JP7803129B2 - Resin sealing mold - Google Patents

Description

The disclosed embodiment relates to a resin-sealed mold.

Conventionally, there is known a technique for exposing electrodes, heat sinks, or the like by scraping a resin-sealed molded product obtained by resin-sealing a molded product. For example, Patent Document 1 discloses a technique for exposing electrodes by scraping the resin formed on the surface of a semiconductor wafer, which is a molded product, after the semiconductor wafer is resin-sealed in a resin-sealing mold.

Japanese Patent Application Laid-Open No. 2003-045906

However, in resin-sealed molded products manufactured using the resin-sealed mold described in Patent Document 1, a thick layer of resin is removed when exposing the electrodes. Therefore, when the resin-sealed mold described in Patent Document 1 is used to manufacture resin-sealed molded products in which the exposed target is a heat sink, there is an issue of high processing costs for the resin-sealed molded products.

One aspect of this embodiment has been made in light of the above, and aims to provide a resin-sealed mold that can reduce the manufacturing costs of resin-sealed molded products.

A resin-sealing mold according to one embodiment is a resin-sealing mold for resin-sealing a molded product that includes a heat sink placed in a cavity formed between a first mold and a second mold. The first mold has a first cavity block with a cavity surface that forms the cavity. The gap between the heat sink and the cavity surface narrows during resin-sealing of the molded product.

According to one aspect of the embodiment, a resin sealing mold can be provided that can reduce the manufacturing costs of resin-sealed molded products.

FIG. 1 is a partial cross-sectional view showing an example of a resin-sealed mold according to the first embodiment. FIG. 2 is a diagram for explaining the function of the resin sealing mold according to the first embodiment. FIG. 3 is a diagram showing an example of a process for scraping off the resin from the resin-sealed molded product molded by the resin-sealing mold according to the first embodiment. FIG. 4 is a diagram showing an example of a manufacturing process of a resin-sealed molded product using a resin-sealed mold without a cavity block, and an example of the resin-sealed molded product. FIG. 5 is a perspective view showing an example of a resin sealing apparatus according to the first embodiment. FIG. 6 is a diagram (part 1) for explaining the resin sealing process performed by the resin sealing apparatus according to the first embodiment. FIG. 7 is a diagram (part 2) for explaining the resin sealing process by the resin sealing apparatus according to the first embodiment. FIG. 8 is a diagram (part 3) for explaining the resin sealing process by the resin sealing apparatus according to the first embodiment. FIG. 9 is a diagram (part 4) for explaining the resin sealing process by the resin sealing apparatus according to the first embodiment. FIG. 10 is a diagram (part 5) for explaining the resin sealing process by the resin sealing apparatus according to the first embodiment. FIG. 11 is a diagram (part 6) for explaining the resin sealing process by the resin sealing apparatus according to the first embodiment. FIG. 12 is a partially enlarged view showing an example of the resin-sealing mold according to the first embodiment. FIG. 13 is a partially enlarged view showing another example of the resin-sealing mold according to the first embodiment. FIG. 14 is a partial cross-sectional view showing an example of a resin-sealing mold according to the second embodiment. FIG. 15 is a diagram for explaining the function of the resin sealing mold according to the second embodiment. FIG. 16 is a perspective view showing an example of a resin sealing apparatus according to the second embodiment. FIG. 17 is a diagram (part 1) for explaining the resin sealing process by the resin sealing apparatus according to the second embodiment. FIG. 18 is a diagram (part 2) for explaining the resin sealing process by the resin sealing apparatus according to the second embodiment. FIG. 19 is a diagram (part 3) for explaining the resin sealing process by the resin sealing apparatus according to the second embodiment. FIG. 20 is a diagram (part 4) for explaining the resin sealing process by the resin sealing apparatus according to the second embodiment. FIG. 21 is a diagram (part 5) for explaining the resin sealing process by the resin sealing apparatus according to the second embodiment. FIG. 22 is a diagram (part 6) for explaining the resin sealing process by the resin sealing apparatus according to the second embodiment.

Embodiments of the resin-sealed mold disclosed in this application will be described in detail below with reference to the accompanying drawings. Note that the present invention is not limited to the embodiments described below.

1. First embodiment
<1.1. Configuration of resin-sealed mold>
1, the resin-sealing mold 1 according to the first embodiment includes an upper mold 2 and a lower mold 3. The upper mold 2 is an example of a first mold, and the lower mold 3 is an example of a second mold.

The upper mold 2 and lower mold 3 have cavity surfaces that form the cavity 70. As shown in Figure 1, when the upper mold 2 and lower mold 3 are in a clamped state in which they abut against each other, the cavity 70 is formed by the upper mold 2 and lower mold 3. A molded product 80 is placed within the cavity 70, and the molded product 80 is sealed within the cavity 70 with resin.

The workpiece 80 shown in FIG. 1 includes leads 81, bonding wires 82, an IC (Integrated Circuit) chip 83, heat sinks 84 and 85, and a spacer 86. The leads 81 and heat sinks 84 and 85 are, for example, metal members such as copper. The spacer 86 is, for example, a metal member or ceramic. The workpiece 80 is, for example, a power IC workpiece, but it may be any workpiece having a heat sink and is not limited to the configuration shown in FIG. 1, etc.

The upper mold 2 comprises an upper mold body 11 and an upper cavity block 12. The upper cavity block 12 is an example of a first cavity block. A through hole 11a is formed in the upper mold body 11, and the upper cavity block 12 is movably positioned within this through hole 11a.

The upper mold body 11 forms a portion of the cavity top surface 71, which is the top surface of the cavity 70, and portions of the cavity side surfaces 73 and 74, which are the side surfaces of the cavity 70, while the upper cavity block 12 forms the remaining portion of the cavity top surface 71. Furthermore, the lower mold 3 forms the cavity bottom surface 72, which is the bottom surface of the cavity 70, and portions of the remaining cavity side surfaces 73 and 74.

In the resin sealing mold 1, as shown in FIG. 2(a), when the upper mold 2 and lower mold 3 are clamped, resin 60 is sent into the cavity 70. Then, in the resin sealing mold 1, as shown in FIG. 2(b), resin 60 is filled between the cavity surface 12a of the upper cavity block 12 of the upper mold 2 and the heat sink 85 of the molded product 80.

Then, in the resin sealing mold 1, while the position of the upper cavity block 12 in the upper mold 2 is fixed, the lower mold 3 and upper mold body 11 are moved upward in Figure 2(b), thereby narrowing the gap between the cavity surface 12a of the upper cavity block 12 and the heat sink 85 of the molded product 80, as shown in Figure 2(c). Therefore, as shown in Figure 3(a), the thickness of the resin 60 on the heat sink 85 can be reduced in the resin-sealed molded product 90 formed by resin-sealing the molded product 80 using the resin sealing mold 1.

Here, we will explain the case where the upper cavity block 12 shown in Figure 1 is not provided in the upper mold. If the upper cavity block 12 shown in Figure 2 is not provided, as in the upper mold 2A shown in Figure 4(a), if the gap between the cavity top surface 71 formed by the upper mold 2A and the heat sink 85 of the molded product 80 is narrow, it may not be possible to fill the gap between the cavity top surface 71 and the heat sink 85.

For this reason, as shown in Figure 4(a), the gap between the cavity top surface 71 and the heat sink 85 needs to be larger than in the state shown in Figure 2(c), and as shown in Figure 4(b), the thickness of the resin 60 on the heat sink 85 of the resin-sealed molded product 90 is thicker than in Figure 3(a).

On the other hand, in the resin sealing mold 1 shown in Figure 1, resin 60 is filled between the cavity top surface 71 and the heat sink 85 in a manner that allows the resin 60 to be filled accurately between the cavity top surface 71 and the heat sink 85. Then, in the resin sealing mold 1, the lower mold 3 and upper mold body 11 are moved to narrow the gap between the cavity surface 12a of the upper cavity block 12 that constitutes the cavity top surface 71 and the heat sink 85, thereby reducing the thickness of the resin 60 on the heat sink 85.

This allows the resin encapsulation mold 1 to reduce the thickness of the resin 60 that is removed from the resin 60 of the resin encapsulation molded product 90. Therefore, as shown in Figure 3(b), in the process of exposing the heat sink 85 of the resin encapsulation molded product 90, i.e., in the process of removing the resin 60 of the resin encapsulation molded product 90, the time required to remove the resin 60 can be shortened, and the deterioration rate of the material from which the resin 60 is removed can also be slowed. Note that if the entire heat sink 84 is not exposed in the resin encapsulation molded product 90, a process of removing the resin 60 to expose the entire heat sink 84 is also performed.

Note that the method for narrowing the gap between the cavity surface 12a and the heat sink 85 is not limited to the above example. For example, the resin sealing mold 1 may be configured to narrow the gap between the cavity surface 12a and the heat sink 85 by moving the upper cavity block 12 downward in FIG. 2(b) instead of moving the lower mold 3 and the upper mold body 11 upward in FIG. 2(b).

