JP7799253B2 - Resin sealing device and resin sealing method - Google Patents

Description

The present invention relates to a resin sealing device and a resin sealing method.

Resin sealing devices that resin-seal electronic components mounted on a substrate are known. Such resin sealing devices can be contaminated by particles (resin powder, foreign matter, and other dust) inside the device, which can affect the reliability of molded products in which electronic components are resin-sealed. To prevent such particle contamination, for example, Patent Document 1 discloses a resin molding device that includes a press unit with a molding die that clamps and resin-seals the workpiece and molding resin, and a cleaning device that cleans the backside of the workpiece as it is transported to the press unit.

Japanese Patent Application Laid-Open No. 2021-178411

Particles can adhere not only to the backside of the workpiece, but also to the surface of the workpiece and the loader hand that transports the workpiece. Furthermore, particles can adhere to the workpiece before it is sealed with resin, and can also adhere to the molded product after it has been sealed with resin.

The present invention was made in light of these circumstances, and its object is to provide a resin sealing device and resin sealing method that can suppress particle adhesion and improve the quality of resin-sealed molded products.

One aspect of the present invention is a resin sealing device that seals electronic components in a workpiece, including a substrate and electronic components, with resin. The resin molding unit seals the electronic components in the workpiece with resin by compression molding. The resin molding unit includes a resin sealing mold having an upper mold and a lower mold, and a cleaner unit with a dust collection port provided on the transport path of a loader hand that transports the workpiece to the resin sealing mold. The cleaner unit performs a cleaning operation on at least one of the loader hand and the workpiece moving on the transport path when the loader hand moves on the transport path to supply the workpiece to the resin sealing mold and when the loader hand moves on the transport path to remove the molded workpiece from the resin sealing mold.

According to this aspect, when the loader hand moves along the transport path to supply the workpiece to the resin sealing mold, and when the loader hand moves along the transport path to remove the workpiece from the resin sealing mold, a cleaning operation is performed on at least one of the loader hand and the workpiece. This effectively prevents particles from adhering to the workpiece or the loader hand, improving the quality of the molded product.

A resin sealing method according to another aspect of the present invention is a resin sealing method for resin-sealing electronic components in a workpiece including a substrate and electronic components, and includes supplying the workpiece to a resin sealing mold using a loader hand, resin-sealing the electronic components in the resin sealing mold, and removing the resin-sealed molded workpiece from the resin sealing mold using the loader hand.The method further includes performing a cleaning operation on the loader hand or the workpiece moving on the transport path when the loader hand moves on the transport path to supply the workpiece to the resin sealing mold and when the loader hand moves on the transport path to remove the molded workpiece from the resin sealing mold.

According to this aspect, when the loader hand moves along the transport path to supply the workpiece to the resin sealing mold, and when the loader hand moves along the transport path to remove the workpiece from the resin sealing mold, a cleaning operation is performed on at least one of the loader hand and the workpiece. This effectively prevents particles from adhering to the workpiece or the loader hand, improving the quality of the molded product.

This invention makes it possible to suppress particle adhesion and improve the quality of resin-sealed molded products.

1 is a plan view of a resin sealing device according to an embodiment of the present invention; FIG. 2 is a partially enlarged view of the resin sealing apparatus of FIG. 1 . FIG. 2 is a cross-sectional view of the resin-sealing mold of FIG. 1 . FIG. 2 is a cross-sectional view of the cleaner portion of FIG. 1 . 1 is a flowchart showing a resin sealing method according to an embodiment of the present invention. 1A to 1C are diagrams illustrating a resin sealing method according to an embodiment of the present invention. 1A to 1C are diagrams illustrating a resin sealing method according to an embodiment of the present invention. 1A to 1C are diagrams illustrating a resin sealing method according to an embodiment of the present invention. 1A to 1C are diagrams illustrating a resin sealing method according to an embodiment of the present invention. 1A to 1C are diagrams illustrating a resin sealing method according to an embodiment of the present invention. 1A to 1C are diagrams illustrating a resin sealing method according to an embodiment of the present invention. 1A to 1C are diagrams illustrating a resin sealing method according to an embodiment of the present invention. 1A to 1C are diagrams illustrating a resin sealing method according to an embodiment of the present invention. 1A to 1C are diagrams illustrating a resin sealing method according to an embodiment of the present invention.

Embodiments of the present invention will be described below with reference to the drawings. The drawings of each embodiment are illustrative, and the dimensions and shapes of each part are schematic. The technical scope of the present invention should not be interpreted as being limited to these embodiments.

[First embodiment]
<Resin sealing equipment>
The configuration of a resin sealing apparatus 1 according to an embodiment of the present invention will be described with reference to Figures 1 to 4. Figure 1 is a plan view of the resin sealing apparatus according to this embodiment. Figure 2 is a partially enlarged view of the resin sealing apparatus, Figure 3 is a cross-sectional view of a resin sealing mold, and Figure 4 is a cross-sectional view of a cleaner section. Note that for the sake of clarity, each of Figures 1 to 4 is labeled with directions such as front, back, left, right, up, and down to clarify the relationship between the drawings and to help understand the positional relationship of each component.

The resin sealing apparatus 1 is a manufacturing device that applies resin to a workpiece W to produce a molded product M. The workpiece W includes a substrate S and electronic components P. A molded product M can be produced by molding resin R onto the workpiece W and resin-sealing the electronic components P of the workpiece W. Here, the workpiece W has a surface on which the electronic components P are mounted (hereinafter referred to as the "surface of the workpiece W") and a surface opposite the surface (hereinafter referred to as the "rear surface of the workpiece W"). The rear surface of the workpiece W is the surface on which the electronic components P are not mounted. In the following description, the vertical relationship between the front and rear surfaces of the workpiece W can be reversed as appropriate depending on the structure of the resin sealing mold. For convenience of explanation, the workpiece W after resin sealing may be referred to as a molded product M. The substrate S may be, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, or a semiconductor substrate. The electronic components P may be, for example, semiconductor elements such as IC chips, but are not limited thereto and may include various active and passive elements, MEMS devices, etc. The resin R is, for example, a granular thermosetting resin. The form of the resin R is not limited to the above, and it may also be in liquid or powder form. In this embodiment, as an example, the resin R is molded onto the workpiece W and the functional member H. The functional member H is, for example, a plate-shaped member. The functional member H is provided so that it is exposed on the side opposite to the side on which the substrate S of the molded product M is exposed. The functional member H functions, for example, as a heat dissipation member that dissipates heat generated by the electronic component P or a shielding member that blocks electromagnetic waves. The functional member H may also be a sheet resin.

The resin sealing apparatus 1 according to this embodiment is a compression molding type resin sealing apparatus. As shown in FIG. 1, the resin sealing apparatus 1 includes a work supply unit 10, resin molding units 20 and 30, a resin supply unit 40, a functional component supply unit 50, a first loader 60, a second loader 70, and a molded product recovery unit 90. The first loader 60 transports the work W and is configured to be movable along the first guide section 60R. The second loader 70 transports the resin R and the functional component H and is configured to be movable along the second guide section 70R.

The planar layout of the resin sealing apparatus 1 is not particularly limited, but in the example shown in FIG. 1, the work supply unit 10, resin molding unit 20, resin supply unit 40, resin molding unit 30, and molded product recovery unit 90 are arranged in this order from left to right along the first guide portion 60R in FIG. 1. Furthermore, with respect to the first guide portion 60R as a reference, the resin supply unit 41 is arranged on the rear side, and the functional component supply unit 50 is arranged on the front side. The functional component supply unit 50 and resin supply unit 40 are arranged in this order from front to rear along the second guide portion 70R in FIG. 1. Furthermore, with respect to the second guide portion 70R as a reference, the work supply unit 10 and resin molding unit 20 are arranged on the left side, and the resin molding unit 30 and molded product recovery unit 90 are arranged on the right side.

The work supply unit 10 supplies workpieces W to the first loader hand 61 of the first loader 60. The work supply unit 10 includes a work storage section 11, a workpiece transfer section 13, a workpiece preheating section 15, and a workpiece supply control panel 19. Furthermore, for example, the workpiece supply control panel 19 may include a display section that displays the control parameters of the molded product recovery unit 90, resin supply unit 40, functional component supply unit 50, first loader 60, and second loader 70 (described below), as well as an input section for inputting these control parameters.

The work storage unit 11 stores multiple workpieces W and delivers the workpieces W sequentially. For example, the work storage unit 11 includes multiple workpiece magazines and a workpiece elevation. The workpiece magazine set in the work storage unit 11 stores multiple workpieces W stacked vertically. The workpiece elevation adjusts the position of the workpiece magazine in order to deliver the workpieces W to the workpiece transfer unit 13.

The workpiece transfer unit 13 transfers the workpiece W received from the workpiece storage unit 11 to the workpiece preheating unit 15. For example, the workpiece transfer unit 13 includes a workpiece index that receives and aligns the workpiece W sent out by the workpiece storage unit 11, and a workpiece pick and place that transfers the workpiece W aligned by the workpiece index to the workpiece preheating unit 15.

The workpiece preheating unit 15 preheats the workpiece W received from the workpiece transfer unit 13 and delivers it to the first loader hand 61 of the first loader 60. Preheating the workpiece W before it is transported to the resin molding units 20, 30 can prevent deformation of the workpiece W due to sudden temperature changes inside the resin sealing molds 21, 31. For example, the workpiece preheating unit 15 may be equipped with a preheat rail that heats the workpiece W from its edges. Alternatively, the workpiece preheating unit 15 may be equipped with a hot plate that heats the entire surface of the workpiece W. Note that the workpiece preheating unit 15 may not be provided, and the workpiece W may not be preheated. In this case, the time from when the workpiece W is transported to the resin molding units 20, 30 until the start of loading the resin R and functional components H into the resin molding units 20, 30 or the start of mold closing may be controlled.

The work supply control panel 19 controls the operation of the work supply unit 10. When viewed from above as shown in Figure 1, the work supply control panel 19 is located on the front side of the work supply unit 10. For example, the work supply control panel 19 includes a display unit that displays the control parameters of the work supply unit 10 and an input unit for inputting the control parameters of the work supply unit 10.

The work supply unit 10 may further include a volume measurement unit that measures the volume of the work W, an appearance inspection unit that inspects the appearance of the work W, and the like.

The molded product recovery unit 90 recovers the molded product M from the first loader hand 61 of the first loader 60. The molded product recovery unit 90 includes a molded product receiving section 91, a molded product delivery section 93, and a molded product storage section 95. In the example shown in FIG. 1, the molded product recovery unit 90 is disposed on the opposite side of the resin molding units 20, 30 from the work supply unit 10 in the left-right direction. As a variant, the molded product recovery unit 90 may be disposed on the same side of the resin molding units 20, 30 as the work supply unit 10 in the left-right direction.

The molded product receiving section 91 delivers the molded product M received from the first loader hand 61 of the first loader 60 to the molded product delivery section 93. For example, the molded product receiving section 91 is equipped with a cooling pallet for cooling the molded product M. Alternatively, a cooling pallet may not be provided, and the workpiece W may not be cooled.

The molded product delivery section 93 delivers the molded products M received from the molded product receiving section 91 to the molded product storage section 95. For example, the molded product delivery section 93 includes a molded product index that receives and aligns the molded products M sent out by the molded product receiving section 91, and a molded product pick and place that delivers the molded products M aligned by the molded product index to the molded product storage section 95.

The molded product storage section 95 receives and stores the molded products M. For example, the molded product storage section 95 includes multiple molded product magazines and a molded product elevation. The molded product magazine set in the molded product storage section 95 stores multiple molded products M stacked vertically. The molded product elevation adjusts the position of the molded product magazine to receive the molded products M from the molded product delivery section 93.

The molded product recovery unit 90 may further include a volume measurement unit that measures the volume of the molded product M, an appearance inspection unit that inspects the appearance of the molded product M, and the like.

The resin molding unit 20 molds resin R onto the workpiece W and functional component H. The resin molding unit 20 includes a resin sealing mold 21, a cleaner unit 26, a film handler 27, and a resin molding control panel 29.

As shown in Figure 3, the resin sealing mold 21 comprises a pair of openable and closable lower and upper dies 22 and 23 that fill an internal cavity 25 with resin R for molding. In the example shown in Figure 3, the resin sealing mold 21 is a compression molding mold with a so-called movable lower cavity structure. Specifically, the surface of the upper die 23 facing the lower die 22 is flat, and a cavity 25 is formed on the surface of the lower die 22 facing the upper die 23. The cavity 25 is a recess (an example of a cavity recess) that opens toward the upper die 23.

The lower mold 22 comprises a lower plate 22a, a cavity piece 22b, a clamper 22c, and a biasing member 22d. The cavity piece 22b is fixedly attached to the upper surface of the lower plate 22a (the surface facing the upper mold 23). The clamper 22c is configured in a frame shape surrounding the cavity piece 22b. The clamper 22c is attached to the lower plate 22a via the biasing member 22d so that it can move up and down. The cavity piece 22b forms the bottom surface of the cavity 25, and the clamper 22c forms the side surface of the cavity 25. The lower mold 22 has suction holes 22e and 22f that penetrate the clamper 22c, and a suction hole 22g that penetrates the lower plate 22a and cavity piece 22b. The suction hole 22e opens to the top surface of the clamper 22c. Suction hole 22f opens on the inner surface of clamper 22c facing cavity piece 22b. A seal member (not shown) is inserted below suction hole 22f. Suction hole 22g opens on the top surface of cavity piece 22b, i.e., the bottom surface of cavity 25. Suction holes 22e, 22f, and 22g are used to suck film F set in lower mold 22.

The upper mold 23 comprises an upper plate 23a and a cavity plate 23b. The cavity plate 23b is fixedly assembled to the underside of the upper plate 23a (the surface facing the lower mold 22). The upper mold 23 is provided with a suction hole 23c that penetrates the upper plate 23a and the cavity plate 23b. The suction hole 23c opens to the underside of the cavity plate 23b. The suction hole 23c is a suction hole for sucking the workpiece W set on the upper mold 23.

The cleaner unit 26 cleans at least one of the workpiece W and the first loader hand 61. Details of the cleaner unit 26 will be described later.

The film handler 27 supplies film F to the resin sealing mold 21. Film F is a release film that prevents resin R from penetrating the gaps in the lower mold 22 that form the recess of the cavity 25 and facilitates the release of the molded product M from the lower mold 22. The film handler 27 handles, for example, rolled film and includes an unwinding section that supplies unused film F and a winding section that collects used film F. As shown in FIG. 1, the unwinding and winding sections of the film handler 27 are disposed to the left and right of the resin sealing mold 21. Film F can be made of a polymeric material with excellent heat resistance, ease of release, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene-ethylene copolymer), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), PET (polyethylene terephthalate), PP (polypropylene), and PVDC (polyvinylidine chloride). The thickness of the film F is appropriately selected depending on the physical properties of the material, and is, for example, approximately 50 μm. The shape of the film F is not limited to a roll, and may also be a strip.

The resin molding control panel 29 controls the operation of the resin molding unit 20. When viewed from above as shown in Figure 1, the resin molding control panel 29 is located on the front side of the resin molding unit 20. For example, the resin molding control panel 29 includes a display unit that displays the control parameters of the resin molding unit 20 and an input unit that inputs the control parameters of the resin molding unit 20.

The resin molding unit 30 includes a resin sealing mold 31, a cleaner unit 26, a film handler 37, and a resin molding control panel 39. In the following explanation, details of the resin sealing mold 31, cleaner unit 36, film handler 37, and resin molding control panel 39 will be omitted, but the same configurations as those described for the resin molding unit 20 can be applied.

In addition, at least some of the functions of the resin molding control panels 29, 39 may be consolidated into the work supply control panel 19. For example, the control parameters of the resin molding units 20, 30 may be displayed on the display unit of the work supply control panel 19, and the control parameters of the resin molding units 20, 30 may be input into the input unit of the work supply control panel 19. If all of the functions of the control panels for each unit are consolidated into the work supply control panel 19, the resin molding control panels 29, 39 may be omitted.

The functional component supply unit 50 includes a functional component storage section 51 and a functional component delivery section 53.

The functional component storage section 51 stores multiple functional components H and delivers them sequentially. For example, the functional component storage section 51 is equipped with multiple functional component magazines and a functional component elevation. The functional component magazine set in the functional component storage section 51 stores multiple functional components H stacked vertically. The functional component elevation adjusts the position of the functional component magazine in order to deliver the functional components H to the functional component delivery section 53.

The functional component delivery section 53 delivers the functional component H received from the functional component storage section 51 to the holding tool 78. For example, the functional component delivery section 53 receives the functional component H sent out by the functional component storage section 51, aligns it, and delivers it to the holding tool 78. At this time, the functional component H may be picked up using a chucking function provided in the holding tool 78.

The functional component supply unit 50 may further include a volume measurement unit that measures the volume of the functional component H, an appearance inspection unit that inspects the appearance of the functional component H, a functional component preheating unit that preheats the functional component H, etc.

The resin supply unit 40 supplies granular resin R onto the functional component H. The resin supply unit 40 includes a resin supply section 41 and a resin heater 80.

The resin supply unit 41 supplies resin R onto the functional component H held by the holding tool 78. The resin supply unit 41 includes a hopper (not shown) and a feeder (not shown). If the resin is liquid, the resin supply unit may include a syringe for storing the resin, a piston for pushing out the resin, and a pinch valve for opening and closing the tip of the syringe.

The resin heater 80 heats the functional member H and the resin R supplied onto the functional member H. The heat source for the resin heater 80 may be a known heating mechanism such as an electric wire heater or an infrared heater. The resin heater 80 may not be necessary.

In the resin supply unit 40, it is preferable that the resin guard 44, described below, be placed inside the holding tool 78. The resin guard 44 is configured in a frame shape that follows the outer shape of the functional component H, and is used as a frame that defines the area into which the resin R is dispersed. The resin guard 44 is, for example, attached to the holding tool 78 before the resin R is supplied, and removed from the holding tool 78 after the resin R has been heated.

The resin supply unit 40 may further include a weight measuring unit that measures the weight of the resin R, a vibration unit that disperses the resin R by vibration, and an inspection unit that inspects the degree of dispersion of the resin R.

The first loader 60 transports the workpiece W from the workpiece supply unit 10 to the resin molding units 20, 30. The first loader 60 is configured to be movable along the first guide portion 60R. The first guide portion 60R extends in the left-right direction across the workpiece supply unit 10, the resin molding units 20, 30, the resin supply unit 40, and the molded product recovery unit 90. When viewed from above as shown in FIG. 1, the first guide portion 60R is located, for example, behind the resin sealing molds 21, 31 and in front of the resin supply portion 41. In the configuration example shown in FIG. 1, the first loader 60 transports the molded product M from the resin molding units 20, 30 to the molded product recovery unit 90.

As shown in Figure 2, the first loader 60 includes a first loader hand 61, a first base 62, and a first guide rod 63.

The first loader hand 61 is configured to be able to advance and retreat from the rear of the resin sealing mold 21. In other words, the first loader hand 61 has a transport path for the workpiece W or molded product M (an example of a workpiece) on the rear side of the resin sealing mold 21. The first loader hand 61 holds the workpiece W or molded product M. The first loader hand 61 has, for example, an L-shaped opening and closing claw that supports the underside of the workpiece W or molded product M, but is not limited to this. The first loader hand 61 may adsorb the workpiece W or molded product M using electrostatic force, or may adsorb the workpiece W or molded product M by suction and exhaust.

As shown in Figure 2, the first base 62 is connected to the first guide portion 60R so as to be movable in the left-right direction.

As shown in Figure 2, the first guide rod 63 is connected to the first base 62 and supports the first loader hand 61. The first guide rod 63 is configured to be extendable and retractable in the front-to-rear direction, allowing the first loader hand 61 to move in the front-to-rear direction.

As an example, after receiving the workpiece W at the workpiece transfer section 13, the first loader hand 61 is transported to the right by the first base 62 and moves to a position facing the resin sealing mold 21 in the front-to-rear direction. Next, while holding the workpiece W, the first loader hand 61 enters the resin sealing mold 21 from the rear by extending the first guide rod 63. That is, the first loader hand 61 loads the workpiece W into the resin sealing mold 21. After delivering the workpiece W to the upper mold 23 of the resin sealing mold 21, the first loader hand 61 moves to the rear of the resin sealing mold 21 by contracting the first guide rod 63. After the molded product M is molded and the resin sealing mold 21 is opened, the first loader hand 61 loads the molded product M out of the resin sealing mold 21 by performing the same operation as when loading the workpiece W. The first loader hand 61 is then transported to the right by the first base 62 and delivers the molded product M to the molded product receiving section 91.

The second loader 70 transports the resin R and the functional component H. The second loader 70 is configured to be movable along the second guide portion 70R. The second guide portion 70R is provided, for example, on the resin supply unit 40 and extends in the front-to-rear direction. When viewed from above as shown in Figure 1, the second guide portion 70R intersects, for example, with the first guide portion 60R.

As shown in FIG. 2, the second loader 70 includes a second loader hand 71, a second base 72, and a second guide rod 73.

As shown in FIG. 2, the second base 72 is configured to be movable in the front-to-rear direction relative to the second guide portion 70R, but it is not limited to movement in the front-to-rear direction and may also be configured to be movable in the left-to-right direction.

As shown in FIG. 2, the second guide rod 73 is connected to the second base 72 and supports the second loader hand 71. The second guide rod 73 is configured to be extendable and rotatable from the point where it is connected to the second base 72. As a result, the second guide rod 73 moves the second loader hand 71 forward/backward or left/right, and also rotates the second loader hand 71 around the second base 72.

As an example, the second loader hand 71 transports the holding tool 78 to the functional component delivery section 53. After receiving the functional component H by the holding tool 78 at the functional component delivery section 53, the second loader hand 71 is transported rearward by the second base 72 and transports the functional component H via the holding tool 78 to position P2 rearward of the functional component delivery section 53. Next, the second loader hand 71 moves to position P1 in front of the resin supply section 41 by pivoting the second guide rod 73. Next, the second loader hand 71 moves to the resin supply section 41 by extending the second guide rod 73. At the resin supply section 41, the second loader hand 71 releases the holding tool 78. A resin guard 44 is set inside the released holding tool 78. Then, after the resin R is received on the functional component H and inside the resin guard 44, the functional component H and the resin R are heated, and after heating, the resin guard 44 is removed. The second loader hand 71 then picks up the holding tool 78 again and returns to position P1 by contracting the second guide rod 73. Next, the second loader hand 71 moves to position P3 to the right of the resin sealing mold 21 by rotating the second guide rod 73. Next, while holding the resin R and the functional component H via the holding tool 78, the second loader hand 71 enters the resin sealing mold 21 from the right by extending the second guide rod 73. That is, the second loader hand 71 delivers the resin R and the functional component H into the resin sealing mold 21 via the holding tool 78. After the second loader hand 71 delivers the resin R and functional component H to the resin sealing mold 21, it moves to the right of the resin sealing mold 21 as the second guide rod 73 contracts.

In this way, if the second loader hand 71 can move from the resin supply unit 40 to the functional component delivery section 53 by extending and retracting the second guide rod 73, it is possible to add additional functional component supply units 50 without having to extend the second guide section 70R to the functional component supply units 50.

The first loader 60 and second loader 70 operate in the same way with respect to the resin sealing mold 31 of the resin molding unit 30 as they do with respect to the resin sealing mold 21 of the resin molding unit 20. Therefore, a description of the operation of the first loader 60 and second loader 70 with respect to the resin sealing mold 31 will be omitted. However, the operation of the second loader 70 with respect to the resin sealing mold 31 is the left-right reverse of the operation of the second loader 70 with respect to the resin sealing mold 21.

Next, the transport path taken by the first loader hand 61 when supplying the workpiece to the resin sealing mold 21 will be described. The first loader hand 61 receives the workpiece W in the workpiece preheating section 15. The first loader 60 then moves rightward along the first guide section 60R with the first loader hand 61 holding the workpiece W, transporting the workpiece W to the rear of the resin sealing mold 21. Then, as shown in FIG. 2, the first loader hand 61 and workpiece W are transported to the resin sealing mold 21 by the extension and contraction of the first guide rod 63, and the workpiece W is placed on the resin sealing mold 21 by the first loader hand 61. After being resin-encapsulated in the resin sealing mold 21, the workpiece W, while held by the first loader hand 61, retreats from the resin sealing mold 21 by the extension and contraction of the first guide rod 63.

Next, we will explain the transport path when the first loader hand 61 removes the workpiece from the resin sealing mold 21. As shown in FIG. 2, the first loader hand 61 is transported to the resin sealing mold 21 by the extension and contraction of the first guide rod 63, and with the workpiece W held by the first loader hand 61, the workpiece W is retracted from the resin sealing mold 21 by the extension and contraction of the first guide rod 63. Thereafter, with the first loader hand 61 still holding the workpiece W, the first loader 60 moves to the right along the first guide portion 60R and delivers the workpiece W to the molded product receiving portion 91. The transport path for supplying or removing the workpiece W described above also applies to the resin sealing mold 31.

1 and 2, the transport path of the first loader 60 is located behind the resin-sealing molds 21 and 31, and the cleaner unit 26 is disposed behind the resin-sealing mold 21. The cleaner unit 26 may be connected to the rear of the resin-sealing mold 21, or may be located away from the resin-sealing mold 21. The cleaning operation by the cleaner unit 26 is performed when the first loader hand 61 advances into or retreats from the resin-sealing mold 21 to supply the workpiece W to the resin-sealing mold 21. This cleaning operation is also performed when the first loader hand 61 advances into or retreats from the resin-sealing mold 21 to remove the workpiece W from the resin-sealing mold 21. As shown in FIG. 3, the cleaner unit 26 includes a lower cleaner 26a provided on the lower mold 22 side and an upper cleaner 26b provided on the upper mold 23 side.

As shown in FIG. 4, the lower cleaner 26a is equipped with a brush 262a and a dust collection port 264a. This configuration allows the dust collection port 264a to collect deposits removed from the workpiece W or the first loader hand 61 by the brush 262a. The dust collection port 264a has multiple openings 266a that open upward in the lower cleaner 26a, and the brushes 262a are provided in the areas between each opening 266a. Also, as shown in FIG. 1, the lower cleaner 26a has a width greater than the width of at least one of the workpiece W and the first loader hand 61 (the width in the left-right direction in the example shown in FIG. 1). This allows the entire width of the workpiece W or the first loader hand 61 to be cleaned as the workpiece W or the first loader hand 61 passes through the lower cleaner 26a in the forward and backward directions. Like the lower cleaner 26a, the upper cleaner 26b is equipped with a brush 262b and a dust collection port 264b, and the configuration of these and the opening 266b can be applied to the same as that described for the lower cleaner 26a.

As described above, with the resin sealing device described in this embodiment, the cleaner unit 26 is provided on the transport path of the loader hand that transports the workpiece to the resin sealing mold, and when the first loader hand 61 supplies the workpiece W to the resin sealing mold 21, it can suck and remove particles adhering to the workpiece W and the first loader hand 61. Furthermore, when the first loader hand 61 removes the molded product M from the resin sealing mold 21, it can suck and remove particles adhering to the underside of the molded product M and the first loader hand 61. As a result, the quality of the molded product can be improved.

<Resin sealing method>
Next, the resin sealing method will be described with reference to Figures 5 to 14. Figure 5 is a flowchart showing an example of the resin sealing method using the resin sealing apparatus according to this embodiment. Figures 6 to 10 are views for explaining the resin sealing method according to this embodiment. In the following explanation, a method using a resin sealing apparatus having a cavity in the lower mold will be described. Note that the resin sealing mold 21 of the resin molding unit 20 will be used as an example for explanation, and a description of the resin sealing mold 31 of the resin molding unit 30, which operates in a similar manner, will be omitted.

First, the first loader hand 61 holds the workpiece W (S10).

Specifically, the workpiece W received from the workpiece transfer section 13 in Figure 1 is preheated in the workpiece preheating section 15 and held by the first loader hand 61 of the first loader 60. The first loader hand 61, holding the workpiece W, moves to the resin molding unit 20. Before or after this process, the film F is moved to the cavity 25 provided on the lower mold 22 side. After the film F has been moved, it is sucked through the suction hole 22g and set in the cavity 25.

Next, when the first loader hand 61 enters the resin sealing mold 21, 31, the first loader hand 61 and the workpiece W are cleaned (S20).

Specifically, as shown in FIG. 6 , immediately before the first loader hand 61 enters the resin-sealing mold 21 while holding the workpiece W, it is cleaned by the cleaner unit 26 provided behind the resin-sealing mold 21. The cleaner unit 26 is composed of a lower cleaner 26a provided on the lower mold 22 side and an upper cleaner 26b provided on the upper mold 23 side. The lower cleaner 26a cleans the underside of the first loader hand 61, and the upper cleaner 26b cleans the backside of the workpiece W. After cleaning, the first loader hand 61 enters the resin-sealing mold 21 and delivers the workpiece W to the upper mold 23.

Next, when the first loader hand 61 retreats from the resin sealing molds 21, 31, the first loader hand 61 is cleaned (S30).

Specifically, as shown in FIG. 7, after the workpiece W is transferred to the upper mold 23, the first loader hand 61 is cleaned by the cleaner unit 26 while retracted from the resin-sealing mold 21. At this time, the lower cleaner 26a cleans the underside of the first loader hand 61. At the same time, the upper cleaner 26b cleans the top surface of the first loader hand 61.

Then, the electronic component P is resin-sealed using the resin sealing molds 21 and 31 (S40).

Specifically, as shown in Figure 8, the resin sealing mold 21 is clamped, and the resin R is heated while being pressurized by the lower mold 22 and upper mold 23. Once the resin R has hardened, the mold is opened.

Next, when the first loader hand 61 enters the resin sealing mold 21, 31, the first loader hand 61 is cleaned (S50).

Specifically, after resin sealing, the first loader hand 61 re-enters the resin sealing mold 21 to retrieve the molded product M. At this time, as shown in FIG. 9, the first loader hand 61 is cleaned by the cleaner unit 26 while entering the resin sealing mold 21. Specifically, the lower cleaner 26a cleans the underside of the first loader hand 61. At the same time, the upper cleaner 26b cleans the upper surface of the first loader hand 61. After cleaning, the first loader hand 61 enters the resin sealing mold 21 and retrieves the workpiece W.

Next, when the first loader hand 61 retreats from the resin sealing molds 21, 31, the first loader hand 61 and the workpiece W are cleaned (S60).

Specifically, as shown in Figure 10, after receiving the workpiece W, the first loader hand 61 is cleaned by the cleaner unit 26 while retreating from the resin sealing mold 21. At this time, the lower cleaner 26a cleans the underside of the first loader hand 61, and the upper cleaner 26b cleans the backside of the workpiece W.

As described above, according to the resin sealing method described in this embodiment, the cleaner unit 26 is provided on the transport path of the first loader hand 61 that transports the workpiece W to the resin sealing mold 21, and can suck and remove particles adhering to the workpiece W and the first loader hand 61 when the workpiece W is supplied to the resin sealing mold 21 by the first loader hand 61. In addition, when the molded product M is removed from the resin sealing mold 21 by the first loader hand 61, particles adhering to the underside of the molded product M and the first loader hand 61 can be sucked and removed. As a result, the quality of the molded product can be improved.

Second Embodiment
<Resin sealing equipment>
Next, the structure of a resin-sealed mold 121 according to the second embodiment will be described with reference to Figures 11 to 14. Figure 11 is a cross-sectional view that schematically shows the structure of a resin-sealed mold 121 according to the second embodiment.

In this embodiment, unlike the first embodiment, a cavity 125 is provided on the upper mold 122 side. The resin sealing mold 21 is a pair of openable and closable molds that fill the internal cavity 125 with resin R to form a mold. The resin sealing mold 121 comprises an upper mold 122 and a lower mold 123. The surface of the lower mold 123 facing the upper mold 122 is flat, and the cavity 125 is formed on the surface of the upper mold 122 facing the lower mold 123. In other words, the resin sealing mold 121 is a compression molding mold with a so-called movable upper cavity structure. The cavity 125 is a recess that opens toward the lower mold 123, and corresponds to an example of a "cavity recess" according to the present invention.

The upper mold 122 comprises an upper plate 122a, a cavity piece 122b, a clamper 122c, and a biasing member 122d. The cavity piece 122b is fixedly attached to the underside of the upper plate 122a (the surface facing the lower mold 123). The clamper 122c is configured in a frame shape to surround the cavity piece 122b. The clamper 122c is attached to the upper plate 122a via the biasing member 122d so that it can move up and down. The cavity piece 122b forms the bottom surface of the cavity 125, and the clamper 122c forms the side surface of the cavity 125. The lower mold 123 is provided with suction holes 122e and 122f that penetrate the clamper 122c, and a suction hole 122g that penetrates the upper plate 122a and the cavity piece 122b. Suction hole 122e opens to the bottom surface of clamper 122c. Suction hole 122f opens to the inner surface of clamper 122c facing cavity piece 122b. A seal member (not shown) is inserted below suction hole 122f. Suction hole 122g opens to the top surface of cavity piece 122b, i.e., the bottom surface of cavity 125. Suction holes 122e, 122f, and 122g are used to suck film F set in upper mold 122.

The lower mold 123 comprises a lower plate 123a and a cavity plate 123b. The cavity plate 123b is fixedly assembled to the upper surface of the lower plate 123a (the surface facing the upper mold 122). The lower mold 123 is provided with a suction hole 123c that penetrates the lower plate 123a and the cavity plate 123b. The suction hole 123c opens to the underside of the cavity plate 123b. The suction hole 123c is a suction hole for sucking the workpiece W set on the lower mold 123.

Using such a resin-sealed mold makes it possible to compression mold an upper cavity movable structure with a cavity 125 on the upper mold 122 side. Furthermore, the cleaner unit 26 cleans the first loader hand on the transport path, improving molding quality.

<Resin sealing method>
Next, a resin sealing method using a resin sealing mold 121 according to a second embodiment will be described with reference to FIGS. 11 to 14. FIGS. 11 to 14 are diagrams for explaining the resin sealing method according to this embodiment. In the following explanation, a method using a resin sealing device having a cavity in the upper mold will be described. The resin sealing mold 121 of this embodiment has a cavity 125 in the upper mold 122. Therefore, unlike the first embodiment in which the workpiece W was placed on the upper mold 23, in this embodiment the workpiece W is placed on the lower mold 123.

As shown in FIG. 11, the first loader hand 61 enters the resin sealing mold 21 while holding the workpiece W, and is cleaned by a cleaner unit 26 provided on the transport path of the first loader hand 61, which transports the workpiece W to the resin sealing mold 21.

As shown in Figure 12, after the workpiece W is transferred, the first loader hand 61 is cleaned by the cleaner unit 26 while retreating from the resin sealing mold 121.

After resin sealing, the first loader hand 61 re-enters the resin sealing mold 121 to retrieve the molded product M. At this time, as shown in Figure 13, the first loader hand 61 is cleaned by the cleaner unit 26 while entering the resin sealing mold 121.

As shown in Figure 14, after the workpiece W is transferred, the first loader hand 61 is cleaned by the cleaner unit 26 while retreating from the resin sealing mold 121.

[Modification]
A modification different from the above embodiment will be described.

Either resin molding unit 20 or resin molding unit 30 may be omitted. That is, only one resin molding unit may be provided, with one resin supply unit supplying resin to one resin molding unit. Three or more resin molding units may also be provided. In this case, two or more resin supply units may be provided. For example, two resin molding units and a resin supply unit provided between the two resin molding units to supply resin to the two resin molding units may be considered as one unit group, and multiple unit groups may be arranged side by side in the left-right direction.

In the above embodiment, the first loader 60 functions as a work loader that loads the workpiece W into the resin sealing molds 21, 31, and also functions as a molded product unloader that unloads the molded product M from the resin sealing molds 21, 31. However, the function of the first loader 60 may be limited to that of a work loader. That is, the resin sealing apparatus may further include a third loader as a molded product unloader. Such a third loader may, for example, share a transport path with the first loader and be configured to be movable along the first guide section. The resin sealing apparatus may also further include a third guide section for transporting the third loader.

The arrangement of the cleaner unit 26 is not limited to the above embodiment; for example, either the lower cleaner 26a or the upper cleaner 26b may be used. Furthermore, depending on the transport path of the workpiece W and the first loader hand 61, the cleaner unit 26 may be appropriately positioned in the front, back, left, or right directions of the resin sealing mold 21.

In the above embodiment, the lower cleaner 26a and upper cleaner 26b have the same structure as shown in Figure 4, but their configurations may be modified to suit the cleaning target. For example, if the lower cleaner 26a cleans the underside of the first loader hand, a configuration suitable for cleaning flat surfaces can be used.

As shown in Figures 2 and 3, the cleaner unit 26 according to the above embodiment is configured so that its width in the left-right direction is equal to that of the first loader hand 61 and its width in the front-to-rear direction is smaller than that of the first loader hand 61. However, this configuration is not limited to this. For example, the cleaner unit 26 may also be configured so that its width in the front-to-rear direction is equal to that of the first loader hand 61. Alternatively, the cleaner unit 26 may have a large area in the front-to-rear and left-to-right directions that can cover the entire first loader hand 61. These configurations allow for efficient cleaning with the dust collection port 264a set to a predetermined size. Furthermore, the cleaner unit 26 may be movable between near and far to bring it closer to the object, or suction may be activated only when cleaning is required and stopped when cleaning is not required.

In the above embodiment, the dust collection port 264a has multiple openings 266a on the top surface of the lower cleaner 26a, but this is not limited to this. For example, the dust collection port may have only one opening. The arrangement, shape, and size of the openings of the dust collection port may also be set as appropriate. The arrangement, number, etc. of the brushes 262a in this embodiment may also be set as appropriate depending on the type of opening 266a. Note that these configurations can also be applied to the upper cleaner 26b in the same way.

In the above embodiment, the first loader hand 61 is configured to make one round trip over the cleaner section 26 when entering and leaving the resin sealing mold 21, but it may also make multiple round trips so as to overlap above or below the cleaner section 26.

In the above embodiment, the lower cleaner 26a and upper cleaner 26b have the same configuration as shown in Figure 4, but they may have different configurations depending on the object to be cleaned. For example, the lower cleaner 26a may have a higher density of brushes 262a than the upper cleaner 26b, a higher suction force for the dust collection port 264a, or a larger cleaner area. In the case of the lower cavity structure of Figure 4, the resin R is placed on the lower mold 22 side. Therefore, when the first loader hand 61 retreats from the resin sealing mold 21, it is conceivable that the resin R will adhere to the first loader hand 61. In this case, using the configuration of the above modified example enables efficient cleaning of the first loader hand 61 in a lower cavity structure.

As described above, the resin sealing apparatus 1 according to one aspect of the present invention is a resin sealing apparatus that seals electronic components in a workpiece, including a substrate and electronic components, with resin. It includes a resin molding unit that seals the electronic components in the workpiece with resin by compression molding. The resin molding unit includes a resin sealing mold having an upper mold and a lower mold, and a cleaner unit with a dust collection port provided on the transport path of a loader hand that transports the workpiece to the resin sealing mold. The cleaner unit performs a cleaning operation on at least one of the loader hand and the workpiece moving on the transport path when the loader hand moves on the transport path to supply the workpiece to the resin sealing mold, and when the loader hand moves on the transport path to remove the molded workpiece from the resin sealing mold.

This allows for cleaning of at least one of the loader hand and the workpiece during transport, preventing particles from adhering to the workpiece before resin sealing and to the molded product after resin sealing. This improves the quality of the resin-sealed molded product.

In the above aspect, when the loader hand enters the resin sealing mold to supply the workpiece to the resin sealing mold, the cleaner unit performs a cleaning operation on at least one of the loader hand and the workpiece moving along the transport path.

In the above aspect, the cleaner unit performs a cleaning operation on the loader hand moving along the transport path when the loader hand retreats from the resin sealing mold to supply the workpiece to the resin sealing mold.

In the above aspect, when the loader hand enters the resin-sealing mold to remove the workpiece from the resin-sealing mold, the cleaner unit performs a cleaning operation on the loader hand moving along the transport path.

In the above aspect, when the loader hand retreats from the resin-sealing mold to remove the workpiece from the resin-sealing mold, the cleaner unit performs a cleaning operation on at least one of the loader hand and the workpiece moving along the transport path.

In the above aspect, the dust collection port of the cleaner unit is located above the transport path of the loader hand, and the cleaner unit cleans the upper side of at least one of the loader hand and the workpiece.

In the above aspect, the dust collection port of the cleaner unit is located below the transport path of the loader hand, and the cleaner unit cleans the underside of at least one of the loader hand and the workpiece.

In the above aspect, the dust collection ports of the cleaner unit are provided above and below the transport path of the loader hand, and the cleaner unit cleans the upper and lower sides of at least one of the loader hand and the workpiece, respectively.

In the above aspect, the cleaner unit performs a cleaning operation on at least one of the loader hand and the workpiece that reciprocates along the transport path.

In the above aspect, the cleaner unit further includes a brush that can contact at least one of the loader hand and the workpiece, a blowing unit that blows compressed air or ionized air, or an emitting unit that emits ultrasonic waves.

In the above embodiment, the upper mold has a cavity recess that opens toward the lower mold.

In the above embodiment, the lower mold has a cavity recess that opens toward the upper mold.

A resin sealing method according to another aspect of the present invention is a resin sealing method for resin-sealing electronic components in a workpiece including a substrate and electronic components, and includes supplying the workpiece to a resin sealing mold using a loader hand, resin-sealing the electronic components in the resin sealing mold, and removing the resin-sealed molded workpiece from the resin sealing mold using the loader hand.The method further includes performing a cleaning operation on the loader hand or the workpiece moving on the transport path when the loader hand moves on the transport path to supply the workpiece to the resin sealing mold and when the loader hand moves on the transport path to remove the molded workpiece from the resin sealing mold.

This allows for cleaning of at least one of the loader hand and the workpiece during transport, preventing particles from adhering to the workpiece before resin sealing and to the molded product after resin sealing. This improves the quality of the resin-sealed molded product.

The embodiments described above are intended to facilitate understanding of the present invention and are not intended to limit the scope of the present invention. The elements included in the embodiments, as well as their arrangement, materials, conditions, shape, size, etc., are not limited to those illustrated and can be modified as appropriate. Furthermore, configurations shown in different embodiments can be partially substituted or combined.

REFERENCE SIGNS LIST 1...Resin sealing apparatus 10...Work supply unit 20, 30...Resin molding unit 21, 31...Resin sealing mold 25, 35...Cavity 27, 37...Film handler 26, 36...Cleaner section 40...Resin supply unit 44...Resin guard 50...Functional member supply unit 60...First loader 61...First loader hand 70...Second loader 71...Second loader hand 80...Resin heater 90...Molded product recovery unit W...Work P...Electronic component S...Substrate R...Resin H...Functional member F...Film

Claims (13)

A resin sealing apparatus for sealing electronic components in a workpiece including a substrate and electronic components with resin,
a resin molding unit that seals the electronic components of the workpiece with resin by compression molding,
The resin molding unit includes:
a resin sealing mold having an upper mold and a lower mold;
a cleaner unit having a dust collection port, the cleaner unit being provided on a transport path of a loader hand that transports the workpiece to the resin sealing mold;
The cleaner section performs a cleaning operation on at least one of the loader hand and the workpiece moving on the transport path when the loader hand moves on the transport path to supply the workpiece to the resin sealing mold, and when the loader hand moves on the transport path to remove the workpiece from the resin sealing mold after molding. The resin sealing apparatus of claim 1, wherein the cleaner unit performs a cleaning operation on at least one of the loader hand and the workpiece moving on the transport path when the loader hand enters the resin sealing mold to supply the workpiece to the resin sealing mold. The resin sealing apparatus of claim 1, wherein the cleaner unit performs a cleaning operation on the loader hand moving along the transport path when the loader hand retreats from the resin sealing mold to supply the workpiece to the resin sealing mold. The resin sealing device described in claim 1, wherein the cleaner unit performs a cleaning operation on the loader hand moving along the transport path when the loader hand enters the resin sealing mold to remove the workpiece from the resin sealing mold. The resin sealing apparatus of claim 1, wherein the cleaner unit performs a cleaning operation on at least one of the loader hand and the workpiece moving on the transport path when the loader hand retreats from the resin sealing mold to remove the workpiece from the resin sealing mold. the dust collection port of the cleaner unit is provided above the transport path of the loader hand,
2. The resin sealing apparatus according to claim 1, wherein the cleaner unit cleans an upper side of at least one of the loader hand and the workpiece. the dust collection port of the cleaner unit is provided below the transport path of the loader hand,
2. The resin sealing apparatus according to claim 1, wherein the cleaner unit cleans the underside of at least one of the loader hand and the workpiece. the dust collection ports of the cleaner unit are provided above and below the transport path of the loader hand,
2. The resin sealing apparatus according to claim 1, wherein the cleaner unit cleans the upper and lower sides of at least one of the loader hand and the workpiece. The resin sealing device described in claim 1, wherein the cleaner unit performs a cleaning operation on at least one of the loader hand and the workpiece, which reciprocate along the transport path. The resin sealing device according to claim 1, wherein the cleaner unit further includes a brush capable of contacting at least one of the loader hand and the workpiece, a blowing unit that blows compressed air or ionized air, or a radiation unit that emits ultrasonic waves. A resin sealing device according to any one of claims 1 to 10, wherein the upper mold has a cavity recess that opens toward the lower mold. A resin sealing device according to any one of claims 1 to 10, wherein the lower mold has a cavity recess that opens toward the upper mold. A resin sealing method for resin-sealing an electronic component in a workpiece including a substrate and the electronic component, comprising:
supplying the workpiece to a resin sealing mold by a loader hand;
Resin-sealing the electronic component with the resin-sealing mold; and
removing the resin-sealed molded workpiece from the resin-sealing mold by a loader hand;
The resin sealing method further includes performing a cleaning operation on the loader hand or the workpiece moving on the transport path when the loader hand moves on the transport path to supply the workpiece to the resin sealing mold, and when the loader hand moves on the transport path to remove the workpiece from the resin sealing mold after molding.