JP7790945B2 - Imaging device and control method thereof - Google Patents

Description

The present invention relates to an imaging device with an image stabilization function using an image sensor, and a control method thereof.

Image capture devices equipped with an image blur correction function to correct shake applied to the image capture device housing during image capture are becoming increasingly common. One known method for correcting image shake is the in-housing image blur correction method, which corrects image shake by oscillating (displacing) the image sensor in a plane perpendicular to the optical axis in accordance with the magnitude and direction of the detected shake.

In order to improve the displacement drive performance of the image sensor, the in-casing image stabilization method minimizes the number of contact points between the moving part that holds the image sensor and the fixed part that is fixed to the image sensor casing. In addition, the flexible circuit board that electrically connects the image sensor to the control circuit inside the casing is designed to be as long and thin as possible so as not to impede the displacement drive of the image sensor.

This type of configuration with the in-casing image stabilization method leaves little room for heat dissipation to transfer heat generated in the image sensor to the outside, posing a problem in that the image sensor is prone to becoming very hot during image capture. To address this issue, Patent Document 1 discloses an imaging device equipped with a heat dissipation member that can be moved in the optical axis direction relative to a heat dissipation section provided in the image sensor and placed in a contacting or separated state. Patent Document 2 also discloses an imaging device in which a heat dissipation member is placed around the image sensor, and the image sensor is moved so that it contacts the heat dissipation member when heat dissipation from the image sensor is required.

JP 2009-278584 A Japanese Patent Application Laid-Open No. 2019-145929

However, the technologies disclosed in Patent Documents 1 and 2 above have the problem that image blur correction cannot be performed when the imaging element is in contact with the heat dissipation member.

The present invention aims to provide an imaging device that can achieve both high heat dissipation performance from the imaging element and consistent image stabilization performance.

The imaging device of the present invention is characterized by comprising an imaging element, a movable section that holds the imaging element and is arranged to be swingable in a direction perpendicular to the imaging optical axis, a fixed section that swingably supports the movable section, a drive section that swings the movable section, a heat transfer member that is arranged to be movable in the optical axis direction, and control means that switches between a first imaging mode in which the movable section is swingable with the heat transfer member separated from the movable section, and a second imaging mode in which the heat transfer member is in contact with the movable section and is swingable integrally with the movable section.

This invention makes it possible to realize an imaging device that can achieve both high heat dissipation performance from the imaging element and consistent image stabilization performance.

FIG. 1 is a block diagram showing a schematic configuration of an imaging device. FIG. 2 is a first diagram showing the structure of an imaging unit and a heat absorption unit. FIG. 2 is a second diagram showing the structure of the imaging unit and the heat absorption unit. 2A and 2B are a rear view and a cross-sectional view along the arrow AA in the rear view of the imaging unit and the heat absorption unit, respectively; 10 is a flowchart illustrating imaging control of the imaging device.

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

Figure 1 is a block diagram showing the schematic configuration of an imaging device 100 according to an embodiment. Specifically, the imaging device 100 is a digital camera.

The imaging device 100 has a photographing lens section 400. The photographing lens section 400 is equipped with an image stabilization lens 410, an AF lens 420, an aperture 430, and an in-lens gyro 440. The imaging device 100 has an imaging unit 200 and a heat absorption unit 300. The imaging unit 200 has an image sensor 231 and an image stabilization drive section 240.

The imaging device 100 includes an aperture driver 123, a correction lens driver 124, an AF lens driver 125, a system controller 120, a memory 140, a shutter 110, a shutter controller 122, an image processor 121, and an in-housing gyro 180. The imaging device 100 also includes a timer 160, a thermometer 170, a storage medium 500, a display unit 150, a battery 600, a power controller 126, a power switch 135, and an operation unit 130.

The imaging lens unit 400 generally consists of multiple lenses, and the image stabilization lens 410 and AF lens 420 shown in Figure 1 are representative examples of some of the lenses included in the imaging device 100.

The system control unit 120 calculates the displacement drive amount of the image stabilization lens 410 based on the amount of shake detected by the in-lens gyro 440, and transmits the calculation result to the correction lens drive unit 124. The correction lens drive unit 124 oscillates the image stabilization lens 410 in a plane perpendicular to the imaging optical axis (hereinafter referred to as the "optical axis") based on the displacement drive amount obtained from the system control unit 120, thereby correcting image shake. An in-lens image stabilization mechanism is configured in this way, but an in-lens image stabilization mechanism is not necessarily required for the imaging device according to the present invention.