<1.2. Configuration of Resin Sealing Device>
As shown in FIG. 5, the resin sealing apparatus 100 according to the first embodiment includes a resin sealing mold 1, a plurality of dies 4, a fixed platen 5, a movable platen 6, and a transfer unit 7.

The multiple divers 4 are parallel to one another and extend vertically, and are supported on a base (not shown). A fixed platen 5 is fixed to the upper end of each diver 4, and a movable platen 6 is attached to the lower end of each diver 4 so that it can move vertically.

The resin sealing mold 1 comprises an upper mold 2 and a lower mold 3. The upper mold 2 has an upper mold body 11 movably attached to a fixed platen 5, and the lower mold 3 is attached to a movable platen 6. The movable platen 6 is driven by a drive mechanism (not shown) to move up and down. The upper mold 2 comprises an upper chess piece 10 having a cavity surface and an upper die set 20 that supports the upper chess piece 10. The lower mold 3 comprises a lower chess piece 30 having a cavity surface and a lower die set 40 that supports the lower chess piece 30.

In the resin sealing apparatus 100, the movable platen 6 moves upward, causing the lower mold 3 to come into contact with the upper mold 2, thereby clamping the upper mold 2 and lower mold 3 together. In the example shown in Figure 5, the resin sealing apparatus 100 is configured so that the lower mold 3 moves upward, but it may also be configured so that the upper mold 2 moves downward.

Furthermore, the resin sealing apparatus 100 shown in FIG. 5 is capable of simultaneously resin-sealing six molded articles 80, but this is not limited to this example, and the number of molded articles 80 that can be simultaneously resin-sealed may be five or less, or seven or more. Further, the resin sealing apparatus 100 shown in FIG. 5 uses six resin tablets 61 to resin-seal six molded articles 80, but this is not limited to this example, and the number of resin tablets 61 may be five or less, or seven or more.

Next, the resin sealing process of the resin sealing device 100 shown in Figure 5 will be described in detail using Figures 6 to 11. Figures 6 to 11 show two of the six molded products 80, and one of the multiple resin tablets 61. Note that Figures 5 to 11 show the molded product 80 shown in Figure 1 etc. in simplified form.

As shown in Figure 6, the molded product 80 and resin tablet 61 are transported by a transport device (not shown) to the resin sealing mold 1 of the resin sealing device 100. Then, as shown in Figure 7, the molded product 80 is placed on the lower die chest 30 of the lower die 3, and the resin tablet 61 is placed in the pot 77 formed in the lower die 3.

Next, as shown in Figure 8, in the resin sealing device 100, the movable platen 6 (see Figure 5) is moved upward by a drive mechanism (not shown), causing the lower mold 3 to abut against the upper mold 2, thereby clamping the upper mold 2 and lower mold 3 together.

By clamping the upper mold 2 and lower mold 3 together, a cull portion 75, a runner portion 76, and a cavity 70 are formed, as shown in Figure 8. The resin tablet 61 is melted by a heater (not shown). Multiple cavities 70 are formed between the upper mold 2 and the lower mold 3 for each molded product 80. The upper mold 2 is provided with an upper cavity block 12 for each molded product 80.

Next, as shown in Figure 9, in the resin sealing device 100, the plunger 8 provided on the transfer unit 7 (see Figure 5) moves upward, and the molten resin tablet 61 is extruded as resin 60 into the cavity 70 via the cull portion 75 (see Figure 8) and the runner portion 76 (see Figure 8). This causes the resin 60 to fill the space between the cavity top surface 71 and the heat sink 85 of the molded product 80 inside the cavity 70.

Next, in the resin sealing apparatus 100, the movable platen 6 (see FIG. 5) is moved upward by a drive mechanism (not shown), causing the movable platen 6 to press the lower mold 3 upward in FIG. 9, and the lower mold 3 to move upward in FIG. 9. Therefore, in the resin sealing apparatus 100, as shown in FIG. 10, the lower mold 3 and the upper mold body 11 move upward in FIG. 10 while the position of the upper cavity block 12 in the upper mold 2 is fixed. This narrows the gap between the cavity surface 12a of the upper cavity block 12 and the heat sink 85 (see FIG. 8) of the molded product 80 (see FIG. 8). Therefore, as shown in FIG. 10, the thickness of the resin 60 on the heat sink 85 becomes thinner.

