JP7783018B2 - Electrode embedding material - Google Patents
Electrode embedding materialInfo
- Publication number
- JP7783018B2 JP7783018B2 JP2021185497A JP2021185497A JP7783018B2 JP 7783018 B2 JP7783018 B2 JP 7783018B2 JP 2021185497 A JP2021185497 A JP 2021185497A JP 2021185497 A JP2021185497 A JP 2021185497A JP 7783018 B2 JP7783018 B2 JP 7783018B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- ceramic
- convex portion
- support member
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Ceramic Products (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Resistance Heating (AREA)
Description
本発明は、電極埋設部材に関する。 The present invention relates to an electrode-embedding member.
従来、半導体製造装置用に基板を加熱するヒーターとしてセラミックス焼結体からなる加熱保持部材とそれを支持する支持部材を一体化した構造が提案されている。 Conventionally, a structure has been proposed for use in semiconductor manufacturing equipment as a heater for heating substrates, integrating a heating and holding member made of a sintered ceramic body with a support member that supports the heating and holding member.
特許文献1は、サセプターと支持部材との取付構造において、サセプターから支持部材中へと伝達される熱を抑制すると共に、サセプターを高温にしたときにも支持部材に集中する応力を緩和することを目的として、被処理物を加熱するためのサセプターと、サセプターに接合されており、内側空間が設けられている支持部材と、支持部材に接合されている開口が設けられたチャンバーとを備え、チャンバーの開口と支持部材の内側空間とが連通しており、支持部材の内側空間がチャンバーの内部空間に対して気密に封止され、支持部材が、筒状の本体部分と支持部材のサセプター側の端部に設けられた拡径部とを備え、支持部材の縦断面の外側輪郭において本体部分と拡径部との間に一つのアール部分または複数の連続したアール部分が設けられている取付構造が開示されている。 Patent Document 1 discloses a mounting structure for a susceptor and a support member, which aims to suppress heat transfer from the susceptor into the support member and alleviate stress concentrated in the support member even when the susceptor is heated to a high temperature. The mounting structure includes a susceptor for heating the workpiece, a support member joined to the susceptor and having an internal space, and a chamber joined to the support member and having an opening, the opening of the chamber communicating with the internal space of the support member, the internal space of the support member being airtightly sealed from the internal space of the chamber, the support member having a cylindrical main body and an expanded diameter portion at the end of the support member facing the susceptor, and the outer contour of the vertical cross section of the support member having one or multiple continuous rounded portions between the main body and the expanded diameter portion.
特許文献2は、加熱基体と、この加熱基体に接合された支持部材とを有する加熱装置において、加熱基体と、支持部材との接合部近傍にクラックが発生することを効果的に防止することを目的として、加熱面を有する板状の加熱基体と、この加熱基体の背面接合された中空筒状の支持部材とを備え、加熱基体と支持部材との接合界面の外端近傍で、この加熱基体の背面と支持部材の外表面とを滑らかに接続する凹曲面部が形成され、凹曲面部は、支持部材の軸線を含む断面において、短軸方向が支持部材の軸線方向と平行である楕円の弧の曲線を有しているセラミックスよりなる加熱装置が開示されている。 Patent Document 2 discloses a heating device having a heating base and a support member joined to the heating base. The heating device, which aims to effectively prevent cracks from occurring near the joint between the heating base and the support member, includes a plate-shaped heating base with a heating surface and a hollow, cylindrical support member joined to the back surface of the heating base. Near the outer edge of the joint interface between the heating base and the support member, a concave curved surface is formed that smoothly connects the back surface of the heating base to the outer surface of the support member. The concave curved surface is made of ceramic and has an elliptical arc whose minor axis direction is parallel to the axial direction of the support member in a cross section including the axis of the support member.
本発明者らは、特許文献1または特許文献2のようにプレートの下面に座(凸部)を設け、座に支持部材を接合し、座の断面にR形状を設けるだけでは、支持部材の接合部の破損はある程度抑制できても、プレートと座の境界の隅部と支持部材の接合部とが近接しているとプレートの下面に設けられた座の隅部や接合部の一方に偏って集中する応力による隅部や接合部の破損や気密不良によるリークをなくすことが十分でない場合があり、従来よりも高温のプロセスに使用した場合にその影響が顕著になることを発見した。 The inventors have discovered that while simply providing a seat (convex portion) on the underside of a plate, joining a support member to the seat, and providing an R-shaped cross section of the seat, as in Patent Document 1 or Patent Document 2, can suppress damage to the joint of the support member to a certain extent, if the corner of the boundary between the plate and the seat and the joint of the support member are close to each other, it may not be sufficient to prevent damage to the corner or joint due to stress concentrated unevenly on one side of the corner or joint of the seat provided on the underside of the plate, or to prevent leaks due to poor airtightness, and this effect becomes more pronounced when used in processes at higher temperatures than conventional methods.
本発明者らの鋭意研究により、プレート下面から座の側面にかけての断面形状を所定の形状にすることで、支持部材の接合部に生じる応力だけでなく、プレートと座の境界の隅部に生じる応力も緩和されることを見出し、本発明を完成させた。 Through extensive research, the inventors discovered that by creating a specific cross-sectional shape from the underside of the plate to the side of the seat, stress generated at the joints of the support members is alleviated, as is stress generated at the corners where the plate and seat meet, leading to the completion of this invention.
本発明は、このような事情に鑑みてなされたものであり、隅部に生じる応力が緩和されると共に、支持部材の接合部に生じる応力が緩和され、隅部や接合部の破損リスクや気密不良リスクを低減することができる電極埋設部材を提供することを目的とする。 The present invention was made in light of these circumstances, and aims to provide an electrode-embedding member that alleviates stress that occurs in corners and at the joints of support members, thereby reducing the risk of damage to corners and joints and the risk of poor airtightness.
(1)上記の目的を達成するため、本発明の電極埋設部材は、電極埋設部材であって、上面に基板載置面を有し、セラミックス焼結体により平板状に形成された基材本体、および前記基板載置面に対向する前記基材本体の下面から下方に突出して前記基材本体と一体的に形成された凸部を有するセラミックス基材と、前記セラミックス基材の前記基材本体に埋設された電極と、前記基板載置面に対向する前記凸部の下面に接合された支持部材と、を備え、前記セラミックス基材の中心軸を含む断面において、前記セラミックス基材の前記基材本体の下面および前記凸部の側面の断面は連続する曲線で形成され、前記曲線は変曲点を有することを特徴としている。 (1) In order to achieve the above object, the electrode-embedding member of the present invention comprises a ceramic base having a substrate mounting surface on its upper surface and a substrate main body formed in a flat plate shape from a sintered ceramic body, and a convex portion formed integrally with the substrate main body and protruding downward from the lower surface of the substrate main body facing the substrate mounting surface; an electrode embedded in the substrate main body of the ceramic base; and a support member joined to the lower surface of the convex portion facing the substrate mounting surface, wherein in a cross section including the central axis of the ceramic base, the cross sections of the lower surface of the substrate main body of the ceramic base and the side surface of the convex portion are formed by a continuous curve, and the curve has an inflection point.
このように、基材本体の下面および凸部の側面の断面が連続する曲線で形成され、当該曲線が変曲点を有することで、基材本体と凸部の境界の隅部および支持部材の接合部を離間させることができ、隅部に生じる応力が緩和されると共に、支持部材の接合部に生じる応力が緩和される。その結果、隅部や接合部の破損リスクや気密不良リスクを低減することができる。 In this way, the cross sections of the underside of the base body and the side of the convex portion are formed by a continuous curve, and because this curve has an inflection point, the corners at the boundary between the base body and the convex portion and the joints of the support members can be separated, alleviating stress that occurs in the corners and also in the joints of the support members. As a result, the risk of damage and poor airtightness at the corners and joints can be reduced.
さらに、本発明の電極埋設部材は、前記凸部の前記基材本体との境界の直径をDs1、前記凸部の下面の直径をDs2としたとき、前記変曲点を有する前記凸部の全体において、1.1≦Ds1/Ds2≦1.5であることを特徴としている。Furthermore, the electrode-embedded member of the present invention is characterized in that, when the diameter of the boundary between the convex portion and the substrate main body is Ds1 and the diameter of the lower surface of the convex portion is Ds2, 1.1≦Ds1/Ds2≦1.5 is satisfied throughout the entire convex portion having the inflection point.
凸部の基材本体との境界の直径をDs1、凸部の下面の直径をDs2としたとき、前記変曲点を有する前記凸部の全体において、Ds1/Ds2を所定の範囲とすることで、隅部および支持部材の接合部に生じる応力をより緩和することができる。When the diameter of the boundary between the convex portion and the substrate body is Ds1 and the diameter of the underside of the convex portion is Ds2, by setting Ds1/Ds2 within a predetermined range throughout the entire convex portion having the inflection point, the stress generated at the corners and the joints of the support member can be further alleviated.
(2)上記の目的を達成するため、本発明の電極埋設部材は、電極埋設部材であって、上面に基板載置面を有し、セラミックス焼結体により平板状に形成された基材本体、および前記基板載置面に対向する前記基材本体の下面から下方に突出して前記基材本体と一体的に形成された凸部を有するセラミックス基材と、前記セラミックス基材の前記基材本体に埋設された電極と、前記基板載置面に対向する前記凸部の下面に接合された支持部材と、を備え、前記セラミックス基材の中心軸を含む断面において、前記セラミックス基材の前記基材本体の下面および前記凸部の側面の断面は連続する曲線で形成され、前記曲線は変曲点を有する。さらに、前記凸部の前記基材本体との境界の直径をDs1、前記凸部の下面の直径をDs2とし、前記凸部の厚さをTとしたとき、(Ds1-Ds2)/2≧Tであることを特徴としている。(2) To achieve the above object, the present invention provides an electrode-embedding member, comprising: a ceramic substrate having a substrate mounting surface on its upper surface, a substrate body formed into a flat plate shape from a sintered ceramic body, and a protrusion projecting downward from a lower surface of the substrate body opposite the substrate mounting surface and integrally formed with the substrate body; an electrode embedded in the substrate body of the ceramic substrate; and a support member joined to the lower surface of the protrusion opposite the substrate mounting surface, wherein, in a cross section including the central axis of the ceramic substrate, the lower surface of the substrate body and the side surface of the protrusion are formed by a continuous curve, and the curve has an inflection point. Furthermore, the present invention is characterized in that, where Ds1 is the diameter of the boundary of the protrusion with the substrate body, Ds2 is the diameter of the lower surface of the protrusion, and T is the thickness of the protrusion, then (Ds1 - Ds2)/2 ≧ T.
このように、(Ds1-Ds2)/2とTとの関係を規定することで、凸部の厚さよりも片側の凸部の基材本体との境界の直径と凸部の下面の直径との差を大きくすることができ、隅部と接合部を大きく離間させることができるので、隅部および接合部に生じる応力をより緩和することができる。 In this way, by specifying the relationship between (Ds1-Ds2)/2 and T, the difference between the diameter of the boundary between one side of the convex and the substrate body and the diameter of the underside of the convex can be made larger than the thickness of the convex, and the corners and joints can be spaced farther apart, thereby further alleviating the stress generated in the corners and joints.
(3)また、本発明の電極埋設部材において、前記曲線は、変曲点を2以上有することを特徴としている。 (3) In the electrode-embedding member of the present invention, the curve has two or more inflection points .
このように、断面の曲線を変曲点を2以上有する曲線とすることで、基材本体の下面および凸部の側面の形状を様々な形状にすることができ、隅部に生じる応力が緩和されると共に、支持部材の接合部に生じる応力が緩和される。また、凸部の厚さを厚くした形状にも対応できる。
By making the cross-sectional curve a curve with two or more inflection points, the shape of the lower surface of the substrate body and the side surface of the convex portion can be varied, which alleviates stress at the corners and also at the joints of the support member.It can also accommodate thicker convex portions.
本発明によれば、基材本体と凸部の境界の隅部に生じる応力が緩和されると共に、支持部材の接合部に生じる応力が緩和され、隅部や接合部の破損リスクや気密不良リスクを低減することができる。 This invention alleviates stress at the corners of the boundary between the base material body and the protrusion, as well as stress at the joints of the support members, reducing the risk of damage to the corners and joints and the risk of poor airtightness.
次に、本発明の実施の形態について、図面を参照しながら説明する。説明の理解を容易にするため、各図面において同一の構成要素に対しては同一の参照番号を付し、重複する説明は省略する。なお、構成図において、各構成要素の大きさは概念的に表したものであり、必ずしも実際の寸法比率を表すものではない。 Next, an embodiment of the present invention will be described with reference to the drawings. To facilitate understanding, the same reference numbers will be used in each drawing to refer to the same components, and duplicate explanations will be omitted. Note that in the structural diagrams, the size of each component is shown conceptually and does not necessarily represent the actual dimensional ratio.
[実施形態]
[電極埋設部材の構成]
まず、本実施形態に係る電極埋設部材の構成を説明する。図1は、本実施形態に係る電極埋設部材の一例を示す模式的な断面図である。図2は、図1の電極埋設部材の部分断面図である。本実施形態に係る電極埋設部材100は、セラミックス基材110と、電極130と、支持部材140と、を備える。電極埋設部材100は、シャフト付ヒーター等に適用される。
[Embodiment]
[Configuration of electrode-embedded member]
First, the configuration of the electrode-embedded member according to this embodiment will be described. Fig. 1 is a schematic cross-sectional view showing an example of the electrode-embedded member according to this embodiment. Fig. 2 is a partial cross-sectional view of the electrode-embedded member of Fig. 1. The electrode-embedded member 100 according to this embodiment includes a ceramic substrate 110, an electrode 130, and a support member 140. The electrode-embedded member 100 is applied to a heater with a shaft, etc.
セラミックス基材110は、セラミックス焼結体により平板状に形成された基材本体112、および基板載置面114に対向する基材本体の下面116から下方に突出して基材本体112と一体的に形成された凸部118を有する。ここで、「基材本体と一体的に形成された凸部」とは、基材本体112と凸部118とが接合材で接合されていないことをいう。セラミックス基材110の基板載置面114の形状は、円板状、多角形状、楕円状など、様々な形状にすることができる。セラミックス焼結体の材料は、炭化珪素、酸化アルミニウム、窒化アルミニウム、窒化珪素などが用いられる。 The ceramic substrate 110 has a substrate body 112 formed into a flat plate from a ceramic sintered body, and a convex portion 118 formed integrally with the substrate body 112 and protruding downward from the lower surface 116 of the substrate body facing the substrate mounting surface 114. Here, "convex portion formed integrally with the substrate body" means that the substrate body 112 and the convex portion 118 are not joined with a bonding material. The substrate mounting surface 114 of the ceramic substrate 110 can have a variety of shapes, including a disk, polygon, or ellipse. Materials used for the ceramic sintered body include silicon carbide, aluminum oxide, aluminum nitride, and silicon nitride.
電極埋設部材100は、セラミックス基材110の中心軸を含む断面において、セラミックス基材110の基材本体の下面116および凸部の側面122の断面は連続する曲線で形成される。また、当該曲線は変曲点124を有する。このように、基材本体の下面116および凸部の側面122の断面が連続する曲線で形成され、当該曲線が変曲点124を有することで、基材本体112と凸部118の境界126の隅部128および支持部材140の接合部142の端部を一定程度離間させることができ、隅部128に生じる応力が緩和されると共に、支持部材140の接合部142に生じる応力が緩和される。その結果、隅部128や接合部142の破損リスクや気密不良リスクを低減することができる。断面における変曲点124の接線方向は、鉛直方向や水平方向だけでなく、様々な方向であってよい。 In a cross section of the ceramic substrate 110 including the central axis, the cross sections of the lower surface 116 of the substrate body and the side surfaces 122 of the convex portions of the ceramic substrate 110 are formed by a continuous curve. This curve also has an inflection point 124. In this way, the cross sections of the lower surface 116 of the substrate body and the side surfaces 122 of the convex portions are formed by a continuous curve, and this curve has an inflection point 124, allowing the corners 128 of the boundaries 126 between the substrate body 112 and the convex portions 118 and the ends of the joints 142 of the support member 140 to be spaced apart to a certain extent, thereby alleviating stresses generated in the corners 128 and the joints 142 of the support member 140. As a result, the risk of damage to the corners 128 and the joints 142 and the risk of poor airtightness can be reduced. The tangent direction of the inflection point 124 in the cross section may be various directions, not just vertical or horizontal.
基材本体の下面116および凸部の側面122の断面が連続する曲線で形成されるとは、基材本体の下面116から凸部の側面122に至る断面曲線の中間に特異点がないことをいう。本明細書で特異点とは、セラミックス基材110の中心軸を含む断面において、R0.5(mm)以下またはC0.5(mm)以下に相当する角部または隅部をいう。このような角部または隅部は、応力や熱流が集中しやすくなり、クラック等の破損の起点となりやすいためである。また、従来よりも高温のプロセスに使用した場合にその影響が顕著になる。 The cross section of the lower surface 116 of the substrate body and the side surface 122 of the convex portion being formed by a continuous curve means that there is no singular point midway along the cross-sectional curve extending from the lower surface 116 of the substrate body to the side surface 122 of the convex portion. In this specification, a singular point refers to a corner or edge corresponding to an R of 0.5 (mm) or less or a C of 0.5 (mm) or less in a cross section including the central axis of the ceramic substrate 110. This is because such corners or edges are prone to stress and heat flow concentration, making them prone to becoming the starting point for damage such as cracks. Furthermore, this effect becomes more pronounced when used in processes at higher temperatures than conventional processes.
また、基材本体の下面116および凸部の側面122の断面が連続する曲線で形成されるとは、言い換えると、基材本体の下面116と凸部の側面122とが滑らかに接続されているといってもよい。連続する曲線は、直線を含んでもよい。また、連続する曲線は、変曲点が直線に含まれる形状であってもよい。連続する曲線は、R3(mm)以下またはC3(mm)以下に相当する角部または隅部を含まないことが好ましい。 Furthermore, the cross section of the lower surface 116 of the base body and the side surface 122 of the convex portion being formed by a continuous curve can be rephrased as meaning that the lower surface 116 of the base body and the side surface 122 of the convex portion are smoothly connected. The continuous curve may include a straight line. Furthermore, the continuous curve may have a shape in which an inflection point is included in the straight line. It is preferable that the continuous curve does not include any corners or angles equivalent to R3 (mm) or less or C3 (mm) or less.