The system control unit 120 calculates the amount of drive of the AF lens 420 in the optical axis direction based on the defocus amount detected by the image processing unit 121 using the image plane phase difference method, and sends the calculation result to the AF lens driving unit 125. The AF lens driving unit 125 drives the AF lens 420 in the optical axis direction based on the amount of drive of the optical axis direction obtained from the system control unit 120, thereby performing a focusing operation (focusing) on the subject. The iris 430 adjusts the amount of light incident on the image sensor 231. The iris driving unit 123 drives the iris 430 under the control of the system control unit 120.

The system control unit 120 is a microcontroller that performs overall control of the imaging device 100. For example, the system control unit 120 controls the shutter 110, AF lens 420, and aperture 430 to perform AF control and AE processing based on the results of calculations performed by the image processing unit 121 on the image signal output from the image sensor 231. The memory 140 includes a ROM that stores constants, variables, programs, etc. for the operation of the system control unit 120, and a RAM that is used for temporary storage of various data and as a work area for the system control unit 120. The image processing unit 121 generates a digital image signal by AD converting the image signal acquired from the image sensor 231, and also performs predetermined image processing on the image signal.

The image sensor 231 converts the optical image formed on the imaging surface 231a (see Figure 2(b)) into an electrical signal to generate an image signal, which is output to the image processing unit 121. The system control unit 120 calculates the displacement drive amount for the image sensor 231 based on the amount of shake detected by the in-housing gyro 180, and transmits the calculation result to the image shake correction drive unit 240. The image shake correction drive unit 240 oscillates the image sensor 231 in a plane perpendicular to the optical axis based on the displacement drive amount obtained from the system control unit 120, thereby correcting image shake. In this way, an in-housing image shake correction mechanism that corrects image shake within the housing of the imaging device 100 is configured.

The timer 160 measures various elapsed times. The thermometer 170 measures the temperature of the image sensor 231. The storage medium 500 is, for example, an SD card, a CF card, a CFexpress card, etc., but is not limited to these. The operation unit 130 includes various buttons and switches, a touch panel superimposed on the display screen of the display unit 150, etc., and is responsible for setting conditions for performing image capture, playback of captured images, communication, etc., and inputting user instructions such as starting image capture and image playback to the system control unit 120.

The power switch 135 switches the power of the imaging device 100 on and off. The power control unit 126 is composed of a battery detection circuit, a DC/DC converter, a switch circuit that switches between blocks to which electricity is supplied, and other components. The power control unit 126 detects the type and remaining charge of the battery 600 that powers the imaging device 100, and supplies the necessary voltage to each component, including the storage medium, for the necessary period based on the detection results and instructions from the system control unit 120. The display unit 150 is, for example, a liquid crystal display device, and displays captured images (live view images), plays back and displays captured images stored in the storage medium 500, and displays menu screens, etc.

Under the control of the system control unit 120, the heat absorption unit 300 absorbs heat generated by the image sensor 231 and suppresses temperature rise of the image sensor 231 depending on the usage status of the image sensor 100 (particularly the operating status of the image sensor 231).

The imaging device 100 allows selective setting, via the operation unit 130, between a first imaging mode, which prioritizes image stabilization performance over heat absorption performance from the imaging element 231, and a second imaging mode, which prioritizes heat absorption performance from the imaging element 231 over image stabilization performance. The first imaging mode prioritizes image stabilization, making it useful for, for example, still image capture with a slow shutter speed. The second imaging mode achieves both high heat dissipation performance from the imaging element 231 and a certain level of image stabilization performance. Therefore, the second imaging mode is useful for video capture, in which the temperature of the imaging element 231 is likely to rise. It enables longer continuous shooting times and reduced image noise while achieving a certain level of image stabilization effectiveness. The system control unit 120 sets the imaging mode to the first imaging mode or the second imaging mode based on instructions from the operation unit 130. In the imaging device 100, the first imaging mode is set to normal mode by default, but this is not limited to this.

The relationship between the mechanical structures of the imaging unit 200 and heat absorption unit 300 changes between the first and second imaging modes. Next, we will explain the configurations of the imaging unit 200 and heat absorption unit 300.