In this way, the resin sealing apparatus 100 moves the movable platen 6 upward to bring the heat sink 85 closer to the cavity surface 12a, thereby narrowing the gap between the cavity surface 12a and the heat sink 85. Therefore, the resin sealing apparatus 100 can narrow the gap between the cavity surface 12a and the heat sink 85 without providing a mechanism or drive unit that moves the upper cavity block 12 downward in FIG. 9.

In addition, the resin sealing apparatus 100 may be configured such that, instead of moving the movable platen 6 upward from the state shown in FIG. 9, the upper cavity block 12 moves downward in FIG. 9 to narrow the gap between the cavity surface 12a and the heat sink 85.

Then, as shown in Figure 11, in the resin sealing device 100, the movable platen 6 (see Figure 5) moves downward, separating the lower mold 3 from the upper mold 2, and the resin-sealed molded product 90 is removed from the resin-sealing mold 1 by a conveying device (not shown).

In this way, the resin sealing apparatus 100 according to the first embodiment can reduce the thickness of the resin 60 that is removed from the resin 60 of the resin-sealed molded product 90. Therefore, when exposing the heat sink 85 of the resin-sealed molded product 90, the time required to remove the resin 60 can be shortened, and the deterioration rate of the material from which the resin 60 is removed can also be slowed.

In addition, in the resin sealing device 100, the through hole 11a has a diameter large enough to cover the entire heat sink 85, and is formed in a position facing the heat sink 85. Then, after resin 60 is filled between the cavity surface 12a of the upper cavity block 12 placed in the through hole 11a and the upper surface of the heat sink 85, the lower mold 3 and upper mold body 11 or the upper cavity block 12 move, causing the upper cavity block 12 to move within the through hole 11a. Therefore, the resin sealing device 100 can appropriately thin the thickness of the resin 60 on the heat sink 85 in the resin-sealed molded product 90.

The upper cavity block 12 is attached to a movement mechanism (not shown) driven by a drive source (not shown), and moves through the through-hole 11a when driven by the movement mechanism (not shown). The drive source (not shown) is, for example, a servo motor controlled by a control unit (not shown), but is not limited to such an example.

As shown in FIG. 12, the through hole 11a has a diameter larger than the size of the upper surface of the heat sink 85 and smaller than the cavity top surface. The cavity top surface is formed by the upper surface of the upper mold body 11 and the cavity surface 12a of the upper cavity block 12. This allows the thickness of the resin 60 on the upper surface of the resin-sealed molded product 90 to be reduced in areas other than the area corresponding to the through hole 11a, as shown in FIG. 3(a).

This reduces the amount of resin 60 that is removed from the resin 60 of the resin-sealed molded product 90, shortening the time it takes to remove the resin 60 and slowing down the deterioration rate of the components that remove the resin 60.

In addition, in the above example, the cavity surface 12a of the upper cavity block 12, which forms part of the top surface of the cavity 70, is a flat surface, but the cavity surface 12a of the upper cavity block 12 is not limited to a flat surface. For example, the cavity surface 12a may be configured to have a recess 12b formed by a depression large enough to cover the heat sink 85, as shown in Figure 13.

As shown in Figure 13, the recess 12b of the upper cavity block 12 is formed in the cavity surface 12a facing the heat sink 85 and is large enough to cover the entire heat sink 85. After resin 60 is filled between the recess 12b of the upper cavity block 12 and the upper surface of the heat sink 85, the lower mold 3 and upper mold body 11 move upward in Figure 13. As a result, the upper cavity block 12 moves within the through hole 11a, and the cavity surface 12a of the upper cavity block 12 approaches the heat sink 85.

Because the opening of the recess 12b has a smaller area than the opening of the through hole 11a, the resin sealing mold 1 shown in FIG. 13 can reduce the protruding area on the top surface of the resin-sealed molded product 90 compared to the resin sealing mold 1 shown in FIG. 12. Therefore, with the resin sealing mold 1 shown in FIG. 13, the amount of resin 60 that is removed during the process of exposing the heat sink 85 of the resin-sealed molded product 90 can be further reduced.

In the resin sealing mold 1 shown in Figure 13, even if the molded product 80 has a different upper surface area of the heat sink 85, the amount of resin 60 can be easily reduced by replacing it with an upper cavity block 12 that has a recess 12b with an opening that corresponds to the area of the upper surface of the heat sink 85, without having to replace the entire upper mold 2.

In the example described above, the upper mold 2 is provided with the upper cavity block 12, but the resin sealing mold 1 may be configured such that the lower mold 3, instead of the upper mold 2, is provided with a through hole corresponding to the through hole 11a and a cavity block corresponding to the upper cavity block 12 that faces the heat sink 85 of the molded product 80 and moves through the through hole 11a. In this case, the cavity surface of the cavity block corresponding to the cavity surface 12a of the upper cavity block 12 forms at least a portion of the cavity bottom surface 72, and the molded product 80 is placed in the cavity 70 in a state that is upside down from the state shown in FIG. 1.

