JP7795874B2 - Substrate Processing Equipment - Google Patents

Description

This invention relates to a substrate processing apparatus that processes substrates. Examples of substrates include semiconductor wafers, liquid crystal display substrates, organic electroluminescence (EL) substrates, flat panel display (FPD) substrates, optical display substrates, magnetic disk substrates, optical disk substrates, magneto-optical disk substrates, photomask substrates, and solar cell substrates.

Patent Document 1 discloses a substrate processing apparatus. The substrate processing apparatus includes a processing housing and an air supply unit. The processing housing processes substrates inside the processing housing. The air supply unit supplies gas (e.g., air) into the processing housing.

The air supply unit includes a filter, a duct, and a fan. The filter is located on top of the processing housing. The filter blows gas into the processing housing. The duct is located outside the processing housing. The duct is connected to the filter. The fan is located outside the processing housing. The fan is connected to the duct.

The fan is positioned above the filter. In a plan view, the fan is positioned so that it overlaps with the filter. The fan and filter are aligned vertically. The duct extends vertically between the filter and the fan.

Japanese Patent Application Laid-Open No. 2009-200193

However, the substrate processing apparatus of Patent Document 1 has the following problems. The filter is located on top of the processing housing. The fan is located above the filter. As a result, the entire fan is located above the processing housing. As a result, the air supply unit protrudes upward from the processing housing by a large amount. In other words, the protruding length of the air supply unit that protrudes upward from the processing housing is relatively large.

By arranging multiple processing casings vertically, the processing capacity of the substrate processing apparatus can be improved without increasing the footprint of the substrate processing apparatus. However, if the air supply unit protrudes significantly upward from the processing casing, it is difficult to easily increase the number of processing casings lined up vertically, as this would result in the substrate processing apparatus becoming excessively long in length in the vertical direction.

The present invention was made in consideration of these circumstances, and aims to provide a substrate processing apparatus that can reduce the protruding length of the air supply unit that extends upward from the processing housing.

To achieve these objectives, the present invention has the following configuration. Specifically, the present invention provides a substrate processing apparatus comprising: a first processing housing for processing substrates therein; and a first air supply unit for supplying gas into the interior of the first processing housing; the first air supply unit comprising: a filter disposed above the first processing housing and for blowing gas into the interior of the first processing housing; a duct disposed outside the first processing housing and connected to the filter; and a fan disposed outside the first processing housing and connected to the duct; the fan disposed in a position that does not overlap the filter in a plan view; and at least a portion of the fan disposed at the same height as the first processing housing.

The substrate processing apparatus includes a first processing housing and a first air supply unit. The first processing housing processes substrates inside the first processing housing. The first air supply unit supplies gas into the inside of the first processing housing. The first air supply unit includes a filter, a duct, and a fan. The filter is located on top of the first processing housing. The filter blows gas into the inside of the first processing housing. The duct and fan are each provided outside the first processing housing. The duct is connected to the filter. The fan is connected to the duct.

Here, the fan is positioned so that it does not overlap the filter in a plan view. Therefore, the filter and fan are not aligned vertically. Furthermore, at least a portion of the fan is positioned at the same height as the first processing housing. Therefore, at least a portion of the fan does not protrude upward from the first processing housing. Therefore, the protruding length of the first air supply unit that protrudes upward from the first processing housing is reduced.

As described above, the substrate processing apparatus of the present invention can reduce the protruding length of the first air supply unit extending upward from the first processing housing. Hereinafter, the protruding length of the first air supply unit extending upward from the first processing housing will be simply referred to as the "protruding length of the first air supply unit."

In the substrate processing apparatus described above, it is preferable that at least a portion of the fan is positioned lower than the filter. The height position of the fan is relatively low. Therefore, the protruding length of the first air supply unit is suitably reduced.

In the substrate processing apparatus described above, the fan is preferably positioned so that it does not overlap the first processing housing in a plan view. The fan is not positioned above the first processing housing. Therefore, the protruding length of the first air supply unit is effectively reduced.

In the above-described substrate processing apparatus, it is preferable that the protruding length of the first air supply unit extending upward from the first processing housing is no more than twice the length of the filter in the vertical direction. The protruding length of the first air supply unit is sufficiently small.

In the substrate processing apparatus described above, the duct preferably includes a first horizontal section extending substantially horizontally from the filter, a vertical section extending downward from the first horizontal section, and a second horizontal section extending substantially horizontally from the vertical section to the fan and positioned lower than the first horizontal section. The vertical section makes it easy to position the second horizontal section lower than the first horizontal section. The second horizontal section makes it easy to lower the height position of the fan. This effectively reduces the protruding length of the first air supply unit.

In the substrate processing apparatus described above, the first processing housing includes an upper plate, which includes a first upper plate portion on which the filter is installed and a second upper plate portion disposed below the vertical portion and the second horizontal portion, and it is preferable that the second upper plate portion be lower than the first upper plate portion. The second upper plate portion is lower than the first upper plate portion. This makes it easy to lower the height position of the vertical portion. Furthermore, the height position of the second horizontal portion can be easily lowered. This makes it easy to lower the height position of the fan. Therefore, the protruding length of the first air supply unit is suitably reduced.

In the substrate processing apparatus described above, it is preferable that a portion of the duct overlaps the filter when viewed from the front. In other words, it is preferable that a portion of the duct be positioned at the same height as the filter. The height position of the duct is relatively low. Therefore, the protruding length of the first air supply unit is suitably reduced.

In the substrate processing apparatus described above, the duct preferably includes a flat portion disposed above the filter, extending horizontally, and blowing gas downward, and the vertical length of the flat portion is shorter than the vertical length of the filter. The vertical length of the flat portion is shorter than the vertical length of the filter. In other words, the flat portion is thinner than the filter. Therefore, the protruding length of the first air supply unit is preferably reduced.

In the substrate processing apparatus described above, the overall length of the flat portion and the filter in the vertical direction is preferably less than twice the length of the filter in the vertical direction. The height position of the flat portion is relatively low. Therefore, the protruding length of the first air supply unit is suitably reduced.

In the substrate processing apparatus described above, the height position of the upper surface of the flat portion preferably corresponds to the upper end of the duct. The upper end of the duct is relatively low. Therefore, the protruding length of the first air supply unit is suitably reduced.

In the substrate processing apparatus described above, the duct preferably includes an outer groove portion that is connected to the periphery of the flat portion and sends gas to the flat portion, and the length of the outer groove portion in the vertical direction is preferably greater than the length of the flat portion in the vertical direction. The length of the outer groove portion in the vertical direction is greater than the length of the flat portion in the vertical direction. Therefore, the outer groove portion can smoothly supply gas to the flat portion.

In the substrate processing apparatus described above, the outer groove portion preferably has a ring shape surrounding the flat portion in a plan view. The outer groove portion can supply gas to the entire peripheral edge of the flat portion.

In the substrate processing apparatus described above, it is preferable that the outer groove portion extends downward from the peripheral edge of the flat portion, and that at least a portion of the outer groove portion overlaps with the filter in a front view. The outer groove portion extends downward from the peripheral edge of the flat portion. This makes it easy to lower the height position of the outer groove portion. At least a portion of the outer groove portion overlaps with the filter in a front view. This makes the height position of the outer groove portion relatively low. This effectively reduces the protruding length of the first air supply unit.

In the substrate processing apparatus described above, the duct preferably includes a baffle plate installed in the outer groove portion that guides a portion of the gas flowing through the outer groove portion to the flat portion. The baffle plate allows the gas to flow more smoothly from the groove portion to the flat portion. This allows the filter to properly blow out the gas. This allows substrates to be properly processed inside the first processing housing.

In the substrate processing apparatus described above, the baffle plate preferably intersects the direction in which the outer groove portion extends. The baffle plate can effectively guide a portion of the gas flowing through the outer groove portion to the flat portion.

In the above-described substrate processing apparatus, the substrate processing apparatus comprises a transport space extending in a horizontal first direction and adjacent to the first processing housing, a transport mechanism installed in the transport space and transporting substrates into the first processing housing, and a piping space adjacent to the first processing housing. Preferably, the first processing housing and the transport space are perpendicular to the first direction and aligned in a horizontal second direction in a plan view, the first processing housing and the piping space are aligned in the first direction, the fan is open to the piping space, and the fan sends gas in the piping space to a filter. The transport space extends in the first direction. The first processing housing and the transport space are aligned in the second direction in a plan view. The first processing housing and the piping space are aligned in the first direction in a plan view. Therefore, the transport space and the piping space are adjacent to the first processing housing without interfering with each other. The fan is open to the piping space adjacent to the first processing housing. The fan sends gas in the piping space adjacent to the first processing housing to a filter. As a result, the fan can be easily placed near the first processing housing without interfering with the transport mechanism, making it easy to reduce the size of the first air supply unit.

In the above-described substrate processing apparatus, it is preferable that the first processing housing has an exhaust port formed in a position facing the piping space, and that the fan be positioned above the exhaust port. The fan does not interfere with the exhaust port.

In the above-described substrate processing apparatus, the substrate processing apparatus comprises a horizontal exhaust section provided in the piping space, connected to the exhaust port, and extending horizontally, and a vertical exhaust section provided in the piping space, connected to the horizontal exhaust section, and extending vertically; the fan is preferably positioned higher than the horizontal exhaust section, and the fan and the vertical exhaust section are aligned in the second direction when viewed from the front. The fan is positioned higher than the horizontal exhaust section. Therefore, the fan does not interfere with the horizontal exhaust section. The fan and the vertical exhaust section are aligned in the second direction when viewed from the first direction. Therefore, the fan does not interfere with the vertical exhaust section.

In the substrate processing apparatus described above, the vertical exhaust unit includes a first vertical exhaust pipe extending vertically and a second vertical exhaust pipe extending vertically. The horizontal exhaust unit includes a switching mechanism that switches the exhaust path of the first processing housing to one of the first vertical exhaust pipe and the second vertical exhaust pipe. Preferably, the fan, the first vertical exhaust pipe, and the second vertical exhaust pipe are aligned in the second direction when viewed from the first direction. The switching mechanism and the first vertical exhaust pipe and the second vertical exhaust pipe enable gas to be properly exhausted from inside the first processing housing. This allows substrates to be properly processed inside the first processing housing. The fan, the first vertical exhaust pipe, and the second vertical exhaust pipe are aligned in the second direction when viewed from the front. Therefore, the fan does not interfere with the first vertical exhaust pipe and the second vertical exhaust pipe.

The substrate processing apparatus described above preferably includes a pressure sensor that measures the pressure of the gas inside the first processing housing, and a control unit that controls the fan based on the detection result of the pressure sensor. The control unit can suitably control the pressure of the gas inside the first processing housing. Therefore, substrates can be appropriately processed inside the first processing housing.

The substrate processing apparatus described above includes an adjustment unit installed inside the first processing housing, which receives the gas blown out from the filter and blows the gas downward; and a substrate holding unit installed inside the first processing housing and positioned below the adjustment unit, which holds a substrate. The filter blows the gas downward. The adjustment unit includes an adjustment chamber positioned below the filter, extending horizontally, and larger than the filter in a plan view. A guide member is provided in the adjustment chamber and guides the gas downward in the adjustment chamber. A blowout plate positioned below the adjustment chamber, extending horizontally, and having a plurality of blowout holes is preferably arranged. All of the guide member is positioned outside the filter in a plan view, and all of the guide member is positioned outside the substrate held by the substrate holding unit in a plan view.

The filter blows gas downward. The adjustment chamber is located below the filter. Therefore, the adjustment unit can optimally receive the gas blown out from the filter in the adjustment chamber.

The blow-out plate is positioned below the adjustment chamber. It extends horizontally. The blow-out plate has multiple blow-out holes. This allows the adjustment unit to optimally blow gas downward from the blow-out plate through the blow-out holes.

The substrate holding unit is installed inside the first processing housing. The substrate holding unit is positioned below the adjustment unit. The substrate holding unit holds the substrate. This allows the adjustment unit to optimally supply gas to the substrate held by the substrate holding unit.

The adjustment chamber extends horizontally. In plan view, the adjustment chamber is larger than the filter. The guide member is provided in the adjustment chamber. The guide member guides gas downward in the adjustment chamber. In plan view, the entire guide member is positioned outside the filter. Therefore, the guide member prevents the blow-out plate from including a defective blow-out portion. A defective blow-out portion is a portion of the blow-out plate that does not substantially blow out gas. In other words, the blow-out plate does not include an outlet that does not substantially blow out gas. All blow-out holes blow out gas.

In plan view, the entire guide member is positioned outward from the substrate held by the substrate holding unit. Here, the portion of the blow-out plate located below the guide member is called the guide zone. The airflow blown out by the guide zone is called the third blow-out flow. In plan view, the guide zone is positioned outward from the substrate held by the substrate holding unit. The third blow-out flow is relatively strong. Therefore, the third blow-out flow protects the substrate held by the substrate holding unit from the atmosphere outside the third blow-out flow. Therefore, the third blow-out flow keeps the substrate held by the substrate holding unit clean. As a result, the substrate processing apparatus can process substrates held by the substrate holding unit with high quality.

In the substrate processing apparatus described above, the guide member is preferably disposed only in the upper part of the adjustment chamber and extends vertically. The guide member can effectively guide the gas downward in the adjustment chamber. Furthermore, the gas flows smoothly through the lower part of the adjustment chamber. Therefore, the gas in the adjustment chamber flows smoothly along the blow-out plate. As a result, the guide member further prevents the blow-out plate from having poor blow-out areas.

The substrate processing apparatus described above preferably includes a blocking wall that closes the side of the adjustment chamber. The blocking wall prevents gas from escaping from the adjustment chamber through the side of the adjustment chamber. As a result, all of the gas in the adjustment chamber exits the blow-out plate through the blow-out holes. Therefore, the blocking member further prevents the blow-out plate from having any defective blow-out areas.

The substrate processing apparatus described above further comprises a discharge unit installed inside the first processing housing and configured to discharge processing liquid onto the substrate held by the substrate holding unit, the discharge unit including a tip portion movable between a discharge position and a standby position, and when the tip portion is in the standby position, the tip portion is preferably positioned outward of the substrate held by the substrate holding unit in a plan view, and when the tip portion is in the standby position, the guide member is preferably positioned between the tip portion and the substrate held by the substrate holding unit in a plan view. When the tip portion is in the standby position, the guide member is preferably positioned between the tip portion and the substrate held by the substrate holding unit in a plan view. Therefore, when the tip portion is in the standby position, the guide zone is positioned between the tip portion and the substrate held by the substrate holding unit in a plan view. When the tip portion is in the standby position, the third blown airflow is blown toward between the tip portion and the substrate held by the substrate holding unit. Therefore, when the tip portion is in the standby position, the third blown airflow protects the substrate held by the substrate holding unit from the tip portion. Therefore, the third outlet flow keeps the substrates held by the substrate holders even cleaner. As a result, the substrate processing apparatus can process the substrates held by the substrate holders with high quality.

In the above-described substrate processing apparatus, it is preferable that the apparatus further comprises a cup installed inside the first processing housing, arranged around the substrate holding unit, and configured to receive the processing liquid, and that at least a portion of the guide member overlaps with the cup in a plan view. At least a portion of the guide member overlaps with the cup in a plan view. Therefore, at least a portion of the guide zone overlaps with the cup in a plan view. At least a portion of the third outlet flow is blown toward the cup. Therefore, the third outlet flow effectively protects the substrate held by the substrate holding unit. Therefore, the third outlet flow effectively keeps the substrate held by the substrate holding unit clean. As a result, the substrate processing apparatus can process the substrate held by the substrate holding unit with high quality.

In the above-described substrate processing apparatus, it is preferable that the blow-off plate be detachable from the first processing housing. This allows for easy maintenance of the blow-off plate.

In the substrate processing apparatus described above, the blow plate preferably comprises a first member and a second member adjacent to the first member. The blow plate includes a first member and a second member. The first member is smaller than the entire blow plate. This makes it easier to maintain the first member. The second member is smaller than the entire blow plate. This makes it easier to maintain the second member. This makes it easier to maintain the blow plate.

The present invention is a substrate processing apparatus comprising: a first processing housing for processing substrates therein; and a first gas supply unit for supplying gas into the first processing housing; the first gas supply unit comprising: a filter disposed above the first processing housing and blowing gas into the interior of the first processing housing; and a duct disposed outside the first processing housing and connected to the filter; the duct comprising: a flat portion disposed above the filter, extending horizontally, and blowing gas downward; and an outer groove portion connected to the periphery of the flat portion and supplying gas to the flat portion; the length of the outer groove portion in the vertical direction being greater than the length of the flat portion in the vertical direction.