電極130は、セラミックス基材110の基材本体112に埋設される。電極130の形状は、メッシュ状や箔状など、様々な形状とすることができる。また、材質も、モリブデン、タングステンなど、様々な材質とすることができる。 The electrode 130 is embedded in the substrate body 112 of the ceramic substrate 110. The electrode 130 can be in a variety of shapes, such as mesh or foil. It can also be made of a variety of materials, such as molybdenum or tungsten.
支持部材140は、基板載置面114に対向する凸部の下面120に接合される。支持部材140は、セラミックス焼結体からなり、セラミックス基材110を支持する。支持部材140を形成するセラミックス焼結体は、セラミックス基材110を形成するセラミックス焼結体と同じ種類のセラミックスを主成分とすることが好ましい。この場合、焼結助剤の有無やその量は異なっていてもよい。 The support member 140 is bonded to the underside 120 of the convex portion facing the substrate mounting surface 114. The support member 140 is made of a ceramic sintered body and supports the ceramic substrate 110. The ceramic sintered body that forms the support member 140 preferably contains the same type of ceramic as the ceramic sintered body that forms the ceramic substrate 110 as its main component. In this case, the presence or absence of a sintering aid and its amount may differ.
凸部の基材本体との境界126の直径をDs1、凸部の下面120の直径をDs2としたとき、1.1≦Ds1/Ds2≦1.5であることが好ましい。このように、凸部の基材本体との境界126の直径をDs1、凸部の下面120の直径をDs2としたとき、Ds1/Ds2を所定の範囲とすることで、隅部128および支持部材140の接合部142に生じる応力をより緩和することができる。 When the diameter of the boundary 126 of the convex portion with the base material body is Ds1 and the diameter of the lower surface 120 of the convex portion is Ds2, it is preferable that 1.1≦Ds1/Ds2≦1.5. In this way, when the diameter of the boundary 126 of the convex portion with the base material body is Ds1 and the diameter of the lower surface 120 of the convex portion is Ds2, by setting Ds1/Ds2 within a specified range, stress generated in the corner portion 128 and the joint portion 142 of the support member 140 can be further alleviated.
凸部の基材本体との境界126の直径をDs1、凸部の下面120の直径をDs2とし、凸部118の厚さをTとしたとき、(Ds1-Ds2)/2≧Tであることが好ましい。このように、(Ds1-Ds2)/2とTとの関係を規定することで、凸部118の厚さよりも片側の凸部118の基材本体112との境界の直径と凸部の下面120の直径との差を大きくすることができ、隅部128と接合部142を十分に離間させることができるので、隅部128および接合部142に生じる応力をより緩和することができる。 When the diameter of the boundary 126 of the convex portion with the base material main body is Ds1, the diameter of the lower surface 120 of the convex portion is Ds2, and the thickness of the convex portion 118 is T, it is preferable that (Ds1 - Ds2)/2 ≧ T. By specifying the relationship between (Ds1 - Ds2)/2 and T in this way, the difference between the diameter of the boundary of one side of the convex portion 118 with the base material main body 112 and the diameter of the lower surface 120 of the convex portion can be made larger than the thickness of the convex portion 118. This allows the corner portion 128 and the joint portion 142 to be sufficiently spaced apart, thereby further mitigating stress generated in the corner portion 128 and the joint portion 142.
隅部128と接合部142を離間させ過ぎると、隅部128および接合部142に生じる応力をバランスよく緩和する効果が低減するため、(Ds1-Ds2)/2の上限は、(Ds1-Ds2)/2≦20Tであることが好ましい。 If the corner 128 and the joint 142 are spaced too far apart, the effect of mitigating the stress generated in the corner 128 and the joint 142 in a balanced manner will be reduced, so it is preferable that the upper limit of (Ds1 - Ds2)/2 be (Ds1 - Ds2)/2 ≦ 20T.
電極埋設部材100は、複数の電極130を備えていてもよい。例えば、ヒーター用電極と静電吸着用電極とを備えることで、電極埋設部材100は、ヒーター付静電チャックとして使用できる。 The electrode-embedded member 100 may be provided with multiple electrodes 130. For example, by providing a heater electrode and an electrostatic attraction electrode, the electrode-embedded member 100 can be used as a heater-equipped electrostatic chuck.
電極埋設部材100は、上記以外に必要な端子150および端子穴152を備える。これにより、電極130に給電することができる。 The electrode-embedded member 100 also includes the necessary terminals 150 and terminal holes 152, which allow power to be supplied to the electrode 130.
図3は、本実施形態に係る電極埋設部材の変形例を示す模式的な断面図である。図4は、図3の電極埋設部材の部分断面図である。図3、および図4に示されるように、基材本体の下面116から凸部の側面122に至る断面曲線は、変曲点124を2以上有することが好ましい。このように、断面曲線を変曲点124を2以上有する曲線とすることで、基材本体の下面116および凸部の側面122の形状を様々な形状にすることができ、隅部128に生じる応力が緩和されると共に、支持部材140の接合部142に生じる応力が緩和される。また、凸部118の厚さを厚くした形状にも対応できる。 Figure 3 is a schematic cross-sectional view showing a modified example of an electrode-embedded member according to this embodiment. Figure 4 is a partial cross-sectional view of the electrode-embedded member of Figure 3. As shown in Figures 3 and 4, the cross-sectional curve extending from the lower surface 116 of the substrate body to the side surface 122 of the convex portion preferably has two or more inflection points 124. By making the cross-sectional curve a curve with two or more inflection points 124, the lower surface 116 of the substrate body and the side surface 122 of the convex portion can be shaped in a variety of shapes, which reduces stress at the corners 128 and at the joints 142 of the support member 140. It can also accommodate shapes in which the thickness of the convex portion 118 is increased.
また、図3、および図4に示されるように、断面曲線が変曲点124を2以上有する曲線である場合、接合部近傍の凸部の側面122と接合部近傍の支持部材の側面の断面は、連続する曲線であることが好ましい。これにより、凸部の側面122と支持部材の側面とを滑らかに接続することができ、支持部材140の接合部142に生じる応力がより緩和される。また、変曲点の数が2以上であっても、凸部の側面122と凸部の下面120とが滑らかに接続されていてもよい。 Furthermore, as shown in Figures 3 and 4, when the cross-sectional curve is a curve with two or more inflection points 124, it is preferable that the cross section of the side surface 122 of the convex portion near the joint and the side surface of the support member near the joint be a continuous curve. This allows the side surface 122 of the convex portion and the side surface of the support member to be smoothly connected, further mitigating stress generated at the joint 142 of the support member 140. Furthermore, even if the number of inflection points is two or more, the side surface 122 of the convex portion and the lower surface 120 of the convex portion may be smoothly connected.
本発明の電極埋設部材100は、隅部に生じる応力が緩和されると共に、支持部材の接合部に生じる応力が緩和され、その結果、隅部や接合部の破損リスクや気密不良リスクを低減することができる。 The electrode-embedding member 100 of the present invention alleviates stress that occurs in corners and at the joints of the support member, thereby reducing the risk of damage and poor airtightness at corners and joints.
[電極埋設部材の製造方法]
次に、本実施形態に係る電極埋設部材の製造方法を説明する。本発明の実施形態に係る電極埋設部材は、例えば、以下に説明する成形体ホットプレス法によって作製される。なお、製法は本方法に限られず、例えば、粉末ホットプレス法や従前のグリーンシート積層法等であってもよい。粉末ホットプレス法は、セラミックス原料粉と所定の発熱抵抗体や電極を交互に重ねることにより発熱抵抗体や電極をセラミックスの内部に埋設し、それを1軸ホットプレス焼成する方法である。
[Method of manufacturing electrode-embedded member]
Next, a method for manufacturing the embedded electrode member according to the present embodiment will be described. The embedded electrode member according to the present embodiment is manufactured, for example, by a molded body hot pressing method described below. Note that the manufacturing method is not limited to this method, and may be, for example, a powder hot pressing method or a conventional green sheet lamination method. The powder hot pressing method is a method in which ceramic raw material powder and predetermined heating resistors and electrodes are alternately stacked to embed the heating resistors and electrodes inside the ceramic, and then the resultant is uniaxial hot press fired.
成形体ホットプレス法による本発明の実施形態に係る電極埋設部材の製造方法は、セラミックス成形体形成工程、セラミックス脱脂体作製工程、セラミックス基材前駆体形成工程、セラミックス基材焼成工程、曲面加工工程、支持部材成形体形成工程、支持部材脱脂体作製工程、支持部材焼成工程、および接合工程を備えている。 The manufacturing method for an electrode-embedded member according to an embodiment of the present invention using a molded body hot pressing method includes a ceramic molded body forming process, a ceramic degreased body fabricating process, a ceramic substrate precursor forming process, a ceramic substrate firing process, a curved surface processing process, a support member molded body forming process, a support member degreased body fabricating process, a support member firing process, and a joining process.