In the above example, the cavity surface 12a of the upper cavity block 12 forms part of the cavity top surface 71 or part of the cavity bottom surface 72, but this is not limited to such an example. For example, the cavity surface 12a of the upper cavity block 12 may be a cavity surface that forms the entire cavity top surface 71 or the entire cavity bottom surface 72.

Furthermore, in the resin sealing mold 1 described above, the thickness of the resin 60 on the heat sink 85 is reduced by narrowing the gap between the cavity surface 12a of the upper cavity block 12 and the heat sink 85, but this is not a limited example. For example, the resin sealing mold 1 can bring the cavity surface 12a of the upper cavity block 12 into contact with the heat sink 85 from the state shown in Figure 9, in which the molded product 80 is being resin-sealed. This allows the resin sealing mold 1 to prevent the resin 60 from forming on the heat sink 85.

As described above, the resin sealing mold 1 according to the first embodiment is a resin sealing mold that resin-seals a molded product 80, including a heat sink 85 disposed in a cavity 70 formed between an upper mold 2 and a lower mold 3. The upper mold 2 has an upper cavity block 12 with a cavity surface 12a that forms the cavity 70. The upper mold 2 is an example of a first mold, and the upper cavity block 12 is an example of a first cavity block. Furthermore, with the resin sealing mold 1, the gap between the heat sink 85 and the cavity surface 12a is narrowed during resin sealing of the molded product 80. This allows the resin sealing mold 1 to manufacture a resin-sealed molded product 90 with a thin layer of resin 60 on the heat sink 85, or a resin-sealed molded product 90 without resin 60 formed on the heat sink 85. Therefore, the resin sealing mold 1 can reduce the manufacturing costs of the resin-sealed molded product 90.

In addition, multiple cavities 70 are formed between the upper mold 2 and the lower mold 3 for each molded product 80, and the upper mold 2 is provided with an upper cavity block 12 for each molded product 80. This allows the resin sealing mold 1 to accurately manufacture, for example, a resin sealing molded product 90 in which the thickness of the resin 60 on the heat sink 85 is thin.

The cavity surface of the upper mold 2 forms at least a portion of the cavity top surface 71 or cavity bottom surface 72, and the upper cavity block 12 has a recess 12b on the cavity surface that is large enough to cover the heat sink 85. This allows the resin-sealing mold 1 to further reduce the amount of resin 60 that is removed from the resin 60 of the resin-sealed molded product 90.

2. Second embodiment
2.1. Structure of resin-sealed mold
The resin-sealed mold according to the second embodiment differs from the resin-sealed mold 1 according to the first embodiment in that the lower mold includes a lower mold body and a cavity block. In the following, components having the same functions as those in the first embodiment are denoted by the same reference numerals and their description is omitted, and the description will focus on the differences from the resin-sealed mold 1 of the first embodiment.

As shown in FIG. 14, the resin sealing mold 1A according to the second embodiment includes an upper mold 2 and a lower mold 3A. The lower mold 3A is the other example of a second mold. The upper mold 2 and the lower mold 3A have cavity surfaces that form a cavity 70, and as shown in FIG. 14, when the upper mold 2 and the lower mold 3A are in a clamped state in which they abut against each other, the cavity 70 is formed by the upper mold 2 and the lower mold 3A.

The lower mold 3A comprises a lower mold body 31 and a lower cavity block 32. The lower cavity block 32 is an example of a second cavity block. A through hole 31a is formed in the lower mold body 31, and the lower cavity block 32 is hydraulically movable within this through hole 31a. The lower cavity block 32 can move in either the direction in which the upper cavity block 12 of the upper mold 2 presses the heat sink 85 via the resin 60, or the direction in which the upper cavity block 12 presses the heat sink 85 directly.

The through hole 31a has a diameter large enough to cover the entire heat sink 84, and is formed in a position facing the heat sink 84. When the upper mold 2 and lower mold 3A are in a clamped state where they abut against each other, the cavity surface 32a of the lower cavity block 32 arranged within the through hole 31a abuts against the underside of the heat sink 84. Note that in the clamped state, there may be a gap between the cavity surface 32a of the lower cavity block 32 and the underside of the heat sink 84.