The length of the outer groove portion in the vertical direction is greater than the length of the flat portion in the vertical direction. Therefore, the outer groove portion can smoothly supply gas to the flat portion. As a result, the flat portion can be easily made thinner. Therefore, the protruding length of the first air supply unit is suitably reduced.

The substrate processing apparatus of the present invention can reduce the protruding length of the first air supply unit that extends upward from the first processing housing.

FIG. 2 is a plan view showing the inside of the substrate processing apparatus according to the embodiment. FIG. 2 is a front view of the processing block. FIG. 2 is a right side view showing the configuration of the left part of the substrate processing apparatus. FIG. FIG. FIG. FIG. FIG. 2 is a vertical cross-sectional view of the processing housing. FIG. 1 is a vertical cross-sectional view of a portion of a duct. FIG. 2 is a horizontal cross-sectional view of a portion of the duct. 10A and 10B are diagrams illustrating the flow of gas in a flat portion and an outer groove portion. 10A and 10B are diagrams illustrating the flow of gas in a flat portion and an outer groove portion. FIG. 2 is a plan view showing the inside of the processing housing. FIG. 2 is a control block diagram of the substrate processing apparatus. FIG. 10 is a side view of a processing housing according to a modified embodiment. FIG. 10 is a side view of a processing housing according to a modified embodiment. FIG. 10 is a plan view showing the inside of a processing housing in a modified embodiment. FIG. 10 is a vertical cross-sectional view of a processing housing according to a modified embodiment. FIG. 10 is a plan view of an adjustment section in a modified embodiment. FIG. 10 is a plan view showing the inside of a processing housing in a modified embodiment. FIG. 10 is a vertical cross-sectional view of a processing housing according to a modified embodiment. FIG. 10 is a plan view of a blow-out plate in a modified embodiment.

The substrate processing apparatus of the present invention will be described below with reference to the drawings.

<1. Overview of the substrate processing apparatus>
1 is a plan view showing the inside of a substrate processing apparatus 1 according to an embodiment of the present invention. The substrate processing apparatus 1 processes a substrate (e.g., a semiconductor wafer) W.

Substrate W is, for example, a semiconductor wafer, a liquid crystal display substrate, an organic electroluminescence (EL) substrate, an FPD (flat panel display) substrate, an optical display substrate, a magnetic disk substrate, an optical disk substrate, a magneto-optical disk substrate, a photomask substrate, or a solar cell substrate. Substrate W has a thin, flat plate shape. Substrate W has a roughly circular shape in a plan view.

The substrate processing apparatus 1 includes an indexer unit 3 and a processing block 11. The processing block 11 is connected to the indexer unit 3. The indexer unit 3 supplies substrates W to the processing block 11. The processing block 11 processes the substrates W. The indexer unit 3 retrieves the substrates W from the processing block 11.

For convenience, in this specification, the direction in which the indexer unit 3 and processing block 11 are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the processing block 11 toward the indexer unit 3 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For reference, front, rear, right, left, top, and bottom are indicated in each figure as appropriate.

The front-to-rear direction X is an example of the first direction in this invention. The width direction Y is an example of the second direction in this invention.

When no distinction is made between "forward," "backward," "rightward," and "leftward," they are referred to as "horizontal" or "lateral."

The indexer unit 3 has multiple (e.g., four) carrier placement units 4. The carrier placement units 4 are arranged in the width direction Y. Each carrier placement unit 4 places one carrier C thereon. The carrier C stores multiple substrates W. The carrier C is, for example, a FOUP (front opening unified pod).

The indexer unit 3 has a transport space 5. The transport space 5 is located behind the carrier placement unit 4.

The indexer unit 3 includes a transport mechanism 6. The transport mechanism 6 is installed in the transport space 5. The transport mechanism 6 is located behind the carrier platform 4. The transport mechanism 6 transports substrates W. The transport mechanism 6 is accessible to the carriers C placed on the carrier platform 4.

The structure of the transport mechanism 6 will now be described. The transport mechanism 6 comprises a hand 7 and a hand drive unit 8. The hand 7 supports one substrate W in a horizontal position. The hand drive unit 8 is connected to the hand 7. The hand drive unit 8 moves the hand 7.

The structure of the hand driver 8 is illustrated below. The hand driver 8 includes a first driver 8a and a second driver 8b. The first driver 8a itself is unable to move horizontally. The first driver 8a supports the second driver 8b. The first driver 8a moves the second driver 8b in the vertical direction Z. The first driver 8a further rotates the second driver 8b around a rotation axis parallel to the vertical direction Z. The second driver 8b supports the hand 7. The second driver 8b moves the hand 7 back and forth horizontally relative to the first driver 8a. The second driver 8b is configured, for example, as an articulated arm.

Using the hand drive unit 8 described above, the hand 7 can move in the vertical direction Z. The hand 7 can move in the horizontal direction. The hand 7 can rotate within a horizontal plane.

The processing block 11 includes a transport space 12A. The transport space 12A is located in the center of the processing block 11 in the width direction Y. The transport space 12A extends in the front-to-rear direction X. The front of the transport space 12A is connected to the transport space 5 of the indexer unit 3.

The processing block 11 is equipped with a transport mechanism 13A. The transport mechanism 13A is installed in the transport space 12A. The transport mechanism 13A transports substrates W.

The processing block 11 includes a substrate placement unit 16A. The substrate placement unit 16A is installed in the transport space 12A. The substrate placement unit 16A is located in front of the transport mechanism 13A. The transport mechanism 13A is accessible to the substrate placement unit 16A. The transport mechanism 6 of the indexer unit 3 is also accessible to the substrate placement unit 16A. The substrate placement unit 16A places substrates W to be transported between the transport mechanism 6 and the transport mechanism 13A.

Figure 2 is a front view of the processing block 11. In addition to the transport space 12A, the processing block 11 also has a transport space 12B. The transport space 12B is located below the transport space 12A. In a plan view, the transport space 12B is located at the same position as the transport space 12A. The transport space 12B is connected to the transport space 5 of the indexer unit 3.

The processing block 11 has one partition wall 17. The partition wall 17 is located below the transport space 12A and above the transport space 12B. The partition wall 17 has a horizontal plate shape. The partition wall 17 separates the transport space 12A from the transport space 12B.

In addition to transport mechanism 13A, processing block 11 is equipped with transport mechanism 13B. Transport mechanism 13B is installed in transport space 12B. Transport mechanism 13B is installed below transport mechanism 13A. Transport mechanism 13B transports substrates W.

Although not shown, the processing block 11 has a substrate placement unit provided in the transport space 12B. This allows the transport mechanism 6 and the transport mechanism 13B to transfer substrates W to each other.

Transport mechanisms 13A and 13B have the same structure. When there is no need to distinguish between transport mechanisms 13A and 13B, they will be referred to as transport mechanism 13.

The structure of the transport mechanism 13 will now be described. The transport mechanism 13 comprises a hand 14 and a hand driver 15. The hand 14 supports one substrate W in a horizontal position. The hand driver 15 is connected to the hand 14. The hand driver 15 moves the hand 14. The hand driver 15 moves the hand 14 in the front-to-rear direction X, the width direction Y, and the vertical direction Z.

An example of the structure of the hand drive unit 15 is shown below. The hand drive unit 15 includes, for example, two support pillars 15a, a vertical movement unit 15b, a horizontal movement unit 15c, a rotation unit 15d, and an advance/retract movement unit 15e. The support pillars 15a are fixedly installed. The support pillars 15a are arranged on the sides of the transport space 12A. The two support pillars 15a are aligned in the front-to-rear direction X. Each support pillar 15a extends in the vertical direction Z. Each support pillar 15a supports a vertical movement unit 15b. The vertical movement unit 15b extends in the front-to-rear direction X between the two support pillars 15a. The vertical movement unit 15b moves parallel to the support pillars 15a in the vertical direction Z. The vertical movement unit 15b supports the horizontal movement unit 15c. The horizontal movement unit 15c moves parallel to the front-to-rear direction X relative to the vertical movement unit 15b. The horizontal movement unit 15c supports the rotation unit 15d. The rotating unit 15d rotates relative to the horizontal moving unit 15c. The rotating unit 15d rotates around a rotation axis parallel to the vertical direction Z. The rotating unit 15d supports the advancing and retreating moving unit 15e. The advancing and retreating moving unit 15e supports the hand 14. The advancing and retreating moving unit 15e moves the hand 14 forward and backward relative to the rotating unit 15d. The advancing and retreating moving unit 15e moves the hand 14 back and forth in one horizontal direction determined by the orientation of the rotating unit 15d.

The hand drive unit 15 described above allows the hand 14 to move parallel to the vertical direction Z. The hand 14 can move parallel to the front-to-rear direction X. The hand 14 can rotate within a horizontal plane. The hand 14 can move forward and backward relative to the rotation unit 15d.

When there is no need to distinguish between transport spaces 12A and 12B, they will be referred to as transport space 12 as appropriate.

The processing block 11 includes processing towers 21A, 21B, 21C, and 21D. Processing towers 21A and 21B are located to the left of the transport space 12. Processing towers 21A and 21B are aligned in the front-to-back direction X. Processing towers 21C and 21D are located to the right of the transport space 12. Processing towers 21C and 21D are aligned in the front-to-back direction X.

The processing block 11 includes piping spaces 51A, 51B, 51C, and 51D. Piping spaces 51A and 51B are located to the left of the transport space 12. Piping space 51A is adjacent to the processing tower 21A. Piping space 51B is adjacent to the processing tower 21B. Piping spaces 51C and 51D are located to the right of the transport space 12. Piping space 51C is adjacent to the processing tower 21C. Piping space 51D is adjacent to the processing tower 21D. Each of the piping spaces 51A-51D is separated from the transport space 12.

Figure 3 is a right side view showing the configuration of the left section of the substrate processing apparatus. The processing tower 21A has multiple (e.g., six) processing casings 22. All processing casings 22 belonging to the processing tower 21A are aligned in a row in the vertical direction Z. The processing casings 22 belonging to the processing tower 21A are stacked on top of each other.

The piping space 51A extends in the vertical direction Z. The piping space 51A is adjacent to each processing casing 22 belonging to the processing tower 21A.

The piping space 51A is open to the outside of the substrate processing apparatus 1. For example, the processing block 11 has an opening 52 formed above the piping space 51A.

Refer to Figure 2. Each processing casing 22 belonging to processing tower 21A is adjacent to transport space 12. Some processing casings 22 belonging to processing tower 21A are adjacent to transport space 12A. Other processing casings 22 belonging to processing tower 21A are adjacent to transport space 12B.

See Figures 1-3. The processing tower 21B has multiple (e.g., six) processing casings 22. The processing casings 22 belonging to the processing tower 21B are arranged in the same manner as the processing casings 22 belonging to the processing tower 21A. The piping space 51B is configured in the same manner as the piping space 51A. Therefore, each processing casing 22 belonging to the processing tower 21B is adjacent to the piping space 51B. Each processing casing 22 belonging to the processing tower 21B is adjacent to the transport space 12.

Each of the processing towers 21C and 21D has a plurality of processing casings 22 (e.g., six). The processing casings 22 belonging to the processing towers 21C and 21D are arranged in the same manner as the processing casings 22 belonging to the processing tower 21A. The piping spaces 51C and 51D are configured in the same manner as the piping space 51A. Therefore, each processing casing 22 belonging to the processing tower 21C is adjacent to the piping space 51C. Each processing casing 22 belonging to the processing tower 21C is adjacent to the transport space 12. Each processing casing 22 belonging to the processing tower 21D is adjacent to the piping space 51D. Each processing casing 22 belonging to the processing tower 21D is adjacent to the transport space 12.

The transport mechanism 13 transports substrates W to all processing housings 22 belonging to processing towers 21A-21D. Specifically, the transport mechanism 13A transports substrates W to the processing housing 22 adjacent to the transport space 12A. The transport mechanism 13B transports substrates W to the processing housing 22 adjacent to the transport space 12B.

Refer to Figure 1. The processing casing 22 and the transport space 12 are aligned in the width direction Y in a plan view. For example, the processing casing 22 and the transport space 12 belonging to processing tower 21A are aligned in the width direction Y in a plan view. For example, the processing casing 22 and the transport space 12 belonging to processing tower 21C are aligned in the width direction Y in a plan view.

When piping spaces 51A-51D are not distinguished, they will be referred to as piping space 51 as appropriate. The processing casing 22 and piping space 51 are aligned in the front-to-back direction X in a plan view. For example, the processing casing 22 belonging to processing tower 21A and the piping space 51A adjacent to processing tower 21A are aligned in the front-to-back direction X in a plan view. For example, the processing casing 22 belonging to processing tower 21C and the piping space 51C adjacent to processing tower 21C are aligned in the front-to-back direction X in a plan view.

2. Internal configuration of processing housing 22
Referring to Figure 1, the processing housings 22 belonging to the processing towers 21A-21D have the same structure. The processing housings 22 process substrates W therein. The processing housings 22 define a processing space for processing the substrates W therein. The substrate processing apparatus 1 includes a substrate holding unit 26 and a discharge unit 27. The substrate holding unit 26 is disposed inside the processing housing 22. The substrate holding unit 26 holds the substrate W. The discharge unit 27 is disposed inside the processing housing 22. The discharge unit 27 discharges a processing liquid onto the substrate W held by the substrate holding unit 26.

Figure 4 is a perspective view of the processing housing 22. Figure 5 is a plan view of the processing housing 22. Figure 6 is a front view of the processing housing 22. Figure 7 is a side view of the processing housing 22. The processing housing 22 has a generally box-like shape.

The processing housing 22 has a transfer opening 25. The transfer opening 25 is located adjacent to the transfer space 12. The transfer opening 25 faces the transfer space 12. The substrate W can pass through the transfer opening 25. The transport mechanism 13 transports the substrate W into the processing housing 22. The transport mechanism 13 transports the substrate W to the substrate holder 26 through the transfer opening 25.

Figure 8 is a vertical cross-sectional view of the processing housing. For convenience, the discharge unit 27 is not shown in Figure 8. The substrate holder 26 holds one substrate W in a horizontal position.

The substrate processing apparatus 1 includes a rotational drive unit 28. The rotational drive unit 28 is installed inside the processing housing 22. The rotational drive unit 28 is connected to the substrate holding unit 26. The rotational drive unit 28 rotates the substrate holding unit 26. The substrate W held by the substrate holding unit 26 rotates integrally with the substrate holding unit 26.

The substrate processing apparatus 1 includes a cup 29. The cup 29 is provided inside the processing housing 22. The cup 29 has a generally cylindrical shape. The cup 29 is arranged around the substrate holder 26. The cup 29 catches processing liquid splashed from the substrate W held by the substrate holder 26.

The processing housing 22 has an upper plate 24. The upper plate 24 is disposed at the top of the processing housing 22. The upper plate 24 extends in a substantially horizontal direction.

The upper plate 24 has a recessed space S that is recessed downward. Specifically, the upper plate 24 has a first upper plate portion 24a and a second upper plate portion 24b. The second upper plate portion 24b is lower than the first upper plate portion 24a. The first upper plate portion 24a is positioned above the substrate holding portion 26. The second upper plate portion 24b is positioned close to the piping space 51. The recessed space S is located above the second upper plate portion 24b.

<3. Configuration of the air supply unit>
2 and 3, the substrate processing apparatus 1 includes a plurality of (for example, 24) gas supply units 30. The gas supply units 30 supply gas (for example, air) into the processing housing 22.

One air supply unit 30 is provided for each processing housing 22. Each air supply unit 30 supplies gas to only one processing housing 22. Each air supply unit 30 does not supply gas to more than one processing housing 22.

For convenience, Figure 8 illustrates the entire air supply unit 30. The air supply unit 30 includes a filter 31, a duct 32, and a fan 41. The filter 31 is disposed on top of the processing housing 22. The filter 31 blows gas into the interior of the processing housing 22. The duct 32 is provided outside the processing housing 22. The duct 32 is connected to the filter 31. The fan 41 is provided outside the processing housing 22. The fan 41 is connected to the duct 32.

The filter 31 is installed on the upper plate 24. The filter 31 is installed on the first upper plate portion 24a. The filter 31 is positioned above the substrate holder 26.

The fan 41 sends gas. The gas flows from the fan 41 through the duct 32 to the filter 31. One fan 41 sends gas to only one filter 31. The filter 31 filters the gas. The filter 31 blows out the filtered gas. The filter 31 is, for example, a ULPA (UltraLow Penetration Air) filter. The gas flows from the filter 31 into the inside of the processing housing 22. One fan 41 sends gas to only one processing housing 22. The airflow volume of one fan 41 corresponds to the amount of gas supplied to one processing housing 22.

The fan 41 sends gas horizontally. The filter 31 blows the gas downward. Figure 8 shows a schematic diagram of the flow of gas sent by the fan 41 and the flow of gas blown out by the filter 31. The airflow direction of the fan 41 is different from the airflow direction of the filter 31. For example, the airflow direction of the fan 41 is perpendicular to the airflow direction of the filter 31.

The gas blown out from the filter 31 reaches the substrate holder 26. A downward airflow (downflow) is formed around the substrate W held by the substrate holder 26.

The arrangement of the processing housing 22, filter 31, duct 32, and fan 41 is explained below.

At least a portion of the filter 31 is positioned higher than the processing housing 22. For example, the entire filter 31 is positioned higher than the processing housing 22. For example, the entire filter 31 is positioned above the processing housing 22.

A portion of the duct 32 is positioned higher than the processing housing 22. The other portion of the duct 32 is positioned at the same height as the processing housing 22. Specifically, the processing housing 22 has an upper end 23t and a lower end 23b. For example, the height position of the upper plate 24 corresponds to the upper end 23t. A portion of the duct 32 is positioned higher than the upper end 23t. The other portion of the duct 32 is positioned at a position equal to or lower than the upper end 23t and equal to or higher than the lower end 23b. The entire duct 32 is positioned at a position equal to or higher than the lower end 23b.

At least a portion of the duct 32 is positioned above the processing housing 22. The duct 32 is positioned adjacent to the upper plate 24. The duct 32 extends along the upper plate 24.

Duct 32 has a portion that is positioned higher than filter 31 and a portion that is positioned lower than filter 31. Therefore, duct 32 extends from a position higher than filter 31 to a position lower than filter 31.

The duct 32 has a portion that is positioned above the filter 31. The duct 32 covers the upper part of the filter 31. The duct 32 extends from the filter 31 in a substantially horizontal direction. The duct 32 extends from the filter 31 to the piping space 51.

At least a portion of the fan 41 is positioned at the same height as the processing housing 22. At least a portion of the fan 41 is positioned at a position equal to or lower than the upper end 23t and equal to or higher than the lower end 23b.

All of the fans 41 are positioned higher than the lower end 23b.

The fan 41 includes a portion that is positioned higher than the processing housing 22. Therefore, the fan 41 extends from a position higher than the upper end 23t to a position lower than the upper end 23t.

The fan 41 has a portion that is positioned lower than the second upper plate portion 24B. Therefore, the fan 41 extends from a position higher than the first upper plate portion 24a to a position lower than the second upper plate portion 24B.

The fan 41 is positioned on the side of the processing housing 22. The entire fan 41 is positioned on the side of the processing housing 22. The fan 41 is not positioned above the processing housing 22.

At least a portion of the fan 41 is positioned lower than the filter 31.

The fan 41 includes a portion that is positioned higher than the filter 31. Therefore, the fan 41 extends from a position higher than the filter 31 to a position lower than the filter 31.

The fan 41 is positioned to the side of the filter 31. The entire fan 41 is positioned to the side of the filter 31. The fan 41 is not positioned above the filter 31. The filter 31 and fan 41 are not aligned in the vertical direction Z.

At least a portion of the fan 41 is positioned at a position equal to or lower than the duct 32. Specifically, the duct 32 has an upper end 32t. At least a portion of the fan 41 is positioned at a position equal to or lower than the upper end 32t.

In this embodiment, the entire fan 41 is positioned lower than the upper end 32t. Therefore, the upper end 32t corresponds to the upper end of the air supply unit 30.

Figure 5 shows the filter 31 with a dashed line. The filter 31 has a substantially rectangular shape in a plan view. The entire filter 31 overlaps the processing housing 22 in a plan view.

A large portion of the duct 32 overlaps with the processing housing 22 in a plan view. The other portion of the duct 32 does not overlap with the processing housing 22 in a plan view. The other portion of the duct 32 is disposed in the piping space 51.

The duct 32 overlaps the entire filter 31 in a plan view.

The fan 41 is positioned so that it does not overlap with the processing housing 22 in a plan view. The fan 41 does not have any portion that overlaps with the processing housing 22 in a plan view.

The fan 41 is positioned so that it does not overlap the filter 31 in a plan view. The fan 41 does not have any portion that overlaps with the filter 31 in a plan view.

The fan 41 is arranged in the piping space 51. For example, all of the fan 41 is arranged in the piping space 51.

The fan 41 is open to the piping space 51. The fan 41 takes in gas from the piping space 51. The fan 41 sends the gas from the piping space 51 to the filter 31.

Figure 6 shows part of the filter 31 with a dashed line. Part of the duct 32 overlaps with the filter 31 when viewed from the front of the processing housing 22.

Figure 7 shows a portion of the processing housing 22 with a dashed line. A portion of the duct 32 overlaps with the filter 31 when viewed from the side of the processing housing 22. At least a portion of the fan 41 overlaps with the processing housing 22 when viewed from the side of the processing housing 22.

4. Detailed Configuration of Filter 31 and Duct 32
8, the filter 31 extends in the horizontal direction. The filter 31 has a flat shape. The length L1 of the filter 31 in the vertical direction Z is shorter than the length of the filter 31 in the horizontal direction.

The filter 31 has an upper surface 31a and a lower surface 31b. The upper surface 31a and the lower surface 31b are each approximately horizontal. The filter 31 takes in gas from the upper surface 31a. The filter 31 releases gas from the lower surface 31b. The lower surface 31b corresponds to the blowing surface of the filter 31.

The upper surface 31a of the filter 31 is positioned higher than the processing housing 22. The lower surface 31b of the filter 31 is positioned at approximately the same height as the first upper plate portion 24a.

See Figures 4 and 6. The duct 32 has a first horizontal section 33, a vertical section 38, and a second horizontal section 39. The first horizontal section 33 extends horizontally from the filter 31. The vertical section 38 extends downward from the first horizontal section 33. The second horizontal section 39 extends horizontally from the vertical section 38 to the fan 41. The second horizontal section 39 is positioned lower than the first horizontal section 33.

See Figure 5. The entire first horizontal portion 33 overlaps with the processing housing 22 in a plan view. The entire vertical portion 38 overlaps with the processing housing 22 in a plan view. The second horizontal portion 39 has a portion that overlaps with the processing housing 22 and a portion that does not overlap with the processing housing 22 in a plan view.

The first horizontal portion 33 overlaps the entire filter 31 in a planar view. The vertical portion 38 does not overlap the filter 31 in a planar view. The second horizontal portion 39 does not overlap the filter 31 in a planar view.

The first horizontal portion 33 has a flat portion 34. The flat portion 34 has a peripheral edge portion 35. The flat portion 34 has a substantially rectangular shape in a plan view.

The flat portion 34 overlaps the entire filter 31 in a plan view. The flat portion 34 has approximately the same area as the filter 31 in a plan view. The flat portion 34 is slightly larger than the filter 31 in a plan view.

The first horizontal portion 33 has an outer groove 36. In a plan view, the outer groove 36 is arranged around the flat portion 34. In a plan view, the outer groove 36 has a ring shape that surrounds the flat portion 34. The outer groove 36 is connected to the peripheral edge 35 of the flat portion 34. The outer groove 36 is connected to the entire peripheral edge 35 of the flat portion 34. The outer groove 36 is connected to the entire circumference of the peripheral edge 35 of the flat portion 34.

The outer groove portion 36 has a ring shape that surrounds the filter 31 in a plan view. The outer groove portion 36 does not overlap with the filter 31 in a plan view.

Furthermore, the outer groove 36 extends from a portion of the peripheral edge 35 of the flat portion 34 to the vertical portion 38. The flat portion 34 is indirectly connected to the vertical portion 38 via the outer groove 36. The outer groove 36 delivers gas to the flat portion 34.

Refer to Figure 8. The first horizontal portion 33 is positioned above the first upper plate portion 24a. The first horizontal portion 33 extends along the first upper plate portion 24a. The vertical portion 38 is positioned above the second upper plate portion 24b. The vertical portion 38 extends to a position lower than the first upper plate portion 24a. The second horizontal portion 39 is positioned above the second upper plate portion 24b. At least a portion of the second horizontal portion 39 is positioned at a position lower than the first upper plate portion 24a. The vertical portion 38 and the second horizontal portion 39 are each positioned in the recessed space S. The second horizontal portion 39 extends along the second upper plate portion 24b. The second horizontal portion 39 extends to the piping space 51.

The first horizontal section 33 includes the upper end 32t of the duct 32.

The flat portion 34 extends horizontally. The flat portion 34 is positioned above the filter 31. The flat portion 34 covers the upper part of the filter 31. The flat portion 34 is positioned close to the filter 31. The flat portion 34 blows gas downward.

Figure 8 shows the length L1 of the filter 31 in the vertical direction. Figure 8 shows the overall length L2 of the flattened portion 34 and the filter 31 in the vertical direction Z. Length L2 is greater than length L1. Length L2 is less than twice length L1.

The outer groove portion 36 extends downward from the flat portion 34. The outer groove portion 36 extends to a position lower than the upper surface 31a of the filter 31. The entire outer groove portion 36 is positioned higher than the lower surface 31b of the filter 31. The outer groove portion 36 is positioned close to the side of the filter 31.

The outer groove 36 does not extend upward from the flat portion 34. The outer groove 36 does not extend to a position higher than the flat portion 34. The entire outer groove 36 is positioned at a position equal to or lower than the flat portion 34.

The first horizontal portion 33 shown in Figure 6 corresponds to the outer groove portion 36. The outer groove portion 36 extends in a substantially horizontal direction. At least a portion of the outer groove portion 36 overlaps with the filter 31 when the processing housing 22 is viewed from the front.

Figure 9 is a vertical cross-sectional view of a portion of the duct 32. The flat portion 34 has an upper surface 34a. The height position of the upper surface 34a corresponds to the upper end 32t of the duct 32. The height position of the upper surface 34a corresponds to the upper end of the air supply unit 30.

The flat portion 34 has a lower surface 34b and an opening 34c. The lower surface 34b and opening 34c are located below the upper surface 34a. The opening 34c is formed in the lower surface 34b. The opening 34c extends over most of the lower surface 34b. The position of the lower surface 34b corresponds to the peripheral edge 35 of the flat portion 34.

In a plan view, the opening 34c has approximately the same area as the filter 31. The opening 34c is positioned above the upper surface 31a of the filter 31. The opening 34c is positioned close to the upper surface 31a of the filter 31. The flat portion 34 supplies gas to the filter 31 through the opening 34c.

The outer groove portion 36 extends downward from the peripheral edge portion 35 of the flat portion 34.

Figure 9 shows the length L3 of the flat portion 34 in the vertical direction Z and the length L4 of the outer groove portion 36 in the vertical direction Z. Length L3 is smaller than length L1. Length L4 is larger than length L3.

Figure 10 is a horizontal cross-sectional view of a portion of the duct 32. The peripheral edge 35 includes a first side 35a, a second side 35b, a third side 35c, and a fourth side 35d. The outer groove 36 includes a first portion 36a, a second portion 36b, a third portion 36c, and a fourth portion 36d. The first portion 36a is connected to the first side 35a. The first portion 36a extends along the first side 35a. Similarly, the second to fourth portions 36b-36d are connected to the second to fourth sides 35b-35d, respectively. The second to fourth portions 36b-36d extend along the second to fourth sides 35b-35d, respectively. The first to fourth portions 36a-36d are connected in a circular shape.

The first portion 36a and the second portion 36b each extend to the vertical portion 38. The first portion 36a and the second portion 36b are close to the vertical portion 38. The third portion 36c and the fourth portion 36d are far from the vertical portion 38. The third portion 36c is narrower than the first portion 36a and the second portion 36b in a plan view. The fourth portion 36d is narrower than the first portion 36a and the second portion 36b in a plan view.

The duct 32 is equipped with one or more baffles 37. The baffles 37 are also called baffles. The baffles 37 are installed in the outer groove portion 36. The baffles 37 guide a portion of the gas flowing through the outer groove portion 36 to the flat portion 34.

The baffle plate 37 intersects with the extension direction of the outer groove portion 36. For example, the baffle plate 37 is perpendicular to the extension direction of the outer groove portion 36. For example, the baffle plate 37 has a substantially vertical plate shape.

The baffle plate 37 narrows the flow path of the outer groove portion 36. The baffle plate 37 blocks only a portion of the flow path of the outer groove portion 36. The baffle plate 37 is, for example, positioned only below the outer groove portion 36.

In this embodiment, the duct 32 has three baffles 37a, 37b, and 37c. Baffle 37a is installed in the second portion 36b. Baffle 37b is installed in the third portion 36c. In a plan view, baffle 37b is located at the center of the third portion 36c in the direction in which the third portion 36c extends. Baffle 37c is installed in the fourth portion 36d. In a plan view, baffle 37c is located at the center of the fourth portion 36d in the direction in which the fourth portion 36d extends.

The effect of the baffle plate 37 will now be explained. The inventors conducted a simulation of the gas flow in the flat portion 34 and the outer groove portion 36. Figures 11 and 12 are diagrams that schematically show the simulation results. Figures 11 and 12 are diagrams that schematically show the gas flow in the flat portion 34 and the outer groove portion 36, respectively.

Figure 11 shows the simulation results when the duct 32 does not have a baffle plate 37. When the duct 32 does not have a baffle plate 37, the gas tends to swirl in the flat portion 34.

Specifically, when the baffle plate 37 is not installed, gas tends to flow in the direction in which the outer groove portion 35 extends. When the baffle plate 37 is not installed, gas does not easily flow from the outer groove portion 36 to the flat portion 34. For example, a relatively large amount of gas flows from the first portion 36a to the fourth portion 36d. In other words, a relatively small amount of gas flows from the first portion 36a to the first edge 35a. A relatively large amount of gas flows from the second portion 36b to the third portion 36c. In other words, a relatively small amount of gas flows from the second portion 36b to the second edge 35b. The portion where the third portion 36c and the fourth portion 36d are connected to each other is called the "connection portion J." A relatively large amount of gas flows from the third portion 36c to the connection portion J. A relatively large amount of gas flows from the fourth portion 36d to the connection portion J. The gas hits the connection portion J, bounces off, and then flows to the flat portion 34. For this reason, A relatively large amount of gas flows from the connection J to the third side 35c and fourth side 35d of the flat portion 34. The portion of the flat portion 34 closest to the connection J is called the "rear portion K." Gas vortices are likely to occur in the rear portion K. In the region where gas vortices occur, most of the gas flows horizontally, with little gas flowing downward. As a result, in the region where gas vortices occur, the amount or speed of gas flowing from the flat portion 34 to the filter 31 drops significantly.

Figure 12 shows the simulation results when the duct 32 is equipped with a baffle plate 37. When the duct 32 is equipped with a baffle plate 37, the gas is less likely to swirl in the flat portion 34.

Specifically, when the baffle plate 37 is installed, gas flows more easily from the outer groove portion 36 to the flat portion 34. When the baffle plate 37 is installed, gas flows less easily in the direction in which the outer groove portion 35 extends. For example, the baffle plate 37a increases the amount of gas flowing from the second portion 36b to the second edge 35b. The baffle plate 37a decreases the amount of gas flowing from the second portion 36b to the third portion 36c. The baffle plate 37b increases the amount of gas flowing from the third portion 36c to the third edge 35c. The baffle plate 37b decreases the amount of gas flowing from the third portion 36c to the connection portion J. The baffle plate 37c increases the amount of gas flowing from the fourth portion 36d to the fourth edge 35d. The baffle plate 37c decreases the amount of gas flowing from the fourth portion 36d to the connection portion J. As a result, the amount of gas flowing from the connection portion J to the flat portion 34 decreases. Gas vortexes are unlikely to occur in the deepest portion K. Gas vortexes are also unlikely to occur in parts of the flat portion 34 other than the deepest portion K. In other words, gas vortexes are unlikely to occur throughout the flat portion 34. As a result, gas flows approximately uniformly from the flat portion 34 to the filter 31 throughout the entire flat portion 34.

The inventors also performed a simulation of the air velocity distribution at the outlet surface of the filter 31. The simulation results for the case where the duct 32 does not have a baffle plate 37 are as follows:

Average velocity of gas across the entire blowing surface Va1: 0.18 m/s
Maximum gas velocity Vmax1: 0.194 m/s
Minimum gas velocity Vmin1: 0.153 m/s
Speed uniformity U1: 23%

Here, the velocity uniformity U1 is the difference between the maximum velocity Vmax1 and the minimum velocity Vmin1 divided by the average velocity Va1.
U1=(Vmax1-Vmin1)/Va1*100

Although not shown in the figure, the portion of the filter 31 located directly below the rear portion K is referred to as the "rear portion F." The gas velocity in the rear portion F is significantly lower than the average velocity Va1. The gas velocity in the rear portion F is close to the minimum velocity Vmin1.

The simulation results for the case where the duct 32 is equipped with a baffle plate 37 are as follows:

Average velocity of gas across the entire blowing surface Va2: 0.18 m/s
Maximum gas velocity Vmax2: 0.190 m/s
Minimum gas velocity Vmin2: 0.176 m/s
Speed uniformity U2: 8%

Here, the velocity uniformity U2 is the difference between the maximum velocity Vmax2 and the minimum velocity Vmin2 divided by the average velocity Va2.
U2=(Vmax2-Vmin2)/Va2*100

In this way, the baffle plate 37 effectively equalizes the air speed at the blowing surface of the filter 31. The baffle plate 37 improves the uniformity of the air speed at the blowing surface of the filter 31. As a result, the filter 31 blows out gas from the blowing surface of the filter 31 in a substantially uniform manner.

Refer to Figure 8. In this embodiment, no straightening member is provided below the filter 31 or above the substrate holding part 26. The straightening member is a member that regulates the flow of gas. The straightening member is, for example, a plate with multiple small holes formed therein. Therefore, while the gas flows from the filter 31 to the substrate holding part 26, the gas flow path is not narrowed to a size smaller than the area of the blowing surface of the filter 31. In other words, the gas reaches the substrate holding part 26 from the filter 31 without being narrowed to a size smaller than the area of the blowing surface of the filter 31.

<5. Protrusion length of air supply unit>
6 shows the protruding length L5 of the air supply unit 30 that protrudes upward from the processing housing 22. In this specification, the protruding length L5 of the air supply unit 30 that protrudes upward from the processing housing 22 will be referred to as the "protruding length L5 of the air supply unit 30" as appropriate. The protruding length L5 of the air supply unit 30 is equal to or less than twice the length L1 of the filter 31 in the vertical direction Z.

The protruding length L5 of the air supply unit 30 is defined, for example, as follows: The protruding length L5 of the air supply unit 30 is the distance in the vertical direction Z between the upper end of the overlapping portion and the upper end 23t of the processing housing 22. Here, the "overlapping portion" is the portion of the air supply unit 30 that overlaps with the processing housing 22 in a plan view.

In this embodiment, the overlapping portion of the air supply unit 30 includes all of the filter 31 and part of the duct 32 described above. The overlapping portion of the air supply unit 30 does not include the fan 41. This is because the fan 41 does not overlap with the processing housing 22 in a plan view. Therefore, the fan 41 is not a factor in the protrusion length L5. The upper end of the overlapping portion of the air supply unit 30 corresponds to the upper end 32t of the duct 32. Therefore, the discharge length L5 of the air supply unit 30 is the distance in the vertical direction Z between the upper end 32t and the upper end 23t.

Of the two processing casings 22 adjacent to each other in the vertical direction Z, the lower processing casing 22 is referred to as the "first processing casing 22A" and the upper processing casing 22 is referred to as the "second processing casing 22B." The air supply unit 30 that supplies gas to the interior of the first processing casing 22A is referred to as the "first air supply unit 30A." In this case, the second processing casing 22B is positioned above the duct 32 of the first air supply unit 30A. The second processing casing 22B is positioned adjacent to the duct 32 of the first air supply unit 30A.

The fan 41 of the first air supply unit 30A does not overlap with the second processing casing 22B in a plan view. Therefore, the fan 41 of the first air supply unit 30A does not interfere with the second processing casing 22B.

6. Exhaust Configuration of Processing Housing 22
7 , the processing housing 22 includes exhaust ports 53. The exhaust ports 53 are formed at positions facing the piping space 51. Gas inside the processing housing 22 is exhausted to the outside of the processing housing 22 through the exhaust ports 53. The exhaust ports 53 are arranged at the same height as the processing housing 22. All of the exhaust ports 53 are arranged at positions equal to or lower than the upper end 23t and equal to or higher than the lower end 23b. The exhaust ports 53 are arranged at the bottom of the processing housing 22.

The exhaust port 53 is located below the fan 41. The fan 41 and exhaust port 53 are aligned in the vertical direction Z when viewed from the side of the processing housing 22.

The fan 41 and exhaust port 53 are each positioned close to the transport space 12.

See Figures 2 and 4-6. The substrate processing apparatus 1 has multiple (e.g., 24) horizontal exhaust sections 55. One horizontal exhaust section 55 is provided for each processing housing 22. The horizontal exhaust sections 55 are provided in the piping space 51. The horizontal exhaust sections 55 are connected to the exhaust ports 53. The horizontal exhaust sections 55 extend horizontally. The horizontal exhaust sections 55 are positioned at the same height as the processing housing 22. All of the horizontal exhaust sections 55 are positioned at a position equal to or lower than the upper end 23t and equal to or higher than the lower end 23b.

The horizontal exhaust section 55 is positioned lower than the fan 41. A portion of the horizontal exhaust section 75 is positioned close to the transport space 12. A portion of the horizontal exhaust section 55 is positioned below the fan 41. A portion of the horizontal exhaust section 55 overlaps with the fan 41 in a plan view.

See Figure 6. As described above, the fan 41 of the first air supply unit 30A is positioned lower than the upper end 32t of the duct 32 of the first air supply unit 30A. The second processing casing 22B is positioned above the duct 32 of the first air supply unit 30A. Therefore, the fan 41 of the first air supply unit 30A is positioned lower than the second processing casing 22B.

The horizontal exhaust section 55 connected to the second processing casing 22B is referred to as the "second horizontal exhaust section 55B." The entire second horizontal exhaust section 55B is positioned at the same height as the second processing casing 22B. Therefore, the fan 41 of the first air supply unit 30A is positioned lower than the second horizontal exhaust section 55B. Therefore, the fan 41 of the first air supply unit 30A does not interfere with the second horizontal exhaust section 55B. For the same reason, the fan 41 of the first air supply unit 30A does not interfere with the exhaust port (not shown) of the second processing casing 22B.

See Figures 2, 4, and 5. The substrate processing apparatus 1 has multiple (e.g., four) vertical exhaust units 60. One vertical exhaust unit 60 is provided for each of multiple (e.g., six) processing casings 22 lined up in a row in the vertical direction Z. The vertical exhaust units 60 are provided in the piping space 51. The vertical exhaust units 60 are connected to horizontal exhaust units 55. Each vertical exhaust unit 60 is connected to multiple (e.g., six) horizontal exhaust units 55. The vertical exhaust units 60 extend in the vertical direction Z.

The vertical exhaust section 60 includes a first vertical exhaust pipe 61, a second vertical exhaust pipe 62, and a third vertical exhaust pipe 63. The first to third vertical exhaust pipes 61-63 are each connected to the horizontal exhaust section 55. The first to third vertical exhaust pipes 61-63 each extend in the vertical direction Z.

See Figure 2. The vertical exhaust section 60 extends from a position lower than the fan 41 to a position higher than the fan 41. The fan 41 and the vertical exhaust section 60 are aligned in the width direction Y when viewed from the front-to-rear direction X. The fan 41 is positioned close to the transport space 12. The vertical exhaust section 60 is positioned far from the transport space 12.

The first to third vertical exhaust pipes 61-63 are aligned in the width direction Y when viewed from the front-to-rear direction X. The first to third vertical exhaust pipes 61-63 each extend from a position lower than the fan 41 to a position higher than the fan 41. The fan 41 and the first to third vertical exhaust pipes 61-63 are aligned in the width direction Y when viewed from the front-to-rear direction X.

Figure 13 is a plan view of the processing housing 22. The horizontal exhaust section 55 is equipped with a switching mechanism 56. The switching mechanism 56 switches the exhaust path of the processing housing 22 to one of the first to third vertical exhaust pipes 61-63. Here, the exhaust path of the processing housing 22 is divided by the horizontal exhaust section 55 and the vertical exhaust section 60. More specifically, each horizontal exhaust section 55 divides the exhaust path of one processing housing 22. Each vertical exhaust section 60 divides the exhaust paths of all processing housings 22 lined up in a row in the vertical direction Z. The exhaust path of the processing housing 22 is not open to the piping space 51.

Specifically, the switching mechanism 56 switches between a first state, a second state, and a third state. In the first state, the switching mechanism 56 connects the processing housing 22 to the first vertical exhaust pipe 61 and isolates the processing housing 22 from the second and third vertical exhaust pipes 62 and 63. In the first state, only the first vertical exhaust pipe 61 exhausts gas from the processing housing 22. That is, in the first state, the second vertical exhaust pipe 62 does not exhaust gas from the processing housing 22, and the third vertical exhaust pipe 63 does not exhaust gas from the processing housing 22 either. In the second state, the switching mechanism 56 connects the processing housing 22 to the second vertical exhaust pipe 62 and isolates the processing housing 22 from the first and third vertical exhaust pipes 61 and 63. In the second state, only the second vertical exhaust pipe 62 exhausts gas from the processing housing 22. In the third state, the switching mechanism 56 connects the processing housing 22 to the third vertical exhaust pipe 63 and isolates the processing housing 22 from the first and second vertical exhaust pipes 61, 62. In the third state, the third vertical exhaust pipe 63 exclusively exhausts gas from the processing housing 22.

For example, the switching mechanism 56 is provided inside the horizontal exhaust section 55. The switching mechanism 56 includes a first opening/closing section 57, a second opening/closing section 58, and a third opening/closing section 59. The first opening/closing section 57 connects the processing casing 22 to the first vertical exhaust pipe 61 and isolates the processing casing 22 from the first vertical exhaust pipe 61. The second opening/closing section 58 connects the processing casing 22 to the second vertical exhaust pipe 62 and isolates the processing casing 22 from the second vertical pipe 62. The third opening/closing section 59 connects the processing casing 22 to the third vertical exhaust pipe 63 and isolates the processing casing 22 from the third vertical exhaust pipe 63. Each of the first to third opening/closing sections 57-59 is, for example, a valve.

7. Configuration for controlling the pressure of gas inside the processing housing 22
The substrate processing apparatus 1 includes an exhaust damper 65. The exhaust damper 65 is provided in the exhaust path of the processing housing 22. The exhaust damper 65 adjusts the flow rate of gas flowing through the exhaust path of the processing housing 22. For example, the exhaust damper 65 is provided inside the horizontal exhaust unit 55.

The substrate processing apparatus 1 is equipped with a pressure sensor 67. The pressure sensor 67 measures the pressure of the gas inside the processing housing 22. The pressure sensor 67 is installed inside the processing housing 22.

Figure 14 is a control block diagram of the substrate processing apparatus 1. The substrate processing apparatus 1 includes a control unit 69. The control unit 69 acquires the detection result of the pressure sensor 67. The control unit 69 controls at least one of the fan 41 and the exhaust damper 65 based on the detection result of the pressure sensor 67. In this way, the control unit 69 adjusts the pressure of the gas inside the processing housing 22. For example, the control unit 69 controls both the fan 41 and the exhaust damper 65 based on the detection result of the pressure sensor 67. The control unit 69 is communicatively connected to the fan 41, the exhaust damper 65, and the pressure sensor 67.

For example, the control unit 69 adjusts the airflow rate of the fan 41. For example, the control unit 69 adjusts the opening degree of the exhaust damper 65.

For example, the control unit 69 adjusts the detection result of the pressure sensor 67 so that it remains constant. For example, the control unit 69 adjusts the pressure of the gas inside the processing housing 22 so that it remains constant. For example, the control unit 69 adjusts the detection result of the pressure sensor 67 so that it becomes a preset target value. For example, the control unit 69 adjusts the pressure of the gas inside the processing housing 22 so that it becomes a preset target value.

Furthermore, the control unit 69 controls the transport mechanism 6, the transport mechanism 13, the substrate holding unit 26, the discharge unit 27, the rotation drive unit 28, and the switching mechanism 56.

The control unit 69 is realized by a central processing unit (CPU) that executes various processes, a random-access memory (RAM) that serves as a work area for the processes, and storage media such as a fixed disk. The storage media stores various types of information in advance. For example, the storage medium stores information (processing recipes) that define the operating conditions for the processes performed on substrates W inside each processing housing 22. For example, the storage medium stores information that defines the conditions or target values for the gas pressure inside the processing housing 22. For example, the storage medium stores information that defines the operating conditions for switching the exhaust path performed by the switching mechanism 56.

8. Operation Example of Substrate Processing Apparatus 1
An example of the operation of the substrate processing apparatus 1 will now be briefly described.

The indexer unit 3 supplies substrates W to the processing block 11. Specifically, the transport mechanism 6 transfers the substrates W from the carrier C to the transport mechanism 13 in the processing block 11.

The transport mechanism 13 transports the substrate W from the indexer unit 3 to the interior of one of the processing housings 22 (substrate holder 26).

The air supply unit 30 supplies gas to the processing housing 22. Specifically, the fan 41 sends the gas to the duct 32. The duct 32 sends the gas to the filter 31. Specifically, the gas flows through the second horizontal section 39, the vertical section 38, and the first horizontal section 33, in that order. In the first horizontal section 33, the gas flows from the outer groove section 36 to the flat section 34, and from the flat section 34 to the filter 31. The filter filters the gas. The filter 31 blows the filtered gas into the processing housing 22. The gas flows downward inside the processing housing 22. In other words, a downflow is formed inside the processing housing 22.

The switching mechanism 56 switches the exhaust path of the processing housing 22 to one of the first, second, or third vertical exhaust pipes 61-63. For example, the switching mechanism 56 switches the exhaust path of the processing housing 22 depending on the type of processing liquid being discharged by the discharge unit 27.

For example, the switching mechanism 56 switches the exhaust path of the processing housing 22 to the first vertical exhaust pipe 61. In this case, gas inside the processing housing 22 is exhausted to the first vertical exhaust pipe 61 through the exhaust port 53 and horizontal exhaust section 55.

The control unit 69 controls at least one of the fan 41 and the exhaust damper 65 based on the detection results of the pressure sensor 67. In this way, the control unit 69 adjusts the pressure of the gas inside the processing housing 22.

The substrate W is processed inside the processing housing 22. Specifically, the substrate holder 26 holds the substrate W. The rotation driver 28 rotates the substrate W held by the substrate holder 26. The discharger 27 supplies processing liquid to the substrate W held by the substrate holder 26. The cup 29 receives processing liquid splashed from the substrate W.

After the substrate W has been processed inside the processing housing 22, the processing block 11 returns the processed substrate W to the indexer unit 3. Specifically, the transport mechanism 13 takes the substrate W from inside the processing housing 22 (substrate holder 26). The transport mechanism 13 then hands it over to the transport mechanism 6 of the indexer unit 3.

The indexer unit 3 retrieves substrates W from the processing block 11. Specifically, the transport mechanism 6 transports the substrates W from the processing block 11 to the carrier C.

9. Effects of the embodiment
The substrate processing apparatus 1 includes a processing housing 22 and an air supply unit 30. The processing housing 22 processes the substrate W therein. The air supply unit 30 supplies gas to the inside of the processing housing 22. The air supply unit 30 includes a filter 31, a duct 32, and a fan 41. The filter 31 is disposed on the top of the processing housing 22. The filter 31 blows gas into the inside of the processing housing 22. The duct 32 and the fan 41 are each provided outside the processing housing 22. The duct 32 is connected to the filter 31. The fan 41 is connected to the duct 32.

The fan 41 is positioned so as not to overlap the filter 31 in a plan view. In other words, the fan 41 does not have any portion that overlaps with the filter 31 in a plan view. Therefore, the filter 31 and the fan 41 are not aligned in the vertical direction Z. Furthermore, at least a portion of the fan 41 is positioned at the same height as the processing housing 22. In other words, at least a portion of the fan 41 is positioned at a position equal to or lower than the upper end 23t of the processing housing 22 and equal to or higher than the lower end 23b of the processing housing 22. Therefore, at least a portion of the fan 41 does not protrude upward from the processing housing 22. Even when the filter 31 is positioned above the processing housing 22, the fan 41 can be prevented from protruding significantly upward from the processing housing 22. This reduces the protrusion length L5 of the air supply unit 30.

As described above, the substrate processing apparatus 1 can reduce the protruding length L5 of the air supply unit 30.

As a result, two processing housings 22 adjacent in the vertical direction Z can be positioned close to each other. In other words, the separation distance between two processing housings 22 adjacent in the vertical direction Z can be reduced. Therefore, even if the number of processing housings 22 lined up in the vertical direction Z increases, the length of the substrate processing apparatus 1 in the vertical direction Z does not become excessively large. Therefore, the number of processing housings 22 lined up in the vertical direction Z can be easily increased. This makes it possible to improve the processing capacity of the substrate processing apparatus 1 while minimizing an increase in the footprint of the substrate processing apparatus 1.

At least a portion of the fan 41 is positioned lower than the filter 31. Therefore, the height position of the fan 41 is relatively low. This effectively reduces the protruding length L5 of the air supply unit 30.

At least a portion of the duct 32 is positioned lower than the filter 31. This makes it easy to position at least a portion of the fan 41 lower than the filter 31.

The fan 41 is positioned so that it does not overlap with the processing housing 22 in a plan view. In other words, the fan 41 does not have any portion that overlaps with the processing housing 22 in a plan view. Therefore, the fan 41 is not positioned above the processing housing 22. Therefore, the fan 41 is not a factor in the protruding length L5 of the air supply unit 30. Therefore, the protruding length L5 of the air supply unit 30 is effectively reduced.

The protruding length L5 of the air supply unit 30 is less than twice the length L1 of the filter in the vertical direction Z. The protruding length L5 of the air supply unit 30 is sufficiently small.

The protruding length L5 of the air supply unit 30 is the distance in the vertical direction Z between the upper end of the overlapping portion of the air supply unit 30 and the upper end 22t of the processing housing 22. Therefore, reducing the protruding length L5 of the air supply unit 30 is equivalent to thinning the overlapping portion of the air supply unit 30. Therefore, by reducing the protruding length L5 of the air supply unit 30, the separation distance between two adjacent processing housings 22 in the vertical direction Z can be reduced.

The upper end 32t of the duct 32 corresponds to the upper end of the air supply unit 30. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

The duct 32 comprises a first horizontal section 33, a vertical section 38, and a second horizontal section 39. The first horizontal section 33 extends substantially horizontally from the filter 31. The vertical section 38 extends downward from the first horizontal section 33. The second horizontal section 39 extends substantially horizontally from the vertical section 38 to the fan 41. The second horizontal section 39 is positioned lower than the first horizontal section 33. In this way, the vertical section 38 makes it easy to position the second horizontal section 39 lower than the first horizontal section 33. The second horizontal section 39 makes it easy to lower the height position of the fan 41. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

The processing housing 22 has an upper plate portion 24. The upper plate 24 has a first upper plate portion 24a and a second upper plate portion 24b. The filter 31 is installed on the first upper plate portion 24a. The second upper plate portion 24b is positioned below the vertical portion 38 and the second horizontal portion 39. The second upper plate portion 24b is lower than the first upper plate portion 24a. This makes it easy to lower the height position of the vertical portion 38. Furthermore, the height position of the second horizontal portion 39 can also be easily lowered. This makes it easy to lower the height position of the fan 41. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

A portion of the duct 32 overlaps with the filter 31 when viewed from the front. In other words, a portion of the duct 32 is positioned at the same height as the filter 31. As a result, the height position of the duct 32 is relatively low. This effectively reduces the protruding length L5 of the air supply unit 30.

The duct 32 has a flat portion 34. The flat portion 34 is positioned above the filter 31. The flat portion 34 extends horizontally. The flat portion 34 blows gas downward. The length L3 of the flat portion 34 in the vertical direction Z is smaller than the length L1 of the filter 31 in the vertical direction Z. In other words, the flat portion 34 is thinner than the filter 31. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

The overall length L2 of the flat portion 34 and filter 31 in the vertical direction Z is less than twice the length L1 of the filter 31 in the vertical direction Z. Therefore, the height position of the flat portion 34 is relatively low. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

The height position of the upper surface 34a of the flat portion 34 corresponds to the upper end 32t of the duct 32. Therefore, the upper end 32t of the duct 32 is relatively low. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

The height position of the upper surface 34a of the flat portion 34 corresponds to the upper end of the air supply unit 30. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

The duct 32 has an outer groove 36. The outer groove 36 is connected to the peripheral edge 35 of the flat portion 34. The outer groove 36 delivers gas to the flat portion 34. The length L4 of the outer groove 36 in the vertical direction Z is greater than the length L3 of the flat portion 34 in the vertical direction Z. Therefore, the outer groove 36 can smoothly supply gas to the flat portion 34.

In a plan view, the outer groove portion 36 has a ring shape that surrounds the flat portion 34. Therefore, the outer groove portion 36 can supply gas to the entire peripheral portion 35 of the flat portion 34.

The outer groove portion 36 extends downward from the peripheral edge 35 of the flat portion 34. This makes it easy to lower the height of the outer groove portion 36. At least a portion of the outer groove portion 36 overlaps with the filter 31 in a front view. This makes the height of the outer groove portion 36 relatively low. This effectively reduces the protruding length L5 of the air supply unit 30.

The duct 32 is equipped with a baffle 37. The baffle 37 is installed in the outer groove portion 36. The baffle 37 guides a portion of the gas flowing in the outer groove portion 36 to the flat portion 34. The baffle 37 allows the gas to flow more smoothly from the outer groove portion 36 to the flat portion 34. For example, the gas is distributed substantially uniformly throughout the flat portion 34. For example, the gas is less likely to swirl in the flat portion 34. Therefore, the filter 31 appropriately blows out the gas. For example, the filter 31 blows out the gas substantially uniformly from the entire blowing surface of the filter 31. For example, the filter 31 blows out the gas at substantially the same wind speed from the entire blowing surface of the filter 31. Therefore, the substrate W can be appropriately processed inside the processing housing 22.

The baffle plate 37 intersects the direction in which the outer groove portion 36 extends. Therefore, the baffle plate 37 can effectively guide a portion of the gas flowing through the outer groove portion 36 to the flat portion 34.

The substrate processing apparatus 1 comprises a transport space 12, a transport mechanism 13, and a piping space 51. The transport space 12 extends in the front-to-rear direction X. The transport space 12 is adjacent to the processing housing 22. The transport mechanism 13 is installed in the transport space 12. The transport mechanism 13 transports substrates W into the processing housing 22. The piping space 51 is adjacent to the processing housing 22. The processing housing 22 and the transport space 12 are aligned in the width direction Y in a plan view. The processing housing 22 and the piping space 51 are aligned in the front-to-rear direction X. Therefore, the transport space 12 and the piping space 51 do not interfere with each other.

The fan 41 is open to the piping space 51. The fan 41 sends gas from the piping space 51 to the filter 31. This allows the fan 41 to be easily positioned near the processing housing 22 without interfering with the transport mechanism 13. This allows the air supply unit 30 to be easily made smaller.

The processing housing 22 has an exhaust port 53. The exhaust port 53 is formed in a position facing the piping space 51. The fan 41 is positioned above the exhaust port 53. Therefore, the fan 41 does not interfere with the exhaust port 53.

The substrate processing apparatus 1 includes a horizontal exhaust section 55 and a vertical exhaust section 60. The horizontal exhaust section 55 is provided in the piping space 51. The horizontal exhaust section 55 is connected to the exhaust port 53. The horizontal exhaust section 55 extends horizontally. The vertical exhaust section 60 is provided in the piping space 51. The vertical exhaust section 60 is connected to the horizontal exhaust section 55. The vertical exhaust section 60 extends in the vertical direction Z. The fan 41 is positioned higher than the horizontal exhaust section 55. Therefore, the fan 41 does not interfere with the horizontal exhaust section 55. The fan 41 and the vertical exhaust section 60 are aligned in the width direction Y when viewed from the front-to-rear direction X. Therefore, the fan 41 does not interfere with the vertical exhaust section 60.

The vertical exhaust unit 60 includes a first vertical exhaust pipe 61 and a second vertical exhaust pipe 62. The horizontal exhaust unit 55 includes a switching mechanism 56. The switching mechanism 56 switches the exhaust path of the processing housing 22 to either the first vertical exhaust pipe 61 or the second vertical exhaust pipe 62. This allows gas to be properly exhausted from inside the processing housing 22.

Furthermore, the vertical exhaust unit 60 includes a third vertical exhaust pipe 63. The switching mechanism 56 switches the exhaust path of the processing housing 22 to one of the first to third vertical exhaust pipes 61-63. This allows gas to be more efficiently exhausted from inside the processing housing 22.

The fan 41, first vertical exhaust pipe 61, and second vertical exhaust pipe 62 are aligned in the width direction Y when viewed from the front-to-rear direction X. Therefore, the fan 41 does not interfere with the first vertical exhaust pipe 61 and the second vertical exhaust pipe 62.

The fan 41, first vertical exhaust pipe 61, second vertical exhaust pipe 62, and third vertical exhaust pipe 63 are aligned in the width direction Y when viewed from the front-to-rear direction X. Therefore, the fan 41 does not interfere with the first to third vertical exhaust pipes 61-63.

The substrate processing apparatus 1 is equipped with a pressure sensor 67 and a control unit 69. The pressure sensor 67 measures the pressure of the gas inside the processing housing 22. The control unit 69 controls the fan 41 based on the detection result of the pressure sensor 67. For example, the control unit 69 controls the fan 41 to adjust the airflow rate of the fan 41. This allows the control unit 69 to adjust the amount of gas supplied to the processing housing 22. Therefore, the control unit 69 can suitably control the pressure of the gas inside the processing housing 22. Therefore, the substrate W can be suitably processed inside the processing housing 22.

The fan 41 sends gas only to the processing housing 22. The airflow rate of the fan 41 corresponds to the amount of gas supplied to the processing housing 22. Therefore, the amount of gas supplied to the processing housing 22 can be easily adjusted.

The vertical exhaust section 60 passes gas exhausted from two or more processing casings 22. Therefore, the pressure of the gas inside a processing casing 22 may be affected by the other processing casings 22. Specifically, the vertical exhaust section 60 passes gas exhausted from all processing casings 22 lined up in a row in the vertical direction Z. Therefore, the gas pressure inside the processing casings 22 may affect each other among all processing casings 22 lined up in a row in the vertical direction Z. Therefore, the pressure of the gas inside the processing casing 22 is prone to fluctuate. Even in this case, the control section 69 can effectively suppress fluctuations in the pressure of the gas inside the processing casing 22.

In particular, when the switching mechanism 56 switches the exhaust path of the processing housing 22 between the first, second, and third vertical exhaust pipes 61-63, the gas pressure inside the processing housing 22 is likely to fluctuate. Even in this case, the control unit 69 can effectively suppress fluctuations in the gas pressure inside the processing housing 22.

The substrate processing apparatus 1 is equipped with an exhaust damper 65. The exhaust damper 65 is provided in the exhaust path of the processing housing 22. The control unit 69 controls the fan 41 and the exhaust damper 65 based on the detection results of the pressure sensor 67. For example, the control unit 69 adjusts the opening degree of the exhaust damper 65 by controlling the exhaust damper 65. This allows the control unit 69 to adjust the amount of gas discharged from the processing housing 22. Therefore, the control unit 69 can more appropriately control the pressure of the gas inside the processing housing 22. This allows the substrate W to be processed more appropriately inside the processing housing 22.

The substrate processing apparatus 1 includes a processing housing 22 and an air supply unit 30. The air supply unit 30 includes a filter 31 and a duct 32. The duct 32 includes a flat portion 34 and an outer groove portion 35. The length L4 of the outer groove portion 35 in the vertical direction Z is greater than the length L3 of the flat portion 34 in the vertical direction Z. Therefore, the outer groove portion 35 can smoothly supply gas to the flat portion 34. As a result, the flat portion 34 can be easily made thinner. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

The present invention is not limited to the embodiments described above and can be modified as follows:

In the embodiment, a portion of the fan 41 is positioned at the same height as the processing housing 22. However, this is not limited to this. The entire fan 41 may be positioned at the same height as the processing housing 22. Specifically, the entire fan 41 may be positioned at a position equal to or lower than the upper end 23t of the processing housing 22 and equal to or higher than the lower end 23b.

In the embodiment, the fan 41 does not overlap the processing housing 22 in a plan view. However, this is not limited to this. At least a portion of the fan 41 may overlap the processing housing 22 in a plan view. For example, the entire fan 41 may overlap the processing housing 22 in a plan view.

In the embodiment, the fan 41 is disposed in the piping space 51. However, this is not limited to this. For example, at least a portion of the fan 41 may be disposed above the processing housing 22. For example, at least a portion of the fan 41 may be disposed above the second upper plate portion 24b of the processing housing 22. For example, at least a portion of the fan 41 may be disposed in the recessed space S.

In the above-described embodiment, the fan 41 was not a factor in the protruding length L5 of the air supply unit 30. However, this is not limited to this. The fan 41 may also be a factor in the protruding length L5 of the air supply unit 30.

In the above-described embodiment, the protruding length L5 of the air supply unit 30 was the distance in the vertical direction Z between the upper end of the overlapping portion of the air supply unit 30 and the upper end 23t of the processing housing 22. However, this is not limited to this. For example, the protruding length L5 of the air supply unit 30 may be the distance in the vertical direction Z between the upper end of the air supply unit 30 and the upper end 23t of the processing housing 22.

In the above-described embodiment, the entire fan 41 is positioned lower than the upper end 32t of the duct 32. However, this is not limited to this. At least a portion of the fan 41 may be positioned higher than the upper end 32t of the duct 32.

In the above-described embodiment, the upper end 32t of the duct 32 corresponds to the upper end of the air supply unit 30. However, this is not limited to this. The upper end of the fan 41 may also correspond to the upper end of the air supply unit 30.

In the embodiment, the number of processing casings 22 lined up in the vertical direction Z was six. However, this is not limited to this. The number of processing casings 22 lined up in the vertical direction Z may be changed as appropriate.

In the embodiment, the vertical exhaust section 60 is equipped with a third vertical exhaust pipe 63. However, this is not limited to this. The third vertical exhaust pipe 63 may be omitted.

In this embodiment, the exhaust damper 65 is provided inside the horizontal exhaust section 55. However, this is not limited to this. At least a portion of the exhaust damper 65 may be disposed outside the horizontal exhaust section 55. For example, at least a portion of the exhaust damper 65 may be disposed inside the processing housing 22. For example, it may be disposed near the exhaust port 53.

In this embodiment, the exhaust port 53 is positioned close to the transport space 12. However, this is not limited to this. The position of the exhaust port 53 may be changed as appropriate. In conjunction with changing the position of the exhaust port 53, the position of the horizontal exhaust section 55 may also be changed as appropriate.

Figures 15 and 16 are side views of a processing housing according to a modified embodiment. Note that the same components as those in the embodiment are designated by the same reference numerals, and detailed descriptions will be omitted. Figure 15 does not include the vertical exhaust section 60, etc.

See Figure 15. In a modified embodiment, the processing housing 22 has an exhaust port 73 instead of the exhaust port 53. The exhaust port 73 is located far from the transport space 12. The exhaust port 73 is not located below the fan 41. The fan 41 and the exhaust port 73 are not aligned in the vertical direction Z when viewed from the side of the processing housing 22.

See FIG. 16. In a modified embodiment, the substrate processing apparatus 1 includes a horizontal exhaust section 75 instead of the horizontal exhaust section 55. The horizontal exhaust section 75 is connected to the exhaust port 73. The horizontal exhaust section 75 extends horizontally from the exhaust port 73. The horizontal exhaust section 75 extends to the vertical exhaust section 60. The vertical exhaust section 60 is connected to the horizontal exhaust section 75. A portion of the horizontal exhaust section 75 is positioned far from the transport space 12. The horizontal exhaust section 75 does not have a portion close to the transport space 12. Although not shown, the entire horizontal exhaust section 75 does not overlap with the fan 41 in a plan view.

In this embodiment, the substrate processing apparatus 1 does not include an adjustment unit that adjusts the gas blown out from the filter 31. However, this is not limited to this. The substrate processing apparatus 1 may also include an adjustment unit. Below, a substrate processing apparatus 1 according to a modified embodiment will be described in detail.

Figure 17 is a plan view showing the interior of the processing housing 22 in the modified embodiment. Figure 18 is a vertical cross-sectional view of the processing housing 22 in the modified embodiment. Note that the same components as in the embodiment are designated by the same reference numerals, and detailed descriptions will be omitted.

First, we will explain the configuration of the processing housing 22, substrate holder 26, cup 29, discharge unit 27, and filter 31.

The processing housing 22 defines a processing space 81 inside the processing housing 22. The processing space 81 is an open space.

The processing housing 22 has multiple (e.g., four) side walls 82. Each side wall 82 is disposed on a side of the processing housing 22. Each side wall 82 extends in the vertical direction Z.

When distinguishing between the side walls 82, they are referred to as side walls 82a, 82b, 82c, and 82d. Side walls 82a and 82c each extend in the width direction Y in a plan view. Side walls 82a and 82c face each other. Side walls 82b and 82d each extend in the front-to-rear direction X in a plan view. Side walls 82b and 82d face each other. Side wall 82b extends from side wall 82a to side wall 82c. Side wall 82d also extends from side wall 82a to side wall 82c. Side wall 82d is in contact with the transport space 12. A transport opening 25 is formed in side wall 82d.

As described in the embodiment, the substrate processing apparatus 1 includes a substrate holding unit 26. The substrate holding unit 26 is disposed inside the processing housing 22. The substrate holding unit 26 holds a substrate W. Figures 17 and 18 show the central axis Q. The central axis Q passes through the center of the substrate W supported by the substrate holding unit 26 and is parallel to the vertical direction Z.

As described in the embodiment, the substrate processing apparatus 1 includes a cup 29. The cup 29 is installed inside the processing housing 22. The cup 29 is installed in the processing space 81. The cup 29 is arranged around the substrate holder 26. The cup 29 receives the processing liquid.

The cup 29 has a vertical wall portion 83, an inclined portion 84, and an upper opening 85. The vertical wall portion 83 extends in the vertical direction Z. The vertical wall portion 83 has a cylindrical shape centered on the central axis Q. The inclined portion 84 is connected to the vertical wall portion 83. The inclined portion 84 extends upward from the vertical wall portion 83 and approaches the central axis Q. The inclined portion 84 has a truncated cone shape centered on the central axis Q. In a planar view, the inclined portion 84 has an annular shape. In a planar view, the upper opening 85 is positioned inside the inclined portion 84. The upper opening 85 is formed at approximately the same height as the upper end of the inclined portion 84. The upper opening 85 extends horizontally. The upper opening 85 has a circular shape centered on the central axis Q. In a planar view, the upper opening 85 is wider than the substrate W. In plan view, the upper opening 85 completely overlaps the substrate W held by the substrate holder 26.

As described in the embodiment, the substrate processing apparatus 1 includes one or more (e.g., three) discharge units 27. The discharge units 27 are installed inside the processing housing 22. The discharge units 27 are installed in the processing space 81. The discharge units 27 discharge processing liquid onto the substrate W held by the substrate holder 26.

When distinguishing between the individual discharge units 27, they are referred to as discharge units 27a, 27b, and 27c. Each of the discharge units 27a-27c is, for example, a nozzle. Each of the discharge units 27a-27c is positioned higher than the substrate W held by the substrate holder 26.

The substrate processing apparatus 1 is equipped with one or more (e.g., three) movement mechanisms 86. The movement mechanisms 86 move the discharge unit 27.

When distinguishing between the individual moving mechanisms 86, they are referred to as moving mechanisms 86a, 86b, and 86c. Moving mechanism 86a is connected to discharge portion 27a. Moving mechanism 86a moves discharge portion 27a. Moving mechanism 86a rotates discharge portion 27a around rotation axis Ra. Similarly, moving mechanisms 86b and 86c are connected to discharge portions 27b and 27c, respectively. Moving mechanisms 86b and 86c move discharge portions 27b and 27c, respectively. Moving mechanisms 86b and 86c rotate discharge portions 27b and 27c around rotation axes Rb and Rc, respectively. The rotation axes Ra-Rc are each parallel to the vertical direction Z. The rotation axes Ra-Rc pass through moving mechanisms 86a-86c, respectively.

Discharge portion 27a has a base end 87a. Base end 87a is connected to moving mechanism 86a. In plan view, base end 87a is located outside cup 29. Similarly, discharge portions 27b and 27c have base ends 87b and 87c, respectively. Base ends 87b and 87c are connected to moving mechanisms 86b and 86c, respectively. Base ends 87b and 87c are located outside cup 29 in plan view.

Discharge unit 27a has a tip 88a. Tip 88a is movable between a processing position and a standby position. Specifically, movement mechanism 86a moves tip 88a between the processing position and the standby position. Similarly, discharge units 27b and 27c have tip 88b and 88c, respectively. Tip 88b and 88c are movable between a processing position and a standby position. Specifically, movement mechanisms 86b and 86c move tip 88b and 88c between the processing position and the standby position, respectively.

Figure 17 shows tip portions 88a-88c positioned in the standby position using solid lines. When tip portion 88a is positioned in the standby position, tip portion 88a is positioned outward of the substrate W held by substrate holder 26 in a planar view. In other words, when tip portion 88a is positioned in the standby position, tip portion 88a does not overlap with the substrate W held by substrate holder 26 in a planar view. Similarly, when tip portions 88b, 88c are positioned in their respective standby positions, tip portions 88b, 88c are positioned outward of the substrate W held by substrate holder 26 in a planar view. In other words, when tip portions 88b, 88c are positioned in their respective standby positions, tip portions 88b, 88c do not overlap with the substrate W held by substrate holder 26 in a planar view.

Furthermore, when tip 88a is in the standby position, tip 88a is positioned outside cup 29 in a planar view. Similarly, when tips 88b and 88c are each in the standby position, tip 88b and 88c are each positioned outside cup 29 in a planar view.

When tip 88a is in the standby position, discharge portion 27a extends along side wall 82a. Similarly, when tip portions 88b and 88c are in the standby position, discharge portions 27b and 27c extend along side walls 82b and 82c, respectively.

Figure 17 shows tip portions 88a-88c positioned in the processing position using dashed lines. When tip portion 88a is positioned in the processing position, tip portion 88a overlaps with the substrate W held by substrate holder 26 in a planar view. Similarly, when tip portions 88b and 88c are positioned in their respective processing positions, tip portions 88b and 88c overlap with the substrate W held by substrate holder 26 in a planar view.

Refer to Figure 18. The tip 88a has an outlet 89a. The outlet 89a is an opening through which the treatment liquid is discharged. Similarly, the tip 88b has an outlet 89b. The tip 88c also has an outlet (not shown).

Hereinafter, when there is no need to distinguish between tip portions 88a-88c, they will be referred to as tip portion 88.

As described in the embodiment, the substrate processing apparatus 1 includes a filter 31. The filter 31 is disposed in the upper part of the processing housing 22. The filter 31 is installed on the upper plate 24. The filter 31 is installed on the first upper plate portion 24a. The filter 31 blows gas downward. The filter 31 blows gas from the lower surface 31b of the filter 31.

The substrate processing apparatus 1 includes an adjustment unit 91. The adjustment unit 91 receives the gas (e.g., air) blown out from the filter 31. The adjustment unit 91 adjusts the flow of the gas. The adjustment unit 91 blows the gas downward.

The adjustment unit 91 is located below the filter 31.

The adjustment unit 91 is disposed inside the processing housing 22. The adjustment unit 91 is disposed above the processing space 81. The adjustment unit 91 is in contact with the processing space 81. The adjustment unit 91 is disposed above the substrate holding unit 26. The adjustment unit 91 is disposed above the discharge unit 27. The adjustment unit 91 is disposed above the cup 29.

The adjustment unit 91 includes an adjustment chamber 92. The adjustment chamber 92 is a space. The adjustment chamber 92 is disposed below the filter 31. The adjustment chamber 92 contacts the filter 31. The adjustment chamber 92 contacts the lower surface 31b of the filter 31.

The adjustment chamber 92 is disposed below the upper plate 24 of the processing housing 22. The adjustment chamber 92 contacts the upper plate 24. More specifically, the adjustment chamber 92 is disposed below the first upper plate portion 24a. The adjustment chamber 92 contacts the first upper plate portion 24a.

The adjustment chamber 92 extends horizontally. The horizontal length of the adjustment chamber 92 is longer than the horizontal length of the filter 31.

The adjustment chamber 92 has a flat shape. The length of the adjustment chamber 92 in the vertical direction Z is sufficiently shorter than the length of the adjustment chamber 92 in the horizontal direction. The adjustment chamber 92 corresponds to a horizontal flow path for flowing gas radially from the filter 31.

The adjustment unit 91 includes a blow-out plate 93. The blow-out plate 93 is disposed below the adjustment chamber 92. The blow-out plate 93 contacts the adjustment chamber 92. The blow-out plate 93 contacts the processing space 81.

The blow-out plate 93 has a plate shape. The blow-out plate 93 extends horizontally. The blow-out plate 93 has an upper surface 93a and a lower surface 93b. The upper surface 93a contacts the adjustment chamber 92. The lower surface 93b contacts the processing space 81.

The horizontal length of the blow-out plate 93 is longer than the horizontal length of the filter 31. The horizontal length of the blow-out plate 93 is equal to or longer than the horizontal length of the adjustment chamber 92.

The blow-out plate 93 has a plurality of blow-out holes 94. The blow-out holes 94 are formed in the blow-out plate 93. The blow-out holes 94 penetrate the blow-out plate 93. The blow-out holes 94 penetrate the blow-out plate 93 in the vertical direction Z. The blow-out holes 94 are small holes that are sufficiently smaller than the blow-out plate 93. The blow-out holes 94 are arranged closely together. The blow-out holes 94 connect the adjustment chamber 92 and the processing space 81 to each other. The lower surface 93b of the blow-out plate 93 corresponds to the blow-out surface of the adjustment unit 91.

The blow-out plate 93 is detachable from the housing 22.

Specifically, the adjustment unit 91 includes a support pin 95. The support pin 95 is attached to the housing 22. The support pin 95 protrudes, for example, from the side wall 82 of the housing 22. The support pin 95 extends horizontally. The support pin 95 supports the blow-out plate 93. The blow-out plate 93 is placed on the support pin 95. The lower surface 93b of the blow-out plate 93 contacts the support pin 95.

When the support pins 95 support the blow-out plate 93, the support pins 95 prohibit the blow-out plate 93 from moving downward relative to the support pins 95. When the support pins 95 support the blow-out plate 93, the support pins 95 allow the blow-out plate 93 to move upward relative to the support pins 95 (processing housing 22). This allows the blow-out plate 93 to be easily attached to and detached from the housing 22.

The adjustment unit 91 is equipped with a blocking wall 96. The blocking wall 96 closes the side of the adjustment chamber 92. The blocking wall 96 prevents gas from leaking from the adjustment chamber 92 to the outside of the adjustment chamber 92 through the side of the adjustment unit 91.

The blocking wall 96 is disposed at the peripheral edge of the adjustment chamber 92. The blocking wall 96 is disposed between the upper plate 24 and the blow-out plate 93. The blocking wall 96 extends in the vertical direction Z. For example, the blocking wall 96 is supported on the upper plate 24 (specifically, the first upper plate portion 24a). The blocking wall 96 extends downward from the upper plate 24 (specifically, the first upper plate portion 24a). Alternatively, the blocking wall 96 is supported on the blow-out plate 93. The blocking wall 96 extends upward from the blow-out plate 93.

The blocking wall 96 allows the blow-out plate 93 to move slightly upward relative to the processing housing 22. This makes it easy to attach the blow-out plate 93 to the housing 22. The blow-out plate 93 can also be easily removed from the housing 22.

Specifically, a clearance is provided either between the blocking wall 96 and the upper plate 24, or between the blocking wall 96 and the blow-out plate 93. The clearance is space.

The clearance is small enough to substantially prevent gas from escaping from the adjustment chamber 92 through the clearance. The clearance is, for example, 1 mm.

As described above, the adjustment chamber 92 is defined by the filter 31, the upper plate 24 (first upper plate portion 24a), the blow-out plate 93, and the blocking wall 96.

The adjustment unit 91 includes a guide member 97. The guide member 97 is provided in the adjustment chamber 92. The guide member 97 is disposed between the filter 31 and the blocking wall 96. The guide member 97 guides gas downward in the adjustment chamber 92. The guide member 97 creates a relatively strong downward airflow in the vicinity of the guide member 97.

The guide member 97 is positioned at the top of the adjustment chamber 92. The guide member 97 is not positioned at the bottom of the adjustment chamber 92. The guide member 97 is positioned only at the top of the adjustment chamber 92. The guide member 97 extends in the vertical direction Z. The guide member 97 blocks the top of the adjustment chamber 92. The guide member 97 prevents gas from flowing horizontally in the top of the adjustment chamber 92. The guide member 97 opens the bottom of the adjustment chamber 92. The guide member 97 opens the bottom of the adjustment chamber 92 horizontally. The guide member 97 allows gas to flow horizontally in the bottom of the adjustment chamber 92. Therefore, the guide member 97 can effectively guide gas downward in the adjustment chamber 92. Furthermore, the gas flows smoothly through the bottom of the adjustment chamber 92. The gas in the adjustment chamber 92 flows smoothly along the upper surface 93a of the blow-out plate 93. The gas in the adjustment chamber 92 does not stagnate near the upper surface 93a of the blow-out plate 93.

Specifically, the guide member 97 has a generally plate-like shape. The guide member 97 is supported by the upper plate 24 (specifically, the first upper plate portion 24a). The guide member 97 contacts the upper plate 24 (specifically, the first upper plate portion 24a). The guide member 97 extends downward from the upper plate 24 (specifically, the first upper plate portion 24a). The lower portion of the guide member 97 is higher than the blow-out plate 93. The guide member 97 is spaced apart from the blow-out plate 93. The guide member 97 does not contact the blow-out plate 93.

The length of the guide member 97 in the vertical direction Z is shorter than the length of the adjustment chamber 92 in the vertical direction Z. For example, the length of the guide member 97 in the vertical direction Z is less than half the length of the adjustment chamber 92 in the vertical direction Z.

The blow-out plate 93 and the guide member 97 form a narrow passage 98 between them. The narrow passage 98 is a space. The narrow passage 98 is located below the guide member 97 and above the blow-out plate 93. Gas can pass through the narrow passage 98. For example, the length of the narrow passage 98 in the vertical direction Z is more than half the length of the adjustment chamber 92 in the vertical direction Z. For example, the length of the narrow passage 98 in the vertical direction Z is 4 mm or more.

Figure 19 is a plan view of the adjustment unit 91 in a modified embodiment. For convenience, Figure 19 shows the blow-out plate 93, blocking wall 96, and guide member 97 with hatching.

The blow-out plate 93 comprises a first member 101 and a second member 102. The first member 101 and the second member 102 are separable from each other. The blow-out plate 93 can be divided into the first member 101 and the second member 102. The first member 101 and the second member 102 are aligned horizontally. The second member 102 is adjacent to the first member 101. In a plan view, the second member 102 does not substantially overlap the first member 101.

Figure 19 shows the filter 31 with a dashed line. In plan view, the filter 31 has a substantially rectangular shape.

In a plan view, the blow-out plate 93 is larger than the filter 31. In a plan view, the blow-out plate 93 overlaps the entire filter 31. In a plan view, the first member 101 overlaps the entire filter 31. In a plan view, the entire second member 102 is positioned outside the filter 31. In a plan view, the second member 102 does not overlap the filter 31.

In a plan view, the entire blocking wall 96 is positioned outside the filter 31. In a plan view, the blocking wall 96 does not overlap with the filter 31. In a plan view, the blocking wall 96 has a closed ring shape. In a plan view, the blocking wall 96 surrounds the periphery of the filter 31.

In plan view, the adjustment chamber 92 is the area inside the blocking wall 96. In plan view, the adjustment chamber 92 is larger than the filter 31. In plan view, the adjustment chamber 92 overlaps the entire filter 31.

In a plan view, the blow-out plate 93 overlaps the entire blocking wall 96. In a plan view, the blow-out plate 93 overlaps the entire adjustment chamber 92. In a plan view, the blow-out plate 93 is equal to or larger than the adjustment chamber 92. In a plan view, the blow-out plate 93 overlaps the entire guide member 97.

In a plan view, the entire guide member 97 is positioned outside the filter 31. In a plan view, the guide member 97 does not overlap the filter 31. In a plan view, the entire guide member 97 is positioned inside the blocking wall 96. In a plan view, the guide member 97 has an open ring shape. The guide member 97 has a first end connected to the blocking wall 96 and a second end connected to the blocking wall 96.

In plan view, it is preferable that the distance between the filter 31 and the guide member 97 be approximately equal to the distance between the guide member 97 and the blocking wall 96.

The blocking wall 96 has blocking portions 96a, 96b, 96c, and 96d. Blocking portions 96a-96d are each part of the blocking wall 96. Blocking portions 96a-96d each extend linearly in a plan view. Blocking portions 96a and 96c each extend in the width direction Y. Blocking portions 96b and 96d each extend in the front-to-rear direction X. Blocking portion 96a is adjacent to side wall 82a in a plan view. Similarly, blocking portions 96b-96d are adjacent to side walls 82b-82d in a plan view.

The guide member 97 has guide portions 97a, 97b, and 97c. Each of the guide portions 97a, 97b, and 97c is a part of the guide member 97. Each of the guide portions 97a, 97b, and 97c extends linearly in a plan view. Each of the guide portions 97a and 97c extends in the width direction Y. The guide portion 97b extends in the front-to-rear direction X.

Guide portion 97a is positioned between blocking portion 96a and filter 31. Guide portion 97b is positioned between blocking portion 96b and filter 31. Guide portion 97c is positioned between blocking portion 96c and filter 31. Blocking portion 97a, guide portion 97a, filter 31, guide portion 97c, and blocking portion 96c are arranged in this order in the front-to-back direction X. Blocking portion 96b, guide portion 97b, filter 31, and blocking portion 96d are arranged in this order in the width direction Y.

Figure 19 shows distances Da-Dc and Ea-Ec. Distance Da is the separation distance between the filter 31 and guide portion 97a. Distance Db is the separation distance between the filter 31 and guide portion 97b. Distance Dc is the separation distance between the filter 31 and guide portion 97c. Distance Ea is the separation distance between the guide portion 97a and blocking portion 96a. Distance Eb is the separation distance between the guide portion 97b and blocking portion 96b. Distance Ec is the separation distance between the guide portion 97b and blocking portion 96c.

It is preferable that distance Ea is approximately equal to distance Da. It is preferable that distance Eb is approximately equal to distance Db. It is preferable that distance Ec is approximately equal to distance Dc.

It is preferable that distance Db is approximately equal to distance Da. It is preferable that distance Dc is approximately equal to distance Da.

It is preferable that distance Eb is approximately equal to distance Ea. It is preferable that distance Ec is approximately equal to distance Ea.

Figure 20 is a plan view showing the interior of the processing housing 22 in a modified embodiment. In Figure 20, each of the tip portions 88a-88c is positioned in a standby position. Figure 20 shows the filter 31, blocking wall 96, and guide member 97 with dashed lines.

In a plan view, the filter 31 overlaps the substrate W held by the substrate holding portion 26. In a plan view, the filter 31 overlaps a large portion of the substrate W held by the substrate holding portion 26. In a plan view, the filter 31 overlaps the cup 29. In a plan view, the filter 31 overlaps the inclined portion 84. In a plan view, the filter 31 overlaps the upper opening 85. When the tip portion 88a is located in the standby position, the tip portion 88a is positioned outside the filter 31 in a plan view. When the tips 88b and 88c are located in the standby positions, the tips 88b and 88c are each positioned outside the filter 31 in a plan view.

The entire blocking wall 96 is positioned outward from the substrate W held by the substrate holding portion 26 in a plan view. The blocking wall 96 does not overlap with the substrate W held by the substrate holding portion 26 in a plan view. The blocking wall 96 surrounds the periphery of the substrate W held by the substrate holding portion 26 in a plan view. At least a portion of the blocking wall 96 is positioned outward from the cup 29 in a plan view. At least a portion of the blocking wall 96 is positioned outward from the inclined portion 84 in a plan view. The entire blocking wall 96 is positioned outward from the upper opening 85 in a plan view. When the tip portion 88a is in the standby position, the tip portion 88a is positioned outward from the blocking wall 96 in a plan view. When the tip portion 88a is in the standby position, a portion of the discharge portion 27a is positioned inside the blocking wall 96 in a plan view. When the tip portion 88b is in the standby position, the tip portion 88b is positioned inside the blocking wall 96 in a plan view. When tip 88b is in the standby position, the entire discharge portion 27b is positioned inside the blocking wall 96 in a plan view. When tip 88c is in the standby position, a portion of tip 88c is positioned outside the blocking wall 96 in a plan view. When tip 88c is in the standby position, a portion of discharge portion 27c is positioned inside the blocking wall 96 in a plan view.

The entire guide member 97 is positioned outside the substrate W held by the substrate holder 26 in a plan view. The guide member 97 does not overlap with the substrate W held by the substrate holder 26 in a plan view.

At least a portion of the guide member 97 overlaps with the cup 29 in a plan view. In this modified embodiment, a portion of the guide member 97 overlaps with the cup 29 in a plan view. The other portion of the guide member 97 is positioned outward from the cup 29 in a plan view. However, this is not limited to this. The entire guide member 97 may overlap with the cup 29 in a plan view. At least a portion of the guide member 97 overlaps with the inclined portion 84 in a plan view. In this modified embodiment, a portion of the guide member 97 overlaps with the inclined portion 84 in a plan view. The other portion of the guide member 97 is positioned outward from the inclined portion 84 in a plan view. However, this is not limited to this. The entire guide member 97 may overlap with the inclined portion 84 in a plan view. The entire guide member 97 is positioned outward from the upper opening 85 in a plan view. The guide member 97 does not overlap with the upper opening 85 in a plan view.

When tip 88 is in the standby position, at least a portion of discharge portion 27 is positioned outside guide member 97 in a plan view. Specifically, when tip 88a is in the standby position, the entire discharge portion 27a is positioned outside guide member 97 in a plan view. When tip 88b is in the standby position, the entire discharge portion 27b is positioned outside guide member 97 in a plan view. When tip 88c is in the standby position, a portion of discharge portion 27c is positioned outside guide member 97 in a plan view.

When tip 88 is in the standby position, tip 88 is positioned outside guide member 97 in a plan view. Specifically, when tip 88a is in the standby position, the entire tip 88a is positioned outside guide member 97 in a plan view. Similarly, when tips 88b and 88c are each positioned in their standby positions, tip 88b and 88c are each positioned outside guide member 97 in a plan view.

When the tip 88a is in the standby position, the guide portion 97a is positioned between the tip 88a and the substrate W held by the substrate holder 26 in a planar view. When the tip 88a is in the standby position, the guide portion 97a extends to separate the tip 88a from the substrate W held by the substrate holder 26 in a planar view. Similarly, when the tips 88b, 88c are in the standby position, the guide portions 97b, 97c are respectively positioned between the tips 88b, 88c and the substrate W held by the substrate holder 26 in a planar view. When the tips 88b, 88c are in the standby position, the guide portions 97b, 97c are respectively extended to separate the tip 88b, 88c from the substrate W held by the substrate holder 26 in a planar view.

Figure 21 is a vertical cross-sectional view of the processing housing 22 in a modified embodiment. Figure 21 shows the gas flow diagrammatically using dashed lines.

The filter 31 blows the gas downward. The adjustment unit 91 receives the gas blown out from the filter 31. The adjustment unit 91 blows the gas downward. Specifically, the adjustment chamber 92 receives the gas from the filter 31. The blow-out plate 93 blows the gas into the processing space 81.

Figure 22 is a plan view of the blow-out plate 93 in a modified embodiment. For convenience, a core zone 103 and a peripheral zone 104 are defined for the blow-out plate 93. The core zone 103 is the portion of the blow-out plate 83 located below the filter 31. In other words, the core zone 103 is the portion of the blow-out plate 83 that overlaps with the filter 31 in a plan view. The peripheral zone 104 is the portion of the blow-out plate 83 located outside the core zone 103 and inside the blocking wall 96.

The peripheral zone 104 is defined as a guide zone 104g, a first zone 104a, and a second zone 104b. The guide zone 104g is a portion of the peripheral zone 104 located below the guide member 97. The guide zone 104g may further include a portion of the peripheral zone 104 located near the guide member 97 in a plan view. The first zone 104a is a portion of the peripheral zone 104 located inside the guide zone 104g. The second zone 104b is a portion of the peripheral zone 104 located outside the guide zone 104g.

Refer to Figure 21. For convenience, the airflows blown out by the blow-out plate 93 are defined as a core blow-out flow G0, a first blow-out flow G1, a second blow-out flow G2, and a third blow-out flow G3. The core blow-out flow G0 is the airflow blown out from the core zone 103. The first blow-out flow G1 is the airflow blown out from the first zone 104a. The second blow-out flow G2 is the airflow blown out from the second zone 104b. The third blow-out flow G3 is the airflow blown out from the guide zone 104g.

For convenience, the processing space 81 is defined as a core area 107, a first area 108, and a second area 109. The core area 107 is the portion of the processing space 81 located directly below the core zone 103. The first area 108 is the portion of the processing space 81 located directly below the first zone 104a. The second area 109 is the portion of the processing space 81 located directly below the second zone 104b.

The gas flow in the conditioning chamber 92 and processing space 81 will be explained. In the conditioning chamber 92, the gas starts from the filter 31 and reaches the blow-out plate 83. The airflow in the conditioning chamber 92 is classified into a straight flow and a curved flow. A straight flow flows straight downward without turning horizontally. The straight flow reaches the core zone 103. A curved flow turns horizontally and then turns downward to reach the blow-out plate 83. The curved flow reaches the peripheral zone 104.

The curved flows are further classified into first, second, and third air flows. The first flow bends downward before reaching the guide member 97. The first flow reaches the first zone 104a. The second flow bends downward after passing through the guide member 97 (narrow passage 98). The second flow reaches the second zone 104b. The third flow bends downward near the guide member 97. The third flow reaches the guide zone 104g. The third flow is stronger than the first flow. The third flow is stronger than the second flow.

The core outlet flow G0 flows downward from the core zone 103. The core outlet flow G0 enters the core area 107. The first outlet flow G1 flows downward from the first zone 104a. The first outlet flow G1 enters the first area 108. The second outlet flow G2 flows downward from the second zone 104b. The second outlet flow G2 enters the second area 109. The third outlet flow G3 flows downward from the guide zone 104g. The third outlet flow G3 enters between the first area 108 and the second area 109.

The third blown-out flow G3 is stronger than the first blown-out flow G1. The speed of the third blown-out flow G3 is greater than the speed of the first blown-out flow G1. The third blown-out flow G3 is stronger than the second blown-out flow G2. The speed of the third blown-out flow G3 is greater than the speed of the second blown-out flow G2. The first blown-out flow G1 is located inside the third blown-out flow G3. The second blown-out flow G2 is located outside the third blown-out flow G3. Therefore, the third blown-out flow G3 branches into an inner flow G3a and an outer flow G3b.

The internal flow G3a flows downward and inward. As it flows downward, the internal flow G3a approaches the central axis Q. As it flows downward, the internal flow G3a enters the first area 108. Due to the internal flow G3a, the first blown flow G1 also flows downward and approaches the central axis Q. The first blown flow G1 enters the core area 107 from the first area 108. The core blown flow G0 and the first blown flow G1 pass through the upper opening 85. The core blown flow G0 and the first blown flow G1 are supplied to the substrate W held by the substrate holder 26. Furthermore, the internal flow G3a may also enter the core area 107 from the first area 108. The internal flow G3a may also pass through the upper opening 85.

The external flow G3b flows downward and outward. As it flows downward, it moves away from the central axis Q. As it flows downward, the external flow G3b enters the second area 109. The external flow G3b causes the second blown flow G2 to also flow downward and move away from the central axis Q. The external flow G3b prevents the atmosphere in the second area 109 from reaching the first area 108. The external flow G3b prevents the atmosphere in the second area 109 from passing through the upper opening 85. The external flow G3b prevents the atmosphere in the second area 109 from reaching the substrate W held by the substrate holder 26. Therefore, the external flow G3b protects the substrate W held by the substrate holder 26 from the atmosphere in the second area 109. The external flow G3b keeps the substrate W held by the substrate holder 26 clean.

The effects of the modified embodiment will now be described. The filter 31 blows gas downward. The substrate processing apparatus 1 includes an adjustment unit 91. The adjustment unit 91 is installed inside the processing housing 22. The adjustment unit 91 includes an adjustment chamber 92. The adjustment chamber 92 is located below the filter 31. Therefore, the adjustment unit 91 can preferably receive the gas blown out from the filter 31 in the adjustment chamber 92.

The adjustment unit 91 includes a blow-out plate 93. The blow-out plate 93 is disposed below the adjustment chamber 92. The blow-out plate 93 extends horizontally. The blow-out plate 93 has multiple blow-out holes 94. This allows the adjustment unit 91 to effectively blow out gas downward from the blow-out plate 93 through the blow-out holes 94.

The substrate holding unit 26 is installed inside the processing housing 22. The substrate holding unit 26 is disposed below the adjustment unit 91. The substrate holding unit 26 holds a substrate W. Therefore, the adjustment unit 91 can suitably supply gas to the substrate W held by the substrate holding unit 26. Specifically, the adjustment unit 91 can form a downflow of gas around the substrate W held by the substrate holding unit 26.

The adjustment chamber 92 extends horizontally. In a plan view, the adjustment chamber 92 is larger than the filter 31. The adjustment unit 91 includes a guide member 97. The guide member 97 is provided in the adjustment chamber 92. The guide member 97 guides gas downward in the adjustment chamber 92. As a result, the guide member 97 prevents the blow-out plate 93 from including poorly blown-out portions. Poorly blown-out portions are portions of the blow-out plate 93 that do not substantially blow out gas. In other words, the blow-out plate 93 does not include any outlet ports 94 that do not substantially blow out gas. All of the blow-out holes 94 blow out gas. In this way, the guide member 97 adjusts the flow of gas in the adjustment chamber 92.

The core zone 103 is close to the filter 31. The peripheral zone 104 is far from the filter 31. For this reason, poor discharge areas are more likely to occur in the peripheral zone 104 than in the core zone 103. The entire guide member 97 is positioned outside the filter 31 in a plan view. That is, the entire guide member 97 is positioned above the peripheral zone 104. Therefore, the guide member 97 prevents the peripheral zone 104 from including poor discharge areas. Specifically, the guide member 97 prevents the velocity of the first outlet flow G1 from becoming substantially zero. The guide member 97 prevents the velocity of the second outlet flow G2 from becoming substantially zero. The guide member 97 prevents the velocity of the third outlet flow G3 from becoming substantially zero.

The entire guide member 97 is positioned outward of the substrate W held by the substrate holding unit 26 in a plan view. Therefore, the guide zone 104g is positioned outward of the substrate W held by the substrate holding unit 26 in a plan view. The third blown-out flow G3 blown out from the guide zone 104g is relatively strong. Therefore, the third blown-out flow G3 protects the substrate W held by the substrate holding unit 26 from the atmosphere outside the third blown-out flow G3. Therefore, the third blown-out flow G3 keeps the substrate W held by the substrate holding unit 26 clean. As a result, the substrate processing apparatus 1 can process the substrate W held by the substrate holding unit 26 with good quality.

Furthermore, the third blown air flow G3 increases the amount of gas supplied to the substrate W held by the substrate holder 26. Therefore, the substrate processing apparatus 1 can process the substrate W held by the substrate holder 26 with high quality.

The guide member 97 is positioned above the adjustment chamber 92. The guide member 97 extends in the vertical direction Z. Therefore, the guide member 97 can effectively guide the gas downward within the adjustment chamber 92.

The guide member 97 is positioned only at the top of the adjustment chamber 92. In other words, the guide member 97 is not positioned at the bottom of the adjustment chamber 92. The guide member 97 opens the bottom of the adjustment chamber 92. This allows the gas to flow smoothly through the bottom of the adjustment chamber 92. In other words, the gas does not stagnate in the bottom of the adjustment chamber 92. Therefore, the gas in the adjustment chamber 92 flows smoothly along the blow-out plate 93. As a result, the guide member 97 more effectively prevents the blow-out plate 93 from including poorly blown areas.

The guide member 97 is positioned above the adjustment chamber 92. In other words, the guide member 97 does not open the top of the adjustment chamber 92. Therefore, when the gas passes through the guide member 97 (narrow passage 98), the gas does not bend upward. Therefore, the gas flows smoothly through the lower part of the adjustment chamber 92. As a result, the guide member 92 can more effectively prevent the blow-out plate 93 from including poor blow-out areas.

Distance Ea is approximately equal to distance Da. Therefore, the difference in size between the first zone 104a and the second zone 104b is small. Therefore, the difference in speed between the first blow-out flow G1 and the second blow-out flow G2 is small. Therefore, the guide member 97 can effectively prevent the peripheral zone 104 from including poorly blown-out areas. Similarly, distance Eb is approximately equal to distance Db. Distance Ec is approximately equal to distance Dc. Therefore, the guide member 97 can even more effectively prevent the peripheral zone 104 from including poorly blown-out areas.

Distance Eb is approximately equal to distance Ea. Therefore, the speed of the first blown-out flow G1 does not vary excessively across the first zone 104a. Therefore, the guide member 97 can effectively prevent the first zone 103 from including poorly blown-out areas. Similarly, distance Ec is approximately equal to distance Ea. Therefore, the guide member 97 can even more effectively prevent the first zone 104a from including poorly blown-out areas.

It is preferable that distance Db is approximately equal to distance Da. Therefore, the speed of second blow-out flow G2 does not vary excessively across second zone 104b. Therefore, guide member 97 can effectively prevent second zone 104b from including poorly blown-out areas. Similarly, distance Dc is approximately equal to distance Da. Therefore, guide member 97 can even more effectively prevent second zone 104b from including poorly blown-out areas.

The substrate processing apparatus 1 is equipped with a blocking wall 96. The blocking wall 96 closes the side of the adjustment chamber 92. The blocking wall 96 prevents gas from flowing out of the adjustment chamber 92 through the side of the adjustment chamber 92. As a result, all of the gas inside the adjustment chamber 92 is discharged from the blow-out plate 93 through the blow-out holes 94. Therefore, the blocking wall 96 further prevents the blow-out plate 93 from having any defective blow-out portions.

The substrate processing apparatus 1 includes a discharge unit 27. The discharge unit 27 is installed inside the processing housing 22. The discharge unit 27 discharges processing liquid onto a substrate W held by the substrate holding unit 26. The discharge unit 27 includes a tip 88 that is movable between a discharge position and a standby position. When the tip 88 is in the standby position, the tip 88 is positioned outward from the substrate W held by the substrate holding unit 26 in a planar view. When the tip 88 is in the standby position, the guide member 97 is positioned between the tip 88 and the substrate W held by the substrate holding unit 26 in a planar view. Therefore, when the tip 88 is in the standby position, the guide zone 104g is positioned between the tip 88 and the substrate W held by the substrate holding unit 26 in a planar view. When the tip 88 is in the standby position, the third blown flow G3 is blown toward between the tip 88 and the substrate W held by the substrate holding unit 26. Therefore, when the tip 88 is located in the standby position, the third blown air flow G3 protects the substrate W held by the substrate holding part 26 from the tip 88. For example, the third blown air flow G3 prevents the atmosphere near the tip 88 from reaching the substrate W held by the substrate holding part 26. For example, the third blown air flow G3 prevents particles from moving from the tip 88 to the substrate W held by the substrate holding part 26. Therefore, the third blown air flow G3 keeps the substrate W held by the substrate holding part 26 even cleaner. As a result, the substrate processing apparatus 1 can process the substrate W held by the substrate holding part 26 with good quality.

The substrate processing apparatus 1 is equipped with a cup 29. The cup 29 is installed inside the processing housing 22. The cup 29 is arranged around the substrate holding part 26. The cup 29 receives the processing liquid. At least a portion of the guide member 97 overlaps with the cup 29 in a plan view. Therefore, at least a portion of the guide zone 104g overlaps with the cup 29 in a plan view. At least a portion of the third blown flow G3 is blown toward the cup 29. Therefore, the third blown flow G3 effectively protects the substrate W held by the substrate holding part 26. Therefore, the third blown flow G3 effectively keeps the substrate W held by the substrate holding part 26 clean. As a result, the substrate processing apparatus 1 can process the substrate W held by the substrate holding part 26 with high quality.

For example, the third blown flow G3 effectively prevents gas from flowing along the upper surface of the inclined portion 84 toward the central axis Q. For example, the third blown flow G3 effectively prevents gas from flowing inward along the upper surface of the inclined portion 84 of the cup 29. For example, the third blown flow G3 effectively prevents gas from passing near the upper surface of the inclined portion 84 and entering the upper opening 85. Therefore, the third blown flow G3 effectively protects the substrate W held by the substrate holding part 26 from the upper surface of the inclined portion 84. For example, the third blown flow G3 prevents the atmosphere near the upper surface of the inclined portion 84 from reaching the substrate W held by the substrate holding part 26. For example, the third blown flow G3 prevents particles from moving from the upper surface of the inclined portion 84 to the substrate W held by the substrate holding part 26.

The blow-off plate 93 is detachable from the processing housing 22. This allows for easy maintenance of the blow-off plate 93.

The blow-out plate 93 comprises a first member 101 and a second member 102. The second member 102 is adjacent to the first member 101. The first member 101 is smaller than the entire blow-out plate 93. This makes it easier to maintain the first member 101. The second member 102 is smaller than the entire blow-out plate 93. This makes it easier to maintain the second member 102. This makes it easier to maintain the blow-out plate 93.

In a plan view, the first member 101 overlaps the entire filter 31. In a plan view, the entire second member 102 is disposed outside the filter 31. Therefore, the filter 31 can be conveniently maintained by removing only the first member 101 from the processing housing 22. The filter 31 can be conveniently maintained without removing the second member 102 from the processing housing 22.

The embodiments and variant embodiments may be further modified as appropriate by replacing or combining each configuration with the configuration of other variant embodiments.

DESCRIPTION OF SYMBOLS 1 ... substrate processing apparatus 11 ... processing block 12A, 12B, 12 ... transport space 13A, 13B, 13 ... transport mechanism 22 ... processing housing 22A ... first processing housing 22B ... second processing housing 23t ... upper end of processing housing 23b ... lower end of processing housing 24 ... upper plate 24a ... first upper plate portion 24b ... second upper plate portion 26 ... substrate holding portion 27 ... discharge portion 29 ... cup 30 ... air supply unit 30A ... first air supply unit 31 ... filter 31a ... upper surface of filter 31b ... lower surface of filter (blowout surface of filter)
32: Duct 33: First horizontal portion 34: Flat portion 34a: Upper surface of flat portion 34b: Lower surface of flat portion 34c: Opening of flat portion 35: Peripheral edge portion of flat portion 36: Outer groove portion 37, 37a, 37b, 37c: Baffle plate 38: Vertical portion 39: Second horizontal portion 41: Fan 51A, 51B, 51C, 51D, 51: Piping space 53, 73: Exhaust port 55, 75: Horizontal exhaust portion 56: Switching mechanism 60: Vertical exhaust portion 61: First vertical exhaust portion 62: Second vertical exhaust portion 63: Third vertical exhaust portion 65: Exhaust damper 67: Pressure sensor 69: Control unit 88, 88a, 88b, 88c Tip of discharge part 91 ... Adjustment part 92 ... Adjustment chamber 93 ... Blowout plate 94 ... Blowout hole 95 ... Support pin 96 ... Blocking wall 97 ... Guide member 101 ... First member 102 ... Second member 104g ... Guide zone G3 ... Third blowout flow G3a ... Inner flow G3b ... Outer flow L1 ... Length of filter in the vertical direction L2 ... Overall length of flat part and filter in the vertical direction L3 ... Length of flat part in the vertical direction L4 ... Length of outer groove part in the vertical direction L5 ... Protrusion length of air supply unit that protrudes upward from the processing housing S ... Recessed space W ... Substrate X ... Front-to-rear direction (first direction)
Y: Width direction (second direction)
Z: vertical direction

Claims (25)

A substrate processing apparatus,
a first processing housing for processing substrates therein;
a first gas supply unit that supplies gas to the inside of the first processing housing;
Equipped with
The first air supply unit is
a filter disposed in an upper portion of the first processing housing and blowing out gas into the first processing housing;
a duct provided outside the first processing housing and connected to the filter;
a fan provided outside the first processing housing and connected to the duct;
Equipped with
the fan is disposed at a position not overlapping with the filter in a plan view,
At least a part of the fan is disposed at the same height as the first processing casing,
The duct is
a first horizontal portion extending horizontally from the filter;
a vertical portion extending downward from the first horizontal portion;
a second horizontal portion extending horizontally from the vertical portion to the fan and positioned lower than the first horizontal portion;
Equipped with
the first processing housing includes a top plate;
The upper plate is
a first upper plate portion on which the filter is installed;
a second upper plate portion disposed below the vertical portion and the second horizontal portion;
Equipped with
The second upper plate portion is lower than the first upper plate portion. A substrate processing apparatus,
a first processing housing for processing substrates therein;
a first gas supply unit that supplies gas to the inside of the first processing housing;
Equipped with
The first air supply unit is
a filter disposed in an upper portion of the first processing housing and blowing out gas into the first processing housing;
a duct provided outside the first processing housing and connected to the filter;
a fan provided outside the first processing housing and connected to the duct;
Equipped with
the fan is disposed at a position not overlapping with the filter in a plan view,
At least a part of the fan is disposed at the same height as the first processing casing,
The duct is
a flat portion disposed above the filter, extending horizontally, and blowing gas downward;
an outer groove portion connected to a peripheral edge portion of the flat portion and configured to send gas to the flat portion;
Equipped with
The substrate processing apparatus, wherein the length of the outer groove portion in the vertical direction is greater than the length of the flat portion in the vertical direction. 3. The substrate processing apparatus according to claim 2,
The length of the flat portion in the vertical direction is smaller than the length of the filter in the vertical direction.
Substrate processing equipment. 4. The substrate processing apparatus according to claim 2,
The overall length of the flat portion and the filter in the vertical direction is less than twice the length of the filter in the vertical direction.
Substrate processing equipment. 5. The substrate processing apparatus according to claim 2,
The height position of the upper surface of the flat portion corresponds to the upper end of the duct.
Substrate processing equipment. 6. The substrate processing apparatus according to claim 2 ,
The outer groove portion has a ring shape surrounding the flat portion in a plan view.
Substrate processing equipment. 7. The substrate processing apparatus according to claim 2 ,
the outer groove portion extends downward from the peripheral edge portion of the flat portion,
At least a portion of the outer groove overlaps with the filter in a front view. 8. The substrate processing apparatus according to claim 2 ,
the duct includes a baffle plate disposed in the outer groove portion and guiding a part of the gas flowing through the outer groove portion to the flat portion. 9. The substrate processing apparatus according to claim 8 ,
The baffle plate intersects with a direction in which the outer groove portion extends. A substrate processing apparatus,
a first processing housing for processing substrates therein;
a first gas supply unit that supplies gas to the inside of the first processing housing;
Equipped with
The first air supply unit is
a filter disposed in an upper portion of the first processing housing and blowing out gas into the first processing housing;
a duct provided outside the first processing housing and connected to the filter;
a fan provided outside the first processing housing and connected to the duct;
Equipped with
the fan is disposed at a position not overlapping with the filter in a plan view,
At least a part of the fan is disposed at the same height as the first processing casing,
The substrate processing apparatus includes:
a transport space extending in a horizontal first direction and adjacent to the first processing housing;
a transport mechanism installed in the transport space and configured to transport a substrate into the first processing housing;
a piping space adjacent to the first processing housing;
Equipped with
the first processing casing and the transport space are aligned in a horizontal second direction perpendicular to the first direction in a plan view,
the first processing casing and the piping space are aligned in the first direction,
The fan is open to the piping space,
The fan sends the gas in the piping space to a filter. 11. The substrate processing apparatus according to claim 10 ,
The first processing housing includes:
an exhaust port formed at a position facing the piping space;
Equipped with
The fan is disposed above the exhaust port. 12. The substrate processing apparatus according to claim 11 ,
The substrate processing apparatus includes:
a horizontal exhaust portion provided in the piping space, connected to the exhaust port, and extending in a horizontal direction;
a vertical exhaust section provided in the piping space, connected to the horizontal exhaust section, and extending in a vertical direction;
Equipped with
The fan is disposed at a position higher than the horizontal exhaust section,
The substrate processing apparatus, wherein the fan and the vertical exhaust unit are aligned in the second direction when viewed from a first direction. 13. The substrate processing apparatus according to claim 12 ,
The vertical exhaust section is
a first vertical exhaust pipe extending in a vertical direction;
a second vertical exhaust pipe extending in a vertical direction;
Equipped with
The horizontal exhaust section is
a switching mechanism that switches the exhaust path of the first processing housing to one of the first vertical exhaust pipe and the second vertical exhaust pipe;
Equipped with
the fan, the first vertical exhaust pipe, and the second vertical exhaust pipe are aligned in the second direction when viewed from a first direction. A substrate processing apparatus,
a first processing housing for processing substrates therein;
a first gas supply unit that supplies gas to the inside of the first processing housing;
Equipped with
The first air supply unit is
a filter disposed in an upper portion of the first processing housing and blowing out gas into the first processing housing;
a duct provided outside the first processing housing and connected to the filter;
a fan provided outside the first processing housing and connected to the duct;
an adjusting unit that is installed inside the first processing housing, receives the gas blown out from the filter, and blows the gas downward;
a substrate holding unit that is installed inside the first processing housing and disposed below the adjustment unit and that holds a substrate;
Equipped with
the fan is disposed at a position not overlapping with the filter in a plan view,
At least a part of the fan is disposed at the same height as the first processing casing,
The filter blows gas downward,
The adjustment unit
an adjustment chamber disposed below the filter, extending horizontally, and larger than the filter in a plan view;
a guide member provided in the adjustment chamber and guiding the gas downward in the adjustment chamber;
a blowout plate disposed below the adjustment chamber, extending horizontally, and having a plurality of blowout holes;
Equipped with
the entire guide member is disposed outside the filter in a plan view,
the entire guide member is disposed outward of the substrate held by the substrate holding portion in a plan view,
the blowing plate includes a core zone;
The airflow blown out by the blowing plate includes a core blowing flow,
the core outlet flow is an airflow blown downward from the core zone,
The core zone overlaps with the substrate held by the substrate holder in a plan view. 15. The substrate processing apparatus according to claim 14 ,
The substrate processing apparatus, wherein the guide member is disposed only in an upper portion of the adjustment chamber and extends in a vertical direction. 16. The substrate processing apparatus according to claim 14 ,
The substrate processing apparatus further comprises a blocking wall that closes a side portion of the adjustment chamber. 17. The substrate processing apparatus according to claim 14 ,
a discharge unit that is installed inside the first processing housing and that discharges a processing liquid onto the substrate held by the substrate holder;
Equipped with
the discharge portion includes a tip portion that is movable between a discharge position and a standby position;
when the tip portion is located at a standby position, the tip portion is disposed outward of the substrate held by the substrate holding portion in a plan view,
When the tip portion is located at a standby position, the guide member is disposed between the tip portion and the substrate held by the substrate holder in a plan view. 18. The substrate processing apparatus according to claim 14 ,
a cup disposed inside the first processing housing, the cup being arranged around the substrate holder and receiving a processing liquid;
At least a portion of the guide member overlaps with the cup in a plan view. 19. The substrate processing apparatus according to claim 14 ,
The blow-out plate is detachably attached to the first processing housing. 20. The substrate processing apparatus according to claim 14 ,
The blowing plate is
A first member;
a second member adjacent to the first member;
A substrate processing apparatus comprising: 21. The substrate processing apparatus according to claim 1 ,
At least a part of the fan is disposed at a position lower than the filter. 22. The substrate processing apparatus according to claim 1 ,
The substrate processing apparatus, wherein the fan is disposed at a position that does not overlap with the first processing casing in a plan view. 23. The substrate processing apparatus according to claim 1,
The protruding length of the first air supply unit extending upward from the first processing casing is equal to or less than twice the length of the filter in the vertical direction.
Substrate processing equipment. 24. The substrate processing apparatus according to claim 1 ,
a part of the duct overlaps with the filter in a front view. 25. The substrate processing apparatus according to claim 1 ,
The substrate processing apparatus includes:
a pressure sensor that measures the pressure of the gas inside the first processing housing;
a control unit that controls the fan based on a detection result of the pressure sensor;
A substrate processing apparatus comprising: