JP7782111B2 - キャパシタ部品及びキャパシタ部品の製造方法 - Google Patents
キャパシタ部品及びキャパシタ部品の製造方法Info
- Publication number
- JP7782111B2 JP7782111B2 JP2022000094A JP2022000094A JP7782111B2 JP 7782111 B2 JP7782111 B2 JP 7782111B2 JP 2022000094 A JP2022000094 A JP 2022000094A JP 2022000094 A JP2022000094 A JP 2022000094A JP 7782111 B2 JP7782111 B2 JP 7782111B2
- Authority
- JP
- Japan
- Prior art keywords
- internal electrode
- electrode layers
- zirconium
- germanium
- capacitor component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Composite Materials (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
ニッケル(Ni)を含む第1粉末、ジルコニウム(Zr)を含む第2粉末、及びゲルマニウム(Ge)を含む第3粉末を用意した。
110 誘電体層
121、122 内部電極層
130 カバー層
210、220 外部電極
H 孔
1000 キャパシタ部品
Claims (12)
- 誘電体層及び内部電極層を有する本体と、
前記本体に配置され、前記内部電極層と連結される外部電極と、を備え、
前記内部電極層は、ジルコニウム(Zr)及びゲルマニウム(Ge)をそれぞれ含み、
前記内部電極層の全体に対して、前記内部電極層に含有されたジルコニウム(Zr)及びゲルマニウム(Ge)の含有量(at%)の合計の比は、3.3以上3.7以下である、キャパシタ部品。 - 前記内部電極層の全体に対して、前記内部電極層に含有されたジルコニウム(Zr)含有量(at%)の比は1.6以上1.8以下である、請求項1に記載のキャパシタ部品。
- 前記内部電極層の全体に対して、前記内部電極層に含有されたゲルマニウム(Ge)含有量(at%)の比は1.7以上1.9以下である、請求項1または2に記載のキャパシタ部品。
- 前記内部電極層はニッケル(Ni)をさらに含む、請求項1から3のいずれか一項に記載のキャパシタ部品。
- 前記内部電極層には、前記内部電極層を貫通する非導電性部が形成され、
第1方向に沿った前記本体の断面において、
前記第1方向に垂直な第2方向に沿った前記内部電極層の総長さに対して、前記非導電性部を除いた前記第2方向に沿った前記内部電極層の長さの比は、0.8以上である、請求項1から4のいずれか一項に記載のキャパシタ部品。 - 誘電体層及び内部電極層を有する本体と、
前記本体に配置され、前記内部電極層と連結される外部電極と、を備え、
前記内部電極層は、ニッケル(Ni)-ジルコニウム(Zr)-ゲルマニウム(Ge)合金を含み、
前記内部電極層に含有されたニッケル(Ni)含有量(at%)に対して、前記内部電極層に含有されたジルコニウム(Zr)及びゲルマニウム(Ge)含有量(at%)の合計の比は、3.8以上4.3以下である、キャパシタ部品。 - 前記内部電極層に含有されたゲルマニウム(Ge)含有量(at%)は、前記内部電極層に含有されたジルコニウム(Zr)含有量(at%)よりも多い、請求項1から6のいずれか一項に記載のキャパシタ部品。
- 前記内部電極層は、バリウム(Ba)及びチタン(Ti)をさらに含む、請求項1から7のいずれか一項に記載のキャパシタ部品。
- 誘電体グリーンシートを形成する段階と、
ニッケル(Ni)を含む第1粉末、ジルコニウム(Zr)を含む第2粉末、及びゲルマニウム(Ge)を含む第3粉末を含む導電性ペーストを前記誘電体グリーンシートに塗布する段階と、を含む、キャパシタ部品の製造方法。 - 前記第2及び第3粉末は、
前記導電性ペーストにおいてニッケル(Ni)の全体重量に対して、ジルコニウム(Zr)及びゲルマニウムのそれぞれの重量の合計の比が4.0~4.5以下になるように添加された、請求項9に記載のキャパシタ部品の製造方法。 - 前記導電性ペーストが塗布された前記誘電体グリーンシートを複数積層して積層体を形成する段階と、
前記積層体を焼結して誘電体層及び内部電極層を含む本体を形成する段階と、を含む、請求項9または10に記載のキャパシタ部品の製造方法。 - 前記本体を形成する段階において、
前記第1~第3粉末のニッケル(Ni)、ジルコニウム(Zr)及びゲルマニウム(Ge)は、ニッケル(Ni)-ジルコニウム(Zr)-ゲルマニウム(Ge)合金を形成する、請求項11に記載のキャパシタ部品の製造方法。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210114068A KR102880975B1 (ko) | 2021-08-27 | 2021-08-27 | 커패시터 부품 및 커패시터 부품의 제조 방법 |
| KR10-2021-0114068 | 2021-08-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023033067A JP2023033067A (ja) | 2023-03-09 |
| JP7782111B2 true JP7782111B2 (ja) | 2025-12-09 |
Family
ID=85292334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022000094A Active JP7782111B2 (ja) | 2021-08-27 | 2022-01-04 | キャパシタ部品及びキャパシタ部品の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11894189B2 (ja) |
| JP (1) | JP7782111B2 (ja) |
| KR (1) | KR102880975B1 (ja) |
| CN (1) | CN115732226A (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023129775A (ja) * | 2022-03-07 | 2023-09-20 | 太陽誘電株式会社 | 積層セラミック電子部品及び積層セラミック電子部品の製造方法 |
| KR102754411B1 (ko) * | 2023-10-16 | 2025-01-13 | 삼성전기주식회사 | 적층형 커패시터 |
| US20250259789A1 (en) * | 2024-02-08 | 2025-08-14 | Samsung Electro-Mechanics Co., Ltd. | Multilayered ceramic capacitor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004263255A (ja) | 2003-03-03 | 2004-09-24 | Kawatetsu Mining Co Ltd | 表面処理金属超微粉、その製造方法、導電性金属ペースト及び積層セラミックコンデンサ |
| JP2013135095A (ja) | 2011-12-27 | 2013-07-08 | Tdk Corp | 電極焼結体、積層電子部品、内部電極ペースト、電極焼結体の製造方法、積層電子部品の製造方法 |
| JP2019186519A (ja) | 2018-04-10 | 2019-10-24 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層型キャパシタ |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3203238B2 (ja) | 1999-11-01 | 2001-08-27 | 三井金属鉱業株式会社 | 複合ニッケル微粉末 |
| CA2359347A1 (en) | 2001-10-18 | 2003-04-18 | Cesur Celik | Laminated ceramic capacitor internal electrode material |
| JP5155743B2 (ja) * | 2008-03-04 | 2013-03-06 | 三井金属鉱業株式会社 | 導電性ペースト用銅粉及び導電性ペースト |
| JP6042736B2 (ja) | 2013-01-30 | 2016-12-14 | 新日鉄住金化学株式会社 | ニッケル微粒子含有組成物及びその製造方法 |
| KR101973450B1 (ko) * | 2018-03-22 | 2019-04-29 | 삼성전기주식회사 | 세라믹 전자부품 및 이의 제조방법 |
| JP2021100020A (ja) | 2019-12-20 | 2021-07-01 | 太陽誘電株式会社 | 積層セラミック電子部品及びその製造方法 |
-
2021
- 2021-08-27 KR KR1020210114068A patent/KR102880975B1/ko active Active
-
2022
- 2022-01-04 JP JP2022000094A patent/JP7782111B2/ja active Active
- 2022-01-05 US US17/569,027 patent/US11894189B2/en active Active
- 2022-03-10 CN CN202210230275.9A patent/CN115732226A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004263255A (ja) | 2003-03-03 | 2004-09-24 | Kawatetsu Mining Co Ltd | 表面処理金属超微粉、その製造方法、導電性金属ペースト及び積層セラミックコンデンサ |
| JP2013135095A (ja) | 2011-12-27 | 2013-07-08 | Tdk Corp | 電極焼結体、積層電子部品、内部電極ペースト、電極焼結体の製造方法、積層電子部品の製造方法 |
| JP2019186519A (ja) | 2018-04-10 | 2019-10-24 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層型キャパシタ |
Also Published As
| Publication number | Publication date |
|---|---|
| US11894189B2 (en) | 2024-02-06 |
| KR20230031623A (ko) | 2023-03-07 |
| KR102880975B1 (ko) | 2025-11-04 |
| CN115732226A (zh) | 2023-03-03 |
| US20230071865A1 (en) | 2023-03-09 |
| JP2023033067A (ja) | 2023-03-09 |
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