The lower mold body 31 forms part of the cavity bottom surface 72 and part of the cavity side surfaces 73 and 74, and the cavity surface 32a of the lower cavity block 32 forms the remaining part of the cavity bottom surface 72.

In the resin sealing mold 1A, as shown in Figure 15(a), resin 60 is sent into the cavity 70, and within the cavity 70, the resin 60 fills the space between the cavity surface 12a of the upper cavity block 12 and the heat sink 85 of the molded product 80.

Then, in the resin sealing mold 1A, the lower mold 3A and upper mold body 11 move upward in Figure 15(a), and the heat sink 85 approaches the upper cavity block 12 of the upper mold 2. If the upper cavity block 12 comes into contact with the molded product 80 as the heat sink 85 approaches the upper cavity block 12, as shown in Figure 15(b), the molded product 80 may be damaged, such as being broken or deformed.

As described above, the resin sealing mold 1A is provided with a lower cavity block 32 that moves within the through hole 31a using hydraulic pressure. When the workpiece 80 is pressed by the upper cavity block 12, the hydraulic pressure biasing the lower cavity block 32 overcomes the pressing force of the upper cavity block 12, causing the lower cavity block 32 to move downward.

The amount of downward movement of the lower cavity block 32 increases as the pressing force of the upper cavity block 12 on the molded product 80 increases. Therefore, compared to the resin sealing mold 1, the resin sealing mold 1A can reduce damage to the molded product 80 caused by the pressing force of the upper cavity block 12 on the molded product 80.

Note that the upper cavity block 12 presses the workpiece 80 when, for example, the heat sink 85 of the workpiece 80 is tilted or when the vertical dimension of the workpiece 80 is larger than the design value. The heat sink 85 may tilt, for example, when the workpiece 80 is being transported to the resin sealing mold 1A or when the resin 60 is being filled into the cavity 70, but this is not a limiting example.

In this way, with the resin sealing mold 1A, the thickness of the resin 60 that is removed from the resin 60 of the resin-sealed molded product 90 can be reduced. Furthermore, even if the upper cavity block 12 comes into contact with the molded product 80, the movement of the lower cavity block 32 can prevent damage to the molded product 80.

<2.2. Configuration of Resin Sealing Device>
16, the resin sealing apparatus 100A according to the second embodiment differs from the resin sealing apparatus 100 according to the first embodiment in that it includes a resin sealing mold 1A and a hydraulic pump 9 instead of the resin sealing mold 1. In the following, components having the same functions as those in the first embodiment are denoted by the same reference numerals and their description will be omitted, and the description will focus on the differences from the resin sealing apparatus 100 according to the first embodiment.

In the resin sealing apparatus 100A, the lower mold 3A includes a lower chess piece 30A having a cavity surface and a lower die set 40 that supports the lower chess piece 30A. The lower chess piece 30A includes the lower mold body 31 and lower cavity block 32 described above. The resin sealing apparatus 100A shown in Figure 16 is configured so that the lower mold 3A moves upward, but it may also be configured so that the upper mold 2 moves downward.

Next, the resin sealing operation of the molded product 80 using the resin sealing apparatus 100A shown in Figure 16 will be described in detail using Figures 17 to 22. As shown in Figure 17, the molded product 80 and resin tablet 61 are transported to the resin sealing mold 1A of the resin sealing apparatus 100A by a transport device (not shown). Note that in the example shown in Figures 16 to 22, the molded product 80 shown in Figure 14 etc. is shown in a simplified form.

In the state shown in Figure 17, the lower cavity block 32 of the lower mold 3A is moved upward by hydraulic pressure from the hydraulic pump 9 and is maintained in the position shown in Figure 17. Also, as shown in Figure 18, a molded product 80 is placed on the lower mold chest 30A of the lower mold 3A, and a resin tablet 61 is placed in the pot 77 formed in the lower mold 3A.

Next, as shown in Figure 19, in the resin sealing apparatus 100A, the movable platen 6 (see Figure 16) moves upward, causing the lower mold 3A to abut against the upper mold 2, clamping the upper mold 2 and lower mold 3A together. Multiple cavities 70 are formed between the upper mold 2 and the lower mold 3A for each molded article 80. The upper mold 2 has an upper cavity block 12 for each molded article 80, and the lower mold 3A has a lower cavity block 32 for each molded article 80.

Next, as shown in Figure 20, in the resin sealing device 100A, the plunger 8 moves upward, and the resin tablet 61 melted by the transfer unit 7 (see Figure 16) is extruded as resin 60 into the cavity 70 via the cull portion 75 (see Figure 19) and the runner portion 76 (see Figure 19). As a result, the resin 60 fills the space between the cavity surface 12a of the upper cavity block 12 and the heat sink 85 of the molded product 80 within the cavity 70.