セラミックス成形体形成工程では、例えば、AlNを主成分とし、焼結助剤としてY成分が添加された第1のセラミックス原料粉から複数のセラミックス成形体を形成する。例えば、セラミックス原料粉末に焼結助剤のY成分としてY2O3、バインダ、可塑剤、分散剤などの添加剤を適宜添加して混合して、スラリーを作製し、スプレードライ法等により顆粒(第1のセラミックス原料粉)を造粒後、加圧成形して複数のセラミックス成形体を形成することができる。原料となるセラミックス粉末としては、窒化アルミニウム以外には、例えば、炭化珪素、酸化アルミニウム、窒化珪素などが用いられる。 In the ceramic molded body forming process, for example, multiple ceramic molded bodies are formed from a first ceramic raw material powder containing AlN as the main component and Y as a sintering aid. For example, Y2O3 as the Y component of the sintering aid, and additives such as a binder, plasticizer, and dispersant are appropriately added to the ceramic raw material powder and mixed to prepare a slurry, which is then granulated by a spray-drying method or the like to produce granules (first ceramic raw material powder), which are then pressure-molded to form multiple ceramic molded bodies. In addition to aluminum nitride, silicon carbide, aluminum oxide, silicon nitride, and the like can be used as the raw ceramic powder.
セラミックス原料粉末は、高純度であることが好ましく、その純度は、好ましくは96%以上、より好ましくは98%以上である。また、セラミックス原料粉末の平均粒径は、好ましくは0.1μm以上1.0μm以下である。 The ceramic raw material powder is preferably highly pure, with a purity of preferably 96% or higher, and more preferably 98% or higher. The average particle size of the ceramic raw material powder is preferably 0.1 μm or higher and 1.0 μm or lower.
混合方法は、湿式、乾式の何れであってもよく、例えばボールミル、振動ミルなどの混合器を用いることができる。成形方法としては、例えば、一軸加圧成形や冷間静水等方圧加圧(CIP:Cold Isostatic Pressing)法などの公知の方法を用いればよい。なお、セラミックス成形体を形成する方法は、加圧成形に限らず、例えば、グリーンシート積層、または鋳込み成形であっても適用が可能であり、これらを適宜脱脂、またはさらに仮焼する工程により、セラミックス成形体を製造することができる。 The mixing method may be either wet or dry, and a mixer such as a ball mill or vibration mill may be used. Forming may be performed using known methods such as uniaxial pressing or cold isostatic pressing (CIP). The method of forming the ceramic compact is not limited to pressure forming; other methods, such as green sheet lamination or slip casting, can also be used. The ceramic compact can be manufactured by degreasing these appropriately or by further calcining them.
セラミックス成形体は、成形後、機械加工により成形体の形状が整えられてもよい。また、セラミックス成形体の片面(他のセラミックス成形体との接合面)に、電極の形状に合わせた形状の溝が形成されてもよい。機械加工は、脱脂後に行なってもよい。 After forming, the ceramic compact may be machined to adjust its shape. Also, a groove shaped to match the shape of the electrode may be formed on one side of the ceramic compact (the surface to be bonded to another ceramic compact). Machining may be performed after degreasing.
セラミックス脱脂体作製工程では、複数のセラミックス成形体を所定の温度以上、所定の時間以上脱脂処理して複数のセラミックス脱脂体を作製する。 In the ceramic degreased body production process, multiple ceramic molded bodies are degreased at a predetermined temperature or higher for a predetermined period of time or longer to produce multiple ceramic degreased bodies.
セラミックス成形体は、例えば、500℃以上900℃以下の温度で熱処理され、セラミックス脱脂体となる。脱脂時間は、1時間以上120時間以下であることが好ましい。脱脂には、大気炉または窒素雰囲気炉を用いることができるが、バインダの有機成分を除去することが重要なので大気炉の方が好ましい。 The ceramic molded body is heat-treated, for example, at a temperature of 500°C or higher and 900°C or lower, to produce a degreased ceramic body. The degreasing time is preferably 1 hour or higher and 120 hours or lower. An atmospheric or nitrogen atmosphere furnace can be used for degreasing, but an atmospheric furnace is preferred because it is important to remove the organic components of the binder.
セラミックス基材前駆体形成工程では、電極を準備し、電極、および複数のセラミックス脱脂体を組み合わせて、上面に基板載置面を有し、平板状に形成され、電極が埋設されたセラミックス基材前駆体を形成する。凸部は、この段階で概形が形成されていてもよいし、焼成後に研削、研磨加工等して凸部を形成してもよい。 In the ceramic substrate precursor formation process, electrodes are prepared, and the electrodes and multiple ceramic degreased bodies are combined to form a ceramic substrate precursor that has a substrate mounting surface on its upper surface, is formed in a flat plate shape, and has the electrodes embedded in it. The protrusions may be roughly formed at this stage, or they may be formed by grinding, polishing, etc. after firing.
電極は、電極埋設部材の設計に応じた形状に加工されたものを準備する。電極の形状は、メッシュ状や箔状など、様々な形状とすることができる。また、材質も、モリブデン、タングステンなど、様々な材質とすることができる。 The electrodes are prepared in a shape that matches the design of the electrode-embedding member. The electrodes can be in a variety of shapes, such as mesh or foil. They can also be made of a variety of materials, such as molybdenum or tungsten.
セラミックス基材焼成工程では、形成されたセラミックス基材前駆体を、基板載置面に垂直方向に一軸加圧焼成してセラミックス基材を焼成する。焼成条件は材質によって異なるが、AlNを主成分とするセラミックスを使用する場合、加圧する力は、1MPa以上であることが好ましい。また、焼成温度は、1700℃以上2000℃以下であることが好ましい。焼成時間は、1時間以上12時間以下であることが好ましく、1時間以上5時間以下であることがより好ましい。焼成雰囲気は、例えば、窒素や不活性ガス雰囲気であるが、真空などの雰囲気であってもよい。これにより、複数のセラミックス脱脂体が焼結してセラミックス焼結体となり、これらが一体化され、電極が埋設されたセラミックス基材が得られる。 In the ceramic substrate firing process, the formed ceramic substrate precursor is uniaxially pressurized and fired in a direction perpendicular to the substrate mounting surface to fire the ceramic substrate. Firing conditions vary depending on the material, but when using a ceramic primarily composed of AlN, a pressure of 1 MPa or more is preferred. The firing temperature is preferably 1700°C or higher and 2000°C or lower. The firing time is preferably 1 hour or higher and 12 hours or lower, and more preferably 1 hour or higher and 5 hours or lower. The firing atmosphere is, for example, a nitrogen or inert gas atmosphere, but may also be a vacuum atmosphere. As a result, multiple degreased ceramic bodies are sintered to form a ceramic sintered body, which is then integrated to produce a ceramic substrate with embedded electrodes.
曲面加工工程では、セラミックス基材の基材本体の下面から凸部の側面に至る面を、セラミックス基材の中心軸を含む断面において、セラミックス基材の基材本体の下面および凸部の側面の断面が変曲点を有する連続する曲線で形成されるように加工を行なう。曲面加工工程は、支持部材との接合工程の後に行なってもよい。 In the curved surface processing step, the surface of the ceramic substrate extending from the lower surface of the substrate body to the side surface of the convex portion is processed so that, in a cross section including the central axis of the ceramic substrate, the cross section of the lower surface of the substrate body of the ceramic substrate and the cross section of the side surface of the convex portion are formed as a continuous curve with an inflection point. The curved surface processing step may be performed after the joining step with the support member.
断面曲線の変曲点は、2以上あることが好ましい。また、凸部の基材本体との境界の直径Ds1と、凸部の下面の直径Ds2に対し、1.1≦Ds1/Ds2≦1.5を満たすように加工することが好ましい。また、凸部の基材本体との境界の直径Ds1、凸部の下面の直径Ds2、凸部の厚さTに対し、(Ds1-Ds2)/2≧Tを満たすように加工することが好ましい。 It is preferable that there are two or more inflection points in the cross-sectional curve. Furthermore, it is preferable that the processing be performed so that the diameter Ds1 of the boundary between the protrusion and the substrate body and the diameter Ds2 of the lower surface of the protrusion satisfy the relationship 1.1≦Ds1/Ds2≦1.5. Furthermore, it is preferable that the processing be performed so that the diameter Ds1 of the boundary between the protrusion and the substrate body, the diameter Ds2 of the lower surface of the protrusion, and the thickness T of the protrusion satisfy the relationship (Ds1-Ds2)/2≧T.
支持部材成形体形成工程では、例えば、AlNを主成分とし、焼結助剤としてY成分が添加された、または焼結助剤が添加されない第2のセラミックス原料粉から支持部材成形体を形成する。第2のセラミックス原料粉の作製方法や支持部材成形体の成形方法等は、セラミックス成形体形成工程と同じでよい。第2のセラミックス原料粉は、焼結助剤を含まないことが好ましい。 In the support member compact formation process, the support member compact is formed from a second ceramic raw material powder, which may contain, for example, AlN as the main component and a Y component as a sintering aid, or no sintering aid. The method for producing the second ceramic raw material powder and the method for forming the support member compact may be the same as those in the ceramic compact formation process. It is preferable that the second ceramic raw material powder does not contain a sintering aid.
支持部材脱脂体作製工程では、支持部材成形体を所定の温度以上、所定の時間以上脱脂処理して支持部材脱脂体を作製する。支持部材成形体の脱脂条件の数値範囲等は、セラミックス脱脂体作製工程と同じでよい。なお、支持部材脱脂体作製工程を、セラミックス脱脂体作製工程と同時に行ってもよい。 In the support member degreased body production process, the support member molded body is degreased at a predetermined temperature or higher for a predetermined time or longer to produce a support member degreased body. The numerical ranges and other conditions for degreasing the support member molded body may be the same as those in the ceramic degreased body production process. The support member degreased body production process may also be carried out simultaneously with the ceramic degreased body production process.
支持部材焼成工程では、支持部材脱脂体を焼成してセラミックス基材を支持する支持部材を焼成する。焼成条件は材質によって異なるが、AlNを主成分とするセラミックスを使用する場合、支持部材の焼成は、常圧焼成であることが好ましい。また、焼成温度は、1800℃以上2000℃以下であることが好ましい。焼成時間は、1時間以上12時間以下であることが好ましい。焼成雰囲気は、例えば、窒素や不活性ガス雰囲気であるが、真空などの雰囲気であってもよい。 In the support member firing process, the degreased support member is fired to form a support member that supports the ceramic substrate. Firing conditions vary depending on the material, but when using ceramics whose main component is AlN, the support member is preferably fired at atmospheric pressure. The firing temperature is preferably 1800°C or higher and 2000°C or lower. The firing time is preferably 1 hour or higher and 12 hours or lower. The firing atmosphere is, for example, a nitrogen or inert gas atmosphere, but may also be a vacuum atmosphere.
接合工程では、セラミックス基材と支持部材とを接合する。接合は、接合材を用いた接合方法、および接合材を用いない接合方法のいずれかを用いることができる。 In the bonding process, the ceramic substrate and the support member are bonded together. Bonding can be performed using either a bonding method that uses a bonding material or a bonding method that does not use a bonding material.
最初に接合材を用いた接合方法を説明する。まず、接合材を準備し、セラミックス基材の凸部の下面の支持部材を接合する接合部または支持部材の接合部側の端面の少なくとも一方に接合材を塗布する。接合部および支持部材の接合部側の端面は、表面粗さRaを1.6μm以下にすることが好ましく、0.4μm以下に研磨することがより好ましい。塗布する接合材の厚さは、5μm以上30μm以下であることが好ましい。 First, we will explain the joining method using a joining material. First, prepare the joining material and apply it to at least one of the joining portion where the support member is joined to the underside of the convex portion of the ceramic substrate or the end face of the support member facing the joining portion. The joining portion and the end face of the support member facing the joining portion preferably have a surface roughness Ra of 1.6 μm or less, and more preferably are polished to 0.4 μm or less. The thickness of the applied joining material is preferably 5 μm or more and 30 μm or less.
次に、接合部に支持部材を配置し、基板載置面に垂直方向に加圧しつつ加熱する。接合条件は材質によって異なるが、AlNを主成分とするセラミックスを使用する場合、加圧する力は、5kPa以上であることが好ましい。また、加熱温度は、1500℃以上1800℃以下であることが好ましい。加熱時間は、0.5時間以上5時間以下であることが好ましい。加熱雰囲気は、例えば、窒素や不活性ガス雰囲気であるが、真空などの雰囲気であってもよい。これにより、セラミックス基材と支持部材とを接合することができる。 Next, a support member is placed on the joining portion and heated while applying pressure perpendicular to the substrate mounting surface. The joining conditions vary depending on the material, but when using ceramics whose main component is AlN, a pressure of 5 kPa or more is preferable. The heating temperature is preferably 1500°C or higher and 1800°C or lower. The heating time is preferably 0.5 hours or higher and 5 hours or lower. The heating atmosphere is, for example, a nitrogen or inert gas atmosphere, but a vacuum atmosphere or other atmosphere is also acceptable. This allows the ceramic substrate and support member to be joined.
接合材は、セラミックス基材と支持部材とを接合できればどのようなものであってもよい。例えば、セラミックス基材および支持部材をAlNを主成分とするセラミックスで形成した場合、これらと同一の主成分であるAlN粉末にY2O3粉末を少なくとも含む混合粉末のペーストであってもよい。また、AlN90wt%以上95wt%以下で、Y2O3を5wt%以上含み、必要に応じて接合時融液となる温度を調節するためにCaO、MgO、ZrO2、SiO2を含むペーストであってもよい。 The bonding material may be any material capable of bonding the ceramic substrate and the support member. For example, if the ceramic substrate and the support member are made of ceramics primarily composed of AlN, the bonding material may be a paste of a mixed powder containing AlN powder, which is the same primary component as the ceramic substrate and the support member, and at least Y2O3 powder. Alternatively, the bonding material may be a paste containing 90 wt% to 95 wt% AlN and 5 wt% or more Y2O3 , and optionally containing CaO, MgO, ZrO2 , and SiO2 to adjust the temperature at which the material becomes molten during bonding.
次に、接合材を用いない接合方法を説明する。セラミックス基材の凸部の下面の支持部材を接合する接合部に支持部材を配置する。接合部および支持部材の接合部側の端面は、表面粗さRaを0.1μm以下に研磨することが好ましい。次に、基板載置面に垂直方向に加圧しつつ加熱する。接合条件は材質によって異なるが、AlNを主成分とするセラミックスを使用する場合、加圧する力は、1MPa以上であることが好ましい。また、加熱温度は、1600℃以上2000℃以下であることが好ましい。加熱時間は、0.5時間以上6時間以下であることが好ましい。加熱雰囲気は、例えば、窒素や不活性ガス雰囲気であるが、真空などの雰囲気であってもよい。これにより、セラミックス基材と支持部材とを接合することができる。 Next, a bonding method that does not use a bonding material will be described. A support member is placed at the bonding section where the support member is bonded to the underside of the protruding portion of the ceramic substrate. The bonding section and the end face of the support member on the bonding side are preferably polished to a surface roughness Ra of 0.1 μm or less. Next, the substrate is heated while being pressurized in a direction perpendicular to the substrate mounting surface. Bonding conditions vary depending on the material, but when using ceramics whose main component is AlN, a pressure of 1 MPa or more is preferred. The heating temperature is also preferably 1600°C or higher and 2000°C or lower. The heating time is preferably 0.5 hours or higher and 6 hours or lower. The heating atmosphere is, for example, a nitrogen or inert gas atmosphere, but a vacuum atmosphere or other atmosphere may also be used. This allows the ceramic substrate and support member to be bonded.
焼成後のセラミックス基材に必要な端子穴を設ける。端子穴の穿設は、支持部材との接合の前に行なってもよいし、後に行なってもよい。そして、端子穴にロウ材等で端子を接続する。端子は、Ni等を用いることができる。また、ロウ材はAuロウ等を用いることができる。 The necessary terminal holes are drilled in the fired ceramic substrate. The terminal holes can be drilled before or after joining to the support member. Terminals are then connected to the terminal holes using brazing material or the like. Ni or other materials can be used for the terminals. Au brazing material or the like can also be used for the brazing material.
このようにすることで、隅部に生じる応力が緩和されると共に、支持部材の接合部に生じる応力が緩和され、その結果、隅部や接合部の破損リスクや気密不良リスクを低減することができる電極埋設部材を製造することができる。 By doing this, stress generated at the corners and at the joints of the support members is alleviated, resulting in the manufacture of an electrode-embedded member that reduces the risk of damage and poor airtightness at the corners and joints.
なお、セラミックス脱脂体作製工程と、セラミックス基材前駆体形成工程との間に、セラミックス仮焼体作製工程を設けてもよい。セラミックス仮焼体作製工程を設ける場合、セラミックス脱脂体を所定の温度で仮焼してセラミックス仮焼体を作製する。これにより、電極埋設部材の寸法精度をより高くすることができる。仮焼条件は材質によって異なるが、AlNを主成分とするセラミックスを使用する場合、仮焼温度は1200℃以上1700℃以下であることが好ましい。仮焼時間は、0.5時間以上12時間以下であることが好ましい。仮焼雰囲気は、窒素や不活性ガス雰囲気であることが好ましいが、真空などの雰囲気であってもよい。仮焼体作製工程を設ける場合、機械加工は仮焼体作製工程の後に行なってもよい。 A ceramic calcined body preparation process may be performed between the ceramic degreased body preparation process and the ceramic substrate precursor formation process. When the ceramic calcined body preparation process is performed, the ceramic degreased body is calcined at a predetermined temperature to prepare a ceramic calcined body. This allows for higher dimensional accuracy of the electrode-embedded member. Calcination conditions vary depending on the material, but when using a ceramic whose main component is AlN, the calcination temperature is preferably 1200°C or higher and 1700°C or lower. The calcination time is preferably 0.5 hours or higher and 12 hours or lower. The calcination atmosphere is preferably a nitrogen or inert gas atmosphere, but may also be a vacuum or other atmosphere. When the calcined body preparation process is performed, machining may be performed after the calcined body preparation process.
[実施例および比較例]
(実施例1-1)
5wt%Y2O3を添加したAlNを主成分とするセラミックス原料粉を準備した。これを用いて、直径330mm、厚さ20mmのセラミックス成形体、および直径330mm、厚さ25mmのセラミックス成形体をCIP成形した。直径330mm、厚さ25mmのセラミックス成形体の一方の面に、電極埋設用の溝(Φ292mm、深さ0.12mm)を形成した。
[Examples and Comparative Examples]
(Example 1-1)
A ceramic raw material powder containing 5 wt % Y2O3 as the main component of AlN was prepared. Using this, a ceramic compact measuring 330 mm in diameter and 20 mm in thickness and a ceramic compact measuring 330 mm in diameter and 25 mm in thickness were formed by CIP. A groove (Φ292 mm, depth 0.12 mm) for embedding an electrode was formed on one side of the 330 mm diameter, 25 mm thick ceramic compact.
次に、2つのセラミックス成形体を、550℃、12時間脱脂して、2つのセラミックス脱脂体を作製した。次に、発熱抵抗体(電極)として、最外径290mmのモリブデン製のモリブデンメッシュ(線径0.1mm、メッシュサイズ♯50)を所定の形状に裁断したものを準備した。そして、溝を形成したセラミックス脱脂体の溝に発熱抵抗体を載置し、他方のセラミックス脱脂体で挟み、セラミックス基材前駆体を作製した。 Next, the two ceramic compacts were degreased at 550°C for 12 hours to produce two ceramic degreased bodies. Next, a molybdenum mesh (wire diameter 0.1 mm, mesh size #50) made of molybdenum with an outermost diameter of 290 mm, cut to a specified shape, was prepared as a heating resistor (electrode). The heating resistor was then placed in the groove of the ceramic degreased body, which had grooves formed in it, and sandwiched between the other ceramic degreased body to produce a ceramic substrate precursor.
次に、セラミックス基材前駆体の載置面に垂直な方向に6MPaの力を加えつつ、1800℃、5時間、1軸ホットプレス焼成した。このようにして、電極埋設部材本体を焼成した。焼成後のセラミックス基材のサイズは、直径約330mm、厚さ約36mmであった。焼成したセラミックス基材に接合前の加工を行なった。基材本体の直径を320mm、厚さを20mmとし、セラミックス基材の下面に所定の大きさ、および側面形状を有する凸部を形成し、凸部の下面の支持部材との接合部となる位置の表面粗さを、Ra0.1μm以下に仕上げた。また、電極と端子の電気的接続のための端子穴を埋設された電極に到達するように加工した。 Next, the ceramic substrate precursor was subjected to uniaxial hot press firing at 1800°C for 5 hours while applying a force of 6 MPa in the direction perpendicular to the mounting surface. In this way, the electrode-embedded member body was fired. The ceramic substrate after firing measured approximately 330 mm in diameter and 36 mm in thickness. The fired ceramic substrate was then processed prior to bonding. The substrate body had a diameter of 320 mm and a thickness of 20 mm. A convex portion with a specified size and side shape was formed on the underside of the ceramic substrate, and the surface roughness of the underside of the convex portion at the position that would become the joint with the support member was finished to an Ra of 0.1 μm or less. In addition, a terminal hole for electrical connection between the electrode and terminal was machined to reach the embedded electrode.
凸部のサイズは、基材本体との境界の直径Ds1を65mm、凸部の下面の直径Ds2を60mm、厚さTを5mmとした。凸部の側面の形状は、セラミックス基材の基材本体の下面と凸部の側面とが滑らかに接続され、凸部の側面と凸部の下面とが滑らかに接続され、中間に特異点を有さないで凸部の側面に1つの変曲点を有するような形状とした。すなわち、セラミックス基材の中心軸を含む断面において、セラミックス基材の基材本体の下面および凸部の側面の断面は連続する曲線で形成され、当該曲線は変曲点を有する形状である。 The size of the convex portion was such that the diameter Ds1 of the boundary with the substrate body was 65 mm, the diameter Ds2 of the underside of the convex portion was 60 mm, and the thickness T was 5 mm. The shape of the side of the convex portion was such that the underside of the substrate body of the ceramic substrate and the side of the convex portion were smoothly connected, and the side of the convex portion and the underside of the convex portion were smoothly connected, with no singular point in between and one inflection point on the side of the convex portion. In other words, in a cross section including the central axis of the ceramic substrate, the cross section of the underside of the substrate body of the ceramic substrate and the side of the convex portion are formed by a continuous curve, and this curve has a shape with an inflection point.
これとは別に、焼結助剤を添加していないAlNを主成分とするセラミックス原料粉を用いて、焼成後の形状が外径60mm、内径50mm、高さ210mmの中空筒状となるようにセラミックス成形体をCIP形成した。これを、550℃、12時間脱脂して、セラミックス脱脂体を作製した。セラミックス脱脂体を、1900℃、5時間常圧焼成して、支持部材を焼成した。焼成した支持部材の接合部側の端面の表面粗さを、Ra0.1μm以下に仕上げた。 Separately, a ceramic compact was formed using CIP using ceramic raw material powder primarily composed of AlN with no added sintering aids, so that after firing it would have a hollow cylindrical shape with an outer diameter of 60 mm, an inner diameter of 50 mm, and a height of 210 mm. This was degreased at 550°C for 12 hours to produce a degreased ceramic body. This degreased ceramic body was then fired at 1900°C for 5 hours at atmospheric pressure to produce a support member. The surface roughness of the end face on the joint side of the fired support member was finished to Ra 0.1 μm or less.
そして、セラミックス基材の接合部に支持部材を配置し、載置面に垂直な方向に1MPaの力を加えつつ、1700℃、1時間加熱し接合した。その後、Φ5mm、長さ270mmのNi棒を、Auロウで真空中1000℃でロウ付けを行なった。最後に、仕上げ加工として、外形を所定の形状に加工した。このようにして、実施例1-1のシャフト付きヒーターを作製した。 A support member was then placed at the joining portion of the ceramic substrate, and the substrate was heated at 1700°C for 1 hour while applying a force of 1 MPa in the direction perpendicular to the mounting surface to bond the two together. A Ni rod measuring 5 mm in diameter and 270 mm in length was then brazed to the substrate using Au solder at 1000°C in a vacuum. Finally, the outer shape was machined to the specified shape as a finishing process. In this way, the heater with a shaft of Example 1-1 was produced.
(実施例1-2)
実施例1-2は、凸部のサイズを凸部と基材本体との境界の直径Ds1を70mm、凸部の下面の直径Ds2を60mm、厚さTを6mmとしたことを除き、実施例1-1と同じ条件で実施例1-2のシャフト付きヒーターを作製した。
(Example 1-2)
In Example 1-2, the heater with a shaft of Example 1-2 was produced under the same conditions as Example 1-1, except that the size of the convex portion was such that the diameter Ds1 of the boundary between the convex portion and the substrate main body was 70 mm, the diameter Ds2 of the lower surface of the convex portion was 60 mm, and the thickness T was 6 mm.
(実施例1-3)
実施例1-3は、凸部のサイズを凸部と基材本体との境界の直径Ds1を90mm、凸部の下面の直径Ds2を60mm、厚さTを10mmとしたことを除き、実施例1-1と同じ条件で実施例1-3のシャフト付きヒーターを作製した。
(Examples 1-3)
In Example 1-3, the heater with a shaft of Example 1-3 was produced under the same conditions as Example 1-1, except that the size of the convex portion was such that the diameter Ds1 of the boundary between the convex portion and the substrate main body was 90 mm, the diameter Ds2 of the lower surface of the convex portion was 60 mm, and the thickness T was 10 mm.
(実施例1-4)
実施例1-4は、凸部のサイズを凸部と基材本体との境界の直径Ds1を100mm、凸部の下面の直径Ds2を60mm、厚さTを10mmとしたことを除き、実施例1-1と同じ条件で実施例1-4のシャフト付きヒーターを作製した。
(Examples 1 to 4)
In Example 1-4, the heater with a shaft of Example 1-4 was produced under the same conditions as Example 1-1, except that the size of the convex portion was such that the diameter Ds1 of the boundary between the convex portion and the substrate main body was 100 mm, the diameter Ds2 of the lower surface of the convex portion was 60 mm, and the thickness T was 10 mm.
(実施例2-1)
実施例2-1は、凸部の側面の形状を、セラミックス基材の基材本体の下面と凸部の側面とが滑らかに接続され、中間に特異点を有さないで凸部の側面に2つの変曲点を有するような形状とした。すなわち、セラミックス基材の中心軸を含む断面において、セラミックス基材の基材本体の下面および凸部の側面の断面は連続する曲線で形成され、当該曲線は2つの変曲点を有する形状である。また、シャフトの接合後、凸部の側面とシャフトの側面が滑らかに接続されるように加工した。それ以外は、実施例1-1と同じ条件で実施例2-1のシャフト付きヒーターを作製した。
(Example 2-1)
In Example 2-1, the shape of the side of the convex portion was such that the lower surface of the substrate body of the ceramic substrate and the side of the convex portion were smoothly connected, and the side of the convex portion had two inflection points without any singular point in between. That is, in a cross section including the central axis of the ceramic substrate, the cross section of the lower surface of the substrate body of the ceramic substrate and the side of the convex portion was formed by a continuous curve, and this curve had a shape with two inflection points. In addition, after joining the shaft, the side of the convex portion and the side of the shaft were processed so that they were smoothly connected. Otherwise, the heater with a shaft of Example 2-1 was produced under the same conditions as Example 1-1.
(実施例2-2)
実施例2-2は、凸部のサイズを凸部と基材本体との境界の直径Ds1を70mm、凸部の下面の直径Ds2を60mm、厚さTを8mmとしたことを除き、実施例2-1と同じ条件で実施例2-2のシャフト付きヒーターを作製した。
(Example 2-2)
In Example 2-2, the heater with a shaft of Example 2-2 was produced under the same conditions as Example 2-1, except that the size of the convex portion was such that the diameter Ds1 of the boundary between the convex portion and the substrate main body was 70 mm, the diameter Ds2 of the lower surface of the convex portion was 60 mm, and the thickness T was 8 mm.
(実施例2-3)
実施例2-3は、凸部のサイズを凸部と基材本体との境界の直径Ds1を90mm、凸部の下面の直径Ds2を60mm、厚さTを12mmとしたことを除き、実施例2-1と同じ条件で実施例2-3のシャフト付きヒーターを作製した。
(Example 2-3)
In Example 2-3, the heater with a shaft of Example 2-3 was produced under the same conditions as Example 2-1, except that the size of the convex portion was such that the diameter Ds1 of the boundary between the convex portion and the substrate main body was 90 mm, the diameter Ds2 of the lower surface of the convex portion was 60 mm, and the thickness T was 12 mm.
(実施例2-4)
実施例2-4は、凸部のサイズを凸部と基材本体との境界の直径Ds1を100mm、凸部の下面の直径Ds2を60mm、厚さTを12mmとしたことを除き、実施例2-1と同じ条件で実施例2-4のシャフト付きヒーターを作製した。
(Example 2-4)
In Example 2-4, the heater with a shaft of Example 2-4 was produced under the same conditions as Example 2-1, except that the size of the convex portion was such that the diameter Ds1 of the boundary between the convex portion and the substrate main body was 100 mm, the diameter Ds2 of the lower surface of the convex portion was 60 mm, and the thickness T was 12 mm.
(実施例3-1)
実施例3-1は、凸部のサイズを、基材本体との境界の直径Ds1を65mm、凸部の下面の直径Ds2を60mm、厚さTを5mmとした。セラミックス基材の基材本体の下面と凸部の側面とが滑らかに接続され、凸部の側面と凸部の下面とが滑らかに接続され、中間に特異点を有さないで凸部の側面に3つの変曲点を有するような形状とした。すなわち、セラミックス基材の中心軸を含む断面において、セラミックス基材の基材本体の下面および凸部の側面の断面は連続する曲線で形成され、当該曲線は3つの変曲点を有する形状である。それ以外は、実施例1-1と同じ条件で実施例3-1のシャフト付きヒーターを作製した。
(Example 3-1)
In Example 3-1, the size of the convex portion was such that the diameter Ds1 of the boundary with the substrate body was 65 mm, the diameter Ds2 of the lower surface of the convex portion was 60 mm, and the thickness T was 5 mm. The lower surface of the substrate body of the ceramic substrate and the side surface of the convex portion were smoothly connected, and the side surface of the convex portion and the lower surface of the convex portion were smoothly connected, and the side surface of the convex portion had three inflection points without any singular points in between. In other words, in a cross section including the central axis of the ceramic substrate, the cross section of the lower surface of the substrate body of the ceramic substrate and the side surface of the convex portion was formed by a continuous curve, and this curve had a shape with three inflection points. Otherwise, the heater with a shaft of Example 3-1 was produced under the same conditions as Example 1-1.
(実施例3-2)
実施例3-2は、凸部のサイズを凸部と基材本体との境界の直径Ds1を70mm、凸部の下面の直径Ds2を60mm、厚さTを8mmとしたことを除き、実施例3-1と同じ条件で実施例3-2のシャフト付きヒーターを作製した。
(Example 3-2)
In Example 3-2, the heater with a shaft of Example 3-2 was produced under the same conditions as Example 3-1, except that the size of the convex portion was such that the diameter Ds1 of the boundary between the convex portion and the substrate main body was 70 mm, the diameter Ds2 of the lower surface of the convex portion was 60 mm, and the thickness T was 8 mm.
(実施例3-3)
実施例3-3は、凸部のサイズを凸部と基材本体との境界の直径Ds1を90mm、凸部の下面の直径Ds2を60mm、厚さTを15mmとしたことを除き、実施例3-1と同じ条件で実施例3-3のシャフト付きヒーターを作製した。
(Example 3-3)
In Example 3-3, the heater with a shaft of Example 3-3 was produced under the same conditions as Example 3-1, except that the size of the convex portion was such that the diameter Ds1 of the boundary between the convex portion and the substrate main body was 90 mm, the diameter Ds2 of the lower surface of the convex portion was 60 mm, and the thickness T was 15 mm.
(実施例3-4)
実施例2-4は、凸部のサイズを凸部と基材本体との境界の直径Ds1を100mm、凸部の下面の直径Ds2を60mm、厚さTを15mmとしたことを除き、実施例3-1と同じ条件で実施例3-4のシャフト付きヒーターを作製した。
(Examples 3-4)
In Example 2-4, the heater with a shaft of Example 3-4 was produced under the same conditions as Example 3-1, except that the size of the convex portion was such that the diameter Ds1 of the boundary between the convex portion and the substrate main body was 100 mm, the diameter Ds2 of the lower surface of the convex portion was 60 mm, and the thickness T was 15 mm.
(比較例1)
比較例1は、凸部のサイズを凸部と基材本体との境界の直径Ds1を60mm、凸部の下面の直径Ds2を60mm、厚さTを5mmとし、凸部の側面の形状を、断面が基材本体の下面と垂直な直線になり、変曲点を有しないようにしたことを除き、実施例1-1と同じ条件で比較例1のシャフト付きヒーターを作製した。基材本体の下面と凸部の側面との間の隅部の断面は、C0.2mmに相当する特異点となっていた。
(Comparative Example 1)
In Comparative Example 1, the heater with a shaft of Comparative Example 1 was produced under the same conditions as in Example 1-1, except that the size of the convex portion was such that the diameter Ds1 of the boundary between the convex portion and the main substrate body was 60 mm, the diameter Ds2 of the lower surface of the convex portion was 60 mm, the thickness T was 5 mm, and the shape of the side surface of the convex portion was such that the cross section was a straight line perpendicular to the lower surface of the main substrate body and had no inflection points. The cross section of the corner between the lower surface of the main substrate body and the side surface of the convex portion was a singular point corresponding to C0.2 mm.
(比較例2)
比較例1は、凸部のサイズを凸部と基材本体との境界の直径Ds1を70mm、凸部の下面の直径Ds2を60mm、厚さTを8mmとし、凸部の側面の形状を、断面が曲線になり、2つの変曲点を有するようにして、さらに曲線の途中にC0.3mmに相当する角部、すなわち特異点を設けたことを除き、実施例1-1と同じ条件で比較例1のシャフト付きヒーターを作製した。
(Comparative Example 2)
In Comparative Example 1, the heater with a shaft of Comparative Example 1 was produced under the same conditions as in Example 1-1, except that the size of the convex portion was such that the diameter Ds1 of the boundary between the convex portion and the main substrate body was 70 mm, the diameter Ds2 of the underside of the convex portion was 60 mm, and the thickness T was 8 mm, and the shape of the side surface of the convex portion was such that the cross section was curved with two inflection points, and further a corner corresponding to C0.3 mm, i.e. a singular point, was provided midway along the curve.
(目視による破損の確認)
作製した実施例および比較例の電極埋設部材をプロセスチャンバに設置し、発熱抵抗体に外部電源を接続して650℃~200℃の繰り返し温度サイクルを負荷した。1サイクルごとに電極埋設部材の基材本体の下面と凸部の側面との間の隅部、および支持部材の接合部を目視により確認し、破損の有無を調べた。その結果、実施例および比較例共に、12サイクル終了後も目視による破損は確認されなかった。
(Visual inspection of damage)
The fabricated electrode-embedded members of the Examples and Comparative Examples were placed in a process chamber, and an external power source was connected to the heating resistor, and repeated temperature cycles of 650°C to 200°C were applied. After each cycle, the corners between the underside of the base body of the electrode-embedded member and the side of the protrusion, as well as the joints of the support members, were visually inspected to check for damage. As a result, no visual damage was observed in either the Examples or Comparative Examples, even after 12 cycles.
(気密試験)
また、1サイクルごとに支持部材の端部にヘリウムリークディテクタを接続し、支持部材の外側からHeガスを吹き付け、接合部からのHeリークの有無を評価した。このとき、Heリークが10-8Pa・m3/s未満のものをリークなしと判断して合格とし、10-8Pa・m3/s以上となったものをリークありと判断し不合格とした。
(Airtightness test)
A helium leak detector was connected to the end of the support member and He gas was sprayed from the outside of the support member to evaluate the presence or absence of He leak from the joint. A He leak of less than 10-8 Pa· m3 /s was judged to be no leak and passed, and a He leak of 10-8 Pa· m3 /s or more was judged to be leak and failed.
実施例の電極埋設部材は、いずれも12サイクル終了後もHeリークは合格基準を満たしていた。 All of the electrode-embedded materials used in the examples met the He leakage criteria even after 12 cycles.
一方、比較例1は、2サイクル後に10-8Pa・m3/s以上となり、不合格と判断された。また、比較例2は、8サイクル後に10-8Pa・m3/s以上となり、不合格と判断された。これは、隅部または接合部で目に見えない程度のクラックが発生したためと考えられる。すなわち、比較例の断面曲線の形状では、隅部と接合部の両方の応力を緩和できないことが分かった。 On the other hand, Comparative Example 1 had a stress of 10 -8 Pa·m 3 /s or more after two cycles and was therefore judged to have failed. Furthermore, Comparative Example 2 had a stress of 10 -8 Pa·m 3 /s or more after eight cycles and was therefore judged to have failed. This is thought to be due to the occurrence of invisible cracks at the corners or joints. In other words, it was found that the shape of the cross-sectional curve of the Comparative Example was unable to alleviate stress at both the corners and joints.
