JP7801349B2 - Current-carrying materials - Google Patents

Description

The present invention relates to an electrically conductive member that is transparent to electromagnetic waves.

Sensors and communication devices that use electromagnetic waves, such as millimeter waves and microwaves, have been widely used. These devices are often installed in vehicles, for example, and are surrounded by protective covers. Accumulation of snow and ice on such covers, or fogging caused by water vapor, is known to cause false detection in sensors located inside the covers or communication failure in communication devices.

Electromagnetically transparent covers, such as those disclosed in Patent Document 1, have been developed to remove snow, ice, and fogging while allowing electromagnetic waves used in sensors, communication devices, and the like to pass through. The electromagnetically transparent cover in Patent Document 1 includes multiple wires with portions that extend parallel to each other. Because these multiple wires have portions that extend parallel to each other, electromagnetic waves can pass through these portions. Furthermore, the multiple wires generate heat when current is applied, and function as a heater.

Japanese Patent Application Laid-Open No. 2020-05057

However, the electromagnetic wave transparent cover disclosed in Patent Document 1 had the problem that if even one of the multiple wires functioning as a heater were to break, a section would become incapable of conducting electricity, reducing its performance as a heater, i.e., it had low robustness against wire breakage.

To improve robustness against wire breakage, it is possible to form multiple wires in a grid pattern, as disclosed in JP 2020-021169 A, for example. However, while forming multiple wires in a grid pattern improves robustness against wire breakage, there is a problem in that the multiple wires cannot transmit electromagnetic waves.

The present invention has been made to solve these conventional problems, and aims to provide an electrically conductive member that is both transparent to electromagnetic waves and robust against breakage.

The above object can be achieved by the following configuration.
[1] An insulating substrate;
a plurality of main wirings disposed on the insulating substrate and extending in a first direction at intervals from one another;
a plurality of auxiliary wirings disposed on the insulating substrate, each extending in a second direction intersecting the first direction and intersecting two or more of the main wirings continuously;
each of the plurality of auxiliary wirings has a length of 2.00 mm or less along the second direction;
The distance between the auxiliary wirings adjacent to each other along the first direction is 0.30 mm or more.
[2] The current-carrying member according to [1], wherein the plurality of auxiliary wirings continuously intersect with two to twelve of the main wirings.
[3] The current-carrying member according to [2], wherein the plurality of auxiliary wirings continuously intersect four or five of the main wirings.
[4] The current-carrying member according to [2], wherein the plurality of auxiliary wirings continuously intersect two or three of the main wirings.
[5] The current-carrying member according to any one of [1] to [4], wherein the auxiliary wirings adjacent to each other in the first direction intersect with the same main wiring and with the different main wirings.
[6] The plurality of auxiliary wirings include auxiliary wirings adjacent to each other along the second direction,
The conductive member according to any one of [1] to [5], wherein the auxiliary wirings adjacent to each other along the second direction are arranged on the same straight line along the second direction.
[7] The current-carrying member according to any one of [1] to [6], wherein the plurality of auxiliary wirings are arranged at equal intervals from one another in the first direction.
[8] The current-carrying member according to any one of [1] to [7], wherein the spacing between the auxiliary wires adjacent to each other along the first direction is 0.30 mm or more and 2.00 mm or less.
[9] The current-carrying member according to [8], wherein the spacing between the auxiliary wires adjacent to each other along the first direction is 0.30 mm or more and 1.00 mm or less.
[10] The current-carrying member according to [9], wherein the distance between the auxiliary wires adjacent to each other along the first direction is 0.60 mm or more and 0.90 mm or less.
[11] The electrically conductive member according to any one of [1] to [10], further comprising a transparent cover disposed on the back surface of the insulating substrate relative to the surface on which the plurality of main wirings and the plurality of auxiliary wirings are disposed.
[12] When placed near a transceiver that transmits and receives electromagnetic waves,
The conductive member according to [11], wherein the spacing between adjacent auxiliary wirings along the first direction is greater than or equal to one-quarter and less than one-half of the wavelength of the electromagnetic waves transmitted and received by the transceiver in the transparent cover and the insulating substrate.
[13] The current-carrying member according to any one of [1] to [12], which has a three-dimensional shape.
[14] The electrically conductive member according to any one of [1] to [13], further comprising a plurality of dummy wirings arranged between the plurality of main wirings on the insulating substrate and electrically insulated from the plurality of main wirings and the plurality of auxiliary wirings.
[15] The plurality of dummy wirings include dummy wirings adjacent to each other along the second direction,
The conductive member according to [14], wherein the dummy wirings adjacent to each other along the second direction are arranged on the same straight line along the second direction.
[16] The current-carrying member according to [15], wherein the plurality of dummy wirings are arranged at positions that halve the interval between the auxiliary wirings adjacent to each other along the first direction.
[17] The plurality of dummy wirings are arranged with gaps in a direction perpendicular to the first direction from the main wirings adjacent to the dummy wirings in the second direction,
The current-carrying member according to any one of [14] to [16], wherein the gap has a length of 0.5 μm or more and 10.0 μm or less in a direction perpendicular to the first direction.

The electrically conductive member of the present invention comprises an insulating substrate, a plurality of main wirings arranged on the insulating substrate and extending at intervals from one another in a first direction, and a plurality of auxiliary wirings arranged on the insulating substrate, each extending in a second direction intersecting the first direction and continuously intersecting two or more of the main wirings, each of which has a length along the second direction of 2.00 mm or less, and the spacing between adjacent auxiliary wirings along the first direction is 0.30 mm or more, thereby achieving both electromagnetic wave transparency and robustness against disconnections.

2 is a cross-sectional view schematically showing a part of a current-carrying member according to the first embodiment of the present invention. FIG. FIG. 2 is a plan view of the current-carrying member according to the first embodiment of the present invention. 2 is an enlarged schematic view showing a plurality of conductive wires of a current-carrying member according to the first embodiment of the present invention; FIG. FIG. 4 is an enlarged schematic view showing a plurality of conductive wires of a current-carrying member according to a first modified example of the first embodiment of the present invention. FIG. 10 is an enlarged schematic view showing a plurality of conductive wires of a current-carrying member according to a second modified example of the first embodiment of the present invention. FIG. 10 is an enlarged schematic view showing a plurality of conductive wires of a current-carrying member according to a third modified example of the first embodiment of the present invention. 10 is an enlarged schematic view showing a plurality of conductive wires of a current-carrying member according to a second embodiment of the present invention; FIG. FIG. 10 is an enlarged schematic view showing main wiring and dummy wiring according to a second embodiment of the present invention. FIG. 10 is an enlarged schematic view showing a conductive wire of a current-carrying member according to a comparative example. FIG. 10 is an enlarged schematic view showing a conductive wire of a current-carrying member according to another comparative example.

Hereinafter, the current-carrying member of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
It should be noted that the drawings described below are illustrative for explaining the present invention, and the present invention is not limited to the drawings shown below.
In the following, the term "to" indicating a range of values includes the values written on both sides. For example, if ε is between α and β, the range of ε includes α and β, and expressed in mathematical notation, α≦ε≦β.
Unless otherwise specified, angles such as "parallel" and "perpendicular" include a generally acceptable error range in the relevant technical field.
Furthermore, the term "same" includes a margin of error generally accepted in the relevant technical field.

Additionally, "(meth)acrylate" refers to either or both of acrylate and methacrylate, "(meth)acrylic" refers to either or both of acrylic and methacrylic, and "(meth)acryloyl" refers to either or both of acryloyl and methacryloyl.
Unless otherwise specified, "transparent to visible light" means that the visible light transmittance is 40% or more, preferably 80.0% or more, and more preferably 90.0% or more in the visible light wavelength range of 380 nm to 800 nm. Furthermore, in the following description, "transparent" means transparent to visible light, unless otherwise specified.
The visible light transmittance is measured using "Plastics - Determination of total light transmittance and total light reflectance" as defined in JIS (Japanese Industrial Standards) K 7375:2008.

First Embodiment
1 shows a current-carrying member 11 according to an embodiment of the present invention. The current-carrying member 11 includes a transparent insulating substrate 12, a plurality of conductive wires 13 formed on one surface of the insulating substrate 12, and a transparent cover 15 attached to the other surface of the insulating substrate 12 via a transparent adhesive layer 14. The current-carrying member 11 is transparent and has a visible light transmittance of, for example, 75.0% or more.

The current-carrying member 11 has an inner surface S1 located on the side of the multiple conductive wiring 13, and an outer surface S2 located on the side of the transparent cover 15, which is opposite the inner surface S1. As will be described later, the current-carrying member 11 has the property of transmitting so-called polarized waves, in which the electric field oscillates along a certain direction. For example, sensors and communication devices that use polarized waves can be placed facing the inner surface S1 when in use.

As shown in Figure 2, the current-carrying member 11 has a pair of electrode pads 16 connected to both ends of the plurality of conductive wirings 13 in order to apply a voltage to the plurality of conductive wirings 13. By applying a voltage between the pair of electrode pads 16, for example, a current flows from one electrode pad 16 to the other electrode pad 16, causing the plurality of conductive wirings 13 to generate heat and function as a heater.

The sheet resistance of the current-carrying member 11 due to the multiple conductive wirings 13 is preferably 0.1 Ω/□ or more and 10.0 Ω/□ or less, and more preferably 0.3 Ω/□ or more and 3.0 Ω/□ or less. Because the current-carrying member 11 has a low sheet resistance of 10.0 Ω/□ or less, it has high heating performance with a large amount of heat generated under voltage-limited conditions, and also has high electromagnetic wave transmittance. Furthermore, because the current-carrying member 11 has a resistance value of 0.10 Ω/□ or more, it has high heating performance with a large amount of heat generated even under current-limited conditions.

The multiple conductive wirings 13 include multiple main wirings M1 extending along a first direction D1 in which pairs of electrode pads 16 are arranged, and auxiliary wirings A1 extending along a second direction D2 intersecting the first direction D1 and continuously intersecting two or more main wirings M1.

As shown in Figure 3, the multiple main wirings M1 are arranged at intervals Q1 from each other in a direction perpendicular to the first direction D1. In this way, the multiple main wirings M1 extend along the first direction D1 and are arranged in the second direction D2, so that they transmit polarized waves whose electric fields oscillate in a direction perpendicular to the first direction D1, while easily blocking polarized waves whose electric fields oscillate in the first direction D1.

The auxiliary wirings A1 are arranged at intervals P1 in the first direction D1, and are arranged at intervals T1 in the second direction D2, with gaps T1 having a length corresponding to the intervals Q1. The intervals P1 between the auxiliary wirings A1 in the first direction D1 are designed to be 0.30 mm or greater.
The auxiliary wirings A1 continuously intersect with the four main wirings M1 in the second direction D2 and have a length L1 equal to the distance between two of the four main wirings M1 located at both ends in the second direction D2. This length L1 is designed to be 2.00 mm or less.

Furthermore, among the multiple auxiliary wirings A1, auxiliary wirings A1 adjacent to each other in the second direction D2 are arranged on the same straight line extending along the second direction D2.

Furthermore, adjacent auxiliary wirings A1 spaced apart by a distance P1 in the first direction D1 are arranged offset from each other in the second direction D2 so that a gap T1 separating adjacent auxiliary wirings A1 in the second direction D2 and having a length corresponding to the distance Q1 is located in the center in the second direction D2 of the auxiliary wirings A1 arranged on both sides of the first direction D1.

Furthermore, the multiple main wirings M1 and the multiple auxiliary wirings A1 have a sufficiently narrow line width so that the current-carrying member 11 is transparent. Specifically, the line width of the multiple main wirings M1 and the multiple auxiliary wirings A1 is preferably 1000.00 μm or less, more preferably 500.00 μm or less, and even more preferably 300.00 μm or less. Furthermore, so that the current-carrying member 11 can function sufficiently as a heater, the multiple main wirings M1 and the multiple auxiliary wirings A1 have a line width equal to or greater than a certain level. Specifically, the lower limit of the line width of the multiple main wirings M1 and the multiple auxiliary wirings A1 is preferably 1.00 μm or more, and more preferably 3.00 μm or more.

Furthermore, from the viewpoint of conductivity, the thickness of the multiple main wirings M1 and the multiple auxiliary wirings A1 can be set to 0.01 μm or more and 200.00 μm or less, with the upper limit preferably being 30.00 μm or less, more preferably 20.00 μm or less, even more preferably 9.00 μm or less, and particularly preferably 5.00 μm or less. The lower limit of the thickness of the multiple main wirings M1 and the multiple auxiliary wirings A1 is preferably 0.01 μm or more, more preferably 0.10 μm or more, and even more preferably 0.5 μm or more.

In general, heaters that generate heat by passing electricity through the wiring can cause the heated wiring to break due to so-called overcurrents occurring in the wiring or due to mechanical loads such as friction being applied to the wiring.

In the current-carrying member 11 according to embodiment 1, even if one of the multiple main wirings M1 is broken, the current flowing through the main wiring M1 can flow to the other main wirings M1 through the auxiliary wiring A1, thereby fully maintaining heater performance. In other words, the current-carrying member 11 has high robustness against breakage.

Furthermore, it is known that electromagnetic waves are generally more likely to be shielded when wiring extends in two different directions, such as in a so-called mesh shape.
However, the inventors discovered that by designing the length L1 of the multiple auxiliary wirings A1 along the second direction D2 to be 2.00 mm or less and the spacing P1 between the multiple auxiliary wirings A1 in the first direction D1 to be 0.30 mm or more, the conductive member 11 can block polarized waves whose electric field oscillates in the first direction D1 in which the multiple main wirings M1 extend, while transmitting polarized waves whose electric field oscillates in a direction perpendicular to the first direction D1.

As such, the conductive member 11 of embodiment 1 of the present invention comprises a plurality of main wirings M1 extending in the first direction D1 and a plurality of auxiliary wirings A1 extending in the second direction D2 and continuously intersecting the four main wirings M1, each of which has a length L1 of 2.00 mm or less along the second direction D2, and the spacing P1 between adjacent auxiliary wirings A1 along the first direction D1 is 0.30 mm or more, thereby achieving both electromagnetic wave transparency and robustness against breakage of the plurality of main wirings M1.

While it has been described that the spacing P1 between adjacent auxiliary wirings A1 along the first direction D1 is 0.30 mm or greater, the inventors have found that while a wider spacing P1 improves electromagnetic wave transparency, a narrower spacing P1 improves robustness against disconnection. Therefore, from the perspective of achieving both electromagnetic wave transparency and robustness against disconnection, the inventors have found that the spacing P1 is preferably 0.30 mm or greater but 2.00 mm or less, more preferably 0.30 mm or greater but 1.00 mm or less, and even more preferably 0.60 mm or greater but 0.90 mm or less. When the spacing P1 is designed within these ranges, both electromagnetic wave transparency and robustness against disconnection can be achieved. However, designing the spacing P1 within a more preferred range improves both electromagnetic wave transparency and robustness against disconnection.

Although it has been described that the main wiring M1 extending along the first direction D1 and the auxiliary wiring A1 extending along the second direction D2 intersect with each other, the main wiring M1 and the auxiliary wiring A1 may or may not be perpendicular to each other. The intersection angle between the main wiring M1 and the auxiliary wiring A1 is preferably between 60 degrees and 90 degrees so that polarized waves whose electric field oscillates in a direction perpendicular to the first direction D1 in which the main wiring M1 extends can pass through the current-carrying member 11. Here, the intersection angle between the main wiring M1 and the auxiliary wiring A1 refers to an angle between 0 degrees and 90 degrees formed by the intersection of the main wiring M1 and the auxiliary wiring A1.

In addition, although an example has been described in which the multiple auxiliary wirings A1 all have a constant length L1 along the second direction D2, they do not have to have a constant length in the second direction D2 as long as it is 2.00 mm or less. For example, the current-carrying member 11 may include multiple auxiliary wirings having multiple lengths of 2.00 mm or less along the second direction D2.

Furthermore, the auxiliary wirings A1 adjacent to each other in the second direction D2 are arranged at a distance Q1 in a direction perpendicular to the first direction D1, but as long as the auxiliary wirings A1 are arranged at a distance from each other and are electrically insulated, the distance between the auxiliary wirings A1 adjacent to each other in the second direction D2 is not particularly limited.

Furthermore, while adjacent auxiliary wirings A1 in the first direction D1 are shown intersecting the same main wiring M1 and different main wirings M1, they may intersect only the same main wiring M1 or different main wirings M1. However, intersecting both the same main wiring M1 and different main wirings M1 is preferable to intersecting adjacent auxiliary wirings A1 in the first direction D1 with both the same main wiring M1 and different main wirings M1, as this increases the number of current paths in the multiple main wirings M1 and the multiple auxiliary wirings A1 when current is passed between a pair of electrode pads 16, thereby increasing robustness against disconnections of the multiple main wirings M1 and the multiple auxiliary wirings A1.

It has been described that the multiple auxiliary wirings A1 include auxiliary wirings A1 adjacent to each other along the second direction D2 and that these auxiliary wirings A1 are arranged on the same straight line. However, as long as the spacing P1 between adjacent auxiliary wirings A1 in the first direction D1 is 0.30 mm or more, the auxiliary wirings A1 arranged across a gap T1 in the second direction D2 do not have to be arranged on the same straight line in the second direction D2. However, by arranging the auxiliary wirings A1 arranged across a gap T1 in the second direction D2 on the same straight line in the second direction D2, the presence of the multiple auxiliary wirings A1 becomes less noticeable to an observer of the current-carrying member 11. Therefore, from the perspective of making the presence of the multiple auxiliary wirings A1 less noticeable, it is preferable that the auxiliary wirings A1 arranged across a gap T1 in the second direction D2 be arranged on the same straight line in the second direction D2.

Furthermore, while the conductive member 11 is described as having multiple auxiliary wirings A1, if it has at least two auxiliary wirings A1 that have a length L1 of 2.00 mm or less along the second direction D2 and are adjacent to each other at a spacing P1 of 0.30 mm or more along the first direction D1, it is possible to achieve both electromagnetic wave transparency and robustness against breakage of the multiple main wirings M1.

In addition, while Figure 2 shows that the current-carrying member 11 has a shape that follows a plane, it can also have a shape that follows a curved surface. For example, by forming multiple conductive wires 13 on an insulating substrate 12 that has a curved surface, the current-carrying member 11 can be formed to have a shape that follows the curved shape of the insulating substrate 12. Examples of such curved shapes include shapes that follow the surface of any three-dimensional shape, such as a sphere, cylinder, or cone.

The conductive member 11 can also have a shape that follows the surface of a more complex three-dimensional object. Examples of complex three-dimensional objects include automobile emblems, radar radomes, radar front covers, automobile headlamp covers, antennas, reflectors, etc. By arranging the conductive member 11 of an embodiment of the present invention along the shape of such a three-dimensional object, it is possible, for example, to arrange the conductive member 11 along the automobile emblem and install a radar inside the emblem.

The current-carrying member 11 can be placed near a transceiver (not shown), such as a sensor or radar that uses electromagnetic waves. In particular, when the transceiver uses polarized waves, the current-carrying member 11 is placed so that the direction in which the electric field oscillates in the polarized waves and the first direction D1 in which the multiple main wirings M1 extend are mutually perpendicular, so that the polarized waves can pass through the current-carrying member 11. Various examples of transceivers are available, including, for example, a so-called 4D (4-dimensional) imaging radar.

In this case, the spacing P1 between the multiple auxiliary wirings A1 is preferably at least one-quarter but less than one-half the wavelength of the electromagnetic waves transmitted and received by the transceiver in the transparent cover 15 and insulating substrate 12, and is preferably at least 0.30 mm. When the spacing P1 is designed within this range, the current-carrying member 11 can sufficiently transmit the electromagnetic waves transmitted and received by the transceiver.

In addition, the current-carrying member 11 includes a transparent cover 15 bonded to the insulating substrate 12 via a transparent adhesive layer 14, but it may also be configured without the adhesive layer 14 and transparent cover 15, and only include the insulating substrate 12, multiple conductive wirings 13, and a pair of electrode pads 16. However, by including the transparent cover 15 on the current-carrying member 11, the mechanical strength of the current-carrying member 11 is improved and the insulating substrate 12 is protected, thereby preventing failure of the current-carrying member 11 due to mechanical loads.

Furthermore, Figure 3 shows that multiple auxiliary wirings A1 each continuously intersect with four main wirings M1, but as long as the auxiliary wirings A1 have a length of 2.00 mm or less, the number of main wirings M1 that the auxiliary wirings A1 continuously intersect with is not limited to four, and may be two, three, or five or more.

Figure 4 shows an example of a current-carrying member 11A in which an auxiliary wiring A2 continuously intersects two main wirings M2. In the current-carrying member 11A, each of the multiple auxiliary wirings A2 continuously intersects two main wirings M2. The multiple auxiliary wirings A2 have a length L2 equal to the distance between two adjacent main wirings M2 in the second direction D2. This length L2 is 2.00 mm or less.

The auxiliary wirings A2 are arranged at intervals P2 in the first direction D1, the intervals P2 being 0.30 mm or greater.
Adjacent main wirings M2 are arranged at intervals Q2 in a direction perpendicular to the first direction D1.
In addition, adjacent auxiliary wirings A2 spaced apart by a distance P2 in the first direction D1 are arranged offset from each other in the second direction D2 so that the auxiliary wirings A2 are located on both sides in the first direction D1 of a gap T2 that separates adjacent auxiliary wirings A2 in the second direction D2 and has a length corresponding to the distance Q2.

Figure 5 shows an example of a current-carrying member 11B in which an auxiliary wiring A3 continuously intersects six main wirings M3. In the current-carrying member 11B, each of the multiple auxiliary wirings A3 continuously intersects six main wirings M3. The multiple auxiliary wirings A3 have a length L3 equal to the distance along the second direction D2 between two main wirings M3 located at both ends in the second direction D2, out of the six main wirings M3 continuously arranged in the second direction D2. This length L3 is 2.00 mm or less.

The auxiliary wirings A3 are arranged at intervals P3 in the first direction D1, the intervals P3 being 0.30 mm or greater.
Adjacent main wirings M3 are arranged at an interval Q3 in a direction perpendicular to the first direction D1.

Furthermore, the auxiliary wirings A3 adjacent to each other in the first direction D1 and spaced apart by a distance P3 are arranged offset from each other in the second direction D2 so that a gap T3 separating adjacent auxiliary wirings A3 in the second direction D2 and having a length corresponding to the distance Q3 is located at the center in the second direction D2 of the auxiliary wirings A3 arranged on both sides of the first direction D1.

Figure 6 shows an example of a current-carrying member 11C in which an auxiliary wiring A4 continuously intersects twelve main wirings M4. In the current-carrying member 11C, each of the multiple auxiliary wirings A4 continuously intersects twelve main wirings M4. The multiple auxiliary wirings A4 have a length L4 equal to the distance along the second direction D2 between two main wirings M4 located at both ends in the second direction D2, out of the twelve main wirings M3 continuously arranged in the second direction D2. This length L4 is 2.00 mm or less.

The auxiliary wirings A4 are arranged at intervals P4 in the first direction D1, and the intervals P4 are equal to or greater than 0.30 mm.
Adjacent main wirings M4 are arranged at a distance Q4 from each other in a direction perpendicular to the first direction D1.

Furthermore, the auxiliary wirings A4 adjacent to each other in the first direction D1 and spaced apart by a distance P4 are arranged offset from each other in the second direction D2 so that a gap T4 separating adjacent auxiliary wirings A4 in the second direction D2 and having a length corresponding to the distance Q4 is located at the center in the second direction D2 of the auxiliary wirings A4 arranged on both sides of the first direction D1.

In this way, if the length L1 of the auxiliary wiring A1 is 2.00 mm or less, the spacing P3 of the auxiliary wiring A1 is 0.30 mm or more, and the auxiliary wiring A1 intersects two or more main wirings M1, it is possible to achieve both electromagnetic wave transparency and robustness against breakage of multiple main wirings M1.

Embodiment 2
In order to make the presence of the multiple auxiliary wirings A1 in the current-carrying member 11 less noticeable, the current-carrying member 11 may also have dummy wirings that are electrically insulated from the multiple main wirings M1 and the multiple auxiliary wirings A1.

As shown in Figure 7, the current-carrying member 11D of embodiment 2 has a plurality of main wirings M5 that are the same as the plurality of main wirings M1 in the current-carrying member 11 of embodiment 1 shown in Figure 3, and a plurality of auxiliary wirings A5 that are the same as the plurality of auxiliary wirings A1 in the current-carrying member 11 of embodiment 1. In addition, the current-carrying member 11D has a plurality of dummy wirings B1 arranged between adjacent main wirings M5 in the second direction D2.

The multiple dummy wirings B1 are arranged at a fixed distance N1 from each other, at the position of the gap T5 separating adjacent auxiliary wirings A5 in the second direction D2, and at a position that bisects the spacing P5 between the multiple auxiliary wirings A5 in the first direction D1. The dummy wirings B1 arranged on the gap T5 are arranged on the same line as the multiple auxiliary wirings A5 arranged on both sides in the second direction D2. Furthermore, the multiple dummy wirings B1 arranged at the position that bisects the spacing P5 between the multiple auxiliary wirings A5 in the first direction D1 are arranged on the same line along the second direction D2. In this way, the dummy wirings B1 adjacent to each other along the second direction D2 are arranged on the same line along the second direction D2.

In this way, the multiple dummy wirings B1 are arranged in the first direction D1 at the same positions as the multiple auxiliary wirings A5 and at positions that bisect the spacing P5 between the multiple auxiliary wirings A5, so that the multiple main wirings M5, the multiple auxiliary wirings A5, and the multiple dummy wirings B1 form a mesh pattern MP. By forming the mesh pattern MP in this way, the presence of the multiple main wirings M5, the multiple auxiliary wirings A5, and the multiple dummy wirings B1 is prevented from being too noticeable to an observer of the current-carrying member 11D.

As shown in Figure 8, the dummy wiring B1 is arranged across a gap G1 from the main wirings M5 arranged on both sides of it in a direction perpendicular to the first direction D1. Therefore, the dummy wiring B1 is insulated from the multiple main wirings M5. The inventors have also discovered that when this gap G1 has a length of 0.5 μm or more and 10.0 μm or less in the direction perpendicular to the first direction D1, the transmittance of polarized waves whose electric field oscillates in a direction perpendicular to the first direction D1 through the conductive member 11D is further improved.

From the above, according to the current-carrying member 11D of embodiment 2, in addition to being able to achieve both electromagnetic wave transparency and robustness against breakage of the multiple main wirings M5 and auxiliary wirings A5, similar to the current-carrying member 11 of embodiment 1, the presence of the multiple main wirings M5, multiple auxiliary wirings A5 and multiple dummy wirings B1 is prevented from being conspicuous to an observer of the current-carrying member 11D, and the electromagnetic wave transparency of the current-carrying member 11D can be improved.

The following describes in detail each component constituting the current-carrying member 11 of embodiment 1. The following description also applies to each component of current-carrying members 11A, 11B, and 11C of the modified example of embodiment 1, and each component of current-carrying member 11D of embodiment 2.

<Insulating substrate>
The insulating substrate 12 is not particularly limited as long as it has insulating properties and can support at least a plurality of conductive wirings 13 and a pair of electrode pads 16, but it is preferably transparent and made of a resin material.
Specific examples of resin materials constituting the insulating substrate 12 include polymethyl methacrylate (PMMA), acrylonitrile butadiene styrene (ABS), polyethylene terephthalate (PET), polycarbonate (PC), polycycloolefin, (meth)acrylic, polyethylene naphthalate (PEN), polyethylene (PE), polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC), polyvinylidene chloride (PVDC), polyvinylidene difluoride (PVDF), polyarylate (PAR), polyethersulfone (PES), polymeric acrylic, fluorene derivatives, and crystalline cycloolefin polymer (Cyclo Olefin Polymer). Polymer (COP), triacetylcellulose (TAC), etc.

From the viewpoint of the transparency and durability of the insulating substrate 12, it is preferable that the insulating substrate 12 be composed primarily of one of polymethyl methacrylate resin, polycarbonate resin, acrylonitrile butadiene styrene resin, and polyethylene terephthalate resin. Here, the term "main component of the insulating substrate 12" refers to a component that accounts for 80% or more of the constituent components of the insulating substrate 12.

The visible light transmittance of the insulating substrate 12 is preferably 85.0% to 100.0%.
The thickness of the insulating substrate 12 is not particularly limited, but from the viewpoint of ease of handling, it is preferably 0.05 mm or more and 2.00 mm or less, and more preferably 0.10 mm or more and 1.00 mm or less.

<Conductive wiring>
The conductive wiring 13 is made of a material having conductivity. Metals, metal oxides, carbon materials, conductive polymers, etc. can be used as the conductive wiring 13. For example, when the conductive wiring 13 is made of a metal, the type of metal is not particularly limited, and examples include copper, silver, aluminum, chromium, lead, nickel, gold, tin, and zinc, but copper, silver, aluminum, and gold are more preferred from the viewpoint of conductivity.

Methods for forming metallic conductive wiring include semi-additive, full-additive, subtractive, silver halide, printing with metal-containing ink or its precursor, inkjet printing, and laser direct structuring. These methods can also be used in combination. Bulk metal materials can also be used, and nanowires and nanoparticles can also be used. When the conductive wiring 13 is made of a carbon material, its structure and composition are not particularly limited. Materials such as carbon nanotubes, fullerenes, carbon nanobuds, graphene, and graphite can be used. When the conductive wiring 13 is made of a metal oxide, ITO (Indium Tin Oxide) can be used. When the conductive wiring 13 is made of a conductive polymer, PEDOT (Poly(3,4-ethylenedioxythiophene)) can be used.

<Adhesive layer>
An optically clear adhesive sheet (OCA) or an optically clear adhesive resin (OCR) can be used as the adhesive layer 14 that bonds the insulating substrate 12 and the transparent cover 15 to each other. The preferred thickness of the adhesive layer 14 is 10 μm or more and 200 μm or less. For example, the 8146 series manufactured by 3M can be used as the optically clear adhesive sheet.

<Transparent cover>
The transparent cover 15 is not particularly limited as long as it has insulating properties, but it is preferably transparent and made of a resin material.
Specific examples of resin materials constituting the transparent cover 15 include, similarly to the insulating substrate 12, polymethyl methacrylate, acrylonitrile butadiene styrene, polyethylene terephthalate, polycarbonate, polycycloolefin, (meth)acrylic, polyethylene naphthalate, polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyvinylidene fluoride, polyarylate, polyethersulfone, polymeric acrylic, fluorene derivatives, crystalline cycloolefin polymer, triacetyl cellulose, etc.
The thickness of the transparent cover 15 is preferably 0.2 mm to 20.0 mm.

The present invention will be described in more detail below with reference to examples. The materials, amounts used, ratios, treatment details, treatment procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention, and the scope of the present invention should not be construed as being limited by the following examples.
Example 1
(Preparation of insulating substrate)
A polycarbonate resin film (Teijin Panlite PC-2151) having a thickness of 250.0 μm was prepared as an insulating substrate.

(Preparation of primer layer-forming composition)
The following components were mixed to obtain a composition for forming a primer layer.
Z913-3 (manufactured by Aica Kogyo Co., Ltd.) 33 parts by weight IPA (isopropyl alcohol) 67 parts by weight

(Formation of primer layer)
The obtained primer layer-forming composition was bar-coated onto an insulating substrate so that the average dry film thickness was 0.4 μm, and then dried for 3 minutes at 80° C. Thereafter, the formed layer of the primer layer-forming composition was irradiated with ultraviolet (UV) rays at an irradiation dose of 1000 mJ to form a primer layer having a thickness of 0.4 μm.

On the insulating substrate on which the primer layer has been formed in this manner, a copper plating method is used, which includes the steps of preparing a composition for forming a plated layer precursor layer, preparing a substrate with a plated layer precursor layer, preparing a substrate with a plated layer, and forming a patterned conductive film, as shown in Figures 2 and 3.

(Preparation of composition for forming a plated layer precursor layer)
The following components were mixed to obtain a composition for forming a plateable layer precursor layer.
IPA (isopropyl alcohol) 38.00 parts by mass Polybutadiene maleic acid 4.00 parts by mass FAM-401 (manufactured by Fujifilm Corporation) 1.00 parts by mass IRGACURE OXE02 (manufactured by BASF, ClogP = 6.55)
0.05 parts by mass

(Preparation of substrate with plating layer precursor layer)
The obtained composition for forming a plateable layer precursor layer was bar-coated onto the primer layer to a film thickness of 0.2 μm, and dried for 1 minute in an atmosphere at 120° C. Immediately thereafter, a polypropylene film having a thickness of 12.0 μm was laminated onto the composition for forming a plateable layer precursor layer, thereby producing a substrate with a plateable layer precursor layer.

(Preparation of substrate with plating layer)
A quartz glass photomask was prepared, having a width of 110.804 mm in the first direction D1, a width of 100.804 mm in the second direction D2, and a thickness of 6.00 mm, and on which an exposure pattern corresponding to the plurality of conductive wirings 13 and the pair of electrode pads 16 shown in Figures 2 and 3 was formed. As shown in Figure 3, this photomask included exposure patterns corresponding to a plurality of main wirings M1 extending in the first direction D1 at intervals Q1 from one another, and a plurality of auxiliary wirings A1 extending in the second direction D2 and continuously intersecting the four main wirings M1.

The line width of the exposure patterns corresponding to the multiple main wirings M1 and the multiple auxiliary wirings A1 was 4 μm, and the spacing between the exposure patterns corresponding to adjacent main wirings M1 in the second direction D2 was 0.16 mm. The length in the second direction D2 of the exposure patterns corresponding to the auxiliary wiring A1 was 0.48 mm, and the spacing between the exposure patterns corresponding to adjacent auxiliary wirings A1 in the first direction D1 was 0.90 mm.

The substrate with the plated layer precursor layer was irradiated with ultraviolet light (energy amount 200 mJ/cm ² , wavelength 365 μm) through a photomask. Next, the substrate with the plated layer precursor layer after ultraviolet light irradiation was developed with a pure water shower for 5 minutes to produce a substrate with a plated layer.

(Formation of patterned conductive film)
The plated layer-bearing substrate was immersed in a 1% by mass aqueous sodium bicarbonate solution at 35°C for 5 minutes. Next, the plated layer-bearing substrate was immersed in a palladium catalyst imparting solution RONAMERSE SMT (manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at 55°C for 5 minutes. After rinsing the plated layer-bearing substrate with water, it was subsequently immersed in CIRCUPOSIT 6540 (manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at 35°C for 5 minutes, and then rinsed again with water. The plated layer-bearing substrate was further immersed in CIRCUPOSIT 4500 (manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at 45°C for 20 minutes, followed by rinsing with water, to form a patterned conductive film on the plated layer, having a pattern corresponding to the exposure pattern of the photomask used in the process of preparing the plated layer-bearing substrate. As a result, a current-carrying member of Example 1 having a plurality of main wirings M1, a plurality of auxiliary wirings A1, and a pair of electrode pads 16 on the insulating substrate was obtained as shown in FIGS.

(Installing the transparent cover)
1, a transparent adhesive sheet (OCA; 8146-2 manufactured by 3M) was attached as an adhesive layer 14 to the back surface of the insulating substrate 12 on which the plurality of conductive wirings 13 was formed, and a polycarbonate plate having a thickness of 2 mm was further attached to the adhesive sheet as a transparent cover 15. The electrically conductive member to which the transparent cover 15 was attached in this manner was used for evaluation.

Here, in the conductive member of Example 1, the spacing Q1 between adjacent main wirings M1 in a direction perpendicular to the first direction D1 was 0.16 mm, the length L1 of the auxiliary wiring A1 in the second direction D2 was 0.48 mm, and the spacing P1 between adjacent auxiliary wirings A1 along the first direction D1 was 0.90 mm.

Example 2
The conductive member of Example 2 was produced in the same manner as Example 1, except that a photomask on which an exposure pattern corresponding to the plurality of main wirings M3 and the plurality of auxiliary wirings A3 shown in Figure 5 was formed was used as the photomask used in the process of producing the substrate with the plated layer of Example 1.

In the photomask used in Example 2, the line width of the exposure patterns corresponding to the multiple main wirings M3 and the multiple auxiliary wirings A3 was 4 μm, and the spacing between the exposure patterns corresponding to adjacent main wirings M3 was 0.16 mm. Furthermore, the length in the second direction D2 of the exposure pattern corresponding to the auxiliary wiring A3 was 0.80 mm, and the spacing between the exposure patterns corresponding to adjacent auxiliary wirings A3 in the first direction D1 was 0.80 mm.

Furthermore, in the conductive member of Example 2, the spacing Q3 between adjacent main wirings M3 in a direction perpendicular to the first direction D1 was 0.16 mm, the length L3 of the auxiliary wiring A3 in the second direction D2 was 0.80 mm, and the spacing P3 between adjacent auxiliary wirings A3 along the first direction D1 was 0.80 mm.

Example 3
The conductive member of Example 3 was produced in the same manner as Example 1, except that a photomask on which an exposure pattern corresponding to the plurality of main wirings M2 and the plurality of auxiliary wirings A2 shown in Figure 4 was formed was used as the photomask used in the process of producing the substrate with the plated layer of Example 1.

In the photomask used in Example 3, the line width of the exposure patterns corresponding to the multiple main wirings M2 and the multiple auxiliary wirings A2 was 4 μm, and the spacing between the exposure patterns corresponding to adjacent main wirings M2 was 0.16 mm. Furthermore, the length in the second direction D2 of the exposure patterns corresponding to the auxiliary wirings A2 was 0.16 mm, and the spacing between the exposure patterns corresponding to adjacent auxiliary wirings A2 in the first direction D1 was 1.00 mm.

Furthermore, in the conductive member of Example 3, the spacing Q2 between adjacent main wirings M2 in a direction perpendicular to the first direction D1 was 0.16 mm, the length L2 of the auxiliary wiring A2 in the second direction D2 was 0.16 mm, and the spacing P2 between adjacent auxiliary wirings A2 along the first direction D1 was 1.00 mm.

Example 4
The conductive member of Example 4 was produced in the same manner as Example 1, except that a photomask on which an exposure pattern corresponding to the plurality of main wirings M4 and the plurality of auxiliary wirings A4 shown in Figure 6 was formed was used as the photomask used in the process of producing the substrate with the plated layer of Example 1.

In the photomask used in Example 4, the line width of the exposure patterns corresponding to the multiple main wirings M4 and the multiple auxiliary wirings A4 was 4 μm, and the spacing between the exposure patterns corresponding to adjacent main wirings M4 was 0.16 mm. Furthermore, the length in the second direction D2 of the exposure pattern corresponding to the auxiliary wiring A4 was 1.76 mm, and the spacing between the exposure patterns corresponding to adjacent auxiliary wirings A4 in the first direction D1 was 0.80 mm.

Furthermore, in the conductive member of Example 4, the spacing Q4 between adjacent main wirings M4 in a direction perpendicular to the first direction D1 was 0.16 mm, the length L4 of the auxiliary wiring A4 in the second direction D2 was 1.76 mm, and the spacing P2 between adjacent auxiliary wirings A4 along the first direction D1 was 0.80 mm.

Example 5
The current-carrying member of Example 5 was produced in the same manner as in Example 1, except that the spacing between exposure patterns corresponding to adjacent auxiliary wirings A4 along the first direction D1 was set to 0.40 mm in the photomask used in the process of producing the plateable layer-provided substrate of Example 1. In the current-carrying member of Example 5, the spacing P1 between adjacent auxiliary wirings A1 along the first direction D1 was 0.40 mm.

Example 6
The current-carrying member of Example 6 was produced in the same manner as in Example 1, except that the spacing between exposure patterns corresponding to adjacent auxiliary wirings A1 along the first direction D1 was set to 1.60 mm in the photomask used in the process of producing the plateable layer-provided substrate of Example 1. In the current-carrying member of Example 6, the spacing P1 between adjacent auxiliary wirings A1 along the first direction D1 was 1.60 mm.

Example 7
The conductive member of Example 7 was produced in the same manner as Example 1, except that a photomask on which an exposure pattern corresponding to the plurality of main wirings M5, the plurality of auxiliary wirings A5, and the plurality of dummy wirings B1 shown in Figure 7 was formed was used as the photomask used in the process of producing the substrate with the plated layer of Example 1.

In the photomask used in Example 7, the line width of the exposure patterns corresponding to the multiple main wirings M5 and the multiple auxiliary wirings A5 was 4 μm, and the spacing between the exposure patterns corresponding to adjacent main wirings M5 was 0.16 mm. Furthermore, the length in the second direction D2 of the exposure pattern corresponding to the auxiliary wiring A5 was 0.48 mm, and the spacing between the exposure patterns corresponding to adjacent auxiliary wirings A4 in the first direction D1 was 0.90 mm.

In the current-carrying member of Example 7, the distance Q5 between adjacent main wirings M5 in the direction perpendicular to the first direction D1 was 0.16 mm, the length L5 of the auxiliary wiring A5 in the second direction D2 was 0.48 mm, and the distance P5 between adjacent auxiliary wirings A4 along the first direction D1 was 0.90 mm. The length of the gap G1 between the dummy wiring B1 and the main wiring M5 in the direction perpendicular to the first direction D1 was 5.0 μm.

Example 8
The conductive member of Example 8 was produced in the same manner as Example 7, except that in the photomask used in the process of producing the substrate with the plated layer of Example 7, the length of the gap between the exposure pattern corresponding to the main wiring M5 and the exposure pattern corresponding to the dummy wiring B1 was changed.

In the conductive member of Example 8, the length of the gap G1 between the dummy wiring B1 and the main wiring M5 in a direction perpendicular to the first direction D1 was 20.0 μm.

Example 9
The current-carrying member of Example 9 was produced in the same manner as in Example 1, except that the substrate with the plated layer was subjected to the following three-dimensional forming process.
(3D molding)
The substrate with the plateable layer was placed in a molding jig having a plurality of through holes for evacuation, and the substrate with the plateable layer was heated until the temperature of the substrate with the plateable layer reached approximately 160° C. Furthermore, when the temperature of the substrate with the plateable layer reached approximately 160° C., the molding jig was evacuated, whereby the substrate with the plateable layer was brought into close contact with the molding jig, and the substrate with the plateable layer was three-dimensionally molded into a semi-cylindrical shape.

Example 10
An electric-conductive member was produced in the same manner as in Example 9, except that the substrate with the plated layer was three-dimensionally formed into a hemispherical shape.

Example 11
The conductive member of Example 11 was prepared in the same manner as Example 1, except that instead of the copper plating method, a silver nanowire method was used on a substrate with a plated layer precursor layer, which consists of the steps of preparing a silver nanowire dispersion, preparing an adhesive solution, preparing a non-patterned silver nanowire conductive substrate, and preparing a patterned silver nanowire conductive substrate, as shown below, to form multiple conductive wirings 13 and a pair of electrode pads 16.

(Preparation of Silver Nanowire Dispersion)
The following additive solutions A, B, C and D were prepared in advance.
<Additional liquid A>
60 mg of stearyltrimethylammonium chloride, 6.0 g of a 10% aqueous solution of stearyltrimethylammonium hydroxide, and 2.0 g of glucose were dissolved in 120.0 g of distilled water to prepare reaction solution A-1. Separately, 72 mg of silver nitrate powder was dissolved in 2.0 g of distilled water to prepare aqueous silver nitrate solution A-2.
Furthermore, while the reaction solution A-1 was kept at 25°C and vigorously stirred, the aqueous silver nitrate solution A-2 was added to the reaction solution A-1. After the addition of the aqueous silver nitrate solution A-2, the reaction solution A-1 was vigorously stirred for 180 minutes to obtain an added solution A.

<Additional liquid B>
Additive solution B was obtained by dissolving 42.0 g of silver nitrate powder in 958 g of distilled water.
<Additional liquid C>
Additive solution C was obtained by mixing 75 g of 25% aqueous ammonia with 925 g of distilled water.
<Additional liquid D>
Additive solution D was obtained by dissolving 400 g of polyvinylpyrrolidone (K30) in 1.6 kg of distilled water.

Next, a silver nanowire dispersion was prepared as follows.
First, 1.30 g of stearyltrimethylammonium bromide powder, 33.1 g of sodium bromide powder, 1.000 g of glucose powder, and 115.0 g of nitric acid (1N) were dissolved in 12.7 kg of distilled water at 80 ° C. This solution was maintained at 80 ° C. and stirred at 500 rpm. Additive solution A was added at a rate of 250 cc/min, additive solution B at 500 cc/min, and additive solution C at 500 cc/min. The solution containing additive solution A, additive solution B, and additive solution C was heated and stirred for 100 minutes at a stirring speed of 200 rpm while maintaining the liquid temperature at 80 ° C. The solution was then cooled to 25 ° C. The stirring speed was changed to 500 rpm, and additive solution D was added to this solution at 500 cc/min. The solution to which additive solution D had been added in this manner was designated as feed solution E1.

Next, while vigorously stirring the 1-propanol, Charge Liquid E1 was added all at once so that the volume ratio of 1-propanol to Charge Liquid E1 was 1:1. The resulting mixture of 1-propanol and Charge Liquid E1 was stirred for 3 minutes to obtain Charge Liquid E2.

Furthermore, ultrafiltration of feed liquid E2 was carried out using an ultrafiltration module with a molecular weight cutoff of 150,000 as follows. After concentrating the resulting feed liquid E2 four-fold, the four-fold concentrated feed liquid E2 was added with a mixed solution of distilled water and 1-propanol (volume ratio 1:1) and concentrated repeatedly until the conductivity of the filtrate finally reached 50 μS/cm or less, yielding a silver nanowire dispersion with a metal content of 0.45%.

(Preparation of adhesive solution)
An adhesive solution was prepared according to the following formulation:
<Adhesive solution>
Tetraethoxysilane (KBE-04, manufactured by Shin-Etsu Chemical Co., Ltd.)
5.0 parts by mass 3-glycidoxypropyltrimethoxysilane (KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.)
3.2 parts by mass 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane (KBM-303, manufactured by Shin-Etsu Chemical Co., Ltd.)
1.8 parts by mass: acetic acid aqueous solution (acetic acid concentration = 0.05%, pH = 5.2) 10.0 parts by mass: curing agent (boric acid, manufactured by Wako Pure Chemical Industries, Ltd.) 0.8 parts by mass: colloidal silica (Snowtex O, average particle size 10 nm to 20 nm, solid content concentration 20%, pH = 2.6, manufactured by Nissan Chemical Industries, Ltd.)
60.0 parts by mass of surfactant (Narrow Acty HN-100, manufactured by Sanyo Chemical Industries, Ltd.)
0.2 parts by mass

The adhesive solution was prepared in the following manner.
First, while vigorously stirring an aqueous acetic acid solution, 3-glycidoxypropyltrimethoxysilane was added dropwise over a period of 3 minutes to obtain aqueous solution 1. Next, while vigorously stirring aqueous solution 1, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane was added over a period of 3 minutes to obtain aqueous solution 2. Next, while vigorously stirring aqueous solution 2, tetraethoxysilane was added over a period of 5 minutes, and stirring was continued for two hours thereafter to obtain aqueous solution 3. Next, colloidal silica, a curing agent, and a surfactant were added successively to aqueous solution 3 to prepare a bonding solution.

Fabrication of Unpatterned Silver Nanowire Conductive Substrates
The surface of a polycarbonate substrate (polycarbonate resin film (Teijin Panlite PC-2151) 250 μm thick) was subjected to a corona discharge treatment, and then a 0.02% aqueous solution of N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane was applied using a bar coating method to a coating amount of 8.8 mg/ ^m2 , followed by drying at 100°C for 1 minute to obtain a surface-treated polycarbonate substrate.

Furthermore, after subjecting the surface of the surface-treated polycarbonate substrate to a corona discharge treatment, the above adhesive solution was applied to the surface using the bar coating method, and the surface was dried by heating at 170°C for 1 minute to form an adhesive layer with a thickness of 0.5 μm, thereby obtaining a polycarbonate substrate with an adhesive layer.

A solution of an alkoxide compound with the following composition was stirred at 60°C for 1 hour, and after confirming that it was homogeneous, a sol-gel solution was obtained. 2.24 parts by mass of the resulting sol-gel solution was mixed with 17.76 parts by mass of the silver nanowire dispersion obtained in the silver nanowire dispersion preparation process, and then diluted with distilled water and 1-propanol to obtain a liquid composition (sol-gel coating liquid). The solvent ratio of the resulting liquid composition was distilled water:1-propanol = 60:40.

<Solution of Alkoxide Compound>
Tetraethoxysilane (KBE-04, manufactured by Shin-Etsu Chemical Co., Ltd.)
5.0 parts by weight 1% aqueous acetic acid solution 11.0 parts by weight Distilled water 4.0 parts by weight

The surface of the adhesive layer of the polycarbonate substrate with the adhesive layer was subjected to corona discharge treatment, and the liquid composition (sol-gel coating solution) was applied to the surface using a bar coating method so that the silver amount was 0.015 g/ ^m2 and the total solid coating amount was 0.120 g/ ^m2.Then , the substrate was heated at 100°C for 1 minute to cause a sol-gel reaction, thereby forming a conductive layer.In this way, an unpatterned silver nanowire conductive substrate was obtained.The mass ratio of tetraethoxysilane (alkoxide compound) to silver nanowires in the conductive layer was 7:1.

Fabrication of Patterned Silver Nanowire Conductive Substrates
A patterning treatment was carried out by applying a dissolving solution (etching solution) in a pattern to the non-patterned silver nanowire conductive substrate obtained above using a screen printing method.

Screen printing was performed using a Mino Group Co., Ltd. WHT-3 model and a No. 4 Yellow squeegee. The silver nanowire etching solution for forming the pattern was prepared by mixing CP-48S-A liquid, CP-48S-B liquid (both manufactured by Fujifilm Corporation) and pure water in a 1:1:1 ratio and thickening with hydroxyethyl cellulose. This was used as the screen printing ink. The pattern used for screen printing was the same as the exposure pattern of the photomask used in Example 1. The etching solution was applied to a non-patterned silver nanowire conductive substrate at a coating weight of 0.01 g/ ^cm² , left at 25°C for 2 minutes, and then washed with pure water to perform the patterning process.

By performing the above patterning process, an electrically conductive member of Example 11 was obtained, in which a patterned conductive film having multiple main wirings M1, multiple auxiliary wirings A1, and a pair of electrode pads 16 as shown in Figures 2 and 3 was formed on an insulating substrate.

Example 12
The conductive member of Example 12 was prepared in the same manner as in Example 1, except that instead of the copper plating method, a silver salt method was used to form a plurality of conductive wirings 13 and a pair of electrode pads 16 on a substrate with a plated layer precursor layer, which method includes the steps of preparing a silver halide emulsion, preparing a composition for forming a photosensitive layer, forming a photosensitive layer, exposure treatment and development treatment, heating treatment, gelatin decomposition treatment, and polymer crosslinking treatment, as shown below.

(Preparation of Silver Halide Emulsion)
To Solution 1 below, maintained at 38°C and pH 4.5, were added 90% of each of Solutions 2 and 3 below simultaneously over 20 minutes with stirring to form 0.16 µm core grains. Solutions 4 and 5 below were then added over 8 minutes, followed by the addition of the remaining 10% of Solutions 2 and 3 over 2 minutes, allowing the grains to grow to 0.21 µm. 0.15 g of potassium iodide was then added, and the mixture was ripened for 5 minutes to complete grain formation.

1 liquid:
750ml water
Gelatin 8.6g
3g sodium chloride
1,3-dimethylimidazolidine-2-thione 20 mg
Sodium benzenethiosulfonate 10mg
Citric acid 0.7g
2 liquid:
300ml water
Silver nitrate 150g
3 liquid:
300ml water
38g sodium chloride
32g potassium bromide
Potassium hexachloroiridate (III) (0.005% KCl 20% aqueous solution) 5 ml
Ammonium hexachlororhodate
(0.001% NaCl 20% aqueous solution) 7ml
4 liquid:
100ml water
Silver nitrate 50g
5 liquid:
100ml water
13g sodium chloride
11g potassium bromide
Yellow prussiate 5mg

The material was then washed using the standard flocculation method. Specifically, the temperature was lowered to 35°C, and the pH was lowered using sulfuric acid until the silver halide precipitated (pH was in the range of 3.6 ± 0.2). Next, approximately 3 liters of the supernatant liquid was removed (first wash). Another 3 liters of distilled water was added, followed by sulfuric acid until the silver halide precipitated. Another 3 liters of the supernatant liquid was removed (second wash). The same operation as the second wash was repeated once more (third wash), completing the washing and desalting process. After washing and desalting, the emulsion was adjusted to pH 6.4 and pAg 7.5, and then 2.5 g of gelatin, 10 mg of sodium benzenethiosulfonate, 3 mg of sodium benzenethiosulfinate, 15 mg of sodium thiosulfate, and 10 mg of chloroauric acid were added, followed by chemical sensitization at 55°C to obtain the optimum sensitivity, followed by the addition of 100 mg of 1,3,3a,7-tetraazaindene as a stabilizer and 100 mg of Proxel (trade name, manufactured by ICI Co., Ltd.) as a preservative. The finally obtained emulsion was a silver iodochlorobromide cubic grain emulsion containing 0.08 mol % of silver iodide and a silver chlorobromide ratio of 70 mol % of silver chloride and 30 mol % of silver bromide, with an average grain size of 0.22 μm and a coefficient of variation of 9%.

(Preparation of photosensitive layer-forming composition)
To the above emulsion, 1.2× ¹⁰ mol/mol Ag of 1,3,3a,7-tetraazaindene, 1.2× ¹⁰ mol/mol Ag of hydroquinone, 3.0× ¹⁰ mol/mol Ag of citric acid, 0.90 g/mol Ag of 2,4-dichloro-6-hydroxy-1,3,5-triazine sodium salt, and a trace amount of hardener were added, and the pH of the coating solution was adjusted to 5.6 using citric acid.
To the above-mentioned coating solution, a polymer latex containing a polymer represented by the following formula (P-1) and a dispersant composed of a dialkylphenyl PEO sulfate (the mass ratio of dispersant/polymer was 2.0/100=0.02) was added so that the polymer/gelatin (mass ratio) became 0.5/1 relative to the gelatin contained therein.
Furthermore, EPOXY RESIN DY 022 (trade name: manufactured by Nagase ChemteX Corporation) was added as a crosslinking agent. The amount of the crosslinking agent added was adjusted so that the amount of the crosslinking agent in the silver halide-containing photosensitive layer described below was 0.09 g/ ^m2 .
In this manner, a composition for forming a photosensitive layer was prepared.
The polymer represented by the following formula (P-1) was synthesized with reference to Japanese Patent Nos. 3,305,459 and 3,754,745.

(Formation of Photosensitive Layer)
The above-mentioned polymer latex was applied to the insulating substrate in Example 1 to provide an undercoat layer having a thickness of 0.05 μm.
Next, a silver halide-free layer having a thickness of 1.0 μm was formed on the undercoat layer by coating the composition for forming the silver halide-free layer, which was a mixture of the above-mentioned polymer latex and gelatin. The mixture mass ratio of the polymer to the gelatin (polymer/gelatin) was 2:1, and the polymer content was 0.65 g/ ^m2 .
Next, the above-described photosensitive layer-forming composition was applied onto the silver halide-free layer to form a 2.5 μm-thick silver halide-containing photosensitive layer, in which the polymer to gelatin mass ratio (polymer/gelatin) was 0.5:1 and the polymer content was 0.22 g/ ^m2 .
Next, a protective layer having a thickness of 0.15 μm was formed on the silver halide-containing photosensitive layer by coating the protective layer-forming composition, which was a mixture of the above-mentioned polymer latex and gelatin. The mixture mass ratio of the polymer to the gelatin (polymer/gelatin) was 0.1:1, and the polymer content was 0.015 g/ ^m2 .

(Exposure processing and development processing)
The photosensitive layer formed on the insulating substrate was exposed to parallel light emitted from a high-pressure mercury lamp as a light source through the photomask of Example 1. After exposure, the layer was developed with the following developer, and further developed with a fixer (product name: N3X-R for CN16X: manufactured by Fujifilm Corporation), rinsed with pure water, and then dried.

Developer composition:
The following compounds are contained in 1 liter (L) of the developer.
Hydroquinone 0.037 mol/L
N-methylaminophenol 0.016 mol/L
Sodium metaborate 0.140 mol/L
Sodium hydroxide 0.360 mol/L
Sodium bromide 0.031 mol/L
Potassium metabisulfite 0.187 mol/L

(Heat treatment)
Furthermore, the dried insulating substrate was placed in a superheated steam bath at 120° C. for 130 seconds for heat treatment.

(Gelatin decomposition treatment)
Furthermore, the heat-treated insulating substrate was immersed in a gelatin decomposition solution (40°C) prepared as follows for 120 seconds, and then immersed in warm water (liquid temperature: 50°C) for 120 seconds to be washed.

<Preparation of gelatin decomposition solution>
Triethanolamine and sulfuric acid were added to an aqueous solution of a protease (Biophrase 30L, manufactured by Nagase ChemteX Corporation) (protease concentration: 0.5% by mass) to adjust the pH to 8.5.

(polymer cross-linking treatment)
Furthermore, the gelatin-decomposed insulating substrate was immersed in a 1% aqueous solution of Carbodilite V-02-L2 (trade name: manufactured by Nisshinbo) for 30 seconds, removed from the aqueous solution, and immersed in pure water (room temperature) for 60 seconds for washing.

In this way, by the silver salt method, an electrically conductive member of Example 12 was obtained on an insulating substrate, having multiple main wirings M1, multiple auxiliary wirings A1, and a pair of electrode pads 16 as shown in Figures 2 and 3.

<Comparative Example 1>
The current-carrying member of Comparative Example 1 was fabricated in the same manner as in Example 1, except that a photomask on which an exposure pattern in which a plurality of conductive wirings 13E were formed consisting only of a plurality of main wirings M6, as shown in FIG. 8, was used as the photomask used in the process of fabricating the plated layer-equipped substrate of Example 1. In the photomask used in Comparative Example 1, the line width of the exposure pattern corresponding to the plurality of main wirings M6 was 4 μm, and the spacing Q6 between the exposure patterns corresponding to adjacent main wirings M6 was 0.16 mm. Furthermore, in the current-carrying member of Comparative Example 1, the spacing Q6 between adjacent main wirings M2 in the direction perpendicular to the first direction D1 was 0.16 mm.

<Comparative Example 2>
The conductive member of Comparative Example 1 was prepared in the same manner as in Example 1, except that a photomask was used in the process of preparing the substrate with a plated layer of Example 1, which had an exposure pattern formed on it in which all of the multiple main wirings M7 and all of the multiple auxiliary wirings A7 of the conductive wiring 13F intersected in a grid pattern, as shown in Figure 10.

In the photomask used in Comparative Example 2, the line width of the exposure patterns corresponding to the multiple main wirings M7 and the multiple auxiliary wirings A7 was 4 μm, and the spacing between the exposure patterns corresponding to adjacent main wirings M7 was 0.16 mm. Furthermore, the length in the second direction D2 of the exposure pattern corresponding to the auxiliary wiring A7 was 100.00 mm, and the spacing between the exposure patterns corresponding to adjacent auxiliary wirings A2 in the first direction D1 was 0.16 mm.

Furthermore, in the conductive member of Comparative Example 2, the spacing Q7 between adjacent main wirings M7 in a direction perpendicular to the first direction D1 was 0.16 mm, the length of the auxiliary wiring A7 in the second direction D2 was 100.00 mm, and the spacing P7 between adjacent auxiliary wirings A7 along the first direction D1 was 0.16 mm.

<Comparative Example 3>
The conductive member of Comparative Example 3 was prepared in the same manner as in Example 1, except that the photomask used in the process of preparing the substrate with the plated layer of Example 1 had an exposure pattern formed thereon in which one auxiliary wiring continuously intersected with 16 main wirings.

In the photomask used in Comparative Example 3, the line width of the exposure patterns corresponding to the multiple main wirings and the multiple auxiliary wirings was 4 μm, and the spacing between the exposure patterns corresponding to adjacent main wirings was 0.16 mm. Furthermore, the length of the exposure patterns corresponding to the auxiliary wirings in the second direction D2 was 2.40 mm, and the spacing between the exposure patterns corresponding to adjacent auxiliary wirings in the first direction D1 was 0.25 mm.

Furthermore, in the conductive member of Comparative Example 3, the spacing between adjacent main wirings M7 in a direction perpendicular to the first direction D1 was 0.16 mm, the length of the auxiliary wiring in the second direction D2 was 2.40 mm, and the spacing between adjacent auxiliary wirings along the first direction D1 was 0.25 mm.

<Comparative Example 4>
An electrically conductive member of Comparative Example 4 was produced in the same manner as in Example 1, except that in the photomask used in the process of producing the plateable layer-provided substrate of Example 1, the length of the exposure patterns corresponding to the plurality of auxiliary wirings A1 was 0.48 mm and the spacing between the exposure patterns corresponding to adjacent auxiliary wirings A1 along the first direction D1 was 0.25 mm. In the electrically conductive member of Comparative Example 4, the length L1 of the plurality of auxiliary wirings A1 was 0.48 mm and the spacing P1 between adjacent auxiliary wirings A1 along the first direction D1 was 0.25 mm.

The conductive members of Examples 1 to 12 and Comparative Examples 1 to 4 obtained as described above were evaluated as follows.

(Electromagnetic wave transmittance evaluation)
The transmittance of millimeter waves of a specific wavelength was measured for the current-carrying member using a millimeter-wave network analyzer (Keysight Technologies Millimeter Wave Network Analyzers N5290A). First, the current-carrying member was attached to a 2 mm thick stainless steel plate having an 80 mm diameter hole. The two ports of the millimeter-wave network analyzer were placed facing each other. The current-carrying member attached to the stainless steel plate was positioned so that the 80 mm diameter hole in the stainless steel plate was located at the midpoint between the two ports, and so that the surface of the flat current-carrying member was perpendicular to the line connecting the two ports.

In this state, the transmittance of 76.5 GHz millimeter waves through the current-carrying member was measured. The transmittance measured without a current-carrying member between the two ports was set to 0 dB, and the transmittance of the current-carrying member was calculated. A rating of S was assigned if the measured transmittance was -0.65 dB or greater, an A rating of A if the transmittance was between -0.65 dB and -1.0 dB, a B rating of B if the transmittance was between -1.0 dB and -2.0 dB, and a C rating if the transmittance was less than -2.0 dB. Here, a rating of S in the electromagnetic wave transmittance evaluation indicates that the current-carrying member has excellent electromagnetic wave transmittance, a rating of A indicates that the current-carrying member has excellent electromagnetic wave transmittance, a rating of B indicates that the current-carrying member has electromagnetic wave transmittance that is acceptable for practical use, and a rating of C indicates that the current-carrying member does not transmit electromagnetic waves sufficiently, making it difficult to use in practice.

(Disconnection robustness evaluation)
First, conductive tape was applied to each of the pair of electrode pads of the current-carrying member, and the current-carrying member was placed in a thermostatic chamber set to a temperature of +10°C, a relative humidity of 60%, and no wind. In this state, a thermometer (ETS320 manufactured by FLIR) was used to measure the average temperature of the portion of the current-carrying member where the multiple conductive wires were arranged. A power supply (digital multimeter: DME1600 manufactured by Kikusui Electronics Co., Ltd.) was used to apply a voltage between the pair of electrode pads via the conductive tape so that the average temperature reached 35°C. Then, with voltage applied between the pair of electrode pads, the same thermometer was used to measure the temperature distribution in a 50 mm x 50 mm area at the center of the portion of the current-carrying member where the multiple conductive wires were arranged. Next, the range with the highest average temperature and the range with the lowest average temperature were identified within a 2 mm x 2 mm area within this 50 mm x 50 mm area, and the difference in average temperature between the two identified ranges (temperature difference within the range) was calculated.

Next, the current-carrying member was removed from the thermostatic chamber, and the surface of the current-carrying member on which the plurality of conductive wires was arranged was rubbed 100 times with #0000 steel wool while applying a load of 100 g/cm ^2. Thereafter, the plurality of conductive wires were observed with an optical microscope, and it was confirmed that partial disconnections had occurred.

Next, the conductive member was placed back in the thermostatic chamber, set to a temperature of +10°C, relative humidity of 60%, and no wind. In this state, a thermometer (FLIR ETS320) was used to measure the temperature of the conductive wires in the conductive member. A power supply (Kikusui Electronics DME1600 digital multimeter) was used to apply a voltage between a pair of electrode pads via conductive tape so that the temperature reached 35°C. Then, with voltage applied between the pair of electrode pads, the same thermometer was used to measure the temperature distribution in a 50 mm x 50 mm area at the center of the conductive wires in the conductive member. Next, within this 50 mm x 50 mm area, the highest and lowest average temperature ranges were identified within a 2 mm x 2 mm area, and the difference in average temperature between the two identified ranges (temperature difference within the area) was calculated.

Finally, the difference between the temperature difference within the range calculated before rubbing the current-carrying member 100 times and the temperature difference within the range calculated after rubbing the current-carrying member 100 times was calculated, and a difference of less than 3°C was assigned a rating of A, a difference of 3°C or more was assigned a rating of B, and a difference of 5°C or more was assigned a rating of C. Here, in the wire breakage robustness evaluation, a rating of A indicates that the current-carrying member has excellent robustness against wire breakage, a rating of B indicates that the current-carrying member has robustness against wire breakage that is practically acceptable, and a rating of C indicates that the current-carrying member does not have sufficient robustness against wire breakage and is therefore practically unacceptable.

(Visibility evaluation)
The current-carrying member was placed on black paper, and 10 observers observed the current-carrying member from a point 1 m away from the current-carrying member under fluorescent light to evaluate whether the multiple conductive wirings were clearly visible. When fewer than two observers rated the multiple conductive wirings as clearly visible, the evaluation was graded A. When four or more but fewer than ten observers rated the multiple conductive wirings as clearly visible, the evaluation was graded B. When ten observers rated the multiple conductive wirings as clearly visible, the evaluation was graded C. Here, a grade A in the visibility evaluation indicates that the current-carrying member has excellent visibility, a grade B indicates that the current-carrying member has visibility that is acceptable for practical use, and a grade C indicates that the current-carrying member does not have sufficient visibility and is therefore problematic for practical use. The term "current-carrying member having visibility" means that the multiple conductive wirings in the current-carrying member are not clearly visible to the observer.

Table 1 below shows the results of the electromagnetic wave transmission evaluation and the disconnection robustness evaluation for Examples 1 to 12 and Comparative Examples 1 to 4.

As shown in Table 1, the conductive members of Examples 1 to 12 all had an electromagnetic wave transparency rating of B or higher and an open circuit robustness rating of B or higher, indicating that they are capable of achieving both electromagnetic wave transparency and robustness against open circuit breakage.

Example 1 received an electromagnetic wave transmission rating of S and an open circuit robustness rating of A. In contrast, Example 2 received an electromagnetic wave transmission rating of A, Example 3 received a open circuit robustness rating of B, and Example 4 received an electromagnetic wave transmission rating of B. As such, it can be seen that the fewer the number of main wirings that are continuously crossed by multiple auxiliary wirings, the better the electromagnetic wave transmission, but the greater the number of main wirings that are continuously crossed by multiple auxiliary wirings, the better the robustness against open circuit. It can be seen that both electromagnetic wave transmission and robustness against open circuit are most improved when multiple auxiliary wirings continuously cross four main wirings, as in the current-carrying member of Example 1. However, even when multiple auxiliary wirings continuously cross twelve main wirings, as in Example 4, it is possible to achieve both electromagnetic wave transmission and robustness against open circuit.

Furthermore, Example 5 received an electromagnetic wave transmittance rating of B and a disconnection robustness rating of A, while Example 6 received an electromagnetic wave transmittance rating of S and a disconnection robustness rating of B. As such, it can be seen that the narrower the spacing between the multiple auxiliary wirings in the first direction D1, the more robustness against disconnection improves, and the wider the spacing between the multiple auxiliary wirings in the first direction D1, the more electromagnetic wave transmittance improves. Examples 4 and 5 show that both electromagnetic wave transmittance and robustness against disconnection can be sufficiently achieved whether the spacing between the multiple auxiliary wirings is 0.40 mm or 1.6 mm.

Examples 7 and 8 received an electromagnetic wave transmittance rating of S and an electromagnetic wave robustness rating of A. In particular, Example 7 had an electromagnetic wave transmittance of -0.55 dB, which was superior to the -0.6 dB electromagnetic wave transmittance of Example 1. As such, it can be seen that the smaller the gap between the dummy wiring and the main wiring, the better the electromagnetic wave transmittance. Therefore, it can be seen that even when the current-carrying member includes dummy wiring, electromagnetic wave transmittance and robustness against disconnections can be improved, and in particular, electromagnetic wave transmittance can be further improved when the gap between the dummy wiring and the main wiring is 5 μm or less.

As with Example 1, Examples 9 and 10 received an electromagnetic wave transparency rating of S and a disconnection robustness rating of A. This demonstrates that, regardless of the shape of the current-carrying member, when multiple auxiliary wirings continuously intersect with two or more main wirings, it is possible to achieve both electromagnetic wave transparency and robustness against disconnection.

As with Example 1, Examples 11 and 12 received an electromagnetic wave transparency rating of S and a disconnection robustness rating of A. This demonstrates that, regardless of the manufacturing method of the current-carrying member, when multiple auxiliary wirings continuously intersect with two or more main wirings, it is possible to achieve both electromagnetic wave transparency and robustness against disconnection.

Comparative Example 1 received an electromagnetic wave transparency rating of S, but a disconnection robustness rating of C. In Comparative Example 1, there is only a main wiring extending along the first direction D1, and no auxiliary wiring. Therefore, if a disconnection occurs in the main wiring, a portion will be created between a pair of electrode pads where electricity cannot flow, which is thought to be why the disconnection robustness rating was C.

Comparative Example 2 received an A rating for robustness against disconnection, but a C rating for electromagnetic wave transparency. Because the multiple auxiliary wirings in Comparative Example 2 were 100 mm long, the multiple auxiliary wirings interfered with polarized waves having an electric field oscillating in a direction perpendicular to the first direction D1, blocking these polarized waves, resulting in a D rating for electromagnetic wave transparency.

Comparative Example 3 received a disconnection robustness rating of A, but an electromagnetic wave transmittance rating of C. In Comparative Example 3, multiple auxiliary wires continuously intersect with 16 main wires and have a length of 2.40 mm. This is thought to be why the multiple auxiliary wires interfere with polarized waves having an electric field oscillating in a direction perpendicular to the first direction D1, blocking this polarized wave, resulting in an electromagnetic wave transmittance rating of D.

Comparative Example 4 received a disconnection robustness rating of A, but an electromagnetic wave transparency rating of C. In Comparative Example 4, the spacing between multiple auxiliary wires in the first direction D1 is very short at 0.25 mm, which is thought to make it easier for current to flow from one auxiliary wire to another auxiliary wire spaced 0.25 mm apart in the first direction D1, and as a result, it is thought that current tends to flow in the second direction D2. Therefore, the multiple auxiliary wires and polarized waves with electric fields oscillating in a direction perpendicular to the first direction D1 interfered with each other, blocking these polarized waves, which is thought to have resulted in a D rating for electromagnetic wave transparency.

The results of the visibility evaluation for Examples 1 to 12 and Comparative Examples 1 to 4 are shown in Table 1 below.

As shown in Table 1, the visibility ratings of the conductive members of Examples 1 to 5 and 7 to 12 and the conductive members of Comparative Examples 1 to 4 were all B or higher, indicating that they have visibility that is not problematic for practical use.

In particular, Examples 7 and 8 received a visibility rating of A. In Examples 7 and 8, the current-carrying member includes dummy wiring arranged at intervals narrower than the intervals between the multiple auxiliary wirings in the first direction D1, as shown in Figure 7, forming a mesh pattern MP. Therefore, it is believed that the intervals between the multiple auxiliary wirings in the first direction D1 and the second direction D2, the presence of the multiple auxiliary wirings, and the presence of the multiple main wirings were not noticeable to an observer of the current-carrying member.

The present invention is basically configured as described above. While the current-carrying member of the present invention has been described in detail above, the present invention is not limited to the above-described embodiment, and various improvements and modifications may of course be made without departing from the spirit of the present invention.

11, 11A, 11B, 11C, 11D: Conductive member, 12: Insulating substrate, 13, 13A, 13B, 13C, 13D, 13E, 13F: Conductive wiring, 14: Adhesive layer, 15: Transparent cover, 16: Electrode pad, A1, A2, A3, A4, A5: Auxiliary wiring, B1: Dummy wiring, D1: First direction, D2: Second direction, G1: Gap, L1, L2, L3, L4, L5: Length, M1, M2, M3, M4, M5, M6, M7: Main wiring, N1, P1, P2, P3, P4, P5, P7, Q1, Q2, Q3, Q4, Q5, Q6, Q7: Spacing, S1: Inner surface, S2: Outer surface, T1, T2, T3, T4, T5: Air gap.

Claims (18)

an insulating substrate;
a plurality of main wirings disposed on the insulating substrate and extending in a first direction at intervals from one another;
a plurality of auxiliary wirings disposed on the insulating substrate, each extending in a second direction intersecting the first direction and intersecting two or more of the main wirings continuously;
each of the plurality of auxiliary wirings has a length of 2.00 mm or less along the second direction;
the interval between the auxiliary wirings adjacent to each other along the first direction is 0.30 mm or more;
a current-carrying member in which two or more of the auxiliary wirings are adjacent to each other in the first direction ; The conductive member according to claim 1, wherein the plurality of auxiliary wirings continuously intersect two to twelve of the main wirings. The conductive member according to claim 2, wherein the plurality of auxiliary wirings continuously intersect four or five of the main wirings. The current-carrying member according to claim 2, wherein the plurality of auxiliary wirings continuously intersect two or three of the main wirings. The current-carrying member according to claim 1 , wherein two adjacent main wirings are connected by two or more auxiliary wirings. 6. The current-carrying member according to claim 1, wherein the auxiliary wirings adjacent to each other in the first direction intersect with the same main wiring and with different main wirings. the plurality of auxiliary wirings include auxiliary wirings adjacent to each other along the second direction,
The current-carrying member according to any one of claims 1 to 5 , wherein the auxiliary wires adjacent to each other along the second direction are arranged on the same straight line along the second direction. The current-carrying member according to any one of claims 1 to 5 , wherein the plurality of auxiliary wires are arranged at equal intervals in the first direction. 6. The current-carrying member according to claim 1, wherein the distance between the auxiliary wires adjacent to each other in the first direction is 0.30 mm or more and 2.00 mm or less. The current-carrying member according to claim 9 , wherein the distance between the auxiliary wires adjacent to each other in the first direction is not less than 0.30 mm and not more than 1.00 mm. The current-carrying member according to claim 10 , wherein the distance between the auxiliary wires adjacent to each other in the first direction is not less than 0.60 mm and not more than 0.90 mm. The conductive member according to any one of claims 1 to 5 , further comprising a transparent cover disposed on a surface of the insulating substrate opposite to a surface on which the plurality of main wirings and the plurality of auxiliary wirings are disposed. When placed near a transmitter/receiver that transmits and receives electromagnetic waves,
The conductive member according to claim 12, wherein the spacing between adjacent auxiliary wirings along the first direction is greater than or equal to one-quarter and less than one-half of the wavelength of the electromagnetic waves transmitted and received by the transceiver in the transparent cover and the insulating substrate. The current-carrying member according to any one of claims 1 to 5 , which has a three-dimensional shape. The conductive member according to any one of claims 1 to 5 , further comprising a plurality of dummy wirings disposed between the plurality of main wirings on the insulating substrate and electrically insulated from the plurality of main wirings and the plurality of auxiliary wirings. the plurality of dummy wirings include dummy wirings adjacent to each other along the second direction,
The current-carrying member according to claim 15 , wherein the dummy wirings adjacent to each other along the second direction are arranged on the same straight line along the second direction. The current-carrying member according to claim 16 , wherein the plurality of dummy wirings are arranged at positions that halve the interval between the auxiliary wirings adjacent to each other along the first direction. the plurality of dummy wirings are arranged with gaps in a direction perpendicular to the first direction from the main wirings adjacent to the dummy wirings in the second direction,
The current-carrying member according to claim 15 , wherein the gap has a length of 0.5 μm or more and 10.0 μm or less in a direction perpendicular to the first direction.