Next, in the resin sealing apparatus 100A, the movable platen 6 (see FIG. 16) is moved upward by a drive mechanism (not shown), causing the movable platen 6 to press the lower mold 3A upward in FIG. 20, moving the lower mold 3A upward in FIG. 20. Therefore, in the resin sealing apparatus 100A, as shown in FIG. 21, the lower mold 3A and the upper mold body 11 move upward in FIG. 21 while the position of the upper cavity block 12 in the upper mold 2 is fixed. This narrows the gap between the cavity surface 12a of the upper cavity block 12 and the heat sink 85 of the molded product 80. Therefore, in the resin sealing apparatus 100A, a resin-sealed molded product 90 is formed in which the thickness of the resin 60 on the heat sink 85 is thin.

In addition, the resin sealing apparatus 100A may be configured to narrow the gap between the cavity surface 12a and the heat sink 85 by moving the upper cavity block 12 downward in FIG. 20 instead of moving the movable platen 6 upward from the state shown in FIG. 20.

Then, as shown in FIG. 22, in the resin sealing apparatus 100A, the movable platen 6 (see FIG. 16) moves downward, separating the lower mold 3A from the upper mold 2, and the resin-sealed molded product 90 is removed from the resin-sealing mold 1A by a conveying device (not shown).

When the upper cavity block 12 of the upper mold 2 does not come into contact with the molded product 80 during resin sealing of the molded product 80, the lower cavity block 32 of the lower mold 3A is biased in a direction toward the molded product 80 against the downward force applied to the molded product 80, maintaining the state shown in Figure 21. This allows the resin sealing apparatus 100A to accurately manufacture the resin-sealed molded product 90.

Furthermore, if a downward force greater than the hydraulic pressure from the hydraulic pump 9 is applied to the lower cavity block 32 of the lower mold 3A during resin sealing of the molded product 80, the hydraulic pressure from the hydraulic pump 9 will be overcome by the downward force, causing the lower cavity block 32 to move downward.

As a result, during resin sealing of the molded product 80, if the upper cavity block 12 presses the molded product 80 downward, applying a downward force to the lower cavity block 32 greater than the hydraulic pressure from the hydraulic pump 9, the lower cavity block 32 will move downward. This allows the resin sealing device 100A to prevent damage to the molded product 80 caused by the upper cavity block 12 pressing against it.

In addition, in the resin sealing device 100A, the through hole 31a has a diameter large enough to cover the entire heat sink 84, and is formed in a position facing the heat sink 84. When the upper mold 2 and lower mold 3A are clamped, the cavity surface 32a of the lower cavity block 32 arranged within the through hole 31a abuts against the lower surface of the heat sink 84.

As a result, with the resin sealing device 100A, even when the lower cavity block 32 moves downward, the amount of resin 60 that penetrates into the through-hole 31a can be reduced compared to when the cavity surface 32a of the lower cavity block 32 is the entire cavity bottom surface 72.

Note that the lower cavity block 32 is hydraulically biased, but this is not a limitation. For example, the lower cavity block 32 may be configured to be movable within the through-hole 31a by a drive source such as a servo motor.

In this case, for example, a pressure sensor that detects the pressure applied to the lower cavity block 32 may be attached to the resin sealing mold 1A, and if the pressure detected by the pressure sensor is equal to or greater than a threshold value, the lower cavity block 32 may be moved downward by controlling the drive source via a control unit (not shown).

Furthermore, if the pressure detected by the pressure sensor is equal to or greater than a threshold value, the higher the pressure detected by the pressure sensor, the greater the downward movement of the lower cavity block 32 can be.

In the above example, the upper cavity block 12 is provided in the upper mold 2, and the lower cavity block 32 is provided in the lower mold 3A in the resin-sealing mold 1A. However, this is not limited to this example. For example, the resin-sealing mold 1A may be configured such that the lower mold 3A, instead of the upper mold 2, is provided with a cavity block corresponding to the through hole 11a and the through hole corresponding to the upper cavity block 12, and the upper mold 2, instead of the lower mold 3A, is provided with a cavity block corresponding to the through hole 31a and the through hole corresponding to the lower cavity block 32. In this case, the cavity surface of the cavity block corresponding to the cavity surface 12a of the upper cavity block 12 forms at least a portion of the cavity bottom surface 72, and the cavity surface of the cavity block corresponding to the cavity surface 32a of the lower cavity block 32 forms at least a portion of the cavity top surface 71. The molded product 80 is then placed in the cavity 70 in a state that is upside down from the state shown in FIG. 14.

Furthermore, in the resin sealing mold 1A described above, the thickness of the resin 60 on the heat sink 85 is reduced by narrowing the gap between the cavity surface 12a of the upper cavity block 12 and the heat sink 85, but this is not a limited example. For example, the resin sealing mold 1A can bring the cavity surface 12a of the upper cavity block 12 into contact with the heat sink 85 from the state shown in Figure 20, where the molded product 80 is being resin-sealed. This allows the resin sealing mold 1A to prevent resin 60 from being formed on the heat sink 85.

As described above, the resin sealing mold 1A according to the second embodiment is a resin sealing mold that resin-seals a molded product 80, including a heat sink 85 disposed in a cavity 70 formed between an upper mold 2 and a lower mold 3A. The upper mold 2 has an upper cavity block 12 with a cavity surface 12a that forms the cavity 70. The upper mold 2 is an example of a first mold, and the upper cavity block 12 is an example of a first cavity block. During resin sealing of the molded product 80, the gap between the heat sink 85 and the cavity surface 12a narrows. This allows the resin sealing mold 1A to produce, for example, a resin-sealed molded product 90 in which the thickness of the resin 60 on the heat sink 85 is thin, or a resin-sealed molded product 90 in which no resin 60 is formed on the heat sink 85. Therefore, the resin sealing mold 1A can reduce the manufacturing costs of the resin-sealed molded product 90.

The lower mold 3A also includes a lower cavity block 32 that can move in a direction in which the heat sink 85 is pressed by the cavity surface 12a of the upper cavity block 12 during resin sealing of the molded product 80. The lower mold 3A is an example of a second mold, and the lower cavity block 32 is an example of a second cavity block. This allows the resin sealing mold 1A to prevent damage to the molded product 80 when the molded product 80 is pressed by the upper cavity block 12.

In addition, the lower cavity block 32 of the lower mold 3A is hydraulically biased toward the molded product 80 during resin sealing of the molded product 80. As a result, when a downward force greater than the hydraulic pressure from the hydraulic pump 9 is applied to the lower cavity block 32 of the lower mold 3A in the resin sealing mold 1A, the hydraulic pressure from the hydraulic pump 9 overcomes the downward force, and the lower cavity block 32 moves downward. Therefore, in the resin sealing mold 1A, the lower cavity block 32 can be moved downward without controlling the movement of the lower cavity block 32 with a servo motor or the like, avoiding a complex configuration.

Further advantages and modifications may readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

1, 1A Resin sealing mold 2 Upper mold (an example of a first mold)
2A Upper mold 3, 3A Lower mold (an example of a second mold)
9 Hydraulic pump 11 Upper mold body 11a Through hole 12 Upper cavity block (an example of a first cavity block)
12a Cavity surface 12b Recess 31 Lower mold body 31a Through hole 32 Lower cavity block (an example of a second cavity block)
60 Resin 70 Cavity 71 Cavity top surface 72 Cavity bottom surface 80 Molded product 84, 85 Heat sink 90 Resin-sealed molded product 100, 100A Resin-sealing device

Claims (5)

A resin sealing mold for resin-sealing a molded product including a heat sink disposed in a cavity formed between a first mold and a second mold,
The molded article is
the resin on the heat sink is scraped off after the resin sealing to expose the heat sink,
The first mold comprises:
a first cavity block having a cavity surface that forms the cavity;
a resin sealing mold, characterized in that a gap between the heat sink and the cavity surface is narrowed while resin is present between the heat sink and the cavity surface during the resin sealing of the molded product, so that the thickness of the resin on the heat sink after the resin sealing is thin. The cavity is
A plurality of the molded articles are formed between the first mold and the second mold,
The first mold comprises:
The resin sealing mold according to claim 1 , wherein the first cavity block is provided for each of the molding workpieces. The cavity surface is
forming at least a part of the top or bottom surface of the cavity;
The first cavity block comprises:
3. The resin sealing mold according to claim 1, wherein the cavity surface has a recess formed by a depression large enough to cover the heat sink. The second mold comprises:
The resin sealing mold according to any one of claims 1 to 3, characterized in that it comprises a second cavity block that is movable in a direction in which the heat sink is pressed by the cavity surface during the resin sealing of the molded product. The second cavity block comprises:
The resin sealing mold according to claim 4, wherein the resin sealing member is hydraulically biased in a direction approaching the molded product during the resin sealing of the molded product.