Figure 2 is the first diagram showing the structure of the imaging unit 200 and heat absorption unit 300. Figures 2(a) and 2(b) show an exploded perspective view of the imaging unit 200 and a perspective view of the heat absorption unit 300, respectively, with the imaging unit 200 and heat absorption unit 300 viewed from different directions in Figures 2(a) and 2(b).

The imaging unit 200 is constructed by sandwiching an imaging element unit 230 between a front plate 210 and a back plate 220, which are made of frame-shaped metal plates. The front plate 210 is fixed to the structure that makes up the housing of the imaging device 100 and is immovable, while the back plate 220 is fixed to the front plate 210, sandwiching the imaging element unit 230 between them.

The image sensor unit 230 has an image sensor 231, an image sensor holder 232 that holds the image sensor 231, and a heat dissipation plate 250 held by the image sensor holder 232. The image sensor holder 232 has an opening in the center, and the image sensor 231 is held by being adhered to the image sensor holder 232 around the central opening with its imaging surface 231a exposed from the central opening toward the front side. An optical element 235 such as a low-pass filter that protects the image sensor 231 is placed in front of the central opening of the image sensor holder 232. However, the optical element 235 is not necessarily required.

The heat dissipation plate 250 is a sheet metal member having an inner surface 251 that faces the back surface of the image sensor 231. Note that the heat dissipation plate 250 may be a sheet metal member made of a magnetic metal material or a non-magnetic metal material.

The heat dissipation plate 250 is held in the image sensor holder 232 with screws or the like, with heat transfer rubber 260 sandwiched between the back surface of the image sensor 231 and the inner surface 251 of the heat dissipation plate. Three balls 211 (rolling members) are arranged around the image sensor 231 between the front plate 210 and the image sensor holder 232, surrounding the optical axis in a plane perpendicular to the optical axis. The three balls 211 roll freely, so that the image sensor unit 230 is held between the front plate 210 and the back plate 220 so that it can move (swing) in any direction in a plane perpendicular to the optical axis.

The image sensor holder 232 holds a magnet 233, which magnetically attracts the front plate 210, causing the front plate 210 and image sensor holder 232 to come into contact with each other via the ball 211. This determines the flange back position of the image sensor 231 in the imaging device 100 to be at a specified position.

Next, the configuration of the image stabilization drive unit 240 will be described. Magnet 241 is arranged on the front plate 210, and magnet 242 is arranged on the back plate 220, so that they face each other in the optical axis direction. In addition, coil 243 is arranged in the image sensor holder 232 at a position sandwiched between magnets 241 and 242. By supplying power to coil 243 from the power supply control unit 126, the magnetic field generated in coil 243 interacts with the magnetic fields of magnets 241 and 242, generating repulsive and attractive forces that control the oscillation of the image sensor unit 230. In other words, the front plate 210 and back plate 220 are fixed parts fixed to the housing of the imaging device 100, and support the image sensor unit 230 so that it can oscillate.

Generally, the system control unit 120 controls the driving of the image stabilization drive unit 240 so that the image sensor unit 230 is maintained at the center position of the image capture, and also performs swing control to displace the image sensor unit 230 in a direction that cancels out image shake of the imaging device 100.

The heat absorption unit 300 is positioned opposite the heat dissipation plate outer surface 252 of the heat dissipation plate 250 in the optical axis direction, and is attached to the rear plate 220. Figure 3 is a second diagram showing the structure of the imaging unit 200 and heat absorption unit 300. Figures 3(a) and 3(b) show a perspective view of the imaging unit 200 and an exploded perspective view of the heat absorption unit 300, respectively, with the imaging unit 200 and heat absorption unit 300 viewed from different directions in Figures 3(a) and 3(b).

The heat absorption unit 300 comprises a substrate 310, a first magnet 312, a second magnet 324, a third magnet 322, a heat absorption contact 320, a graphite sheet 330, and a coil 340.

The substrate 310 is a plate-like member made of a non-magnetic material, and is attached to and held by the rear plate 220. Therefore, the substrate 310 is held immovably relative to the housing of the imaging device 100 via the rear plate 220. A first magnet 312 is disposed on the substrate inner surface 311 of the substrate 310, which faces the heat dissipation plate outer surface 252 in the optical axis direction. The heat absorption contact 320 is a heat transfer member made of a non-magnetic metal material, has a generally flat plate shape, and is disposed between the heat dissipation plate outer surface 252 and the substrate inner surface 311. A second magnet 324 is disposed on the surface of the heat absorption contact 320 facing the substrate inner surface 311.