以上により、本発明の電極埋設部材は、基材本体と凸部の境界の隅部に生じる応力が緩和されると共に、支持部材の接合部に生じる応力が緩和され、隅部や接合部の破損リスクや気密不良リスクを低減することができる電極埋設部材であることが確かめられた。 From the above, it has been confirmed that the electrode-embedding member of the present invention alleviates stress that occurs at the corners of the boundary between the substrate body and the protrusion, as well as stress that occurs at the joints of the support member, thereby reducing the risk of damage to corners and joints and the risk of poor airtightness.
本発明は上記実施形態に限定されず、本発明の思想と範囲に含まれる様々な変形および均等物に及ぶことはいうまでもない。また、各図面に示された構成要素の構造、形状、数、位置、大きさ等は説明の便宜上のものであり、適宜変更しうる。 The present invention is not limited to the above-described embodiments, and naturally includes various modifications and equivalents that fall within the spirit and scope of the present invention. Furthermore, the structure, shape, number, position, size, etc. of the components shown in each drawing are for convenience of explanation and may be changed as appropriate.
100 電極埋設部材
110 セラミックス基材
112 基材本体
114 基板載置面
116 基材本体の下面
118 凸部
120 凸部の下面
122 凸部の側面
124 変曲点
126 基材本体と凸部の境界
128 隅部
130 電極
140 支持部材
142 接合面
150 端子
152 端子穴
100 Electrode-embedding member 110 Ceramic substrate 112 Substrate body 114 Substrate mounting surface 116 Lower surface of substrate body 118 Convex portion 120 Lower surface of convex portion 122 Side surface of convex portion 124 Inflection point 126 Boundary 128 between substrate body and convex portion Corner portion 130 Electrode 140 Support member 142 Bonding surface 150 Terminal 152 Terminal hole
Claims (3)
上面に基板載置面を有し、セラミックス焼結体により平板状に形成された基材本体、および前記基板載置面に対向する前記基材本体の下面から下方に突出して前記基材本体と一体的に形成された凸部を有するセラミックス基材と、
前記セラミックス基材の前記基材本体に埋設された電極と、
前記基板載置面に対向する前記凸部の下面に接合された支持部材と、を備え、
前記セラミックス基材の中心軸を含む断面において、前記セラミックス基材の前記基材本体の下面および前記凸部の側面の断面は連続する曲線で形成され、
前記曲線は変曲点を有し、
前記凸部の前記基材本体との境界の直径をDs1、前記凸部の下面の直径をDs2としたとき、前記変曲点を有する前記凸部の全体において、
1.1≦Ds1/Ds2≦1.5
であることを特徴とする電極埋設部材。 An electrode embedding member,
a ceramic substrate having a substrate body formed into a flat plate shape from a ceramic sintered body and having a substrate mounting surface on an upper surface thereof, and a protrusion protruding downward from a lower surface of the substrate body facing the substrate mounting surface and formed integrally with the substrate body;
an electrode embedded in the substrate body of the ceramic substrate;
a support member joined to a lower surface of the convex portion facing the substrate mounting surface,
In a cross section including a central axis of the ceramic base, a cross section of the lower surface of the base body of the ceramic base and a cross section of a side surface of the protrusion are formed by a continuous curve,
the curve has an inflection point;
When the diameter of the boundary between the protrusion and the substrate body is Ds1 and the diameter of the lower surface of the protrusion is Ds2, in the entire protrusion having the inflection point,
1.1≦Ds1/Ds2≦1.5
An electrode-embedding member characterized by :
上面に基板載置面を有し、セラミックス焼結体により平板状に形成された基材本体、および前記基板載置面に対向する前記基材本体の下面から下方に突出して前記基材本体と一体的に形成された凸部を有するセラミックス基材と、
前記セラミックス基材の前記基材本体に埋設された電極と、
前記基板載置面に対向する前記凸部の下面に接合された支持部材と、を備え、
前記セラミックス基材の中心軸を含む断面において、前記セラミックス基材の前記基材本体の下面および前記凸部の側面の断面は連続する曲線で形成され、
前記曲線は変曲点を有し、
前記凸部の前記基材本体との境界の直径をDs1、前記凸部の下面の直径をDs2とし、前記凸部の厚さをTとしたとき、前記変曲点を有する前記凸部の全体において、
(Ds1-Ds2)/2≧T
であることを特徴とする電極埋設部材。 An electrode embedding member,
a ceramic substrate having a substrate body formed into a flat plate shape from a ceramic sintered body and having a substrate mounting surface on an upper surface thereof, and a protrusion protruding downward from a lower surface of the substrate body facing the substrate mounting surface and formed integrally with the substrate body;
an electrode embedded in the substrate body of the ceramic substrate;
a support member joined to a lower surface of the convex portion facing the substrate mounting surface,
In a cross section including a central axis of the ceramic base, a cross section of the lower surface of the base body of the ceramic base and a cross section of a side surface of the protrusion are formed by a continuous curve,
the curve has an inflection point;
When the diameter of the boundary between the protrusion and the substrate body is Ds1, the diameter of the lower surface of the protrusion is Ds2, and the thickness of the protrusion is T, in the entire protrusion having the inflection point,
(Ds1-Ds2)/2≧T
An electrode-embedding member characterized by :
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021185497A JP7783018B2 (en) | 2021-11-15 | 2021-11-15 | Electrode embedding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021185497A JP7783018B2 (en) | 2021-11-15 | 2021-11-15 | Electrode embedding material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023072822A JP2023072822A (en) | 2023-05-25 |
| JP7783018B2 true JP7783018B2 (en) | 2025-12-09 |
Family
ID=86425341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021185497A Active JP7783018B2 (en) | 2021-11-15 | 2021-11-15 | Electrode embedding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7783018B2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000021957A (en) | 1998-07-01 | 2000-01-21 | Kyocera Corp | Sample heating device |
| US20020170679A1 (en) | 2001-02-09 | 2002-11-21 | Ngk Insulators, Ltd. | Susceptor supporting construction |
| JP2008270197A (en) | 2007-03-28 | 2008-11-06 | Ngk Insulators Ltd | Heating device |
| JP2017191910A (en) | 2016-04-15 | 2017-10-19 | 日本特殊陶業株式会社 | Substrate holding device and manufacturing method thereof |
-
2021
- 2021-11-15 JP JP2021185497A patent/JP7783018B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000021957A (en) | 1998-07-01 | 2000-01-21 | Kyocera Corp | Sample heating device |
| US20020170679A1 (en) | 2001-02-09 | 2002-11-21 | Ngk Insulators, Ltd. | Susceptor supporting construction |
| JP2008270197A (en) | 2007-03-28 | 2008-11-06 | Ngk Insulators Ltd | Heating device |
| JP2017191910A (en) | 2016-04-15 | 2017-10-19 | 日本特殊陶業株式会社 | Substrate holding device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023072822A (en) | 2023-05-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100672802B1 (en) | Substrate heating device and manufacturing method thereof | |
| JP6650332B2 (en) | Substrate holding device and method of manufacturing the same | |
| KR100634182B1 (en) | Substrate heater and fabrication method for the same | |
| JP6688167B2 (en) | Holding device manufacturing method | |
| KR102832282B1 (en) | Multilayer composite ceramic plate and its manufacturing method | |
| JP6389802B2 (en) | Heating apparatus and manufacturing method thereof | |
| JP2021185123A (en) | Ceramic-aluminum assembly comprising fitting groove | |
| JP2022147715A (en) | Electrode embedded member and substrate holding member | |
| JP6618409B2 (en) | Substrate holding device and manufacturing method thereof | |
| JP7517630B2 (en) | Substrate holding member and manufacturing method thereof | |
| JP7783018B2 (en) | Electrode embedding material | |
| JP6672244B2 (en) | Manufacturing method of ceramic joined body | |
| JP6438352B2 (en) | Heating device | |
| US11869796B2 (en) | Electrode-embedded member and method for manufacturing same, electrostatic chuck, and ceramic heater | |
| JP5928672B2 (en) | Manufacturing method of alumina ceramic joined body | |
| JP7836151B2 (en) | Support member, substrate holding member, and method for manufacturing the same | |
| JPH1053470A (en) | Joined body of ceramic and its production | |
| JP2024065891A (en) | Ceramic heater | |
| JP7820211B2 (en) | Electrode embedding member and substrate holding member | |
| JP7265941B2 (en) | zygote | |
| JP2023023670A (en) | ceramic heater | |
| JP7663332B2 (en) | Substrate holding member and manufacturing method thereof | |
| JP7780287B2 (en) | Joint, manufacturing method thereof, and electrode-embedded member | |
| JP7792254B2 (en) | Joint, manufacturing method thereof, and electrode-embedded member | |
| JP2023169797A (en) | Electrode embedding member and substrate holding member |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20240905 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20240918 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20240919 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240920 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20240920 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20250226 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20250527 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20250617 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250804 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20251118 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20251127 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7783018 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |