JP7793473B2 - Circulation device and method for controlling circulation device - Google Patents

Description

This disclosure relates to a circulation device and a control method thereof.

In the manufacturing process of semiconductor devices, the surface of a substrate such as a semiconductor wafer is treated with a chemical solution. Examples of such treatments include cleaning, and examples of such chemical solutions (hereinafter, also referred to as "treatment solutions," including rinse solutions and organic solvents) include acidic liquids.

For example, in a single-substrate processing apparatus, in which substrates are processed one at a time, the substrates are rotated while held substantially horizontally, and a processing liquid is supplied to the surface of the rotating substrate. This processing is carried out in a processing enclosure commonly known as a chamber.

After the processing liquid is supplied to the substrate, it is recovered and reused. Specifically, the processing liquid is supplied to the chamber, and after being used for processing, the processing liquid is recovered. This supply and recovery of the processing liquid is carried out by a circulation device installed outside the chamber.

When multiple chambers are provided, each is housed in a processing unit. The processing units are stacked in a roughly vertical direction and comprise a configuration commonly referred to as a tower. Multiple towers may be provided.

The supply of processing liquid from the circulation system and the recovery of processing liquid to the circulation system are performed for each tower. The supply and recovery of processing liquid to multiple chambers are performed for each tower.

The circulation device performs a circulation process (tentatively referred to as "external circulation") that supplies and recovers treatment liquid from the tower, as well as a circulation process (tentatively referred to as "internal circulation") that circulates treatment liquid within the circulation device without passing through the tower. External and internal circulation are achieved by squeezing out the treatment liquid using a pump.

External circulation and internal circulation for each of these towers are mentioned, for example, in Patent Document 1 below. Furthermore, the use of sulfuric acid as the treatment liquid is mentioned, for example, in Patent Document 2 below.

Furthermore, the discharge of processing liquid under its own weight is mentioned in the following Patent Documents 3, 4, and 5.

Japanese Patent Application Laid-Open No. 2021-052038 Japanese Patent Application Laid-Open No. 2020-088208 Japanese Patent Application Laid-Open No. 2021-174973 Patent No. 5860731 Japanese Patent Application Laid-Open No. 2021-44476

The trunk device has a storage tank that stores the treatment liquid. Whether external circulation or internal circulation is used, the treatment liquid is first stored in the storage tank.

Processing liquid is exchanged to increase its processing capacity. For convenience, this exchange is also referred to as "processing liquid exchange" below. Processing liquid exchange mainly involves discharging the processing liquid stored in the storage tank, and storing new processing liquid in the storage tank. Processing liquid remaining outside the storage tank, for example in the external circulation or internal circulation pathways, is also subject to discharge.

For example, when a magnetically levitated centrifugal pump is used, the presence of liquid at the pump's intake port effectively presses out the liquid. The treated liquid can also be discharged by its own weight, without the use of a pump. With gravity discharge, there is no need to use a pump to press out the treated liquid.

The amount of treatment liquid remaining in the external circulation path, for example the tower, and the temperature of the treatment liquid (hereinafter also referred to as "liquid temperature") will vary depending on the situation. The same applies to the internal circulation path.

When the temperature of the treatment liquid is low, the viscosity of the treatment liquid is high. In particular, the viscosity of sulfuric acid varies greatly depending on the temperature. For example, 98% concentrated sulfuric acid exhibits a high viscosity of 23.8×10 ⁻³ Pa·s at a temperature of 25°C, but the viscosity drops significantly to 4.1×10 ⁻³ Pa·s at a temperature of 100°C.

If the viscosity of the treatment liquid is high, it takes a long time for the treatment liquid to be discharged by its own weight. From the perspective of shortening the discharge time, it is desirable to have as few areas where the treatment liquid is discharged by its own weight as possible and to discharge the treatment liquid by squeezing it out with a pump.

The present disclosure was made in consideration of the above-mentioned issues and aims to provide technology for efficiently exchanging liquid in a circulation device.

A first aspect of the method for controlling a circulation device according to the present disclosure is a method for controlling a circulation device that supplies and recovers liquid to and from an external path. The circulation device includes a storage tank for storing the liquid; a first pipe having a first inlet end through which the liquid flows from the storage tank and used to supply the liquid; a first valve connected to the storage tank and controlling the discharge of the liquid from the storage tank to the outside of the circulation device; a pump provided in the first pipe, having an intake port connected to the first inlet end and an outlet port, and for compressing the liquid; a heater provided in the first pipe and connected to the outlet port, for heating the liquid; a second pipe having a second outlet end through which the liquid flows into the storage tank and used to recover the liquid; and a second pipe provided in the second pipe and connected to the second outlet end to the storage tank. a third pipe having a third outlet end through which the liquid is discharged into the storage tank and serving as a path for the liquid to be stored in the storage tank from a liquid supply source outside the circulation device; a third valve provided in the third pipe and controlling the flow of the liquid from the third outlet end to the storage tank; a fourth pipe connected to the second pipe on the opposite side of the second valve from the second outlet end and serving as a path for discharging the liquid from the second pipe to the outside of the circulation device; a fourth valve provided in the fourth pipe and controlling the discharge of the liquid; and a fifth valve connected to the discharge port and controlling the discharge of the liquid to the outside of the circulation device.

In this first aspect, the method includes a first step of stopping the pump, closing the third valve, and opening the first valve; a second step of stopping the pump, closing the third valve, and opening the second and fourth valves; a third step, after steps one and two, of stopping the pump, closing the first valve, and opening the third valve; and a fourth step, after step three, of closing the first and third valves, opening the fifth valve, and operating the pump.

A second aspect of the method for controlling a circulation device according to the present disclosure is the first aspect. In this second aspect, the circulation device further includes: a fifth pipe having a fifth outlet end through which the liquid flows into the storage tank and connected to the first pipe on the side of the heater opposite the pump; a sixth valve provided on the fifth pipe and controlling the outflow of the liquid from the fifth outlet end to the storage tank; a sixth pipe connected to the fifth pipe on the side opposite the sixth valve from the fifth outlet end and serving as a path for discharging the liquid from the fifth pipe to the outside of the circulation device; and a seventh valve provided on the sixth pipe and controlling the discharge of the liquid.

The method in this second aspect further includes a fifth step in which the sixth valve and the seventh valve are opened in the second step, and after the fourth step, the first valve, the third valve, the fifth valve, and the sixth valve are closed, the seventh valve is opened, and the pump is driven.

A third aspect of the circulation device control method according to the present disclosure is the second aspect. In this third aspect, the method further includes a sixth step, after the fifth step, of closing the first valve, the second valve, the third valve, the fifth valve, the sixth valve, and the seventh valve, opening the fourth valve, and driving the pump.

A fourth aspect of the circulation device control method according to the present disclosure is any one of the first, second, and third aspects. In this fourth aspect, the circulation device further includes a flow meter disposed between the first inlet end and the suction port, which measures the flow rate of the liquid. In this fourth aspect, the time at which the fourth step ends is determined based on the flow rate.

A fifth aspect of the method for controlling a circulation device according to the present disclosure is the second or third aspect. In this fifth aspect, the circulation device further includes a flow meter disposed between the first inlet end and the suction port, which measures the flow rate of the liquid. In this fifth aspect, the time at which the fifth step ends is determined based on the flow rate.

A sixth aspect of the method for controlling a circulation device according to the present disclosure is the third aspect. In this sixth aspect, the circulation device further includes a flow meter disposed between the first inlet end and the suction port, which measures the flow rate of the liquid. In this sixth aspect, the time at which the sixth step ends is determined based on the flow rate.

A first aspect of the circulation device according to the present disclosure is a circulation device that supplies and recovers a liquid to an external path, and includes: a storage tank that stores the liquid; a first pipe that has a first inlet end through which the liquid flows from the storage tank and is used to supply the liquid; a first valve that is connected to the storage tank and controls the discharge of the liquid from the storage tank to the outside of the circulation device; a pump that is provided in the first pipe and has an intake port connected to the first inlet end and an outlet port and that presses out the liquid; a heater that is provided in the first pipe and connected to the outlet port and that heats the liquid; a second pipe that has a second outlet end through which the liquid flows into the storage tank and is used to recover the liquid; and a valve that is provided in the second pipe and has a pre-flow valve that flows from the second outlet end to the storage tank. The circulation system includes a second valve that controls the outflow of the liquid; a third pipe having a third outlet end through which the liquid flows into the storage tank and which is a path for the liquid to flow from a liquid supply source outside the circulation device to the storage tank; a third valve that is provided in the third pipe and controls the outflow of the liquid from the third outlet end to the storage tank; a fourth pipe that is connected to the second pipe on the opposite side of the second valve from the second outlet end and is a path for discharging the liquid from the second pipe to the outside of the circulation device; a fourth valve that is provided in the fourth pipe and controls the discharge of the liquid; a fifth valve that is connected to the outlet and controls the discharge of the liquid to the outside of the circulation device; and a control unit that controls the first valve, the second valve, the third valve, the fourth valve, the pump, and the heater.

In the first aspect, the control unit stops the pump, closes the third valve, and opens the first valve during a first period; stops the pump, closes the third valve, and opens the second and fourth valves during a second period; stops the pump, closes the first valve, and opens the third valve during a third period after the first and second periods; and closes the first and third valves and opens the fifth valve during a fourth period after the third period, and drives the pump.

A second aspect of the circulation device according to the present disclosure is the first aspect, further comprising: a fifth pipe having a fifth outlet end through which the liquid flows out into the storage tank and connected to the first pipe on the side of the heater opposite the pump; a sixth valve provided on the fifth pipe and controlling the outflow of the liquid from the fifth outlet end to the storage tank; a sixth pipe connected to the fifth pipe on the side opposite the sixth valve from the fifth outlet end and serving as a path for discharging the liquid from the fifth pipe to the outside of the circulation device; and a seventh valve provided on the sixth pipe and controlling the discharge of the liquid.

In the second aspect, the control unit opens the sixth valve and the seventh valve during the second period, and closes the first valve, the third valve, the fifth valve, and the sixth valve, opens the seventh valve, and drives the pump during a fifth period following the fourth period.

A third aspect of the circulation device disclosed herein is the second aspect, wherein, during a sixth period following the fifth period, the control unit closes the first valve, the second valve, the third valve, the fifth valve, the sixth valve, and the seventh valve, opens the fourth valve, and drives the pump.

A fourth aspect of the circulation device according to the present disclosure is any one of the first, second, and third aspects, further comprising a flow meter disposed between the first inlet end and the suction port, for measuring the flow rate of the liquid. The time at which the fourth period ends is determined based on the flow rate.

A fifth aspect of the circulation device according to the present disclosure is the second or third aspect, further comprising a flow meter disposed between the first inlet end and the suction port, for measuring the flow rate of the liquid. The time at which the fifth period ends is determined based on the flow rate.

A sixth aspect of the circulation device according to the present disclosure is the third aspect, further comprising a flow meter disposed between the first inlet end and the suction port, for measuring the flow rate of the liquid. The end of the sixth period is determined based on the flow rate.

According to the first aspect of the circulation device control method and the first aspect of the circulation device disclosed herein, regardless of whether a magnetically levitated centrifugal pump is used as the pump, the treatment liquid is replaced in the reservoir T and in the section of the first piping from the first inlet end to the position where the fifth valve is provided. Replacing the liquid by using pressure from the pump contributes to efficient liquid exchange.

According to the second aspect of the circulation device control method and the second aspect of the circulation device disclosed herein, the treatment liquid is replaced in the section of the first piping from the position where the fifth valve is provided to the point where the fifth piping is connected to the first piping.

According to a third aspect of the circulation device control method and a third aspect of the circulation device disclosed herein, the treatment liquid in the liquid path supplied from the first pipe and recovered from the second pipe is replaced.

According to the fourth to sixth aspects of the circulation device control method of the present disclosure, and the fourth to sixth aspects of the circulation device of the present disclosure, the time at which the liquid has been replaced is less affected by the temperature of the old liquid before replacement. This reduces the possibility of overestimating the time required to replace the liquid, contributing to efficient liquid replacement.

1 is a cross-sectional view schematically showing a substrate processing apparatus. 1 is a vertical cross-sectional view schematically showing a substrate processing apparatus. FIG. 3 is a longitudinal cross-sectional view schematically showing a longitudinal cross-section of the substrate processing apparatus taken along line III-III. FIG. 10 is a side view schematically illustrating an example of a configuration of the left part of the processing block as viewed in the left direction. FIG. 10 is a side view schematically illustrating an example of a configuration of the right part of the processing block as viewed in the right direction. FIG. 2 is a cross-sectional view schematically showing the configuration of a processing unit. FIG. 2 is a vertical cross-sectional view schematically showing the configuration of a processing unit. FIG. 2 is a block diagram showing a functional configuration for controlling the operation of each component of the substrate processing apparatus. FIG. 2 is a block diagram showing an example of the configuration of a control unit. FIG. 2 is a piping diagram illustrating the configuration of a circulation device. FIG. 10 is a diagram illustrating the configuration of an external path outside the circulation device. FIG. 2 is a block diagram showing an outline of the functions of a control unit. FIG. 2 is a piping diagram illustrating the configuration of a circulation device. FIG. 2 is a piping diagram illustrating the configuration of a circulation device. FIG. 2 is a piping diagram illustrating the configuration of a circulation device. FIG. 2 is a piping diagram illustrating the configuration of a circulation device. FIG. 2 is a piping diagram illustrating the configuration of a circulation device. FIG. 2 is a piping diagram illustrating the configuration of a circulation device. FIG. 2 is a piping diagram illustrating the configuration of a circulation device. 10 is a flowchart illustrating an operation of exchanging a treatment liquid.

Embodiments of the present disclosure will be described below with reference to the accompanying drawings. The components described in each embodiment are merely examples, and the scope of the present disclosure is not intended to be limited to these examples. The drawings are shown only in a schematic manner. In the drawings, the dimensions and number of parts may be exaggerated or simplified as necessary to facilitate understanding. In the drawings, parts with similar configurations and functions are designated by the same reference numerals, and duplicate explanations will be omitted where appropriate.

In the following explanation, a right-handed XYZ Cartesian coordinate system is used to explain the positional relationships of each element. Specifically, it is assumed that the X and Y axes extend horizontally, and the Z axis extends vertically (up and down). In the drawings, the direction in which the tip of the arrow points is indicated as the + (plus) direction, and the opposite direction as the - (minus) direction. Specifically, the vertically upward direction is the +Z direction, and the vertically downward direction is the -Z direction.

In this specification, unless otherwise specified, expressions indicating relative or absolute positional relationships (e.g., "parallel," "orthogonal," "center") not only indicate that positional relationship precisely, but also indicate a state that includes tolerances and a state in which the same level of functionality is achieved when the relative angles or distances are displaced to the extent that the same level of functionality is achieved. Expressions indicating that two or more things are in an equal state (e.g., "identical," "equal," "homogeneous"), unless otherwise specified, not only indicate a state in which they are strictly quantitatively equal, but also indicate a state in which there is a tolerance or a difference that allows the same level of functionality to be achieved.

Unless otherwise specified, expressions indicating shape (such as "rectangular" or "cylindrical") not only refer to the strict geometric shape, but also to shapes that have irregularities or chamfers, for example, to the extent that a similar effect is achieved.

The expressions "comprise," "include," "have," "includes," or "have" of one element are not exclusive expressions that exclude the presence of other elements.

Unless otherwise specified, the term "connected" refers to a state in which two elements are in contact with each other, as well as a state in which two elements are separated by another element.

Unless otherwise specified, "moving" in a certain direction may include not only moving parallel to that direction, but also moving in a direction that has a component in that direction.

<1. Configuration of substrate processing apparatus>
Fig. 1 is a cross-sectional view schematically showing a substrate processing apparatus 790. Fig. 2 is a longitudinal cross-sectional view schematically showing a longitudinal section of the substrate processing apparatus 790 along the front-rear direction (±X direction).

The substrate processing apparatus 790 processes substrates (e.g., semiconductor wafers) W using a processing liquid that is supplied to and recovered from the circulation apparatus according to the present disclosure. The circulation apparatus and its control method will be described in detail below. The circulation apparatus and substrate processing apparatus 790 may be collectively referred to as a substrate processing system.

The substrate W may be, for example, a thin, flat plate having an approximately disk shape. In FIG. 1, the outer edges of the substrate W stored in the carrier C described below and the outer edges of the substrate W held by the holder 711 described below are both indicated by dashed lines.

The substrate processing apparatus 790 includes, for example, an indexer unit 792 and a processing block 793. The processing block 793 is connected to the indexer unit 792.

The indexer unit 792 and the processing block 793 are aligned horizontally. The indexer unit 792, for example, supplies substrates W to the processing block 793. The processing block 793, for example, processes the substrates W. The indexer unit 792, for example, retrieves the substrates W from the processing block 793.

For convenience, in this specification, the horizontal direction in which the indexer unit 792 and processing block 793 are aligned is referred to as the ±X direction (also referred to as the front-to-back direction). Within the ±X direction (front-to-back direction), the direction from the processing block 793 to the indexer unit 792 is referred to as the -X direction (also referred to as the front direction or forward), and the direction from the indexer unit 792 to the processing block 793 is referred to as the +X direction (also referred to as the rear direction or backward).

The horizontal direction perpendicular to the ±X directions (front-to-back directions) is taken as the ±Y direction (also called the width direction). Within the ±Y directions (width directions), the direction toward the right when facing the -X direction (front direction) is taken as the +Y direction (also called the right direction or rightward), and the direction toward the left when facing the -X direction (front direction) is taken as the -Y direction (also called the left direction or leftward).

Directions perpendicular to the horizontal direction are taken to be the ±Z directions (also called the up-down direction). Within the ±Z directions (up-down direction), the direction of gravity is taken to be the -Z direction (also called the down direction or lower), and the direction opposite to the direction of gravity is taken to be the +Z direction (also called the up direction or upper). When no particular distinction is made between front, rear, right, and left, these are all simply referred to as sides.

<1-1. Configuration of the indexer section>
As shown in FIG. 1, the indexer section 792 includes a plurality of (e.g., four) carrier placement sections 721, a transport space 722, and one or more (e.g., one) first transport mechanisms (also referred to as indexer mechanisms) 723.

Multiple carrier placement sections 721 are arranged in the width direction (±Y direction). One carrier C is placed on each carrier placement section 721. The carrier C stores multiple substrates W. For example, a FOUP (front opening unified pod) is used as the carrier C.

The transport space 722 is located behind the carrier placement section 721 (+X direction). The transport space 722 extends in the width direction (±Y direction). The first transport mechanism 723 is located in the transport space 722.

The first transport mechanism 723 is located behind (in the +X direction) the carrier placement unit 721. The first transport mechanism 723 transports substrates W. The first transport mechanism 723 accesses the carriers C placed on the carrier placement unit 721.

The first transport mechanism 723 includes a hand 7231 and a hand driver 7232. The hand 7231 supports one substrate W in a horizontal position. The hand driver 7232 is connected to the hand 7231 and moves the hand 7231. Specifically, the hand driver 7232 moves the hand 7231 in the front-to-back directions (±X directions), width directions (±Y directions), and up-down directions (±Z directions). The hand driver 7232 has multiple electric motors.

As shown in Figures 1 and 2, the hand drive unit 7232 includes, for example, a rail 7232a, a horizontal movement unit 7232b, a vertical movement unit 7232c, a rotation unit 7232d, and an advance/retreat movement unit 7232e.

The rail 7232a is fixed, for example, to the bottom of the transport space 722. The rail 7232a extends in the width direction (±Y direction).

The horizontal movement section 7232b is supported by the rail 7232a. The horizontal movement section 7232b moves in the width direction (±Y direction) relative to the rail 7232a.

The vertical movement section 7232c is supported by the horizontal movement section 7232b. The vertical movement section 7232c moves up and down relative to the horizontal movement section 7232b.

The rotating part 7232d is supported by the vertical moving part 7232c. The rotating part 7232d rotates relative to the vertical moving part 7232c. The rotating part 7232d rotates around the rotation axis A1. The rotation axis A1 is an imaginary line extending in the vertical direction.

The advancing/retreating unit 7232e moves relative to the rotating unit 7232d. The advancing/retreating unit 7232e moves back and forth along a horizontal direction determined by the orientation of the rotating unit 7232d. The advancing/retreating unit 7232e is connected to the hand 7231.

This hand driver 7232 enables the hand 7231 to move in parallel in the vertical direction, in any horizontal direction, and rotate around the rotation axis A1.

<1-2. Processing block configuration>
Fig. 3 is a longitudinal cross-sectional view schematically illustrating an example of the longitudinal cross-section of the substrate processing apparatus 790 taken along line III-III in Fig. 1, viewed from the rear (+X direction). Fig. 4 is a side view schematically illustrating an example of the configuration of the left (-Y direction) portion (also referred to as the left part) of the processing block 793, viewed from the left (-Y direction). Fig. 5 is a side view schematically illustrating an example of the configuration of the right (+Y direction) portion (also referred to as the right part) of the processing block 793, viewed from the right (+Y direction).

For example, as shown in Figures 1 to 5, the processing block 793 includes two transport spaces 74A, 74B, two second transport mechanisms 75A, 75B, a plurality of (here, 24) processing units 76, two substrate placement units 77A, 77B, one partition wall 73w, and a horizontal exhaust system 780.

The transport space 74A is located in the center of the processing block 793 in the width direction (±Y direction). The transport space 74A extends in the front-to-rear direction (±X direction). The front portion (also referred to as the front part) of the transport space 74A is connected to the transport space 722 of the indexer section 792.

Transport space 74B has approximately the same shape as transport space 74A. Specifically, transport space 74B is located in the center of processing block 793 in the width direction (±Y direction). Transport space 74B extends in the front-to-rear direction (±X direction). The front portion (also referred to as the front part) of transport space 74B is connected to transport space 722 of indexer section 792.

Transport space 74B is located below transport space 74A. Transport space 74B is located so as to overlap transport space 74A in a plan view. When transport spaces 74A and 74B are not distinguished from each other, they are both simply referred to as transport space 74.

Partition wall 73w has, for example, a horizontal plate shape. Partition wall 73w is located below transport space 74A and above transport space 74B. Partition wall 73w separates transport space 74A from transport space 74B.

The substrate placement unit 77A is located in the transport space 74A. The substrate placement unit 77A is located at the front of the transport space 74A. The first transport mechanism 723 of the indexer unit 792 also accesses the substrate placement unit 77A. One or more substrates W are placed on the substrate placement unit 77A.

Substrate placement section 77B is located in transport space 74B. Substrate placement section 77B is located below substrate placement section 77A. Substrate placement section 77B is located at the front of transport space 74B. Substrate placement section 77B is positioned so as to overlap substrate placement section 77A in a plan view. Substrate placement section 77B is positioned in the same position as substrate placement section 77A in a plan view.

The first transport mechanism 723 of the indexer unit 792 also accesses the substrate placement unit 77B. One or more substrates W are placed on the substrate placement unit 77B. When the substrate placement units 77A and 77B are not distinguished from each other, they are both simply referred to as the substrate placement unit 77.

The second transport mechanism 75A is located in the transport space 74A. The second transport mechanism 75A transports substrates W. The second transport mechanism 75A has access to the substrate placement unit 77A.

The second transport mechanism 75B is located in the transport space 74B. The second transport mechanism 75B transports substrates W. The second transport mechanism 75B has the same structure as the second transport mechanism 75A. The second transport mechanism 75B accesses the substrate placement unit 77B. When the second transport mechanisms 75A and 75B are not distinguished from each other, they are both simply referred to as the second transport mechanism 75.

Each of the second transport mechanisms 75 includes a hand 751 and a hand driver 752. The hand 751 supports one substrate W in a horizontal position. The hand driver 752 is connected to the hand 751. The hand driver 752 moves the hand 751 in the front-to-rear directions (±X directions), width directions (±Y directions), and up-down directions. The hand driver 752 includes multiple electric motors.

Specifically, the hand drive unit 752 includes, for example, two support columns 752a, a vertical movement unit 752b, a horizontal movement unit 752c, a rotation unit 752d, and an advance/retract movement unit 752e.

The two support pillars 752a are fixed, for example, to the side of the transport space 722. The two support pillars 752a are aligned in the front-to-rear direction (±X direction). Each support pillar 752a extends in the up-down direction.

The vertical movement unit 752b is supported by two support columns 752a. The vertical movement unit 752b extends in the front-to-rear direction (±X direction) and is installed between the two support columns 752a. The vertical movement unit 752b moves up and down relative to the two support columns 752a.

The horizontal movement unit 752c is supported by the vertical movement unit 752b. The horizontal movement unit 752c moves in the front-to-back direction (±X direction) relative to the vertical movement unit 752b. The horizontal movement unit 752c moves in the front-to-back direction (±X direction) between the two support columns 752a.

The rotating part 752d is supported by the horizontal moving part 752c. The rotating part 752d rotates relative to the horizontal moving part 752c. The rotating part 752d rotates around the rotation axis A2. The rotation axis A2 is an imaginary line extending in the vertical direction.

The advancing/retreating unit 752e moves relative to the rotating unit 752d. The advancing/retreating unit 752e moves back and forth horizontally in a direction determined by the orientation of the rotating unit 752d. The advancing/retreating unit 752e is connected to the hand 751.

This hand drive unit 752 allows the hand 751 to perform translational movement in the vertical direction, translational movement in any horizontal direction, and rotational movement around the rotation axis A2.

Each of the 24 processing units 76 performs a predetermined process on the substrates W transported by the second transport mechanism 75.

Processing block 793 includes six processing units 76A, six processing units 76B, six processing units 76C, and six processing units 76D. When processing units 76A, 76B, 76C, and 76D are not distinguished from one another, they are all simply referred to as processing units 76.

The six processing units 76A are positioned so that they are stacked vertically. In other words, the six processing units 76A are lined up in a row vertically. The six processing units 76B are positioned so that they are stacked vertically. In other words, the six processing units 76B are lined up in a row vertically. The six processing units 76C are positioned so that they are stacked vertically. In other words, the six processing units 76C are lined up in a row vertically. The six processing units 76D are positioned so that they are stacked vertically. In other words, the six processing units 76D are lined up in a row vertically.

Each of the six processing units 76A, six processing units 76B, six processing units 76C, and six processing units 76D is included in the towers mentioned above (here, four towers).

The six processing chambers 761 in the six processing units 76A are stacked vertically. The six processing chambers 761 in the six processing units 76B are stacked vertically. The six processing chambers 761 in the six processing units 76C are stacked vertically. The six processing chambers 761 in the six processing units 76D are stacked vertically.

The six processing units 76A and six processing units 76B are located to the left (-Y direction) of the transport spaces 74A and 74B. The six processing units 76A and six processing units 76B are aligned in the front-to-back direction (±X direction) along the transport spaces 74A and 74B. The six processing units 76B are located behind the six processing units 76A (+X direction).

The six processing units 76C and the six processing units 76D are located to the right (+Y direction) of the transport spaces 74A and 74B. The six processing units 76C and the six processing units 76D are aligned in the front-to-back direction (±X direction) along the transport spaces 74A and 74B. The six processing units 76D are located behind the six processing units 76C (+X direction).

The six processing units 76A and the six processing units 76C face each other across the transport spaces 74A and 74B. The six processing units 76B and the six processing units 76D face each other across the transport spaces 74A and 74B.

The second transport mechanism 75 accesses the holder 711 of the processing unit 76. The second transport mechanism 75A, located above the partition wall 73w, transports substrates W to the upper 12 of the 24 processing units 76 (4 units x upper 3 tiers) and unloads the substrates W from these upper 12 processing units 76. The second transport mechanism 75B, located below the partition wall 73w, transports substrates W to the lower 12 of the 24 processing units 76 (4 units x lower 3 tiers) and unloads the substrates W from these lower 12 processing units 76.