In the first imaging mode, which prioritizes image stabilization drive performance over heat absorption performance from the imaging unit 200, the first magnet 312 and the second magnet 324 are attracted to each other, thereby holding the heat absorption contact 320 to the base material 310. Note that the attracted state of the first magnet 312 and the second magnet 324 may be in contact with each other, or they may be attracted to each other with a certain gap between them. In this state, the heat absorption contact 320 is separated from the heat dissipation plate 250 and is held in a position by the base material 310, which is defined as "the heat absorption contact 320 being in the first position."

A hole shape 313 is formed in the substrate inner surface 311 of the substrate 310, and a convex shape 321 corresponding to the hole shape 313 is formed on the surface of the heat absorption contact 320 facing the substrate inner surface 311 in the optical axis direction. When the heat absorption contact 320 is in the first position, the hole shape 313 and the convex shape 321 engage, restricting movement of the heat absorption contact 320 in a direction perpendicular to the optical axis direction.

A third magnet 322 and a graphite sheet 330 are arranged on the surface of the heat-absorbing contact 320 that faces the heat-dissipating plate outer surface 252 of the heat-dissipating plate 250 in the optical axis direction. The graphite sheet 330 is strip-shaped, with one end connected to the heat-dissipating contact 320 and the other end connected to a part of the housing of the imaging device 100, thereby thermally connecting the heat-dissipating contact 320 to the housing. A magnet holding hole 253 is provided on the heat-dissipating plate outer surface 252 of the heat-dissipating plate 250 at a position corresponding to the third magnet 322, and a fourth magnet 350 (imaging unit side magnet) is adhered and held in the magnet holding hole 253.

In the second differential mode, which prioritizes heat absorption performance from the imaging unit 200 over image stabilization drive performance, the third magnet 322 and the fourth magnet 350 are attracted to each other, thereby holding the heat absorption contact 320 in contact with the heat dissipation plate 250. Note that the attracted state of the third magnet 322 and the fourth magnet 350 may be a state in which they are in contact with each other, or a state in which they are attracted to each other with a certain gap between them. In this state, the heat absorption contact 320 is spaced apart from the substrate 310 and in contact with the heat dissipation plate 250, which is defined as "the heat absorption contact 320 being in the second position."

The heat-absorbing contact 320 has a dowel shape 323 on the surface facing the heat-dissipating plate outer surface 252 of the heat-dissipating plate 250 in the optical axis direction, and the heat-dissipating plate outer surface 252 has a hole shape 254 that corresponds to the dowel shape 323. When the heat-absorbing contact 320 is in the second position in contact with the heat-dissipating plate 250, the dowel shape 323 and the hole shape 254 engage. Therefore, when the image sensor unit 230 is swung in the plane perpendicular to the optical axis, the heat-absorbing contact 320 also swung integrally with the image sensor unit 230 in the plane perpendicular to the optical axis.

The position of the heat-absorbing contact 320 is switched between the first position and the second position by passing current through the coil 340. To enable this switching, the coil 340 is positioned on the substrate 310 so as to face the third magnet 322 when the heat-absorbing contact 320 is in the first position. The coil 340 is an electromagnet, and generates a magnetic field to switch the position of the heat-absorbing contact 320 between the first position and the second position.

Next, the relationship between the position of the heat absorption contact 320 and the operation control of the coil 340 will be explained. Figure 4(a) is a rear view of the imaging unit 200 and the heat absorption unit 300. Figure 4(b) is a cross-sectional view taken along the arrow A-A in Figure 4(a) when the heat absorption contact 320 is in the first position. Figure 4(c) is a cross-sectional view taken along the arrow A-A in Figure 4(a) when the heat absorption contact 320 is in the second position.

As described above, when the heat-absorbing contact 320 is in the first position, the second magnet 324 arranged on the heat-absorbing contact 320 is attracted to the first magnet 312 arranged on the substrate 310 and held in contact with the substrate inner surface 311. In this state, an attractive force is also generated between the third magnet 322 held by the heat-absorbing contact 320 and the fourth magnet 350 held by the heat-dissipating plate 250, but the magnitude of this attractive force is greater than the attractive forces between the first magnet 312 and the second magnet 324. When the heat-absorbing contact 320 is in the first position, heat generated by the image sensor 231 is transferred to the heat-dissipating plate 250 via the heat-transfer rubber 260, and then to the image sensor holder 232 via the contact surface between the heat-dissipating plate 250 and the image sensor holder 232.

To switch the heat-absorbing contact 320 from the first position to the second position, current is supplied to the coil 340 while the image sensor unit 230 is in the reference position, generating a magnetic force F1 that acts as a repulsive force against the third magnet 322. Note that the image sensor unit 230 being in the reference position refers to the image sensor unit 230 being positioned so that the optical axis passes through the center of the imaging surface 231a of the image sensor 231. Due to the generation of magnetic force F1, the combined force of the attractive forces of the third magnet 322 and the fourth magnet 350 and magnetic force F1 becomes greater than the attractive forces of the first magnet 312 and the second magnet 324, causing the heat-absorbing contact 320 to move toward the heat dissipation plate 250. At this time, the hole 313 and the convex shape 321 are disengaged, and the hole 254 and the dowel shape 323 are engaged.

As described above, in the second position, the heat-absorbing contact 320 is held by adhesion to the heat-dissipating plate outer surface 252 of the heat-dissipating plate 250, with the graphite sheet 330 sandwiched between them. In the second position, compared to the first position, the distance between the third magnet 322 and the fourth magnet 350 is shorter, increasing the attractive force acting therebetween, while the distance between the first magnet 312 and the second magnet 324 is longer, decreasing the attractive force acting therebetween. As a result, the attractive force acting on the third magnet 322 and the fourth magnet 350 is greater than the attractive force acting on the first magnet 312 and the second magnet 324, and the heat-absorbing contact 320 remains attached to the heat-dissipating plate outer surface 252 even after current flow to the coil 340 is stopped.

When the heat-absorbing contact 320 is in the second position, in addition to the heat transfer path in the first position, heat generated by the image sensor 231 is transferred from the heat dissipation plate 250 to the housing of the image sensor 100 via the graphite sheet 330. As a result, when the heat-absorbing contact 320 is in the second position, more heat generated by the image sensor 231 can be dissipated to the housing of the image sensor 100 than when the heat-absorbing contact 320 is in the first position, making it possible to suppress temperature increases in the image sensor 231.

On the other hand, when the heat-absorbing contact 320 is in the second position, the weight of the heat-absorbing contact 320 and the reaction force of the graphite sheet 330 are applied to the image sensor unit 230. Therefore, it is undeniable that the responsiveness of the image sensor unit 230 to the oscillation control for image shake correction by the image shake correction drive unit 240 is lower than when the heat-absorbing contact 320 is in the first position. However, by increasing the driving force for oscillating the image sensor unit 230 in the second imaging mode in which the heat-absorbing contact 320 is in the second position compared to the first imaging mode in which the heat-absorbing contact 320 is in the first position during image shake correction control, the decrease in responsiveness can be suppressed. Note that, considering that the image shake correction performance is lower in the second imaging mode than in the first imaging mode, control may be performed to limit the range of selectable shooting parameters, such as by disabling the selection of slower shutter speeds. Making slow shutter speeds unselectable can be rephrased as making the lower limit of the selectable shutter speed shorter in the second imaging mode than in the first imaging mode.

When returning the heat-absorbing contact 320 from the second position to the first position, current is applied to the coil 340 so that a magnetic force F2 is generated in the opposite direction to that generated when the heat-absorbing contact 320 was moved from the first position to the second position. In other words, the heat-absorbing contact 320 can be returned to the first position by attracting the third magnet 322 to the coil 340, which functions as an electromagnet. After the heat-absorbing contact 320 has returned to the first position, even if current is turned off to the coil 340, the attractive force acting between the first magnet 312 and the second magnet 324 will hold the heat-absorbing contact 320 in the first position.

The mechanism for moving the heat absorption contact 320 between the first and second positions is not limited to the magnet and coil configuration described above, and other configurations may also be used. For example, the third magnet 322 held by the heat absorption contact 320 and the fourth magnet 350 and coil 340 held by the heat dissipation plate 250 may be eliminated. Instead, a rollable ball (rolling member) is sandwiched between the heat absorption contact 320 and the substrate 310, and the substrate 310 is not fixed to the imaging unit 200, allowing the entire heat absorption unit 300 to move in the optical axis direction by a specified drive device. Even with this configuration, the heat absorption contact 320 can move between the first and second positions, and when the heat absorption contact 320 is in the second position, the heat absorption contact 320 can oscillate integrally with the heat dissipation plate 250 in a plane perpendicular to the optical axis.

Next, we will explain the sequence of events from setting the imaging mode to capturing an image. Figure 5 is a flowchart explaining the imaging control of the imaging device 100. Each process (step) indicated by an S number in the flowchart of Figure 5 is realized by the system control unit 120 loading a predetermined program stored in the ROM of the memory 140 into the RAM of the memory 140 and comprehensively controlling the operation of each unit of the imaging device 100.

When the power switch 135 is turned on and the imaging device 100 starts up, in S501 the system control unit 120 sets the imaging mode to the first imaging mode, which is the default setting. In S502, the system control unit 120 determines whether a change to the second imaging mode has been accepted via the operation unit 130. If the system control unit 120 determines that a change to the second imaging mode has been accepted (YES in S502), the process proceeds to S503.

In S503, the system control unit 120 displays a warning on the display unit 150. The warning includes information that the image stabilization function will be partially restricted and that selectable shooting parameters will be partially restricted. In S504, the system control unit 120 energizes the coil 340 of the heat absorption unit 300, causing the heat absorption contact 320 to move from the first position to the second position. In S505, the system control unit 120 changes the control method so that the driving force of the image stabilization drive unit 240 is greater than that in the first imaging mode (changing the driving force of the image stabilization drive unit 240 from that in the first imaging mode to that in the second imaging mode).

In S506, the system control unit 120 determines whether a shooting instruction has been received via the operation unit 130. If the system control unit 120 determines that a shooting instruction has been received (YES in S506), the process proceeds to S507; if the system control unit 120 determines that a shooting instruction has not been received (NO in S506), the process proceeds to S509.

In S507, the system control unit 120 acquires an image (image capture processing). In S508, the system control unit 120 stores image data of the captured image acquired in S508 in the storage medium 500. In S509, the system control unit 120 determines whether a change to the first image capture mode has been accepted via the operation unit 130. If the system control unit 120 determines that a change to the first image capture mode has been accepted (YES in S509), the process proceeds to S510. In S510, the system control unit 120 energizes the coil 340 of the heat absorption unit 300 to move the heat absorption contact 320 from the second position to the first position. In S510, the system control unit 120 returns the image stabilization control method to the normal control method (changes the driving force of the image stabilization drive unit 240 from the driving force in the second image capture mode to the driving force in the first image capture mode), and then returns the process to S501.

If the system control unit 120 determines in S509 that a change to the first imaging mode has not been received (NO in S509), the process proceeds to S512. In S512, the system control unit 120 determines whether an imaging end instruction has been received via the operation unit 130. If the system control unit 120 determines that an imaging end instruction has been received (YES in S512), the process proceeds to S513. If the system control unit 120 determines that an imaging end instruction has not been received (NO in S512), the process returns to S506. An imaging end instruction is, for example, operation of the power switch 135 to turn off the imaging device 100. In S513, the system control unit 120 energizes the coil 340 of the heat absorption unit 300, moves the heat absorption contact 320 from the second position to the first position, and then terminates this process.

If the system control unit 120 determines in S502 that a change to the second imaging mode has not been accepted (NO in S502), the process proceeds to S514. The processes of S514 to S516 are the same as the processes of S506 to S508, and therefore will not be described here. The process of S517 is the same as the process of S512. If the system control unit 120 determines that an instruction to end imaging has been accepted (YES in S517), the process ends; if it determines that an instruction to end imaging has not been accepted (NO in S517), the process returns to S501.

In this way, by switching between the first and second imaging modes as needed depending on the imaging scene, the user can, for example, capture long video recordings while performing image stabilization, or obtain images with highly corrected image stabilization.

The present invention has been described in detail above based on preferred embodiments, but the present invention is not limited to these specific embodiments, and various forms within the scope of the gist of the invention are also included.

The present invention can also be realized by supplying a program that realizes one or more of the functions of the above-described embodiments to a system or device via a network or storage medium, and having one or more processors in the computer of that system or device read and execute the program. It can also be realized by a circuit (e.g., an ASIC) that realizes one or more functions.

REFERENCE SIGNS LIST 100 Imaging device 120 System control unit 200 Imaging unit 210 Front plate 220 Rear plate 230 Imaging element unit 231 Imaging element 240 Image blur correction drive unit 310 Base material 312 First magnet 320 Heat absorption contact 322 Third magnet 324 Second magnet 340 Coil 350 Fourth magnet

Claims (11)

An imaging element;
a movable section that holds the image sensor and is arranged to be swingable in a direction perpendicular to the photographing optical axis;
a fixed portion that supports the movable portion so that the movable portion can swing;
a drive unit that swings the movable unit;
a heat transfer member arranged to be movable in the optical axis direction;
an imaging device comprising: a control means for switching between a first imaging mode in which the movable part is capable of swinging while the heat transfer member is separated from the movable part, and a second imaging mode in which the heat transfer member is in contact with the movable part and is capable of swinging integrally with the movable part. The imaging device described in claim 1, characterized in that the control means makes the magnitude of the driving force applied by the drive unit to oscillate the movable unit in the second imaging mode greater than the magnitude of the driving force applied to oscillate the movable unit in the first imaging mode. The imaging device according to claim 1 or 2, wherein the control means limits the range of shooting parameters that can be set in the second imaging mode to a range that is more limited than the range of shooting parameters that can be set in the first imaging mode. the photographing parameter is a shutter speed,
4. The image pickup apparatus according to claim 3, wherein said control means sets the lower limit of the shutter speed in said second image pickup mode to be shorter than that in said first image pickup mode. The fixing portion is
a base material that holds the heat transfer member in a state where the heat transfer member is spaced apart from the movable portion;
a coil provided on the substrate;
a first magnet provided on the substrate;
the heat transfer member includes a second magnet and a third magnet;
the movable portion includes a fourth magnet provided on a back surface of the imaging element,
in the first imaging mode, the heat transfer member is held on the base by attraction between the first magnet and the second magnet;
5. The imaging device according to claim 1, wherein, when transitioning from the first imaging mode to the second imaging mode, the control unit causes a current to flow through the coil to generate a repulsive force between the coil and the third magnet, moves the third magnet toward the fourth magnet to attract the third magnet and the fourth magnet, and separates the first magnet and the second magnet, thereby bringing the heat transfer member into contact with the movable part. The imaging device described in claim 5, characterized in that the control means stops the flow of electricity to the coil after the heat transfer member transitions from being held by the base material to being in contact with the movable part. The imaging device described in claim 5 or 6, characterized in that, when transitioning from the second imaging mode to the first imaging mode, the control means passes a current through the coil to generate an attractive force between the coil and the third magnet, moving the third magnet toward the coil to separate the third magnet from the fourth magnet and attracting the first magnet to the second magnet, thereby holding the heat transfer member to the base material. The imaging device described in claim 7, characterized in that the control means stops the supply of electricity to the coil after the heat transfer member transitions from a state in contact with the movable part to a state in which it is held by the base material. a substrate that holds the heat transfer member;
a rolling member sandwiched between the base material and the heat transfer member;
a driving means for integrally moving the heat transfer member, the rolling member, and the base material along the photographing optical axis,
5. The imaging device according to claim 1, wherein the control means controls the driving of the driving means to move the heat transfer member, the rolling member, and the base material integrally along the imaging optical axis, thereby switching between the first imaging mode and the second imaging mode. An imaging device according to any one of claims 1 to 9, wherein the heat transfer member is thermally connected to the housing of the imaging device. An imaging element;
a movable section that holds the image sensor and is arranged to be swingable in a direction perpendicular to the photographing optical axis;
a fixed portion that supports the movable portion so that the movable portion can swing;
a drive unit that swings the movable unit;
a heat transfer member arranged to be movable in the optical axis direction, the control method for an imaging device comprising: a step of switching between a first imaging mode in which the movable part is capable of swinging while the heat transfer member is separated from the movable part, and a second imaging mode in which the heat transfer member is in contact with the movable part and is capable of swinging integrally with the movable part.