pressed-against-each-other state. Furthermore, when the lid portion 50 is closed on the housing 10, the second holding portion 22 releases the tubes 210, 220 from their hold. Therefore, after the cutting operation, the tubes 210, 220 can be rotated on the second holding portion 22 side (see FIG. 10).

As shown in FIG. 5, a first driven gear 25a is formed on the outer peripheral surface of the base portion 25. Furthermore, a second driven gear 60a is formed on the outer peripheral surface of the tube accommodating portion 60. Each driven gear 25a, 60a is configured to mesh with a drive gear G1 that rotates and drives the rotation mechanism 80.

In the tube connection device 1, the gear motor M2 applies a rotational driving force to the drive gear G1 when the base 25 and tube storage unit 60 are combined. When the drive gear G1 rotates, the base 25 and tube storage unit 60 rotate in conjunction with the rotation of the drive gear G1, causing the tubes 210, 220 arranged in the base 25 and tube storage unit 60 to rotate accordingly. In each drawing, the rotational movement of each tube 210, 220 is indicated by arrow r.

The portion of each tube 210, 220 that is rotated is the side located on the second holding section 22 side (the side indicated by the arrow Y1 in FIG. 2) when the cutting position Y0 shown in FIG. 2 and FIG. 9 is used as a reference. In the tube joining device 1 according to this embodiment, the other side of each tube 210, 220, indicated by the arrow Y2 in FIG. 2, is the portion that is not rotated before or after the cutting and joining operation.

As shown in Figures 1 and 8, the tube joining device 1 has a fixed tube pressing section 70 that maintains the tubes 210, 220 held by the first holding section 21 in a pressed state against each other.

The fixed-side tube pressing portion 70 can be configured to maintain the tubes 210, 220 pressed against each other when the lid portion 50 is closed. The fixed-side tube pressing portion 70 can be positioned, for example, near the first holding portion 21 of the housing 10.

The control unit 40 can be configured using a microcomputer or the like. The control unit 40 has a CPU and a memory unit that stores the control program for the entire device executed by the CPU and various data. The memory unit can be configured using ROM, RAM, etc.

In the tube joining device 1 according to this embodiment, the control unit 40 controls operations such as the "cutting operation," "retraction operation," and "position change operation," which will be described later.

The first tube 210 and the second tube 220 can be made of, for example, a resin tube with inner lumens 211, 221 (see Figure 13) through which a fluid containing biological components can flow. Each tube 210, 220 can be made of, for example, polyvinyl chloride. However, the material of each tube 210, 220 is not limited as long as it can be joined to each other by cutting and applying pressure. For example, each tube 210, 220 may be made of a different material. There are also no particular limitations on the outer diameter or cross-sectional shape of each tube 210, 220.

As shown in FIG. 6, the first tube 210 is composed of a tube on the peritoneal dialysate bag T11 side. A specified connector T12 is attached to the tip of the first tube 210. The dialysate tube T14 of the dialysate bag T11 is connected to the opposite side of the tip of the first tube 210 via a branch pipe T13. The first tube 210 is also connected to the drainage tube T16 of the drainage bag T15 via the branch pipe T13.

The second tube 220 is composed of a tube placed on the side of the user H's peritoneal catheter T26 used during peritoneal dialysis. Specifically, the second tube 220 includes an extension tube T21 and a protective tube T22. The extension tube T21 is connected to the peritoneal catheter T26 via a connecting tube T23, a silicone tube T24, and a catheter joint T25. One end of the peritoneal catheter T26 can be inserted into the user H's abdominal cavity.

The flow of the cutting and joining operations performed by the tube joining device 1 is outlined below with reference to Figures 7 to 12.

When user H begins joining tubes using the tube joining device 1, he or she sets the tubes 210, 220 in the first holding portion 21 and the second holding portion 22, as shown in Figure 7.

After setting the tubes 210, 220, user H closes the lid 50. When the lid 50 is closed, the tubes 210, 220 are pressed against each other by the fixed tube pressing unit 70 and the rotation mechanism 80, as shown in Figure 8.

User H operates various buttons on the operation panel located on the housing 10 to instruct the control unit 40 to perform the cutting and joining operation.

When the control unit 40 receives instructions from user H, it brings the wafer 100 closer to each of the tubes 210, 220, as shown in Figure 9, and cuts each of the tubes 210, 220.

As shown in FIG. 10, after cutting each tube 210, 220, the control unit 40 drives the rotation mechanism 80 to rotate each tube 210, 220 so that the positions of the cut first end 210a of the first tube 210 and the cut second end 220a of the second tube 220 are interchanged.

As shown in FIG. 11, after cutting each tube 210, 220, the control unit 40 moves the wafer 100 away from the cutting position Y0. The control unit 40 presses and joins the ends 210a, 220a of each tube 210, 220 that have been released from the second holding unit 22 against the tubes 210, 220 that have not been rotated.

After the ends 210a, 210b of the tubes 210, 220 have been swapped and joined, user H can pull the joints located on the outer surfaces of the tubes 210, 220 with their fingers or the like to separate the tubes 210, 220, as shown in Figure 12.

Once the joining operation is complete, the side of the first tube 210 connected to the connector T12 remains joined to the second tube 220 via the second end 220a of the second tube 220. Furthermore, the second tube 220 connected to the peritoneal catheter T26 remains joined to the side of the first tube 210 connected to the branch tube T13 via the first end 210a of the first tube 210.

Next, the effects of this embodiment will be explained along with the control details of the control unit 40, with reference to Figures 13 to 20.

Figures 13 to 20 illustrate a state in which peritoneal fluid has already been discharged through the first tube 210 before the cutting and joining operation is performed using the tube joining device 1, resulting in the remaining of a biological foreign substance S (e.g., a solidified liquid containing lipids, proteins, etc.) near the cutting position Y0 in the lumen 211 of the first tube 210.

As shown in FIG. 13, when cutting the first tube 210 and the second tube 220, the control unit 40 performs a cutting operation in which the wafer 100 is brought relatively close to the first tube 210 and the second tube 220.

Specifically, during the cutting operation, the control unit 40 moves the wafer 100 toward the first tube 210 and the second tube 220 along a predetermined first path p1. At this time, the control unit 40 performs a lifting operation to lift the holder unit 30 along the first path p1 (see FIG. 4).

When the first tube 210 and the second tube 220 are cut by the wafer 100, foreign matter S may leak from the inner cavity 211 of the first tube 210, as shown in Figure 14. Furthermore, the leaked foreign matter S may adhere to each side surface 101, 102 of the wafer 100 that comes into contact with the cut surface of the first tube 210 during the cutting operation.

As shown in FIG. 15 , after cutting the first tube 210 and the second tube 220, the control unit 40 rotates each tube 210, 220 to swap the positions of the first end 210a and the second end 220a (the rotation of each tube 210, 220 is indicated by arrow r). When the control unit 40 rotates the first tube 210 and the second tube 220, a portion of the foreign matter S attached to the second side 102 located on the side in contact with the cut first end 210a of the first tube 210 and the cut second end 220a of the second tube 220 is removed or thinned by being dispersed onto the wafer 100 as each tube 210, 220 rotates. However, a portion of the foreign matter S located outside the range of rotation of each tube 210, 220 (the portion attached to the rear side of the tube joining device 1, the side indicated by arrow X1 in FIG. 4 ) remains on the second side 102 of the wafer 100. Furthermore, more foreign matter S remains on the other side of the first tube 210 and the second tube 220, i.e., on the first side 101 located on the side that is not rotated after cutting, than on the second side 102.

As shown in the comparative examples of Figures 19 and 20, if the wafer 100 is retracted from each tube 210, 220 along the second path p2, which is the same as the first path p1, after the cutting operation while foreign matter S is attached to each side surface 101, 102, the foreign matter S attached to each side surface 101, 102 will adhere to the outer surface of each tube 210, 220. If the tubes 210, 220 are joined together while foreign matter S is attached to the outer surface of each tube 210, 220, the foreign matter S will get mixed into the joint located at the end face of each tube 210, 220 or will hinder the formation of the joint. This will reduce the strength of the joint and increase the possibility of pinholes occurring. In particular, in the portion where foreign matter S was not removed when the first tube 210 was rotated (the portion toward the rear of the tube connecting device 1), more foreign matter S that had migrated from the first side surface 101 to the tubes 210, 220 and from the second side surface 102 to the tubes 210, 220 gather, making the above-mentioned pinholes more likely to occur.

In the tube joining device 1 according to this embodiment, the control unit 40 performs a "position change operation" described below to prevent a decrease in joining strength or the occurrence of pinholes due to the foreign matter S described above.

After cutting the first tube 210 and the second tube 220, the control unit 40 performs a position change operation (operation indicated by arrow m1 in the figure) to change the position of at least one of the first tube 210 and the second tube 220, the wafer 100, and the holder unit 30, as shown in FIG. 17, so that the first path p1, along which the wafer 100 approaches the first tube 210 and the second tube 220 relatively during the cutting operation, and the second path p2, along which the wafer 100 moves away relatively from the first tube 210 and the second tube 220 during the retraction operation, are different paths.

In this embodiment, during the position change operation, the wafer 100 is moved toward the rear side of the tube joining device 1 (the side in the direction intersecting the extension direction of the first tube 210 and the second tube 220, the side indicated by arrow X1 in Figure 4).

The components to be moved during the position change operation and the direction of movement are not particularly limited, as long as the first path p1 and the second path p2 are different paths. Furthermore, the specific paths of the first path p1 and the second path p2 are not particularly limited, as long as they are different paths.

As shown in FIG. 18, after performing the position change operation, the control unit 40 performs a retraction operation to relatively separate the wafer 100 from the first tube 210 and the second tube 220.

Specifically, during the retraction operation, the control unit 40 moves the wafer 100 away from the first tube 210 and the second tube 220 along a predetermined second path p2 that is different from the first path p1. At this time, the control unit 40 performs a lowering operation to lower the holder unit 30 along the second path p2 (see FIG. 4).

As shown in Figure 18, by making the second path p2 a different path from the first path p1, foreign matter S adhering to each side surface 101, 102 of the wafer 100 can be prevented from coming into contact with each tube 210, 220 during the retraction operation. This prevents foreign matter S from getting into the bonded portion during the bonding operation that follows the cutting operation. This effectively prevents a decrease in bond strength and the occurrence of pinholes.

As described above, when rotating the first tube 210, the tube joining device 1 can remove or thin the foreign matter S attached to the wafer 100 by diffusing a portion of the foreign matter S as the first tube 210 rotates (see FIG. 15 ). Therefore, the control unit 40 can rotate the first tube 210 multiple times within a range of rotation angles that satisfies the following formula (1): Rotation angle θ [°] = 180 × 360 × n ... formula (1)
Here, n is an integer of 1 or more.

The control unit 40 can swap the positions of the first end 210a of the first tube 210 and the second end 220a of the second tube 220 by rotating one side of the first tube 210 and the second tube 220 by 180°. Furthermore, based on the above formula (1), the control unit 40 can increase the rotation angle so that one side of each tube 210, 220 is 180°, 540° (= 180° + 360°), 900° (= 180° + 360° + 360°), etc., thereby removing or thinning the foreign matter S by diffusing it on the wafer 100 through multiple rotations.

In the above formula (1), if the number of rotations of the first tube 210 and the second tube 220 is excessively high, twisting of the first tube 210 and the second tube 220 after joining may cause crushing of the inner lumens 211 and 221 of each tube 210 and 220. Therefore, in the above formula (1), it is preferable that n≦4 (a range in which the positions of the first end 210a and the second end 220a are interchanged five times).

As described above, the tube joining apparatus 1 according to this embodiment is a tube joining apparatus that cuts the first tube 210 and the second tube 220, then swaps and joins the cut first end 210a of the first tube 210 with the cut second end 220a of the second tube 220. The tube joining apparatus 1 includes a tube holding unit 20 that holds the first tube 210 and the second tube 220, a holder unit 30 that holds a wafer 100 that cuts the first tube 210 and the second tube 220 held by the tube holding unit 20, and a control unit 40 that controls the operation of each unit of the apparatus. The control unit 40 performs a cutting operation that brings the wafer 100 relatively close to the first tube 210 and the second tube 220 when cutting the first tube 210 and the second tube 220, and a retraction operation that moves the wafer 100 relatively away from the first tube 210 and the second tube 220 after cutting the first tube 210 and the second tube 220. Then, after cutting the first tube 210 and the second tube 220, the control unit 40 performs a position change operation to change the position of at least one of the first tube 210 and the second tube 220, the wafer 100, and the holder unit 30 so that the first path p1, along which the wafer 100 moves relatively closer to the first tube 210 and the second tube 220 during the cutting operation, and the second path p2, along which the wafer 100 moves relatively away from the first tube 210 and the second tube 220 during the retraction operation, are different paths.

With the tube joining device 1 configured as described above, the first path p1 and the second path p2 are different paths, preventing foreign matter S adhering to each side surface 101, 102 of the wafer 100 from coming into contact with each tube 210, 220 during the retraction operation. This prevents foreign matter S from getting into the joining portion during the joining operation that follows the cutting operation. This effectively prevents a decrease in joining strength and the occurrence of pinholes.

Furthermore, the control unit 40 moves the wafer 100 toward the first tube 210 and the second tube 220 along the first path p1 during the cutting operation, and moves the wafer 100 away from the first tube 210 and the second tube 220 along the second path p2 during the retraction operation. After cutting the first tube 210 and the second tube 220, the control unit 40 changes the position of the wafer 100 and/or the holder unit 30 so that the first path p1 and the second path p2 are different paths. With the tube joining device 1 configured in this manner, changing the position of the wafer 100 and/or the holder unit 30 during the position change operation can more reliably set the first path p1 and the second path p2 to be different paths. This more effectively prevents a decrease in joining strength and the occurrence of pinholes.

Furthermore, the control unit 40 performs an elevation operation to raise the holder unit 30 along the first path p1 during the cutting operation, and performs a descending operation to lower the holder unit 30 along the second path p2 during the retraction operation. After cutting the first tube 210 and the second tube 220, the control unit 40 moves the position of the wafer 100 and/or the holder unit 30 in a direction intersecting the extension direction of the first tube 210 and the second tube 220 so that the first path p1 and the second path p2 are different paths. With the tube joining device 1 configured in this manner, when the wafer 100 and the holder unit 30 are moved along the second path p2, foreign matter S attached to the portion of the wafer 100 behind the tube joining device 1 can be prevented from adhering to each tube 210, 220. This more effectively prevents a decrease in joining strength and the occurrence of pinholes.

The tube joining device 1 also has a rotation mechanism 80 that rotates the first tube 210 and the second tube 220 to swap the relative positions of the cut first end 210a and the cut second end 220a. After cutting the first tube 210 and the second tube 220, the control unit 40 rotates the first tube 210 and the second tube 220 and then performs a position change operation. With the tube joining device 1 configured in this manner, the rotation of the first tube 210 and the second tube 220 removes or thins out a portion of the foreign matter S adhering to the wafer 100, and then performs the position change operation and joining operation. This makes it possible to more effectively prevent a decrease in joining strength and the occurrence of pinholes.

The control unit 40 also rotates the first tube 210 and the second tube 220 within a range of rotation angles that satisfies the following formula (1): Rotation angle θ [°] = 180 + 360 × n (Formula 1)
Here, n is an integer of 1 or more.

With the tube joining device 1 configured as described above, the first tube 210 and the second tube 220 can be rotated multiple times to effectively remove or thin out any foreign matter S adhering to the wafer 100 during the rotation operation. This makes it possible to more effectively prevent a decrease in joining strength and the occurrence of pinholes.

Furthermore, the wafer 100 is a plate-shaped metal wafer that is heated during cutting, and the first tube 210 and second tube 220 are resin tubes with internal lumens 211, 221 through which fluid containing biological components can flow. Therefore, the tube connecting device 1 can prevent a decrease in connection strength and the occurrence of pinholes in tubes for medical applications such as those used in peritoneal dialysis.

The above describes the tube connecting device according to the present invention, but the present invention is not limited to the above-described embodiment, and various modifications are possible within the scope of the claims.

For example, the application of the present invention is not limited to peritoneal dialysis. As one example, it can be applied to a device that joins a tube connected to a container (bag) that contains blood products used in transfusions with another tube. As another example, it can be applied to a device that joins a tube connected to a container (bag) that contains cell culture medium containing various collected and cultured cells with another tube.

Furthermore, the tube joining device of the present invention is not particularly limited in terms of its specific device configuration, control content, control procedures, etc., as long as it is configured to prevent a decrease in joining strength or the occurrence of pinholes by performing a specified position change operation after cutting the first tube and the second tube.

1 Tube joining device 10 Housing 20 Tube holding section 21 First holding section 22 Second holding section 30 Holder section 40 Control section 50 Lid section 80 Rotation mechanism 100 Wafer (cutting member)
210 First tube 210a Cut first end 211 First tube lumen 220 Second tube 220a Cut second end 221 Second tube lumen p1 First path p2 Second path

Claims (5)

A tube joining device that cuts a first tube and a second tube, and then joins the first end of the first tube and the second end of the second tube by swapping them,
a tube holding portion that holds the first tube and the second tube;
a holder portion for holding a cutting member for cutting the first tube and the second tube held by the tube holding portion;
a control unit that controls the operation of each unit of the device,
the control unit performs a cutting operation of moving the cutting member relatively close to the first tube and the second tube when cutting the first tube and the second tube, and a retraction operation of moving the cutting member relatively away from the first tube and the second tube after cutting the first tube and the second tube,
the control unit performs a position change operation to change the position of at least one of the first tube and the second tube, the cutting member, and the holder unit after cutting the first tube and the second tube so that a first path along which the cutting member relatively approaches the first tube and the second tube during the cutting operation and a second path along which the cutting member relatively moves away from the first tube and the second tube during the retracting operation are different paths;
The control unit
During the cutting operation, the cutting member is moved toward the first tube and the second tube along the first path, and during the retracting operation, the cutting member is moved away from the first tube and the second tube along the second path,
The control unit
A tube joining device that changes the position of the cutting member and/or the holder portion after cutting the first tube and the second tube so that the first path and the second path are different paths. The control unit
an ascending operation of ascending the holder part along the first path during the cutting operation, and a descending operation of descending the holder part along the second path during the retreating operation;
The control unit
2. The tube joining device of claim 1, wherein after cutting the first tube and the second tube, the position of the cutting member and/or the holder portion is moved in a direction intersecting the extension direction of the first tube and the second tube so that the first path and the second path are different paths. a rotation mechanism that rotates the first tube and the second tube to interchange the relative positions of the cut first end and the cut second end;
3. The tube joining device according to claim 1, wherein the control unit rotates the first tube and the second tube after cutting the first tube and the second tube , and then performs the position change operation. The tube connecting device according to claim 3 , wherein the control unit controls the rotation mechanism to rotate the first tube and the second tube within a range of rotation angles that satisfies the following formula (1):
Rotation angle θ [°] = 180 + 360 × n ... Equation (1)
Here, n is an integer of 1 or more. the cutting member is a plate-shaped metal wafer that is heated during cutting;
5. The tube connecting device according to claim 1 , wherein the first tube and the second tube are resin tubes having an inner cavity through which a fluid containing a biological component can flow.