<1-3. Configuration of processing unit>
6 is a cross-sectional view showing a schematic configuration of the processing unit 76, taking the processing unit 76A as an example. Each processing chamber 761 is adjacent to the transfer space 74.

Figure 7 is a vertical cross-sectional view showing the general configuration of the processing unit 76, using processing unit 76C as an example.

As shown in Figures 6 and 7, each processing unit 76 includes a processing chamber 761 (also referred to as a chamber or processing housing), a supply pipe space 762, and an exhaust pipe space 763. For example, multiple processing units 76 have the same structure.

<1-4. Configuration of the processing chamber>
The processing chamber 761 has, for example, a substantially box shape. The processing chamber 761 has, for example, a substantially rectangular shape in plan view, front view, and side view. The processing chamber 761 has a processing space 761s therein. The processing unit 76 processes the substrate W in the processing space 761s. In Figure 6, the outer edge of the substrate W held by the holder 711 is indicated by a dashed line.

The processing chamber 761 has a substrate transfer opening 761o on the transfer space 74 side. The substrate transfer opening 761o is formed in the side wall of the processing chamber 761. The substrate transfer opening 761o is sized to allow a substrate W to pass through. The second transport mechanism 75 moves the substrate W between the outside of the processing chamber 761 (specifically, the transfer space 74) and the inside of the processing chamber 761 (specifically, the processing space 761s) via the substrate transfer opening 761o. Each processing unit 76 has a shutter (not shown) that opens and closes the substrate transfer opening 761o.

Each processing unit 76 includes, for example, a holding section 711 and a fluid supply section 712.

The holder 711 is located inside the processing chamber 761. The holder 711 holds a substrate W. More specifically, the holder 711 holds one substrate W in a horizontal position. The holder 711 includes a part (also referred to as a drive part) that rotates the substrate W held by the holder 711, for example, around an imaginary rotation axis A3 along the vertical direction.

A spin chuck is used for the holder 711. The spin chuck rotates the substrate W, for example, around a rotation axis A3 that passes through the center of the substrate W and extends in the vertical direction.

Specifically, the spin chuck includes a chuck pin (chuck member) 711p, a spin base 711b, a rotation shaft 711s connected to the center of the underside of the spin base 711b, and an electric motor 711m as a drive unit that applies rotational force to the rotation shaft 711s.

The rotation shaft 711s extends vertically along the rotation axis A3. For example, the rotation shaft 711s is a hollow shaft.

A spin base 711b is coupled to the upper end of the rotation shaft 711s. The spin base 711b has a horizontally aligned disk shape. In a plan view, the spin base 711b is circular, centered on the rotation axis A3, and has a diameter larger than the diameter of the substrate W. A plurality of (e.g., six) chuck pins 711p are positioned circumferentially spaced apart around the periphery of the upper surface of the spin base 711b.

The multiple chuck pins 711p can be opened and closed between a closed state in which they contact the peripheral edge of the substrate W to grip the substrate W, and an open state in which they are retracted from the peripheral edge of the substrate W. In the open state, for example, the multiple chuck pins 711p contact the underside of the peripheral edge of the substrate W to support the substrate W from below.

The chuck pin 711p is driven to open and close by a unit including, for example, a link mechanism built into the spin base 711b and a drive source located outside the spin base 711b. The drive source includes, for example, a ball screw mechanism and an electric motor that provides driving force to the ball screw mechanism.

Each processing unit 76 includes, for example, a heater unit 719. The heater unit 719 is located above the spin base 711b. An elevator shaft 719r extending vertically along the rotation axis A3 is coupled to the underside of the heater unit 719.

The lifting shaft 719r is inserted through a through-hole that passes vertically through the center of the spin base 711b and through a hollow portion that passes vertically through the rotation shaft 711s.

The lower end of the lift shaft 719r extends further downward than the lower end of the rotation shaft 711s. A lift unit 719m is connected to the lower end of the lift shaft 719r. By operating the lift unit 719m, the heater unit 719 moves up and down between a lower position close to the upper surface of the spin base 711b and an upper position where it supports the lower surface of the substrate W and lifts the substrate W from the chuck pins 711p.

The lifting unit 719m includes, for example, a ball screw mechanism and an electric motor that provides driving force to the ball screw mechanism. This allows the lifting unit 719m to position the heater unit 719 at any intermediate position between the lower and upper positions.

For example, the heating surface 719u, which is the upper surface of the heater unit 719, can be positioned at a distance with a predetermined gap between it and the underside of the substrate W, and the substrate W can be heated by radiant heat from the heating surface 719u. For example, if the substrate W is lifted by the heater unit 719, the heating surface 719u can be brought into contact with the underside of the substrate W, and the substrate W can be heated with a greater amount of heat by heat conduction from the heating surface 719u.

The heater unit 719 has the form of a disk-shaped hot plate. The heater unit 719 includes a plate body, multiple support pins, and a heater. The upper surface of the plate body is a flat surface that lies along a horizontal plane. In a plan view, the plate body has a circular shape similar to that of the substrate W and a diameter slightly smaller than that of the substrate W.

The outer peripheral edge of the plate body is located inside the multiple chuck pins 711p. In other words, the plate body is surrounded by the multiple chuck pins 711p in the horizontal direction. This prevents the heater unit 719 from interfering with the chuck pins 711p when the heater unit 719 moves up and down.

Each of the multiple support pins is, for example, a hemispherical pin positioned so as to protrude slightly upward from the upper surface of the plate body. The multiple support pins are arranged approximately evenly on the upper surface of the plate body. There may not be multiple support pins on the upper surface of the plate body (heating surface 719u).

For example, when multiple substrates W are supported in contact with the support pins, the lower surfaces of the substrates W and the upper surface of the plate body (heating surface 719u) face each other with a small gap between them. This allows the heater unit 719 to heat the substrates W efficiently and uniformly.

The heater may be, for example, a resistor built into the plate body. The upper surface of the plate body (heating surface 719u) can be heated to a temperature higher than the boiling point of the organic solvent by, for example, passing electricity through the heater. The power supply line to the heater is passed through the lift shaft 719r. The power supply line is connected to a power supply unit 719e that supplies power to the heater.

Each processing unit 76 includes, for example, a cylindrical cup 717 surrounding the holder 711 inside the processing chamber 761.

The fluid supply unit 712 supplies, for example, multiple types of fluids to the substrate W held by the holder 711. The multiple types of fluids include, for example, processing liquids such as chemical liquids, rinse liquids, and organic solvents. The chemical liquids include, for example, etching liquids and cleaning liquids. The chemical liquids used include, for example, acidic liquids (acid-based liquids) and alkaline liquids (alkaline-based liquids).

The acidic solution may contain, for example, at least one of hydrofluoric acid (hydrofluoric acid), a mixture of hydrochloric acid and hydrogen peroxide (SC2), sulfuric acid, sulfuric acid and hydrogen peroxide (SPM), hydrofluoric nitric acid (a mixture of hydrofluoric acid and nitric acid), and hydrochloric acid.

The alkaline solution may include, for example, at least one of ammonia hydrogen peroxide solution (SC1), ammonia water, ammonium fluoride solution, and tetramethylammonium hydroxide (TMAH).

The rinse liquid is, for example, a liquid used to wash away chemicals on the substrate W. For example, deionized water (DIW) is used as the rinse liquid.

The organic solvent is, for example, a liquid used to remove the rinse liquid from the substrate W. For example, isopropyl alcohol (IPA) is used as the organic solvent.

The multiple fluids include, for example, gases such as inert gases. Examples of inert gases include nitrogen gas.

The fluid supply unit 712 includes, for example, a first mobile nozzle 71n, a second mobile nozzle 72n, and a third mobile nozzle 73n, each of which ejects a specific fluid.

The first movable nozzle 71n is moved horizontally by the first moving unit 71M. By moving horizontally, the first movable nozzle 71n can be moved between a position facing the center of rotation of the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "first discharge position") and a position not facing the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "first home position").

The first discharge position may be, for example, a position where the first processing liquid discharged from the first movable nozzle 71n lands on the center of rotation of the upper surface of the substrate W. The first home position is a position outside the holder 711 in a planar view. More specifically, the first home position may be a position outside the cup 717 in a planar view.

The first moving nozzle 71n may be moved up or down by the first moving unit 71M to approach the upper surface Wa of the substrate W held by the holder 711, or may be moved upward away from the upper surface Wa of the substrate W held by the holder 711.

The first moving unit 71M includes, for example, a first rotating shaft 71s extending vertically, a first arm 71a connected to the first rotating shaft 71s and extending horizontally, and a first arm driving mechanism 71m that drives the first arm 71a.

The first arm drive mechanism 71m swings the first arm 71a by rotating the first rotation shaft 71s around a virtual rotation axis A4 that extends in the vertical direction. The first movable nozzle 71n is attached to a location on the first arm 71a that is horizontally spaced from the rotation axis A4.

In response to the swinging of the first arm 71a, the first movable nozzle 71n moves along an arc-shaped trajectory in the horizontal direction, as indicated by the two-dot chain arrow in Figure 6. The first arm drive mechanism 71m may move the first arm 71a up and down, for example, by raising and lowering the first rotation shaft 71s in the vertical direction.

The first movable nozzle 71n has the function of supplying a first processing liquid (also referred to as the first treatment liquid) to the upper surface Wa of the substrate W held by the holder 711. A first processing liquid supply pipe P1, which functions as a pipe for supplying the first treatment liquid, is connected to the first movable nozzle 71n.

A first processing liquid on-off valve V1 is installed in the first processing liquid supply pipe P1, functioning as a valve for opening and closing the flow path of the first processing liquid supply pipe P1. The first processing liquid supply pipe P1 is supplied with the first processing liquid from the processing liquid distribution unit 701 or processing liquid distribution unit 702, which will be described later. Here, an acidic liquid such as sulfuric acid (HSO) is used as the first processing liquid. The first moving nozzle 71n may be a straight nozzle that ejects the first processing liquid, or a two-fluid nozzle that ejects a mixture of the first processing liquid and an inert gas.

The second movable nozzle 72n is moved horizontally by the second moving unit 72M. By moving horizontally, the second movable nozzle 72n can be moved between a position facing the center of rotation of the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "second discharge position") and a position not facing the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "second home position").

The second discharge position may be, for example, a position where the second processing liquid discharged from the second movable nozzle 72n lands on the center of rotation of the upper surface of the substrate W. The second home position is a position outside the holder 711 in a planar view. More specifically, the second home position may be a position outside the cup 717 in a planar view.

The second moving nozzle 72n may be moved up or down by the second moving unit 72M to approach the upper surface Wa of the substrate W held by the holder 711, or may be moved upward away from the upper surface Wa of the substrate W held by the holder 711.

The second moving unit 72M includes, for example, a second rotation shaft 72s extending vertically, a second arm 72a connected to the second rotation shaft 72s and extending horizontally, and a second arm drive mechanism 72m that drives the second arm 72a.

The second arm drive mechanism 72m swings the second arm 72a by rotating the second rotation shaft 72s around a virtual rotation axis A5 that extends in the vertical direction. The second movable nozzle 72n is attached to the second arm 72a at a location horizontally spaced from the rotation axis A5.

In response to the swinging of the second arm 72a, the second movable nozzle 72n moves along an arc-shaped trajectory in the horizontal direction, as indicated by the two-dot chain arrow in Figure 6. The second arm drive mechanism 72m may move the second arm 72a up and down, for example, by raising and lowering the second rotation shaft 72s in the vertical direction.

The second moving nozzle 72n has the function of supplying a second processing liquid (also referred to as the second processing liquid) to the upper surface Wa of the substrate W held by the holder 711. A second processing liquid supply pipe P2, which functions as a pipe for supplying the second processing liquid, is connected to the second moving nozzle 72n.

A second processing liquid on-off valve V2 is installed in the second processing liquid supply pipe P2, functioning as a valve for opening and closing the flow path of the second processing liquid supply pipe P2. The second processing liquid is supplied to the second processing liquid supply pipe P2 from the processing liquid distribution unit 701 or the processing liquid distribution unit 702, which will be described later. Here, an alkaline liquid such as ammonia-hydrogen peroxide solution (SC1) is used as the second processing liquid. The second moving nozzle 72n may be a straight nozzle that ejects the second processing liquid, or a two-fluid nozzle that ejects a mixture of the second processing liquid and an inert gas.

The third movable nozzle 73n is moved horizontally by the third moving unit 73M. By moving horizontally, the third movable nozzle 73n can be moved between a position facing the center of rotation of the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "third discharge position") and a position not facing the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "third home position").

The third discharge position may be, for example, a position where the third processing liquid discharged from the third movable nozzle 73n lands on the center of rotation of the upper surface of the substrate W. The third home position is a position outside the holder 711 in a planar view. More specifically, the third home position may be a position outside the cup 717 in a planar view.

The third moving nozzle 73n may be moved up or down by the third moving unit 73M to approach the upper surface Wa of the substrate W held by the holder 711, or may be moved upward away from the upper surface Wa of the substrate W held by the holder 711.

The third moving unit 73M includes, for example, a third rotation shaft 73s extending vertically, a third arm 73a connected to the third rotation shaft 73s and extending horizontally, and a third arm drive mechanism 73m that drives the third arm 73a.

The third arm drive mechanism 73m swings the third arm 73a by rotating the third rotation shaft 73s around a virtual rotation axis A6 that extends in the vertical direction. The third movable nozzle 73n is attached to the third arm 73a at a location horizontally spaced from the rotation axis A6.

In response to the swinging of the third arm 73a, the third movable nozzle 73n moves along an arc-shaped trajectory in the horizontal direction, as indicated by the two-dot chain arrow in Figure 6. The third arm drive mechanism 73m may move the third arm 73a up and down by raising and lowering the third rotation shaft 73s in the vertical direction.

The third movable nozzle 73n has the function of supplying a third processing liquid (also referred to as the third treatment liquid) to the upper surface Wa of the substrate W held by the holder 711. A third processing liquid supply pipe P3, which functions as a pipe for supplying the third treatment liquid, is connected to the third movable nozzle 73n.

A third processing liquid on-off valve V3 is installed in the third processing liquid supply pipe P3, functioning as a valve for opening and closing the flow path of the third processing liquid supply pipe P3. The third processing liquid supply pipe P3 is supplied with the third processing liquid from the processing liquid distribution unit 701 or the processing liquid distribution unit 702, which will be described later. Here, a rinse liquid such as deionized water (DIW) is used as the third processing liquid. The third moving nozzle 73n may be a straight nozzle that ejects the third processing liquid, or a two-fluid nozzle that ejects a mixture of the third processing liquid and an inert gas.

The processing unit 76 includes, for example, a fan filter unit (FFU) as the air supply section 718. The FFU can further purify the air in the clean room in which the substrate processing apparatus 790 is installed and supply it into the processing chamber 761.

The FFU is attached, for example, to the ceiling wall of the processing chamber 761. The FFU is equipped with a fan and a filter (e.g., a HEPA filter) for taking in air from within the clean room and sending it into the processing chamber 761, and is capable of creating a downflow of clean air within the processing chamber 761. In order to more uniformly distribute the clean air supplied from the FFU within the processing chamber 761, a punched plate with multiple blow-out holes may be placed directly below the ceiling wall.

For example, an exhaust port 762o is provided in part of the side wall of the processing chamber 761 near the floor wall of the processing chamber 761, and is connected to the outside of the substrate processing apparatus 790 (such as the factory's exhaust equipment). For example, of the clean air supplied from the FFU and flowing down through the processing chamber 761, the air that passes near the cup 717, etc., is discharged outside the substrate processing apparatus 790 via the exhaust port 762o. For example, a configuration for introducing an inert gas such as nitrogen gas into the upper part of the processing chamber 761 may be added.

<1-5. Supply pipe space configuration>
As shown in Figures 4 and 5, four supply pipe spaces 762 extend vertically. For example, one supply pipe space 762A extends vertically from the lowest (first) processing unit 76A to the highest (sixth) processing unit 76A. For example, one supply pipe space 762B extends vertically from the lowest (first) processing unit 76B to the highest (sixth) processing unit 76B. For example, one supply pipe space 762C extends vertically from the lowest (first) processing unit 76C to the highest (sixth) processing unit 76C. For example, one supply pipe space 762D extends vertically from the lowest (first) processing unit 76D to the highest (sixth) processing unit 76D. When the supply pipe spaces 762A to 762D are not distinguished from one another, they are all simply referred to as supply pipe spaces 762.

The supply pipe space 762 is an area where pipes for supplying fluids to the processing chamber 761 are arranged. The supply pipe space 762 is equipped with, for example, a first processing liquid supply pipe P1, a second processing liquid supply pipe P2, a third processing liquid supply pipe P3, a first processing liquid on-off valve V1, a second processing liquid on-off valve V2, and a third processing liquid on-off valve V3. The first processing liquid supply pipe P1, the second processing liquid supply pipe P2, and the third processing liquid supply pipe P3 are led out of the supply pipe space 762 into the processing chamber 761 and connected to the first moving nozzle 71n, the second moving nozzle 72n, and the third moving nozzle 73n.

<1-6. Exhaust pipe space configuration>
As shown in FIGS. 4 and 5 , four exhaust pipe spaces 763 extend vertically. For example, one exhaust pipe space 763A extends vertically from the lowest (first) processing unit 76A to the highest (sixth) processing unit 76A. For example, one exhaust pipe space 763B extends vertically from the lowest (first) processing unit 76B to the highest (sixth) processing unit 76B. For example, one exhaust pipe space 763C extends vertically from the lowest (first) processing unit 76C to the highest (sixth) processing unit 76C. For example, one exhaust pipe space 763D extends vertically from the lowest (first) processing unit 76D to the highest (sixth) processing unit 76D. When the exhaust pipe spaces 763A to 763D are not distinguished from one another, they are all simply referred to as exhaust pipe spaces 763.

Each exhaust pipe space 763 is an area where piping is arranged to exhaust gas from the processing chamber 761. As shown in Figures 4 to 7, each exhaust pipe space 763 is arranged with, for example, an exhaust path switching mechanism 770, a first vertical exhaust pipe 771, a second vertical exhaust pipe 772, and a third vertical exhaust pipe 773.

For example, exhaust pipe space 763A is provided with an exhaust path switching mechanism 770 for each of the processing chambers 761 of the lowest (first) processing unit 76A to the highest (sixth) processing unit 76A. For example, exhaust pipe space 763B is provided with an exhaust path switching mechanism 770 for each of the processing chambers 761 of the lowest (first) processing unit 76B to the highest (sixth) processing unit 76B. For example, exhaust pipe space 763C is provided with an exhaust path switching mechanism 770 for each of the processing chambers 761 of the lowest (first) processing unit 76C to the highest (sixth) processing unit 76C. For example, in the exhaust pipe space 763D, an exhaust path switching mechanism 770 is arranged for each of the processing chambers 761 of the processing unit 76D in the lowest stage (first stage) to the highest stage (sixth stage).

There are, for example, four sets of the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773. The first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773 are pipes for discharging gas exhausted from the processing chamber 761 via the exhaust path switching mechanism 770 to the outside of the substrate processing apparatus 790.

In each exhaust pipe space 763, for example, the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773 extend from the side of the lowest (first) processing chamber 761 to the side of the highest (sixth) processing chamber 761. In each exhaust pipe space 763, for example, the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773 are aligned in the width direction (±Y direction). In each exhaust pipe space 763, the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773 function to exhaust gases flowing in via the exhaust path switching mechanism 770 from each of the processing chambers 761 of the six vertically stacked processing units 76.

When the first vertical exhaust pipe 771 is used to distinguish between the processing units 76A to 76D, it is referred to as the first vertical exhaust pipes 771A to 771D. When the second vertical exhaust pipe 772 is used to distinguish between the processing units 76A to 76D, it is referred to as the second vertical exhaust pipes 772A to 772D. When the third vertical exhaust pipe 773 is used to distinguish between the processing units 76A to 76D, it is referred to as the third vertical exhaust pipes 773A to 773D.

The first vertical exhaust pipe 771A, second vertical exhaust pipe 772A, and third vertical exhaust pipe 773A of the first set (first group) are configured to exhaust air from each of the six processing units 76A. The first vertical exhaust pipe 771B, second vertical exhaust pipe 772B, and third vertical exhaust pipe 773B of the second set (second group) are configured to exhaust air from each of the six processing units 76B. The first vertical exhaust pipe 771C, second vertical exhaust pipe 772C, and third vertical exhaust pipe 773C of the third set (third group) are configured to exhaust air from each of the six processing units 76C. The first vertical exhaust pipe 771D, second vertical exhaust pipe 772D, and third vertical exhaust pipe 773D of the fourth set (fourth group) are configured to exhaust air from each of the six processing units 76D.

The exhaust path switching mechanism 770 is a mechanism for switching the gas exhaust path from the processing chamber 761 to the outside of the substrate processing apparatus 790 via one of the vertical exhaust pipes: the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773.

The exhaust path switching mechanism 770 is disposed on each side of the processing chamber 761. The exhaust path switching mechanism 770 is connected to the processing chamber 761 via the exhaust port 762o, for example, to exhaust gas from the processing chamber 761. The exhaust path switching mechanism 770 is also connected to, for example, a first vertical exhaust pipe 771, a second vertical exhaust pipe 772, and a third vertical exhaust pipe 773 that extend in the vertical direction.

As shown in FIG. 6, the exhaust path switching mechanism 770 has, for example, a first opening/closing unit 71d and a second opening/closing unit 72d. The first opening/closing unit 71d and the second opening/closing unit 72d have, for example, a door-like structure and operate like a swinging door.

The first opening/closing unit 71d and the second opening/closing unit 72d rotate about a rotation axis driven by a motor or the like. The exhaust path switching mechanism 770 is set to one of the following states by opening and closing the first opening/closing unit 71d and the second opening/closing unit 72d: a state in which gas flows from the processing space 761s into the first vertical exhaust pipe 771 (also referred to as the first state), a state in which gas flows from the processing space 761s into the second vertical exhaust pipe 772 (also referred to as the second state), or a state in which gas flows from the processing space 761s into the third vertical exhaust pipe 773 (also referred to as the third state).

For example, during the period when the first chemical liquid is ejected from the first movable nozzle 71n, the exhaust path switching mechanism 770 is set to the first state. For example, during the period when the second chemical liquid is ejected from the second movable nozzle 72n, the exhaust path switching mechanism 770 is set to the second state. For example, during the period when the third chemical liquid is ejected from the third movable nozzle 73n, the exhaust path switching mechanism 770 is set to the third state.

<1-7. Horizontal exhaust system configuration>
As shown in Figures 3 to 5, the horizontal exhaust system 780 includes a first horizontal exhaust pipe 781A, a second horizontal exhaust pipe 782A, a third horizontal exhaust pipe 783A, a first horizontal exhaust pipe 781B, a second horizontal exhaust pipe 782B, and a third horizontal exhaust pipe 783B.

For example, as shown in Figures 3 and 4, the first horizontal exhaust pipe 781A, the second horizontal exhaust pipe 782A, and the third horizontal exhaust pipe 783A are positioned above the two uppermost (sixth) processing units 76A and 76B, extending in the front-to-rear direction (±X direction). The first horizontal exhaust pipe 781A, the second horizontal exhaust pipe 782A, and the third horizontal exhaust pipe 783A are aligned, for example, in the width direction (±Y direction).

For example, the first horizontal exhaust pipe 781A is connected to the first vertical exhaust pipe 771A for the processing unit 76A and the first vertical exhaust pipe 771B for the processing unit 76B so that they communicate with each other. The first horizontal exhaust pipe 781A exhausts gas from the first vertical exhaust pipes 771A and 771B.

For example, the second horizontal exhaust pipe 782A is connected to the second vertical exhaust pipe 772A for the processing unit 76A and the second vertical exhaust pipe 772B for the processing unit 76B so that they communicate with each other. The second horizontal exhaust pipe 782A exhausts gas from the second vertical exhaust pipes 772A and 772B.

For example, the third horizontal exhaust pipe 783A is connected so that it communicates with the third vertical exhaust pipe 773A for the processing unit 76A and the third vertical exhaust pipe 773B for the processing unit 76B. The third horizontal exhaust pipe 783A exhausts gas from the third vertical exhaust pipes 773A and 773B.

For example, as shown in Figures 3 and 5, the first horizontal exhaust pipe 781B, the second horizontal exhaust pipe 782B, and the third horizontal exhaust pipe 783B are positioned above the two uppermost (sixth) processing units 76C and 76D, extending in the front-to-rear direction (±X direction). The first horizontal exhaust pipe 781B, the second horizontal exhaust pipe 782B, and the third horizontal exhaust pipe 783B are aligned, for example, in the width direction (±Y direction).

For example, the first horizontal exhaust pipe 781B is connected to the first vertical exhaust pipe 771C for the processing unit 76C and the first vertical exhaust pipe 771D for the processing unit 76D so that they communicate with each other. The first horizontal exhaust pipe 781B exhausts gas from the first vertical exhaust pipes 771C and 771D.

For example, the second horizontal exhaust pipe 782B is connected to the second vertical exhaust pipe 772C for the processing unit 76C and the second vertical exhaust pipe 772D for the processing unit 76D so that they communicate with each other. The second horizontal exhaust pipe 782B exhausts gas from the second vertical exhaust pipes 772C and 772D.

For example, the third horizontal exhaust pipe 783B is connected so that it communicates with the third vertical exhaust pipe 773C for the processing unit 76C and the third vertical exhaust pipe 773D for the processing unit 76D. The third horizontal exhaust pipe 783B exhausts gas from the third vertical exhaust pipes 773C and 773D.

The first horizontal exhaust pipe 781A, the second horizontal exhaust pipe 782A, and the third horizontal exhaust pipe 783A are longer than the first horizontal exhaust pipe 781B, the second horizontal exhaust pipe 782B, and the third horizontal exhaust pipe 783B.

Gas flows backward (in the +X direction) through the first horizontal exhaust pipe 781A, the second horizontal exhaust pipe 782A, the third horizontal exhaust pipe 783A, the first horizontal exhaust pipe 781B, the second horizontal exhaust pipe 782B, and the third horizontal exhaust pipe 783B.

The substrate processing apparatus 790 has an exhaust section 768 including, for example, four exhaust pipe spaces 763 and a horizontal exhaust system 780, and this exhaust section 768 can exhaust gas from the processing chamber 761 to the outside of the substrate processing apparatus 790 (such as the factory's exhaust equipment).

A processing liquid storage unit 705 is provided at the rear (+X direction) of the substrate processing apparatus 790. The processing liquid storage unit 705 stores processing liquid distribution units 701 and 702 and processing liquid supply sources 703 and 704. For example, the processing liquid supply source 703 stores a chemical liquid, and the processing liquid supply source 704 stores a rinse liquid.

The processing liquid distribution units 701 and 702 both obtain processing liquid, specifically, a chemical liquid from a processing liquid supply source 703 and a rinse liquid from a processing liquid supply source 704. The processing liquid distribution unit 701 distributes the processing liquid to processing units 76C and 76D. The processing liquid distribution unit 702 distributes the processing liquid to processing units 76A and 76B.

Pipes that supply processing liquid from the processing liquid distribution section 701 to processing units 76C and 76D are provided in supply pipe spaces 762C and 762D, respectively. Pipes that supply processing liquid from the processing liquid distribution section 702 to processing units 76A and 76B are provided in supply pipe spaces 762A and 762B, respectively.

<1-8. Control system of substrate processing apparatus>
1, the substrate processing apparatus 790 includes a control unit 79. The control unit 79 is a part for controlling the operation of each component of the substrate processing apparatus 790, for example.

Figure 8 is a block diagram showing the functional configuration for controlling the operation of each component of the substrate processing apparatus 790. The control unit 79 is communicatively connected to the first transport mechanism 723, the second transport mechanism 75, the multiple processing units 76, and the horizontal exhaust system 780.

More specifically, the control unit 79 is communicatively connected to each of the elements to be controlled, for example, the multiple processing units 76 and the horizontal exhaust system 780. This allows the control unit 79 to control the operation of, for example, the first transport mechanism 723, the second transport mechanism 75, the multiple processing units 76, and the horizontal exhaust system 780.

Figure 9 is a block diagram showing an example configuration of the control unit 79. The control unit 79 is realized, for example, by a general-purpose computer. The control unit 79 has, for example, a communication unit 791, an input unit 797, an output unit 798, a memory unit 794, a processing unit 795, and a drive 796, which are connected via a bus line 79Bu.

The communication unit 791 transmits and receives signals via communication lines between, for example, the first transport mechanism 723, the second transport mechanism 75, the multiple processing units 76, and the horizontal exhaust system 780. The communication unit 791 may also receive signals from, for example, a management server for managing the substrate processing apparatus 790.

The input unit 797 inputs signals corresponding to, for example, the operator's actions. The input unit 797 includes, for example, operation units such as a mouse and keyboard that can input signals corresponding to operations, a microphone that can input signals corresponding to voice, and various sensors that can input signals corresponding to movement.

The output unit 798 outputs, for example, various types of information in a manner that can be recognized by the operator. The output unit 798 includes, for example, a display unit that visibly outputs various types of information and a speaker that audibly outputs various types of information. The display unit may, for example, have the form of a touch panel integrated with at least a portion of the input unit 797.

The storage unit 794 stores, for example, the program Pg1 and various information. The storage unit 794 is configured, for example, with a non-volatile storage medium such as a hard disk or flash memory. The storage unit 794 may be configured, for example, with one storage medium, with two or more integrated storage media, or with two or more separate storage media. The storage medium stores, for example, information regarding the operating conditions of the first transport mechanism 723, the second transport mechanism 75, the multiple processing units 76, and the horizontal exhaust system 780. The information regarding the operating conditions of the processing units 76 includes, for example, a processing recipe (process recipe) for processing the substrate W.

The processing unit 795 includes, for example, an arithmetic processing unit 795a that functions as a processor and a memory 795b that serves as a work area for arithmetic processing. The arithmetic processing unit 795a may include, for example, an electronic circuit such as a central processing unit (CPU), and the memory 795b may include, for example, a random access memory (RAM). The processing unit 795 implements the functions of the control unit 79, for example, by reading and executing program Pg1 stored in the storage unit 794. Therefore, in the control unit 79, various functional units that control the operation of each unit of the substrate processing apparatus 790 are implemented, for example, by the processing unit 795 performing arithmetic processing according to the procedures described in program Pg1. In other words, the functions and operations of the substrate processing apparatus 790 can be implemented by executing program Pg1 by the control unit 79 included in the substrate processing apparatus 790. Some or all of the functional units implemented by the control unit 79 may be implemented in hardware, for example, using dedicated logic circuits.

The drive 796 is, for example, a part to which the portable storage medium Sm1 can be attached and detached. For example, when the storage medium Sm1 is attached, the drive 796 exchanges data between the storage medium Sm1 and the processing unit 795. When the storage medium Sm1 storing the program Pg1 is attached to the drive 796, the drive 796 reads and stores the program Pg1 from the storage medium Sm1 into the storage unit 794.

An example of the overall operation of the substrate processing apparatus 790 is described below. In the substrate processing apparatus 790, for example, the control unit 79 controls each component of the substrate processing apparatus 790 in accordance with a recipe that describes the transport procedure and processing conditions for the substrate W, thereby performing the series of operations described below.

When a carrier C containing an unprocessed substrate W is placed on the carrier placement section 721, the first transport mechanism 723 removes the unprocessed substrate W from the carrier C. The first transport mechanism 723 transports the unprocessed substrate W to the substrate placement section 77. The second transport mechanism 75 transports the unprocessed substrate W from the substrate placement section 77 to a processing unit 76 specified by a recipe or the like. The transfer of the substrate W between the first transport mechanism 723 and the second transport mechanism 75 may be performed directly between the hand 7231 and the hand 751, for example, without going through the substrate placement section 77.

The processing unit 76 into which the substrate W has been loaded performs a predetermined series of substrate processing steps on the substrate W. In this series of substrate processing steps, for example, a chemical liquid and a rinse liquid are supplied to the upper surface Wa of the substrate W held in the holder 711 in the order listed.

After the process using the rinse liquid, an organic solvent may be supplied. After the process using the organic solvent, for example, a process (also called a drying process) is performed to remove the organic solvent from the upper surface Wa of the substrate W and dry the upper surface Wa of the substrate W. During the drying process, for example, the substrate W held by the holder 711 is rotated around the rotation axis A3 by the electric motor 711m serving as a drive unit.

When the series of substrate processing steps for the substrate W in the processing unit 76 is completed, the second transport mechanism 75 removes the processed substrate W from the processing unit 76. The second transport mechanism 75 transports the processed substrate W to the substrate platform 77. The first transport mechanism 723 transports the substrate W from the substrate platform 77 to a carrier C on the carrier platform 721.

In the substrate processing apparatus 790, the first transport mechanism 723 and the second transport mechanism 75 repeatedly perform the transport operations described above in accordance with the recipe, and each processing unit 76 performs a series of substrate processing operations on substrates W in accordance with the processing recipe. In this way, a series of substrate processing operations are performed on substrates W one after another.

<2. Explanation of the circulation device>
10 and 13 to 19 are piping diagrams illustrating the configuration of the circulation device 100. In these figures, a processing liquid supply source 30 and a waste liquid section 40, which are located outside the circulation device 100 and will be described later, are also shown.

Figure 11 is a diagram illustrating the configuration of the external path P located outside the circulation device 100. The circulation device 100 supplies and recovers liquid Q to the external path P. Specifically, the external path P is the towers P10 and P30. Liquid Q is supplied to the towers P10 and P30 via pipes P1a and P3a, respectively. Liquid Q is recovered from the towers P10 and P30 via pipes P1b and P3b, respectively.

The circulation device 100 can be used in both the treatment liquid distribution sections 701 and 702.

When the circulation device 100 is used as the processing liquid distribution section 701, for example, pipes P1a and P1b are pipes through which processing liquid flows in the six processing units 76C, and pipes P3a and P3b are pipes through which processing liquid flows in the six processing units 76D.

For example, processing liquid is supplied to and recovered from tower P10 and the six processing units 76C via pipes P1a and P1b. For example, processing liquid is supplied to and recovered from tower P30 and the six processing units 76D via pipes P3a and P3b. Pipes P1a and P1b are provided in supply pipe space 762C, and pipes P3a and P3b are provided in supply pipe space 762D.

When the circulation device 100 is used as the treatment liquid distribution section 702, for example, tower P10 is a pipe through which treatment liquid flows in six treatment units 76A, and tower P30 is a pipe through which treatment liquid flows in six treatment units 76B.

For example, processing liquid is supplied to and recovered from tower P10 and the six processing units 76A via pipes P1a and P1b. For example, processing liquid is supplied to and recovered from tower P30 and the six processing units 76B via pipes P3a and P3b. Pipes P1a and P1b are provided in supply pipe space 762A, and pipes P3a and P3b are provided in supply pipe space 762B.

The circulation device 100 includes a storage tank T. The storage tank T stores a liquid Q. The liquid Q is, for example, sulfuric acid or a diluted solution thereof (dilute sulfuric acid).

The circulation device 100 is equipped with a valve 81. The valve 81 is connected to a storage tank T. The valve 81 controls the discharge of liquid Q from the storage tank T to the outside of the circulation device 100, specifically to the waste liquid section 40, for example.

The circulation device 100 includes a pipe 1. The pipe 1 has an inlet end 101 and is used to supply liquid Q via pipes P1a and P3a. Liquid Q flows into the inlet end 101 from a storage tank T.

The circulation device 100 includes a pipe 2. The pipe 2 has an outlet end 202 and is used to recover liquid Q via pipes P1b and P3b. Liquid Q flows out of the outlet end 202 into the storage tank T.

The circulation device 100 is equipped with a valve 21. The valve 21 is provided in the pipe 2 and controls the outflow of the liquid Q from the outlet end 202 to the storage tank T. For example, an on-off valve is used as the valve 21.

The circulation in which liquid Q flows out of storage tank T and into storage tank T via pipes 1, 2, P1a, P3a, P1b, P3b and valve 21 is commonly referred to as "external circulation."

The circulation device 100 includes a pump 12. The pump 12 is provided in the pipe 1. The pump 12 has an intake port 12a and an outlet port 12b. The intake port 12a is connected to the inlet end 101. The pump 12 presses out the liquid Q from the intake port 12a to the outlet port 12b. For example, a magnetically levitated centrifugal pump is used as the pump 12. For example, a bearingless pump manufactured by Levitronix is used as the magnetically levitated centrifugal pump.

The circulation device 100 includes a heater 11. The heater 11 is connected to the outlet 12b in the pipe 1. The heater 11 heats the liquid Q. For example, a pair of heaters 11 are arranged in series in the pipe 1.

The circulation device 100 includes a pipe 3. The pipe 3 is a path for liquid Q to be stored outside the circulation device 100, specifically from, for example, the processing liquid supply source 30, to the storage tank T. The pipe 3 has an outlet end 302. The liquid Q flows out from the outlet end 302 into the storage tank T.

When the circulation device 100 is employed as the processing liquid distribution unit 701, the processing liquid supply source 703 functions as the processing liquid supply source 30. When the circulation device 100 is employed as the processing liquid distribution unit 702, the processing liquid supply source 704 functions as the processing liquid supply source 30.

The circulation device 100 is equipped with a valve 31. The valve 31 is provided in the pipe 3 and controls the outflow of the liquid Q from the outlet end 302 to the storage tank T. For example, an on-off valve is used as the valve 31.

The circulation device 100 includes a pipe 4. The pipe 4 is connected to the pipe 2 on the side opposite the outlet end 202 of the valve 21. For example, the pipe 4 has an end 401, which is connected to the pipe 2. The end 401 is located between the valve 21 and the pipes P1b and P3b. The pipe 4 is a path for discharging the liquid Q from the pipe 2 to the outside of the circulation device 100, specifically to the waste liquid section 40, for example.

The circulation device 100 is equipped with a valve 84. The valve 84 is provided in the pipe 4 and controls the discharge of the liquid Q. For example, an on-off valve is used as the valve 84.

The circulation device 100 includes a pipe 5. The pipe 5 is connected to the pipe 1 on the opposite side of the heater 11 from the pump 12. The pipe 5 has an outlet end 502. Liquid Q flows out from the outlet end 502 into the storage tank T. For example, the pipe 5 has an end 501, which is connected to the pipe 1. The end 501 is located between the heater 11 and the pipes P1a and P3a.

The circulation device 100 includes a valve 51. The valve 51 is provided in the pipe 5 and controls the outflow of the liquid Q from the outlet end 502 to the storage tank T. The valve 51 may be, for example, an on-off valve.

The circulation in which liquid Q flows out of storage tank T and into storage tank T via pipes 1, 5 and valve 51 is commonly referred to as "internal circulation."

The circulation device 100 includes a pipe 6. The pipe 6 is connected to the pipe 5 on the side opposite the outlet end 502 of the valve 51. For example, the pipe 6 is connected to the pipe 5 at end 501. The pipe 6 is a path for discharging the liquid Q from the pipe 5 to the outside of the circulation device 100, specifically to the waste liquid section 40, for example.

The circulation device 100 is equipped with a valve 86. The valve 86 is provided in the pipe 6 and controls the discharge of the liquid Q. For example, an on-off valve is used as the valve 86.

The circulation device 100 is equipped with a filter 16. The filter 16 is installed in the pipe 1 between the heater 11 and the pipes 5 and 6. The filter 16 has the function of removing impurities from the liquid Q.

For example, the filter 16 is a pair of filters 161, 163 connected in parallel to each other in the pipe 1. Such a parallel connection contributes to reducing pressure loss in the filter 16 and, ultimately, in the pipe 1.

The circulation device 100 includes a pipe 7. The pipe 7 has an outlet end 708. The pipe 7 is connected to the pipe 1 between the heater 11 and the filter 16. For example, the pipe 7 is connected to the pipe 1 at the end 707. Liquid Q flows out from the outlet end 708 into the reservoir T.

The circulation device 100 includes a valve 71. The valve 71 is provided in the pipe 7 and controls the outflow of the liquid Q from the outlet end 708 to the storage tank T. The valve 71 may be, for example, an on-off valve.

The circulation in which liquid Q flows out of storage tank T and into storage tank T via pipes 1, 7 and valve 71 is commonly referred to as "preliminary circulation."

Preliminary circulation is performed, for example, prior to the start of internal circulation. When the temperature of liquid Q (hereinafter simply referred to as "liquid temperature") is low, the viscosity of liquid Q is high, and it is undesirable for high-viscosity liquid Q to pass through filter 16. In preliminary circulation, liquid Q is heated to reduce its viscosity, and then liquid Q is used for internal circulation through filter 16. Performing preliminary circulation of liquid Q to increase the liquid temperature and reduce the viscosity of liquid Q contributes to smooth internal circulation via filter 16.

The circulation device 100 includes a pipe 8. The pipe 8 is connected to the pipe 7 on the side of the valve 71 opposite the outlet end 708. For example, the pipe 8 is connected to the pipe 7 at end 707. The pipe 8 is a path for discharging the liquid Q from the pipe 7 to the outside of the circulation device 100, specifically to the waste liquid section 40, for example.

The circulation device 100 is equipped with a valve 88. The valve 88 is provided in the pipe 8 and controls the discharge of the liquid Q. For example, an on-off valve is used as the valve 88.

The circulation device 100 includes a pipe 9. The pipe 9 is connected to the filter 16. The pipe 9 is a path for discharging the liquid Q from the filter 16 to the outside of the circulation device 100, specifically to the waste liquid section 40, for example.

The circulation device 100 is equipped with a valve 89. The valve 89 is provided in the pipe 9 and controls the discharge of the liquid Q. For example, the valve 89 may include a valve 891 connected to the filter 161 and a valve 893 connected to the filter 163. For example, both the valves 891 and 893 may be open/close valves.

The circulation device 100 is equipped with a valve 80. The valve 80 is connected to the outlet 12b. The valve 80 controls the discharge of the liquid Q to the outside of the circulation device 100, specifically, for example, to the waste liquid section 40.

The circulation device 100 is equipped with a flow meter 15. The flow meter 15 is installed between the inlet end 101 and the suction port 12a. The flow meter 15 measures the flow rate of the liquid Q in the pipe 1.

The circulation device 100 is equipped with a thermometer 17 and a pressure gauge 18. The thermometer 17 and pressure gauge 18 are installed, for example, between the heater 11 and the filter 16. The thermometer 17 measures the temperature of the liquid Q in the pipe 1. The pressure gauge 18 measures the pressure of the liquid Q in the pipe 1.

Figure 12 is a block diagram showing an outline of the functions of the control unit U. The control unit U controls the operation of valves 21, 31, 51, 71, 80, 81, 84, 86, 88, and 89. For example, the control unit U supplies control signals Sv to valves 21, 31, 51, 71, 80, 81, 84, 86, 88, and 89 to control their opening and closing.

The control unit U controls the operation of the heater 11 and the pump 12. For example, the control unit U supplies a control signal Sh to the heater 11 to control the heating of the liquid Q by the heater 11. For example, the control unit U supplies a control signal Sp to the pump 12 to control the flow rate of the liquid Q by the pump 12.

The control unit U inputs data Fd from the flowmeter 15, which indicates the flow rate of the liquid Q flowing through the pipe 1. The control unit U can integrate this flow rate. The control unit U inputs data Td from the thermometer 17, which indicates the temperature of the liquid Q in the pipe 1. The control unit U inputs data Pd from the pressure gauge 18, which indicates the pressure of the liquid Q in the pipe 1.

The control unit U controls the rotation speed of the pump 12 using the control signal Sp based on the data Fd and Pd, and the control unit U controls the heating of the liquid Q by the heater 11 using the control signal Sh based on the data Td, using well-known technology. Therefore, details about the technology used to control the pump 12 and heater 11 will not be provided here.

The following explains the relationship between the opening and closing of the valve and the operation of the pump 12 (specifically, driving and stopping (hereinafter also simply referred to as "on" and "off")). In the following explanation, the pair of triangles that make up the symbol representing the valve are represented by a black triangle when the valve is in an open state (hereinafter also referred to as the "open state") and a white triangle when the valve is in a closed state (hereinafter also referred to as the "closed state").

<2-1. Condition before changing processing solution>
10 shows a state in which internal circulation and external circulation are performed, with valves 21 and 51 open and valves 31, 71, 80, 81, 84, 86, 88, and 89 closed.

Pump 12 is on, and liquid Q flows from tower P10 through pipe P1b into pipe 2 as liquid flow F1b. Liquid Q flows from tower P30 through pipe P3b into pipe 2 as liquid flow F3b. Liquid flows F1b and F3b join in pipe 2 to form liquid flow F2. Liquid flow F2 passes through valve 21 and flows out from outlet end 202 into storage tank T.

In pipe 5, liquid Q flows as liquid flow F5 from end 501 to outlet end 502 via valve 51.

The liquid flow F1 flowing through pipe 1 is divided into the aforementioned liquid flow F5, a liquid flow F1a flowing through pipe P1a toward tower P10, and a liquid flow F3a flowing through pipe P3a toward tower P30. Liquid Q undergoes external and internal circulation.

<2-2. Discharge of treated liquid from storage tank T>
In the process of replacing the processing liquid, before the introduction of a new processing liquid into the circulation device 100 is started, the processing liquid that was used before the introduction (hereinafter referred to as the "old processing liquid") is started to be discharged.

First, old processing liquid is discharged from storage tank T. Figure 13 shows the state in which old processing liquid Q is discharged from storage tank T. During this discharge, pump 12 is turned off.

During this discharge, new processing liquid is not yet introduced into storage tank T. Valve 31 is closed. Valve 81 opens. Liquid Q, which is old processing liquid, flows as liquid flow F81 through valve 81 to the outside, specifically to waste liquid section 40. Liquid Q is discharged from storage tank T through valve 81 due to its own weight.

The process of discharging liquid Q from storage tank T in the manner described above may be tentatively referred to as process J1 for ease of future reference.

Valves 21, 51, 71, 80, 84, 86, 88, and 89 do not substantially contribute to or hinder the discharge. Therefore, it does not matter whether valves 21, 51, 71, 80, 84, 86, 88, and 89 are open or closed. However, Figure 13 illustrates a case where valves 21 and 51 are open and valves 71, 80, 84, 86, 88, and 89 are closed, reflecting the state before the processing liquid was replaced.

<2-3. Discharge of treated liquid from piping by its own weight>
14 shows a state in which old processing liquid is discharged from the piping due to its own weight. During this discharge, new processing liquid is not yet introduced into the storage tank T. The valve 31 remains closed. In FIG. 14, the storage tank T is illustrated in a state in which the liquid Q has already been discharged (hereinafter also referred to as "drained") in step J1.

The completion of the discharge of liquid Q from storage tank T (drainage from storage tank T completed) can be determined, for example, by detecting the position of the liquid surface of liquid Q. This position may be detected, for example, by a liquid sensor installed a first predetermined distance away from the bottom surface of storage tank T, or may be detected by optical distance measurement from above storage tank T.

Valves 21 and 84 are opened, and liquid Q, the old processing liquid that is in pipe 2 on the reservoir tank T side of end 401, is discharged to the outside, specifically to waste liquid section 40. Liquid Q, the old processing liquid, flows through pipe 2 as liquid flow F2b in the direction from outlet end 202 toward end 401, via valve 21. Liquid flow F2b passes through end 401 and flows through pipe 4 as liquid flow F4. Liquid Q is discharged to waste liquid section 40 via valve 84.

Valves 51 and 86 are opened, and liquid Q, the old processing liquid in pipe 5, is discharged to the outside, specifically to waste liquid section 40. Liquid Q flows through pipe 5 as liquid flow F5b in the direction from outlet end 502 to end 501, via valve 51. Liquid flow F5b passes through end 501 and becomes liquid flow F6, flowing through pipe 6. Liquid Q is discharged to waste liquid section 40 via valve 86.

Valves 71 and 88 are opened, and liquid Q, the old processing liquid in pipe 7, is discharged to the outside, specifically to the waste liquid section 40. Liquid Q flows through pipe 7 as liquid flow F7b in the direction from outlet end 708 to end 707, via valve 71. Liquid flow F7b passes through end 707 and flows through pipe 8 as liquid flow F8. Liquid Q is discharged to the waste liquid section 40 via valve 88.

The process of discharging liquid Q by gravity from the portion of pipe 2 closer to storage tank T than end 401, and from pipes 5 and 7, as described above, may be tentatively referred to as process J2 for ease of future reference.

Valves 80, 81, and 89 do not substantially contribute to or impede the discharge. Therefore, it does not matter whether valves 80, 81, and 89 are open or closed. However, Figure 14 illustrates an example in which step J2 is performed following step J1, with valves 80 and 89 remaining closed and valve 81 remaining open.

Whether liquid Q has been discharged (drained) from part of pipe 2 and pipes 5 and 7 in step J2 is determined based on, for example, the maximum viscosity expected for liquid Q and the elapsed discharge time calculated based on the design specifications of the circulation device 100.

Processes J1 and J2 have in common the fact that old processing liquid is discharged by gravity. Therefore, processes J1 and J2 can be performed in parallel. For example, by turning pump 12 off, closing valve 31, and opening valves 21, 51, 71, 84, 86, and 88, old processing liquid Q can be discharged by gravity from storage tank T, the portion of pipe 2 closer to storage tank T than end 401, and pipes 5 and 7. In this case, because pump 12 is off, it does not matter whether valves 80 and 89 are open or closed.

Even with steps J1 and J2, at least the old processing liquid in pipes P1a, P3a, P1b, and P3b is not substantially discharged. Similarly, the old processing liquid in pipe 1, more specifically between inlet end 101 and end 501, is not substantially discharged.

The old processing liquid (hereinafter referred to as "gravity residual liquid") remaining in these areas is expelled by pump 12 when it is on. The amount of gravity residual liquid expelled by pump 12 when it is on is calculated by integrating the flow rate measured by flow meter 15.

For example, the total amount of residual liquid due to gravity is estimated from the design specifications of the circulation device 100. Therefore, when the integrated value of the flow rate measured by the flow meter 15 (hereinafter simply referred to as the "integrated value") reaches the above-mentioned total amount estimated from the design specifications (hereinafter "estimated total amount"), it can be determined that the discharge of the treated liquid is complete.

<2-4. Discharge of treatment liquid from pump 12 and its vicinity>
After steps J1 and J2 are performed, the liquid Q remaining in the pump 12 and its vicinity as old processing liquid is discharged. However, this discharge does not simply discharge the old processing liquid, but also introduces new processing liquid. Such introduction is suitable when a magnetically levitated centrifugal pump is used as the pump. The liquid remaining due to gravity is replaced with new processing liquid.

When measuring flow rate, the viscosity of the fluid being measured affects the measured flow rate. The viscosity of the fluid depends on the temperature of that fluid. Because the temperature of old processing liquid varies depending on the process using the processing liquid, calibrating the flow meter 15 to measure its flow rate is complicated. Liquid Q supplied as new processing liquid can be easily set to a predetermined temperature, for example, room temperature. To calibrate the flow meter 15, it is sufficient to use the viscosity of liquid Q at the predetermined temperature. This facilitates accurate measurement of liquid Q measured by the flow meter 15. When the integrated value of new processing liquid pumped out by pump 12 reaches the expected total volume, it is determined that the discharge of residual liquid by gravity has been completed.

To introduce new processing liquid to replace the residual liquid by gravity, new processing liquid is introduced into the circulation device 100 into the storage tank T from which liquid Q was discharged in step J1. Specifically, after steps J1 and J2 are performed, liquid Q is stored in storage tank T from the outside, specifically from the processing liquid supply source 30. For ease of future reference, the step of storing liquid Q in storage tank T may be tentatively referred to as step J3.

Figure 15 shows the state in which step J3 is being executed. In step J3, pump 12 remains off following steps J1 and J2. Valve 81 is closed and valve 31 is open.

With valve 31 in the open state, new processing liquid Q flows as liquid flow F3 from the processing liquid supply source 30 through valve 31 and outflow end 302, and liquid Q is stored in storage tank T. The temperature of liquid Q stored in storage tank T in step J3 is, for example, room temperature.

Valves 21, 51, 71, 80, 84, 86, 88, and 89 may be open or closed, but Figure 15 illustrates a case in which the open and closed states in step J2 are maintained. Specifically, valves 21, 51, 71, 84, 86, and 88 are open, and valves 80 and 89 are closed.

The predetermined amount of liquid Q stored in storage tank T is, for example, the amount that should be stored when circulation device 100 is operating normally. The amount of liquid Q stored in storage tank T is determined, for example, by detecting the position of the liquid surface of liquid Q. This position may be detected, for example, by a liquid sensor installed a second predetermined distance from the bottom surface of storage tank T, or may be detected by optical distance measurement from above storage tank T.

When step J3 is completed, that is, when the predetermined amount of liquid Q has been stored in storage tank T (hereinafter also tentatively referred to as "storage completed"), valve 31 transitions from an open state to a closed state. Valve 80 is opened, and then pump 12 transitions from an off state to an on state. These operations replace the gravity residual liquid with new treatment liquid in the section of pipe 1 between inlet end 101 and the position where valve 80 is installed (hereinafter, including pump 12, tentatively referred to as "section R1"). For ease of reference later, the process of replacing gravity residual liquid in section R1 with treatment liquid via valve 80 may be tentatively referred to as step J4.

Figure 16 shows the state in which step J4 is being performed. In step J4, pump 12 is on, and the residual liquid due to gravity is gradually replaced by new treatment liquid Q flowing from storage tank T via inlet end 101 toward valve 80. At this time, liquid Q flows through pipe 1 at portion R1 as liquid flow F1, and then flows through valve 80 as liquid flow F80. Liquid Q passes through valve 80 and is discharged to the outside, for example, to waste liquid section 40.

In step J4, valves 21, 51, 71, 84, 86, 88, and 89 may or may not be open or closed, but Figure 16 illustrates a case in which the open and closed states in step J3 are maintained. Specifically, valves 21, 51, 71, 84, 86, and 88 are open, and valve 89 is closed.

In step J4, the gravity residual liquid present between the inlet end 101 and the suction port 12a is sucked into the pump 12, and liquid Q is supplied from the suction port 12a as new treatment liquid, immediately following the gravity residual liquid. Therefore, regardless of whether a magnetically levitated centrifugal pump is used for the pump 12, the gravity residual liquid in section R1 is replaced with new treatment liquid.

In step J4, the old processing liquid in the circulation device 100 is replaced with new processing liquid by using the pump 12 to expel the processing liquid, which contributes to efficient exchange of the processing liquid.

When the residual liquid due to gravity in region R1 is replaced with new treatment liquid, it is determined that the discharge of residual liquid due to gravity in region R1 is complete. When it is determined that the discharge is complete, step J4 ends.

Whether or not this discharge is complete is determined from the integrated value of the flow rate of liquid flow F1 after pump 12 transitions from the off state to the on state. For example, an estimated value for the amount of liquid remaining due to gravity in area R1 (hereinafter tentatively referred to as the "first estimated value") is determined from the design specifications. When the integrated value of the flow rate of liquid flow F1 reaches the first estimated value, it is determined that the discharge of liquid remaining due to gravity in area R1 is complete.

The liquid Q whose flow rate is measured by the flow meter 15 in step J4 is mostly new liquid Q stored in the storage tank T in step J3, except for the liquid Q remaining between the inlet end 101 and the flow meter 15. Therefore, measurements by the flow meter 15 are less affected by the temperature and therefore the viscosity of the old processing liquid Q before replacement, and are more accurate than when they are affected by this. The fact that the determination of when the processing liquid has been replaced is not affected by the viscosity of the old processing liquid reduces the possibility of overestimating the time required to replace the processing liquid. This reduction contributes to efficient replacement of the processing liquid.

<2-5. Discharge of processing liquid from heater 11 and its vicinity>
After step J4 is performed, the liquid Q remaining in the heater 11 and its vicinity as the old processing liquid is discharged. However, this discharge does not simply discharge the old processing liquid, but also introduces new processing liquid.

Valve 80 transitions from an open state to a closed state. Valves 31, 71, and 81 are closed, and valve 88 is open. Pump 12 is on. The fact that pump 12 remains off from the end of step J4 until valves 71 and 80 are closed contributes to accurately determining the discharge of residual liquid due to gravity.

With valves 71 and 80 closed, valve 88 open, and pump 12 on, residual liquid due to gravity is replaced with new processing liquid in the section of pipe 1 from the position where valve 80 is installed to end 707 (including heater 11, tentatively referred to as "section R2" below).

The process of replacing the residual liquid in area R2 with treatment liquid via valve 88 may be tentatively referred to as process J5 for ease of future reference.

Figure 17 shows the state in which step J5 is being performed. In step J5, pump 12 is on, and the residual liquid due to gravity is sequentially replaced by new treatment liquid Q flowing from reservoir T via inlet end 101 toward valve 88. At this time, liquid Q flows through pipe 1 at portions R1 and R2 as liquid flow F1, and then flows through pipe 8 via end 707 as liquid flow F8. Liquid Q is discharged to the outside, for example, to waste liquid section 40, via valve 88.

In step J5, valves 21, 51, 84, 86, and 89 may be open or closed, but Figure 17 illustrates a case in which the open and closed states in step J4 are maintained. Specifically, valves 21, 51, 84, and 86 are open, and valve 89 is closed.

In step J5, new processing liquid already present in region R1 in step J4 and liquid Q passing through region R1 from reservoir T are caused to flow to region R2 by the function of pump 12, which is in the on state. Therefore, regardless of whether a magnetically levitated centrifugal pump is used for pump 12, the liquid remaining in region R2 due to its own weight is replaced with new processing liquid.

When the residual liquid due to gravity in region R2 is replaced with new treatment liquid, it is determined that the discharge of residual liquid due to gravity in region R2 is complete. When it is determined that the discharge is complete, step J5 ends.

Whether or not this discharge is complete is determined from the integrated value of the flow rate of liquid flow F1 from the point in time when valve 71 is closed, valve 80 transitions from an open state to a closed state, and pump 12 is on. For example, an estimated value for the amount of residual liquid due to gravity in area R2 (hereinafter tentatively referred to as the "second estimated value") is determined from the design specifications. When the integrated value of the flow rate of liquid flow F1 reaches the second estimated value, it is determined that the discharge of residual liquid due to gravity in areas R1 and R2 is complete.

Alternatively, when the integrated value of the flow rate of the liquid flow F1 after the pump 12 transitions from the off state to the on state, which is performed at the beginning of step J4, reaches the sum of the first assumed value and the second assumed value, it is determined that the discharge of the residual liquid due to gravity in parts R1 and R2 has been completed.

<2-6. Discharge of treated liquid from filter 16 and its vicinity>
After step J5 is performed, the liquid Q remaining in the filter 16 and its vicinity as the old processing liquid is discharged. However, this discharge does not simply discharge the old processing liquid, but also introduces new processing liquid.

Valves 31, 81, 80, and 71 continue to remain closed from step J5. Valve 88 transitions from an open state to a closed state. Valve 51 is closed. Pump 12 is on. The fact that pump 12 remains off from the end of step J5 until valves 51 and 88 close helps to accurately determine the discharge of residual liquid due to gravity.

With valves 51, 71, 80, and 88 closed, valve 86 open, and pump 12 on, the residual liquid due to gravity is replaced with new treatment liquid in the section of pipe 1 between end 707 and end 501 (including filter 16, tentatively referred to as "section R3" below).

The process of replacing the gravitational residual liquid in area R3 with treatment liquid via valve 86 may be tentatively referred to as process J6 for ease of future reference. Process J6 contributes to omitting the process of discharging the old treatment liquid from filter 16 via pipe 9 and valve 89.

Figure 18 shows the state in which step J6 is being performed. In step J6, pump 12 is on, and new processing liquid Q flows from storage tank T to part R3 via parts R1 and R2, replacing the processing liquid sequentially toward valve 86. At this time, liquid Q flows through pipe 1 at parts R1, R2, and R3 as liquid flow F1, and then flows through pipe 6 via end 501 as liquid flow F6. Liquid Q is discharged to the outside, for example, to waste liquid section 40, via valve 86.

While valves 21, 84, and 89 may be open or closed in step J6, Figure 18 illustrates an example in which their opening and closing states in step J5 are maintained. Specifically, valves 21 and 84 are open, and valve 89 is closed.

In step J6, new processing liquid already present in areas R1 and R2 by steps J4 and J5, and liquid Q passing from storage tank T via areas R1 and R2, are flowed to area R3 by the function of pump 12, which is in the on state. Therefore, regardless of whether a magnetically levitated centrifugal pump is used for pump 12, the liquid remaining by gravity in area R3 is replaced with new processing liquid.

When the residual liquid due to gravity in region R3 is replaced with new treatment liquid, it is determined that the discharge of residual liquid due to gravity in region R3 is complete. When it is determined that the discharge is complete, step J6 ends.

Whether or not this discharge is complete is determined from the integrated value of the flow rate of liquid flow F1 from the point in time when valve 86 is open, valves 51 and 71 are closed, valve 88 transitions from the open state to the closed state, and pump 12 is on. For example, an estimated value for the amount of gravity-residual liquid in area R3 (hereinafter tentatively referred to as the "third estimated value") is determined from the design specifications. When the integrated value of the flow rate of liquid flow F1 reaches the third estimated value, it is determined that the discharge of gravity-residual liquid in areas R1, R2, and R3 is complete.

Alternatively, when the integrated value of the flow rate of the liquid flow F1 after the pump 12 transitions from the off state to the on state, which is performed at the beginning of step J4, reaches the sum of the first estimated value, the second estimated value, and the third estimated value, it is determined that the discharge of the residual liquid due to gravity in areas R1, R2, and R3 has been completed.

<2-7. Discharge of processing solution from external path P and its vicinity>
After step J6 is performed, the liquid Q remaining in the external path P and its vicinity as the old processing liquid is discharged. However, this discharge does not simply discharge the old processing liquid, but also introduces new processing liquid.

Valves 31, 81, 80, 51, 71, and 88 continue to remain closed from step J6. Valve 21 is closed, and valve 86 transitions from an open state to a closed state. Valves 84 and 89 are closed. Pump 12 is on. The fact that pump 12 remains off from the end of step J6 until valves 21 and 86 close helps to accurately determine the discharge of residual liquid due to gravity.

With valves 21, 80, 71, 88, 51, and 86 closed, valve 84 open, and pump 12 on, residual liquid due to gravity is replaced with new treatment liquid in pipes P1a, P3a, P1b, and P3b and external path P.

The process of replacing the residual liquid due to gravity in the pipes P1a, P3a, P1b, and P3b and the external path P with the treatment liquid via valve 84 may be tentatively referred to as process J7 for ease of future reference.

Figure 19 shows the state in which step J7 is being performed. In step J7, pump 12 is on, and new processing liquid Q flows from storage tank T to pipes P1a and P3a via pipe 1, sequentially replacing the processing liquid toward valve 84. At this time, liquid Q flows through pipe 1 as liquid flow F1, and liquid flow F1 branches into liquid flows F1a and F3a flowing through pipes P1a and P3a, respectively. Liquid flows F1b and F3b flowing through pipes P1b and P3b, respectively, join together and flow through pipe 2, and then flow through pipe 4 via end 401 as liquid flow F4. Liquid Q is discharged via valve 84 to the outside, for example, to waste liquid section 40.

In step J7, new processing liquid already present in pipe 1 due to steps J4, J5, and J6, and liquid Q passing through pipe 1 from storage tank T, are caused to flow into pipes P1a and P3a by the function of pump 12, which is in the on state. Therefore, regardless of whether a magnetically levitated centrifugal pump is used for pump 12, the liquid remaining due to gravity in pipes P1a and P3a, and ultimately in external path P and pipes P1b and P3b, is replaced with new processing liquid.

When the residual liquid due to gravity in the pipes P1a, P3a, P1b, and P3b and the external path P is replaced with new treatment liquid, it is determined that the discharge of residual liquid due to gravity in these areas has been completed. Once this discharge is complete, step J7 ends.

Whether or not this discharge is complete is determined from the integrated value of the flow rate of liquid flow F1 from the time when valves 21 and 86 are closed and pump 12 is on. For example, an estimated value (tentatively referred to as the "fourth estimated value") of the amount of liquid remaining due to gravity in pipes P1a, P3a, P1b, and P3b and external path P is determined from the design specifications. When the integrated value of the flow rate of liquid flow F1 reaches the fourth estimated value, it is determined that the discharge of liquid remaining due to gravity in parts R1, R2, and R3, pipes P1a, P3a, P1b, and P3b, and external path P is complete.

Alternatively, when the integrated value of the flow rate of the liquid flow F1 after the pump 12 transitions from the off state to the on state, which is executed at the beginning of step J4, reaches the sum of the first estimated value, the second estimated value, the third estimated value, and the fourth estimated value, it is determined that the discharge of the residual liquid due to gravity from parts R1, R2, R3, pipes P1a, P3a, P1b, P3b, and external path P has been completed.

Alternatively, the discharge of residual liquid due to gravity within the circulation device 100 is determined to be complete when the integrated value of the flow rate of liquid flow F1 after the pump 12 transitions from the off state to the on state, which was performed at the beginning of step J4, reaches the expected total volume.

3. Processing solution replacement flowchart
20 is a flowchart illustrating the process of replacing a processing liquid, specifically the steps described above. The flowchart is entitled "Processing Liquid Replacement" because it illustrates the steps of replacing an old processing liquid with a new processing liquid.

In this flowchart, process J1 is first executed in step S11. As described above, process J1 involves discharging the treatment liquid from storage tank T by gravity, so step S11 is labeled "gravity drainage from storage tank T."

In step S12, it is determined whether the processing liquid has been drained from the storage tank T. If the determination is negative, process J1 in step S11 continues. If the determination is positive, step S13 is executed. The determination in step S12 is made, for example, using the position of the liquid surface of liquid Q in the storage tank T.

In step S13, process J2 is performed. As described above, process J2 involves draining the treatment liquid from pipes 2, 5, and 7 by gravity, and therefore step S13 is labeled "gravity drainage from pipes 2, 5, and 7." Steps S11 and S13 may be performed in parallel.

In step S14, it is determined whether the processing liquid has been drained from pipes 2, 5, and 7. If the determination is negative, process J2 in step S13 continues. If the determination is positive, step S15 is executed. The determination in step S14 is made, for example, using the maximum expected viscosity of liquid Q and the elapsed drain time calculated based on the design specifications of the circulation device 100.

In step S15, process J3 is performed. As described above, process J3 involves storing new processing liquid in storage tank T, so step S13 is labeled "storage."

In step S16, it is determined whether storage in storage tank T has ended. If the determination is negative, process J3 in step S15 continues. If the determination is positive, step S17 is executed. The determination in step S16 is made, for example, using the position of the liquid surface of liquid Q in storage tank T.

In step S17, process J4 is performed. As described above, process J4 replaces the old processing liquid with new processing liquid in region R1, so step S17 is labeled "Replacing processing liquid in region R1."

In step S18, it is determined whether replacement of the processing liquid in region R1 has been completed. The determination in step S18 is made, for example, using the integrated value of the flow rate of liquid flow F1. If the determination is negative, process J4 in step S17 continues. If the determination is positive, step S19 is executed.

In step S19, process J5 is performed. As described above, process J5 replaces the old processing liquid with new processing liquid in region R2, so step S19 is labeled "Replacing processing liquid in region R2."

In step S20, it is determined whether replacement of the processing liquid in region R2 has been completed. The determination in step S20 is made, for example, using the integrated value of the flow rate of liquid flow F1. If the determination is negative, process J5 in step S19 continues. If the determination is positive, step S21 is executed.

In step S21, process J6 is performed. As described above, process J6 replaces the old processing liquid with new processing liquid in region R3, so step S21 is labeled "Replacing processing liquid in region R3."

In step S22, it is determined whether replacement of the treatment liquid in region R3 has been completed. The determination in step S22 is made, for example, using the integrated value of the flow rate of liquid flow F1. If the determination is negative, process J6 in step S21 continues. If the determination is positive, step S23 is executed.

In step S23, process J7 is performed. As described above, process J7 replaces old processing liquid with new processing liquid in pipes P1a, P3a, P1b, and P3b and the external path P. Step S23 is simply labeled "Replacing processing liquid in external path P."

In step S24, it is determined whether replacement of the processing liquid in the pipes P1a, P3a, P1b, and P3b and the external path P has been completed. The determination in step S24 is made, for example, using the integrated flow rate of the liquid flow F1. If the determination is negative, process J7 in step S23 continues. If the determination is positive, all residual liquid due to gravity is discharged, and the processing liquid replacement process is completed.

Steps J1, J2, J3, J4, J5, J6, and J7 are realized by the operation of pump 12 of circulation device 100 (specifically, switching between on and off states) and the operation of valves 21, 31, 51, 71, 80, 81, 84, 86, 88, and 89 (specifically, switching between open and closed states) under the control of control unit U.

<4. General explanation>
The above-mentioned steps can be generally explained as follows: The exchange of the liquid Q, which is the processing liquid, is realized by controlling the circulation device 100. The circulation device 100 supplies and recovers the liquid to and from the external path.

[1] The circulation device 100 includes a storage tank T, pipes 1, 2, 3, and 4, valves 21, 31, 80, 81, and 84, a heater 11, and a pump 12.

Storage tank T is intended to store liquid Q. Pipe 1 has an inlet end 101 and is used to supply liquid Q. Liquid Q flows into inlet end 101 from storage tank T.

Valve 81 is connected to storage tank T and controls the discharge of liquid Q from storage tank T to the outside of circulation device 100, for example, to waste liquid section 40.

Pump 12 is installed in pipe 1 and is used to pump out liquid Q. Pump 12 has an intake port 12a and an outlet port 12b. Intake port 12a is connected to inlet end 101.

The heater 11 is connected to the outlet 12b in the pipe 1. The heater 11 heats the liquid Q.

Pipe 2 has an outlet end 202 and is used to recover liquid Q. Liquid Q flows out from outlet end 202 into storage tank T.

Valve 21 is provided in pipe 2. Valve 21 controls the outflow of liquid Q from outlet end 202 to reservoir T.

Pipe 3 has an outlet end 302. Pipe 3 is a path for liquid Q to be stored in storage tank T from a liquid supply source outside the circulation device, such as processing liquid supply source 30. Liquid Q flows out from outlet end 302 into storage tank T.

Valve 31 is provided in pipe 3. Valve 31 controls the outflow of liquid Q from outlet end 302 to reservoir T.

Pipe 4 is connected to pipe 2 on the side opposite the outlet end 202 of valve 21. Pipe 4 is a path for discharging liquid Q from pipe 2 to the outside of circulation device 100, for example, to waste liquid section 40.

Valve 84 is installed in pipe 4 and controls the discharge of liquid Q.

The valve 80 is connected to the outlet 12b and controls the discharge of the liquid Q outside the circulation device 100, for example to the waste liquid section 40.

The method for controlling the circulation device 100 includes steps J1, J2, J3, and J4.

In process J1, pump 12 is stopped, valve 31 is closed, and valve 81 is open. Valves 21, 51, 71, 80, 84, 86, 88, and 89 other than valves 31 and 81 may be open or closed. The period during which process J1 is performed is hereinafter referred to as the first period. The end of the first period is determined, for example, by detecting the liquid level position in storage tank T for liquid Q.

In process J2, pump 12 is stopped, valve 31 is closed, and valves 21 and 84 are open. Valves 51, 71, 80, 81, 86, 88, and 89 other than valves 31, 21, and 84 may be open or closed. The period during which process J2 is performed is hereinafter referred to as the second period. The end of the second period is determined based on, for example, the expected maximum viscosity of liquid Q and the elapsed discharge time calculated based on the design specifications of circulation device 100.

Step J3 is executed in a third period after the first and second periods. In step J3, pump 12 is stopped, valve 81 is closed, and valve 31 is open. The opening and closing of valves 21, 51, 71, 80, 84, 86, 88, and 89 other than valves 31 and 81 is irrelevant. The end of the third period is determined, for example, by detecting the liquid level in storage tank T for liquid Q.

Step J4 is executed in the fourth period after the third period. In step J4, valves 81 and 31 are closed, valve 80 is open, and pump 12 is driven.

By performing steps J1, J2, J3, and J4, the treatment liquid is replaced in the reservoir T and in the region R1 from the inlet end 101 to the position where the valve 80 is installed, regardless of whether a magnetically levitated centrifugal pump is used for the pump 12. Replacing the treatment liquid by using the pump 12 to expel the treatment liquid contributes to efficient exchange of the treatment liquid.

[2] The circulation device 100 further includes pipes 5, 6, 7, and 8 and valves 51, 86, 71, and 88.

Pipes 5 and 7 have outlet ends 502 and 708, respectively. Both pipes 5 and 7 are connected to pipe 1 on the opposite side of heater 11 from pump 12. Liquid Q flows out of both outlet ends 502 and 708 into reservoir T.

Valves 51 and 71 are provided on pipes 5 and 7, respectively. Valves 51 and 71 control the outflow of liquid Q from outlet ends 502 and 708, respectively, to reservoir T.

Pipes 6 and 8 are connected to pipes 5 and 7 on the opposite side of valves 51 and 71 from outlet ends 502 and 708, respectively. Pipes 6 and 8 are paths for discharging liquid Q from pipes 5 and 7 to the outside of circulation device 100, for example, to waste liquid section 40.

Valves 86 and 88 are provided on pipes 6 and 8, respectively. Both valves 86 and 88 control the discharge of liquid Q.

In the method for controlling the circulation device 100, in step J2, valves 51, 71, 86, and 88 are in an open state. The method for controlling the circulation device 100 further includes steps J5 and J6.

Both steps J5 and J6 are executed in the fifth period after the fourth period. In both steps J5 and J6, valves 81, 31, and 80 are closed and pump 12 is driven. In step J5, valve 71 is closed and valve 88 is open. In step J6, valve 51 is closed and valve 86 is open.

Taking steps J5 and J6 together, it can be said that the processing liquid is replaced at least in region R2 from the position where valve 80 is provided to end 707.

Alternatively, the fifth period can be explained by dividing it into a first half and a second half. In the first half of the fifth period, step J5 is performed to replace the treatment liquid in region R2, and in the second half of the fifth period, step J6 is performed to replace the treatment liquid in region R3 from end 707 to end 501.

[3] The method for controlling the circulation device 100 further includes step J7. Step J7 is performed in a sixth period after the fifth period. In step J7, valves 81, 21, 31, 80, 51, 71, 86, and 88 are closed, valve 84 is open, and pump 12 is driven. By performing step J7, the processing liquid in the path of liquid Q supplied from pipe 1 and recovered from pipe 2, specifically pipes P1a, P3a, P1b, and P3b and external path P, is replaced.

[4] The circulation device 100 further includes a flow meter 15. The flow meter 15 is provided between the inlet end 101 and the suction port 12a. The flow meter 15 measures the flow rate of the liquid Q.

For example, the flow rate measured by the flow meter 15 is used to determine step S18, specifically the end of process J4 or the end of the fourth period, for example, the end of the processing liquid in area R1.

For example, the flow rate measured by the flow meter 15 is used to determine the completion of steps S20 and S22, specifically the completion of processes J5 and J6. Alternatively, it can be used to determine when the fifth period ends, for example, whether the processing liquid in regions R2 and R3 has been replaced.

For example, the flow rate measured by the flow meter 15 is used to determine step S24, specifically the end of process J7 or the end of the sixth period, for example, the end of the processing liquid in the external path P.

All or part of the components of each of the above embodiments and various modified examples can be combined as appropriate and consistent.

1 Piping (first piping)
2 Piping (second piping)
3 Piping (third piping)
4 Piping (4th piping)
5, 7 Piping (5th piping)
6, 8 Piping (6th Piping)
11 heater 12 pump 12a intake port 12b discharge port 15 flow meter 21 valve (second valve)
30 Processing liquid supply source (liquid supply source)
31 Valve (third valve)
40 Waste liquid section (external)
Valve 51, 71 (6th valve)
80 valves (5th valve)
81 Valve (first valve)
84 valve (4th valve)
Valves 86 and 88 (7th valve)
100 Circulation device 101 Inflow end (first inflow end)
202 Outlet end (second outlet end)
302 Outlet end (third outlet end)
502, 708 Outlet end (fifth outlet end)
J1 process (1st process)
J2 process (second process)
J3 process (3rd process)
J4 process (4th process)
J5, J6 process (5th process)
J7 process (6th process)
P External path Q Liquid T Reservoir U Control unit

Claims (12)

1. A method for controlling a circulation device that supplies and withdraws liquid to an external pathway, the method comprising:
The circulation device is
a reservoir for storing the liquid;
a first pipe having a first inlet end through which the liquid flows from the reservoir tank and used for supplying the liquid;
a first valve connected to the reservoir tank and controlling discharge of the liquid from the reservoir tank to the outside of the circulation device;
a pump provided in the first pipe, the pump having a suction port connected to the first inlet end and a discharge port, the pump configured to pump out the liquid;
a heater provided in the first pipe and connected to the discharge port, the heater heating the liquid;
a second pipe having a second outlet end through which the liquid is discharged into the reservoir and used for recovering the liquid;
a second valve provided in the second pipe to control the outflow of the liquid from the second outlet end to the reservoir;
a third pipe having a third outlet end through which the liquid flows into the storage tank, the third pipe being a path for the liquid to be stored in the storage tank from a liquid supply source outside the circulation device;
a third valve provided in the third pipe and controlling the outflow of the liquid from the third outlet end to the storage tank;
a fourth pipe connected to the second pipe on the opposite side of the second valve from the second outlet end, the fourth pipe being a path for discharging the liquid from the second pipe to the outside of the circulation device;
a fourth valve provided in the fourth pipe and controlling the discharge of the liquid; and a fifth valve connected to the outlet and controlling the discharge of the liquid to an outside of the circulation device,
The method comprises:
a first step of stopping the pump, closing the third valve, and opening the first valve;
a second step of stopping the pump, closing the third valve, and opening the second valve and the fourth valve;
a third step of stopping the pump, closing the first valve, and opening the third valve after the first step and the second step; and a fourth step of closing the first valve and the third valve, opening the fifth valve, and driving the pump after the third step. The circulation device is
a fifth pipe having a fifth outlet end through which the liquid flows into the reservoir, the fifth pipe being connected to the first pipe on the opposite side of the heater from the pump;
a sixth valve provided in the fifth pipe and controlling the outflow of the liquid from the fifth outlet end to the storage tank;
a sixth pipe connected to the fifth pipe on the side opposite the fifth outlet end with respect to the sixth valve, the sixth pipe being a path for discharging the liquid from the fifth pipe to the outside of the circulation device; and a seventh valve provided in the sixth pipe and controlling the discharging of the liquid,
The method comprises:
In the second step, the sixth valve and the seventh valve are opened,
2. The method for controlling a circulation device according to claim 1, further comprising a fifth step, after the fourth step, of closing the first valve, the third valve, the fifth valve, and the sixth valve, opening the seventh valve, and driving the pump. 3. The method for controlling a circulation device according to claim 2, further comprising a sixth step, after the fifth step, of closing the first valve, the second valve, the third valve, the fifth valve, the sixth valve, and the seventh valve, opening the fourth valve, and driving the pump. The circulation device is
a flow meter disposed between the first inlet end and the suction port for measuring a flow rate of the liquid;
4. The method for controlling a circulation device according to claim 1, wherein the time at which the fourth step ends is determined based on the flow rate. The circulation device is
a flow meter disposed between the first inlet end and the suction port for measuring a flow rate of the liquid;
4. The method for controlling a circulation device according to claim 2, wherein the time at which the fifth step is to be completed is determined based on the flow rate. The circulation device is
a flow meter disposed between the first inlet end and the suction port for measuring a flow rate of the liquid;
4. The method for controlling a circulation device according to claim 3, wherein the time when the sixth step ends is determined based on the flow rate. A circulation device that supplies and recovers liquid to an external path,
a reservoir for storing the liquid;
a first pipe having a first inlet end through which the liquid flows from the reservoir tank and used for supplying the liquid;
a first valve connected to the reservoir tank and controlling discharge of the liquid from the reservoir tank to the outside of the circulation device;
a pump provided in the first pipe, the pump having a suction port connected to the first inlet end and a discharge port, the pump configured to pump out the liquid;
a heater provided in the first pipe and connected to the discharge port, the heater heating the liquid;
a second pipe having a second outlet end through which the liquid is discharged into the reservoir and used for recovering the liquid;
a second valve provided in the second pipe and controlling the outflow of the liquid from the second outlet end to the storage tank;
a third pipe having a third outlet end through which the liquid flows into the storage tank, the third pipe being a path for the liquid to be stored in the storage tank from a liquid supply source outside the circulation device;
a third valve provided in the third pipe and controlling the outflow of the liquid from the third outlet end to the storage tank;
a fourth pipe connected to the second pipe on the opposite side of the second valve from the second outlet end, the fourth pipe being a path for discharging the liquid from the second pipe to the outside of the circulation device;
a fourth valve provided in the fourth pipe and controlling the discharge of the liquid;
a fifth valve connected to the outlet and controlling the discharge of the liquid to the outside of the circulation device; and a control unit that controls the first valve, the second valve, the third valve, the fourth valve, the pump, and the heater,
The control unit
During a first period, the pump is stopped, the third valve is closed, and the first valve is opened;
During a second period, the pump is stopped, the third valve is closed, and the second valve and the fourth valve are opened;
during a third period after the first period and the second period, the pump is stopped, the first valve is closed, and the third valve is opened;
during a fourth period after the third period, the first valve and the third valve are closed, the fifth valve is opened, and the pump is driven;
Circulation device. a fifth pipe having a fifth outlet end through which the liquid flows into the reservoir, the fifth pipe being connected to the first pipe on the opposite side of the heater from the pump;
a sixth valve provided in the fifth pipe and controlling the outflow of the liquid from the fifth outlet end to the storage tank;
a sixth pipe connected to the fifth pipe on the side opposite the fifth outlet end with respect to the sixth valve, the sixth pipe being a path for discharging the liquid from the fifth pipe to the outside of the circulation device; and a seventh valve provided in the sixth pipe and controlling the discharging of the liquid,
The control unit
the sixth valve and the seventh valve are opened during the second period;
during a fifth period after the fourth period, the first valve, the third valve, the fifth valve, and the sixth valve are closed, the seventh valve is opened, and the pump is driven;
The circulation device according to claim 7. The control unit
during a sixth period after the fifth period, the first valve, the second valve, the third valve, the fifth valve, the sixth valve, and the seventh valve are closed, the fourth valve is opened, and the pump is driven;
The circulation device according to claim 8. a flow meter disposed between the first inlet end and the suction port for measuring a flow rate of the liquid;
10. The circulation device according to claim 7, wherein the time when the fourth period ends is determined based on the flow rate. a flow meter disposed between the first inlet end and the suction port for measuring a flow rate of the liquid;
The circulation device according to claim 8 or 9, wherein the time when the fifth period ends is determined based on the flow rate. a flow meter disposed between the first inlet end and the suction port for measuring a flow rate of the liquid;
The circulation device of claim 9 , wherein the time when the sixth period ends is determined based on the flow rate.